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Middlesex University Research Repository An open access repository of Middlesex University research http://eprints.mdx.ac.uk Lei, Daiqing (1999) Multi-chip module interconnections at microwave frequencies: electromagnetic simulation and material characterisation. PhD thesis, Middlesex University. Available from Middlesex University’s Research Repository at http://eprints.mdx.ac.uk/13417/ Copyright: Middlesex University Research Repository makes the University’s research available electronically. Copyright and moral rights to this thesis/research project are retained by the author and/or other copyright owners. The work is supplied on the understanding that any use for commercial gain is strictly forbidden. A copy may be downloaded for personal, non- commercial, research or study without prior permission and without charge. Any use of the thesis/research project for private study or research must be properly acknowledged with reference to the work’s full bibliographic details. This thesis/research project may not be reproduced in any format or medium, or extensive quotations taken from it, or its content changed in any way, without first obtaining permission in writing from the copyright holder(s). If you believe that any material held in the repository infringes copyright law, please contact the Repository Team at Middlesex University via the following email address: [email protected] The item will be removed from the repository while any claim is being investigated. Mi~dles.ex University London " Middlesex University Research Repository: an open access repository of Middlesex University research http://eprints.mdx.ac.uk Lei, Daiqing, 1999. Multi-chip module interconnections at microwave frequencies: electromagnetic simulation and material characterisation. Available from Middlesex University's Research Repository. Copyright: Middlesex University Research Repository makes the University's research available electronically. Copyright and moral rights to this thesis/research project are retained by the author and/or other copyright owners. The work is supplied on the understanding that any use for commercial gain is strictly forbidden. A copy may be downloaded for personal, non-commercial, research or study without prior permission and without charge. Any use of the thesis/research project for private study or research must be properly acknowledged with reference to the work's full bibliographic details. This thesis/research project may not be reproduced in any format or medium, or extensive quotations taken from it, or its content changed in any way, without first obtaining permission in writing from the copyright holder(s). If you believe that any material held in the repository infringes copyright law, please contact the Repository Team at Middlesex University via the following email address: [email protected] The item will be removed from the repository while any claim is being investigated. Multi-chip Module Interconnections at Microwave Frequencies: Electromagnetic Simulation and Material Characterisation Daiqing Li Communication Research Group School of Computing Science Middlesex University January 1999 A thesis submitted to Middlesex University in partial fulfilment of the requirements for the degree of Doctor of~hilosophy Abstract In this work both the interconnections and materials used in multi-chip modules (MCMs) at microwave frequencies have been investigated. The electrical behaviour of the interconnections was studied using commercially available 2.SD and 3D electromagnetic simulators (HFSSTM, MDSTM and Momentum™). State-of-the-art conductive and dielectric film materials used in the fabrication of multi-layer MCM structures were characterized using microstrip/waveguide resonator techniques. The models chosen for simulation of interconnections are commensurate with those in current use in MCM technology. Crosstalk between microstrip conductors in multi-layer MCM structures was simulated and new knowledge leading to new design rules was obtained. Typical elements in MCM interconnect structures, such as vias, bends and airbridges were also investigated. The principal features of these elements were simulated and the results were obtained in S-parameter form. Based on the simulated results, these parasitic elements were modelled in terms of their equivalent circuits which can be used in circuit simulators to aid more rigorous MCM circuit design. A microstrip ring resonator, fabricated using the newly developed conductive material from Heraeus, was employed to measure the line loss. New techniques have been developed to measure the permittivity and loss tangent of thin dielectric films. In the previous methods for the measurement of these films, the accuracy in measuring the relative permittivity is limited and there is no available technique to measure the loss tangent. A novel cavity perturbation method was developed to accurately measure both the relative permittivity and loss tangent of the films deposited on a supporting substrate. An additional independent technique, derived from transmission line theory, for measuring the relative permittivity of dielectric film was also established. A particular feature of the new ii teclmiques, which led to high accuracy in measuring dielectric constant and loss tangent was the positioning of the dielectric film in the region of maximum electric field strength, thereby ensuring maximum interaction between the electric field and the film material. A rigorous error analysis was performed on the new techniques, which led to the establishment of practical measurement correction factors. A simple and rigorous method has also been developed to accurately measure the loss tangent of dielectrics with known dielectric constant using a resonant cavity. The novel method eliminates the need for any physical measurement of the dielectric sample. The new technique should permit the development of techniques for very high frequency characterisation of dielectric materials. iii Acknowledgements I thank my supervisors, Dr. Charles E. Free, Dr. Peter Barnwell and Keith E. G. Pitt for their encouragement and guidance during my research. I am also grateful to Heraeus Inc. for their financial support, sample preparation and technical information. Thanks also to my colleague K. P. Tang for his support in using CAD software and helpful discussions. I thank Martin Scott, Donald Thorpe, Pathma Gunasingham and Dave Court for their assistance in preparing samples and using clean room facilities. iv Table of contents Abstract 11 Acknowledgements IV Overview of thesis Xl Chapter 1 Introductions and literature review 1 1.1 Overview of multi-chip modules(MCMs) used at high frequencies 1 1.2 The aim of this study and the approaches adopted 4 1.2.1 Simulation and modelling of interconnections in MCMs 4 1.2.2 Characterisation of MCM materials at the microwave frequencies 5 Chapter 2 Crosstalk between microstrip lines in multi-chip modules(MCMs) 12 2.1 Introduction 12 2.2 The classification of MCM teclmologies 14 2.3 Microwave theory for parallel-coupled microstrip lines 17 2.4 Simulation techniques 19 2.5 Structures investigated using HFSSTM 22 2.6 Simulation and results 25 2.7 Conclusions 32 v Chapter 3 Simulation and modelling of vias in MCMs and high density packaging in microwave frequencies 35 3.1 Introduction 35 3.2 Structures under Investigation 36 3.3 Comparison between simulated and experimental results for a grounding via 42 3.4 Simulation of cylindrical, square and wedge-shaped vias 43 3.4.1 Simulated S-parameters of vias 43 3.4.2 Simulated phase change from vias 48 3.5 Modelling of vias by equivalent circuit 52 3.6 Conclusions 55 Chapter 4 Interactions between discontinuities in proximity in MCM interconnection in microwave frequencies 58 4.1 Introduction 58 4.2 Simulation and modelling of microstrip bends in MCM interconnection 59 4.2.1 HP Momentum: a 2.5-D multi-layer planar electromagnetic field solver 59 4.2.2 Simulation and modelling of a single microstrip bend 60 4.2.3 Two offset microstrip bends 63 4.2.4 Crosstalk between two microstrip bends 65 4.2.5 Summary for simulation and modelling of mi cro strip bends 69 4.3 Interaction between vias in MCM interconnection at microwave frequencies 70 4.3.1 Simulation of a standard cylindrical grounding via 70 4.3.2 Simulation of a 35 flm cylindrical via 72 vi 4.3.3 Investigation of a 35 11m cylindrical via connected by microstrip lines with Different angles 75 4.3.4 Two offset vias 79 4.3.5 Crosstalk between two individual vias in proximity 82 4.3.6 Summary for simulation of interaction between vias 84 4.4 Simulation of airbridge in high frequency, high density packaging 85 4.4.1 The effect of airbridge height on transmission behaviour 85 4.4.2 Characteristic impedance and phase constant of airbridge line 89 4.4.3 Simulated results for airbridge 92 4.4.4 Crosstalk between airbridge lines in proximity 96 4.4.5 Summary for simulation of airbridge lines 100 Chapter 5 Design rules for interconnections in mutichip modules 102 5.1 Design rules for the minimisation of crosstalk between conductor lines 102 5.2 Design rules for intercom1ect vias in multi-layer MCM structures 103 5.3 Design rules for airbridge line in MCM interconnections 104 5.4 Design rules for interaction between discontinuities in proximity in multi-layer MCM interconnections 104 Chapter 6 Characterisation of conductive materials using a ring resonator 106 6.1 Theory of micro strip ring resonator 106 6.2 Optimisation of coupling gap for microstrip ring resonator 109 6.3 Test results