Reliable Design of Three-Dimensional Integrated Circuits
Reliable Design of Three-Dimensional Integrated Circuits For obtaining the academic degree of Doctor of Engineering Department of Informatics Karlsruhe Institute of Technology (KIT) Karlsruhe, Germany Approved Dissertation by Master of Science Shengcheng Wang From Tianjin, China Date of Oral Examination: 04.05.2018 Supervisor: Prof. Dr. Mehdi Baradaran Tahoori, Karlsruhe Institute of Technology Co-supervisor: Prof. Dr. Said Hamdioui, Delft University of Technology ii Shengcheng Wang Haid-und-Neu Str. 62 76131 Karlsruhe Hiermit erkläre ich an Eides statt, dass ich die von mir vorgelegte Arbeit selbstständig verfasst habe, dass ich die verwendeten Quellen, Internet-Quellen und Hilfsmittel voll- ständig angegeben haben und dass ich die Stellen der Arbeit - einschließlich Tabellen, Karten und Abbildungen - die anderen Werken oder dem Internet im Wortlaut oder dem Sinn nach entnommen sind, auf jeden Fall unter Angabe der Quelle als Entlehnung kenntlich gemacht habe. Karlsruhe, Mai 2018 ——————————— Shengcheng Wang iii This page would be intentionally left blank. Abstract Beginning with the invention of the first Integrated Circuit (IC) by Kilby and Noyce in 1959, performance growth inIC is realized primarily by geometrical scaling, which has resulted in a steady doubling of device density from one technology node to another. This observation was famously known as “Moore’s law”. However, the performance en- hancement due to traditional technology scaling has begun to slow down and present diminishing returns due to a number of imminent show-stoppers, including fundamen- tal physical limits of transistor scaling, the growing significance of quantum effects as transistors shrink, and a mismatch between transistors and interconnects regarding size, speed and power.
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