André Delhaise, Ph.D. Project Consultant – Materials

PROFILE André Delhaise is a motivated and methodical Forensic Materials Scientist with OFFICE 2785 Skymark Avenue experience in characterizing and interpreting material processing-structure, Suite 14 structure-property and property-performance relationships for failure analysis Mississauga, ON L4W 4Y3 and development efforts. He is an organized project manager with experience in leading multi-disciplinary teams and coordinating technical direction in $1M+ CONTACT consortium projects in the aerospace and defence industries. While completing Cell: +1 647 210 7078 Office: +1 866 782 3473 his doctorate, he was awarded “Best of Proceedings” out of 130 papers at an [email protected] international conference on electronics manufacturing. CORPORATE OFFICE At Envista, André provides the full range of materials testing and analysis. His 2785 Skymark Avenue key strengths include the following: Suite 14 Mississauga, ON L4W 4Y3

► Forensic Investigation ► Metallography WEBSITE ► Scanning Electron Microscopy ► Hardness Testing www.envistaforensics.com ► Electron Backscatter Diffraction ► Bend Testing ► Drop Testing ► Dye & Pry ► Electron Probe Microanalysis ► Thermal Cycling ► X-Ray Diffraction ► Heat Treating ► Optical Microscopy ► Corrosion Analysis

► Industries: Forensic Engineering, Aerospace and Defense. Metallurgical ► Computer Skills: Minitab, MATLAB, Microsoft Office, ImageJ, Solidworks

EDUCATION Doctor of Philosophy (Ph.D.), Materials Engineering, 2018 Department of Materials Science & Engineering (MSE), University of – Toronto, Thesis Title: “Solid-State Diffusion of Bismuth in Tin-Rich, Lead-Free Solder Alloys”

Bachelor of Applied Science with Honours, Materials Engineering, 2013 Department of Materials Science & Engineering (MSE), University of Toronto – Toronto, Ontario

PROFESSIONAL AFFILIATIONS ► TMS Member, 2020 – Present ► Dragon Boat Member, 2014 – 2018 ► Surface Mount Technology Association (SMTA) Member, 2012 – Present ► Canadian Ski Patrol Member and Volunteer Patroller, 2012 – 2015 ► Material Advantage Student Member, 2009 – 2019

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André Delhaise, Ph.D. Project Consultant – Materials

PROFESSIONAL BACKGROUND February 2021 – Present: Envista Forensics – Toronto, ON Project Consultant – Materials

September 2020 – December 2020: Algonquin College of Applied Arts & Technology – , ON (Remote) Computer-Aided-Design Teacher (Part-Time)

February 2017 – November 2020: Celestica, Inc. – Newmarket, Ontario Forensic Manufacturing & Materials Engineer

September 2013 – August 2017: University of Toronto – Toronto, Ontario Teaching Assistant

May 2011 – August 2012: Celestica, Inc. – Toronto, Ontario Materials Laboratory Technician

PUBLICATIONS

Refereed Publications

► A. Delhaise, Z. Bagheri, S. Meschter, P. Snugovsky, J. Kennedy, Tin Whisker Growth on Electronic Assemblies Soldered with Bi-Containing, Pb-Free Alloys, Journal of Electronic Materials, DOI: 10.1007/s11664-020-08544-6 Also presented at TMS 2020 149th Annual Meeting & Exhibition, San Diego, CA, USA, February 23- February 27, 2020 ► A. Delhaise, P. Snugovsky, J. Kennedy, D. Hillman, I. Matijevic, S. Meschter, D. Adams, M. Kammer, M. Romansky, J. Juarez, I. Straznicky, L. Snugovsky, R. Wilcoxon, D. Perovic, Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys, Journal of Electronic Materials, Vol 49, Issue 1 (2020) Also presented at TMS 2019 148th Annual Meeting & Exhibition, San Antonio, TX, USA, March 10-March 14, 2019 ► A. Delhaise, S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, Tin Whisker Formation in Bismuth- Containing Lead-Free Solder Alloys after Long-Term Ambient Temperature, High Humidity Storage, Part I: Whisker Inspection Results, Journal of Surface Mount Technology, Vol 32, Issue 2 (2019), pp. 14-26 Also presented at 2018 International Conference for Electronics Enabling Technologies (ICEET), Surface Mount Technology Association, Markham, Canada, June 5-7, 2018 ► P. Banh, A. Delhaise, D. Perovic, The Study of Dissolution of Bi Particles in Sn using a Novel in situ Heating Technique in SEM, Journal of Surface Mount Technology, Vol 32, Issue 2 (2019), pp. 7-13 Also presented at 2018 International Conference for Electronics Enabling Technologies (ICEET), Surface Mount Technology Association, Markham, Canada, June 5-7, 2018 ► A. Delhaise, D. Hillman, P. Snugovsky, J. Kennedy, R. Wilcoxon, D. Adams, S. Meschter, J. Juarez, M. Kammer, I. Straznicky, D. Perovic, Effect of Thermal Treatment on the Microstructure, Properties, and

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André Delhaise, Ph.D. Project Consultant – Materials

Reliability of Lead-Free Bismuth Containing Solder Alloys, Journal of Surface Mount Technology, Vol 32, Issue 1 (2019), pp. 19-29 Also presented at 2017 SMTA International, Surface Mount Technology Association, Rosemont, IL, USA, September 17-21, 2017 ► A. Delhaise, Z. Chen, D. Perovic, Solid-State Diffusion of Bi in Sn – Effects of Anisotropy, Temperature, and High Diffusivity Pathways, JOM, Vol 71, Issue 1 (2019), pp. 133-142 Also presented at TMS 2019 148th Annual Meeting & Exhibition, San Antonio, TX, USA, March 10-March 14, 2019 ► A. Delhaise, Z. Chen, D. Perovic, Study of the Solid-State Diffusion of Bi in Sn – Effects of β-Sn Grain Orientation, Journal of Electronic Materials, Vol 48, Issue 1 (2019), pp. 32-43 Also presented at TMS 2018 147th Annual Meeting & Exhibition, Phoenix, AZ, USA, March 11-March 15, 2018 ► A. Delhaise, P. Snugovsky, I. Matijevic, J. Kennedy, M. Romansky, D. Hillman, D. Adams, S. Meschter, J. Juarez, M. Kammer, I. Straznicky, L. Snugovsky, D. Perovic, Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys, Journal of Surface Mount Technology, Vol 31, Issue 1 (2018), pp. 33-42 Also presented at 2017 International Conference on Soldering and Reliability (ICSR), Surface Mount Technology Association, Markham, Canada, June 6-8, 2017 ► A. Delhaise, D. Perovic, Study of the Solid-State Diffusion of Bi in Polycrystalline Sn Using Electron Probe Microanalysis, Journal of Electronic Materials, Vol 47, Issue 3 (2018), pp. 2057-2065 Also presented at Materials Science & Technology Conference 2016, Salt Lake City, UT USA, Oct 23- 27, 2016 ► A. Delhaise, D. Perovic, P. Snugovsky, The Effects of Bi and Aging on the Microstructure and Mechanical Properties of Sn-rich Alloys, Journal of Surface Mount Technology, Vol 30, Issue 2 (2017), pp. 21-27 Also presented at 2016 International Conference on Soldering and Reliability (ICSR), Surface Mount Technology Association, Markham, Canada, May 9-11, 2016 ► A. Delhaise, P. Snugovsky, L. Snugovsky, E. Kosiba, D. Perovic, Microstructure and Hardness of Bi- containing Solder Alloys after Solidification and Aging, Journal of Surface Mount Technology, Vol 27, Issue 3 (2014), pp. 22-27 Also presented at 2014 International Conference on Soldering and Reliability (ICSR), Surface Mount Technology Association, Toronto, Canada, May 13-15, 2014

Conference Papers ► A. Delhaise, S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after Short-Term High Temperature, High Humidity Storage, SMTA International 2019, Surface Mount Technology Association, Rosemont, IL, USA, September 22-26, 2019

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André Delhaise, Ph.D. Project Consultant – Materials

► A. Delhaise, S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, Evaluation of Tin Whisker Formation on Discrete Capacitor Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after Long-Term Ambient Temperature, High Humidity Storage, International Conference for Electronics Enabling Technologies (ICEET) 2019, Surface Mount Technology Association, Toronto, Canada, June 4-6, 2019 ► R. Coyle, J. Smetana, D. Hillman, C. Johnson, R. Parker, B. Sandy-Smith, H. Zhang, J. Geng, M. Osterman, B. Arfaei, A. Delhaise, K. Howell, J. Bath, S. Longgood, A. Kleyner, J. Silk, R. Pandher, E. Lundeen, J. Noiray, Alloy Composition and Thermal Fatigue of High-Reliability Pb-Free Solder Alloys, SMTA International 2018, Surface Mount Technology Association, Rosemont, IL, USA, October 14-18, 2018 ► R. Coyle, J. Smetana, D. Hillman, C. Johnson, R. Parker, B. Sandy-Smith, H. Zhang, J. Geng, M. Osterman, B. Arfaei, A. Delhaise, K. Howell, J. Bath, S. Longgood, A. Kleyner, J. Silk, R. Pandher, E. Lundeen, J. Noiray, The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High-Reliability Pb-Free Solder Alloys, SMTA International 2018, Surface Mount Technology Association, Rosemont, IL, USA, October 14-18, 2018 ► A. Delhaise, M. Brillantes, I. Tan, P. Snugovsky, J. Kennedy, D. Hillman, S. Meschter, D. Adams, M. Kammer, I. Straznicky, D. Perovic, Restoration of Microstructure and Mechanical Properties of Lead-Free Bismuth Containing Solder Joints after Accelerated Reliability using a Thermal Treatment, SMTA International 2018, Surface Mount Technology Association, Rosemont, IL, USA, October 14-18, 2018 ► A. Delhaise, S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, Evaluation of Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys after Long-Term Ambient Temperature, High Humidity Storage, International Conference for Electronics Enabling Technologies (ICEET) 2018, Surface Mount Technology Association, Toronto, Canada, June 5-7, 2018 ► A. Delhaise, D. Perovic, P. Snugovsky, The Effects of Bi and Aging on the Microstructure and Mechanical Properties of Sn-rich Alloys, 2015 International Conference on Soldering and Reliability (ICSR), Surface Mount Technology Association, Toronto, Canada, May 20-21, 2015 ► S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, E. Kosiba, A. Delhaise, SERDP Tin Whisker Testing and Modeling: High Temperature/High Humidity Conditions, 2013 International Conference on Soldering and Reliability (ICSR), Surface Mount Technology Association, Toronto, Canada, May 14-17, 2013

Conference Presentations ► A. Delhaise, P. Banh, D. Perovic, A Preliminary Study of the Dissolution of Bi in β-Sn using in situ Scanning Electron Microscopy, 149th Annual Meeting & Exhibition, San Diego, CA, USA, Feb 23-27, 2020 ► A. Delhaise, J.P. Tupac-Yupanqui Cardoso, J. Chua, R. Kauser, F. Azhari, D. Perovic, Compression Creep Behavior of Sn-Ag-Cu-Bi Pb-Free Solder Alloy, 149th Annual Meeting & Exhibition, San Diego, CA, USA, Feb 23-27, 2020 ► A. Delhaise, Z. Bagheri, S. Meschter, P. Snugovsky, J. Kennedy, The Effects of Bismuth on Tin Whisker Growth after High Temperature, High Humidity Storage, Materials Science & Technology Conference 2019, Portland, OR, USA, Sep 29-Oct 3, 2019

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André Delhaise, Ph.D. Project Consultant – Materials

► A. Delhaise, D. Perovic, Preliminary TEM Analysis on the Strengthening Effects of Bi in Pb-free Solder Alloys, TMS 2017 146th Annual Meeting & Exhibition, San Diego, CA, USA, February 26-March 2, 2017 ► E. Kosiba, A. Delhaise, P. Snugovsky, J. McMahon, D. Perovic, Microstructural Improvements of SAC Alloys with Bi Additions during Accelerated Thermal Cycling, TMS 2016 145th Annual Meeting & Exhibition, Nashville, TN, USA, February 14-18, 2016 ► A. Delhaise, P. Snugovsky, S. Meschter, Z. Bagheri, E. Kosiba, D. Perovic, Metallurgical and Statistical Analysis of Whisker Growth in Electronic Assemblies, Materials Science & Technology Conference 2013, Montréal, Canada, Oct 27-31, 2013

HONOURS AND AWARDS ► “Best of Proceedings” Award, SMTA International Conference, Jan 2018 For the paper “Effect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead- Free Bismuth Containing Solder Alloys.” ► Ontario Graduate Scholarship (OGS) Recipient (value $15000 CAD), Jul 2017 ► Ontario Graduate Scholarship (OGS) Recipient (value $15000 CAD), Jul 2016 ► NACE Toronto Section Award Recipient, Jul 2013 For excellence in undergraduate thesis work about Corrosion Engineering

REPRESENTATIVE PROJECT EXPERIENCE ► Autonomous problem solver with experience troubleshooting metallurgical aspects of electronic device failure analyses, as well as consulting lab customers on future risk mitigation approaches ► Cross-functional collaboration expertise from spearheading and participating in multi-company R&D consortium projects on lead-free electronics technology development ► Coordinated with Sandia National Laboratory to develop testing protocol and launched ongoing mechanical testing at University of Toronto to obtain requisite data for constitutive thermomechanical model to predict solder alloy performance ► Demonstration of flexibility while prioritizing and managing multiple parallel failure analysis and product qualification jobs, which produced quick turnaround times ► Acquired technical communication skills while interfacing with and preparing reports for internal and external customers, which accurately documented testing results, provided corrective recommendations, and maintained the lab’s trusted reputation ► Partnered with industry consortium on successful provisional patent application to improve the reliability of electronic assemblies in mission-critical environments ► Showed versatility by planning and delivering synchronous classes to 30 first-year students on Computer- Aided-Design (CAD), using Solidworks 2020 software ► Developed creative and engaging CAD course deliverables, including problem sets, projects, and tests, which prepared students for employment in the workforce

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