Texas Instruments Incorporated
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OMAP2430 Applications Processor
TM Technology for Innovators OMAP2430 applications processor All-in-One Key features entertainment • Advanced Imaging, Video and Audio Accelerator (IVA™ 2) boosts video for 3G mobile performance in mobile phones by up to 4X and imaging performance by up to 1.5X phones • Delivering a multimedia experience with consumer electronics quality to the handset • Multi-engine parallel processing architecture for supporting complex usage scenarios • Built-in M-Shield™ mobile security technology enables value-added services and terminal security • Support for all major High Level Operating Systems (HLOS) aids applications development PRODUCT BULLETIN Leading imaging The new OMAP2430 processor from Texas Instruments (TI) delivers a new and video level of multimedia performance to third-generation (3G) mobile phones and performance other handheld systems. Leveraging TI’s proven OMAP™ 2 architecture, the OMAP2430 features an advanced imaging, video and audio accelerator (IVA™ 2) that provides a 4X improvement in video processing and 1.5X improvement in image processing over previously available solutions for mobile phones. The processor’s high video performance enables advanced codec algorithms that promote higher compression ratios allowing networks to support more data, bringing down costs for service providers and allowing them to deploy revenue- generating services such as mobile digital TV and mobile-to-mobile gaming. Support for these services, plus high-resolution, high-speed decode of standard video compression algorithms, brings a TV-like viewing quality and the familiar features of consumer electronics to mobile communications. The OMAP2430 is optimized for the complex applications characteristic of 3G wireless communications. Offering even higher performance than first-generation OMAP 2 processors while at a lower cost, the OMAP2430 processor provides the ultimate balance between multimedia performance, flexibility, power and cost. -
Remuneration Policy for the Board of Management of Asml Holding N.V
REMUNERATION POLICY FOR THE BOARD OF MANAGEMENT OF ASML HOLDING N.V. (VERSION 2021) Remuneration Policy for the Board of Management of ASML Holding N.V. (version 2021) Public Board of Management Remuneration Policy 2021 This remuneration policy for the Board of Management of ASML Holding N.V. (“BoM”) applies as from January 1, 2021 onwards. The remuneration policy was approved by the Supervisory Board (“SB”) of ASML, upon recommendation of its Remuneration Committee (“RC”) and adopted by the General Meeting (“GM”) on 29 April 2021. The Works Council exercised its right to cast its advisory vote prior to adoption. Remuneration as a strategic instrument The remuneration policy supports the long-term development and strategy of the Company in a highly dynamic environment, while aiming to fulfill all stakeholders’ requirements and keeping an acceptable risk profile. More than ever, the challenge for us is to drive technology, to serve our customers and to satisfy our stakeholders. These drivers are embedded in the identity, mission and values of ASML and its affiliated enterprises and are the backbone of the remuneration policy. The SB ensures that the policy and its implementation are linked to the Company’s objectives. The objective of the remuneration policy is to enable ASML to attract, motivate and retain qualified industry professionals for the BoM in order to define and achieve our strategic goals. The policy acknowledges the internal and external context as well as our business needs and long-term strategy. The policy is designed to encourage behavior that is focused on long-term value creation and the long-term interests and sustainability of the Company, while adopting the highest standards of good corporate governance. -
Ethics Agreement in Order to Avoid Any Financial Conflict
Date: 7 .-e-•15 Iett..% 1--4 17 MEMORANDUM FOR THE RECORD SUBJECT: Ethics Agreement In order to avoid any financial conflict of interest in violation of 18 U.S.C. § 208(a) or the appearance of a financial conflict of interest as defined in the Standards of Ethical Conduct for Employees of the Executive Branch, 5 C.F.R. § 2635.502, and to adhere to the Ethics Pledge instituted by Executive Order 13770 issued on January 28, 2017, and entitled "Ethics Commitments by Executive Branch Appointees" (the Ethics Pledge), I am issuing the following statement. I understand that as an appointee I must sign the Ethics Pledge and that I will be bound by the requirements and restrictions therein even if not specifically mentioned in this or any other ethics agreement. Before beginning my covered Federal position, I resigned from my non-Federal positions with the Association of State and Territorial Health Officials (ASTHO) and the State of Georgia on July 6, 2017. Pursuant to the Ethics Pledge, I will not, for a period of two years from the date of my appointment to my covered Federal position, participate in an official capacity in any particular matter involving specific parties that is directly and substantially related to ASTHO, unless an exception applies or I am granted a waiver. I understand that this provision in the Ethics Pledge does not apply to state government entities, including the State of Georgia. Even when the two-year restriction of the Ethics Pledge does not apply, under 5 C.F.R. § 2635.502, I will not, for a period of one year from the date of my resignation from ASTHO and the State of Georgia, participate in any particular matter involving specific parties in which ASTHO or the State of Georgia is a party or represents a party, unless I am first authorized to participate, pursuant to 5 C.F.R. -
Analog Devices, Inc. (Exact Name of Registrant As Specified in Its Charter)
UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 Form 10-K (Mark One) ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended October 28, 2017 OR TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the transition period from to Commission File No. 1-7819 Analog Devices, Inc. (Exact name of registrant as specified in its charter) Massachusetts 04-2348234 (State or other jurisdiction of incorporation or organization) (I.R.S. Employer Identification No.) One Technology Way, Norwood, MA 02062-9106 (Address of principal executive offices) (Zip Code) (781) 329-4700 (Registrant’s telephone number, including area code) ______________________________ Securities registered pursuant to Section 12(b) of the Act: Common Stock $0.16 2/3 Par Value Nasdaq Global Select Market Title of Each Class Name of Each Exchange on Which Registered Securities registered pursuant to Section 12(g) of the Act: None Title of Class Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. YES NO Indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or Section 15(d) of the Act. YES NO Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days. -
GS40 0.11-Μm CMOS Standard Cell/Gate Array
GS40 0.11-µm CMOS Standard Cell/Gate Array Version 1.0 January 29, 2001 Copyright Texas Instruments Incorporated, 2001 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the materials, methods, techniques, or apparatus described herein are the exclusive property of Texas Instruments. No disclosure of information or drawings shall be made to any other person or organization without the prior consent of Texas Instruments. IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this war- ranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WAR- RANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. -
NXP's A71CH Trust Anchor Solution Delivers Secure Connections to Google Cloud Iot Core
NXP's A71CH Trust Anchor Solution Delivers Secure Connections to Google Cloud IoT Core September 10, 2018 Collaboration brings “zero-touch” onboarding of devices to Google Cloud IoT with NXP A71CH, Plug & Trust Secure Element EINDHOVEN, The Netherlands, Sept. 10, 2018 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) today officially announced a solution for secure, scalable connections of devices using NXP’s A71CH to Google IoT Cloud. NXP is providing Original Equipment Manufacturers (OEMs) a “Plug & Trust” experience for authenticating to Google Cloud IoT Core. NXP’s A71CH is a trust anchor, ready-to-use security solution designed for integration into next-generation IoT devices, such as edge nodes and gateways. When embedded into devices, the chip signs a secure token and is validated by Google IoT Core to enable seamless peer-to-peer cloud connections with private credentials pre-injected for autonomous cloud onboarding and authentication. “Security is a critical concern that must be top of mind when deploying and managing IoT devices that connect to the cloud,” said Antony Passemard, Head of Product, Cloud IoT at Google. “This solution makes it easy for developers to add a strong identity encryption and access control. We’re happy to work with NXP, a recognized industry leader in IoT and security, to simplify development of IoT devices with embedded security.” “Security-by-design is key to unlocking the next wave of IoT device connections,” said Philippe Dubois, senior director and general manager of IoT security solutions at NXP. “Our solution aims to solve scalability and complexity issues commonly associated with securing and managing edge devices. -
Fund Holdings As of 6/30/2021 Massmutual Balanced Fund Invesco Prior to 5/1/2021, the Fund Name Was Massmutual Premier Balanced Fund
Fund Holdings As of 6/30/2021 MassMutual Balanced Fund Invesco Prior to 5/1/2021, the Fund name was MassMutual Premier Balanced Fund. Fund Shares or Par Position Market Security Name Ticker CUSIP Weighting % Amount Value Apple Inc AAPL 037833100 3.91 48,433 6,633,384 Microsoft Corp MSFT 594918104 3.45 21,552 5,838,437 USTREAS T-Bill Auction Ave 3 Mon 1.69 2,862,977 JPMorgan Chase & Co JPM 46625H100 1.56 16,948 2,636,092 Verizon Communications Inc VZ 92343V104 1.45 43,768 2,452,321 The Home Depot Inc HD 437076102 1.42 7,556 2,409,533 Intel Corp INTC 458140100 1.29 38,961 2,187,271 Procter & Gamble Co PG 742718109 1.04 13,105 1,768,258 Cisco Systems Inc CSCO 17275R102 1.03 32,830 1,739,990 UnitedHealth Group Inc UNH 91324P102 1.00 4,215 1,687,855 Comcast Corp Class A CMCSA 20030N101 0.94 28,021 1,597,757 AT&T Inc T 00206R102 0.91 53,587 1,542,234 Oracle Corp ORCL 68389X105 0.83 18,031 1,403,533 Deere & Co DE 244199105 0.76 3,635 1,282,101 Accenture PLC Class A ACN G1151C101 0.74 4,237 1,249,025 Johnson Controls International PLC JCI G51502105 0.74 18,185 1,248,037 Visa Inc Class A V 92826C839 0.71 5,152 1,204,641 Texas Instruments Inc TXN 882508104 0.70 6,128 1,178,414 Costco Wholesale Corp COST 22160K105 0.67 2,850 1,127,660 Bank of America Corp BAC 060505104 0.64 26,192 1,079,896 Broadcom Inc AVGO 11135F101 0.63 2,223 1,060,015 Abbott Laboratories ABT 002824100 0.57 8,348 967,784 Target Corp TGT 87612E106 0.56 3,949 954,631 Honeywell International Inc HON 438516106 0.56 4,324 948,469 Goldman Sachs Group Inc GS 38141G104 0.53 2,374 901,004 -
Integrated Step-Down Converter with SVID Interface for Intel® CPU
Product Order Technical Tools & Support & Folder Now Documents Software Community TPS53820 SLUSE33 –FEBRUARY 2020 Integrated Step-Down Converter with SVID Interface for Intel® CPU Power Supply 1 Features 3 Description The TPS53820 device is D-CAP+ mode integrated 1• Single chip to support Intel VR13.HC SVID POL applications step-down converter for low current SVID rails of Intel CPU power supply. It provides up to two outputs to • Two outputs to support VCCANA (5.5 A) and power the low current SVID rails such as VCCANA P1V8 (4 A) (5.5 A) and P1V8 (4 A). The device employs D-CAP+ • D-CAP+™ Control for Fast Transient Response mode control to provide fast load transient • Wide Input Voltage (4.5 V to 15 V) performance. Internal compensation allows ease of use and reduces external components. • Differential Remote Sense • Programmable Internal Loop Compensation The device also provides telemetry, including input voltage, output voltage, output current and • Per-Phase Cycle-by-Cycle Current Limit temperature reporting. Over voltage, over current and • Programmable Frequency from 800 kHz to 2 MHz over temperature protections are provided as well. 2 • I C System Interface for Telemetry of Voltage, The TPS53820 device is packaged in a thermally Current, Output Power, Temperature, and Fault enhanced 35-pin QFN and operates between –40°C Conditions and 125°C. • Over-Current, Over-Voltage, Over-Temperature (1) protections Table 1. Device Information • Low Quiescent Current PART NUMBER PACKAGE BODY SIZE (NOM) • 5 mm × 5 mm, 35-Pin QFN, PowerPAD Package TPS53820 RWZ (35) 5 mm × 5 mm (1) For all available packages, see the orderable addendum at 2 Applications the end of the data sheet. -
NXP Semiconductors NV
SECURITIES AND EXCHANGE COMMISSION FORM SC 14D9/A Tender offer solicitation / recommendation statements filed under Rule 14d-9 [amend] Filing Date: 2017-12-13 SEC Accession No. 0000914121-17-001815 (HTML Version on secdatabase.com) SUBJECT COMPANY NXP Semiconductors N.V. Mailing Address Business Address HIGH TECH CAMPUS 60 31 40 27 43704 CIK:1413447| IRS No.: 000000000 EINDHOVEN P7 5656AG Type: SC 14D9/A | Act: 34 | File No.: 005-85657 | Film No.: 171253046 SIC: 3674 Semiconductors & related devices FILED BY ELLIOTT ASSOCIATES, L.P. Mailing Address Business Address 40 WEST 57TH STREET 40 WEST 57TH STREET CIK:904495| IRS No.: 222140975 | State of Incorp.:DE | Fiscal Year End: 1231 30TH FLOOR 30TH FLOOR Type: SC 14D9/A NEW YORK NY 10019 NEW YORK NY 10019 2125062999 Copyright © 2017 www.secdatabase.com. All Rights Reserved. Please Consider the Environment Before Printing This Document UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, DC 20549 AMENDMENT NO. 1 to SCHEDULE 14D-9 (RULE 14d-101) SOLICITATION/RECOMMENDATION STATEMENT UNDER SECTION 14(D)(4) OF THE SECURITIES EXCHANGE ACT OF 1934 NXP Semiconductors N.V. (Name of Subject Company) Elliott Associates, L.P. Elliott International, L.P. Paul E. Singer Elliott Capital Advisors, L.P. Elliott Special GP, LLC Braxton Associates, Inc. Elliott Asset Management LLC Elliott International Capital Advisors Inc. Hambledon, Inc. Elliott Management Corporation The Liverpool Limited Partnership Liverpool Associates Ltd. Elliott Advisors (UK) Limited Manchester Securities Corp. (Name of Person(s) Filing Statement) Common Shares, par value EUR 0.20 per share (Title of Class of Securities) N6596X109 (CUSIP Number of Class of Securities) Richard M. -
A Report on Semiconductor Foundry Access by US Academics (Discussion Held at a Meeting Virtually Held at the National Science Foundation on Dec 16, 2020)
A Report on Semiconductor Foundry Access by US Academics (Discussion held at a meeting virtually held at the National Science Foundation on Dec 16, 2020) Organizers: Sankar Basu1, Erik Brunvand2, Subhasish Mitra3, H.-S. Philip Wong4 Scribes: Sayeef Salahuddin5, Shimeng Yu6 1 NSF, [email protected] 2 NSF, [email protected] 3 Stanford University, [email protected] 4 Stanford University, [email protected] 5 University of California, Berkeley, [email protected] 6 Georgia Institute of Technology, [email protected] 2 Executive Summary Semiconductor technology and microelectronics7 is a foundational technology that without its continued advancement, the promises of artificial intelligence (AI), 5G/6G communication, and quantum computing will never be realized in practice. Our nation’s economic competitiveness, technology leadership, and national security, depend on our staying at the forefront of microelectronics. We must accelerate the pace of innovation and broaden the pool of researchers who possess research capability in circuit design and device technologies, and provide a pathway to translate these innovations to industry. This meeting has brought to the fore the urgent need for access to semiconductor foundry and design ecosystem to achieve these goals. Microelectronics is a field that requires sustained and rapid innovations, especially as the historical rate of progress following a predictable path, is no longer guaranteed as it had been in the past. Yet, there are many plausible paths to move forward, and the potential for further advances is immense. There is a future in system integration of heterogeneous technologies that requires end-to-end co-design and innovation. Isolated push along silos, such as miniaturization of components, will be inadequate. -
UNITED STATES SECURITIES and EXCHANGE COMMISSION Washington, D.C
QuickLinks -- Click here to rapidly navigate through this document UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 SCHEDULE TO Tender Offer Statement under Section 14(d)(1) or 13(e)(1) of the Securities Exchange Act of 1934 (Amendment No. 23) NXP Semiconductors N.V. (Name of Subject Company (Issuer)) Qualcomm River Holdings B.V. (Offeror) an indirect, wholly-owned subsidiary of QUALCOMM Incorporated (Ultimate Parent of Offeror) (Names of Filing Persons (identifying status as offeror, issuer or other person)) Common shares, par value €0.20 per share (Title of Class of Securities) N6596X109 (CUSIP Number of Class of Securities) Donald J. Rosenberg Executive Vice President, General Counsel and Corporate Secretary QUALCOMM Incorporated 5775 Morehouse Drive San Diego, California 92121 Telephone: (858) 587-1121 (Name, address and telephone number of person authorized to receive notices and communications on behalf of filing persons) with copies to: Scott A. Barshay Christiaan de Brauw Steven J. Williams Allen & Overy LLP Paul, Weiss, Rifkind, Wharton & Garrison LLP Apollolaan 15 1285 Avenue of the Americas PO Box 75440 New York, NY 10019 Amsterdam 1070 AK +1 212 373 3000 Netherlands +31 20 674 1000 CALCULATION OF FILING FEE Transaction Valuation* Amount of Filing Fee** $44,805,140,610.61 $5,247,572.95 * Calculated solely for purposes of determining the filing fee. The calculation of the transaction value is determined by adding the sum of (i) 343,644,985 common shares, par value €0.20 per share (not including treasury -
Timeline of the Semiconductor Industry in South Portland
Timeline of the Semiconductor Industry in South Portland Note: Thank you to Kathy DiPhilippo, Executive Director/Curator of the South Portland Historical Society and Judith Borelli, Governmental Relations of Texas Inc. for providing some of the information for this timeline below. Fairchild Semiconductor 1962 Fairchild Semiconductor (a subsidiary of Fairchild Camera and Instrument Corp.) opened in the former Boland's auto building (present day Back in Motion) at 185 Ocean Street in June of 1962. They were there only temporarily, as the Western Avenue building was still being constructed. 1963 Fairchild Semiconductor moves to Western Avenue in February 1963. 1979 Fairchild Camera and Instrument Corp. is acquired/merged with Schlumberger, Ltd. (New York) for $363 million. 1987 Schlumberger, Ltd. sells its Fairchild Semiconductor Corp. subsidiary to National Semiconductor Corp. for $122 million. 1997 National Semiconductor sells the majority ownership interest in Fairchild Semiconductor to an investment group (made up of Fairchild managers, including Kirk Pond, and Citcorp Venture Capital Ltd.) for $550 million. Added Corporate Campus on Running Hill Road. 1999 In an initial public offering in August 1999, Fairchild Semiconductor International, Inc. becomes a publicly traded corporation on the New York Stock Exchange. 2016 Fairchild Semiconductor International, Inc. is acquired by ON Semiconductor for $2.4 billion. National Semiconductor 1987 National Semiconductor acquires Fairchild Semiconductor Corp. from Schlumberger, Ltd. for $122 million. 1995 National Semiconductor breaks ground on new 200mm factory in December 1995. 1996 National Semiconductor announces plans for a $600 million expansion of its facilities in South Portland; construction of a new wafer fabrication plant begins. 1997 Plant construction for 200mm factory completed and production starts.