The Bipolar Junction Transistor (BJT)
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Imperial College London Department of Physics Graphene Field Effect
Imperial College London Department of Physics Graphene Field Effect Transistors arXiv:2010.10382v2 [cond-mat.mes-hall] 20 Jul 2021 By Mohamed Warda and Khodr Badih 20 July 2021 Abstract The past decade has seen rapid growth in the research area of graphene and its application to novel electronics. With Moore's law beginning to plateau, the need for post-silicon technology in industry is becoming more apparent. Moreover, exist- ing technologies are insufficient for implementing terahertz detectors and receivers, which are required for a number of applications including medical imaging and secu- rity scanning. Graphene is considered to be a key potential candidate for replacing silicon in existing CMOS technology as well as realizing field effect transistors for terahertz detection, due to its remarkable electronic properties, with observed elec- tronic mobilities reaching up to 2 × 105 cm2 V−1 s−1 in suspended graphene sam- ples. This report reviews the physics and electronic properties of graphene in the context of graphene transistor implementations. Common techniques used to syn- thesize graphene, such as mechanical exfoliation, chemical vapor deposition, and epitaxial growth are reviewed and compared. One of the challenges associated with realizing graphene transistors is that graphene is semimetallic, with a zero bandgap, which is troublesome in the context of digital electronics applications. Thus, the report also reviews different ways of opening a bandgap in graphene by using bi- layer graphene and graphene nanoribbons. The basic operation of a conventional field effect transistor is explained and key figures of merit used in the literature are extracted. Finally, a review of some examples of state-of-the-art graphene field effect transistors is presented, with particular focus on monolayer graphene, bilayer graphene, and graphene nanoribbons. -
The Reliability of the Silicon Nitride Dielectric in Capacitive MEMS
The Pennsylvania State University The Graduate School Department of Materials Science and Engineering THE RELIABILITY OF THE SILICON NITRIDE DIELECTRIC IN CAPACITIVE MEMS SWITCHES A Thesis in Materials Science and Engineering by Abuzer Dogan © 2005 Abuzer Dogan Submitted in Partial Fulfillment of the Requirements for the Degree of Master of Science August 2005 I grant The Pennsylvania State University the nonexclusive right to use this work for the University's own purposes and to make single copies of the work available to the public on a not-for-profit basis if copies are not otherwise available. Abuzer Dogan We approve the thesis of Abuzer Dogan. Date of Signature Susan Trolier-McKinstry Professor of Ceramic Science and Engineering Thesis Advisor Michael Lanagan Associate Professor of Engineering Science and Mechanics and Materials Science and Engineering Mark Horn Associate Professor of Engineering Science and Mechanics James P. Runt Professor of Polymer Science Associate Head for Graduate Studies iii ABSTRACT Silicon nitride thin film dielectrics can be used in capacitive radio frequency micro-electromechanical systems switches since they provide a low insertion loss, good isolation, and low return loss. The lifetime of these switches is believed to be adversely affected by charge trapping in the silicon nitride. These charges cause the metal bridge to be partially or fully pulled down, degrading the on-off ratio of the switch. Little information is available in the literature providing a fundamental solution to this problem. Consequently, the goals of this research were to characterize SixNy–based MIM (Metal-Insulator-Metal) capacitors and capacitive MEMS switches to measure the current-voltage response. -
Chapter Iii Power Bipolar Junction Transistor (Bjt)
50 CHAPTER III POWER BIPOLAR JUNCTION TRANSISTOR (BJT) 3.1 INTRODUCTION Switching time and switching losses are primary concerns in high power applications. These two factors can significantly influence the frequency of operation and the efficiency of the circuit. Ideally, a high power switch should be able to turn-on and turn-off controllably and with minimum switching loss. The Bipolar junction transistor is an important power semiconductor device used as a switch in a wide variety of applications. The switching speed of a BJT is often limited by the excess minority charge storage in the base and collector regions of the transistor during the saturation state. The conventional methods for improving the switching frequency by reducing the lifetime of the lightly doped collector region through incorporation of impurities such as Au, Pt or by introducing radiation-induced defects have been found unsuitable for high voltage devices due to increased leakage, soft breakdown and high ‘ON’ state voltage [27]. Among the techniques proposed to overcome these problems, use of universal contact (UC) [2, 14] is particularly promising. The present work looks in detail at the various aspects arising out of incorporation of UC in BJTs. The UC is incorporated in the transistor by creating additional diffused regions in an otherwise conventional transistor. These diffused regions influence the minority carrier distribution, nature of minority current flow and also some other parameter such as VCE(sat). To study these phenomena, 51 an analytical model is developed and is utilized to understand the effect of universal contact on reverse recovery, VCE(sat) and other related issues. -
Download Technical Paper
TECHNICAL PAPER Thermal and Electrical Breakdown Versus Reliability of Ta2O5 under Both – Bipolar Biasing Conditions P. Vašina, T. Zedníček, Z. Sita AVX Czech Republic, s.r.o., Dvorakova 328, 563 01 Lanskroun, Czech Republic J. Sikula and J. Pavelka CNRL TU Brno, Technicka 8, 602 00 Brno, Czech Republic Abstract: Our investigation of breakdown is mainly oriented to find a basic parameters describing the phenomena as well as its impact on reliability and quality of the final product that is “GOOD” tantalum capacitor. Basically, breakdown can be produced by a number of successive processes: thermal breakdown because of increasing conductance by Joule heating, avalanche and field emission break, an electromechanical collapse due to the attractive forces between electrodes electrochemical deterioration, dendrite formation and so on. Breakdown causes destruction in the insulator and across the electrodes mainly by melting and evaporation, sometimes followed by ignition. An identification of breakdown nature can be achieved from VA characteristics. Therefore, we have investigated the operating parameters both in the normal mode, Ta is a positive electrode, as well as in the reverse mode with Ta as a negative one. In the reverse mode we have reported that the thermal breakdown is initiated by an increase of the electrical conductance by Joule heating. Consequently followed in a feedback cycle consisting of temperature - conductivity - current - Joule heat - temperature. In normal mode an electrical breakdown can be stimulated by an increase of the electrical conductance in a channel by an electrical pulse and stored charge leads to the sample destruction. Both of these breakdowns have got a stochastic behaviour and could be hardly localized in advance. -
ECE 255, Diodes and Rectifiers
ECE 255, Diodes and Rectifiers 23 January 2018 In this lecture, we will discuss the use of Zener diode as voltage regulators, diode as rectifiers, and as clamping circuits. 1 Zener Diodes In the reverse biased operation, a Zener diode displays a voltage breakdown where the current rapidly increases within a small range of voltage change. This property can be used to limit the voltage within a small range for a large range of current. The symbol for a Zener diode is shown in Figure 1. Figure 1: The symbol for a Zener diode under reverse biased (Courtesy of Sedra and Smith). Figure 2 shows the i-v relation of a Zener diode near its operating point where the diode is in the breakdown regime. The beginning of the breakdown point is labeled by the current IZK also called the knee current. The oper- ating point can be approximated by an incremental resistance, or dynamic resistance described by the reciprocal of the slope of the point. Since the slope, dI proportional to dV , is large, the incremental resistance is small, generally on the order of a few ohms to a few tens of ohms. The spec sheet usually gives the voltage of the diode at a specified test current IZT . Printed on March 14, 2018 at 10 : 29: W.C. Chew and S.K. Gupta. 1 Figure 2: The i-v characteristic of a Zener diode at its operating point Q (Cour- tesy of Sedra and Smith). The diode can be fabricated to have breakdown voltage of a few volts to a few hundred volts. -
MOSFET Technology Scaling, Leakage Current, and Other Topics
Chapter 7 MOSFET Technology Scaling, Leakage Current and Other Topics 7.1 Technology Scaling Small is Beautiful YEAR 1992 1995 1997 1999 2001 2004 2007 2010 Technology 0.5 0.35 0.25 0.18 0.13 90 65 45 Generation µµµm µµµm µµµm µµµm µµµm nm nm nm • New technology node every three years or so. Defined by minimum metal line width. • All feature sizes, e.g. gate length, are ~70% of previous node. • Reduction of circuit size by 2 good for cost. Semiconductor Devices for Integrated Circuits (C. Hu) Slide 7-1 International Technology Roadmap for Semiconductors, 1999 Edition Year of Shipment 1999 2002 2005 2008 2011 2014 DRAM metal half pitch 180 130 100 70 50 35 (nm) MPU physical Lg (nm) 140 85 65 45 32 22 Tox (nm) 1.5-1.8 1.5-1.9 1-1.5 0.8-1.2 0.6-0.8 0.5-0.6 VDD 1.5-1.8 1.2-1.5 0.9-1.2 0.6-0.9 0.5-0.6 0.3-0.6 µµµ µµµ Ion,HP ( A/ m) 750/350 750/350 750/350 750/350 750/350 750/350 µµµ Ioff,HP (nA/ m) 5 10 20 40 60 160 µµµ µµµ Ion,LP ( A/ m) 490/230 490/230 490/230 490/230 490/230 490/230 µµµ Ioff,LP (pA/ m) 7 10 20 40 80 160 No known solutions •Vdd is reduced at each node to contain power consumption in spite of rising transistor density and frequency •Tox is reduced to raise I on for speed consideration Semiconductor Devices for Integrated Circuits (C. -
Leakage Current and Breakdown Electric-Field Studies on Ultrathin
APPLIED PHYSICS LETTERS 87, 182904 ͑2005͒ Leakage current and breakdown electric-field studies on ultrathin atomic-layer-deposited Al2O3 on GaAs ͒ H. C. Lin and P. D. Yea School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907 G. D. Wilk Advanced Semiconductor Materials (ASM) America, 3440 East University Drive, Phoenix, Arizona 85034 ͑Received 29 June 2005; accepted 1 September 2005; published online 25 October 2005͒ Atomic-layer deposition ͑ALD͒ provides a unique opportunity to integrate high-quality gate dielectrics on III-V compound semiconductors. We report detailed leakage current and breakdown electric-field characteristics of ultrathin Al2O3 dielectrics on GaAs grown by ALD. The leakage current in ultrathin Al2O3 on GaAs is comparable to or even lower than that of state-of-the-art SiO2 on Si, not counting the high-k dielectric properties for Al2O3. A Fowler-Nordheim tunneling analysis on the GaAs/Al2O3 barrier height is also presented. The breakdown electric field of Al2O3 is measured as high as 10 MV/cm as a bulk property. A significant enhancement on breakdown electric field up to 30 MV/cm is observed as the film thickness approaches to 1 nm. © 2005 American Institute of Physics. ͓DOI: 10.1063/1.2120904͔ Al2O3 is a widely used insulating material for gate di- sured as high as 10 MV/cm for films thicker than 50 Å, electric, tunneling barrier, and protection coating due to its which is near the bulk breakdown electric field for ALD excellent dielectric properties, strong adhesion to dissimilar Al2O3. A significant enhancement on breakdown electric materials, and its thermal and chemical stabilities. -
Capacitors and Dielectrics Dielectric - a Non-Conducting Material (Glass, Paper, Rubber….)
Capacitors and Dielectrics Dielectric - A non-conducting material (glass, paper, rubber….) Placing a dielectric material between the plates of a capacitor serves three functions: 1. Maintains a small separation between the plates 2. Increases the maximum operating voltage between the plates. 3. Increases the capacitance In order to prove why the maximum operating voltage and capacitance increases we must look at an atomic description of the dielectric. For now we will show that the capacitance increases by looking at an experimental result: Experiment Since VVCCoo, then Since Q is the same: Coo V CV C V o K CVo C K Dielectric Constant Co Since C > Co , then K > 1 C kCo V V o k kvacuum = 1 (vacuum) k = 1.00059 (air) kglass = 5-10 Material Dielectric Constant k Dielectric Strength (V/m) Air 1.00054 3 Paper 3.5 16 Pyrex glass 4.7 14 A real dielectric is not a perfect insulator and thus you will always have some leakage current between the plates of the capacitor. For a parallel-plate capacitor: C kCo kA C o d From this equation it appears that C can be made as large as possible by decreasing d and thus be able to store a very large amount of charge or equivalently a very large amount of energy. Is there a limit on how much charge (energy) a capacitor can store? YES!! +q K e- - F =qE E e e- E dielectric -q As charge ‘q’ is added to the capacitor plates, the E-field will increase until the dielectric becomes a conductor (dielectric breakdown). -
Power MOSFET Basics by Vrej Barkhordarian, International Rectifier, El Segundo, Ca
Power MOSFET Basics By Vrej Barkhordarian, International Rectifier, El Segundo, Ca. Breakdown Voltage......................................... 5 On-resistance.................................................. 6 Transconductance............................................ 6 Threshold Voltage........................................... 7 Diode Forward Voltage.................................. 7 Power Dissipation........................................... 7 Dynamic Characteristics................................ 8 Gate Charge.................................................... 10 dV/dt Capability............................................... 11 www.irf.com Power MOSFET Basics Vrej Barkhordarian, International Rectifier, El Segundo, Ca. Discrete power MOSFETs Source Field Gate Gate Drain employ semiconductor Contact Oxide Oxide Metallization Contact processing techniques that are similar to those of today's VLSI circuits, although the device geometry, voltage and current n* Drain levels are significantly different n* Source t from the design used in VLSI ox devices. The metal oxide semiconductor field effect p-Substrate transistor (MOSFET) is based on the original field-effect Channel l transistor introduced in the 70s. Figure 1 shows the device schematic, transfer (a) characteristics and device symbol for a MOSFET. The ID invention of the power MOSFET was partly driven by the limitations of bipolar power junction transistors (BJTs) which, until recently, was the device of choice in power electronics applications. 0 0 V V Although it is not possible to T GS define absolutely the operating (b) boundaries of a power device, we will loosely refer to the I power device as any device D that can switch at least 1A. D The bipolar power transistor is a current controlled device. A SB (Channel or Substrate) large base drive current as G high as one-fifth of the collector current is required to S keep the device in the ON (c) state. Figure 1. Power MOSFET (a) Schematic, (b) Transfer Characteristics, (c) Also, higher reverse base drive Device Symbol. -
Analyzing the Effect of Gate Dielectric on the Leakage Currents
MATEC Web of Conferences57, 01028 (2016) DOI: 10.1051/matecconf/2016 57 01028 ICAET - 2016 Analyzing the effect of gate dielectric on the leakage currents Sakshi, Sandeep Dhariwal and Amandeep Singh Lovely Professional University- Phagwara, India Abstract. An analytical threshold voltage model for MOSFETs has been developed using different gate dielectric oxides by using MATLAB software. This paper explains the dependency of threshold voltage on the dielectric material. The variation in the subthreshold currents with the change in the threshold voltage sue to the change of dielectric material has also been studied. Index Terms— threshold voltage, gate dielectric oxides, subthreshold currents Basic material properties which are important for the selection of alternative gate dielectric are dielectric permittivity, band gap, band alignment with respect to 1 INTRODUCTION silicon, thermodynamic stability, film morphology and Earlier the VLSI designers were mainly concerned about uniformity, interface quality, and reliability [4]. the performance and miniaturization of the VLSI devices. For the last few years, power dissipation has been a serious issue because of the significant growth in portable computing and wireless communication. For more than 40 years, silicon dioxide has been used as dielectric because of its manufacturability and providing a continuous improved transistor performance as it is grown thinner and thinner [1-2]. The scaling of gate dielectric is done to improve the MOS transistor performance. The continuous scaling down of physical thickness of the gate dielectric and gate length has improved device performance and increased packing densities. Because of continuous scaling, the silicon dioxide dielectric thickness has been reduced to such an extent that further scaling will lead to increase in poly- Si gate depletion, gate dopant penetration, power consumption, etc. -
Dielectric Strength of Insulator Materials
electrical-engineering-portal.com http://electrical-engineering-portal.com/dielectric-strength-insulator-materials Dielectric Strength Of Insulator Materials Edvard The atoms in insulating materials have very tightly- bound electrons, resisting free electron flow very well. However, insulators cannot resist indefinite amounts of voltage. With enough voltage applied, any insulating material will eventually succumb to the electrical ”pressure” and electron flow will occur. However, unlike the situation with conductors where current is in a linear proportion to applied voltage (given a fixed resistance), current through an insulator is quite nonlinear: for voltages below a certain threshold level, virtually no electrons will flow, but if the voltage exceeds that threshold, there will be a rush of current. Once current is forced through an insulating material, breakdown of that material’s molecular structure has Medium voltage mastic tape - self-amalgamating insulating compound occurred. After breakdown, the material may or may designed for quick, void-free insulation layering not behave as an insulator any more, the molecular structure having been altered by the breach. There is usually a localized ”puncture” of the insulating medium where the electrons flowed during breakdown. Dielectric strength comparison between materials Material * Dielectric strength (kV/inch) Vacuum 20 Air 20 to 75 Porcelain 40 to 200 Paraffin Wax 200 to 300 Transformer Oil 400 Bakelite 300 to 550 Rubber 450 to 700 Shellac 900 Paper 1250 Teflon 1500 Glass 2000 to 3000 Mica 5000 * = Materials listed are specially prepared for electrical use. Thickness of an insulating material plays a role in determining its breakdown voltage, otherwise known as dielectric strength. -
2300V Reverse Breakdown Voltage Ga2o3 Schottky Rectifiers
Q92 ECS Journal of Solid State Science and Technology, 7 (5) Q92-Q96 (2018) 2162-8769/2018/7(5)/Q92/5/$37.00 © The Electrochemical Society 2300V Reverse Breakdown Voltage Ga2O3 Schottky Rectifiers Jiancheng Yang,1,∗ F. Ren, 1,∗∗ Marko Tadjer,2 S. J. Pearton, 3,∗∗,z and A. Kuramata4 1Department of Chemical Engineering, University of Florida, Gainesville, Florida 32611, USA 2Naval Research Laboratory, Washington, DC 20375, USA 3Department of Materials Science and Engineering, University of Florida, Gainesville, Florida 32611, USA 4Tamura Corporation and Novel Crystal Technology, Inc., Sayama, Saitama 350-1328, Japan We report field-plated Schottky rectifiers of various dimensions (circular geometry with diameter 50–200 μm and square diodes −3 −2 2 15 −3 with areas 4 × 10 –10 cm ) fabricated on thick (20μm), lightly doped (n = 2.10 × 10 cm ) β-Ga2O3 epitaxial layers grown by Hydride Vapor Phase Epitaxy on conducting (n = 3.6 × 1018 cm−3) substrates grown by Edge-Defined, Film-Fed growth. The −4 −2 maximum reverse breakdown voltage (VB) was 2300V for a 150 μm diameter device (area = 1.77 × 10 cm ), corresponding to a breakdown field of 1.15 MV.cm−1. The reverse current was only 15.6 μA at this voltage. This breakdown voltage is highest reported 2 2 for Ga2O3 rectifiers. The on-state resistance (RON) for these devices was 0.25 .cm , leading to a figure of merit (VB /RON)of21.2 MW.cm−2. The Schottky barrier height of the Ni was 1.03 eV, with an ideality factor of 1.1 and a Richardson’s constant of 43.35 A.cm−2.K−2 obtained from the temperature dependence of the forward current density.