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MEPTEC Report 3 2011 A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 15, Number 4 WINTER The Heat Is On 2012 Revolutionary and Evolutionary Innovations in Thermal Management page 17 ALLVIA, Inc. – providing Silicon Interposer and TSV foundry services to Semiconductor, Optoelectronics and MEMS industries. page 18 INSIDE THIS ISSUE Packaging and Test Many Factors Both Silicon 3D Players Markets Face Some Driving Chips Interposers and Need to Figure Substantial Headwinds Up Into the 3D Memory Out Their Spot as We Come to the Vertical Space Stacking Avail- in the Supply End of 2011 able From IBM Chain 14 20 22 SPRING 201130 MEPTEC Report 3 BOARD LETTER MEPTEC – Network to Innovate Nikhil Kelkar, Sr. Director of Package Development and Assembly Engineering Intersil Corporation MEPTEC Advisory Board Member NUMEROUS OP-EDS IN THE LAST smart energy, medical, etc. For example, With fewer hands-on training opportuni- few years have discussed the transforma- it is interesting to note that future package ties on-shore, MEPTEC is an excellent tion of the Package and Assembly industry requirements for the lighting industry may resource for gaining practical insights and more generally about the transforma- be similar to those of deep down drilling and tapping into experts for development tion of the overall semiconductor industry but with life expectancy of automotive and problem solving. in the United States. With the advent of the electronics! Therefore, MEPTEC’s busi- MEPTEC has survived and thrived outsourced manufacturing model, not only ness model continues to be flexible to during the last three plus decades due to has manufacturing moved offshore but attract and include engineers from paral- its business model of providing a plat- so has process and equipment engineer- lel and adjunct industries because today’s form for networking and in doing so has, ing. However, innovation is still present package and test engineers are going to probably inadvertently, contributed to in the US – which we all strive to support solve tomorrows lighting and MEMS innovation in semiconductor package and for future success of semiconductor and problems. Second, continue to build a test industry. A revamped advisory board related industries. vertical network within the semiconduc- with “new blood” working alongside MEPTEC provides an unparalleled tor industry. Boundaries between wafer industry veterans will make MEPTEC platform for semiconductor package and fabrication and IC packaging as well as even stronger in its quest to bring inno- test engineers to build their network with between IC packaging and systems are vative package and test technologies to their peers, customers, and suppliers of more blurred than ever. For example, the forefront for years to come. ◆ materials, equipment and assembly/test wafer level 2D/3D packaging is drawing services. To quote Prof. Andrew Hargadon, suppliers of wafer, assembly, MEMS and NIKHIL KELKAR is Sr. Director of “Innovation is about connecting and not solar packaging technologies to innovate Package Development and Assembly inventing. No idea will make a difference new methods and designs for competi- Engineering at Intersil Corporation, without building around it the networks tive package solutions. Last but not least, a global technology leader special- that will support it as it grows, and net- MEPTEC provides a forum for package izing in the design and manufacturing work partners with which it will ultimately and test engineers to discuss capabilities of high performance analog semi- flourish.” Therefore, earlier in 2011 when and requirements with customers – many conductors. Prior to joining Intersil I was approached to be a member of the of those have significantly grown their in 2005, Nikhil held a succession of MEPTEC advisory board, I immediately respective packaging groups and are play- engineering and management posi- thought of it as an excellent opportunity to ing a direct role in package technology tions at National Semiconductor and be an integral part of the network (going development. pioneered micro SMD wafer level beyond never missing Jim Walker’s Sep- I cannot close this article without packaging technology. He holds a B.E. tember Industry Forecast Luncheon!). mentioning the acquisition of National in Mechanical Engineering from Govt. To provide a network that will support Semiconductor by Texas Instruments. I College of Engineering Pune (India) and grow with innovative ideas, MEPTEC am probably one of the last generations and a Masters in Mechanical Engi- continues to focus in the following three of new college grads who attended the neering from University of Maryland specific areas: First, promote building a ‘National Semiconductor University’ and at College Park. He is a member of network of packaging and test engineers benefited from its access to abundant theo- IEEE and holds over 40 US patents. across parallel industries such as lighting, retical knowledge and practical training. FOUR NEW MEPTEC SYMPOSIUM CDs NOW AVAILABLE ONLINE. In Association With A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM MEPTEC&SMTAPRESENT A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM A SPECIAL ONE-DAY TECHNICAL SYMPOSIUM Microelectronics Packaging & Test Engineering Council Surface Mount Technology Association A SPECIAL TWO-DAY TECHNICAL SYMPOSIUM KNOWN MEMS - 2011 2.5D, 3D KGD PLUS 20% OFF DRIVING INNOVATION Medical Electronics and Beyond GOOD Symposium / Day One Bringing 3D Integration MEMS, THERMAL, Existing Technologies Enable 2011 DIE Future Innovations Vital Technologies for Health to the Packaging Mainstream In an Era of Multi-Die Packaging and 3D Integration AND MEDICAL SAN JOSE • CALIFORNIA ASU CAMPUS • TEMPE • ARIZONA SANTA CLARA • CALIFORNIA SANTA CLARA • CALIFORNIA Presented by 5.19.11 9. 2 7.11 Presented by 11.9.11 Presented by 11.10.11 CD PACKAGES. ORDER ONLINE AND DOWNLOAD TODAY AT MEPTEC.ORG meptec.org WINTER 2011 MEPTEC REPORT 3 2011 The MEPTEC Report is a Publication of the Microelectronics Packaging & Test Engineering Council P. O. Box 222, Medicine Park, OK 73557 Tel: (650) 714-1570 Email: [email protected] WINTER A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 15, Number 4 Publisher MEPCOM LLC Editor Bette Cooper Art Director/Designer Gary Brown 2011 ON THE Cover Sales Manager Gina Edwards A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 15, Number 4 WINTER The Heat Is On THE HEAT IS ON 2012 – “Revolutionary and Evolutionary Innova- MEPTEC Advisory Board 2012 Board Members Revolutionary and Evolutionary Innovations 17 tions in Thermal Management”. MEPTEC is pleased to announce in Thermal Management page 17 the continuation of our “Heat is On” Thermal Management Symposiums, Ivor Barber LSI Corporation which for the second year will be co-located with the 28th Annual Joel Camarda SemiOps ALLVIA, Inc. – providing Silicon Interposer and TSV foundry services to Semiconductor, Optoelectronics Jerry Dellheim ASM Pacific and MEMS industries. SEMI-THERM Conference and Exposition. Both events will be held at the page 18 Jeff Demmin Tessera Inc. INSIDE THIS ISSUE DoubleTree Hotel in San Jose, California. The Heat Is On 2012 will be Packaging and Test Many Factors Both Silicon 3D Players Markets Face Some Driving Chips Interposers and Need to Figure Substantial Headwinds Up Into the 3D Memory Out Their Spot Douglass Dixon Henkel Corporation as We Come to the Verticle Space Stacking Avail- in the Supply End of 2011 able From IBM Chain 14 20 22 SPRING 201130 MEPTEC Report 3 held on Monday, March 19th. SEMI-THERM runs March 18th to the 22nd. Nikhil Kelkar Intersil Corporation Nick Leonardi Premier Semiconductor Services Phil Marcoux ALLVIA, Inc. ANALYSIS – The markets for semiconductor packaging ANALYSIS FOLLOW-UP Semiconductor Manufacturing Markets 2.5D, 3D and Beyond Bhavesh Muni Dow Chemical Corp. Facing Uncertain 2012 Bringing 3D Integration to the Packaging Mainstream Mark Stromberg Mark LaPedus, Senior Editor and test face some substantial headwinds as we come Gartner SemiMD Raj Pendse STATS ChipPAC THE MARKETS FOR SEMICONDUCTOR FOR DECADES, THE IC PRODUCTION, in-house memory and logic technologies, 14 packaging and test face some substantial packaging and test flows have been fabs and packaging expertise. headwinds as we come to the end of straightforward and predictable. For vendors that use third-party 2011. Most notably is the global eco- But as the world moves toward the foundries and packaging houses in 2.5D nomic situation, highlighted by Europe’s 2.5D and 3D chip era, the lines in the IC or 3D, the production flow consists of debt markets, and the recent flooding in manufacturing flow are blurring. Within multiple and complex choices, which, to the end of 2011. Most notably is the global economic situ- Thailand that severely damaged several these emerging segments, the chip “sup- in turn, will put pressure on the supply back-end processing plants. Our cur- ply chain model is under stress,” said chain. During a presentation, Rice out- rent projections call for essentially flat Rich Rice, senior vice president of sales lined several models for the interposer Rich Rice ASE (US) Inc. conditions in 2011 with SATS providers for North America at ASE Inc., the U.S. flow – all of which are viable: growing revenues about 2%, while back- arm for Advanced Semiconductor Engi- • The foundry handles all steps, includ- end equipment suppliers will report sales neering Inc. (ASE) of Taiwan. ASE is ing
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