Printed in Germany. All rights reserved. Germany.rights in All Printed Elektronik. Mikro MEN © Copyright 2006. August Germany product. the released and adapted consequently has Elektronik is only possible after the user has precisely specified the operation environment and after MEN Mikro plants such in products MEN‘s of Application purposes. therapeutical for used appliances medical in application for and reactors the nuclear in use for of suited not are use Elektronik Mikro MEN of or products The application the of out arising liability document. this in described products any assume not does Elektronik Mikro MEN notice without herein products design. reliability,the or improve function to on changes make to right the reserves and products its of use the from arising damages incidental or consequential for liability no accepts Elektronik Mikro MEN inaccuracies. for assumed is responsibility however,no publication; of Information in this document has been carefully checked and is believed to be accurate as of the date holders. respective their of trademarks registered or trademarks are names product or brand All ■ ■ Industry). Electrical the of Services and Products for Delivery and Supply ■ +49-911-99335-161 under Germany in hotline ■ ■ ■ ■ Information Shipping and Ordering Embedded Solutions reliability and flexibility.and reliability innovation, maximizing while applications industrial demanding for solutions I/O and computing embedded provide to is mission Our Warranty on MEN products is 24 months. 24 is products MEN Warrantyon 200. USD or 100 EUR is value order Minimum of Conditions (General ZVEI to according insurance, excluding works, ex done is Shipment support our call or [email protected] to mail or websites our to refer please support technical For websites. our from download for ready are packages Software websites. our from download for ready are manuals user software and Hardware websites. MEN's on sheets data corresponding the to refer please numbers ordering product For System from WindRiver from System Operating VxWorksReal-time VectorInformatik from Stack Protocol CANopen Solutions Real-Time Sysgo from Linux Embedded Softing from Stack Protocol Profibus Schroff from TechnologyRack 19“ QNX from System Operating Real-time QNX Semiconductor Freescale from Processors PowerPC Corporation Altera from Cores Processor Soft TechnologyNIOS FPGA and TechnologyPartners Manufacturers Group Manufacturers Computer Industrial PCI Automation in CAN Consortium Embedded PC/104 Group User Profibus Alliance Standards Open Alliance Systems PXI technologies mezzanine for group user international The of Member ISO 9001:2000 ISO 14001:2005 ZA de la Châtelaine la de ZA Cassin René rue 18, SA Elektronik Mikro MEN France www.men.de [email protected] 99335-901 911 (0) +49 Fax: 99335-0 911 (0) +49 Phone: Nürnberg 90411 5-7 Straße Neuwieder (Headquarters) GmbH Elektronik Mikro MEN Germany www.menmicro.com [email protected] 267-8803 (512) Fax: 267-8883 (512) Phone: 78645-4160 TX Vista, Lago 4160 Box PO Inc. Micro MEN USA www.men-france.fr [email protected] 211 955 450 (0) +33 Fax: 312 955 450 (0) +33 Phone: Gaillard 74240
Product Overview 2006 Standard Product Overview 2006 2006 Overview Product Standard Solutions Embedded
Computers for Computers Applications Board-Level Board-Level Industrial Industrial
Embedded Solutions MEN M-Modules 110 Software PC-MIP 58 System-on-Module 4 CompactPCI MENProduct Lines 28 VMEbus 62 Mezzanine 42 Power PMC 44 SA 45 Busless 47 Busless 50 System-on-Module shock, drop, bump, vibration, humidity,resistancevibration, chemical bump, drop, shock, temperature, operation +85°C to -40 for: Designed Contents Embedded Solutions Embedded
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Embedded Solutions CompactPCI MEN p. 17 p. 16 p. 16 p. 15 p. 14 p. 15 p. – 13 p. 12 p. 12 p. 10 p. 9 p. 12 p. 11 p. 7 p. 6 p. MEN CompactPCI functions. I/O further by extensionindividual and flexible for slots mezzanineinclude also cards Many storage. CompactFlash FRAM, or SRAM non-volatile plus memory storageconfigurationmassvoltagecontrol.possibilitiesand ratureand systemMemoryincludestandard DRAM functionality,PC art featureboardsCPUindustrialreal-time tempe allwatchdogsfunctionsasfor orsuchclock, on Intel MENoffers a full range of 3U and 6U CompactPCI for implementationfor furtherapplication-specificof functions. PC-MIPand XMCPMC, Overview – 3U/6U CompactPCI 3U/6U – Overview F203 F204 F205 F206 F206N F206I F207 F301 F600 F601 F9 F11 F12 F13 F14 F15 CompactPCI 3U
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Carrier PC-MIP Carrier M-Module Carrier M-Module OctalUART SlaveSBC Carrier PC/104 Carrier PCI-104 Switch Ethernet F14/F15 I/O“ „Legacy SideCard F14/F15 media“ „Multi- SideCard SBC SBC SBC SBC SBC SBC Type ® and PowerPC Core NiosSoft 1.8GHz 600MHz.. CeleronM Pentium/ M 400..933MHz Celeron PentiumIII/ ULV/ULP 384MHz MPC5200/ PowerPC 800MHz MPC8540/ PowerPC 373,1GHz CeleronM 760,2GHz PentiumM T2500,2GHz IntelCore Duo CPU ® solutions are completed by a huge number of industrial I/O boards based on the M-Module ® architectures for rugged industrial and embedded applications. In addition to state-of-the- ® forpower supply toCompactPCI 4HP,connected powersupply CompactPCIfor connectedto 4HPor8HP, 1orcPCI2 slots PCIsystem slot, 32-bit/33MHz orstand-alone cPCI3 slots PCIsystem slot, 32-bit/33MHz CompactPCI1 slot PCIsystem slot, 32-bit/33MHz CompactPCI1 slot PCIsystem slot, 32-bit/33MHz orstand-alone cPCI1 Express slot cPCI1 slot or PCIsystem slot, 32-bit/33MHz orstand-alone cPCI1 Express slot cPCI1 slot or PCIsystem slot, 32-bit/33MHz cPCI cPCI/PXI 1 CompactPCI1 slot CompactPCI1 slot CompactPCI1 slot 3.3VVIO CompactPCI1 slot, 32-bit/33..66-MHz peripheralslot CompactPCI1 32-bit/33..66-MHz CompactPCI2 slots 32-bit/33-MHz, PCI-1041 module cPCI2 slots with 32-bit/33-MHz, CompactPCI2 slots 32-bit/33-MHz, ANSI/IEC mezzanine standards. A growing number of boards are equipped with FPGAsequippedareboardswithANSI/IEC growingmezzanine standards.ofnumber A ® Express / Boards Express 16MBDRAM 2MBFlash, MBFlash2 32MBSDRAM, CompactFlash GBDDR1RAM, CompactFlash 2MBSRAM, 512MBDRAM, graphicsRAM SRAM,16MB NANDFlash, 2MB 2MBNVRAM, DDRSDRAM, 256MBonboard NANDFlash (SO-DIMM), GBDDR2DRAM 1.8”hard disk CompactFlashor DRAM(soldered), 2GBDDR2 1.8”hard disk CompactFlashor DRAM(soldered), 2GBDDR2 max. Memory
(viafront, extension cards 1VGA, 2DVI, audio GigabitEthernet, 8USB 2.0, PCIe4lanes x1, 2SATA, 2 orrear I/O) (viafront, extension cards 1VGA, 2DVI, audio GigabitEthernet, 8USB 2.0, PCIe6lanes x1, 2SATA, 2 Interfaces (RS232/422/485,isol./not i.) layervia SA-Adapters Octal16450 UART; physical 1debug interface Ethernetport (rear J2) troller(rear J1); Opt.: 1Fast (front);1Fast Ethernet con Upto 8Fast Ethernet ports notisolated) (RS232/422/485,isolated/ viaSA-Adapters 1..4UARTs notisolated) (RS232/422/485,isolated/ 0..1COM via SA-Adapter 1..2DVI, 1audio, 2IDE 4USB 2.0, DVI,1Gigabit Ethernet, keyboard/mouse VGA/digitalvideo output, USB1.1, opt. COM 2 2Fast Ethernet, COM 1, 2 USB1.1, 2CAN 2Fast Ethernet, COM 1, Ethernet,1COM 2Gigabit Ethernet, 1Fast orrear I/O) ® single-board computers on different performance levels based ® Boards ® , NAND Flash and on-board hard disks for program for disks hard on-board and Flash NAND ,
- FPGA On-board I/Ofunctions foruser-def. AlteraCycl. I/Ofunctions user-defined Cyclonefor Altera I/Ofunctions user-defined Cyclonefor Altera I/Ofunctions user-defined Cyclonefor Altera F601Multimedia– F600Legacy– I/O 3U/6Usystems: Extensioncards for F602PCI–Express F601Multimedia– F600Legacy– I/O 3U/6Usystems: Extensioncards for Extensions Local 3 PC-MIP3 slots M-Module1 slots M-Module2 slots FPGAforcustom I/O FPGAforcustom I/O PCI-to-ISAbridge PC/1041 slot, modules PCI-104Upto4 2.5”SATA drive 2.5”SATA drive extensioncard keyb./mouse,COM1), IDE,USB,2 VGA, RearI/Ocard (Ethern., localhard disk SAadapters,7 FPGAforcustom I/O, F602PCI–Express QNX VxWorks, Linux, Windows, Linux Windows, Software driversw PC-MIP driversw M-Module driversw M-Module WindowsXP VxWorks, Linux, updatetools devel.pack., designs, Niossample software driver PCI-104 software driver PCI-104 necessary not software Driver QNX VxWorks, Linux, Windows, QNX VxWorks, Linux, Windows, VxWorks Linux, Windows, VxWorks Linux, Windows, QNX VxWorks, Linux, QNX VxWorks, Linux,
instrumentation, robotics, automation, Industrial multimedia instrumentation, robotics, automation, Industrial Applications instrumentation Industrialautom., instrumentation Industrialautom., instrumentation Industrialautom., industrialautom. mobilecomp., Transportation, automation industrial mobilecomp., Transportation, industrialautom. mobilecomp., Transportation, industrialautom. mobilecomp., Transportation, industrialautom. computing, mobile Transportation, instrumentation robotics, automation, Industrial instrumentation robotics, automation, Industrial instrumentation automation, Industrial automation industrial mobilecomp., Transportation, medical robotics, automation, industrial mobilecomp., Transportation, robotics,medical industrialautom., mobilecomp., Telecom, multimedia
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6U CompactPCI 6U shock, drop, bump, vibration, humidity,resistancevibration, chemical bump, drop, shock, temperature, operation +85°C to -40 for: Designed 25 p. D202 25 p. D203 24 p. D302 23 p. D3A 23 p. D3B 22 p. D3C 20 p. D4 21 p. D5C 19 p. D601 18 p. D6
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carrier PC-MIP carrier M-Module BinaryI/O SBC SBC SBC SBC SBC SBC Blade Server SBC, Type www.men.de/products/ 300MHz MPC8245/ PowerPC 300MHz MPC8245/ PowerPC 300MHz MPC8245/ PowerPC 1.7and2.2GHz Pentium4 Mobile 800MHz MPC8540/ PowerPC 1GHz Celeron373,M 760,M 2GHz UptoPentium 1GHz CeleronM upto2GHz, PentiumM CPU
F15 – 3U CompactPCI®/ Express SBC with Intel ®Core™ Duo Processor 1 CompactPCI1 slot CompactPCI1 slot CompactPCI1 slot slot,cPCI1 slot 32-bitPCIsystem slot,cPCI1 slot 32-bitPCIsystem slot,cPCI1 slot 32-bitPCIsystem swap,PICMG 2.16 cPCI1 slot, hot PCIsystem slot, 64-bit/66MHz swap,PICMG 2.16 cPCI1 slot, hot peripheralslot, PCIsystem/ 64-bit/66MHz orstand-alone CompactPCI1 slot PCIsystem slot, 32-bit/33MHz PICMG2.16, 2.9 hotswap, slot,cPCI1 slot, PCI-X;PCIsystem 64-bit/66MHz.. PXI Compact ® Boards PCI/ CompactFlash 512MBDRAM, CompactFlash 512MBDRAM, CompactFlash 512MBDRAM, CompactFlash 1GBDRAM, FRAM NANDFlash, 2GBECC DRAM, CompactFlash DRAM(soldered), 2GBDDR2 NANDFlash FRAM, SDRAM,SRAM, 2GBECC DDR2 max. Memory keyboard/mouse COMs,4 USB, IDE, Fast2 Ethernet, keyboard/mouse COMs,4 USB, IDE, Fast2 Ethernet, keyboard/mouse COMs,4 USB, IDE, Fast2 Ethernet, floppy,keyboard/mouse COMs,2 USB,3 LPT, Gigabit3 Ethernet, DVI(VGA/TFT), COMs,6 parallel ATA Fast1 Ethernet, upto Rear:Gigabit2 Ethernet, Front:RS2321 debug (viarear I/O) VGA,1DVI 1orLVDS Ethernet,USB32.0, SATA,2 Gigabit2 COMsupto2 grahics,USB32.0, SATA,2 PATA,2 Gigabit4 Ethernet, PCIelanes4 x4to Interfaces I/Ofunctions foruser-defined AlteraCyclone I/Ofunctions foruser-defined AlteraCyclone FPGA On-board 6PC-MIP slots slots 4M-Module TypeI/II 3PC-MIP slots slots 3M-Module 2PMC slots or1 PMC slot TypeI/II, 2PC-MIP slots 2PMC slots slots or2 PMC or1 lane x8) 2lanes x4 2XMC (PCIe Extensions Local software PC-MIPdriver driversoftware M-Module OS-9,QNX Linux,VxWorks, Windows,RTX, OS-9,QNX VxWorks, Linux, OS-9,QNX VxWorks, Linux, OS-9,QNX VxWorks, Linux, VxWorks Linux, Windows, QNX VxWorks, Linux, QNX VxWorks, Linux, Windows, Linux Windows, Software MEN instrumentation Industrialautom., instrumentation Industrialautom., instrumentation automation, Industrial automation Industrial automation Industrial automation Industrial instrumentation communication, Industrialautom., datacom Telecom, andvisualization in-flightcontrol Aerospace datacom Telecom, Applications CompactPCI
CompactPCI MEN CompactPCI
F15 – 3U CompactPCI®/Express Core™ Duo SBC
■ Intel® Core™ Duo T00, GHz ■ PCI Express® 6 lanes x1 ■ HP system master or busless ■ -bit CompactPCI® or cPCI Express® ■ Up to GB DDR DRAM soldered ■ CompactFlash® or 1.8" hard disk slot ■ SATA interfaces ■ Video via VGA and DVI ■ Gigabit Ethernet (PCIe) ■ Up to 8 USB .0 ■ High Definition audio ■ Prepared for rugged environments
CPU ■ Type I; True IDE; DMA support ■ VGA connector at front panel ■ Dual-core Intel® Core™ Duo T2500, Mass Storage ■ Two additional DVI connectors at front panel L2400 (LV), U2500 (ULV) or single-core ■ Parallel IDE (PATA) optional via side card Celeron® M 440, M 423 (ULV) ■ One IDE port for local CompactFlash®, or: ■ Simultaneous connection of two monitors ■ Up to 2.0GHz processor core frequency ■ One IDE hard-disk/CD-ROM port via I/O ■ Up to 667MHz front-side bus frequency on-board connector ■ USB ■ ■ CompactPCI ■ Chipset Serial IDE (SATA) Two USB 2.0 ports via Series A connectors ■ Northbridge: Intel® 945GM Express ■ Two channels via side-board connector at front panel ■ Southbridge: Intel® ICH7-M DH ■ Transfer rates up to 150MB/s ■ Four USB 2.0 ports via side-board connector Memory ■ RAID level 0/1 support ■ Two USB 2.0 ports via rear I/O on request ■ 2MB L2 cache integrated in Core Duo Graphics ■ UHCI implementation (1MB with Celeron® M) ■ Integrated in 945GM Express chipset ■ Data rates up to 480Mbits/s ■ Up to 4 GB SDRAM system memory ■ 200/250MHz 256-bit graphics core ■ Ethernet ■ Soldered; DDR2 ■ Up to 10.6 GB/s memory bandwidth ■ Two 10/100/1000Base-T Ethernet channels ■ 667MHz memory bus frequency ■ Maximum resolution: 2048 x 1536 pixels ■ RJ45 connectors at front panel ■ Dual-channel, 2x64 bits 16M colors @ 75Hz refresh rate ■ Ethernet controllers are connected by ■ 8Mbits boot Flash ■ Dynamic Display Modes for flat-panel, two x1 PCIe lanes ■ Serial EEPROM 2kbits for factory settings wide-screen and Digital TV support ■ On-board LEDs to signal activity status and ■ CompactFlash® card interface ■ Dual screen support via ADD2 digital connection speed ■ Via on-board IDE video devices ■ High Definition (HD) audio ■ Accessible via side-board connector Front Connections ■ VGA ■ Two USB 2.0 (Series A) ■ Two Ethernet (RJ45) Miscellaneous ■ Real-time clock, buffered by a GoldCap ■ Watchdog timer ■ Temperature measurement ■ One user LED ■ Reset button PCI Express® ■ Two x1 lanes to connect local 1000Base-T Ethernet controllers (250MB/s in each dir.) ■ One x4 or four x1 lanes for extension through side-board connector CompactPCI® Bus ■ Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0 ■ CompactPCI® Express support (EXP.0 R1.0) ■ System slot ■ 32-bit/33-MHz CompactPCI® bus ■ V(I/O): +3.3V (+5V tolerant) Busless Operation ■ Board can be supplied with +5V only, all other voltages are generated on the board
Intel® Virtualization Technology, allows a platform to run multiple operating systems and applications in independent partitions; one computer system can function as multiple "virtual" systems
6 MEN CompactPCI
F14 – 3U CompactPCI®/Express Pentium® M SBC
■ ULV Celeron® M 7 up to Pentium® M 760 ■ PCI Express® lanes x1 ■ HP system master or busless ■ -bit CompactPCI® or cPCI Express® ■ Up to 1 GB DDR DRAM soldered ■ CompactFlash® or 1.8" hard disk slot ■ SATA interfaces ■ Video via VGA and DVI ■ Gigabit Ethernet (PCIe) ■ Up to 8 USB .0 ■ High Definition audio ■ Power consumption 11..W ■ Prepared for rugged environments
CPU ■ Ethernet ■ One user LED ■ ULV Celeron® M 373 up to Pentium® M 760 ■ Two 10/100/1000Base-T Ethernet channels, or: ■ Reset button ■ 1.0 to 2.0GHz processor core frequency one 10/100/1000Base-T and one PCI Express® ■ 400MHz or 533MHz front-side bus frequency 10/100Base-T channel ■ Two x1 lanes to connect local 1000Base-T ■ Chipset ■ RJ45 connectors at front panel Ethernet controllers ■ Northbridge: Intel® 915GM ■ Ethernet controllers are connected by ■ Two x1 lanes for extension through side-card ■ ® Southbridge: Intel ICH6M two x1 PCIe lanes connector, or: CompactPCI Memory ■ On-board LEDs to signal activity status and ■ Three x1 lanes if one Gigabit Ethernet ■ 512KB L2 cache integrated in Celeron® M or connection speed channel is replaced by Fast Ethernet 2MB L2 cache integrated in Pentium® M ■ High Definition (HD) audio ■ Up to 250MB/s per channel in each direction ■ Up to 1GB SDRAM system memory ■ Accessible via side-card connector CompactPCI® Bus ■ Soldered Front Connections (Standard) ■ Compliance with CompactPCI® Core ■ DDR2 ■ VGA Specification PICMG 2.0 R3.0 ■ 400MHz or 533MHz memory bus frequency ■ Two USB 2.0 (Series A) ■ CompactPCI® Express support (EXP.0 R1.0) ■ Dual-channel, 2x64 bits ■ Two Ethernet (RJ45) ■ System slot ■ 4Mbits boot Flash Miscellaneous ■ 32-bit/33-MHz CompactPCI® bus ■ Serial EEPROM 2kbits for factory settings ■ Real-time clock, buffered by a GoldCap ■ V(I/O): +3.3V (+5V tolerant) ■ CompactFlash® card interface ■ Watchdog timer Busless Operation ■ Via on-board IDE ■ Temperature measurement ■ Board can be supplied with +5V only, ■ Type I all other voltages are generated on the board ■ True IDE ■ DMA support Mass Storage ■ Parallel IDE (PATA) ■ One IDE port for local CompactFlash®, or: ■ One IDE port for on-board hard disk ■ Serial IDE (SATA) ■ Two channels via side-card connector, or: one channel via side card and one channel via rear I/O ■ Transfer rates up to 150MB/s Graphics ■ Integrated in 915GM chipset ■ Analog CRT DAC interface support ■ Supports max. DAC frequency up to 400 MHz ■ 24-bit RAMDAC support ■ Maximum resolutions: 2048 x 1536 pixels 16M colors @ 75Hz refresh rate (analog); 1600 x 1200 pixels 16M colors @ 60Hz (dig.) ■ Incorporates PanelLink Digital technology (Silicon Image) ■ VGA connector at front panel ■ Two additional DVI connectors at front panel optional via side card ■ Simultaneous connection of two monitors I/O ■ USB ■ Two USB 2.0 ports via Series A connectors at front panel ■ Four USB 2.0 ports via side-card connector ■ Two USB 2.0 ports via rear I/O on request ■ UHCI implementation ■ Data rates up to 480Mbits/s
7 MEN CompactPCI
F600 – 3U CompactPCI® Side Card for SATA/Legacy I/O
■ HP extension for U Intel® SBCs F1, F1 ■ 1- COMs via SA-Adapters™ ■ Optical isolation depending on SA-Adapter™ ■ ." SATA hard disk slot
Mass Storage ■ Serial IDE (SATA) ■ One port for on-board 2.5" hard-disk drive ■ One port for external device ■ CompactPCI Transfer rates up to 150MB/s (depends on hard disk, 28MB/s for 2.5" hard disk) ■ RAID level 0/1 support (depends on CPU board) Miscellaneous ■ CompactPCI® J1 and J2 are assembled for increased mechanical stability and/or for power supply via J1 I/O Electrical Specifications ■ Up to four UARTs ■ RS232..RS485, isolated or not: ■ Supply voltage/power consumption: ■ From four CPU-controlled USB channels for free use in system (e. g. cable to front) ■ +5V (-3%/+5%), 21mA typ. ■ Two at front panel ■ Data rates up to 1 Mbit/s (with two SA1 SA-Adapters™, w/o hard disk) ■ Two on board, instead of on-board SATA ■ 640-byte transmit buffer, 576-byte receive ■ +3.3V (-3%/+5%), 50mA typ. device, on request buffer (with two SA1 SA-Adapters™, w/o hard disk) ■ Physical interface using SA-Adapters™ via ■ Handshake lines: full support; lines depend ■ MTBF: 1,663,000h @ 40°C (derived from 10-pin connectors on SA-Adapters™ MIL-HDBK-217F) F601 – 3U CompactPCI® Side Card for Multimedia
■ /8HP extension for U Intel® SBCs F1, F1 ■ DVI connections ■ 1 HD audio ■ 1 COM, alternatively with optical isolation ■ ." SATA hard disk slot
I/O ■ DVI ■ 1 (4HP) or 2 (8HP) DVI-D conn. at front panel ■ RS232..485 UART (COM1) ■ Transfer rates up to 150MB/s (depends on ■ SDVO PanelLink transmitter ■ One D-Sub connector at second front panel hard disk, 28MB/s for 2.5" hard disk) ■ Maximum resolution: 1600 x 1200 pixels ■ Via SA-Adapter™ ■ RAID level 0/1 support (dep. on CPU board) ■ 60Hz refresh rate ■ Data rates up to 115kbits/s Miscellaneous ■ DualMon support ■ 16-byte transmit/receive buffer ■ CompactPCI®J1 and J2 are assembled for ■ Audio ■ Handshake lines: full support; lines depend increased mechanical stability and/or for ■ One HD audio codec at front panel on SA-Adapter™ power supply via J1 ■ Integrated 2W Class D mono amplifier Mass Storage ■ CompactPCI® J2 can optionally be used ■ Symmetric stereo output ■ Serial IDE (SATA) to realize several functions via rear I/O 8 ■ Symmetric mono output ■ One port for on-board 2.5" hard-disk drive MEN CompactPCI
F11 – 3U CompactPCI®/PXI™ Pentium® III SBC
■ -bit 1 HP CompactPCI®/PXI™System slot or stand-alone ■ ULP Pentium® III up to 9 MHz ■ ULV Celeron® up to 60 MHz ■ Up to 1 MB DRAM, MB SRAM, CompactFlash® ■ Fast Ethernet, COM1, USB 1.1 (front) ■ Option: COM (front)VGA, keyboard/mouse (front) ■ Up to 1600 x 100 pixels ■ IDE (on-board) ■ Prepared for ." hard disk on board ■ FPGA – further programmable I/O functions ■ Option: up to 7 SA-Adapters™
CPU Front Connections Miscellaneous ■ Celeron® or Pentium® III ■ VGA ■ Real-time clock, backed up by the carrier board ■ 400MHz/650MHz or 933MHz processor ■ Two USB 1.1 (Series A) ■ Integrated hardware monitor core frequency ■ Two Ethernet (RJ45) ■ Reset button ■ 100MHz or 133MHz system bus frequency ■ Two RS232 UARTs COM1/COM2 (D-Sub) ■ 4 FPGA-controlled LEDs ■ 33MHz APIC bus frequency ■ PS/2 keyboard/mouse CompactPCI® Bus Memory ■ Compliance with CompactPCI® Core CompactPCI ■ 256KB or 512KB L2 cache integrated in CPU Rear I/O Specification PICMG 2.0 R3.0 ■ Up to 512MB SDRAM system memory ■ IDE ■ System slot ■ One 144-pin SO-DIMM socket for ■ Other functions on request ■ Double-slot solution SDRAM modules ■ Mainly compatible with F9 board (plus 1 mechanical slot for hard disk) ■ 133/100MHz memory bus frequency FPGA ■ 32-bit/33-MHz PCI-to-PCI bridge ■ 2MB BIOS/FPGA Flash ■ Standard factory FPGA configuration: ■ V(I/O): +3.3V or +5V (Universal Board) ■ 2MB SRAM ■ Main bus interface PXI™ ■ CompactFlash® interface ■ 16Z025_UART - UART controller ■ Prepared for four trigger lines compliant with ■ Type I (controls COM1..COM2) PXI™ Specification R1.0 ■ True IDE ■ 16Z058_SRAM - SRAM over SPI ■ Available on request Mass Storage The FPGA offers the possibility to add ■ Parallel IDE (PATA) customized I/O functionality. See website. ■ One port for local CompactFlash® ■ One port for local hard-disk drive ■ Drive can be mounted directly on the CPU board Graphics ■ Integrated VGA graphics controller ■ VGA connector at front panel ■ Up to 1600 x 1200 pixels I/O ■ USB ■ Two USB 1.1 ports ■ Two Series A connectors at front panel ■ UHCI implementation ■ Data rates up to 12Mbits/s ■ Supplies High-Power (500mA) without external power supply ■ Ethernet ■ Two 10/100Base-T Ethernet interfaces ■ Two RJ45 connectors at front panel ■ Four on-board LEDs to signal LAN Link and Activity status ■ Two RS232 UARTs (COM1/COM2) ■ COM1: 9-pin D-Sub connector at front panel ■ COM2: Physical interface at front panel using SA-Adapter™ via 10-pin ribbon cable on I/O connector ■ Data rates up to 115kbits/s ■ 60-byte transmit/receive buffers ■ Handshake lines: CTS, RTS; DCD, DSR, DTR ■ PS/2 keyboard/mouse
9 MEN CompactPCI
F9 – 3U CompactPCI® Pentium® M SBC
■ Pentium® M (LV) up to 1.8 GHz ■ Celeron® M (ULV) 600 MHz ■ 1-slot -bit CompactPCI® system master ■ PXI™ system controller ■ 1 GB DDR RAM (SO-DIMM), CompactFlash® ■ Graphics controller / DVI-I (front) ■ Gigabit Ethernet (front) ■ Dual USB .0 (front) ■ COM 1, IDE, USB, keyboard/mouse via rear I/O
CPU Mass Storage I/O ■ Celeron® M (ULV) or Pentium® M ■ Fast IDE ports ■ USB ■ 600MHz..1.8GHz ■ One IDE port for local CompactFlash® or ■ Two USB 2.0 ports ■ i855 Chipset 1.8" hard disk or connection to mezzanine ■ Two Series A connectors at front panel ■ 82855GME Graphics/Memory Controller expansion board with on-board hard disk ■ Two ports via rear I/O transition module Hub (GMCH) drive or external device (Secondary IDE) ■ OHCI 1.0a implementation ■ 82801D I/O Controller Hub (ICH4) ■ One IDE port via rear I/O transition module ■ Data rates up to 480Mbits/s ■ 82802 Firmware Hub (FWH) (Primary IDE) ■ Ethernet ® ■ CompactPCI Memory ■ CompactFlash card interface (Secondary IDE) One 10/100/1000Base-T Gigabit Ethernet ■ L2 cache integrated in CPU ■ Type I and Type II interface ■ Celeron® M: 512KB ■ True IDE ■ RJ45 connector at front panel or via ■ Pentium® M: 1MB or 2MB ■ For CFA ATA memory card or Microdrive rear I/O transition module ■ Up to 1GB SDRAM system memory Graphics ■ Two display LEDs in RJ45 connector to ■ One 200-pin SO-DIMM socket for DDR ■ Integrated VGA graphics controller signal LAN Link and Activity status ■ SDRAM modules ■ DVI-I connector at front panel or VGA Front Connections ■ PC2100/2700 connection via rear I/O / transition module ■ DVI ■ DDR266/333 ■ Maximum resolution: 2048 x 1536, 16M ■ Two USB 2.0 (Series A) ■ CompactFlash® card interface colors @ 75Hz refresh rate (analog); ■ One Ethernet (RJ45) ■ Type I and Type II 1600 x 1200, 16M colors @ 60Hz refresh Rear I/O ■ True IDE rate (digital) ■ Via rear I/O transition module F9R ■ PanelLink Digital technology (not supported on board versions 02F009-06 and 02F009-07) ■ Primary IDE (on-board) ■ VGA analog video (back panel) ■ Two USB 2.0 ports (back panel) ■ Gigabit Ethernet (back panel) ■ COM1 (on-board, TTL level), for connection of MEN SA-Adapters™ ■ PS/2 keyboard/mouse (back panel) I/O on Expansion Board F9E ■ USB 2.0 (front) ■ Fast Ethernet (front) ■ COM1 (front) ■ COM2 (front) instead of USB ■ AC'97 audio (front) instead of Ethernet ■ PS/2 keyboard/mouse (front) ■ Secondary IDE usage for ■ CompactFlash® or ■ 1.8" hard disk or ■ 2.5" hard disk ■ Floppy disk ■ Local GPIO ■ Rear I/O CompactPCI® Bus ■ Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0 ■ System slot ■ 32-bit/33-MHz PCI-to-PCI bridge ■ Rear I/O via J2/P2 (not supported on board versions 02F009-06 and 02F009-07) ■ V(I/O): +5V (+3.3V tolerant) ■ Board versions 02F009-06 and 02F009-07 only support 32 bit CompactPCI® but can be used in 64-bit systems
10 MEN CompactPCI
F13 – 3U CompactPCI® MPC8540 SBC
■ -bit/-MHz cPCI system slot, HP ■ MPC80, 800MHz (PowerQUICC™ III) ■ FPGA 1,000 LEs (approx.1,000 gates) ■ Up to GB DDR DRAM (SO-DIMM) ■ NAND Flash ■ Gigabit/1 Fast Ethernet (RJ on front) ■ 1 COM (RJ on front) ■ FPGA for user-defined I/O functions ■ MENMON™ BIOS for PowerPC® cards
CPU Front Connections (Standard) Miscellaneous ■ PowerPC® ■ Three Ethernet (RJ45) ■ Real-time clock with GoldCap backup ■ MPC8540 PowerQUICC™ III ■ One RS232 UART (RJ45) ■ Power supervision and watchdog ■ 800MHz (666..833MHz optional) FPGA ■ Reset button, GPIO-controlled ■ e500 PowerPC®core with SPE APU and MMU ■ Standard factory FPGA configuration: ■ Three user LEDs, GPIO-controlled; 1 FPGA ■ Integrated Northbridge and Southbridge ■ Main bus interface power status LED ■ High memory bandwidth ■ 16Z070_IDEDISK – IDE controller CompactPCI® Bus Memory for NAND Flash ■ Compliance with CompactPCI® Core ■ ■ 2x32KB L1 data and instruction cache, 16Z043_SDRAM – SDRAM controller (16MB) Specification PICMG 2.0 R3.0 CompactPCI 256KB L2 cache/SRAM integrated in MPC8540 ■ 16Z023_IDE_NHS –IDE controller ■ System slot ■ Up to 2GB SDRAM system memory (PIO mode 0; non-hot-swap) ■ 32-bit/33-MHz PCI-to-PCI bridge ■ One SO-DIMM slot for SDRAM modules ■ 16Z025_UART – UART controller ■ V(I/O): +3.3V (+5V tolerant) ■ DDR2100 with or without ECC (controls COM10) PXI™ ■ 133MHz memory bus frequency ■ 16Z034_GPIO – GPIO controller ■ Four trigger lines compliant with PXI™ ■ Up to 1GB soldered NAND Flash (depending (40 lines, 5 IP cores) Specification R1.0 on chip availability), FPGA-controlled ■ The FPGA offers the possibility to add ■ 8MB boot Flash customized I/O functionality. See website. ■ 32KB non-volatile FRAM ■ Up to 16MB additional SDRAM, FPGA-controlled, e.g. for video data ■ Serial EEPROM 4kbits for factory settings Mass Storage ■ Parallel IDE (PATA) ■ One IDE port via 44-pin on-board connector ■ FPGA-controlled ■ PIO mode 0 support I/O ■ Three Ethernet channels ■ Two 10/100/1000Base-T Ethernet channels ■ One 10/100Base-T Ethernet channel ■ Three RJ45 connectors at front panel ■ Two on-board LEDs to signal LAN Link and Activity ■ One RS232 UART (COM1) ■ One RJ45 connector at front panel ■ Data rates up to 115kbits/s ■ 16-byte transmit/receive buffer ■ Handshake lines: CTS, RTS ■ One UART (COM10) ■ FPGA-controlled ■ Accessible via I/O connector ■ Physical interface at front panel using SA-Adapter™ via 10-pin ribbon cable on I/O connector ■ RS232..RS485, isolated or not: for free use in system (e. g. cable to front) ■ Data rates up to 115kbits/s ■ 16-byte transmit/receive buffer ■ Handshake lines: CTS, RTS; DCD, DSR, DTR; RI ■ GPIO ■ 36 GPIO lines ■ FPGA-controlled ■ Connection via on-board I/O connector ■ Further I/O depending on FPGA configuration
11 MEN CompactPCI
F12 – 3U CompactPCI® MPC5200 SBC
■ -bit/-MHz cPCI system slot, HP ■ MPC00/8 MHz ■ FPGA 1,000 LEs (approx. 1,000 gates) ■ Up to 6 MB on-board DDR SDRAM ■ Up to 8 MB boot Flash, NAND Flash ■ Up to MB SRAM, 16MB graphics memory ■ Dual Fast Ethernet, COM, USB (front) ■ Dual CAN controller ■ FPGA for user-defined I/O functions ■ MENMON™ BIOS for PowerPC® cards ■ -0 to +8°C with qualified components
CPU ■ FPGA-controlled ■ Accessible via I/O connector ■ PowerPC®, MPC5200, up to 400MHz ■ PIO mode 0 support ■ Physical interface at front panel using Memory I/O SA-Adapter™ via 10-pin ribbon cable on ■ 2x16KB L1 data and instruction cache ■ USB I/O connector intgrated in MPC5200 ■ One USB 1.1 port ■ RS232..RS485, isolated or not: for free use in ■ Up to 256MB SDRAM system memory ■ Series A connector at front panel system (e. g. cable to front) ■ Soldered, DDR ■ OHCI implementation ■ Data rates up to 115kbits/s ■ ■ ■ CompactPCI 64MHz memory bus frequency Data rates up to 12Mbits/s 16-byte transmit/receive buffer ■ Up to 1GB soldered NAND Flash (depending ■ Ethernet ■ Handshake lines: CTS, RTS; DCD, DSR, DTR; RI on chip availability), FPGA-controlled ■ Two 10/100Base-T Ethernet channels ■ CAN bus ■ Up to 8MB boot Flash ■ 2 RJ45 or 1 D-Sub connector at front panel ■ Two CAN bus channels ■ Up to 2MB GoldCap-backed SRAM, or: up to ■ Note: 2nd Ethernet channel will be operable ■ 2.0 A/B CAN protocol 128KB non-volatile FRAM in Q1/2007; through update of FPGA. ■ Data rates up to 1 Mbit/s ■ Serial EEPROM 8kbits for factory settings ■ One RS232 UART (COM1) ■ Connection via on-board connectors ■ Up to 16MB additional SDRAM, connected ■ RJ45 or D-Sub connector at front panel ■ External transceivers using SA-Adapters™ to FPGA, e.g. for video data ■ Data rates up to 115kbits/s ■ GPIO Mass Storage ■ 512-byte transmit/receive buffer ■ 36 GPIO lines ■ Parallel IDE (PATA) ■ Handshake lines: CTS, RTS ■ FPGA-controlled ■ One IDE port via 44-pin on-board connector ■ One UART (COM10) ■ Connection via on-board I/O connector ■ Further I/O depending on FPGA configuration Front Connections (Standard) ■ One USB 1.1 (Series A) ■ Two Ethernet (RJ45) ■ One RS232 UART (RJ45) FPGA ■ Standard factory FPGA configuration: ■ Main bus interface ■ 16Z070_IDEDISK - IDE contr. for NAND Flash ■ 16Z043_SDRAM - SDRAM controller (16 MB) ■ 16Z023_IDE_NHS - IDE controller (PIO mode 0; non-hot-swap) ■ 16Z025_UART - UART controller (controls COM10) ■ 16Z034_GPIO - GPIO controller (40 lines, 5 IP cores) ■ The FPGA offers the possibility to add custmized I/O functionality. See website. Miscellaneous ■ Real-time clock with GoldCap backup ■ Power supervision and watchdog ■ Reset button, GPIO-controlled ■ Three user LEDs, GPIO-controlled; 1 FPGA power status LED CompactPCI® Bus ■ Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0 ■ System slot ■ 32-bit/33-MHz PCI-to-PCI bridge ■ V(I/O): +3.3V (+5V tolerant) PXI™ ■ 4 trigger lines compliant with PXI™ Spec. R1.0
1 MEN CompactPCI
F301 – 3U CompactPCI® 9-Port Ethernet Switch
■ 8 HP -bit/-MHz CompactPCI® ■ Up to 8 Fast Ethernet ports (front) ■ 1 Fast Ethernet controller (rear J1) ■ Option: 1 Fast Ethernet port (rear J) ■ -0 to +8°C with qualified components
Electrical Specifications ■ Supply voltage/power consumption: ■ +5V (-3%/+5%), 1200mA max. ■ +3.3V (-3%/+5%), 400mA max. ■ MTBF: 442,000h @ 40°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: conforming to CompactPCI® specification for 3U boards ■ Weight: 200g Environmental Specifications ■ Temperature range (operation): ■ -40..+85°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C CompactPCI Ethernet CompactPCI® Bus ■ Relative humidity (operation): max. 95% nc ■ 9-port Ethernet switch device KS8999 ■ Compliance with cPCI®Specification 2.0 R3.0 ■ Relative humidity (storage): max. 95% nc ■ Eight 10/100Base-T transceivers ■ Only one slot required on the 3U cPCI®bus ■ Altitude: -300m to + 3,000m ■ Nine MAC units with integr. Layer 2 switch ■ Peripheral slot ■ Shock: 15g/11ms ■ 82551ER Fast Ethernet Controller ■ Compliance with PCI Specification 2.1 ■ Bump: 10g/16ms Peripheral Connections ■ 32-bit/33-MHz PCI-to-PCI bridge ■ Vibration (sinusoidal): 2g/10..150Hz ■ Via front panel on 8 RJ45 / 6 D-Sub plug conn. ■ V(I/O): +3.3V or +5V (Universal Board) ■ Conformal coating on request
F207 – 3U CompactPCI® PCI-104 Carrier Board
■ 1 PCI-10 slot ■ For stacking of up to PCI-10 modules ■ 8 HP CompactPCI® with one PCI-10 module ■ PCI-to-PCI bridge
PCI-10 Electrical Specifications ■ One slot for PCI-104 ■ Supply voltage/power consumption: ■ Up to four stacked PCI-104 modules ■ +5V (-3%/+5%), 40mA max. ■ 8HP solution with 1 PCI-104 module mounted (without PCI-104 module) ■ Second front panel as needed ■ +3.3V (-3%/+5%), 60mA max. ■ Shock: 15g/11ms (filler panel or with connector cut-outs) (without PCI-104 module) ■ Bump: 10g/16ms Peripheral Connections ■ MTBF: tbd. @ 40°C ■ Vibration (sinusoidal): 2g/10..150Hz ■ Via front panel (derived from MIL-HDBK-217F) ■ Conformal coating on request Local PCI Bus Mechanical Specifications Safety ■ 32-bit/33-MHz, 3.3V or 5V (on req.) V(I/O) ■ Dimensions: conforming to CompactPCI® ■ PCB manufactured with a flammability rating ■ Compliant with PCI Specification 2.2 specification for 3U boards of 94V-0 by UL recognized manufacturers CompactPCI® Bus ■ Front panel: aluminum with 1 handle EMC ■ Compliance with CompactPCI® Core ■ Weight: 170g ■ Tested according to EN 55022 (radio distur Specification PICMG 2.0 R3.0 Environmental Specifications bance), IEC1000-4-2 (ESD) and IEC1000-4-4 ■ Peripheral slot ■ Temperature range (operation): (burst) with regard to CE conformity ■ Only one slot required on 3U cPCI® bus ■ -40..+85°C ■ PCI2050 PCI-to-PCI bridge ■ Airflow: min. 10m³/h ■ Max. clock frequency 33MHz ■ Temperature range (storage): -40..+85°C ■ 32-bit/33-MHz PCI-to-PCI bridge ■ Relative humidity (oper.): max. 95% nc ■ V(I/O): +3.3V or +5V (Universal Board) ■ Relative humidity (storage): max. 95% nc ■ Altitude: -300m to + 3,000m 1 MEN CompactPCI
F206N – 3U CompactPCI® Nios®II Slave Board
■ -bit/-MHz CompactPCI® ■ Peripheral slot function ■ FPGA 1,000 LEs (approx. 1,000 gates) ■ Nios® II soft processor ■ MB SDRAM, MB Flash ■ Flexible FPGA-Flash structure ■ Open platform FPGA development package ■ Support of Wishbone and Avalon® bus ■-0 to +8°C with qualified components
CPU ■ Two optional plugs for on-board connection Miscellaneous ■ Nios® II soft processor, 33MHz via ribbon cable ■ Four user LEDs, FPGA-controlled Memory ■ Different physical layers through ■ Local PCI Bus ■ 512 bytes instruction cache and 512 bytes SA-Adapters™: RS232, RS422, RS485, TTY, ■ 32-bit/33-MHz, 3.3V V(I/O) data cache integrated in Nios® II Ethernet, CAN bus, binary I/O, audio, PS/2 ■ Compliant with PCI Specification 2.2 ■ 32MB SDRAM system memory ■ One optional 40-pin plug connector CompactPCI® Bus ■ Soldered ■ For FPGA-controlled functions ■ Compliance with CompactPCI®Core ■ 133MHz memory bus frequency ■ For use of SA-Adapters™ Specification PICMG 2.0 R3.0 ■ 2MB boot Flash ■ For on-board connection via ribbon cable ■ Peripheral slot I/O ■ Different physical layers through SA- ■ 32-bit/33-MHz PCI ■ One RS232 UART (COM10) Adapters™: RS232, RS422, RS485, TTY, ■ V(I/O): +3.3V ® CompactPCI ■ D-Sub connector at front panel Ethernet, CAN bus, binary I/O, audio, PS/2 ■ Only one slot required on 3U cPCI backplane ■ Data rates up to 115kbits/s FPGA ■ More supplementary CompactPCI® slots ■ 60-byte transmit/receive buffer ■ Standard factory FPGA configuration: required depending on SA-Adapters™ ■ Handshake lines: full support ■ Nios® II soft processor Electrical Specifications ■ For debugging ■ 16Z014_PCI - PCI to Wishbone interface ■ Supply voltage/power consumption: ■ Three 10-pin connectors ■ 16Z052_GIRQ - Global Interrupt Contr. (Nios®) ■ +5V (-3%/+5%), current depends only on ■ For FPGA-controlled functions ■ 16Z052_GIRQ - Global Interrupt Contr. (CPU) mounted SA-Adapters™ ■ For use of SA-Adapters™ ■ 16Z069_RST - Reset Controller ■ +3.3V (-3%/+5%), 500mA typ. ■ One receptacle for direct SA-Adapter™ ■ 16Z043_SDRAM - SDRAM controller (32MB) ■ MTBF: 308,000h @ 40°C (derived from connection at the front ■ 16Z045_FLASH - Flash interface MIL-HDBK-217F) ■ Two receptacles for direct connection of ■ 16Z025_UART - UART contr. (contr. COM10) long SA-Adapters™ at the front ■ The FPGA offers the possibility to add customized I/O functionality. See website.
F206I
1 F206N F206 MEN CompactPCI
F206I – 3U CompactPCI®-ISA PC/104 Carrier Board
■ 1 CompactPCI® slot -bit/MHz (opt. 66MHz) ■ HP closed front panel ■ 1 to PC/10 slots ■ PCI-to-ISA bridge ■ FPGA 1,000 LEs (approx.1,000 gates) ■ -0 to +8°C with qualified components
CompactPCI® to PC/10 bridge Mechanical Specifications ■ Altitude: -300m to + 3,000m ■ 1 to 4 PC/104 slots ■ Dimensions: conforming to CompactPCI® ■ Shock: 15g/11ms ■ FPGA-controlled specification for 3U boards ■ Bump: 10g/16ms CompactPCI® Bus ■ Single 3U front panel slot (additional slots ■ Vibration (sinusoidal): 2g/10..150Hz ■ Compliance with CompactPCI Core may be required for mounted PC/104 ■ Conformal coating on request Specification PICMG 2.0 R3.0 boards) Safety ■ Peripheral slot ■ Front panel: aluminum with 1 handle ■ PCB manufactured with a flammability rating ■ V(I/O): +3.3V ■ Weight: 95g of 94V-0 by UL recognized manufacturers
Electrical Specifications Environmental Specifications EMC CompactPCI ■ Supply voltage/power consumption: ■ Temperature range (operation): ■ Tested according to EN 55022 ■ +5V (-3%/+5%), current depends only on ■ -40..+85°C (qualified components) (radio disturbance), IEC1000-4-2 (ESD) and mounted PC/104 modules ■ Airflow: min. 10m³/h IEC1000-4-4 (burst) with regard to CE ■ +3.3V (-3%/+5%), > 500mA typ. ■ Temperature range (storage): -40..+85°C conformity ■ MTBF: 316,000h @ 40°C (derived from ■ Relative humidity (operation): max. 95% MIL-HDBK-217F) non-condensing ■ Relative humidity (storage): max. 95% nc
F206 – 3U CompactPCI®Octal UART for SA-Adapters™
■ Octal 160 UART ■ RS//8/TTY, isolated/not isolated ■ Large receive and transmit FIFOs ■ Very high data rates up to Mbits/s ■ Full handshake support ■ Hardware flow control for RS8 half duplex ■ Physical layer via SA-Adapters™ ■ -8 SA-Adapters™ (1- CompactPCI® slots) ■ Appl. for other protocols like HDLC ■ -0 to +8°C with qualified components
UARTs Miscellaneous ■ Front panel: aluminum with 1 handle ■ Up to eight UARTs ■ Four status LEDs ■ Weight: 95g ■ Accessible via on-board connectors Local PCI Bus Environmental Specifications ■ Physical interface at front panel using ■ 32-bit/33-MHz, 3.3V V(I/O) ■ Temperature range (operation): SA-Adapters™ via 10-pin ribbon cable ■ Compliant with PCI Specification 2.2 ■ -40..+85°C (qualified components) ■ Diff. variations with SA-Adapters™ possible: CompactPCII® Bus ■ Airflow: min. 10m³/h ■ RS232, RS422, RS485, TTY ■ Compliance with CompactPCI® Core ■ Temperature range (storage): -40..+85°C ■ Data rates up to 2 Mbits/s Specification PICMG 2.0 R3.0 ■ Relative humidity (operation): max. 95% nc ■ 60-byte transmit/receive buffer ■ Peripheral slot ■ Relative humidity (storage): max. 95% nc ■ Handshake lines: full support; lines depend ■ V(I/O): +3.3V ■ Altitude: -300m to + 3,000m on SA-Adapters™ Electrical Specifications ■ Shock: 15g/11ms FPGA ■ Supply voltage/power consumption: ■ Bump: 10g/16ms ■ Standard factory FPGA configuration: ■ +5V (-3%/+5%), current depends only on ■ Vibration (sinusoidal): 2g/10..150Hz ■ Main bus interface mounted SA-Adapters™ ■ Conformal coating on request ■ 16Z054_SYSTEM - System unit ■ +3.3V (-3%/+5%), > 500mA typ. Safety ■ 16Z025_UART - UART controller ■ MTBF: 308,000h @ 40°C ■ PCB manufactured with a flammability rating (controls COM10..COM13) (derived from MIL-HDBK-217F) of 94V-0 by UL recognized manufacturers ■ 16Z025_UART - UART controller Mechanical Specifications (controls COM14..COM17) ■ Dimensions: conforming to CompactPCI® ■ 16Z045_FLASH - Flash interface specification for 3U boards ■ The FPGA offers the possibility to add custo- ■ Single 3U front panel slot for up to 2 UARTs mized I/O functionality. See FPGA. ■ Up to three supplementary front panel slots 1 required for overall eight UARTs MEN CompactPCI
F205 / F204 – 3U CompactPCI®/PXI™ M-Module™ Carrier Boards
■ 1 CompactPCI® bus slot M-Module™ Slots ■ M-Module™ slots ■ Two M-Module™ slots ■ Flexible PXI™ trigger routing ■ Compliant with M-Module™ standard ■ Characteristics: D08, D16, A08, INTA, TRIGI, TRIGO Peripheral Connections ■ Via front panel CompactPCI® Bus ■ Compliance with CompactPCI® Specification 2.0 R2.1 ■ Only one slot required on the 3U CompactPCI® bus ■ 32-bit/33-MHz PCI-to-M-Module™ bridge ■ FPGA-based ■ Compliant with PCI Specification 2.2 ■ Target on PCI bus ■ V(I/O): +5V (+3.3V on request) PXI™ ■ Eight trigger lines compliant with PXI™ ■ 1 CompactPCI® bus slot Specification R1.0 ™ ™ ™
CompactPCI ■ 1 M-Module slot ■ Routing of PXI trigger lines to M-Module ■ Flexible PXI™ trigger routing interface TRIGA, TRIGB Electrical Specifications ■ Supply voltage/power consumption: ■ +5V (-3%/+5%), 20mA typ. ■ +3.3V (-3%/+5%), 20mA typ. ■ MTBF: 1,046,000h @ 50°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: 111.7mm x 160mm standard ■ Front panel: aluminum without handles, cut-outs for front connectors of 2 M-Modules™ ■ Weight: 125g (without M-Modules™) Environmental Specifications ■ Temperature range (operation): ■ 0..+60°C or -40..+85°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity (operation): max. 95% non-condensing ■ Relative humidity (storage): max. 95% non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request Safety ■ PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers EMC ■ Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity
16 MEN CompactPCI
F203 – 3U CompactPCI®/PXI™ PC-MIP® Carrier Board
■ 1 CompactPCI® bus slot CompactPCI® Bus Environmental Specifications ■ PC-MIP® slots ■ Compliance with CompactPCI® ■ Temperature range (operation): Specification 2.0 R2.1 ■ 0..+60°C ■ Only one slot required on the 3U ■ Industrial temperature range on request CompactPCI® bus ■ Airflow: min. 10m³/h ■ DECchip 21150 PCI-to-PCI bridge ■ Temperature range (storage): -40..+85°C ■ Target and/or initiator on PCI bus ■ Relative humidity (operation): max. 95% ■ Max. clock frequency 33MHz non-condensing ■ Power supply 5V and 3.3V ■ Relative humidity (storage): max. 95% ■ Compliance with PCI Specification 2.1 non-condensing ■ 32-bit PCI data bus ■ Altitude: -300m to + 3,000m ■ V(I/O): +3.3V or +5V (Universal Board) ■ Shock: 15g/11ms PC-MIPs ■ Bump: 10g/16ms ■ Up to three PC-MIP® modules on one board ■ Vibration (sinusoidal): 2g/10..150Hz ■ Support of 1 Type I and 2 Type II modules ■ Conformal coating on request ■ Local 32-bit PCI bus Safety Peripheral Connections ■ PCB manufactured with a flammability rating ■ Via front panel of 94V-0 by UL recognized manufacturers Electrical Specifications EMC ■ Supply voltage/power consumption: ■ Tested according to EN 55022 ■ +5V (4.85V..5.25V), 5mA typ. (radio disturbance), IEC1000-4-2 (ESD) and CompactPCI ■ +3.3V (3.2V..3.5V), 150mA typ. IEC1000-4-4 (burst) with regard to CE ■ MTBF: 80,000h @ 50°C conformity (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: conforming to CompactPCI® specification for 3U boards ■ Front panel: aluminum with 1 handle ■ Weight: 160g
17 MEN CompactPCI
D6 – 6U CompactPCI® Pentium® M Blade Server
■ Pentium® M up to GHz ■ Up to 1GB Flash-on-disk (NAND) ■ PCI Express® x and x (or 1x8) ■ SATA, PATA interfaces ■ ULV Celeron® M 1GHz ■ Graphics up to 180x10 ■ HP CompactPCI® system slot, ■ Gigabit Ethernet (PCIe) 6-bit/66-MHz ■ USB .0, COM ■ Hot-swap, PICMG .16 support ■ Individual I/O in FPGA ■ Up to 1GB DDR ECC SDRAM ■ XMC/PMC slots (PCIe) ■ Non-volatile SRAM, FRAM
CPU ■ Ethernet FPGA ■ Celeron® M ULV 373 up to Pentium® M 760 ■ Two 10/100/1000Base-T Ethernet channels ■ Standard factory FPGA configuration: ■ 1.0 GHz or 1.4 GHz or 2.0 GHz processor at front panel ■ 16Z052_GIRQ - Interrupt controller core frequency ■ Two 10/100/1000Base-T Ethernet channels ■ 16Z070_IDEDISK - IDE contr. for NAND Flash ■ 400MHz or 533MHz front-side bus frequency at rear (2.16) ■ 16Z024_SRAM - SRAM controller ■ Chipset ■ RJ45 connectors at front panel ■ 16Z043_SDRAM - Additional SDRAM ■ Northbridge: Intel® MCH E7520 server chip set ■ Ethernet controllers are connected by four x4 controller (up to 32MB) ■ Southbridge: Intel® ICH 6300ESB PCIe lanes ■ 16Z044_DISP - Display controller ■ ■ CompactPCI High-end memory controller Two on-board LEDs per channel (front) to (60Hz/75Hz, 6-bit RGB) ■ Passive heat sink signal LAN Link, Activity status and ■ 16Z034_GPIO - GPIO controller (25 lines) Memory connection speed ■ The FPGA offers the possibility to add ■ 512KB L2 cache integrated in Celeron® M or ■ Two UARTs (COM1..COM2) customized I/O functionality. See website. 2MB L2 cache integrated in Pentium® M ■ Via on-board adapter or rear I/O Board Management ■ Up to 1GB SDRAM system memory ■ COM1: Physical RS232 interface at ■ Board Management Controller (BMC) ■ Soldered front panel using adapter PCB, instead of ■ CPU alarm and status monitoring ■ DDR2 with ECC support XMC/PMC 0, or: via rear I/O ■ Voltage and current supervision ■ 400MHz memory bus frequency ■ COM2: Via rear I/O, or: Physical interface ■ Reset control ■ Dual-channel, 2x64 bits at front panel using SA-Adapter™ via ■ CPU and board temperature monitoring ■ Up to 1GB soldered NAND Flash (depending 10-pin ribbon cable on I/O connector, ■ Prepared for BIOS update via BMC on chip availability), FPGA-controlled optional, instead of XMC/PMC 0, Mezzanine Slots ■ Up to 8MB boot Flash RS232..RS485, isolated or not ■ Two slots usable for PMC or XMC ■ Up to 8MB non-volatile SRAM ■ Data rates up to 115kbits/s ■ Two XMC slots ■ Backed by GoldCap or external battery ■ 16-byte transmit/receive buffer ■ Compliant with XMC standard VITA ■ Up to 32MB additional SDRAM, connected ■ Handshake lines: full support (rear I/O); CTS, 42.3-200x to FPGA, e.g. for video data DCD, DSR, DTR, RTS (COM1 at front); CTS, ■ PCI Express® lanes: 1 x4 or 2 x4 or 1 x8 ■ Up to 16KB non-volatile serial FRAM DTR, RTS (COM2 at front) ■ Two PMC slots ■ Serial EEPROM 3x2kbit for factory settings ■ 25 GPIO lines via rear I/O ■ Compliant with PMC standard IEEE 1386.1 ■ CompactFlash® card interface, optional, ■ Further I/O depending on FPGA config. ■ 32-bit/33-MHz, 3.3V V(I/O) instead of XMC/PMC 0 Front Connections ■ PMC I/O module (PIM) support Mass Storage ■ One USB 2.0 (Series A) Miscellaneous ■ Parallel IDE (PATA) ■ Two Ethernet (RJ45) ■ Real-time clock with GoldCap backup ■ One port for local hard-disk/CD-ROM, or: ■ COM1/VGA (instead of XMC/PMC 0) ■ Reset button ■ One port for local CompactFlash® ■ COM2 (D-Sub, optional, instead of XMC/ ■ Four status LEDs, one hot-swap LED (blue) ■ One port for rear I/O PMC 0 and COM1/VGA) PCI Express® ■ Serial IDE (SATA) ■ XMC/PMC 0 and 1 ■ Four x4 lanes to connect local 1000Base-T ■ One port via on-board connector ■ CompactFlash® (opt., instead of XMC/PMC 0) Ethernet controllers (1GB/s in each direction) ■ One port for rear I/O Rear I/O ■ Two x4 or one x8 lanes for XMC extension ■ Transfer rates up to 150MB/s ■ IDE (PATA), one port; IDE (SATA), one port (1GB/s or 2GB/s in each direction) Graphics ■ USB 2.0, two ports CompactPCI® Bus ■ FPGA-controlled ■ Ethernet 1000Base-T according to PICMG ■ Compliance with CompactPCI® Core ■ 2D graphics, frame-buffered 2.16, two ports Specification PICMG 2.0 R3.0 ■ VGA up to SXGA ■ COM1/COM2 ■ System slot ■ Maximum resolution: 1280 x 1024 pixels ■ 25 GPIO lines ■ Up to 64-bit/66-MHz PCI-to-PCI bridge/PCI-X ■ VGA connector at front panel, ■ Mezzanine rear I/O: PMC 0 and 1 ■ V(I/O): +3.3V instead of XMC/PMC 0 ■ CompactPCI® hot-swap support compliant I/O with CompactPCI® Hot Swap Specification ■ USB PICMG 2.1 R2.0 ■ One USB 2.0 port at front via Series A conn. ■ Compliance with CompactPCI® Packet ■ Two USB 2.0 ports via rear I/O Switching Backplane PICMG 2.16 R1.0 ■ UHCI implementation ■ Prepared for compliance with CompactPCI® ■ Data rates up to 480Mbits/s System Management PICMG 2.9 R1.0
18 MEN CompactPCI
D601 – Conduction-Cooled 6U CPCI Pentium® M SBC
■ ULV Celeron® M 7, 1GHz ■ SATA interfaces ■ Up to Pentium® M 760, GHz ■ Video via VGA and 1 DVI ■ -bit CompactPCI® or LVDS ■ HP system master or busless ■ Gigabit Ethernet ■ Up to 1 GB DDR DRAM soldered ■ USB .0 ■ CompactFlash® ■ Conductive cooling
CPU Graphics ■ ULV Celeron® M 373 up to Pentium® M 760 ■ Integrated in 915GM chipset ■ 1.0 to 2.0GHz processor core frequency ■ Analog CRT DAC interface support ■ 400MHz or 533MHz front-side bus frequency ■ Supports max. DAC frequency up to 400 MHz ■ Chipset ■ 24-bit RAMDAC support ■ Northbridge: Intel® 915GM ■ Maximum resolutions: 2048 x 1536 pixels ■ Southbridge: Intel® ICH6M 16M colors @ 75Hz refresh rate (analog); Miscellaneous Memory 1600 x 1200 pixels 16M colors @ 60Hz (dig.) ■ Real-time clock, buffered by a GoldCap ■ 512KB L2 cache integrated in Celeron® M or ■ LVDS wide panel support up to 1920 x 1200 ■ Watchdog timer 2MB L2 cache integrated in Pentium® M pixels (WUXGA) ■ Temperature measurement ■ Up to 1GB SDRAM system memory ■ Incorporates PanelLink Digital technology ■ On-board user LED for debugging ■ Soldered (Silicon Image) ■ On-board reset button for debugging ■ ® DDR2 ■ VGA/DVI/LVDS connection via rear I/O CompactPCI Bus CompactPCI ■ 400MHz or 533MHz memory bus frequency Rear I/O ■ Compliance with CompactPCI® Core ■ Dual-channel, 2x64 bits ■ USB Specification PICMG 2.0 R3.0 ■ 4Mbits boot Flash ■ Three USB 2.0 ports via rear I/O ■ System slot ■ Serial EEPROM 2kbits for factory settings ■ UHCI implementation ■ 32-bit/33-MHz CompactPCI® bus ■ CompactFlash® card interface ■ Data rates up to 480Mbits/s ■ V(I/O): +3.3V (+5V tolerant) ■ Via on-board IDE ■ Ethernet Busless Operation ■ Type I ■ Two 10/100/1000Base-T Ethernet channels ■ Board can be supplied through J1 or J5 ■ True IDE ■ Accessible via rear I/O on J3 connector, all other voltages are generated ■ DMA support ■ Compatible with PICMG 2.16 on the board Mass Storage ■ Ethernet controllers are connected by ■ +5V supply through J1, or: ■ Parallel IDE (PATA) two x1 PCIe lanes ■ +16..+36V supply through J5, using on-board ■ One IDE port for local CompactFlash® ■ On-board LEDs to signal activity status and DC/DC converter ■ Serial IDE (SATA) connection speed ■ Two channels via rear I/O ■ PS/2 ■ Transfer rates up to 150MB/s ■ Two ports ■ Accessible via rear I/O
D6 D601 19 MEN CompactPCI
D4 – 6U CompactPCI® Pentium® 4 SBC
■ Mobile Pentium® up to .GHz ■ 1-slot CompactPCI® 6-bit/66MHz ■ PXI™ system controller ■ 1GB DRAM, CompactFlash® ■ Graphics controller/digital video output ■ Gigabit Ethernet (front) ■ 1 Gigabit Ethernet (PICMG .16) – depending on model ■ USB ■ COMs, IDE, floppy, parallel, keyboard/mouse ■ 1 PMC or PC-MIP® mezzanine slots
CPU I/O GPIO ■ Pentium® 4 Mobile Processor ■ USB ■ Accessible via on-board connector ■ 1.2 to 2.2GHz processor core frequency ■ 1x USB 2.0 at front, 2x at rear with ■ 8 I/O lines ■ MPGA478 Socket up to 480Mbits/s Front Connections ■ 845G Chipset ■ Ethernet ■ DVI, one USB 2.0 (Series A) ■ 400MHz local bus frequency ■ Two 10/100/1000Base-T Ethernet at front panel ■ Two Ethernet (RJ45) Memory ■ One 10/100/1000Base-T Ethernet at rear (2.16) ■ One RS232 UART COM1 (RJ45) ■ Up to 1GB DDR SDRAM system memory ■ RJ45 connector at front panel ■ One PS/2 keyboard/mouse ■ 144-pin SO-DIMM slot for SDRAM modules ■ Supports network boot (depend. on BIOS vers.) ■ Two PC-MIP® slots or one PMC slot ■ CompactPCI 200MHz memory bus frequency ■ One RS232 UART (COM1) Rear I/O ■ 8 Mbits BIOS Flash firmware hub ■ RJ45 connector at front panel ■ Dual USB 2.0 ■ CompactFlash® card interface ■ Handshake lines: CTS, RTS; DCD, DSR, DTR ■ Ethernet 10/100/1000Base-T ■ Via on-board IDE ■ One UART (COM2) ■ RS232 UART COM2 ■ Type I/II, Microdrive, true IDE ■ Via on-board ribbon cable or rear I/O ■ IDE interface Mass Storage ■ Physical interface at front panel or using ■ GPIO lines ■ Fast IDE ports SA-Adapter™ via 10-pin ribbon cable on I/O ■ Floppy disk interface ■ Primary IDE hard-disk/CD-ROM port; connector, depending on board version ■ LPT interface via rear I/O or on-board hard disk ■ RS232..RS485, isolated or not: for free use in ■ Mainly compatible with D2 board ■ Secondary IDE port for local CompactFlash® system (e. g. cable to front) Mezzanine Slots (or 44-pin ribbon cable connector) ■ Handshake lines: CTS, RTS; DCD, DSR, DTR; ■ Two PC-MIP® slots Graphics RI (with rear I/O) ■ Compliant with PC-MIP® specification ■ Integrated in 845G chipset ■ AC'97 audio ■ Type I/II slots ■ DVI connector at front panel ■ Accessible via on-board connector ■ Or: One PMC slot ■ PS/2 keyboard/mouse ■ Compliant with PMC standard IEEE 1386.1 ■ PS/2 connector at front panel ■ Up to 64-bit/64-MHz, 3.3V V(I/O) ■ PMC I/O module (PIM) support through J4 Miscellaneous ■ Real-time clock ■ Watchdog timer ■ Temperature measurement ■ User LEDs ■ Reset button CompactPCI® Bus ■ Compliance with PICMG 2.0 R3.0, PICMG 2.1 R2.0, PICMG 2.16 R1.0 ■ System slot; peripheral slot avail. on request ■ 66-MHz/64-bit PCI-to-PCI Bridge ■ V(I/O): +5V (+3.3V tolerant) PXI™ ■ Prepared for eight trigger lines compliant with PXI™ Specification R1.0 (on request)
CT2 – RIO Module for D4
■ 6U/80mm format ■ For use of standard connectors
0 MEN CompactPCI
D5C – 6U CompactPCI® MPC8540 SBC / PMC
■ PowerPC® MPC80/800 MHz ■ FPGA 1,000 LEs (approx. 1,000 gates) ■ 1-slot CompactPCI® 6-bit/66-MHz ■ System slot or peripheral slot ■ Hot-swap and PICMG .16 support ■ Up to GB ECC SDRAM ■ NAND Flash, FRAM ■ Graphics via PMC or FPGA ■ Gigabit/1 Fast Ethernet ■ Parallel ATA for on-board hard disk ■ Further I/O individual via FPGA ■ PMC slots ■ MENMON™ BIOS for PowerPC® cards
CPU Front Connections Miscellaneous ■ MPC8540 PowerQUICC™ III ■ COM1 (D-Sub) ■ Real-time clock with GoldCap backup ■ 800MHz (666..833MHz optional) ■ PMC 0 and 1 ■ Power supervision and watchdog ■ e500 PowerPC® core with SPE APU ■ CompactFlash® (optional, instead of PMC 1) ■ Support of a system management interface and MMU ■ COM10 (optional, via SA-Adapter™ on ■ Reset button, GPIO-controlled, ■ Integrated Northbridge and Southbridge additional front panel) in ejector handle CompactPCI ■ High memory bandwidth Rear I/O ■ Three user LEDs, GPIO-controlled; 1 FPGA Memory ■ Three Ethernet, COM2/COM10, GPIO power status LED ■ 2x32KB L1 data and instruction cache, ■ Mezzanine rear I/O: PMC 0 and 1 Local PCI Bus 256KB L2 cache/SRAM integr. in MPC8540 FPGA ■ 32-bit/33-MHz, 3.3V V(I/O) ■ Up to 2GB SDRAM system memory ■ The FPGA offers the possibility to add ■ 64-bit/66-MHz on request ■ SO-DIMM slot for SDRAM modules customized I/O functionality. For standard ■ Compliant with PCI Specification 2.2 ■ DDR2100 with or without ECC factory FPGA configuration see website. PXI™ ■ 133MHz memory bus frequency Mezzanine Slots ■ Eight trigger lines compliant with PXI™ ■ Up to 1GB soldered NAND Flash, FPGA- ■ Two PMC slots Specification R1.0 controlled, 8MB boot Flash ■ Compliant with PMC standard IEEE 1386.1 ■ Up to 16MB add. SDRAM, FPGA-controlled, ■ Up to 64-bit/64-MHz, 3.3V V(I/O) 32KB non-volatile FRAM ■ PMC I/O module (PIM) support through J4 ■ Serial EEPROM 4kbits for factory settings Mass Storage ■ Parallel IDE (PATA) ■ 1x for rear I/O /on-board hard disk/on-board CompactFlash slot ■ Drive can be connected via ribbon cable or using MEN adapter kit ■ Only 1 cPCI® slot needed even with hard disk ■ PIO mode 0 support I/O ■ Three Ethernet channels ■ Two 10/100/1000Base-T Ethernet channels ■ One 10/100Base-T Ethernet channel ■ Accessible via rear I/O on J3 ■ Compatible with PICMG 2.16 ■ Two RS232 UARTs (COM1/COM2) ■ COM1: D-Sub connector at front panel ■ COM2: Accessible via rear I/O on J4 ■ Data rates up to 115kbits/s ■ 16-byte transmit/receive buffer ■ Handshake lines: CTS, RTS ■ One LVTTL UART (COM10) ■ FPGA-controlled ■ Accessible via on-board I/O connector or rear I/O on J4 ■ Physical interface at front panel using SA- Adapter™ via 10-pin ribbon cable on I/O conn. ■ RS232..RS485, isolated or not: for free use in system (e. g. cable to front) ■ Data rates up to 115kbits/s ■ 60-byte transmit/receive buffers ■ Handshake lines: CTS, RTS; DCD, DSR, DTR; RI GPIO ■ 36 lines FPGA controlled ■ FPGA-controlled ■ Accessible via on-board I/O connector 1 or rear I/O on J4 MEN CompactPCI
D3C – 6U CompactPCI® MPC8245 SBC / PMC
■ PowerPC® MPC8 with 60e core ■ 1-slot CompactPCI® system slot ■ 1MB DRAM, CompactFlash® ■ Graphics via PMC ■ Dual Fast Ethernet ■ COMs, USB, IDE, keyboard/mouse ■ PMC slots ■ MENMON™ BIOS for PowerPC® cards
CPU I/O ■ PowerPC® ■ USB ■ MPC8245, 300MHz, double precision FPU ■ One USB 1.1 port ■ Two UARTs (COM3/COM4) Memory ■ Available via I/O connector ■ Accessible via I/O connector ■ L1 Cache integrated in MPC8245 ■ External PHY ■ Physical interface using SA-Adapter™ ■ Up to 512MB SDRAM system memory ■ Data rates up to 12Mbits/s via 10-pin ribbon cable on I/O connector ■ One 144-pin SO-DIMM slot for ■ Ethernet ■ RS232..RS485, isolated or not: for free use SDRAM modules ■ Two 10/100Base-T Ethernet channels in system (e. g. cable to front) ■ 100MHz memory bus frequency ■ RJ45 connector at front panel with two LEDs ■ Handshake lines: none ■ 2MB Flash ■ One RS232 UART (COM1) ■ Keyboard/mouse, PS/2 compatible ■ ■ CompactPCI ■ Serial EEPROM 2KB for factory settings RJ45 connector at front panel External adapters for line drivers required ■ CompactFlash® card interface ■ 16-byte transmit/receive buffer Mezzanine Slots ■ Via on-board IDE ■ Handshake lines: CTS, RTS; DCD, DSR, DTR ■ Two PMC slots ■ Type I, True IDE ■ One UART (COM2) ■ Compliant with PMC standard IEEE 1386.1 Mass Storage ■ Accessible via I/O connector Miscellaneous ■ IDE port for hard disk drives ■ Physical interface using SA-Adapter™ ■ Serial real-time clock with integrated 56-byte ■ Drive can be connected via ribbon cable via 10-pin ribbon cable on I/O connector NVRAM or mounted directly on the CPU board using ■ RS232..RS485, isolated or not: for free ■ Serial hardware watchdog in supervisory MEN adapter kit use in system (e. g. cable to front) circuit ■ Only one CompactPCI® bus slot needed ■ 16-byte transmit/receive buffer ■ Temperature sensor even with hard disk ■ Handshake lines: ■ User LEDs (external) ■ One IDE port for local CompactFlash® CTS, RTS; DCD, DSR, DTR; RI ■ Hex switch for user settings ■ Local PCI Bus ■ 32-bit/33-MHz, 3.3V V(I/O) ■ Compliant with PCI Specification 2.2 CompactPCI® Bus ■ Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0 ■ System slot ■ 32-bit/33-MHz PCI-to-PCI bridge ■ V(I/O): +3.3V (+5V tolerant) PXI™ ■ 2 trigger lines compliant with PXI™ Specif. Electrical Specifications ■ Supply voltage/power consumption: ■ +5V (-3%/+5%), 1.65A typ. ■ ±12V for mezzanines only, tbd. ■ MTBF: 63,000h @ 50°C (derived from MIL-HDBK-217F) Environmental Specifications ■ Temperature range (operation): ■ 0..+60°C or -40..+85°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity (operation): max. 95% non-condensing ■ Relative humidity (storage): max. 95% non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request EMC ■ Tested according to EN 55022 (radio distur- bance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity
MEN CompactPCI
D3B – 6U CompactPCI® MPC8245 SBC / M-Module™
■ PowerPC® MPC8 with 60e core ■ 1-slot CompactPCI® system slot ■ 1MB DRAM, CompactFlash® ■ Dual Fast Ethernet ■ COMs, USB, IDE, keyboard/mouse ■ M-Module™ slots ■ MENMON™ BIOS for PowerPC® cards CompactPCI
D3A – 6U CompactPCI® AD67 – I/O Extension MPC8245 SBC PC-MIP® for D3
■ PowerPC® MPC8 with 60e core Connectors for: ■ 1-slot CompactPCI® system slot ■ SA-Adapters (serial I/O) ■ 1MB DRAM, CompactFlash® ■ PS/ ■ Graphics via PC-MIP® ■ 1 USB ■ Dual Fast Ethernet ■ 1 ." hard disk ■ COMs, USB, IDE, keyboard/mouse ■ PC-MIP® slots (Type I/II) ■ MENMON™ BIOS for PowerPC® cards
MEN CompactPCI
D302 – 6U CompactPCI® Card with 128 Binary I/Os
■ 1-slot CompactPCI® peripheral board ■ optically isolated units ■ channels for each unit ■ Individual use of each channel as input or output ■ Individual edge-triggered interrupts ■ Input/output load on ground ■ High-side output switches ■ Output current 1.9A per channel or 16A per unit ■ Over-current and over-temperature protection
Electrical Specifications ■ Isolation voltage ■ 500V DC between isolated side and digital side ■ 180V DC between the channels ■ CompactPCI Voltage between the connector shield and isolated ground is limited to 180V using a varistor; AC coupling between connector shield and isolated ground through 47nF capacitor ■ Supply voltage/power consumption: ■ +5V (4.85V..5.25V), 106mA ■ +3.3V (3.2V..3.5V), 27mA ■ +24V (external supply voltage 12..32V), 78mA (total for all units) ■ MTBF: 129,000h @ 50°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: standard double Eurocard, 233.3mm x 160mm ■ Weight: 324g Environmental Specifications Binary I/Os Input Characteristics ■ Temperature range (operation): ■ 128 binary signals ■ Input voltage min.: 0V ■ 0..+60°C or -40..+85°C ■ 4 optically isolated units ■ Input voltage max. external supply ■ Airflow: min. 10m³/h ■ 32 channels for each unit voltage (12..32V) ■ Temperature range (storage): -40..+85°C ■ Individual use of each channel as input ■ Voltage level log. 0: 0V..6V or open ■ Relative humidity range (operation): or output ■ Voltage level log. 1: 12V..32V max. 95% without condensation ■ Individual edge-triggered interrupts ■ Input current log. 1: 2.03mA @ 24V ■ Relative humidity range (storage): max. 95% ■ Input/output load on ground ■ Switching threshold: 9.2V @ 0.78mA typ. without condensation ■ High-side output switches ■ Switching time for input change: min. 33µs, ■ Altitude: -300m to + 3,000m ■ High output current max. 44µs ■ Shock: 15g/11ms ■ Max. 1.9A per channel ■ Excess voltage protection: max. +47V ■ Bump: 10g/16ms ■ Max. 16A per unit Peripheral Connections ■ Vibration (sinusoidal): 2g/10..150Hz ■ Over-current and over-temperature ■ Via front panel on four shielded 44-pin ■ Conformal coating on request protection HD-Sub receptacle connectors Safety Output Characteristics CompactPCI® Bus ■ PCB manufactured with a flammability rating ■ Output voltage range: 12V..32V ■ CompactPCI® peripheral slot of 94V-0 by UL recognized manufacturers ■ Output current log. 0: max. 10mA ■ PICMG Spec. 2.0 R3.0 compliant EMC ■ Output current log. 1: max. 1.9A ■ 32-bit data bus ■ Tested according to EN 55022 (radio ■ Switching time for output change: < 200µs ■ 33MHz disturbance), IEC1000-4-2 (ESD) and ■ Isolation voltage (optocoupler): 500V DC ■ V(I/O): +5V IEC1000-4-4 (burst) with regard to CE ■ Concurrent primary and secondary bus conformity operation
MEN CompactPCI
D203 – 6U CompactPCI®/PXI™ M-Module™ Carrier Board
■ 1 CompactPCI® bus slot ■ M-Module™ slots ■ Full PXI™ trigger support ■ Flexible PXI™ trigger routing CompactPCI
D202 – 6U CompactPCI® PXI™ PC-MIP® Carrier Board
■ 1 CompactPCI® bus slot ■ 1 PXI™ slot ■ 6 PC-MIP® slots
CT1 – RIO Module for D202
■ 6U/80mm format ■ For use of standard connectors
MEN CompactPCI
CPCI Rack 0701-0021 – 8 Slots Single Eurocard
■ 19" rack-mountable ■ IEEE 1101.10/11 compliance ■ U/8HP system + 1U fan tray ■ U cards horizontal ■ 8-slot U backplane ■ System slot right ■ Prepared for rear I/O ■ Space for mass storage devices ■ 00W ATX power supply ■ For MEN SBCs F9, F11, F1, F1, F1, F1
General System Characteristics ■ Compliance with IEC 60 297-3, IEEE 1101.10 ■ 8 slots for 3U Eurocard boards with rear I/O
CompactPCI ■ 8HP on the right for I/O extension, additional front panels etc. Mechanical Specifications ■ 19" rack-mount standard ■ 3U card vertical ■ 1U fan chassis with two vertical fans ■ 3U/12HP bay for 3.5" floppy disk drive, 3.5" hard disk drive ■ Dimensions: 3U, 84HP, 278mm depth ■ Weight: tbd. CompactPCI® Backplane ■ Compliance with CompactPCI® Spec. 2.0 Rev. 3.0 and IEC 61 076-4-101 (connectors) ■ 8-slot ■ 3U with rear I/O ■ System slot on the right Power Supply ■ PC power supply PS/2 ■ 3U/32HP ■ ATX-PSU 300W ■ 100V..240V AC wide range ■ 48..63Hz ■ Agency-approved: CE, UL Recognized Component mark ■ Front-panel power connectors ■ Front-panel power-on switch Environmental Specifications ■ Temperature range (operation): ■ 0..+50°C EMC ■ Power supply: 0..+40°C without derating ■ Tested according to EN 55022 (radio distur ■ Temperature range (storage): bance), IEC1000-4-2 (ESD) and IEC1000-4-4 ■ -40..+85°C (burst) with regard to CE conformity ■ Power supply: -20..+65°C without derating Suited for MEN Boards... ■ Relative humidity (operation): max. 95% ■ F9 non-condensing ■ F11 ■ Relative humidity (storage): max. 95% ■ F12 non-condensing ■ F13 ■ Altitude: -300m to + 3,000m ■ F14 ■ Shock: 15g/11ms ■ F15 ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz
6 MEN CompactPCI
CPCI Rack 0701-0030 – 6 Slots Double Eurocard
■ 19" rack-mountable ■ IEEE 1101.10/11 compliance ■ U/8HP system ■ 6U cards horizontal ■ 6-slot 6-bit 6U backplane ■ System slot right ■ Prepared for rear I/O ■ 0W ATX PSU ■ For MEN SBCs D, DC, D6
General System Characteristics ■ Compliance with IEC 60 297-3-101, -102, -103, IEEE 1101.10, IEEE 1101.10/11
■ 6 slots for 6U Eurocard boards CompactPCI ■ 6 slots for 6U rear I/O 80mm I/O boards ■ Hot swap ventilation unit with 2 fans Mechanical Specifications ■ 19" rack-mount standard, black ■ 6U card horizontal ■ Dimensions: 3U, 84HP, 275mm depth ■ Weight: tbd. Chassis ■ Rear I/O bay for 6 horizontal rear I/O boards, 6U, 80 mm depth CompactPCI® Backplane ■ Compliance with CompactPCI® Spec. 2.0 Rev. 3.0 and IEC 61 076-4-101 (connectors) ■ 6-slot ■ 6U with rear I/O on J3/J4/J5 ■ System slot on the right Power Supply ■ Power supply unit ■ ATX PSU 250W with wide range input and IEC receptacle ■ 100V..240V AC ■ 50/60Hz ■ Four voltages: 3.3V/14A, 5V/20A, 12V/16A, -12V/0.8 A ■ Power connector at back-panel ■ Power-on switch incl. LED at front panel Environmental Specifications ■ Temperature range (operation): 0..+45°C EMC ■ Extended temperature range on request ■ Tested according to EN 55022 (radio ■ Airflow: min. 10m³/h disturbance), EN 61000-6-2 and EN 60950 ■ Temperature range (storage): -40..+85°C Suited for MEN Boards... ■ Relative humidity (operation): max. 95% ■ D4 non-condensing ■ D5C ■ Relative humidity (storage): max. 95% ■ D6 non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz
7 2 8 VMEbus MEN
for implementation of further application-specific functions. application-specific further of implementation for PC-MIP and XMC PMC, MEN VMEbus solutions are completed by a huge number of industrial I/O boards based on the M-Module the on based boards I/O industrial of number huge a by completed are solutions VMEbus MEN functions. I/O further by extension individual and flexible for slots mezzanine include also cards Many storage. program for disks hard CompactFlash FRAM, or SRAM non-volatile plus memory system DRAM standard temperaturefor watchdogs or include control.possibilities voltage configuration and storage mass and Memory In addition to state-of-the-art PC functionality, all CPU boards feature industrial functions such as real-time clock, PowerPC on based levels performance different on computers single-board VME64 and VME 6U and 3U of range full a offers MEN p. 40 p. A201S 39 p. A302 38 p. A405 36 p. A12A 36 p. A12B 35 p. A12C 37 p. A13C 32 p. A14C 34 p. A15A 34 p. A15B 34 p. A15C Boards VMEbus 6U Overview – 3U/6U VMEbus Boards VMEbus 3U/6U – Overview
VMEbus
SBC SBC SBC SBC SBC Type carrier M-Module I/O Binary processing data Digital SBC SBC SBC
inFPGA 405cores PowerPC4 300MHz MPC8245/ PowerPC 300MHz MPC8245/ PowerPC 300MHz MPC8245/ PowerPC 933MHz PentiumIII/ 800MHz MPC8540/ PowerPC 400MHz MPC8245/ PowerPC 400MHz MPC8245/ PowerPC 400MHz MPC8245/ PowerPC CPU ® and Intel and ® 1 VMEbus1 slot VMEbus1 slot VMEbus1 slot Slave, VMEbus1 slot Master/slave, VMEbus1 slot Master/slave, VMEbus1 slot Master/slave, VMEbus1 slot master/slave, A32/D64 VMEbus1 slot master/slave, A32/D64 VMEbus1 slot master/slave, A32/D64 VMEbus1 slot master/slave, A32/D64 VMEbus1 slot master/slave, A32/D64 VMEbus ANSI/IEC mezzanine standards. A growing number of boards areFPGAs growingboards with A ofequipped standards. number mezzanine ANSI/IEC ® architectures for rugged industrial and embedded applications. embedded and industrial rugged architecturesfor 16MBFlash 4MBZBTRAM, CompactFlash 512MBDRAM, CompactFlash 512MBDRAM, CompactFlash 512MBDRAM, CompactFlash 512MBDRAM, FRAM NANDFlash, 2GBECCDRAM, CompactFlash 512MBDRAM, CompactFlash 512MBDRAM, CompactFlash 512MBDRAM, max. Memory 2 Fast2 Ethernet, Interfaces transceivers multi-gigabit8 transceivers, fiber-optics2 keyboard/mouse COMs,4 USB, IDE, Fast2 Ethernet, keyboard/mouse COMs,4 USB, IDE, Fast2 Ethernet, keyboard/mouse COMs,4 USB, IDE, Fast2 Ethernet, viatransition module TFT/video,audio etc. COMs,4 USB, graphics Gigabit/FastEthernet, COMs,6 parallel ATA Fast1 Ethernet, upto Gigabit2 Ethernet, keyboard/mouse COMs,4 USB, IDE, Fast2 Ethernet, keyboard/mouse COMs,4 USB, IDE, Fast2 Ethernet, keyboard/mouse COMs,4 USB, IDE, FPGA On-board FPGAs Virtex-II2 Pro I/Ofunctions foruser-defined AlteraCyclone 3 PMC3slots Extensions Local slots M-Module4 PMC2slots TypeI/II PC-MIP3 slots slots M-Module3 PMC2slots PMC2slots PMC2slots TypeI/II PC-MIP3 slots slots M-Module3 ® , NAND Flash and on-board and Flash NAND , Linux, Software software M-Moduledriver Vxworks,OS-9 QNX,RTX, Windows,Linux, OS-9,QNX VxWorks,Linux, OS-9,QNX VxWorks,Linux, OS-9,QNX VxWorks,Linux, RTX,Vxworks Linux,QNX, Windows, QNX VxWorks, Linux, OS-9,QNX VxWorks, Linux, OS-9,QNX VxWorks, Linux, OS-9,QNX VxWorks, Industrial Applications instrumentation Industrialautom., instrumentation Industrialautom., medical physics, Research, automation Industrial automation Industrial automation Industrial instrumentation automation, Industrial automation Industrial automation Industrial automation Industrial automation
™ , shock, drop, bump, vibration, humidity,resistancevibration, chemical bump, drop, shock, temperature, operation +85°C to -40 for: Designed Boards VMEbus 3U
■ p. 31 p. – 30 p. B202S B201S B11
under software) and accessories available information, ordering options, and possibilities configuration of description (including sheets data detailed more and Up-to-date
carrier M-Module carrier M-Module SBC Type www.men.de/products/ CPU MPC8245/400MHz PowerPC A14C – 6U VME64 SBC with PowerPC with SBC VME64 6U – A14C VMEbus 1 VMEbus1 slot VMEbus1 slot VMEbus1 slot Master/slave, CompactFlash 512MBDRAM, max. Memory ® keyboard/mouse COMs,2 IDE, USB, Interfaces MPC8540 1 M-Module1 slot M-Module2 slots TypeI/II PC-MIP2 slots Extensions Local driversoftware M-Module driversoftware M-Module OS-9,QNX, VxWorks,Linux, Software instrumentation Industrialautomation, instrumentation Industrialautomation, industrialautomation Transportation, Applications MEN VMEbus 2 9 VMEbus MEN VMEbus
B11 – 3U VMEbus MPC8245 SBC / PC-MIP®
■ PowerPC® MPC8 up to 00MHz ■ 1-slot VMEbus master/slave ■ 1MB ultra-fast DPRAM ■ 1MB DRAM, CompactFlash® ■ Graphics via PC-MIP® ■ Ethernet via PC-MIP® ■ COMs, IDE, USB, keyboard/mouse ■ PC-MIP® slots ■ MENMON™ BIOS for PowerPC® cards
VMEbus CPU I/O Miscellaneous ■ PowerPC® ■ USB ■ Real-time clock ■ MPC8245 ■ One USB 1.1 port ■ Watchdog and hardware monitor for ■ 300MHz ■ Accessible via I/O connector on-board temperature control Memory ■ OHCI implementation ■ Hex switch for user settings ■ 32KB L1 Cache integrated in MPC8245 ■ Data rates up to 12Mbits/s Local PCI Bus ■ Up to 256MB SDRAM system memory ■ Two UARTs (COM1/COM2) ■ 32-bit/33-MHz, 3.3V V(I/O) ■ One 144-pin SO-DIMM slot for ■ Accessible via I/O connector ■ Compliant with PCI Specification 2.1 SDRAM modules ■ Physical interface using SA-Adapter™ VMEbus ■ 2MB Flash via 10-pin ribbon cable on I/O connector ■ Slot-1 function with auto-detection ■ Serial EEPROM 2KB for factory settings ■ RS232..RS485, isolated or not: for free ■ Master ■ CompactFlash® card interface use in system (e.g. cable to front) ■ D08(EO):D16:A24:A16:RMW ■ Via on-board IDE ■ 16-byte transmit/receive buffer ■ Transfer rate max. 7MB/s ■ Type I ■ Handshake lines: ■ Slave ■ True IDE CTS, RTS; DCD, DSR, DTR; RI ■ D08(EO):D16:A24:BLT Mass Storage ■ PS/2 keyboard/mouse ■ Transfer rate max. 30MB/s ■ Fast IDE ports ■ Accessible via I/O connector ■ Interrupter D08(O):I(7-1):ROAK ■ One IDE hard-disk/CD-ROM port Mezzanine Slots ■ Interrupt handler D08(O):IH(7-1) via on-board connector ■ Two PC-MIP® slots ■ Single level 3 fair requester / arbiter ■ One IDE port for local CompactFlash® ■ Compliant with PC-MIP® specification ■ Bus timer, arbitration timer ■ Type I/II slots ■ Utility functions Electrical Specifications ■ Supply voltage/power consumption: ■ +5V (-3%/+5%), 6W ■ MTBF: 124,000h @ 50°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: standard single Eurocard, 100mm x 160mm ■ Weight: 138g Environmental Specifications ■ Temperature range (operation): ■ 0..+60°C or -40..+85°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity range (operation): max. 95% non-condensing ■ Relative humidity range (storage): max. 95% non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request Safety ■ PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers EMC ■ Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity
0 MEN VMEbus
B202S – 3U VMEbus M-Module™ Carrier Board
■ M-Module™ slots ■ 1 VMEbus slot
VMEbus Mechanical Specifications Safety VMEbus ■ Only one slot required on the VMEbus ■ B201S: ■ PCB manufactured with a flammability rating ■ A24, A16, D16, D08 (E/O) slave ■ Dimensions: standard single Eurocard, of 94V-0 by UL recognized manufacturers ■ D08(O) interrupter 100mm x 160mm EMC M-Modules™ ■ Front panel: aluminum with 1 handle, cut- ■ Tested according to EN 55022 (radio ■ B201S: one M-Module™ slot on the board out for front connector of M-Module™ disturbance), IEC1000-4-2 (ESD) and ■ B202S: two M-Module™ slots on the board ■ Weight: 108g (without M-Modules™) IEC1000-4-4 (burst) with regard to CE ■ M-Module™ characteristics: D08, D16, A08, ■ B202S: conformity INTA, INTC ■ Dimensions: 110mm x 155mm Compatibility ■ Front panel: aluminum without handles, ■ Full compatibility with A201S cut-outs for front connectors of (4 M-Module™ slots) 2 M-Modules™ ■ Functional compatibility with B201, B202 ■ Weight: 102g (without M-Modules™) (2 M-Module™ slots) and A201N Environmental Specifications (4 M-Module™ slots) ■ Temperature range (operation): Peripheral Connections ■ 0..+60°C or -40..+85°C ■ Via front panel ■ Airflow: min. 10m³/h Electrical Specifications ■ Temperature range (storage): -40..+85°C ■ Supply voltage/power consumption: ■ Relative humidity range (operation): max. ■ B201S: +5V (+5%, -0%), 350mA typ. 95% non-condensing (without M-Modules™) ■ Relative humidity range (storage): max. ■ B202S: +5V (+5%, -0%), 320mA typ. 95% non-condensing (without M-Modules™) ■ Altitude: -300m to + 3,000m ■ MTBF: ■ Shock: 15g/11ms ■ B201S: tbd. @ 50°C (derived from ■ Bump: 10g/16ms MIL-HDBK-217F) ■ Vibration (sinusoidal): 2g/10..150Hz ■ B202S: 580,000h @ 50°C (derived from ■ Conformal coating on request MIL-HDBK-217F)
1 MEN VMEbus
A14C – 6U VME64 MPC8540 SBC / PMC
■ PowerPC® MPC80/800MHz ■ Up to 6 COMs ■ FPGA 1,000 LEs ■ Parallel ATA for on-board (approx. 1,000 gates) hard disk ■ 1-slot 6-bit VMEbus master ■ Further I/O individually and slave via FPGA ■ Up to GB (ECC) DRAM ■ PMC slots ■ NAND Flash, FRAM ■ MENMON™ BIOS for ■ Graphics via PMC or FPGA PowerPC® cards ■ Gigabit/1 Fast Ethernet
CPU ■ COM20..COM23 (optional, instead of VMEbus ■ MPC8540 PowerQUICC™ III PMC modules, or in second front-panel slot) ■ Compliant with VME64 Spec. ■ ■ ■ VMEbus 800MHz (666..833MHz optional) PMC 0 and 1 Slot-1 function with auto-detection ■ e500 PowerPC® core with SPE APU and MMU Rear I/O ■ Master – D08(EO):D16:D32:D64:A16:A24: ■ Integrated Northbridge and Southbridge ■ COM10, GPIO, Mezzanine rear I/O: PMC 0 A32:ADO:BLT:RMW ■ High memory bandwidth FPGA ■ Slave – D08(EO):D16:D32:D64:A16:A24:A32: Memory ■ The FPGA offers the possibility to add BLT:RMW ■ 2x32KB L1 data and instruction cache, customized I/O functionality. For standard ■ 1MB shared fast SRAM 256KB L2 cache/SRAM integr. in MPC8540 factory FPGA configuration see website. ■ DMA ■ Up to 2GB SDRAM system memory Mezzanine Slots ■ Mailbox functionality ■ SO-DIMM slot for SDRAM modules ■ Two PMC slots ■ Interrupter D08(O):I(7-1):ROAK ■ DDR2100 with or without ECC ■ Compliant with PMC standard IEEE 1386.1 ■ Interrupt handler D08(O):IH(7-1) ■ 133MHz memory bus frequency ■ Up to 64-bit/64-MHz, 3.3V V(I/O) ■ Single level 3 fair requester ■ Up to 1GB soldered NAND Flash ■ PMC I/O module (PIM) support through J4 ■ Single level 3 arbiter (dep. on chip availability), FPGA-controlled Miscellaneous ■ Bus timer ■ 8MB boot Flash ■ Real-time clock with GoldCap backup ■ Location Monitor ■ 32KB non-volatile FRAM ■ Power supervision and watchdog ■ Performance ■ Up to 16MB additional SDRAM, ■ Reset button, GPIO-contr., in ejector handle ■ Coupled read/write D32 non-block transfer FPGA-controlled, e.g. for video data Local PCI Bus rate 6.5 MB/s ■ Serial EEPROM 4kbits for factory settings ■ 32-bit/33-MHz, 3.3V V(I/O) ■ DMA read/write D32 BLT trans. rate 12.1 MB/s Mass Storage ■ Compliant with PCI Specification 2.2 ■ DMA read/write D64 MBLT trans. rate 25 MB/s ■ Parallel IDE (PATA) ■ One port for hard-disk drives ■ For conn. via ribbon cable or direct assembly on CPU board using adapter kit (instead of PMC) ■ Only one VMEbus slot needed even with hard disk ■ PIO mode 0 support I/O ■ Three Ethernet channels ■ Two 10/100/1000Base-T Ethernet channels ■ One 10/100Base-T Ethernet channel ■ Three RJ45 connectors at front panel ■ 2 on-board LEDs to signal LAN Link and Activity ■ One RS232 UART (COM1) ■ One RJ45 connector at front panel ■ Data rates up to 115kbits/s ■ 16-byte transmit/receive buffer ■ Handshake lines: CTS, RTS ■ One LVTTL UART (COM10) ■ FPGA-controlled ■ Accessible via rear I/O ■ Data rates up to 115kbits/s ■ 60-byte transmit/receive buffers ■ Handshake lines: CTS, RTS; DCD, DSR, DTR; RI ■ Quad UART (COM20..COM23) ■ Physical interface using SA-Adapters™ via 10-pin ribbon cable on I/O connector ■ RS232..RS485, isolated or not: for free use in system (e. g. cable to front) ■ Data rates up to 115kbits/s ■ 128-byte transmit/receive buffer ■ Handshake lines: CTS, RTS; DCD, DSR, DTR; RI ■ 39 GPIO lines, FPGA-controlled ■ Accessible via rear I/O Front Connections ■ Three Ethernet (RJ45) ■ COM1 (RJ45) MEN VMEbus
A15C – 6U VME64 MPC8245 SBC / PMC
■ PowerPC® MPC8/00MHz ■ 1-slot 6-bit VMEbus master and slave ■ 1MB DRAM, CompactFlash® ■ Graphics via PMC ■ Dual 10/100Mbit Fast Ethernet ■ COMs, USB, IDE, keyboard/mouse ■ PMC slots ■ MENMON™ BIOS for PowerPC® cards
CPU ■ PS/2 keyboard/mouse VMEbus ■ PowerPC® MPC8245, 400MHz ■ Accessible via I/O connector ■ Compliant with VME64 Spec. ■ ■ ■ Double precision FPU Requires external PHY Slot-1 function with auto-detection VMEbus Memory Rear I/O ■ Master – D08(EO):D16:D32:D64:A16:A24: ■ L1 Cache integrated in MPC8245 ■ PMC 0 A32:ADO:BLT:RMW ■ Up to 512MB SDRAM system memory Mezzanine Extensions ■ Slave – D08(EO):D16:D32:D64:A16:A24: ■ 144-pin SO-DIMM slot for SDRAM modules ■ Two PMC slots A32:BLT:RMW ■ 133MHz memory bus frequency ■ Compliant with PMC standard IEEE 1386.1 ■ 1MB shared fast SRAM ■ 2MB Boot Flash ■ Up to 64-bit/64-MHz, 3.3V V(I/O) ■ DMA ■ 32MB application Flash (optional) ■ PMC I/O module (PIM) support thr. J4 (slot 0) ■ Mailbox functionality ■ 64-bit data bus Miscellaneous ■ Interrupter D08(O):I(7-1):ROAK ■ Serial EEPROM 4kbits for factory settings ■ Serial real-time clock, integr. 56-byte NVRAM ■ Interrupt handler D08(O):IH(7-1) ■ CompactFlash® card interface ■ Serial hardware watchdog in supervis. circuit ■ Single level 3 fair requester ■ Via on-board IDE, type I, true IDE ■ Temperature sensor ■ Single level 3 arbiter Mass Storage ■ Hex switch for user settings ■ Bus timer ■ Parallel IDE (PATA) ■ User LEDs (integrated into COM1 connector) ■ Location Monitor ■ One port for local CompactFlash® ■ Reset button in ejector handle ■ Performance ■ One port for local hard-disk drive ■ Abort button via I/O connector ■ Coupled read/write D32 non-block transfer ■ Drive can be connected via ribbon cable ■ JTAG/BDM connector rate 6.5 MB/s or mounted directly on the CPU board using Local PCI Bus ■ DMA read/write D32 BLT trans. rate 12.1 MB/s MEN adapter kit ■ 32-bit/33-MHz, 3.3V V(I/O) ■ DMA read/write D64 MBLT trans. rate 25 MB/s ■ Only one VMEbus slot needed even with ■ Compliant with PCI Specification 2.2 hard disk ■ IDE port also available for rear I/O, alternatively to on-board connector I/O ■ USB ■ One USB 1.1 port ■ Accessible via I/O connector J2 ■ OHCI implementation ■ Data rates up to 12Mbits/s ■ External PHY ■ Ethernet ■ Two 10/100Base-T Ethernet channels ■ RJ45 connectors with two LEDs at front panel ■ One RS232 UART (COM1) ■ RJ45 connector at front panel ■ Data rates up to 115kbits/s ■ 16-byte transmit/receive buffer ■ Handshake lines: CTS, RTS; DCD, DSR, DTR ■ 16550 compliant ■ One UART (COM2) ■ Accessible via I/O connector ■ Physical interface at front panel or using SA-Adapter™ via 10-pin ribbon cable on I/O connector, depending on board version ■ RS232..RS485, isolated or not: for free use in system (e. g. cable to front) ■ Data rates up to 115kbits/s ■ 16-byte transmit/receive buffer ■ Handshake lines: full support; lines depend on SA-Adapters™ ■ 16550 compliant ■ Two UARTs (COM3/COM4) ■ Accessible via I/O connector ■ Data rates up to 115kbits/s ■ 16-byte transmit/receive buffer ■ Handshake lines: none ■ 16550 compliant MEN VMEbus
A15B – 6U VME64 MPC8245 SBC / M-Module™
■ PowerPC® MPC8/00MHz ■ 1-slot 6-bit VMEbus master and slave ■ 1MB DRAM, CompactFlash® ■ Dual 10/100Mbit Fast Ethernet ■ COMs, USB, IDE, keyboard/mouse ■ M-Module™ slots ■ MENMON™ BIOS for PowerPC® cards VMEbus
A15A – 6U VME64 MPC8245 AD67 – I/O Extension SBC / PC-MIP® for A15
■ PowerPC® MPC8 with 60e core Connectors for: ■ 1-slot CompactPCI® system slot ■ SA-Adapters (serial I/O) ■ 1MB DRAM, CompactFlash® ■ PS/ ■ Graphics via PC-MIP® ■ 1 USB ■ Dual Fast Ethernet ■ 1 ." hard disk ■ COMs, USB, IDE, keyboard/mouse ■ PC-MIP® slots (Type I/II) ■ MENMON™ BIOS for PowerPC® cards
MEN VMEbus
A12C – 6U VMEbus MPC8245 SBC / PMC
■ PowerPC® MPC8/00MHz ■ 1-slot VMEbus master and slave ■ 1MB DRAM, CompactFlash® ■ Graphics via PMC ■ Dual 10/100Mbit Fast Ethernet ■ COMs, USB, IDE, keyboard/mouse ■ PMC slots ■ MENMON™ BIOS for PowerPC® cards
CPU ■ Two UARTs (COM3/COM4) ■ ® ■ PowerPC MPC8245 Accessible via I/O connector VMEbus ■ 300MHz ■ Physical interface using SA-Adapter™ ■ Double precision FPU via 10-pin ribbon cable on I/O connector Local PCI Bus Memory ■ RS232..RS485, isolated or not: for free use in ■ 32-bit/33-MHz, 3.3V V(I/O) ■ L1 Cache integrated in MPC8245 system (e. g. cable to front) ■ Compliant with PCI Specification 2.2 ■ Up to 512MB SDRAM system memory ■ Handshake lines: none VMEbus ■ One 144-pin SO-DIMM slot for ■ PS/2 keyboard/mouse ■ Slot-1 function with auto-detection SDRAM modules ■ Accessible via I/O connector ■ Master ■ 100MHz memory bus frequency ■ Requires external PHY ■ D08(EO):D16:A24:A16 ■ 2MB Flash Mezzanine Slots ■ Transfer rate max. 7MB/s ■ Serial EEPROM 2KB for factory settings ■ Two PMC slots ■ Slave ■ CompactFlash® card interface ■ Compliant with PMC standard IEEE 1386.1 ■ D08(EO):D16:A24:BLT ■ Via on-board IDE Miscellaneous ■ Transfer rate max. 15MB/s ■ Type I ■ Serial real-time clock with integrated ■ Up to 1MB dual-ported fast SRAM ■ True IDE 56-byte NVRAM ■ Interrupter D08(O):I(7-1):ROAK Mass Storage ■ Serial hardware watchdog in supervis. circuit ■ Interrupt handler D08(O):IH(7-1) ■ Parallel IDE (PATA) ■ Temperature sensor ■ Single level 3 fair requester ■ One port for local CompactFlash® ■ User LEDs (external) ■ Single level 3 arbiter ■ One port for local hard-disk drive ■ Hex switch for user settings ■ Bus timer ■ Drive can be connected via ribbon cable or mounted directly on the CPU board using MEN adapter kit ■ Only one VMEbus slot needed even with hard disk I/O ■ USB ■ One USB 1.1 port ■ Available via I/O connector ■ External PHY ■ Data rates up to 12Mbits/s ■ Ethernet ■ Two 10/100Base-T Ethernet channels ■ RJ45 connector at front panel with two LEDs ■ One RS232 UART (COM1) ■ RJ45 connector at front panel ■ 16-byte transmit/receive buffer ■ Handshake lines: CTS, RTS; DCD, DSR, DTR ■ One UART (COM2) ■ Accessible via I/O connector ■ Physical interface using SA-Adapter™via 10-pin ribbon cable on I/O connector ■ RS232..RS485, isolated or not: for free use in system (e. g. cable to front) ■ 16-byte transmit/receive buffer ■ Handshake lines: CTS, RTS; DCD, DSR, DTR; RI
MEN VMEbus
A12B – 6U VMEbus MPC8245 SBC / M-Module™ VMEbus ■ PowerPC® MPC8/00MHz ■ 1-slot VMEbus master and slave ■ 1MB DRAM, CompactFlash® ■ Dual 10/100Mbit Fast Ethernet ■ COMs, USB, IDE, keyboard/mouse ■ M-Module™ slots ■ MENMON™ BIOS for PowerPC® cards
A12A – 6U VMEbus MPC8245 AD67 – I/O Extension SBC / PC-MIP® for A12
■ PowerPC® MPC8/00MHz Connectors for: ■ 1-slot VMEbus master and slave ■ SA-Adapters (serial I/O) ■ 1MB DRAM, CompactFlash® ■ PS/ ■ Graphics via PC-MIP® ■ 1 USB ■ Dual 10/100Mbit Fast Ethernet ■ 1 ." hard disk ■ COMs, USB, IDE, keyboard/mouse ■ PC-MIP® slots (Type I/II) ■ MENMON™ BIOS for PowerPC® cards
6 MEN VMEbus
A13C – 6U VME64 Pentium® III SBC / PMC
■ Pentium® III (Celeron®) up to 9MHz ■ 1-slot 6-bit VME master or slave ■ 1MB DRAM, CompactFlash® ■ Graphics ■ Gigabit Ethernet ■ USB ■ Quad UART ■ Further I/O via transition module (e.g. TFT/video, audio) ■ PMC slots ■ Optional on-board hard disk (IDE)
■ CPU Ethernet Mezzanine Slots VMEbus ■ Celeron® or Pentium® III ■ One 10/100/1000Base-T Ethernet channel ■ Two PMC slots ■ 400MHz or 933MHz processor core frequ. ■ RJ45 connector at front panel ■ Compliant with PMC standard IEEE 1386.1 ■ 256KB or 512KB L2 cache ■ Three on-board LEDs to signal LAN ■ PMC I/O module (PIM) support through J4 ■ 100MHz or 133MHz system bus frequency Link, Activity status and connection speed Miscellaneous ■ 33MHz APIC bus frequency (10/100/1000Base-T) ■ Battery-backed real-time clock Memory ■ Quad UART (COM2..COM5) ■ Integrated hardware monitor ■ 256MB or 512MB SDRAM system memory ■ Accessible via I/O connector VMEbus ■ One 144-pin SO-DIMM socket for ■ Physical interface using SA-Adapters™ ■ Compliant with VME64 Specification SDRAM modules via 10-pin ribbon cable on I/O connector ■ Slot-1 function with auto-detection ■ 133/100MHz memory bus frequency ■ RS232..RS485, isolated or not: for free use in ■ Master – D08(EO):D16:D32:D64:A16:A24: ■ CompactFlash® interface, type I, true IDE system (e. g. cable to front) A32:ADO:BLT:RMW Mass Storage ■ Data rates up to 115kbits/s ■ Slave – D08(EO):D16:D32:D64:A16:A24: ■ Parallel IDE (PATA) ■ 128-byte transmit/receive buffer A32:BLT: RMW ■ One IDE hard-disk/CD-ROM port via ■ Handshake lines: CTS, RTS; DCD, DSR, DTR; RI ■ 1MB shared fast SRAM on-board connector Rear I/O ■ DMA ■ One IDE port for local CompactFlash® ■ For I/O via transition module or for ■ Mailbox functionality Graphics mezzanine rear I/O (not simultaneously) ■ Interrupter D08(O):I(7-1):ROAK ■ Integrated VGA graphics controller ■ Transition module I/O ■ Interrupt handler D08(O):IH(7-1) ■ VGA connector at front panel ■ One UART (COM1) ■ Single level 3 fair requester / arbiter I/O ■ PS/2 keyboard/mouse ■ Bus timer, location Monitor, performance ■ One USB 1.1 port ■ Floppy disk interface ■ Coupled read/write D32 non-block transfer ■ Series A connector at front panel ■ AC'97 audio rate 6.5 MB/s ■ UHCI implementation ■ TFT panel ■ DMA read/write D32 BLT trans. rate 12.1 MB/s ■ Data rates up to 12Mbits/s ■ Mezzanine rear I/O ■ DMA read/write D64 MBLT trans. rate 25 MB/s ■ PMC 0 A13A – with PC-MIPs®
■ PC-MIP® slots (Type I/II)
VT1 – RIO Module for A13
■ Floppy drive ■ SA-Adapters for COM and keyboard/mouse ■ TFT display
7 MEN VMEbus
A405 – 6U VME64 Slave Processing Board / PMC
■ Virtex™-II Pro FPGAs ■ PowerPC® 0 cores ■ Application-specific digital data processing ■ 1-slot VME6 slave ■ MB ZBT RAM ■ 16MB Flash ■ Firmware in CompactFlash® ■ PMC slots 6-bit/66MHz ■ fiber-optics transceivers ■ 8 multi-gigabit transceivers VMEbus FPGA ■ User FPGA I/O ■ Two FPGAs Xilinx® Virtex™-II Pro ■ User-defined firmware, different for each ■ Fiber-Optic Connections ■ One used as System FPGA, one as User FPGA application ■ Two fiber-optics transceivers ■ 20,880 logic elements ■ Standardized interface to System FPGA: ■ Connectors at front panel ■ 1,584 Kbits BRAM FIFO-based transfer of large data streams ■ 2 Gbits/s RocketIO™ per channel ■ System FPGA (5 RocketIO™), Random access of User FPGA ■ Further I/O depending on FPGA ■ Generic firmware, VHDL, identical for registers, .. (32-bit bus) configuration all applications Processors Rear I/O ■ Modular: On-chip bus with independent ■ Quad PowerPC® ■ Via VMEbus P0/P2 backplane interface modules ■ Four PowerPC® 405 CPU cores implemented ■ 179 user-defined FPGA I/O lines ■ Generic control system interface (VMEbus) in two Virtex™-II Pro FPGAs Mezzanine Slots ■ Generic System FPGA firmware structure ■ 400 MHz ■ Two PMC slots supports development of generic control Memory ■ Compliant with PMC standard IEEE 1386.1 system software, with a generic C++ base ■ 4MB Zero Bus Latency (ZBT) RAM ■ Up to 64-bit/64-MHz, 3.3V V(I/O) class, and derived classes for different ■ 16MB Flash VMEbus diagnostics applications ■ CompactFlash®card interface ■ Compliant with VME64 Specification ■ For FPGA user firmware data ■ Slave ■ Type I ■ D08(EO):D16:D32:A32 ■ Transfer rate max. 20 MB/s Electrical Specifications ■ Supply voltage/power consumption: ■ +5V (-3%/+5%), tbd. ■ MTBF: tbd. @ 40°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: standard double Eurocard, 233.3mm x 160mm ■ Weight: tbd. Environmental Specifications ■ Temperature range (operation): ■ 0..+60°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity (operation): max. 95% non-condensing ■ Relative humidity (storage): max. 95% non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request Safety ■ PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers EMC ■ Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity
8 MEN VMEbus
A302 – 6U VMEbus Card with 128 Binary I/Os
■ 1-slot A/D16 VMEbus slave ■ optically isolated units ■ channels for each unit ■ Individual use of each channel as input or output ■ Individual edge-triggered interrupts ■ Input/output load on ground ■ High-side output switches ■ Output current 1.9A per channel or 16A per unit ■ Over-current and over-temperature protection VMEbus Binary I/Os ■ Supply voltage/power consumption: ■ Relative humidity range (operation): max. ■ 128 binary signals ■ +5V (4.85V..5.25V), 106mA 95% without condensation ■ 4 optically isolated units ■ +3.3V (3.0V..3.6V), 27mA ■ Relative humidity range (storage): max. ■ 32 channels for each unit ■ +24V (external supply voltage 12..32V), 95% without condensation ■ Individual use of each channel as input or 78mA (total for all units) ■ Altitude: -300m to + 3,000m output ■ MTBF: 98,000h @ 50°C (derived from ■ Shock: 15g/11ms ■ Individual edge-triggered interrupts MIL-HDBK-217F) ■ Bump: 10g/16ms ■ Input/output load on ground Mechanical Specifications ■ Vibration (sinusoidal): 2g/10..150Hz ■ High-side output switches ■ Dimensions: standard double Eurocard, ■ Conformal coating on request ■ High output current 233.3mm x 160mm Safety ■ Max. 1.9A per channel ■ Weight: 280g ■ PCB manufactured with a flammability rating ■ Max. 16A per unit Environmental Specifications of 94V-0 by UL recognized manufacturers ■ Over-current and over-temperature ■ Temperature range (operation): EMC protection ■ 0..+60°C or -40..+85°C ■ Tested according to EN 55022 (radio Output Characteristics ■ Airflow: min. 10m³/h disturbance), IEC1000-4-2 (ESD) and ■ Output voltage range: 12V..32V ■ Temperature range (storage): -40..+85°C IEC1000-4-4 (burst) with regard to CE ■ Output current log. 0: max. 10mA conformity ■ Output current log. 1: max. 1.9A ■ Switching time for output change: < 200µs ■ Isolation voltage (optocoupler): 500V DC Input Characteristics ■ Input voltage min.: 0V ■ Input voltage max. external supply voltage (12..32V) ■ Voltage level log. 0: 0V..6V or open ■ Voltage level log. 1: 12V..32V ■ Input current log. 1: 2.03mA @ 24V ■ Switching threshold: 9.2V @ 0.78mA typ. ■ Switching time for input change: min. 33µs, max. 44µs ■ Excess voltage protection: max. +47V Peripheral Connections ■ Via front panel on four shielded 44-pin HD- Sub receptacle connectors VMEbus ■ Only one slot required on the VMEbus ■ A24/A16/D16/D08(EO) slave ■ D08(O) interrupter Electrical Specifications ■ Isolation voltage ■ 500V DC between isolated side and digital side ■ 180V DC between the channels ■ Voltage between the connector shield and isolated ground is limited to 180V using a varistor; AC coupling between connector shield and isolated ground through 47nF capacitor
9 MEN VMEbus
A203N – 6U VME64 M-Module™ Carrier Board
■ M-Module™ slots ■ 1 VME6 slave slot ■ (Master prepared) ■ 7-level interrupter
Mezzanine Slots ■ Four M-Module™ slots ■ Compliant with M-Module™ standard ■ Characteristics: D08, D16, D32, A08, A24, INTA, INTC, TRIGO, TRIGI ■ Prepared for DMA16, DMA32 ■ VMEbus Prepared for D16 burst, D32 burst Interrupt Controller ■ Interrupt handling individually for each M-Module™ Peripheral Connections ■ Via front panel ■ Via 96-pin P2 connector (rear I/O) VMEbus ■ Only one slot required on the VMEbus ■ Slave ■ D08(EO):D16:D32:A16:A24:A32;BLT, prepared for D16BLT and D32BLT ■ Transfer rate max. tbd. MB/s ■ Master ■ Prepared for D32:D64:A32;D32BLT;D64BLT ■ Transfer rate max. tbd. MB/s ■ Interrupter D08(O):I(7-1) ■ Single level 3 fair requester Electrical Specifications ■ Supply voltage/power consumption: +5V (-3%/+5%), tbd. (without M-Modules™) ■ MTBF: 137,000h @ 50°C (derived from MIL-HDBK-217F)
A201S – 6U VMEbus M-Module™ Carrier Board
■ M-Module™ slots ■ 1 VMEbus slot ■ VMEbus slave A16/A/D16, interrupter
The A201S is an M-Module™ carrier board for universal I/O on the VMEbus, allowing high flexibility in applications such as process and motion control, measuring and instrumentation, communication or special-purpose tasks. The M-Modules™ are screwed tightly on the carrier board, but the board needs only one slot on the VMEbus.
An interrupt controller handles the M-Modules™ individually. In VMEbus D16 systems the I/O signals of the M-Modules™ can be accessed from P2/J2 inside the rack.
0 MEN VMEbus
VME64 Rack 0700-0012 – 8 Slots Double Eurocard
■ 19" rack-mountable ■ IEEE 1101.10/11 compliance ■ U/8HP system ■ 6U cards horizontal ■ 8-slot 6-bit 6U backplane ■ Prepared for rear I/O ■ 00W open frame PSU ■ For MEN SBCs A1, A1, A1C, A1
General System Characteristics VMEbus ■ Compliance with IEC 60 297-3-101, -102, -103, IEEE 1101.10, IEEE 1101.10/11 ■ 8 slots for 6U Eurocard boards ■ 8 slots for 6U rear I/O 80mm I/O boards ■ Ventilation using speed-controlled fan through side panels Mechanical Specifications ■ 19" rack-mount standard, shielded ■ 6U card horizontal ■ Dimensions: 4U, 84HP, 277.5mm depth ■ Weight: tbd. Chassis ■ 4U vented front panel with display module and power switch VMEbus Backplane ■ Compliance with VMEbus Specifications IEEE 1014 and IEC 821 ■ 8-slot ■ System bus J1/J2, 6U, no J0 Power Supply ■ Power supply unit ■ Open frame PSU 400W with wide range input and power factor correction ■ 100V..240V AC ■ 50/60Hz ■ Four voltages: 3.3V/35A, 5V/60A, 12V/10A, -12V/6A ■ Back-panel power connectors ■ Power-on switch Environmental Specifications ■ Temperature range (operation): ■ 0..+45°C ■ Extended temperature range on request ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity (operation): max. 95% non-condensing ■ Relative humidity (storage): max. 95% non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz EMC ■ Tested according to EN 55022 (radio disturbance), EN 61000-6-2 and EN 60950 Suited for MEN Boards... ■ A12 ■ A13 ■ A14C ■ A15
1 MEN Power Supplies for 19" Systems
3U 12HP PSU for 19" systems, 66..154V
■ 19" rack mountable (VMEbus, CompactPCI®) ■ U, 1HP ■ Input 110V DC nom. (66-1V) ■ Output .1V, 7W ■ H1 DIN161 plug connector (front and rear) ■ -0..+8°C operation temperature without derating ■ Conformal coating ■ Complies with EN 01
General ■ Supply Fail (FAL) Output Characteristics ■ Standard Euro rack size 19" Output FAL: Isolated optocoupler output ■ Output: 5V/80W ■ Integrated heat sink for extremely low with NPN transistor ■ Accuracy: ±0.5% thermal stress to temperature sensitive Current: 5mA ■ Voltage deviation: 12% omponents Voltage max.: 5V ■ Rise time: 80ms ■ Glued parts for better vibration resistance Pins: Open collector FAL, emitter FAL ■ Overvoltage protection: 1.2V ■ Overtemperature and overvoltage shutdown connected to V out- ■ Overcurrent protection: 1.08A min., ■ Short circuit protection Isolation: FAL-V in: 1.500 Vrms 1.15A max. ■ Remote on/off ■ Sense (S) ■ Overtemperature shutdown: 101°C min., ■ LEDs: green LED indicates correct input Provides compensation of voltage drops 105°C typ., 107°C max. voltage, yellow LED indicates operating (max. 0.2V each line) between power supply Connection mode and load ■ Input and output via DIN 41612 plug
Power Supplies ■ Fixed switching frequency 200kHz Pins S+ and S- of converter must be connector, type H15 ■ Reverse polarity protection by internal connected to load Electrical Specifications protector ■ Shutdown interrupt (SD-INT) ■ Isolation ■ Thermal Warning (TW) SD-INT in: 24V Input/output: 1500V eff Operating criteria: Overtemperature SD-INT out current: 5mA Input/case: 1500V eff shutdown -5K (Risk of overtemperature SD-INT out voltage: 5V Output/case: 500V eff exists.) SD-INT out pins: Collector pull-up resistor ■ MTBF: tbd. @ 50°C Output TW: Output with NPN transistor, 10K to V out+ (derived from MIL-HDBK-217F) emitter connected with V out-; SD-INT out isolation: SD-INT in to Mechanical Specifications max. current 30mA SD-INT out: 1.500 Vrms ■ Dimensions: 3U, 12HP, 128.4mm height ■ Hold-up Time Input Characteristics ■ Weight: ca. 1395g According to EN 50155 Class S2 for ■ Nominal voltage input: 110V DC ■ Environmental Specifications P out 75W ■ Input voltage range: 66..154V ■ Temperature range (operation): -40..+85°C ■ Voltage on threshold: 1.1V ■ Temperature range (storage): -40..+105°C ■ No load input current: 15mA ■ Shock: according to IEC 68-2-27 ■ Continuous shock: according to IEC 68-2-29 ■ Vibration: according to IEC 68-2-6 ■ Protection Class of protection: Class I, EN 60950 Degree of protection: IP20 (inserted in rack), DIN 40050 (IEC 529) ■ Pollution degree: 2 (EN 60950)
MEN Power Supplies for 19" Systems
3U 8HP PSU for 19" systems, 9..36V
■ 19" rack mountable ■ U, 8HP ■ Input V DC nom. (9-6V) ■ Output .V and V ■ Power W ■ H1 DIN161 plug connector (front and rear) ■ SMBus ■ External I/Os for key function ■ -0..+8°C operation temperature ■ Conformal coating ■ Complies with EN 01
General ■ Two status LEDs on front panel Electrical Specifications ■ Standard Euro rack size 19" Green LED indicates correct input voltage ■ Isolation ■ Integrated heat sink for extremely low Yellow LED indicates correct output voltage Input/output: 1500V eff thermal stress to temperature sensitive Driven by transistor Input/shield: 1500V eff components ■ External switch (key) with binary input Output/shield: 1500V eff ■ DC/DC Converter ■ Switch-on by key input or wake-on time Ground/shield: 1500V eff Fuse-protected ■ Switch-off by key input or software ■ MTBF: 240,600 @ 40°C ■ Microcontroller ■ Alternative power supply at the backplane (derived from MIL-HDBK-217F) Voltage and temperature supervision for use as redundant PSU Mechanical Specifications (readable via SMBus) ■ Overtemperature and overvoltage shutdown ■ Dimensions: 3U, 8HP, 128.4mm height Communication with CPU ■ Short circuit protection ■ Weight: 653g ■ Watchdog functionality ■ Remote on/off Environmental Specifications Power Supplies ■ 3 binary inputs ■ Reverse polarity protection by intern. protector ■ Temperature range (operation): -40..+85°C Voltage level according to external power ■ Fixed switching frequency: 250KHz ■ Temperature range (storage): -40..+85°C supply input voltage (max. 36 VDC) Input Characteristics ■ Shock: according to EN60068-2-27 Optically isolated ■ Nominal voltage input: 24VDC ■ Continuous shock: according to User-specific functionality ■ Input voltage range: 9..36V EN60068-2-29 (e.g. external switch on/off signal) ■ No load input power: 900mW ■ Vibration: according to EN600-2-6 ■ 3 binary outputs Output Characteristics ■ Protection Voltage level according to external ■ Output power (max.): 35W Class of protection: Class II, EN 60950 power supply input voltage ■ Output power (min.): 5W Degree of protection: IP20 (insert in rack), Isolated by relays ■ 5V tolerance: +5%/-3% EN60529 User-specific functionality ■ 3.3V tolerance: -+3% EMC ■ SMBus signals on back connector ■ Overvoltage protection: +0.5V/-0.2V ■ Tested according to EN55022 (radio Voltage level 3.3V ■ Overtemperature shutdown: 50°...90° disturbance), EN61000-4-2 (ESD), Controlled by CPU Connection EN61000-4-4 (burst) and EN61000-4-5 Communication between the power supply ■ Input and output via DIN 41612 plug (surge) unit and the CPU connector, type H15
3U 8HP PSU, 18..72V
As above, but with 18V to 7V input range (6V DC nom.)
3U 8HP PSU, 36..154V
As above, but with 6V to 1V input range (110V DC nom.)
44 SA-Adapters MEN SA-Adapters™ can be used on the majority of MEN’s VMEbus, CompactPCI VMEbus, MEN’s of majority the on used be can SA-Adapters™ requirements.isolation and transceivers line the to regard with flexibility enhancing boards, CPU MEN's of many to interfaces I/O additional add to allows concept SA The to cable. ribbon via panel frontdirectly the to connected be Alternatively,can mezzanine. plugged adapter a the as board CPU the be can which adapter, per provided is line serial One functions. I/O small other and faces inter fieldbus I/O, serial legacy for interfaces physical the providing boards universal small are SA-Adapters™ be verified for every board configuration requested. configuration board every for verified be to needs and criteria system operating and FPGA as well features,as functional and mechanical of combination Whether a specific SA-Adapter™ (or a mix of different SA-Adapters™) fits on a specific CPU board is determined by a shock, drop, bump, vibration, humidity,resistancevibration, chemical bump, drop, shock, temperature, operation +85°C to -40 for: Designed SA-Adapters
SA18 SA15 SA13 SA12 SA9 SA8 SA3 SA2 08SA1
■ SA-Adapters
under software) and accessories available information, ordering options, and possibilities configuration of description (including sheets data detailed more and Up-to-date
www.men.de/products/ Interface RS232
USB1.1, -40..+85°C digital8 I/Olines, -40..+85°C PS/2forkeyboard/mouse, -40..+85°C AudioCodec AC’97, Interbus-Smaster CANISOhigh-speed RS232 RS422/RS485, halfduplex orfull duplex -40..+85°C
™
– Serial Line Physics for MEN Boards MEN for Physics Line Serial –
slto Supported Isolation No Yes No Yes Yes Yes Yes No Yes
P10,AD67, CT2, VT1 SC13a/b/c,090009 (Kahlua Box) D3a/b/c,D5c, D6,F9, F11, F12, F13 A12a/b/c,A13N, A14c, A15a/b/c, B11 EM1/A,EM3/A, EM4N, EM7N, EM8/A, PP1 F11onrequest+ F11onrequest+ F11onrequest+ F11,F12, F13, EM1/A, EM4N, EM8/A onrequest+ Ason08SA1 Asfor08SA1 PP1onrequest+ Call on SA12 – Audio Codec AC’97 Codec Audio – SA12 MEN Boards ® , ESM™, PCI-104 or busless SBCs. busless or PCI-104 ESM™, , -
■ ■ ■ ■ ■ ■ ■ ■ 6. page see ... Core 3U – F15 ■ ■ ■ ■ ■ ■ ■ ■ ■ 19. page see ... Pentium 6U Conduction-Cooled – D601 ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 18. page see ... Server Blade Pentium 6U – D6 module. PCI-104 plugged additional an with ESM™ an and/or card carrier application-specific an with ESM™ an module), the operate to sufficient is connection supply power (the ESM™ stand-alone a of either consists control embedded complete A systems. operating various for packages support board and functions, application-specific of range a for used be can that FPGA an I/O, board-specific memory), and or chipset (x86 core computing a of consists ESM™ The module. plug-on a on puters com- complete are modules ESM™ 50-57. pages see ... System Modules System ESM Individual I/O in FPGA in I/O Individual COM 2 2.0, USB 3 1280x1024 to up Graphics SATA, 2 PATA2 interfaces (NAND) Flash-on-disk 1GB to Up FRAM SRAM, Non-volatile SDRAM ECC DDR2 1GB to Up support 2.16 PICMG Hot-swap, ULVCeleron Pentium Prepared for rugged environments rugged for Prepared audio Definition High 2.0 USB 8 to Up DVI 2 and VGA via Video SATA 2 interfaces soldered DRAM DDR2 GB 4 to Up busless or master system 4HP Intel cooling Conductive 2.0 USB 3 Ethernet Gigabit 2 LVDSor DVI 1 and VGA via Video SATA 2 interfaces soldered DRAM DDR2 GB 1 to Up busless or master system 4HP Pentium to Up ULVCeleron ® ™ Core Embedded ® M up to 2GHz to up M ™ Duo T2500, 2GHz T2500, Duo ® ® ® M 373, 1GHz 373, M 1GHz M M SBC M ® M 760, 2GHz 760, M ™ Duo SBC Duo ® M RISC CPU, RISC ■ 9. page see ... SBC Pentium 3U – F11 ■ ■ ■ ■ ■ ■ ■ ■ ■ Pentium to up ■ 7. page see ... ■ ■ ■ ■ ■ ■ ■ ■ ■ 12. page see ... SBC MPC5200 3U – F12 ■ ■ ■ ■ ■ ■ gates) 144,000 (approx. ■ (PowerQUICC ■ 11. page see ... SBC MPC8540 3U – F13 ■ ■ ■ ■ ■ ■ ■ ■ ■ SBC Pentium 3U – F14 ULP Pentium ULP environments rugged for Prepared 11..35W consumption Power audio Definition High 2.0 USB 8 to Up (PCIe) Ethernet Gigabit 2 DVI 2 and VGA via Video SATA 2 interfaces soldered DRAM DDR2 GB 1 to Up busless or master system 4HP ULVCeleron -40 to +85°C with qualified components qualified with +85°C to -40 functions I/O user-defined for FPGA controller CAN Dual (front) USB COM, Ethernet, Fast Dual memory graphics 16MB SRAM, MB 2 to Up Flash NAND Flash, boot MB 8 to Up SDRAM DDR on-board MB 256 to Up gates) 144,000 (approx. LEs 12,000 FPGA MHz MPC5200/384 MENMON™ functions I/O user-defined for FPGA front) on (RJ45 COM 1 front) on (RJ45 Ethernet Fast Gigabit/1 2 Flash NAND (SO-DIMM) DRAM DDR GB 2 to Up LEs 12,000 FPGA 800MHz MPC8540, SA-Adapters 7 to up Option: functions I/O programmable further – FPGA board on disk hard 2.5" for Prepared (on-board) IDE pixels 1200 x 1600 to Up (front) keyboard/mouse (front)VGA, COM2 Option: (front) 1.1 USB 2 COM1, Ethernet, Fast 2 SRAM 2MB DRAM, MB 512 to Up ULVCeleron
BIOS for PowerPC for BIOS ® ® ® M 373 M up to 650 MHz 650 to up ™ III up to 933 MHz 933 to up III III) ® M 760 M ™ ™ ® ® ® III M cards MEN Busless SBCs Busless
45 Busless SBCs MEN Busless SBCs
SC13C – 6U PowerPC® SBC with PMCs
■ PowerPC® MPC8/00MHz ■ 6U form factor ■ 1MB DRAM, CompactFlash® ■ Graphics via PMC ■ Dual 10/100Mbit Fast Ethernet ■ COMs, USB, IDE, keyboard/mouse ■ PMC slots
CPU ■ IDE port for hard disk drives Electrical Specifications ■ PowerPC® MPC8245, 300MHz ■ Drive can be connected via ribbon cable ■ Supply voltage/power consumption: Memory or mounted directly on the CPU board using ■ +5V (4.85V..5.25V), 1.65 A typ. ■ Level 1 Cache integrated in MPC8245 MEN adapter kit ■ ±12V for mezzanines only, tbd. ■ Up to 512MB SDRAM system memory ■ Keyboard/mouse ■ MTBF: 63,000h @ 50°C (derived from ■ 1 SO-DIMM slot, 100MHz memory bus frequ. ■ PS/2 compatible MIL-HDBK-217F) ■ Flash 2MB ■ External adapters for line drivers required Mechanical Specifications ■ Serial EEPROM 2KB for factory settings ■ USB port ■ Dimensions: standard double Eurocard, ■ CompactFlash® card interface for Flash ATA ■ External line drivers 233.3mm x 160mm (true IDE) via on-board IDE Local PCI Bus ■ Weight (without mezzanines and Interfaces ■ PCI Spec. 2.2 compliant accessories): 237g ■ Two 10/100Mbits/s Ethernet channels 32-bit data bus, 33MHz, 3.3V Environmental Specifications ■ 82559ER controller Mezzanine Extensions ■ Temperature range (operation): Busless SBCs ■ RJ45 at front panel with two LEDs ■ Two PMCs ■ 0..+60°C or -40..+85°C ■ One RS232 UART (COM1) ■ Compliant with PMC standard IEEE 1386.1 ■ Airflow: min. 10m³/h ■ 16-byte transmit/receive buffer Miscellaneous ■ Temperature range (storage): -40..+85°C ■ RJ45 at front panel ■ Serial real-time clock with integrated 56-byte ■ Relative humidity (operation): max. 95% nc ■ One UART (COM2) NVRAM ■ Relative humidity (storage): max. 95% nc ■ 16-byte transmit/receive buffer ■ Serial hardware watchdog in supervisory ■ Altitude: -300m to + 3,000m ■ Physical interface using SA-Adapter™ circuit ■ Shock: 15g/11ms via 10-pin ribbon cable on I/O connector ■ Power supply via on-board 4-pin power ■ Bump: 10g/16ms ■ RS232..RS485, isolated or not: for free use in connector ■ Vibration (sinusoidal): 2g/10..150Hz system (e. g. cable to front) ■ Temperature sensor ■ Conformal coating on request ■ Two MPC8245 UARTs ■ Hex switch for user settings ■ Accessible via I/O connector ■ User LEDs (external) SC13B – with M-Modules™
■ M-Module slots
SC13A – with PC-MIPs®
■ PC-MIP slots (Type I/II)
AD67 – I/O Extension for SC13
■ SA-Adapters (serial I/O) ■ PS/ 6 ■ 1 USB MEN Busless Systems
Human-Machine Interfaces – Individual Solutions
For example: ■ Aluminum EMC enclosure ■ V power supply ■ TFT with touch interface ■ Integrated keyboard ■ Resolution 80 x 60 to 600 x 800 ■ Printer, CompactFlash® at front ■ I/O connections at rear ■ MPC8/66..00MHz ■ DRAM, CompactFlash® ■ CAN, Ethernet, serial ... interfaces ■ Additional I/O via on-board FPGA ■ Java (Internet access)
Mechanical Specifications TFT ■ Ethernet ■ Aluminum enclosure ■ Hitachi TX31D30VC1CAA ■ 10/100Mbits/s Ethernet interface ■ Dimensions: depth 75 mm (max.), ■ 800 x 600 pixels, 6 bits/color ■ One or two channels width 483 mm, height 288 mm ■ 300 cd/m² ■ RJ45 connectors at rear side ■ IP rating: IP20 according to EN 60529 ■ TTL interface ■ CAN bus CPU Touch panel ■ ISO high speed ■ PowerPC® MPC8245, 266..400MHz ■ Analog resistive touch panel ■ Optically isolated Memory Printer ■ Baud rate up to 1Mbit/s ■ 32..512MB SO-DIMM / 133MHz ■ Fast thermal printer, e.g. Seiko LP1245 ■ Debug/Service Connection ■ Two CompactFlash® slots ■ Printing speed > 15mm/s ■ RS232 ■ One located at the front, dust protection ■ Paper feed speed > 30mm/s ■ Standard connector at front cover ■ Push button for form feed Further I/O options through FPGA ■ One inside the system, for program data Interfaces ■ All functions optional, can be Busless Systems Graphics ■ Serial Connection factory-programmed as needed ■ 32MHz video frequency ■ RS232/RS422/RS485 selectable through ■ IDE interface ■ 16MB video SDRAM software setup ■ SRAM controller ■ 16 bits/pixel (5-5-6) ■ Isolated ■ Quad UART ■ Linearly organized frame buffer interface ■ Standard baud rates up to 115.2 kbaud ■ GPIO ■ Two handshake lines in RS232 mode PCI bus Extension Interface ■ PCI-104 extension slot Miscellaneous Features ■ SA-Adapter extension interface ■ For flexible serial interfacing ■ Connection at rear side Power Supply ■ 24V +/-25%, 0,8A typical, 2A max. ■ 3.15t fuse Environmental Specifications ■ Temperature range (operation): ■ 0..+50°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -20..+60°C ■ Relative humidity (operation): max. 85% non-condensing ■ Relative humidity (storage): max. 85% non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 6g/6ms ■ Crash: 15g/0.33ms ■ Vibration (sinusoidal): 1g/5..2000Hz Safety ■ PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers EMC ■ Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity
7 8 Busless Systems MEN Kahlua Box – Industrial Control System Control Industrial – Box Kahlua ■ ■ ■ ■ ■ ■ system(e.g.cable tofront) ■ 10-pinribbon cable onI/Oconnector ■ ■ ■ ■ ■ ■ ■ ■ ■ Interfaces (trueIDE) viaon-board IDE ■ ■ ■ ■ ■ ■ Memory ■ mounting ■ CPU ■ ■ height80mm ■ ■ MechanicalSpecifications ■ ■ ■ ■ ■ NVRAM ■ Miscellaneous ■ ■ fouradditional M-Modules ■ ■ ■ ■ ■ ■ PCI bus, compliantwith PC-MIP ■ MezzanineExtensions ■ ■ adapterkit mounteddirectly onthePCB using MEN ■ ■
Configurable with: Configurable CompactFlash MB 1MB) (max. DRAM 6MB MPC8/00MHz supply power DC 0W / V enclosure EMC aluminum Compact Busless Systems Busless Reset/abortbuttons UserLEDs (external) Hexswitch foruser settings Temperaturesensor Serialhardware watchdog insupervis. circuit Serialreal-time clock with integrated 56-byte Characterist.: A08, A24, D16, D32, INTA, INTC Compliantwith M-Module Optionforall three versions: carrier board for Compliantwith PMCstandard IEEE 1386.1 090009-05:twoPMCs Characterist.: D16, D32, A08, A24, INTA, INTC Compliantwith M-Module 090009-03:three M-Modules 090009-04: three PC-MIPs Type I/II on local USB Keyboard/mouse,PS/2 compatible Drivecanbeconnected viaribbon cable or IDEport forhard disk drives RS232..RS485,isolated ornot: forfree usein Physicalinterfaces using SA-Adapters 16-bytetransmit/receive buffer ThreeUARTs (COM2..COM4) RJ45atfront panel 16-bytetransmit/receive buffer OneRS232 UART (COM1) RJ45atfront panel with twoLEDs 82559ERcontroller Two10/100Mbits/s Ethernet channels CompactFlash SerialEEPROM 2KBfor factory settings Flash2MB 100MHzmemory busoperation SO-DIMMslot forupto512MB SDRAM LevelCache1 integrated inMPC8245 PowerPC 6U/4HPsingle-board computer forsandwich Weight:tbd. kg(depending onset-up) IPrating: IP30 according toEN60529 Dimensions:245mm,d width 266mm, Aluminumenclosure – SA-Adapters – PMCs – PC-MIPs – M-Modules – ® MPC8245 300MHz@ ® card interface forFlash ATA ™ ™ PMC slots PMC ™ ™ ™ ®
standard standard ™
® specification ™ via ■ withfan: noderation) Wattpower dissipation onmezzanines; ■ ■ Environmental Specifications ■ ■ ■ ■ connector:200mA max. each ■ +5.1V/6A,+12V/+0.4A, -12V/-0.4A ■ ■ ■ ElectricalSpecifications
Airflow:min. 10m³/h 0..+45°C(w/o fan: derated by2.25°C per Temperaturerange (operation): MTBF:tbd. (derived from MIL-HDBK-217F) Outputcurrent total: 1.05A max. Outp. curr. for SA-Adapter Outputcurrent forUSB conn.: 300mA max. Outputcurrent forkeyboard/mouse Outputcurrent ofinternal DC/DC converter: Input:18..36V DC;0.8A typ., 2Amax. Powersupply unit PSU ™ : 200mA max. each bance),IEC1000-4-2 (ESD) andIEC1000-4-4 ■ EMC of94V-0 byULrecognized manufacturers ■ Safety ■ ■ ■ ■ ■ ■ ■ (burst)with regard toCEconformity Testedaccording toEN55022 (radio distur- PCBmanufactured withflammability a rating Vibration(sinusoidal): 2g/10..150Hz Bump:10g/16ms Shock:15g/11ms Altitude:-300m 3,000mto+ Relativehumidity (storage): max. 95%nc Relativehumidity (operation): max. 95%nc Temperaturerange (storage): -40..+85°C MEN Busless Systems
UBOX™ – Rugged Embedded or Panel Computer
For example: ■ Aluminum/zinc-plated EMC enclosure ■ 8-6 VAC power supply ■ 10." TFT-LCD touch panel ■ 60 x 80 pixels @ 66,1 colors ■ Pentium® or PowerPC® architectures ■ Memory configuration variable ■ Ethernets, USBs, COMs etc. variable ■ Additional I/O via on-board FPGA ■ I/O connections at rear ■ Windows®, Linux, VxWorks®, QNX®
Embedded Computer UBox™ Basex86/PowerPC® ■ Housing ■ Aluminum/zinc-plated steel plate, EMC enclosure ■ 202 x 315 x 49.8 mm ■ Power Supply Unit ■ 85-264VAC, 50/60Hz, 25W ■ Over-voltage protection ■ -25 to +60°C operation temperature ■ Electronics ■ EM1 with PowerPC® MPC 5200 / 384MHz ■ EM1A with PowerPC® MPC 5200B / 384MHz ■ EM1N with PowerPC® MPC 5200B / Busless Systems 384MHz HMI with a printer, ■ EM3 with PowerPC® MPC 8560 / 800MHz back view ■ EM3A with PowerPC® MPC 8560 / 800MHz ■ EM4N with PowerPC® MPC 8245 / 400MHz ■ EM7 with ULV/ULP Celeron®/Pentium® III up to 933MHz ■ EM8 with PowerPC® MPC 8540 / 800MHz ■ EM8A with PowerPC® MPC 8540 / 800MHz ■ Up to 1GB SDRAM View with lifted ■ CompactFlash® or NAND Flash cover ■ Standard serial connections depending on type of ESM™ ■ Further COMs, Ethernet, USB, floppy, CAN, IDE, graphics, audio, keyboard/mouse, digital I/O etc. customizable via FPGA
Panel Computer UBox™ Vision x86/PowerPC® ■ Same housing and electronics Inside view as UBox™ Base ■ System incl. 10.4" display 202 x 315 x 78.2 mm ■ TFT-LCD panel ■ 640 x 3 x 480 pixels @ 266,144 colors (6 bits/color) ■ 4 timing signals ■ Supply voltage for backlight ■ Low reflection/high color saturation ■ -10 to +65°C operation temperature ■ Shock and vibration qualified Simple “Front Panel” ■ Integrated touch screen ■ Other types and sizes of displays on request The cooling principle
DIN-Rail Computer UBox™ Rail x86/PowerPC® ■ Same housing and electronics as UBox™ Base ■ Additional mechanics on a different carrier plate on the back side of the housing for mounting on a DIN rail
9 50 System-on-Module ESM MEN carrierboard. The FPGA on every ESM shock, drop, bump, vibration, humidity,resistancevibration, chemical bump, drop, shock, temperature, operation +85°C to -40 for: Designed 52 p. EM1A 52 p. EM1N – EM1 57 p. EM2 53 p. EM3A 53 p. EM3 55 p. EM4N 56 p. EM7 54 p. EM8A 54 p. EM8 humidity, chemicals, -40 to +85°C operation temperature. operation +85°C to humidity,-40 chemicals, ESM modules. Serial interface adapters (SA-Adapters ESM CompactPCI a of backplane the to or board ESM Some card. carrier the to FPGA the programmedin functions the of signals I/O the feeds ESM the of configuration application-specific final the on depending variable is ESM a of independent still Windows also Linux, i.e. – support is BSP the and application, specific that I/O provides which code, VHDL application- in any programmed to FPGA fixed an not function, is which specific I/O) memory, set, chip CPU, RISC or (PC hardware the of consist They ESM an Overview – ESM – Overview
■
System-on-Module ESM System-on-Module
under software) and accessories available information, ordering options, and possibilities configuration of description (including sheets data detailed more and Up-to-date
additional J3 connector that is used to replace the front I/O connectors to route the signals to the carrier the to signals the route to connectors I/O front the replace to used is that connector J3 additional ™ ™ ™ ™ modules can be used stand-alone, plugged onto a customized carrier card and/or stacked with PCI-104 with stacked and/or card carrier customized a onto plugged stand-alone, used be can modules J2 while assignment, signal fixed a has J1 connectors: system two have They PCI. on based are modules SOM). – (System-On-Module module a on computers complete are Modules System Embedded modules have been developed to work also in rugged environments – shock, vibration, drop, resonance, drop, vibration, shock, – environments rugged in also work to developed been have modules rearI/O SBC– frontI/O SBC– frontI/O SBC– frontI/O SBC– rearI/O SBC– frontI/O SBC– frontI/O SBC– frontI/O SBC– rearI/O SBC– frontI/O SBC– Type www.men.de/products/ MPC5200B/384MHz PowerPC MPC5200B/384MHz PowerPC MPC5200/384MHz PowerPC 400MHz,650MHz TualatinULV Celeron / 933MHz/ TualatinULPPentium III MPC8560/800MHz PowerPC MPC8560/800MHz PowerPC MPC8245/400MHz PowerPC 400MHz,650MHz TualatinULV Celeron / 933MHz/ TualatinULPPentium III MPC8540/800MHz PowerPC MPC8540/800MHz PowerPC CPU ™ Embedded System Modules System Embedded Memory 2 MBNVRAM2 NANDFlash, 256MBDDRAM SDRAM, MBNVRAM2 NANDFlash, 256MBDDRAM SDRAM, MBNVRAM2 NANDFlash, 256MBDDRAM SDRAM, CompactFlash 512MBDRAM, GBNAND1 Flash (SO-DIMM) GBDDRAM2 GBNAND1 Flash (SO-DIMM) GBDDRAM2 CompactFlash 512MBDRAM, CompactFlash 512MBDRAM, GBNAND1 Flash (SO-DIMM) GBDDRAM2 GBNAND1 Flash (SO-DIMM) GBDDRAM2
™ max. additionally allows implementation of IP cores tailored to the application. ® or VMEbus system. VMEbus or ™ Interfaces etc.viaFPGA CAN,2 graphics, serial lines USBonJ3rear I/Oconnector; Fast2 Ethernet, COM,1 1 etc.viaFPGA CAN,2 graphics, serial lines USB(front); Fast2 Ethernet, COM,1 1 etc.viaFPGA CAN,2 graphics, serial lines USB(front); Fast2 Ethernet, COM,1 1 carrierboard mouse,(E)IDE, floppy via TFT/video,audio, keyboard/ Ethernet,USB,COM, 1 Graphics,Gigabit orFast inFPGA I/Oconnector, further I/O Ethernet,COMs2 onJ3rear Gigabit2 Ethernet, Fast1 furtherI/OinFPGA Gigabit2 Ethernet, COMs,2 IDEviaFPGA graphics,further COMs, CAN, Fast2 Ethernet, COMs,2 furtherI/Ovia FPGA graphics,USB,2 (E)DIE (rear); (front); Fast2 Ethernet, COMs2 inFPGA I/Oconnector, further I/O Ethernet,COMs2 onJ3rear furtherI/OinFPGA Gigabit2 Ethernet, COMs,2 ) provide access to additional line physics on any type of ESM ® or a real-time operating system. operating real-time a or definedI/O functions AlteraCyclone II for user- definedI/O functions AlteraCyclone II for user- definedI/O functions AlteraCyclone for user- definedI/O functions AlteraCyclone for user- definedI/O functions AlteraCyclone for user- definedI/O functions AlteraCyclone for user- definedI/O functions AlteraCyclone for user- definedI/O functions AlteraCyclone for user- definedI/O functions AlteraCyclone for user- On-board
FPGA ™ and the carrier board. J2 also J2 board. carrier the and Software Linux,VxWorks Linux,VxWorks Linux,VxWorks VxWorks QNX,RTX, Windows,Linux, Linux,VxWorks Linux,VxWorks Linux,VxWorks VxWorks QNX,RTX, Windows,Linux, Linux,VxWorks Linux,VxWorks ™ modules include modules Applications automotive transportation, Industrialautomation, automotive transportation, Industrialautomation, automotive transportation, Industrialautomation, instrumentation Industrialautomation, Telecom Telecom Industrialautomation Industrialautomation robotics communication, Industrial robotics communication, Industrial ™
EK7 – with EM8 (PowerPC EM8 with – EK7 (PowerPC EM1N with – EK6N (ULV/ULPCeleron EM7 with – EK (PowerPC EMN with – EK StarterKitOverview Benelux. the in or France, in USA, the in example for – partners and Centers Know-How MEN by and headquarters MEN the by offered are services integration and design mechanical as well as design core IP FPGA and board Carrier housing. a design or functions, additional those for drivers ware standard PCI-based components, load chooseadditional I/O functions into the FPGA, write soft- card, carrier simple a develop to sary neces- be may it quantity and application the on Depending I/O. to limited is application each for overhead design the evaluation, After PC. standard a in installed be also can and options mounting versatile provides kit starter ESM™ Each le. modu- PCI-104 a mounting for adapter an and features, ESM™ the on depending cables several memory,PSU, DRAM card, carrier the functions, I/O additional with FPGA an ESM™), (the module CPU the of consists usually kit The Module. System Embedded of specific a functions the of most of evaluation allows kit starter ESM™ An ESM ™ Starter Kits Starter
EM3A – ESM™ with MPC8560 (PowerQUICC® III) ® MPC 80) MPC ® MPC 8) MPC ® MPC 00B) MPC ® /Pentium ® III) EK7 – with EM8 with – EK7 EM1N with – EK6N EM7 with – EK5 EM4N with – EK2 MEN System-on-Module ESM System-on-Module
1 System-on-Module ESM MEN System-on-Module ESM
EM1N – Embedded System Module with MPC5200B
Embedded System Module with: ■ MPC00B / 8 MHz ■ FPGA 18,7 LEs (approx. ,000 gates) ■ Up to 6 MB on-board DDR SDRAM ■ Up to 8 MB boot Flash, NAND Flash ■ Up to MB SRAM, 16 MB graphics memory ■ Dual Fast Ethernet, COM, USB 1.1 (front) ■ Dual CAN controller ■ MENMON™ BIOS for PowerPC® cards ■ COMs, graphics, IDE etc. optional via FPGA ■ Stackable with PCI-10
CPU Graphics ■ External transceivers using SA-Adapters™ ■ PowerPC® MPC5200B, up to 400MHz ■ Avail. via I/O connector, FPGA-controlled ■ Further I/O depending on FPGA config. Memory I/O FPGA ■ 2x16KB L1 data and instruction cache ■ One USB 1.1 port ■ The FPGA offers the possibility to add integrated in MPC5200 ■ Series A connector at front panel customized I/O functionality. For standard ■ Up to 256MB SDRAM system memory ■ OHCI implementation factory FPGA configuration see website. ■ Soldered, DDR ■ Data rates up to 12Mbits/s PCI Interface ■ 64MHz memory bus frequency ■ Ethernet ■ 32-bit, 33-MHz PCI interface at PCI-104 ■ Up to 1GB soldered NAND Flash (depend. ■ Two 10/100Base-T Ethernet channels connector J1 on chip availability), FPGA-controlled ■ Two RJ45 or one D-Sub conn. at front panel ■ Compliant with PCI Specification 2.2 ■ Up to 8MB boot Flash ■ One RS232 UART (COM1) ■ Support of 4 external masters ■ Up to 2MB battery-backed SRAM, or: ■ RJ45 or D-Sub connector at front panel Miscellaneous up to 128KB non-volatile FRAM ■ Data rates up to 115kbits/s ■ Real-time clock, battery-backed ■ Serial EEPROM 8kbits for factory settings ■ 512-byte transmit/receive buffer ■ Power supervision and watchdog ■ Up to 16MB additional SDRAM, connected ■ Handshake lines: CTS, RTS Electrical Specifications to FPGA, e.g. for video data ■ CAN bus ■ Supply voltage/power consumption: Mass Storage ■ Two CAN bus channels ■ +5V (-2%/+5%), 100mA typ. ■ Parallel IDE (PATA) ■ 2.0 A/B CAN protocol ■ +3.3V (-2%/+5%), 1A typ. ■ One port for hard-disk drives ■ Data rates up to 1 Mbit/s ■ MTBF: 116,000h @ 50°C (derived from ■ Avail. via I/O connector, FPGA-controlled ■ Connection via on-board connectors MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: conforming to ESM™ specific. (PCB: 149mm x 71mm), Type I-S ■ Weight: 90g (w/o heat sink) Environmental Specifications ■ Temperature range (operation): -40..+85°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity (operation): max. 95% nc
System-on-Module ESM ■ Relative humidity (storage): max. 95% nc ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request
EM1A – rear I/O ESM™ with MPC5200B
EM1A offers 2 Fast Ethernet, COM and USB via J3 rear I/O connector instead of 2 Fast Ethernet, COM and USB via RJ45 on front (EM1N). MEN System-on-Module ESM
EM3 – Embedded System Module with MPC8560
Embedded System Module with: ■ MPC860, 800 MHz ■ FPGA 1,000 LEs (approx. 1,000 gates) ■ -bit/-MHz PCI, opt. 6-bit/66-MHz ■ Up to GB DDR SDRAM (SO-DIMM) ■ NAND Flash ■ Gigabit / 1 Fast Ethernet, 1 COM (RJ) ■ MENMON BIOS for PowerPC® cards ■ COMs, CAN, graphics, IDE etc. via FPGA ■ Stackable with PCI-10
CPU Mass Storage Front Connections ■ PowerPC® MPC8560 PowerQUICC™ III ■ Parallel IDE (PATA) ■ Three Ethernet (RJ45) ■ 800MHz (666..833MHz optional) ■ One port for hard-disk drives ■ One RS232 UART COM1 (RJ45) ■ e500 PowerPC® core with SPE APU and MMU ■ Available via I/O conn., FPGA-controlled ■ The FPGA offers the possibility to add ■ Integrated Northbridge and Southbridge Graphics customized I/O functionality. For standard ■ High memory bandwidth ■ Available via I/O conn., FPGA-controlled factory FPGA configuration see website. Memory I/O PCI Interface ■ 2x32KB L1 data and instruction cache, ■ Three Ethernet channels ■ 32- or 64-bit, 33-MHz PCI interface at 256KB L2 cache / SRAM integr. in MPC8560 ■ Two 10/100/1000Base-T Ethernet channels PCI-104 connectors J1 and J2 ■ Up to 2GB SDRAM system memory ■ One 10/100Base-T Ethernet channel ■ Compliant with PCI Specification 2.2 ■ One SO-DIMM slot for SDRAM modules ■ Three RJ45 connectors at front panel ■ Support of four external masters ■ DDR2100 with or without ECC ■ Two on-board LEDs to signal LAN Link Miscellaneous ■ 133MHz memory bus frequency and Activity ■ Real-time clock with GoldCap backup ■ Up to 1GB soldered NAND Flash ■ One RS232 UART (COM1) ■ Power supervision and watchdog (depend. on chip availability), FPGA-contr. ■ One RJ45 connector at front panel Electrical Specifications ■ 8MB boot Flash ■ Data rates up to 115kbits/s ■ Supply voltage/power consumption: ■ 32KB non-volatile FRAM ■ 16-byte transmit/receive buffer ■ +5V (-2%/+5%), 2.5A ■ Up to 16MB additional SDRAM, ■ Handshake lines: CTS, RTS ■ +3.3V (-2%/+5%), 0.5A FPGA-controlled, e.g. for video data ■ Further I/O depending on ■ MTBF: tbd. @ 40°C (derived from ■ Serial EEPROM 4kbits for factory settings FPGA configuration MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: conforming to ESM™ specific. (PCB: 149mm x 71mm), Type I-S ■ Weight: 110g (w/o heat sink); standard heat sink: 155g Environmental Specifications ■ Temperature range (operation): 0..+60°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C
■ Relative humidity (operation): max. 95% nc System-on-Module ESM ■ Relative humidity (storage): max. 95% nc ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request
EM3A – rear I/O ESM™ with MPC8560
EM3A offers 2 Gigabit Ethernet, 1 Fast Ether- net and 2 COMs via J3 rear I/O connector instead of 2 Gigabit Ethernet, 1 Fast Ethernet and 1 COM via RJ45 on front (EM3).
MEN System-on-Module ESM
EM8 – Embedded System Module with MPC8540
Embedded System Module with: ■ MPC80, 800 MHz ■ FPGA 1,000 LEs (approx. 1,000 gates) ■ -bit/-MHz PCI, opt. 6-bit/66-MHz ■ Up to GB DDR SDRAM (SO-DIMM) ■ NAND Flash ■ Gigabit / 1 Fast Ethernet, 1 COM (RJ) ■ MENMON™ BIOS for PowerPC® cards ■ COMs, CAN, graphics, IDE etc. via FPGA ■ Stackable with PCI-10
CPU ■ IDE port for hard-disk drives Electrical Specifications ■ PowerPC MPC8540 / 800MHz (1GHz option.) ■ Available at I/O Connector ■ Supply voltage/power consumption: Memory Additional I/O through FPGA ■ +5V (4.85V..5.25V), tbd. ■ 2x32kB L1 data and instruction cache, 256kB ■ Available at I/O connector ■ +3.3V (3.0V..3.6V), tbd. L2 cache / SRAM integrated in MPC8560 ■ Depending on FPGA composition ■ MTBF: tbd. @ 50°C ■ SO-DIMM slot for up to 2GB DDR SDRAM ■ FPGA Altera 1C12 Mechanical Specifications ■ 133MHz (DDR2100) memory bus operation ■ 12000 Logic elements ■ Dimensions: conforming to ESM specification with ECC ■ Standard and user-defined functions (PCB: 149mm x 71mm) ■ Up to 1 GB NAND Flash ■ UARTs ■ Weight: tbd. ■ Flash 8MB, 16-bit data bus ■ Floppy disk interface Environmental Specifications ■ Serial EEPROM 4kbit for factory settings ■ Display control ■ Temperature range (operation): 0..+60°C 3 ■ Up to 32MB SDRAM, connected to FPGA, ■ Touch panel control ■ Airflow: min. 10m /h e.g. for video data ■ Other/further I/O options on request ■ Temperature range (storage): -40..+85°C Interfaces PCI Interface ■ Relative humidity (operation): max. 95% nc ■ Two 10/100/1000Mbits/s Ethernet channels ■ 32- or 64-bit, 33- or 66-MHz PCI interface at ■ Relative humidity (storage): max. 95% nc + one 10/100Mbits/s Ethernet channel PCI-104 connectors J1 and J2 ■ Altitude: -300m to + 3,000m ■ MPC8560 internal controllers ■ Support of 4 external masters ■ Shock: 15g/11ms ■ Three RJ45 connectors at front panel Miscellaneous ■ Bump: 10g/16ms ■ One UART RS232 serial interface (COM1) ■ Real-time clock ■ Vibration (sinusoidal): 2g/10..150Hz ■ One RJ45 connectors at front panel ■ Power supervision and watchdog Safety ■ Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity EMC ■ Tested according to EN 55022 / 1999-05 (radio disturbance) and EN 55024 / 1999-05 (immunity) with regard to CE conformity System-on-Module ESM
EM8A – I/O on J3 ESM™ with MPC8540
EM8A offers 2 Gigabit Ethernet, 1 Fast Ether- net and 2 COMs via J3 rear I/O connector instead of 2 Gigabit Ethernet, 1 Fast Ethernet and COM via RJ45 on front (EM8).
MEN System-on-Module ESM
EM4N – Embedded System Module with MPC8245
Embedded System Module with: ■ PowerPC® MPC8 up to 00 MHz ■ FPGA 1,000 LEs (approx. 1,000 gates) ■ Up to 1 MB SDRAM, CompactFlash® ■ Dual Fast Ethernet, dual COM (front) ■ Graphics optional via FPGA (plus 16 MB SDRAM) ■ MENMON™ BIOS for PowerPC® cards ■ Further COMs, CANopen, IDE.. opt. via FPGA ■ Stackable with PCI-10
CPU PCI Interface Environmental Specifications ■ PowerPC® ■ 32-bit/33-MHz PCI interface at PCI-104 ■ Temperature range (operation): ■ MPC8245 connector J1 ■ 0..+60°C or -40..+85°C ■ 266MHz..400MHz ■ Support of two external masters ■ Airflow: min. 10m³/h Memory Miscellaneous ■ Temperature range (storage): -40..+85°C ■ L1 Cache integrated in MPC8245 ■ Real-time clock ■ Relative humidity (operation): max. 95% nc ■ Up to 512MB SDRAM system memory ■ Power supervision and watchdog ■ Relative humidity (storage): max. 95% nc ■ One 144-pin SO-DIMM slot for Electrical Specifications ■ Altitude: -300m to + 3,000m SDRAM modules ■ Supply voltage/power consumption: ■ Shock: 15g/11ms ■ 133MHz memory bus frequency ■ +5V (-2%/+5%), 500mA ■ Bump: 10g/16ms ■ 2MB Flash ■ +3.3V (-2%/+5%), 1A, w/o SO-DIMM; ■ Vibration (sinusoidal): 2g/10..150Hz ■ Up to 16MB additional SDRAM, connected increases up to 1.6A depending on installed ■ Conformal coating on request to FPGA, e.g. for video data SO-DIMM Safety ■ Serial EEPROM 4kbit for factory settings ■ MTBF: 320,000h @ 40°C (derived from ■ PCB manufactured with a flammability rating ■ CompactFlash® card interface for Flash ATA MIL-HDBK-217F) of 94V-0 by UL recognized manufacturers ■ Via on-board IDE Mechanical Specifications EMC ■ Type I ■ Dimensions: conforming to ESM™ ■ Tested according to EN 55022 (radio ■ True IDE specification (PCB: 149mm x 71mm), disturbance), IEC1000-4-2 (ESD) and Mass Storage Type I-S IEC1000-4-4 (burst) with regard to CE ■ Parallel IDE (PATA) ■ Weight: 100g conformity ■ One port for hard-disk drives ■ Available via I/O connector ■ FPGA-controlled ■ CompactFlash® interface Graphics ■ Available via I/O connector ■ FPGA-controlled I/O ■ Ethernet ■ Two Ethernet 10/100Base-T channels
■ Two RJ45 connectors at front panel System-on-Module ESM ■ Two on-board LEDs to signal LAN Link and Activity ■ Two RS232 UARTs (COM1/COM2) ■ Two RJ45 connectors at front panel ■ Data rates up to 115kbits/s ■ 16-byte transmit/receive buffer ■ Handshake lines: none ■ Further I/O possible through FPGA Front Connections ■ Two Ethernet (two RJ45 or one D-Sub) ■ COM1/COM2 (two RJ45 or one D-Sub) FPGA ■ The FPGA offers the possibility to add customized I/O functionality. For standard factory FPGA configuration see website.
MEN System-on-Module ESM
EM7 – Embedded System Module with Pentium® III
Embedded System Module with: ■ ULP Pentium® III / 9 MHz ■ ULV Celeron® / up to 60 MHz ■ FPGA 1,000 LEs (approx. 1,000 gates) ■ Up to 1 MB DRAM, CompactFlash® ■ Dual Fast Ethernet (front) ■ Dual UART (front) ■ Graphics, USB 1.1, (E)IDE, CAN bus ■ Individual programmable I/O functions in FPGA ■ Stackable with PCI-10
CPU PCI Interface Mechanical Specifications ■ Celeron® or Pentium® III ■ 32-bit/33-MHz PCI interface at PCI-104 ■ Dimensions: conforming to ESM™ specific. ■ 400MHz/650MHz or 933MHz processor connector J1 (PCB: 149mm x 71mm), Type I-S core frequency ■ Compliant with PCI Specification 2.2 ■ Weight: 106g (w/o heat sink, w/o ■ 100MHz or 133MHz system bus frequency ■ Support of 3 external masters CompactFlash® card); standard heat sink: ■ 33MHz APIC bus frequency Miscellaneous 155g Memory ■ Real-time clock, backed up by the Environmental Specifications ■ 256KB or 512KB L2 cache integrated in CPU carrier board ■ Temperature range (operation): ■ 512MB SDRAM system memory ■ Integrated hardware monitor ■ 0..+60°C ■ One 144-pin SO-DIMM slot for Electrical Specifications ■ Industrial temperature range on request SDRAM modules ■ Supply voltage/power consumption: ■ Airflow: min. 10m³/h ■ 133/100MHz memory bus frequency ■ +5V (-2%/+5%), 900mA typ. ■ Temperature range (storage): -40..+85°C ■ 2MB BIOS/FPGA Flash (Celeron® 400MHz), 1200mA typ. ■ Relative humidity (operation): max. 95% ■ CompactFlash® card interface (Celeron® 650MHz), 1900mA typ. non-condensing ■ Type I (Pentium® III 933MHz) ■ Relative humidity (storage): max. 95% ■ True IDE ■ +3.3V (-2%/+5%), 700mA typ. non-condensing ■ Supports DMA (Celeron® 400MHz), 700mA typ. ■ Altitude: -300m to + 3,000m Mass Storage (Celeron® 650MHz), 700mA typ. ■ Shock: 15g/11ms ■ Parallel IDE (PATA) (Pentium® III 933MHz) ■ Bump: 10g/16ms ■ One port for local CompactFlash® ■ MTBF: 200,000h @ 40°C (derived from ■ Vibration (sinusoidal): 2g/10..150Hz ■ One port for hard-disk/CD-ROM via I/O MIL-HDBK-217F) ■ Conformal coating on request connector to carrier board Graphics ■ Integrated VGA graphics controller ■ Available via I/O connector J2 I/O ■ USB ■ Two USB 1.1 ports ■ Available via I/O connector J2 ■ UHCI implementation ■ Data rates up to 12Mbits/s
System-on-Module ESM ■ Supplies High-Power (500mA) without external power supply ■ Ethernet ■ Two 10/100Base-T Ethernet interfaces ■ Two RJ45 connectors (or one 9-pin D-Sub connector) at front panel ■ Four on-board LEDs to signal LAN Link and Activity status ■ Two RS232 UARTs (COM1/COM2) ■ Two RJ45 connectors (or one 9-pin D-Sub connector) at front panel ■ Data rates up to 115kbits/s ■ 60-byte transmit/receive buffers ■ Handshake lines: CTS, RTS; DCD, DSR, DTR ■ Further I/O depending on FPGA configuration Front Connections ■ Two Ethernet (Two RJ45 or one D-Sub) ■ Two RS232 UARTs COM1/COM2 (Two RJ45 or one D-Sub) FPGA ■ Standard factory FPGA configuration: ■ Main bus interface ■ 16Z025_UART - UART controller (controls COM1..COM3) ■ 16Z029_CAN - CAN bus (2 IP cores) ■ The FPGA offers the possibility to add 6 customized I/O functionality. See website. MEN System-on-Module ESM
EM2 – Embedded System Module with Pentium® III
Embedded System Module with: ■ ULP Pentium® III / 9 MHz ■ ULV Celeron® / 00 MHz ■ Up to 1 MB DRAM, CompactFlash® ■ Graphics, USB 1.1 (front) ■ Gigabit Ethernet (front) ■ 1 COM, keyboard/mouse, IDE, floppy (rear) ■ Stackable with PCI-10
CPU Miscellaneous ■ Temperature range (storage): -40..+85°C ■ Celeron® or Pentium® III ■ Real-time clock, battery-buffered ■ Relative humidity (operation): max. 95% ■ 400MHz/650MHz or 933MHz processor core ■ Integrated hardware monitor non-condensing frequency Electrical Specifications ■ Relative humidity (storage): max. 95% ■ 256KB or 512KB L2 cache ■ Supply voltage/power consumption: non-condensing ■ 100MHz or 133MHz system bus frequency ■ +5V (-2%/+5%), 796mA (Celeron® version) ■ Altitude: -300m to + 3,000m ■ 33MHz APIC bus frequency ■ +3.3V (-2%/+5%), 794mA ■ Shock: 15g/11ms Memory (Celeron® version) ■ Bump: 10g/16ms ■ 512MB SDRAM system memory ■ MTBF: 165,000h @ 50°C (derived from ■ Vibration (sinusoidal): 2g/10..150Hz ■ One 144-pin SO-DIMM slot for SDRAM MIL-HDBK-217F) ■ Conformal coating on request modules Mechanical Specifications Safety ■ 133/100MHz memory bus frequency ■ Dimensions: conforming to ESM™ ■ PCB manufactured with a flammability rating ■ CompactFlash® interface specification (PCB: 149mm x 71mm), of 94V-0 by UL recognized manufacturers ■ Type I Type I-S EMC ■ True IDE ■ Weight: 135g (w/o heat sink, w/o ■ Tested according to EN 55022 (radio Mass Storage CompactFlash® card); standard heat sink: disturbance), IEC1000-4-2 (ESD) and ■ Fast IDE ports 155g IEC1000-4-4 (burst) with regard to CE ■ One port for local CompactFlash® Environmental Specifications conformity ■ One port for hard-disk/CD-ROM ■ Temperature range (operation): via I/O connector to carrier board ■ 0..+60°C Graphics ■ Industrial temperature range on request ■ Integrated VGA graphics controller ■ Airflow: min. 10m³/h ■ VGA connector at front panel I/O ■ USB ■ One USB 1.1 port ■ Series A connector at front panel ■ UHCI implementation ■ Data rates up to 12Mbits/s ■ Supplies High-Power (500mA) without external power supply
■ Ethernet System-on-Module ESM ■ One 10/100/1000Base-T Ethernet interface ■ RJ45 interface at front panel ■ Three on-board LEDs to signal LAN Link, Activity status and connection speed (10/100/1000Base-T) I/O Extension ■ Super I/O ■ Accessible via J2 ■ Keyboard ■ Mouse ■ COM1 ■ Floppy ■ TFT panel ■ AC'97 audio (on request) PCI Interface ■ 32-bit/33-MHz PCI interface at PCI-104 connector J1 ■ Compliant with PCI Specification 2.2 ■ Support of 4 external masters
7 5 8 System-on-Module PCI-104 MEN shock, drop, bump, vibration, humidity,resistancevibration, chemical bump, drop, shock, temperature, operation +85°C to -40 for: Designed 60 p. PP1 61 p. PP4 carrier boards for PCI-104 and PC/104 modules are also available from MEN. from available also are modules PC/104 and PCI-104 for boards carrier PCI-104 modules can also be stacked with ESM backplane. external an of overhead the requiring without self-stacked, be single a morethan allow to as way a such in aredesigned connectors bus The connectors. bus socket board computers or modular expansion for such systems. One of the All key features exclusively.of PCI-104 is its unique bus single- PCI compact entire of implementation for support used be can and modules mm), 96 x (90 inches PCI-104 3.8 x 3.6 measure modules the bus) PCI plus bus (ISA modules bus PC/104-Plus (ISA and modules only) PC/104 the Unlike specification. PCI-104 the with accordance in flavors different of boards PowerPC rugged a up build to started has MEN Overview – PCI-104 Modules PCI-104 – Overview
■
System-on-Module PCI-104 System-on-Module
under software) and accessories available information, ordering options, and possibilities configuration of description (including sheets data detailed more and Up-to-date
SBC Controller Fieldbus MVB Type www.men.de/products/ MPC5200/384MHz PowerPC --- CPU Memory 64KBFRAM 16MBFlash, 32MBSDRAM, 2MBFlash 16MBSDRAM, max. PP1 with MPC 5200B MPC with PP1 1 USB11.1 (via SAadapter) CAN2(via SAadapters) RS232,2 Fast1 Ethernet, (optionallyESDand OGF) isolatedEMD redundant1 channel, Transmitter/receiverinterface, Interfaces ™ ® Embedded System Modules (see pages 50-57). 3U CompactPCI -based product line of single-board computers and companion and computers single-board of line product -based Layer2support under MDIS CANopenandMSCAN/ (VectorInformatik), Linux,CANopen firmware MENMON,VxWorks, QNX,RTX, OS-9 Windows,Linux, VxWorks, Software operatingtemp. -40..+85°C operatingtemp. -40..+85°C Environment Standard industrialautomation medicalengineering, aerospace,naval, Railways,automotive, Railways Applications module to module pin-and- ®
MEN System-on-Module PCI-104
PC/104 Carrier Boards
F206I – 3U CompactPCI®-ISA PC/104 Carrier Board
■ 1 CompactPCI® slot -bit/MHz (opt. 66MHz) ■ HP closed front panel ■ 1 to PC/10 slots ■ PCI-to-ISA bridge ■ FPGA 1,000 LEs (approx. 1,000 gates) ■ -0 to +8°C with qualified components
For detailed information see page 15.
F207 – 3U CompactPCI® PCI-104 Carrier Board
■ 1 PCI-10 slot ■ For stacking of up to PCI-10 modules ■ 8 HP CompactPCI® with one PCI-10 module ■ PCI-to-PCI bridge
For detailed information see page 13.
C205 – PCI-104 Mezzanine Test Adapter
■ 1 PMC slot or ■ 1 PC-MIP® slot or ■ 1 PCI-10 slot System-on-Module PCI-104 MPC5200/B Starter Kit
The EK is a starter kit that allows evaluation of the functions of the PP1 PCI-10 module (see page 60):
■ PP1 with MPC00/B / 8 MHz ■ 18 MB SDRAM ■ 16 MB Flash, 6 KB FRAM ■ 1 Fast Ethernet, COMs, CAN bus
ATX-compatible carrier card: ■ 1 PCI-10 slot, 1 PCI slot
Accessories: ■ External PSU ■ SA-Adapter™ kit x CAN
9 MEN System-on-Module PCI-104
PP1 – PCI-104 Module with MPC5200/B
■ PowerPC® MPC00/B / 8 MHz ■ -bit/-MHz PCI ■ Up to 18 MB SDRAM ■ Up to 16 MB Flash ■ Up to 6 KB FRAM ■ 1 Fast Ethernet, dual UART ■ Dual CAN with CANopen support ■ MENMON™ BIOS for PowerPC® cards ■ -0 to +8°C with qualified components
CPU ■ 512-byte transmit/receive buffer Front Connections ■ PowerPC® MPC5200/B, 384MHz ■ Handshake lines: none ■ One Ethernet (D-Sub) Memory ■ One USB 1.1 port ■ Two RS232 UARTs COM1/COM2 (D-Sub) ■ Up to 128MB SDRAM system memory ■ Physical line interface via SA-Adapter™ on PCI Interface ■ Soldered I/O connector P2 ■ 32-bit/33-MHz PCI interface at PCI-104 ■ 64MHz memory bus frequency ■ OHCI implementation connector J1 ■ 16MB Flash ■ Data rates up to 12Mbits/s ■ Compliant with PCI Specification 2.2 ■ 64KB non-volatile FRAM ■ Two independent CAN interfaces ■ Support of one external master ■ Serial EEPROM 16kbits for factory settings ■ Physical line interface via SA-Adapters™ on Miscellaneous I/O I/O connector P2 ■ Real-time clock ■ Ethernet ■ Display interface ■ Temperature sensor ■ 10/100Base-T Ethernet ■ Four characters, 5 by 7 pixels ■ Three push buttons and LED on optional ■ 9-pin D-Sub connector at front panel ■ For additional display adapter PCB display PCB (on request) ■ Two RS232 UARTs (COM1/COM2) (on request) Electrical Specifications ■ One 9-pin D-Sub connector at front panel ■ 8 GPIO lines ■ Supply voltage/power consumption: ■ Data rates up to 115kbits/s ■ Accessible via I/O connector P2 ■ +5V, ±5%, 100mA typ. ■ +3.3V, ±5%, 900mA typ. ■ MTBF: 450,000h @ 40°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: conforming to PCI-104 specification ■ Weight: 90g Environmental Specifications ■ Temperature range (operation): ■ -40..+85°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity (operation): max. 95% non-condensing ■ Relative humidity (storage): max. 95% non-condensing ■ Altitude: -300m to + 3,000m
System-on-Module PCI-104 ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request Safety ■ PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers EMC ■ Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity
60 MEN System-on-Module PCI-104
PP4 – PCI-104 Module with MVB Interface
■ -bit/-MHz PCI target ■ MVB transmitter/receiver ■ Master and slave interface ■ 1 redundant channel ■ Isolated EMD (optionally ESD and OGF) ■ Up to 16MB SDRAM, MB Flash ■ -0 to +8°C with qualified components ■ Conformal coating
MVB Multifunction Vehicle Bus Environmental Specifications Safety Interface ■ Temperature range (operation): ■ PCB manufactured with a flammability rating ■ Interface implemented in ASIC and FPGA ■ -40..+85°C of 94V-0 by UL recognized manufacturers ■ Electrical Middle Distance (EMD) medium ■ Airflow: min. 10m³/h EMC ■ RS485/422 transceiver ■ Temperature range (storage): -40..+85°C ■ Tested according to EN 55022 (radio ■ Option: ESD (Electrical Short Distance ■ Relative humidity (operation): max. 95% disturbance), IEC1000-4-2 (ESD) and medium) and OGF (Optical Glass Fiber non-condensing IEC1000-4-4 (burst) with regard to CE medium), on request ■ Relative humidity (storage): max. 95% conformity ■ Accessible on two 9-pin D-Sub front non-condensing connectors ■ Altitude: -300m to + 3,000m Memory ■ Shock: 15g/11ms ■ 16MB SDRAM system memory ■ Bump: 10g/16ms ■ Traffic Memory for MVB interface ■ Vibration (sinusoidal): 2g/10..150Hz ■ 2MB Flash ■ Conformal coating on request ■ For FPGA configuration data PCI Interface ■ 32-bit/33-MHz PCI interface at PCI-104 connector J1 Miscellaneous ■ Two yellow on-board LEDs to signal MVB activity Electrical Specifications ■ Isolation voltage: 1500V DC / 1000V AC between isolated side and digital side ■ Supply voltage/power consumption: ■ +5V, ±5%, 140mA typ. ■ +3.3V, +3.3V..+3.6V, 300mA ■ MTBF: 498,000 @ 40°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: conforming to PCI-104 specification ■ Weight: 72g System-on-Module PCI-104
61 MEN PCI Mezzanine I/O
Overview – PCI Mezzanine I/O
MEN offers a range of PCI-based mezzanine modules with typical computer I/O functions such as graphics, Ethernet, UARTs, USB, FireWire, TTL I/O, memory and fieldbus interfaces, in accordance with the relevant PC-MIP® or PMC standard. PC-MIP®, ANSI-standardized since 2002, is a PCI-based mezzanine standard perfectly suited for adding typical computing I/O to the system in a flexible, "component-like" manner. PC-MIPs® are modular, economical I/O exten- sions for all types of industrial computers, from embedded systems up to high-end workstations. The pure 100% PCI interface comes with a 32-bit data bus and a single 3.3-V signaling voltage only. There are two compatible types of modules: Type I with rear I/O only (50 I/O pins incl. PXI trigger signals and 14 ground pins) and Type II with both rear and front I/O for direct connection of sensitive signals. 6 PC-MIPs® (300 I/O lines) fit, for example, on a 6U carrier board, 3 PC-MIPs® fit on a 3U carrier board. PC-MIP® modules have also been developed to work in rugged environments – shock, vibration, drop, resonance, humidity, chemicals, -40 to +85°C operating temperature. The PMC standard is a combination of two IEEE standards, IEEE 1386 Standard Mechanics for a Common Mezzanine Card Family (CMC) and IEEE 1386.1 Standard Physical and Environmental Layers for PCI Mezzanine Cards (PMC). It provides a mezzanine module standard used to add the more complex I/O functionally (such as telecom interfaces) independent of the form factor.
Function Intelligence I/O Lines Memory Miscellaneous Front Isolation Consumption Software Connector typ. XMC P601 Quad Redundant 4 channels 2 x4 PCI Express 4 RJ45 Yes +3.3V: 100mA Windows, Linux p. 64 Gigabit Ethernet 10/100/1000Base-T lanes +5V: 1.4A +12V: 600mA PMC P518 Frame Buffer FPGA VGA or DVI (front), 16MB 1 DVI No +5V: 10mA max. Linux, Windows p. 65 Interface LVDS (rear) SGRAM +3.3V: 300mA 2000/XP PC-MIPs P18 Frame Buffer FPGA VGA or DVI (front), 16MB 1 DVI No +5V: 10mA max. Linux, Windows PCI Mezzanine I/O p. 65 Interface LVDS (rear) SGRAM +3.3V: 300mA 2000/XP P16 Dual 100Base-T i8259 2 full-duplex 2x 8-pin RJ45 Yes +3.3V: 300mA Linux, QNX, p. 66 Ethernet channels VxWorks, OS-9 P15 Non-volatile PLX9030 256KB, Non volatile, No +5V: 25mA Linux, VxWorks, p. 66 SRAM 512KB w/o battery +3.3V: 90mA OS-9 P14 IEEE 1394 TI TSB43AA22 1 channel 400 Mbits/s 6-pin JFW No +5V: 100mA Windows p. 67 OHCI FireWire OHCI PHY/Link +3.3V: 300mA NT/2000/XP Controller Layer Controller +12V: 100mA P13 48-bit TTL I/O --- 48 Fast I/O 36-pin half-pitch No +5V: 1.1A Windows, Linux, p. 67 Interface (6 groups input with line D-Sub +3.3V: 68mA VxWorks, RTX, OS-9, or output) termination QNX P11 Quad RS422/485 16C950 4 asynchronous 26-pin half-pitch No +5V: 130mA Windows, Linux, p. 68 UART full-duplex channels D-Sub +3.3V: 40mA VxWorks P10 Quad RS232 16C950 4 asynchronous TTL level at rear 26-pin half-pitch No +5V: 130mA Windows, Linux, p. 68 UART full-duplex channels alternatively D-Sub +3.3V: 40mA VxWorks, OS-9 P6 Profibus DP ASPC 2 1 channel Class 1 Complete software 9-pin D-Sub Yes +5V: 450mA Windows, Linux, p. 69 Master MC68331 or Class 2 master on board (Softing) VxWorks, RTX, OS-9, QNX P5 Intelligent CAN i82527 1 channel full and CANopen master/ 9-pin D-Sub Yes +5V: 470mA max. Windows, Linux, p. 69 Interface MC68331 extended CAN slave software on (2 channels) VxWorks, RTX, OS-9, board (Vector) QNX P4 Ultra2 SCSI SYM53C895 Single-ended 40MB/s data No +5V: 80mA Windows – Controller and LVD throughput +3.3V: 100mA
■ Up-to-date and more detailed data sheets (including description of configuration possibilities and options, ordering information, available accessories and software) under www.men.de/products/
62 Designed for: -40 to +85°C operation temperature, shock, drop, bump, vibration, humidity, chemical resistance Non-Intelligent PC-MIP Non-Intelligent D202 F203 P601 – Quad Redundant Gigabit Ethernet XMC ■ ■ ■ TestAdapter Mezzanine PCI – C205 1 PCI-10 slot PCI-10 1 PC-MIP 1 or slot PMC 1 1 6UCompactPCI1 slot 13U CompactPCI slot Bus System ® slot or slot 2PC-MIP slots Type I 4PC-MIP slots Type II, 1PC-MIP slot Type I 2PC-MIP slots Type II, Mezzanine Type ® Carrier Cards Carrier SeePC-MIPs SeePC-MIPs Software ComputerI/O ComputerI/O Applications MEN PCI-to-PCIbridge PCI-to-PCIbridge Miscellaneous PCIMezzanine I/O
6 PCI Mezzanine I/O MEN PCI Mezzanine I/O
P601 – Quad Redundant Gigabit Ethernet XMC
■ Four 10/100/1000Base-T channels ■ Alternatively two redundant channel pairs ■ RJ connectors at front ■ x PCIe lanes ■ Full and half duplex ■ 1. kV electrical isolation
Ethernet Electrical Specifications Safety ■ Four 10/100/1000Base-T Ethernet channels ■ Isolation voltage: 1.5kV DC electrical isolation ■ PCB manufactured with a flammability rating at front panel between isolated side and digital side of 94V-0 by UL recognized manufacturers ■ RJ45 connectors at front panel ■ Supply voltage/power consumption: EMC ■ Two independent dual-port Ethernet ■ +5V or +12V (-5%/+5%), 1.4A typ. (+5V), ■ Tested according to EN 55022 (radio controllers 600mA typ. (+12V) disturbance), IEC1000-4-2 (ESD) and ■ Fully integrated Gigabit Ethernet Media ■ +3.3V (-5%/+5%), 100mA typ. IEC1000-4-4 (burst) with regard to CE Access Controllers (MAC) and physical layer ■ MTBF: 386,400h @ 40°C (derived from conformity ports (PHY) MIL-HDBK-217F) ■ 48kB per port on-chip packet buffer Mechanical Specifications ■ Full duplex and half duplex operation ■ Dimensions: conforming to XMC ■ Ethernet controllers are connected by standard VITA 42.0-200x PCI Mezzanine I/O two x4 PCIe lanes ■ Weight: 104 g (with heat sink) ■ Two LEDs per channel to signal LAN Environmental Specifications Link, Activity status and connection speed ■ Temperature range (operation): (10/100/1000Base-T) ■ 0..+60°C XMC Characteristics ■ Industrial temperature range on request ■ Compliant with XMC standard ■ Airflow: min. 10m³/h VITA 42.3-200x ■ Temperature range (storage): -40..+85°C ■ PCI Express® lanes: two x4 ■ Relative humidity (operation): max. 95% Peripheral Connections non-condensing ■ Via front panel on four RJ45 connectors ■ Relative humidity (storage): max. 95% PCI Express® non-condensing ■ Two x4 lanes to connect local 1000Base-T ■ Altitude: -300m to + 3,000m Ethernet controllers (1GB/s per channel in ■ Shock: 15g/11ms each direction) ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request
6 P601 MEN PCI Mezzanine I/O
P518 – PMC Frame Buffer Interface
■ Frame buffer functionality in FPGA ■ FPGA 1,000 LEs (approx.1,000 gates) ■ Color depth 16-bit RGB ■ 60 x 80 up to 180 x 10 pixels resolution ■ Frequencies 60 Hz and 7 Hz ■ MB integrated graphics RAM ■ DVI digital video output (DVI-I front connector) ■ LVDS TFT via rear-I/O or on-board connector
Video Signals ■ Frequencies: DVI/VGA 60Hz or 75Hz; PMC Characteristics (PCI) ■ DVI interface; FP to DVI conversion LVDS 60Hz ■ Compliant with PCI Specification 2.2 ■ VGA interface; FP to VGA conversion Memory ■ 32-bit/33-MHz, 3.3V V(I/O); 66MHz ■ TFT interface via rear I/O ■ 32MB/133MHz SDRAM with 32-bit on request ■ Color depth 16-bit RGB memory interface ■ Target ■ Resolutions DVI/VGA (change only by FPGA Electrical Specifications FPGA update): 640 x 480 or 800 x 600 ■ The FPGA offers the possibility to add ■ Supply voltage/power consumption: or 1024 x 768 or 1280 x 1024 customized I/O functionality. For standard ■ +5V (4.85V..5.25V), 10mA max. ■ Resolutions LVDS (change only by factory FPGA configuration see website. ■ +3.3V (3.0V..3.6V), 300mA typ. FPGA update): Peripheral Connection ■ MTBF: 426,000h @ 40°C (derived from ■ 640 x 480 or 800 x 600 or 1024 x 768 ■ Flat-panel and VGA signals via DVI-I front MIL-HDBK-217F) with one or two LVDS connections connector Mechanical Specifications ■ 1280 x 1024 with two LVDS conn. only ■ LVDS signals via P4 rear I/O or P1 ■ Dimensions: conforming to IEEE 1386.1 on-board connector ■ Weight: 70g P18 – PC-MIP ® Frame Buffer Interface
■ Frame buffer functionality in FPGA ■ FPGA 1,000 LEs (approx.1,000 gates) ■ Color depth 16-bit RGB ■ 60 x 80 up to 180 x 10 pixels resolution ■ Frequencies 60 Hz and 7 Hz ■ MB integrated graphics RAM ■ VGA analog video output (front) or ■ DVI digital video output (DVI-I front) PCI Mezzanine I/O ■ LVDS TFT via rear-I/O connector
Video Signals ■ Frequencies: DVI/VGA 60Hz or 75Hz; PC-MIP® Characteristics (PCI) ■ DVI interface; FP to DVI conversion LVDS 60Hz ■ Compliant with PCI Specification 2.2 ■ VGA interface; FP to VGA conversion Memory ■ 32-bit/33-MHz, 3.3V V(I/O); 66MHz ■ LVDS TFT interface via rear I/O ■ 32MB/133MHz SDRAM with 32-bit on request ■ Color depth 16-bit RGB memory interface ■ Target ■ Resolutions DVI/VGA (change only by FPGA Electrical Specifications FPGA update): 640 x 480 or 800 x 600 or ■ The FPGA offers the possibility to add ■ Supply voltage/power consumption: 1024 x 768 or 1280 x 1024 customized I/O functionality. For standard ■ +5V (4.85V..5.25V), 10mA max. ■ Resolutions LVDS (change only by factory FPGA configuration see website. ■ +3.3V (3.0V..3.6V), 300mA typ. FPGA update): Peripheral Connection ■ MTBF: ■ 640 x 480, 800 x 600 or 1024 x 768 with ■ Flat-panel and VGA signals via DVI-I ■ P18: 480,000h @ 40°C (derived from one or two LVDS connections connector at front or MIL-HDBK-217F) ■ 1280 x 1024 with two LVDS conn. only ■ VGA signals via VGA connector at front ■ P18A: 517,900h @ 40°C (derived from ■ LVDS signals via J3 rear I/O MIL-HDBK-217F)
P518 P18 6 MEN PCI Mezzanine I/O
P16 – PC-MIP® Dual 100Base-T Ethernet
■ Dual 10/100Base-T Fast Ethernet ■ Dual Intel® 89 Controller ■ Dual RJ connector ■ Full duplex ■ Electrical isolation
Ethernet Interface ■ MTBF: 490,000h @ 50°C (derived from ■ Two 10/100Base-T interfaces MIL-HDBK-217F) ■ Two 82559ER controllers Mechanical Specifications ■ Full duplex support ■ Dimensions: PC-MIP® Type II conforming to Safety ■ Media Access Control (MAC) address stored PC-MIP® Standard ■ PCB manufactured with a flammability rating in on-board serial EEPROM ■ Weight: 30g of 94V-0 by UL recognized manufacturers PCI Characteristics Environmental Specifications EMC ■ 32-bit PCI, complying with PCI Local Bus ■ Temperature range (operation): 0..+60°C ■ Tested according to EN 55022 (radio Specification, Rev. 2.1 ■ Industrial temperature range on request disturbance), IEC1000-4-2 (ESD) and ■ Target and initiator ■ Airflow: min. 10m³/h IEC1000-4-4 (burst) with regard to CE Peripheral Connection ■ Temperature range (storage): -40..+85°C conformity ■ Via front panel on two standard 8-pin RJ45 ■ Relative humidity (operation): max. 95% nc receptacle connectors ■ Relative humidity (storage): max. 95% nc Electrical Specifications ■ Altitude: -300m to + 3,000m ■ Isolation voltage: 1kV RMS (0..1000m above ■ Shock: 15g/11ms sea level) ■ Bump: 10g/16ms ■ Supply voltage/power consumption: ■ Vibration (sinusoidal): 2g/10..150Hz ■ +3.3V (3.0V..3.6V), 300mA typ., 450mA max. ■ Conformal coating on request
P15 – PC-MIP® Non-volatile SRAM
■ FRAM technology ■ No batteries required ■ 6KB or 1KB ■ PC-MIP® Type I
PCI Mezzanine I/O Memory ■ MTBF: tbd. @ 40°C (derived from ■ 256KB or 512KB FRAM MIL-HDBK-217F) ■ Four memory banks with 512KB Mechanical Specifications ■ Two memory banks with 256KB ■ Dimensions: PC-MIP® Type I conforming to ■ Access time: 70ns PC-MIP® Standard, without J3 ■ Shock: 15g/11ms ■ Cycle time: 130ns ■ Weight: 34g ■ Bump: 10g/16ms PCI Characteristics Environmental Specifications ■ Vibration (sinusoidal): 2g/10..150Hz ■ 32-bit/33-MHz PCI, complying with PCI ■ Temperature range (operation): ■ Conformal coating on request Local Bus Specification, Rev. 2.1 ■ -40..+85°C Safety ■ Target ■ Airflow: min. 10m³/h ■ PCB manufactured with a flammability rating Peripheral Connection ■ Temperature range (storage): -40..+85°C of 94V-0 by UL recognized manufacturers ■ No peripheral connections ■ Relative humidity (operation): max. 95% EMC Electrical Specifications non-condensing ■ Tested according to EN 55022 (radio ■ Supply voltage/power consumption: ■ Relative humidity (storage): max. 95% disturbance), IEC1000-4-2 (ESD) and ■ +5V (4.85V..5.25V), 22.5mA typ. non-condensing IEC1000-4-4 (burst) with regard to CE ■ +3.3V (3.0V..3.6V), 86.3mA typ. ■ Altitude: -300m to + 3,000m conformity
66 P16 P15 MEN PCI Mezzanine I/O
P14 – PC-MIP® FireWire Controller
■ OHCI PHY/Link Layer Controller ■ 1 channel ■ TI TSBAA integrated 19a-000 ■ Up to 00Mbits/s ■ Not conforming to RoHS
Controller ■ +5V (4.85V..5.25V), 100mA max. ■ TI TSB43AA22 Integrated 1394a-2000 ■ +3.3V (3.0V..3.6V), 300mA max. OHCI PHY/Link Layer Controller ■ +12V (11.4V..12.6V), 100mA max. Data Transfer Rates (without 1394 cable power charge) ■ Relative humidity (storage): max. 95% nc ■ 100, 200 and 400Mbits/s ■ MTBF: tbd. @ 50°C (derived from ■ Altitude: -300m to + 3,000m PCI Characteristics MIL-HDBK-217F) ■ Shock: 15g/11ms ■ 32-bit PCI, complying with PCI Local Bus Mechanical Specifications ■ Bump: 10g/16ms Specification, Rev. 2.1 ■ Dimensions: PC-MIP® Type II conforming to ■ Vibration (sinusoidal): 2g/10..150Hz ■ Target and initiator PC-MIP® specification ■ Conformal coating on request Peripheral Connections ■ Weight: 23g Safety ■ Via front panel on a shielded 6-pin Molex Environmental Specifications ■ PCB manufactured with a flammability rating receptacle connector ■ Temperature range (operation): 0..+60°C of 94V-0 by UL recognized manufacturers Miscellaneous ■ Industrial temperature range on request EMC ■ Cable Active LED for on-board diagnosis ■ Airflow: min. 10m³/h ■ Tested according to EN 55022 (radio Electrical Specifications ■ Temperature range (storage): -40..+85°C disturbance), IEC1000-4-2 (ESD) and IEC ■ Supply voltage/power consumption: ■ Relative humidity (operation): max. 95% nc 1000-4-4 (burst) with regard to CE conform.
P13 – PC-MIP® 48-bit TTL I/O Interface
■ TTL inputs/outputs ■ 8mA drivers ■ Active terminators ■ Same line interface as SCSI ■ Fast 16-bit host access
Input/Output Peripheral Connections ■ 48-bit TTL I/O ■ Via front panel on a shielded 36-pin PCI Mezzanine I/O ■ 6 groups, alternatively input or output half-pitch D-Sub receptacle connector ■ Weight: ■ Active terminators can be activated for ■ Only Type II models ■ Type I module: 24g each group ■ 28-bit I/O, incl. trigger functionality ■ Type II module: 34g ■ Output low current (VOL max. 0.55V): ■ Via J3/carrier board (rear I/O) Environmental Specifications min. 64mA ■ Type I and Type II models ■ Temperature range (operation): ■ Output high current (VOH min. 2.0V): ■ Full 48-bit I/O functionality ■ 0..+60°C or -40..+85°C min. -15mA Electrical Specifications ■ Airflow: min. 10m³/h ■ Input high current: max. 100µA ■ Supply voltage/power consumption: ■ Temperature range (storage): -40..+85°C ■ Input low current: max. -100µA ■ +5V (4.85V..5.25V), 1.1A ■ Relative humidity (operation): max. 95% nc ■ Input voltage: min. -0.5V, max. 6V ■ +3.3V (3.0V..3.6V), 68mA ■ Relative humidity (storage): max. 95% nc PCI Characteristics ■ MTBF: 334,000h @ 50°C (derived from ■ Altitude: -300m to + 3,000m ■ 32-bit PCI, complying with PCI Local Bus MIL-HDBK-217F) ■ Shock: 15g/11ms Specification, Rev. 2.1 Mechanical Specifications ■ Bump: 10g/16ms ■ Target ■ Dimensions: PC-MIP® Type I/II conforming ■ Vibration (sinusoidal): 2g/10..150Hz to PC-MIP® specification ■ Conformal coating on request
P14 P13 67 MEN PCI Mezzanine I/O
P11 – PC-MIP® Quad RS422/485 UART
■ Four asynchronous channels ■ Full-duplex ■ 18 bytes FIFO per transmitter/receiver ■ 18 bytes FIFO per channel
UART Environmental Specifications ■ 4 16C950 high-performance UARTs ■ Temperature range (operation): ■ Full software compatibility with 16C550 UARTs ■ 0..+60°C ■ Vibration (sinusoidal): 2g/10..150Hz ■ Configured with I/O or memory base address ■ Industrial temperature range on request ■ Conformal coating on request ■ 8 128-byte FIFOs ■ Airflow: min. 10m³/h Safety ■ Data rates ■ Temperature range (storage): -40..+85°C ■ PCB manufactured with a flammability rating ■ UART controller supports up to 15Mbits/s ■ Relative humidity (operation): max. 95% nc of 94V-0 by UL recognized manufacturers ■ Physical interface supports up to 10Mbits/s ■ Relative humidity (storage): max. 95% nc EMC ■ Full duplex/half duplex interface ■ Altitude: -300m to + 3,000m ■ Tested according to EN 55022 (radio PCI Characteristics ■ Shock: 15g/11ms disturbance), IEC1000-4-2 (ESD) and ■ 32-bit PCI, complying with PCI Local Bus ■ Bump: 10g/16ms IEC1000-4-4 (burst) with regard to CE conf. Specification, Rev. 2.2 ■ Target Peripheral Connections ■ Via front panel on a shielded 26-pin half-pitch D-Sub receptacle connector ■ Via J3/carrier board Electrical Specifications ■ Supply voltages/power consumption: ■ +5V (4.85V..5.25V), 130mA ■ +3.3V (3.15V..3.6V), 40mA ■ MTBF: 190,000h @ 50°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: PC-MIP® Type II conforming to PC-MIP® specification ■ Weight: 28g PCI Mezzanine I/O P10 – PC-MIP® Quad RS232 UART
■ Four asynchronous channels ■ Full-duplex ■ 18 bytes FIFO per transmitter/receiver ■ 18 bytes FIFO per channel ■ Alternatively TTL-level at rear (SA-Adapters™)
UART Environmental Specifications ■ 4 16C950 high-performance UARTs ■ Temperature range (operation): 0..+60°C ■ Full software compatibility with 16C550 UARTs ■ Industrial temperature range on request ■ Configured with I/O or memory base address ■ Airflow: min. 10m³/h ■ Vibration (sinusoidal): 2g/10..150Hz ■ 8 128-byte FIFOs ■ Temperature range (storage): -40..+85°C ■ Conformal coating on request ■ Data rates ■ Relative humidity (operation): max. 95% nc EMC ■ UART controller supports up to 15Mbits/s ■ Relative humidity (storage): max. 95% nc ■ Tested according to EN 55022 (radio ■ Physical interface supports up to 120kbits/s ■ Altitude: -300m to + 3,000m disturbance), IEC1000-4-2 (ESD) and PCI Characteristics ■ Shock: 15g/11ms IEC1000-4-4 (burst) with regard to CE ■ 32-bit PCI, complying with PCI Local Bus ■ Bump: 10g/16ms conformity Specification, Rev. 2.2 ■ Target Peripheral Connections ■ Via front panel on a shielded 26-pin half- pitch D-Sub receptacle conn. (RS232 level) ■ Via J3/carrier board (TTL level) Electrical Specifications ■ Supply voltages/power consumption: ■ +5V (4.85V..5.25V), 130mA ■ +3.3V (3.15V..3.6V), 40mA ■ MTBF: 190,000h @ 50°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: PC-MIP® Type II conforming to PC-MIP® specification 68 ■ Weight: 34g MEN PCI Mezzanine I/O
P6 – PC-MIP® Profibus DP Master
■ Class 1/ Profibus DP master (DIN19) ■ Isolated RS8, RS (debug) interface ■ Local -bit CPU ■ Up to 17 active or passive stations ■ 1Mbits/s data transfer rate ■ 1MB DRAM ■ Complete Softing Profibus software on-board ■ Compatible with PROFIBUS DP Configurator
MC681/16MHz CPU ASPC Profibus Controller Miscellaneous ■ CPU32 performance ■ Up to 12Mbaud data rate ■ 1MB shared memory for communication ■ Complete Profibus DP softw. on one ■ 16-bit DMA interface (local) and program PC-MIP® ■ Complete bus access protocol ■ PCI interface with autoincrement address mode ■ Local interrupt controller ■ Up to 127 active or passive stations ■ Status LEDs ■ Hardware watchdog ■ Isolated Profibus interface Peripheral Connections ■ Via front panel on a shielded 9-pin D-Sub receptacle connector PCI Characteristics ■ 32-bit PCI, complying with PCI Local Bus Specification, Rev. 2.2 ■ Target and initiator ■ I2O Ready Messaging Unit Electrical Specifications ■ Electrical isolation: 500V DC ■ Supply voltage/power consumption: ■ +5V, max. 0.65A (short-circuit current at Profibus side) ■ +5V, approx. 0.45A (normal operation) ■ MTBF: 450,000h @ 50°C (derived from MIL-HDBK-217F) PCI Mezzanine I/O P5 – PC-MIP® Intelligent CAN Interface
■ Full CAN/Extended CAN ■ Optical isolation ■ Local -bit CPU ■ CANopen master and slave support ■ ISO high-speed coupling ■ Vector Informatik tools ■ 1Mbit/s data transfer rate ■ Intelligent CAN Layer support
CAN Controller Memory ■ I82527 ■ 1MB shared SRAM for communication ■ Standard and extended frames and program ■ Up to 15 message objects Peripheral Connections ■ Up to 1Mbit/s ■ Via front panel 9-pin D-Sub plug connector Electrical Specifications I/O Processor PCI Characteristics ■ Optical isolation: 180V DC GND-to-Shield ■ MC68331, 32-bit CPU32, 24MHz ■ 32-bit PCI, complying with PCI Local Bus ■ Supply voltage/power consumption: Physical Interface Specification, Rev. 2.2 ■ +5V (4.85V..5.25V), tbd. ■ ISO high speed transceiver 82C251 ■ Target and initiator ■ +3.3V (3.14V..3.47V), tbd. ■ Optically isolated ■ I2O Ready Messaging Unit ■ MTBF: 310,000h @ 50°C (derived from ■ Automotive 24V compliant MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: PC-MIP® Type II conforming to PC-MIP® specification, 10H module ■ Weight: 32g Environmental Specifications ■ Temperature range (operation): ■ 0..+60°C or -40..+85°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity (operation): max. 95% nc ■ Relative humidity (storage): max. 95% nc ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request 69 70 M-Module Mezzanine I/O MEN Non-Intelligent Carrier Boards for M-Modules for Boards Carrier Non-Intelligent shock, drop, bump, vibration, humidity,resistancevibration, chemical bump, drop, shock, temperature, operation +85°C to -40 for: Designed a long-terma availability ofminimum 10years (and longer according toindividual agreements). vibration, drop, resonance, humidity, chemicals, and up to -40 to +85°C screenedoperationregardingenvironmentsqualifiedruggedorshock, –in temperature.also work developed tobeen have boards M-Modules MEN analogandbinary I/Oaswell asallcommon fieldbus interfaces. Typical M-Module carrierA board indouble Eurocard format, forinstance, canaccommodate uptofour M-Modules signalswithout loss of data or signal quality –using, for example, shielded D-Sub connectors and COAX cables. bus,burst transfers 100MB/s,toup DMAandtrigger capabilities. M-Modules M-ModuleThe computers,from embedded systems uptohigh-end workstations. flexibleway.a systeminreal-world theM-Modules to I/O M-Modules Introduction – M-Module – Introduction rather than requiring a separate adapter panel with ribbon-cable connections. This provides a clean path for
■ C203 C204 A201S B201S B202S D203 F204 F205 M-Module
under software) and accessories available information, ordering options, and possibilities configuration of description (including sheets data detailed more and Up-to-date PCIlong card PCIshort card Slave,1 6U VMEbus slot Slave,1 3U VMEbus slot Slave,1 3U VMEbus slot 16U CompactPCI slot 13U CompactPCI slot 13U CompactPCI slot Bus www.men.de/products/ System ™
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MEN M-Module Mezzanine I/O
C204 – Short-Card PCI M-Module™ Carrier Board
C204: C203: ■ 1 M-Module slot ■ M-Module slots ■ PCI short card ■ PCI long card
PCI Bus M-Modules™ Peripheral Connections ■ Slots required on the PCI bus: ■ Number of M-Modules™ on one board: ■ Via PC slot ■ One short-card slot ■ One M-Module™ ■ Via additional PC slot connection cables ■ PCI 9050 controller ■ One pass-thru window per M-Module™ (C203) ■ Target on PCI bus ■ Characteristics: D08, D16, D32, A08, Electrical Specifications ■ Max. clock frequency 33MHz A24, INTA, TRIGI, TRIGO ■ Supply voltage/power consumption: +5V ■ Power supply 5V PXI™ (4.85V..5.25V), 200mA typ. ■ Compliance with PCI Specification 2.1 ■ Five trigger lines compliant with PXI™ ■ MTBF: 52,000h @ 50°C ■ 32-bit PCI data bus Specification rev. 1.0 (derived from MIL-HDBK-217F) ■ Via 10-pin plug connector Mechanical Specifications ■ Routing of PXI™ trigger lines to M-Module™ ■ Dimensions: 55mm by 106.9mm interface TRIGA, TRIGB ■ Weight: 100g
C203 – Long-Card
PCI Bus ■ Slots required on the PCI bus: ■ One long-card slot ■ PCI 9050 controller ■ Target on PCI bus ■ Max. clock frequency 33MHz ■ Power supply 5V ■ Compliance with PCI Specification 2.1 ■ 32-bit PCI data bus M-Modules™ ■ Number of M-Modules™ on one board: ■ Up to three M-Modules™ ■ One pass-thru window per M-Module™
■ Characteristics: D08, D16, D32, A08, A24, M-Module Mezzanine I/O INTA, TRIGI, TRIGO PXI™ ■ Five trigger lines compliant with PXI™ Specification rev. 1.0 ■ Via 10-pin plug connector ■ Routing of PXI™ trigger lines to M-Module™ interface TRIGA, TRIGB Peripheral Connections ■ Via PC slot ■ Via additional PC slot connection cables Electrical Specifications ■ Supply voltage/power consumption: +5V (4.85V..5.25V), 200mA typ. ■ MTBF: 52,000h @ 50°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: 296mm by 115.6mm ■ Weight: 144g
71 MEN M-Module Mezzanine I/O
Overview – M-Modules™ for Binary and Analog I/O
inary I/O M-Modules™ are designed for switching relays, lamps or other loads, for handling signals from mechanical switches and for output of digital signals. They differ in their number and kind of channels, their load on ground or supply voltage and they feature different protection mechanisms like short circuit protection, over-current/over-voltage protection, read-back of I/O status etc. Analog I/O M-Modules™ are designed for universal current or voltage applications as well as for measure- ment tasks like data acquisition. They differ in their number of channels, resolution, precision, acquisition and conversion time, etc. All of these M-Modules™ are optically isolated, with shielded D-Sub connectors at the front.
M-Modules™ for Binary Process I/O
I/O Lines Load on... Input Voltage Output Voltage Output Current Front Optical Consumption Software Range Range per Channel Connector Isol. typ. M82 16 inputs 0..40V 44-pin HD-Sub Yes 220mA Windows, Linux, p. 74 QNX, OS-9, VxWorks, RTX M81 16 outputs 0..36V 500mA 44-pin HD-Sub Yes 330mA (max.) Windows, Linux, p. 74 QNX, OS-9, VxWorks, RTX M66 32 inputs Ground 0..32V 12..32V Max. 1.9A 44-pin HD-Sub Yes 200mA Windows, Linux, p. 75 or outputs QNX, OS-9, VxWorks, RTX M58 32-bit TTL 44-pin HD-Sub 200mA Windows, Linux, p. 79 I/O with line QNX, OS-9, VxWorks, termination RTX M43 8 relay Max. 100V 1A 25-pin D-Sub Yes 700mA Windows, Linux, p. 80 outputs QNX, OS-9, VxWorks, RTX M32 16 inputs Supply 0..180V 25-pin D-Sub Yes 50mA Windows, Linux, p. 76 voltage QNX, OS-9, VxWorks, RTX M31 16 inputs Ground 0..180V 25-pin D-Sub Yes 50mA Windows, Linux, p. 76 QNX, OS-9, VxWorks,
M-Module Mezzanine I/O RTX M28 16 outputs Ground 8..36V 500mA 25-pin D-Sub Yes 100mA Windows, Linux, p. 77 QNX, OS-9, VxWorks, RTX M27 16 outputs Supply 8..36V 500mA 25-pin D-Sub Yes 100mA Windows, Linux, p. 77 voltage QNX, OS-9, VxWorks, RTX M24 8/16 inputs Ground or 0..32V 25-pin D-Sub Yes 120mA Windows, Linux, p. 78 supply or screw terminal QNX, OS-9, VxWorks, voltage RTX M22 8 inputs or Ground 0..32V 0..32V 2A 25-pin D-Sub Yes 250mA Windows, Linux, p. 78 8 outputs or screw terminal QNX, OS-9, VxWorks, RTX M11 18-bit TTL 25-pin D-Sub 200mA Windows, Linux, p. 79 I/O QNX, OS-9, VxWorks, RTX
■ Up-to-date and more detailed data sheets (including description of configuration possibilities and options, ordering information, available accessories and software) under www.men.de/products/
72 MEN M-Module Mezzanine I/O Digital Input M-Modules™ M81 and M82
M-Modules™ for Analog Process I/O
I/O Lines Current / Resolution Acquisition/ Miscellaneous Front Optical Consumption Software Voltage Conversion Time Connector Isolation typ. M62 16 outputs Current or 12 bits 15µs 25-pin D-Sub Yes 110mA (no DC Windows, Linux, p. 83 voltage 560mA (with DC) QNX, VxWorks, RTX, OS-9
M37 4 outputs Current or 16 bits 8.5µs Simultaneous 25-pin D-Sub Yes +5V: 850mA Windows, Linux, M-Module Mezzanine I/O p. 85 voltage update, external ±12V: 300mA QNX, VxWorks, RTX, trigger OS-9 M36 8/16 inputs Current or 16 bits 10µs Semi-intelligent 25-pin D-Sub Yes 110mA (no DC), Windows, Linux, p. 82 voltage with 580mA (with DC) QNX, VxWorks, RTX, dual-ported RAM OS-9 M35N 8/16 inputs Current or 14 bits 7.8µs Improved version 25-pin D-Sub Yes 190mA (no DC), Windows, Linux, p. 81 voltage of M34/M35 670mA (with DC) QNX, VxWorks, RTX, OS-9 M33 8 outputs Current or 12 bits 10µs Simultaneous 25-pin D-Sub Yes 140mA (no DC), Windows, Linux, p. 84 voltage update 950mA (with DC) QNX, VxWorks, RTX, OS-9
Designed for: -40 to +85°C operation temperature, 73 shock, drop, bump, vibration, humidity, chemical resistance MEN M-Module Mezzanine I/O
M82 – 16 Binary Inputs
■ 16 fast 0kHz inputs ■ 0..0V input voltage ■ Constant current inputs ■ Hysteresis function ■ Interrupt generation ■ 00VDC isolation from the system ■ 100VDC isolation between the channels ■ -0 to +8°C with qualified components
Binary Inputs M-Module™ Characteristics ■ Temperature range (storage): -40..+85°C ■ FET constant current source inputs ■ A08, D16, INTA, INTB, IDENT ■ Relative humidity range (operation): ■ 5.6mA typ. Electrical Specifications max. 95% non-condensing ■ Input voltages and currents: ■ Isolation voltage: ■ Relative humidity range (storage): max. 95% ■ 0..40V max. ■ 500V DC between isolated side and non-condensing ■ 5.5V, ±0.5V (switching voltage 0) @ 3mA digital side ■ Altitude: -300m to + 3,000m min., 3.3mA typ., 4mA max. ■ All channels are optically isolated (100V ■ Shock: 15g/11ms ■ 9.5V, ±0.5V (switching voltage 1) @ 4mA between the channels) ■ Bump: 10g/16ms min., 5.6mA typ., 10mA max. ■ Supply voltage/power consumption: +5V ■ Vibration (sinusoidal): 2g/10..150Hz ■ 15.2V, ±0.5V (switching voltage 2) @ 4mA (4.85V..5.25V), 220mA typ. ■ Conformal coating on request min., 5.6mA typ., 10mA max. ■ MTBF: 370,000h @ 40°C (derived from Safety ■ Switching Times MIL-HDBK-217F) ■ PCB manufactured with a flammability rating ■ Rise time: 4.2µs typ. Mechanical Specifications of 94V-0 by UL recognized manufacturers ■ Fall time: 32µs typ. ■ Dimensions: conforming to M-Module™ EMC Miscellaneous Standard ■ Tested according to EN 55022 (radio ■ Hysteresis function ■ Weight: 72g disturbance), IEC1000-4-2 (ESD) and ■ Interrupt generation with maskable interrupt Environmental Specifications IEC1000-4-4 (burst) with regard to CE Peripheral Connections ■ Temperature range (operation): conformity ■ Via front panel on a shielded 44-pin HD-Sub ■ 0..+60°C or -40..+85°C receptacle connector ■ Airflow: min. 10m³/h M81 – 16 Binary Outputs
■ 16 opto-relay outputs ■ 0..6V output voltage per channel ■ 00mA output current per channel ■ Thermal and short-circuit protection ■ 00VDC isolation from the system ■ 100VDC isolation between the channels ■ -0 to +8°C with qualified components
Binary Outputs ■ M-Module™ Characteristics Mechanical Specifications ■ Output Voltage: 0..36V ■ A08, D16, IDENT ■ Dimensions: conforming to M-Module™ ■ Output Current max. 500mA per channel Electrical Specifications Standard ■ Switching Times ■ Isolation voltage: ■ Weight: 72g ■ Turn-on time: 700µs typ. ■ 500V DC between isolated side and Environmental Specifications ■ Turn-off time: 40µs typ. digital side ■ Temperature range (operation):
M-Module Mezzanine I/O Miscellaneous ■ All channels are optically isolated ■ 0..+60°C or -40..+85°C ■ Thermal and short circuit protection ■ Supply voltage/power consumption: +5V ■ Airflow: min. 10m³/h ■ Outputs are designed for AC and DC (4.85V..5.25V), 330mA max. ■ Temperature range (storage): -40..+85°C operation ■ MTBF: 1,200,000h @ 40°C (derived from ■ Relative humidity range (operation): max. Peripheral Connection MIL-HDBK-217F) 95% non-condensing ■ Via front panel on a shielded 44-pin HD-Sub ■ Relative humidity range (storage): max. 95% receptacle connector non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request Safety ■ PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers EMC ■ Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity
7 M81 MEN M-Module Mezzanine I/O
M66 – 32 Binary Inputs/Outputs
■ inputs 0..V or ■ outputs 1..V or ■ Mixed I/O in groups of ■ 1.9A output current per channel ■ 16A switching power on one M66 ■ Load on ground ■ Optical isolation
Binary I/Os M-Module™ Characteristics Safety ■ 32 binary signals ■ A08, D08, INTA, IDENT ■ PCB manufactured with a flammability rating ■ 4 optically isolated units Electrical Specifications of 94V-0 by UL recognized manufacturers ■ 8 channels for each unit ■ Isolation voltage: EMC ■ Individual use of each channel as ■ 500V DC between isolated side and ■ Tested according to EN 55022 (radio input or output digital side disturbance), IEC1000-4-2 (ESD) and ■ Individual edge-triggered interrupts ■ 180V DC between the channels IEC1000-4-4 (burst) with regard to CE ■ Input/output load on ground ■ Voltage between the connector shield and conformity ■ High-side output switches isolated ground is limited to 180V using a ■ High output current varistor; AC coupling between connector ■ Max. 1.9A per channel shield and isolated ground through 47nF ■ Max. 4A per unit capacitor ■ Over-current and over-temperature ■ Supply voltage/power consumption: protection ■ +5V (4.85V..5.25V), 200mA typ. Output Characteristics ■ +24V (external supply voltage 12..32V), ■ Output voltage range: 12V..32V 46mA typ. ■ Output current log. 0: max. 10µA ■ MTBF: 45,000h @ 50°C (derived from ■ Output current log. 1: max. 1.9A MIL-HDBK-217F) ■ Switching time for output change: Mechanical Specifications 200µs typ. ■ Dimensions: conforming to M-Module™ ■ Isolation voltage (optocoupler): 500V DC Standard Input Characteristics ■ Weight: 110g ■ Input voltage min.: 0V Environmental Specifications ■ Input voltage max. external supply voltage ■ Temperature range (operation): (12..32V) ■ 0..+60°C or -40..+85°C ■ Voltage level log. 0: 0V..6V or open ■ Airflow: min. 10m³/h ■ Voltage level log. 1: 12V..32V ■ Temperature range (storage): -40..+85°C ■ Input current log. 1: 4.05mA @ 24V ■ Relative humidity range (operation): ■ Switching threshold: 9.2V @ 0.78mA typ. max. 95% without condensation ■ Switching time for input change: 200µs typ. ■ Relative humidity range (storage): D0 – 6U CompactPCI® Card ■ Excess voltage protection: ± 50V max. 95% without condensation with 18 Binary I/Os » Page 24 Peripheral Connections ■ Altitude: -300m to + 3,000m ■ Via front panel on a shielded 44-pin HD-Sub ■ Shock: 15g/11ms A0 – 6U VMEbus Card receptacle connector ■ Bump: 10g/16ms with 18 Binary I/Os » Page 39 ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request M-Module Mezzanine I/O
M82 M66 7 MEN M-Module Mezzanine I/O
M32 – 16 Binary Inputs
■ 16 inputs 0..1V ■ Optical isolation ■ Constant current inputs ■ -0 to +8°C with ■ Debouncing circuit qualified components ■ Interrupt generation ■ Load on supply voltage
Binary Inputs ■ Input clamping voltage: 39V, ±15% Peripheral Connections ■ Input load on supply voltage ■ Switching time for input change: 3µs typ. ■ Via front panel on a shielded 25-pin D-Sub ■ FET constant current source inputs Debouncing Time receptacle connector ■ Input voltage ranges: ■ 14ms (defined by PLD programming) ■ Via carrier board (rear I/O) ■ 5..40V; 2.5..3.5mA (high level) Miscellaneous M-Module™ Characteristics ■ 5..180V (M-Module™ version for ■ Debouncing circuit ■ A08, D16, INTA, INTB, IDENT extended temperature range) ■ Interrupt generation with maskable interrupt Electrical Specifications ■ 0..1V; 0..0.2mA (low level) ■ Isolation voltage: ■ 500V DC between isolated side and digital side ■ Voltage between the connector shield and isolated ground is limited to 180V using a varistor; AC coupling between connector shield and isolated ground through 47nF capacitor ■ Supply voltage/power consumption: +5V (4.85V..5.25V), 50mA typ. ■ MTBF: 300,000h @ 50°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: conforming to M-Module™ Standard ■ Weight: 67.5g
M31 – 16 Binary Inputs
■ 16 inputs 0..1V ■ Optical isolation ■ Constant current inputs ■ -0 to +8°C with ■ Debouncing circuit qualified components ■ Interrupt generation ■ Load on ground
Binary Inputs Debouncing Time Electrical Specifications ■ Input load on ground ■ 14ms (defined by PLD programming) ■ Isolation voltage: ■ FET constant current source inputs Miscellaneous ■ 500V DC between isolated side and ■ Input voltages and currents: ■ Debouncing circuit digital side
M-Module Mezzanine I/O ■ 5..40V; 2.5..3.5mA (high level) ■ Interrupt generation with maskable interrupt ■ Voltage between the connector shield and ■ 5..180V (M-Module™ version for extended Peripheral Connections isolated ground is limited to 180V using a temperature range) ■ Via front panel on a shielded 25-pin D-Sub varistor; AC coupling between connector ■ 0..1V; 0..0.2mA (low level) receptacle connector shield and isolated ground through 47nF ■ Switching time for input change: 3µs typ. ■ Via carrier board (rear I/O) capacitor M-Module™ Characteristics ■ Supply voltage/power consumption: +5V ■ A08, D16, INTA, INTB, IDENT (4.85V..5.25V), 50mA typ. ■ MTBF: 300,000h @ 50°C (derived from MIL-HDBK-217F) Mechanical Specifications ■ Dimensions: conform. to M-Module™ Standard ■ Weight: 67.5g Environmental Specifications ■ Temperature range (operation): ■ 0..+60°C or -40..+85°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity range (oper.): max. 95% nc ■ Relative humidity range (stor.): max. 95% nc ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms 76 ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request MEN M-Module Mezzanine I/O
M28 – 16 Binary Outputs
■ 16 outputs 8..6V ■ 00mA output current per channel ■ Thermal and short-circuit protection ■ Load on ground ■ Optical isolation
Output Voltage ■ MTBF: 58,000h @ 50°C (derived from ■ Temperature range (storage): -40..+85°C ■ 8..36V; 500mA (closed) MIL-HDBK-217F) ■ Relative humidity range (oper.): max. 95% nc ■ 2V max.; 10µA max. (open) Mechanical Specifications ■ Relative humidity range (stor.): max. 95% nc Output Current ■ Dimen.: conforming to M-Module™ Standard ■ Altitude: -300m to + 3,000m ■ Max. 500mA per channel ■ Weight: 82g ■ Shock: 15g/11ms ■ No derating Environmental Specifications ■ Bump: 10g/16ms Miscellaneous ■ Temperature range (operation): 0..+60°C ■ Vibration (sinusoidal): 2g/10..150Hz ■ Load on ground ■ Industrial temperature range on request ■ Conformal coating on request ■ Thermal and short circuit protection ■ Airflow: min. 10m³/h Peripheral Connections ■ Via front panel on a shielded 25-pin D-Sub receptacle connector ■ Via carrier board (rear I/O) M-Module™ Characteristics ■ A08, D16, IDENT Electrical Specifications ■ Isolation voltage: ■ 500V DC between isolated side and digital side ■ Voltage between the connector shield and isolated ground is limited to 180V using a varistor; AC coupling between conn. shield and isolated ground through 47nF capacitor ■ Supply voltage/power consumption: +5V (4.85V..5.25V), 100mA typ.
M27 – 16 Binary Outputs
■ 16 outputs 8..6V ■ 00mA output current per channel ■ Thermal and short-circuit protection ■ Load on supply voltage ■ Optical isolation
Output Voltage Mechanical Specifications ■ Relative humidity range (storage): ■ 8..36V; 10µA max. (open) ■ Dimensions: conforming to M-Module™ max. 95% non-condensing ■ 2V max.; 500mA (closed) Standard ■ Altitude: -300m to + 3,000m Output Current ■ Weight: 84g ■ Shock: 15g/11ms
■ Max. 500mA per channel Environmental Specifications ■ Bump: 10g/16ms M-Module Mezzanine I/O ■ No derating ■ Temperature range (operation): 0..+60°C ■ Vibration (sinusoidal): 2g/10..150Hz Miscellaneous ■ Industrial temperature range on request ■ Conformal coating on request ■ Load on supply voltage ■ Airflow: min. 10m³/h Safety ■ Thermal and short circuit protection ■ Temperature range (storage): -40..+85°C ■ PCB manufactured with a flammability rating Peripheral Connections ■ Relative humidity range (operation): of 94V-0 by UL recognized manufacturers ■ Via front panel on a shielded 25-pin D-Sub max. 95% non-condensing receptacle connector ■ Via carrier board (rear I/O) M-Module™ Characteristics ■ A08, D16, IDENT Electrical Specifications ■ Isolation voltage: ■ 500V DC between isolated side and digital side ■ Voltage between the connector shield and isolated ground is limited to 180V using a varistor; AC coupling between connector shield and isolated ground through 47nF capacitor ■ Supply voltage/power consumption: +5V (4.85V..5.25V), 100mA typ. ■ MTBF: 58,000h @ 50°C (derived from 77 MIL-HDBK-217F) MEN M-Module Mezzanine I/O
M24 – 8/16 Binary Inputs
■ 8/16 Schmitt trigger inputs 0..V ■ Debouncing circuit ■ Individual interrupt generation ■ Load on ground or supply voltage ■ Screw terminal/LED version available ■ Optical isolation
Binary Inputs Input Control Miscellaneous ■ 16 binary inputs with 25-pin D-Sub conn. ■ BIOC (Binary Input/Output Controller) ■ Debouncing circuit ■ 8 binary inputs with screw terminal and LED Switching Voltage and Current ■ Interrupt generation for each channel on display ■ U low = VBB / (2 - 0.5V) each signal edge ■ Input load on ground or supply voltage ■ U high = VBB / (2 + 0.5V) Peripheral Connections ■ Schmitt trigger characteristics with 2V ■ I in = ±5mA (VBB = 24V) ■ Via front panel on a shielded 25-pin D-Sub hysteresis Overload Protection connector (16 inputs) or ■ Input current 5mA @ 24V typ. ■ Intelligent protection ■ Via screw terminal and LED display (8 inputs) ■ Input voltage range 12..32V ■ Via carrier board (rear I/O) M-Module™ Characteristics ■ A08, D08, INTA, IDENT Electrical Specifications ■ Isolation voltage: ■ 500V DC between isolated side and digital side ■ Voltage between the connector shield and isolated ground is limited to 180V using a varistor; AC coupling between connector shield and isolated ground through 47nF capacitor ■ Supply voltage/power consumption: ■ +5V (4.85V..5.25V), 120mA typ. ■ +24V (10V..32V), 50mA typ. ■ MTBF: tbd. (derived from MIL-HDBK-217F)
M22 – 8 Binary Inputs/Outputs
■ 8 channels output 0..V or ■ 8 channels input 0..V ■ A load per channel ■ Load on ground ■ Overload and line-break detection ■ Interrupt generation per channel ■ Screw terminal/LED version available ■ Optical isolation
Outputs Inputs Input/Output Control
M-Module Mezzanine I/O ■ Output voltage range 12V..32V ■ Switching voltage 5.5V typ. ■ BIOC (Binary Input/Output Controller) ■ Output current max. 2A per channel, ■ Input current 0.5mA (external switch Miscellaneous no derating to ground) ■ Load on ground ■ Switching time for output change: < 55µs ■ Switching time for input change: < 80µs ■ Overload protection using delay circuit ■ Overheating and short-circuit protection ■ Overvoltage protection with inductive loads ■ Line-break detection ■ Low heat production (0.2V typ. loss per switch at 2A current) ■ Interrupt generation for each channel Peripheral Connections ■ Via front panel on a shielded 25-pin D-Sub receptacle connector or ■ Via screw terminal and LED display ■ Via carrier board (rear I/O) M-Module™ Characteristics ■ A08, D08, INTA, IDENT Mechanical Specifications ■ Dimensions: conforming to M-Module™ Standard ■ Weight: 78g (with D-Sub connector)
78 MEN M-Module Mezzanine I/O
M58 – 32-bit TTL I/O Interface
■ TTL inputs/outputs ■ 8mA drivers ■ Active terminators ■ Same line interface as SCSI ■ Fast 16-bit host access
Input/Output ■ 32-bit TTL I/O ■ 48mA driver performance per I/O bit ■ 4 groups, alternatively input or output ■ Active terminators can be activated for each group ■ Output low current (VOL max. 0.55V): min. 64mA ■ Output high current (VOH min. 2.0V): min. -15mA ■ Input high current: max. 100µA ■ Input low current: max. -100µA ■ Input voltage: min. -0.5V, max. 6V ■ Switching times: ■ Output low-to-high: approx. 130ns ■ Output high-to-low: approx. 170ns ■ Input: approx. 50ns Miscellaneous ■ Trigger line with interrupt capabilities Peripheral Connections ■ Via front panel on a shielded 44-pin HD-Sub receptacle connector ■ Via carrier board (rear I/O) M-Module™ Characteristics ■ A08, D16, INTA, IDENT
M11 – 16-bit TTL I/O Interface
■ 18 TTL inputs/outputs ■ handshake lines ■ Programmable timer ■ bits resolution
TTL I/O Electrical Specifications ■ Industrial temperature range on request ■ 18 TTL inputs/outputs ■ Supply voltage/power consumption: +5V ■ Airflow: min. 10m³/h 680 Parallel Interface Timer (4.85V..5.25V), 200mA typ. ■ Temperature range (storage): -40..+85°C ■ 68000 bus compatible ■ MTBF: 120,000h @ 50°C (derived from ■ Relative humidity range (oper.): max. 95% nc ■ Port modes include: MIL-HDBK-217F) ■ Relative humidity range (stor.): max. 95% nc ■ Bit I/O Mechanical Specifications ■ Altitude: -300m to + 3,000m
■ Unidirectional 8-bit and 16-bit ■ Dimen.: conforming to M-Module™ Standard ■ Shock: 15g/11ms M-Module Mezzanine I/O ■ Bidirectional 8-bit and 16-bit ■ Weight: 78g ■ Bump: 10g/16ms ■ Programmable handshaking options Environmental Specifications ■ Vibration (sinusoidal): 2g/10..150Hz ■ 24-bit timer ■ Temperature range (operation): 0..+60°C ■ Conformal coating on request ■ Five separate interrupt vectors ■ Separate port and timer interrupt service requests Input Voltages and Currents ■ Input voltage "high" min. 2V, max. 4.75V ■ Input voltage "low" min. -0.3V, max. 1.8V ■ Input leakage current max. 10µA Output Voltages and Currents ■ Output current in "off-state" min. -0.1mA, max. -1mA ■ Output voltage "high" min. 2.4V (load < -0.15mA) ■ Output voltage "low" max. 0.5V (load < 2.4mA) Peripheral Connections ■ Via front panel on a shielded 25-pin D-Sub receptacle connector ■ Via carrier board (rear I/O) M-Module™ Characteristics 79 ■ A08, D08, INTC, IDENT MEN M-Module Mezzanine I/O
M43 – 8 Relay Outputs
■ 8 relay outputs ■ 1A switching power per relay ■ One throw-over contact per relay ■ Output voltage range max. 100V ■ No separate supply voltage
Relay Outputs Mechanical Specifications ■ 8 outputs as throw-over contacts ■ Dimensions: conforming to M-Module™ ■ NO (normally open), NC (normally closed) Standard and common contacts ■ Weight: 98g Ratings Environmental Specifications ■ Maximum switching voltage: 48V ■ Temperature range (operation): ■ Maximum switching current: 3A ■ 0..+60°C ■ Maximum operation current: 1A ■ Industrial temperature range on request ■ Maximum switching power: 60W ■ Airflow: min. 10m³/h Switching Time ■ Temperature range (storage): -40..+85°C ■ 2ms typ. for NO and NC ■ Relative humidity range (operation): Miscellaneous max. 95% non-condensing ■ Relay status can be read out – "read-modify- ■ Relative humidity range (storage): write" accesses possible max. 95% non-condensing ■ Low heat development by use of CMOS ■ Altitude: -300m to + 3,000m components ■ Shock: 15g/11ms Peripheral Connections ■ Bump: 10g/16ms ■ Via front panel on a shielded 25-pin D-Sub ■ Vibration (sinusoidal): 2g/10..150Hz receptacle connector ■ Conformal coating on request ■ Via carrier board (rear I/O) Safety M-Module™ Characteristics ■ PCB manufactured with a flammability rating ■ A08, D08, IDENT of 94V-0 by UL recognized manufacturers Electrical Specifications EMC ■ Supply voltage/power consumption: +5V ■ Tested according to EN 55022 (radio (+10%/-0%), 700mA typ. (all relays active) disturbance), IEC1000-4-2 (ESD) and ■ MTBF: 1,000,000h @ 50°C (derived from IEC1000-4-4 (burst) with regard to CE MIL-HDBK-217F) conformity M-Module Mezzanine I/O
80 MEN M-Module Mezzanine I/O
M35N – 8/16 Analog Inputs, 14 Bits
■ 8/16 current or voltage inputs ■ 1 bits resolution ■ 7.8µs acquisition/conversion time ■ Precision better than 0.0% ■ Unipolar/bipolar software-selectable ■ Autoincrement of channel number ■ External triggering ■ Optical isolation (00V)
A/D Conversion Miscellaneous Mechanical Specifications ■ 14 bits @ 7.8µs ■ External trigger (isolated, rising-edge ■ Dimensions: conforming to M-Module™ ■ Precision: depends on M-Module™ settings; sensitive) Standard see user manual ■ External binary input ■ Weight: 84g (incl. adapter) ■ Noise: depends on M-Module™ settings; Peripheral Connections Environmental Specifications see user manual ■ Via front panel on a shielded 25-pin D-Sub ■ Temperature range (operation): ■ Programmable gain factor of 1, 2, 4 or 8 receptacle connector ■ 0..+60°C or -45..+85°C (factor 16 by hardware jumpering) ■ Via carrier board (rear I/O) ■ Airflow: min. 10m³/h ■ Software-selectable unipolar or bipolar M-Module™ Characteristics ■ Temperature range (storage): -40..+85°C operation ■ A08, D16, INTA, IDENT ■ Relative humidity (operation): ■ Sample and hold Electrical Specifications max. 95% non-condensing ■ Autoincrement of channel number ■ Isolation voltage: ■ Relative humidity (storage): Input Signal Conditioning: ■ 500V DC between isolated side and max. 95% non-condensing 16 inputs digital side ■ Altitude: -300m to + 3,000m ■ Voltage or Current Inputs ■ 180V DC between the channels ■ Shock: 15g/11ms ■ 16 analog inputs, single-ended ■ Voltage between the connector shield and ■ Bump: 10g/16ms ■ High input voltage tolerance isolated ground is limited to 180V using a ■ Vibration (sinusoidal): 2g/10..150Hz ■ Cross-talk less than 60db varistor; AC coupling between connector ■ Conformal coating on request ■ Low-pass filter 1kHz shield and isolated ground through 47nF Safety ■ Voltage Measurement capacitor ■ PCB manufactured with a flammability rating ■ Voltage max.: ±15V ■ Supply voltages/power consumption: of 94V-0 by UL recognized manufacturers ■ Voltage full scale: ±10V ■ +5V (4.85V..5.25V), 300mA EMC ■ Input resistance: 100 kOhm, ±10% ■ MTBF: 198,000h @ 40°C (derived from ■ Tested according to EN 55022 (radio ■ Current Measurement MIL-HDBK-217F) disturbance), IEC1000-4-2 (ESD) and ■ Current max.: ±25mA IEC1000-4-4 (burst) with regard to CE ■ Current full scale: ±20mA, UA = ±1.25V conformity ■ Load resistance: 62.5 Ohm, ±0.1% Input Signal Conditioning: 8 inputs ■ Voltage or Current Inputs ■ 8 analog inputs, differential ■ High common mode range ±200V ■ Cross-talk less than 60db ■ Low-pass filter 3kHz
■ Voltage Measurement M-Module Mezzanine I/O ■ Voltage max.: ±200V (common mode) ■ Voltage full scale: ±10V ■ Input resistance: 400 kOhm typ. ■ Current Measurement ■ Current max.: ±25mA ■ Voltage max. to IGND: ±200V ■ Input resistance: 62.5 Ohm, ±0.1%
81 MEN M-Module Mezzanine I/O
M36 – 8/16 Analog Inputs
■ 8/16 current or voltage inputs ■ 16 bits resolution ■ 10 µs acquisition/conversion time ■ Unipolar/bipolar software-selectable ■ Auto-sampling system ■ Communication via dual-ported RAM ■ External triggering ■ Optical isolation ■ On-board signal conditioning with SA-Adapter™
A/D Conversion Input Signal Conditioning Electrical Specifications ■ 16 bits @ 10µs with AD0 ■ Isolation voltage: ■ Precision: ±2 LSB, ±0.1% typ. ■ Voltage or Current Inputs ■ 500V DC between isolated side and digital ■ Noise: ±3 LSB of mean value, delta = 0.8 ■ 8 analog inputs, differential side ■ Optically isolated (500V isolation) ■ High common mode range ±200V ■ 180V DC between the channels ■ Programmable gain factor of 1, 2, 4 or 8 ■ Cross-talk less than 60db ■ Voltage between the connector shield and (factor 16 by hardware jumpering) ■ Low-pass filter 3kHz isolated ground is limited to 180V using a ■ Offset max. 4 LSB (25°C) ■ Voltage Measurement varistor; AC coupling between connector ■ Full-scale error max. 4 LSB (25°C) ■ Precision: ±0.5% shield and isolated ground through 47nF ■ Software-selectable unipolar or bipolar ■ Voltage max.: ±200V (common mode) capacitor operation ■ Voltage full scale: ±10V ■ Supply voltages/power consumption: ■ Sample and hold ■ Input resistance: 400 kOhm typ. ■ +5V (4.85V..5.25V), 110mA typ. (without ■ Autoincrement of channel number ■ Current Measurement DC/DC converter), 580mA (with DC/DC), Input Signal Conditioning ■ Precision: ±1% 990mA (with DC/DC and AD01) with AD01 ■ Current max.: ±25mA ■ External supply voltages (without on- ■ Voltage or Current Inputs ■ Voltage max. to IGND: ±200V board DC/DC converter and adapter): +15V: ■ 16 analog inputs, single-ended ■ Input resistance: 62.5 Ohm, ±0.1% 14.5V..15.5V, +60mA; -15V: 14.5V..15.5V, ■ High input voltage tolerance Miscellaneous -32mA ■ Cross-talk less than 56db ■ External trigger (isolated, rising-edge ■ MTBF: 312,000h @ 50°C (derived from ■ Low-pass filter 1kHz sensitive) MIL-HDBK-217F) ■ Voltage Measurement ■ External binary input Mechanical Specifications ■ Precision: ±0.5% Peripheral Connections ■ Dimensions: conforming to M-Module™ ■ Voltage max.: ±15V ■ Via front panel on a shielded 25-pin D-Sub Standard ■ Voltage full scale: ±10V receptacle connector ■ Weight (incl. adapter): 102g ■ Input resistance: 100 kOhm, ±10% ■ Via carrier board (rear I/O) Environmental Specifications ■ Current Measurement M-Module™ Characteristics ■ Temperature range (operation): ■ Precision: ±1% ■ A08, D16, INTA, IDENT ■ 0..+60°C ■ Current max.: ±25mA ■ Industrial temperature range on request ■ Current full scale: ±20mA, UA = ±1.25V ■ Airflow: min. 10m³/h ■ Load resistance: 62.5 Ohm, ±0.1% ■ Temperature range (storage): -40..+85°C ■ Relative humidity range (operation): max. 95% non-condensing ■ Relative humidity range (storage): max. 95% non-condensing
M-Module Mezzanine I/O ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request Safety ■ PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers EMC ■ Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity
8 MEN M-Module Mezzanine I/O
M62 – 16 Analog Outputs
■ 16 current or voltage outputs ■ 1 bits resolution ■ 1 µs acquisition/conversion time ■ Optical isolation
D/A Conversion M-Module™ Characteristics ■ Altitude: -300m to + 3,000m ■ 16 channels ■ A08, D16, IDENT ■ Shock: 15g/11ms ■ 12 bits Electrical Specifications ■ Bump: 10g/16ms ■ Conversion time 15µs ■ Isolation voltage: 500V DC ■ Vibration (sinusoidal): 2g/10..150Hz ■ ±2 LSB gain ■ Supply voltage/power consumption: ■ Conformal coating on request Voltage Output ■ +5V (4.85V..5.25V), 110mA typ. (without Safety ■ Output current: 2mA max. DC/DC converter), 560mA (with DC/DC, ■ PCB manufactured with a flammability rating ■ Output linearity: ±1 LSB voltage outputs without load) of 94V-0 by UL recognized manufacturers ■ Accuracy: ±0.2%, ±1 LSB differential ■ External supply ±15V: 04M062-01 (voltage EMC ■ Voltage ranges: 0..10V; -10V..+10V output): +90mA typ., -25mA without load; ■ Tested according to EN 55022 (radio Current Output 04M062-02 (current output): +129mA typ., disturbance), IEC1000-4-2 (ESD) and ■ Accuracy: ± 0.5% -48mA without load IEC1000-4-4 (burst) with regard to CE ■ Current range : 4..20mA (other ranges pos- ■ MTBF: 560,000h @ 50°C (derived from conformity sible on request) MIL-HDBK-217F) ■ Max. output voltage 6V Mechanical Specifications ■ Max. load resistance 300 Ohm ■ Dimensions: conforming to M-Module™ Possible Configurations Standard ■ 16 voltage outputs ■ Weight: 100g ■ 16 current outputs Environmental Specifications ■ 8 voltage outputs ■ Temperature range (operation): ■ 8 current outputs ■ 0..+60°C Peripheral Connections ■ Industrial temperature range on request ■ Via front panel on a shielded 25-pin D-Sub ■ Airflow: min. 10m³/h receptacle connector ■ Temperature range (storage): -40..+85°C ■ Via carrier board (rear I/O) ■ Relative humidity range (operation): max. 95% non-condensing ■ Relative humidity range (storage): max. 95% non-condensing M-Module Mezzanine I/O
8 MEN M-Module Mezzanine I/O
M33 – 8 Analog Outputs
■ 8 current or voltage outputs ■ 1 bits resolution ■ 10 µs acquisition/conversion time ■ Simultaneous channel update ■ Optical isolation
D/A Conversion Peripheral Connections ■ Altitude: -300m to + 3,000m ■ 8 channels ■ Via front panel on a shielded 25-pin D-Sub ■ Shock: 15g/11ms ■ 12 bits receptacle connector ■ Bump: 10g/16ms ■ DAC conversion time 10µs ■ Via carrier board (rear I/O) ■ Vibration (sinusoidal): 2g/10..150Hz ■ ±5 LSB gain M-Module™ Characteristics ■ Conformal coating on request ■ Simultaneous update of all channels possible ■ A08, D16, IDENT Safety Voltage Output Electrical Specifications ■ PCB manufactured with a flammability rating ■ Output current: 5mA max. ■ Isolation voltage: 500V DC of 94V-0 by UL recognized manufacturers ■ Output linearity: ±1 LSB ■ Supply voltage/power consumption: EMC ■ Accuracy: ±0.2%, ±1 LSB differential ■ +5V (4.85V..5.25V), 480mA quiescent cur- ■ Tested according to EN 55022 (radio ■ Voltage ranges: 0..10V; -5V..+5V; -10V..+10V rent, 600mA with 8 channels voltage output, disturbance), IEC1000-4-2 (ESD) and ■ Voltage output stable up to 1µF capacitive 650mA with 4 channels current output IEC1000-4-4 (burst) with regard to CE load ■ External supply voltage +24V: 15.6V..30V conformity Current Output ■ MTBF: 200,000h @ 50°C (derived from ■ Accuracy: ± 0.5% MIL-HDBK-217F) ■ Current range: 0..20mA; 4..20mA Mechanical Specifications ■ Max. output voltage 10V ■ Dimensions: conforming to M-Module™ ■ Load resistance range: 0..500 Ohm Standard Slew Rates for Voltage Output ■ Weight: 80g ■ 0V..+10V mode: switch from 0V to +10V; Environmental Specifications slew rate (SR) = 4V/µs ■ Temperature range (operation): ■ -5V..+5V mode: switch from -5V to +5V; ■ 0..+60°C slew rate (SR) = 4V/µs ■ Industrial temperature range on request ■ -10V..+10V mode: switch from -10V to +10V; ■ Airflow: min. 10m³/h slew rate (SR) = 4V/µs ■ Temperature range (storage): -40..+85°C ■ Relative humidity range (operation): max. 95% non-condensing ■ Relative humidity range (storage): max. 95% non-condensing M-Module Mezzanine I/O
8 MEN M-Module Mezzanine I/O
M37 – 4 Analog Outputs
■ current or voltage outputs ■ 16 bits high resolution ■ 8. µs acquisition/conversion time ■ Simultaneous channel update ■ Synchronization with external trigger ■ Optical isolation
D/A Conversion Electrical Specifications Safety ■ 4 channels ■ Isolation voltage: 500V DC ■ PCB manufactured with a flammability rating ■ 16 bits ■ Supply voltage/power consumption: of 94V-0 by UL recognized manufacturers ■ Conversion time: 8.5µs ■ With on-board DC/DC converter: EMC ■ Output linearity: ±1LSB +5V (4.85V..5.25V), 850mA typ., ■ Tested according to EN 55022 (radio ■ Simultaneous updating of all channels ±12V 300mA typ. disturbance), IEC1000-4-2 (ESD) and ■ Synchronization with external trigger ■ Without DC/DC converter: 100mA typ. IEC1000-4-4 (burst) with regard to CE Voltage Output ■ External supply ±15V: -100mA (no load conformity ■ Output current: ±5mA max. connected), +110mA (no load connected) ■ Accuracy: ±0.3% ■ MTBF: tbd. (derived from MIL-HDBK-217F) ■ Voltage range: -10V..+10V Mechanical Specifications Current Output ■ Dimensions: conforming to M-Module™ ■ Accuracy: ±0.5% Standard ■ Current range: 0..20mA ■ Weight: 98g ■ Max. load resistance: 500 Ohm Environmental Specifications Peripheral Connections ■ Temperature range (operation): ■ Via front panel on a shielded 25-pin D-Sub ■ 0..+60°C receptacle connector ■ Industrial temperature range on request ■ Via carrier board (rear I/O) ■ Airflow: min. 10m³/h M-Module™ Characteristics ■ Temperature range (storage): -40..+85°C ■ A08, D16, INTA, IDENT ■ Relative humidity range (operation): max. 95% non-condensing ■ Relative humidity range (storage): max. 95% non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request M-Module Mezzanine I/O
8 MEN M-Module Mezzanine I/O
Overview – M-Modules™ for Instrumentation and Motion/Robotics
Instrumentation M-Modules™ always consist of a complete instrument on a single module, such as multi-meters, oscilloscopes, function and waveform generators, switches, data acquisition devices etc. Some of them are equipped with their own processors or DSPs for fast on-board data pre-processing. These virtual instruments – together with the appropriate carrier card – typically reside in a PC or in a more complex CompactPCI®, PXI, VME or VXI main frame, with all front panel controls and displays simulated on the monitor. M-Modules™ for robotics and motion include motor controllers, timer/counters, SSI or synchro/resolover functions.
M-Modules™ for Instrumentation
Function I/O Lines Measuring Resolution Convers. Trigger Memory Front Cons. Software Ranges Time Connector typ. M97 Universal 2 inputs 0..100MHz, 10ns @ ±1LSB 5-pin DBM 750mA Windows, Linux, p. 88 Counter DC: 60V, AC: 42V 5W5S (max.) QNX, OS-9, D-Sub VxWorks, RTX M78 4-Channel 4 voltage Variable 12 bits Variable TRIGA: sample 16MB 4 "Lemosa" 600mA up Windows, Linux, p. 89 Digital inputs TRIGB receptacles to 900mA, QNX, OS-9, Oscilloscope depend. on VxWorks, RTX sampl. rate M76 Digital 1 input DC: ±125mV..±60V; 22.5 bits @ 5-pin h 700mA Windows, Linux, p. 90 Multimeter ±12.5mA.. ±2.5A; 10Hz sampling igh-voltage (max.) QNX, OS-9, AC: 250mV RMS..42V D-Sub VxWorks, RTX RMS; 25mA RMS..2.5A RMS; Ohm: 0..25 M M70 Universal 16 voltage 0.025..1V 16 bits 20ms typ. 80kB DSP 44-pin HD-Sub 500mA Windows, Linux, p. 91 Temperature inputs QNX, OS-9, Acquisition VxWorks, RTX M68 Quad Output 4 outputs ±10V 16 bits 7µs TRIGA: sample 2x 80kB DSP 4 "Lemosa" 500mA Windows, Linux, p. 92 Function & TRIGB: gate receptacles QNX, OS-9, Waveform VxWorks, RTX Generator M67 1-Channel 1 voltage ±1V DC 12 bits 25ns, TRIGA: trigger 4MB buffer 15-pin 700mA Windows, Linux,
M-Module Mezzanine I/O p. 93 Digital input 40MHz combined (incl. QNX, OS-9, Oscilloscope D-Sub adapter) VxWorks, RTX M63 32-/16-Bit 32 inputs, Out: 12..32V 10µs TRIGA: sample 2x 80kB DSP 44-pin HD-Sub 570mA Windows, Linux, p. 94 Binary Data 16 outputs, In: 0..32V TRIGB: gate QNX, OS-9, Acquisition/ 24V signals VxWorks, RTX Generation M59 Quad Input 4 differential, ±5V, ±10V 16 bits 10µs TRIGA: sample 2x 80kB DSP 4 "Lemosa" 700mA Windows, Linux, p. 95 Analog Data DC/AC TRIGB: gate receptacles QNX, OS-9, Acquisition voltage VxWorks, RTX M56 16-Channel 16 relay 1µA..50mA, max. 50V 50-pin HD-Sub 100mA Windows, Linux, p. 96 Analog switches ±1.25V, ±2.5V, QNX, OS-9, Multiplexer VxWorks, RTX M16 Quad Input 4 differential, ±1.25V, ±2.5V, 12 bits 35µs TRIGA: sample 512-byte 25-pin D-Sub 550mA Windows, Linux, p. 97 Analog Data DC/AC ±5V, ±10V, ±20V TRIGB: filter FIFO QNX, OS-9, Acquisition voltage freq. VxWorks, RTX M8 IEC Bus 1 channel 25-pin D-Sub 290mA Windows, Linux, p. 97 Controller QNX, OS-9, VxWorks, RTX
86 MEN M-Module Mezzanine I/O Digital Oscilloscope M-Module™ M78
M-Modules™ for Motion
Function I/O Resolution Interface Miscellaneous Front Optical Consumption Software Lines Connector Isolation typ. M72 Motion Counter 4 32 bits RS422 or TTL, 24V Different counter 44-pin HD-Sub Yes 550mA Windows, Linux, p. 98 modes QNX, VxWorks, RTX, M-Module Mezzanine I/O OS-9 M54 DC Motor 1 RS422 or TTL, ±10V, LM628, 25-pin D-Sub Yes 1A Windows, Linux, p. 99 Controller 8 binary inputs, additional binary I/O QNX, VxWorks, RTX, 2 binary outputs OS-9 M50 Synchro/Resolver 1 10..16 bits Synchro/resolver AD2S82A 25-pin D-Sub Yes 550mA Windows, Linux, p. 100 Converter interface resolver-to-digital QNX, VxWorks, RTX, converter OS-9 M47 SSI Controller 4 32 bits RS422 Absolute value 25-pin D-Sub Yes 500mA Windows, Linux, p. 101 data input QNX, VxWorks, RTX, OS-9
■ Up-to-date and more detailed data sheets (including description of configuration possibilities and options, ordering information, available accessories and software) under www.men.de/products/
Designed for: -40 to +85°C operation temperature, 87 shock, drop, bump, vibration, humidity, chemical resistance MEN M-Module Mezzanine I/O
M97 – Universal Counter
■ 1 channel with input lines ■ 100MHz counter technology ■ bits resolution (9½ digits) ■ 10ns @ ±1LSB ■ Quartz oscillator better than 1ppM accuracy ■ Variable conversion ■ 6 measuring functions ■ 0..100MHz, HV input: ±00V, LV input: ±10V ■ Input voltages over 60V DC and V AC -> EN6090 ■ 0mV sensitivity ■ Programmable switching points and hysteresis ■ Optical isolation
Basic Features Frequency A ■ Supply voltage/power consumption: +5V ■ 100-MHz counter technology ■ Resolution: measuring time 10ns @ ±1 LSB (4.85V..5.25V), 750mA ■ 32 bits resolution (9 1/2 digits) ■ Measuring times: ■ MTBF: tbd. @ 50°C (derived from ■ 6 measuring functions programmable in steps of 1ms MIL-HDBK-217F) ■ Programmable switching points and High time, Low time, Period Mechanical Specifications hysteresis ■ Range: 42s ■ Dimensions: conforming to M-Module™ Measurement Functions ■ Resolution: 10ns @ ±1LSB Standard ■ Frequency (line A) Totalize ■ Weight: 120g ■ High time ■ Gate by line B Environmental Specifications ■ Low time ■ Maximum pulse duration: 42s ■ Temperature range (operation): ■ Period ■ Resolution: 10ns @ ±1LSB ■ 0..+60°C or -40..+85°C ■ Totalize (line A) during external gate (line B) ■ Gate error ±10ns ■ Airflow: min. 10m³/h ■ Time difference (line A to B) Time Difference ■ Temperature range (storage): -40..+85°C Input Characteristics (A to B input) ■ Maximum time difference: 42s ■ Relative humidity (operation): max. 95% ■ 2 input lines ■ Resolution: 10ns @ ±2LSB non-condensing ■ 2 high-voltage inputs for ±300V Time Base ■ Relative humidity (storage): max. 95% ■ 2 coax inputs for ±10V ■ Frequency: non-condensing ■ Input voltage range 1kHz, based on 100MHz system clock ■ Altitude: -300m to + 3,000m ■ ±10V peak-to-peak, input impedance 100 ■ Time range: 1ms..32.767s ■ Shock: 15g/11ms kOhm, frequency AC: 10Hz..100MHz, DC: ■ Resolution: 1ms @ ±10ns ■ Bump: 10g/16ms 0..100MHz Peripheral Connections ■ Vibration (sinusoidal): 2g/10..150Hz ■ ±300V peak-to-peak, input impedance 2 ■ Via front panel on a 5-pin DBM 5W5S D-Sub ■ Conformal coating on request MOhm, frequency AC: 10Hz..100kHz, DC: connector with two high-voltage contacts Safety 0..100kHz; fully usable only if requirements and two coax contacts by FCT ■ THE M97 DOES NOT COMPLY WITH THE of EN60950 are fulfilled through additional ■ Via carrier board using 24-pin connector REQUIREMENTS OF THE EN6095 safety measures (see user manual) (rear I/O) STANDARD. THE MAXIMUM INPUT ■ Maximum input voltage if no further safety M-Module™ Characteristics VOLTAGES ARE 60V DC AND 42V AC. measures are taken: ■ A08, D16, INTA, IDENT HOWEVER, THE M97 WAS DESIGNED ■ 60V DC / 42V AC Electrical Specifications TO PROVIDE HIGH-VOLTAGE ■ Sensitivity: programmable in steps of ■ Isolation voltage (inputs): 500V DC FUNCTIONALITY. IF YOU NEED TO ■ 5.37mV @ ±10V ■ Absolute maximum input voltages: APPLY VOLTAGES HIGHER THAN 60V DC ■ 164mV @ ±300V ■ High-voltage contacts: 500V (only with AND 42V AC, TAKE APPROPRIATE
M-Module Mezzanine I/O ■ Minimum pulse duration: 10ns additional safety measures according to MEASURES TO KEEP THE SAFETY ■ Input noise: < 100µV typ. EN60950) REQUIREMENTS OF EN60950. ■ Coupling: AC or DC (programmable) ■ Coax contacts: 20V ■ PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers EMC ■ Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity
88 MEN M-Module Mezzanine I/O
M78 – 4-Channel Digital Oscilloscope
■ analog input channels ■ 0 MS/s for each channel simultaneously ■ Full oscilloscope functionality ■ 1 bits resolution ■ 16 MB local memory ■ 6 dB SNR at .8 MHz ■ Comprehensive trigger possibilities ■ External trigger and clocking ■ Flexible on-board signal conditioning
Analog Input Recording Environmental Specifications ■ 4 analog input channels ■ 12 ADC bits per channel ■ Temperature range (operation): ■ Prepared for input conditioning adapter ■ Up to 8 external binary inputs ■ 0..+60°C ■ ±1V max. input range (without input Peripheral Connections ■ Industrial temperature range on request conditioning adapter) ■ Via front panel on 4 shielded receptacle ■ Airflow: min. 10m³/h Analog Performance connectors ■ Temperature range (storage): -40..+85°C ■ High SNR: >60dB @ max. sampling ■ Via carrier board (rear I/O) ■ Relative humidity (operation): max. 95% frequency (with external low jitter clock) M-Module™ Characteristics non-condensing ■ Lowpass input filter with 3dB cut-off ■ A08, D16, D32, INTA, IDENT, TRIGI ■ Relative humidity (storage): max. 95% frequency at 32MHz Electrical Specifications non-condensing General Purpose Inputs ■ Supply voltage/power consumption: ■ Altitude: -300m to + 3,000m ■ 2 digital GPIs per channel (GPI0..GPI7) ■ +5V (4.85V..5.25V) ■ Shock: 15g/11ms (TTL/LVTTL) ■ 900mA typ. with 50MHz sampling rate ■ Bump: 10g/16ms ■ GPI0 is configurable as an external clock ■ 750mA typ. with 25MHz sampling rate ■ Vibration (sinusoidal): 2g/10..150Hz source (LVTTL recommended) ■ 600mA typ. with >= 1MHz sampling rate ■ Conformal coating on request ■ GPI1 is configurable as an external trigger ■ MTBF: 588,000h @ 40°C (derived from Safety source (TTL/LVTTL) MIL-HDBK-217F) ■ PCB manufactured with a flammability rating Binary Outputs Mechanical Specifications of 94V-0 by UL recognized manufacturers ■ 4 outputs to control signal conditioning ■ Dimensions: conforming to M-Module™ EMC adapter or external hardware Standard ■ Tested according to IEC1000-4-2 (ESD) and Trigger ■ Weight: 100g (incl. input adapter) IEC1000-4-4 (burst) with regard to CE ■ Internal trigger, signal-sensitive with conformity adjustable hysteresis function ■ Free trigger positioning ■ Rising or falling edge ■ Programmable trigger delay ■ External trigger ■ Software trigger Acquisition Clock ■ External 10kHz..50MHz ■ Internal low noise 48MHz ■ Internally divided by FPGA (base: 48MHz)
System Clock M-Module Mezzanine I/O ■ FPGA Clock 100MHz ■ SDRAM Clock 100MHz Buffer ■ 16MB memory ■ Organized as a ring FIFO ■ Width: 4 words ■ 2 MSamples with four active channels ■ 4 MSamples with two active channels ■ 8 MSamples with one active channel ■ Random access by the host A/D Conversion ■ 12 bits resolution, max. 50MS/s ■ Track/hold ■ Oversampling technology
89 MEN M-Module Mezzanine I/O
M76 – Digital Multimeter
■ Up to bits resolution (6 ½ digits) ■ Max. resolution 0nV, nA, 0µOhm ■ 0.01% DC accuracy ■ 0 measuring ranges ■ DC: ±1mV..±00V; ±1.mA..±.A ■ AC: 0mV RMS..0V RMS; mA RMS...A RMS ■ Input voltages over 60V DC and V AC -> EN6090 ■ Resistance: 0... MOhm ■ True RMS measurements ■ Autocalibration ■ Optical isolation ■ Maximum input voltage if requirements of AC Current Measurement Resolution EN60950 are fulfilled through additional ■ Maximum input voltage if no further ■ 22.5 bits @ 10Hz sampling safety measures (see user manual): safety measures are taken: ■ 20 bits @ 50/60 Hz sampling ■ High-voltage input: 250V AC ■ 42V AC for all measuring ranges ■ 11 bits @ 1kHz sampling ■ Normal input: 60V AC ■ Sine 40Hz..100Hz DC Voltage Measurement ■ Measuring ranges: ■ Measuring ranges: ■ Maximum input voltage if no further safety ■ 250mV RMS, sine 40Hz..100kHz, error < 5% ■ 25mARMS, 250mARMS, 2.5ARMS measures are taken: ■ 2.5V RMS, sine 40Hz..100kHz, error < 1% ■ Crest factor: max. 4 ■ 60V DC / 42V AC for all measuring ranges ■ 25V RMS, sine 40Hz..100kHz, error < 1% ■ Measuring accuracy: ■ Maximum input voltage if requirements of ■ 250V RMS (high-voltage input), ■ 24 hours, 23°C ±1°C: error < 0.5% EN60950 are fulfilled through additional sine 40Hz..100Hz, error < 1% ■ 90 days, 23°C ±5°C: error < 1% safety measures (see user manual): ■ Crest factor: max. 4 ■ Range error < 1% ■ High-voltage input: 500V DC for 500V range ■ Measuring accuracy @ 50/60Hz: ■ Shunt: ■ Normal input: 125V DC for 125mV, 1.25V, ■ 24 hours, 23°C ±1°C: error < 0.5% ■ 1 Ohm @ 25mA, 250mA range 12.5V and 125V range ■ 90 days, 23°C ±5°C: error < 1% ■ 0.1 Ohm @ 2.5A range ■ Measuring ranges: ■ Range error < 1% Resistance Measurement ■ -125mV..+125mV, -1.25V..+1.25V, ■ Input impedance: ■ Measuring ranges: -12.5V..+12.5V, -125V..+125V, -500V..+500V ■ High-voltage input: 40 MOhm ■ 250 Ohm, 2.5 kOhm, 25 kOhm, ■ Measuring accuracy: ■ Normal input: 1 MOhm 250 kOhm, 2.5 MOhm ■ 24 hours, 23°C ±1°C: error < 0.025% ■ Input current: max. 10pA @ 23°C ■ Measuring accuracy 250 Ohm, 2.5 kOhm, ■ 90 days, 23°C ±5°C: error < 0.05% ■ CMRR: 100dB @ 50/60Hz 25 kOhm, 250 kOhm: ■ Temperature coefficient 0°C..+55°C: DC Current Measurement ■ 24 hours, 23°C ±1°C: error < 0.1% error < 0.01% ■ Max. input voltage if no further safety mea- ■ 90 days, 23°C ±5°C: error < 0.2% ■ Input impedance: sures are taken: 60V DC for all meas. ranges ■ Temperature coefficient 0°C..+55°C: ■ 40 MOhm @ 500V input (HV) ■ Measuring ranges: error < 0.01% ■ 10 MOhm @ 125V and 12.5V range ■ -12.5mA..+12.5mA, -125mA..+125mA ■ Measuring accuracy 2.5 MOhm: ■ > 1 GOhm @ 1.25V and 125mV range ■ -1.25A..+1.25A, -2.5A..+2.5A ■ 24 hours, 23°C ±1°C: error < 1% ■ Input current: max. 10pA @ 23°C ■ Measuring accuracy: ■ 90 days, 23°C ±5°C: error < 2% ■ CMRR: 100dB @ 50/60Hz ■ 24 hours, 23°C ±1°C: error < 0.025% ■ Temperature coefficient 0°C..+55°C: ■ NMRR: 60dB @ 50/60Hz ■ 90 days, 23°C ±5°C: error < 0.05% error < 0.1% AC Voltage Measurement ■ Temperature coefficient 0°C..+55°C: ■ Measuring modes: 2- and 4-wire ■ Maximum input voltage if no further safety error < 0.01% ■ Maximum measuring voltage: 2.5V measures are taken: ■ Shunt: 1 Ohm @12.5mA, 125mA range / Peripheral Connections ■ 60V DC / 42V AC for all measuring ranges 0.1 Ohm @ 1.25A, 2.5A range ■ Via front panel on a 5-pin 5W5S D-Sub receptacle connector with high-voltage
M-Module Mezzanine I/O contacts (recommended) ■ Via carrier-board connector (rear-panel I/O) (not recommended) M-Module™ Characteristics ■ A08, D16, INTA, IDENT Safety ■ THE M76 DOES NOT COMPLY WITH THE REQUIREMENTS OF THE EN60950 STANDARD. THE MAXIMUM INPUT VOLTAGES FOR ALL TYPES OF MEASUREMENTS ARE 60V DC AND 42V AC. HOWEVER, THE M76 WAS DESIGNED TO PROVIDE HIGH- VOLTAGE FUNCTIONALITY. IF YOU NEED TO APPLY VOLTAGES HIGHER THAN 60V DC AND 42V AC, TAKE APPROPRIATE MEASURES TO KEEP THE SAFETY REQUIREMENTS OF EN60950. ■ PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers Mechanical Specifications ■ Dimensions: conforming to M-Module™ 90 Standard ■ Weight: 94g MEN M-Module Mezzanine I/O
M70 – Temperature Acquisition
■ , 8 or 16 channels ■ RTDs: PT100/PT1000 ■ -, - or -wire connection ■ Thermocouples ■ 16 bits resolution ■ 0ms typ. conversion time ■ 0.0..1V measuring range ■ Input protection ■ Line-break detection ■ DSP MIPS ■ 80KB memory ■ Optical isolation
Digital Signal Processor Miscellaneous Mechanical Specifications ■ 1 ADSP-2181 (Analog Devices) ■ On-board digital temperature sensor ■ Dimensions: conforming to M-Module™ ■ 16k x 16 bits data buffer ■ EEPROM for calibration values Standard ■ 16k x 24 bits program memory ■ M-Module™ identification EEPROM ■ Weight: 82g ■ 80KB total DSP memory ■ On-board DC/DC converter for supply of Environmental Specifications ■ 32 MHz clock frequency A/D converter ■ Temperature range (operation): A/D Conversion Peripheral Connections ■ 0..+60°C or -40..+85°C ■ 20-bit Delta-Sigma A/D converter CS5526 ■ Via front panel on a shielded 44-pin HD-Sub ■ Airflow: min. 10m³/h (Crystal Semiconductor) receptacle connector ■ Temperature range (storage): -40..+85°C ■ Linearity error: 0.0015%FS ■ Via carrier board (rear I/O) ■ Relative humidity range (operation): ■ Noise free resolution: 18 bits M-Module™ Characteristics max. 95% non-condensing ■ Bipolar/unipolar input ranges (25mV to 5V) ■ A08, D16, INTA, DMA, IDENT ■ Relative humidity range (storage): ■ Maximum sampling rate: 200Hz Electrical Specifications max. 95% non-condensing Inputs ■ Isolation voltage: ■ Altitude: -300m to + 3,000m ■ 16 voltage inputs with 25mV..1V sensitivity ■ 500V DC between isolated side and ■ Shock: 15g/11ms ■ Measuring current < 0.4mA (power in digital side ■ Bump: 10g/16ms the sensor < 0.3mW) ■ Voltage between the connector shield and ■ Vibration (sinusoidal): 2g/10..150Hz Sensors isolated ground is limited to 180V using a ■ Conformal coating on request ■ Resistance temperature detectors (RTD): varistor; AC coupling between connector Safety PT100 or PT1000 shield and isolated ground through 47nF ■ PCB manufactured with a flammability rating ■ Supported temperature range: -200..+850°C capacitor of 94V-0 by UL recognized manufacturers ■ Thermocouples of type K or type T, option: ■ Supply voltage/power consumption: +5V EMC configuration for other types (4.85V..5.25V), 500mA typ. ■ Tested according to EN 55022 (radio ■ Supported temperature range type K: ■ MTBF: tbd. (derived from MIL-HDBK-217F) disturbance), IEC1000-4-2 (ESD) and -200..+1372°C IEC1000-4-4 (burst) with regard to CE ■ Supported temperature range type T: conformity -200..+400°C ■ Line break detection Measuring Accuracy ■ RTD 2-wire: ±0.7%, ±0.5°C ■ RTD 3-wire: ±0.3%, ±0.5°C ■ RTD 4-wire: ±0.1%, ±0.5°C
■ Thermocouple: ±0.5%, ±0.5°C M-Module Mezzanine I/O ■ All values refer to the final measuring value of the thermo sensor at an ambient temperature of 0..+60°C. Error tolerance of sensor must be added.
91 MEN M-Module Mezzanine I/O
M68 – 4-Channel Function & Waveform Generator
■ 16-bit D/A converters ■ Individual offset and output voltage range ■ 100kHz update rate per channel ■ 7µs acquisition/conversion time ■ ±10V measuring range ■ DSPs, MIPS each ■ 160kB memory ■ Optical isolation
D/A Conversion M-Module™ Characteristics ■ Bump: 10g/16ms ■ Resolution: 16 bits ■ A08, D16, INTA, IDENT, TRIGI ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conversion time: 7µs Electrical Specifications ■ Conformal coating on request ■ Absolute accuracy: ±0.5% ■ Isolation voltage: Safety ■ Differential accuracy: ±0.05%, ■ 500V DC between isolated side and ■ PCB manufactured with a flammability rating no missing codes digital side of 94V-0 by UL recognized manufacturers Outputs ■ Voltage between the connector shield EMC ■ 4 analog outputs and isolated ground is limited to 180V using ■ Tested according to EN 55022 (radio ■ Current range: ±1mA a varistor; AC coupling between connector disturbance), IEC1000-4-2 (ESD) and ■ Voltage range: ±10V shield and isolated ground through 47nF IEC1000-4-4 (burst) with regard to CE ■ Output accuracy depends on load resistance capacitor conformity ■ Output impedance: 0 Ohm ■ Supply voltage/power consumption: +5V Miscellaneous (4.85V..5.25V), 500mA ■ Adjustable peak via 12-bit DAC ■ MTBF: 151,000h @ 50°C (derived from ■ Self-calibration (firmware) MIL-HDBK-217F) ■ 6th-order output lowpass filter 15kHz Mechanical Specifications ■ 100kHz maximum output rate ■ Dimensions: conforming to M-Module™ Digital Signal Processing Standard ■ 2 processors ADSP 2181 (Analog Devices) ■ Weight: 98g ■ Data reduction by interpolation Environmental Specifications ■ 16k x 16 bits data buffer ■ Temperature range (operation): ■ 16k x 24 bits program memory ■ 0..+60°C or -40..+85°C ■ Programming via host interface ■ Airflow: min. 10m³/h ■ External or internal trigger ■ Temperature range (storage): -40..+85°C (software-programmable) ■ Relative humidity range (operation): Peripheral Connections max. 95% non-condensing ■ Via front panel on 4 shielded receptacle ■ Relative humidity range (storage): connectors max. 95% non-condensing ■ Via carrier board (rear I/O) ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms M-Module Mezzanine I/O
9 MEN M-Module Mezzanine I/O
M67 – 1-Channel Digital Oscilloscope
■ 1 analog voltage input 0MS/s ■ 1 bits resolution ■ ns acquisition/conversion time ■ ±1V DC measuring range ■ MB SDRAM ■ Complex trigger logic ■ Oversampling technology ■ Flexible onboard signal conditioning ■ Optical isolation
Analog Input M-Module™ Characteristics Safety ■ ±1V max. input range, 75 Ohm ■ A08, D16, D32, INTA, DMA, IDENT, TRIGI ■ PCB manufactured with a flammability rating ■ Input conditioning via adapter PCB Electrical Specifications of 94V-0 by UL recognized manufacturers Trigger ■ solation voltage: 500V DC EMC ■ Trigger at signal level, external signal or ■ Supply voltage/power consumption: ■ Tested according to EN 55022 (radio via software ■ +5V (4.85V..5.25V), 700mA typ. (with disturbance), IEC1000-4-2 (ESD) and ■ Rising or falling edge sample adapter) IEC1000-4-4 (burst) with regard to CE ■ Trigger at start, middle, end ■ +12V (±5%), +50mA conformity Clock ■ -12V (±5%), -40mA ■ Internal or external clock, max. 40MHz ■ MTBF: tbd. (derived from MIL-HDBK-217F) ■ Divider 2n Mechanical Specifications Buffer ■ Dimensions: conforming to M-Module™ ■ 4MB Standard ■ Random access by the host possible ■ Weight: 112g (incl. adapter) A/D Conversion Environmental Specifications ■ 12 bits, 40MSPS ■ Temperature range (operation): ■ 64dB SNR at 3.58MHz ■ 0..+60°C ■ Track/hold ■ Industrial temperature range on request ■ Oversampling technology ■ Airflow: min. 10m³/h Recording ■ Temperature range (storage): -40..+85°C ■ 12 ADC bits and 4 external binary inputs ■ Relative humidity range (operation): Binary Inputs/Outputs max. 95% non-condensing ■ 4 inputs ■ Relative humidity range (storage): ■ 6 outputs max. 95% non-condensing Peripheral Connections ■ Altitude: -300m to + 3,000m ■ Via front panel on a shielded combined 15- ■ Shock: 15g/11ms pin D-Sub receptacle connector ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request M-Module Mezzanine I/O
9 MEN M-Module Mezzanine I/O
M63 – 32-/16-Bit Binary Data Acquisition/Generation
■ inputs 0..V ■ 16 output channels ■ 1..V, 00mA each ■ V signals ■ Simultaneous sampling ■ 100kHz sampling rate per channel ■ 10µs acquisition/conversion time ■ DSPs, MIPS each ■ 160kB memory ■ Optical isolation
I/O M-Module™ Characteristics Safety ■ 16 outputs (high-side driver) ■ A08, D16, INTA, IDENT, IMP, TRIGI ■ PCB manufactured with a flammability rating ■ Output voltage range: 12V..32V Electrical Specifications of 94V-0 by UL recognized manufacturers ■ Output current log. 0: max. -200µA ■ Isolation voltage: EMC ■ Output current log. 1: max. 500mA ■ 500V DC between isolated side and ■ Tested according to EN 55022 (radio ■ Switching time for output change: < 5µs digital side disturbance), IEC1000-4-2 (ESD) and ■ Isolation voltage (optocoupler): 500V DC ■ Voltage between the connector shield and IEC1000-4-4 (burst) with regard to CE ■ 32 inputs isolated ground is limited to 180V using a conformity ■ Input voltage range: 0V..32V varistor; AC coupling between connector ■ Switching threshold log. 1: 10V..32V shield and isolated ground through 47 nF ■ Switching threshold log. 0: 0V..5V or open capacitor ■ Input current log. 1: < 1mA ■ Supply voltage/power consumption: +5V ■ Switching time for input change: < 50µs (4.85V..5.25V), 570mA typ. ■ Excess voltage protection: ± 50V ■ MTBF: 189,500h @ 50°C (derived from ■ 16 inputs offer the possibility to be set to TTL MIL-HDBK-217F) level (inputs at DSP-B) Mechanical Specifications ■ Division into two groups, each group being ■ Dimensions: conforming to M-Module™ controlled by one DSP Standard Digital Signal Processing ■ Weight: 96g ■ 2 processors ADSP 2181 (Analog Devices) Environmental Specifications ■ 16k x 16 bits data memory ■ Temperature range (operation): ■ 16k x 24 bits program memory ■ 0..+60°C ■ Programming via host interface ■ Industrial temperature range on request ■ External or internal trigger (programmable) ■ Airflow: min. 10m³/h ■ DMA host interface ■ Temperature range (storage): -40..+85°C Peripheral Connections ■ Relative humidity range (operation): ■ Via front panel on a shielded 44-pin HD-Sub max. 95% non-condensing receptacle connector ■ Relative humidity range (storage): ■ Via carrier board (rear I/O) max. 95% non-condensing ■ Intermodule Port ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz
M-Module Mezzanine I/O ■ Conformal coating on request
9 MEN M-Module Mezzanine I/O
M59 – 4-Channel Data Acquisition
■ 16-bit A/D converters ■ differential DC/AC inputs ■ Simultaneous sampling ■ 100kHz ADC sampling rate per channel ■ 10µs acquisition/conversion time ■ ±1.V, ±.V, ±V, ±10V ■ On-board signal conditioning ■ DSPs, MIPS each ■ 160kB memory ■ Optical isolation
A/D Conversion Anti-Aliasing Environmental Specifications ■ Resolution: 16 bits ■ 8th-order Bessel lowpass filter, cutoff ■ Temperature range (operation): ■ Conversion time: max. 8µs frequency fg = 20kHz ■ 0..+60°C or -40..+85°C ■ Fixed ADC sampling rate: 100kHz Digital Signal Processing ■ Airflow: min. 10m³/h ■ Can be decimated through firmware ■ 2 processors ADSP 2181 (Analog Devices) ■ Temperature range (storage): -40..+85°C to 100Hz..100kHz ■ Data reduction by interpolation ■ Relative humidity range (operation): ■ Integral linearity error: ±3LSB ■ 16k x 16 bits data buffer max. 95% non-condensing ■ Full-scale error: ±0.5% ■ 16k x 24 bits program memory ■ Relative humidity range (storage): ■ Simultaneous sampling of all four channels ■ Programming via host interface max. 95% non-condensing Inputs ■ External or internal trigger (programmable) ■ Altitude: -300m to + 3,000m ■ 4 differential analog inputs Peripheral Connections ■ Shock: 15g/11ms ■ DC and AC coupling ■ Via front panel on 4 shielded receptacle ■ Bump: 10g/16ms ■ 0.5Hz highpass with AC coupling connectors ■ Vibration (sinusoidal): 2g/10..150Hz ■ Measuring ranges: ■ Via carrier board (rear I/O) ■ Conformal coating on request ■ ±1.25V, ±2.5V, ±5V, ±10V ■ Intermodule Port Safety ■ Individually configurable M-Module™ Characteristics ■ PCB manufactured with a flammability rating ■ Optical isolation using optocouplers ■ A08, D16, INTA, IDENT, TRIGI of 94V-0 by UL recognized manufacturers ■ 4 voltage references for software calibration Electrical Specifications EMC ■ Small signal: ■ Isolation voltage: ■ Tested according to EN 55022 (radio ■ Max. 5Vss ■ 500V DC between isolated side and disturbance), IEC1000-4-2 (ESD) and ■ Fg = 20kHz (-3dB) digital side IEC1000-4-4 (burst) with regard to CE ■ Large signal: ■ Voltage between the connector shield and conformity ■ Max. 20Vss isolated ground is limited to 180V using a ■ Fg = 10kHz (-3dB) varistor; AC coupling between connector ■ Fg = 5kHz (0dB) (no attenuation) shield and isolated ground through ■ Accuracy after software adjustment: ±1mV 47nF capacitor ■ Temperature drift (0..+60°C): ±0.1% ■ Supply voltage/power consumption: +5V ■ Noise (0..+60°C): (4.85V..5.25V), 700mA typ. ■ X1: ±8LSB; delta = 1.7 ■ MTBF: 143,000h @ 50°C (derived from ■ X2: ±10LSB; delta = 2.0 MIL-HDBK-217F) ■ X4: ±12LSB; delta = 2.2 Mechanical Specifications ■ X8: ±18LSB; delta = 3.4 ■ Dimensions: conforming to M-Module™ ■ Overall: ±0.03% Standard
■ Weight: 90g M-Module Mezzanine I/O
9 MEN M-Module Mezzanine I/O
M56 – 16-Channel Analog Multiplexer
■ 16 powerless-switching relays ■ 1µA..0mA (max. 0V), ±1.V, ±.V, ■ One throw-over contact each ■ No separate supply voltage ■ Low heat development ■ Optical isolation
Relay Outputs Electrical Specifications ■ Relative humidity (storage): ■ 16 outputs as throw-over contacts ■ Isolation voltage: max. 95% non-condensing ■ Switching voltages and currents ■ 500V DC between isolated side and ■ Altitude: -300m to + 3,000m ■ Switching voltage: max. 50V digital side ■ Shock: 15g/11ms ■ Switching current: max. 100mA ■ Voltage between the connector shield and ■ Bump: 10g/16ms ■ Switching power: max. 5W digital ground is limited to 180V using a ■ Vibration (sinusoidal): 2g/10..150Hz ■ Cross-talk varistor; AC coupling between connector ■ Conformal coating on request ■ Cross-talk damping between individual shield and digital ground through 47nF Safety inputs: > 60dB capacitor ■ PCB manufactured with a flammability rating ■ Cross-talk damping between input and ■ 150V DC between relay switching contacts of 94V-0 by UL recognized manufacturers output: > 60dB ■ 250V DC between the channels EMC ■ Maximum frequency without cross-talk: ■ Supply voltage/power consumption: +5V ■ Tested according to EN 55022 (radio 100MHz (5V..5.5V), 150mA typ. with load, disturbance), IEC1000-4-2 (ESD) and ■ Load current 125mA typ. w/o load IEC1000-4-4 (burst) with regard to CE ■ Min. 1µA ■ MTBF: 47,000h @ 50°C (derived from conformity ■ Max. 50mA MIL-HDBK-217F) ■ Initial contact resistance: max. 50 mOhm ■ Maximum switching quantity: Miscellaneous 100,000,000 for any relay ■ Relay position can be read back Mechanical Specifications ■ Low heat development by use of CMOS ■ Dimensions: conforming to M-Module™ components and bistable/monostable relays Standard Peripheral Connections ■ Weight: 75g ■ Via front panel on a shielded 50-pin D-Sub Environmental Specifications receptacle connector ■ Temperature range (operation): M-Module™ Characteristics ■ 0..+60°C ■ A08, D08, IDENT ■ Industrial temperature range on request ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity (operation): max. 95% non-condensing M-Module Mezzanine I/O
96 MEN M-Module Mezzanine I/O
M16 – 4-Channel Data Acquisition
■ differential DC/AC voltage input channels ■ 1 bits resolution ■ µs acquisition ■ ±1.V, ±.V, ±V, ±10V, ±0V ■ Simultaneous sampling of all channels ■ External measurement trigger ■ FIFO for data buffering ■ Optical isolation
A/D Conversion FIFO ■ Supply voltage/power consumption: ■ 12 bits/35µs ■ 512 bytes, 64 samples (4 words each) ■ Digital part: +5V (4.85V..5.25V), ■ Simultaneous sampling of four channels Peripheral Connections 220mA max. ■ Precision: ■ Via front panel on a shielded 25-pin D-Sub ■ Analog part: ±15V (±5%), +200mA, ■ Offset < 5mV receptacle connector -100mA typ. ■ Gain < 0.2% ■ Via carrier board (rear I/O) ■ MTBF: 228,000h @ 50°C (derived from ■ Sampling frequency: max. 28kHz M-Module™ Characteristics MIL-HDBK-217F) Input Conditioning ■ A08, D16, INTA, DMA, IDENT, TRIGI Mechanical Specifications ■ Precision: ±0.1% Electrical Specifications ■ Dimensions: conforming to M-Module™ ■ Input resistance > 100 kOhm ■ Isolation voltage Standard Voltage Input ■ 500V DC between M-Module™ interface ■ Weight: 75g ■ 4 analog inputs, differential and analog input connector EMC ■ ±1.25V, ±2.5V, ±5V, ±10V, ±20V ■ Voltage between the connector shield and ■ Tested according to EN 55022 (radio distur- ■ Common mode rejection: 55dB analog input connector is limited to 180V bance), IEC1000-4-2 (ESD) and IEC1000-4-4 Programmable Low-Pass Filter using a varistor; AC coupling between (burst) with regard to CE conformity ■ Operation range: 5Hz..10,000Hz connector shield and analog input connector ■ Filter transconductance: 48dB/octave through 47nF capacitor
M8 – IEC Bus Controller
■ GPIB controller, talker and listener ■ IEC6/IEEE88 ■ Automatic handshake (source and acceptor)
Controller Electrical Specifications ■ NAT9914 ■ Supply voltage/power consumption: +5V GPIB Functions (4.85V..5.25V), 290mA typ. ■ Support of controller, talker and listener ■ MTBF: 120,000h @ 50°C (derived from EMC ■ Completely according to IEC625 (IEEE488) MIL-HDBK-217F) ■ Tested according to EN 55022 (radio distur- Miscellaneous Mechanical Specifications bance), IEC1000-4-2 (ESD) and IEC1000-4-4 ■ Automatic handshake (source and acceptor) ■ Dimensions: conforming to M-Module™ (burst) with regard to CE conformity ■ Interrupt level Standard Peripheral Connections ■ Weight: 68g ■ Via front panel on a shielded 25-pin D-Sub
plug connector M-Module Mezzanine I/O ■ Via carrier board connector (rear I/O) M-Module™ Characteristics ■ A08, D08, INTA
M8 M16 97 MEN M-Module Mezzanine I/O
M72 – Motion Counter
■ independent cascadable -bit counters ■ comparators per counter ■ Quadrature incremental encoder interface ■ Pulse width/frequency measurement ■ Multimode event generation ■ Customized counter modes via FPGA ■ RS or TTL or V ■ Optical isolation
Four Independent Counters ■ TTL input characteristics: Environmental Specifications ■ 32-bit up/down counter ■ Uin < 0.5V = "low" ■ Temperature range (operation): ■ Two 32-bit comparators ■ Uin > 2.2V = "high" ■ 0..+60°C ■ One 32-bit preload register ■ Uin max. = 12V ■ Industrial temperature range on request ■ Clock frequency 40MHz ■ Max. input current: ±5mA ■ Airflow: min. 10m³/h Counter Modes ■ 24V input characteristics: ■ Temperature range (storage): -40..+85°C ■ Single count ■ Uin < 1V = "low" ■ Relative humidity (operation): ■ 1x quadrature, 2x quadrature, 4x quadrature ■ Uin > 10V = "high" max. 95% non-condensing ■ Frequency measurement ■ Uin max. = 30V ■ Relative humidity (storage): ■ Pulse width "high", pulse width "low" ■ Max. input current: ±10mA max. 95% non-condensing ■ Period measurement, timer ■ Max. frequency measurement: 500kHz ■ Altitude: -300m to + 3,000m Input Output ■ Shock: 15g/11ms ■ 3 inputs for each counter ■ 4 TTL outputs (optically isolated) ■ Bump: 10g/16ms ■ RS422, TTL or 24V input ■ Output current: ■ Vibration (sinusoidal): 2g/10..150Hz ■ Timing characteristics for the different ■ High current: 10mA ■ Conformal coating on request modes: ■ Low current: 15mA Safety ■ Single count: t high > 200ns; t low > 200ns Peripheral Connections ■ PCB manufactured with a flammability rating ■ Quadrature: time between two active edges ■ Via front panel on a shielded 44-pin HD-Sub of 94V-0 by UL recognized manufacturers (t edges > 400ns) receptacle connector EMC ■ Frequency measurement: gating time M-Module™ Characteristics ■ Tested according to EN 55022 (radio 10ms, < 2.5MHz ■ A08, D16, INTA, IDENT disturbance), IEC1000-4-2 (ESD) and ■ Pulse width: t high or t low > 15µs Electrical Specifications IEC1000-4-4 (burst) with regard to CE ■ Period: t high or t low > 15µs, internal ■ Isolation voltage: 500V DC conformity frequency 2.5MHz ■ Supply voltage/power consumption: +5V ■ Synchronization of input signals with (4.85V..5.25V), 550mA on-board clock (40MHz) ■ MTBF: 70,000h @ 50°C (derived from ■ Input debouncing time: 100ns MIL-HDBK-217F) ■ RS422 input characteristics: see user manual Mechanical Specifications ■ Dimensions: conforming to M-Module™ Standard ■ Weight: 100g M-Module Mezzanine I/O
98 MEN M-Module Mezzanine I/O
M54 – DC Motor Controller
■ 1 LM68 supported channel ■ For every motor type with ±10V control input ■ Position and velocity operation ■ Quadrature incremental encoder interface ■ PID values programmable ■ RS or TTL, ±10V, 1 relay output ■ Additional binary I/O ■ Optical isolation
LM68 Motor Controller Peripheral Connections Environmental Specifications ■ LM628 precision motor controller ■ Via front panel on a shielded 25-pin D-Sub ■ Temperature range (operation): ■ 32-bit position, velocity and acceleration receptacle connector ■ 0..+60°C registers ■ Via carrier board (rear I/O) ■ Industrial temperature range on request ■ 256µs control-loop update time M-Module™ Characteristics ■ Airflow: min. 10m³/h ■ Programmable digital PID filter with 16-bit ■ A08, D08, INTA, IDENT ■ Temperature range (storage): -40..+85°C coefficients Electrical Specifications ■ Relative humidity range (operation): ■ Operating modes: position and velocity ■ Isolation voltage: max. 95% non-condensing ■ Position feedback interface ■ 500V DC from M-Module™ interface ■ Relative humidity range (storage): ■ Incremental encoder ■ 100V DC from binary I/O max. 95% non-condensing ■ Quadrature signals with optional index ■ 100V DC from motor interface ■ Altitude: -300m to + 3,000m ■ RS422 or TLL signal level ■ Supply voltage/power consumption: +5V ■ Shock: 15g/11ms Motor Interface (4.85V..5.25V), 1A typ. ■ Bump: 10g/16ms ■ Optically isolated from all other parts ■ MTBF: tbd. (derived from MIL-HDBK-217F) ■ Vibration (sinusoidal): 2g/10..150Hz ■ ±10V analog output Mechanical Specifications ■ Conformal coating on request ■ Resolution: 12 bits, ±2 LSB ■ Dimensions: conforming to M-Module™ Safety Quadrature Incremental Encoder Standard ■ PCB manufactured with a flammability rating Interface ■ Weight: 108g of 94V-0 by UL recognized manufacturers ■ Index pulse EMC ■ RS422 or TTL signal level ■ Tested according to EN 55022 (radio ■ Line break monitor disturbance), IEC1000-4-2 (ESD) and ■ Plausibility check for glitch detection IEC1000-4-4 (burst) with regard to CE Binary I/O conformity ■ I/O controller Zilog Z8536 ■ Optically isolated from all other parts ■ Supply: 12..36V, 50mA typ. ■ Binary inputs: ■ 8 inputs connected to port A of Z8536 (6 inputs digitally debounced) ■ Switching voltage: 1.2V nominal ■ Input frequency: I0/I1 max. 125Hz, I2..I7 max. 50Hz ■ Input resistance: 12 kOhm, ±10% ■ Binary outputs:
■ 2 outputs connected to port B of the Z8536 M-Module Mezzanine I/O ■ Protected highside outputs (BTS412) ■ Switching current: Imax = -1A ■ Overload protection: Imax = -10A typ.
99 MEN M-Module Mezzanine I/O
M50 – Synchro/Resolver Converter
■ Resolver/synchro-to-digital converter ■ Up to 16 bits resolution ■ On-board reference frequency generation ■ On-board signal conditioning ■ arc minutes accuracy ■ Analog velocity output ■ Optical isolation ■ Not conforming to RoHS
ADS8A Resolver-to-Digital Peripheral Connections ■ Bump: 10g/16ms Converter ■ Via front panel on a shielded 25-pin D-Sub ■ Vibration (sinusoidal): 2g/10..150Hz ■ Resolution: 10/12/14/16 bits receptacle connector ■ Conformal coating on request ■ Reference input voltage: variable, 2V ■ Via carrier board (rear I/O) Safety RMS..90V RMS/115V RMS M-Module™ Characteristics ■ PCB manufactured with a flammability rating ■ Reference output voltage: ■ A08, D16, INTA, IDENT of 94V-0 by UL recognized manufacturers max. 26V RMS, 1.5W Electrical Specifications EMC ■ Reference frequency range: 50..20,000Hz ■ Isolation voltage: 500V DC ■ Tested according to EN 55022 (radio ■ Accuracy: ■ Supply voltage/power consumption: +5V disturbance), IEC1000-4-2 (ESD) and ■ ±2/±4/±8/±22 arc min, ±1LSB (4.85V..5.25V), 550mA typ. IEC1000-4-4 (burst) with regard to CE (resolver input) ■ MTBF: 34,000h @ 50°C (derived from conformity ■ Accuracy: ±9/±13/±15/±29 arc min, ±1LSB MIL-HDBK-217F) (synchro input) Mechanical Specifications ■ Tracking rate: depends on frequency and ■ Dimensions: conforming to M-Module™ resolution (max. 1040 rps) Standard ■ Small/large step settling time: depends on ■ Weight: 102g frequency and resolution Environmental Specifications Miscellaneous ■ Temperature range (operation): ■ Input signals: 10% max. harmonic distortion ■ 0..+60°C ■ Velocity output: ±8V ■ Industrial temperature range on request ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity range (operation): max. 95% non-condensing ■ Relative humidity range (storage): max. 95% non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms M-Module Mezzanine I/O
100 MEN M-Module Mezzanine I/O
M47 – SSI Controller
■ -channel -bit SSI ■ Serial Synchronous Interface ■ RSA interface ■ Automatic communication ■ RAM-like double buffer user interface ■ Gray/binary decoding for each channel ■ Line-break detection ■ Absolute value data input ■ External Baud rate possible ■ Optical isolation for each channel
SSI Interface M-Module™ Characteristics ■ Relative humidity range (storage): ■ 4-channel Serial Synchronous Interface (SSI) ■ A08, D08, INTA, IDENT max. 95% non-condensing ■ Optical isolation Electrical Specifications ■ Altitude: -300m to + 3,000m ■ RS422A interface ■ Isolation voltage ■ Shock: 15g/11ms Data Transmission ■ 500V DC between M-Module™ interface and ■ Bump: 10g/16ms ■ Baud rate external sensor interface ■ Vibration (sinusoidal): 2g/10..150Hz ■ 62.5 kbaud, 125 kbaud, 250 kbaud, ■ Voltage between the connector shield and ■ Conformal coating on request 500 kbaud sensor interface is limited to 180V using a Safety ■ Programmable for each channel varistor; AC coupling between connector ■ PCB manufactured with a flammability rating ■ Word length shield and sensor interface through 10nF of 94V-0 by UL recognized manufacturers ■ 1..32 bits capacitor EMC ■ Programmable for each channel ■ Supply voltage/power consumption: +5V ■ Tested according to EN 55022 (radio Memory (4.85V..5.25V), 150mA without external disturbance), IEC1000-4-2 (ESD) and ■ 16-byte RAM-like double buffer user interface sensors connected, max. 850mA with 4 IEC1000-4-4 (burst) with regard to CE Interfaces sensors connected conformity ■ 4 RS422 ports, optically isolated ■ MTBF: 33,000h @ 50°C (derived from ■ Supply voltage for external sensors etc.: MIL-HDBK-217F) 5V (±10%), 400mA max. all channels Mechanical Specifications summed up ■ Dimensions: conforming to M-Module™ Miscellaneous Standard ■ Automatic communication ■ Weight: 60g ■ Gray and binary decoding, programmable Environmental Specifications for each channel ■ Temperature range (operation): ■ Sensor connection detection ■ 0..+60°C or -40..+85°C ■ Interrupt triggering on a new data ■ Airflow: min. 10m³/h transmission ■ Temperature range (storage): -40..+85°C Peripheral Connections ■ Relative humidity range (operation): ■ Via front panel on a shielded 25-pin D-Sub max. 95% non-condensing receptacle connector ■ Via carrier board (rear I/O) M-Module Mezzanine I/O
101 MEN M-Module Mezzanine I/O
Overview – M-Modules™ for Fieldbus Interfacing and Legacy I/O
Out of the large variety of fieldbus standards dedicated to distributed I/O solutions, MEN offers the most popular ones: CANopen (Vector protocol stack and tools) and PROFIBUS DP (Softing protocol stack and tools) – with master and slave functionality. The corresponding driver software is based on MDIS™, which makes the M-Modules™ ready for use under Windows®, Linux and the most popular real-time operating systems. MEN’s know-how with fieldbus solutions implemented on different platforms includes also DeviceNet, Bitbus, MVB and WTB.
M-Modules™ are also available with legacy I/O functions for many different communication standards for data exchange with any type of development or target computer system as well as for periphery such as modems, scanners, CD-ROMs, printers or disk drives.
M-Modules™ for Fieldbus Connection
Function I/O Interface Memory Miscellaneous Front Optical Firmware Consumption Driver Lines Connector Isol. typ. Software
M-Module Mezzanine I/O M79 Profibus DP 1 DIN19245: 1MB shared 9-pin D-Sub Yes Softing protocol 287mA Windows, Linux, p. 104 Slave Interface RS485 memory portation QNX, VxWorks, (ISO/OSI layer 2) RTX, OS-9 M65 Intelligent Dual 2 ISO high-speed 2x 1MB sync. Full CAN, 25-pin D-Sub Yes CAN layer 2, 470mA max. Windows, Linux, p. 104 CAN Interface DRAM, Extended CAN CANopen (Vector) (2 channels) QNX, VxWorks, 2x 512KB Flash 280mA (1 chan.) RTX, OS-9 M57 Profibus 1 DIN19245: 1MB DRAM 9-pin D-Sub Yes ISO/OSI protocol 800mA Windows, Linux, p. 105 DP Master RS485, layer 2/DP (Softing), QNX, VxWorks, Interface RS232 (debug) PROFIBUS DP RTX, OS-9 Configurator tool M51 Quadruple CAN 4 ISO high-speed CAN 2.0B, 25-pin D-Sub Yes CAN layer 2 900mA Windows, Linux, p. 105 Interface Extended CAN QNX, VxWorks, RTX, OS-9 M39 InterBus-S Slave 1 RS485, 2KB dual- 9-pin D-Sub Yes 210mA OS-9 – Interface RS232 (debug) ported RAM
■ Up-to-date and more detailed data sheets (including description of configuration possibilities and options, ordering information, available accessories and software) under www.men.de/products/
102 MEN M-Module Mezzanine I/O Profibus Slave Interface M-Module™ M79
M-Modules™ for Communication
Function I/O Intellig. Memory Miscellaneous Front Optical Consumption Driver Lines Connector Isolation typ. Software
M77 Quad RS232/ 4 14950 256 bytes FIFO Physical interface 25-pin D-Sub Yes 200mA Windows, M-Module Mezzanine I/O p. 106 RS422/485 UART for all transmitters/ selectable by software VxWorks receivers M75 HDLC/SDLC 2 85C30- Quadruple 2 RS422 full-duplex or 2x 15-pin Yes 600mA Windows, Linux, p. 107 Controller compatible asynchronous 2 RS485 half-duplex; micro D-Sub QNX, OS-9, via FPGA FIFO memory synchronous/ VxWorks, RTX asynchronous M69N RS232 UART 4 1 UART FIFO Full duplex; 44-pin HD-Sub Yes 700mA Windows, Linux, p. 108 controller asynchronous VxWorks
M45N RS232 UART 8 2 UART FIFO Full duplex; 25-pin HD-Sub No 100mA Windows, Linux, p. 108 controllers asynchronous VxWorks
M17 Triple 3 MC68302/ 256KB DRAM, DMA, RS232, RS422, 25-pin D-Sub Prepared for 500V DC 250mA Windows, OS-9 p. 109 Communication 16MHz 0.5MB EPROM, RS485 via adapter, 1x isolation; depends on (w/o adapters) Controller 4KB FIFO X.21bis via adapter adapter type
Designed for: -40 to +85°C operation temperature, 103 shock, drop, bump, vibration, humidity, chemical resistance MEN M-Module Mezzanine I/O
M79 – Profibus DP Slave Interface
■ DIN19 ■ Isolated RS8 ■ Local 16-bit CPU ■ 1Mbits/s data transfer rate ■ Complete Softing Profibus software on board ■ Compatible with Softing tools
C16 CPU ■ Complete bus access protocol ■ Voltage between the connector shield and ■ 16-bit data bus, 20-bit address bus ■ Up to 127 active or passive stations isolated ground is limited to 180V using a ■ Complete Profibus DP software on one Miscellaneous varistor; AC coupling between connector M-Module™ ■ 1MB shared memory for communication shield and isolated ground through 47nF ■ Local interrupt controller and program capacitor ■ Hardware watchdog ■ Isolated RS485 Profibus interface ■ Supply voltage/power consumption: Slave: SPC Profibus Controller Peripheral Connections ■ +5V (4.85V..5.25V), 287mA ■ Up to 12Mbaud data rate ■ Via front panel on a shielded 9-pin D-Sub ■ MTBF: 860,000h @ 40°C (derived from ■ 8-bit interface (local) receptacle connector MIL-HDBK-217F) ■ Complete DP slave protocol M-Module™ Characteristics Mechanical Specifications Master: ASPC Profibus Controller ■ A08, D16, INTA, IDENT ■ Dimensions: conforming to M-Module™ ■ Optional, for M79 as Profibus Master Electrical Specifications Standard ■ Up to 12Mbaud data rate ■ Electrical isolation: 500V DC ■ Weight: 53g ■ 16-bit DMA interface (local) ■ 500V DC between isolated side and digital side
M65 – Intelligent Dual CAN Interface
■ Full CAN/Extended CAN ■ Two independent channels ■ Two local -bit CPUs ■ ISO high-speed coupling ■ 1Mbit/s data transfer rate ■ Optical isolation ■ CANopen master and slave support ■ Vector Informatik tools ■ Intelligent CAN Layer support
CAN Controllers Memory Electrical Specifications ■ I82527 ■ 1MB shared SRAM for communication and ■ Isolation voltage: 500V DC ■ Standard and extended frames program per channel ■ Supply voltage/power consumption: +5V ■ Up to 15 message objects Physical Interface (4.85V..5.25V), 470mA max. ■ Up to 1Mbit/s ■ ISO high speed coupling (optically isolated) (2 channels), 280mA (1 channel) ■ ISO 11898 high speed up to 1Mbit/s, both Peripheral Connections ■ MTBF: 40,000h @ 50°C (derived from channels optically isolated using DC/DC ■ Via front panel on a shielded 25-pin D-Sub MIL-HDBK-217F)
M-Module Mezzanine I/O converters receptacle connector Mechanical Specifications I/O Processors ■ Via carrier board (rear I/O) ■ Dimensions: conforming to M-Module™ ■ MC68331 M-Module™ Characteristics Standard ■ 32-bit CPU32 ■ A08, D16, INTA, IDENT ■ Weight: 84g ■ 24MHz
10 M79 M65 MEN M-Module Mezzanine I/O
M57 – Profibus DP Master Interface
■ Class 1/ Profibus DP master (DIN19) ■ Isolated RS8, RS (debug) interface ■ Local -bit CPU ■ Up to 17 active or passive stations ■ 1Mbit/s data transfer rate ■ 1MB DRAM ■ Complete Softing Profibus software on board ■ Compatible with PROFIBUS DP Configurator
MC681/16MHz CPU Peripheral Connections Environmental Specifications ■ CPU32 performance ■ Via front panel on a shielded 9-pin D-Sub ■ Temperature range (operation): ■ Complete Profibus DP software on receptacle connector ■ 0..+60°C one M-Module™ M-Module™ Characteristics ■ Industrial temperature range on request ■ Local interrupt controller ■ A08, A24, D16, INTA, IDENT ■ Airflow: min. 10m³/h ■ Hardware watchdog Electrical Specifications ■ Temperature range (storage): -40..+85°C ASPC Profibus Controller ■ Isolation voltage: 500V DC ■ Relative humidity range (operation): ■ Up to 12Mbaud data rate ■ Supply voltage/power consumption: +5V max. 95% non-condensing ■ 16-bit DMA interface (local) (4.85V..5.25V), 800mA typ. ■ Relative humidity range (storage): ■ Complete bus access protocol ■ MTBF: 45,000h @ 50°C (derived from max. 95% non-condensing ■ Up to 127 active or passive stations MIL-HDBK-217F) ■ Altitude: -300m to + 3,000m Miscellaneous Mechanical Specifications ■ Shock: 15g/11ms ■ 1MB shared memory for communication ■ Dimensions: conforming to M-Module™ ■ Bump: 10g/16ms and program Standard ■ Vibration (sinusoidal): 2g/10..150Hz ■ Fast M-Module™ interface with ■ Weight: 92g ■ Conformal coating on request autoincrement address mode ■ Status LEDs ■ Isolated Profibus interface M51 – Quadruple CAN Interface
■ SJA1000 CAN controllers ■ .0B Basic CAN/Extended CAN ■ ISO high-speed coupling ■ Optical isolation ■ CANopen support
Four SJA1000 CAN Controllers Peripheral Connections Environmental Specifications ■ CAN 2.0B functionality, Extended CAN ■ Via front panel on a shielded 25-pin D-Sub ■ Temperature range (operation): ■ Serial multi-master network with unlimited receptacle connector ■ 0..+60°C number of nodes ■ Via carrier board (rear I/O) ■ Industrial temperature range on request ■ Bus access priorities M-Module™ Characteristics ■ Airflow: min. 10m³/h ■ 29-bit message identifier ■ A08, D08, INTA, IDENT ■ Temperature range (storage): -40..+85°C ■ Powerful error handling capabilities Electrical Specifications ■ Relative humidity range (operation): ■ Programmable transfer rates up to 1Mbit/s ■ Isolation voltage: 500V DC max. 95% non-condensing ■ Bus length up to 40m at 1Mbit/s ■ Supply voltage/power consumption: +5V ■ Relative humidity range (storage): (ISO high speed) (4.85V..5.25V), 900mA typ. (with 4CAN contr.) max. 95% non-condensing ■ Guaranteed latency for highest-priority ■ MTBF: 45,000h @ 50°C (derived from ■ Altitude: -300m to + 3,000m objects MIL-HDBK-217F) ■ Shock: 15g/11ms ■ 0..8 bytes data block length Mechanical Specifications ■ Bump: 10g/16ms Physical Interface ■ Dimensions: conforming to M-Module™ ■ Vibration (sinusoidal): 2g/10..150Hz M-Module Mezzanine I/O ■ ISO high speed coupling (optically isolated) Standard ■ Conformal coating on request ■ Weight: 90g
M57 M51 10 MEN M-Module Mezzanine I/O
M77 – Quad RS232/RS422/RS485 UART
■ x 16C9 high-performance UARTs ■ 18 Bytes FIFO buffer ■ Serial data rates up to 1.1 Mbits/s ■ Software programmable ■ Full and half duplex on channels ■ 00VDC optical isolation ■ 180VDC isolation between channels
Quad RS/8/ Interface M-Module™ Characteristics ■ Altitude: -300m to + 3,000m ■ All 4 channels with 4 lines ■ Compliant with M-Module™ standard ■ Shock: 15g/11ms (no handshake lines) ■ A08, D08, INTA, IDENT ■ Bump: 10g/16ms ■ All 4 channels optically isolated from the Electrical Specifications ■ Vibration (sinusoidal): 2g/10..150Hz system and from each other ■ Isolation voltage: ■ Conformal coating on request OX16C9 Communication Engine ■ 500V DC between isolated side and Safety ■ Software-programmable serial data rates up digital side ■ PCB manufactured with a flammability rating to 1.152 Mbaud full duplex/half duplex ■ 180V DC between the channels of 94V-0 by UL recognized manufacturers on 4 channels ■ Voltage between the connector shield and EMC ■ 128 bytes of FIFO for each transmitter/ isolated ground is limited to 180V using a ■ Tested according to EN 55022 (radio distur- receiver varistor; AC coupling between connector bance), IEC1000-4-2 (ESD) and IEC1000-4-4 ■ Detection of bad data in receiver FIFO shield and isolated ground through 47nF (burst) with regard to CE conformity ■ Selectable arbitrary trigger levels for receiver capacitor and transmitter FIFO interrupts ■ Supply voltage/power consumption: +5V ■ Improved automatic flow control using selec (4.85V..5.25V), 200mA typ. table arbitrary thresholds ■ MTBF: 560,000h @ 40°C (derived from ■ Automated flow control using DSR#/DTR# MIL-HDBK-217F) ■ Independent software reset of each channel Mechanical Specifications ■ Readable FIFO filling levels ■ Dimensions: conforming to M-Module™ ■ Optional generation of RS485 buffer enable Standard signal ■ Weight: 67g ■ Transmitter and Receiver can be disabled Environmental Specifications ■ 5..8 bits per character plus parity ■ Temperature range (operation): ■ Parity mode: odd, even, no or forced ■ 0..+60°C or -40..+85°C ■ Stop bits: 1, 1.5 or 2 ■ Airflow: min. 10m³/h Peripheral Connections ■ Temperature range (storage): -40..+85°C ■ Via front panel on a shielded 25-pin D-Sub ■ Relative humidity range (operation): receptacle connector max. 95% non-condensing ■ Via carrier board (rear I/O) ■ Relative humidity range (storage): max. 95% non-condensing M-Module Mezzanine I/O
106 MEN M-Module Mezzanine I/O
M75 – Dual HDLC/SDLC Controller
■ full-duplex RS channels or ■ half-duplex RS8 channels ■ Mbits/s per channel ■ Synchronous/asynchronous ■ Industry-standard 8C0 ■ Optically isolated
Serial Communication Controller Electrical Specifications ■ Altitude: -300m to + 3,000m ■ 85C30-compatible via FPGA ■ Isolation voltage: ■ Shock: 15g/11ms ■ Two channels with data transfer rates up to ■ 180V DC between channel A and B ■ Bump: 10g/16ms 2Mbits/s full duplex per channel connectors ■ Vibration (sinusoidal): 2g/10..150Hz ■ 10 x 19-bit status FIFO ■ 500V DC to the system ■ Conformal coating on request ■ 14-bit byte counter ■ Voltage between the connector shield and Safety ■ HDLC/SDLC protocol isolated ground is limited to 180V using a ■ PCB manufactured with a flammability rating ■ Vector interrupt varistor; AC coupling between connector of 94V-0 by UL recognized manufacturers Quadruple Asynchronous FIFO shield and isolated ground through 47nF EMC Memory IDT70 capacitor ■ Tested according to EN 55022 (radio ■ 2kB depth each direction ■ Supply voltage/power consumption: +5V disturbance), IEC1000-4-2 (ESD) and ■ Asynchronous and simultaneous read (4.85V..5.25V), 600mA typ. IEC1000-4-4 (burst) with regard to CE and write ■ MTBF: 570,000h @ 40°C (derived from conformity Physical Interface MIL-HDBK-217F) ■ Front panel connectors: Mechanical Specifications ■ RS422 ■ Dimensions: conforming to M-Module™ ■ Optically isolated Standard ■ Rear I/O connector: ■ Weight: 82g ■ TTL Environmental Specifications ■ Not isolated ■ Temperature range (operation): Peripheral Connections ■ 0..+60°C ■ Via front panel on two shielded 15-pin micro ■ Industrial temperature range on request D-Sub plug connectors ■ Airflow: min. 10m³/h ■ Via carrier board (rear I/O) ■ Temperature range (storage): -40..+85°C M-Module™ Characteristics ■ Relative humidity (operation): ■ A08, D08, INTA, INTC, IDENT max. 95% non-condensing ■ Relative humidity (storage): max. 95% non-condensing M-Module Mezzanine I/O
107 MEN M-Module Mezzanine I/O
M69N – Quad RS232 Interface
■ intelligent RS interfaces ■ 1 UART controller ■ Asynchronous mode ■ Receivers / transmitters ■ Modem control lines ■ Receiver and transmitter FIFOs
RS Interfaces ■ Baud rate up to 115,200 baud ■ 2 with 4 lines (2 modem control lines) ■ Readable FIFO levels ■ 2 with 6 lines (4 modem control lines) ■ Automated in-band flow control using ■ All 4 channels optically isolated from programmable Xon/Xoff characters, ■ Transmitter and receiver can be disabled the system and from each other in both directions ■ Transmitter idle interrupt UART Controller ■ Automated out-of-band flow control using ■ Sleep mode (low operating current) ■ 4 independent full-duplex asynchronous CTS/RTS and/or DSR/DTR Peripheral Connections 16C950 high performance UART channels ■ Arbitrary trigger levels for receiver and ■ Via front panel on a shielded 25-pin D-Sub each transmitter FIFO interrupts receptacle connector ■ 128-byte FIFO for each transmitter and ■ Programmable special character detection ■ Via carrier board (rear I/O) receiver ■ 5-, 6-, 7-, 8- and 9-bits data framing M-Module™ Characteristics ■ UARTs fully software compatible with ■ Detection of bad data in receiver FIFO ■ A08, D08, INTA, IDENT industry standard 16C55x type UARTs ■ Independent channel reset by software Electrical Specifications ■ Isolation voltage: ■ 500V DC between isolated and digital side ■ 180V DC between the channels ■ Voltage between the connector shield and isolated ground is limited to 180V using a varistor; AC coupling between connector shield and isolated ground through 47nF capacitor ■ Supply voltage/power consumption: +5V (-3%/+5%), 200mA typ. ■ MTBF: tbd. @ 40°C Mechanical Specifications ■ Dimensions: conforming to M-Module™ Standard ■ Weight: 78g
M45N – Octal RS232 Interface
■ 8 intelligent RS interfaces ■ UART controllers ■ Asynchronous mode ■ Receivers / transmitters ■ Modem control lines
M-Module Mezzanine I/O ■ Receiver and transmitter FIFOs
8 RS Interfaces ■ Programmable special character detection Environmental Specifications ■ 6 with 4 lines (2 modem control lines) ■ 5-, 6-, 7-, 8- and 9-bits data framing ■ Temperature range (operation): ■ 2 with 6 lines (4 modem control lines) ■ Detection of bad data in receiver FIFO ■ -40..+85°C (screened) UART Controllers ■ Independent channel reset by software ■ Airflow: min. 10m³/h ■ 4 independent full-duplex asynchronous ■ Transmitter and receiver can be disabled ■ Temperature range (storage): -40..+85°C 16C950 high performance UART channels ■ Transmitter idle interrupt ■ Rel. humidity range (operation): max. 95% nc each ■ Sleep mode (low operating current) ■ Rel. humidity range (storage): max. 95% nc ■ 128-byte FIFO for each transmitter and Peripheral Connections ■ Altitude: -300m to + 3,000m receiver ■ Via front panel on a shielded 44-pin HD-Sub ■ Shock: 15g/11ms ■ UARTs fully software compatible with receptacle connectorVia carrier board ■ Bump: 10g/16ms industry standard 16C55x type UARTs (rear I/O) ■ Vibration (sinusoidal): 2g/10..150Hz ■ Baud rate up to 115,200 baud M-Module™ Characteristics ■ Conformal coating on request ■ Readable FIFO levels ■ A08, D16, INTA, IDENT Safety ■ Automated in-band flow control using Electrical Specifications ■ PCB manufactured with a flammability rating programmable Xon/Xoff characters, ■ Supply voltage/power consumption: of 94V-0 by UL recognized manufacturers in both directions +5V (-3%/+5%), 170 mA typ. EMC ■ Automated out-of-band flow control using ■ MTBF: tbd. @ 40°C ■ Tested according to EN 55022 CTS/RTS and/or DSR/DTR Mechanical Specifications (radio disturbance), IEC1000-4-2 (ESD) and ■ Arbitrary trigger levels for receiver and ■ Dimen.: conforming to M-Module™ Standard IEC1000-4-4 (burst) with regard to CE transmitter FIFO interrupts ■ Weight: 70g conformity 108 MEN M-Module Mezzanine I/O
M17 – Triple Intelligent RS232/RS422/RS485 UART
■ independent intelligent channels ■ RS or RS or RS8 (with SA-Adapter™) ■ Local -bit RISC CPU ■ RISC and DMA controller ■ MB Flash ■ MB SRAM
CPU ■ Hardware watchdog ■ Power consumption: ■ PowerPC® ■ RISC CPU for interfaces ■ M17 without adapter: 5V, 100mA typ. ■ MC68302 ■ Three independent full-duplex serial interface ■ AD03 without M17: +5V, 15mA; ±12V, ■ Up to 20MHz controllers ±30mA Interfaces Peripheral Connections ■ AD04 without M17: +5V, 260mA ■ RS232 or RS422 or RS485 ■ Via front panel on a shielded 25-pin D-Sub ■ AD28 without M17: 5V, 250mA Miscellaneous receptacle connector ■ Max. current output ±200mA, ±12V ■ 4KB bidirectional FIFO for interprocessor ■ Via carrier board (rear I/O) (only M17 with AD03) communication M-Module™ Characteristics ■ MTBF: 1,090,000h @ 40°C ■ Up to 2MB Flash ■ A08, D08, INTA, IDENT (derived from MIL-HDBK-217F) ■ EPROM with write protection for boot Electrical Specifications Mechanical Specifications software ■ Isolation voltage: prepared for 500V DC ■ Dimensions: conforming to M-Module™ ■ Up to 2MB SRAM isolation; depends on adapter type Standard ■ Local 6-channel DMA controller ■ Supply voltage: +5V (4.85V..5.25V) ■ Weight: 100g (without adapter); adapter: ■ Local interrupt controller approx. 15g Environmental Specifications ■ Temperature range (operation): ■ 0..+60°C or -40..+85°C ■ Airflow: min. 10m³/h ■ Temperature range (storage): -40..+85°C ■ Relative humidity range (operation): max. 95% non-condensing ■ Relative humidity range (storage): max. 95% non-condensing ■ Altitude: -300m to + 3,000m ■ Shock: 15g/11ms ■ Bump: 10g/16ms ■ Vibration (sinusoidal): 2g/10..150Hz ■ Conformal coating on request Safety ■ PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers EMC ■ Tested according to EN 55022 (radio M17 disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity M-Module Mezzanine I/O
M45N 109 110 Software MEN system supporting open standards, such as POSIX. It comes with elaborate features like an MMU-basedmemoryelaboratefeaturesanwith comeslike ItPOSIX. as standards,supporting systemsuchopen VxWorks Windows additional offers MEN Microsoft MontaVista system. complete the of analysis the for COGNITO and development based Eclipse Linux extensions and several ready-to-use templates. ELinOS v4.1 additionally offers SYSGOs CoTools CODEO for RTAIreal-timeextensions the Grade tools, Carrier graphical libraries, all migration includes Xenomai, Linux and PowerPC Intel MEN MEN's of All most Linux. with systems embedded for environment development integrated an is ELinOS based on MEN's ESM MEN's on based (PowerPC MPC5200/B an for released and tested is PikeOS platform. hardware same the on software non-critical and critical of use the enabling partitioning, software of the features of one is containment Fault co-exist. can partitions heterogeneous these of Several programs. application native or OSEK and POSIX Linux, as such system operating entire an run can PikeOS of partition software Each safety and mission critical systems as well as standard embedded systems for which hard real time is mandatory. The foundation of PikeOS is a powerful microkernel developed according to the highest safety standards for use in Radisys by MicrowareOS-9 QNX QNX others. among management, error enhanced an and protection Operating System Support System Operating ELinOS by SYSGO by ELinOS PikeOS – Partitionable Real-time operating system operating Real-time Partitionable – PikeOS system operating Real-time – OS-9 QNX VxWorks Microsoft MontaVista Software ® ® Neutrino is a reliable, fault tolerant, scalable and true microkernel operating system. operating microkernel true and scalable tolerant, fault reliable, a is Neutrino QNX by Neutrino ® ® Neutrino ® by WindRiver is supported on all MEN PowerPC Windows TM Linux is supported on some MEN PowerPC MEN some on supported is Linux ® ® – Real-time operating system operating Real-time – Windows ® ® TM boards come with complete board support packages for ELinOS. ELinOS Industrial Grade Industrial ELinOS ELinOS. for packages support board complete with come boards (NT, 2000, XP, XP Embedded) is supported on all MEN Intel MEN all (NT,on XP,supported 2000, is Embedded) XP ™ – Embedded Linux Embedded – Embedded System Modules. System Embedded ® is supported on a wide range of MEN PowerPC MEN of range wide a on supported is ® – Real-time operating system operating Real-time – ® is supported on some of MEN’sPowerPC of some on supported is ® driver packages to support all on-board features. on-board all support to packages driver ® ® ® platforms targeted for telecom applications. telecom for targeted platforms and x86 platforms.VxWorks ® ) and Pentium and ) ® platforms. ® and x86 platforms. x86 and ® III platform III ® platforms. In many cases many In platforms. ®
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MEN Software
MENMON™ 2nd Edition – Firmware/BIOS
■ CPU/board setup: Initialize the CPU and its peripherals TM ■ Load the FPGA code ■ PCI auto configuration ■ Perform self-test MON ■ Provide debug/diagnostic features ■ Diagnostics: POST, enhanced diagnostics for user and final production test ■ Boot operating system (from disk, Flash or network)
Architecture Disk Boot Methods Board Bring-up Features ® ® ■ PowerPC Nios (in preparation) ■ PReP partitions ■ Memory inspection/modification Software ■ DOS FAT 12/16 FS ■ PCI config header commands ROM Issues ■ PC BIOS Partition Table support ■ Assembler level debugger ■ Fallback MENMON™ code ■ CPU register commands ■ ROMable Other Boot Methods ■ Memory test (operation with only a few KB of memory) ■ Shared RAM (VME/CompactPCI®) ■ Firmware binary checksum protection Miscellaneous ■ Code size <= 512K Disk Device Support ■ Self-test features ■ ATA/IDE disks or CompactFlash® ■ Diagnostic testsP PCI ■ SCSI disks ■ C-like setup menu ■ PCI auto configuration ■ PC floppy disks ■ VxWorks® bootline support ■ System calls for bootstrappers Console Ethernet Device Support ■ Simple Boot scripts ■ Serial console ■ E100, E1000 ■ Parameter passing to OS ■ VGA / frame buffer ■ Tulip ■ SO-DIMM/SDRAM autodetection ■ PS/2 keyboard ■ MPC5200 ■ SDRAM ECC support ■ Telnet over Ethernet ■ Ethernet speed selection support ■ Watchdog support/triggering ■ HTTP over Ethernet, browser-controlled ■ I2C support Firmware Update Mechanism ■ RTC support Bootable OSes ■ Firmware can update itself ■ Linux ■ Via Modem protocol (YModem) ■ VxWorks® ■ Via network ■ QNX® ■ From disk ■ OS-9® ■ Custom images
Boot Image Formats ■ PPCBOOT (UBOOT) ■ ELF ■ RAW ■ PReP ■ Ethernet Boot Methods/IP Support ■ TFTP/FTP ■ Auto-IP through BOOTP/DHCP
111 MEN Software
MDIS4™ – MEN Driver Interface System
MDIS™ device drivers support: ■ Binary and analog I/O TM ■ Instrument functions ■ Motion controllers ■ Fieldbus controllers ■ Watchdogs, hardware monitors etc.
Typical hardware: ■ M-Modules™ DIS ■ PMC and PC-MIP® ■ Other PCI hardware ■ Components on CPU boards ■ FPGAs on CPU and I/O boards Basic API Functions Content of MDIS4™
Software ■ M_open System Package open path to device ■ MDIS4™ libraries required by the low-level ■ M_read drivers, including documentation read a single value from current channel ■ MDIS4™ libraries required by applications ■ M_write ■ All BBIS handlers supported by this operating write a single value to current channel system ■ M_get ■ MDIS4™ user guide blockread multiple values (data block) ■ Low-level driver installation tool, from device if necessary ■ M_setblock ■ Example BBIS handlers in source code write multiple values (data block) to device ■ Tools to access the MDIS™-API and to ■ M_getstat view debug messages, if necessary get parameter from device ■ M_setstat Content of MDIS4™ set parameter of device ■ Low-Level Driver Package ■ M_close ■ Low-level driver source code including close path to device a generic makefile ■ Example descriptors MDIS™ Functional Parts ■ Example programs and tools ■ Low level driver for device hardware ■ HTML and ASCII-text documentation handling ■ API library for easier driver access ■ Board handler for base board hardware (only some packages) handling ■ MDIS™/BBIS Kernels Management of the initialization and deinitialization sequences Routing of the API calls to the appropriate low-level driver and board handler calls
112 MEN Embedded Solutions A–Z
Products in Alphabetical Order
A12A 6U VMEbus MPC8245 SBC / PC-MIP®. 36 F9 3U CompactPCI® Pentium® M SBC...... 10 M70 Temperature Acquisition...... 91 A12B 6U VMEbus MPC8245 SBC / F11 3U CompactPCI®/PXI™ Pentium® III SBC..9 M72 Motion Counter...... 98 M-Module™...... 36 F12 3U CompactPCI® MPC5200 SBC...... 12 M75 Dual HDLC/SDLC Controller...... 107 A12C 6U VMEbus MPC8245 SBC / PMC...... 35 F13 3U CompactPCI® MPC8540 SBC...... 11 M76 Digital Multimeter...... 90 A13A 6U VME64 Pentium® III SBC / PC-MIP® 37 F14 3U CompactPCI®/Express Pentium® M M77 Quad RS232/RS422/RS485 UART...... 106 A13C 6U VME64 Pentium® III SBC / PMC.....37 SBC...... 7 M78 4-Channel Digital Oscilloscope...... 89 A14C 6U VME64 MPC8540 SBC / PMC...... 32 F15 3U CompactPCI®/Express Core Duo SBC.6 M79 Profibus DP Slave Interface...... 104 A15A 6U VME64 MPC8245 SBC / PC-MIP®..34 F203 3U CompactPCI®/PXI™ PC-MIP® M81 16 Binary Outputs...... 74 A15B 6U VME64 MPC8245 SBC / Carrier Board...... 17 M82 16 Binary Inputs...... 74 M-Module™...... 34 F204 3U CompactPCI®/PXI™ M-Module™ M97 Universal Counter...... 88 A15C 6U VME64 MPC8245 SBC / PMC...... 33 Carrier Board...... 16 MDIS4™ MEN Driver Interface System...... 112 A201S 6U VMEbus M-Module™ Carrier Board. 40 F205 3U CompactPCI®/PXI™ M-Module™ MENMON™ A203N 6U VME64 M-Module™ Carrier Board...40 Carrier Board...... 16 2nd Edition, Firmware/BIOS A302 6U VMEbus Card w. 128 Binary I/Os....39 F206 3U CompactPCI®Octal UART for for PowerPC® Boards...... 111 A405 6U VME64 Slave Processing SA-Adapters™...... 15 Board / PMC...... 38 F206I 3U CompactPCI®-ISA PC/104 Operating System Support...... 110 AD67 I/O Extension for A12...... 36 Carrier Board...... 15 AD67 I/O Extension for A15...... 38 F206N 3U CompactPCI® Nios®II Slave Board...14 P5 PC-MIP® Intelligent CAN Interface...... 69 AD67 I/O Extension for D3...... 23 F207 3U CompactPCI® PCI-104 P6 PC-MIP® Profibus DP Master...... 69 AD67 I/O Extension for SC13...... 46 Carrier Board...... 13 P10 PC-MIP® Quad RS232 UART...... 68 F301 3U CompactPCI® 9-Port Ethernet P11 PC-MIP® Quad RS422/485 UART...... 68 B11 3U VMEbus MPC8245 SBC / PC-MIP®. 30 Switch...... 13 P13 PC-MIP® 48-bit TTL I/O Interface...... 67 B202S 3U VMEbus M-Module™ Carrier Board.31 F600 3U CompactPCI® Side Card for P14 PC-MIP® FireWire Controller...... 67 Busless Single Board Computers...... 45 SATA/Legacy I/O...... 8 P15 PC-MIP® Non-volatile SRAM...... 66 F601 3U CompactPCI® Side Card P16 PC-MIP® Dual 100Base-T Ethernet...... 66 C203 Long-Card PCI M-Module™ for Multimedia...... 8 P18 PC-MIP® Frame Buffer Interface...... 65 Carrier Board...... 71 P518 PMC Frame Buffer Interface...... 65 C204 Short-Card PCI M-Module™ Human-Machine Interfaces P601 Quad Redundant Gigabit Carrier Board...... 71 Individual Solutions...... 47 Ethernet XMC...... 64 CPCI Rack 0701-0021 Power Supplies 8 Slots Single Eurocard...... 26 Kahlua Box for 19" systems 3U, 12HP, 8HP...... 42 CPCI Rack 0701-0030 Industrial Control System...... 48 PP1 PCI-104 Module with MPC5200/B...... 60 6 Slots Double Eurocard...... 27 PP4 PCI-104 Module with MVB Interface....61 CT1 RIO Module for D202...... 25 M8 IEC Bus Controller...... 97 CT2 RIO Module for D4...... 20 M11 16-bit TTL I/O Interface...... 79 SA-Adapters™ M16 4-Channel Data Acquisition...... 97 Serial Line Physics for MEN Boards...... 44 D3A 6U CompactPCI® MPC8245 SBC M17 Triple Intelligent SC13A 6U PowerPC® SBC with PC-MIPs®...... 46 PC-MIP®...... 23 RS232/RS422/RS485 UART...... 109 SC13B 6U PowerPC® SBC with M-Modules™..46 D3B 6U CompactPCI® MPC8245 SBC / M22 8 Binary Inputs/Outputs...... 78 SC13C 6U PowerPC® SBC with PMCs...... 46 M-Module™...... 23 M24 8/16 Binary Inputs...... 78 Slot-PCI Boards...... 71 D3C 6U CompactPCI® MPC8245 SBC / PMC.22 M27 16 Binary Outputs...... 77 Software...... 110 D4 6U CompactPCI® Pentium® 4 SBC...... 20 M28 16 Binary Outputs...... 77 D5C 6U CompactPCI® MPC8540 SBC / PMC.21 M31 16 Binary Inputs...... 76 UBox™ Rugged Embedded or D6 6U CompactPCI® Pentium® M M32 16 Binary Inputs...... 76 Panel Computer...... 49 Blade Server...... 18 M33 8 Analog Outputs...... 84 D202 6U CompactPCI® PXI™ PC-MIP® M35N 8/16 Analog Inputs, 14 Bits...... 81 VME64 Rack 0700-0012 – 8 Slots Carrier Board...... 25 M36 8/16 Analog Inputs...... 82 Double Eurocard...... 41
D203 6U CompactPCI®/PXI™ M-Module™ M37 4 Analog Outputs...... 85 Embed ded Solutions A–Z Carrier Board...... 25 M43 8 Relay Outputs...... 80 D302 6U CompactPCI® Card M45N Octal RS232 Interface...... 108 with 128 Binary I/Os...... 24 M47 SSI Controller...... 101 D601 Conduction-Cooled 6U CPCI M50 Synchro/Resolver Converter...... 100 Pentium® M SBC...... 19 M51 Quadruple CAN Interface...... 105 M54 DC Motor Controller...... 99 EM1A Rear I/O ESM™ with MPC5200B...... 52 M56 16-Channel Analog Multiplexer...... 96 EM1N ESM™ with MPC5200B...... 52 M57 Profibus DP Master Interface...... 105 EM2 ESM™ with Pentium® III...... 57 M59 4-Channel Data Acquisition...... 95 EM3 ESM™ with MPC8560...... 53 M58 32-bit TTL I/O Interface...... 79 EM3A Rear I/O ESM™ with MPC8560...... 53 M62 16 Analog Outputs...... 83 EM4N ESM™ with MPC8245...... 55 M63 32-/16-Bit Binary Data EM7 ESM™ with Pentium® III...... 56 Acquisition/Generation...... 94 EM8 ESM™ with MPC8540...... 54 M65 Intelligent Dual CAN Interface...... 104 EM8A Rear I/O on J3 ESM™ with MPC8540...54 M66 32 Binary Inputs/Outputs...... 75 ESM™ Starter Kits...... 51 M67 1-Channel Digital Oscilloscope...... 93 M68 4-Channel Function & Waveform Generator...... 92 M69N Quad RS232 Interface...... 108
113 Printed in Germany. All rights reserved. Germany.rights in All Printed Elektronik Mikro MEN © Copyright 2006. August Germany Elektronik is only possible after the user has precisely specified the operation environment and after MEN Mikro plants such in products MEN‘s of Application purposes. therapeutical for used appliances medical in Elektronik Mikro MEN of products The document. this in described products Elektronik Mikro MEN notice without herein products design. reliability,the or improve function to on changes make to right the reserves and products its of use Elektronik Mikro MEN inaccuracies. for assumed is responsibility however,no publication; of Information in this document has been carefully checked and is believed to be accurate as of the date holders. respective their of trademarks registered or trademarks are names product or brand All ■ ■ Industry). Electrical the of Services and Products for Delivery and Supply ■ +49-911-99335-161 under Germany in hotline ■ ■ ■ ■ Information Shipping and Ordering Embedded Solutions reliability and flexibility.and reliability innovation, maximizing while applications industrial demanding for solutions I/O and computing embedded provide to is mission Our Warranty on MEN products is 24 months. 24 is products MEN Warrantyon 200. USD or 100 EUR is value order Minimum of Conditions (General ZVEI to according insurance, excluding works, ex done is Shipment support our call or [email protected] to mail or websites our to refer please support technical For websites. our from download for ready are packages Software websites. our from download for ready are manuals user software and Hardware websites. MEN's on sheets data corresponding the to refer please numbers ordering product For ® has consequently adapted and released the product. the released and adapted consequently has System from WindRiver from System VxWorks VectorInformatik from Stack Protocol CANopen Solutions Real-Time Sysgo from Linux Embedded Softing from Stack Protocol Profibus Schroff from TechnologyRack 19“ QNX from System Operating QNX Freescale PowerPC Corporation Altera from Cores Processor Soft TechnologyNIOS FPGA and TechnologyPartners ® ® ® accepts no liability for consequential or incidental damages arising from the from arising damages incidental or consequential for liability no accepts Real-time os o asm ay iblt aiig u o te plcto o ue f the of use or application the of out arising liability any assume not does ® ® ™ Real-time Operating Real-time Processors from Processors ® Semiconductor ® ® are not suited for use in nuclear reactors and for application for and reactors nuclear in use for suited not are ®
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® Manufacturers Group Manufacturers Computer Industrial PCI Automation in CAN Consortium Embedded PC/104 Group User Profibus Alliance Standards Open PXI technologies mezzanine for group user international The of Member . ISO 9001:2000 ISO 14001:2005 ™ Systems Alliance Systems ZA de la Châtelaine la de ZA Cassin René rue 18, Elektronik Mikro MEN France www.men.de [email protected] 99335-901 911 (0) +49 Fax: 99335-0 911 (0) +49 Phone: Nürnberg 90411 5-7 Straße Neuwieder (Headquarters) Elektronik Mikro MEN Germany www.menmicro.com [email protected] 267-8803 (512) Fax: 267-8883 (512) Phone: Warminster,PA18974 VeteransCircle750 Inc. Micro, MEN USA www.men-france.fr [email protected] 211 955 450 (0) +33 Fax: 312 955 450 (0) +33 Phone: Gaillard 74240 ® ® SA GmbH
Product Overview 2006