André Delhaise, Ph.D. Project Consultant – Materials

André Delhaise, Ph.D. Project Consultant – Materials

André Delhaise, Ph.D. Project Consultant – Materials PROFILE André Delhaise is a motivated and methodical Forensic Materials Scientist with OFFICE 2785 Skymark Avenue experience in characterizing and interpreting material processing-structure, Suite 14 structure-property and property-performance relationships for failure analysis Mississauga, ON L4W 4Y3 and development efforts. He is an organized project manager with experience in leading multi-disciplinary teams and coordinating technical direction in $1M+ CONTACT consortium projects in the aerospace and defence industries. While completing Cell: +1 647 210 7078 Office: +1 866 782 3473 his doctorate, he was awarded “Best of Proceedings” out of 130 papers at an [email protected] international conference on electronics manufacturing. CORPORATE OFFICE At Envista, André provides the full range of materials testing and analysis. His 2785 Skymark Avenue key strengths include the following: Suite 14 Mississauga, ON L4W 4Y3 ► Forensic Investigation ► Metallography WEBSITE ► Scanning Electron Microscopy ► Hardness Testing www.envistaforensics.com ► Electron Backscatter Diffraction ► Bend Testing ► Drop Testing ► Dye & Pry ► Electron Probe Microanalysis ► Thermal Cycling ► X-Ray Diffraction ► Heat Treating ► Optical Microscopy ► Corrosion Analysis ► Industries: Forensic Engineering, Aerospace and Defense. Metallurgical ► Computer Skills: Minitab, MATLAB, Microsoft Office, ImageJ, Solidworks EDUCATION Doctor of Philosophy (Ph.D.), Materials Engineering, 2018 Department of Materials Science & Engineering (MSE), University of Toronto – Toronto, Ontario Thesis Title: “Solid-State Diffusion of Bismuth in Tin-Rich, Lead-Free Solder Alloys” Bachelor of Applied Science with Honours, Materials Engineering, 2013 Department of Materials Science & Engineering (MSE), University of Toronto – Toronto, Ontario PROFESSIONAL AFFILIATIONS ► TMS Member, 2020 – Present ► Dragon Boat Canada Member, 2014 – 2018 ► Surface Mount Technology Association (SMTA) Member, 2012 – Present ► Canadian Ski Patrol Member and Volunteer Patroller, 2012 – 2015 ► Material Advantage Student Member, 2009 – 2019 Rev 2021-02-17 Envista Forensics, Ltd. Page | 1 André Delhaise, Ph.D. Project Consultant – Materials PROFESSIONAL BACKGROUND February 2021 – Present: Envista Forensics – Toronto, ON Project Consultant – Materials September 2020 – December 2020: Algonquin College of Applied Arts & Technology – Ottawa, ON (Remote) Computer-Aided-Design Teacher (Part-Time) February 2017 – November 2020: Celestica, Inc. – Newmarket, Ontario Forensic Manufacturing & Materials Engineer September 2013 – August 2017: University of Toronto – Toronto, Ontario Teaching Assistant May 2011 – August 2012: Celestica, Inc. – Toronto, Ontario Materials Laboratory Technician PUBLICATIONS Refereed Publications ► A. Delhaise, Z. Bagheri, S. Meschter, P. Snugovsky, J. Kennedy, Tin Whisker Growth on Electronic Assemblies Soldered with Bi-Containing, Pb-Free Alloys, Journal of Electronic Materials, DOI: 10.1007/s11664-020-08544-6 Also presented at TMS 2020 149th Annual Meeting & Exhibition, San Diego, CA, USA, February 23- February 27, 2020 ► A. Delhaise, P. Snugovsky, J. Kennedy, D. Hillman, I. Matijevic, S. Meschter, D. Adams, M. Kammer, M. Romansky, J. Juarez, I. Straznicky, L. Snugovsky, R. Wilcoxon, D. Perovic, Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys, Journal of Electronic Materials, Vol 49, Issue 1 (2020) Also presented at TMS 2019 148th Annual Meeting & Exhibition, San Antonio, TX, USA, March 10-March 14, 2019 ► A. Delhaise, S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, Tin Whisker Formation in Bismuth- Containing Lead-Free Solder Alloys after Long-Term Ambient Temperature, High Humidity Storage, Part I: Whisker Inspection Results, Journal of Surface Mount Technology, Vol 32, Issue 2 (2019), pp. 14-26 Also presented at 2018 International Conference for Electronics Enabling Technologies (ICEET), Surface Mount Technology Association, Markham, Canada, June 5-7, 2018 ► P. Banh, A. Delhaise, D. Perovic, The Study of Dissolution of Bi Particles in Sn using a Novel in situ Heating Technique in SEM, Journal of Surface Mount Technology, Vol 32, Issue 2 (2019), pp. 7-13 Also presented at 2018 International Conference for Electronics Enabling Technologies (ICEET), Surface Mount Technology Association, Markham, Canada, June 5-7, 2018 ► A. Delhaise, D. Hillman, P. Snugovsky, J. Kennedy, R. Wilcoxon, D. Adams, S. Meschter, J. Juarez, M. Kammer, I. Straznicky, D. Perovic, Effect of Thermal Treatment on the Microstructure, Properties, and Rev 2021-02-17 Envista Forensics, Ltd. Page | 2 André Delhaise, Ph.D. Project Consultant – Materials Reliability of Lead-Free Bismuth Containing Solder Alloys, Journal of Surface Mount Technology, Vol 32, Issue 1 (2019), pp. 19-29 Also presented at 2017 SMTA International, Surface Mount Technology Association, Rosemont, IL, USA, September 17-21, 2017 ► A. Delhaise, Z. Chen, D. Perovic, Solid-State Diffusion of Bi in Sn – Effects of Anisotropy, Temperature, and High Diffusivity Pathways, JOM, Vol 71, Issue 1 (2019), pp. 133-142 Also presented at TMS 2019 148th Annual Meeting & Exhibition, San Antonio, TX, USA, March 10-March 14, 2019 ► A. Delhaise, Z. Chen, D. Perovic, Study of the Solid-State Diffusion of Bi in Sn – Effects of β-Sn Grain Orientation, Journal of Electronic Materials, Vol 48, Issue 1 (2019), pp. 32-43 Also presented at TMS 2018 147th Annual Meeting & Exhibition, Phoenix, AZ, USA, March 11-March 15, 2018 ► A. Delhaise, P. Snugovsky, I. Matijevic, J. Kennedy, M. Romansky, D. Hillman, D. Adams, S. Meschter, J. Juarez, M. Kammer, I. Straznicky, L. Snugovsky, D. Perovic, Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys, Journal of Surface Mount Technology, Vol 31, Issue 1 (2018), pp. 33-42 Also presented at 2017 International Conference on Soldering and Reliability (ICSR), Surface Mount Technology Association, Markham, Canada, June 6-8, 2017 ► A. Delhaise, D. Perovic, Study of the Solid-State Diffusion of Bi in Polycrystalline Sn Using Electron Probe Microanalysis, Journal of Electronic Materials, Vol 47, Issue 3 (2018), pp. 2057-2065 Also presented at Materials Science & Technology Conference 2016, Salt Lake City, UT USA, Oct 23- 27, 2016 ► A. Delhaise, D. Perovic, P. Snugovsky, The Effects of Bi and Aging on the Microstructure and Mechanical Properties of Sn-rich Alloys, Journal of Surface Mount Technology, Vol 30, Issue 2 (2017), pp. 21-27 Also presented at 2016 International Conference on Soldering and Reliability (ICSR), Surface Mount Technology Association, Markham, Canada, May 9-11, 2016 ► A. Delhaise, P. Snugovsky, L. Snugovsky, E. Kosiba, D. Perovic, Microstructure and Hardness of Bi- containing Solder Alloys after Solidification and Aging, Journal of Surface Mount Technology, Vol 27, Issue 3 (2014), pp. 22-27 Also presented at 2014 International Conference on Soldering and Reliability (ICSR), Surface Mount Technology Association, Toronto, Canada, May 13-15, 2014 Conference Papers ► A. Delhaise, S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after Short-Term High Temperature, High Humidity Storage, SMTA International 2019, Surface Mount Technology Association, Rosemont, IL, USA, September 22-26, 2019 Rev 2021-02-17 Envista Forensics, Ltd. Page | 3 André Delhaise, Ph.D. Project Consultant – Materials ► A. Delhaise, S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, Evaluation of Tin Whisker Formation on Discrete Capacitor Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after Long-Term Ambient Temperature, High Humidity Storage, International Conference for Electronics Enabling Technologies (ICEET) 2019, Surface Mount Technology Association, Toronto, Canada, June 4-6, 2019 ► R. Coyle, J. Smetana, D. Hillman, C. Johnson, R. Parker, B. Sandy-Smith, H. Zhang, J. Geng, M. Osterman, B. Arfaei, A. Delhaise, K. Howell, J. Bath, S. Longgood, A. Kleyner, J. Silk, R. Pandher, E. Lundeen, J. Noiray, Alloy Composition and Thermal Fatigue of High-Reliability Pb-Free Solder Alloys, SMTA International 2018, Surface Mount Technology Association, Rosemont, IL, USA, October 14-18, 2018 ► R. Coyle, J. Smetana, D. Hillman, C. Johnson, R. Parker, B. Sandy-Smith, H. Zhang, J. Geng, M. Osterman, B. Arfaei, A. Delhaise, K. Howell, J. Bath, S. Longgood, A. Kleyner, J. Silk, R. Pandher, E. Lundeen, J. Noiray, The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High-Reliability Pb-Free Solder Alloys, SMTA International 2018, Surface Mount Technology Association, Rosemont, IL, USA, October 14-18, 2018 ► A. Delhaise, M. Brillantes, I. Tan, P. Snugovsky, J. Kennedy, D. Hillman, S. Meschter, D. Adams, M. Kammer, I. Straznicky, D. Perovic, Restoration of Microstructure and Mechanical Properties of Lead-Free Bismuth Containing Solder Joints after Accelerated Reliability using a Thermal Treatment, SMTA International 2018, Surface Mount Technology Association, Rosemont, IL, USA, October 14-18, 2018 ► A. Delhaise, S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, Evaluation of Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys after Long-Term Ambient Temperature, High Humidity Storage, International Conference for Electronics Enabling Technologies (ICEET) 2018, Surface Mount Technology Association, Toronto, Canada, June 5-7, 2018 ► A.

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