Power Distribution for Cryogenic Instruments at 6-40K the James Webb Space Telescope Case
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Power Distribution for Cryogenic Instruments at 6-40K The James Webb Space Telescope Case Peter Rumler<1>, Ray Lundqu ist<2>, Jose Lorenzo Alvarez'll , Jeff Since 11<2>, Jim Tutt1e<2> fl ) ESA-ESTEC, 2200AG Noordwijk. Nether/ands, JNh'r.ru111/cr'!! l!sa.1111 <1JNASA-GSFC, Greenbelt, MD-20771 USA, my.a./1111d,111isr'if,11a.1·a .1?01· \ .. -- ABSTRA CT ISIM structure located in Region I of the JWST Observatory. Each instrument's OA is connected The Integrated Science Instrument Module (ISIM) of through a heat strap to a dedicated radiator that the James Webb Space Telescope (JWST) operates its provides passive cooling to temperatures below 40K. instruments passively cooled at around 40 Kelvin (K), In addition, the NIRSpec FPA and the SIDECAR ASIC with a warm Instrument Electronic Compartment (!EC) (System for Image Digitization, Enhancement. Control at 300K attached to it. From the wann electronics all and Retrieval) connect to a dedicated radiator separate secondary signal and power harnesses have to bridge from the NIRSpec OA radiator. The ISIM Structure is this 300-40K temperature difference and minimize the a frame made of square graphite fiber reinforced plastic power dissipation and parasitic heat leak into the cold (GFRP) tubes attached together with gussets and clips, region. and with metal fittings for the Optical Telescope After an introduction of the !SIM with its instruments, Element (OTE) and Science Instrument interfaces. The the IEC with the electronics, and the harness resistivity of the GFRP tube material has been architecture with a special radiator, this paper measured to be in the order of H'l/m, and the resistance \ elaborates on the cryogenic wire selection and tests of the joints between GFRP tubes has been measured to perfonned to establish current de-rating rules for be approximately 10-200! per joint. The resulting different wire types. Finally failure modes are analyzed overall IS IM structure resistance of IO- I oon from the for critical instrument interfaces that could inject OAs to the IEC ground cannot be considered as a low excessive currents and heat into the harness and cold impedance ground plane in Region I. side, and several solutions for the removal of such failures are presented. 1. INTRODUCTION The James Webb Space Telescope (JWST) is an Infrared Space Observatory that will follow-up Hubble in 2016, designed by NASA with contributions from Region 1 ESA and the Canadian Space Agency (CSA). ESA ISIM Structure, provides the Ariane-5 Launch vehicle for JWST and Optic.ii Auemblln supplies the Near Infrared Spectrograph (NIRSpec) and 35-40!( the science part of the Mid Infrared Instrument (M IRI). CSA provides an instrument with a Fine Guidance Sensor (FGS) and tuneable Filter. JWST features a sunshield approximately the size of a tennis court that passively cools the Integrated Science Instrument Region 2 .Module (ISIM) with the infrared instruments. IEC Figure I shows JWST in stowed (launch) configuration 2T3-313K without the sunshield and the three thennal regions Region 3 where instrument components are located. Spacecraft ICOH 2. ISIM OVERVIEW The !SIM is the Payload Element of the JWST, Figure 1. /SIM Component Regions on the JWST containing the Near-Infrared Camera· (NIRCam), Observatory NIRSpec, MIRI, and FGS. The optical assemblies (OA) of the instruments contain the optics, the 2.1 Instruments Electronics Compartment (IEC) respective Focal Plane Assemblies (FPA) with infrared The control electronics for each instrument are detectors and mechanisms, and they are mounted to the contained in the IEC, where the temperature will be • maintained between 273K and 3 13K. The large temperature gradient between Region I and Region 2 NIRSpec requires the use of thermally resistive materials to NIRSpec is a large field of view spectrograph that prevent heat transfer. contains 2 SCAs passively cooled to 38K, each of As a result, all harnesses between Regions I and 2 are which is controlled by a SIDECAR ASIC. The cryogenic harnesses that will have relatively high wire NIRSpec FPE controls the SIDECAR ASICS, and it and shield electrical resistance. Still, they provide a interfaces to the IRSU over SpaceWire. The NIRSpec better ground connection between Regions I and 2 than ICE box controls the mechanisms in Region I with the the structure. The ground impedance is in the order of exception of the Microshutter Array (MSA), which is 1-1011 when using all shield wires (mostly stainless managed by the NIRSpec Microshutter Control steel shields) in parallel for one instrument. Figure 2 Electronics (MCE) box. shows the layout of ISIM and IEC with the interconnecting harnesses. FGS Guider and Tuneable Filter In addition to the instrument control electronics, the The FGS-Guider is used to facilitate fine pointing of IEC contains the JSIM Remote Services Unit (IRSU), the Observatory by providing the Spacecraft with the which provides SpaceWire interfaces to the instrument precise location of a guide star's image in its field of Focal Plane Electronics (FPE) for science data view at 16Hz. FGS includes three separate chains: transmission, as well as thermal control for ISIM Guider-I, Guider-2 and the Tuneable Filter (TF). Each Region I. The command and data handling functions chain consists of one SCA with associated SIDECAR for the instruments are provided by the ISIM ASIC, and a dedicated FPE/ICE module in the FGS Command and Data Handling (ICDH) unit in Region 3 electronics box in the IEC. via a MIL-1553 bus. And the Power Control Unit (PCU) in the spacecraft supplies all electronic boxes MIRI with a 30V unregulated power bus, with a minimum of MIR! is a combined imager and spectrometer that uses 22V and a maximum of35V. an additional cryo-cooler to actively cool its structure The mass ,estimate for the IEC compartment is 102kg to approximately 7K and its SCAs to 4-6K. The MIRI and 132kg for all electronic boxes inside. SCAs make use of a different technology suitable for the medium infrared range, and they are not compatible with the SIDECAR ASICs. Here the FPE directly controls the SCAs via an analog interface, and provides science data to the IRSU over SpaceWire. The MIRI ICE box controls the MIRI mechanisms in Region I with the exception of the cooler. The cooler is controlled by the ·two Cooler Control Electronics (CCEs for Joule Thomson and Pulse Tube coolers) boxes in Region 3. IRSU & ICDH The IRSU includes a Multi-SpaceWire Concentrator (MSC) with 3 parallel SpaceWire links to the ICDH and the !SIM thermal control electronics. It monitors the Region I cryogenic temperature sensors and lklclr1UI~ provides power to the contamination control heaters on Figure 2. JSJM, /EC and Harness Radiator Layout the instrument OAs. The contamination control heaters maintain the temperatures of critical components above 2.2 Instruments and ISIM Electronics the temperature of the surrounding structure during cool-down. The MSC also distributes a 60MHz clock NIRCam to the FPEs and synchroni zation clocks ( I 00/200/500 NIRCam is a large field of view imager that is kHz) to all instrument electronic boxes. passively cooled to 37K. NIRCam contains 10 Sensor The ICDH contains the ISIM Flight Software and each Chip Assemblies (SCAs), each of which is controlled instrument's Flight Software Application, as well as the by a SIDECAR ASIC, developed by Rockwell SpaceWire interfaces to the IRSU and the ISIM 1553 Scientific for JWST operation at 35-40K. Each of the 2 bus interfaces to the control electronics. On the other NIRCam FPE modules in Region 2 controls the side the ICDH interfaces to the Solid State Recorder interface to 5 SIDECAR ASICS in Region I, and it (SSR) over SpaceWire and to the Spacecraft Command interfaces to the IRSU over SpaceWire. The NIRCam and Telemetry Processor (CTP) over the S/C-ISIM Instrument Control Electronics (ICE) box controls the I 553 Bus (see Fig. 3 ). mechanisms in Region I. I ,. REGION2 COiOt. .... , ..... REGION l Figure 3. /SIM Electrical Connection Diagram 3. HARNESS ARCHITECTURE Region 2 harnesses comprise all harnesses inside the IEC. On the Spacecraft side they connect the The Region I harnesses include all the harnesses on the electronics boxes to the Region 3 interface (power, instrument OAs and the !SIM Structure, as well as the SpaceWire, 1553-bus and clock/sync) on ICP-3 via the harnesses connecting between the ISIM structure and common !EC cavity, which is called the IEC the IEC via the tray radiator. The boundary to Region 2 Backbone. is at Interface Connector Panels (ICPs) called ICP-2's The power harnesses are made of A WG-20 copper on the IEC. All harnesses from there up to the wires, with at least two parallel wires for electronics interfaces on the instrument OAs (ICP-1 's) are with low power consumption, and up to IO parallel cryogenic harnesses that must accommodate the large wires for the IRSU with a peak power consumption of temperature gradient (300K - 40K). Harnesses inside I6SW. With a one-way length of 15-16m between the the !EC and on the instrument OAs are isothermal and PCU and the electronics in the !EC, this results in a can be made of copper. The exception is MIR! where maximum roundtrip voltage drop of no more than there is a need for cryogenic harnesses from the !SIM 0.75V (nt peak power and 22V at the interface). This mounting interface and ICP-1 at 40K up to the actively leads to a total of 67 A WG-20 pairs of power feeds for cooled OA at 6K. For the ease of integration and the 12 electronic boxes with 21 power interfaces. For testing another series of interface connector panels an average !EC power consumption of 200W (overall (ICP-A 's) has been introduced between the harness peak power is 535W) this seems to be oversized, but radiator and the ISIM enclosure.