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Inkjet Printing  Bioam  Optical Fibre Preform  Multiple Materials  Dry Powder Micro Dispensing

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The Next Generation of Additive Manufacturing: Multiple Materials Dr. Shoufeng Yang Associate Professor Faculty of Engineering and the Environment University of Southampton, UK Visiting Associate Professor MAE, SC3DP, Singapore Southampton: Warmest and Sunniest Place in the UK 2 2016 3D Printing Electronics Conference Eindhoven Premier league Virgin trip of Titanic from Southampton to New York 3 2016 3D Printing Electronics Conference Eindhoven 3D Printing activities in UoS PEEK Ceramic printing Inkjet printing BioAM Optical fibre preform Multiple materials Dry powder micro dispensing 4 2016 3D Printing Electronics Conference Eindhoven Q: How many materials do we use in our products and systems? In the Cambridge Engineering materials Selector (CES) database there are >3900 materials for Engineer This doesn’t include functional materials such as doped materials in semiconductor 5 2016 3D Printing Electronics Conference Eindhoven Q: Why do we have to use so many different materials? Single material couldn’t provide the multiple and complex functions we required. Compromise and joining and assembly are needed For example, we need – Cu for high thermal conductivity – Al and Ti for light weight – Stainless steel for anti-corrosion – Inconel for high temperature and harsh environment – Polymers for light weight and insulation – Ceramic for high servicing temperature and high hardness – … 6 2016 3D Printing Electronics Conference Eindhoven Q: how many materials 3D Printers can print? SLS: PA, PS, Coated Sand, Coated metals, glass powder composite, PEEK, wax… SLM: SS, Ti and alloy, Al and alloy, Cu alloy, Ni alloy, CoCr, Tool steel… FDM: ABS, PLA, Nylon, PC… SLA: Acrylic… 3DP: Plaster composite, sand… Laser Cladding: metals… … 7 2016 3D Printing Electronics Conference Eindhoven History of 2D Printing technologies: 1. Woodblock printing 200 CE 13. Mimeograph 1886 2. Movable type 1040 14. Screen printing 1910 3. Printing press 1453 15. Spirit duplicator 1923 4. Etching c. 1515 16. Photocopying 1938 5. Mezzotint 1642 17. Inkjet printing 1951 6. Aquatint 1772 18. Dye-sublimation 1957 7. Lithography 1796 19. Phototypesetting 1960s 8. Chromolithography 1837 20. Dot matrix printer 1968 9. Rotary press 1843 21. Laser printing 1969 10. Hectograph 1869 22. Thermal printing c. 1972 11. Offset printing 1875 23. 3D printing 1984 12. Hot metal typesetting 1884 24. Digital press 1993 From Wiki: Printing Can and have they be used for 3D printing? 8 2016 3D Printing Electronics Conference Eindhoven Dispensing technology: why powder? Liquid: taps, digital pipette, ink jet printing, syringe pumps…still advancing but quite mature Semi solid: FDM, injection moulding, glue dispensing, a lot of printing methods for example offset printings… Gas: pneumatic valves etc.. Powder printing: laser printing, very few… 9 2016 3D Printing Electronics Conference Eindhoven Why use Dry Powder Dispensing for MMAM? 1. Required by powder bed based AM, including SLS, SLM, EBM and Zcorp 2. Especially in SLM, the high temperature would not allow any liquid/solvent involved 3. Wider materials availability (Metal, ceramic, polymer…) 4. Materials handling and storage is easier Mohammad Vaezi, Srisit Chianrabutra, Brian Mellor & Shoufeng Yang Virtual and Physical Prototyping, Volume 8, Issue 1, 2013 Multiple material additive manufacturing – Part 1: a review 10 2016 3D Printing Electronics Conference Eindhoven Pioneer of Direct Inkjet Printing Professor Julian RG Evans JRG Evans et al., J. Mater. Sci. L ett., 1995, 14, 1562–1565. 11 2016 3D Printing Electronics Conference Eindhoven Why Multiple Materials AM (MMAM)? Example 1 : Reaction ware with coatings, cooling channels/heaters, sensors, etc. Catalyst coating cooling channel comprise a high thermal conductivity material Steel Conformable high thermal cooling channel/heaters conductivity material 12 2016 3D Printing Electronics Conference Eindhoven Why Multiple Materials AM? Example 2: Metamaterials Science 16 January 2009: Vol. 323 no. 5912 pp. 366-369 Disadvantages: •>10,000 elements •6,000 unique •Manually assembled 13 2016 3D Printing Electronics Conference Eindhoven Success and Limitation: “Multi”-material 3D Printing by Objet Two different curable polymer ink cartridges Two different materials in the object Limited mechanical properties and functionality from polymer Polymer Other Materials Difference Conductivity PEDOT:PSS<103 Most metals 105-106 (S/m) >108-109 Permittivity 2-5 Ceramics >5-103 103 Mechanical Tensile strength Most Metal 500- 10-100 Strength PEEK <100MPa 2000MPa 14 2016 3D Printing Electronics Conference Eindhoven Multi-material Stereolithography: 2016 3D Printing Electronics Conference Eindhoven Multi-material Selective Laser Sintering 2016 3D Printing Electronics Conference Eindhoven Multi-material Laser Powder Deposition Material A Material B Powder-Laser Nozzle Coating object with Powder melt down on 3D single object different material 2016the 3D substrate Printing Electronics Conference Eindhoven Multi-material Fused Deposition Modeling 2016 3D Printing Electronics Conference Eindhoven Multi-material Ultrasonic Consolidation 2016 3D Printing Electronics Conference Eindhoven Functional Prototype: SLA+DW Researchers in the W.M. Keck Center for 3D Innovation at the University of Texas at El Paso have demonstrated the ability to produce a number of working devices by novel combinations of SL and DW. Figure illustrates the process plan for fabrication of a magnetic flux sensor using SL and a nozzle-based DW process. 2016 3D Printing Electronics Conference Eindhoven Stratasys and Optomec 21 2016 3D Printing Electronics Conference Eindhoven And a lot of more other methods… CVD Electro-photography (Xerox method) …… S. Yang and J.R.G. Evans., Powder Technology. Volume 178, Issue 1, 5 September 2007, Pages 56-72 M. Vaezi, S Chianrabutra, B. Mellor & Shoufeng Yang Virtual and Physical Prototyping, Volume 8, Issue 1, 2013 Multiple material additive manufacturing – Part 1: a review 22 2016 3D Printing Electronics Conference Eindhoven Inspiration 23 2016 3D Printing Electronics Conference Eindhoven Our method Schematic diagram of the apparatus Powder Powder hopper hopper Amplifier (powder1) (powder2) Displacement probe Glass tube Oscilloscope Steel rod Sub-woofer Computer Mixing hopper Microscope and camera 24 Powder bed (3D Table) 2016 3D Printing Electronics Conference Eindhoven Dancing to the Music Copper powder dancing in tube Tube Inside Diameter: 450 m Music: Vivaldi - Summer Allegro https://www.youtube.com/watch?v=pH4xHU33AOY S. Yang and J.R.G. Evans, Computer control of powder flow for solid freeforming by acoustic modulation, Powder Technology 133 (2003) 251-254. 25 2016 3D Printing Electronics Conference Eindhoven Advantage of DPP: Wide range of materials 2 mm 2 mm 2 mm 316L Al Al2O3 2 mm 2 mm 2 mm SS CoCr Cu Glass 26 2016 3D Printing Electronics Conference Eindhoven Wide range of materials 2 mm 2 mm 2 mm Glass-filled PA S45 SiC 2 mm SS2 mm SnPb WC 27 2016 3D Printing Electronics Conference Eindhoven Advantage of DPP: Wide Track width range Track Width = 200 µm Track Width = 12 mm From micrometer-scale to millimeter-scale 28 2016 3D Printing Electronics Conference Eindhoven Copper powder printing Particle size (d50) = 13.77 µm 29 2016 3D Printing Electronics Conference Eindhoven Copper powder printing Nozzle diameter = 60 µm , Table speed = 5 mm/s, Standoff Track Width ‹100 µm distance = 150 µm 30 2016 3D Printing Electronics Conference Eindhoven Circuit-printing concept Printing conductive material onto a 3D-printing part with electronic components 31 2016 3D Printing Electronics Conference Eindhoven Three different powders @ different speeds Moving speed = 15 mm/s Moving speed = 10 mm/s Unpublished data 2016 3D Printing Electronics Conference Eindhoven Pyrotechnics 3D Printing Pyrotechnics manufacturing is dangerous – Relies on experience and rules of thumb rather than quantitative analysis and automatic control. – Heavy labor based process 2016 3D Printing Electronics Conference Eindhoven Printed pyrotechnic samples Sponsored by DSTL Collaborator: Simon Coles and Ranko Vrcelj 2016 3D Printing Electronics Conference Eindhoven Enjoy Coffee and Cake: Coffee Art Printing using chocolate powder 35 2016 3D Printing Electronics Conference Eindhoven Conclusion and challenges Wide range of dry powders can be dispensed and controlled from different size of nozzles this is a small step in multiple materials AM but the first step Further investigation on laser sintering/melting and materials interaction 36 2016 3D Printing Electronics Conference Eindhoven Acknowledge: Prof Julian Evans Dr. Simon Coles Dr. Ranko Vrcelj Dr. Brian Mellor Prof Richard Oreffo Prof Jayanta Sahu Prof Jim Scanlan All my PhD students and Project students EPSRC Invibio Ltd. GSK Ltd. DSTL… THANKS YOU 37 2016 3D Printing Electronics Conference Eindhoven.
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