A Review of Degradation Behavior and Modeling of Capacitors: Preprint
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Review of Technologies and Materials Used in High-Voltage Film Capacitors
polymers Review Review of Technologies and Materials Used in High-Voltage Film Capacitors Olatoundji Georges Gnonhoue 1,*, Amanda Velazquez-Salazar 1 , Éric David 1 and Ioana Preda 2 1 Department of Mechanical Engineering, École de technologie supérieure, Montreal, QC H3C 1K3, Canada; [email protected] (A.V.-S.); [email protected] (É.D.) 2 Energy Institute—HEIA Fribourg, University of Applied Sciences of Western Switzerland, 3960 Sierre, Switzerland; [email protected] * Correspondence: [email protected] Abstract: High-voltage capacitors are key components for circuit breakers and monitoring and protection devices, and are important elements used to improve the efficiency and reliability of the grid. Different technologies are used in high-voltage capacitor manufacturing process, and at all stages of this process polymeric films must be used, along with an encapsulating material, which can be either liquid, solid or gaseous. These materials play major roles in the lifespan and reliability of components. In this paper, we present a review of the different technologies used to manufacture high-voltage capacitors, as well as the different materials used in fabricating high-voltage film capacitors, with a view to establishing a bibliographic database that will allow a comparison of the different technologies Keywords: high-voltage capacitors; resin; dielectric film Citation: Gnonhoue, O.G.; Velazquez-Salazar, A.; David, É.; Preda, I. Review of Technologies and 1. Introduction Materials Used in High-Voltage Film High-voltage films capacitors are important components for networks and various Capacitors. Polymers 2021, 13, 766. electrical devices. They are used to transport and distribute high-voltage electrical energy https://doi.org/10.3390/ either for voltage distribution, coupling or capacitive voltage dividers; in electrical sub- polym13050766 stations, circuit breakers, monitoring and protection devices; as well as to improve grid efficiency and reliability. -
Basic PCB Material Electrical and Thermal Properties for Design Introduction
1 Basic PCB material electrical and thermal properties for design Introduction: In order to design PCBs intelligently it becomes important to understand, among other things, the electrical properties of the board material. This brief paper is an attempt to outline these key properties and offer some descriptions of these parameters. Parameters: The basic ( and almost indispensable) parameters for PCB materials are listed below and further described in the treatment that follows. dk, laminate dielectric constant df, dissipation factor Dielectric loss Conductor loss Thermal effects Frequency performance dk: Use the design dk value which is assumed to be more pertinent to design. Determines such things as impedances and the physical dimensions of microstrip circuits. A reasonable accurate practical formula for the effective dielectric constant derived from the dielectric constant of the material is: -1/2 εeff = [ ( εr +1)/2] + [ ( εr -1)/2][1+ (12.h/W)] Here h = thickness of PCB material W = width of the trace εeff = effective dielectric constant εr = dielectric constant of pcb material df: The dissipation factor (df) is a measure of loss-rate of energy of a mode of oscillation in a dissipative system. It is the reciprocal of quality factor Q, which represents the Signal Processing Group Inc., technical memorandum. Website: http://www.signalpro.biz. Signal Processing Gtroup Inc., designs, develops and manufactures analog and wireless ASICs and modules using state of the art semiconductor, PCB and packaging technologies. For a free no obligation quote on your product please send your requirements to us via email at [email protected] or through the Contact item on the website. -
Agilent Basics of Measuring the Dielectric Properties of Materials
Agilent Basics of Measuring the Dielectric Properties of Materials Application Note Contents Introduction ..............................................................................................3 Dielectric theory .....................................................................................4 Dielectric Constant............................................................................4 Permeability........................................................................................7 Electromagnetic propagation .................................................................8 Dielectric mechanisms ........................................................................10 Orientation (dipolar) polarization ................................................11 Electronic and atomic polarization ..............................................11 Relaxation time ................................................................................12 Debye Relation .................................................................................12 Cole-Cole diagram............................................................................13 Ionic conductivity ............................................................................13 Interfacial or space charge polarization..................................... 14 Measurement Systems .........................................................................15 Network analyzers ..........................................................................15 Impedance analyzers and LCR meters.........................................16 -
Application Note: ESR Losses in Ceramic Capacitors by Richard Fiore, Director of RF Applications Engineering American Technical Ceramics
Application Note: ESR Losses In Ceramic Capacitors by Richard Fiore, Director of RF Applications Engineering American Technical Ceramics AMERICAN TECHNICAL CERAMICS ATC North America ATC Europe ATC Asia [email protected] [email protected] [email protected] www.atceramics.com ATC 001-923 Rev. D; 4/07 ESR LOSSES IN CERAMIC CAPACITORS In the world of RF ceramic chip capacitors, Equivalent Series Resistance (ESR) is often considered to be the single most important parameter in selecting the product to fit the application. ESR, typically expressed in milliohms, is the summation of all losses resulting from dielectric (Rsd) and metal elements (Rsm) of the capacitor, (ESR = Rsd+Rsm). Assessing how these losses affect circuit performance is essential when utilizing ceramic capacitors in virtually all RF designs. Advantage of Low Loss RF Capacitors Ceramics capacitors utilized in MRI imaging coils must exhibit Selecting low loss (ultra low ESR) chip capacitors is an important ultra low loss. These capacitors are used in conjunction with an consideration for virtually all RF circuit designs. Some examples of MRI coil in a tuned circuit configuration. Since the signals being the advantages are listed below for several application types. detected by an MRI scanner are extremely small, the losses of the Extended battery life is possible when using low loss capacitors in coil circuit must be kept very low, usually in the order of a few applications such as source bypassing and drain coupling in the milliohms. Excessive ESR losses will degrade the resolution of the final power amplifier stage of a handheld portable transmitter image unless steps are taken to reduce these losses. -
Dielectric Loss
Dielectric Loss - εr is static dielectric constant (result of polarization under dc conditions). Under ac conditions, the dielectric constant is different from the above as energy losses have to be taken into account. - Thermal agitation tries to randomize the dipole orientations. Hence dipole moments cannot react instantaneously to changes in the applied field Æ losses. - The absorption of electrical energy by a dielectric material that is subjected to an alternating electric field is termed dielectric loss. - In general, the dielectric constant εr is a complex number given by where, εr’ is the real part and εr’’ is the imaginary part. Dept of ECE, National University of Singapore Chunxiang Zhu Dielectric Loss - Consider parallel plate capacitor with lossy dielectric - Impedance of the circuit - Thus, admittance (Y=1/Z) given by Dept of ECE, National University of Singapore Chunxiang Zhu Dielectric Loss - The admittance can be written in the form The admittance of the dielectric medium is equivalent to a parallel combination of - Note: compared to parallel an ideal lossless capacitor C’ with a resistance formula. relative permittivity εr’ and a resistance of 1/Gp or conductance Gp. Dept of ECE, National University of Singapore Chunxiang Zhu Dielectric Loss - Input power: - Real part εr’ represents the relative permittivity (static dielectric contribution) in capacitance calculation; imaginary part εr’’ represents the energy loss in dielectric medium. - Loss tangent: defined as represents how lossy the material is for ac signals. Dept of ECE, National University of Singapore Chunxiang Zhu Dielectric Loss The dielectric loss per unit volume: Dept of ECE, National University of Singapore Chunxiang Zhu Dielectric Loss - Note that the power loss is a function of ω, E and tanδ. -
A Comprehensive Guide to Selecting the Right Capacitor for Your Specific Application
CAPACITOR FUNDAMENTALS EBOOK A Comprehensive Guide to Selecting the Right Capacitor for Your Specific Application 2777 Hwy 20 (315) 655-8710 [email protected] Cazenovia, NY 13035 knowlescapacitors.com CAPACITOR FUNDAMENTALS EBOOK TABLE OF CONTENTS Introduction .................................. 2 The Key Principles of Capacitance and How a Basic Capacitor Works .............................. 3 How Capacitors are Most Frequently Used in Electronic Circuits ............................. 6 Factors Affecting Capacitance .................. 9 Defining Dielectric Polarization .................. 11 Dielectric Properties ........................... 15 Characteristics of Ferroelectric Ceramics ......................... 19 Characteristics of Linear Dielectrics .............. 22 Dielectric Classification ......................... 24 Test Parameters and Electrical Properties .......... 27 Industry Test Standards Overview. 32 High Reliability Testing .......................... 34 Visual Standards For Chip Capacitors ............. 37 Chip Attachment and Termination Guidelines ...... 42 Dissipation Factor and Capacitive Reactance ..... 49 Selecting the Right Capacitor for Your Specific Application Needs ............................ 51 1 CAPACITOR FUNDAMENTALS EBOOK INTRODUCTION At Knowles Precision Devices, our expertise in capacitor technology helps developers working on some of the world’s most demanding applications across the medical device, military and aerospace, telecommunications, and automotive industries. Thus, we brought together our top engineers -
LOSSY CAPACITORS 1 Dielectric Loss
Chapter 3—Lossy Capacitors 3–1 LOSSY CAPACITORS 1 Dielectric Loss Capacitors are used for a wide variety of purposes and are made of many different materials in many different styles. For purposes of discussion we will consider three broad types, that is, capacitors made for ac, dc, and pulse applications. The ac case is the most general since ac capacitors will work (or at least survive) in dc and pulse applications, where the reverse may not be true. It is important to consider the losses in ac capacitors. All dielectrics (except vacuum) have two types of losses. One is a conduction loss, representing the flow of actual charge through the dielectric. The other is a dielectric loss due to movement or rotation of the atoms or molecules in an alternating electric field. Dielectric losses in water are the reason for food and drink getting hot in a microwave oven. One way of describing dielectric losses is to consider the permittivity as a complex number, defined as = − j = ||e−jδ (1) where = ac capacitivity = dielectric loss factor δ = dielectric loss angle Capacitance is a complex number C∗ in this definition, becoming the expected real number C as the losses go to zero. That is, we define C∗ = C − jC (2) One reason for defining a complex capacitance is that we can use the complex value in any equation derived for a real capacitance in a sinusoidal application, and get the correct phase shifts and power losses by applying the usual rules of circuit theory. This means that most of our analyses are already done, and we do not need to start over just because we now have a lossy capacitor. -
New Polymer Dielectric for High Energy Density Film Capacitors
New Polymer Dielectric For High Energy Density Film Capacitors Paul Winsor, IV and Edward Lobo CDE 167 John Vertente Blv. New Bedford, MA 02745 Tel.: 508-994-9661 Fax: 508-995-3000 [email protected] [email protected] M. Zafar A. Munshi and Ayad Ibrahim Lithium Power Technolgies, Inc. 20955 Morris Avenue Manvel, TX 77578-3819 Tel.: 281-489-4889 Fax: 281-489-6644 [email protected] Abstract A new dielectric film has been developed that greatly increases the energy density capability of plastic film capacitors. This film has been developed over the past four years by a consortium consisting of Lithium Power Technologies, CDE Corp., Dupont Teijin Films (DTF), Case Western Reserve University, and Ohio Aerospace Institute in an Advanced Technology Program funded by the Department of Commerce. We are now entering the commercialization stage of this project. Plastic film capacitors have been the capacitor of choice for many power electronics, power conditioning, and pulse power applications such as motors, lighting and portable defibrillators because of their low dissipation factor (DF), excellent high-frequency response, high insulation resistance (IR), self-healing ability, and high-voltage capabilities. Existing capacitor technologies now present a barrier to achieving significant packaging (size and weight) reductions and struggle to meet new market-driven performance requirements. These markets not only include hybrid electric vehicles, wind power and portable defibrillators, but also the military and aerospace markets where the power source must be incredibly lightweight. Ultra thin gauge biaxially oriented films produced by DTF in thicknesses of 1.4 to 4 microns and thicker were constructed into metallized capacitors ranging from 1 to 140 microFarads. -
A Guide to Capacitors
The Handyman's Guide to CAPACITORS 32/<(67(5),/0&$3$&,7256 Polyester Films use layers of metal and polyester (Mylar â) dielectric to make a wide Capacitors comprise the largest variety of electronic components. There are range of capacitances in a many types of capacitors, great variations in their performance, many relatively small package at low methods of packaging and marking. and dozens of major manufacturers not voltages. These have become the to mention new types constantly being introduced with specific applications standard caps for DC applications and performances As result, capacitors open cause lots of problems for The "rolled" film layers cause homebrewers. Hopefully this article will take some of the mystery out of the high dissipation and capacitance myriad of capacitors available, plus present some of the classic "do's and vs. temperature problems and should be used carefully in high frequency or don'ts" high current applications 35,1&,3$/&$3$&,7257<3(6 There are many capacitor types, which usually refers to the material used 32/<3523(/(1(),/0&$3$&,7256 for the electrodes, dielectric, and the packaging or sealing method. Here are Polypropylene Films use layers of metal and polypropylene dielectric films some of the major capacitor types used by QRPers: virtually identical to Polyester Film caps. The polypropylene however, is a dielectric offering a higher breakdown voltage ',6.&(5$0,&&$3$&,7256 than polyester, and thus more suitable for high voltage Disk Ceramics consist of two metallic applications. such as switching power supplies. They also have plates separated by a ceramic low loss factors and good capacitance stability making them a dielectric whose area and spacing good choice for high frequency applications, including determines the capacitance. -
Introduction Characteristics and Definitions Used for Film Capacitors Vishay
Introduction Vishay Characteristics and Definitions used for Film Capacitors COMMON FILM DIELECTRICS USED IN FILM CAPACITORS PRODUCTS DIELECTRIC (1) PARAMETER UNIT KT KN KI KP Dielectric constant 1 kHz 3.3 3 3 2.2 - Dissipation factor 1 kHz 50 40 3 1 10-4 Dissipation factor 10 kHz 110 70 6 2 10-4 Dissipation factor 100 kHz 170 100 12 2 10-4 Dissipation factor 1 MHz 200 150 18 4 10-4 Volume resistivity 10+17 10+17 10+17 10+18 Ωcm Dielectric strength 400 300 250 600 V/µm Maximum application temperature 125 150 160 125 °C Power density at 10 kHz 50 40 2.5 0.6 W/cm3 Dielectric absorption 0.2 1.2 0.05 0.01 % Notes (1) According to “IEC 60062”: KT = polyethylene terephthalate (PETP) KN = polyethylene naphtalate (PEN) KI = polyphenylene sulfide (PPS) KP = polypropylene (PP) • Polyethylene terephthalate (PETP) and polyethylene naphtalate (PEN) films are generally used in general purpose capacitors for applications typically with small bias DC voltages and/or small AC voltages at low frequencies. • Polyethylene terephthalate (PETP) has as its most important property, high capacitance per volume due to its high dielectric constant and availability in thin gauges. • Polyethylene naphtalate (PEN) is used when a higher temperature resistance is required compared to PET. • Polyphenylene sulfide (KI) film can be used in applications where high temperature is needed eventually in combination with low dissipation factor. • Polypropylene (KP) films are used in high frequency or high voltage applications due to their very low dissipation factor and high dielectric strength. -
Table of Contents
NOVACAP TECHNICAL BROCHURE Table of Contents A. INTRODUCTION ................................................................................................ 2 B. CAPACITOR APPLICATIONS ......................................................................... 3 C. THE BASIC CAPACITOR ................................................................................. 4 D. CAPACITANCE ................................................................................................... 5 E. FACTORS AFFECTING CAPACITANCE ...................................................... 5 F. DIELECTRIC BEHAVIOR ................................................................................. 7 G. DIELECTRIC PROPERTIES ......................................................................... 13 H. FERROELECTRIC CERAMICS.................................................................... 20 I. LINEAR DIELECTRICS ................................................................................... 24 J. CLASSES OF DIELECTRICS ......................................................................... 25 K. TEST PARAMETERS AND ELECTRICAL PROPERTIES...................... 29 L. INDUSTRY TEST STANDARDS..................................................................... 35 M. HIGH RELIABILITY TESTING .................................................................... 37 N. VISUAL STANDARDS FOR CHIP CAPACITORS ..................................... 40 O. CHIP USER GUIDELINES ............................................................................... 46 1 NOVACAP -
New Advances in Printed Circuits
New Advances in Printed Circuits United States Department of Commerce National Bureau of Standards Miscellaneous Publication 192 Printed Circuit Techniques . Printed circuits have emerged from purely laboratory experiments to become one of the most practical new ideas of mass production of electronic devices. Although many of the techniques were known and used long ago, printed circuits as we understand them today represent a comparatively recent accomplishment. Printed Circuit Techniques presents a comprehensive treatment of the subject. The scope of the book is indicated by the following chapters: Painting Die-Stamping Spraying Dusting Chemical Deposition Performance Vacuum Processes Applications . The book consists of ten chapters, totaling forty-three large, two-column pages. It is adequately illustrated with twenty-one halftones, eighteen line cuts, and five tables. Available from the Superintendent of Documents, U. S. Government Printing Office, Washington 25, D. C. Price: 25 cents a copy. UNITED STATES DEPARTMENT OF COMMERCE • Charles Sawyer, Secretary NATIONAL BUREAU OF STANDARDS • E. U. Condon, Director New Advances in Printed Circuits Proceedings of the First Technical Symposium on Printed Circuits held October 15, 1947, in Washington, D. C, under the Sponsorship of the Aeronautical Board and Technical Direction of the National Bureau of Standards Miscellaneous Publication 192 Issued November 22, 1948 For sale by the Superintendent of Documents, U. S. Government Printing Office, Washington 25, D. C. Price 40 cents PREFACE The wide interest shown in printed circuits by Government, scientific and industrial organizations throughout the country, since the first release of information by the National Bureau of Standards in February 1946, in- creased to the point where it was found desirable to call a general technical symposium for the purpose of bringing together all interested persons and affording a free and open presentation of the status, applications and limitations of the art.