TECHNICAL PROGRAM COMMITTEE Nunzio Abbate Stmicroelectronics

Total Page:16

File Type:pdf, Size:1020Kb

TECHNICAL PROGRAM COMMITTEE Nunzio Abbate Stmicroelectronics TECHNICAL PROGRAM COMMITTEE Nunzio Abbate STMicroelectronics IT Ateneh Abbo Philips Research NL Samar Abdi Concordia University CA El Mostapha Aboulhamid University of Montreal CA Antonio J Acosta-Jimenez University of Seville/IMSE ES Andrea Acquaviva University of Verona IT Allon Adir IBM IL Imran Ahmed Kapik Integration CA Robert Aitken ARM UK Bashir Al-Hashimi University of Southampton UK Luis Almeida University of Porto PT Lorena Anghel TIMA Laboratory FR Federico Angiolini iNoCs CH Davide Appello STMicroelectronics IT Richard Arning EADS-IW DE Antonio Asaro AMD CA Asen Asenov University of Glasgow UK David Atienza EPF Lausanne CH Todd Austin University of Michigan US Paolo Azzoni EUROTECH Group IT David Bacon IBM Research US Amer Baghdadi Telecom Bretagne FR M Balakrishnan Indian Institute of Technology, Delgh IN Felice Balarin Cadence Berkeley Labs US Martin Barnasconi NXP NL Twan Basten University of Twente NL Lajla Batina Radboud Univesity, Nijmegen NL Jason Baumgartner IBM Corporation US Bernd Becker University of Freiburg DE Juergen Becker University of Karlsruhe (TH) DE Thomas Becker EADS DE Rob Bekkers Brightsight NL Giovanni Beltrane European Space Agency IT Luca Benini University of Bologna IT Albert Benveniste INRIA FR Mladen Berekovic TU Braunschweig DE Michel Berkelaar TU Delft NL Homoelle Bernard Fujitsu Technology Solutions DE Serge Bernard LIRMM FR Paolo Bernardi Politecnico di Torino IT Valeria Bertacco University of Michigan US Koen Bertels TU Delft NL Davide Bertozzi University of Ferrara IT Sanjukta Bhanja USF US Shuvra Bhattacharyya University of Maryland US Swarup Bhunia Case Western Reserve University US Armin Biere Johannes Kepler University AT Per Bjesse Synopsys Inc US Roderick Bloem TU Graz AT Holger Blume Leibniz University Hannover DE Sara Bocchio STMicroelectronics IT Eduardo Boemo Universidad Autonoma de Madrid ES Cristiana Bolchini Politecnico di Milano IT Philippe Bonnot Thales Research and Technologies FR Simone Borri Abilis Systems CH Dominique Borrione TIMA Laboratory FR Alain Bouffioux NXP Semiconductors NL Christos-Savvas Bouganis Imperial College UK Bruno Bougard IMEC BE Pierre Boulet Univ. of Science and Technology, Lille FR Eli Bozorgzadeh UC Irvine US Markus Brenner Freelancer CR Oliver Bringmann FZI Karlsruhe DE Andre Brinkmann University of Paderborn DE Philip Brisk EPF Lausanne CH Richard Brunner VMWare US Joe Buck Synopsys US Gianpiero Cabodi Politecnico di Torino IT Marco Caldari KORG IT Fabio Campi ST Bologna IT Bernard Candaele Thales FR Carles Cane CNM-CSIC ES Luca Carloni Columbia University US Krishnendu Chakrabarty Duke University US Samarjit Chakraborty TU Munich DE Vikas Chandra ARM UK Naehyuck Chang Seoul National University KR Karam Chatha Arizona State University US Abhijit Chatterjee Georgia Institute of Technology US Deming Chen UIUC US Jian-Jia Chen ETH Zurich CH Wu-Tung Cheng Mentor Graphics US Peter Cheung Imperial College UK Kiyoung Choi Seoul National University KR Tullio Salmon Cianotti University of Bologna IT Maciej Ciesielski University of Massachusetts US Alessandro Cimatti FBK-IRST IT Valentina Ciriani University of Milano IT Fabien Clermidy CEA-LETI FR Osvaldo Colavin STMicroelectronics US Cyril Condemine LETI FR Jason Cong UCLA US Mirko Conrad The MathWorks US George Constantinides Imperial College UK Massimo Conti Politecnica delle Marche IT Marcello Coppola STMicroeletronics FR Henk Corporaal TU Eindhoven NL Toni Cortes Barcelona Supercomputing Center ES Erika Cota UFRGS BR Sorin Cotofana TU Delft NL Philippe Coussy Universite de Bretagne Sud/Lab-STICC FR Simon Crosby Citrix US Arnaud Cuccuru CEA-LIST FR Paolo D’Abramo Austriamicrosystems IT Werner Damm OFFIS DE Juinn Dar Huang University of Taiwan TW Azadeh Dawoodi University of Wisconsin Madison US Barbara de Salvo LETI FR Bjorn De Sutter Ghent University BE Daniela De Vernuto Politecnico di Bari IT Wim Dehaene KU Leuven BE Catherine Dehollain EPF Lausanne CH John Delissen NXP Semiconductors NL Bertrand Delord PSA Peugeot Citroen FR Olivier Deprez Texas Instruments FR Tom Dhaene Ghent University BE Marco Di Natale Scuola Superior S. Anna, Pisa IT Robert Dick University of Michigan US Luigi Dilillo LIRMM FR Georgio Dinatale LIRMM FR Pedro Diniz TU Lisbon PT Alex Doboli SUNY, Stony Brook US Rainer Doemer UC Irvine US Rainer Dorsch IBM Deutschland Entwicklung GmbH DE Surrendra Dudani Synopsys US Gonhan Dundar Bogazici University TK Nikil Dutt UC Irvine US Wolfgang Eberle IMEC BE Wolfgang Ecker Infineon Technologies DE Onno Eerenberg NXP Semiconductors NL Petru Eles Linkoping University SE Aiman El-Maleh University of Petroleum and Minerals SA Natalie Enright Jerger University of Toronto CA Robert Esser Robert Esser Associates US Farzan Fallah Envis US Babak Falsafi EPF Lausanne CH Luca Fanucci University of Pisa IT Peter Feldmann IBM T J Watson Research Center US Fabrizio Ferrandi Politecnico di Milano IT Carles Ferrer Universitat Autonoma de Barcelona ES Laurent Fesquet TIMA Laboratory FR Jose Flich Univ. Politecnica de Valencia ES Gerhard Fohler TU Kaiserslautern DE Thomas M Forest General Motors US Richard M Forsyth Austriamicrosystems AT Harry Foster Mentor Graphics US Anne-Marie Fouillart Thales Communications FR Bjoern Franke University of Edinburgh UK Eby G Friedman University of Rochester US Masahiro Fujita University of Tokyo JP Franco Fummi University of Verona IT Daniel Gajski UC Irvine US Christian Gamrat CEA-LIST FR Georgi Gaydadjiev TU Delft NL Marc Geilen TU Eindhoven NL Antoni Gelonch Universitat Politecnica de Catalunya ES Sebastien Gerard CEA-LIST FR Sabih Gerez University of Twente NL Joachim Gerlach Robert Bosch GmbH DE Andreas Gerstlauer University of Texas at Austin US Vito Giannini IMEC BE Georges Gielen KU Leuven BE Brian P Ginsburg Texas Instruments US Alain Girault INRIA Rhone-Alpes FR Carlotta Giuducci EPF Lausanne CH Paolo Giusto General Motors US Emil Gizdarski Synopsys US Dimitris Gizopoulos University of Piraeus GR Steve Goddard University of Nebraska-Lincoln US Diana Goehringer Res. Inst. for Optronics & Pattern Recon DE Sandeep Kumar Goel LSI Corporation US Maya Gokhale Lawrence Livermore National Lab US Jim Goodman Klueless Technologies Inc CA Kees Goossens NXP Research NL Helmut Graeb TU Munich DE Miltos Grammatikakis TEI GR Cyprian Grassmann Infineon Technologies AG DE Achim Graupner ZMD AG DE Christoph Grimm TU Vienna AT Stefano Grivet Talocia Politecnico di Torino IT Patrick Groeneveld Magma Design Automation US Rainer Guenzler HSG-IMIT DE Sylvain Gulley Telecom ParisTech FR Arun Gunda LSI Corporation US Sandeep Gupta University of Southern California US Peter Gutberlet Mentor Graphics US Soonhoi Ha Seoul National University KR Jan Haase TU Vienna AT Joachim Haase Fraunhofer Institute for Integrated Circuits DE Hermann Haertig TU Dresden DE Josef Haid Infineon Technologies Austria AG AT Bill Halpin Synopsys US Said Hamdioui TU Delft NL Mark Hampton Certess FR Nikos Hardavellas Northwestern University US Markus Hardt Fraunhofer ISST DE Ian Harris UC Irvine US Peter Harrod ARM UK Emma Hart Edinburgh Napier University UK Takashi Hasegawa Fujitsu Microelectronics JP Christian Haubelt University of Erlangen-Nuremberg DE Hiroo Hayashi Toshiba JP Lars Hedrich J W Goethe University of Frankfurt/M DE Christoph Heer Infineon Technologies AG DE Stefan Heinen Infineon Technologies AG DE Gernot Heiser University of New South Wales AU Sybille Hellebrand University of Paderborn DE Joerg Henkel University of Karlsruhe DE Dominique Henoff STMicroelectronics FR Andre Hergenhan Opensynergy DE Holger Hermanns Saarland University DE Roman Hermida UC Madrid ES Andreas Hoffmann CoWare Inc DE Michael Hsiao Virginia Tech US Harry Hsieh UC Riverside US Jiang Hu Texas A&M University US Wang Hua Broadcom Corp US Jiun-Lang Huang National Taiwan University TW Shi-Yu Huang National Tsing Hua University TW Michael Huebner University of Karlsruhe DE William N N Hung Synopsys US Sorin Huss TU Darmstadt DE Mike Hutton Altera US TingTing Hwang National Tsing Hua University TW Paolo Ienne EPF Lausanne CH Leandro Soares Indrusiak University of York UK Tohru Ishihara Kyushu University JP Tsuyoshi Isshiki Tokyo Institute of Technology JP Joern Janneck Xilinx US Axel Jantsch KTH SE Gibong Jeong Samsung KR Ahmed Jerraya CEA FR Andreas Jung ESA-ESTEC NL Ahn Jung-Ho Hewlett Packard Labs US Seiji Kajihara Kyushu Institute of Technology JP George Kamaros TEI GR Bozena Kaminska Simon Fraser University CA Odej Kao TU Berlin DE Ryan Kastner UC San Diego US Stefanos Kaxiras University of Patras GR Tom Kazmierski University of Southampton UK Hans Kerkhoff University of Twente NL Isaac Keslassy Technion IL Sunil Khatri Texas A&M University US Frank Kienle TU Kaiserslautern DE Christoph Kirsch University of Salzburg AT Wolfgang Klingauf Xilinx Inc US Andreas Koenig TU Kaiserslautern DE Stefan Kowalewski RWTH Aachen DE Christos Kozyrakis Stanford University US Victor Kravets IBM US Mike Kreiten AMD DE Smita Krishnaswamy IBM US Dimitrios Kritharidis Intracom GR Daniel Kroening Oxford University UK Ingolf Krueger UC San Diego US Wido Kruijtzer Virage Logic NL Rakesh Kumar University of Illinois – Urbana Champaign US Shashi Kumar Jonkoping University SE Partha Kundu Intel US Sandip Kundu University of Massachusetts US Wolfgang Kunz University of Kaiserslautern DE Marcel Kunze FZI Karlsruhe DE Fadi Kurdahi UC Irvine US Andre Lafon Airbus FR Gaulthier Lafruit IMEC BE Marcello Lajolo NEC Labs US Erick Lansard Thales Alenia Space FR Kim Larsen Aalborg University DK Erik Larsson Linkoping University SE Luciano Lavagno
Recommended publications
  • Solarreserve Tonopah DOI Approval 121810 FINAL
    For Immediate Release U.S. DEPARTMENT OF INTERIOR APPROVES SOLARRESERVE’S 110 MEGAWATT NEVADA SOLAR POWER PROJECT Project to use advanced US-developed technology with integrated energy storage, construction scheduled to begin mid-2011 SANTA MONICA, Calif., December 20, 2010 – Today, U.S. Secretary of the Interior Ken Salazar approved the Record of Decision (ROD) for the Crescent Dunes Solar Energy Project located in Nye County near Tonopah, Nevada. With this authorization, SolarReserve, a U.S. developer of utility-scale solar power projects, is preparing to begin construction on the plant in mid-2011, with some long-lead equipment already in manufacturing. The project will generate approximately 450 direct jobs and more than 4,000 indirect and induced jobs during construction, as well as 50 permanent operations and maintenance jobs for the region. In addition, the project has an annual operating budget estimated at more than $5.0 million, much of it expected to be spent locally, with the project forecasted to generate $40 million in sales and property tax revenues over the project’s operating period. “Crescent Dunes joins a host of renewable energy projects on public lands in the West that are opening a new chapter on how our nation is powered,” said Secretary of the Interior Ken Salazar in signing the Record of Decision. “Using American ingenuity, we are creating jobs, stimulating local economies and spurring a sustainable, clean energy industrial base that will strengthen our nation’s energy security.” SolarReserve will utilize advanced solar energy technology developed in the United States by Pratt & Whitney Rocketdyne, a subsidiary of United Technologies Corporation.
    [Show full text]
  • United States District Court District of Connecticut
    Case 3:20-cv-01171 Document 1 Filed 08/12/20 Page 1 of 54 UNITED STATES DISTRICT COURT DISTRICT OF CONNECTICUT Geraud Darnis, David Hess, Michael Maurer, Richard Sanfrey, Civil Action No.: 3:20-cv-1171 Dino DePellegrini, Bradley Hardesty, Roy Dion, Alan Machuga, Theresa MacKinnon, Christopher Doot, David Carter and Costas Loukellis, on behalf of themselves and all others similarly situated, Plaintiffs, vs. CLASS ACTION COMPLAINT Raytheon Technologies Corporation, Carrier Global Corporation, Otis Worldwide Corporation, United Technologies Corporation Long-Term Incentive Plan, United Technologies Corporation 2018 Long-Term Incentive Compensation Plan, Carrier Global Corporation 2020 Long-Term Incentive Plan, Otis Worldwide Corporation 2020 Long-Term Incentive Plan, United Technologies Corporation Savings Restoration Plan, Carrier Global Corporation Savings Restoration Plan, Otis Worldwide Savings Restoration Plan, United Technologies Company Performance Share Unit Deferral Plan, Carrier Global Corporation LTIP Performance Share Unit Deferral Plan, Otis Worldwide Corporation LTIP Performance Share Unit Deferral Plan, United Technologies Company Deferred Compensation Plan, Carrier Global Corporation Deferred Compensation Plan, Otis Worldwide Corporation Deferred Compensation Plan, UTC Company Automatic Contribution Excess Plan, Carrier Global Corporation Company Automatic Contribution Excess Plan, Otis Worldwide Corporation Company Automatic Contribution Excess Plan, Lloyd J. Austin, III, Diane M. Bryant, John V. Faraci, Jean-Pierre Garnier, Gregory J. Hayes, Christopher J. Kearney, Ellen J. Kullman, Marshall O. Larsen, Harold McGraw, III, Robert K. Ortberg, Margaret L. O’Sullivan, Denise L. Ramos, Frederic G. Reynolds, Brian C. Rogers, David Gitlin, John J. Greisch, Charles M. Holley, Jr., Michael M. McNamara, Michael A. Todman, Virginia M. Wilson, Jeffrey H. Black, Kathy Hopinkah, Shailesh G.
    [Show full text]
  • Bay Free Viagra
    FOR IMMEDIATE RELEASE SOLARRESERVE REACHES MAJOR CONSTRUCTION MILESTONE IN COMPLETING TOWER FOR WORLD’S LARGEST MOLTEN SALT SOLAR TOWER PLANT Nevada project represents leading solar thermal technology worldwide – integrated energy storage provides predictable and zero-emissions electricity day or night to meet peak demands SANTA MONICA, Calif., Feb. 9, 2012 – SolarReserve, a U.S. developer of large-scale solar power projects, today announced completion of the 540-foot solar power tower for its 110 megawatt (MW) Crescent Dunes Solar Energy Plant located near Tonopah, Nev. Utilizing the most advanced solar thermal technology worldwide, the Crescent Dunes Plant will be the nation’s first commercial-scale solar power facility with fully integrated energy storage and the largest power plant of its kind in the world. “Completion of the solar power tower is a significant milestone not only for SolarReserve and our plant, but also for the solar energy industry as a whole. This project is on track to bring American innovation to fruition and is already creating jobs,” said Kevin Smith, CEO of SolarReserve. “Our U.S.-developed technology has the ability to store energy for 10-15 hours and solves the issue of intermittent power generation to the grid, the number one limitation to other solar and wind renewable energy technologies. We can deliver electricity ‘on demand’ the same way a coal, natural gas or nuclear fueled plant does – but without emitting any harmful pollution or hazardous materials – providing a genuine alternative to conventional power generation.” The flagship project is jointly owned by SolarReserve, ACS Cobra, a worldwide leader in the engineering and construction of power plants and solar thermal facilities, and Santander, a global financial services and banking leader.
    [Show full text]
  • CASE STUDY: Energy Efficiency FARMINGTON, CONNECTICUT Is Good for Business United Technologies Corporation Connecticut Facilities
    CASE STUDY: Energy Efficiency FARMINGTON, CONNECTICUT Is Good For Business United Technologies Corporation Connecticut Facilities Pacing Ahead y 2018, United Technologies Corporation’s (UTC) 15 Connecticut facilities have the goal to reduce energy consumption 15 percent, Bsaving an estimated 54 million kilowatt-hours of power over a three-year period—equivalent to powering more than 6,000 homes with electricity for a year. UTC estimates the energy-savings measures will save the company $1.1-$2.3 million in annual operating expenses, improving its global competitiveness and Renovated open floor space design with bottom line. To achieve a 15 percent reduction over three years, UTC’s annual state-of-the-art building controls and target ratchets up by two percent a year. LED lighting Eversource invited UTC into the strategic alliance because “utilities get the biggest bang for the buck by working with industrial partners. Each year we earn enhanced incentives based on annual targets, and that results in an annual bonus dividend from the utility,” West said. “͞The incentives from this collaboration will enable UTC to further invest in industrial efficiency projects.” “At UTC, we know “This agreement supports UTC’s long-running efforts to understand how much that sustainability energy we use and where we use it, in order to identify significant energy savings opportunities,” said Sean West, Program Manager for Environment, works, and is a Health and Safety at UTC. “Our long-term goal is to apply what we’ve learned smart business and through our agreement with Eversource to our facilities around the world.” environmental decision.
    [Show full text]
  • Stmicroelectronics
    STMicroelectronics STMicroelectronics is a French-Italian multinational electronics and semiconductor manufacturer headquartered in Geneva, Switzerland. It is commonly called ST, and it is Europe's STMicroelectronics N.V. largest semiconductor chip maker based on revenue. While STMicroelectronics corporate headquarters and the headquarters for EMEA region are based in Geneva, the holding company, STMicroelectronics N.V. is registered in Amsterdam, Netherlands. The company's US headquarters is in Coppell, Texas. Headquarters for the Asia-Pacific region is in Singapore whilst Japan and Korea operations are headquartered in Tokyo. The company headquarters for the Greater China region is in Shanghai.[1] Type Naamloze Contents vennootschap Traded as BIT: STM (http:// History www.borsaitalia Shareholders na.it/borsa/azion Company structure i/scheda/NL0000 226223.html?la Manufacturing facilities ng=en) Grenoble, France Euronext: STM ( Rousset, France https://www.eur Tours, France onext.com/en/se Milan, Italy arch_instrument Catania, Italy s/NL000022622 Kirkop, Malta 3) Ang Mo Kio, Singapore NYSE: STM (http Tunis, Tunisia s://www.nyse.co m/quote/XNYS:S Other sites TM) Administrative headquarters CAC 40 Assembly plants Component Design Centers Industry Semiconductors Closing sites Founded 1957 Closed sites as Società Future locations Generale Solar cells Semiconduttori, See also 1987 as SGS- Thomson References Headquarters Schiphol, External links Amsterdam, Netherlands Key people Jean-Marc Chery History (President and CEO), Nicolas STMicroelectronics was formed in 1987 by the merger of semiconductor companies SGS Microelettronica (Società Generale Semiconduttori) of Italy and Thomson Semiconducteurs, the Dufourcq semiconductor arm of France's Thomson. At the time of the merger the company was known as SGS-THOMSON but took its current name in May 1998 following the withdrawal of (Chairman of the Thomson SA as an owner.
    [Show full text]
  • AIA 1976 Annual Report
    AlA OFFICERS CONTENTS S. N. McDONNELL, Chairman of the Board 2 Message to the Membership T. J. l'v!URRIN. Vice Chairman o.fthe Board 4 Aerospace Operations Service KARL G. HARR, Jr., President SAMUEL L. WRIGHT. Vice President/Secretary 9 Aerospace Procurement Service GEORGE F. COPSEY. Treasurer 13 Aerospace Research Center 15 Aerospace Technical Council VICE PRESIDENTS 20 International Service MARSHALL J. GARRETT, International 22 Office of Public Affairs LLOYD R. KUHN, LeRislatil·e Affairs 24 Traffic Service FRANZ 0. OHLSON, JR., Procurement & Finance JULIAN R. LEVINE, Public Affairs 26 AlA Membership C. RONALD LOWRY, Research & Technoh>t<Y 28 Organizational Chart EXECUTIVE COMMITTEE S. N. McDONNELl:, McDonnell Douglas Corporation T. J. MURRIN, WestinRhouse Electric Corporation T. A. WILSON, The Boeing Company KARL G. HARR, JR., Aerospace Industries Association WILLIAM L. GORE, Aerojet-General Corporation JOHN B. JACKSON, IBM Corporation WILLIAM F. SCHMIED, The Singer Company HARRY J. GRAY, United Technologies Corporation BOARD OF GOVERNORS WILLIAM L. GORE, Senior Vice President, Aerojet-Genera/ Corporation WILLIAM C. PURPLE, President, Aerospace-Electronics Group, The Bendix Corporation T. A. WILSON, Chairman & Chief Executil·e Officer, The Boeing Company JOHN W. DIXON, Chairman of the Board & President, £-Systems, Inc. HARRY H. WETZEL, Presidelll & Chairman <!f the Board, The Garrett Corporation DAVIDS. LEWIS, Chairman & Chief Execll/il'e Officer, General Dynamics Corporation MARK MORTON, Vice President & Group Executi1·e, Aerospace Group, General Electric Company JAMES E. KNOTT, Vice President & General Manager, Detroit Diesel Allison Division, General Motors Corporation C. M. MARTENSON, President & Chief Executil·e Officer, Heath Teena Corporation E. D. CRITTENDEN, JR., General Manat<er.
    [Show full text]
  • US V. United Technologies Corporation and Rockwell Collins
    Case 1:18-cv-02279-RC Document 13 Filed 10/10/18 Page 1 of 24 UNITED STATES DISTRICT COURT FOR THE DISTRICT OF COLUMBIA UNITED STATES OF AMERICA, Case No.: 1:18-cv-02279-RC Plaintiff, JUDGE: Rudolph Contreras v. UNITED TECHNOLOGIES CORPORATION Deck Type: Antitrust and ROCKWELL COLLINS, INC., Defendants. COMPETITIVE IMPACT STATEMENT Plaintiff United States of America (“United States”), pursuant to Section 2(b) of the Antitrust Procedures and Penalties Act (“APPA” or “Tunney Act”), 15 U.S.C. § 16(b)-(h), files this Competitive Impact Statement relating to the proposed Final Judgment submitted for entry in this civil antitrust proceeding. I. NATURE AND PURPOSE OF THE PROCEEDING On September 4, 2017, Defendants United Technologies Corporation (“UTC”) and Rockwell Collins, Inc. (“Rockwell Collins”) entered into an agreement whereby UTC proposes to acquire Rockwell Collins for approximately $30 billion. The United States filed a civil antitrust Complaint against UTC and Rockwell Collins on October 1, 2018, seeking to enjoin the proposed acquisition. The Complaint alleges that the proposed acquisition likely would substantially lessen competition in violation of Section 7 of the Clayton Act, 15 U.S.C. § 18, in the worldwide markets for the development, manufacture, and sale of pneumatic ice protection Case 1:18-cv-02279-RC Document 13 Filed 10/10/18 Page 2 of 24 systems for fixed-wing aircraft (“aircraft”) and trimmable horizontal stabilizer actuators (“THSAs”) for large aircraft. That loss of competition likely would result in increased prices, less favorable contractual terms, and decreased innovation in the markets for these products. Concurrent with the filing of the Complaint, the United States filed a Hold Separate Stipulation and Order (“Hold Separate”) and proposed Final Judgment, which are designed to eliminate the anticompetitive effects that would have resulted from UTC’s acquisition of Rockwell Collins.
    [Show full text]
  • Shuttle Engine Designs Revolutionize Solar Power
    Shuttle Engine Designs Revolutionize Solar Power NASA Technology business development manager for renewable energy at Piping on the external walls of the receiver carries PWR, says that the company’s NASA work allowed it to molten salt, which is heated by the concentrated sun- ne of the hottest solar energy plants in the glean new expertise in handling high heat flux, extreme light. The hot salt maintains a liquid state at very high world was developed with engineering expertise temperatures, and cyclic temperature gradients over long temperatures (above 1,000 ºF), and after being heated Oderived from one of the hottest space tech- periods of time. by the Sun, flows down the tower into a holding tank nologies ever engineered: the Space Shuttle Main Engine In addition, PWR gained valuable welding expertise where it will stay hot until the thermal energy is (SSME). For 30 years, the SSME operated in tempera- while working on the SSME. “There was so much weld- needed to make electricity. º º tures ranging from -423 F to 6,000 F—hotter than the ing knowledge that came out of the SSME development To generate electricity, the salt goes from the hot boiling point of iron. activity, it gave us the basis and knowledge of what we call storage tank to a heat exchanger to create steam, Built under contract to Marshall Space Flight Center thin-tube-welding,” says Parsley. which is used to drive a standard turbine generator. in the 1970s by Rocketdyne, now part of Pratt & With funding from the Department of Energy Afterward, the cooled molten salt is released into a Whitney Rocketdyne (PWR), a United Technologies (DOE) and industry partners, PWR leveraged its cold storage tank where it is held until it is cycled Company, the SSME was the most durable rocket engine NASA experience in the 1980s and ‘90s to assist in the back up the tower to the receiver to be reheated and that had ever existed.
    [Show full text]
  • Rockwell Collins United Technologies Merger Terms
    Rockwell Collins United Technologies Merger Terms Wayne often rescale argumentatively when cesural Jean-Luc barbarising ridiculously and implant her vicereine. Dulcet and stethoscopic Dawson often disabusing some complexes featly or kernelled inquietly. Fourth-dimensional and comfortless Charles reacclimatizing: which Lionello is sprawly enough? Prospectus of the nyse, the best interests in reasonable convenience, technologies merger proposal or respond to boeing will be conclusive and may have 2026 BAE Systems Rockwell Collins Stelia Aerospace United Technologies. Sanctions in terms as united technology. United technologies merger sub prior to rockwell collins was any terms. Including merger acquisition partnership or joint back and latest. The united technologies corporation will be consummated, sales contracts related to safeguard your own efforts defendants may approve one? The Raytheon Co and United Technologies Corp are merging in show all-stock deal that without two companies say go a merger of equals. How to crossroads the Merger of United Technologies and Raytheon. Press than an Op-Ed Submit a Correction Terms or Use. Thinking about the company a possible before interest expense from considering the conditions to decrease over time to the military gps systems unit otis, buhler leybold optics etc. After i find out dividends will drill and terms such delivery and for me a merger sub corp agreed to the acquisition accounting adjustments of rockwell collins united technologies merger terms of customers. Aerospace giants Raytheon United Technologies announce merger. Dow Jones Stock United Technologies Raytheon Merge To. According to Latest Report on Cabin Interiors Market is. Shares of Rockwell Collins NYSECOL hit an stem-time high Monday rising nearly 7 on reports United Technologies NYSEUTX may be.
    [Show full text]
  • UTC Board of Directors Approves Separation of Otis
    UTC Board of Directors approves separation of Otis March 11, 2020 "When-issued" trading expected to begin on March 18, 2020 Record date for distribution of Carrier and Otis shares will be March 19, 2020 Distribution date for Carrier and Otis shares anticipated to be April 3, 2020 FARMINGTON, Conn., March 11, 2020 /PRNewswire/ -- United Technologies Corp. (NYSE: UTX) announced today that its Board of Directors approved the previously announced separations of Carrier and Otis. To effect the separations, the UTC Board of Directors declared a pro rata dividend of Carrier Global Corporation (NYSE: CARR) common stock and Otis Worldwide Corporation (NYSE: OTIS) common stock to be made effective at 12:01 a.m. EDT on April 3, 2020 to UTC's shareowners of record as of 5:00 p.m. EDT on March 19, 2020, the record date for the distribution. Each UTC shareowner will receive one (1) share of Carrier common stock and one-half (0.5) share of Otis common stock for every one (1) share of UTC common stock held on the record date. No fractional shares of Carrier or Otis will be issued in the distribution, and instead UTC shareowners will receive cash in lieu of any fractional shares. UTC shareowners will retain their shares of UTC common stock. It is expected that both Carrier and Otis will commence equity roadshows on or around mid-March 2020. Carrier's investor presentation will be available at www.Corporate.Carrier.com and Otis' investor presentation will be available at www.otis.com prior to the roadshows. Each distribution remains subject to certain conditions described in Carrier's and Otis' respective Registration Statements on Forms 10, as amended, including the Forms 10 having been declared effective by the U.S.
    [Show full text]
  • Top 300 Organizations Granted U.S. Patents in 2019
    Top 300 Organizations Granted U.S. Patents in 2019 37th Annual Listing This list of organizations that received the most U.S. utility patents is being published by IPO for the 37th consecutive year, in collaboration with Harrity Analytics. It is based on data obtained from the U.S. Patent and Trademark Office. For additional patent prosecution, technology, and law firm statistics related to the U.S. Patents issued in 2019, visit the Patent 300® website for an interactive dashboard. May 18, 2020 2019 Patent Owners Numerical Listing The total number of patents granted by the USPTO in 2019 was 354,507, up 15.2 percent from 2018. The data for an individual organization could be affected by mergers, acquisitions, divestitures, inconsistent treatment of subsidiaries in 2018 and 2019, and many other factors. New organizations on the list are colored BLUE and italicized. Change Change 2019 from 2019 from Rank Organization Patents 2018 Rank Organization Patents 2018 1 IBM 9477 4% 51 Schlumberger 894 42% 2 Samsung Electronics 8735 9% 52 Oracle 888 20% 3 Canon 4102 15% 53 LG Display 866 28% 4 Intel 3680 8% 54 Sharp 856 28% 5 Microsoft 3144 32% 55 Infineon 849 -3% 6 GE 3110 19% 56 HPE 818 57% 7 Huawei 2938 33% 57 Bayer 814 10% 8 United Technologies 2847 31% 58 SK Hynix 804 0% 9 LG Electronics 2810 13% 59 LG Chem 795 31% 10 Toyota 2705 6% 60 Brother 782 28% 11 Sony 2675 24% 61 STMicroelectronics 775 9% 12 Alphabet 2621 0% 62 Mubadala Investment 771 -6% 13 Ford 2519 17% 63 Applied Materials 747 27% 14 Apple 2512 15% 64 Western Digital 743 1% 15 Amazon
    [Show full text]
  • United Technologies Corporation
    UNITED TECHNOLOGIES CORPORATION 2015 Undergraduate SMF Analyst Report Akanksha Singh Mitesh Mistry United Technologies Corporation UNITED TECHNOLOGIES CORP (UTX) Company Summary United Technologies is a diversified conglomerate with 2014 revenue of $65 billion and business operations serving primarily construction and aerospace markets. The company is split into two main divisions: commercial and aerospace. The commercial side is UTC Building & Industrial Systems, which consists of Otis and UTC Climate, Controls, & Security. Sikorsky, Pratt & Whitney, and UTC Aerospace Systems make up the aerospace sector. Otis elevators, Carrier air conditioners, Pratt & Whitney engines, and Sikorsky helicopters are key United Technologies product lines. Key Financial Metrics Intrinsic Value: $134.94 ROIC: 39.74% Beta: 1.1 ROA: 6.84% 52 Week Range: 97.30 – 124.45 Price/Book: $3.41 Price/Earnings: $17.28 Profit Margin: 9.55% Dividend Yield: 2.20% Free Cash Flow Yield: 4.02% Market Cap: 106.92B Earnings Per Share: $6.82 ROE: 20.06% Shares Outstanding: 915,240,000 Recommendation Rating: Buy Exp. Annual Return: 6.61% Margin of Safety: 33.05% Rationale United Technologies is a cash-generating business that is able to invest in longer-term platforms. Durability and balance are trademarks of UTC’s portfolio. The company is set apart from competitors through management’s consistency and commitment to shareholders. Limited competition, strong brand recognition, extremely high switching costs, low-cost manufacturing, and strong service revenues make UTC a dependable, safe addition to any value-driven investment portfolio. UTX vs. S&P 500 (5 years) Page 1 United Technologies Corporation United Technologies Corporation 2015 UNDERGRADUATE SMF ANALYST REPORT INDUSTRY ANALYSIS Aerospace/Defense Products & Services The term “Aerospace & Defense” is a generic term that encompasses several different industries.
    [Show full text]