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Prostep Ivip CPO Statement Template
CPO Statement of Mentor Graphics For Questa SIM Date: 17 June, 2015 CPO Statement of Mentor Graphics Following the prerequisites of ProSTEP iViP’s Code of PLM Openness (CPO) IT vendors shall determine and provide a list of their relevant products and the degree of fulfillment as a “CPO Statement” (cf. CPO Chapter 2.8). This CPO Statement refers to: Product Name Questa SIM Product Version Version 10 Contact Ellie Burns [email protected] This CPO Statement was created and published by Mentor Graphics in form of a self-assessment with regard to the CPO. Publication Date of this CPO Statement: 17 June 2015 Content 1 Executive Summary ______________________________________________________________________________ 2 2 Details of Self-Assessment ________________________________________________________________________ 3 2.1 CPO Chapter 2.1: Interoperability ________________________________________________________________ 3 2.2 CPO Chapter 2.2: Infrastructure _________________________________________________________________ 4 2.3 CPO Chapter 2.5: Standards ____________________________________________________________________ 4 2.4 CPO Chapter 2.6: Architecture __________________________________________________________________ 5 2.5 CPO Chapter 2.7: Partnership ___________________________________________________________________ 6 2.5.1 Data Generated by Users ___________________________________________________________________ 6 2.5.2 Partnership Models _______________________________________________________________________ 6 2.5.3 Support of -
Getting Started with Your VXI-1394 Interface for Windows NT/98 And
VXI Getting Started with Your VXI-1394 Interface for Windows NT/98 VXI-1394 Interface for Windows NT/98 November 1999 Edition Part Number 322109D-01 Worldwide Technical Support and Product Information www.ni.com National Instruments Corporate Headquarters 11500 North Mopac Expressway Austin, Texas 78759-3504 USA Tel: 512 794 0100 Worldwide Offices Australia 03 9879 5166, Austria 0662 45 79 90 0, Belgium 02 757 00 20, Brazil 011 284 5011, Canada (Calgary) 403 274 9391, Canada (Ontario) 905 785 0085, Canada (Québec) 514 694 8521, China 0755 3904939, Denmark 45 76 26 00, Finland 09 725 725 11, France 01 48 14 24 24, Germany 089 741 31 30, Greece 30 1 42 96 427, Hong Kong 2645 3186, India 91805275406, Israel 03 6120092, Italy 02 413091, Japan 03 5472 2970, Korea 02 596 7456, Mexico (D.F.) 5 280 7625, Mexico (Monterrey) 8 357 7695, Netherlands 0348 433466, Norway 32 27 73 00, Poland 48 22 528 94 06, Portugal 351 1 726 9011, Singapore 2265886, Spain 91 640 0085, Sweden 08 587 895 00, Switzerland 056 200 51 51, Taiwan 02 2377 1200, United Kingdom 01635 523545 For further support information, see the Technical Support Resources appendix. To comment on the documentation, send e-mail to [email protected] © Copyright 1998, 1999 National Instruments Corporation. All rights reserved. Important Information Warranty The National Instruments VXI-1394 board is warranted against defects in materials and workmanship for a period of one year from the date of shipment, as evidenced by receipts or other documentation. National Instruments will, at its option, repair or replace equipment that proves to be defective during the warranty period. -
Emerging Technologies Multi/Parallel Processing
Emerging Technologies Multi/Parallel Processing Mary C. Kulas New Computing Structures Strategic Relations Group December 1987 For Internal Use Only Copyright @ 1987 by Digital Equipment Corporation. Printed in U.S.A. The information contained herein is confidential and proprietary. It is the property of Digital Equipment Corporation and shall not be reproduced or' copied in whole or in part without written permission. This is an unpublished work protected under the Federal copyright laws. The following are trademarks of Digital Equipment Corporation, Maynard, MA 01754. DECpage LN03 This report was produced by Educational Services with DECpage and the LN03 laser printer. Contents Acknowledgments. 1 Abstract. .. 3 Executive Summary. .. 5 I. Analysis . .. 7 A. The Players . .. 9 1. Number and Status . .. 9 2. Funding. .. 10 3. Strategic Alliances. .. 11 4. Sales. .. 13 a. Revenue/Units Installed . .. 13 h. European Sales. .. 14 B. The Product. .. 15 1. CPUs. .. 15 2. Chip . .. 15 3. Bus. .. 15 4. Vector Processing . .. 16 5. Operating System . .. 16 6. Languages. .. 17 7. Third-Party Applications . .. 18 8. Pricing. .. 18 C. ~BM and Other Major Computer Companies. .. 19 D. Why Success? Why Failure? . .. 21 E. Future Directions. .. 25 II. Company/Product Profiles. .. 27 A. Multi/Parallel Processors . .. 29 1. Alliant . .. 31 2. Astronautics. .. 35 3. Concurrent . .. 37 4. Cydrome. .. 41 5. Eastman Kodak. .. 45 6. Elxsi . .. 47 Contents iii 7. Encore ............... 51 8. Flexible . ... 55 9. Floating Point Systems - M64line ................... 59 10. International Parallel ........................... 61 11. Loral .................................... 63 12. Masscomp ................................. 65 13. Meiko .................................... 67 14. Multiflow. ~ ................................ 69 15. Sequent................................... 71 B. Massively Parallel . 75 1. Ametek.................................... 77 2. Bolt Beranek & Newman Advanced Computers ........... -
Powerplay Power Analysis 8 2013.11.04
PowerPlay Power Analysis 8 2013.11.04 QII53013 Subscribe Send Feedback The PowerPlay Power Analysis tools allow you to estimate device power consumption accurately. As designs grow larger and process technology continues to shrink, power becomes an increasingly important design consideration. When designing a PCB, you must estimate the power consumption of a device accurately to develop an appropriate power budget, and to design the power supplies, voltage regulators, heat sink, and cooling system. The following figure shows the PowerPlay Power Analysis tools ability to estimate power consumption from early design concept through design implementation. Figure 8-1: PowerPlay Power Analysis From Design Concept Through Design Implementation PowerPlay Early Power Estimator Quartus II PowerPlay Power Analyzer Higher Placement and Simulation Routing Results Results Accuracy Quartus II Design Profile User Input Estimation Design Concept Design Implementation Lower PowerPlay Power Analysis Input For the majority of the designs, the PowerPlay Power Analyzer and the PowerPlay EPE spreadsheet have the following accuracy after the power models are final: • PowerPlay Power Analyzer—±20% from silicon, assuming that the PowerPlay Power Analyzer uses the Value Change Dump File (.vcd) generated toggle rates. • PowerPlay EPE spreadsheet— ±20% from the PowerPlay Power Analyzer results using .vcd generated toggle rates. 90% of EPE designs (using .vcd generated toggle rates exported from PPPA) are within ±30% silicon. The toggle rates are derived using the PowerPlay Power Analyzer with a .vcd file generated from a gate level simulation representative of the system operation. © 2013 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos are trademarks of Altera Corporation and registered in the U.S. -
Interconnect Solutions Short Form Catalog
Interconnect Solutions Short Form Catalog How to Search this Catalog This digital catalog provides you with three quick ways to find the products and information you are looking for. Just point and click on the bookmarks to the left, the linked images on the next page or the labeled sections of the table of contents. You can also use the “search” function built into Adobe Acrobat to jump directly to any text reference in this document. Acrobat “Search” function instructions: 1. Press CONTROL + F 2. When the dialog box appears, type in the word or words you are looking for and press ENTER. 3. Depending on your version of Acrobat, it will either take you directly to the first instance found, or display a list of pages where the text can be found. In the latter, click on the link to the pages provided. Interconnect Solutions Short Form Catalog Complete Solutions for the Electronics Industry 3M Electronics offers a comprehensive range of Interconnect Solutions for the electronics industry with a product portfolio that includes connectors, cables, cable assemblies and assembly tooling for a wide variety of applications. 3M is dedicated to innovation, continually developing new products that become an important part of everyday life across many diverse markets. A number of 3M solution categories are based on custom-designed products for specialized applications. 3M Electronics can help you design, modify and customize your product as well as help you to seamlessly integrate our products into your manufacturing process on a global basis. RoHS Compliant Statement “RoHS compliant” means that the product or part does not contain any of the following substances in excess of the following maximum concentration values in any homogeneous material, unless the substance is in an application that is exempt under RoHS: (a) 0.1% (by weight) for lead, mercury, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. -
System-On-Chip Design with Arm® Cortex®-M Processors
System-on-Chip Design with Arm® Cortex®-M Processors Reference Book JOSEPH YIU System-on-Chip Design with Arm® Cortex®-M Processors System-on-Chip Design with Arm® Cortex®-M Processors Reference Book JOSEPH YIU Arm Education Media is an imprint of Arm Limited, 110 Fulbourn Road, Cambridge, CBI 9NJ, UK Copyright © 2019 Arm Limited (or its affiliates). All rights reserved. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, recording or any other information storage and retrieval system, without permission in writing from the publisher, except under the following conditions: Permissions You may download this book in PDF format from the Arm.com website for personal, non- commercial use only. You may reprint or republish portions of the text for non-commercial, educational or research purposes but only if there is an attribution to Arm Education. This book and the individual contributions contained in it are protected under copyright by the Publisher (other than as may be noted herein). Notices Knowledge and best practice in this field are constantly changing. As new research and experience broaden our understanding, changes in research methods and professional practices may become necessary. Readers must always rely on their own experience and knowledge in evaluating and using any information, methods, project work, or experiments described herein. In using such information or methods, they should be mindful of their safety and the safety of others, including parties for whom they have a professional responsibility. To the fullest extent permitted by law, the publisher and the authors, contributors, and editors shall not have any responsibility or liability for any losses, liabilities, claims, damages, costs or expenses resulting from or suffered in connection with the use of the information and materials set out in this textbook. -
Publication Title 1-1962
publication_title print_identifier online_identifier publisher_name date_monograph_published_print 1-1962 - AIEE General Principles Upon Which Temperature 978-1-5044-0149-4 IEEE 1962 Limits Are Based in the rating of Electric Equipment 1-1969 - IEEE General Priniciples for Temperature Limits in the 978-1-5044-0150-0 IEEE 1968 Rating of Electric Equipment 1-1986 - IEEE Standard General Principles for Temperature Limits in the Rating of Electric Equipment and for the 978-0-7381-2985-3 IEEE 1986 Evaluation of Electrical Insulation 1-2000 - IEEE Recommended Practice - General Principles for Temperature Limits in the Rating of Electrical Equipment and 978-0-7381-2717-0 IEEE 2001 for the Evaluation of Electrical Insulation 100-2000 - The Authoritative Dictionary of IEEE Standards 978-0-7381-2601-2 IEEE 2000 Terms, Seventh Edition 1000-1987 - An American National Standard IEEE Standard for 0-7381-4593-9 IEEE 1988 Mechanical Core Specifications for Microcomputers 1000-1987 - IEEE Standard for an 8-Bit Backplane Interface: 978-0-7381-2756-9 IEEE 1988 STEbus 1001-1988 - IEEE Guide for Interfacing Dispersed Storage and 0-7381-4134-8 IEEE 1989 Generation Facilities With Electric Utility Systems 1002-1987 - IEEE Standard Taxonomy for Software Engineering 0-7381-0399-3 IEEE 1987 Standards 1003.0-1995 - Guide to the POSIX(R) Open System 978-0-7381-3138-2 IEEE 1994 Environment (OSE) 1003.1, 2004 Edition - IEEE Standard for Information Technology - Portable Operating System Interface (POSIX(R)) - 978-0-7381-4040-7 IEEE 2004 Base Definitions 1003.1, 2013 -
Chapter 1. Origins of Mac OS X
1 Chapter 1. Origins of Mac OS X "Most ideas come from previous ideas." Alan Curtis Kay The Mac OS X operating system represents a rather successful coming together of paradigms, ideologies, and technologies that have often resisted each other in the past. A good example is the cordial relationship that exists between the command-line and graphical interfaces in Mac OS X. The system is a result of the trials and tribulations of Apple and NeXT, as well as their user and developer communities. Mac OS X exemplifies how a capable system can result from the direct or indirect efforts of corporations, academic and research communities, the Open Source and Free Software movements, and, of course, individuals. Apple has been around since 1976, and many accounts of its history have been told. If the story of Apple as a company is fascinating, so is the technical history of Apple's operating systems. In this chapter,[1] we will trace the history of Mac OS X, discussing several technologies whose confluence eventually led to the modern-day Apple operating system. [1] This book's accompanying web site (www.osxbook.com) provides a more detailed technical history of all of Apple's operating systems. 1 2 2 1 1.1. Apple's Quest for the[2] Operating System [2] Whereas the word "the" is used here to designate prominence and desirability, it is an interesting coincidence that "THE" was the name of a multiprogramming system described by Edsger W. Dijkstra in a 1968 paper. It was March 1988. The Macintosh had been around for four years. -
Opening Plenary March 2021
Opening Plenary March 2021 Glenn Parsons – IEEE 802.1 WG Chair [email protected] 802.1 plenary agenda Monday, March 8th opening Tuesday, March 16th closing • Copyright Policy • Copyright Policy • Call for Patents • Call for Patents • Participant behavior • Participant behavior • Administrative • Membership status • Membership status • Future Sessions • Future Sessions • Sanity check – current projects • 802 EC report • TG reports • Sanity check – current projects • Outgoing Liaisons • Incoming Liaisons • Motions for EC • TG agendas • Motions for 802.1 • Any other business • Any other business 2 INSTRUCTIONS FOR CHAIRS OF STANDARDS DEVELOPMENT ACTIVITIES At the beginning of each standards development meeting the chair or a designee is to: .Show the following slides (or provide them beforehand) .Advise the standards development group participants that: .IEEE SA’s copyright policy is described in Clause 7 of the IEEE SA Standards Board Bylaws and Clause 6.1 of the IEEE SA Standards Board Operations Manual; .Any material submitted during standards development, whether verbal, recorded, or in written form, is a Contribution and shall comply with the IEEE SA Copyright Policy; .Instruct the Secretary to record in the minutes of the relevant meeting: .That the foregoing information was provided and that the copyright slides were shown (or provided beforehand). .Ask participants to register attendance in IMAT: https://imat.ieee.org 3 IEEE SA COPYRIGHT POLICY By participating in this activity, you agree to comply with the IEEE Code of Ethics, all applicable laws, and all IEEE policies and procedures including, but not limited to, the IEEE SA Copyright Policy. .Previously Published material (copyright assertion indicated) shall not be presented/submitted to the Working Group nor incorporated into a Working Group draft unless permission is granted. -
N94-13338 1.1.1 3Rd NASA Symposium on VLSI Design 1991
N94-13338 1.1.1 3rd NASA Symposium on VLSI Design 1991 Experience with Custom Processors in Space Flight Applications M. E. Fraeman, J. R. Hayes, D. A. Lohr, B. W. Ballard, R. L. Williams, and R. M. Henshaw Johns Hopkins University Applied Physics Laboratory Laurel, Maryland 20723 Abstract- APL has developed a magnetometer instrument for a Swedish satel- lite named Freja with launch scheduled for August 1992 on a Chinese Long March rocket. The magnetometer controller utilized a custom microprocessor designed at APL with the Genesil silicon compiler. The processor evolved from our experience with an older bit-slice design and two prior single chip efforts. The architecture of our microprocessor greatly lowered software development costs because it was optimized to provide an interactive and extensible pro- gramming environment hosted by the target hardware. Radiation tolerance of the microprocessor was also tested and was adequate for Freja's mission-- 20 kRad(Si) total dose and very infrequent latch-up and single event upset events. 1 Introduction The Johns Hopkins University Applied Physics Laboratory (APL) has developed a micro- processor that is well suited to one-of-a-kind embedded applications especially in satellite instrument control. The chip has been qualified for use in a magnetometer instrument for the Swedish Freja satellite. The processor's language directed architecture reduced Freja software costs because the flight hardware served as its own development system. Thus, unlike traditional interpreted programming languages like Basic, Lisp, or Smalltalk, our Forth language development system was fully supported on the embedded flight proces- sor. Performance was also equivalent or better than that obtained by other microprocessors programmed in languages like C with traditional cross-compilers and development systems. -
XMOS for AVB Ethernet Based Networking for Audio/Video
Only a few years ago, computer networks were complex beasts tended by special acolytes and running on different standards. Today they have become commonplace in many homes and offices, simply plugged together using Ethernet technology. The same revolutionary change is coming for Audio/Video (AV) networking, as AVB (Audio XMOS for AVB: Video Bridging) products that run over the same network, Ethernet based networking begin to enter the market. for Audio/Video Putting together networks of AV equipment for professional and consumer use, or for use in How Ethernet Works vehicles, is about to become simpler while also Within Ethernet, data is transmitted between delivering better quality. No longer will devices (such as a computer and a printer) in specialist connectors and cables be needed to packets. Each packet carries one or more create a rats' nest of connectivity. Instead addresses for its destination. Like a postal packet traversing the postal system, the network has no Audio Video Bridging (AVB), a set of knowledge of what is in the packet, but uses the international standards, will make setting up address to pass the packet to the next point in the and managing networks almost as simple as network. just plugging together the different elements. In an Ethernet based network, each endpoint Sound and video sources will be mixed and (computer, storage element, printer etc.) is distributed to screens and speakers, with high identified by a unique address and has a single quality, low latency and tight synchronization. connection to the network, through an Ethernet Furthermore, the connectors and cables are switch. -
VM E Bus S Ingle -B Oard C Om Puter
DATASHEET KEY FEATURES 2eSST VMEbus protocol with The Motorola MVME6100 The promise of the VME 320MB/s transfer rate across series provides more than just Renaissance is innovation, the VMEbus faster VMEbus transfer rates; it performance and investment provides balanced performance protection. The MVME6100 MPC7457 PowerPC® processor from the processor, memory series from Motorola delivers running at up to 1.267 GHz subsystem, local buses and I/O on this promise. The innovative 128-bit AltiVec coprocessor for subsystems. Customers looking design of the MVME6100 parallel processing, ideal for for a technology refresh for their provides a high performance data-intensive applications application, while maintaining platform that allows customers backwards compatibility with to leverage their investment in Up to 2GB of on-board DDR their existing VMEbus infra- their VME infrastructure. ECC memory and 128MB of structure, can upgrade to the fl ash memory for demanding The MVME6100 series supports MVME6100 series and applications booting a variety of operating take advantage of its enhanced systems including a complete Two 33/66/100 MHz PMC-X performance features. range of real-time operating sites allow the addition of systems and kernels. A VxWorks industry-standard, application- board support package and specifi c modules Linux support are available for Dual Gigabit Ethernet interfaces the MVME6100 series. for high performance networking The MVME6100 series is the fi rst VMEbus single-board computer (SBC) designed with the Tundra Tsi148 VMEbus interface chip offering two edge source synchronous transfer (2eSST) VMEbus performance. The 2eSST protocol enables the VMEbus to run at a practical bandwidth of 320MB/s in most cases.