DOCSLIB.ORG

Low-Cost Flexible Printed Circuit Technology Based Microelectrode

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Low-Cost Flexible Printed Circuit Technology Based Microelectrode Sensors and Actuators A 169 (2011) 89–97 Contents lists available at ScienceDirect Sensors and Actuators A: Physical jo urnal homepage: www.elsevier.com/locate/sna Low-cost flexible printed circuit technology based microelectrode array for extracellular stimulation of the invertebrate locomotory system a,∗,1 b Alper Bozkurt , Amit Lal a North Carolina State University, Department of Electrical and Computer Engineering, Raleigh, NC 27695-7911, USA b Cornell University, School of Electrical and Computer Engineering, Ithaca, NY 14853, USA a r t i c l e i n f o a b s t r a c t Article history: The biobotic control of invertebrates through functional electrical stimulation of neural and neuromus- Received 6 October 2010 cular tissue is under active exploration. Implantable microelectrodes are often designed to be used in Received in revised form 30 March 2011 chronic long term applications in vertebrates and subjected to strict endurance and resolution require- Accepted 12 May 2011 ments. However, these constraints can be relaxed in invertebrate-related applications to allow low cost Available online 20 May 2011 production for high-volume markets. In this study, we propose flexible printed circuit board (flex-PCB) based electrodes for implantable neuromuscular stimulation, address related shortcomings, and suggest Keywords: 2 modifications in the fabrication process. We were able to obtain a charge storage capacity of 3.18 mC/cm Neural stimulation ␮ × ␮ Electrodes and 1 kHz impedance of 52 k with gold electroplated 100 m 100 m electrode sites on the flex-PCB Gold electrodes. The electrodeposition of iridium oxide and electrochemical polymerization of PEDOT with 2 Iridium oxide dopant PSS on microelectrodes enhanced the charge storage capacity to 38.9 and 124.3 mC/cm where Conductive polymers the 1 kHz impedance magnitude was 16 k and 3 k , respectively. This improvement in electrochemical PEDOT performance was also corroborated by current pulsed voltage excursion studies. The long term dip test Flexible electronics in saline solution supports the potential of flex-PCB electrodes for neural electrostimulation of insects, Invertebrate physiology while revealing potential instability in PEDOT-PSS coatings with continuous high current density pulsing. © 2011 Elsevier B.V. All rights reserved. 1. Introduction the cost of fabrication. The vertebrate implantable microelectrodes are often designed to be used in chronic long term applications. The functional electrical stimulation of the neuromuscular sys- Hence, the endurance of these devices is an important design cri- tem has been increasingly used as a clinical treatment option for terion during the implantation process and against the long term restoration, rehabilitation, and control of movement [1]. Recently, reactions from the biochemical agents that exist in biological tis- this technique has been under investigation as a means to con- sue. In addition, higher sensitivity and specificity are required trol and direct the locomotion of invertebrate organisms, insects to obtain a successful outcome from the sophisticated vertebrate in particular, for applications ranging from ecological monitor- motor control system. Therefore, implantable stimulating micro- ing to search-and-rescue missions in a disaster [2,3]. Such a electrodes are often produced following high-cost conventional “biobotic” control paradigm may benefit extensively from meta- thin-film processing technologies derived from semiconductor fab- morphic development to couple electrically active microelectrodes rication techniques [5]. On the other hand, immunoreaction is into the electrically responsive tissue of the insect to enable an less an issue for the invertebrates and the lifespan of the elec- automated mass production line [4]. The cost of microfabricating trodes in tissue is much less due to the shorter life-time of insects. the metamorphosis-implanted electrodes on this production line Moreover, depending on the electrical actuation and movement is an important concern, especially for the biobotic applications in control scheme, lower spatial resolution for site specificity can be which a larger number of insects would be employed. tolerated due to the relatively less intricate insect motor control Nevertheless, the design constraints of these invertebrate system of the insect. This difference allows the use of larger pads microelectrodes can be compromised to a greater extent with with more pitch sizes. All these features provide the opportunity respect to vertebrate microelectrodes, thus enabling a reduction in to fabricate implantable electrodes through highly standardized and commonly available flexible printed circuit board (flex-PCB) technologies where the production cost is optimized for high ∗ volume markets. Polyimide, the most common substrate for flex- Corresponding author. Tel.: +1 919 515 7349. PCB production, is a biocompatible material [6]. These substrates E-mail address: [email protected] (A. Bozkurt). 1 This work was performed while A.B. was at Cornell University. are often covered with copper as a conductive layer, which can 0924-4247/$ – see front matter © 2011 Elsevier B.V. All rights reserved. doi:10.1016/j.sna.2011.05.015 90 A. Bozkurt, A. Lal / Sensors and Actuators A 169 (2011) 89–97 Fig. 1. Cross-section diagram of the one-layer flexible circuit board electrode (*immersion gold, ** electroplated gold). Nickel–phosphorus layer is only for immersion plating (ENIG). easily be coated with gold for biocompatibility as a standard part The tissue growing through these orifices provides mechanical of the flex-PCB production line. In addition to these, the elec- anchoring in in vivo setups, but that is not in the scope of this ␮ ␮ trode size (50–100 m on each side) and density (50–100 m paper. pitch size) can be determined with conventional flex-PCB technolo- Laser drilling and milling have been widely used to define minia- gies, which can be successfully accommodated for insect-biobot ture structures on flex PCB substrates. Carbon rich debris has been applications. Using this manufacturing technology, the circuit known to occur as a result of photothermal and photochemical components for control and data handling can also be directly mechanisms leading to the ablation of the polymer [9]. To remove assembled on the microelectrode substrate, which is a beneficial the laser ablation debris, we cleaned the received probes ultrason- property in terms of the size, power, and noise performance of the ically by soaking them in acetone and then isopropyl alcohol (IPA) electronics. baths, each for 10 min. Acetone and IPA are known to affect the So far, the use of flex-PCB technology in neural engineering molecular orientation of the polyimide; meanwhile, the ultrasonic research has been limited to manufacturing flexible interconnects pulsing has the potential to irritate the deposited gold surface, so between silicon-based microelectrode arrays and control micro- we performed an electrochemical analysis to characterize the effect electronics [7]. This technology also has been incorporated in of the probe cleaning procedure. in vitro culture dishes to “record” the electrical activity of cultured cardiac-cells [8]. The fabrication and use of implantable in vivo flex- 2.2. Electrochemical deposition PCB “stimulation” electrodes, however, require further analysis and modification. To enhance the electrochemical properties of the flex-PCB In this study, we report on the improvement of electrical and electrodes, we electrodeposited iridium oxide and electropolymer- electrochemical behavior of flex-PCB probes that will be used as ized poly(3,4-ethylenedioxythiophene) poly(styrene-sulfonate) implantable insect tissue stimulation microelectrodes. We present (PEDOT-PSS) over the gold coated electrodes to facilitate extra the in vitro characterization of morphological, electrical, and elec- charge transfer across the interface. For the deposition of iridium trochemical properties of these surface modifications through oxide, we followed a recipe similar to [10]. Seventy-five milligrams scanning electron microscopy, cyclic voltammetry, electrochemi- of iridium (IV) chloride hydrate was dissolved in 50 ml of deionized cal impedance spectroscopy, and current pulsed voltage excursions water by stirring for 30 min at room temperature, which formed in phosphate buffered saline solutions. a black colored solution. Then, 0.5 ml of 30% hydrogen peroxide solution were added to the solution and stirred for 10 min, which 2. Methods and materials turned the color of the solution to yellow. Adding 250 mg of oxalic acid dihydrate turned the color of the solution blue, and that was 2.1. Flexible printed circuit board fabrication stirred for another 10 min. Small amounts of anhydrous potassium carbonate were added to the solution slowly, until a pH of 10.9 was The layouts of the stimulation electrodes were prepared using obtained. The solution was kept at room temperature for 2 days to Target3001 software (Ing.-Buero FRIEDRICH, Germany) and the reach equilibrium before the deposition. generated Gerber files were submitted to Hughes Circuits, Inc. (San PEDOT-PSS monomer solution was prepared by stirring Marcos, CA, USA) for production. For the substrate, 100 ␮m (∼4 mil) 35 mg of 3,4-ethylenedioxythiophene (EDOT) with 250 mg ® TM thick Kapton polyimide film (AP8545, DuPont , DE, USA) was poly(styrenesulfonic acid sodium salt) in 25 ml of deionized water 2 used, which was laminated with 17 ␮m (0.5 oz/ft ) thick copper for 2 h until all of the globules
Load more

Recommended publications
  • Workshop on Computational Physics and Materials Science
    Workshop on Computational Physics and Materials Science: Total Energy and Force Methods 2020 Donostia-San Sebastián, Spain January 8-10, 2020 Institutional support and funding Preface This workshop is organized within the well-established “Total Energy and Force” conference series, which is held at ICTP in Trieste every odd year, and at a different place in the world every even year. The previous most recent workshops of this series outside Trieste took place in Barcelona (2012), Lausanne (2014), Luxembourg (2016) and Cambridge (2018). The main objective of this event is to identify new developments and topics in the field of electronic-structure methods from the first-principles perspective, their diverse applications, and its mathematical foundations. As such, it provides a great opportunity to assemble a wide range of leading scientists working on different aspects of computational material science. The workshop aims to cover the following topics: • Electron-phonon • Dielectrics • 2D materials • Correlation effects • Superconductivity • Topological materials • Transport properties • Excitations Organizing committee • Aran Garcia-Lekue, DIPC • Ivo Souza, UPV/EHU • Ion Errea, UPV/EHU Scientific advisory board • O. Akin-Ojo, University of Ibadan • E. Artacho, University of Cambridge & Nanogune • W. Andreoni, Ecole Polytechnique Fédérale de Lausanne • S. Biermann, Ecole Polytechnique, Palaiseau • R. Car, Princeton University • C. Filippi, University of Twente • M. Finnis, Imperial College • R. Gebauer, International Centre for Theoretical Physics • X.-G. Gong, Fudan University • J. Ihm, Seoul National University • E. Koch, Forschungszentrum Jülich • G. Kresse, University of Vienna • R. M. Martin, Stanford University • F. Mauri, University “La Sapienza” • A. Mostofi, Imperial College London • S. Narasimhan, JNCASR Bangalore • J. B.
    [Show full text]
  • Nextflex Project Call 4.0 Guidebook
    PROJECT CALL 4.0 Release Date: August 6, 2018 TABLE OF CONTENTS 1. FHE Definition 2. Introduction and Background 3. FHE Roadmap 4.0 4. Project Call Topics 4.1. Manufacturing Thrust Area (MTA) 4.2. Technology Platform Demonstrator (TPD) 5. Proposal Submission Process 5.1. Proposal Format Guidelines 5.2. Project Call 4.0 Timeline 5.3. Pre-Proposal Guidelines and Table of Contents 5.4. Full Proposal Guidelines and Table of Contents 6. Administrative Topics 6.1. Confidential Information 6.2. Financial and Cost Share Requirements 6.3. Work Requirements 6.4. Membership Requirements 7. Proposal Evaluation Criteria 7.1. General Overview and Guidelines 8. Contact Information 9. Reference Documents 10. Glossary of Terms Appendix A: Cover Sheet Template Appendix B: Instructions for Filling Out Proposal Cost Calculations Excel Workbook Appendix C: Pre-Proposal Evaluation Criteria Appendix D: Full Proposal Evaluation Criteria PROJECT CALL 4.0 SECTION 1. FHE DEFINITION This section is provided as an introduction to potential members of NextFlex® (“Institute” or “the Institute”) who may not be familiar with Flexible Hybrid Electronics (FHE) and the scope of our efforts in the Manufacturing USA network. NextFlex describes FHE as the intersection of additive circuitry, passive devices, and sensor systems that may be manufactured using printing methods (sometimes referred to as printed electronics) and thin flexible silicon chips or multichip interposer structures. These devices take advantage of the power of silicon and the economies and unique capabilities of printed circuitry to form a new class of devices for IoT, medical, robotics, consumer and communication markets. FHE devices conform to any shape, but are also bendable, twistable, and stretchable.
    [Show full text]
  • Front Cover Sis V2.Indd 1 24/06/2014 11:56 LITHOGRAPHY SOLUTIONS for HIGH-VOLUME MANUFACTURING
    Volume 36 Issue 2 2014 @siliconsemi www.siliconsemiconductor.net Directed self assembly Wafer cleaning legislation Innovation in materials recovery Getting more out of graphene Chip spending increases MEMS microphones Features, News Review, Industry Analysis, Research News and much more. Free Weekly E News round up , go to www.siliconsemiconductor.net Front Cover SiS v2.indd 1 24/06/2014 11:56 LITHOGRAPHY SOLUTIONS FOR HIGH-VOLUME MANUFACTURING Advanced Packaging for Logic and Memory Ultra-High Throughput and Productivity Mid-End and Back-End Interconnect Applications GET IN TOUCH to discuss your manufacturing needs www.EVGroup.com Untitled-1 1 26/03/2014 12:11 executiveview by Rich Rogoff, Vice President and General Manager, Lithography Systems Group, Rudolph Technologies, Inc. We must think “outside of the box” for new approaches in advanced packaging AS SEMICONDUCTOR DEVICES have continued to shrink Moving from round wafers to rectangular substrates in back- in size and grow in complexity, manufacturers have had to end advanced packaging saves corner space, delivering a develop advanced packaging techniques to accommodate roughly 10% improvement in surface utilization. In the case of the rapidly increasing number and density of connections lithography, the larger size of the substrate and the improved required to communicate with the outside world. Often these fit between the reticle and substrate can reduce the handling technologies have developed as adaptations of front-end and processing overhead by a factor of five. These productivity methods. While there is certainly value to be found improvements more than offset any potential reduction in using these well characterized processes, in throughput resulting from an increase in the number of we must be careful not to carry along old alignment points required for these larger substrates.
    [Show full text]
  • Eindhoven University of Technology MASTER Concept Design for Reel To
    Eindhoven University of Technology MASTER Concept design for reel to reel flex foil handling on a component mounting machine Wakker, R. Award date: 2005 Link to publication Disclaimer This document contains a student thesis (bachelor's or master's), as authored by a student at Eindhoven University of Technology. Student theses are made available in the TU/e repository upon obtaining the required degree. The grade received is not published on the document as presented in the repository. The required complexity or quality of research of student theses may vary by program, and the required minimum study period may vary in duration. General rights Copyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights. • Users may download and print one copy of any publication from the public portal for the purpose of private study or research. • You may not further distribute the material or use it for any profit-making activity or commercial gain Concept design for reel to reel flex foil handling on a component mounting machine DCT 2005.93 Remko Wakker s454659 Concept design for reel to reel flex foil handling on a component mounting machine Master thesis committee: prof.dr.ir.M.Steinbuch chairmain dr.ir.P.C.J.N.Rosielle, coach TU/e ing.W.Wesseling, coach Assembl¶eon B.V. ir.F.G.A. Homburg TU/e TECHNISCHE UNIVERSITEIT EINDHOVEN DEPARTMENT OF MECHANICAL ENGINEERING SECTION CONTROL SYSTEMS TECHNOLOGY CONSTRUCTIONS AND MECHANISMS Eindhoven, 24th June 2005 Preface and acknowledgements This report describes the concept design for a reel to reel flex foil production line, that is developed during my Master thesis project at the Technische Universiteit Eindhoven, faculty Mechanical engineering, group Constructions and Mechanisms.
    [Show full text]
  • Project Call 6.0 Guidebook B
    PROJECT CALL 6.0 GUIDEBOOK Online Cover Sheet Submission Deadline: 3/29/2021 Proposal Submission Deadline: 4/6/2021 Original Release Date: February 15, 2021 v1.0 PROJECT CALL 6.0 PROJECT CALL 6.0 TABLE OF CONTENTS Preface 3 SECTION 1. FHE Definition ................................................................................................................ 3 SECTION 2. Introduction and Background .......................................................................................... 3 SECTION 3. FHE Roadmap – 2020 Update ........................................................................................ 6 SECTION 4. Project Call Topics .......................................................................................................... 7 4.1 NextFlex-Funded Topics .............................................................................................................. 8 4.2 DoD Agency-Funded Topics ...................................................................................................... 14 SECTION 5. PROPOSAL SUBMISSION PROCESS ......................................................................... 15 5.1 Project Call 6.0 Timeline ............................................................................................................ 15 5.2 Proposal Format Guidelines ...................................................................................................... 16 5.3 Proposal Guidelines .................................................................................................................
    [Show full text]
  • Call for Papers | 2022 MRS Spring Meeting
    Symposium CH01: Frontiers of In Situ Materials Characterization—From New Instrumentation and Method to Imaging Aided Materials Design Advancement in synchrotron X-ray techniques, microscopy and spectroscopy has extended the characterization capability to study the structure, phonon, spin, and electromagnetic field of materials with improved temporal and spatial resolution. This symposium will cover recent advances of in situ imaging techniques and highlight progress in materials design, synthesis, and engineering in catalysts and devices aided by insights gained from the state-of-the-art real-time materials characterization. This program will bring together works with an emphasis on developing and applying new methods in X-ray or electron diffraction, scanning probe microscopy, and other techniques to in situ studies of the dynamics in materials, such as the structural and chemical evolution of energy materials and catalysts, and the electronic structure of semiconductor and functional oxides. Additionally, this symposium will focus on works in designing, synthesizing new materials and optimizing materials properties by utilizing the insights on mechanisms of materials processes at different length or time scales revealed by in situ techniques. Emerging big data analysis approaches and method development presenting opportunities to aid materials design are welcomed. Discussion on experimental strategies, data analysis, and conceptual works showcasing how new in situ tools can probe exotic and critical processes in materials, such as charge and heat transfer, bonding, transport of molecule and ions, are encouraged. The symposium will identify new directions of in situ research, facilitate the application of new techniques to in situ liquid and gas phase microscopy and spectroscopy, and bridge mechanistic study with practical synthesis and engineering for materials with a broad range of applications.
    [Show full text]
  • First Choice for Advanced Applications AT&S at a GLANCE
    Thick Copper IMS ECP® HSMtec Multilayer mSAP Double sided PTH Flexible & Rigid Flexible 2.5D® High Frequency HDI Any-Layer Metal Core IC substrates HDI Microvia First choice for advanced applications AT&S AT A GLANCE AT&S is one of the world’s leading suppliers of high-value AT&S cultivates the tradition of European engineering in a printed circuit boards and IC substrates highly industrialised setting AT&S has the most advanced high-tech facility for mass pro- The Group spends more than 5% of its annual revenues on duction of HDI printed circuit boards in China, the centre of research and development, enabling it to anticipate the ap- electronics manufacturing. Other plants, in Austria, India and plications of tomorrow. Highly qualified employees as well as Korea, concentrate on small and medium-sized batches for numerous partnerships with universities and international industrial and automotive customers. research institutes ensure that these activities meet the re- quired standards of excellence. AT&S uses problem-solving skills to add value AT&S’s broad portfolio of technologies allows it to provide AT&S is committed to the highest quality standards cutting edge, user-orientated solutions – from prototypes to All of AT&S’s production facilities are certified in accordance printed circuit boards for rapid application in industrial man- with ISO 9001 and/or ISO/TS 16969. AT&S is one of only a ufacturing – acting as a one-stop-shop. This results in major handful of printed circuit board manufacturers that also has reductions in product development lead times for customers, certification according to the EN ISO 13845 standard for med- meaning that AT&S adds value for customers above and be- ical products and the EN 9100 for the aerospace industry.
    [Show full text]
  • Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications
    materials Article Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications Ramona Nolden * , Kerstin Zöll and Anne Schwarz-Pfeiffer Research Institute for Textile and Clothing, Hochschule Niederrhein-University of Applied Sciences, Webschulstraße 31, 41065 Mönchengladbach, Germany; [email protected] (K.Z.); [email protected] (A.S.-P.) * Correspondence: [email protected] Abstract: Embroidery is often the preferred technology when rigid circuit boards need to be con- nected to sensors and electrodes by data transmission lines and integrated into textiles. Moreover, conventional circuit boards, like Lilypad Arduino, commonly lack softness and flexibility. One approach to overcome this drawback can be flexible sequins as a substrate carrier for circuit boards. In this paper, such an approach of the development of flexible and functional sequins and circuit boards for wearable textile applications using subtractive and additive technology is demonstrated. Applying these techniques, one-sided sequins and circuit boards are produced using wax printing and etching copper-clad foils, as well as using dual 3D printing of conventional isolating and electri- cally conductive materials. The resulting flexible and functional sequins are equipped with surface mounted devices, applied to textiles by an automated embroidery process and contacted with a Citation: Nolden, R.; Zöll, K.; conductive embroidery thread. Schwarz-Pfeiffer, A. Development of Flexible and Functional Sequins Keywords: 3D printing; additive manufacturing; circuit boards; functional sequins; subtractive Using Subtractive Technology and 3D technology; wearable electronics Printing for Embroidered Wearable Textile Applications. Materials 2021, 14, 2633. https://doi.org/10.3390/ ma14102633 1.
    [Show full text]
  • Solution-Processed Inorganic Electronics
    Solution-Processed Inorganic Electronics Teymur T Bakhishev Electrical Engineering and Computer Sciences University of California at Berkeley Technical Report No. UCB/EECS-2011-46 http://www.eecs.berkeley.edu/Pubs/TechRpts/2011/EECS-2011-46.html May 11, 2011 Copyright © 2011, by the author(s). All rights reserved. Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. To copy otherwise, to republish, to post on servers or to redistribute to lists, requires prior specific permission. SOLUTION-PROCESSED INORGANIC ELECTRONICS by Teymur T. Bakhishev A dissertation submitted in partial satisfaction of the requirements for the degree of Doctor of Philosophy in Engineering - Electrical Engineering and Computer Sciences in the Graduate Division of the University of California, Berkeley Committee in charge: Professor Vivek Subramanian, Chair Professor Ali Javey Professor Oscar D. Dubon Spring 2011 Abstract SOLUTION-PROCESSED INORGANIC ELECTRONICS by Teymur T. Bakhishev Doctor of Philosophy in Engineering ‐ Electrical Engineering and Computer Sciences University of California, Berkeley Professor Vivek Subramanian, Chair The field of low-cost and solution-processed electronics has experienced a steady increase in research interest over the past two decades. Fueled by continuous advances in materials development and deposition techniques, low-cost, printable electronics are approaching reality. However, a number of advances remain to be accomplished in order to enable some key, sought after applications, such as displays and RFID tags.
    [Show full text]
  • Additive Manufacturing 25 (2019) 477–484
    Additive Manufacturing 25 (2019) 477–484 Contents lists available at ScienceDirect Additive Manufacturing journal homepage: www.elsevier.com/locate/addma Reactive material jetting of polyimide insulators for complex circuit board T design Fan Zhang, Ehab Saleh, Jayasheelan Vaithilingam, You Li, Christopher J. Tuck, ⁎ Richard J.M. Hague, Ricky D. Wildman, Yinfeng He Faculty of Engineering, University of Nottingham, University Park, NG7 2RD, Nottingham, United Kingdom ARTICLE INFO ABSTRACT Keywords: Polyimides are a group of high performance thermal stable dielectric materials used in diverse applications. In 3D print this article, we synthesized and developed a high-performance polyimide precursor ink for a Material Jetting Additive manufacturing (MJ) process. The proposed ink formulation was shown to form a uniform and dense polyimide film through Printed electronics reactive MJ utilising real-time thermo-imidisation process. The printed polyimide film showed a permittivity of Polyimide 3.41 and degradation temperature around 500 °C, both of which are comparable to commercially available Inkjet polyimide films. Benefiting from the capability of being able to selectively deposit material throughMJ,we propose the use of such a formulation to produce complex circuit board structures by the co-printing of con- ductive silver tracks and polyimide dielectric layers. By means of selectively depositing 4 μm thick patches at the cross-over points of two circuit patterns, a traditional double-sided printed circuit board (PCB) can be printed on one side, providing the user with higher design freedom to achieve a more compact high performance PCB structure. 1. Introduction allowed to have any intersections in their route. In industrial manu- facturing, double sided PCB circuit is commonly used, the conductive Material Jetting (MJ) is an advanced, high resolution Additive tracks are usually placed on both sides of the board to achieve increased Manufacturing (AM) method, which can be used to produce structures circuit density and a more compact structure.
    [Show full text]
  • 4D's Flexcam Commercial Opportunity
    Flexible Electronics Integration and Supply Chain Challenges Malcolm J Thompson PhD CEO Nano Bio Manufacturing Consortium 1 FlexTech & NBMC Business Model . 20+ years as industry-led manufacturing consortium w/ government participation . Supported DARPA, AF, ARL, AFRL, SOCOM . Access to leading companies and PhD level SMEs . Industry cost-shared manufacturing development program –> 60%+ industry funding . 165 projects since 1994 . Demonstrated results in tools, materials, processes and demonstrators . Creative, Collaborative, Cost Effective 7/23/201 2 5 How FlexTech Works 1. Define objectives 2. Set cost share floor 3. If equal technical merit, the higher the cost share the higher the score 7/23/2015 3 Why Flex Electronics? Change the Way Electronics Are Built Printable electronics combines graphic arts printing and microelectronics technologies • Requires new devices AND new manufacturing paradigms • Potential to reduce cost at a greater rate than traditional silicon integrated circuit manufacturing • Low Cost Distributed Manufacturing • Rapid Fielding Source: Wiki Commons Conventional Silicon Electronics Printed Electronics Source: LM Corp PE Paradigm: More product flexibility, lower costs, shorter time to bring products to market, and overall innovation and new business opportunities. Rapid Fielding and Distributed Manufacturing 7/23/2015 4 NBMC Background AFRL Flexible Hybrid Electronics NBMC Goal Integration of Materials and Manufacturing within in Aerospace a common platform to address various flexible device applications Challenges and Opportunities February 2013 AFRL awarded FlexTech with a contract to set up the Nano-Bio Manufacturing Consortium A consortium of Government, Industry, and Academic Laboratories that provides R&D funding for collaborative team projects, workshops and working groups to accelerate the maturation of platform capabilities and the creation of innovative product technologies .
    [Show full text]
  • The PCB Magazine, Agust 2014
    E L Hybrid Systems for August 2014 E 26 PRINT Organic and Printed Electronics CTR by Klaus Hecker Piezoelectric, Pyroelectric, 32 and Ferroelectric Materials ONIC for Printed Electronics by Josh Goldberg E D Conductive Ink Market: 44 Photovoltaic and Touch Screen Sectors by Dr. Khasha Ghaffarzadeh S Printed Electronics 2014: World Standardization Effort Growing Opportunities for Collaboration by Marc Carter, page 12 August 2014 • The PCB Magazine 1 IPC echSummit October 28–30, 2014 • Raleigh, North Carolina Combining three events into one, IPC TechSummit focuses on innovation, reliability and leadership — three cornerstones of successful business in today’s electronics marketplace. Running parallel conferences, this world-class event will provide critical knowledge that you need to solve today’s challenges and prepare for the future. Select from sessions in one conference or from all three. Innovation Electronic System Technologies Conference Reliability 8th International Symposium on Tin Whiskers Leadership Executive Management Sessions Mark your calendar now to join your colleagues for this one-of-a-kind learning and networking event. www.ipc.org/TechSummit Printed Electronics AUGUST What is the story with printed electronics? Where have they been and where are they going? Most F importantly, how are they being used in today’s EATURED CONTENT EATURED market? These questions and more are addressed by this month’s feature contributors from IPC, OE-A, and more. 12 Printed Electronics 2014: 32 Piezoelectric, Pyroelectric, and World Standarization Effort— Ferroelectric Materials for Growing Opportunities for Printed Electronics Collaboration by Josh Goldberg by Marc Carter 26 Hybrid Systems for Organic and Printed Electronics by Klaus Hecker FEATURE SHORT 44 Conductive Ink Market: Photovoltaic and Touch Screen Sectors by Dr.
    [Show full text]