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Title of [Thesis, Dissertation] DESIGN AND COMPARATIVE MATERIAL ANALYSIS OF A CAPACITIVE TYPE PRESSURE SENSOR FOR MEASUREMENT OF KNEE PRESSURE DISTRIBUTION OF RODENTS by Al Maqsudur Rashid A thesis submitted in partial fulfillment of the requirements for the degree of Master of Science in Mechanical Engineering MONTANA STATE UNIVERSITY Bozeman, Montana December, 2013 ©COPYRIGHT by Al Maqsudur Rashid 2013 All Rights Reserved ii APPROVAL of a thesis submitted by Al Maqsudur Rashid This thesis has been read by each member of the thesis committee and has been found to be satisfactory regarding content, English usage, format, citation, bibliographic style, and consistency and is ready for submission to The Graduate School. Dr. Ronald June Approved for the Department of Mechanical and Industrial Engineering Dr. Christopher Jenkins Approved for The Graduate School Dr. Karlene A. Hoo iii ACKNOWLEDGEMENTS I would like to express heartfelt gratitude to my supervisor and thesis committee chair Dr. Ron June for supporting me from the very beginning of his project with many encouragements and ideas and suggesting me a proper path to finish my degree. It was a wonderful learning experience for me during the work presented here with proper guidance and mentoring from him. Without his patience I wouldn't have finish this write- up any sooner. Then I would like to give a special thanks to my former supervisor Dr. Ahsan Mian for introducing me to MEMS at MSU and later presenting me this work which eventually gave the foundation of my thesis. I am thankful to Tom Rose who allowed me to cite his experimental data and updating me with experimental measurements from time to time during the ongoing project upon which this work was built on. I am grateful to Harris Mousoulis from Purdue University with whom I have shared and exchanged knowledge about various MEMS clean room process and steps. Also thanks to Donny Zignego for showing me quick tips on how to format this report easily. Lastly all of these would have never been possible if I wouldn’t have received support from my parents thousands mile away from here praying for me all the time. iv TABLE OF CONTENTS 1. INTRODUCTION TO MEMS BASED PRESSURE SENSOR .................................. 1 Mems Pressure Sensor Overview ................................................................................. 1 Piezoresistive and Capacitive MEMS Pressure Sensor ................................................ 3 Motivation ..................................................................................................................... 6 Osteoarthritis and Contact Pressure ........................................................................ 9 Role of Knee Loading in Osteoarthritis ................................................................ 10 Mouse as Experiment Model ................................................................................ 13 2. DESIGN AND MODELING ...................................................................................... 15 Array Configuration .................................................................................................... 15 Pressure Sensor for Rodents: Initial Design ............................................................... 19 First Iteration of Design .............................................................................................. 23 Upper and Lower Polymer Layer ......................................................................... 24 Upper Electrodes ................................................................................................... 24 Lower Electrodes .................................................................................................. 26 Thin Insulation Layer With Air Pocket ................................................................ 27 Second Iteration of Design .......................................................................................... 28 Full Sensor ............................................................................................................ 29 Upper and Lower Polymer Layer ......................................................................... 30 Upper and Lower Electrodes ................................................................................ 31 Insulation Layer .................................................................................................... 32 Connecting Pads ................................................................................................... 33 Drawbacks of This Design .................................................................................... 34 Third Iteration of Design: Micro-Fabrication Steps ................................................... 35 Photolithography ................................................................................................... 36 Cleaning Wafer ..................................................................................................... 36 Barrier Layer Deposition ...................................................................................... 37 Photoresists Layer ................................................................................................. 37 Soft Baking ........................................................................................................... 38 Alignment of Mask ............................................................................................... 38 Photoresist Development ...................................................................................... 38 Etching .................................................................................................................. 39 Recommended Fabrication Steps .......................................................................... 40 Final Design Parameters ....................................................................................... 43 Total Sensor .......................................................................................................... 43 Upper and Lower Polymer Layer ......................................................................... 44 Upper and Lower Electrodes ................................................................................ 45 Bump Layer Initial and Final design .................................................................... 46 Mask Design ............................................................................................................... 50 Metallization Masks .............................................................................................. 53 Bump Extrusion Mask .......................................................................................... 56 v TABLE OF CONTENTS - CONTINUED 3. MATERIAL SELECTION ......................................................................................... 59 Polymers ..................................................................................................................... 59 PDMS .................................................................................................................... 60 Polyimide .............................................................................................................. 66 Electrode Material ....................................................................................................... 77 4. STRUCTURAL ANALYSIS ...................................................................................... 79 Finite Element Analysis .............................................................................................. 79 Properties Used for PDMS ................................................................................... 80 Properties Used for Polyimide .............................................................................. 80 Properties Used for Gold ...................................................................................... 80 Properties Used for Copper ................................................................................... 81 Properties of Tibia (bone material) ....................................................................... 81 Design Modeler Setup .......................................................................................... 81 Static Structural Analysis Settings .............................................................................. 83 Defining Contact and Target Surfaces ........................................................................ 84 Contact Region 1 and 2 ......................................................................................... 85 Contact Region 3 and 4 ......................................................................................... 86 Contact Region 5 and 6 ......................................................................................... 87 Generation of Mesh ..................................................................................................... 90 Boundary Conditions and Loading Condition ............................................................ 92 5. RESULTS AND DISCUSSIONS ............................................................................... 94 Thickness Effect ........................................................................................................ 112 6. VERIFICATION OF FE MODELING .................................................................... 118 7. THERMAL STRESS ................................................................................................ 121 8. READOUT CIRCUIT SCHEMATIC .....................................................................
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