Appendix 1 Outcome of EPPI-Inspired Database Searches

Total Page:16

File Type:pdf, Size:1020Kb

Appendix 1 Outcome of EPPI-Inspired Database Searches H2020-ICT-2016-1 ICT-35-2016 Enabling responsible ICT-related research and innovation Responsible Ethical Learning with Robotics Appendix 1 Outcome of EPPI-inspired database searches Version 1.0 Date 19.06.2017 Filename Appendix 1 for Deliverable 2.2. Type Document Dissemination level Confidential Project reference No. 731726 Work package 2 Date Name Partner Document Leader Stine Trentemøller P1 Participants Cathrine Hasse P1 Jessica Sorenson P1 Maria Bulgheroni P2 Alex Gimondi P2 Valentina Simonetti P2 Brunella Marzolini P2 Partners No Name Short name Country 1 Aarhus University AU Denmark 2 Ab.Acus srl ABACUS Italy 3 De Montfort University DMU United Kingdom 4 Universitaet Hohenheim UHOH Germany “This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 731726” 1 Index APPENDIX 1 ....................................................................................................................................................... 4 INTRODUCTION ................................................................................................................................................. 4 PART A: CORE CONCEPTS .................................................................................................................................. 5 i. ROBOT AS CONCEPT AND MATERIALITY......................................................................................................... 6 Search methodology ...................................................................................................................................... 6 Database queries ........................................................................................................................................... 6 Charts and trends .......................................................................................................................................... 8 Selected literature ......................................................................................................................................... 9 ii. COLLABORATIVE LEARNING ......................................................................................................................... 73 Search methodology .................................................................................................................................... 73 Database queries ......................................................................................................................................... 74 Charts and trends ........................................................................................................................................ 75 Selected literature ....................................................................................................................................... 78 iii. HUMAN PROXIMITY .................................................................................................................................... 81 Search methodology .................................................................................................................................... 81 Database queries ......................................................................................................................................... 82 Charts and trends ........................................................................................................................................ 82 Selected literature ....................................................................................................................................... 83 PART B: OTHER RELEVANT CONCEPTS ......................................................................................................... 119 iv. ARTIFICIAL INTELLIGENCE ......................................................................................................................... 120 Database queries ....................................................................................................................................... 120 Charts and trends ...................................................................................................................................... 121 Selected literature ..................................................................................................................................... 121 v. DESIGN PROCESS ....................................................................................................................................... 125 Search methodology .................................................................................................................................. 125 Database queries ....................................................................................................................................... 125 Charts and trends ...................................................................................................................................... 127 Selected literature ..................................................................................................................................... 129 vi. SCIENCE AND TECHNOLOGY STUDIES (STS) .............................................................................................. 131 Search methodology .................................................................................................................................. 131 Database queries ....................................................................................................................................... 132 Charts and trends ...................................................................................................................................... 134 2 Selected literature ..................................................................................................................................... 139 vii. HUMAN-ROBOT INTERACTION (HRI) ....................................................................................................... 162 Search methodology .................................................................................................................................. 162 Database queries ....................................................................................................................................... 163 Charts and trends ...................................................................................................................................... 165 Selected literature ..................................................................................................................................... 168 3 APPENDIX 1 INTRODUCTION This appendix presents the search data that served as the foundation for the EPPI-inspired systematic reviews of REELER concepts. Part A covers findings relevant to the core concepts, including Robot as Materiality and Concept; Collaborative Learning; and Human Proximity. Part B covers findings relevant to the other relevant concepts, including Artificial Intelligence; Design Process; Science and Technology Studies; and Human-Robot Interaction. The structure of our search processes was iterative. The initial search often included the primary search term while subsequent searches included secondary search terms in order to find literature relevant to the REELER project. For example, in our search for Collaborative Learning, we searched “collaborative learning” and then performed subsequent searches cross-referencing e.g. “collaborative learning” with “robot”, “work”, “ethics”, “gender”, etc. In this way, a search process might return literature relevant for review for several REELER concepts. While we attempt to structure these appendices according to topic, the content inevitably reflects the interwoven nature of the searches and the literature. 4 PART A: CORE CONCEPTS 5 i. ROBOT AS CONCEPT AND MATERIALITY Search methodology A general search for robot, robotics, and variations on this word returns well over 300,000 hits in SCOPUS. Such a search is too broad and does not address the robot as an ontological concept. The concept robot has been included in most of our searches because it frames all of our concepts in the context of the REELER project. For example, a search for STS and robot returned literature for both the Science and Technology Studies review and the Robot as Materiality and Concept review. For this reason, you will find selected searches for this review here, and other supporting searches under different headings. I searched the US Department of Education database ERIC for the terms robot and robotics. I performed subsequent searches with other keywords relevant to education. After reviewing the results for both searches, I found that the additional search terms (learning, education, etc.) limited the search unnecessarily. Because ERIC is a database for education / pedagogy, the inclusion of learning and education was redundant and their inclusion omitted relevant results. A search for (robotics OR robot OR robots) returned 661 mostly relevant results. I then searched AnthroSource for robot and robotics, in combination with other relevant terms. The search returned roughly 100-200 hits for the various combinations. After skimming article titles for a few of these searches, I could find no relevant results. Finally, I searched SCOPUS for the same search terms, returning many more hits. Of course, SCOPUS covers many disciplines and the words
Recommended publications
  • Workshop on Computational Physics and Materials Science
    Workshop on Computational Physics and Materials Science: Total Energy and Force Methods 2020 Donostia-San Sebastián, Spain January 8-10, 2020 Institutional support and funding Preface This workshop is organized within the well-established “Total Energy and Force” conference series, which is held at ICTP in Trieste every odd year, and at a different place in the world every even year. The previous most recent workshops of this series outside Trieste took place in Barcelona (2012), Lausanne (2014), Luxembourg (2016) and Cambridge (2018). The main objective of this event is to identify new developments and topics in the field of electronic-structure methods from the first-principles perspective, their diverse applications, and its mathematical foundations. As such, it provides a great opportunity to assemble a wide range of leading scientists working on different aspects of computational material science. The workshop aims to cover the following topics: • Electron-phonon • Dielectrics • 2D materials • Correlation effects • Superconductivity • Topological materials • Transport properties • Excitations Organizing committee • Aran Garcia-Lekue, DIPC • Ivo Souza, UPV/EHU • Ion Errea, UPV/EHU Scientific advisory board • O. Akin-Ojo, University of Ibadan • E. Artacho, University of Cambridge & Nanogune • W. Andreoni, Ecole Polytechnique Fédérale de Lausanne • S. Biermann, Ecole Polytechnique, Palaiseau • R. Car, Princeton University • C. Filippi, University of Twente • M. Finnis, Imperial College • R. Gebauer, International Centre for Theoretical Physics • X.-G. Gong, Fudan University • J. Ihm, Seoul National University • E. Koch, Forschungszentrum Jülich • G. Kresse, University of Vienna • R. M. Martin, Stanford University • F. Mauri, University “La Sapienza” • A. Mostofi, Imperial College London • S. Narasimhan, JNCASR Bangalore • J. B.
    [Show full text]
  • Nextflex Project Call 4.0 Guidebook
    PROJECT CALL 4.0 Release Date: August 6, 2018 TABLE OF CONTENTS 1. FHE Definition 2. Introduction and Background 3. FHE Roadmap 4.0 4. Project Call Topics 4.1. Manufacturing Thrust Area (MTA) 4.2. Technology Platform Demonstrator (TPD) 5. Proposal Submission Process 5.1. Proposal Format Guidelines 5.2. Project Call 4.0 Timeline 5.3. Pre-Proposal Guidelines and Table of Contents 5.4. Full Proposal Guidelines and Table of Contents 6. Administrative Topics 6.1. Confidential Information 6.2. Financial and Cost Share Requirements 6.3. Work Requirements 6.4. Membership Requirements 7. Proposal Evaluation Criteria 7.1. General Overview and Guidelines 8. Contact Information 9. Reference Documents 10. Glossary of Terms Appendix A: Cover Sheet Template Appendix B: Instructions for Filling Out Proposal Cost Calculations Excel Workbook Appendix C: Pre-Proposal Evaluation Criteria Appendix D: Full Proposal Evaluation Criteria PROJECT CALL 4.0 SECTION 1. FHE DEFINITION This section is provided as an introduction to potential members of NextFlex® (“Institute” or “the Institute”) who may not be familiar with Flexible Hybrid Electronics (FHE) and the scope of our efforts in the Manufacturing USA network. NextFlex describes FHE as the intersection of additive circuitry, passive devices, and sensor systems that may be manufactured using printing methods (sometimes referred to as printed electronics) and thin flexible silicon chips or multichip interposer structures. These devices take advantage of the power of silicon and the economies and unique capabilities of printed circuitry to form a new class of devices for IoT, medical, robotics, consumer and communication markets. FHE devices conform to any shape, but are also bendable, twistable, and stretchable.
    [Show full text]
  • Front Cover Sis V2.Indd 1 24/06/2014 11:56 LITHOGRAPHY SOLUTIONS for HIGH-VOLUME MANUFACTURING
    Volume 36 Issue 2 2014 @siliconsemi www.siliconsemiconductor.net Directed self assembly Wafer cleaning legislation Innovation in materials recovery Getting more out of graphene Chip spending increases MEMS microphones Features, News Review, Industry Analysis, Research News and much more. Free Weekly E News round up , go to www.siliconsemiconductor.net Front Cover SiS v2.indd 1 24/06/2014 11:56 LITHOGRAPHY SOLUTIONS FOR HIGH-VOLUME MANUFACTURING Advanced Packaging for Logic and Memory Ultra-High Throughput and Productivity Mid-End and Back-End Interconnect Applications GET IN TOUCH to discuss your manufacturing needs www.EVGroup.com Untitled-1 1 26/03/2014 12:11 executiveview by Rich Rogoff, Vice President and General Manager, Lithography Systems Group, Rudolph Technologies, Inc. We must think “outside of the box” for new approaches in advanced packaging AS SEMICONDUCTOR DEVICES have continued to shrink Moving from round wafers to rectangular substrates in back- in size and grow in complexity, manufacturers have had to end advanced packaging saves corner space, delivering a develop advanced packaging techniques to accommodate roughly 10% improvement in surface utilization. In the case of the rapidly increasing number and density of connections lithography, the larger size of the substrate and the improved required to communicate with the outside world. Often these fit between the reticle and substrate can reduce the handling technologies have developed as adaptations of front-end and processing overhead by a factor of five. These productivity methods. While there is certainly value to be found improvements more than offset any potential reduction in using these well characterized processes, in throughput resulting from an increase in the number of we must be careful not to carry along old alignment points required for these larger substrates.
    [Show full text]
  • Eindhoven University of Technology MASTER Concept Design for Reel To
    Eindhoven University of Technology MASTER Concept design for reel to reel flex foil handling on a component mounting machine Wakker, R. Award date: 2005 Link to publication Disclaimer This document contains a student thesis (bachelor's or master's), as authored by a student at Eindhoven University of Technology. Student theses are made available in the TU/e repository upon obtaining the required degree. The grade received is not published on the document as presented in the repository. The required complexity or quality of research of student theses may vary by program, and the required minimum study period may vary in duration. General rights Copyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights. • Users may download and print one copy of any publication from the public portal for the purpose of private study or research. • You may not further distribute the material or use it for any profit-making activity or commercial gain Concept design for reel to reel flex foil handling on a component mounting machine DCT 2005.93 Remko Wakker s454659 Concept design for reel to reel flex foil handling on a component mounting machine Master thesis committee: prof.dr.ir.M.Steinbuch chairmain dr.ir.P.C.J.N.Rosielle, coach TU/e ing.W.Wesseling, coach Assembl¶eon B.V. ir.F.G.A. Homburg TU/e TECHNISCHE UNIVERSITEIT EINDHOVEN DEPARTMENT OF MECHANICAL ENGINEERING SECTION CONTROL SYSTEMS TECHNOLOGY CONSTRUCTIONS AND MECHANISMS Eindhoven, 24th June 2005 Preface and acknowledgements This report describes the concept design for a reel to reel flex foil production line, that is developed during my Master thesis project at the Technische Universiteit Eindhoven, faculty Mechanical engineering, group Constructions and Mechanisms.
    [Show full text]
  • Project Call 6.0 Guidebook B
    PROJECT CALL 6.0 GUIDEBOOK Online Cover Sheet Submission Deadline: 3/29/2021 Proposal Submission Deadline: 4/6/2021 Original Release Date: February 15, 2021 v1.0 PROJECT CALL 6.0 PROJECT CALL 6.0 TABLE OF CONTENTS Preface 3 SECTION 1. FHE Definition ................................................................................................................ 3 SECTION 2. Introduction and Background .......................................................................................... 3 SECTION 3. FHE Roadmap – 2020 Update ........................................................................................ 6 SECTION 4. Project Call Topics .......................................................................................................... 7 4.1 NextFlex-Funded Topics .............................................................................................................. 8 4.2 DoD Agency-Funded Topics ...................................................................................................... 14 SECTION 5. PROPOSAL SUBMISSION PROCESS ......................................................................... 15 5.1 Project Call 6.0 Timeline ............................................................................................................ 15 5.2 Proposal Format Guidelines ...................................................................................................... 16 5.3 Proposal Guidelines .................................................................................................................
    [Show full text]
  • Call for Papers | 2022 MRS Spring Meeting
    Symposium CH01: Frontiers of In Situ Materials Characterization—From New Instrumentation and Method to Imaging Aided Materials Design Advancement in synchrotron X-ray techniques, microscopy and spectroscopy has extended the characterization capability to study the structure, phonon, spin, and electromagnetic field of materials with improved temporal and spatial resolution. This symposium will cover recent advances of in situ imaging techniques and highlight progress in materials design, synthesis, and engineering in catalysts and devices aided by insights gained from the state-of-the-art real-time materials characterization. This program will bring together works with an emphasis on developing and applying new methods in X-ray or electron diffraction, scanning probe microscopy, and other techniques to in situ studies of the dynamics in materials, such as the structural and chemical evolution of energy materials and catalysts, and the electronic structure of semiconductor and functional oxides. Additionally, this symposium will focus on works in designing, synthesizing new materials and optimizing materials properties by utilizing the insights on mechanisms of materials processes at different length or time scales revealed by in situ techniques. Emerging big data analysis approaches and method development presenting opportunities to aid materials design are welcomed. Discussion on experimental strategies, data analysis, and conceptual works showcasing how new in situ tools can probe exotic and critical processes in materials, such as charge and heat transfer, bonding, transport of molecule and ions, are encouraged. The symposium will identify new directions of in situ research, facilitate the application of new techniques to in situ liquid and gas phase microscopy and spectroscopy, and bridge mechanistic study with practical synthesis and engineering for materials with a broad range of applications.
    [Show full text]
  • First Choice for Advanced Applications AT&S at a GLANCE
    Thick Copper IMS ECP® HSMtec Multilayer mSAP Double sided PTH Flexible & Rigid Flexible 2.5D® High Frequency HDI Any-Layer Metal Core IC substrates HDI Microvia First choice for advanced applications AT&S AT A GLANCE AT&S is one of the world’s leading suppliers of high-value AT&S cultivates the tradition of European engineering in a printed circuit boards and IC substrates highly industrialised setting AT&S has the most advanced high-tech facility for mass pro- The Group spends more than 5% of its annual revenues on duction of HDI printed circuit boards in China, the centre of research and development, enabling it to anticipate the ap- electronics manufacturing. Other plants, in Austria, India and plications of tomorrow. Highly qualified employees as well as Korea, concentrate on small and medium-sized batches for numerous partnerships with universities and international industrial and automotive customers. research institutes ensure that these activities meet the re- quired standards of excellence. AT&S uses problem-solving skills to add value AT&S’s broad portfolio of technologies allows it to provide AT&S is committed to the highest quality standards cutting edge, user-orientated solutions – from prototypes to All of AT&S’s production facilities are certified in accordance printed circuit boards for rapid application in industrial man- with ISO 9001 and/or ISO/TS 16969. AT&S is one of only a ufacturing – acting as a one-stop-shop. This results in major handful of printed circuit board manufacturers that also has reductions in product development lead times for customers, certification according to the EN ISO 13845 standard for med- meaning that AT&S adds value for customers above and be- ical products and the EN 9100 for the aerospace industry.
    [Show full text]
  • Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications
    materials Article Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications Ramona Nolden * , Kerstin Zöll and Anne Schwarz-Pfeiffer Research Institute for Textile and Clothing, Hochschule Niederrhein-University of Applied Sciences, Webschulstraße 31, 41065 Mönchengladbach, Germany; [email protected] (K.Z.); [email protected] (A.S.-P.) * Correspondence: [email protected] Abstract: Embroidery is often the preferred technology when rigid circuit boards need to be con- nected to sensors and electrodes by data transmission lines and integrated into textiles. Moreover, conventional circuit boards, like Lilypad Arduino, commonly lack softness and flexibility. One approach to overcome this drawback can be flexible sequins as a substrate carrier for circuit boards. In this paper, such an approach of the development of flexible and functional sequins and circuit boards for wearable textile applications using subtractive and additive technology is demonstrated. Applying these techniques, one-sided sequins and circuit boards are produced using wax printing and etching copper-clad foils, as well as using dual 3D printing of conventional isolating and electri- cally conductive materials. The resulting flexible and functional sequins are equipped with surface mounted devices, applied to textiles by an automated embroidery process and contacted with a Citation: Nolden, R.; Zöll, K.; conductive embroidery thread. Schwarz-Pfeiffer, A. Development of Flexible and Functional Sequins Keywords: 3D printing; additive manufacturing; circuit boards; functional sequins; subtractive Using Subtractive Technology and 3D technology; wearable electronics Printing for Embroidered Wearable Textile Applications. Materials 2021, 14, 2633. https://doi.org/10.3390/ ma14102633 1.
    [Show full text]
  • Solution-Processed Inorganic Electronics
    Solution-Processed Inorganic Electronics Teymur T Bakhishev Electrical Engineering and Computer Sciences University of California at Berkeley Technical Report No. UCB/EECS-2011-46 http://www.eecs.berkeley.edu/Pubs/TechRpts/2011/EECS-2011-46.html May 11, 2011 Copyright © 2011, by the author(s). All rights reserved. Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. To copy otherwise, to republish, to post on servers or to redistribute to lists, requires prior specific permission. SOLUTION-PROCESSED INORGANIC ELECTRONICS by Teymur T. Bakhishev A dissertation submitted in partial satisfaction of the requirements for the degree of Doctor of Philosophy in Engineering - Electrical Engineering and Computer Sciences in the Graduate Division of the University of California, Berkeley Committee in charge: Professor Vivek Subramanian, Chair Professor Ali Javey Professor Oscar D. Dubon Spring 2011 Abstract SOLUTION-PROCESSED INORGANIC ELECTRONICS by Teymur T. Bakhishev Doctor of Philosophy in Engineering ‐ Electrical Engineering and Computer Sciences University of California, Berkeley Professor Vivek Subramanian, Chair The field of low-cost and solution-processed electronics has experienced a steady increase in research interest over the past two decades. Fueled by continuous advances in materials development and deposition techniques, low-cost, printable electronics are approaching reality. However, a number of advances remain to be accomplished in order to enable some key, sought after applications, such as displays and RFID tags.
    [Show full text]
  • Additive Manufacturing 25 (2019) 477–484
    Additive Manufacturing 25 (2019) 477–484 Contents lists available at ScienceDirect Additive Manufacturing journal homepage: www.elsevier.com/locate/addma Reactive material jetting of polyimide insulators for complex circuit board T design Fan Zhang, Ehab Saleh, Jayasheelan Vaithilingam, You Li, Christopher J. Tuck, ⁎ Richard J.M. Hague, Ricky D. Wildman, Yinfeng He Faculty of Engineering, University of Nottingham, University Park, NG7 2RD, Nottingham, United Kingdom ARTICLE INFO ABSTRACT Keywords: Polyimides are a group of high performance thermal stable dielectric materials used in diverse applications. In 3D print this article, we synthesized and developed a high-performance polyimide precursor ink for a Material Jetting Additive manufacturing (MJ) process. The proposed ink formulation was shown to form a uniform and dense polyimide film through Printed electronics reactive MJ utilising real-time thermo-imidisation process. The printed polyimide film showed a permittivity of Polyimide 3.41 and degradation temperature around 500 °C, both of which are comparable to commercially available Inkjet polyimide films. Benefiting from the capability of being able to selectively deposit material throughMJ,we propose the use of such a formulation to produce complex circuit board structures by the co-printing of con- ductive silver tracks and polyimide dielectric layers. By means of selectively depositing 4 μm thick patches at the cross-over points of two circuit patterns, a traditional double-sided printed circuit board (PCB) can be printed on one side, providing the user with higher design freedom to achieve a more compact high performance PCB structure. 1. Introduction allowed to have any intersections in their route. In industrial manu- facturing, double sided PCB circuit is commonly used, the conductive Material Jetting (MJ) is an advanced, high resolution Additive tracks are usually placed on both sides of the board to achieve increased Manufacturing (AM) method, which can be used to produce structures circuit density and a more compact structure.
    [Show full text]
  • 4D's Flexcam Commercial Opportunity
    Flexible Electronics Integration and Supply Chain Challenges Malcolm J Thompson PhD CEO Nano Bio Manufacturing Consortium 1 FlexTech & NBMC Business Model . 20+ years as industry-led manufacturing consortium w/ government participation . Supported DARPA, AF, ARL, AFRL, SOCOM . Access to leading companies and PhD level SMEs . Industry cost-shared manufacturing development program –> 60%+ industry funding . 165 projects since 1994 . Demonstrated results in tools, materials, processes and demonstrators . Creative, Collaborative, Cost Effective 7/23/201 2 5 How FlexTech Works 1. Define objectives 2. Set cost share floor 3. If equal technical merit, the higher the cost share the higher the score 7/23/2015 3 Why Flex Electronics? Change the Way Electronics Are Built Printable electronics combines graphic arts printing and microelectronics technologies • Requires new devices AND new manufacturing paradigms • Potential to reduce cost at a greater rate than traditional silicon integrated circuit manufacturing • Low Cost Distributed Manufacturing • Rapid Fielding Source: Wiki Commons Conventional Silicon Electronics Printed Electronics Source: LM Corp PE Paradigm: More product flexibility, lower costs, shorter time to bring products to market, and overall innovation and new business opportunities. Rapid Fielding and Distributed Manufacturing 7/23/2015 4 NBMC Background AFRL Flexible Hybrid Electronics NBMC Goal Integration of Materials and Manufacturing within in Aerospace a common platform to address various flexible device applications Challenges and Opportunities February 2013 AFRL awarded FlexTech with a contract to set up the Nano-Bio Manufacturing Consortium A consortium of Government, Industry, and Academic Laboratories that provides R&D funding for collaborative team projects, workshops and working groups to accelerate the maturation of platform capabilities and the creation of innovative product technologies .
    [Show full text]
  • The PCB Magazine, Agust 2014
    E L Hybrid Systems for August 2014 E 26 PRINT Organic and Printed Electronics CTR by Klaus Hecker Piezoelectric, Pyroelectric, 32 and Ferroelectric Materials ONIC for Printed Electronics by Josh Goldberg E D Conductive Ink Market: 44 Photovoltaic and Touch Screen Sectors by Dr. Khasha Ghaffarzadeh S Printed Electronics 2014: World Standardization Effort Growing Opportunities for Collaboration by Marc Carter, page 12 August 2014 • The PCB Magazine 1 IPC echSummit October 28–30, 2014 • Raleigh, North Carolina Combining three events into one, IPC TechSummit focuses on innovation, reliability and leadership — three cornerstones of successful business in today’s electronics marketplace. Running parallel conferences, this world-class event will provide critical knowledge that you need to solve today’s challenges and prepare for the future. Select from sessions in one conference or from all three. Innovation Electronic System Technologies Conference Reliability 8th International Symposium on Tin Whiskers Leadership Executive Management Sessions Mark your calendar now to join your colleagues for this one-of-a-kind learning and networking event. www.ipc.org/TechSummit Printed Electronics AUGUST What is the story with printed electronics? Where have they been and where are they going? Most F importantly, how are they being used in today’s EATURED CONTENT EATURED market? These questions and more are addressed by this month’s feature contributors from IPC, OE-A, and more. 12 Printed Electronics 2014: 32 Piezoelectric, Pyroelectric, and World Standarization Effort— Ferroelectric Materials for Growing Opportunities for Printed Electronics Collaboration by Josh Goldberg by Marc Carter 26 Hybrid Systems for Organic and Printed Electronics by Klaus Hecker FEATURE SHORT 44 Conductive Ink Market: Photovoltaic and Touch Screen Sectors by Dr.
    [Show full text]