A Dual-Core, Dual-Thread Itanium Processor
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Instruction-Level Distributed Processing
COVER FEATURE Instruction-Level Distributed Processing Shifts in hardware and software technology will soon force designers to look at microarchitectures that process instruction streams in a highly distributed fashion. James E. or nearly 20 years, microarchitecture research In short, the current focus on instruction-level Smith has emphasized instruction-level parallelism, parallelism will shift to instruction-level distributed University of which improves performance by increasing the processing (ILDP), emphasizing interinstruction com- Wisconsin- number of instructions per cycle. In striving munication with dynamic optimization and a tight Madison F for such parallelism, researchers have taken interaction between hardware and low-level software. microarchitectures from pipelining to superscalar pro- cessing, pushing toward increasingly parallel proces- TECHNOLOGY SHIFTS sors. They have concentrated on wider instruction fetch, During the next two or three technology generations, higher instruction issue rates, larger instruction win- processor architects will face several major challenges. dows, and increasing use of prediction and speculation. On-chip wire delays are becoming critical, and power In short, researchers have exploited advances in chip considerations will temper the availability of billions of technology to develop complex, hardware-intensive transistors. Many important applications will be object- processors. oriented and multithreaded and will consist of numer- Benefiting from ever-increasing transistor budgets ous separately -
Caching Basics
Introduction Why memory subsystem design is important • CPU speeds increase 25%-30% per year • DRAM speeds increase 2%-11% per year Autumn 2006 CSE P548 - Memory Hierarchy 1 Memory Hierarchy Levels of memory with different sizes & speeds • close to the CPU: small, fast access • close to memory: large, slow access Memory hierarchies improve performance • caches: demand-driven storage • principal of locality of reference temporal: a referenced word will be referenced again soon spatial: words near a reference word will be referenced soon • speed/size trade-off in technology ⇒ fast access for most references First Cache: IBM 360/85 in the late ‘60s Autumn 2006 CSE P548 - Memory Hierarchy 2 1 Cache Organization Block: • # bytes associated with 1 tag • usually the # bytes transferred on a memory request Set: the blocks that can be accessed with the same index bits Associativity: the number of blocks in a set • direct mapped • set associative • fully associative Size: # bytes of data How do you calculate this? Autumn 2006 CSE P548 - Memory Hierarchy 3 Logical Diagram of a Cache Autumn 2006 CSE P548 - Memory Hierarchy 4 2 Logical Diagram of a Set-associative Cache Autumn 2006 CSE P548 - Memory Hierarchy 5 Accessing a Cache General formulas • number of index bits = log2(cache size / block size) (for a direct mapped cache) • number of index bits = log2(cache size /( block size * associativity)) (for a set-associative cache) Autumn 2006 CSE P548 - Memory Hierarchy 6 3 Design Tradeoffs Cache size the bigger the cache, + the higher the hit ratio -
Processamento Paralelo Em Cuda Aplicado Ao Modelo De Geração De Cenários Sintéticos De Vazões E Energias - Gevazp
PROCESSAMENTO PARALELO EM CUDA APLICADO AO MODELO DE GERAÇÃO DE CENÁRIOS SINTÉTICOS DE VAZÕES E ENERGIAS - GEVAZP André Emanoel Rabello Quadros Dissertação de Mestrado apresentada ao Programa de Pós-Graduação em Engenharia Elétrica, COPPE, da Universidade Federal do Rio de Janeiro, como parte dos requisitos necessários à obtenção do título de Mestre em Engenharia Elétrica. Orientadora: Carmen Lucia Tancredo Borges Rio de Janeiro Março de 2016 PROCESSAMENTO PARALELO EM CUDA APLICADO AO MODELO DE GERAÇÃO DE CENÁRIOS SINTÉTICOS DE VAZÕES E ENERGIAS - GEVAZP André Emanoel Rabello Quadros DISSERTAÇÃO SUBMETIDA AO CORPO DOCENTE DO INSTITUTO ALBERTO LUIZ COIMBRA DE PÓS-GRADUAÇÃO E PESQUISA DE ENGENHARIA (COPPE) DA UNIVERSIDADE FEDERAL DO RIO DE JANEIRO COMO PARTE DOS REQUISITOS NECESSÁRIOS PARA A OBTENÇÃO DO GRAU DE MESTRE EM CIÊNCIAS EM ENGENHARIA ELÉTRICA. Examinada por: ________________________________________________ Profa. Carmen Lucia Tancredo Borges, D.Sc. ________________________________________________ Prof. Antônio Carlos Siqueira de Lima, D.Sc. ________________________________________________ Dra. Maria Elvira Piñeiro Maceira, D.Sc. ________________________________________________ Prof. Sérgio Barbosa Villas-Boas, Ph.D. RIO DE JANEIRO, RJ – BRASIL MARÇO DE 2016 iii Quadros, André Emanoel Rabello Processamento Paralelo em CUDA Aplicada ao Modelo de Geração de Cenários Sintéticos de Vazões e Energias – GEVAZP / André Emanoel Rabello Quadros. – Rio de Janeiro: UFRJ/COPPE, 2016. XII, 101 p.: il.; 29,7 cm. Orientador(a): Carmen Lucia Tancredo Borges Dissertação (mestrado) – UFRJ/ COPPE/ Programa de Engenharia Elétrica, 2016. Referências Bibliográficas: p. 9 6-99. 1. Programação Paralela. 2. GPU. 3. CUDA. 4. Planejamento da Operação Energética. 5. Geração de cenários sintéticos. I. Borges, Carmen Lucia Tancredo. II. Universidade Federal do Rio de Janeiro, COPPE, Programa de Engenharia Elétrica. -
45-Year CPU Evolution: One Law and Two Equations
45-year CPU evolution: one law and two equations Daniel Etiemble LRI-CNRS University Paris Sud Orsay, France [email protected] Abstract— Moore’s law and two equations allow to explain the a) IC is the instruction count. main trends of CPU evolution since MOS technologies have been b) CPI is the clock cycles per instruction and IPC = 1/CPI is the used to implement microprocessors. Instruction count per clock cycle. c) Tc is the clock cycle time and F=1/Tc is the clock frequency. Keywords—Moore’s law, execution time, CM0S power dissipation. The Power dissipation of CMOS circuits is the second I. INTRODUCTION equation (2). CMOS power dissipation is decomposed into static and dynamic powers. For dynamic power, Vdd is the power A new era started when MOS technologies were used to supply, F is the clock frequency, ΣCi is the sum of gate and build microprocessors. After pMOS (Intel 4004 in 1971) and interconnection capacitances and α is the average percentage of nMOS (Intel 8080 in 1974), CMOS became quickly the leading switching capacitances: α is the activity factor of the overall technology, used by Intel since 1985 with 80386 CPU. circuit MOS technologies obey an empirical law, stated in 1965 and 2 Pd = Pdstatic + α x ΣCi x Vdd x F (2) known as Moore’s law: the number of transistors integrated on a chip doubles every N months. Fig. 1 presents the evolution for II. CONSEQUENCES OF MOORE LAW DRAM memories, processors (MPU) and three types of read- only memories [1]. The growth rate decreases with years, from A. -
Hierarchical Roofline Analysis for Gpus: Accelerating Performance
Hierarchical Roofline Analysis for GPUs: Accelerating Performance Optimization for the NERSC-9 Perlmutter System Charlene Yang, Thorsten Kurth Samuel Williams National Energy Research Scientific Computing Center Computational Research Division Lawrence Berkeley National Laboratory Lawrence Berkeley National Laboratory Berkeley, CA 94720, USA Berkeley, CA 94720, USA fcjyang, [email protected] [email protected] Abstract—The Roofline performance model provides an Performance (GFLOP/s) is bound by: intuitive and insightful approach to identifying performance bottlenecks and guiding performance optimization. In prepa- Peak GFLOP/s GFLOP/s ≤ min (1) ration for the next-generation supercomputer Perlmutter at Peak GB/s × Arithmetic Intensity NERSC, this paper presents a methodology to construct a hi- erarchical Roofline on NVIDIA GPUs and extend it to support which produces the traditional Roofline formulation when reduced precision and Tensor Cores. The hierarchical Roofline incorporates L1, L2, device memory and system memory plotted on a log-log plot. bandwidths into one single figure, and it offers more profound Previously, the Roofline model was expanded to support insights into performance analysis than the traditional DRAM- the full memory hierarchy [2], [3] by adding additional band- only Roofline. We use our Roofline methodology to analyze width “ceilings”. Similarly, additional ceilings beneath the three proxy applications: GPP from BerkeleyGW, HPGMG Roofline can be added to represent performance bottlenecks from AMReX, and conv2d from TensorFlow. In so doing, we demonstrate the ability of our methodology to readily arising from lack of vectorization or the failure to exploit understand various aspects of performance and performance fused multiply-add (FMA) instructions. bottlenecks on NVIDIA GPUs and motivate code optimizations. -
An Algorithmic Theory of Caches by Sridhar Ramachandran
An algorithmic theory of caches by Sridhar Ramachandran Submitted to the Department of Electrical Engineering and Computer Science in partial fulfillment of the requirements for the degree of Master of Science at the MASSACHUSETTS INSTITUTE OF TECHNOLOGY. December 1999 Massachusetts Institute of Technology 1999. All rights reserved. Author Department of Electrical Engineering and Computer Science Jan 31, 1999 Certified by / -f Charles E. Leiserson Professor of Computer Science and Engineering Thesis Supervisor Accepted by Arthur C. Smith Chairman, Departmental Committee on Graduate Students MSSACHUSVTS INSTITUT OF TECHNOLOGY MAR 0 4 2000 LIBRARIES 2 An algorithmic theory of caches by Sridhar Ramachandran Submitted to the Department of Electrical Engineeringand Computer Science on Jan 31, 1999 in partialfulfillment of the requirementsfor the degree of Master of Science. Abstract The ideal-cache model, an extension of the RAM model, evaluates the referential locality exhibited by algorithms. The ideal-cache model is characterized by two parameters-the cache size Z, and line length L. As suggested by its name, the ideal-cache model practices automatic, optimal, omniscient replacement algorithm. The performance of an algorithm on the ideal-cache model consists of two measures-the RAM running time, called work complexity, and the number of misses on the ideal cache, called cache complexity. This thesis proposes the ideal-cache model as a "bridging" model for caches in the sense proposed by Valiant [49]. A bridging model for caches serves two purposes. It can be viewed as a hardware "ideal" that influences cache design. On the other hand, it can be used as a powerful tool to design cache-efficient algorithms. -
Clock Gating for Power Optimization in ASIC Design Cycle: Theory & Practice
Clock Gating for Power Optimization in ASIC Design Cycle: Theory & Practice Jairam S, Madhusudan Rao, Jithendra Srinivas, Parimala Vishwanath, Udayakumar H, Jagdish Rao SoC Center of Excellence, Texas Instruments, India (sjairam, bgm-rao, jithendra, pari, uday, j-rao) @ti.com 1 AGENDA • Introduction • Combinational Clock Gating – State of the art – Open problems • Sequential Clock Gating – State of the art – Open problems • Clock Power Analysis and Estimation • Clock Gating In Design Flows JS/BGM – ISLPED08 2 AGENDA • Introduction • Combinational Clock Gating – State of the art – Open problems • Sequential Clock Gating – State of the art – Open problems • Clock Power Analysis and Estimation • Clock Gating In Design Flows JS/BGM – ISLPED08 3 Clock Gating Overview JS/BGM – ISLPED08 4 Clock Gating Overview • System level gating: Turn off entire block disabling all functionality. • Conditions for disabling identified by the designer JS/BGM – ISLPED08 4 Clock Gating Overview • System level gating: Turn off entire block disabling all functionality. • Conditions for disabling identified by the designer • Suspend clocks selectively • No change to functionality • Specific to circuit structure • Possible to automate gating at RTL or gate-level JS/BGM – ISLPED08 4 Clock Network Power JS/BGM – ISLPED08 5 Clock Network Power • Clock network power consists of JS/BGM – ISLPED08 5 Clock Network Power • Clock network power consists of – Clock Tree Buffer Power JS/BGM – ISLPED08 5 Clock Network Power • Clock network power consists of – Clock Tree Buffer -
Evolution of Microprocessor Performance
EvolutionEvolution ofof MicroprocessorMicroprocessor PerformancePerformance So far we examined static & dynamic techniques to improve the performance of single-issue (scalar) pipelined CPU designs including: static & dynamic scheduling, static & dynamic branch predication. Even with these improvements, the restriction of issuing a single instruction per cycle still limits the ideal CPI = 1 Multiple Issue (CPI <1) Multi-cycle Pipelined T = I x CPI x C (single issue) Superscalar/VLIW/SMT Original (2002) Intel Predictions 1 GHz ? 15 GHz to ???? GHz IPC CPI > 10 1.1-10 0.5 - 1.1 .35 - .5 (?) Source: John P. Chen, Intel Labs We next examine the two approaches to achieve a CPI < 1 by issuing multiple instructions per cycle: 4th Edition: Chapter 2.6-2.8 (3rd Edition: Chapter 3.6, 3.7, 4.3 • Superscalar CPUs • Very Long Instruction Word (VLIW) CPUs. Single-issue Processor = Scalar Processor EECC551 - Shaaban Instructions Per Cycle (IPC) = 1/CPI EECC551 - Shaaban #1 lec # 6 Fall 2007 10-2-2007 ParallelismParallelism inin MicroprocessorMicroprocessor VLSIVLSI GenerationsGenerations Bit-level parallelism Instruction-level Thread-level (?) (TLP) 100,000,000 (ILP) Multiple micro-operations Superscalar /VLIW per cycle Simultaneous Single-issue CPI <1 u Multithreading SMT: (multi-cycle non-pipelined) Pipelined e.g. Intel’s Hyper-threading 10,000,000 CPI =1 u uuu u u Chip-Multiprocessors (CMPs) u Not Pipelined R10000 e.g IBM Power 4, 5 CPI >> 1 uuuuuuu u AMD Athlon64 X2 u uuuuu Intel Pentium D u uuuuuuuu u u 1,000,000 u uu uPentium u u uu i80386 u i80286 -
Itanium-Based Solutions by Hp
Itanium-based solutions by hp an overview of the Itanium™-based hp rx4610 server a white paper from hewlett-packard june 2001 table of contents table of contents 2 executive summary 3 why Itanium is the future of computing 3 rx4610 at a glance 3 rx4610 product specifications 4 rx4610 physical and environmental specifications 4 the rx4610 and the hp server lineup 5 rx4610 architecture 6 64-bit address space and memory capacity 6 I/O subsystem design 7 special features of the rx4610 server 8 multiple upgrade and migration paths for investment protection 8 high availability and manageability 8 advanced error detection, correction, and containment 8 baseboard management controller (BMC) 8 redundant, hot-swap power supplies 9 redundant, hot-swap cooling 9 hot-plug disk drives 9 hot-plug PCI I/O slots 9 internal removable media 10 system control panel 10 ASCII console for hp-ux 10 space-saving rack density 10 complementary design and packaging 10 how hp makes the Itanium transition easy 11 binary compatibility 11 hp-ux operating system 11 seamless transition—even for home-grown applications 12 transition help from hp 12 Itanium quick start service 12 partner technology access centers 12 upgrades and financial incentives 12 conclusion 13 for more information 13 appendix: Itanium advantages in your computing future 14 hp’s CPU roadmap 14 Itanium processor architecture 15 predication enhances parallelism 15 speculation minimizes the effect of memory latency 15 inherent scalability delivers easy expansion 16 what this means in a server 16 2 executive The Itanium™ Processor Family is the next great stride in computing--and it’s here today. -
Arduino and AVR
Arduino and AVR Ke vin J Dola n a nd Eric Te ve lson Agenda • History of Arduino • Comparison to Other Platforms • Arduino Uno - Hardware • ATmega328P Peripherals • Instruction Set • Processor Components • Pipe lining • Programming • Applica tions • Future of Arduino History of Arduino • Fa mily of Microcontrolle rs cre a te d a s a ma ste rs the sis proje ct • intended for use by a non-technical audience of artists, designers, etc. • Made for accessibility and ease of use. • Programming made easy for the audience • Ability to program board via USB • Inexpensive price point • Expanded for other types and configurations • Example: Arduino Lilypad for wearable technologies • Popularity has expanded functionality including “shields” and Bluetooth. Comparison to Other Platforms • Raspberry Pi • Raspberry Pi is a full computer that can run and support an OS, and has built in graphics. • Porta bility is a n issue , since a n e xte rna l supply is ne e de d. • Network needs more setup on an Arduino • Raspberry Pi does not support analog sensors as well • Teensy • Less expensive • Compatible with Arduino “sketches” and “shields” • Be tte r ADC sa mpling, sa me functiona lity, be tte r re solution • Sma lle r physica l boa rd size Arduino Uno - Hardware • ATmega328P Microcontroller • 3 2 KB Fla s h Me m o ry (2 KB S RAM, 1 KB EEP RO M) • 16 MH z C lo c k • 14 Digita l I/O Pins • 6 PWM Digita l I/O Pins • 6 Analog Input Pins • Up to 20mA DC Current per I/O Pin up to 300mA total across all pins • 50mA DC Current on 3.3V Pin Arduino Uno - Hardware ATmega328P Peripherals • Total of 6 accessible A/D Pins on Port C • 14 GPIO (7 Pins each from PORT B & D) • UART (Se ria l) • SPI Support • Watchdog timer to reset CPU Instruction Set • Harvard Architecture, which is non-von Neumann memory, but still a von Neumann architecture. -
Saber Eletrônica, Designers Pois Precisamos Comprovar Ao Meio Anunciante Estes Números E, Assim, Carlos C
editorial Editora Saber Ltda. Digital Freemium Edition Diretor Hélio Fittipaldi Nesta edição comemoramos o fantástico número de 258.395 downloads da edição 460 digital em PDF que tivemos nos primeiros 50 dias de circu- www.sabereletronica.com.br lação. Assim, esperamos atingir meio milhão em twitter.com/editora_saber seis meses. Na fase de teste, no ano passado, com Editor e Diretor Responsável a Edição Digital Gratuita que chamamos de “Digital Hélio Fittipaldi Conselho Editorial Freemium (Free + Premium) Edition”, já atingimos João Antonio Zuffo este marco e até ultrapassamos. Redação Fica aqui nosso agradecimento a todos os que Hélio Fittipaldi Augusto Heiss seguiram nosso apelo, para somente fazerem Revisão Técnica Eutíquio Lopez download das nossas edições através do link do Portal Saber Eletrônica, Designers pois precisamos comprovar ao meio anunciante estes números e, assim, Carlos C. Tartaglioni, Diego M. Gomes obtermos patrocínio para manter a edição digital gratuita. Publicidade Aproveitamos também para avisar aos nossos leitores de Portugal, Caroline Ferreira, cerca de 6.000 pessoas, que infelizmente os custos para enviarmos as Nikole Barros revistas impressas em papel têm sido altos e, por solicitação do nosso Colaboradores Alexandre Capelli, distribuidor, não enviaremos mais os exemplares impressos em papel Bruno Venâncio, para distribuição no mercado português e ex-colônias na África. César Cassiolato, Dante J. S. Conti, Em junho teremos a edição especial deste semestre e o assunto prin- Edriano C. de Araújo, cipal é a eletrônica embutida (embedded electronic), ou como dizem os Eutíquio Lopez, Tsunehiro Yamabe espanhóis e portugueses: electrónica embebida. Como marco teremos também no Centro de Exposições Transamérica em São Paulo, a 2ª edição da ESC Brazil 2012 e a 1ª MD&M, o maior evento de tecnologia para o mercado de design eletrônico que, neste ano, estará sendo promovido PARA ANUNCIAR: (11) 2095-5339 pela UBM junto com o primeiro evento para o setor médico/odontoló- [email protected] gico (a MD&M Brazil). -
Analysis of Body Bias Control Using Overhead Conditions for Real Time Systems: a Practical Approach∗
IEICE TRANS. INF. & SYST., VOL.E101–D, NO.4 APRIL 2018 1116 PAPER Analysis of Body Bias Control Using Overhead Conditions for Real Time Systems: A Practical Approach∗ Carlos Cesar CORTES TORRES†a), Nonmember, Hayate OKUHARA†, Student Member, Nobuyuki YAMASAKI†, Member, and Hideharu AMANO†, Fellow SUMMARY In the past decade, real-time systems (RTSs), which must in RTSs. These techniques can improve energy efficiency; maintain time constraints to avoid catastrophic consequences, have been however, they often require a large amount of power since widely introduced into various embedded systems and Internet of Things they must control the supply voltages of the systems. (IoTs). The RTSs are required to be energy efficient as they are used in embedded devices in which battery life is important. In this study, we in- Body bias (BB) control is another solution that can im- vestigated the RTS energy efficiency by analyzing the ability of body bias prove RTS energy efficiency as it can manage the tradeoff (BB) in providing a satisfying tradeoff between performance and energy. between power leakage and performance without affecting We propose a practical and realistic model that includes the BB energy and the power supply [4], [5].Itseffect is further endorsed when timing overhead in addition to idle region analysis. This study was con- ducted using accurate parameters extracted from a real chip using silicon systems are enabled with silicon on thin box (SOTB) tech- on thin box (SOTB) technology. By using the BB control based on the nology [6], which is a novel and advanced fully depleted sili- proposed model, about 34% energy reduction was achieved.