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Proximity Correction and Resolution Enhancement of Plasmonic Lens Lithography Far Beyond the Near Cite This: RSC Adv.,2017,7,12366 field Diffraction Limit†

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Proximity Correction and Resolution Enhancement of Plasmonic Lens Lithography Far Beyond the Near Cite This: RSC Adv.,2017,7,12366 field Diffraction Limit† RSC Advances View Article Online PAPER View Journal | View Issue Proximity correction and resolution enhancement of plasmonic lens lithography far beyond the near Cite this: RSC Adv.,2017,7,12366 field diffraction limit† Yunfei Luo,‡a Ling Liu,‡ab Wei Zhang,a Weijie Kong,a Chengwei Zhao,a Ping Gao,a Zeyu Zhao,a Mingbo Pu,a Changtao Wanga and Xiangang Luo*a Near-field optical imaging methods have been suffering from the issue of a near field diffraction limit, i.e. imaging resolution and fidelity depend strongly on the distance away from objects, which occurs due to the great decay effect of evanescent waves. Recently, plasmonic cavity lens with off-axis light illumination was proposed as a method for going beyond the near field diffraction limit for imaging dense nanoline patterns. In this paper, this investigation was further extended to more general cases for isolated and discrete line patterns, by enhancing the resolution and correcting the proximity effect with assistant peripheral groove structures. Experiment results demonstrate that the width of single, double Received 4th January 2017 Creative Commons Attribution-NonCommercial 3.0 Unported Licence. and multiple line patterns is well controlled and the uniformity is significantly improved in lithography Accepted 15th February 2017 with a 365 nm light wavelength and 120 nm working distance, being approximately ten times the air DOI: 10.1039/c7ra00116a distance defined by the near field diffraction limit. The methods are believed to find applications in rsc.li/rsc-advances nanolithography, high density optical storage, scanning probe microscopy and so forth. 1. Introduction 60 nm.16–18 More recently, various plasmonic lens lithography were proposed for the improvement of resolution, aspect prole – In conventional far-eld optics, the imaging resolution is and imaging contrast, by using smooth superlens,19 21 metal 22–24 25,26 This article is licensed under a diffraction limited, as usually dened in the form of the Ray- reector cladding, plasmonic cavity lens etc., providing leigh–Abbe limit.1,2 In near eld optics, the detection and an efficient way for the fabrication of various nano- – employment of evanescent waves help to realize sub-diffraction structures.27 29 Plasmonic cavity lens even has achieved resolu- Open Access Article. Published on 21 2 2017. Downloaded 2021-10-01 6:25:10. imaging, as shown by scanning near eld optical microscopes tion up to a half-pitch of 22 nm in experiment.30 (SNOMs),3,4 and near eld optical lithography.5–9 The attainable resolution in conventional near eld lithog- Surface plasmon polaritons (SPPs) are coupled waves of raphy and plasmonic lens lithography is mainly determined by electromagnetic elds and free electrons at the interface the evanescent waves employed in imaging process, which between dielectric and conducting media.10,11 SPPs exhibit decay abruptly with air distance away from mask patterns. So unique sub-diffraction propagation features with much shorter even small air separation between patterns and plasmonic lens propagation wavelengths than those in dielectric media, which would reduce resolution signicantly, which could be evaluated was successfully applied for optical lithography beyond the by analyzing evanescent waves' exponentially decaying feature diffraction limit.12–14 In 2000, Pendry pioneered the study of in air. This point could be referred to as the near-eld diffrac- a superlens composed of a at slab with negative permittivity, tion limit.31,32 Resultantly, contacting mode or physically where excited surface plasmon polaritons help to amplify an stacked mask pattern, superlens and even resist layer, is usually object's evanescent waves, which would produce the super applied in experimental demonstrations of plasmonic lens – resolution images.15 Plasmonic imaging lithography based on lithography.6,18,22,33 40 This is clearly unexpected in practical superlens was demonstrated with a silver lm positioned applications, considering that some abrasions and contamina- between mask and resist, with a half-pitch resolution below tion of mask patterns may occur in the lithography process and ne alignment would not be readily performed as masks are contacted with photoresist layers. aState Key Laboratory of Optical Technologies on Nano-Fabrication and In our recent investigation, plasmonic cavity lens imaging Micro-Engineering, Institute of Optics and Electronics, Chinese Academy of Sciences, with off-axis light illumination (OAI) was proposed an assis- P.O. Box 350, Chengdu 610209, China. E-mail: [email protected] tance to go beyond the near eld diffraction limit, by separating bUniversity of Chinese Academy of Sciences, Beijing 100049, China mask patterns and lens with a large air spacer helping to † Electronic supplementary information (ESI) available. See DOI: 10.1039/c7ra00116a facilitate lithography operation and protection of nano mask 41 ‡ These authors contributed equally to this work. patterns. In this special case the air thickness is much larger 12366 | RSC Adv.,2017,7, 12366–12373 This journal is © The Royal Society of Chemistry 2017 View Article Online Paper RSC Advances than that dened by near eld diffraction limit. However this investigation is only useful for patterns with periodical dense nano lines and hence suffers from greatly limited types of patterns. As for discrete and isolated nano lines, which are commonly used in logic integrated circuits,42,43 quantum chips44,45 and optical metamaterials46,47 etc., great proximity effect of image width and difference between edge and central lines hampers the resolution and delity of images.48 In this paper, we investigates further the plasmonic cavity lens lithography far beyond near eld diffraction limit, in more general Fig. 2 Simulated electric filed intensity of single silt for 60 nm feature cases with single and multiple adjacent nano lines. Resolution size at the centre of photoresist (Pr) layer of noncontact plasmonic enhancement and proximity correction are performed by utilizing lithography without or with grooves-assisted under NI with 120 nm air working distance. (a) Without assistance grooves at the mask pattern. peripheral assistant grooves and off-axis light illumination. Both (b) With assistance grooves at the mask pattern. (c) Normalized electric numerical simulations and experimental results show that nano field profiles of (a, b) at the central of Pr layer. discrete lines could be well imaged with plasmonic lens lithog- raphy beyond near eld diffraction limit. As shown in one À example, nano-lines patterns with a feature size of 60 nm are thermal evaporation at a base pressure of 5.0 Â 10 4 Pa with À imaged under 365 nm illumination light with 120 nm air space deposition rate of 5 nm s 1. The AFM measured surface between the mask and plasmonic cavity lens, approximately 10 roughness (root-mean-square) was about 0.57 nm. About 30 nm times longer than that in conventional near- eld photolithog- thick photoresist of the diluted AR-P3170 (diluted by ALLRE- raphy. It is believed that our method is potentially promising for SIST GMBH, Strausberg, 30 nm@4000 rpm) was spun on the Ag applications such as nano fabrications, optical storage etc. layer to record the near-eld images. Aer 5 min of the prebake Creative Commons Attribution-NonCommercial 3.0 Unported Licence. of photo resist at 100 C on hotplate, the surface roughness of 2. Experimental section photo resist was measured to be about 0.3 nm. Then, a 20 nm thick Ag lm is evaporated on the photo resist (base pressure 2.1 Numerical simulations À À 5.0 Â 10 4 Pa, deposition rate 1 nm s 1) and the measured The electric eld intensity distributions shown in Fig. 1–3 were roughness of the top surface is 0.43 nm (Fig. S2 in the ESI†). simulated using a commercial Comsol soware. Rigorous The fabrication of the Cr mask started from the deposition of coupled wave analysis (RCWA) was applied to calculate the Cr lm by Magnetron Sputtering (RF power 400 W, deposition optical transfer function (OTF) as shown in Fig. 4 and the À rate 0.5 nm s 1 and temperature 300 C) onto a sapphire transmission amplitude distributions was shown in Fig. 5. The substrate. The thickness of the deposited Cr lm was equal to This article is licensed under a RCWA code was written based on the eqn given in ref. 49. The the air distance. Then, photoresist of AZ 3100 (AZ Electronic electric eld intensity distributions shown in Fig. 6 and 7 were Materials, 1 mm/4000 rpm) was spin-coated on the top of Cr lm simulated using a commercial CST soware. and a 10 mm wide window in the photoresist was realized by UV Open Access Article. Published on 21 2 2017. Downloaded 2021-10-01 6:25:10. photolithography. The post-exposure window was developed by 2.2 Fabrication procedures for the plasmonic cavity lens and AZ 300MIF (AZ Electronic Materials) and was transferred into Cr mask For the Ag–PR–Ag plasmonic cavity structure, the 50 nm thick Ag lm was rstly deposited on a fused silica substrate by the Fig. 1 Simulated electric filed intensity of single silt for 60 nm feature size under NI with 80 nm air working distance. (a) Conventional near- field imaging under NI. (b) Superlens imaging under NI. (c) Plasmonic Fig. 3 FWHM of a single line without or with grooves at the exit side of cavity lens imaging under NI, in the form of 20 nm thick Ag film, 30 nm mask of near field optics, superlens lithography and plasmonic cavity thick Pr film and 50 nm thick Ag cladding. (d) Normalized electric field lens imaging structures as a function of working distance under normal profiles of (a–c) at the central position of Pr layer. incidence (NI, kx,inc ¼ 0). This journal is © The Royal Society of Chemistry 2017 RSC Adv.,2017,7, 12366–12373 | 12367 View Article Online RSC Advances Paper Fig.
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