Product Design for Wire-Bondability
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2018 A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 22, Number 2 SUMMER PRODUCT DESIGN FOR WIRE-BONDABILITY Developing a Wire Bond Interconnect Begins with the End in Mind page 24 + Top 4 Considerations When Disposing of a Cleanroom Facility page 34 MEPTEC MEMBER COMPANY PROFILE Founded in 1976, Samtec is a privately held, $713 million global manufacturer of a broad line of electronic interconnect solutions. Samtec is headquartered in New Albany, Indiana, USA. Their global reach includes over 5,000 employees with 33 locations in 24 countries. page 12 -Corp. INSIDE THIS ISSUE Copper clip The design of an Technology develop- Selling a manufactur- based package ASIC is often the ments, market trends, ing asset such as a integration sol- key to success for recent patents, and cleanroom facility can ution provides medical device news from Binghamton be a difficult and time- key advantages. developers. University. intensive process. 16 20 27 SPRING34 2011 MEPTEC Report 3 A proud legacy. An exciting future. As the original pioneers of the OSAT industry, Amkor has helped define and advance the technology manufacturing landscape. Since 1968, we’ve delivered innovative packaging solutions with the service and capacity global customers rely on. We’re proud of what we’ve done, and can’t wait to show you what’s next. www.amkor.com 2018 The MEPTEC Report is a Publication of the Microelectronics Packaging & Test Engineering Council 315 Savannah River Dr., Summerville, SC 29485 Tel: (650) 714-1570 Email: [email protected] A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 22, Number 2 SUMMER Publisher MEPCOM LLC Editor Bette Cooper Art Director/Designer Gary Brown Sales Manager Gina Edwards 2018 ON THE COVER A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 22, Number 2 SUMMER PRODUCT DESIGN FOR Wire bonding is a commonly used process to create low-cost and reliable WIRE-BONDABILITY MEPTEC Advisory Board Developing a Wire Bond Interconnect electrical interconnects for microelectronic assemblies and is used to manu- Begins with the End in Mind page 24 facture the vast majority of fully packaged semiconductor products. More Board Members + Top 4 Considerations When recently, it is being used as an interconnect solution for batteries. When Disposing of a Cleanroom Facility page 34 developing a wire bond interconnect it is important to begin the design with Ivor Barber AMD MEPTEC MEMBER COMPANY PROFILE Founded in 1976, Samtec is a privately held, $713 million global manufacturer of a broad line of electronic interconnect the end in mind. The best outcomes can be achieved when the design team solutions. Samtec is headquartered in New Albany, Indiana, USA. Their global reach includes over 5,000 employees with 33 locations in 24 countries. Jack Belani Indium Corporation page 12 includes the process engineering team in the design reviews and product deci- -Corp. INSIDE THIS ISSUE Copper clip The design of an Technology develop- Selling a manufactur- based package ASIC is often the ments, market trends, ing asset such as a sions as early in the cycle as possible. integration sol- key to success for recent patents, and cleanroom facility can SemiOps ution provides medical device news from Binghamton be a difficult and time- Joel Camarda key advantages. developers. University. intensive process. 16 20 27 SPRING34 2011 MEPTEC Report 3 Cover Photo Courtesy of SMART Microsystems Ltd. Jeff Demmin Booz Allen Hamilton Douglass Dixon Henkel Corporation PROFILE – By integrating specialized technology centers PROFILE KEY PRODUCTS AND TECHNOLOGIES SILICON-TO-SILICON Samtec’s history is a manufacturer of high speed board-to-board intercon- SMART Microsystems Samtec’s Corporate Headquarters in New Albany, IN, USA nects and cable systems, and of having Nick Leonardi the industry’s largest variety of two-piece board stacking connector products. led by industry experts working side-by-side, Samtec fos- In the last decade Samtec’s Silicon- MICROELECTRONICS to-Silicon business model continues to distinguish and define Samtec. Simply INTERCONNECT SOLUTIONS put, Silicon-to-Silicon capabilities assist 12 designers in optimizing the high-speed serial path from bare die, to IC package QUICK HISTORY employees. FOUNDED IN 1976, Samtec is a privately and assembly, to PCB, to connectors, to In the mid-1970s, Sam Shine was The company’s business model was held, $713 million global manufacturer of cable assemblies, and back again. These Vice President of Sales and Marketing for “Sudden Service.” Simply put, the goal a broad line of electronic intercon-nect capabilities include: a mid-sized connector company that was was to deliver quality products with the solutions. Samtec is headquartered in ters an environment conducive to true innovation and collabo- best customer service in the industry. At • Assisting IC layout designers to opti- PPM Associates riding a wave of increased demand and New Albany, Indiana.Their global reach Phil Marcoux the time, Sudden Service principals were: mize power and signal integrity of the includes over 5,000 employees with 33 had decided to become a major player bare die during the IC design process locations in 24 countries. Manufacturing in the market by going public. Pleasing • Quick turn-around of orders, large is performed in 12 different locations: stock holders with growth at any cost and small • Developing complex, customized became the work of the day. As automat- New Albany, IN; Scottsburg, IN; Colo- • Quick delivery of samples IC packaging and assembly solutions Samtec’s High-Speed Cable Assemblies rado Springs, CO; Wilsonville, OR; Costa ed production processes became increas- enabling maximum IC density, preci- Rica; Huizhou China; Dongguan, China; ingly inflexible, Shine became increas- • Quick delivery of catalogs sion and ruggedness grounding and routing flexibility. They ety of high-speed interconnects, in either Johor, Malaysia; Penang, Malaysia; Tai- ingly frustrated, feeling the company was • Prompt, correct answers to technical • Enabling PCB designers to create dens- are available with up to 560 I/Os, with single ended 50 Ω or 100 Ω differential ration. They have more than 600 separate product series which wan, Singapore and Vietnam. losing its ability to service customers. and order status inquiries Samtec has more than 600 sepa- Large minimum order quantities, er, faster PCBs by providing factory stack heights up to 40 mm, with option- pairs, across a variety of centerlines and • Consistent follow-through on all rate product series which results in over long delivery lead times that sometimes and field-based technical support to al power modules. configurations. shipments 108 trillion part number combinations. stretched into months, unexpected price ensure signal chain optimization Xilinx • High speed edge card interconnects HIGH-SPEED CABLE increases as gold was deregulated, and Sudden Service worked, and the Gamal Refai-Ahmed They serve more than 23,000 customers, • Providing the products, tools, design are available in a variety of centerlines, multiple week deliveries for samples, company began a period of sustained, Samtec’s state-of-the-art High Speed in at least 125 countries, spanning all expertise and consulting services to from 0.50 mm to 2.00 mm. Many are were common in the industry at that time. substantial growth. In subsequent years Cable Plant, located in Wilsonville, OR, industries, from well-known global tech link high-speed signal chains between rated to 56 Gbps PAM4, in vertical, On January 2, 1976, Samtec opened Samtec successfully introduced lines of is focused on R&D and manufacturing of giants to small start-ups, and everyone in PCBs and through backplanes right angle and edge-mount orienta- between. By integrating specialized tech- for business. The business name was flexible two-piece board stacking inter- precision extruded micro coax and twinax tions, with power/signal combo pins, nology centers led by industry experts selected based on the acronym Sales and connects, micro-pitch and SMT connector • Engineer industry standard and custom- cable. Being vertically integrated allows results in over 108 trillion part number combinations. They and low-profile designs. working side-by-side, Samtec strives to Manufacturer of Technical Electronic systems, high-speed and high-bandwith ized copper and optical cable assem- Samtec to offer full system solutions, foster an environment conducive to true Components. That first year, a small connectors and cable assemblies, and blies at data rates up to 56 Gbps and HIGH SPEED CABLE ASSEMBLIES which creates design flexibility to devel- innovation and collaboration. space was rented in New Albany, Indi- more recently microelectronic intercon- beyond While Samtec has over 16 standard op products that meet strict performance ana with Sam and his wife the only two nect solutions and optical cable systems. high-speed cable assembly products, the requirements. The HSCG is aggressively HIGH SPEED BOARD-TO-BOARD majority of design challenges are solved pursuing next generation micro coax and eda 2 asic Consulting INTERCONNECTS by Samtec’s ability to mix-and-match twinax products that meet the challenges Herb Reiter Samtec is an industry leader in the either twinax or coax cables with a vari- for 56 Gbps and 112 Gbps. development and support of high speed, serve more than 23,000 customers, in at least 125 countries, high bandwidth, board-to-board intercon- nects. Key products include: • Mated strip connector sets on 0.50, 0.635, 0.80 mm pitch, with and without integral ground planes, in stack heights from 5 – 25 mm. Many of these prod- ucts are rated at 56 Gbps PAM4, and are available in vertical, right-angle, ASE (US) Inc. spanning all industries, from global tech giants to small start-ups. and co-planar designs, in single-ended Rich Rice and differential pair designs. • High-density array connectors, in both 1.27 mm and 0.80 mm pitch grids.