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Neda Shahabi Ghahfarokhi Thesis (PDF 1MB) Minimising Capacitive Couplings and Distributing Copper Losses in Planar Magnetic Elements This thesis is submitted in partial fulfilment of requirements for the degree of Master of Engineering Neda Shahabi Ghafarokhi (B.Eg) Engineering systems/Built Environment and Engineering DECEMBER 2010 STATEMENT OF ORIGINAL AUTHOUSHIP The work submitted in this thesis, has not been previously published for a degree or diploma, at any other education institution. To the best of my knowledge and belief the materials contained in this thesis are belongs to the author except from the referenced subjects. Neda Shahabi Ghahfarokhi Date ACKNOWLDGMENTS I express my gratitude to my supervisor Associated Professor Firuz Zare for his continuous guidance and financial support over this work. I express my sincere thanks to my beloved husband, Arash, for his great assistance, encouragement and advices during this research. Finally I dedicate this trivial work to my dear parents for their infinite love and support. ABSTRACT Planar magnetic elements are becoming a replacement for their conventional rivals. Among the reasons supporting their application, is their smaller size. Taking less bulk in the electronic package is a critical advantage from the manufacturing point of view. The planar structure consists of the PCB copper tracks to generate the desired windings .The windings on each PCB layer could be connected in various ways to other winding layers to produce a series or parallel connection. These windings could be applied coreless or with a core depending on the application in Switched Mode Power Supplies (SMPS). Planar shapes of the tracks increase the effective conduction area in the windings, brings about more inductance compared to the conventional windings with the similar copper loss case. The problem arising from the planar structure of magnetic inductors is the leakage current between the layers generated by a pulse width modulated voltage across the inductor. This current value relies on the capacitive coupling between the layers, which in its turn depends on the physical parameters of the planar scheme. In order to reduce this electrical power dissipation due to the leakage current and Electromagnetic Interference (EMI), reconsideration in the planar structure might be effective. The aim of this research is to address problem of these capacitive coupling in planar layers and to find out a better structure for the planar inductance which offers less total capacitive coupling and thus less thermal dissipation from the leakage currents. Through Finite Element methods (FEM) several simulations have been carried out for various planar structures. The labs prototypes of these structures are built with the similar specification of the simulation cases. The capacitive couplings of the samples are determined with Spectrum Analyser whereby the test analysis verified the simulation results. Keywords: Planar magnetic element, Equivalent capacitive coupling, High frequency modelling, Electromagnetic interferences, Power electronics. CONTRIBIUTIONS Planar magnetic elements have less bulk and are a better substitute for the conventional winding types of inductors. The main problem with these planar elements is the relatively high capacitive couplings between their layers. In this thesis different structures of planar elements are analysed and the main contributions are as followed: 1) In the third chapter with applying the 3D Finite Element analysis in two layer planar elements, different structures are compared. The main focus is on shifting effect of the layer positions with respect to the other, which is verified through the FE simulation and tests. Thus shifting would be effective in reduction of the total capacitive coupling in a planar element with two layers. 2) In chapter four, the idea of shifting the layers has been extended to multi- layer planar elements to find out the effectiveness of the layer shifting in the equivalent capacitive coupling reduction. The simulation and test results show the failure of this idea for multilayer structure. 3) The fifth chapter introduces of a novel structure for multi-layer planar elements which is effective in reduction of the total capacitive couplings compared to the simple structures. These results are verified with simulation and experimental tests. The results of this research are prepared as two accepted international conference papers and two submitted journal papers: Neda Shahabi,F. Zare, G.ledwich, “New configuration winding method for reduction of capacitive coupling in planar magnetic elements,” EPE-PEMC ,power electronic and drives automation, OHRID,SEP 2010 published. Neda Shahabi,F. Zare, G.ledwich, “ A novel structure to decrease of capacitive coupling in planar magnetic elements”, AUPEC ,Power Electronic and Drives Automation, New Zealand,DEC2010 accepted Neda Shahabi,F. Zare, G.ledwich , “ Improving quality of planar inductors and transformers by minimizing capacitive couplings and distributing copper losses” under review for IET, Power Electronic journal. Neda Shahabi,F. Zare, G.ledwich, “ New configuration winding method for reduction of capacitive coupling in planar magnetic elements. selected by the editor of journal of Energy and Power ENG to be considered for publishing TABLE OF CONTENTS Statement of Original Authorship.............................................................................................................i Acknowledgment................................................................................................................................ii Abstract...........................................................................................................................................iii Keywords.........................................................................................................................................iv Contribution.......................................................................................................................................v Table of Contents..............................................................................................................................vii List of Figures.................................................................................................................................ix List of Tables.................................................................................................................................xiii Abbreviations................................................................................................................................xiv 1.0 Introduction........................................................................................................1 1.1 Prologue to Investigation............................................................................................................1 1.2 Literature review.......................................................................................................................5 1.2.1 Capacitive Coupling in Planar Magnetic Elements........................................................5 1.2.2 Methods for reduction f capacitive coupling........................................................... 1.2.3 Electromagnetic Interference (EMI)..........................................................................7 1.2.4 Skin Effect and Proximity Effect in Planar Elements................................................9 1.2.5 Inductance and Leakage Inductance in Planar Elements............................................10 1.2.6 Winding Arrangement in Planar Capacitive Coupling..........................................13 1.3 Finite Element Method Introduction.....................................................................................15 1.3.1 Finite Element Introduction in Electrostatic Problem............................................17 1.3.2 Magnetostatic and Finite Element Equations..........................................................20 1.4 Instruction to ANSYS (Mechanical ADPL)..........................................................................21 2.0 Planar Inductor Impedance Characteristics................................................24 2.1 Introduction.........................................................................................................................24 2.2 Capacitive Coupling in Planar Elements................................................................................26 2.2.1 Calculation of Capacitive Coupling between Planar Tracks.......................................27 2.2.2 2D FE Analysis of Capacitive Coupling in Planar Elements.....................................29 2.2.3 Shifting Effect on the capacitive coupling between Planar Tracks............................29 2.2.4 Relation between Insulation Thickness and Capacitive Coupling of the Planar Tracks.........................................................................................................................29 2.3 Electrical Resistance in Planar Elements..............................................................................38 2.3.1 Relation between Current Direction and Electrical Resistance..................................41 2.3.2 Effect of Shifting on the Electrical Resistance of Planar Tracks..........................50 2.3.3 Relation between Insulation Thickness and Resistance.......................................53 3.0 Shifting Effect of Planar Layers on Total Capacitive Coupling of Two Planar Element................................................................................................58
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