QUARTERLY TECHNOLOGY MONITOR

Smartphone Design Win Quarterly Monitor Q2 2021 A first ever technology monitor on the latest components, packaging and silicon chip choices of the smartphone makers. This smartphone monitor utilizes data from Q2 2021 shows leading in design representative phones (65+ phones per year wins (16% of total design wins) and package torn down in the System Plus Consulting Phone footprint consumption (20%). Snapdragon Teardown Track Module) and follows the OEM processors and RF components (transceivers, market share, which means that the selected RFFEM) explain this. phones are a good representation of the Regarding die area consumption, leads market. Also provided is the detailed design (46% of total die area) thanks to memories and wins and related supply chain for the eight imagesensors. phones being analyzed, along with supply chain BGA and LGA packages are the main packaging alternativesfor the maindevices. platform, with 34% of package footprint For each device and module, you get access to consumption. Title: Smartphone the technologychoices of the manufacturers. Design Win Quarterly U.S.-based companies account for 42% of IC Monitor – Q2 2021 This monitor offers a clear view of the market- design wins and 33% of total die area leading semiconductor companies and a direct (Qualcomm, Apple, Cirrus Logic and Qorvo have Pages: 150 comparisonbetweenOEMs. This includes: the majority). Even though Korea represents Date: June 2021 oDesign wins for the top ' OEM only 7% of the IC design wins number, it Format: (per Mfr., nationality,type of device…) represents 47% in terms of the total die area. o PDF with graphs and oPackaging evolution in terms of type, Memory player Samsungdrives this result. analyses footprint,pitch… 300mm (12-inch) wafer represents 71% of total o Web-based dynamic oDie area evolution per function, technology die area used in Q2 2021, with leading-edge dashboard node, wafer size… technology nodes (14nm down to 5nm) o Direct access to the oFocus per category (processor, camera, Analyst representing 27% of the total die area. memory,sensor…) According to Q2 2021 smartphone shipments, Reference: SPM21002 During a full year you will receive an updated 300mm wafersaccount for 5.4M units shipped. Smartphones analyzed: TechnologyMonitor on a quarterlybasis. o ZTE Axon 20 DIE AREA EVOLUTION o BLU G90 100% o Note20 90% Ultra 80% o 70% KOREA UK + SWEDEN AUSTRIA o Apple iPhone 12 mini 60% UNIDENTIFIED GERMANY o Pro 50% TAIWAN o Mi 10 Ultra SWITZERLAND 40% JAPAN NETHERLANDS KOREA o LG Wing 5G 30% JAPAN USA USA 20% CHINA 10% CHINA 0% Mate 10 lite P20 Pro Mate 20 P30 Pro Mate 20 X (5G) Mate 30 Pro 5G Mate Xs P40 Pro Mate 40 Pro

COMPOUND SEMICONDUCTORS - COMPUTING & – DISPLAY – IMAGING – LIGHTING – MEMORY – PACKAGING - PHOTONICS - POWER ELECTRONICS - RF - MANUFACTURING - SENSING SMARTPHONE DESIGN WIN QUARTERLY MONITOR – Q2 2021

COMPLETE MONITOR WITH o A web-based dynamic dashboard o A PDF slide deck with graphs and o Direct access to the System Plus database with historical data from comments/analyses to explain the analyst past years and the last quarter, main technology evolutions in the including at least six new smartphone market smartphones TABLE OF CONTENTS

Overview/Methodology eBoM Cost Focus on Application Processors Executive Summary • eBoM Cost per Category • Focus on Application Processors Design Wins ✓ Smartphone details, OEM • OEM Evolution • Design Wins per Vendors evolution (Apple, Samsung, Focus on Memory ✓ Smartphone details, OEM Huawei) • Focus on NAND evolution (Apple, Samsung, Die, Wafer & Technology • Focus on DRAM Huawei) • Die Area per Vendor • OEM Evolution • Design Wins per Nationality ✓ Smartphone details, OEM Focus on Sensors ✓ Smartphone details, OEM evolution (Apple, Samsung, • Focus on Sensors: CMOS Image evolution (Apple, Samsung, Huawei) Sensors Huawei) • Die Area per Nationality Packaging ✓ Smartphone details, OEM • Focus on Sensors: Others • Package Footprint per Vendors evolution (Apple, Samsung, • OEM Evolution ✓ Smartphone details, OEM Huawei) Focus on RF evolution (Apple, Samsung, • Die Area per Category • Focus on RF Huawei) ✓ Smartphone details, OEM • OEM Evolution • Package Footprint per Category evolution (Apple, Samsung, Focus on Passives • Package Footprint per Family Huawei) • Focus on Capacitors • Package Footprint : OEM • Wafer Size repartition • Focus on Resistors Evolution (Apple, Samsung, • Wafer Material Repartition • Focus on Inductors Huawei) • Technology Node Repartition AUTHORS

Romain Fraux is the CEO of System Plus Consulting. Supporting industrial companies in their development, Romain and his team are offering a complete range of services, costing tools and reports. Romain has been working for System Plus Consulting for more than 12 years and was previously the company’s CTO.

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Camera Modules Comparison Phone Track Module Processor Quarterly Market 2021 – Vol. 1 Teardown Track Monitor Technology, Process & Cost Report Unmached teardowns of phone Market & Technology Monitor Technology and cost comparison systems with bill-of-material, While finding new application, of visual spectrum cameras in block diagram and high- and sustaining the established the 2020 flagships: the Apple resolution photos. Access ones, CPUs, GPUs, and APUs iPhone 12 Pro Max, Samsung comprehensive and full parts list hold the keys to the next ten Galaxy S20 Ultra, and Huawei with easy-to-navigate links to all years of the processor market. P40 Pro. semiconductor components in March 2021 April 2021 each system. QUATERLY TECHNOLOGY MONITOR

SMARTPHONE REFERENCES USED

Q2 2021 : ZTE Axon 20 5G BLU G90 Samsung Galaxy Samsung Galaxy Note20 Ultra S21+

Apple iPhone 12 Huawei Mate LG Wing 5G mini US 40 Pro Ultra

The monitor takes into account 32 smartphones: Q3 2020 : Q4 2020 : Q1 2021 : o Huawei Mate Xs o Apple iPhone SE (2020) o APPLE iPhone 12 5G o LG Electronics V60 ThinQ 5G o Pro 5G o APPLE iPhone 12 Pro Max o Razr 2019 o + o 4a o Find X2 5G o OnePlus 8 5G o 7 SE 5G Youth o Ultra 5G o X50 5G o o o Samsung Galaxy M31 o o Vivo Nex 3s 5G o Sharp AQUOS R5G o SAMSUNG Galaxy Z Fold 2 o Xiaomi Mi 10 Pro 5G o ZTE Nubia Red Magic 5G o Pro

ABOUT SYSTEM PLUS CONSULTING WHAT IS A REVERSE COSTING®? System Plus Consulting is specialized Reverse Costing® is the process of disassembling a device (or a in the cost analysis of electronics system) in order to identify its technology and calculate its from semiconductor devices to manufacturing cost, using in-house models and tools. electronic systems. A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling price of a product is available. CONTACTS Our services: Headquarters America Sales Office Asia Sales Office • STRUCTURE & PROCESS 22, bd Benoni Goullin Steven LAFERRIERE Takashi ONOZAWA ANALYSES Nantes Biotech Western USA & Japan & Rest of Asia 44200 Nantes Canada +81 80 4371 4887 • TEARDOWN TRACKS France +1 310-600-8267 [email protected] • CUSTOM ANALYSES +33 2 40 18 09 16 [email protected] • COSTING SERVICES [email protected] Mavis WANG • COSTING TOOLS Chris YOUMAN Greater China • TRAININGS Europe Sales Office Eastern USA & Canada TW +886 979 336 809 Lizzie LEVENEZ +1 919-607-9839 CN +8613661566824 www.systemplus.fr Frankfurt am Main [email protected] [email protected] [email protected] Germany +49 151 23 54 41 82 Peter OK [email protected] Korea +82 10 4089 0233 [email protected] TERMS AND CONDITIONS OF SALES

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