View Annual Report
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Enel Green Power, Sharp and Stmicroelectronics Sign Agreement for the Largest Photovoltaic-Panel Manufacturing Plant in Italy
Enel Green Power, Sharp and STMicroelectronics Sign Agreement for the Largest Photovoltaic-Panel Manufacturing Plant in Italy January 4, 2010 3:04 AM ET Enel Green Power, Sharp and STMicroelectronics join forces to produce innovative thin-film photovoltaic panels. The plant, located in Catania, Italy, is expected to have initial production capacity of 160 MW per year and is targeted to grow to 480 MW over the next years. In addition, Enel Green Power and Sharp will jointly develop solar farms focusing on the Mediterranean area, with a total installed capacity at a level of 500 MW, by the end of 2016. Geneva, January 4, 2010 – Today, Enel Green Power, Sharp and STMicroelectronics signed an agreement for the manufacture of triple-junction thin-film photovoltaic panels in Italy. At the same time, Enel Green Power and Sharp signed a further agreement to jointly develop solar farms. Today's agreement regarding the photovoltaic panel factory follows the Memorandum of Understanding signed in May 2008 by Enel Green Power and Sharp. STMicroelectronics has joined this strategic partnership. This agreement marks the first time that three global technology and industrial powerhouses have joined together in an equal partnership to contribute their unique value-add to the solar industry. It brings together Enel Green Power, with its international market development and project management know-how; Sharp, and its exclusive triple-junction thin-film technology, which will be operational in the mother plant in Sakai, Japan as of spring 2010; and STMicroelectronics, with its manufacturing capacity, skills and resources in highly advanced, hi-tech sectors such as microelectronics. -
Intesa Sanpaolo Group Conflicts of Interest
Conflicts of interest 24/07/2020 Intesa Sanpaolo Group conflicts of interest Please read carefully the important disclosures at the end of this publication COMPANIES CONFLICTS OF INTEREST 2I RETE GAS SPA We provide the following information on Intesa Sanpaolo Group's conflicts of interest: - One or more of the companies of the Intesa Sanpaolo Banking Group have an equity stake of 5% or more in 2I RETE GAS SPA or in the Company that has a controlling interest in 2I RETE GAS SPA or are a major shareholder of 2I RETE GAS SPA - One or more of the companies of the Intesa Sanpaolo Banking Group have elected one or more members of the Board of Directors or the Board of Statutory Auditors or another controlling body of 2I RETE GAS SPA or of the parent company 2I RETE GAS SPA or the majority shareholder of 2I RETE GAS SPA - One or more of the companies of the Intesa Sanpaolo Banking Group have granted significant financing to 2I RETE GAS SPA and its parent and group companies A2A SPA We provide the following information on Intesa Sanpaolo Group's conflicts of interest: - One or more of the companies of the Intesa Sanpaolo Banking Group have granted significant financing to A2A SPA and its parent and group companies ABITARE IN SPA We provide the following information on Intesa Sanpaolo Group's conflicts of interest: - One or more of the companies of the Intesa Sanpaolo Banking Group are one of the main financial lenders to ABITARE IN SPA and its parent and group companies - Intesa Sanpaolo acts as Corporate Broker relative to securities issued -
International Conference on Education 47Th Session
ED/MD/103 Final report International Conference on Education 47th session Geneva 8 – 11 September 2004 UNESCO International Bureau of Education (i) TABLE OF CONTENTS Page AGENDA ................................................................................................................................. (iii) PART I - PROCEEDINGS OF THE CONFERENCE A. Opening ceremony ................................................................................................. 1 B. Organization of work – Methodology .................................................................... 2 C. Celebration of International Literacy Day ............................................................. 3 D. Closing ceremony .................................................................................................. 4 E. Award of the Comenius Medal .............................................................................. 5 F. Side-meetings.......................................................................................................... 5 PART II - DOCUMENTS ISSUED BY THE CONFERENCE A. General report ......................................................................................................... 7 B. Message from the 47th session of ICE and proposed priorities for action ........................................................................... 11 ANNEXES I. Opening address by H.E. Mr Fabian Osuji, Minister of Education of Nigeria II. Opening address by Mr Koïchiro Matsuura, Director-General of UNESCO III. Opening address by H.E. -
TEA6422 TEA6422D TEA6422DT Stmicroelectronics Datasheet
TEA6422 BUS-CONTROLLED AUDIO MATRIX ■ 6 Stereo Inputs ■ 3 Stereo Ouputs ■ Gain Control 0 dB/Mute for each Output ■ Cascadable (2 different addresses) ■ Serial Bus Controlled ■ Very Low Noise ■ Very Low Distorsion SHRINK DIP24 ■ Fully ESD Protected (Shrink Plastic Package) ■ Wide Audio Dynamic Range ( 3 V ) RMS ORDER CODE: TEA6422 DESCRIPTION The TEA6422 switches 6 stereo audio inputs on 3 stereo outputs. All the switching possibilities are changed through the I2C BUS. SO28 (Plastic Monopackage) ORDER CODE: TEA6422D Figure 1. PIN CONNECTIONS SO28 SDIP24 GND 1 28 SDA GND 1 24 SDA CAPACITANCE 2 27 SCL 2 23 CAPACITANCE SCL VS 3 26 ADDR VS 3 22 ADDR L1 4 25 R1 L1 4 21 R1 L2 5 24 R2 L2 5 20 R2 L3 6 23 R3 L3 6 19 R3 NC 7 22 NC L4 7 18 R4 NC 8 21 NC L5 8 17 R5 L4 9 20 R4 L6 9 16 R6 L5 10 19 R5 LOUT1 10 15 ROUT3 L6 11 18 R6 ROUT1 11 14 LOUT3 LOUT1 12 17 ROUT3 LOUT2 12 13 ROUT2 ROUT1 13 16 LOUT3 LOUT2 14 15 ROUT2 September 2003 1/10 1 TEA6422 BLOCK DIAGRAM RIGHT INPUTS GAIN = 0 dB RIGHT OUTPUTS VS SDA C SUPPLY BUS DECODER SCL GND ADDR LEFT OUTPUTS GAIN = 0 dB LEFT INPUTS ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VCC Supply Voltage 12 V o Toper Operating Temperature 0, + 70 C o Tstg Storage Temperature - 20, + 150 C THERMAL DATA Symbol Parameter Value Unit SDIP24 75 oC/W R (j-a) Junction - ambient Thermal Resistance th SO28 75 oC/W 2/10 1 TEA6422 ELECTRICAL CHARACTERISTICS o Ω Ω TA = 25 C, VS = 9 V, RL = 10 k , RG = 600 , f = 1 kHz (unless otherwise specified) Symbol Parameter Test Conditions Min. -
4133-6266-6020.6 EMTN PROGRAMME PROSPECTUS This
EMTN PROGRAMME PROSPECTUS This document constitutes two base prospectuses: (i) the base prospectus of TIM S.p.A. and (ii) the base prospectus of Telecom Italia Finance S.A. (together, the EMTN Programme Prospectus). TIM S.p.A. (incorporated with limited liability under the laws of the Republic of Italy) TELECOM ITALIA FINANCE S.A. (incorporated with limited liability under the laws of the Grand-Duchy of Luxembourg) €20,000,000,000 Euro Medium Term Note Programme unconditionally and irrevocably guaranteed in respect of Notes issued by Telecom Italia Finance S.A. by TIM S.p.A. (incorporated with limited liability under the laws of the Republic of Italy) Under this €20,000,000,000 Euro Medium Term Note Programme (the Programme), TIM S.p.A. (TIM) and Telecom Italia Finance S.A. (TI Finance and, together with TIM in its capacity as an issuer, the Issuers and each an Issuer) may from time to time issue notes (the Notes) denominated in any currency agreed with the relevant Dealer (as defined below). Payment of all amounts owing in respect of the Notes issued by TI Finance will be unconditionally and irrevocably guaranteed by TIM (in such capacity, the Guarantor). The maximum aggregate nominal amount of all Notes from time to time outstanding under the Programme will not exceed €20,000,000,000 (or its equivalent in other currencies calculated as described in the Programme Agreement), subject to increase as described herein. The Notes may be issued on a continuing basis to one or more of the Dealers specified under “Overview of the Programme” and any additional Dealer appointed under the Programme from time to time by the Issuers (each a Dealer and, together, the Dealers), which appointment may be for a specific issue or on an ongoing basis. -
World's Smallest Micro-Mirror Scanning Technology From
Press release Communiqué de presse Comunicato stampa 新闻稿 / 新聞稿 プレスリリース 보도자료 T4264D World’s Smallest Micro-Mirror Scanning Technology from STMicroelectronics Chosen for Intel® RealSense™ High-Resolution LiDAR Depth Camera L515 Power-efficient, hi-res LiDAR camera capturing millions of depth points per second suits a wide range of Industrial and Computing use cases Geneva, March 8, 2021 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has developed a tiny MEMS mirror with Intel enabling spatial scanning of an environment. Intel developed a LiDAR system based on this micro-mirror, providing high-resolution scanning for industrial applications such as robotic arms for bin picking, volumetric measurements, logistics, and 3D scanning. Built into the Intel RealSense LiDAR1 Camera L515, the small dimensions of the ST micro-mirror contribute to the LiDAR camera’s hockey-puck size (61mm diameter x 26mm height). The micro-mirror enables continuous laser scanning across the entire field of view. In combination with a custom photodiode sensor, the RealSense LiDAR Camera L515 renders a 3D depth map of the entire scene. “With 30 frames per second and a field-of-view of 70° by 55°, ST’s 2nd-generation micro-mirror continues to set the bar for 3D scanning and detection applications,” said Benedetto Vigna, President Analog, MEMS and Sensors Group, STMicroelectronics. “Continuing the long-term supply relationship for micro-mirrors with Intel demonstrates our never-ending efforts to leverage our long-lasting leadership in MEMS to meet the demanding technical and supply needs of our customers.” The L515 leverages the scanning capabilities of ST’s MEMS to deliver high-resolution depth with no interpolated pixels, the ability to control the field of view, and provides close to zero pixel blur driven by the low 50nS exposure time. -
John Hancock Disciplined Value International Fund A: JDIBX C: JDICX I: JDVIX R2: JDISX R4: JDITX R6: JDIUX
All data is as of June 30, 2021 Q2 - 2021 International equity fund Quarterly commentary John Hancock Disciplined Value International Fund A: JDIBX C: JDICX I: JDVIX R2: JDISX R4: JDITX R6: JDIUX Objective Use for Morningstar category Long-term growth of capital Core international holding Foreign Large Value Quarterly commentary Highlights The fund beneited from strong stock selection in the communication International equities rallied in the second quarter, helping the fund’s services sector, where SK Telecom Co., Ltd. was a top performer ater its benchmark—the MSCI EAFE Index—achieve a series of all-time highs management announced a plan to split the company in two to recognize before it peaked in mid-June. value. The fund also outperformed in energy, due largely to a rally in shares The fund delivered a positive return, but it trailed the index. of Cenovus Energy, Inc., IMI PLC, and Hitachi Corp. All three companies Given the underperformance of the value style relative to growth, the were top contributors for the quarter, as was a zero weighting in the fund’s value-driven strategy was a headwind to results compared with the Japanese company Sotbank Group Corp. broad-based benchmark. Market review and outlook Portfolio changes International stocks performed well in the past three months as economic We increased the fund’s weightings in industrials and healthcare while data continued to improve as the gradual rollout of vaccines fostered a reducing its allocation to information technology. The changes were all resumption of normal business conditions. Broad measures of consumer stock speciic, and the structure of the portfolio didn’t change materially. -
Xtera® Selected As the Supplier for the ARBR Subsea Cable System
1/23/2018 Xtera® Selected as the Supplier for the ARBR Subsea Cable System Xtera® Selected as the Supplier for the ARBR Subsea Cable System January 23, 2018 09:00 ET | Source: Xtera HONOLULU and ALLEN, Texas, Jan. 23, 2018 (GLOBE NEWSWIRE) Xtera®, a provider of innovative subsea fibre optic solutions, today announces it has been selected as the supplier of the ARBR submarine fibre optic cable system developed jointly by Seaborn Networks and the Werthein Group. The 2,700 km open system, 4fibre pair, 48Tbps, direct PoPtoPoP subsea cable will connect Argentina and Brazil. The ARBR subsea cable system will allow for direct onward connectivity to New York, via the Seabras1 system, thereby providing a lower latency route between the commercial and financial centers of Buenos Aires, São Paulo, Rio de Janeiro and New York. The ARBR cable is fully funded and on an accelerated implementation schedule to bring valuable new capacity on an underserved route, providing important new connectivity to this region. “This award further consolidates Xtera’s position as a strong player in the regional submarine market segment and is a significant endorsement of Xtera’s differentiated product offering,” says Stuart Barnes, Chairman and Chief Strategy Officer, Xtera. “Our four pillars of product and service offerings encompass subsea systems technologies, wet and dry upgrades, IP licensing, and OEM / specialist units to selected markets. Xtera is further defined by its flexible approach to system partnering and contracting structures that ensure the best value for investment and a solution aligned to each customer’s need.” The ARBR subsea cable system will utilize Xtera’s fieldproven submarine repeaters with hybrid EDFARaman design, enabling a robust optimized transmission system. -
Euro Stoxx® Residual Momentum Premium Index
EURO STOXX® RESIDUAL MOMENTUM PREMIUM INDEX Components1 Company Supersector Country Weight (%) EUROFINS SCIENTIFIC null null 3.37 SARTORIUS STEDIM BIOTECH null null 3.20 EDP RENOVAVEIS null null 2.97 HELLOFRESH AG null null 2.21 SIEMENS GAMESA null null 2.21 SARTORIUS PREF. null null 2.16 KESKO null null 2.07 DEUTSCHE POST null null 1.89 CORBION null null 1.81 BRENNTAG null null 1.80 SIGNIFY null null 1.75 ZALANDO null null 1.68 SEB null null 1.56 LVMH MOET HENNESSY null null 1.52 BOLLORE null null 1.48 INTERPUMP GRP null null 1.45 SIEMENS null null 1.44 CAP GEMINI null null 1.41 RATIONAL null null 1.41 BMW null null 1.40 BANCO BPM null null 1.37 FUCHS PETROLUB PREF null null 1.30 SOITEC null null 1.27 SAINT GOBAIN null null 1.25 PUBLICIS GRP null null 1.23 MICHELIN null null 1.22 UNIBAIL-RODAMCO-WESTFIELD null null 1.20 WARTSILA null null 1.15 CAIXABANK null null 1.13 STELLANTIS null null 1.12 CNH Industrial NV null null 1.12 SOLVAY null null 1.11 BCO BILBAO VIZCAYA ARGENTARIA null null 1.09 PROSIEBENSAT.1 MEDIA null null 1.08 NOKIAN RENKAAT null null 1.08 COVESTRO null null 1.06 DEUTSCHE BANK null null 1.02 INFINEON TECHNOLOGIES null null 1.02 DAIMLER null null 1.02 STMICROELECTRONICS null null 1.02 CONTINENTAL null null 1.01 REXEL null null 0.99 FLUTTER ENTERTAINMENT null null 0.99 AALBERTS null null 0.99 COMMERZBANK null null 0.95 RYANAIR null null 0.94 HEIDELBERGCEMENT null null 0.93 BASF null null 0.93 ASML HLDG null null 0.93 SPIE null null 0.90 ING GRP null null 0.90 ELIS null null 0.89 HERMES INTERNATIONAL null null 0.88 ASM -
Semiconductors & Semiconductor Equipment
Semiconductors & Semiconductor Equipment Driving forces Highlighted criteria & The application of advanced semiconductors has progressed dimension weights beyond traditional computing products to include the Internet Environmental Dimension..34% of Things, Artificial Intelligence, automotive applications, 5G, – Climate Strategy and high-performance computing. Cybersecurity is a strategic – Environmental Policy & priority that is increasing in importance, since security should Management Systems be included by design during chip R&D. The rate at which the – Operational Eco-Efficiency number of transistors on a chip doubles (i.e., Moore’s Law) is – Product Stewardship slowing as integrated circuits become smaller. The semiconductor industry must, therefore, investigate new architectures, materials, Social Dimension ............. 23% and packaging to go beyond current scaling and performance – Human Capital Development constraints, while also addressing the demand for low energy- – Talent Attraction & Retention consumption products. To sustain a rapid pace of innovation, the industry will need to increase R&D investment that, in turn, Governance & Economic will necessitate attracting and retaining a skilled workforce and Dimension ........................ 43% developing talent. The industry must continue to improve its – Innovation Management ultra-pure water usage, energy and waste management, and – Product Quality and Recall pollution prevention. It must also increase promotion of projects Management to substitute hazardous materials and -
Annual Report and Financial Statements Annual Report and Financial Statements 2016 BOARD of DIRECTORS
2016 Annual Report and Financial Statements Annual Report and Financial Statements 2016 BOARD OF DIRECTORS Chairman Marcos Marcelo Mindlin Vice-Chairman Gustavo Mariani Director Ricardo Alejandro Torres Damián Miguel Mindlin Diego Martín Salaverri Clarisa Lifsic Santiago Alberdi Carlos Tovagliari Javier Campos Malbrán Julio Suaya de María Alternate Director José María Tenaillon Juan Francisco Gómez Mariano González Álzaga Mariano Batistella Pablo Díaz Index Alejandro Mindlin Brian Henderson Gabriel Cohen Annual Report 4 Carlos Pérez Bello Glossary of Terms 8 Gerardo Carlos Paz Consolidated Financial Statements 166 SUPERVISORY COMMITTEE Glossary of Terms 168 President José Daniel Abelovich Consolidated Statement of Financial Position 172 Statutory Auditor Jorge Roberto Pardo Consolidated Statement of Comprehensive Income (Loss) 174 Germán Wetzler Malbrán Consolidated Statement of Changes In Equity 176 Alternate Statutory Auditor Marcelo Héctor Fuxman Consolidated Statement of Cash Flows 180 Silvia Alejandra Rodríguez Tomás Arnaude Notes to the Consolidated Financial Statements 183 AUDIT COMMITTEE Report of Independent Auditors 344 President Carlos Tovagliari Contact 348 Regular Member Clarisa Lifsic Santiago Alberdi Annual Report Contents Glossary of Terms 8 1. 2016 Results and Future Outlook 12 2. Corporate Governance 19 3. Our Shareholders / Stock Performance 25 4. The Macroeconomic Context 28 5. The Argentine Electricity Market 30 6. The Argentine Oil and Gas Market 53 7. Relevant Events for the Fiscal Year 67 8. Description of Our Assets 80 9. Human Resources 110 10. Corporate Responsibility 113 11. Information Technology 118 12. Quality, Safety, Environment & Labor Health 119 13. Results for the Fiscal Year 122 2016 Annual Report 14. Dividend Policy 148 To the shareholders of Pampa Energía S.A. -
Audit Report, Consolidated Annual Financial Statements, and Consolidated Management Report All for the Year Ended December 31, 2010
AUDIT REPORT, CONSOLIDATED ANNUAL FINANCIAL STATEMENTS, AND CONSOLIDATED MANAGEMENT REPORT ALL FOR THE YEAR ENDED DECEMBER 31, 2010 TELEFÓNICA, S.A. AND SUBSIDIARIES COMPOSING THE TELEFÓNICA GROUP CONSOLIDATED FINANCIAL STATEMENTS (CONSOLIDATED ANNUAL ACCOUNTS) AND CONSOLIDATED MANAGEMENT REPORT FOR THE YEAR ENDED DECEMBER 31, 2010 TELEFÓNICA GROUP CONSOLIDATED STATEMENT OF FINANCIAL POSITION AT DECEMBER 31 (MILLIONS OF EUROS) ASSETS NOTE 2010 2009 A) NON-CURRENT ASSETS 108,721 84,311 Intangible assets (Note 6) 25,026 15,846 Goodwill (Note 7) 29,582 19,566 Property, plant and equipment (Note 8) 35,797 31,999 Investment properties 5 5 Investments in associates (Note 9) 5,212 4,936 Non-current financial assets (Note 13) 7,406 5,988 Deferred tax assets (Note 17) 5,693 5,971 B) CURRENT ASSETS 21,054 23,830 Inventories 1,028 934 Trade and other receivables (Note 11) 12,426 10,622 Current financial assets (Note 13) 1,574 1,906 Tax receivables (Note 17) 1,331 1,246 Cash and cash equivalents (Note 13) 4,220 9,113 Non-current assets held for sale 475 9 TOTAL ASSETS (A + B) 129,775 108,141 EQUITY AND LIABILITIES NOTE 2010 2009 A) EQUITY 31,684 24,274 Equity attributable to equity holders of the parent 24,452 21,734 Non-controlling interests (Note 12) 7,232 2,540 B) NON-CURRENT LIABILITIES 64,599 56,931 Non-current interest-bearing debt (Note 13) 51,356 47,607 Non-current trade and other payables (Note 14) 2,304 1,249 Deferred tax liabilities (Note 17) 6,074 3,082 Non-current provisions (Note 15) 4,865 4,993 C) CURRENT LIABILITIES 33,492 26,936 Current interest-bearing debt (Note 13) 9,744 9,184 Current trade and other payables (Note 14) 19,251 14,023 Current tax payables (Note 17) 2,822 2,766 Provisions (Note 15) 1,675 963 TOTAL EQUITY AND LIABILITIES (A+B+C) 129,775 108,141 The accompanying Notes 1 to 25 and Appendices I to VI are an integral part of these consolidated statements of financial position.