Rambus Buys Into CXL Interconnect Ecosystem with Two New Deals June 17 2021
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Summit™ M5x Protocol Analyzer / Jammer for PCI Express® 5.0
Summit™ M5x Protocol Analyzer / Jammer for PCI Express® 5.0 The Summit M5x is Teledyne LeCroy’s highest performance PCI Express analyzer, Key Features offering both inline probing and direct tapping approaches to protocol capture - the best in overall diversity in probing methods. Find errors fast • One button error check Inline operation provides advanced features such as: real-time error injection (jammer) • Fast upload speed for PCI Express 4.0 specification; support for data rates of 2.5 GT/s, 5.0 GT/s, 8.0 • Large trace memory GT/s, and 16.0 GT/s; full data capture on bidirectional link widths of x1, x2, x4, x8 and • Powerful triggering/filtering x16 for up to 16 GT/s; and up to 128GB of trace memory. See and understand the traffic ® • Get useful information Direct tapping operation supports PCIe 5.0 protocol analysis with speeds up to • More choices of data views 32GT/s at up to x8 link widths. The Summit M5x is ideal for high-performance protocol • More ways to analyze data development of add-in boards, switches, servers and workstations, and for customers • Custom decoding and reports currently working on PCIe. Data capture Flexible Hardware Analyzer for CXL (Compute Express Link) Links. • 100% data capture at 32.0 GT/s The Summit M5x PCIe 5.0 Protocol Analyzer is a Support is provided for CXL.io, CXL.mem and high-end analyzer that offers important analysis CXL.cache with full decoding from the FLIT layer Deep memory buffer features for new application development. to the CXL Message layers. -
PATENT PLEDGES Jorge L. Contreras*
PATENT PLEDGES Jorge L. Contreras* ABSTRACT An increasing number of firms are making public pledges to limit the enforcement of their patents. In doing so, they are entering a little- understood middle ground between the public domain and exclusive property rights. The best-known of these patent pledges are FRAND commitments, in which patent holders commit to license their patents to manufacturers of standardized products on terms that are “fair, reasonable and non-discriminatory.” But patent pledges have been appearing in settings well beyond standard-setting, including open source software, green technology and the life sciences. As a result, this increasingly prevalent private ordering mechanism is beginning to reshape the role and function of patents in the economy. Despite their proliferation, little scholarship has explored the phenomenon of patent pledges beyond FRAND commitments and standard- setting. This article fills this gap by providing the first comprehensive descriptive account of patent pledges across the board. It offers a four-part taxonomy of patent pledges based on the factors that motivate patent holders to make them and the effect they are intended to have on other market actors. Using this classification system, it argues that pledges likely to induce reliance in other market actors should be treated as “actionable” * Associate Professor, S.J. Quinney College of Law, University of Utah and Senior Policy Fellow, American University Washington College of Law. The author thanks Jonas Anderson, Clark Asay, Marc Sandy Block, Mark Bohannon, Matthew Bye, Michael Carrier, Michael Carroll, Colleen Chien, Thomas Cotter, Carter Eltzroth, Carissa Hessick, Meredith Jacob, Jay Kesan, Anne Layne-Farrar, Irina Manta, Sean Pager, Gideon Parchomovsky, Arti Rai, Amelia Rinehart, Cliff Rosky, Daniel Sokol and Duane Valz for their helpful comments, suggestions and discussion of this article and contributions of data to the Patent Pledge Database at American University. -
SC20를 통해 본 HPC 기술 동향 HPC Technology Through SC20
Electronics and Telecommunications Trends SC20를 통해 본 HPC 기술 동향 HPC Technology Through SC20 어익수 (I.S. Eo, [email protected]) 슈퍼컴퓨팅기술연구센터 책임연구원 모희숙 (H.S. Mo, [email protected]) 슈퍼컴퓨팅기술연구센터 책임연구원 박유미 (Y.M. Park, [email protected]) 슈퍼컴퓨팅기술연구센터 책임연구원/센터장 한우종 (W.J. Han, [email protected]) 인공지능연구소 책임연구원/연구위원 ABSTRACT High-performance computing (HPC) is the underpinning for many of today’s most exciting new research areas, to name a few, from big science to new ways of fighting the disease, to artificial intelligence (AI), to big data analytics, to quantum computing. This report captures the summary of a 9-day program of presentations, keynotes, and workshops at the SC20 conference, one of the most prominent events on sharing ideas and results in HPC technology R&D. Because of the exceptional situation caused by COVID-19, the conference was held entirely online from 11/9 to 11/19 2020, and interestingly caught more attention on using HPC to make a breakthrough in the area of vaccine and cure for COVID-19. The program brought together 103 papers from 21 countries, along with 163 presentations in 24 workshop sessions. The event has covered several key areas in HPC technology, including new memory hierarchy and interconnects for different accelerators, evaluation of parallel programming models, as well as simulation and modeling in traditional science applications. Notably, there was increasing interest in AI and Big Data analytics as well. With this summary of the recent HPC trend readers may find useful information to guide the R&D directions for challenging new technologies and applications in the area of HPC. -
Designware IP for Cloud Computing Socs
DesignWare IP for Cloud Computing SoCs Overview Hyperscale cloud data centers continue to evolve due to tremendous Internet traffic growth from online collaboration, smartphones and other IoT devices, video streaming, augmented and virtual reality (AR/VR) applications, and connected AI devices. This is driving the need for new architectures for compute, storage, and networking such as AI accelerators, Software Defined Networks (SDNs), communications network processors, and solid state drives (SSDs) to improve cloud data center efficiency and performance. Re-architecting the cloud data center for these latest applications is driving the next generation of semiconductor SoCs to support new high-speed protocols to optimize data processing, networking, and storage in the cloud. Designers building system-on-chips (SoCs) for cloud and high performance computing (HPC) applications need a combination of high-performance and low-latency IP solutions to help deliver total system throughput. Synopsys provides a comprehensive portfolio of high-quality, silicon-proven IP that enables designers to develop SoCs for high-end cloud computing, including AI accelerators, edge computing, visual computing, compute/application servers, networking, and storage applications. Synopsys’ DesignWare® Foundation IP, Interface IP, Security IP, and Processor IP are optimized for high performance, low latency, and low power, while supporting advanced process technologies from 16-nm to 5-nm FinFET and future process nodes. High-Performance Computing Today’s high-performance computing (HPC) solutions provide detailed insights into the world around us and improve our quality of life. HPC solutions deliver the data processing power for massive workloads required for genome sequencing, weather modeling, video rendering, engineering modeling and simulation, medical research, big data analytics, and many other applications. -
Access Order and Effective Bandwidth for Streams on a Direct Rambus Memory Sung I
Access Order and Effective Bandwidth for Streams on a Direct Rambus Memory Sung I. Hong, Sally A. McKee†, Maximo H. Salinas, Robert H. Klenke, James H. Aylor, Wm. A. Wulf Dept. of Electrical and Computer Engineering †Dept. of Computer Science University of Virginia University of Utah Charlottesville, VA 22903 Salt Lake City, Utah 84112 Abstract current DRAM page forces a new page to be accessed. The Processor speeds are increasing rapidly, and memory speeds are overhead time required to do this makes servicing such a request not keeping up. Streaming computations (such as multi-media or significantly slower than one that hits the current page. The order of scientific applications) are among those whose performance is requests affects the performance of all such components. Access most limited by the memory bottleneck. Rambus hopes to bridge the order also affects bus utilization and how well the available processor/memory performance gap with a recently introduced parallelism can be exploited in memories with multiple banks. DRAM that can deliver up to 1.6Gbytes/sec. We analyze the These three observations — the inefficiency of traditional, performance of these interesting new memory devices on the inner dynamic caching for streaming computations; the high advertised loops of streaming computations, both for traditional memory bandwidth of Direct Rambus DRAMs; and the order-sensitive controllers that treat all DRAM transactions as random cacheline performance of modern DRAMs — motivated our investigation of accesses, and for controllers augmented with streaming hardware. a hardware streaming mechanism that dynamically reorders For our benchmarks, we find that accessing unit-stride streams in memory accesses in a Rambus-based memory system. -
Big Data, AI, and the Future of Memory
Big Data, AI, and the Future of Memory Steven Woo Fellow and Distinguished Inventor, Rambus Inc. May 15, 2019 Memory Advancements Through Time 1990’s 2000’s 2010’s 2020’s Synchronous Memory Graphics Memory Low Power Memory Ultra High Bandwidth for PCs for Gaming for Mobile Memory for AI Faster Compute + Big Data Enabling Explosive Growth in AI 1980s Annual Size of the Global Datasphere – 1990s Now 175 ZB More 180 Accuracy Compute Neural Networks 160 140 120 Other Approaches 100 Zettabytes 80 60 40 20 Scale (Data Size, Model Size) 2010 2015 2020 2025 Source: Adapted from Jeff Dean, “Recent Advances in Artificial Intelligence and the Source: Adapted from Data Age 2025, sponsored by Seagate Implications for Computer System Design,” HotChips 29 Keynote, August 2017 with data from IDC Global DataSphere, Nov 2018 Key challenges: Moore’s Law ending, energy efficiency growing in importance ©2019 Rambus Inc. 3 AI Accelerators Need Memory Bandwidth Google TPU v1 1000 TPU Roofline Inference on newer silicon (Google TPU K80 Roofline HSW Roofline v1) built for AI processing largely limited LSTM0 by memory bandwidth LSTM1 10 MLP1 MLP0 v nVidia K80 CNN0 Inference on older, general purpose Intel Haswell CNN1 hardware (Haswell, K80) limited by LSTM0 1 LSTM1 compute and memory bandwidth TeraOps/sec (log scale) (log TeraOps/sec MLP1 MLP0 CNN0 0.1 CNN1 LSTM0 1 10 100 1000 Memory bandwidth is a critical LSTM1 Ops/weight byte (log scale) resource for AI applications = Google TPU v1 = nVidia K80 = Intel Haswell N. Jouppi, et.al., “In-Datacenter Performance Analysis of a Tensor Processing Unit™,” https://arxiv.org/ftp/arxiv/papers/1704/1704.04760.pdf ©2019 Rambus Inc. -
Sirius Federal ITES-3H CLIN 0301 Catalog
W52P1J‐16‐D‐0018 0301 Catalog ‐ Sirius Federal, LLC Catalog Catalog Vendor Part Manufacturer Manufacturer Part Number Description List Price ITES‐3H Sell Price % Off List Price UNSPSC Comment Standards Number CLIN Number Win 10 Pro 64 English French Spanish 3 0301 31209 Dell 619‐AHKN (Part of Dell configuration) (Part of $0.00 $0.00 20% 43.21.15.15 Bundle) HP 5y NBD Onsite/Disk Retention NB 3 0302 402258 Hewlett Packard (HPI) UE337E SVC , Notebook and Tablet PC (3/3/0 $345.00 $276.00 20% 81.11.18.11.00 warranty), Hardware Support during 3 0301 402259 Hewlett Packard (HPI) H1L08AA#ABA HP 3005pr USB3.0Port Replicator $260.00 $208.00 20% 43.21.16.03.00 OptiPlex 3020 Small Form Factor 3 0301 402260 Dell 210‐ABIX $700.00 $560.00 20% 43.21.15.07.00 (CTO) Wyse 7030 PCoIP zero client, 4xDP, 3 0301 402438 Dell 210‐AKBO Fiber Ready, with mouse and power $829.00 $663.20 20% 43.21.15.06.00 cord, keyboard sent separately 3 0301 402693 Hewlett Packard (HPI) D9Y32AA#ABA HP UltraSlim Dock 2013 $300.00 $240.00 20% 43.21.16.02.00 3 0301 403917 DBL ‐ Belkin Components B2B061 Belkin Wired USB Standard Keyboard $15.00 $12.00 20% 43.21.17.06.00 3 0301 403918 Dell 210‐ACYX Dell Precision 7910 XCTO Base $4,203.00 $3,362.40 20% 43.21.15.02.00 Dual Intel Xeon Processor E5‐2609 v3 3 0301 403919 Dell 338‐BFJJ $0.00 $0.00 20% 43.20.15.03.00 (6C,1.9GHz, 15M, 85W) Dual Intel Xeon Processor E5‐2609 v3 3 0301 403920 Dell 412‐AAED $0.00 $0.00 20% 43.20.15.03.00 (6C,1.9GHz, 15M, 85W) 16GB (4x4GB) 2133MHz DDR4 3 0301 403922 Dell 370‐ABUO $0.00 $0.00 20% 32.10.16.21.00 RDIMM -
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TAKING OCP to the NEXT LEVEL – WORKLOAD OPTIMIZATION Krishna Paul Principal Engineer Data Center Group
TAKING OCP TO THE NEXT LEVEL – WORKLOAD OPTIMIZATION Krishna Paul Principal Engineer Data Center Group Consume. Collaborate. Collaborate. Contribute. Contribute. OPEN COMPUTE HISTORY OF COMMITMENT AND LEADERSHIP 2011 +25 +80 Founding Contributions and Products Board Member Enablements with Partners of OCP Consume. Collaborate. Collaborate. Contribute. Contribute. GETTING TO $10B IN OCP DEPLOYMENT Workload Open Management Integrated Optimized Solutions Consume. Collaborate. Collaborate. Contribute. Contribute. NEW OCP COMPUTE PLATFORMS THIS YEAR Mount Olympus Next Gen Platform Cooper Lake Processor Platforms for Cascade Lake Processor 2S 4S (2x 2S) 8S (4x 2S) Consume. Collaborate. Collaborate. Contribute. Contribute. *Other names and brands may be claimed as property of others. INTEL® HIGH-DENSITY, CLOUD-OPTIMIZED PLATFORM Cloud-Optimized Platform 2U 450mm x 780mm 4S Intel® Xeon® Scalable processors 48 DDR4 memory slots, SATA/SAS/NVMe 2.5” SSD drive bays Available in second half 2019 *Other names and brands may be claimed as property of others. Consume. Collaborate. Collaborate. Contribute. Contribute. OCP CARDS SUPPORT NEW AI ACCELERATORS INTEL® NERVANA™ NEURAL NETWORK PROCESSOR (NNP) FOR TRAINING: FOR INFERENCE: Nervana™ Dedicated deep learning training acceleration Dedicated deep learning inference acceleration Optimized memory and interconnects 10nm Intel® process node In production in 2019 In production in 2019 Intel is a proud partner of the community Consume. Collaborate. Collaborate. Contribute. Contribute. *Other names and brands may be claimed as property of others. ANNOUNCING A NEW CPU-TO-DEVICE INTERCONNECT STANDARD COMPUTE EXPRESS LINK (CXL) ▪ New CXL specification and consortium ▪ Memory coherent, high-speed interconnect ▪ Initial spec donated by Intel ▪ Intel® believes there is an opportunity for an OCP working group to define new form factors for CXL ▪ Optimized stack with x16 PCI Express Gen 5 physical and electrical connection (32 GT/s) ▪ Use cases include AI, networking, media, graphics and more ▪ Availability expected 2021 Consume. -
Download Attachment
NON-CONFIDENTIAL 2010-1556 UNITED STATES COURT OF APPEALS FOR THE FEDERAL CIRCUIT ASUSTEK COMPUTER INC., ASUS COMPUTER INTERNATIONAL, INC., BFG TECHNOLOGIES, INC., BIOSTAR MICROTECH (U.S.A.) CORP., BIOSTAR MICROTECH INTERNATIONAL CORP., DIABLOTEK, INC., EVGA CORP., G.B.T., INC., GIGA-BYTE TECHNOLOGY CO., LTD., HEWLETT-PACKARD COMPANY, MSI COMPUTER CORP., MICRO-STAR INTERNATIONAL COMPANY, LTD., GRACOM TECHNOLOGIES LLC (FORMERLY KNOWN AS PALIT MULTIMEDIA, INC.), PALIT MICROSYSTEMS LTD., PINE TECHNOLOGY (MACAO COMMERCIAL OFFSHORE) LTD., AND SPARKLE COMPUTER COMPANY, LTD. Appellants, — v. — INTERNATIONAL TRADE COMMISSION, Appellee, and RAMBUS, INC., Intervenor, and NVIDIA CORPORATION, Intervenor. ______________ 2010-1557 ______________ NVIDIA CORPORATION, Appellant, — v. — INTERNATIONAL TRADE COMMISSION, Appellee, and RAMBUS, INC., Intervenor. ______________ ON APPEAL FROM THE UNITED STATES INTERNATIONAL TRADE COMMISSION IN INVESTIGATION NO. 337-TA-661 ______________ NON-CONFIDENTIAL REPLY BRIEF OF APPELLANTS NVIDIA CORPORATION ET AL. _______________ *Caption Continued on Next Page COMPANION CASES TO: 2010-1483 RAMBUS, INC., Appellant, — v. — INTERNATIONAL TRADE COMMISSION, Appellee, and NVIDIA CORPORATION ET AL., Intervenors. ______________ RUFFIN B. CORDELL I. NEEL CHATTERJEE MARK S. DAVIES ANDREW R. KOPSIDAS RICHARD S. SWOPE RACHEL M. MCKENZIE FISH & RICHARDSON P.C. NITIN GAMBHIR LAUREN J. PARKER 1425 K Street, NW, 11th Floor ORRICK, HERRINGTON ORRICK, HERRINGTON Washington, DC 20005 & SUTCLIFFE LLP & SUTCLIFFE LLP Tel. No. 202-626-6449 -
Workstation Fisse E Mobili Monitor Hub Usb-C Docking
OCCUPATEVI DEL VOSTRO BUSINESS, NOI CI PRENDEREMO CURA DEI VOSTRI COMPUTERS E PROGETTI INFORMATICI 16-09-21 16 WORKSTATION FISSE E MOBILI MONITOR HUB USB-C DOCKING STATION Noleggiare computer, server, dispositivi informatici e di rete, Cremonaufficio è un’azienda informatica presente nel terri- può essere una buona alternativa all’acquisto, molti infatti torio cremonese dal 1986. sono i vantaggi derivanti da questa pratica e il funziona- Sin dai primi anni si è distinta per professionalità e capacità, mento è molto semplice. Vediamo insieme alcuni di questi registrando di anno in anno un trend costante di crescita. vantaggi: Oltre venticinque anni di attività di vendita ed assistenza di Vantaggi Fiscali. Grazie al noleggio è possibile ottenere di- prodotti informatici, fotocopiatrici digitali, impianti telefonici, versi benefici in termini di fiscalità, elemento sempre molto reti dati fonia, videosorveglianza, hanno consolidato ed affer- interessante per le aziende. Noleggiare computer, server e mato l’azienda Cremonaufficio come fornitrice di prodotti e dispositivi di rete permette di ottenere una riduzione sulla servizi ad alto profilo qualitativo. tassazione annuale e il costo del noleggio è interamente Il servizio di assistenza tecnica viene svolto da tecnici interni, deducibile. specializzati nei vari settori, automuniti. Locazione operativa, non locazione finanziaria. A differen- Cremonaufficio è un operatore MultiBrand specializzato in za del leasing, il noleggio non prevede l’iscrizione ad una Information Technology ed Office Automation e, come tale, si centrale rischi, di conseguenza migliora il rating creditizio, avvale di un sistema di gestione operativa certificato ISO 9001. facilita il rapporto con le banche e l’accesso ai finanzia- menti. -
HP Zbook Firefly 15 G8 Intel Core I7-1165G7 15.6Inch FHD AG LED 32GB 1TB SSD Quadro T500 4GB Wifi6 BT5 OPT.WWAN W10P64 W3/3/3
SPESIFIKAATIOT 1(4) 28.6.2021 HP Zbook Firefly 15 G8 Intel Core i7-1165G7 15.6inch FHD AG LED 32GB 1TB SSD Quadro T500 4GB WiFi6 BT5 OPT.WWAN W10P64 W3/3/3 HP Zbook Firefly 15 G8 Intel Core i7-1165G7 15.6inch FHD AG LED 32GB Tuotenimike: 1TB SSD Quadro T500 4GB WiFi6 BT5 OPT.WWAN W10P64 W3/3/3 HP ZBook Firefly 15 G8 Mobile Workstation - Core i7 1165G7 / 2.8 GHz - Win 10 Pro 64-bit - 32 Gt RAM - 1 Tt SSD NVMe, TLC - 15.6" IPS 1920 x Kuvaus: 1080 (Full HD) - T500 / Iris Xe Graphics - Wi-Fi 6, Bluetooth - kbd: ruotsalainen/suomalainen EAN-koodi: 0195697572883 Valmistajan takuu: 36 kuukauden takuu paikan päällä Yleistä Tuotteen tyyppi: Kannettava tietokone Käyttöjärjestelmä: Windows 10 Pro 64-bit Edition - englanti / suomi / ruotsi Suoritin / Chipset CPU: Intel Core i7 (11.sukupolvi) 1165G7 / 2.8 GHz Max. turbonopeus: 4.7 GHz Ydinten määrä: Quad-Core Välimuisti: L3 - 12 Mt 64-bitin Computing: Kyllä Ominaisuudet: Intel Turbo Boost Technology Muisti RAM: 32 Gt (1 x 32 Gt) Tuettu enimmäismuisti 64 Gt (RAM): Tekniikka: DDR4 SDRAM - non-ECC Tukikomppania ThinkIT Oy Tel: 010 3965 100 Elimäenkatu 22 A Loutinkatu 49 A [email protected] 00510 HELSINKI 04400 JÄRVENPÄÄ www.tukikomppania.fi SPESIFIKAATIOT 2(4) 28.6.2021 Nopeus: 3200 MHz Nimellisnopeus: 3200 MHz Koko tai muoto: SO-DIMM 260-pin Paikkojen määrä: 2 Tyhjät paikat: 1 Tallennuslaitteet 1 Tt SSD M.2 2280 PCIe 3.0 x4 - NVM Express (NVMe), triple-level cell Päätallennus: (TLC) Näyttö Tyyppi: 15.6" - IPS LCD taustavalo-teknologia: LED-taustavalo Erotuskyky: 1920 x 1080 (Full HD) Leveä näyttö: