2020

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Media Sponsors: MICROWAVE WEEK IMS2020 Table of Contents IS ALL ABOUT CONNECTIONS… IMS2020 Steering Committee ...... 2 Technical Program Review Committee ...... 3

From social media to downloading papers Sunday 5 in real time — we’ve got you covered! Workshops and Short Courses ...... 6 – 9 Three Minute Thesis Competition ...... 10 JOIN THE CONVERSATION: RFIC Plenary Session ...... 11 Make sure you’re engaging with IMS2020 RFIC Welcome Reception ...... 12 Industry Showcase and Student Paper Finalists . . . . . 12 –13 on our social channels: Monday 15 t Follow us on Twitter: http://twitter.com/MTT_IMS RFIC Technical Sessions ...... 16 – 19 I Follow us on Instagram: http://instagram.com/mtt_ims Workshops and Short Courses ...... 20 – 21 Technical Lectures ...... 22 fo Like us on Facebook: RF Bootcamp ...... 22 http://www.facebook.com/IEEE.MTTS.IMS RFIC Panel Session ...... 23 IMS Plenary Session ...... 24 i Engage with fellow attendees on LinkedIn: https://www.linkedin.com/groups/2375668/ Tuesday 25 (Group Name: IEEE MTT-S International Microwave IMS Technical Sessions ...... 26, 28, 34–35, 38–39 Symposium (IMS)) RFIC Technical Sessions ...... 27, 29 Student Design Competition ...... 30 i https://www.linkedin.com/company/ieee-mtt-s- Technical Lecture ...... 30 international-microwave-symposium-ims/ MicroApps Schedule ...... 31 IMS Student Paper Competition ...... 32–33 Yo Follow us on YouTube: Industry Workshops ...... 33 http://www.youtube.com/user/mttims Joint IMS-RFIC Panel ...... 36 5G Summit and Evening Panel Session ...... 37 Don’t forget to use the official IMS hashtag: #ims2020 Young Professionals Panel and Networking ...... 40 Amateur (HAM) Radio Social Event ...... 41 For the most up to date information visit: ims-ieee.org/mobile-apps-and-social-media Wednesday 43 IMS Technical Sessions ...... 44–45, 48–49, 52–53 IMS MICROWAVE WEEK: MicroApps Schedule ...... 46 There’s an app for that! IMS Interactive Forum ...... 47 Industry Workshops ...... 50 Download papers in real time! IMS Panel Session ...... 51 The IMS Microwave Week app is able to download the technical content MTT-S Awards ...... 54 now available in the Apple App that you registered for, e.g., IMS and/ IEEE Fellows Awards ...... 55 Store and Google Play store. Install or RFIC papers, workshop notes; as Women In Microwaves ...... 56 the app on your Android or iOS well as locate exhibitors and explore device to view the full schedule of everything that Boston has to offer! Thursday 57 Workshops; Short Courses; IMS, The app now includes an opt-in Social IMS Technical Sessions ...... 58–59, 62–63, 66–67 RFIC, and ARFTG Technical Sessions; Networking Feature that let's you MicroApps Schedule ...... 60 Panel Sessions; Social Events; search for fellow attendees who Industry Workshops ...... 61 and Exhibition Information. On-site opted-in to be contacted for net­ IMS Panel Session ...... 65 during Microwave Week, you will be working. Download the app today! Advanced Practice and Industry Paper Competitions . . . . . 68 To download the app, search for ‘IMS Microwave IMS Closing Session and Reception ...... 70 Week’ on the app store for your device or scan a Friday 71 QR code below. ARFTG ...... 72–73 Workshops ...... 74–76 Technnical Lecture ...... 76 For assistance, please email Exhibitor Index ...... 77–79 [email protected]. PLEASE NOTE: This program book is meant to be commemorative and reflects what would have taken place should IMS2020 and Microwave Week remained an in person event, 21–26 June 2020 in Los Angeles, CA. A new virtual event program book will be available in Mid July 2020. For the latest information please visit www.ims-ieee.org.

1 IMS2020

STEERING COMMITTEE

EXECUTIVE COMMITTEE General Chair Timothy Lee Local Arrangements/ General Vice-Chair Jon Hacker Operations Co-Chair Andy Morishita Plenary Session Jon Hacker General Vice-Chair Mike Delisio Plenary Session Mike Delisio TPC Chair Gabriel Rebeiz Conference Manager Elsie Vega TPC Co-Chair Jim Buckwalter Exhibition Manager Lee Wood Finance Chair Sherry Hess Registration/EPMS Manager Kevin Lepine Marketing and Publications Chair Kevin Miyashiro Marketing and Publications Manager Amanda Local Arrangements/ Scacchitti Operations Co-Chair Carolyn Kitamura

SENIOR ADVISORS AND AUXILIARY Student Paper Competition (Chair) Chip Moyer LOCAL ARRANGEMENTS OPERATIONS CONFERENCE CHAIRS/LIAISONS Student Paper Competition Adam Young COMMITTEE Senior Advisor JK McKinney Student Paper Competition Laya Mohammadi Chair Carolyn Kitamura Calantoc Senior Advistor Kevin Miyashiro Student Paper Competition Adrian Tang Co-Chair Andy Morishita IMS2019 General Chair Larry Kushner Student Design Competitions Micheal Thornburn Conference Management Elsie Vega IMS2021 General Chair Steve Kenney Student Demonstrations Hossein Hashemi Conference Management Dillian Waldon IMS2022 General Chair Ron Ginley Advanced Practice Competition Jim Sowers Entertainment Carolyn Kitamura Calantoc RFIC (Chair) Waleed Khalil Three Minute Thesis (Sunday Workshop) Entertainment Andy Morishita John Bandler RFIC (TPC Chair) Brian Floyd Entertainment (Welcome/Awards) Katie Allen Three Minute Thesis (Sunday Workshop) RFIC (TPC Co-Chair) Osama Shanaa Finance (Chair) Sherry Hess Erin Kiley ARFTG (Chair) Jon Martin Finance (Co-Chair) JK McKinney MicroApps Janet O’Neil Treasurer Robert Alongi MicroApps James Weiler TECHNICAL PROGRAM COMMITTEE Registration (Chair) Takao Inoue Industry Workshops Charlie Jackson TPC Co-Chair Gabriel Rebeiz Registration Manager Nannette Jordan Industry Workshops Kevin Geary TPC Co-Chair Jim Buckwalter Registration/EPMS Manager Kevin Lepine Historical Exhibit Terry Cisco TPC Senior Advisor Tim Hancock Visa Support Zaher Bardai Historical Exhibit Robert Dengler European Liason Juergen Hasch Student Volunteer Coordination (Chair) European Liason Frank Van Fliet MARKETING AND PUBLICATIONS Cristina Felicitas European Liason Pierre Blondy COMMITTEE (MP3) Student Volunteer Coordination (Co-Chair) Asian Liason (China) Ke Wu Reyn Mukai Chair Kevin Miyashiro Asian Liason (Korea) Jae-sung Rieh Guest Lounge Dillian Waldron Co-Chair Janet Nguyen Electronic Paper Management System LA Events Guide Book Coleson Costales MP3 Management Amanda Scacchitti Sandy Owens Web Liaison Peter Song Content Editor Wayne Shiroma EPMS Manager Kevin Lepine Young Professionals (Chair) Caitlyn Cooke IMS Ambassador Janet O’Neil Workshops (Chair) Ethan Wang Young Professionals (Co-Chair) Chad Patterson IMS Ambassador John Kuno Workshops Payam Heydari Women in Microwaves Helen Fung Microwave Magazine (Guest Co-Editor) Workshops Jeremy Dunworth Women in Microwaves Claudia Wong Zoya Popovic Workshops - RFIC Danilo Manstretta STEM Program (Co-Chair) Bronson Edralin Microwave Magazine, IMS Issue, Editor 5G Summit Walid Ali-Ahmad Madhu Gupta STEM Program (Co-Chair) Nancy Whann 5G Summit Tim LaRocca Mobile App Patrick Bell Project Connect (Co-Co-Chair) Spencer Pace Short Courses Hasan Sharifi Program Book Janet Nguyen Project Connect (Co-Chair) Andy Pham Short Courses Joe Bardin Social Media Steven Turner Project Connect (Chair) Darcy Bibb RF Boot Camp (Chair) Larry Dunleavy Website Editor Peter Song Project Connect Rhonda Franklin RF Boot Camp Joanne Mistler Co-Content Editor Coleson Costales Project Connect Rashaunda Henderson Panel Sessions (Chair) Fred Schindler Co-Content Editor Kaita Tsuchiya Project Connect Tom Weller Panel Sessions John Wood Amateur Ham Radio (Chair) Steven Vaughn Focus/Special Sessions Julio Navarro Amateur Ham Radio (Co-Chair) Dylon Mutz Focus/Special Sessions Gayle Collins Focus/Special Sessions Mona Jarahi Interactive Forum Zaher Bardai 2 IMS2020

TECHNICAL PROGRAM REVIEW COMMITTEE

Alessandro Galli Liang Zhou Frederick Raab Rudy Emrick Dominique Schreurs David Jackson Roberto Gomez-Garcia David Brown Markus Gardill Hung-Wei Wu Dan Jiao Xun Gong Ali Darwish Kamran Ghorbani Malgorzata Celuch Jan Machac Julien Lintignat Edward Niehenke Jose-Maria Munoz-Ferreras Guglielmo d Inzeo Francisco Mesa Xiaoguang Liu Philipp Pahl Jeffrey Nanzer Rashaunda Henderson Vladimir Okhmatovski Raafat Mansour Anh-Vu Pham Natalia Nikolova James Hwang TAPAN SARKAR Eric Naglich Ruediger Quay Chris Rodenbeck Pawel Kopyt Werner Thiel Sanghoon Shin Michael Roberg Jacquelyn Vitaz Arnaud Pothier John Bandler Hjalti Sigmarsson Mark van der Heijden Martin Vossiek Vadim Yakovlev Zhizhang David Chen Tao Yang Peter Asbeck Zaher Bardai Victor Lubecke Erin Kiley Pierre Blondy Steven Bowers Kenneth Barnett Kenneth Mays Slawomir Koziel John Ebel Debasis Dawn Tumay Kanar Fred Schindler Michel Nakhla Songbin Gong Nathalie Deltimple Kwang-Jin Koh Marco Pirola Amelie Hagelauer Sushil Kumar Byung-Wook Min James Rautio Brice Ivira Laya Mohammadi Julio Navarro Jose Rayas-Sanchez Amir Mortazawi Joe Qiu David Ricketts Costas Sarris Steven Stitzer Kaushik Sengupta Chintan Thakkar Vikas Shilimkar Guoan Wang Paul Sheehy Yuanxun Ethan Wang Sherif Ahmed Robert Weigel Joseph Staudinger Volker Ziegler Marcus DaSilva Dominique Baillargeat Richard Campbell Slim Boumaiza Leonard Hayden Rhonda Franklin Morgan Chen Erick Djoumessi Jon Martens Florian Herrault Leo de Vreede Christian Fager Nate Orloff Telesphor Kamgaing Paul Draxler Kenneth Kolodziej Tibault Reveyrand Valentina Palazzi Wolfgang Heinrich Timothy Lee Alfred Riddle John Papapolymerou Al Katz Arnaldo Oliveira Andrej Rumiantsev Kamal Samanta Gregor Lasser Gent Paparisto Peter Aaen Manos Tentzeris Rui Ma Kate Remley Rob Jones Maciej Wojnowski John Wood Ian GRESHAM Jianguo Ma Baljit Chandhoke Jonmei Yan Jasmin Grosinger Shahed Reza Julio Costa Farshid Aryanfar Changzhan Gu Paul Tasker Amin Ezzeddine SungWon Chung Etienne Perret Douglas Teeter Patrick Fay Jeremy Dunworth Lora Schulwitz Qijun Zhang Tony Ivanov Cynthia Hang Thomas Ussmueller Fabrizio Bonani Nicholas Kolias Ozgur Inac Andreas Weisshaar Subrata Halder Peter Magnee Arvind Keerti Kazuya Yamamoto Roni Khazaka Dimitris Pavlidis Donald LaFrance Seungyoung Ahn Jose Pedro Cheng P. Wen Sriram Muralidharan Nuno Carvalho Christopher Silva Joseph Bardin Munkyo Seo Alessandra Costanzo Almudena Suarez Roee Ben-Yishay Sorin Voinigescu Marco Dionigi Anding Zhu Luciano Boglione Irfan Ashiq Shigeo Kawasaki Maurizio Bozzi Terry Cisco William Deal Jenshan Lin Jun Choi George Duh Payam Heydari Paolo Mezzanotte Christian Damm Pekka Kangaslahti Vadim Issakov Kenjiro Nishikawa Tatsuo Itoh Fatih Kocer Sanggeun Jeon Smail Tedjini Weichiang Lee Chinchun Meng Dietmar Kissinger Olga Boric-Lubecke Tzyh-Ghuang Ma James Whelehan Imran Mehdi Chia-Chan Chang Jason Soric Emery Chen Joachim Oberhammer J-C Chiao Ke Wu Murat Demirkan Theodore Reck Souvik Dubey Bayaner Arigong Edward Gebara Adrian Tang Changzhi Li Thomas Lingel Deukhyoun Heo Huei Wang Xun Luo H. John Kuno Samet Zihir Fabian Lurz Stephen Maas Herbert Zirath Holger Maune Brad Nelson Firooz Aflatouni Bo Pan Hiroshi Okazaki Tibor Berceli Luca Perregrini Nils Pohl david Harame Hualiang Zhang Hermann Boss Mona Jarrahi Stephane Bila Christian Carlowitz Tadao Nagatsuma Wenquan Che Srinivasan Gopal Luca Pierantoni Christopher Galbraith Lance Kuo Jianping Yao Alexander Koelpin Isar Mostafanezhad Goutam Chattopadhyay Juseop Lee Koichi Murata Jonathan Comeau Haiwen Liu Ramon Beltran Aly Fathy Dimitra Psychogiou Vittorio Camarchia Jose Luis Gonzalez-Jimenez Magdalena Salazar Palma Charles Campbell Glenn Hopkins Simone Bastioli Robert Caverly Hasan Sharifi Miguel Laso Wenhua Chen Frank van Vliet Giuseppe Macchiarella Gayle Collins Roberto Vincenti Gatti Richard Snyder Marc Franco Christian Waldschmidt Weimin Sun Damon Holmes Adam Young Cristiano Tomassoni Youngwoo Kwon Mohamed Abouzahra Ming Yu Zoya Popovic Danny Elad

3 4 SUNDAY, 21 JUNE 2020 IMS2020

SUNDAY

Sunday

5 LACC IMS2020

SUNDAY WORKSHOPS 08:00 – 17:15 SUNDAY, 21 JUNE 2020

Workshop Title Workshop Abstract WSA SUNDAY Machine Learning and AI Tech- Recent development of machine learning and AI techniques have extended the capability of conventional RF and niques with Intelligent RF/ mm-wave systems beyond their classical limits to solve unconventional problems. This workshop will showcase intelligent mixed-signal, RF/mm-wave, and microwave photonics systems, which exploit machine learning and AI mm-Wave Systems for Wireless techniques in three focused application areas — advanced wireless communication, sensing, and computation. Communication, Sensing, and With a focused theme on wireless communication, the workshop will explore machine learning and AI techniques Computation exploited for RF signal conditioning, dynamic wireless spectrum collaboration, wireless power amplifier linearization, Sponsor: IMS; RFIC and massive MIMO mm-wave phased array beamforming. With a focus on sensing and imaging applications, the Organizer: A. Arbabian, Stanford workshop will present machine learning based radar signal processing techniques for autonomous navigation and University, V. Giannini, Uhnder, their implementations with integrated frequency modulated continuous wave (FMCW) radar systems. The unique V. Giannini, Uhnder advantages in using neural networks in super-resolution radar signal processing will also be discussed in comparison to classical approaches such as maximum likelihood estimation. With a focus on computation, the 08:00 – 17:15 workshop will culminate mixed-signal, RF/mm-wave, and microwave photonics circuit techniques to accelerate energy-efficient multi-dimensional signal processing for machine learning and AI algorithms. In addition, this workshop will discuss several applications of photonic deep learning hardware accelerators in wireless communica- tion such as RF fingerprinting. The emphasis of the workshop will be given to the design considerations and the interaction between underlying hardware system architectures and signal processing algorithms for advancing the capability of classical systems by leveraging machine learning and AI techniques. WSB CMOS mm-Wave Imaging Radars: Advances in mm-wave CMOS technology have resulted in fully integrated mm-wave radar sensors that offer a State-of-the-Art and a Peek into cost-effective and robust solution to automotive safety, provide accurate industrial sensing and enable gesture recognition. This workshop will feature technical experts from both academia and industry to present the state-of- the Future! the-art in mm-wave CMOS technology such as all-digital architectures, higher carrier frequencies, advanced signal Sponsor: IMS; RFIC processing and machine learning. These technologies promise to improve the achievable accuracy and push Organizer: B. Jalali Farahani, Acacia performance levels further. Speakers will also share their view of the next steps in this space and the possibilities Communications, R. Aroca, Acacia for the future. Communications 08:00 – 17:15

WSC Coherent Optical Communications The introduction of IoT (Internet of things) and cloud computing has accelerated the demand for higher bandwidth for Cloud Data Centers, Metro, and higher capacity networks. Coherent detection, where the phase information of the optical carrier provides higher signal-to-noise ratios, has gained an ever-increasing momentum. Today coherent communication dominates and Submarine Networks long-haul networks operating with data rates beyond 400 Gbps per wavelength. Thanks to advancements in digital Sponsor: IMS; RFIC signal processing that leverage ultra-low power implementations in deep submicron technologies (i.e. 7nm), the Organizer: F. Sebastiano, Technische cost and power of coherent transponders are becoming competitive for short reach networks as well (inter and Universiteit Delft, J. Bardin, UMass intra-data centers). Reducing the cost and enhancing the overall performance of such networks are only achievable Amherst through highly integrated solutions that encompass complex digital signal processing algorithms, state-of-the-art 08:00 – 17:15 transimpedance amplifiers and modulator drivers, and integrated silicon photonics. The co-design and co-optimiza- tion become the key factor in further power and performance scaling of coherent transponders. Different parts of optical communication systems have the been subject of prior workshops at RFIC. This workshop, however, brings together a multidisciplinary team of experts to inform the audience of various technology advancements in all key components that make up an integrated optical communication system. Co-design, co-optimization, and hybrid integration will be the theme and focus of this workshop and are addressed by several speakers from different backgrounds. The following talks are planned for this workshop: (1) Introduction to the Workshop: (Co-organizers) 15-minutes Brief overview of coherent and direct detection in optical communication systems. Market Forces and Network Evolution: (Martin Zirngibl Chief Technologist at II-VI-Confirmed) 40-minutes • Coherent scaling trends from long-haul to data centers • Direct or coherent detection for short reach 800G and beyond • How to use technologies that have been used for long-haul for short-reach applications • Co-packaging optics and processors • Q&A 5-minutes (2) Integrated Optics: (Chris Doerr, VP of Engineering Advanced Development, Acacia- Confirmed) 40-minutes • State-of-the-art SiPh transceivers for 100Gbaud and beyond: Performance, Hybrid Integration, and Packaging • Laser requirements and integration challenges • Q&A 5-minutes (3) mm-Wave ASICs: (Prof. Jim. Buckwalter- University of Santa Barbara-Confirmed) 40-minutes • Energy-efficient Coherent Optical Transceivers using Silicon Photonic and Si CMOS/SiGe BiCMOS RFICs • Q&A 5-minutes (4) ADCs and DACs for coherent transmission beyond 400G (Ian Dedic - Acacia-Confirmed) 40-minutes • architecture and challenges • performance scaling • opto-electronic co-design • Q&A 5-minutes (5) Digital Signal Processing: (Prof. Joseph M. Kahn- Stan- ford-Confirmed) 40-minutes • How coherent detection and digital signal processing (DSP) revolutionized long-haul systems • DSP-based compensation of dispersion, polarization effects, component limitations, and laser phase noise • Digital vs. analog signal processing for emerging coherent intra- and inter-data center systems • Q&A 5-minutes (6) Panel Discussion 40-minutes. Address more debatable topics. Allow all the speakers and audience to participate in the discussion and tackle the problem from different angles. Panel is moderated by co-organizers.

6 LACC IMS2020

SUNDAY WORKSHOPS 08:00 – 17:15 SUNDAY, 21 JUNE 2020

Workshop Abstract Workshop Title WSD Quantum computing has recently spurred intense research activity towards the development of the cryogenic Cryogenic Electronics for Quantum SUNDAY electronics to control quantum devices operating at cryogenic temperatures. Furthermore, several applications Computing and Beyond: Applications, beyond quantum computing require cryogenic electronics either to be compatible with very low ambient Devices, and Circuits temperatures or to outperform the performance of their room-temperature counterparts. This workshop will Sponsor: RFIC present an overview of cryogenic electronics from applications down to device operation, focusing on integrated Organizer: D. Chowdhury, Broadcom, circuits. First, typical applications requiring operation at cryogenic temperatures, such as quantum computing D.Y.C. Lie, Texas Tech University, (first talk) and particle physics (second talk), will be presented to highlight requirements, current limitations, and P. Reynaert, Katholieke Universiteit future perspectives. Next, the operation of SiGe (third talk) and CMOS (fourth talk) at cryogenic temperatures will be discussed. Finally, four design examples of integrated circuits employing SiGe, bulk CMOS and FD-SOI Leuven CMOS and targeting low-noise amplification or quantum computing will be shown, thus practically demonstrat- 08:00 – 17:15 ing techniques to exploit (or circumvent) cryogenic operation. WSE LNA, PA, SW, phase shifter can all be integrated into 1 silicon RF Front-End (RFFE) IC for mm-wave 5G, and even Fully Integrated Silicon vs. Hybrid multichannel integration are likely; however, the advantages in costs, robustness, manufacturability for the RFFE Systems for 5G mm-Wave all-silicon RFFE IC approach not yet clear vs. hybrid III-V/silicon solutions for 5G. The power efficiency of Highly Efficient PA Design Trade-Offs mm-wave 5G broadband PA is considerably lower than their 4G counterparts, and GaN/GaAs III-V based PAs Sponsor: RFIC have high output power and good efficiency vs. those of silicon-based PAs, but hybrid integration approaches Organizer: B. Sadhu, IBM T.J. Watson increase rapidly in cost as complexity increases, as will be covered in this workshop. mm-Wave PA linearity vs. Research Center, T. LaRocca, Northrop PAE (power-added-efficiency) at power backoff is always a design trade-off, and novel RF linearization techniques are required to improve these 5G mm-wave PAs. All-silicon solutions with superstrates for antennas Grumman are currently being investigated, and we will discuss the PA-Antenna and PA-Package co-design for 5G MIMO PAs 08:00 – 17:15 as well. mm-Wave Phased-Array Transceiver WSF The tutorial-style workshop by top phased array experts in academia and industry will provide an in-depth Design: From Basics to Advance- learning experience for the attendees and walk them through the different aspects of mm-wave phased-array ments transceiver design. The workshop will feature leading experts from academia and industry and cover the Sponsor: RFIC following topics on mm-wave phased arrays: (1) silicon-based mm-wave phased array basics, (2) phase and Organizer: A. Frappé, IEMN (UMR gain control circuits, (3) package, antenna and module co-design and calibration, (5) phased array measure- ments: on-chip and over-the-air, (5) applications of phased arrays in commercial and defense systems, and (6) 8520), J. Kitchen, Arizona State current 5G NR phased array systems, limitations, and an outlook towards 6G. University, R. Pullela, MaxLinear 08:00 – 17:15

Sub-6GHz Advanced Transmitter WSG 5G communications in the sub-6GHz frequencies offer enhanced data rates, capacity, and flexibility but face Architectures and PA Linearization challenges such as energy efficiency, linearity, integration, and scalability. To increase battery life, optimization of the efficiency of the power amplifier is of utmost importance. This workshop investigates digitally intensive Techniques transmit architectures and pre-distortion techniques that enhance efficiency of transmitters and power amplifiers Sponsor: RFIC used in these next-generation wireless systems. Experts from industry and academia will share their latest Organizer: E. Klumperink, University of research on linearization techniques to build highly efficient linear PAs in various technologies employing Twente, K. Entesari, Texas A&M University topologies such as Doherty, out-phasing or polar. Circuit topologies and digital signal processing algorithms for 08:00 – 17:15 pre-distortion of these power amplifiers will also be covered in this workshop. WSH To meet an order-of-magnitude increase in data traffic demand on mobile networks, 5G networks will be key to 5G Radio Circuits and Systems support this growth. 5G massive multiple-input, multiple-output (MIMO) technology will deliver high data rates to Exploiting MIMO and Digital many users, helping to increase capacity. It will support real-time multimedia services and reduce energy Beamforming consumption by targeting signals to individual users utilizing digital beamforming. Also, element-level digital Sponsor: RFIC beamforming that supports emerging multi-beam communications and directional sensing at mm-wave Organizer: G. Hueber, Silicon Austria frequency range, will expand the use of mm-wave phased-arrays and make them broadly applicable across Labs, Y.-H. Liu, IMEC Department of Defense (DoD) systems. The focus of this workshop is to present state-of-the-art radio circuits and systems exploiting MIMO and digital beamforming at sub-6GHz and mm-wave bands for both civilian 5G 08:00 – 17:15 NR and defense applications.

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SUNDAY, 21 JUNE2020 SUNDAY, orkshop Abstract W – 17:15 08:00

Wireless systems using higher (100–300GHz) mm-wave carrier frequencies will benefit from large available available carrier large frequencies will benefit from Wireless systems using higher (100–300GHz) mm-wave Simple spatial multiplexing. spectral re-use via massive massive the very given short wavelengths, and, bandwidths hub and in both point-multipoint network that ~1Tb/s capacities are feasible analysis suggests radio link budget and attenuation, high Friss path loss and high foul-weather is limited by range But, point-point backhaul links. and the potential design of such the technical challenges, will examine the design, We beams are readily blocked. tile module and antenna array characteristics, radio propagation link budgets, including link architecture, systems, digital beamformer design, analysis, range MIMO beamformer dynamic massive MIMO channel estimation, design, SiGe and III-V technolo- RF front-end design in CMOS, to accommodate beam blockage, design of mesh networks as a function of architecture. consumption and estimates of system DC power gies, is a great place for new and experienced engineers to learn about the adventure of space. and experienced engineers to learn place for new about the adventure is a great and synchroniza- distribution, the generation, systems, mm-wave In emerging 5G cellular communication and other the latest design techniques of covers This workshop tion of the local oscillator (LO) signals remain a challenge. spurious low phase noise, LO signals with low to generate frequency synthesis circuit components and systems The first talk and long term stability across a wide operation frequency range. bandwidth, wide modulation tones, 5G in the advanced oscillator (VCO) coupling mitigation address LO frequency synthesis and voltage-controlled and sub-THz VCO design for mm-wave The second talk focuses on ultra-wide-tuning-range cellular transceiver. The third talk explores state-of-the-art for frequency-modulated continuous loops (PLLs) phase locked frequencies. molecular method, cost reference clock generation low And the last talk introduces a new (FMCW) generation. wave synchronization and navigation. for wireless network clock, Want to understand the “Go” in GoGo Wireless In-flight Satellite Internet? in learning Interested in GoGo about satellite “Go” to understand the Want PDK or next Need to design on CMOS using a high-reliability CubeSats and its demands on RF electronics? orbits, from the satellite to technical know-how provides This vertically oriented workshop rad-hard process? generation of satellite orbits and A review commercial and defense leaders in space hardware. bringing together by the device small-formfor factor, drive the and overviewCubeSats detailed of a as well as system on the antenna demands the for and challenges of the market review a comprehensive by This is followed high reliability electronics is covered. for space in both RFICs will then cover The workshop SatCom terminals and the need for high reliability electronics. sensors. CMOS for deep space very power low CMOS and III-V technology including a special overview of advanced and the techniques to successfully design in space effects on CMOS, of radiation types, a technical review Finally, This bulk CMOS is offered. using a radiation hard library advanced radiation hard process on or a next generation that are and bandwidth energy efficiency, amplifiers do not fulfill all of the requirements of linearity, power Presently, particularly for the user communications, operation for 5G and future radio and mm-wave required for new or through improved amplifiers, of ultra-high linearity power techniques are required in the design New equipment. the perfor- extension techniques to dramatically improve enhancement and bandwidth efficiency linearization, radio and It is noted that all aspects of new systems. mance to open the full potential of future communications with non-negligible element-to-element placed into arrays become more challenging when design PA mm-wave well as linearization as spectrum, amplifier designs in the mm-wave will explore power This workshop coupling. etc.) and efficiency enhancement tracking, envelope outphasing, techniques (digital pre-distortion (DPD), and base stations. in both user equipment etc.), modulation, supply (load-modulation, Indoor positioning and localization will be the big wave in next generation IoT. It is a process of obtaining the IoT. in next generation will be the big wave Indoor positioning and localization IoT applications, technology enabling various is a key which or a user in an indoor environment, location of a device smartphone popular several In this workshop, etc. smart industrial, distance-bounded security, smart building, e.g., Currently Bluetooth will be discussed. that are used for localizing people or objects based wireless technologies WiFi Ultra-WideBand approaches. are three popular standard compliant localization (UWB) and EnergyLow (BLE), advantage so BLE-based localization has the smartphoneBLE is the most widely adopted based wireless protocol, also used in and it is now technology, UWB is an emerging wireless localization infrastructure. in densely deployed accuracy thanks cm-level IEEE802.15.4z can provide UWB protocol The new 11). iphone future smartphones (e.g., an will also play in most of the buildings, as a wireless technology WiFi, deployed Finally, to it wide spectrum. indoor the anchor-less Finally, important with the upcoming IEEE 802.11az protocol. role in accurate positioning in this workshop. also be covered localization using radar will WORKSHOPS orkshop Title W 100–300GHz Wirelessmm-Wave for 0.1–1Tb/s Networks Sponsor: RFIC Infineon Rueddenklau, Organizer: U. OvG Issakov, V. Technologies, Magdeburg Universität 08:00 – 17:15 13:30 – 17:15 Recent Advances in Frequency Recent Generation Techniques for and Beyond mm-Wave, sub-6GHz, Sponsor: RFIC of University Gu, Organizer: J. Rodwell, M. Davis, California, Santa of California, University Northrop LaRocca, T. Barbara, Grumman Highly Linear and Linearized Amplifiers for Broadband Power Communications and mm-Wave Sponsor: RFIC Wu, W. MIT, Han, Organizer: R. Samsung 08:00 – 11:50 Sponsor: RFIC Qualcomm, Walling, Organizer: J. Semiconductor Apogee Eliezer, O. 08:00 – 17:15 08:00 – 17:15 Systems: Satellite Communication An End-to-End Review From LEO-GEO-CubeSat System Requirements to Radiation Hardened Devices Wireless Technologies for Indoor for Technologies Wireless Positioning and Localisation Systems Sponsor: RFIC; IMS Broadcom, Mikhemar, Organizer: M. LaRocca, T. Systems, BAE Turner, S.E. Northrop Grumman

WSI WSJ WSK WSL WSM

LACC SUNDAY

SUNDAY 8 LACC IMS2020

SUNDAY WORKSHOPS 08:00 – 17:15 SUNDAY, 21 JUNE 2020

Workshop Abstract Workshop Title WSN The rationale for the 5th generation of mobile communications (5G) development is to expand the broadband Wireless Technologies for Ultra- SUNDAY capability of mobile networks, and to provide capabilities not only for consumers but also for other sectors of Reliable Low-Latency Communication the economy in particular vertical industries at large such as manufacturing. 5G is built to address three essential types of communication: extreme mobile broadband (eMBB), massive machine type communication (URLLC) Applications (mMTC), and ultra-reliable low-latency communications (URLLC). The first type, enhanced mobile broadband Sponsor: IMS (eMBB) is meant to provide both extreme high data-rate (several Gbps) and low latency communications Organizer: U. Rueddenklau, Infineon (several ms) also to offer enhanced coverage, well beyond that provided by 4G. mMTC is designed to provide Technologies, V. Issakov, OvG Universität wide area coverage and deep penetration for hundreds of thousands of sensor devices per square kilometer of Magdeburg coverage. mMTC is also designed to provide ubiquitous connectivity with low software and hardware complexity 13:30 – 17:15 for a device and battery-saving low-energy operation. The third category URLLC, which is also called Critical MTC, wherein monitoring and control occur in real time, E2E latency requirements are very low (at millisecond levels), and the need for reliability is high, e.g., down to 10E-5 and lower. The objective of URLLC is, among others, to provide communication to industrial process control and sensor networking that have stringent requirements in terms of reliability and low latency at the application layer. In this half-day workshop we focus on URLLC, particularly Latency and Reliability for URLLC. 5G will ensure that URLLC will have the capability to achieve a latency over the 5G radio interface of e.g. 1 ms with a reliability of 1-10E-5 meaning that a small packet can be transferred over the radio interface, where the successful transmission can be guaranteed with a failure probability of 10E-5 within a specified time bound e.g. 1ms. Low latency communication is enabled by introducing short transmission slots, allowing faster uplink and downlink transmission. By reducing the transmission duration and interval, both the time over the air and the delay introduced at the transmitter while waiting for the next transmission opportunity are reduced. Reliability can be achieved by e.g. using robust modulation and coding schemes (MCS), and diversity/redundancy techniques. Known channel coding schemes are used (such as Turbo codes or low-density-parity-check (LDPC) codes for data channels; and tail-biting convolutional or Reed-Müller codes or Polar codes for control channels, respectively). Redundancy can be provided by various means among e.g. multi-antenna, frequency or time diversity. Multi-connectivity via multi-carrier or multiple transmission points comes as a further diversity technique extending, where the device is connected via multiple frequency carriers to the radio network. Several flavors of multi-connectivity have been defined in 3GPP. While these features previously focused on improving the user throughput, by aggregating resources of the different used carriers, the focus has shifted recently to improve the transmission reliability. We describe use cases, frequency spectrum situation, technologies including measurement challenges for the 5G area of Industry 4.0 for IIoT, factory automation and smart manufacturing. Distinguished speakers from leading companies and 5G standartization discuss several aspects of 5G wireless infrastructure.

9

2020 S IM 10:00 – 12:00 SUNDAY, 21 JUNE 2020 SUNDAY, AWR AWR Sherry VP Marketing, Hess, A Pocket-Sized Microwave Detector Microwave A Pocket-Sized A&M University Texas Elif Tu3D Kaya, A Truly Connected World Waterloo of University Ifrah Jaffri, We1F Devices with Low-Power IoT: Interacting State University Washington Chung-Ching Lin, Tu2A The Backbone of Future Wireless Sensor Networks: Adaptable Smart Cities Virginia of University Sheth, Mo2C Jay and Downloads with Microwave Predictions Weather Enhancing Electronics Technology Georgia Institute of Sunil Rao, Tu1A RF Systems Possible Low-Voltage Make Tsinghua University Wang, Bowen Tu1D Interference-Canceling 5G Devices Research Center Watson T.J. IBM Mo3A Arun Paidimarri, Data Your While Delivering World 5G Signals Can See the Research Center Watson J. T. IBM Mo3A Bodhisatwa Sadhu, Wireless Communications Wire for A The Human Body: Purdue University Mo2A Baibhab Chatterjee, Silicon of Stars Institute of Technology Tokyo Wang, Yun Tu2B Ready for 6G? We Are BITS Pilani Awani Khodkumbhe, Tu1C Antenna Measurements Empowering 5G Wisconsin of University ARFTG Mohammadreza Ranjbar Naeini, McMaster University; McMaster Bandler, John LACC 17:00 – 15:00

Abdessamad Boulmirat, Université Grenoble Alpes - CEA, Alpes - CEA, Grenoble Université Abdessamad Boulmirat, AhmedBen Ayed, University of Waterloo AhmedBen Ayed, Eduardo Vilela Pinto dos Anjos, KU Leuven Anjos, Vilela Pinto dos Eduardo Group at National InstrumentsGroup at National Shaping and Steering Electromagnetic Beams for Pennies on Shaping and Steering Electromagnetic Beams for Pennies the Dollar (Caltech) Technology California Institute of Akbar, Th2G Fatemeh without the Rainbow Effect Array Antenna Magical University Rutgers Minning Zhu, Tu4A Waste Radio for Recycling Textiles Smart of Southampton University Wagih, Th1E Mahmoud Efficiency Using Signal Power Towers’ Improving 5G Cell Processing We1F Electronic Ecosystems Energy-Saving Journey towards Cities Twin of Minnesota, University Dave, Th2D Aditya Thriving Beyond Copper for 5G of Florida University Renuka Bowrothu, Tu4A But We Can Silent, Hear You! University Tong Shanghai Jiao Wen, Li We3D Finding the Musical Notes of Material Properties at Dallas Texas of University Nikita Mahjabeen, Tu4D Beating the Enemy in Communication Dublin College University Wang, Xiaoyu We3G No Ambiguity at All! University Tong Shanghai Jiao Xu, Wei We2B Redefining Electronics through Printing of Science and Abdullah University King Yang, Shuai Tu1G Technology is in the House! Microwave Diabetes! Be Gone, Florida International University Vital, Th2E Dieff Wireless Com- of Improving and Enabling Future Generations Factor munications: the Grandparent WEIF1 LETI THIS YEAR’S FINALISTS ARE: FINALISTS YEAR’S THIS Making 5G Devices Multilingual Tu3C ORGANIZERS/CO-CHAIRS: CEREMONIES: OF MASTER TBA JUDGES: Presentation Skills Session Pre-Competition Kiley Bandler and Erin John Hosted by 13:00-14:00 Thesis Briefing Session Three Minute Session 14:00-15:00 Thesis Coaching Three Minute 15:00-17:00 Thesis Competition Three Minute Erin Kiley, MCLA Erin Kiley,

p­ ow in its fourth year, the in its fourth year, ow Week 3MT® Microwave is designedcompetition

tition will receive their prizes at tition will receive (3MT®) COMPETITION (3MT®) e­ the IMS2020 Closing Ceremony 25 June 2020. Thursday, on all Microwave encourage We attendees to come to Week our Pre-Competition Presentation our briefing Skills Session, and our coaching session, all in the same venue session, as the competition. by one static slide, in a language in a language one static slide, by appropriate to a non-specialist audience. for 2020: our finalists New ARFTG. RFIC and represent IMS, The winners of the 3MT® com­ to stimulate interest in the wideto stimulate interest in of microwave of applications range Eligible student and technology. competitors professional young of three a presentation will make supported only minutes or less,

THREE THESIS MINUTE N

SUNDAY 10 LACC IMS2020

RFIC PLENARY SESSION 17:30 – 19:00 SUNDAY, 21 JUNE 2020

PLENARY SPEAKER 1 Is the Third Wave Coming in CMOS RF? Dr. Thomas Byunghak Cho, EVP Samsung Semiconductor SUNDAY ABSTRACT: n the late 90’s, academia’s active research on CMOS RF, combined with the industry’s increasing need for compact and low-cost mobile devices, had triggered a succession of waves in CMOS RF, making the rapid deployment and I widespread commercialization of CMOS RFICs. Of course, there were many technical challenges and concerns in using CMOS for RF for the first time, such as substrate noise, lack of good RF models, etc. However, they weren’t big enough to stop those waves. In fact, CMOS scaling for digital and increasing digital signal processing capabilities added extra momentum to the waves. As a result, CMOS RF has played a key role in enabling many generations of modern solutions for a variety of wireless applications such as Cellular, WiFi, BT, GPS, IoT, etc. Now, we are in 2020. The market is still hot. It demands even more mobile performance than before. New applications such as 5G, Automotive, AR/VR, etc. are on the rise. However, for RFIC designers, the situation is even more challenging than before. RF perfor- mance gain from scaling has slowed down. Sub-6GHz spectrum is quite busy and crowded, pushing new standards to higher frequency. Low power consumption is ever important. In this complex situation, several questions arise. Is the third wave coming in CMOS RF? If so, what are the winds that will create the new wave? Is the wave big enough to enable new applications? In this talk, we will briefly go over the past two decades of CMOS RF history and examine these questions to gain insights into the future.

PLENARY SPEAKER 2 The Flexible Future of RF Prof. Ali Hajimiri, Bren Prof. of Elect. Eng. and Medical Eng., Caltech ABSTRACT: ver the last quarter of a century, RF and mm-wave CMOS integrated circuits have gone from the realm of exotic research to becoming the only realistic way to implement almost all commercial communication and sensing O systems. The ability to reliably integrate a large number of active and passive components operating at RF and mm-wave frequencies continues to enable an unlimited number of new applications and design approaches previously not practical or economical. Wireless power transfer at a distance is an example of an emerging third prong of novel use cases for RF and mm-waves integrated circuits. Despite these major advances, such RF and microwave systems remain relatively small, static, and rigid, thereby limiting their ability to be used in many novel applications ranging from wearable fabric, to easily deployable large-scale arrays in various environments. Such systems can provide significant additional utilization of the unprecedented IC fabrication capacity of the silicon foundries and enable yet another wave of new domains of use. Flexible lightweight collapsible active electromagnetic surfaces enabled by an array of CMOS RFICs with the dynamic ability to compensate and correct for mechanical changes in the real time can open the door to a breadth of new applications from RF active fabric for clothing to communi- cation and wireless power transfer systems that can be rapidly deployed on the ground and in space to enable a truly wireless ecosystem of the future.

11 LACC IMS2020

RFIC WELCOME 19:00 – 21:00 SUNDAY, 21 JUNE 2020 RECEPTION FEATURING INDUSTRY SHOWCASE AND STUDENT PAPER AWARD FINALISTS

SUNDAY THE INDUSTRY SHOWCASE The RFIC Industry Showcase Session, held concurrently with the plenary reception, will highlight a total of 10 outstanding paper finalists listed below, submitted by authors from the industry. In this interactive session, authors will present their innovative work in poster format. These 10 paper finalists were nominated this year by the RFIC Technical Program Committee to enter the final contest. A committee of eleven TPC judges have selected the top three Industry Papers after rigorous reviews and discussions. The top three will be announced during the RFIC Plenary Session on 21 June 2020 in Los Angeles, and each winner will receive a plaque. This year’s Industry Paper Award finalists are:

3D Imaging Using mmWave 5G Signals | RMo3A-1 | 13:40 High Resolution CMOS IR-UWB Radar for Non-Contact Human Junfeng Guan, Arun Paidimarri, Alberto Valdes-Garcia, Vital Signs Detection | RMo1B-3 | 08:40 Bodhisatwa Sadhu Sang Gyun Kim, In Chang Ko, Seung Hwan Jung IBM T.J. Watson Research Center, USA GRIT Custom-IC, Korea Spatio-Temporal Filtering: Precise Beam Control Using Fast Beam Parasitic Model to Describe Breakdown in Stacked-FET Switching | RMo4A-2 | 16:10 SOI Switches | RMo2D-3 | 10:50 Arun Paidimarri, Bodhisatwa Sadhu Kathleen Muhonen1, Scott Parker1, Kaushik Annam2 IBM T.J. Watson Research Center, USA 1Qorvo, USA, 2University of Dayton, USA A 77GHz 8RX3TX Transceiver for 250m Long Range Automotive 77GHz CMOS Built-In Self-Test with 72dB C/N and Less Radar in 40nm CMOS Technology | RMo1B-2 | 08:20 Than 1ppm Frequency Tolerance for a Multi-Channel Radar Tatsunori Usugi, Tomotoshi Murakami, Yoshiyuki Utagawa, Application RMo1B-5 | 09:20 Shuya Kishimoto, Masato Kohtani, Ikuma Ando, Masato Kohtani, Tomotoshi Murakami, Yoshiyuki Utagawa, Kazuhiro Matsunaga, Chihiro Arai, Tomoyuki Arai, Shinji Yamaura Tomoyuki Arai, Shinji Yamaura DENSO, Japan DENSO, Japan A 1.2V, 5.5GHz Low-Noise Amplifier with 60dB On-Chip Selectivity A Reconfigurable SOI CMOS Doherty Power Amplifier for Uplink Carrier Aggregation and 1.3dB NF | RTu2C-2 | 10:30 Module for Broadband LTE High-Power User Equipment Daniel Schrögendorfer, Thomas Leitner Applications | RMo2A-2 | 10:30 Infineon Technologies, Austria A. Serhan1, D. Parat1, P. Reynier1, M. Pezzin1, R. Mourot1, F. Chaix1, R. Berro1, P. Indirayanti2, C. De Ranter2, K. Han2, M. Borremans2, A D-Band Radio-on-Glass Module for Spectrally-Efficient and 1 1 Low-Cost Wireless Backhaul | RMo2B-3 | 10:50 E. Mercier , A. Giry 1 2 Amit Singh, Mustafa Sayginer, Michael J. Holyoak, Joseph Weiner, CEA-Leti, France, Huawei Technologies, Belgium John Kimionis, Mohamed Elkhouly, Yves Baeyens, Industry Paper Contest Eligibility: The first author must have an Shahriar Shahramian affiliation from industry. The first author must also be the lead author of Nokia Bell Labs, USA the paper and must present the paper at the Symposium. Fully Autonomous System-on-Board with Complex Permittivity Sensors and 60GHz Transmitter for Biomedical Implant Applications | RMo3A-4 | 14:40 Issakov1, C. Heine1, V. Lammert1, J. Stoegmueller1, M. Meindl2, U. Stubenrauch1, C. Geissler1 1Infineon Technologies, Germany, 2eesy-IC, Germany

12 IMS2020

SUNDAY STUDENT PAPER AWARD FINALISTS The RFIC Symposium’s Student Paper Award is devised to both encourage student paper submissions to the conference as well as give the authors of the finalists’ papers a chance to promote their research work with the conference attendees after the plenary session during reception time. A total of thirteen outstanding student paper finalists were nominated this year by the RFIC Technical Program Committee to enter the final contest. A committee of ten TPC judges have selected the top-three papers after rigorous reviews and discussions. All finalists benefit from a complimentary RFIC registration. The top-three Student Papers will be announced during the RFIC Plenary Session on 21 June 2020 in Los Angeles. Each winner will receive an honorarium and a plaque. This year’s Student Paper Award finalists are: Ultra Compact, Ultra Wideband, DC-1GHz CMOS Circulator Based on A Wideband True-Time-Delay Phase Shifter with 100% Fractional Quasi-Electrostatic Wave Propagation in Commutated Switched Bandwidth Using 28nm CMOS | RMo1D-1 | 08:00 Capacitor Networks | RMo1C-5 | 09:20 Minjae Jung, Hong-Jib Yoon, Byung-Wook Min, Yonsei University, Aravind Nagulu1, Mykhailo Tymchenko2, Andrea Alù2, Harish Korea 1 Krishnaswamy A 16-Element Fully Integrated 28GHz Digital Beamformer with 1Columbia University, USA, 2University of Texas at Austin, USA In-Package 4×4 Patch Antenna Array and 64 Continuous-Time A 66.97pJ/Bit, 0.0413mm2 Self-Aligned PLL-Calibrated Harmonic- Band-Pass Delta-Sigma Sub-ADCs | RTu2B-1 | 10:10 Injection-Locked TX with >62dBc Spur Suppression for IoT Applica- Rundao Lu, Christine Weston, Daniel Weyer, Fred Buhler, tions Michael P. Flynn, RTu2A-1 | 10:10 University of Michigan, USA Chung-Ching Lin, Huan Hu, Subhanshu Gupta, Washington State A Dual-Core 8–17GHz LC VCO with Enhanced Tuning Switch-Less Tertiary University, USA Winding and 208.8dBc/Hz Peak FoMT in 22nm FDSOI | RMo4C-4 | A Scalable 60GHz 4-Element MIMO Transmitter with a Frequency- 16:50 Domain-Multiplexing Single-Wire Interface and Harmonic-Rejec- Omar El-Aassar, Gabriel M. Rebeiz, University of California, tion-Based De-Multiplexing | RMo3B-3 | 14:20 San Diego, USA 1 1, 1 Ali Binaie , Sohail Ahasan Armagan Dascurcu , Mahmood Baraani A 7.4dBm EIRP, 20.2% DC-EIRP Efficiency 148GHz Coupled Loop 1 2 2 1 Dastjerdi , Robin Garg , Manoj Johnson , Arman Galioglu , Arun Oscillator with Multi-Feed Antenna in 22nm FD-SOI | RTu1A-5 | 09:20 Natarajan2, Harish Krishnaswamy1 Muhammad Waleed Mansha, Mona Hella, Rensselaer Polytechnic 1 2 Columbia University, USA, Oregon State University, USA Institute, USA A SiGe Millimeter-Wave Front-End for Remote Sensing and Imaging Characterization of Partially Overlapped Inductors for Compact Layout | RMo4B-3 | 16:30 Design in 130nm RFCMOS and 22nm FinFET Processes | RMo2D-2 | Milad Frounchi, John D. Cressler, Georgia Tech, USA 10:30 A 1.5–3GHz Quadrature Balanced Switched-Capacitor CMOS Xuanyi Dong, Andreas Weisshaar, Oregon State University, USA Transmitter for Full Duplex and Half Duplex Wireless Systems | A Hybrid-Integrated Artificial Mechanoreceptor in 180nm CMOS | RMo2C-1 | 10:10 RMo3A-3 | 14:20 1 2 1 Nimrod Ginzberg , Dror Regev , Emanuel Cohen Han Hao, Lin Du, Andrew G. Richardson, Timothy H. Lucas, 1Technion, Israel, 2Toga Networks, Israel Mark G. Allen, Jan Van der Spiegel, Firooz Aflatouni, University of A Dual-Mode V-Band 2/4-Way Non-Uniform Power-Combining PA Pennsylvania, USA with +17.9-dBm Psat and 26.5-% PAE in 16-nm FinFET CMOS | Student Paper Contest Eligibility: The student must have been RMo3C-1 | 13:40 a full-time student (9 hours/term graduate, 12 hours/term unde­ 1 2 3 1 Kun-Da Chu , Steven Callender , Yanjie Wang , Jacques C. Rudell , rgraduate) during the time the work was performed. The student 2 2 Stefano Pellerano , Christopher Hull must also be the lead author of the paper and must present the 1University of Washington, USA, 2Intel, USA, 3USA paper at the Symposium. A DC to 43-GHz SPST Switch with Minimum 50-dB Isolation and +19.6-dBm Large-Signal Power Handling in 45-nm SOI-CMOS | RMo1D-2 | 08:20 Ayman Eltaliawy1, John R. Long1, Ned Cahoon2 1University of Waterloo, Canada, 2GLOBALFOUNDRIES, USA

13 MONDAY 14 MONDAY, 22 JUNE 2020 IMS2020

MONDAY Monday

15 404AB Mo1D-3: DC-40GHz SPDTs in 22nm FD- SOI and Back-Gate Impact Study catholique de Rack; Université M. catholique Nyssens; Université L. Louvain; eV-Technologies; Wane; S. de Louvain; Raskin; J.-P. Bajon; eV-Technologies; D. catholique de Louvain Université UHF to S-Band RF A 100W, Mo1D-4: Switch in the Super-Lattice Castellated (SLCFET) 3S Transistor Field Effect Process Parke; Hug; Northrop Grumman; J. J.J. Kapoor; Northrop V. Northrop Grumman; Grumman Mo1D: Switches and Delay and Delay Mo1D: Switches Receiver Front-Ends Elements for NXP Leenaerts, Chair: Domine M.W. Semiconductors Università Co-Chair: Danilo Manstretta, di Pavia Mo1D-1: A Wideband True-Time-Delay Phase Shifter with 100% Fractional Bandwidth Using 28nm CMOS Yonsei Yoon; H.-J. M. Jung; Yonsei Univ.; Univ. Yonsei Min; B.-W. Univ.; 43-GHz SPST SwitchA DC to Mo1D-2: with Minimum 50-dB Isolation and Power +19.6-dBm Large-Signal Handling in 45-nm SOI-CMOS J.R. Waterloo; of Univ. Eltaliawy; A. Cahoon; N. Waterloo; of Long; Univ. GLOBALFOUNDRIES 403B Mo1C-3: A 3.4–4.6GHz In-Band Full- A 3.4–4.6GHz Mo1C-3: Duplex Front-End in CMOS Using a Bi-Directional Frequency Converter MIT; Wang; MIT; C. Wang; Yi; MIT; J. X. Lincoln Laboratory; Kolodziej; MIT K.E. R. Han; MIT Mo1C-4: A Self-Interference-Tolerant, Receiver with More Multipath Rake Than 40-dB Rejection and 9-dB SNR Channel Multipath Gain in a Fading Santa of California, Hamza; Univ. A. of California, Hill; Univ. Barbara; C. of AlShammary; Univ. Santa Barbara; H. Buckwalter; Santa Barbara; J. California, Santa Barbara of California, Univ. Wideband, Ultra Compact, Mo1C-5: Ultra Based on DC-1GHz CMOS Circulator Propagation Quasi-Electrostatic Wave in Commutated Switched Capacitor Networks Tymchenko; M. Nagulu; Columbia Univ.; A. Alù; A. Univ. at Austin; of Texas Univ. Krishnaswamy; H. Austin; at Texas of Columbia Univ. Mo1C: Circulators and Full-Duplex and Mo1C: Circulators Transceivers IMS (UMR 5218) Chair: François Rivet, Qualcomm Wiklund, Co-Chair: Magnus Widely- Mo1C-1: RFIC Inductorless, Based Circulators Shekel N-Path Tunable on Harmonic Engineering Reiskarimian; Columbia Univ.; N. H. Khorshidian; Columbia Univ.; M. Columbia Univ. Krishnaswamy; ReceiverA Full-Duplex Mo1C-2: Multiphase Switched- Leveraging Based Multi-Domain FIR Capacitor-Delay Filter Cancelers A. Univ.; Nagulu; Columbia A. Ahasan; S. Gaonkar; Columbia Univ.; Chen; Columbia T. Columbia Univ.; H. Columbia Univ.; Zussman; G. Univ.; Columbia Univ. Krishnaswamy; MONDAY, 22 22 JUNE | LACC 2020 | MONDAY, 09:40 – 08:00

403A Mo1B-5: 77GHz CMOS Built-In Self-Test Mo1B-5: 77GHz CMOS Built-In Self-Test Than 1ppm with 72dB C/N and Less for a Multi- Tolerance Frequency Channel Radar Application Murakami; T. Kohtani; DENSO; M. Arai; Utagawa; DENSO; T. DENSO; Y. DENSO Yamaura; DENSO; S. Mo1B-3: High Resolution CMOS IR- UWB Radar for Non-Contact Human Vital Signs Detection GRIT Ko; Custom-IC; I.C. Kim; GRIT S.G. Jung; GRIT Custom-IC Custom-IC; S.H. 60GHz FMCW RadarA 62mW Mo1B-4: in 28nm CMOS IMEC; P. Kankuppe; A. IMEC; Park; S. Guermandi; IMEC; D. Renukaswamy; Garcia; IMEC; J.C. Visweswaran; A. IMEC; IMEC; Wambacq; Sinha; IMEC; P. IMEC; S. Craninckx; IMEC J. Mo1B-2: A 77GHz 8RX3TX Transceiver Automotive Radar for 250m Long Range Technology in 40nm CMOS Y. Murakami; DENSO; T. Usugi; DENSO; T. Kishimoto; DENSO; DENSO; S. Utagawa; Ando; DENSO; K. I. Kohtani; DENSO; M. T. Arai; DENSO; DENSO; C. Matsunaga; DENSO Yamaura; Arai; DENSO; S. Mo1B: Microwave and mmWave and mmWave Mo1B: Microwave Radar Systems Analog Devices Chair: Ed Balboni, Propulsion Jet Co-Chair: Duane Howard, Laboratory Low Phase NoiseMo1B-1: Low Power in Transceiver 60GHz Multichannel Applications 28nm CMOS for Radar Technologies; Rimmelspacher; Infineon J. Technologies; G. Infineon Ciocoveanu; R. Bassi; Technologies; M. Steffan; Infineon V. Issakov; Infineon Technologies; Infineon Technologies 402AB

TECHNICAL SESSIONS TECHNICAL

Mo1A-4: A 10-to-12GHz 5mW Charge- A 10-to-12GHz Mo1A-4: Achieving 50fsec RMS Sampling PLL -258.9dB FOM and -65dBc Jitter, Reference Spur Delft; F. Universiteit Technische Gong; J. Delft; Universiteit Technische Sebastiano; Technische Babaie; Charbon; EPFL; M. E. Delft Universiteit Mo1A-3: A 2.0–2.9GHz Digital Ring- A 2.0–2.9GHz Mo1A-3: Clock Multiplier Based Injection-Locked Using a Self-Alignment Frequency Loop for Reference Spur Tracking Reduction Fudan Univ.; Ye; D. Xu; Fudan Univ.; R. of Shi; Univ. C.-J.R. Lyu; Fudan Univ.; L. Washington Mo1A-2: A 1Mb/s 2.86% EVM GFSKA 1Mb/s Mo1A-2: Without Modulator Based on BB-DPLL Digital Calibration Background Rhee; Tsinghua W. Liu; Tsinghua Univ.; Y. Tsinghua Wang; Univ. Z. Univ.; Mo1A-1: A 23.6–38.3GHz Low-Noise Mo1A-1: andPLL with Digital Ring Oscillator Dividers Multi-Ratio Injection-Locked Sensing for Millimeter-Wave Angeles; Los of California, Zhang; Univ. Y. Angeles; Los of California, Zhao; Univ. Y. Angeles; Los of California, Huang; Univ. R. ; Univ. Tung National Chiao Liang; C.-J. Univ. Tung Chiang; National Chiao C.-W. Univ. Tung Kuan; National Chiao Y.-C. ; Los of California, Chang; Univ. ; M.-C.F. Angeles Mo1A: High Spectral Purity Purity Spectral Mo1A: High Loops Phase-Locked University Auburn Chair: Foster Dai, Fa Systems BAE Cali, Co-Chair: D. Joseph

08:20 08:40 09:00 09:20 9:40

08:00 RFIC

MONDAY 16 MONDAY 17

10:10 10:30 10:50 11:10 11:30 11:50 404AB Mo2D-3: Parasitic Model to Describe Mo2D-3: Parasitic SOI Breakdown in Stacked-FET Switches Qorvo; Parker; K. Muhonen; Qorvo; S. K. of Dayton Annam; Univ. Mo2D-4: Residual Network Based A Direct Synthesis of EM Structures: Transformers Study on One-to-One Er; Georgia S. Tech; Munzer; Georgia D. Li; Y. Tech; Chen; Georgia M. Tech; Mannem; Georgia N.S. Tech; Georgia Wang; Zhao; H. Georgia Tech; T. Tech; Georgia Tech Mo2D: Novel RF Devices and Mo2D: Novel Modeling Approaches Tower Chair: Preisler, Edward Semiconductor TSMC Co-Chair: Hsieh-Hung Hsieh, Mo2D-1: W-Band Noise with Back-Gate Characterization 22nm FDSOI mm- Advanced Effects for MOSFETs Wave Huynh; Fraunhofer IPMS; D.K. Le; Q.H. Fraunhofer Wang; Fraunhofer IPMS; D. Zhao; GLOBALFOUNDRIES; IPMS; Z. T. Lehmann; GLOBALFOUNDRIES; S. Rudolph; M. Kämpfe; Fraunhofer IPMS; Universität Brandenburgische Technische of Partially Mo2D-2: Characterization Overlapped Inductors for Compact Design in 130nm RFCMOS and Layout 22nm FinFET Processes A. State Univ.; Dong; Oregon X. State Univ. Oregon Weisshaar; 403B Mo2C-3: A Differential Digital 4-Way Digital 4-Way A Differential Mo2C-3: Amplifier with 48% Doherty Power Power Efficiency for Low Drain Peak Applications Bowers; Virginia; S.M. of Sheth; Univ. J. of Virginia Univ. Mo2C-4: 1.2–3.6GHz 32.67dBm 4096- Using Reconfigurable QAM Digital PA for Transformer Combining Power Wireless Communication T. Qian; UESTC; UESTC; H.J. Yang; B. Luo; UESTC UESTC; X. Wang; Digital Power A Quadrature Mo2C-5: Amplifier with Hybrid Doherty and Impedance Boosting for Efficiency Enhancement in Complex Domain J. UESTC; Yang; Qian; UESTC; B. H.J. Luo; X. Xu; Fudan Univ.; Zhou; UESTC; H. UESTC Mo2C-1: A 1.5–3GHz Quadrature A 1.5–3GHz Quadrature Mo2C-1: CMOSBalanced Switched-Capacitor and Half for Full Duplex Transmitter Duplex Wireless Systems Toga Regev; D. Technion; Ginzberg; N. Technion Cohen; E. Networks; CMOS Switched- A 65nm Mo2C-2: Capacitor Carrier Aggregation Transmitter Huynh; Le; Fraunhofer IPMS; D.K. Q.H. Fraunhofer Wang; Fraunhofer IPMS; D. Zhao; GLOBALFOUNDRIES; IPMS; Z. T. GLOBALFOUNDRIES; Lehmann; S. Rudolph; Kämpfe; Fraunhofer IPMS; M. Universität Brandenburgische Technische Mo2C: Digital Power Amplifiers Power Mo2C: Digital Qualcomm Walling, Chair: Jeffrey Co-Chair: AmLogic Justin (ChiaHsin) Wu, MONDAY, 22 JUNE | LACC 2020 | – 11:50 MONDAY, 10:10

403A Mo2B-5: A Fully Integrated 32Gbps A Fully Integrated Mo2B-5: Wireless Link with UWB 2×2 LoS MIMO Analog Processing for Point-to-Point Backhaul Applications Grave; B. Stanford Univ.; Sawaby; M. Stanford Univ.; Jany; C. Stanford Univ.; Kananian; S. Chen; Stanford Univ.; C. Calascibetta; P. Stanford Univ.; Gianesello; STMicroelectronics; F. Arbabian; STMicroelectronics; A. Stanford Univ. Mo2B-3: A D-Band Radio-on-GlassA D-Band Mo2B-3: and Module for Spectrally-Efficient Low-Cost Wireless Backhaul Sayginer; Labs; M. Singh; Nokia Bell A. Nokia Holyoak; Nokia Bell Labs; M.J. Bell Labs; J. Nokia Weiner; Bell Labs; J. Elkhouly; Kimionis; Nokia Bell Labs; M. Nokia Bell Baeyens; Y. Nokia Bell Labs; Nokia Bell Labs Shahramian; Labs; S. IFA 134–149GHz Mo2B-4: Receiver Beamforming Phased-Array Channel with 6.4–7.5dB NF Using CMOS 45nm RFSOI G.M. San Diego; of California, Li; Univ. S. San Diego of California, Rebeiz; Univ. Mo2B-2: A 71–76/81–86GHz, E-Band, E-Band, A 71–76/81–86GHz, Mo2B-2: 16-Element Transceiver Phased-Array Selection Module with Image Variation for Low EVM Architecture K. of Michigan; Ebrahimi; Univ. N. J. of Michigan; Sarabandi; Univ. Santa of California, Buckwalter; Univ. Barbara Mo2B: Millimeter-Wave Circuits in Circuits Mo2B: Millimeter-Wave for High Data-Rate D and E Band Wireless Links of Institute Tokyo Chair: Kenichi Okada, Technology Co-Chair: STMicroelec- Pierre Busson, tronics TX and Mo2B-1: D-Band Phased-Array RX Front Ends Utilizing Radio-on-Glass Technology Elkhouly; Nokia Bell Labs; M.J. M. Hendry; D. Nokia Bell Labs; Holyoak; Zierdt; Nokia Nokia Bell Labs; M. Singh; Nokia Bell Labs; A. Bell Labs; S. Nokia Bell Labs; Sayginer; M. Y. Shahramian; Nokia Bell Labs; Nokia Bell Labs Baeyens;

TECHNICAL SESSIONS TECHNICAL 402AB

C. Yang; Univ. of Southern California; M. of Southern California; M. Univ. Yang; C. A. of Southern California; Univ. Ayesh; T.-F. of Southern California; Zhang; Univ. of Southern California; M.S.-W. Univ. Wu; of Southern California Chen; Univ. Mo2A-4: A 29-mW 26.88-GHz Non- A 29-mW Mo2A-4: Uniform Sub-Sampling Receiver Front- Alias Spreading End Enabling Spectral N. Li; Zhejiang Univ.; M. Li; Zhejiang M. Li; Zhejiang Univ.; N. Zhang; Z. Zhejiang Univ.; Wang; S. Univ.; Gao; Zhejiang Univ.; H. Zhejiang Univ.; ; X. Univ. Tung Kuan; National Chiao Y.-C. Xu; Zhejiang Univ. Z. Zhejiang Univ.; Yu; Mo2A-3: A 4-Element 7.5–9GHzA 4-Element Mo2A-3: Receiver with 8 Array Phased Beams Simultaneously Reconfigurable Technology in 65nm CMOS A. Serhan; CEA-LETI; D. Parat; CEA-LETI; Parat; D. Serhan; CEA-LETI; A. CEA-LETI; Pezzin; Reynier; CEA-LETI; M. P. Chaix; CEA- F. Mourot; CEA-LETI; R. Indirayanti; Berro; CEA-LETI; P. LETI; R. De Ranter; C. Technologies; Huawei Han; Huawei K. Technologies; Huawei Borremans; Huawei M. Technologies; A. Mercier; CEA-LETI; E. Technologies; Giry; CEA-LETI Mo2A-2: A Reconfigurable SOI CMOS A Reconfigurable Mo2A-2: Amplifier Module for Doherty Power User High-Power Broadband LTE Equipment Applications B. Chatterjee; Purdue Univ.; A. A. Chatterjee; Purdue Univ.; B. Seo; D.-H. Purdue Univ.; Srivastava; S. Purdue Univ.; Yang; D. Purdue Univ.; Sen; Purdue Univ. Mo2A-1: A Context-Aware Transmitter with Reconfigurable 802.15.6 NB-HBC and 2.24pJ/Bit, 400.9MHz MedRadio 4.93pJ/Bit, Efficiency Transmit Modes with 33.6% François Rivet, IMS (UMR Co-Chair: François Rivet, 5218) Magnus Wiklund, Qualcomm Wiklund, Chair: Magnus

Mo2A: Reconfigurable RF RF Mo2A: Reconfigurable Front-End Blocks RFIC 403B Mo3C-3: An Embedded 200GHz Power Amplifier with 200GHz Power An Embedded Mo3C-3: and 19.5dB Gain in 65nm Power 9.4dBm Saturated CMOS of Momeni; Univ. O. Davis; of California, Bameri; Univ. H. Davis California, Amplifier in a 250-nm InP Power A 130-GHz Mo3C-4: Process with 32% PAE Fang; Y. Santa Barbara; of California, Ning; Univ. K. Univ. Rodwell; Santa Barbara; M. of California, Univ. of Buckwalter; Univ. Santa Barbara; J. of California, of Buckwalter; Univ. Santa Barbara; J. California, Santa Barbara California, and HighA 160GHz High Output Power Mo3C-5: Amplifier in a 130-nm SiGe BiCMOS Power Efficiency Technology Wang; Y. Chen; Tsinghua Univ.; W. X. Li; Tsinghua Univ.; Tsinghua Univ. Feng; Z. Tsinghua Univ.; Mo3C-1: A Dual-Mode V-Band 2/4-Way Non-Uniform V-Band 2/4-Way A Dual-Mode Mo3C-1: with +17.9-dBm Psat and 26.5- PA Power-Combining in 16-nm FinFET CMOS % PAE Y. Callender; Intel; S. Washington; of Univ. Chu; K.-D. Pellerano; S. Washington; of Rudell; Univ. ; J.C. Wang; Hull; Intel Intel; C. Power Highly Efficient CMOS A 28-GHz Mo3C-2: Amplifier Using a Compact Symmetrical 8-Way Combiner with IMD3 Power Parallel-Parallel Cancellation Method Nam; Pusan National I. Ahn; Pusan National Univ.; H. Lee; Pusan National Univ. O. Univ.; Mo3C: mmWave Power Amplifiers Power Mo3C: mmWave Leuven Universiteit Katholieke Chair: Reynaert, Patrick Xilinx Co-Chair: Oleh Krutko, 403A MONDAY, 22 JUNE | LACC 2020 | MONDAY, – 15:20 13:40

Mo3B-5: A 10.56Gbit/s, -27.8dB EVM Polar -27.8dB A 10.56Gbit/s, Mo3B-5: at 60GHz in 28nm CMOS Transmitter Brebels; Khalaf; Pharrowtech; S. IMEC; K. Nguyen; J. Wambacq; IMEC; P. Vaesen; IMEC; K. Shrivas; IMEC; M. IMEC Mo3B-3: A Scalable 60GHz 4-Element MIMOA Scalable Mo3B-3: with a Frequency-Domain-Multiplexing Transmitter Single-Wire Interface and Harmonic-Rejection-Based De-Multiplexing Ahasan; Columbia S. Univ.; Binaie; Columbia A. Baraani M. Dascurcu; Columbia Univ.; A. Univ.; State Garg; Oregon R. Dastjerdi; Columbia Univ.; Galioglu; A. State Univ.; Oregon Johnson; M. Univ.; H. State Univ.; Oregon Natarajan; A. Columbia Univ.; Columbia Univ. Krishnaswamy; 56–72GHz to 10.56GHzA Bidirectional Mo3B-4: T/R Switches in Front-End with Integrated Tranceiver 28-nm CMOS Technology Wang; J. Tsinghua Univ.; Li; D. Tsinghua Univ.; Zhu; W. Tsinghua Wang; Y. Zhang; Rice Univ.; X. Tsinghua Univ.; Univ. Mo3B-2: A 64-QAM 45-GHz SiGe Transceiver for IEEE Transceiver 45-GHz SiGe A 64-QAM Mo3B-2: 802.11aj P. Chen; Southeast Univ.; J. Zhou; Southeast Univ.; P. Universiteit Technische Gao; H. Southeast Univ.; Yan; Southeast Yu; J. Hou; Southeast Univ.; D. Eindhoven; Southeast Univ.; Wang; C. Hu; Southeast Univ.; J. Univ.; Z. Southeast Univ.; Wang; L. Univ.; Dong; Southeast H. Jiang; Southeast Univ. Mo3B: Millimeter-Wave Transceivers and and Transceivers Mo3B: Millimeter-Wave Building Blocks Labs Nokia Bell Chair: Shahriar Shahramian, Fudan University Co-Chair: Hongtao Xu, Gain & Linearity Variable Mo3B-1: 60GHz CMOS Enhancement LNA in 65nm RWTH Negra; R. Aachen Univ.; RWTH Bierbuesse; D. Aachen Univ. 402AB

TECHNICAL SESSIONS TECHNICAL

Mo3A-4: Fully Autonomous System-on-Board withAutonomous Mo3A-4: Fully Transmitter Complex Permittivity and 60GHz Sensors Applications for Biomedical Implant Texas Bharadwaj; Instruments; S. Texas Breen; Instruments Texas Bhatara; Instruments; S. S. Samala; Texas Instruments; D. Shetty; Texas Texas Shetty; Instruments; D. Texas Samala; S. Texas Ram; Instruments; S. Texas Parkar; Instruments; Z. Instruments; D. Texas Dudhia; V. Instruments; ArtificialMo3A-3: A Hybrid-Integrated Mechanoreceptor in 180nm CMOS Mo3A-2: Digitally Assisted mm-Wave FMCW Radar for Assisted mm-Wave Mo3A-2: Digitally High Performance Instruments;K. A. Subburaj; Texas Mani; Texas Bhatia; Instruments; K. Texas Dandu; Instruments; K. Texas Ramasubramanian; Instruments; K. Texas Sachdev; Instruments; R. Texas Murali; Instruments; S. Instruments; Texas Gupta; Instruments; P. Texas Mo3A-1: 3D Imaging Using mmWave 5G Signals mmWave Mo3A-1: 3D Imaging Using Paidimarri; A. Center; Research Watson T.J. IBM Guan; J. Watson Research Valdes-Garcia; IBM Center; A. IBM T.J. Watson T.J. Sadhu; IBM Research Center; B. Watson T.J. Research Center Mo3A: RFIC Systems and Applications I: Applications Systems and Mo3A: RFIC and Radar Systems Biomedical Semiconductor Apogee Chair: Oren Eliezer, IMEC Liu, Yao-Hong Co-Chair:

14:00 14:20 14:40 15:00 15:20

13:40 RFIC

MONDAY 18 MONDAY 19

15:50 16:10 16:30 16:50 17:10 17:30 403B Mo4C-3: A 0.35mW 70GHz Divide-by-4 TSPC 70GHz Divide-by-4 A 0.35mW Mo4C-3: Technology Frequency Divider on 22nm FD-SOI CMOS Carta; Dresden; C. Universität Technische Tibenszky; Z. Technische Ellinger; Dresden; F. Universität Technische Dresden Universität VCO with Enhanced 8–17GHz LC A Dual-Core Mo4C-4: Winding and 208.8dBc/Hz Tertiary Switch-Less Tuning in 22nm FDSOI FoMT Peak Rebeiz; G.M. Diego; San of California, El-Aassar; Univ. O. San Diego of California, Univ. Mo4C: High-Performance Frequency- Components Generation Broadcom Mikhemar, Chair: Mohyee Samsung Wu, Co-Chair: Wanghua A 0.082mm² 24.5-to-28.3GHz Multi-LC-Tank Mo4C-1: Single- Separate Two VCO Using Fully-Differential Achieving Capacitor a 1D-Tuning Inductors and Turn 1/f³ PN Corner189.4dBc/Hz FOM and 200±50kHz of Chen; University Y. of Macau; Guo; University H. Martins; R.P. of Macau; Mak; University Macau; P.-I. of Macau University Multi-Ratio Injection- A 22.4-to-40.6-GHz Mo4C-2: Multiplier with 57.7-dBc Harmonic Frequency Locked Rejection Zhao; Liu; UESTC; C. UESTC; H. Peng; Y. Zhang; UESTC; J. Kang; UESTC K. UESTC; Wu; Y. UESTC; MONDAY, 22 JUNE | LACC 2020 | MONDAY, – 17:30 15:50 403A

Mo4B-3: A SiGe Millimeter-Wave Front-End for A SiGe Millimeter-Wave Mo4B-3: Remote Sensing and Imaging Tech Cressler; Georgia J.D. Tech; Frounchi; Georgia M. 50–500-GHz Coherent A Fully Integrated Mo4B-4: Frequency Comb Receiver for Broadband Sensing and Imaging Applications A. Angeles; Los of California, Univ. Razavian; S. Angeles Los of California, Babakhani; Univ. Mo4B-2: A High-Speed 390GHz BPOOK Transmitter in Transmitter 390GHz BPOOK A High-Speed Mo4B-2: 28nm CMOS Reynaert; P. Leuven; D’heer; Univ. Katholieke C. Leuven Univ. Katholieke Mo4B: Millimeter-Wave and Terahertz Circuits Circuits Terahertz and Mo4B: Millimeter-Wave for Sensing and Communications and Systems Davis of California, University Chair: Omeed Momeni, MIT Co-Chair: Ruonan Han, Source 132–147GHz Power An Integrated Mo4B-1: with +27dBm EIRP de Martino; Haag; KIT; C. A. IMEC; Visweswaran; A. T. Schneider; KIT; Delft; K. Universiteit Technische Vignon; IMEC; K. Erlangen-Nürnberg; B. Maiwald; FAU Technische M. Spirito; Technologies; Infineon Aufinger; IMEC Wambacq; Zwick; KIT; P. T. Delft; Universiteit

402AB TECHNICAL SESSIONS TECHNICAL

I. Bashir; Equal1 Labs; D. Leipold; Equal1 Labs; M. Leipold; Equal1 Labs; M. Bashir; Equal1 Labs; D. I. Dublin; College Univ. Esmailiyan; A. Asker; Equal1 Labs; Siriburanon; Univ. T. Dublin; College Univ. Wang; H. Dublin; College Giounanlis; Univ. Dublin; P. College Univ. Miceli; Dublin; D.A. College Koziol; Univ. A. Dublin; R.B. College Blokhina; Univ. Dublin; E. College Dublin College Univ. Staszewski; Mo4A-4: RF Clock Distribution System for a Scalable at Quantum Processor in 22-nm FDSOI Operating 3.8K Cryogenic Temperature Y. Chen; MediaTek; B. Xu; MediaTek; E. Lu; MediaTek; O. O. MediaTek; Lu; E. Xu; MediaTek; B. Chen; MediaTek; Y. Shana’a; MediaTek Mo4A-3: An Integrated True Zero-Wait-Time Dynamic Zero-Wait-Time True An Integrated Mo4A-3: Frequency Selection (DFS) Look-Ahead Scheme for WiFi-Radar Co-Existence System A. Paidimarri; IBM T.J. Watson Research Center; B. Research Center; B. Watson T.J. IBM Paidimarri; A. Research Center Watson T.J. Sadhu; IBM Mo4A-2: Spatio-Temporal Filtering: Precise Beam Mo4A-2: Spatio-Temporal Beam Switching Control Using Fast J. Kim; Samsung; J.M. Kim; Samsung; S. Han; Samsung; Kim; Samsung; S. J.M. Kim; Samsung; J. Kim; Samsung; Samsung; H. Dayal; Samsung; P. Vora; P. Lee; Samsung; Samsung; J. Yoon; D. Lee; Samsung; J. Song; Lu; Samsung; K.-B. Chang; Samsung; I.S.-C. T. Lee; Samsung J. Son; Samsung; Samsung; S.W. Mo4A-1: A Flexible Control and Calibration A Flexible Control and Calibration Mo4A-1: Millimeter- Using RISC-V MCU for 5G Architecture Transceivers Mobile RF Wave Rocco Tam, NXP Semiconductors Tam, Co-Chair: Rocco Renyuan Wang, BAE Systems BAE Wang, Chair: Renyuan

Mo4A: RFIC System and Applications II: Applications II: System and Mo4A: RFIC Wireless and Communication Wideband Quantum Computing RFIC LACC IMS2020

MONDAY WORKSHOPS 08:00 – 17:15 MONDAY, 22 JUNE 2020

Workshop Title Workshop Abstract WMA Enabling Technologies for Efficient Recently, major advances in analog front-ends for ultra-high speed wireless communication systems targeting Ultra-High Speed Wireless Communi- data rates towards 100Gbps have been demonstrated at high frequencies between 100 and 300GHz. In order to deliver this performance in a complete system to the end-user, they need to be integrated with very high cation Systems Towards 100Gb/s bandwidth baseband components, analog-to-digital converters and high-speed digital signal processors. Sponsor: IMS Substantial challenges need to be addressed, most notably high relative and absolute bandwidth, high Organizer: C. Carlowitz, FAU Erlan- frequencies at technological limits as well as low efficiency in terms of power consumption and system size. gen-Nürnberg; N. Kaneda, Nokia Bell Consequently, reconsidering central system architecture decisions from a holistic perspective can be beneficial Labs to achieve efficient implementations. Enabling technologies will be covered, including front-end designs in 08:00 – 17:15 different frequency ranges (75–300GHz), technologies (SiGe, InP, CMOS), with antenna to baseband integration, phased array / MIMO, synchronous sampling receivers / ADCs as well as efficient real-time basebands. WMB MONDAY Recent Advances in mm-Wave The amount of new radar based 3D sensing applications at mm-wave frequencies is continuously growing. The Circuits and Systems for Emerging radar sensors are used extensively almost everywhere to make the daily life more comfortable and safe. Driven by the demand for module size reduction, the operating frequencies of the radar modules keep on increasing, as Radar Sensing Applications one can integrate antennas in package or on chip and reduce the module size. The achievable compact module Sponsor: IMS; RFIC size, low DC power consumption and affordable price open up numerous opportunities for radar sensors to be Organizer: A. Hagelauer, Universität employed in a whole new range of applications. Thus, there is a growing interest in using radar sensors beyond Bayreuth; I. Nasr, Infineon Technologies; the classical applications, e.g. automotive radar or door openers. Recent advances in modulation techniques V. Issakov, OvG Universität Magdeburg and radar signal processing techniques in combination with MIMO radar arrays, enable achieving very high 08:00 – 17:15 spatial resolution for three-dimensional (3D) radar imaging. Hence, radar has become also a viable option for such emerging applications as wearable devices, robot-assisted surgery and many others. In this full-day workshop distinguished speakers from leading companies and academia will present the latest advances on a wide range of topics spanning from chip design, advanced system architectures and modulation techniques for emerging (non-automotive) radar applications, such as industrial, healthcare, UaV detection, smart presence detection and indoor people monitoring. The novel system architectures addressed in this workshop include e.g. reconfigurable transmitters towards software-defined radar, reconfigurable system on chip with power duty cycling using a finite state machine, radar interference detection and mitigation techniques, achieving high spatial resolution using a single radar sensor using delay lines and another using MIMO radar in combination with chirp modulation and frequency-division multiplexing. Additionally, physical implementation aspects are addressed by comparison of SOI CMOS versus SiGe technology for mm-wave radar realizations. Finally, design aspects of integrated antennas on-chip for radar applications is discussed. A brief concluding discussion will round-off the workshop to summarize the key learnings on the wide range of aspects presented during the day.

WMC Platforms, Trials, and Applications Emerging RF technologies for 5G, such as MIMO, scaled phased arrays, and mm-wave transceivers, have — The Next Step for 5G and Future reached a significant level of maturity enabling initial product deployments and standards completion. While RF-specific challenges remain, significant wireless R&D efforts around the world are now integrating the new RF Wireless Networks capabilities into end-to-end wireless networking platforms and application demonstrations. Such testbeds and Sponsor: IMS application proofs-of-concept (PoC) are key to accelerate the commercial deployment of 5G, augment its impact Organizer: A. Valdes-Garcia, IBM T.J. and value, and ultimately ignite the vision for what 6G may become. This workshop will present a comprehensive Watson Research Center; C. Fager, overview of multi-disciplinary efforts in the areas of advanced end-to-end platforms for wireless research, Chalmers University of Technology; emerging 5G trials, and testbeds for new radio concepts. Common themes in the workshop are (1) the Z. Chen, Dalhousie University enablement and execution of real-world wireless experimentation and (2) projects where emerging RF hardware 08:00 – 17:15 capabilities (such those provided by multi-antenna mm-wave systems) are a main differentiator. The expert speakers will present diverse perspectives on these topics including: university-led research, industry-lead research, government-academia collaborations, and deployments led by telecommunication equipment providers. The audience will gain a broad understanding of the challenges associated with incorporating RF hardware into these testbeds and performance results from platform-scale experimentation. Last, but not least, a common thread of discussion throughout the workshop, and particularly at the concluding panel, will be an initial set of requirements, concepts, and implementation challenges for 6G networks.

WME Wireless Power Transmission — Wireless Power Transmission (WPT) has gained a lot of attention over the past decade, and various applications Myths and Reality have been proposed, from low-power IoT device non-directive powering to beaming mm-waves for propulsion. Sponsor: IMS The goal of this workshop is to present a critical review of WPT applications, from very low-power to high-power ones, using kHz to GHz frequencies. Near-field inductive and capacitive power transfer in the kHz and low MHz Organizer: N.B. Carvalho, Universidade ISM bands will be first overviewed and then compared in the context of kW-level power for both stationary and de Aveiro; Z. Popovic, University of in-motion electric vehicles. Power transfer for implants will be discussed, and near-field compared to mid-field. Colorado Boulder Directive beaming for Space Solar Satellites will be overviewed in the context of existing demonstrations, and 08:00 – 17:15 roadblocks to real systems presented. Finally, non-directive far-field low-power Simultaneous Wireless Information and Power Transfer (SWIPT) will be addressed as a way to make 5G – Massive IoT a reality. The 5G – Massive Internet-of-Things (MIoT) vision calls for thousands of interconnected devices using a multitude of sensors to provide useful information. As a result, mechanical and electrical properties become important, such as conformal profile, compact size, flexibility, stretchability, or even biodegradable properties. The combination of wireless power transmission and information can be the solution to address the needs of Massive IoT, due to the simplicity of the circuit and the ability to minimize the usage of batteries or even completely eliminate them. 20 LACC IMS2020

MONDAY WORKSHOPS 08:00 – 17:15 MONDAY, 22 JUNE 2020

Workshop Abstract Workshop Title With the deployment of sub-6GHz 5G, a strong interest for power-efficient broadband amplifiers has emerged. Calibrated Testbeds for the WMF Multiple-input PAs such as (1) outphasing power amplifiers (OPA) operating in the Doherty-Chireix continuum, Characterization, Optimization and and (2) load-modulated balanced amplifiers (LMBA) appear to provide promising opportunities. This workshop will focus on the new types of calibrated testbeds, test equipment and associated control and measurement Linearization of Multi-Input Power techniques which have been developed for their characterization, optimization and linearization. The characteri- Amplifiers zation of multi-input power amplifiers introduces new challenges. The different RF sources need to be phase Sponsor: ARFTG IMS locked if they do not share the same local oscillator (LO). The modulation needs to be time synchronized. The Organizer: J.A. Reynoso-Hernández, testbed itself needs to be calibrated at its test ports for (1) power, (2) LO phase and (3) group delay. The CICESE; K. Rawat, IIT Roorkee measurements also need to consider reflections since multi-input PAs are exhibiting dynamically varying input 08:00 – 17:15 impedances. New types of test solutions are emerging to facilitate the characterization and linearization of multi-input PAs including: the use of multiport VNAs operated as multi-channel VSAs, the synchronization of modular instruments or the use of BIST (built-in self-test) combined with machine learning. In support of the workshop theme, two talks will also feature a review of the theory of multiple-input PAs such as OPA and LMBA MONDAY to establish the drive requirements, and one talk will address the linearization of multi-input PAs. Emphasis throughout the workshop will be placed on describing the various testbeds developed, their calibration, and their use for the characterization, optimization and linearization of multi-input power amplifiers.

Innovations in material science are crucial for the ongoing development of faster, high-throughput wireless Materials by Design for Microwave WMG communications at microwave and mm-wave frequencies. As communications systems advance into the and mm-Wave Communications mm-wave regime, low-loss materials are needed for fast, efficient, on-chip signal transmission. High-mobility Sponsor: IMS materials are required for energy-efficient transducers that enable small-cell-based platforms. New measure- ment methods and material testbeds are needed to understand nonlinearity and intermodulation. Tunable Organizer: N. Orloff, NIST; T.M. Wallis, materials are required for beam-forming applications and other reconfigurable systems. Materials-by-design NIST approaches to advanced materials offer the enticing possibility of engineering optimal property-performance 08:00 – 17:15 material relationships to meet these needs. Materials-by-design approaches can be applied across a wide variety of relevant systems, including ferrite ceramics, tunable oxides, perovskites, and novel nanomaterials. In the context of developing devices for wireless communications, materials-by-design can serve as the foundation of a multifaceted approach that includes materials engineering, materials and device modeling, measurements, and ultimate incorporation of material building blocks into microwave and mm-wave systems. This workshop will bring together researchers in all facets of this approach in the context of microwave and mm-wave communica- tions, serving as a bridge between what are sometimes disparate communities. Researchers in materials synthesis will contribute insight about materials design and optimization. Specifically, they will show how current state-of-the art, first-principles calculations can now be used to accurately predict yet-to-be-synthesized compounds with superior, application-specific functionalities. From there, experts in microwave and mm-wave modeling will show how devices based on new materials can be designed and validated with computational and analytical approaches. For example, tunable metal oxides provide a rich testbed that illustrates how ab initio, multi-physics modeling can enable design and validation with novel material systems by quantifying fundamen- tal, frequency-dependent properties such as conductivity, permittivity, and permeability. Transitioning from numerical and analytical modeling to practical measurements, microwave and mm-wave metrologists will describe methods for characterization of materials, both as free-standing systems and as integrated building blocks within devices. In one case, nonlinear, on-chip measurements of thin films will serve to illustrate how measurements can enable optimized performance in communications devices. In another case, microwave microscopy will be introduced as a tool for local microwave characterization of materials with nanoscale spatial resolution. Finally, device and systems engineers will bring these aspects together to illustrate the ultimate incorporation of novel materials into practical wireless communications devices. Practical applications that will be covered in this workshop include reconfigurable mm-wave antennas, non-reciprocal devices based on magnetic heterostructures, and bulk acoustic wave (BAW) filters.

Advanced Microwave and mm-Wave WMH The workshop will discuss the advanced microwave and mm-wave techniques and technologies for 5G wireless communication applications. These include system and transceiver architectures including software-defined Techniques and Technologies for 5G phased array radio, recent advances and different techniques and technologies in designing power amplifiers, Applications switches, low-noise amplifiers and filters in both sub-6GHz and mm-wave 5G frequency bandwidths. This Sponsor: IMS; RFIC workshop brings together the experts of both bulk CMOS, SOI CMOS, GaN HEMT and other technologies to Organizer: A. Grebennikov, Sumitomo explain the advantages and proper choice of certain technology to design different active and passive Electric Europe; F. Balteanu, Skyworks components of 5G front-ends and transceivers. Specifically, efficient transmitter design using advanced Doherty Solutions techniques for base station and sub-6GHz front-end modules using envelope-tracking techniques for handset 08:00 – 17:15 applications will be discussed.

21

2020 S IM

MONDAY, 22 JUNE 2020 MONDAY, MONDAY, 22 JUNE 2020 MONDAY, Course Syllabus This full day course will cover real-world, practical, modern design and practical, real-world, course will cover This full day engineers, new technicians, engineering fundamentals needed by and marketing well as students, college engineers wanting a refresh, Experts within industrysales professionals. and academia will share simulation and systems basics, of: RF/Microwave their knowledge antenna microwave and spectrum network analysis, design, network Attendees completing the course will earn 2 CEUs. and radar basics. – 17:00 12:00 LACC LACC 16:45 – 08:00

In this lecture, we will discuss the nature and properties of oscillators and the general behavior of the phase noise. of the behavior properties discuss the nature and will general of oscillators and the we In this lecture, In particular, the resultant design insights. noise in oscillators and to model the phase methods then investigate We will use We a time-varying on the impulse sensitivity function (ISF). model of noise in oscillators based develop we - the effect of cyclostation 1/f noise, of importantthis model to describe some such as up-conversion phenomena will look at the We impact of correlatedary and the noise and their associated design implications. noise source, we will injection locking and puling and finally of the approach to model oscillator generalization developed newly designs examples of oscillators. look at several At mixers and oscillators. blocks in RF systems along with amplifiers, filters are one of the basic building Microwave Luckily, expert. you are not a filter design though even be called on to design or specify a filter, may you some point, can be applied to It for narrow band filters that is easy to learnthere is simple design method universal. and quite the method and, technology manufacturing except SAW-BAW, lumped element or distributed topology and any any “no math” This technical lecture is a or more. from a fraction of a percent up to 20 percent for bandwidths is valid filter synthesis tech- of complex no knowledge and that requires only simple algebra approach to filter design accuracy and method with the addition of EM simulation for on Dishal’s is based root of the design flow The niques. cross-cou- design method can also be expanded to include The basic geometry. port tuning for updates to the filter The first is a been prepared for this technical lecture. have examples design flow Two pled filters and multiplexers. Example project and the second is a microstrip combline bandpass filter. combline bandpass filter high Q cavity to attendees. available files will be made

Lecture TitleLecture BOOTCAMP Daniel Swanson, DGS Speaker: Daniel Swanson, LLC Associates, 13:30 – 17:00 Ali Hajimiri, Caltech Ali Hajimiri, Speaker: 12:00 – 13:30 Intuitive Microwave Filter Design with EM Simulation Understanding Oscillator Phase Understanding Noise and Locking his one day course is ideal for newcomers to the microwave to the microwave course is ideal for newcomers his one day world, such as technicians, new engineers, college students, college engineers, new such as technicians, world, as marketing as well engineers changing their career path,

TMA1 TMB2 The RF/Microwave Signal Chain The RF/Microwave Network Characteristics, Analysis and Measurement Network Characteristics, Fundamentals of RF Simulation Impedance Matching Basics Spectral Analysis Spectral and Receiver Technology RF Signal Generation Modulation and Vector Signal Analysis Antenna Basics Microwave RFMW Application Focus and sales professionals looking to become more comfortableand sales professionals looking to become in circuit and system RF & Microwave customer interactions involving concepts and terminology. The format or of the RF Boot Camp is similar to that of a workshop with multiple presenters from industryshort course, and academia of topics including: presenting on a variety

MONDAY LECTURES TECHNICAL T

MONDAY 22 MONDAY 23

20 20 S IM MONDAY, 22 JUNE 2020 MONDAY, BAE Systems, USA; BAE Systems, – 13:15 12:00 LACC

Washington University, USA University, Washington ; Chris Rudell, France Bordeaux University, Co-Founder & CEO, Co-Founder & CEO, Laskar, USA; Joy Technology, Tagore Founder & CEO, Joseph Cali, USA; Joseph Semiconductors, Apogee

PANEL SESSION PANEL

any successful software startup companies of recent years were able to launch their product via the internet quickly and relatively were successful software startup companies of recent years any of these have Many product. hardware a physical delivering effortlessly reached a high number of users without ever appeared to have “unicorn”. as a qualifying thereby of $1B, a valuation exceeded even

Co-Founder & CEO, CoreHW, Finland CoreHW, Co-Founder & CEO, ABSTRACT: Tomi-Pekka Takalo, Takalo, Belgium; Tomi-Pekka IC, Tusk Co-Founder & CEO, Steyaert, USA; Wouter Maja Systems,

Amitava Das, Amitava PANELISTS: Oren Eliezer, PANEL ORGANIZERS AND MODERATORS: AND ORGANIZERS PANEL HW Startups an Oxymoron? Longer — No

Come and share your own experiences, opinion and questions! opinion experiences, own Come and share your the chances of success are for an RFIC startup. The panel will try to answer questions such as whether the development of RFICs will soon be done only in the existing large companies and what companies and what only in the existing large of RFICs will soon be done the development The panel will try questions such as whether to answer strategies they had, and what challenges they have been facing. been have they challenges and what had, strategies they to bootstrap the activity from a funding point of view, what led them to believe that they can compete in a given market, what business and exit business and exit what market, in a given can compete that they them to believe led what of view, to bootstrap the activity from a funding point In this lunchtime panel several entrepreneurs, at different levels of the maturity of their companies, will share their experiences: how they were able were they will share their experiences: how of the maturity of their companies, at different levels entrepreneurs, In this lunchtime panel several becoming more difficult to attract young talent into this field. becoming more difficult to attract RFIC entrepreneurs nowadays seem be challenged with competing over the attention and funds of potential investors, and it is apparently also the attention and funds of potential investors, with competing over seem be challenged RFIC entrepreneurs nowadays IC fabrication, measurement equipment and marketing and delivery measurement equipment and marketing logistics. IC fabrication, In contrast, RFIC companies experience long and costly development and productization cycles, due to the high costs of the personnel, CAD tools, due to the high costs of the personnel, and productization cycles, RFIC companies experience long and costly development In contrast,

Francois Rivet, Francois M

RFIC RFIC

2020 S IM MONDAY, 22 JUNE 2020 MONDAY, Development, Development, – 19:00 17:30

alf the planet is now online. Great news – at least for those who can connect. But what of the rest? 3.6 billion of the rest? But what can connect. – at least for those who Great news online. alf the planet is now digital no other technology Like before, for granted. the rest of us take cut-off from a world people remain totally can They barriers. traditional development to overcome unprecedented power platforms apps have and devices, bring education where there are no teachers, health advice where there are no doctors, financial services arewhere there there are no doctors, where health advice there are no teachers, bring education where there are no books. libraries where no banks, But its transformational potential will be magnified 1,000 times in the hands of our world. The Internet has changed Digital is the transformational force of information. through lack of access to the power people held back for generations the UN pledge In short, date of 2030. the target Goals by Development that will enable us to meet the 17 UN Sustainable ABSTRACT: the Board and Chief Executive Officer, Viasat, Inc. Viasat, Officer, Chairman of the Board and Chief Executive Mark Dankberg,

H PLENARY SESSION PLENARY

to ‘Leave No-one Behind’ will mean getting everyone online. everyone will mean getting No-one Behind’ ‘Leave to Africa and literacy and digital skills are in short infrastructure supply? In is lacking, incomes are low, where that happen in markets make do we How The situation can look an estimated US$9 billion in investment. people online and will mean bringing 220 million new connecting the continent alone, opportunity a great forThe interrelatedness provides of the SDGs the picture. paradigm shift can dramatically change but sometimes a simple bleak, access Coupled with policy approaches that prioritize digital skills and promote within and across institutions. common approaches and integration and affordability, the power of digital could just turn out to be the power to change the world. to change could just turn of digital out to be the power the power and affordability, PLENARY 2 SPEAKER PLENARY International Telecommunication Union International Telecommunication Can Digital Technologies Really Change the World? the Really Change Technologies Can Digital Telecommunication Director, Doreen Bogdan-Martin, PLENARY SPEAKER 1 SPEAKER PLENARY LACC IMS

MONDAY 24

TUESDAY 25

20 20 S IM

TUESDAY, 23 JUNE 2020 JUNE 23 TUESDAY,

Tuesday Tuesday

Late Breaking News

409AB Tu1H-3: Computationally Efficient Tu1H-3: Performance-Driven Surrogate Components Modeling of Microwave Analysis Using Principal Component University; Koziel; Reykjavik S. Gdansk Pietrenko-Dabrowska; A. Bandler; J.W. Technology; of University McMaster Univ. Design of SIW Filters in Tu1H-4: Nets D-Band Using Invertible Neural Georgia Torun; H.M. Yu; Georgia Tech; H. Tech; Rehman; Georgia M.U. Tech; Tech Swaminathan; Georgia M. Inductor Automated Spiral Tu1H-5: PI Network with a Calibrated Design by Manifold Mapping Technique of Li; Univ. of Regina; S. Univ. Fan; X. of Regina; Univ. Laforge; Regina; P.D. ITESO Rayas-Sánchez; J.E. Tu1H: Advances in RF and in RF Advances Tu1H: CAD Techniques Microwave Massachusetts College Chair: Erin Kiley, of ArtsLiberal ITESO - Co-Chair: Rayas-Sanchez, Jose of Guadalajara University The Jesuit Tu1H-1: Variability High-Dimensional Space Analysis via Parameters Partitioning Ferranti; IMT F. Carleton Univ.; Tao; Y. Nakhla; Carleton Univ. Atlantique; M. Training Adaptively Weighted Tu1H-2: of Space-Mapping Surrogates for Yield Estimation of Microwave Accurate Components Feng; Carleton F. Tianjin Univ.; Zhang; J. Technology; of Univ. Na; Beijing W. Univ.; Zhang; Carleton Q.J. Tianjin Univ.; Jin; J. Univ. Cheng; SUSTech Q.S. . An Objective Function Tu1H-6: Parameter Formulation for Circuit Based on the Kullback- Extraction Leibler Distance Loera-Díaz; ITESO; R. Focus & Special Sessions

408B Emerging Technologies Emerging Technologies & Applications Tu1G: Innovative RF Switches and RF Innovative Tu1G: Applications of South University Wang, Chair: Guoan Carolina Air Force US Co-Chair: Ebel, John Research Laboratory Tu1G-3: Fully Printed VO2 Switch BasedVO2 Fully Printed Tu1G-3: Filter Flexible and Reconfigurable Vaseem; M. Li; KAUST; W. KAUST; Yang; S. Shamim; KAUST A. KAUST; Miniaturized Reconfigurable Tu1G-4: 28GHz PCM-Based 4-Bit Latching Attenuator for 5G mmWave Variable Applications Mansour; R.R. Waterloo; of Univ. Singh; T. of Waterloo Univ. of Monolithic Integration Tu1G-5: RF Switches in a Phase-Change Production SiGe BiCMOS Process Demonstrations with RF Circuit Semiconductor; Tower Slovin; G. Tu1G-1: RF-MEMS Switched Capacitor RF-MEMS Switched Tu1G-1: Electrodes Using Ta/Ta2O5 XLIM (UMR 7252); Orlianges; J.-C. Laouini; XLIM (UMR 7252); C. M. Blondy; P. Hallepee; XLIM (UMR 7252); XLIM (UMR 7252) FCO (6.3 fsA 25THz Tu1G-2: Material Phase-Change RON*C_OFF) Volume in a High RF Switch Fabricated withManufacturing Environment Times Cycling > 1 Billion Demonstrated Semiconductor; Tower El-Hinnawy; N. Rose; Semiconductor; J. Tower Slovin; G. Tower Howard; Semiconductor; D. Tower Semiconductor Semiconductor; Tower El-Hinnawy; N. Rose; Semiconductor; J. Tower Masse; C. Tower Howard; Semiconductor; D. Tower Semiconductor TUESDAY, 23 JUNE 23 LACC | 2020 TUESDAY, | 09:40 – 08:00

Systems & Applications

408A Active Components Tu1F-5: An Enhanced Large-Power An Enhanced Large-Power Tu1F-5: Magnetron S-Band Injection-Locked Ripple with Anode Voltage Inhibition Yang; B. Chen; Sichuan Univ.; X. Tu1F-4: A 2.3kW 80% Efficiency SingleA 2.3kW Tu1F-4: Amplifier forGaN Transistor 400.8MHz and UHF Radar Accelerators Particle Systems Technologies; Formicone; Integra G. Technologies Custer; Integra J. Zhao; Sichuan Univ.; X. Univ.; Kyoto Liu; C. Univ.; Shinohara; Kyoto N. Sichuan Univ. Tu1F-2: An Over 230W, 0.5–2.1GHz Over 230W, An Tu1F-2: Amplifier Using Wideband GaN Power Transmission-Line-Transformer-Based Combining Technique Sato; Niida; Fujitsu Laboratories; M. Y. Nishimori; Fujitsu Fujitsu Laboratories; M. Laboratories; Ohki; Fujitsu T. Laboratories; Laboratories Nakamura; Fujitsu N. Compact and Highly Efficient Tu1F-3: Amplifier at Lumped Push-Pull Power Level with Quasi-Static Drain Kilowatt Supply Modulation Dancila; D. Uppsala Univ.; Tong; R. Uppsala Univ. Tu1F: High Power Amplifiers for HF Amplifiers for High Power Tu1F: Through S Band Inc. QORVO, Chair: Marc Franco, Villanova Co-Chair: Robert Caverly, University Coaxial Series-Combined Tu1F-1: PowerDielectric Resonator Class-F Amplifier System Ophir RF; Wang; Beltran; Ophir RF; F. R.A. Villagrana; Ophir RF G.

Passive Components 406AB

Tu1E-5: Small-Scale Beam Scanning Tu1E-5: High Impedance with an Ultrathin Antenna Surface-Based Leaky Wave with Multiple Feeds of South Univ. Tanmoy; M.M.R.H. of South Latif; Univ. Alabama; S.I. of Almutawa; Univ. Alabama; A.T. Capolino; Univ. Irvine;California, F. of California, Irvineof California, Tu1E-3: Partially-Air-Filled Slow-Wave Partially-Air-Filled Slow-Wave Tu1E-3: Waveguide Substrate Integrated in Metallic Nanowire Membrane Technology Corsi; RFIC-Lab (EA 7520); J. Rehder; de São Paulo; Universidade G.P. de São Gomes; Universidade L.G. Serrano; A.L.C. Bertrand; L2E; M. Paulo; Pistono; E. de São Paulo; Universidade Ferrari; RFIC-Lab RFIC-Lab (EA 7520); P. (EA 7520) Dan Jiao, Purdue University Chair: Dan Jiao, Inc. ANSYS, Co-Chair: Thiel, Werner Polarization Linear-to-Circular Tu1E-1: Converter Based on Stacked Metasurfaces Aperturewith Coupling Interlayer Angeles; Los of California, Univ. Tao; C. Tu1E: Novel Components, Novel Components, Tu1E: and Methods for Waveguides, Radiating Structures of California, Univ. Papathanasopoulos; A. of California, Itoh; Univ. T. Angeles; Los Los Angeles Tu1E-4: The Transition Between The Transition Tu1E-4: for Radiative and Reactive Region in Leaky Waves Planar Waveguiding Structures di Roma Università Fuscaldo; W. Burghignoli; Università “La Sapienza”; P. Galli; A. “La Sapienza”; di Roma “La Sapienza” di Roma Università Tu1E-2: A Coupled Pair of Anti- of Pair A Coupled Tu1E-2: Symmetrically Nonreciprocal Composite Right/Left-Handed Metamaterial Lines Technology; Institute of Ueda; Kyoto T. Institute of Kyoto Yamagami; K. of California, Itoh; Univ. T. Technology; Los Angeles TECHNICAL SESSIONS TECHNICAL

08:00 08:10 08:20 08:30 08:40 08:50 09:00 09:10 09:20 09:30 09:40

Microwave Field, Device & Circuit Techniques Device & Circuit Microwave Field, IMS

TUESDAY 26 TUESDAY 27

08:00 08:10 08:20 08:30 08:40 08:50 09:00 09:10 09:20 09:30 09:40

404AB M. Elsayed; RWTH Aachen Univ.; Aachen Univ.; RWTH Elsayed; M. Aachen Univ. RWTH Negra; R. 5000× Load FOM, A Sub-10fs Tu1D-3: Driving Capacity and 5mV Output Ripple Digital LDO with Dual-Mode Detector and Dead- Voltage Nonlinear Pump Loop Zone Charge Rhee; W. Tsinghua Wang; Univ.; B. Tsinghua Univ. Wang; Z. Tsinghua Univ.; 7-Bit CMOSA 32–40GHz Tu1D-4: Phase Shifter with 0.38dB/1.6° RMS Magnitude/Phase Errors for Phased Systems Array Lv; W. Duan; ECRIEE; Li; USTC; Z. Y. Xie; USTC; USTC; Z. Pan; ECRIEE; D. Sun; USTC Dai; ECRIEE; L. Y. Tu1D: Mixed-Signal and Power Mixed-Signal and Power Tu1D: for RF Techniques Management Transceivers IEMN Frappé, Antoine Chair: (UMR 8520) Co-Chair: Bahar Jalali Farahani, DAC-Based Fourier-Domain Tu1D-1: the Towards New Concepts Transmitter: Wireless Realisation of Multigigabit Transmitters Aachen Univ.; RWTH Hanay; O. Univ.; Aachen RWTH Bayram; E. Aachen Univ.; Müller; RWTH S. VIN Slope- 40V A 10MHz Tu1D-2: Gaussian Gate Driven Reconfigurable GaN DC-DC Converter 49.1dB with Conducted EMI Noise Reduction at 100MHz Southern Methodist Univ.; Yang; C. Chen; Southern Methodist Univ.; W. Texas Fan; Instruments; Y. Da; Texas W. Gui; Southern Methodist Instruments; P. Univ. Cisco Systems

403B Tu1C-3: PreservingTu1C-3: Modulated Polar Amplifier Linearity Class-E Power Under Load Mismatch Pilani; Khodkumbhe; BITS A. Twente; of Huiskamp; Univ. M. Twente; of Ghahremani; Univ. A. Annema; A.-J. of Twente; Nauta; B. Univ. of Twente Univ. A Tu1C-4: 28GHz Voltage-Combined Amplifier with a Doherty Power OutputCompact Transformer-Based Combiner in 22nm FD-SOI IMEC; K. Tang; Zong; IMEC; X. Z. IMEC; G. Yan; Khalaf; Pharrowtech; D. Liu; Y. IMEC; Nguyen; IMEC; J. Mangraviti; IMEC Wambacq; IMEC; P. A 6GHz 160MHz Bandwidth Tu1C-5: MU-MIMO Eight-Element Direct Digital TX Utilizing FIR H-Bridge Beamforming DAC Jie; L. of Michigan; Zheng; Univ. B. of Univ. Wang; R. of Michigan; Univ. of Michigan Flynn; Univ. M.P. Michigan; Tu1C-1: A 1–3GHz I/Q Interleaved Tu1C-1: as a DriverDirect-Digital RF Modulator in 40nm CMOS for a Common-Gate PA Delft; Universiteit Technische Shen; Y. Universiteit Technische Bootsman; R. Universiteit Technische Alavi; Delft; M.S. Delft; L.C.N. Technische de Vreede; Delft Universiteit A Tu1C-2: 1.3V Wideband RF-PWM Employing Cartesian Transmitter Analog Outphasing and a Switched- Capacitor Class-D Output Stage V Austin; at Texas of Kang; Univ. H. Austin; at Texas of Univ. Rayudu; .S. Austin; at Texas of Kim; Univ. K.Y. Austin at Texas of Univ. Gharpurey; R. Tu1C: Linearization and Efficiency Linearization and Efficiency Tu1C: Techniques Enhancement NXP Chair: Szymanowski, Margaret Semiconductors Neuralink Co-Chair: Chung, Sungwon TUESDAY, 23 JUNE 23 LACC | 2020 TUESDAY, | 09:40 – 08:00

403A Tu1B-4: A 2.5-to-4.5-GHz Switched- A 2.5-to-4.5-GHz Tu1B-4: LC-Mixer-First Acoustic-Filtering RF +30dBm Achieving <6dB NF, Front-End IIP3 at 1×Bandwidth Offset of Illinois at Urbana- Seo; Univ. H. of Illinois at Zhou; Univ. Champaign; J. Urbana-Champaign Tu1B-2: 10–35GHz Passive Mixer-First 10–35GHz Passive Tu1B-2: +14dBm In-BandAchieving Receiver Arrays IIP3 for Digital Beam-Forming of California, Univ. Krishnamurthy; S. of Niknejad; Univ. A.M. Berkeley; Berkeley California, 65nm CMOS Down- A 9–31GHz Tu1B-3: Converter B1dB with >4dBm OOB Molnar; A. Cornell Univ.; Boynton; Z.G. Cornell Univ. Tu1B: 5G Focus Session on 5G Focus Tu1B: in Mixer-First Receivers Advances of University Chair: Ramesh Harjani, Minnesota Co-Chair: Harish Krishnaswamy, Columbia University Mixer-First Receiver mm-Wave Tu1B-1: Filter Elliptic Low-Pass with Passive of Southern California; Song; Univ. P. of Southern California Hashemi; Univ. H.

TECHNICAL SESSIONS TECHNICAL 402AB

M.W. Mansha; Rensselaer Polytechnic Rensselaer Polytechnic Mansha; M.W. Hella; Rensselaer Institute; M. Institute Polytechnic Tu1A-5: A 7.4dBm EIRP, 20.2% DC- A 7.4dBm EIRP, Tu1A-5: EIRP Efficiency 148GHz Coupled Loop Antenna in Oscillator with Multi-Feed 22nm FD-SOI B. Philippe; Katholieke Univ. Leuven; P Leuven; Univ. Philippe; Katholieke B. Leuven Univ. Reynaert; Katholieke . Tu1A-4: A 126GHz, 22.5% Tuning, A Tu1A-4: 126GHz, 22.5% Tuning, 191dBc/Hz FOMt 3rd Harmonic Class-F Oscillator for D-Band Extracted Applications in 16nm FinFET B. Blampey; CEA-LETI; A. Boulmirat; A. CEA-LETI; Blampey; B. A. Siligaris; CEA-LETI; J.L. Gonzalez- CEA-LETI; J.L. Siligaris; A. CEA-LETI; Jany; Jimenez; CEA-LETI; C. Tu1A-3: A Multichannel Programmable Programmable A Multichannel Tu1A-3: High Order Frequency Multiplier for Channel Bonding and Full Duplex at 60GHz Band Transceivers CEA-LETI; A. Hamani; CEA-LETI; C. Hamani; CEA-LETI; C. A. CEA-LETI; Dehos; CEA-LETI S.G. Rao; Georgia Tech; M. Frounchi; M. Tech; Rao; Georgia S.G. Tech Cressler; Georgia J.D. Tech; Georgia Tu1A-2: A D-Band SiGe FrequencyA D-Band Tu1A-2: Doubler with a Harmonic Reflector Balun Triaxial Embedded in a P. Stärke; Technische Universität Universität Technische Stärke; P. Universität Rieß; Technische Dresden; V. Universität Technische Carta; Dresden; C. Technische Ellinger; Dresden; F. Dresden Universität Tu1A-1: Frequency Multiplier-by-4 Frequency Multiplier-by-4 Tu1A-1: (Quadrupler) with 52dB Spurious-Free for 152GHz to 220GHz Dynamic Range (G-Band) in 130nm SiGe - STMicroelec Cathelin, Andreia Co-Chair: tronicsy Ehsan Afshari, University of University Afshari, Chair: Ehsan Michigan Tu1A: mmWave Signal Generation Signal mmWave Tu1A: RFIC

Late Breaking News 409AB Tu2H: Advances Advances in Tu2H: Modeling Electromagnetic Techniques Dalhousie Chair: Chen, Zhizhang David University di Politecnico Co-Chair: Marco Pirola, Torino Tu2H-3: Multiphysics Sensitivity Multiphysics Tu2H-3: Analysis in FDTD Based Simulations Electromagnetic-Thermal Sarris; Liu; Intel; C.D. K.-A. of Toronto Univ. for the Technique The Entropy Tu2H-5: Time-Reversal Reconstruction Source Feng; Dalhousie University; X.-Y. Liang; J.-C. Chen; Dalhousie University; Z. Southeast Univ. Tu2H-1: Surface-Volume-Surface EFIE Surface-Volume-Surface Tu2H-1: Circuits Analysis of 3-D Microwave for with Finite Substrates in Multilayered Dielectric Inclusions Gholami; of Manitoba; R. Zheng; Univ. S. Univ. Okhmatovski; V. of Manitoba; Univ. of Manitoba Tu2H-4: Application of ConformalApplication Tu2H-4: of 2D Validation Mapping to Rigorous Coupled EM-CFD Modelling of Univ. Warsaw Wilczynski; K. Olszewska-Placha; M. Technology; Celuch; QWED QWED; M. Tu2H-2: A Volume A Volume Current Tu2H-2: Based Analysis of Method of Moments in Layered Shielded Planar 3-D Circuits Media Thelen; Rautio; Sonnet Software; M. J.C. Sonnet Software Focus & Special Sessions

408B Emerging Technologies Emerging Technologies & Applications Tu2G: Filters on Based Tu2G: Acoustic Micro-machined or StructuresElectromagnetic of University Hagelauer, Amelie Chair: Bayreuth ofCo-Chair: University Songbin Gong, Illinois at Urbana-Champaign Tu2G-3: An Intrinsically SwitchableAn Tu2G-3: FBAR FilterBalanced Ferroelectric at 2GHz of Michigan; Zolfagharloo Koohi; Univ. M. Mortazawi; A. of Michigan; Univ. Peng; W. of Michigan Univ. W-Band Tu2G-4: Micro-Fabricated Filters Band-Pass Waveguide Jguirim; XLIM (UMR 7252); N. XLIM (UMR 7252); Dalmay; C. XLIM (UMR 7252); Passerieux; D. Acoustic Suppression of Tu2G-5: Resonances in All-Oxide Varactors Darmstadt; Univ. Technische Walk; D. Univ. Technische Kienemund; D. Univ. Technische Agrawal; Darmstadt; P. Univ. Technische Salg; Darmstadt; P. Univ. Technische Zeinar;Darmstadt; L. Technische Komissinskiy; Darmstadt; P. Univ. Technische Alff; Darmstadt; L. Univ. Univ. Technische Jakoby; Darmstadt; R. Univ. Technische Maune; Darmstadt; H. Darmstadt Tu2G-1: High-Q Bandpass-to-Bandstop Tu2G-1: on SAWReconfigurable Filter Based Resonators Zhou; USTC; L. Sheng; Chen; USTC; Q. R. Zhang; UMass Chen; USTC; H. USTC; C. Lowell Microfabrication of a Tu2G-2: Half- Miniaturized Monolithic Folded for Cavity Waveguide Mode Integrated W-Band Applications Alberta; of Univ. Jones; T.R. Alberta of Univ. Daneshmand; M. (UMR 7252) XLIM Blondy; P. TUESDAY, 23 JUNE 23 | LACC 2020 TUESDAY, | – 11:50 10:10

Systems & Applications

408A Active Components Tu2F: Power Amplifiers for S and Amplifiers for S and Power Tu2F: C Band di Politecnico VittorioChair: Camarchia, Torino NXP Co-Chair: Damon Holmes, Semiconductors of Electro-Communications; R. Ishikawa; Ishikawa; of Electro-Communications; R. of Electro-Communications; Univ. Filtering Class-F Integrated Tu2F-4: Amplifier Based on Microstrip Power Multimode Resonator Zhou; CityU; Zhou; CityU; X.Y. L.-H. College Univ. Pang; Chan; CityU; J. W.S. Ho; CityU Dublin; D. Tu2F-2: A 3.9-GHz-Band OutphasingA 3.9-GHz-Band Tu2F-2: Amplifier with Compact Power Combiner Based on Dual-Power-Level Design for Wide-Dynamic-Range Operation of Electro- Univ. Ogasawara; R. Univ. Takayama; Communications; Y. of Electro-Communications Honjo; Univ. K. Co-Designed High-Efficiency Tu2F-3: Amplifier GaN Filter Power of Colorado Estrada; University J.A. Autònoma Univ. de Paco; Boulder; P. University Johannes; de Barcelona; S. Psychogiou; of Colorado Boulder; D. of Colorado Boulder;University Z. of Colorado Boulder University Popovic; Tu2F-1: Optimal Supply Voltage for PA for PA Voltage Optimal Supply Tu2F-1: CorrectionOutput Power Under Load Scenarios Varying Instituto de Gonçalves; C.F. Barradas; F.M. Telecomunicações; L.C. Telecomunicações; Instituto de Telecomunicações; Nunes; Instituto de Cabral; Instituto de P.M. Instituto Pedro; J.C. Telecomunicações; de Telecomunicações

Passive Components

406AB

Tu2E-2: Terahertz Through Generation Terahertz Tu2E-2: Bias-Free Telecommunication Compatible Photoconductive Nanoantennas Over a 5THz Radiation Bandwidth Angeles; Los of California, Univ. Turan; D. Los of California, Univ. Yardimci; N.T. of California, Lu; Univ. P.K. Angeles; of Jarrahi; Univ. M. Angeles; Los California, Los Angeles Self-Adaptive Bandpass Filter Application to a Frequency and its Set-On Oscillator of Cyprus; Charalambous; Univ. G. of Cyprus Iezekiel; Univ. S. Tu2E-6: Microwave Photonic Microwave Tu2E-6: Mona Jarrahi, University of Chair: University Mona Jarrahi, California, Los Angeles Universita Co-Chair: Luca Pierantoni, delle Marche Politecnica Tu2E: Advances in Microwave in Microwave Advances Tu2E: and Photonics Terhertz to Nanotechnology K. Haddadi; IEMN (UMR 8520) Haddadi; IEMN K. Covert Photonics-Enabled Tu2E-5: Transmitter Millimeter-Wave Hopkins Johns Siman-Tov; E. Hopkins Johns Kalkavage; J.H. Univ.; Juarez; General Dynamics; J.C. Univ.; Tu2E-3: A 63-Pixel Plasmonic Photo­ A 63-Pixel Tu2E-3: Array Focal-Plane conductive Terahertz Angeles; Los of California, Li; Univ. X. Angeles Los of California, Jarrahi; Univ. M. of Near-Field Scan­ Operation Tu2E-4: up Microscopy ning Millimeter-Wave to 67GHz Under Scanning Electron VisionMicroscopy IEMN (UMR 8520); Polovodov; P. Avramovic; Théron; Eliet; V. S. D. Dambrine; Deresmes; G. D. Boyaval; C. Hopkins Univ. Coleman; Johns D.M. Tu2E-1: High-Sensitivity Plasmonic High-Sensitivity Tu2E-1: Detector Photoconductive Terahertz Ytterbium- a Femtosecond Driven by Doped Fiber Laser Angeles; Los of California, Univ. Turan; D. Los of California, Univ. Yardimci; N.T. of California, Jarrahi; Univ. M. Angeles; Los Angeles TECHNICAL SESSIONS TECHNICAL

10:10 10:20 10:30 10:40 10:50 11:00 11:10 11:20 11:30 11:40 11:50

Microwave Field, Device & Circuit Techniques Device & Circuit Microwave Field, IMS

TUESDAY 28 TUESDAY 29

10:10 10:20 10:30 10:40 10:50 11:00 11:10 11:20 11:30 11:40 11:50 403B Tu2C-5: A 0.08mm² 1–6.2GHz Receiver Front-End with Tu2C-5: Balun-LNA Inverter-Based Shunt-Feedback Università Prevedelli; D. Guo; Chengdu University; B. Manstretta; D. di Pavia; Castello; Università R. di Pavia; di Pavia Università Tu2C-3: A 5–6GHz Low-Noise Amplifier with >65- Low-Noise A 5–6GHz Tu2C-3: FinFET Control in 22nm CMOS Variable-Gain dB Technology Lee; Intel Intel; H.-J. Yeh; Y.-S. Amplifier A Wideband Variable-Gain withTu2C-4: a in 40-nm CMOS Exponential Generation Negative Technology Liu; NTU; Boon; NTU; Z. Kong; NTU; C.C. Dong; NTU; L. Y. Zhou; NTU A. NTU; Yang; Li; NTU; K. C. Tu2C: Sub-6 GHz Receiver Front-End Circuits Circuits Sub-6 GHz Receiver Front-End Tu2C: A&M University Texas Chair: Kamran Entesari, Co-Chair: Gary Qualcomm Hau, Wide-Band RF Front-End Module for 5G A Tu2C-1: mMIMO Applications Malladi; NXP V.N.K. Fraser; NXP Semiconductors; M. Staudinger; NXP Semiconductors; Semiconductors; J. Chang; NXP Semiconductors C.-W. Amplifier with 60dB 5.5GHz Low-Noise A 1.2V, Tu2C-2: and Aggregation On-Chip Selectivity for Uplink Carrier 1.3dB NF Leitner; T. Technologies; Schrögendorfer; Infineon D. Technologies Infineon

TUESDAY, 23 JUNE 23 | LACC 2020 TUESDAY, | – 11:50 10:10 403A

Tu2B-5: Inter-Stream Loopback Calibration for 5G Inter-Stream Loopback Calibration Tu2B-5: Systems Phased-Array Hwang; Y. Kim; Samsung; Y. Aoki; Samsung; Y. Dao; Samsung; Kim; Samsung; M.T. Samsung; S. Kang; Minn; Samsung; H. Kang; Samsung; D. D. Ryu; Samsung; A.-S. Samsung; Park; Samsung; H.-C. Samsung Yang; S.-G. Samsung; Jeon; S. Tu2B-3: A 24–28GHz Power and Area Efficient and Power A 24–28GHz Tu2B-3: Front-End Transceiver 4-Element Phased-Array Peak/OP1dB Transmitter with 21.1%/16.6% Supporting 2.4Gb/s in 256-QAM for 5-G PAE Communications Lv; W. Tsinghua Wang; Univ.; Zhu; Tsinghua J. Univ.; W. Zhu; Y. Liao; ECRIEE; B. Rice Univ.; Zhang; ECRIEE; X. Tsinghua Wang; Univ. ECRIEE; Y. with Transceiver Ka-Band SATCOM A CMOS Tu2B-4: Enhanced Dual-Channel Low-NF ACI-Cancellation TX RX and High-Linearity Wide-Dynamic-Range Tokyo You; Institute D. of Technology; Tokyo Wang; Y. Institute of Tokyo Fu; X. Technology; Institute of Institute of Technology; Nakamura; Tokyo T. Technology; Someya; T. Technology; Institute of Tokyo Fadila; A.A. Tokyo A. Institute Kawaguchi; of Technology; Tokyo Institute of Tokyo Pang; J. Technology; Institute of Institute of Technology; Tokyo Yanagisawa; Technology; K. Zhang; Tokyo Y. Institute of Technology; Liu; Tokyo B. T Institute of Tokyo Zhang; H. Technology; Institute of Tu2B-2: A 28GHz Front-End Module with T/R Switch Front-End Module with A 28GHz Tu2B-2: and 3.2dB 21.5% PAEmax Achieving 17.2dBm Psat, NF in 22nm FD-SOI for 5G Communication IMEC; K. Mangraviti; IMEC; G. Tang; Liu; IMEC; X. Y. IMEC; Wu; W.-M. Zhang; IMEC; Y. Khalaf; Pharrowtech; IMEC Wambacq; Debaillie; IMEC; P. IMEC; B. Chen; S.-H. Tu2B: 5G Focus Session on Millimeter-Wave Session on Millimeter-Wave 5G Focus Tu2B: and Systems Components Northrop GrummanTimChair: Larocca, Davis of California, University Co-Chair: Jane Gu, 28GHz Digital A 16-Element Fully Integrated Tu2B-1: Antenna 4×4 Patch Beamformer with In-Package Delta- Band-Pass and 64 Continuous-Time Array Sigma Sub-ADCs of Michigan; Univ. Weston; C. of Michigan; Lu; Univ. R. of Michigan; Buhler; Univ. F. of Michigan; Univ. Weyer; D. of Michigan Flynn; Univ. M.P.

402AB TECHNICAL SESSIONS TECHNICAL

J. Im; Univ. of Michigan; J. Breiholz; Univ. of Virginia; of Breiholz; Univ. J. of Michigan; Im; Univ. J. Tu2A-5: A Fully Integrated 0.2V 802.11ba Wake-Up Wake-Up 0.2V 802.11ba A Fully Integrated Tu2A-5: Receiver with -91.5dBm Sensitivity Virginia; D.D. of Calhoun; Univ. Virginia; B. of Li; Univ. S. of Michigan Univ. Wenzloff; Z. Feng; Univ. of Michigan; L.-X. Chuo; Univ. of Michigan; of Michigan; Chuo; Univ. L.-X. of Michigan; Feng; Univ. Z. of Michigan; Kim; Univ. Y. of Michigan; Shi; Univ. Y. Tu2A-4: A mm-Scale Sensor Node with a 2.7GHzA mm-Scale Tu2A-4: Using Full-Duplex Self-Coherent Transceiver 1.3µW Achieving 3.5m Range Backscattering Y. Guo; Tsinghua Univ.; Z. Wang; RITS Wang; Z. Tsinghua Univ.; Guo; Y. of Michigan Blaauw; Univ. D. of Michigan; Kim; Univ. H. Z. Weng; Tsinghua Univ.; H. Jiang; Tsinghua Univ.; Tsinghua Univ.; Jiang; H. Univ.; Tsinghua Weng; Z. Tu2A-3: A 400MHz/900MHz Dual-Band Ultra-Low- A 400MHz/900MHz Tu2A-3: Applications for Biomedical Transmitter Digital Power S. Mondal; Univ. of California, San Diego; D.A. Hall; Univ. Hall; Univ. D.A. San Diego; California, of Mondal; Univ. S. Diego San of California, Tu2A-2: A 67-µW Ultra-Low Power PVT-Robust PVT-Robust Power Ultra-Low A 67-µW Tu2A-2: MedRadio Transmitter C.-C. Lin; Washington State Univ.; H. Hu; Washington Washington Hu; H. Univ.; State Washington Lin; C.-C. State Univ. Washington Gupta; S. State Univ.; Tu2A-1: A 66.97pJ/Bit, 0.0413mm² Self-Aligned PLL- A 66.97pJ/Bit, Tu2A-1: TX with >62dBc Harmonic-Injection-Locked Calibrated Applications Spur Suppression for IoT Gernot Hueber, Silicon Austria Labs Austria Silicon Co-Chair: Gernot Hueber, Chair: NUS Chun Huat Heng, Tu2A: Ultra-Low Power Transceivers Power Ultra-Low Tu2A: RFIC LACC IMS2020

STUDENT DESIGN 09:30 – 17:00 TUESDAY, 23 JUNE 2020 COMPETITIONS ll attendees are invited to the 16th annual IMS Student Design Competitions. Students have been busy over the past several months designing and building solutions to the challenging engineering problems presented in the 12 student design competitions listed below. AJudges will measure the students’ designs at this event to determine the winners of the various competitions. With 130+ students regis- tered across 50+ teams, this lively event is bound to be filled with teamwork and friendly competition. Come to this event to cheer on the students, celebrate their hard work, and learn about their innovative designs.

# Title 09:00 10:00 11:00 12:00 13:00 14:00 15:00 16:00 1 Switched Acoustic Filter Modules

2 5G Wideband 3.4-3.8 GHz Receiver

3 13.56 MHz High Efficiency Power Amplifier

4 Exploring 5G: Design of a 26 GHz filter 5 Spectrum Sensing radio Receiver 6 High Efficiency Power Amplifiers

7 Linear HPA Design with Behavioral Model

8 Wide Frequency Coverage Tunable Bandstop

TUESDAY Filter

9 Digital Predistortion

10 Microwave Energy Harvesting

11 High Sensitivity Motion Radar

12 Microwave Photonic Link Receiver

TUESDAY LACC TECHNICAL LECTURES 12:00 – 13:30 TUESDAY, 23 JUNE 2020

Lecture Title Course Syllabus TTA1 Quantum Computing: an RF Quantum computing is moving from a long running research interest in the physics community to a field promising Control Perspective significant impact to society. The process of transitioning from a research prototype to scalable, fault tolerant Speaker: Evan Jeffrey, Google, Inc. computing systems will provide numerous opportunities for engagement from the RF and microwave design community. This talk will provide an introduction to quantum computing with a focus on superconducting transmon 12:00 – 13:30 qubit architectures that is accessible to microwave engineers. This will include a description of the basic principles of quantum computing and the most important commercial applications. Then we will cover the transmon qubit and how the basic operational requirements are all achieved via analog RF circuits. Finally, we will cover the basics of how fault tolerance is achieved in a fundamentally analog system and what challenges are needed to build such a system along with a picture of what a fault tolerant computer might look like. TTA1 Trends in Automotive Radars: This technical lecture will introduce fundamental automotive radar performance parameters, review latest market Waveform, System Implementa- trends and functional requirements, and discuss the latest signaling waveforms and practical system implementa- tion aspects. It will also introduce IC technology options for next-generation car-radar products, discuss key circuits tion, and IC Technologies and present measurement results of a fully-integrated radar front-end in 40nm CMOS silicon technology and review Speaker: Cicero Vaucher, NXP experiments using the CMOS chip in several prototype radars. Finally, it will discuss typical antenna implementa- Semiconductors tions, radar link budget considerations, and multiple cascaded chips usage for high angular resolution imaging 12:00 – 13:30 radars.

30 LACC IMS2020

MICROAPPS SCHEDULE 09:40 – 16:50 TUESDAY, 23 JUNE 2020 MicroApps offers a lot of information in 15 minutes! These presentations of application notes target the working engineer or technician and are color coded by general topic area below.

START TIME TITLE SPEAKERS 9:40 SMD Characterization Using Progressive De-embedding Methods with a VNA Rebecca Wilson – Copper Mountain Technologies 9:55 Stingray - X-Ku Band Phased Array Prototyping System Eamon Nash, Weston Sapia – Analog Devices 10:10 60 GHz Phased Array Antenna Design Using XFdtd for WiGig Application Naveen Kumar, T J – Remcom 10:25 A 24GHz Radar Evaluation and Development Platform Alex Andrews – Analog Devices 10:40 16TX-16RX S-Band Phased Array Radar Prototyping Platform Chas Frick, Michael Jones, Peter Delos – Analog Devices 10:55 A 2.6GHz Compact 40W Fully Integrated 3-Way Doherty for m-MIMO 5G Applications Marc Vigneau – Ampleon 11:10 Gaining Insight to Doherty Amplifiers Markus Loerner – Rohde & Schwarz 11:25 Fully Integrated IC-Package Co-Simulation Flow for RF IC Designs Feng Ling, Changhua Wan, Joshua – Xpeedic Technology 11:40 Power Handling in Passive Surface Mount RF Devices Hassan Dani – Knowls DLI 12:00 What is the Best Semiconductor Technology for 5G mmWave Applications? - PANEL Pat Hindle – Microwave Journal Session 13:05 Surface Mount Quadrature Hybrid Couplers for Microwave Designs Dave Thibado – Knowles Corporation 13:20 Alternative Architectures for Extending Ground Coverage of Mobile Networks Using Paul Moakes – CommAgility - Wireless Telecom Satellites 13:35 Device Miniaturization with High K Materials Jared Burdick – Knowles Capacitors TUESDAY 13:50 Network Synthesis and Vendor Component Models Support Impedance Matching Circuit David Vye, Chris Bean – AWR Group, NI Development 14:05 Automated Rigorous Filter Synthesis using Mician Filter Workbench Ralf Ihmels – Mician GmbH 14:20 Highly Accurate Calculation of EM Shielding Effectiveness in WIPL-D Software Package Branko Mrdakovic – WIPL-D 14:35 Power Amplifier Modeling for System-Level Simulation Joel Kirshman – AWR Group, NI 14:50 The Advantages of FET Based Limiters Chris Gregoire – Custom MMIC 15:05 RF Amplifier Bias Networks: What could go wrong? Ray Barker – Analog Devices 15:20 TFLE-Thin Film Lumped Elements Filters and Transition Time Converters (TTC) Solutions. Rafi Hershtig – K&L Microwave 15:35 Component Phase Noise Measurement Practices Jacob Trevithick – Marki Microwave 15:50 AXIEM EM Simulation for Complex ICs and PCBs John Dunn – AWR Group, NI 16:05 Easy Semiconductor Workflows with the new Sonnet Technology File (.STF) Brian Rautio – Sonnet Software 16:20 Parallel and Remote Schematic Simulation and Optimization in AWR Dustin Hoekstra – AWR Group, NI 16:35 A New Wave of Simulation for Electromagnetism and Design Optimization Katsuhiko Kosenda – Murata Software

n 5G Cell Phone ≤ 6GHz, FR1 n 5G Millimeterwave, FR2 n Antenna and Antenna Components n Components & Materials n CAD and Modeling Products and Techniques n High Power Devices, including GaN Devices n Instrumentation and Measurement Techniques n Systems

MicroApps Sponsor: MicroApps Media Sponsor:

31 LACC IMS2020

IMS STUDENT PAPER 10:10 – 11:50 TUESDAY, 23 JUNE 2020 COMPETITION he Technical Paper Review Committee has identified the following students as Finalists in this year’s Student Paper Competition. Finalists will be presenting their papers at the Student Paper Competition’s Interactive Forum (SPC-IF) in addition to their regular T presentation. All attendees are encouraged to stop by the SPC-IF and interact with these promising students, in addition to seeing them in their regular speaking sessions. THIS YEAR’S SPC FINALISTS ARE: High Output Power Ultra-Wideband Distributed Amplifier using Diamond Heat A 19 GHz Lithium Niobate Acoustic Filter with FBW of 2.4% | Tu3E Spreader in InP DHBT Technology | Tu4F Student Finalists: Liuqing Gao, Yansong Yang, Songbin Gong, Univ. of Illinois at Student Finalists: Md Tanjil Shivan, Maruf Hossain, Ralf Doerner, Ksenia Nosaeva, Urbana, Champaign Hady Yacoub, Ferdinand-Braun-Institut; Tom K Johansen, Technical Univ. of Denmark; Advisor: Songbin Gong, University of Illinois at Urbana, Champaign, Wolfgang Heinrich, Ferdinand-Braun-Institut; Viktor Krozer, Ferdinand-Braun-Institut A High-Sensitivity Low-Power Vital Sign Radar Sensor Based on Super-Regenera- Advisor: Professor Viktor Krozer, Ferdinand-Braun-Institut / Johann Wolfgang tive Oscillator Architecture | We2D Goethe-Universität Frankfurt am Main, Student Finalists: Yichao Yuan, Rutgers Univ., Austin Ying, Kuang Chen, California High-Sensitivity Plasmonic Photoconductive Terahertz Detector Driven by a Fem- State Univ., Northridge, Chung-Tse (Michael) Wu, Rutgers Univ. tosecond Ytterbium-Doped Fiber Laser | Tu2E Advisor: Chung-Tse (Michael) Wu, Rutgers University Student Finalists: Deniz Turan, Nezih Tolga Yardimci, Mona Jarrahi, Polylithic Integration for RF/MM-Wave Chiplets using Stitch-Chips: Modeling, Univ. of California, Los Angeles Fabrication, and Characterization | Th1D Advisor: Mona Jarrahi, University of California, Los Angeles Student Finalists: Ting Zheng, Paul K. Jo, Sreejith Kochupurackal Rajan, Negative Group Delay Enabled Artificial Transmission Line Exhibiting Muhannad S. Bakir, Georgia Institute of Technology Squint-Free, Dominant Mode, Backward Leaky-Wave Radiation | Tu4A Advisor: Muhannad S. Bakir, Georgia Institute of Technology Student Finalists: Minning Zhu, Chung-Tse (Michael) Wu, Rutgers Univ. Impact of Input Nonlinearity on Efficiency, Power, and Linearity Performance Advisor: Chung-Tse Michael Wu, Rutgers University of GaN RF Power Amplifiers | Tu3H A 1 mW Cryogenic LNA Exploiting Optimized SiGe HBTs to Achieve an Student Finalists: Sagar Dahr and Fadhel M. Ghannouchi , University of Calgary Average Noise Temperature of 3.2 K from 4–8 GHz | Tu3B Advisor: Prof. Fadhel M. Ghannouchi, University of Calgary Student Finalists: Wei-Ting Wong, Mohsen Hosseini, Univ. of Massachusetts, Noncontact High-Linear Motion Sensing Based on A Modified TUESDAY Amherst, Holger Rücker, IHP GmbH, Joseph Bardin, Univ. of Massachusetts, Amherst Differentiate and Cross-Multiply Algorithm | We2B Advisor: Joseph Bardin, Univ. of Massachusetts, Amherst Student Finalists: Wei Xu, Changzhan Gu, Shanghai Jiao Tong Univ. Load Modulated Balanced mm-Wave CMOS PA with Integrated Linearity Advisor: Prof. Changzhan Gu, Shanghai Jiao Tong University, Shanghai Enhancement for 5G applications | Th1G A 162 GHz Ring Resonator based High Resolution Dielectric Sensor | Tu3D Student Finalists: Chandrakanth R. Chappidi, Princeton Univ., Tushar Student Finalists: Hai Yu, Bo Yu, Skyworks Solutions, Inc., Xuan Ding, Sebastian Sharma, NXP Semiconductors, Zheng Liu, Kaushik Sengupta, Princeton Univ. Gomez-Diaz, Jane Gu, Univ. of California, Davis, Advisor: Kaushik Sengupta, Princeton Univ. Advisor: Qun Jane Gu, University of California, Davis Miniaturized 28 GHz PCM-Based 4-bit Latching Variable Attenuator | Tu1G A Feasibility Study on the Use of Microwave Imaging for In-Vivo Screening of Student Finalists: Tejinder Singh, Raafat Mansour, Univ. of Waterloo Knee Prostheses | We2D Advisor: Raafat R. Mansour, Centre for Integrated RF Engineering, Univ. of Waterloo Student Finalists: Konstantin Root, Martin Vossiek,Friedrich-Alexander- Transmit-Receive Cross-Modulation Distortion Correction in a 5-6GHz Full Duplex Universität Erlangen-Nürnberg Quadrature Balanced CMOS RF Front-End | Th2F Advisor: Martin Vossiek, Friedrich-Alexander-Universität Erlangen-Nürnberg, Student Finalists: Nimrod Ginzberg, Technion - Israel Institute of Technology, Tomer Localization and Tracking Bees Using a Battery-less Transmitter and an Autono- Gidoni, Tel-Aviv University, Dror Regev, Huawei Technologies Co., Ltd., Emauel Cohen, mous Unmanned Aerial Vehicle | Th3C Technion - Israel Institute of Technology Student Finalists: Jake Shearwood, Sam Williams, Nawaf Aldabashi, Paul Cross, Advisor: Professor Emanuel Cohen, Technion - Israel Institute of Technology Bangor Univ., Breno M. Freitas, Federal University of Ceará, Chaochun Zhang, China Gate Bias Incorporation into Cardiff Behavioural Modelling Agricultral University, Cristiano Palego, Bangor Univ. Formulation | Tu4H Advisor: Cristiano Palego, Bangor University Student Finalists: Ehsan M. Azad, James J. Bell, Roberto Quaglia, Jorge J. Closed-Loop Sign Algorithms for Low-Complexity Digital Predistortion | We3G Moreno Rubio, Paul J. Tasker, Cardiff University Student Finalists: Pablo Pascual Campo, Vesa Lampu, Tampere University, Lauri Advisor: Roberto Quaglia, Cardiff University Anttila, Alberto Brihuega, Tampere Univ. of Technology, Markus Allén, Mikko Valkama, A Compact Reconfigurable N-Path Low-Pass Filter Based on Negative Tampere University Trans-Resistance with <1dB Loss and >21dB Out-of-Band Rejection | We3E Advisor: Mikko Valkama, Tampere University Student Finalists: Mohammad Khorshidian, Columbia Univ., Negar InP HBT Oscillators Operating up to 682 GHz with Coupled-Line Load Reiskarimian, Massachusetts Institute of Technology, Harish Krishnaswamy, for Improved Efficiency and Output Power |We3C Columbia Univ. Student Finalists: Jungsoo Kim, Heekang Son, Doyoon Kim, Kiryong Song, Advisor: Prof. Harish Krishnaswamy, Columbia University Junghwan Yoo, Jae Sung Rieh, Korea Univ. A Compact Bandpass Filter with Wide Stopband and Low Radiation Loss Using Advisor: Jae-Sung Rieh, Korea University, [email protected] Substrate Integrated Defected Ground Structure | We2E A Low Power 60 GHz 6 V CMOS Peak Detector | Th3G Student Finalists: Deshan Tang, Changxuan Han, Zhixian Deng, Huizhen J. Qian, Student Finalists: Zoltán Tibenszky, Corrado Carta, Frank Ellinger, Technische Univ. Xun Luo, Univ. of Electronic Science and Technology of China Dresden Advisor: Xun Luo, University of Electronic Science and Technology of China Advisor: Dr. Frank Ellinger, Technische Univ. Dresden Dual-Octave-Bandwidth RF-Input Pseudo-Doherty Load Modulated Balanced Concurrent Dual-Band Microstrip Line Hilbert Transformer for Spectrum Amplifier with≥ 10-dB Power Back-off Range | We2G Aggregation Real-Time Analog Signal Processing | WEIF1 Student Finalists: Yuchen Cao, Kenle Chen, Univ. of Central Florida Student Finalists: Rakibul Islam, Md Hedayatullah Maktoomi, Washington State Advisor: Kenle Chen, Univ. of Central Florida Univ., Yixin Gu, Univ. of Texas at Arlington, Bayaner Arigong, Washington State Univ. An Enhanced Large-Power S-band Injection-Locked Magnetron with Advisor: Bayaner Arigong, Washington State University Anode Voltage Ripple Inhibition | Tu1F Phase Recovery in Sensor Networks based on incoherent Repeater Elements | Student Finalists: Xiaojie Chen, Xiang Zhao, Sichuan Univ., Bo Yang, Th2C Naoki Shinohara, Kyoto Univ., Changjun Liu, Sichuan Univ. Student Finalists: David Werbunat, Benedikt Meinecke, Maximilian Steiner, Advisor: Changjun Liu, School of Electronics and Information Engineering, Christian Waldschmidt, Ulm Univ. Sichuan University, China Advisor: Christian Waldschmidt,Ulm University 32 IMS2020

SPC FINALISTS CONTINUED: In-Situ Self-Test and Self-Calibration of Dual-Polarized 5G TRX, Phased Arrays Octave Frequency Range Triple-band Low Phase Noise K/Ka-Band VCO with Leveraging Orthogonal-Polarization Antenna Couplings | Th1F a New Dual-path Inductor, , | Tu4C Student Finalists: Ahmed Nafe, Abdurrahman H. Aljuhani, Univ. of California, San Student Finalists: Md Aminul Hoque, Mohammad Chahardori, Washington Diego, Kerim Kibaroglu, Movandi, Mustafa Sayginer, Nokia Bell Labs, Gabriel State Univ., Pawan Agarwal, MaxLinear, Inc., Mohammed Ali Mokri, Deukhyoun Rebeiz, Univ. of California, San Diego Heo, Washington State Univ. Advisor: Prof. Gabriel M. Rebeiz, University of California San Diego Advisor: Deukhyoun Heo, Washington State University A Scalable Switchable Dual-Polarized 256-Element Ka-Band SATCOM Transmit Phased-Array with Embedded RF Driver and ±70° Beam Scanning | We3F Liquid Crystal Based Parallel-Polarized Dielectric Image Guide Phase Shifter Student Finalists: Kevin Kai Wei Low, Univ. of California, San Diego, Samet Zihir, at W-Band | Tu4A Integrated Device Technology, Inc., Tumay Kanar, Integrated Device Technology, Inc., Student Finalists: Henning Tesmer, Roland Reese, Ersin Polat, Rolf Jakoby, Gabriel Rebeiz, Univ. of California, San Diego Holger Maune, Technische Univ. Darmstadt Advisor: Gabriel M. Rebeiz, University of California, San Diego Advisor: Prof. Rolf Jakoby, Technische Universität Darmstadt A Silicon-Based Closed-Loop 256-Pixel Near-Field Capacitive Sensing Array with 3-ppm Sensitivity and Selectable Frequency Shift Gain | We1B Student Finalists: Jia Zhou, Univ. of California, Los Angeles, Chia-Jen Liang, National Chiao Tung Univ., Christopher E. Chen, Jieqiong Du, Rulin Huang, Univ. of California, Los Angeles, Richard Al Hadi, Alcatera LLC, James C.M. Hwang, Cornell Univ., Mau-Chung, Frank Chang, Univ. of California, Los Angeles Advisor: Professor Frank Chang, Univ. of California, Los Angeles

LACC INDUSTRY WORKSHOPS 08:00 – 17:30 TUESDAY, 23 JUNE 2020 ndustry workshops cover contemporary topics spanning the state of the art in RF, microwave, and mm-wave areas. These two-hour workshops TUESDAY include in-depth technical presentations from and discussions with experts in the industry. Don’t miss this opportunity to expand your knowl- I edge and interact with colleagues in these very relevant fields! SESSION TIME SESSION TITLE EVENT COMPANY SPEAKERS Ian Rippke, Keysight Technologies; Eamon Nash, COTS Phased Array Radar System Design and Keysight Technologies Analog Devices; John Richardson, X-Microwave; Measurement Using Model-Based Engineering Wilfredo Rivas-Torres, Keysight Technologies MathWorks, Inc. 8:00 – 9:40 Automotive Radar IQ Data Simulation for Rick Gentile, MathWorks, Inc.; Honglei Chen, Performance Analysis MathWorks, Inc.

Analytical vs. numerical techniques for beamform- Optenni Ltd Joni Lappalainen, Optenni Ltd; Jussi Rahola, Optenni ing optimization in phased arrays Ltd Neil Hoffman, Keysight Technologies; Rich Hoft, Multi-Channel mmWave EW Receiver Workshop Keysight Technologies Keysight Technologies; Joanne Mistler, Keysight Technologies 10:10 – 11:50 Rick Gentile, MathWorks, Inc.; Tim Reeves, Math- Hybrid Beamforming for 5G Systems MathWorks, Inc. Works, Inc.; Honglei Chen, MathWorks, Inc. Cadence Design Systems, Gent Paparisto, Cadence Design Systems, Inc.; Takao Understanding 5G System-Level Evaluation Inc. Inoue, Cadence Design Systems, Inc. Achieving Electromagnetic Compatibility (EMC) for ETS-Lindgren Ross Carlton, ETS-Lindgren 5G Devices RF and mmWave Frontends: efficient RF power Rohde & Schwarz GmbH & 13:40 – 15:20 amplifiers and affiliates Co KG Optimizing System Performance for Emerging Keysight Technologies Jaakko Juntunen Wideband mmWave Applications Brooks Hanley, Keysight Technologies; Rich Hoft, Phase-Noise Theory and Measurement Workshop Keysight Technologies Keysight Technologies; Joanne Mistler, Keysight Technologies 15:50 – 17:30 Integrated Passive Devices (IPD) for 5G RF Feng Ling, Xpeedic Technology, Inc.; Lijun Chen, Xpeedic Technology, Inc. Front-end Designs Xpeedic Technology Co. Ltd. Enabling Technologies for Silicon Beamformers for Integrated Device Technology, 5G and Satcom Systems Inc. 33

Late Breaking News 404AB Tu3D: Microwave Characterization Characterization Microwave Tu3D: Biological Materials of Liquid and z QWED Sp. Chair: Celuch, Malgorzata o.o Xlim - CNRS- ArnaudCo-Chair: Pothier, De Liroges Unversite Tu3D-4: A 162GHz Ring ResonatorA 162GHz Tu3D-4: Based High Resolution Dielectric Sensor Yu; B. Davis; of California, Univ. Yu; H. of Ding; Univ. Solutions; X. Skyworks Univ. Gómez-Díaz; J.S. Davis; California, of Gu; Univ. Q.J. Davis; of California, Davis California, Electrical Properties of Jurkat Tu3D-5: An Inverted Scanning Microwave Cells: Microscope Study delle Politecnica Università Fabi; G. Università Joseph; Marche; C.H. Jin; Lehigh delle Marche; X. Politecnica Cornell Univ.; Wang; X. University; D’Annunzio” “G. Università Pietrangelo; T. Cheng; Lehigh X. Chieti-Pescara; Hwang; Cornell Univ.; J.C.M. University; delle Politecnica Università Farina; M. Marche Tu3D-1: An SIW Oscillator for Tu3D-1: Microfluidic Lossy Medium Characterization of Alberta; Abdolrazzaghi; M. Univ. Alberta; M. of Kazemi; Univ. N. Alberta of Daneshmand; Univ. Broadband Microwave A CMOS Tu3D-3: Adaptive Dual-Comb Dielectric System for LiquidSpectroscopy Chemical Detection Entesari; K. A&M Univ.; Texas Kaya; E. A&M Univ. Texas

Focus & Special Sessions

403B Emerging Technologies Emerging Technologies & Applications F. Ellinger; Technische Universität Universität Technische Ellinger; F. Dresden 52-Gbps NRZ A 2.85pJ/Bit, Tu3C-3: Feedforward Two-Tap VCSEL Driver with Equalization Santa of California, Univ. Valenzuela; L.A. of California, Andrade; Univ. Barbara; H. Hosseinzadeh; Univ. Santa Barbara; N. Barbara; Santa of California, Santa of California, Maharry;A. Univ. California, of Univ. Schow; Barbara; C.L. of Buckwalter; Univ. Santa Barbara; J.F. Santa Barbara California, CMOSA 6.5~7.5-GHz Tu3C-4: Transmitter Wideband FMCW Radar Based on Synthetic Bandwidth Technique Balon; NUS; K.Y. Su; NUS; S.D. H. Heng; NUS Cheong; NUS; C.-H. A 24–30GHz Ultra-Compact Tu3C-5: Networks All-Pass Phase Shifter Using for 5G User Equipment Leuven; Univ. Anjos; Katholieke E.V.P. Schreurs; Katholieke D.M.M.-P. Vandenbosch; G.A.E. Leuven; Univ. Geurts; NXP M. Leuven; Univ. Katholieke Semiconductors Tu3C: Advanced Advanced Mixed-Signal Tu3C: Driver ICs and Optical Transmitter 100Gbit/s towards - Friedrich-Alex Chair: Christian Carlowitz, Erlangen-Nürnberg ander-Universität Co-Chair: Rohde & Hermann Boss, Schwarz GmbH & Co KG Coding with Gray A 3-Bit DAC Tu3C-1: Signal Generation for 100-Gbit/s PAM Dresden; Universität Technische Rieß; V. Khafaji; Bosch Sensortec; Stärke; M.M. P. Carta; Dresden; C. Universität Technische Dresden; Universität Technische A Tu3C-2: 50-Gb/s Transmitter Optical Based on Co-Design of a 45-nm CMOS SOI Distributed Driver and 90-nm Silicon Photonic Mach-Zehnder Modulator of California, Univ. Hosseinzadeh; N. of Univ. Fang; Santa Barbara; K. Valenzuela; L.A. San Diego; California, of Buckwalter; Univ. J.F. Schow; C.L. Santa Barbara California,

TUESDAY, 23 JUNE 23 2020 | LACC TUESDAY, | – 15:20 13:40

Systems & Applications

403A Active Components Tu3B-5: A 125.5–157GHz 8dB NF Tu3B-5: and 16dB of Gain D-Band Low Noise Amplifier in CMOS SOI 45nm CEA- Siligaris; A. Hamani; CEA-LETI; A. Dehos; CEA-LETI; C. Blampey; LETI; B. Gonzalez Jimenez; CEA-LETI CEA-LETI; J.L. Tu3B-4: A Fully-Integrated W-Band A Tu3B-4: Fully-Integrated Use MMIC for I/Q-Down-Conversion Multi-PixelAstronomical in Radio Receivers Ture; IAF; E. Thome; Fraunhofer F. Leuther; Fraunhofer A. Fraunhofer IAF; Astronomy; Schäfer; MPI for Radio IAF; F. Serres; IRAM; INAF; P. Navarrini; A. Ambacher; Fraunhofer IAF O. J.C. Bardin; Google Bardin; J.C. W-Band SiGe Cryogenic Tu3B-2: BiCMOS Low-Noise Amplifier Research VTT Technical Varonen; M. VTT Sheikhipoor;Centre of Finland; N. Research Centre of Finland; Technical Cleary; Caltech; K. Gabritchidze; B. Caltech; H. Forstén; VTT Technical Rücker;Research Centre of Finland; H. IHP Kaynak; IHP; M. X- to Ka-Band Cryogenic Tu3B-3: Very Long Baseline LNA Module for Interferometry Bowen; Samoska; J. Fung; L. A. Soriano; Kooi; M. J. Montanez; S. Hoppe; Manthena; D. Jacobs; R. C. Özyegin Akgiray; A. Propulsion Lab; Jet Lai; Northrop Grumman; R. University; Barsky; Mei; Northrop Grumman; M. X. Northrop Grumman Tu3B: Advances in Low Noise in Low Advances Tu3B: Computing, for Quantum Circuits and Broadband Sensing, Scientific Communications Propulsion Jet Chair: Kangaslahti, Pekka Laboratory Systems BAE Co-Chair: Duh, George A 1mW Cryogenic LNA Tu3B-1: HBTs toExploiting Optimized SiGe Achieve an Average Noise Temperature of 3.2K from 4–8GHz Hosseini; M. Amherst; UMass Wong; W.-T. Rücker; IHP; Amherst; H. UMass

Passive Components 402AB

Tu3A-5: Design and Analysis of Design and Tu3A-5: for Waveguides 3D Printed Slotted and D-Band Using Stereolithography Electroless Silver Plating Erlangen-Nürnberg; Lomakin; FAU K. Erlangen-Nürnberg; Sippel; FAU M. Erlangen-Nürnberg Gold; FAU G. K. Helmreich; FAU Erlangen-Nürnberg; Helmreich; FAU K. Tu3A-4: AFSIW-to-Microstrip Tu3A-4: Directional Coupler for High-Performance Systems on Substrate 5218); Ghiotto; IMS (UMR A. T. Henrion; IMS (UMR 5218); J.-C. Pham; Martin; IMS (UMR 5218); J.-M. Armengaud; CNES V. IMS (UMR 5218); Tu3A-3: Travelling-Wave SIW Travelling-Wave Tu3A-3: TE20 Mode for Line Using Transmission Antenna Application Millimeter-Wave Dong; UESTC Y. UESTC; Wang; Z. S. Chen; National Taiwan Univ.; T.-L. Wu; Wu; T.-L. Chen; Univ.; S. National Taiwan Univ. National Taiwan Tu3A-2: A Tu3A-2: Cost-Efficient Air-Filled Waveguide Ridge Integrated Substrate Application for mmWave Ting; Univ.; National Taiwan C.-W. Tu3A-1: Dual Image Dielectric Guide Dual Image Tu3A-1: Diversity(DIDG) for Polarization Wave Applications at Millimeter Frequency Djerafi; T. Noferesti; INRS-EMT; M. INRS-EMT Tu3A: Integrated Millimeter-Wave Millimeter-Wave Integrated Tu3A: Lines Transmission at Buffalo University Chair: Jun Choi, of University Co-Chair: Maurizio Bozzi, Pavia TECHNICAL SESSIONS TECHNICAL

13:40 13:50 14:00 14:10 14:20 14:30 14:40 14:50 15:00 15:10 15:20

Microwave Field, Device & Circuit Techniques Device & Circuit Microwave Field, IMS

TUESDAY 34 IMS TECHNICAL SESSIONS 13:40 – 15:20 | TUESDAY, 23 JUNE 2020 | LACC v 406AB 408A 409AB Tu3E: Acoustic Devices for Ultra- Tu3F: Broadband, High- Tu3H: Advances in Microwave high Frequency Applications and Performance GaN and GaAs Semiconductor Devices RF Filter Synthesis Power Amplifiers Chair: Patrick Fay, University of Notre Chair: Brice Ivira, Broadcom Corporation Chair: Charles Campbell, QORVO, Inc. Dame Co-Chair: Amir Mortzawi, University of Co-Chair: Gayle Collins, Obsidian Co-Chair: Tony Ivanov, US Army CERDEC Michigan Microwave, LLC. 13:40

Tu3E-1: A 19GHz Lithium Niobate Tu3F-1: A Compact 10W 2–20GHz Tu3H-1: Impact of Input Nonlinearity Acoustic Filter with FBW of 2.4% GaN MMIC Power Amplifier Using a on Efficiency, Power, and Linearity Decade Bandwidth Output Impedance Performance of GaN RF Power L. Gao; Univ. of Illinois at Urbana- Transformer Amplifiers 13:50 14:00 Champaign; Y. Yang; Univ. of Illinois at Urbana-Champaign; S. Gong; Univ. of M. Roberg; Qorvo; M. Pilla; Qorvo; S.K. Dhar; Univ. of Calgary; T. Sharma; Illinois at Urbana-Champaign S. Schafer; Qorvo; T.R. Mya Kywe; Qorvo; NXP Semiconductors; R. Darraji; R. Flynt; Qorvo; N. Chu; Qorvo Ericsson; D.G. Holmes; J. Staudinger; NXP Semiconductors; X.Y. Zhou; City U; V. Mallette; Focus Microwaves; F.M. Ghannouchi; Univ. of Calgary Tu3E-2: 5.4GHz Acoustic Delay Lines Tu3F-2: 2.5 to 10.0GHz Band-Pass Tu3H-2: High Power AlN/GaN HEMTs in Lithium Niobate Thin Film with 3dB Non-Uniform Distributed GaN MMIC with Record Power-Added-Efficiency Insertion Loss HPA >70% at 40GHz

R. Lu; Univ. of Illinois at Urbana- J. Kamioka; Mitsubishi Electric; K. Harrouche; IEMN (UMR 8520); 14:10 14:20 Champaign; Y. Yang; Univ. of Illinois at M. Hangai; Mitsubishi Electric; S. Miwa; R. Kabouche; IEMN (UMR 8520); Urbana-Champaign; S. Link; Univ. of Mitsubishi Electric; Y. Kamo; Mitsubishi E. Okada; IEMN (UMR 8520); F. Illinois at Urbana-Champaign; S. Gong; Electric; S. Shinjo; Mitsubishi Electric Medjdoub; IEMN (UMR 8520) Univ. of Illinois at Urbana-Champaign

Tu3E-3: An X-Band Lithium Niobate Tu3F-3: Two-Stage Concurrent X/Ku Tu3H-3: InAlN/GaN-on-Si HEMT with TUESDAY Acoustic RFFE Filter with FBW of 3.45% Dual-Band GaAs MMIC Power Amplifier 4.5W/mm in a 200-mm CMOS- and IL of 2.7dB Compatible MMIC Process for 3D P. Zurek; University of Colorado Boulder;

Integration 14:30 Y. Yang; Univ. of Illinois at Urbana- Z. Popovic; University of Colorado Champaign; L. Gao; Univ. of Illinois at Boulder S. Warnock; C.-L. Chen; J. Knecht; Urbana-Champaign; S. Gong; Univ. of R. Molnar; D.-R. Yost; M. Cook; C. Stull; R. Illinois at Urbana-Champaign Johnson; C. Galbraith; J. Daulton; W. Hu; G. Pinelli; MIT Lincoln Laboratory; J. Perozek; MIT; T. Palacios; MIT; B. Zhang;

MIT Lincoln Laboratory 14:40

Tu3E-4: Surface Acoustic Wave Tu3F-4: Broadband Driver Amplifier Tu3H-4: Noise Performance of Sub-100- Resonators Using Lithium Niobate on with Voltage Offset for GaN-Based nm Metamorphic HEMT Technologies Silicon Carbide Platform Switching PAs F. Heinz; Fraunhofer IAF; F. Thome; S. Zhang; Chinese Academy of Sciences; T. Hoffmann; FBH; F. Hühn; FBH; S. Fraunhofer IAF; A. Leuther; Fraunhofer R. Lu; Univ. of Illinois at Urbana- Shevchenko; FBH; W. Heinrich; FBH; IAF; O. Ambacher; Fraunhofer IAF

Champaign; H. Zhou; Chinese Academy A. Wentzel; FBH 14:50 15:00 of Sciences; S. Link; Univ. of Illinois at Urbana-Champaign; Y. Yang; Univ. of Illinois at Urbana-Champaign; Z. Li; Chinese Academy of Sciences; K. Huang; Chinese Academy of Sciences; X. Ou; Chinese Academy of Sciences; S. Gong; Univ. of Illinois at Urbana-Champaign

Tu3E-5: Synthesis and Realization of Tu3F-5: A Dual-Mode Bias Circuit Tu3H-5: High-Power RF Characterization Chebyshev Filters Based on Constant Enabled GaN Doherty Amplifier of Diamond Schottky Barrier Diodes at Electromechanical Coupling Coefficient Operating in 0.85–2.05GHz and X-Band Acoustic Wave Resonators 2.4–4.2GHz X. Konstantinou; Michigan State Univ.; S.-Y. Tseng; National Taiwan Univ.; Y. Komatsuzaki; Mitsubishi Electric; C.J. Herrera-Rodriquez; Michigan State C.-C. Hsiao; Tai-Saw Technology; R. Ma; MERL; S. Sakata; Mitsubishi Univ.; A. Hardy; Fraunhofer USA CCD; R.-B. Wu; National Taiwan Univ. Electric; K. Nakatani; Mitsubishi Electric; J.D. Albrecht; Michigan State Univ.; S. Shinjo; Mitsubishi Electric T. Grotjohn; Michigan State Univ.; J. 15:10 Papapolymerou; Michigan State Univ.T 15:20

Microwave Field, Device & Circuit Techniques Passive Components Active Components Systems & Applications Emerging Technologies & Applications Focus & Special Sessions Late Breaking News 35 LACC IMS2020

IMS/RFIC JOINT 12:00 – 13:15 TUESDAY, 23 JUNE 2020 PANEL SESSION Automotive Radars and AI: Is My Car Really Safe?

PANEL ORGANIZERS AND MODERATORS: Francois Rivet, University of Bordeaux, France Magnus Wiklund, Qualcomm, USA

PANELISTS: Margaret Huang, Sr. Administrative Assistant, Intel, USA; Karam Noujeim, Technology Fellow, Anritsu, USA; Juergen Hasch, Senior Expert, Bosch, Germany Manju Hegde, CEO, Uhnder, USA; Mohammad Emadi, CTO, Zadar Labs, USA

ABSTRACT: re we ready to take ourhands off thecar steering wheel ?In any case, our carsare ready to stealcontrol from us and to do withoutthe major responsible for road accidents: man. This panel will ask the questionof how muchconfidence we havein the electronics of ourcars and A whetherwe can trust it.Automotive radar is the visionand artificial intelligence is the decision making. We will discuss the reliability of thisvision and thisdecision making of our carsto decide if it is wise enough to stop drivingor if we should our hands on the steeringwheel? TUESDAY

36 LACC IMS2020

5G SUMMIT 13:30 – 17:00 TUESDAY, 23 JUNE 2020 he technologies and systems for 5G are now pushing for commercial deployment with focus on Stand Alone (SA) networks, mass market for 5G devices, and global adoption of mmWave in premium devices and for small cell enhancement and fixed wireless access (FWA). Further- T more and looking beyond 5G, technology research and development needs to focus on MIMO enhancement, V2X and IoT evolution, integra- tion of 5G with Non-Terrestrial Network, and new FR3 & FR4 spectrum development. To bring all this into focus, the IEEE Microwave Theory and Techniques Society (MTT-S) is organizing a 5G Summit at the 2020 MTT-S International Microwave Symposium (IMS2020), 23 June 2020, with speakers at the leadership level from different companies and industries to discuss 5G related topics, including foundries, standards, mobile networks, MIMO and millimeter-wave systems, RFIC, and RFFE. As part of the IEEE Comsoc 5G Summit series (details at www.5GSummit.org), this summit will provide a platform for leaders, innovators, and researchers from both industrial and academic communities to collaborate and exchange ideas regarding 5G and beyond 5G technologies. SPEAKERS LIST: Dr. Bami Bastani, Senior Vice President, RF Business Unit, GLOBALFOUNDRIES Differentiated end to end silicon solutions for the new 5G reality Dr. Lawrence Loh, Corporate Senior Vice President and CSO, MediaTek 5G – Evolution or Revolution Dr. Chih-Lin I, China Mobile Chief Scientist, Wireless Technology, China Mobile TBD Mr. Joel King, Senior Vice President and General Manager, Skyworks RF Front-End Evolution from 4G to 5G Dr. Naveen Yanduru, Vice President and General Manager, Renesas Electronics Sub-6GHz and mmWave RFICs for 5G Wireless Infrastructure RF Front Ends” Dr. Curtis Ling, Co-Founder and Chief Technology Officer, MaxLinear

A fabless perspective on 5G phased arrays, from devices to network capacity TUESDAY Dr. Shahriar Shahramian, Director, Bell Labs The 5G Quest: System, Deployment & Application Challenges Dr. Ir. Michael Peeters, Program Director Connectivity, IMEC FR 1,2,3,4,… PA and FEM technology approaches for 5G and beyond The 5G Summit will be open to all IMS and RFIC attendees for a nominal cost, and attendees will be able to register for the 5G Summit using the IMS2020 registration site; the summit will be complemented by a reception for all registered attendees, followed by a rump session to drive a live discussion between the speakers and the audience on the summit presented topics. IMS2020 will be an incredible week that focuses on 5G connectivity and brings together the best engineering minds from systems to hardware.

5G Summit Co-Sponsor: 5G Summit Co-Sponsor:

37

Late Breaking News 404AB Tu4D: Microwave Systems Microwave Tu4D: for Permittivityand Methods Measurements of University Warsaw Kopyt, Chair: Pawel Technology Co-Chair: Rashaunda Hnderson, at Dallas Texas of University Tu4D-5: Clutter Mitigation Based on Clutter Mitigation Tu4D-5: Decomposition Value Adaptive Singular for Radar Images Tomographic in Material Inspection Gashi; Meier; Fraunhofer IAF; B. D. Link; Composite T. Fraunhofer IAF; Schwarze; GFaI; T. Material Supply; Baumann; Zech; Fraunhofer IAF; B. C. Schlechtweg; Fraunhofer IAF; M. IAF; Kühn; Fraunhofer Fraunhofer IAF; J. Reindl; Rösch; Fraunhofer IAF; L.M. M. Freiburg Albert-Ludwigs-Universität R. Henderson; Univ. of Texas at Dallas Texas of Henderson; Univ. R. of Testing Non-Destructive Tu4D-3: Non-Metallic Concentric Pipes Using Measurements Microwave Sharma; NYIT; R. Ravan; NYIT; M. Wu; H. Amineh; NYIT NYIT; R.K. Patel; NYIT; J. Portable Low-Cost Tu4D-4: Measurement Setup for 2D Imaging Semiconductors of Organic Douheret; Celuch; QWED; O. M. Tu4D-1: Broadband Measurement of Broadband Tu4D-1: upDielectric Properties of Substrates Air Line to 67GHz Using a Coaxial at Dallas; Texas of Mahjabeen; Univ. N. at Dallas; Texas of Zanders; Univ. A.P. High-Resolution Millimeter- Tu4D-2: System for Tomography Wave of Low-Permittivity Characterization Materials Technologies; Hölzl; Infineon Och; P.A. A. Schuster; J.O. voestalpine; S. Freidl; Infineon Schrattenecker; P.F. Intel; Scheiblhofer; D. S. Technologies; Pathuri-Bhuvana; V. Zankl; voestalpine; FAU Weigel; Labs; R. Austria Silicon Erlangen-Nürnberg of Univ. Warsaw Korpas; P. Materia Nova; Vigo System; Michnowski; R. Technology; Rudnicki; QWED; J. Olszewska-Placha; M. QWED Focus & Special Sessions

403B Emerging Technologies Emerging Technologies & Applications Tu4C-5: An X-Band LC VCO Using a NewVCO Using An X-Band LC Tu4C-5: Active Capacitor with 53% Boosted and -202.4dBc/Hz FoMT Range Tuning State Univ.; Washington Agarwal; . State Univ.; Washington Chahardori; M. State Univ. Washington Heo; D. Tu4C-3: A Power Efficient 60-GHzA Power Tu4C-3: Oscillator with Super-Regenerative 10-GHz Switching Rate in 22-nm FD- SOI CMOS Universität Technische Ferschischi; A. Technische Ghaleb; Dresden; H. Tibenszky; Dresden; Z. Universität Dresden; Universität Technische Dresden; Universität Technische Carta; C. Universität Technische Ellinger; F. Dresden A Tu4C-4: 0.011-mm² 27.5-GHz VCO Bandpasswith Transformer-Coupled in Achieving -191dBc/Hz FoM Filter 16-nm FinFET CMOS Liao; TSMC; H.-Y. Lu; Y.-T. TSMC; Lin; C.-H. TSMC; Loke; TSMC; Chen; TSMC; A.L.S. S. TSMC Yeh; T.-J. Tu4C: Advanced Advanced Design Tu4C: Controlled Voltage for Techniques Oscillators Bochum Ruhr University Chair: Nils Pohl, NTT DoCoMo, Co-Chair: Hiroshi Okazaki, Inc. Triple- Frequency Range Octave Tu4C-1: VCO Band Low Phase Noise K/Ka-Band Inductor with a New Dual-Path State Univ.; Washington Hoque; Md.A. State Washington Chahardori; M. MaxLinear;Agarwal; M.A. P. Univ.; Heo; D. State Univ.; Washington Mokri; State Univ. Washington A Superharmonic Injection Tu4C-2: VCO in Based G-Band Quadrature CMOS Yu; H. Davis; of California, Ding; Univ. X. Skyworks Yu; B. Davis; of California, Univ. Gu; Q.J. Univ.; Xu; Zhejiang Solutions; Z. Davis of California, Univ. TUESDAY, 23 JUNE 23 | LACC 2020 TUESDAY, | – 17:15 15:55

Systems & Applications

403A Active Components East China Normal Univ. Tu4B-5: A 64.5–88GHz Coupling- Tu4B-5: Concerned CMOS LNA with >10dB Gain and 5dB Minimum NF Zhang; East China Normal Univ.; K. Zhang; of Houston; R. Chen; Univ. J. Tu4B-3: A CMOS Band-Pass Low Noise Band-Pass A CMOS Tu4B-3: Amplifier with Excellent Gain Flatness 5G Communications for mm-Wave Choi; Chungnam National H.-W. Choi; Chungnam National S. University; Kim; Chungnam National C.-Y. University; University A Tri (K/Ka/V)-Band Tu4B-4: Monolithic Amplifier with Shared CMOS Low Noise Gains Variable and Signal Path ; Univ. Tung Liang; National Chiao C.-J. Univ. Tung National Chiao Chiang; C.-W. Angeles; Los of California, Zhou; Univ. ; J. Angeles; Los of California, Huang; Univ. R. ; Univ. Tung National Chiao Wen; K.-A. ; Univ. Tung Chang; National Chiao M.-C.F. Univ. Tung Kuan; National Chiao Y.-C. Chen; G. Shi; East China Normal Univ.; C. Shanghai Eastsoft Microelectronics; Tu4B-2: A Compact Frequency-Tunable Frequency-Tunable A Compact Tu4B-2: Transceivers for Multi-Standard 5G VGA ON Semiconductor;Yishay; Ben R. Elad; ON Semiconductor D. Tu4B: High-Performance Low- Tu4B: Noise Amplifiers Chair: Chiao National Chinchun Meng, University Tung Naval Co-Chair: Luciano Boglione, Research Laboratory A 6.5–12GHz Balanced Tu4B-1: Amplifier with Gain Low-Noise Variable Gain Frequency-Selective Non-Foster Equalization Technique Li; Zhejiang N. Gao; Zhejiang Univ.; H. Wang; S. Li; Zhejiang Univ.; M. Univ.; Univ.; Zhang; Zhejiang Z. Zhejiang Univ.; Univ. Tung Chiao Kuan; National Y.-C. of Gu; Univ. Q.J. Univ.; Zhejiang Yu; ; X. Zhejiang Univ. Xu; Z. Davis; California,

Passive Components 402AB

Tu4A-5: Equivalent Circuit Models Circuit Equivalent Tu4A-5: Anisotropic Composite for Full-Tensor Right/Left-Handed Metamaterials Univ. Kagoshima Nagayama; T. Tu4A-4: Demonstration of Low Loss Demonstration Tu4A-4: V Bands RF Conductor in Ka and for 5G and Multilayers Using Cu/Fe Applications Millimeter Wave Yoon; Y.-K. of Florida; Univ. Bowrothu; R. of Florida Univ. E. Polat; Technische Univ. Darmstadt; Univ. Technische Polat; E. Darmstadt; Univ. Technische Jakoby; R. Darmstadt Univ. Technische Maune; H. Enabled Group Delay Negative Tu4A-3: Line Exhibiting Transmission Artificial Backward Mode, Dominant Squint-Free, Radiation Leaky-Wave Rutgers Wu; C.-T.M. Univ.; Zhu; Rutgers M. Univ. Tu4A-2: Liquid CrystalTu4A-2: Based Parallel- Guide Phase Dielectric Image Polarized Shifter at W-Band Darmstadt; Univ. Technische Tesmer; H. Darmstadt; Univ. Technische Reese; R. K. Wu; Polytechnique Montréal Polytechnique Wu; K. Christian Damm, Ulm University Chair: Christian Damm, Raytheon Co-Chair: Jason Soric, Company A Fine Picosecond Pulse Tu4A-1: Topology Based on Novel SRD Generator NLTL and Tapered Montréal; Rahman; Polytechnique M. Tu4A: Innovative Wave Wave Tu4A: Innovative and Manipulation Transmission, Generation TECHNICAL SESSIONS TECHNICAL

15:50 16:00 16:10 16:20 16:30 16:40 16:50 17:00 17:10 17:20 17:30

Microwave Field, Device & Circuit Techniques Device & Circuit Microwave Field, IMS

TUESDAY 38 TUESDAY 39

15:50 16:00 16:10 16:20 16:30 16:40 16:50 17:00 17:10 17:20 17:30

Late Breaking News

409AB Focus & Special Sessions Tu4H: Advanced Transistor Transistor Advanced Tu4H: Characterization Modeling and Company Raytheon Chair: Rob Jones, QORVO, Teeter, Co-Chair: Doug Inc.406AB J.L. Gomes; T.R. Cunha; J.C. Pedro; Pedro; Cunha; J.C. T.R. Gomes; J.L. Instituto de Telecomunicações Tu4H-3: A Transient Two-Tone RF Two-Tone A Transient Tu4H-3: of Method for the Characterization Capture and Emission Trapping Electron Dynamics in GaN HEMTs Nunes; Barradas; L.C. F.M. Tomé; P.M. Explaining the Different Tu4H-4: Time from Low Constants Extracted on GaN Y22 and IDS-DLTS Frequency HEMTs ­ Telecomuni Gomes; Instituto de J.L. Nunes; Instituto de cações; L.C. Instituto Pedro; J.C. Telecomunicações; de Telecomunicações Tu4H-1: Gate Bias Incorporation Gate Bias Incorporation Tu4H-1: Modelling into Cardiff Behavioural Formulation Bell; J.J. Cardiff University; Azad; E.M. Quaglia; Cardiff R. Cardiff University; Cardiff Moreno Rubio; J.J. University; University Cardiff Tasker; P.J. University; GaN and GaAs HEMT Channel Tu4H-2: Model for Nonlinear Microwave Charge and RF Applications Macquarie Univ. Parker; A.E. Tu4H-5: Extraction of an Extrinsic Extraction Tu4H-5: Network for InGaAs/ Parasitic InP DHBTs Scalable Model Using Electromagnetic simulation of Electronic Li; University Yukun of Technology Science and Emerging Technologies Emerging Technologies & Applications TUESDAY, 23 JUNE 23 | LACC 2020 TUESDAY, | – 17:15 15:55

Systems & Applications

408A Active Components

M. Roberg; Qorvo; G. Hegazi; Qorvo; Hegazi; Roberg; Qorvo; G. M. Qorvo Courtney; P. di Roma “Tor Vergata” di Roma “Tor Power Highly Linear & Efficient Tu4F-5: Amplifier with GaN Spatium Combiner Wavelength MMIC at Millimeter HPA Frequency Kitt; Qorvo; Qorvo; J. Yoon; S.D. Jackson; Qorvo; Murdock; Qorvo; E. D. and 64–110GHz in 250nm InP Liu; Z. Sharma; Princeton Univ.; T. Chappidi; Princeton C.R. Princeton Univ.; S. Princeton Univ.; Saeidi; H. Univ.; Sengupta; K. Princeton Univ.; Venkatesh; Princeton Univ. V-Band Cascode C to Tu4F-3: Amplifier Design Leveraging Distributed a Double Gate Length Gallium Nitride on Silicon Process “Tor di Roma Longhi; Università P.E. di Università Colangeli; S. Vergata”; Ciccognani; W. Vergata”; Roma “Tor Pace; L. Vergata”; “Tor di Roma Università Università Vergata”; di Roma “Tor Limiti; Università E. Leblanc; OMMIC; R. A 20W GaN-on-Si Solid State Tu4F-4: Amplifier for Q-Band Space Power Communication Systems “Tor di Roma Giofrè; Università R. di Roma Costanzo; Università F. Vergata”; A. Massari; Thales Alenia Vergata”; “Tor Space; A. Suriani; Thales Alenia Space; Vitulli; Thales Alenia Space; E. Limiti; F. Università Vergata” di Roma “Tor Tu4F-2: Broadband PA Architectures Architectures Broadband PA Tu4F-2: Combining andAsymmetrical with Across 50–70GHz Cells PA Stacked Tu4F: Innovations in Broadband in Innovations Tu4F: Amplifiers Power Millimeter-wave Systems BAE Chair: Brown, David NXP Co-Chair: Heijden , der Mark van Semiconductors Ultra- Power High Output Tu4F-1: Amplifier in InP Wideband Distributed Using Diamond Heat Technology DHBT Spreader FBH; Hossain; FBH; M. Shivan; T. Technical Johansen; Doerner;T.K. R. FBH; FBH; Nosaeva; of Denmark; K. Univ. Heinrich; FBH; W. FBH; Yacoub; H. Krozer; FBH V.

Passive Components

406AB TECHNICAL SESSIONS TECHNICAL

H. Yin; Southeast Univ.; Z. Jiang; Z. Yin; Southeast Univ.; H. Zhu; Southeast X.-W. Southeast Univ.; Southeast Univ. Yu; C. Univ.; Tu4E-5: Over-The-Air Behavioral Behavioral Over-The-Air Tu4E-5: Wave Modeling of Millimeter withBeamforming Transmitters Concurrent Dynamic Configurations Network Neural Utilizing Heterogenous R. Chai; Univ. of Michigan; A. Mortazawi; Mortazawi; A. of Michigan; Chai; Univ. R. of Michigan Univ. Tu4E-4: A Coupling Factor Independent A Coupling Factor Tu4E-4: System Transfer Wireless Power Nonlinear Circuits Two Employing R. Melville; Emecon R. A. Suárez; Universidad de Cantabria; Suárez; Universidad A. Tu4E-1: Mutual Injection Locking of Mutual Injection Tu4E-1: Through Inductor Oscillator Circuits Coupling Cantabria; de Ramírez; Universidad F. Microwave Field, Device & Circuit Techniques Device & Circuit Microwave Field, A. Suárez; Universidad de Cantabria Suárez; Universidad A. M. Pontón; Universidad de Cantabria; Universidad Pontón; M. Tu4E-3: Analysis and Design of aAnalysis Tu4E-3: Concurrent Dual-Band Self-Oscillating Mixer de Cantabria; Herrera; Universidad A. A. Suárez; Universidad de Cantabria; Suárez; Universidad A. de Cantabria Ramírez; Universidad F. S. Sancho; Universidad de Cantabria; Sancho; Universidad S. Tu4E-2: Analysis Tu4E-2: of the Transient Dynamics of Coupled-Oscillator Systems Subrata Halder, QORVO, Inc. QORVO, Co-Chair: Subrata Halder, Chair: The Aerospace Christopher Silva, Corporation

Tu4E: Nonlinear Circuits & Nonlinear Circuits Tu4E: Systems IMS IMS2020

TUESDAY

40 JW MARRIOTT L.A. LIVE, DIAMOND BALLROOM IMS2020

AMATEUR (HAM) 19:00 – 21:00 TUESDAY, 23 JUNE 2020 RADIO SOCIAL MS2020 will be hosting a ham radio social event in Los Angeles, repeater. Created in the 1950’s by broadcast engineer Art Gentry, W6MEP, California on Tuesday June 23 at 19:00. All radio amateurs and other the K6MYK repeater operated AM on 2 meters and covered the highly Iinterested IMS attendees are cordially invited. The keynote speaker will populated area, greatly increasing connectivity between hams in the Los be the VP of Engineering of the AMSAT Amateur Radio Satellite Organiza- Angeles area and helped spur widespread use of repeaters throughout tion, Jerry Buxton (call sign N0JY)! the country. AMSAT is a worldwide group of hams that was formed in the District of Today, hams are using the latest digital modes and SDR software Columbia in 1969 as an educational organization. For over 50 years defined radio technology in addition to traditional CW, AM phone, AMSAT groups in North America and elsewhere have played a key role SSB, FM, satellite, moon-bounce, and other radio techniques. in significantly advancing the state of the art in space science, space The event will also host the local San Bernardino Microwave Society! education, and space technology. Jerry will be presenting the current and SBMS is a non-profit technical organization that is dedicated to the future technology trends in the exciting area of amateur radio satellite advancement of communications above 1GHz. The club will be demoing communications. some of their amazing microwave equipment and projects that you don’t The Los Angeles, California location for IMS2020 has special significance want to miss! for amateur radio. Located in the Port of Los Angeles, the RMS Queen Participate in a fun and exciting Morse Code competition where con- Mary with her restored wireless room and fully equipped amateur radio testants compete for who can copy the code with the most accuracy! station W6RO is reminiscent of the humble beginnings of amateur radio. Appetizers and refreshments will also be provided! Established in 1979, it was the first permanent amateur radio station to be installed aboard a museum ship. The station is staffed daily and We look forward to seeing you at our exciting event in Los Angeles where guests may earn an operator’s certificate from W6RO. you will view live radio and project demos, learn about the latest advances in the Ham community, and network and connect with other Hams from Near the iconic Hollywood sign on Mount Lee holds significance in am- across the world! TUESDAY ateur radio history as being the site of the first fully-automated amateur

41 RF Globalnet Connects The RF and Microwave World

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rf-globalnet_ims2017.indd 1 3/29/17 1:05 PM WEDNESDAY, 24 JUNE 2020 IMS2020

Wednesday WEDNESDAY

43

Late Breaking News 404AB C.-L. Yang; National Cheng Kung Univ. Yang; C.-L. We1D-3: A Wearable Throat Vibration A Wearable We1D-3: Sensor Based on Split-Ring Microwave Resonator for Harmonics Detection Ho; National Cheng Kung Univ.; Y.-R. Dosimetry Experimental We1D-4: Study Applicator Dedicated of a Miniature RF RF Exposure of Severe to the Evaluation Impact on a 3D Biological Model Rigal; LAAS; L. Tamra; A. LAAS; Augé; S. (USR Lobjois; ITAV V. (USR 3505); ITAV (USR 3505); Ducommun; ITAV 3505); B. Grenier; LAAS Dubuc; LAAS; K. D. Self-Injection- Chest-Worn We1D-5: for Monitoring Tag Oscillator Locked Heart Rate Variability Univ.; Yat-sen Arif; National Sun R.E. Univ.; Yat-sen National Sun Su; W.-C. We1D: Novel Microwave Microwave Novel We1D: for Biomedical Technologies Sensing Abbott Labs Chair: Souvik Dubey, Kun Shan Wu, Co-Chair: Hung-Wei University A Quadband Implantable We1D-1: Antenna System for Simultaneous Wireless and Biotelemetry Powering of Deep-Body Implants Hanyang Yoo; H. Univ.; Basir; Hanyang A. Univ. The Tag We1D-2: Design of Transmitting Intubation Sensing for Nasogastric Chung Cheng Univ.; Lin; National M.-H. Chung Cheng Chang; National C.-C. Chang; National Chung Cheng S.-F. Univ.; Univ. Univ.; Yat-sen National Sun Tang; M.-C. Univ.; Yat-sen Horng; National Sun T.-S. Univ. Yat-sen National Sun Wang; F.-K. Focus & Special Sessions

403B Emerging Technologies Emerging Technologies & Applications We1C: Millimeter-Wave and and Millimeter-Wave We1C: Components Transmitter Terahertz Chair: Theodore Virginia Reck, Diodes Inc. Jet Co-Chair:Propulsion Adrian Tang, Laboratory M. Hella; Rensselaer Polytechnic Institute Hella; Rensselaer Polytechnic M. and High-Gain Broadband We1C-3: 400-GHz InGaAs mHEMT Medium- AmplifierPower S-MMIC John; IAF; L. Gashi; Fraunhofer B. Meier; Fraunhofer IAF; Fraunhofer IAF; D. Tessmann; A. IAF; Rösch; Fraunhofer M. Leuther; Fraunhofer A. Fraunhofer IAF; Maßler; IAF; M. Fraunhofer IAF; H. Fraunhofer IAF; Schlechtweg; Ambacher; Fraunhofer IAF O. A 160–183GHz 0.24-W (7.5% We1C-4: PA, and 0.14-W (9.5% PAE) PA PAE) Amplifier G-Band Power High-Gain, MMICs in 250-nm InP HBT Scientific & Imaging; Teledyne Griffith; Z. Scientific & Teledyne Urteaga; M. Scientific & Teledyne Rowell; Imaging; P. Scientific & Teledyne Tran; Imaging; L. Imaging A We1C-5: 140GHz AmplifierPower and 20.8%with 20.5dBm Output Power Technology in 250-nm InP HBT PAE of California, Ahmed; Univ. A.S.H. Seo; Sungkyunkwan Santa Barbara; M. of California, Univ. Farid; A.A. Univ.; Teledyne Urteaga; Santa Barbara; M. Buckwalter; J.F. Scientific & Imaging; Santa Barbara; of California, Univ. Santa of California, Univ. Rodwell; M.J.W. Barbara We1C-1: A 99–132GHz Frequency We1C-1: Quadrupler Output with 8.5dBm Peak and 8.8% DC-to-RF Efficiency inPower 130nm BiCMOS Mansha; M.W. Analog Devices; Wu; K. Institute; Rensselaer Polytechnic A 135–183GHz Frequency We1C-2: Sixtupler in 250nm InP HBT Do; Chalmers T.N.T. Bao; Ericsson; M. Kuylenstierna; D. Technology; of Univ. Zirath; H. Technology; of Chalmers Univ. Ericsson

| LACC 2020 JUNE 24 | WEDNESDAY, 09:40 – 08:00 Systems & Applications

403A Active Components We1B-5: Microwave Encoders with Microwave We1B-5: Synchronous Reading and Direction Detection for Motion Control Applications de Barcelona; Autònoma Univ. Paredes; F. de Barcelona; Autònoma Herrojo; Univ. C. de Barcelona Autònoma Martín; Univ. F. We1B-4: All-Digital Single Sideband We1B-4: (SSB) Bluetooth Low Energy (BLE) Backscatter with an Inductor-Free, Capacitance Modulator Digitally-Tuned M.S. Washington; of Rosenthal; Univ. J. Washington of Univ. Reynolds; E.C. Durmaz; IHP; C. Baristiran Kaynak; Baristiran Kaynak; Durmaz; IHP; C. E.C. Cordeau; XLIM D. IHP; Kaynak; IHP; M. Pothier; XLIM (UMR A. (UMR 7252); 7252) Battery-Less An Integrated We1B-2: with Clock Tag Wirelessly RFID Powered for UWB Transmitter Recovery and Data Localization Los of California, Rahmani; Univ. H. of California, Univ. Babakhani; A. Angeles; Los Angeles A Silicon-Based Closed- We1B-3: Loop 256-Pixel Near-Field Capacitive with 3-ppm Sensitivity Array Sensing and Selectable Frequency Shift Gain Du; Chen; J. C. Liang; Zhou; C.-J. J. Angeles; Los of California, Huang; Univ. R. Hwang; Alcatera; J.C.M. Al Hadi; R. We1B: Advances Advances Wirelessin We1B: Sensors Graz University Chair: Jasmin Grosinger, of Technology Grenoble Co-Chair: Etienne Perret, Institute of Technology Highly Sensitive Capacitive We1B-1: Locked Sensor Based on Injection Oscillators with ppm Sensing Resolution B. Dalmay; Hallepee; C. C. Babay; M. Barelaud; XLIM (UMR 7252); Chang; M.-C.F. Lehigh University; Angeles Los of California, Univ.

Passive Components 402AB

We1A-5: A Synthesis-Based Design We1A-5: Duplexers Waveguide Procedure for Using a Stepped E-Plane Bifurcated Junction di Milano; Macchiarella; Politecnico G. di Milano; Gentili; Politecnico G.G. L. Accatino; ACConsulting; V. Tornielli Tornielli V. Accatino; ACConsulting; L. ESA-ESTEC di Crestvolant; We1A-4: Synthesis of Extracted Pole of Extracted Synthesis We1A-4: Spikes Without the Extra Filters Yu; Zeng; CUHK; M. Y. CUHK; Yang; Y. Xidian Univ. Wu; CUHK; Q. We1A-3: A Dispersive Coupling We1A-3: Structure for In-Line Helical Resonator Zeros Transmission Filters with CUHK Wu; Zhang; CUHK; K.-L. Y. We1A-2: Design of Extracted-Pole Extracted-Pole Design of We1A-2: Filters: An Application-Oriented Synthesis Approach di Milano; Macchiarella; Politecnico G. CommScope Tamiazzo; S. We1A-1: Direct Synthesis Technique Technique Direct Synthesis We1A-1: of Quasi-Canonical Filters Comprising Blocks Cascaded Frequency-Variant National Univ.; Yokohama He; Y. Yoshikawa; N. Ma; Saitama University; Z. National Univ. Yokohama We1A: Non-Planar Filters Non-Planar I We1A: RS Microwave Chair: Simone Bastioli, Public University Co-Chair: Miguel Laso, (UPNA) of Navarre TECHNICAL SESSIONS TECHNICAL

08:00 08:10 08:20 08:30 08:40 08:50 09:00 09:10 09:20 09:30 09:40

Microwave Field, Device & Circuit Techniques Device & Circuit Microwave Field, IMS

WEDNESDAY 44 IMS TECHNICAL SESSIONS 08:00 – 09:40 | WEDNESDAY, 24 JUNE 2020 | LACC

406AB 408A 408B We1E: High Frequency Non- We1F: Advances in 5G Millimeter- We1G: Emerging Next Generation Reciprocal Techniques using wave Systems and Architectures GaN RF Technologies for 5G and Novel Material, Device and Circuit MMW Applications Approaches Chair: Gent Paparisto, Cadence Design Systems, Inc. Chair: Jeong-Sun Moon, HRL Chair: Dimitris Pavlidis, Florida Co-Chair: Christian Fager, Chalmers Laboratories

International University University of Technology Co-Chair: Kenneth Mays, Boeing 08:00 Co-Chair: Yuanxun Ethan Wang, University of California, Los Angeles We1E-1: Lamb Wave Resonator Loaded We1F-1: Demonstrating 139Gbps We1G-1: Emerging High Power mm- Non-Reciprocal RF Devices and 55.6bps/Hz Spectrum Efficiency Wave RF Transistors Using 8×8 MIMO Over a 1.5-km Link

T. Lu; J.D. Schneider; X. Zou; S. Tiwari; at 73.5GHz Y.-K. Chen; DARPA; A. Sivananthan; Booz 08:10 08:20 Univ. of California, Los Angeles; Allen Hamilton; T.-H. Chang; HetInTec Z. Yao; Berkeley Lab; G. Carman; Univ. C.B. Czegledi; Ericsson; M. Hörberg; of California, Los Angeles; R.N. Candler; Ericsson; M. Sjödin; Ericsson; P. Univ. of California, Los Angeles; Y.E. Wang; Ligander; Ericsson; J. Hansryd; Ericsson; Univ. of California, Los Angeles J. Sandberg; Ericsson; J. Gustavsson; Ericsson; D. Sjöberg; Ericsson; D. Polydorou; OTE; D. Siomos; OTE

We1E-2: Microwave Applications We1F-2: Digital Predistortion of We1G-2: Advanced GaN HEMT of Zirconium-Doped Hafnium Oxide Millimeter-Wave Phased Array Modeling Techniques and Power Ferroelectrics: From Nanoscale Transmitter with Over-The-Air Amplifiers for Millimeter-Wave Calculations up to Experimental Results Calibrated Simplified Conductive Applications Feedback Architecture M. Aldrigo; M. Dragoman; IMT Bucharest; S. Shinjo; Mitsubishi Electric; M. Hangai; E. Laudadio; Università Politecnica delle N. Tervo; Univ. of Oulu; B. Khan; Univ. of Mitsubishi Electric; Y. Yamaguchi; 08:30 Marche; S. Iordanescu; IMT Bucharest; Oulu; O. Kursu; Univ. of Oulu; J.P. Aikio; Mitsubishi Electric; M. Miyazaki; M. Modreanu; I.M. Povey; Univ. College Univ. of Oulu; M. Jokinen; Univ. of Oulu; Mitsubishi Electric Cork; F. Nastase; S. Vulpe; IMT Bucharest; M.E. Leinonen; Univ. of Oulu; M. Juntti; P. Stipa; A. Di Donato; L. Pierantoni; Univ. of Oulu; T. Rahkonen; Univ. of Oulu; D. Mencarelli; Università Politecnica delle A. Pärssinen; Univ. of Oulu Marche 08:40

We1E-3: Novel Non-Reciprocal We1F-3: On the Effectiveness of We1G-3: Qorvo’s Emerging GaN Microwave Spin Wave and Magneto- Near-Field Feedback for Digital Technologies for mmWave Applications Elastic Wave Devices for On-Chip Signal Pre-Distortion of Millimeter-Wave RF Processing Beamforming Arrays Y. Cao; Qorvo; V. Kumar; Qorvo; S. Chen; Qorvo; Y. Cui; Qorvo; S.D. Yoon; Qorvo; E.

I.N. Krivorotov; Univ. of California, Irvine; A. Ben Ayed; Univ. of Waterloo; Beam; Qorvo; A. Xie; Qorvo; J. Jimenez; 08:50 09:00 E.A. Montoya; Univ. of California, Irvine; G. Scarlato; Univ. of Waterloo; P. Mitran; Qorvo; A. Ketterson; Qorvo; C. Lee; A. Khan; Univ. of California, Irvine; A.N. Univ. of Waterloo; S. Boumaiza; Univ. of Qorvo; D. Linkhart; Metamagnetics; A. Slavin; Oakland Univ.; M. Wu; Colorado Waterloo Geiler; Metamagnetics State Univ. WEDNESDAY

We1E-4: Organic Ferrimagnetic We1F-4: High-Frequency Vector- We1G-4: High-Speed Graded-Channel Material Vanadium Tetracyanoethylene Modulated Signal Generation Using GaN HEMTs with Linearity and for Non-Reciprocal Microwave Frequency-Multiplier-Based RF Efficiency Applications Beamforming Architecture J.-S. Moon; HRL Laboratories; B. Grabar; N. Zhu; Yale Univ.; A. Franson; S. Kurfman; I. Jaffri; Univ. of Waterloo; A. Ben Ayed; HRL Laboratories; M. Antcliffe; HRL 09:10 09:20 M. Chilcote; The Ohio State University; Univ. of Waterloo; A.M. Darwish; U.S. Laboratories; J. Wong; HRL Laboratories; D.R. Candido; Univ. of Iowa; K.E. Nygren; Army Research Laboratory; S. Boumaiza; C. Dao; HRL Laboratories; P. Chen; HRL Colorado State Univ.; M.E. Flatté; Univ. Univ. of Waterloo Laboratories; E. Arkun; HRL Laboratories; of Iowa; K.S. Buchanan; Colorado State I. Khalaf; HRL Laboratories; A. Corrion; Univ.; E. Johnston-Halperin; The Ohio HRL Laboratories; J. Chappell; HRL State University; H.X. Tang; Yale Univ. Laboratories; N. Venkatesan; Univ. of Notre Dame; P. Fay; Univ. of Notre Dame

We1E-5: Non-Reciprocal Lithium We1F-5: Aperture-Array & Lens+FPA We1G-5: Advances in the Super-Lattice Niobate-on-Silicon Acoustoelectric Multi-Beam Digital Receivers at 28GHz Castellated Field Effect Transistor Delay Lines on Xilinx ZCU 1275 RF SoC (SLCFET) for High Power Density, Energy Efficient RF Amplification H. Mansoorzare; Univ. of Central Florida; S. Pulipati; V. Ariyarathna; Md.R. Khan; R. Abdolvand; Univ. of Central Florida S. Bhardwaj; A. Madanayake; Florida J. Chang; Northrop Grumman; International Univ. S. Afroz; Northrop Grumman; B. Novak;

We1E-6: A Highly Linear Non-Magnetic Northrop Grumman; J. Merkel; Northrop 09:30 GaN Circulator Based on Spatio- We1F-6: A 3D Detect-Array for Low- Grumman; K. Nagamatsu; Northrop Temporal Modulation with an IIP3 of Complexity W-Band Beam Sensing and Grumman; R. Howell; Northrop Grumman 56dBm Direction-of-Arrival Estimation J.A. Bahaonde; Columbia Univ.; J. Kimionis; M.J. Holyoak; A. Singh; S. I. Kymissis; Columbia Univ.; Shahramian; Y. Baeyens; Nokia Bell Labs H. Krishnaswamy; Columbia Univ. 09:40

Microwave Field, Device & Circuit Techniques Passive Components Active Components Systems & Applications Emerging Technologies & Applications Focus & Special Sessions Late Breaking News 45

2020 S IM Rob Sinno – API Technologies Bob Muro – Pentek Erik Luther – X-Microwave Markus Loerner – Rohde & Schwarz Winfried Simon – IMST GmbH Fang Lu – SAGE Millimeter Lu – SAGE Fang Mo Hasanovic – Smiths Interconnect Mo Hasanovic Vijayendra Siddamsetty – Texas Instuments Texas Siddamsetty – Vijayendra Arun Natarajan – MixComm Christina Huang – JQL Electronics Inc. John Coonrod – Rogers Corp. Coonrod – Rogers John Daniel Schulze, Susan Bagan – MST Dyconex AG Dyconex – MST Susan Bagan Daniel Schulze, Jared Burdick – Knowles Capacitors Jared Burdick – Knowles Gavin FisherGavin – IMECHE Abram Rose – Naitonal Instruments David Bates – Knowles Bates – Knowles David Janet O’Neil – ETS-Lindgren Dave Thibado – Knowles Corporation Thibado – Knowles Dave Paulo Correa – Empowe RF Systems Correa – Empowe Paulo Aleksandr Kotiukov – Morion Aleksandr Kotiukov Tawna Wilsey – Cadence Wilsey Tawna Rafi Hershtig – K&L Microwave Hunsoo Choo, Hsia Kang – Texas Instruments Texas Hsia Kang – Hunsoo Choo, Brian Rautio – Sonnet Software SPEAKERS Sruba Systems – Cadence Design Seshadri Craig Kirkpatrick – FormFactor High Power Devices, including GaN Devices including GaN Devices Devices, High Power Antenna and Antenna Components Antenna and n n 09:40 – 17:00 WEDNESDAY, 24 JUNE 24 2020 WEDNESDAY, – 17:00 09:40

MicroApps Media Sponsor: 5G Millimeterwave, FR2 5G Millimeterwave, Techniques CAD and Modeling Products and Systems n n n SCHEDULE Use of Butler Matrix in Wi-Fi MIMO Application Wi-Fi MIMO Use of Butler Matrix in Designing a Practical 100GbE Real-time Recording System for the Xilinx RFSoC Plug ‘n Play RF Design - Rapid Prototyping and Production of RF and Microwave RF Design - Rapid Prototyping and Production of RF and Microwave ‘n Play Plug Systems Beamforming and Multi Array Measurements Array Beamforming and Multi Highly Integrated Ka-Band Frontend Module for SATCOM and 5G Ka-Band Frontend Module for SATCOM Highly Integrated Dual Antennas Polarized Best Practices for the Installation and Test of Board Level Passive Components for Passive of Board Level Test Best Practices for the Installation and Ka-band Applications and Above Enabling High Channel Count Multi-Antenna Array Systems Array Enabling High Channel Count Multi-Antenna The Design of Integrated RFSOI based mm-wave Beamformers RFSOI based mm-wave The Design of Integrated Millimeterwave 5G solutions and 7mm compact sub 6GHz 5G Solution Millimeterwave How Material Properties and Fabrication can Impact RF Filter Material Properties Performance and Fabrication How Advanced Rigid Organic Substrates for High Frequency Packaging Applications Substrates for High Frequency Packaging Rigid Organic Advanced Passive RF Mounting & Integration RF Mounting Passive Optimisation of Load and Source pull tuning to 110 GHz on Wafer 110 GHz on Optimisation of Load and Source pull tuning to Lies My Tester Told Me: How Impairments in RF Test Equipment Can Hide a DUT’s Equipment Can Hide a DUT’s Test Impairments in RF Me: How Told Tester Lies My EVM True A Panelized Filter Array for Millimeter Wave 5G Applications 5G Wave for Millimeter Array Filter A Panelized 5G New Radio Transceiver and Antenna Arrays: Today’s Modern OTA Test Challenges Challenges Test Modern OTA Today’s Arrays: Antenna and Transceiver Radio 5G New SESSION and Solutions - PANEL S-C Band High Q Low Loss FiltersS-C Band High Q Low for 5G FR1 and Radar Bands Pulse Shape Duplication for High Power SSPA’s Pulse Shape Duplication for High Power Precision Low Phase Noise Oven Controlled Crystal Controlled Phase Noise Oven Precision Low reference source Oscillator as a for modern synthesizers Automating Simulation of S-Parameters in Spectre Simulation of S-Parameters Automating Tunable and Fixed and Flexibility of Filtering Solutions enhances Dynamic Range Tunable Measurements 4G-5G-LTE Bridging the Transition from LTE to 5G NR through Coexistence in Transceiver Transceiver to 5G NR through Coexistence in from LTE Transition Bridging the Integration Sonnet’s Upcoming Fast Solver: Beowulf Upcoming Fast Sonnet’s TITLE Power Amplifier Measurements using Spectre RF Option and Virtuoso ADE Explorer Virtuoso RF Option and using Spectre Amplifier Measurements Power and Assembler Toolkit Engineer’s the Microwave WinCal, 9:40 9:55 16:50 16:35 16:20 16:05 15:50 15:35 15:20 15:05 14:50 14:35 14:20 14:05 13:50 13:35 13:20 13:05 12:00 11:40 11:25 11:10 10:55 10:40 10:25 10:10 START TIME START

6GHz, FR1 5G Cell Phone ≤ 6GHz, Components & Materials Techniques Instrumentation and Measurement

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WEDNESDAY 46 WEDNESDAY 47

2020 S IM A. Pacewicz; Warsaw Univ. of Technology; Technology; of Univ. Warsaw Pacewicz; A. Technology of Univ. Warsaw Kopyt; P. and Extension of Acceleration WEIF1-4: (RPIM) Interpolation Method Radial Point to Complex Electromagnetic Structures Stefan; A.I. Technologies; Sabet; EMAG K. Technologies EMAG a Compact Towards WEIF1-5: Progress Miniaturized Rubidiumand Low-Power Oscillator (mRO) Leuenberger; Gouloumet; Orolia; B. J. Grop; Orolia; S. Schori; Orolia; Orolia; C. Rochat; Orolia P. WEIF1-6: Broadband Conductivity Measurement Method up to 110GHz Disk Circular Using a Balanced-Type Resonator AIST Horibe; AIST; M. Kato; Y. Resonator WEIF1-7: Millimeter-Wave Inductor Based on High Quality Factor CPS and Capacitor Based on Slow-Wave (EA 7520); Saadi; RFIC-Lab A.A. WEIF1-35: Power-Combined RectennaWEIF1-35: Power-Combined Transfer Wireless Power for X-Band Array of Colorado University Kwiatkowski; E. Naval Rodenbeck; U.S. Boulder; C.T. Barton; University Research Laboratory;T.W. University Popovic; of Colorado Boulder; Z. of Colorado Boulder inWEIF1-36: Conductivity Measurement Open Fabry-Perot Band with a mm-Wave Resonator Technology; of Univ. Warsaw Cuper; J. Technology; of Univ. Warsaw Salski; B. Technology; of Univ. Warsaw Karpisz; T. RFIC-Lab (EA 7520); Margalef-Rovira; M. Ferrari; Amara; RFIC-Lab (EA 7520); P. Y. RFIC-Lab (EA 7520) for PCB Gasket A Compact WEIF1-8: Suppression at Leakage Waveguide 110–170GHz Technology; of He; Chalmers Univ. Z.S. Technology; of Hassona; Chalmers Univ. A. Zirath; Pérez-Ortega; Gotmic; H. Á. Technology of Chalmers Univ. WEIF1-9: 3D-Printed Broadband Using Helical- Transformers Impedance Line Segments Transmission Microstrip de Lopez-Villegas; Universitat J.M. de Salas; Universitat A. Barcelona; Vidal; de Universitat Barcelona; N. Barcelona

WEDNESDAY, 24 JUNE 24 2020 WEDNESDAY, WEIF1-26: Complexity Analysis ofAnalysis WEIF1-26: Complexity Amplifiers Linearization Wideband Power for Transmission Signal in Multi-Band Systems Massive MIMO Technology; of Chalmers Univ. Wang; S. Technology; of Cao; Chalmers Univ. W. Technology of Eriksson; Chalmers Univ. T. WEIF1-27: Mechanically Decoupled Rectangular from MMIC to Transitions at G-Band Waveguides and Dielectric Hitzler; Ulm; M. Geiger; Universität M. Universität Waldschmidt; Ulm; C. Universität Ulm WEIF1-28: A Analysis Phase Method Resonancefor Ferromagnetic of Magnetic Nanowires Characterization Garcia; of Minnesota; B. Zhang; Univ. Y. of Um; Univ. J. of Minnesota; Univ. of Minnesota; Stadler; Univ. Minnesota; B. of Minnesota Franklin; Univ. R. mmWave A Software-Defined WEIF1-29: Comprised of Modular, Architecture Radio Attain Near-Infinite Controllable Pixels to and Beam Steering Polarization, Pattern, Angles IMS Choi; POSTECH; POSTECH; D. Park; J. Hong; POSTECH W. Optimization WEIF1-3: Rapid Microwave Using a Design Database and Inverse/ Metamodels Forward University Gdansk Pietrenko-Dabrowska; A. Koziel; Reykjavik S. Technology; of Bandler; Univ. McMaster J.W. University; WEIF1-31: Phase Shifter-Relaxed and 4×4 Tuning Control-Relaxed Continuous Butler Matrix Li; P. State Univ.; Washington Ren; H. Texas of Gu; Univ. Y. Univ.; State Washington Washington State Arigong; at Arlington; B. Univ. WEIF1-32: An Automatic Gain and for DC-Coupled Offset Control Circuit Radar Systems Continuous-Wave Erlangen-Nürnberg; Michler; FAU F. Erlangen-Nürnberg; Schoenhaerl; FAU S. Schellenberger; Brandenburgische S. FAU Shi; K. Universität; Technische Scheiner; FAU Erlangen-Nürnberg; B. Erlangen- Lurz; FAU Erlangen-Nürnberg; F. Erlangen- FAU Weigel; Nürnberg; R. Koelpin; Brandenburgische A. Nürnberg; Universität Technische WEIF1-33: Snow Depth Measurements from an Octo-Copter Mounted Radar McCulloch; J. Agritech; Lincoln Tan; A.E.-C. Rack; University of Canterbury;W. University Agritech; of Canterbury; Platt; Lincoln I. Woodhead; Lincoln Agritech I. and High- WEIF1-34: Ultra-Compact Wireless Sensing Efficiency Rectenna for Applications in Concrete Structure Loubet; LAAS; G. Takacs; A. Sidibe; LAAS; A. LAAS Dragomirescu; LAAS; D. 13:40-15:20

UNIVERSITY STATE MICHIGAN JEFFREY NANZER,

S. Ma; Fudan Univ.; J. Ren; Fudan Univ. J. Ma; Fudan Univ.; S. L. Nie; Fudan Univ.; D. Wei; Fudan Univ.; Fudan Univ.; Wei; D. Nie; Fudan Univ.; L. WEIF1-18: High-k and Low-Loss DielectricWEIF1-18: High-k Tailored Filaments, Composite Feedstock of Microwave Additive Manufacturing for Devices Wang; of South Florida; J. Univ. Kosamiya; V. of South Florida Univ. Kinetic Inductance WEIF1-19: Bi-Layer Detectors for W-Band de Cantabria; Universidad Aja; B. Ambacher; Fraunhofer IAF O. Compact PHEMTA 20–30GHz WEIF1-25: Amplifier Using Coupled-Line Power Technique Based MCCR Matching Fudan Univ.; Wu; T. Zhang; Fudan Univ.; J. L. de la Fuente; Universidad de Cantabria; de la Fuente; Universidad L. Fernandez; de Cantabria; Universidad A. Cantabria; de Universidad Pascual; J.P. de Cantabria; M.C. Artal; Universidad E. Magaz; de Ory; Nanociencia; M.T. IMDEA Granados; Astrobiología; D. Centro de Martin-Pintado; IMDEA Nanociencia; J. Gomez; Centro A. Astrobiología; Centro de de Astrobiología Wave WEIF1-2: Efficient Modeling of Rough Slabs withThrough Propagation FDTD Zhang; Univ. X. Toronto; of Bakirtzis; Univ. S. Toronto of Sarris; Univ. Dublin; C.D. College of a WEIF1-20: Characterization Junction Comb Generator Josephson NIST; Boaventura; A.S. NIST; Babenko; A.A. Brevik; NIST; J.A. Flowers-Jacobs; N.E. Williams; NIST; Z. Fox; NIST; D.F. A.E. NIST; of Colorado Boulder; University Popovic; Benz; NIST Dresselhaus; NIST; S.P. P.D. WEIF1-21: Design and Measurement Wave of a Traveling Josephson Fabricated in a Amplifier Parametric Qubit Process Superconducting Vahidpour; Computing; M. Feng; Rigetti D.C. Mohan; Rigetti Y. Computing; Rigetti Computing; Rigetti Sharac; Computing; N. Stanwyck; Computing; S. Rigetti Whyland; T. Ramachandran; Computing; G. Rigetti Selvanayagam; Computing; M. Rigetti Computing Rigetti WEIF1-22: Lock Detector Integrated in a High Order Frequency Multiplier at 60-GHz-Band in 45nm Operating CMOS SOI Technology Siligaris; A. Boulmirat; CEA-LETI; A. Gonzalez CEA-LETI; J.L. Jany; CEA-LETI; C. Jimenez; CEA-LETI MicrostripA Magnetless WEIF1-23: FilteringCoupled Based on Circulator Time-Modulated Resonators Static and Nafe; M. Davis; of California, Univ. Wu; X. of Liu; Univ. X. Davis; of California, Univ. Davis California, 32-Gb/s 5.6-VppA Novel WEIF1-24: Digital-to-Analog Converter 100nm in for 5G Signal Generation Technology GaN Friesicke; Fraunhofer IAF; C. Weiß; M. Fraunhofer IAF; Quay; Fraunhofer IAF; R.

CO-CHAIR: | CO-CHAIR: CONSULTANT CHAIR: ZAHER BARDAI, INTERACTIVE FORUM INTERACTIVE

Y. Zhu; UESTC; Y. Dong; UESTC Y. Zhu; UESTC; Y. WEIF1-17: Novel Dual-Band Bandpass-to- Bandstop Filter Using Shunt PIN Switches Line Transmission Loaded on the E. Guerrero; Univ. Autònoma de Barcelona; Autònoma Guerrero; Univ. E. de Barcelona; Autònoma Univ. Silveira; P. de Barcelona Autònoma Univ. de Paco; P. WEIF1-16: Synthesis Considerations for WEIF1-16: Synthesis Considerations LadderShunt-Starting Acoustic Wave Filters and Duplexers K. Zhou; Polytechnique Montréal; K. Wu; Wu; Montréal; K. Zhou; Polytechnique K. Montréal Polytechnique WEIF1-15: Compact Substrate-Integrated WEIF1-15: Compact Substrate-Integrated Filtering Crossover by Waveguide Embedding CPW Quarter-Wavelength Resonators J. Lee; Korea Univ. J. de Barcelona; Autònoma Univ. Triano; A. de Barcelona; Autònoma Univ. Verdú; J. J. Lee; Korea Univ.; S. Nam; Korea Univ.; Nam; Korea Univ.; S. Lee; Korea Univ.; J. WEIF1-14: Distributed-Element Absorptive Bandpass Filter a Broadband with Impedance Matching P. Li; Washington State Univ.; H. Ren; H. State Univ.; Washington Li; P. Texas of Gu; Univ. Y. Univ.; State Washington State Portland Pejcinovic; Arlington; B. at State Univ. Washington Arigong; B. Univ.; WEIF1-13: A Second Harmonic Separation WEIF1-13: Symmetric Ports with 180° Coupler Transparent Arbitrary Ratio and Coupling Terminations G. Ceccato; Università di Pavia; J.L. Cano; J.L. di Pavia; Ceccato; Università G. Mediavilla; A. de Cantabria; Universidad Perregrini; de Cantabria; L. Universidad di Pavia Università R. Islam; Washington State Univ.; Univ.; State Washington Islam; R. WEIF1-12: Controlled High Order Mode Coupler Bench Tracking for Generation Test WEIF1-11: Concurrent Dual-Band for Transformer Microstrip Line Hilbert AnalogSpectrum Real-Time Aggregation Signal Processing State Univ.; Washington Maktoomi; Md.H. Arigong; Arlington; B. at Texas of Gu; Univ. Y. State Univ. Washington A. Moulay; INRS-EMT; T. Djerafi; INRS-EMT T. INRS-EMT; Moulay; A. WEIF1-10: Gysel Power Divider with FixedWEIF1-10: Gysel Power Impedance Characteristic P. Qin; Zhejiang Univ.; T. Li; Zhejiang Univ.; Univ.; Li; Zhejiang T. Qin; Zhejiang Univ.; P. Li; Zhejiang Univ. E.-P. WEIF1-1: Toroidal Metasurface for Toroidal WEIF1-1: Sensing High Efficiency WEIF1 WEIF1 IMS LACC Antenna and Antenna Components Antenna and including GaN Devices Devices, High Power n n Techniques CAD and Modeling Products and Systems 5G Millimeterwave, FR2 5G Millimeterwave, n n n 6GHz, FR1 5G Cell Phone ≤ 6GHz, Components & Materials Techniques Instrumentation and Measurement n n n

Late Breaking News 404AB F. Seehaus; FAU Erlangen-Nürnberg; Seehaus; FAU F. We2D-4: A Feasibility Study on the A Feasibility We2D-4: Imaging for in-vivo Use of Microwave Screening of Knee Prostheses Erlangen-Nürnberg; Root; FAU K. Erlangen-Nürnberg; Ullmann; FAU I. Erlangen-Nürnberg FAU Vossiek; M. Vital Sign and Tracking Human We2D-5: Monitoring with a Switched Phased- Radar Self-Injection-Locked Array Univ.; Yat-sen Su; National Sun W.-C. Univ.; Yat-sen National Sun Juan; P.-H. Univ.; Yat-sen Chian; National Sun D.-M. Univ.; Yat-sen Horng; National Sun T.-S. Univ.; Yat-sen National Sun Wen; C.-K. Univ. Yat-sen National Sun Wang; F.-K. We2D-3: A High-Sensitivity Low- We2D-3: Vital Sign Radar Sensor Based Power Oscillator on Super-Regenerative Architecture Chen; A.Y.-K. Yuan; Rutgers Univ.; Y. Rutgers Wu; C.-T.M. Cal State Northridge; Univ. We2D: Advancement Advancement of We2D: Radar and Imaging Biomedical Chair: National Chai-Chan Chang, University Chung Cheng Co-Chair: Tech Changzhi Texas Li, University Frequency-Offset Self- We2D-1: (FOSIL) Radar for Injection-Locked Vital Sign Monitoring Noncontact Univ.; Yat-sen Juan; National Sun P.-H. Univ.; Yat-sen Chen; National Sun K.-H. Univ. Yat-sen National Sun Wang; F.-K. Wrist Pulse Noncontact We2D-2: Detection Using 24-GHz Waveform Radar Sensor for Continuous-Wave Blood Pressure Estimation Tseng; C.-H. Tech; Tseng; Taiwan T.-J. Tech Taiwan

Focus & Special Sessions

403B Emerging Technologies Emerging Technologies & Applications We2C-5: Flexible Radar Front End with We2C-5: at 300GHz Transition Multimodal Gut; Ulm; S. Geiger; Universität M. Hügler; Universität Ulm; P. Universität Ulm Universität Waldschmidt; Ulm; C. A. Shirane; K. Okada; Tokyo Institute of Tokyo Okada; Shirane; K. A. Technology Wireless We2C-3: Communication BarrierUsing Fermi-Level-Managed Waveguide- Diode Receiver with J-Band Input Port Yi; L. Toichi; K. Ayano; F. Nagatsuma; T. Fujiwara; NTT; M. Osaka Univ.; Ito; Kani; NTT; H. NTT; J. Iiyama; N. Kitasato University A 680GHz Direct Detection We2C-4: Receiver Dual-Channel Polarimetric A. Nguyen; Leong; K. K. Cooke; C.M. Mei; Northrop Grumman; Escorcia; X. Barton; T.W. Cubic Nuvotronics; Arroyo; J. of Colorado Boulder;University NASA Wu; Amici; D.L. De G. Toit; Du C. Deal; W.R. Goddard Space Flight Center; Northrop Grumman We2C-1: A We2C-1: 300GHz Wireless Transceiver in 65nm CMOS for IEEE802.15.3d Using Push-Push Subharmonic Mixer Miura; Fujimura; T. Abdo; T. I. Institute of Technology; Tokyo Tokgoz; K.K. Nosaka; NTT; Hamada; NTT; H. H. Wireless Link 0.8-m 100Gbps We2C-2: 240GHz IQ Based on Fully Integrated and Receiver Transmitter Maletic; IHP; E. Eissa; IHP; N. M.H. Kissinger; Kraemer;IHP; D. Grass; IHP; R. Malignaggi; IHP A. Ulm; Universität We2C: Millimeter-Wave and and Millimeter-Wave We2C: and Receiver Transmitter Terahertz Systems Renesas Electronics Chair: Samet Zihir, Corporation Co-Chair: Chalmers Herbert Zirath, University of Technology

WEDNESDAY, 24 JUNE 2020 | LACC 2020 JUNE 24 | – 11:50 WEDNESDAY, 10:10

Systems & Applications

403A Active Components J.-F. Mao; Shanghai Jiao Tong Univ. Tong Mao; Shanghai Jiao J.-F. We2B-5: Noncontact High-Linear We2B-5: Motion Sensing Based on a Modified Differentiate and Cross-Multiply Algorithm Univ.; Tong Jiao Xu; Shanghai W. Univ.; Tong Gu; Shanghai Jiao C. We2B-4: Long-Range Zero-Power Multi- Zero-Power Long-Range We2B-4: UsingSensing in Industrial Environment Diversity and 3D RadarPolarization Imagery Marchal; LAAS; Henry;T. LAAS; D. C. Dejous; IMS (UMR 5218); S. Hemour; Dejous; IMS (UMR 5218); S. C. IMS (UMR 5218) A 5.8GHz Fully-Tunnel-Diodes- We2B-2: and 48dB-Gain 88mV, Based 20µW, Tag Backscattering RFID Fully-Passive Hester; Georgia J. Tech; Eid; Georgia A. Georgia Tech Tentzeris; M.M. Tech; Tag Active for We2B-3: Reflector Harmonic Radar Wave Millimeter at 61/122GHz ISM Band Based on 130nm-BiCMOS SiGe:C Technology FHR; Hansen; Fraunhofer S. Pohl; FHR; N. Bredendiek; Fraunhofer C. Fraunhofer FHR Aubert; LAAS; Philippe; LAAS; H. J. LAAS Pons; P. We2B: Advances in Radar and in Radar Advances We2B: Sensor Systems Backscatter Mitsubishi Yamamoto, Chair: Kazuya Electric Corporation Shanghai Jiao Co-Chair: Changzhan Gu, University Tong Nonlinear Negative We2B-1: Resistance-Based Harmonic Backscatter Amato; Gumber; IMS (UMR 5218); F. K. Università Vergata”; di Roma “Tor

Passive Components 402AB

We2A-5: Substrate Integrated Integrated Substrate We2A-5: Bandpass Filters Waveguide Implemented on Silicon Interposer for Applications Terahertz Franc; LAPLACE A.-L. LAAS; Prigent; G. Wietstruck; IHP; M. (UMR 5213); M. IHP Keynak; A Compact Diplexer for We2A-6: 20/30GHz SIW- Circularly Polarized Antennas Universität Technische Sieganschin; A. Technische Jaschke; Hamburg-Harburg; T. Jacob; A.F. Hamburg-Harburg; Universität Hamburg-Harburg Universität Technische We2A-4: Compact Harmonic Compact Rejection We2A-4: Filter Satellite for C-Band High-Power Applications Pública de Universidad Teberio; F. Martin-Iglesias; Universidad P. Navarra; Arregui; I. Pública de Navarra; I. Pública de Navarra; Universidad Arnedo; Pública de Navarra; Universidad Pública de Universidad Lopetegi; T. Laso; Universidad M.A.G. Navarra; Pública de Navarra We2A-2: An All-Metal An All-Metal We2A-2: Capacitive Coupling Structure for Coaxial Cavity Filters CUHK Wu; Chen; CUHK; K.-L. Y. We2A-3: Design of a Four Channel a Four Design of We2A-3: C-Band Multiplexer with a Modified Star-Junction Topology Alenia Thales Martínez Mendoza; M. Thales Alenia Space; M. García Tudela; Camuñas; Gómez-Chacón Space; R. Thales Alenia Space We2A-1: 3-D Printed Bandpass We2A-1: Filter Interlaced Using Conical Posts Vertically López-Oliver; di Perugia; Università E. di Perugia; Università Tomassoni; C. di Pavia; Università Silvestri; L. Perregrini; L. di Pavia; Bozzi; Università M. Marconi; Università S. di Pavia; Università di Pavia; Università Alaimo; G. di Pavia; di Pavia Università Auricchio; F. We2A: Non-Planar Filters Non-Planar II We2A: of Chinese University Yu, Chair: Ming Hong Kong Co-Chair: Giuseppe Macchiarella, di Milano Politecnico TECHNICAL SESSIONS TECHNICAL

10:10 10:20 10:30 10:40 10:50 11:00 11:10 11:20 11:30 11:40 11:50

Microwave Field, Device & Circuit Techniques Device & Circuit Microwave Field, IMS

WEDNESDAY 48 WEDNESDAY 49 Late Breaking News

10:10 10:20 10:30 10:40 10:50 11:00 11:10 11:20 11:30 11:40 11:50 Focus & Special Sessions

408B Emerging Technologies Emerging Technologies & Applications We2G-3: A Fully-Integrated GaN Doherty A Fully-Integrated We2G-3: Amplifier Module with a Compact Power Frequency-Dependent Compensation Circuit for 5G Massive MIMO Base Stations Sugitani; T. Teranishi; Kato; E. Sakata; K. S. Ma; MERL; K. Mitsubishi Electric; R. Wu; NanoSemi; Chuang; NanoSemi; Y.-C. Horiguchi; Komatsuzaki; K. Y. Fukunaga; K. Mitsubishi Electric Shinjo; S. Yamanaka; K. Assisted Load Digitally We2G-5: Modulated Balanced Amplifier for 200W Cellular Infrastructure Applications Embar R.; NXP Semiconductors; S. Masood; NXP Semiconductors; M. Sharma; NXP Semiconductors; J. T. Staudinger; NXP Semiconductors; Rashev; of Calgary; P. Dhar; Univ. S.K. NXP Tucker; NXP Semiconductors; G. Ghannouchi; Univ. Semiconductors; F.M. of Calgary We2G: Load Modulated Power Modulated Power Load We2G: Amplifiers of University Delft Vreede, Chair: Leo de Technology MaXentric Co-Chair: Draxler, Paul LLC Technologies, RF- Dual-Octave-Bandwidth We2G-1: Input Pseudo-DohertyLoad Modulated PowerAmplifier with q10-dB Balanced Back-Off Range Chen; of Central Florida; K. Cao; Univ. Y. of Central Florida Univ. Efficiency Extend High We2G-2: by Amplifier of Doherty Power Range Impedance of Modifying Characteristic Lines in Load Modulation Transmission Network Li; Univ. Y. Dublin; College Univ. Pang; J. College Chu; Univ. Dublin; C. College CityU; Zhou; UESTC; X.Y. Peng; Dublin; J. Dublin College Zhu; Univ. A. We2G-4: 300W Dual Path GaN Doherty Path 300W Dual We2G-4: Amplifier with 65% Efficiency for Power Cellular Applications Infrastructure Masood; NXP Semiconductors; M. S. Embar R.; NXP Semiconductors; P. NXP Semiconductors; P. Embar R.; S. Holt; NXP Semiconductors; J. Rashev; Kenney; NXP Semiconductors; J.S. Georgia Tech WEDNESDAY, 24 JUNE 2020 | LACC 2020 JUNE 24 | – 11:50 WEDNESDAY, 10:10

Systems & Applications

408A Active Components

We2F-4: A 38-GHz 32-Element Phased- We2F-4: Scalable Based on Transmitter Array Modules for 8-Element Phased-Array 5G MMW Data Links Lin; Y.-H. Hung; Chen; L.-C. C.-N. Lin; National Chao; G.-Y. W.-P. Tang; T.-C. Nien; Y.-H. Liao; W.-J. Univ.; Taiwan National Chung Cheng Univ.; T.-W. Lin; Kuo; K.-Y. T.-Y. Huang; W.-C. Lu; National Lin; H.-C. Y.-C. Huang; Univ. Taiwan We2F-2: A 24–29.5GHz 256-Element We2F-2: with 65.5dBm Peak 5G Phased-Array EIRP and 256-QAM Modulation Diego; San of California, Yin;Univ. Y. San Diego; of California, Zhang; Univ. Z. Rebeiz; Zihir; IDT; G.M. Kanar; IDT; S. T. San Diego of California, Univ. Learning Machine for We2F-3: in 5G Flexible Tuning IBFD Accelerated Duplex Networks Lincoln Laboratory; Kolodziej; MIT K.E. Cookson; MIT Lincoln Laboratory; A.U. Perry; MIT Lincoln Laboratory B.T. We2F: 5G Arrays and Arrays 5G We2F: Beamformers Lockheed MartinChair: Kwang-Jin Koh, Corp. Renesas Kanar, Tumay Co-Chair: Electronics America Hybrid 2-Way A 28GHz, We2F-1: Front-End for 5G Mobile Phased-Array Applications Lee; Samsung; Cho; Samsung; H.-S. N. Kim; Samsung W.-N. Lee; Samsung; H. We2F-5: OLED Display-Integrated OLED Display-Integrated We2F-5: for Arrays Phased Optically Invisible 5G Cellular Devices Millimeter-Wave Choi; POSTECH; POSTECH; J. Park; J. Fine-Chem; Dongwoo M.-S. Park; D. LG You; Fine-Chem;Kim; Dongwoo C. Jung; LG Electronics; Electronics; D. Lee; LG Song; LG Electronics; J. I. Y. Whang; SK Telecom; Electronics; Y.N. Kang; Corning Precision B. Y-TECH; Lee; Hong; POSTECH W. Materials;

Passive Components 406AB TECHNICAL SESSIONS TECHNICAL

D. Psychogiou; University of Colorado University Psychogiou; D. Gómez-García; Universidad Boulder; R. de Alcalá We2E-1: Quasi-Absorptive Substrate- We2E-1: Bandpass Filters Using Integrated Capacitively-Loaded Coaxial Resonators P. Vélez; Univ. Autònoma de Barcelona; Autònoma Vélez; Univ. P. de Autònoma Muñoz-Enano; Univ. J. J. Ebrahimi; Rmit Univ.; A. Barcelona; Ghorbani; Rmit K. Scott; Rmit Univ.; de Autònoma Martín; Univ. F. Univ.; Barcelona We2E-4: Step Impedance Resonator Step Impedance We2E-4: (SIR) Loaded with Complementary Split Ring Resonator (CSRR): Modeling, Analysis and Applications Y. Zhu; UESTC; Y. Dong; UESTC Y. Zhu; UESTC; Y. We2E-2: UIR-Loaded Dual-Mode UIR-Loaded We2E-2: SIW Filter Size and with Compact Zeros Controllable Transmission M. Kong; BUPT; D. Psychogiou; University Psychogiou; University Kong; BUPT; D. M. BUPT Wu; Y. of Colorado Boulder; We2E-5: Quasi-Elliptic Coupled-Line- We2E-5: Based Balanced Bandpass Filters with Stopband Characteristics Ultra-Wide D. Tang; UESTC; C. Han; UESTC; Z. Deng; Han; UESTC; Z. UESTC; C. Tang; D. Luo; UESTC Qian; UESTC; X. UESTC; H.J. We2E-3: Compact Bandpass Filter Compact with We2E-3: Wide Stopband and Low Radiation Loss Defected Integrated Using Substrate Ground Structure Dimitra Psychogiou, University University Chair: Dimitra Psychogiou, We2E: Recent Advances in Compact Advances Recent We2E: and High Performance Planar Filter Realization Design and of Colorado Co-Chair: Christopher Galbraith, Technology, Massachusetts Institute of Lincoln Laboratory

Microwave Field, Device & Circuit Techniques Device & Circuit Microwave Field, IMS

2020 S IM SPEAKERS Paulo Correa, EMPOWER RF SYSTEMS EMPOWER Correa, Paulo Inc; Martha Zemede, Technologies Keysight Raj Sodhi, Keysight Inc; Denis Gregoire, Technologies Keysight Inc Technologies Keysight Inc; Aidin Taeb, Technologies Anritsu Martens, Jon Anritsu Company; Reyes, Steve MPI Corporation Andrej Rumiantsev, Company; Dunn, Inc.; John Cadence Design Systems, Vye, David Inc. Cadence Design Systems, Nizar Messaoudi, Technologies; Keysight Suren Singh, Lakeshore Daughton, David Technologies; Keysight Cryotronics Ethan TMY Technology Lin, Cree-Wolfspeed Liu, Yueying Michael Inc.; Cadence Design Systems, Choe, David Inc. Systems, Cadence Design Thompson, WEDNESDAY, 24 JUNE 24 2020 WEDNESDAY, – 17:30 08:00

EVENT COMPANY EMPOWER RF Systems, Inc. RF Systems, EMPOWER Keysight Technologies Inc Technologies Keysight Anritsu Company Cadence Design Systems, Inc. Technologies Keysight Inc TMY Technology, Technologies Keysight A Cree Company Wolfspeed, Cadence Design Systems, Inc. WORKSHOPS SESSION TITLE High Power Solid State Amplifier Advances in Advances Amplifier State Solid High Power Technology Design Tutorial for a High-Efficiency GaN Doherty for Tutorial Design Amplifier Power Radio (NR) Release Understanding 5G New 15-16 Standards Amplifiers Designing GaN on SiC MMIC Power PDK MWO Using the Cree-Wolfspeed - Demodulation and Confor Learn 5G Signals, with mance Tests the VSA Measurement Addressing Calibration and VNA Broadband On-wafer of Challenges GHz Measurements up to 220 for Quantum Measurement Challenges Cryogenic Applications Testing Solution for 5G Innovative OTA: Redefine NR mmWave Design Flows RF-Microwave Module-Level Integrating Circuit-EM and Thermal Analysis

8:00 – 9:40 10:10 – 11:50 15:50 – 17:30

ndustry workshops cover contemporary topics spanning the state of the art in RF, microwave, and mm-wave areas. These two-hour workshops workshops two-hour These areas. and mm-wave microwave, contemporaryndustry cover state of the art topics spanning the workshops in RF, knowledge this opportunity Don’t miss your to expand with experts from and discussions technical presentations include in-depth the industry. in SESSION TIME and interact with colleagues in these very relevant fields! very with colleagues in these and interact relevant LACC INDUSTRY I

WEDNESDAY 50 WEDNESDAY 51 WEDNESDAY, 24 JUNE 24 2020 WEDNESDAY, WEDNESDAY, 24 JUNE 24 2020 WEDNESDAY, Course Syllabus – 13:15 12:00 LACC – 13:30 12:00 LACC Harold Pratt, Harold Pratt, Washington; Chris Rudell, University of

Phased arrays have been the linchpin technology behind 5G wireless networks, LEO & MEO broadband been the linchpin technology behind 5G wireless networks, have Phased arrays more conventional in addition to many high-speed internet connectivity and to some extend autonomous vehicles, appeal stems from their ability to form (high gain) Their main directive defense and security applications. maintaining smaller form factors than perhaps any while electronically scanned beams with controlled side-lobes, that introduction into phased arrays, This technical lecture offers a top-down reflectors. antenna e.g. other directive will learn Participants to analysis and design methodologies. includes the main operation principles and key antenna elements and and the various systems, performance of phased array the system-level critically evaluate arrangements. array One of the most important RF circuits to emerge in the past decade is the N-path passive mixer (sometimes called in the past decade is the N-path passive One of the most important RF circuits to emerge of deep-submicron CMOS has enabled N-path passive the advent for decades, Although known “N-path filter”). the and linearity, dramatic enhancements in RF receiver providing mixers and filters to be scaled to GHz frequencies, mixer and its This lecture will introduce the N-path passive other interesting capabilities. enabling various The variety of other applications. well as a as interference tolerant receivers, application to frequency flexible, This and optimizing N-path circuits. designing for analyzing, frame work an intuitive lecture will then provide circuit and transistor properties limit N-path mixers’ in which also be used to describe ways will framework Second-or- and linearity. noise, consumption, power to frequency of operation, specifically with regard performance, as techniques for their as well will also be discussed, such as phase noise and LO leakage der phenomena, and examples, worked with several a design methodology for such circuits, The lecture will also suggest mitigation. and such as beamforming, extensions of the core circuit to multi-port applications, will finish with several non-reciprocal circuits. SESSION , Stanford UniversityBoris Murmann,

Gabriel Rebeiz, University California of San Office; Gabriel Rebeiz, Technology Microelectronics DARPA PANEL Lecture Title ith the advent of GS-s data converters driven by Moore’s law and advances in converter architectures, it is now possible to digitize it is now architectures, in converter and advances law Moore’s by driven of GS-s data converters ith the advent and local oscillators reduces RF amplifiers, filters, eliminating mixers, On the one hand, we? should The question is, directly at RF. want to digitize the entire spectrumwe really from do other hand, On the multi-function designs. more flexible, complexity and allows 12:00 – 13:30 Fundamentals of Phased Arrays Fundamentals of Phased Speaker: Marinos Vouvakis, Amherst of Massachusetts University Alyosha Molnar, Cornell Molnar, Alyosha Speaker: Univ. 12:00 – 13:30 N-Path Mixers and Filters: Theory Concept, and Applications

TWA1 TWB2

ABSTRACT: ABSTRACT: Raytheon Technologies; Raytheon Technologies;

Tim Hancock, PANELISTS: PANELISTS: Hornbuckle, Craig Technologies; Diego; Jariet Raytheon Technologies Larry Kushner, Raytheon Technologies PANEL ORGANIZERS AND MODERATORS: AND ORGANIZERS PANEL Who needs RF when we can digitize at the antenna? digitize can we RF when Who needs

IMS IMS

distinguished panel will debate the pros and cons of competing system architectures and the audience will be engaged to judge who is right. who to judge cons of competing system architectures and the audience will be engaged distinguished panel will debate the pros and analog-beam-formed arrays to interferers since spatial filtering occurs after the analog-to-digital conversion. What is the right approach? Our What is conversion. to interferers since spatial filtering occurs after the analog-to-digital analog-beam-formed arrays element-level digital beamforming allows simultaneous beams with different beamwidths and pointing angles, but may be more susceptible than but may different beamwidths and pointing angles, digital beamforming simultaneous beams with allows element-level DC to daylight and process 10’s of GS-s of data if the information BW we care about is orders of magnitude lower? In the context of phased arrays, In the context of phased arrays, is orders of magnitude lower? care about of GS-s of data if the information BW we and process 10’s DC to daylight W

TECHNICAL LECTURES TECHNICAL WEDNESDAY IMS TECHNICAL SESSIONS 15:50 – 17:30 | WEDNESDAY, 24 JUNE 2020 | LACC

402AB 403A 403B 404AB We3A: Recent Advances in Passive We3B: Advanced Nonlinear We3C: Millimeter-Wave and We3D: Millimeter Wave Radar Components Measurement Techniques and Submillimeter-Wave Components Vibrometry: Technical Advances Results and New Phenomenology Chair: Holger Maune, Technische Chair: Dietmar Kissinger, Ulm University Universität Darmstadt Chair: Marcus Da Silva, National Chair: Chris Robenbeck, Naval Research Co-Chair: William Deal, Northrop Co-Chair: Thomas Lingel, TTM Instruments Grumman Corporation Laboratory

15:50 Co-Chair: Sherif Ahmed, Entrepreneur Co-Chair: Chai-Chan Chang, National Chung Cheng University We3A-1: Angular-Momentum Biased We3B-1: Broadband Error Vector We3C-1: InP HBT Oscillators Operating We3D-1: Silent Speech Recognition Circulator with a Common-Differential Magnitude Characterization of a GaN up to 682GHz with Coupled-Line Load Based on Short-Range Millimeter-Wave Mode Topology for RF and Modulation Power Amplifier Using a Vector Network for Improved Efficiency and Output Sensing Isolation Analyzer Power L. Wen; Shanghai Jiao Tong Univ.; H.M. Kadry; Wayne State Univ.; A.M. Angelotti; Univ. of Bologna; G.P. J. Kim; Korea Univ.; H. Son; Korea Univ.; C. Gu; Shanghai Jiao Tong Univ.; 16:00 D.L. Sounas; Wayne State Univ. Gibiino; Univ. of Bologna; C. Florian; Univ. D. Kim; Korea Univ.; K. Song; Korea Univ.; J.-F. Mao; Shanghai Jiao Tong Univ. of Bologna; A. Santarelli; Univ. of Bologna J. Yoo; Korea Univ.; J.-S. Rieh; Korea Univ. 16:10

We3A-2: Miniature Wideband Rat-Race We3B-2: Precisely Synchronized NVNA We3C-2: A DC to 194-GHz Distributed We3D-2: Non-Contact Vital Signs Coupler in Silicon-Based Integrated Setup for Digital Modulation Signal Mixer in 250-nm InP DHBT Technology Monitoring for Multiple Subjects Using Passive Device Technology Measurements at Millimeter-Wave Test a Millimeter Wave FMCW Automotive Bands T. Jyo; NTT; M. Nagatani; NTT; M. Ida; Radar Y.-R. Liu; National Central Univ. ; NTT; M. Mutoh; NTT; H. Wakita; NTT; C.-H. Chan; National Central Univ. ; Y. Zhang; NIM; X. Guo; NIM; Z. Zhang; N. Terao; NTT; H. Nosaka; NTT S.M.M. Islam; University of Hawaii 16:20 Y.-S. Lin; National Central Univ. NIM; Z. He; NIM; A. Yang; NIM at Manoa; N. Motoyama; ON Semiconductor; S. Pacheco; ON We3A-3: A Geometrically Shaped Semiconductor; V.M. Lubecke; University Hemispherical Cavity Resonator with of Hawaii at Manoa Extended Spurious-Free Region J. Li; Shenzhen Univ.; T. Yuan; Shenzhen

16:30 Univ.

We3A-4: Low-Loss Continuous True Time We3B-3: Millimeter-Wave Power We3C-3: Broadband 110–170GHz True We3D-3: Multi-Spectral THz Delay with Delay Summing Amplifier Linearity Characterization Time Delay Circuit in a 130-nm SiGe Micro-Doppler Radar Based on a Using Unequally Spaced Multi-Tone BiCMOS Technology Silicon-Based Picosecond Pulse K. Park; Yonsei Univ.; B.-W. Min; Yonsei Stimulus Univ. A. Karakuzulu; IHP; M.H. Eissa; IHP; Radiator V. Gillet; XLIM (UMR 7252); J.-P. Teyssier; D. Kissinger; Universität Ulm; A. S. Razavian; Univ. of California, Los 16:40 Keysight Technologies; A. Al Hajjar; Malignaggi; IHP Angeles; A. Babakhani; Univ. of OMMIC; A. Gasmi; OMMIC; C. Edoua California, Los Angeles Kacou; OMMIC; M. Prigent; XLIM (UMR 7252); R. Quéré; XLIM (UMR 7252) WEDNESDAY 16:50

We3A-5: Miniaturized Couplers Using We3B-4: Pulse Profiling Active Load We3D-4: Using FMCW Radar for Multi-Mode Star-Junction Pull Measurements Spatially Resolved Intra-Chirp Vibrometry in the Audio Range M.H.A. Elsawaf; Ain Shams Univ.; Y. Alimohammadi; Cardiff University; A.M.H. Nasr; Ain Shams Univ.; A.M.E. E. Kuwata; Cardiff University; X. Liu; L. Piotrowsky; Ruhr-Universität Bochum; Safwat; Ain Shams Univ. Cardiff University; T. Husseini; Al-Furat J. Siska; Ruhr-Universität Bochum;

17:00 Al-Awsat Technical University; J.J. C. Schweer; Ruhr-Universität Bochum; Bell; Cardiff University; L. Wu; Huawei N. Pohl; Ruhr-Universität Bochum Technologies; P.J. Tasker; Cardiff University; J. Benedikt; Cardiff University 17:10

We3A-6: AFSIW Power Divider with We3B-5: Enhanced Wideband We3D-5: AI-Driven Event Recognition Isolated Outputs Based on Balanced- Active Load-Pull with a Vector with a Real-Time 3D 60-GHz Radar Delta-Port Magic-Tee Topology Network Analyzer Using Modulated System Excitations and Device Output Match N.-H. Nguyen; IMEP-LAHC (UMR 5130); Compensation A. Tzadok; IBM T.J. Watson Research A. Ghiotto; IMS (UMR 5218); T. Martin; Center; A. Valdes-Garcia; IBM T.J. Watson IMS (UMR 5218); A. Vilcot; IMEP-LAHC A.M. Angelotti; Univ. of Bologna; Research Center; P. Pepeljugoski; IBM T.J. 17:20 17:30 (UMR 5130); T.-P. Vuong; IMEP-LAHC G.P. Gibiino; Univ. of Bologna; T.S. Watson Research Center; J.-O. Plouchart; (UMR 5130); K. Wu; Polytechnique Nielsen; Keysight Technologies; IBM T.J. Watson Research Center; Montréal D.M.M.-P. Schreurs; Katholieke Univ. M. Yeck; IBM T.J. Watson Research Leuven; A. Santarelli; Univ. of Bologna Center; H. Liu; IBM T.J. Watson Research Center

52 Microwave Field, Device & Circuit Techniques Passive Components Active Components Systems & Applications Emerging Technologies & Applications Focus & Special Sessions Late Breaking News IMS TECHNICAL SESSIONS 15:50 – 17:30 | WEDNESDAY, 24 JUNE 2020 | LACC

406AB 408A 408B We3E: Tunable and Active Filters We3F: Beamforming for Satellite We3G: Digital Predistortion and Communications and Sensors Supply Modulation Chair: Sanghoon Shin, Naval Research Laboratory Chair: Byung-Wook Min, Yonsei Chair: John Wood, Wolfspeed, A Cree Co-Chair: Julien LINTIGNAT, University of University Company

Limoges Co-Chair: David Ricketts, North Carolina Co-Chair: Jonmei Yan, MaXentric State University Technologies, LLC 15:50

We3E-1: A Compact Reconfigurable We3F-1: A Scalable Switchable We3G-1: Closed-Loop Sign Algorithms N-Path Low-Pass Filter Based on Dual-Polarized 256-Element Ka-Band for Low-Complexity Digital Predistortion Negative Trans-Resistance with <1dB SATCOM Transmit Phased-Array with Loss and >21dB Out-of-Band Rejection Embedded RF Driver and ±70° Beam P. Pascual Campo; Tampere University; Scanning V. Lampu; Tampere University; L. Anttila; M. Khorshidian; Columbia Univ.; N. Tampere University; A. Brihuega; Tampere Reiskarimian; Columbia Univ.; K.K.W. Low; Univ. of California, San University; M. Allén; Tampere University; 16:00 H. Krishnaswamy; Columbia Univ. Diego; S. Zihir; IDT; T. Kanar; IDT; G.M. M. Valkama; Tampere University Rebeiz; Univ. of California, San Diego 16:10

We3E-2: BPFs with Parametrically We3F-2: A 28-GHz Full Duplex Front- We3G-2: OTA-Based Data Acquisition Compensated Passband Insertion Loss End and Canceller Using Two Cross- and Signal Separation for Digital and Selectivity Polarized 64-Element Phased Arrays Predistortion of Multi-User MIMO Transmitters in 5G L.K. Yeung; Univ. of California, Los J. Myeong; Yonsei Univ.; K. Park; Yonsei Angeles; X. Zou; Univ. of California, Los Univ.; A. Nafe; Univ. of California, San X. Wang; Univ. College Dublin; Y. Li; Univ. Angeles; Y.E. Wang; Univ. of California, Diego; H. Chung; Univ. of California, San College Dublin; C. Yu; Southeast Univ.; 16:20 Los Angeles Diego; G.M. Rebeiz; Univ. of California, W. Hong; Southeast Univ.; A. Zhu; Univ. San Diego; B.-W. Min; Yonsei Univ. College Dublin 16:30

We3E-3: Fully-Reconfigurable Non- We3F-3: Affordable, Multi-Function We3G-3: L-Band Floating-Ground Reciprocal Bandpass Filters Flight-Worthy Airborne Phased-Array RF Power Amplifier for Reverse-Type Sensor Envelope Tracking Systems D. Simpson; University of Colorado Boulder; D. Psychogiou; University of J. Navarro; Boeing S. Paul; FBH; W. Heinrich; FBH; Colorado Boulder O. Bengtsson; FBH 16:40 WEDNESDAY 16:50

We3E-4: A Dual-Mode Frequency We3F-4: A Scalable 256-Element We3G-4: High Efficiency, High Reconfigurable Waveguide Filter with a E-Band Phased-Array Transceiver for Bandwidth Switch-Mode Envelope Constant Frequency Spacing Between Broadband Communications Tracking Supply Modulator Transmission Zeros M. Repeta; W. Zhai; T. Ross; K. Ansari; F. Hühn; FBH; F. Müller; FBH; G. B.; Univ. of Waterloo; R.R. Mansour; S. Tiller; H.K. Pothula; D. Wessel; X. Li; L. Schellhase; FBH; W. Heinrich; FBH;

Univ. of Waterloo H. Cai; D. Liang; G. Wang; W. Tong; A. Wentzel; FBH 17:00 Huawei Technologies 17:10

We3E-5: Behavior of Lossy Spiral We3F-5: A Dual-Polarized 1024-Element We3G-5: Exploiting the Marx Generator Inductors and Their Applications to the Ku-Band SATCOM Transmit Phased- as a 100MHz High-Speed Multilevel Design of Tunable Band Reject Filters Array with ±70° Scan and 43.5dBW Supply Modulator EIRP H. Jia; Univ. of Waterloo; R.R. Mansour; P. Gjurovski; RWTH Aachen Univ.; Univ. of Waterloo G. Gültepe; Univ. of California, San Diego; L. Huessen; RWTH Aachen Univ.; S. Zihir; IDT; T. Kanar; IDT; G.M. Rebeiz; R. Negra; RWTH Aachen Univ. 17:20 17:30 We3E-6: Novel Reconfigurable Filtering Univ. of California, San Diego Crossover Based on Evanescent-Mode Cavity Resonators J. Lai; UESTC; T. Yang; UESTC; P.-L. Chi; National Chiao Tung Univ. ; R. Xu; UESTC

Microwave Field, Device & Circuit Techniques Passive Components Active Components Systems & Applications Emerging Technologies & Applications Focus & Special Sessions Late Breaking News 53 J.W. MARRIOTT, L.A. LIVE IMS2020

MTT-S AWARDS BANQUET 18:30 – 21:30 WEDNESDAY, 24 JUNE 2020

AWARDS

MTT-S AWARD 2020 AWARD RECIPIENT AND DESCRIPTION

Honorary Life Member Jozef Modelski For past and continuing outstanding services to the Society Robert Weigel For a Career of Leadership, Meritorious Achievement, Creativity and Outstanding Contributions in the Field Microwave Career Award of Microwave Theory and Techniques Wolfgang Heinrich In Recognition of a Distinguished Record of Service to the MTT Society and the Microwave Profession Distinguished Service Award over a Sustained Period of Time Distinguished Educator Award Ian Hunter For Outstanding Achievements as an Educator, Mentor, and Role Model for Microwave Engineers and (established in 1992) Engineering Students Microwave Application Award Ming Yu For the Development of Computer Aided and Robotic Tuning for Filters and Multiplexers N. Walter Cox Award (established in Ryan Miyamoto For Exemplary Service to the Society in a Spirit of Selfless Dedication and Cooperation 1992) Joseph Bardin For Outstanding Early Career Achievements for Fundamental Work in the Area of Ultra-low-noise technology with Application to Emerging Sensor and Communication Systems Shahriar Shahramian For Outstanding Early Career Achievements in mm-Wave Phased-Arrays and Transceivers and for IEEE MTT-S Outstanding Young Being an Educational Role Model with the Signal Path Video Series Engineer Award (established in 2001) Thomas Ussmueller For Outstanding Early Career Achievements in Fundamental Work in the Field of Microwave Technology, Especially Radio Frequency Integrated Circuits, and to Exemplary Service to the Society Jiang Zhu For Outstanding Early Career Achievements in Consumer Applications of RF, Antenna and Electromagnetic Devices in the Areas of Wireless Communications, Human Body Interaction and Sensing

MTT-SOCIETY BEST PAPER AWARDS Bhaskara Rupakula, Gabriel M. Rebeiz For their paper ”Third-Order Intermodulation Effects and System Sensitivity Microwave Prize Degradation in Receive-Mode 5G Phased Arrays in the Presence of Multiple Interferers,” IEEE Transactions on Microwave Theory and Techniques, Vol. 66, Issue 12, pp. 5780 – 5795, Year 2018” Francisco Mesa, Raúl Rodríguez-Berral, Francisco Medina For their paper “Unlocking Complexity Using the ECA: IEEE Microwave Magazine Best Paper The Equivalent Circuit Model as An Efficient and Physically Insightful Tool for Microwave Engineering,” IEEE Microwave Award (established in 2009) Magazine, Vol. 19, No. 4, pp. 44-65, June 2018

WEDNESDAY IEEE Microwave and Wireless Wei Chen, Yida Li, Rongaiang Li, Aaron Voon-Yew Thean, Yong-Xin Guo For their paper “Bendable and Stretchable Components Letters Tatsuo Itoh Prize Microfluidic Liquid Metal-Based-Filter,” IEEE Microwave and Wireless Components Letters Tatsuo Itoh Prize, Vol. 28, (established in 2009) (renamed Issue 3, pp.203-205, March 2018 2010) Jacob W. Kooi, Rodrigo A. Reeves, Arthur W. Lichtenberger, Theodore J. Reck, Andy K. Fung, Sander Weinreb, James IEEE Transactions on Terahertz W. Lamb, Rohit S. Gawande, Kieran A. Cleary, Goutam Chattopadhyay  For their paper “A Programmable Cryogenic Science & Technology Best paper Waveguide Calibration Load With Exceptional Temporal Response and Linearity,” IEEE Transactions on Terahertz Science Award & Technology, Vol. 8, No. 4, pp. 434–445, July 2018

54 IMS2020

IEEE FELLOWS THE IEEE GRADE OF FELLOW is conferred by the Board of Directors upon a person with an extraordinary record of accomplishments in any of the IEEE fields of interest. The total number selected in any one year does not exceed one-tenth of one percent of the total voting Institute membership. The accomplishments that are being honored have contributed importantly to the advancement­ or application of engineering, science and technology, bringing the realization of significant value to society. Seventeen MTT-S members were elected to the grade of Fellow, effective 1 January 2020:

IEEE FELLOWS Filippo Capolino for contributions to development of electromagnetic phenomena in metamaterials and periodic structures William Chappell for leadership in the development of reconfigurable radio frequency and microwave systems Xudong Chen for contributions to optimization methods for electromagnetic inverse scattering Jung-chih Chiao for contributions to wireless and battery-less medical implants Thomas Crowe for leadership in the development of terahertz devices and instrumentation Edward Godshalk for development of microwave on-wafer probing and measurement techniques Akira Inoue for development of inverse class-F power amplifiers for mobile phones Nuria Llombart Juan for contributions to millimeter and submillimeter wave quasi- optical antennas Gong-ru Lin for contributions to ultrafast fiber lasers and highspeed laser diodes for optical communications Kartikeyan Machavaram for contributions to high-power millimeter wave and terahertz sources Chul Soon Park for development of low power millimeter-wave circuits and packages Ullrich Pfeiffer for development of silicon-based millimeter-wave and terahertz circuits and systems Dennis Prather for contributions to diffractive optical systems Jaume Anguera Pros for contributions to small multiband antennas for wireless telecommunication devices Jae-sung Rieh for contributions to silicon-germanium integrated circuits for wireless communications Manfred Schindler for development in microwave switch technology for radar and wireless communication systems Shiwen Yang for development of time-modulated antenna arrays WEDNESDAY

55 IMS2020 WOMEN IN MICROWAVES WEDNESDAY

56

THURSDAY 57

20 20 S IM

Thursday, 25 June 2020 June 25 Thursday,

ThursdayThursday

Late Breaking News 404AB Th1D: Chip-Scale Interconnects Interconnects Th1D: Chip-Scale and Technologies Packaging of University Chair: Rhonda Franklin, Cities Twin Minnesota, Co-Chair: HRL Florian Herrault, LLC Laboratories, Th1D-3: A Low-Loss Balun-EmbeddedA Low-Loss Th1D-3: THz Heterogeneous for Interconnect System Integration Tsing Hua Univ.; Chiu; National T.-Y. Ko; Atom Element Matter; C.-L. Lee; Y.-L. Tseng; NARLabs- S.-H. NARLabs-TSRI; Tsing Hua Univ. Li; National TSRI; C.-H. W Band Carbon Nanotubes Th1D-4: Compatible with CMOS Interconnects Technology XLIM (UMR 7252); Roux-Lévy; P. De Saxce; XLIM (UMR 7252); J.M. Th1D-1: Polylithic Integration for RF/ Integration Th1D-1: Polylithic Stitch- Chiplets Using MM-Wave and Fabrication, Chips: Modeling, Characterization Georgia Jo; P.K. Tech; Zheng; Georgia T. Kochupurackal Rajan; Georgia S. Tech; Tech Bakir; Georgia M.S. Tech; Th1D-2: A W-Band Chip-to-Printed Interconnect Board Circuit Universität Technische Deutschmann; B. Jacob; Technische Hamburg-Harburg; A.F. Hamburg-Harburg Universität Wang; Siah; CINTRA (UMI 3288); J. C.F. CINTRA Tay; CINTRA (UMI 3288); B.K. Coquet; CINTRA (UMI (UMI 3288); P. XLIM (UMR 7252) Baillargeat; 3288); D. Th1D-5: Suspended SiC Filter with DRIE Silicon Subcovers Northrop Kunkee; Grumman; E.T. D.-W. Duan; Northrop Grumman; D.-W. Lai; Northrop Grumman R. A. Sulian; Northrop Grumman; P. Ngo; Ngo; Sulian; Northrop Grumman; P. A. Lin; NorthropNorthrop Grumman; N. Zhang; Northrop Grumman;Grumman; C. Northrop Ferizovic; Grumman; D. Jackson; Northrop Grumman; C.M. Focus & Special Sessions

403B Emerging Technologies Emerging Technologies & Applications Th1C-5: Learning Representations for Applied to Spectrum- Networks Neural EstimationBased Direction-of-Arrival for Automotive Radar Gardill; InnoSenT; Gall; InnoSenT; M. M. Horn; T. Erlangen-Nürnberg; Fuchs; FAU J. InnoSenT Th1C-4: Root-MUSIC Based Power Estimation Method with Super- Resolution FMCW Radar Ishiyama; NTT; F. Toriumi; Y. NTT; Iizuka; T. Kato; NTT NTT; J. Th1C: Advanced Radar Systems Radar Systems Advanced Th1C: for Automotive and Vehicular Applications Universität Chair: Markus Gardill, Würzburg Friedrich-Alex- Co-Chair:Vossiek, Martin Erlangen-Nürnberg ander-Universität Analysis of Noise A System Th1C-2: PerformanceInfluences on the Imaging MIMO Radars Wave of Millimeter Schwarz; Dürr; D. Ulm; A. Universität Waldschmidt; Ulm; C. Universität Ulm Universität Th1C-1: A Fast-Chirp MIMO Radar A Fast-Chirp Th1C-1: FDMASystem Using Beat Frequency with Single-Sideband Modulation Kepler Johannes Nguyen; M.Q. Feger; Johannes Linz; R. Universität Bechter; ZF Linz; J. Kepler Universität Pichler-Scheder; Friedrichshafen; M. Stelzer; Kepler Johannes A. LCM; Linz Universität Th1C-3: Millimeter-Wave Th1C-3: Millimeter-Wave Interferometric Radar for Speed-Over- Ground Estimation Klinefelter; State Univ.; Michigan E. Nanzer; State Univ. Michigan J.A.

THURSDAY, 25 25 JUNE | LACC 2020 THURSDAY, | 09:40 – 08:00

Systems & Applications

403A Active Components Th1B-3: Efficiency Enhancement Using Doherty-Like Over- Technique The-Air Spatial Combining in a 28GHz CMOS Transmitter Phased-Array Technion; Melamed; I. Technion; Sayag; A. E. Cohen; Technion Th1B-4: A Multi-Standard 15–57GHz Th1B-4: 4-Channel Receive Beamformer with Applications 4.8dB Midband NF for 5G San of California, Alhamed; Univ. A.A. San of California, Kazan; Univ. O. Diego; of California, Rebeiz; Univ. G.M. Diego; San Diego Th1B-2: A Highly Rugged 19dBm Rugged A Highly Th1B-2: Device PAFET Using Novel 28GHz PA in Achieving 45RFSOI Technology Peak Efficiency Above 48% Jain; S. GLOBALFOUNDRIES; Syed; S. GLOBALFOUNDRIES; Lederer; GLOBALFOUNDRIES; D. Liu; GLOBALFOUNDRIES; W. GLOBALFOUNDRIES; Veeramani; E. GLOBALFOUNDRIES; Chandhoke; B. Kumar; GLOBALFOUNDRIES; A. Freeman; GLOBALFOUNDRIES G. Th1B: Late-breaking News in Th1B: Late-breaking Circuits and Technologies Silicon State Washington Chair: Deuk Heo, University University Co-Chair: James Buckwalter, Santa Barbara of California, Th1B-1: An E-Band AmplifierPower RF Device with HybridUsing High Power Thickness in Function and Oxide Work FinFET22nm Low-Power Garret; Intel; Intel; J. Yeh; Y.-S. Intel; Yu; Q. Rami; Intel; S. Morarka; S. Koo; Intel; J. Intel Lee; Liu; Intel; H.-J. Intel; G. 08:00 08:10 08:20 08:30 08:40 08:50 09:00 09:10 09:20 09:30 09:40 Passive Components

TECHNICAL SESSIONS TECHNICAL

Microwave Field, Device & Circuit Techniques Device & Circuit Microwave Field, IMS

THURSDAY 58 THURSDAY 59 Late Breaking News

08:00 08:10 08:20 08:30 08:40 08:50 09:00 09:10 09:20 09:30 09:40 Focus & Special Sessions

408B Emerging Technologies Emerging Technologies & Applications Th1G-6: An 18.5W Fully-Digital Th1G-6: System with 60.4% Peak Transmitter Efficiency Universiteit Technische Bootsman; R.J. Universiteit Technische Mul; Delft; D.P.N. Universiteit Shen; Technische Delft; Y. van Ampleon; F. Heeres; Delft; R.M. Technische Alavi; Rijs; Ampleon; M.S. Vreede; de Delft; L.C.N. Universiteit Delft Universiteit Technische Th1G-4: A 22–37GHz Broadband Com­ Th1G-4: Amplifier Power pact Linear mm-Wave Supporting 64-/256-/512-QAM Modulations for 5G Communications Wang; Georgia Tech Wang; H. A. Wang; F. W-Band Wideband Th1G-5: Two CMOS Automotive Radar for mmW PAs Transceivers Shi; East China Normal Univ.; Xue; C. Y. Chen; Shanghai Eastsoft G. of Houston; Chen; Univ. Microelectronics; J. Zhang; East China Normal Univ. R. Th1G-1: A 28GHz Linear and Efficient Th1G-1: AmplifierPower Supporting Wideband OFDM for 5G in 28nm CMOS Univ.; Taiwan National Chang; Y.-W. Tsai; Univ.; National Taiwan T.-C. Univ.; Taiwan Zhong; National J.-Y. Normal Univ.; Taiwan Tsai; National J.-H. Univ. Taiwan Huang; National T.-W. Th1G-3: Load Modulated Balanced with Integrated CMOS PA mm-Wave Linearity Enhancement for 5G Applications Sharma; T. Univ.; Chappidi; Princeton C.R. Liu; Princeton Univ.; Z. Princeton Univ.; Univ. Sengupta; Princeton K. Th1G: Advanced Silicon PAs for 5G Silicon PAs Advanced Th1G: Applications and Automotive Princeton Chair: Kaushik Sengupta, University Army Research Office Co-Chair: Qiu, Joe Th1G-2: A Balanced AmplifierPower Coupled-Line CouplersAsymmetric with Wilkinson Baluns in a 90nm SiGe and BiCMOS Technology Cressler; J.D. Tech; Gong; Georgia Y. Georgia Tech THURSDAY, 25 25 JUNE | LACC 2020 THURSDAY, | 09:40 – 08:00

Systems & Applications

408A Active Components

Th1F-5: 28GHz Active Monopulse Th1F-5: 28GHz Amplitude and Phase Networks with Control and -30dB Null-Bandwidth of 5GHz San Diego; of California, Chung; Univ. H. San Diego; of California, Ma; Univ. Q. San of California, Rebeiz; Univ. G.M. Diego Th1F-3: In-situ Self-Test and Self- Th1F-3: In-situ Self-Test TRX 5G of Dual-Polarized Calibration Orthogonal- Leveraging Arrays Phased Antenna Polarization Couplings San Diego; of California, Nafe; Univ. A. San of California, Aljuhani; Univ. A.H. of California, Kibaroglu; Univ. K. Diego; of Univ. Sayginer; M. San Diego; Rebeiz; Univ. G.M. San Diego; California, Diego San of California, Flexible Deployable, Th1F-4: Scalable, Phased Array Sheets Fikes; Caltech; A. Gal-Katziri; Caltech; M. Abiri; Caltech; Bohn; Caltech; B. F. Hajimiri; A. Hashemi; Caltech; M.R. Caltech Th1F-2: FPGA-Based 2-D FIR Frost Beamformers with Digital Mutual Coupling Compensation Florida International Pulipati; Univ.; S. Th1F: Phased Arrays and Arrays Th1F: Phased Beamformer Technologies TNO, Vliet, van Chair: Frank E. Netherlands Ulm Waldschmidt, Co-Chair: Christian University and Th1F-1: Design Considerations Wideband FPGA Implementation of a Beamformer with Transmit All-Digital Bandwidth 50% Fractional Ma; MERL Pulipati; MERL; R. S. Florida International Ariyarathna; V. of Moratuwa; Univ. Jayaweera; A.L. Univ.; of Moratuwa; Univ. Edussooriya; C.U.S. of Queensland; University Wijenayake; C. of Calgary; Belostotski; Univ. L. Florida International Madanayake; A. Univ.

Passive Components

406AB TECHNICAL SESSIONS TECHNICAL

Th1E-5: 920MHz Band High Sensitive Rectenna with the High Impedance Artificial Antenna on the Dipole Folded Magnetic Conductor Substrate Institute of Kanazawa Yasumaru; N. Institute Sakai; Kanazawa N. Technology; Itoh; Kanazawa K. Technology; of Tamura; T. Institute of Technology; Technology; Institute of Kanazawa Institute of Makino; Kanazawa S. Technology G. Wen; Wen; UESTC G. F. Zhao; UESTC; D. Inserra; UESTC; Zhao; UESTC; D. F. Th1E-3: Compact and High Efficiency Rectifier Design Based on Microstrip Line for Energy Transmission Coupled Harvesting Z. Zeng; Texas A&M Univ.; S. Shen; S. A&M Univ.; Texas Zeng; Z. Hamad Bin Khalifa Wang; HKUST; B. A&M Estrada-López; Texas University; J.J. Sánchez- Murch; HKUST; E. R. Univ.; A&M Univ. Sinencio; Texas Th1E-2: An Ultra-Low-Power Power An Ultra-Low-Power Th1E-2: with Output Circuit Management and Reverse Leakage Bootstrapping Reduction Function for RF Energy Harvesting P. He; Southeast Univ.; J. Xu; Southeast J. He; Southeast Univ.; P. Zhao; Southeast Univ. D. Univ.; Th1E-1: A W-Band Rectenna Using Rectifier andOn-Chip CMOS Switching Slot Antenna Achieving On-PCB Tapered 25% Effective-Power-Conversion Efficiency for Transfer WirelessPower Smail Tedjini, University of University Tedjini, Co-Chair: Smail Grenoble-Alpes France Alessandra Costanzo, University of University Costanzo, Alessandra Chair: Bologna Th1E: Advances in RF Energy Advances Th1E: Harvesting M. Wagih; Univ. of Southampton; Univ. Wagih; M. Th1E-4: High-Efficiency Sub-1GHz Flexible Compact Rectenna Based Antenna-Rectifier Co- on Parametric Design A.S. Weddell; Univ. of Southampton; Univ. Weddell; A.S. S. Beeby; Univ. of Southampton Univ. Beeby; S.

Microwave Field, Device & Circuit Techniques Device & Circuit Microwave Field, IMS

2020 S IM THURSDAY, 25 25 JUNE 2020 THURSDAY, Stanley Oda – Anritsu Company Oda – Stanley Matthias Zapatka, Alexander Thaler, Otmar Fischer – Thaler, Alexander Matthias Zapatka, Inc. INGUN USA, Kazim Peker – Analog Devices – Kazim Peker David Senior, Chong Mei, Samir Tozin – Tozin Samir Chong Mei, Senior, David TTM Technologies Larry – RichardsonRFPD Hawkins Rob Reeder – Texas Instruments Texas Rob Reeder – Dale Johnson, David Hu – Marvin Test Solutions Hu – MarvinTest David Dale Johnson, Dr. Wolfgang Wendler – Rohde & Schwarz Wendler Wolfgang Dr. Mike Leffel – Rohde & Schwarz USA Leffel – Rohde & Schwarz Mike Dustin Kendig – Microsanj Andreas Henkel – Rohde & Schwarz Andreas Henkel Jari Vikstedt – ETS-Lindgren Jari Lawrence Wilson – Rohde & Schwarz Lawrence Tom Costello – Astronics Test Systems Test Astronics – Costello Tom Alejandro Buritica – National InstrumentsAlejandro Buritica – National Kay-Uwe Sander – Rohde & Schwarz Sander Kay-Uwe SPEAKERS Telecom Wireless – Boonton - Strickler Walt Technologies Su Chen Ho – Keysight Antenna Components Antenna and including GaN Devices Devices, High Power n n – 14:05 09:40

MicroApps Media Sponsor: 5G Millimeterwave, FR2 5G Millimeterwave, Techniques CAD and Modeling Products and Systems n n n SCHEDULE Application advantages of modular VNA architectures of modular Application advantages RF & High-Speed Mixed Signal Contacting Solutions for Probing on Board-to- RF & High-Speed Mixed Signal Contacting Solutions Board Connectors The Perfection of Translation Loop: Eliminating the Spurious Signals when Loop: Eliminating the Spurious Signals when Translation of The Perfection Jitter High Frequency Signal Generating Ultralow Predicting Performance of Xinger Passive Components on Customized PCB Components Passive of Xinger Predicting Performance Layouts New highly integrated transceiver with RF front end (RFFE) transceiver highly integrated New Breaking Bandwidth on RF Converter Frontends on RF Converter Breaking Bandwidth Implementing a mmWave Device Interface for ATE Applications ATE Interface for Device Implementing a mmWave Advanced methods to analyze ultra-wide automotive radar signals methods to analyze ultra-wide automotive Advanced Real Time S-Parameter Uncertainty Calculations using the Traceability Chain to a Traceability UncertaintyTime using the Calculations S-Parameter Real of Correlated Uncertainties in National Metrology Institute and taking advantage Calculation the Overall Advanced Imaging Techniques Address the Thermal Challenges Presented by Presented by Thermal Challenges Address the Techniques Imaging Advanced Devices Microwave Advanced Frequency Converting Measurements In The THz Range Made Easy THz Range The Measurements In Frequency Converting FCC Part 30 Emissions Measurements for 5G FR2 Devices 30 Emissions Measurements FCC Part New Techniques for 5G Transmitter Measurements Transmitter for 5G Techniques New Direct RF Data Conversion and Transceiver Architectures in RF Instrumentation Transceiver and Direct RF Data Conversion Speed up Beamformer test with Multi-channel mmWave Vector Signal Transceiver Signal Vector Speed up Beamformer test with Multi-channel mmWave UWB emissions - Improvements in Spectrum Analyzers to cover with new test test with new cover Analyzers to in Spectrum UWB emissions - Improvements requirements TITLE Unveiling the True Performance of Your Wi-Fi Chipset Your of Performance True the Unveiling Correction for ENR Temperature InternalUSB Noise Source with Current and Uncertainty Improvement 9:40 9:55 13:55 13:40 13:25 13:10 12:55 12:40 12:25 12:10 11:55 11:40 11:25 11:10 10:55 10:40 10:25 10:10 START TIME START

Techniques Instrumentation and Measurement FR1 5G Cell Phone ≤ 6GHz, Components & Materials MicroApps Sponsor: n n n

MicroApps offers a lot of information in 15 minutes! These presentations of application notes target the working engineer or technician and areengineer or technician and the working presentationsThese by color coded MicroApps offers notes target of application a lot of information in 15 minutes! topic area below. general LACC MICROAPPS

THURSDAY 60 THURSDAY 61

2020 S IM THURSDAY, 25 25 JUNE 2020 THURSDAY, SPEAKERS Jari Vikstedt, ETS-Lindgren; Harry Skinner, Intel Harry ETS-Lindgren; Vikstedt, Skinner, Jari Assaf National Instruments ; Alejandro Buritica, Anokiwave Toledano, IEEE Craig Kirkpatrick, IMECHE; Fisher, Gavin Cree-Wolfspeed Patel, Kasyap Inc. Cadence Design Systems, Dunn, John – 11:50 08:00

EVENT COMPANY ETS-Lindgren National Instruments Formfactor A Cree Company Wolfspeed, Corp. Maury Microwave Cadence Design Systems, Inc. WORKSHOPS SESSION TITLE 5G Performance Verification Test Challenges of Test Challenges Verification 5G Performance Modern Wireless Devices Practical GaN Power Amplifier Design - Modeled Amplifier Design Practical GaN Power Tips for and Tricks vs Measured Performance, Applications Avionics and Satcom Best Practices for Efficient EM Simulation mmWave Over-the-air (OTA) Test - Best Practices - Best Test (OTA) Over-the-air mmWave Reliable Results and for Fast S-parameter Wafer Thermal on Best Practices for Measurements with and Power Measuring S-Parameters Uncertainty

8:00 – 9:40

10:10 – 11:50

ndustry workshops cover contemporary topics spanning the state of the art in RF, microwave, and mm-wave areas. These two-hour workshops include in-depth include workshops These two-hour areas. and mm-wave microwave, contemporaryndustry cover state of the art topics spanning the workshops in RF, colleagues in and interact with knowledge opportunity Don’t miss this your to expand with experts from and discussions technical presentations industry. in the SESSION TIME

INDUSTRY INDUSTRY LACC

these very relevant fields! these very relevant I Antenna Components Antenna and including GaN Devices Devices, High Power n n 5G Millimeterwave, FR2 5G Millimeterwave, Techniques CAD and Modeling Products and Systems n n n FR1 5G Cell Phone ≤ 6GHz, Components & Materials Techniques Instrumentation and Measurement n n n IMS TECHNICAL SESSIONS 10:10 – 11:50 | THURSDAY, 25 JUNE 2020 | LACC

403A 403B 404AB Th2B: Late-breaking News from Th2C: Networked and Distributed Th2D: 3D Packaging and Additive the Terahertz Frontier Radar and Imaging Systems Manufacturing Chair: Nils Pohl, Ruhr University Bochum Chair: Christian Waldschmidt, Ulm Chair: Kamal Samanta, Sony Corp. Co-Chair: James Buckwalter, University University Co-Chair: Dominique Baillargeat, Xlim of California, Santa Barbara Co-Chair: Martin Vossiek, Ulm University - CNRS- Unversite De Liroges

10:10

Th2B-1: First Demonstration of G-Band Th2C-1: A Self-Mixing Receiver for Th2D-1: RF Systems on Antenna (SoA): Broadband GaN Power Amplifier MMICs Wireless Frequency Synchronization in A Novel Integration Approach Enabled Operating Beyond 200GHz Coherent Distributed Arrays by Additive Manufacturing M. Cwiklinski; Fraunhofer IAF; P. Brückner; S. Mghabghab; Michigan State Univ.; X. He; Georgia Tech; Y. Fang; Georgia 10:20 Fraunhofer IAF; S. Leone; Fraunhofer J.A. Nanzer; Michigan State Univ. Tech; R.A. Bahr; Georgia Tech; M.M. IAF; S. Krause; Fraunhofer IAF; C. Tentzeris; Georgia Tech Friesicke; Fraunhofer IAF; H. Maßler; Fraunhofer IAF; R. Quay; Fraunhofer IAF; O. Ambacher; Fraunhofer IAF 10:30

Th2B-2: 475-GHz 20-dB-Gain InP-HEMT Th2C-2: A Digital Interferometric Array Th2D-2: Wireless 3D Vertical Power Amplifier Using Neutralized with Active Noise Illumination for Interconnect with Power Splitting Common-Source Architecture Millimeter-Wave Imaging at 13.7fps Capability H. Hamada; NTT; T. Tsutsumi; NTT; S. Vakalis; Michigan State Univ.; A. Dave; Univ. of Minnesota; R. Franklin;

10:40 H. Matsuzaki; NTT; H. Sugiyama; NTT; J.A. Nanzer; Michigan State Univ. Univ. of Minnesota H. Nosaka; NTT 10:50

Th2B-3: A High-Isolation and Highly Th2C-3: Wireless Coherent Full-Duplex Th2D-3: 3D Printed One-Shot Linear Super-Wideband SPDT Switch in Double-Sided Two-Way Ranging Deployable Flexible “Kirigami” InP DHBT Technology (CFDDS-TWR) Approach with Phase Dielectric Reflectarray Antenna for mm- Tracking Based Multipath Suppression Wave Applications T. Shivan; FBH; M. Hossain; FBH; R. for Submillimeter Accuracy Doerner; FBH; T.K. Johansen; Technical 11:00 Displacement Sensing Y. Cui; Georgia Tech; S.A. Nauroze; Univ. of Denmark; K. Nosaeva; FBH; H. Georgia Tech; R.A. Bahr; Georgia Tech; Yacoub; FBH; W. Heinrich; FBH; V. Krozer; M. Gottinger; FAU Erlangen-Nürnberg; M.M. Tentzeris; Georgia Tech FBH M. Hoffmann; FAU Erlangen-Nürnberg; M. Vossiek; FAU Erlangen-Nürnberg 11:10 Th2B-4: 240-GHz Reflectometer with Th2C-4: Phase Recovery in Sensor Th2D-4: Evaluation of Micro Laser Integrated Transducer for Dielectric Networks Based on Incoherent Sintering Metal 3D-Printing Technology Spectroscopy in a 130-nm SiGe Repeater Elements for the Development of Waveguide BiCMOS Technology Passive Devices up to 325GHz D. Werbunat; Universität Ulm; D. Wang; Fraunhofer IPMS; M.H. Eissa; B. Meinecke; Universität Ulm; M. Steiner; V. Fiorese; STMicroelectronics; C. Belem IHP; K. Schmalz; IHP; T. Kämpfe; Universität Ulm; C. Waldschmidt; Gonçalves; STMicroelectronics; C. del Rio 11:20 Fraunhofer IPMS; D. Kissinger; Universität Universität Ulm Bocio; Universidad Pública de Navarra; Ulm D. Titz; Polytech’Lab (EA 7498); F. Gianesello; STMicroelectronics; C. Luxey; THURSDAY Polytech’Lab (EA 7498); G. Ducournau; IEMN (UMR 8520); E. Dubois; IEMN (UMR 8520); C. Gaquière; IEMN (UMR 8520); D. Gloria; STMicroelectronics 11:30

Th2B-5: A 311.6GHz Phase-Locked Th2C-5: Fusion of Radar and Loop in 0.13µm SiGe BiCMOS Process Communication Information for with -90dBc/Hz In-Band Phase Noise Tracking in OFDM Automotive Radar at 24GHz Y. Liang; NTU; C.C. Boon; NTU; Y. Dong; NTU; Q. Chen; NTU; Z. Liu; NTU; J.B. Sanson; Instituto de 11:40 C. Li; NTU; T. Mausolf; IHP; D. Kissinger; Telecomunicações; D. Castanheira; Universität Ulm; Y. Wang; UESTC; Instituto de Telecomunicações; H.J. Ng; KIT A. Gameiro; Instituto de Telecomunicações; P.P. Monteiro; Instituto de Telecomunicações 11:50

62 Microwave Field, Device & Circuit Techniques Passive Components Active Components Systems & Applications Emerging Technologies & Applications Focus & Special Sessions Late Breaking News IMS TECHNICAL SESSIONS 10:10 – 11:50 | THURSDAY, 25 JUNE 2020 | LACC

406AB 408A 408B Th2E: Novel Applications of Th2F: In-Band Full-Duplex Th2G: Phased Array and Wireless Power Transfer Cancellers and Transceivers Beamformer Integrated Circuits Chair: Nuno Borges Carvalho, Instituto Chair: Kenneth E. Kolodziej, Massachu- Chair: Jeremy Dunworth, Qualcomm De Telecomunicacoes setts Institute of Technology, Lincoln Research Co-Chair: Marco Dionigi, University of Laboratory Co-Chair: Donald LaFrance, Lockheed

Perugia Co-Chair: Kate Remley, National Institute Martin Corp.

of Standards and Technology 10:10

Th2E-1: High Isolation Simultaneous Th2F-1: A BST Varactor Based Th2G-1: A Fundamental-Frequency Wireless Power and Information Circulator Self Interference Canceller 122GHz Radar Transceiver with 5.3dBm Transfer System Using Coexisting DGS for Full Duplex Transmit Receive Single-Ended Output Power in a 130nm Resonators and Figure-8 Inductors Systems SiGe Technology

A. Barakat; Kyushu Univ.; R.K. Pokharel; C.F. Campbell; Qorvo; J.A. Lovseth; E. Aguilar; FAU Erlangen-Nürnberg; 10:20 Kyushu Univ.; S. Alshhawy; Kyushu Univ.; Collins Aerospace; S. Warren; Qorvo; V. Issakov; OvG Universität Magdeburg; K. Yoshitomi; Kyushu Univ.; S. Kawasaki; A. Weeks; Univ. of Central Florida; R. Weigel; FAU Erlangen-Nürnberg JAXA P.B. Schmid; Qorvo 10:30

Th2E-2: Conductive Coupler for Th2F-2: In-Band Full-Duplex Self- Th2G-2: An Integrated Bistatic 4TX/4RX Wireless Power Transfer Under Interference Canceller Augmented with Six-Port MIMO-Transceiver at 60GHz in Seawater Bandstop-Configured Resonators a 130-nm SiGe BiCMOS Technology for Radar Applications M. Tamura; Toyohashi University of R. Sepanek; BAE Systems ; M. Hickle;

Technology; K. Murai; Toyohashi BAE Systems ; M. Stuenkel; BAE M. Voelkel; FAU Erlangen-Nürnberg; 10:40 University of Technology; M. Matsumoto; Systems S. Pechmann; FAU Erlangen-Nürnberg; Toyohashi University of Technology H.J. Ng; IHP; D. Kissinger; Universität Ulm; R. Weigel; FAU Erlangen-Nürnberg; A. Hagelauer; Universität Bayreuth 10:50

Th2E-3: The K-Band Communication Th2F-3: An Integrated Full-Duplex/ Th2G-3: A Power Efficient BiCMOS Ka- Transmitter/Receiver Powered by the FDD Duplexer and Receiver Achieving Band Transmitter Front-End for SATCOM C-Band HySIC Energy Harvester with 100MHz Bandwidth 58dB/48dB Phased-Arrays Multi-Sensors Self-Interference Suppression Using Hybrid-Analog-Digital Autonomous S. Rasti-Boroujeni; Univ. of Waterloo; S. Yoshida; Kagoshima Univ.; Adaptation Loops A. Wyrzykowska; Univ. of Waterloo; 11:00 K. Matsuura; Univ. of Tokyo; D. Kobuchi; M. Mazaheri; Univ. of Waterloo; A. Univ. of Tokyo; N. Yabuta; Sophia Y. Cao; Univ. of Illinois at Urbana- Palizban; Univ. of Waterloo; S. Ituah; University; T. Nakaoka; Sophia University; Champaign; X. Cao; Univ. of Illinois at Univ. of Waterloo; A. El-Gouhary; Univ. K. Nishikawa; Kagoshima Univ.; Urbana-Champaign; H. Seo; Univ. of of Waterloo; G. Chen; Univ. of Waterloo; S. Kawasaki; JAXA Illinois at Urbana-Champaign; J. Zhou; H. Gharaei-Garakani; Univ. of Waterloo; Univ. of Illinois at Urbana-Champaign M. Nezhad-Ahmadi; Univ. of Waterloo; S. Safavi-Naeini; Univ. of Waterloo 11:10

Th2E-4: A Wireless Power Transfer Th2F-4: A Full-Duplex Transceiver with Th2G-4: A K-Band Low-Complexity System (WPTS) Using Misalignment CMOS RF Circulation and Code-Domain Modular Scalable Wide-Scan Phased Resilient, On-Fabric Resonators for Signal Processing for 104dB Self- Array Wearable Applications Interference Rejection and Watt Level TX Power Handling F. Akbar; Univ. of Michigan; A. Mortazawi; D. Vital; Florida International Univ.; Univ. of Michigan 11:20 J.L. Volakis; Florida International Univ.; A. Hamza; Univ. of California, Santa S. Bhardwaj; Florida International Univ. Barbara; A. Nagulu; Columbia Univ.; H. AlShammary; Univ. of California, Santa Barbara; C. Hill; Univ. of California, Santa Barbara; E. Lam; Univ. of California, THURSDAY Santa Barbara; H. Krishnaswamy; Columbia Univ.; J.F. Buckwalter; Univ. of California, Santa Barbara 11:30 Th2E-5: A 3D Rectenna with All- Th2F-5: Transmit-Receive Cross- Th2G-5: A Compact Ultra-Broadband Polarization and Omnidirectional Modulation Distortion Correction in GaN MMIC T/R Front-End Module Capacity for IoT Applications a 5–6GHz Full Duplex Quadrature Balanced CMOS RF Front-End Q. Lin; Qinghai Nationalities University; S. Wang; National Central Univ. ; H. Wu; Chengdu Ganide Technology; Y. H.-Y. Chang; National Central Univ. N. Ginzberg; Technion; T. Gidoni; Tel Aviv Chen; Chengdu Ganide Technology; L. University; D. Regev; Toga Networks; Hu; Chengdu Ganide Technology; Th2E-6: RF Energy On-Demand for E. Cohen; Technion S. Chen; Qinghai Nationalities University; 11:40 Automotive Applications X. Zhang; Qinghai Nationalities University G. Paolini; Univ. of Bologna; M. Shanawani; Univ. of Bologna;

A. Costanzo; Univ. of Bologna; F. Benassi; 11:50 Univ. of Bologna; D. Masotti; Univ. of Bologna Long- 20 Min. Microwave Field, Device & Circuit Techniques Passive Components Active Components Systems & Applications Emerging Technologies & Applications Focus & Special Sessions Late Breaking News 63 THURSDAY

64 LACC IMS2020

IMS PANEL SESSION 12:00 – 13:15 THURSDAY, 25 JUNE 2020

Connecting the Unconnected Enabled by Wireless Broadband Technologies

PANEL ORGANIZERS AND MODERATORS: Timothy Lee, Boeing; Kartik Kulkarni, Oracle

PANELISTS: Vint Cerf, Google; Alan Mickelson, University of Colorado, Boulder; Vincent Kaabunga, IEEE Africa Committee, Chair; Constantinos Karachalios, IEEE Standards Association; Jin Bains, Facebook Connec- tivity Lab; Mei-Lin Fung, People-Centered Internet

ABSTRACT: he major theme of IMS2020 is “Connectivity Matters.” Connectivity is vital to addressing many of the UN Sustainable Development Goals (SDGs) that provides a shared blueprint for peace and prosperity for people and the planet, now and into the future. At its heart are the 17 T Sustainable Development Goals (SDGs), which are an urgent call for action by all countries - developed and developing - in a global partnership. They recognize that ending poverty and other deprivations must go hand-in-hand with strategies that improve health and education, reduce inequality, and spur economic growth &ndash; all while tackling climate change and working to preserve our oceans and forests. The question is: what the microwave engineering community should be doing to advance the use of our technology to solving some of the world&r- squo;s toughest problems. In two words: CONNECTIVITY MATTERS. This Panel bring together global experts from the technical and policy communities to address the challenge and progress for digital inclusion to the 4 billion people who are unconnected. We are now seeing the emergence of new technology like 5G or low-earth orbit (LEO) satellites. How can the changing landscape, enabled by mobile carriers, equipment makers and individual engineers, be reached? THURSDAY

65 IMS TECHNICAL SESSIONS 13:30 – 14:50 | THURSDAY, 25 JUNE 2020 | LACC

408A 403B 404AB 403A Th3B: Robert J Trew: More than 50 Th3C: Emerging Technologies for Th3D: Late-breaking News in Th3E: Late-breaking News in III-V Years of Service to the Microwave Radar Detection, Tracking, and Millimeter-Wave Communication MMICs Community” Imaging and Radar Systems Chair: Hasan Sharifi, HRL Laboratories Chair: Samir El-Ghazaly, University of Chair: Rudy Emrick, Northrop Grumman Chair: Ethan Wang, University of Co-Chair: James Buckwalter, University Arkansas Corporation California, Los Angeles of California, Santa Barbara

13:40 Co-Chair: George Haddad, National Co-Chair: Danny Elad, ON Semiconduc- Co-Chair: James Buckwalter, University Science Foundation tor of California, Santa Barbara

Th3B-1: Remembering Dr. Robert James Th3C-1: K-Band MIMO FMCW Radar Th3D-1: A 25–29GHz 64-Element Dual- Th3E-1: A 20W 2–20GHz GaN MMIC Trew Using CDMA for TX-Separation Based Polarized/Dual-Beam Small-Cell with Power Amplifier Using a Decade on an Ultra-Wideband SiGe BiCMOS 45dBm 400MHz 5GNR Operation and Bandwidth Transformer-Based Power H.M. Trew; U.S. Department of the Radar Chipset High Spectral Purity Combiner Treasury

13:50 B. Welp; Fraunhofer FHR; H. Chung; Univ. of California, San Diego; M. Roberg; Qorvo; M. Pilla; Qorvo; A. Shoykhetbrod; Fraunhofer FHR; Q. Ma; Univ. of California, San Diego; T.R. Mya Kywe; Qorvo; R. Flynt; Qorvo; S. Wickmann; Fraunhofer FHR; G. Y. Yin; Univ. of California, San Diego; N. Chu; Qorvo Briese; Fraunhofer FHR; G. Weiß; MBDA L. Gao; Univ. of California, San Diego; Deutschland; J. Wenderoth; MBDA G.M. Rebeiz; Univ. of California, San Deutschland; R. Herschel; Fraunhofer Diego FHR; N. Pohl; Fraunhofer FHR 14:00

Th3B-2: Following the Evolution of High- Th3C-2: Measurement-Based Th3D-2: Linearization of mm-Wave Th3E-2: A 120-mW, Q-Band InP HBT Frequency Electronics: From Diodes to Performance Investigation of a Hybrid Large-Scale Phased Arrays Using Near- Power Amplifier with 46% Peak PAE Transistors — A Memorial to the Life of MIMO-Frequency Scanning Radar Field Coupling Feedback for >10Gb/s A. Arias-Purdue; P. Rowell; M. Urteaga; Dr. Robert J. Trew (1944–2019) Wireless Communication A. Shoykhetbrod; Fraunhofer FHR; K. Shinohara; A. Carter; J. Bergman;

14:10 M.S. Gupta; Univ. of California, San Diego H. Cetinkaya; Fraunhofer FHR; S. Nowok; R. Murugesu; Nokia Bell Labs; Teledyne Scientific & Imaging; K. Ning; Fraunhofer FHR M.J. Holyoak; Nokia Bell Labs; H. Chow; Univ. of California, Santa Barbara; Nokia Bell Labs; S. Shahramian; Nokia M.J.W. Rodwell; Univ. of California, Bell Labs Santa Barbara; J.F. Buckwalter; Univ. of California, Santa Barbara 14:20

Th3B-3: Robert J. Trew and the Th3C-3: Ultra-Wideband FMCW Radar Th3D-3: Modular Scalable 80- and Th3E-3: Transformer-Based Broadband Microwave Community with Over 40GHz Bandwidth Below 160-GHz Radar Sensor Platform mm-Wave InP PA Across 42–62GHz 60GHz for High Spatial Resolution in for Multiple Radar Techniques and with Enhanced Linearity and Second M. Golio; Golio Endeavors SiGe BiCMOS Applications Harmonic Engineering 14:30 B. Welp; Fraunhofer FHR; G. Briese; W.A. Ahmad; IHP; M. Kucharski; IHP; Z. Liu; Princeton Univ.; T. Sharma; Fraunhofer FHR; N. Pohl; Fraunhofer FHR A. Ergintav; IHP; D. Kissinger; Universität Princeton Univ.; C.R. Chappidi; Princeton Ulm; H.J. Ng; KIT Univ.; S. Venkatesh; Princeton Univ.; K. Sengupta; Princeton Univ. 14:40

Th3B-4: Bob Trew: Teacher, Researcher, Th3C-4: Harmonic Micro-Doppler Th3D-4: A Radar System Concept for Th3E-4: A 300-µW Cryogenic HEMT LNA Mentor, and Friend Detection Using Passive RF Tags and 2D Unambiguous Angle Estimation for Quantum Computing Pulsed Microwave Harmonic Radar Using Widely Spaced MMICs with A. Riddle; Quanergy Systems Antennas On-Chip at 150GHz E. Cha; Chalmers Univ. of Technology; N. Wadefalk; Low Noise Factory;

14:50 N. Nourshamsi; Michigan State Univ.; C. Hilton; Michigan State Univ.; P. Grüner; Universität Ulm; M. Klose; G. Moschetti; Qamcom Research & S. Vakalis; Michigan State Univ.; Universität Ulm; C. Waldschmidt; Technology; A. Pourkabirian; Low Noise J.A. Nanzer; Michigan State Univ. Universität Ulm Factory; J. Stenarson; Low Noise Factory; J. Grahn; Chalmers Univ. of Technology THURSDAY 15:00

Th3C-5: Localization and Tracking Bees Th3D-5: Wide-Band Frequency Using a Battery-Less Transmitter and an Synthesizer with Ultra-Low Phase Noise Autonomous Unmanned Aerial Vehicle Using an Optical Clock Source J. Shearwood; Bangor Univ.; S. Williams; M. Bahmanian; Universität Paderborn; 15:10 Bangor Univ.; N. Aldabashi; Bangor Univ.; S. Fard; Universität Paderborn; B. P. Cross; Bangor Univ.; B.M. Freitas; Koppelmann; Universität Paderborn; J.C. Universidade Federal do Ceará; C. Zhang; Scheytt; Universität Paderborn China Agricultural University; C. Palego; Bangor Univ. 15:20

66 Microwave Field, Device & Circuit Techniques Passive Components Active Components Systems & Applications Emerging Technologies & Applications Focus & Special Sessions Late Breaking News 408B Th3G: Phased Array Silicon Components Chair: Sorin Voinnigescu, University of Toronto Co-Chair: Cynthia Hang, Raytheon

Company 13:30

Th3G-1: A DC-32GHz 7-Bit Passive Attenuator with Capacitive Compensation Bandwidth Extension Technique in 55nm CMOS

Z. Zhang; Zhejiang Univ.; N. Li; Zhejiang 13:40 Univ.; H. Gao; Zhejiang Univ.; M. Li; Zhejiang Univ.; S. Wang; Zhejiang Univ.; Y.-C. Kuan; National Chiao Tung Univ. ; X. Yu; Zhejiang Univ.; Z. Xu; Zhejiang Univ. 13:50

Th3G-2: A Low Power 60GHz 6V CMOS Peak Detector Z. Tibenszky; Technische Universität Dresden; C. Carta; Technische Universität

Dresden; F. Ellinger; Technische 14:10 Universität Dresden 14:10

Th3G-3: A 35GHz Hybrid π-Network High-Gain Phase Shifter with 360° Continuous Phase Shift Range

D. Wei; Fudan Univ.; X. Ding; Univ. of 14:20 California, Davis; H. Yu; Univ. of California, Davis; Q.J. Gu; Univ. of California, Davis; Z. Xu; Zhejiang Univ.; Y.-C. Kuan; National Chiao Tung Univ. ; S. Ma; Fudan Univ.; J. Ren; Fudan Univ. 14:30

Th3G-4: A 68-dB Isolation 1.0-dB Loss Compact CMOS SPDT RF Switch Utilizing Switched Resonance Network X. Fu; Y. Wang; Z. Li; A. Shirane; K. Okada; Tokyo Institute of Technology 14:40 Th3G-5: A CMOS Balun with Common Ground and Artificial Dielectric Compensation Achieving 79.5% Fractional Bandwidth and <2° Phase Imbalance THURSDAY G. Yang; Tianjin Univ.; R. Chen; Southeast Univ.; K. Wang; Tianjin Univ. 14:50 Th3G-6: A 20.8–41.6-GHz Transformer- Based Wideband Power Amplifier with 20.4-dB Peak Gain Using 0.9-V 28-nm CMOS Process C.-W. Wang; National Taiwan Univ.; Y.-C. Chen; National Taiwan Univ.; W.-J. Lin; National Taiwan Univ.; J.-H. Tsai; National Taiwan Normal Univ.; T.-W. Huang; National Taiwan Univ.

67 IMS2020 ADVANCED PRACTICE AND INDUSTRY PAPER COMPETITIONS

he Advanced Practice Paper Competition (APPC) recognizes outstanding technical contributions that apply to practical applications. All finalist papers are on advanced practices and describe an innovative RF/microwave design, integration technique, process enhancement, and/or combination thereof T that results in significant improvements in performance and/or in time to production for RF/microwave components, subsystems, or systems. The Industry Paper Competition (IPC) recognizes outstanding technical contributions from industry sources.All finalist papers are from the RF/microwave industry and describe innovation of a product or system application that potentially has the highest impact on an RF/microwave product and/or system which will significantly benefit the microwave community and society at large. ADVANCED PAPER COMPETITION A CMOS Balun with Common Ground and Artificial Dielectric Compensation­ A 28GHz, 2-Way Hybrid Phased-Array Front-End for 5G Mobile Achieving 79.5% Fractional Bandwidth and <2° Phase Imbalance Applications G. Yang, Tianjin Univ., R. Chen, Southeast Univ., K. Wang, Tianjin Univ. N. Cho, H.-S. Lee, H. Lee, W.-N. Kim, Samsung 300W Dual Path GaN Doherty Power Amplifier with 65% Efficiency A Second Harmonic Separation Symmetric Ports 180° Coupler with for Cellular Infrastructure Applications Arbitrary Coupling Ratio and Transparent Terminations M. Masood, S. Embar R., P. Rashev, J. Holt, NXP Semiconductors, J.S. Kenney, P. Li, H. Ren, Washington State Univ., Y. Gu, Univ. of Texas at Arlington, B. Georgia Tech Pejcinovic, Portland State Univ., B. Arigong, Washington State Univ. RF Systems on Antenna (SoA): A Novel Integration Approach Ultra-Wideband FMCW Radar with Over 40GHz Bandwidth Below 60GHz for Enabled by Additive Manufacturing High Spatial Resolution in SiGe BiCMOS X. He, Y. Fang, R.A. Bahr, M.M. Tentzeris, Georgia Tech B. Welp, G. Briese, N. Pohl, Fraunhofer FHR Load Modulated Balanced mm-Wave CMOS PA with Integrated Linearity A 680GHz Direct Detection Dual-Channel Polarimetric Receiver Enhancement for 5G Applications C.M. Cooke, K. Leong, K. Nguyen, A. Escorcia, X. Mei, Northrop Grumman, C.R. Chappidi, T. Sharma, Z. Liu, K. Sengupta, Princeton Univ. J. Arroyo, Cubic Nuvotronics, T.W. Barton, University of Colorado Boulder, Analysis and Design of a Concurrent Dual-Band Self-Oscillating Mixer C. Du Toit, G. De Amici, D.L. Wu, NASA Goddard Space Flight Center, W.R. Deal, M. Pontón, A. Herrera, A. Suárez, Universidad de Cantabria Northrop Grumman Scalable, Deployable, Flexible Phased Array Sheets An X-Band Lithium Niobate Acoustic RFFE Filter with FBW of 3.45% and IL M. Gal-Katziri, A. Fikes, F. Bohn, B. Abiri, M.R. Hashemi, A. Hajimiri, Caltech of 2.7dB Y. Yang, L. Gao, S. Gong, Univ. of Illinois at Urbana-Champaign Compact Bandpass Filter with Wide Stopband and Low Radiation Loss Using Substrate Integrated Defected Ground Structure Automated Spiral Inductor Design by a Calibrated PI Network with Manifold D. Tang, C. Han, Z. Deng, H.J. Qian, X. Luo, UESTC Mapping Technique X. Fa, S. Li, P.D. Laforg, Univ. of Regina, Q.S. Cheng- SUSTech AFSIW-to-Microstrip Directional Coupler for High-Performance Systems on Substrate Efficient Modeling of Wave Propagation Through Rough Slabs with FDTD A. Ghiotto, J.-C. Henrion, T. Martin, J.-M. Pham, IMS (UMR 5218), S. Bakirtzis, Univ. of Toronto, X. Zhang, Univ. College Dublin, C.D. Sarris, V. Armengaud, CNES Univ. of Toronto Quasi-Absorptive Substrate-Integrated Bandpass Filters Using High-Frequency Vector-Modulated Signal Generation Using Capacitively-Loaded Coaxial Resonators Frequency-Multiplier-Based RF Beamforming Architecture D. Psychogiou, University of Colorado Boulder, R. Gómez-García, I. Jaffri, A. Ben Ayed, Univ. of Waterloo, A.M. Darwish, U.S. Army Research Universidad de Alcalá Laboratory, S. Boumaiza, Univ. of Waterloo High Isolation Simultaneous Wireless Power and Information High-Resolution Millimeter-Wave Tomography System for Transfer System Using Coexisting DGS Resonators and Figure-8 Inductors Characterization of Low-Permittivity Materials A. Barakat, R.K. Pokharel, S. Alshhawy, K. Yoshitomi, Kyushu Univ., A. Och, P.A. Hölzl- Infineon Technologies, S. Schuster, voestalpine, J.O. Schratte- S. Kawasaki, JAXA necker, Intel, P.F. Freidl, Infineon Technologies, S. Scheiblhofer, D. Zankl- voestal- pine, V. Pathuri-Bhuvan, Silicon Austria Labs, R. Weigel- FAU Erlangen-Nürnberg A Synthesis-Based Design Procedure for Waveguide Duplexers Using a Stepped E-Plane Bifurcated Junction A Dual-Mode Frequency Reconfigurable Waveguide Filter with a Constant G. Macchiarella, G.G. Gentili, Politecnico di Milano, L. Accatino, Frequency Spacing Between Transmission Zeros ACConsulting, V. Tornielli di Crestvolant, ESA-ESTEC G. B., R.R. Mansour, Univ. of Waterloo A Quadband Implantable Antenna System for Simultaneous Wireless Powering and Biotelemetry of Deep-Body Implants A. Basir, H. Yoo, Hanyang Univ.

68 IMS2020

INDUSTRY PAPER COMPETITION A 0.011-mm² 27.5-GHz VCO with Transformer-Coupled Bandpass Filter Digitally Assisted Load Modulated Balanced Amplifier for 200W Cellular Achieving -191dBc/Hz FoM in 16-nm FinFET CMOS Infrastructure Applications C.-H. Lin- TSMC, Y.-T. Lu- TSMC, H.-Y. Liao- TSMC, S. Chen- TSMC, A.L.S. Loke- S. Embar R., M. Masood, T. Sharma, J. Staudinger, NXP Semiconductors, TSMC, T.-J. Yeh- TSMC S.K. Dhar, Univ. of Calgary, P. Rashev, G. Tucker, NXP Semiconductors, Series-Combined Coaxial Dielectric Resonator Class-F Power Amplifier F.M. Ghannouchi, Univ. of Calgary System Suspended SiC Filter with DRIE Silicon Subcovers R.A. Beltran, F. Wang, G. Villagrana, Ophir RF E.T. Kunkee, D.-W. Duan, A. Sulian, P. Ngo, N. Lin, C. Zhang, D. Ferizovic, C.M. In-Band Full-Duplex Self-Interference Canceller Augmented with Band- Jackson, R. Lai, Northrop Grumman stop-Configured Resonators Acceleration and Extension of Radial Point Interpolation Method (RPIM) to R. Sepanek, M. Hickle, M. Stuenkel, BAE Systems Complex Electromagnetic Structures A 135–183GHz Frequency Sixtupler in 250nm InP HBT K. Sabet, A.I. Stefan, EMAG Technologies M. Bao, Ericsson, T.N.T. Do, D. Kuylenstierna, Chalmers Univ. of Technology, Highly Linear & Efficient Power Spatium Combiner Amplifier with H. Zirath, Ericsson GaN HPA MMIC at Millimeter Wavelength Frequency AFSIW-to-Microstrip Directional Coupler for High-Performance S.D. Yoon, J. Kitt, D. Murdock, E. Jackson, M. Roberg, G. Hegazi, P. Courtney, Qorvo Systems on Substrate High-Resolution Millimeter-Wave Tomography System for Characterization of A. Ghiotto,J.-C. Henrion, T. Martin, J.-M. Pham, IMS (UMR 5218), Low-Permittivity Materials V. Armengaud, CNES A. Och, P.A. Hölzl, Infineon Technologies, S. Schuster, voestalpine, Monolithic Integration of Phase-Change RF Switches in a Production J.O. Schrattenecker, Intel, P.F. Freidl, Infineon Technologies, SiGe BiCMOS Process with RF Circuit Demonstrations S. Scheiblhofer, D. Zankl, voestalpine, V. Pathuri-Bhuvana, Silicon Austria Labs, G. Slovin, N. El-Hinnawy, C. Masse, J. Ros, D. Howard, Tower Semiconductor R. Weigel, FAU Erlangen-Nürnberg A Volume Current Based Method of Moments Analysis of Shielded Planar 3-D Circuits in Layered Media J.C. Rautio, M. Thelen, Sonnet Software Design Considerations and FPGA Implementation of a Wideband All-Digital Transmit Beamformer with 50% Fractional Bandwidth S. Pulipati, R. Ma, MERL A 28GHz, 2-Way Hybrid Phased-Array Front-End for 5G Mobile Applications N. Chog, H.-S. Lee, H. Lee, W.-N. Kim, Samsung

69 LACC IMS2020

IMS CLOSING SESSION 15:30 – 18:00 THURSDAY, 25 JUNE 2020

The Road Ahead for Quantum Computing Hartmut Neven, Engineering Director, Quantum Artificial Intelligence Lab, Google ABSTRACT: he demonstration of quantum supremacy established a proof of principle that quantum computers can outperform classical ones on certain computational tasks. T Since achieving this milestone the Google AI Quantum team has been pursuing two development threads, one is to increase the computational volume afforded by a quantum computer and the other is to make good use of the computational volume available. To increase the computational volume, i.e. the number of gate operations that can be performed while still maintaining high output fidelity, we will need to implement quantum error correction. In this talk I will describe the sequence of milestones we hope to achieve en route to a fully error corrected quantum computer. Arguably the question that is the least answered for our community is whether there are commercially or scientifically interesting algorithms beyond the reach of classical machines that can be executed prior to implement- ing error correction. I will report on first examples. THURSDAY

70 FRIDAY, 26 JUNE 2020 IMS2020

Friday FRIDAY

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1 , 2 2020 Vertigo Vertigo , 2 3 Feinmetall

3 2

2 Institut für 3 Instituto de , Marco Spirito , S IM , N. Borges Borges N. , 3 2 2 , Krzysztof , , M. Marchetti M. , 2 2 , Alomari , M. 2 , Steve Reyes Steve , 2 , Yuliya Nesterova Yuliya , Anteverta-mw B.V., Anteverta-mw B.V., IMEC 1 2 2 , Jose Moreir Jose , , V. Camarchia V. , 1 2 , M. Squillante M. , , J. van ‘t Hof van J. , 1 2 Advantest Europe GmbH, GmbH, Europe Advantest www.arftg.org 2

2

Politecnico di Torino, Politecnico di Torino, 1 , Akshay Visweswaran Akshay , 2 1 , Jon Martens Jon , Anritsu , Stuart Nicol , 1 2 1 FRIDAY, 26 JUNE 26 2020 FRIDAY, Delft University of Technology, Technology, Delft University of , A. A. Piacibello , 2 1

Queen’s University Queen’s , E. Malotaux E. , , M. Spirito M. , 3 2 1 TPC Chair 3 , Jan Hesselbarth , , M. Spirito M. , De Martino C. , 1

3 1 3 University of Aveiro, Technology, Delft University of MPI Corporation, Tech, Vertigo University of Stuttgart, University of Stuttgart, APREL.Inc, Technology, Delft University of J. Burghartz J. L. Galatro L. Dabrowiecki 1 1 1 1 1 1 1 GmbH Maryna Nesterova Carvalho Carmine De Martino Tech Mikroelektronik Stuttgart (IMS) J. Brevik, A. Boaventura, M. Castellanos-Beltran, C. Donnelly N. Donnelly N. C. Castellanos-Beltran, M. Boaventura, A. Brevik, J. Williams, D. Dresselhaus, P. Hopkins, P. Fox, A. Flowers-Jacobs, Technology National Institute of Standards and Benz, S. Teyssier and J.-P. Dunsmore, J. Stav, A. Nielsen, T. Verspecht, J. CA Santa Rosa, Technologies, Keysight Figueiredo R. EMAG Technologies Inc, Ann Arbor, MI, USA Ann Arbor, Inc, Technologies EMAG Kaz Sabet, Utpal Dey Telecomunicacoes ‘t Hof van J. Steven Claessens and Taylor Barton; University of Colorado – Taylor Claessens and Steven Boulder General Chair, Martens, ARFTG President, Jon Gering, Joe Aaen, Peter Keysight Technologies Keysight Andrea Ferrero, L. Galatro L. Andrej Rumiantsev – 17:00 08:00 5G Waveform vs. CW: Near-Field De-Coupled Measurement of vs. Waveform 5G Assessment Density Electric and Magnetic Fields for Power Over-the-Air Characterization Of mm-Wave On-Chip Antennas On-Chip Characterization Of mm-Wave Over-the-Air Concept and Calibration Tx Modules, and Exhibits and Interactive Forum Exhibits and Interactive A Cryogenic Quantum-Based RF Source Quantum-Based RF A Cryogenic Analysis for Mixers and Frequency Modulation Distortion Converters Assessment of Systems Notch NPR for Linearity Swept Memory Effects Presenting Long-Term Electro-Optic Mapping Techniques for Characterization of for Characterization Techniques Electro-Optic Mapping Systems (Keynote) Antenna and Devices Circuits, Microwave Over-the-Air Test of Dipole and Patch Antenna Arrays at 28 GHz at 28 Arrays Antenna of Dipole and Patch Test Over-the-Air FieldThem in the Reactive Probing by Vector Gain Based Behavioral Models for Distortion Evaluation Models for Distortion Evaluation Gain Based Behavioral Vector Devices in mm-Wave Multi-port Reflectometry Applied to a Varactor-Tuned Varactor-Tuned Multi-port Applied to a Reflectometry Sampled-Line Welcome and Introduction and Welcome How Did We Get Here? A Short History of VNA Technology Technology A Short HistoryVNA Get Here? of We Did How Talk) (Invited Awards Luncheon Awards Exhibits and Interactive Forum Exhibits and Interactive Towards Commercially Available Quartz Calibration Substrates Available Commercially Towards Calibration, Repeatability and Related Characteristics of On-wa- Calibration, Measurements Broadband 70 kHz-220 GHz Single-Sweep fer, Electromagnetic Field Measurements 08:40-09:00 09:00 to 09:20 09:20 to 09:40 10:40 to 11:00 11:00 to 11:20 11:20 to 11:40 08:10 to 08:40 11:40 to 12:00 14:10 to 14:30 08:00 to 08:10 13:20 to 13:50 14:30 to 14:50 13:50 to 14:10 09:40 to 10:40 12:00 to 13:20 14:50 to 15:40

C-3 C-1 C-4 C-2 B-2 B-3 B-1 B-4 A-3 A-4 A-1 A-2

Break VNA Measurements and Calibration Session C: Oral Sources and Nonlinear Device Measurements Session B: Sources and Nonlinear Device Oral Oral Oral Session A: Break 95th ARFTG Microwave Measurement Conference Technical Program Technical Conference Measurement Microwave ARFTG 95th LACC 72 FRIDAY 72 FRIDAY 73

, 4

, , 3 1

5 1

Dell 7 2020 Army 3 Bureau 2 , Anthony Anthony , Sporton, Sporton, 1 , J. Kvarnstrand J. , 6 , Peter H. Aaen H. Peter , 3 Colorado School 1 3 S IM

7 , Michael Dieudonné , EMITE, EMITE, 2 5 , M. García-Fernández M. ,

5 , and Magnus Isaksson , 2 , M. Foegelle M. , 3 , Charles Baylis , , J. Harbour J. , 2 7

1 , Stavros Iezekiel Stavros , 2 Katholieke Universiteit Leuven Bluetest AB, 2 4 University of Surrey, University of Surrey, , E. Yen 2 7 , Peter Händel Peter , Pennsylvania State University, State University, Pennsylvania , E. Mendivil E. , 2 2 1,2 FRIDAY, 26 JUNE 26 2020 FRIDAY,

, Dominique Schreurs , 2 1 , Benjamin Kirk , 1 , D. Sánchez-Hernández D. , 4 , Cristian Matei , , C. Bax C. , 1 1 , J. Gutierrez J. , , Robert J. Marks II Robert J. , ETS-Lindgren, ETS-Lindgren, 6 3 3 Keysight Technologies, Technologies, Keysight University of Cyprus, University of Cyprus, Baylor University, National Institute of Standards and Technology, Technology, National Institute of Standards and Martone D. Skousen D. L. Chang L. A. Boaventura, J. Brevik, D. Williams, A. Fox, Fox, A. Williams, D. Brevik, J. Boaventura, A. Benz, S. Dresselhaus, P. Hopkins, P. Castellanos-Beltran, M. Technology National Institute of Standards and Muhammed Suleman; University Laforge, Paul Walia, Gaurav of Regina Masahiro Horibe and Iku Hirano, AIST Masahiro Horibe and Iku Hirano, der Daniel van Gu, Yuchen Mohammadreza Ranjbar Naeini, University of Wisconsin-Madison Weide, University Utsunomiya Kogami, Yoshinori Shimizu and Takashi JeongHwan Kim, Jin-Seob Kang, Jeong-Il Park, Chihyun Cho, Cho, Chihyun Park, Jeong-Il Jin-Seob Kang, Kim, JeongHwan KRISS Haris Votsi of Mines Sebastien Mons, Silvia Hernandez, Tibault Reveyrand, University of Limoges XLIM, Edouard Ngoya, Egbert Austin 1 1 1 1 Research Laboratory Robin Schmidt Pawel Barmuta Pawel Zain Ahmed Khan K. Remley K. Veritas, Veritas, , 1 , 1 , J. Quimby J. , , P. Vouras , P. 1 1 – 17:00 08:00 , K. Remley K. , 1 , D. Williams , D. 1 National Institute of Standards and Technology, Technology, National Institute of Standards and 1 , , B. Jamroz B. , 2 1 Colorado School of Mines Measurement of Dielectric PropertiesMeasurement of Dielectric Using Reflected Group Resonator of an Over-Coupled Delay Aperture Synthetic Setup and Control of a Millimeter-Wave Weiss A. Uncertainties;Measurement System with Vector Network Analyzer Calibration for Characterization of Network Vector at RF Frequency MOSFET Device Power Packaged Measurement Probe for Over-the-Air High-Performance for a 3D Printed Technique Measurement Complex Permittivity Rectangular Dielectric Rod using an NRD Guides at 60-GHz Band Backward Unknown-Thru Calibration Method Backward Unknown-Thru Analyzer Reference Network Vector Interferometry-BasedActive Impedance Renormalization 2 A. Elsherbeni A. R. Leonhardt R. SOLT and SOLR calibration methods using a single multiport SOLT standard connection “thru” - Performance Evalu Software-Defined Radio-based System Fast RF Systems Adaptive ation for Real-time Model of Probe Transition Including Probe Mispositioning Transition Model of Probe Cryogenic Calibration of a Quantum-based Radio Cryogenic Frequency Source Over-the-Air Testing of Cellular Large-Form-Factor of Cellular Large-Form-Factor Testing Over-the-Air Chambers in Reverberation Devices Internet-of-Things 16:00 to 16:20 16:20 to 16:40 15:40 to 16:00 16:40 to 17:00

D-2 D-3 D-1 D-4

Interactive Forum Session Interactive Additional D: Additional Session Oral Topics Measurement

LACC

2020

S IM FRIDAY, 26 JUNE 26 2020 FRIDAY, orkshop Abstract W – 17:15 08:00

GaN HEMT based technologies are gaining significant market share in the defense and infrastructure market spaces, due to attractive due to attractive share in the defense and infrastructure spaces, significant market market GaN HEMT based technologies are gaining Practitioners struggling with minimizing physical voltage. intrinsic efficiency and breakdown density, properties such as high output power to the point that in evolving specifications are Market to GaN technology system problems. to solve are being drawn size and weight such modern still come with associated challenges, GaN devices However, optional — it is mandatory. GaN is no longer products, many The traditional high channel temperatures. trapping and reliability concerns due to easily achievable of charge as significant levels Some design communities are very comfortable with empirical technology and design is the transistor model. working interface between concepts cost/higher integration lower but the increased push towards data such as harmonic load pull to implement GaN designs, adoption of and the sub-6GHz market Both the 5G push to mm-wave with empirical data time consuming and costly. working make is long design and assembly downside The solutions. cost integrated low are pushing the infrastructure towards market phased arrays, is ever fast and accurate GaN transistor models, demand for stable, the decrease cycle times, To R&D cost. drives which cycle times, Si2 Compact of the two The progress will present an overview of the current This workshop state-of-the-art in GaN modeling. increasing. in the state-of-the-art in along with advances Modeling Coalition standardized GaN HEMT models (ASM and MVSG) will be presented, of using and designing with the current There will also be feedback from the design community on the challenges model formulation. crop of GaN models There are two perspectives in dealing with beamforming in massive MIMO. The IEEE-ComSoc community has been used to perform the MIMO. in dealing with beamforming perspectives in massive There are two - without much consideration of hardware-imple in the Digital Domain, including the beamforming one, entire MIMO Signal Processing, at both base stations and mobile units if it were require appreciable computational capacity This would mentation challenges. Following of antennas are involved. thousands and maybe hundreds where Radio, New transferred MIMO in the mm-wave to Massive The IEEE-MTTS RF front-end. its own elements must have necessitates that each of the array perspective Solution” “Fully Digital such a with PA/LNA, amount of RF front-ends, such a huge must be in some doubt about the costs of providing other hand, on the community, A antenna array. element of a Massive-MIMO backing each individual array etc. Filters, Converters, DA/AD Mixers, Converting Up/Down noise performance strongly whose and the proximity of the LNAs, the PAs by major cost factor in this scenario is the heat generation for military been developed have phased arrays fully digital Despite the fact that oversized depends on the ambient temperature. the Splitting down heatsinking mechanisms are very the built-in and might not be suitable for commercial purposes. costly purposes, the directivity of such separate However, is one of the scenarios recently implemented. into separate medium-size arrays array large by beams as narrow as those generated are not capable of generating they Therefore, one. than that of the large is much lower arrays interference lower of the power, Multiple beam operations considerably benefit from narrow beams (higher bundling the composite array. with a single RF front-end per is to use Subarrays, “Hybrid Solution”, is called which The alternative, etc.). neighboring beams, between multiple Couplers and Phase need in this case Butler Matrices and/or Rotman Lenses with Steerable Multiple Beams would Subarray. of the generation The geometry are also crucial and topology parameters for avoiding of the Subarrays Shifters for each Subarray. complexity, alternatives in terms two of Hardware/Software these A comparison between Gratings Lobes with the associated ambiguity. is etc. Signal Distortion, PAs, Linearity and Efficiency of consumption in both the RF front-end and the Digital Signal Processing, power is to identify meaningful beamforming the workshop by Another aspect to be covered one of the main aspects of this workshop. optimal architectures can sacrifice architectures from both implementation-feasibility and information-theory In particular, perspectives. The related analog-digital balance must of significant reduction of implementation complexity. a small amount of traffic capacity in favor evolving this rapidly which will cover is the first IMS forum, This workshop strategies of MNOs. deployment be in line with the network discussions andThe post-presentation the workshop. experts by in the technical areas emphasized known The presenters are well topic. the existing of the current state-of-the-art, review and audience will lead to a comprehensive speakers mutual interaction between and the future outlook of this very promising area. challenges, Space based solar power is receiving a resurgence of interest from a number of government and international corporations. Because and international corporations. of government of interest from a number a resurgence is receiving Space based solar power research groups grids, for future power needed constant load power 24/7 carbon free, provides satellite (SPS) concept the solar power Many technologyaround the world are examining the different system and clean energy. components required for this source of brings and this workshop occurred since the early technology 2000s, and system architectures have in microwave advancements technology related topics include electronically steerable Microwave international to discuss their achievements. speakers key together an up to date assessment of is to provide of this workshop The goal and rectennas. beam control systems, retrodirective transmitters, beaming technology is used within the SPS power engineers with information microwave on how microwave the SPS system and provide subsystems. With the amazing growth of THz technologies, a solid-state approach has been pushed forward to contribute to filling a solid-state approach THz technologies, of With the amazing growth of the THz gap. The workshop aims to provide a deep overview of the recent features of mm-wave/THz active devices and circuits devices active a deep overview of the recent features of mm-wave/THz aims to provide The workshop THz gap. of the (ii) phase management), chip harmonic on combination, harmonic generation, (oscillator architecture, (i) signal generation regarding: performance) (iii) noise performance of single amplifiers architectures, low noise amplifiers, amplification (medium-power/high-power of focus on advances aims also to the workshop technologies, characterization of such advanced the complete Targeting devices/circuit. range. at room temperature up to the sub-THz/THz and noise sources devices solid-state silicon/III-V active characterization methods for techniques to accurately extract device noise measurement as common/new linearity as well measurements, will include power They to highlight state-of-the-art performance aims as well for workshop This full day THz range. and and circuit performance up to mm-wave the In detail, GaN). InP, (CMOS/BiCMOS) and III-V (GaAs, (0.1–1THz) technologies such Si mm-wave/THz of cutting-edge a broad range THz noise properties and Silicon (CMOS and SiGe HBT) transistors at process of III-V (InP and metamorphic HEMT) and amplification to optimize a technology performance and LNA how for low-noise Theoretical considerations about Frequencies will be discussed. TRX applications in the higher mm-wave and as PA as well will be given, frequency range and sub-mm-wave examples in the mm-wave THz Si CMOS technologies: III-V, using several phase noise) will be covered efficiency, (power, Signal generation frequency range. blocks or with system waveguide of systems in the 0.1 to 1THz frequency range as an enabler for the development oscillators, with the pulling of high frequency applica- Last, sensing and radar. radiometer, imaging, for communication, THz products single-chip High-data rate discussed. example of enabled applications will be as system-level approaches as well integration packaging and tions, as in the H-band (around in the D-band (110–170GHz) as well envisaged communications for future wireless backhauls is now that are now with link budgets 100Gbps, target can now these systems technologies, and sub-mm-wave With the mm-wave 300GHz). links,THz applications on space (Inter-satellite Other scenarios of the km-range. technologies up to close to be completed with several and roadmaps. future developments cost will drive as at chip-scale with low CubeSat) with high performance/compactness well as OvG

WORKSHOPS orkshop Title GaN Modeling in the Field: Recent Advances and Remaining Challenges Sponsor: IMS Roberg, Qorvo;Organizer: M. Canning, Infineon T. Technologies 08:00 – 17:15 Universität Magdeburg; D. Chen, Intel; Z. Choudhury, Dalhousie University 08:00 – 17:15 Sponsor: IMS Organizer: A. Omar, Beamforming in Massive NewMIMO for mm-Wave Radio Space Based Solar Power (SBSP) Sponsor: IMS Jackson, Organizer: C. Northrop Grumman; Raytheon McSpadden, J. 08:00 – 17:15 Solid-State Technologies, Solid-State Technologies, from Devices to Earth/ Space Applications: Surfing Signal and Power on Noise, Generation Sponsor: IMS Danneville, Organizer: F. IEMN (UMR 8520); G. Ducournau, IEMN (UMR 8520) 08:00 – 17:15 Cutting-Edge THz W

WFB WFC WFF

WFA LACC FRIDAY

FRIDAY 74 FRIDAY 75

WFD WFE WFF WFG 20 20 S IM orkshop Title W Microwave Acoustics and RF MEMS Enabling 5G Sponsor: IMS Organizer: A. Hagelauer, Tag, A. Universität Bayreuth, of University Gong, S. Qorvo, Illinois at Urbana-Champaign 08:00 – 17:15 GaN Modeling in the Field: Recent Advances and Remaining Challenges Sponsor: IMS Roberg, Organizer: M. Canning, Infineon Qorvo;T. Technologies 08:00 – 17:15 Latest Trends and Developments in RF/MW Circuits and Devices, System Technology for Aerospace and Defense Applications Sponsor: IMS UMS, Callet, Organizer: G. Formicone; Integra G. Technologies 08:00 – 17:15 Microwave Magnetic Materials and Devices for Improved Functionality Sponsor: IMS Nordquist, Organizer: C. - Sandia National Laborato University Psychogiou, D. ries, of Colorado Boulder 08:00 – 17:15 SUNDAY, 21 JUNE2020 SUNDAY, – 17:15 08:00

orkshop Abstract W WORKSHOPS

The development of 5G systems promises paradigm-shifting applications while presenting unique challenges across materials, devices, devices, across materials, presenting unique challenges of 5G systems promises paradigm-shifting applications while The development filtering at is the front-end acoustic to support solutions the 5G growth calls for innovative One area that and systems. modules, of international will present upcoming solutions from the experts features a group this workshop who this end, To sub-6GHz and beyond. considerations and then delve will first highlight system-level The workshop academia. approaches from industry as innovative as well solutions that require co-designing devices, design/modeling techniques before comprehensive materials and enabling device into new with insights and outlooks for the A panel discussion will conclude the workshop and packaging are discussed. integration, circuits, as the long-term in RF front-ends. trending acoustic technology devices prospects of acoustic candidates as well With IMS-2020 coming to Los Angeles, CA, an historic hub of the Aerospace and Defense (A&D) industry, also home to NASA / Jet also home to NASA / Jet Aerospace and Defense (A&D) industry, an historic hub of the CA, Angeles, With IMS-2020 coming to Los research and industry world experts, leaders to report together and discuss the latest gathers Propulsion Laboratory this workshop (JPL), as opposed to the more widely in this specific area, that continue on driving innovation RF/MW technology trends and developments to circuit devices, electron active span from solid-state and vacuum Areas of interest discussed in this workshop 5G theme. covered amplifiers still dominate the space Tube Wave Traveling • subtopics are covered: the following In particular, design and techniques. have AlGaN/GaN HEMT devices presentations dedicated to this technology from two • depletion mode sector; come and learn why for reliable spaceborne debate; but qualification criteria applications is still an active RF/MW systems, become ubiquitous in several GaAs and GaN technology from a overview Aerospace Corporation • an of InP, by the the latest qualification criteria will be presented commercial foundry JPL and radar and • latest RF/MW technology sensing presented by for SmallSat and radar remote perspective dish-antenna for high-power and circuit techniques Airbus • solid-state device for Earth observations presented by radiometer payloads design • RF/microwave GaN MMIC amplifier RF pallets for radar systems • broadband high-power and an overview of high-power radars, from emerged including a look at multi-channel technologies that have technology systems, for beamforming in phased-array students and engineers to the to attract young an effort from MIT-LL • on the education front, communications developments workshop is This full-day work. course “build-your-own-radar“ electromagnetic (EM) engineering field with hands-on learning through on the latest trends practitioners in the RF/MW aerospace and defense industry a broader perspective towards want to gain geared who A&D industrygain to the will also and newcomers Novices specific to each different application. as nuances as well and developments in this specific arena. innovation exposure and understanding of the RF/MW landscape that drives a comprehensive GaN HEMT based technologies are gaining significant market share in the defense and infrastructure market spaces, due to attractive due to attractive in the defense and infrastructure share spaces, significant market market GaN HEMT based technologies are gaining Practitioners struggling with minimizing voltage. intrinsic efficiency and breakdown density, properties such as high output power to the point evolving are specifications Market to GaN technology system problems. to solve are being drawn size and weight physical with associated modern still come GaN devices However, — it is mandatory. optional GaN is no longer products, that in many temperatures. high channel trapping and reliability concerns due to easily achievable of charge such as significant levels challenges, are very Some design communities technology comfortable and design is the transistor model. The traditional interface between cost/higher lower but the increased push towards with empirical data such as harmonic to implement GaN designs, working load pull and the sub-6GHz the 5G push to mm-wave Both with empirical data time consuming and costly. working concepts make integration is long The downside solutions. cost integrated low are pushing the infrastructure towards market of phased arrays, adoption market fast and accurate GaN the demand for stable, decrease cycle times, To R&D cost. drives which design and assembly cycle times, The will present an overview of the current This workshop state-of-the-art modeling. in GaN increasing. is ever transistor models, with along GaN HEMT models (ASM and MVSG) will be presented, Si2 Compact Modeling Coalition standardized of the two progress of design community on the challenges There will also be feedback from the in the state-of-the-art in model formulation. advances using and designing with the current crop of GaN models. Microwave magnetic materials and devices provide a rich range of functions and capabilities that cannot be achieved with traditional be achieved of functions and capabilities that cannot a rich range provide magnetic materials and devices Microwave frequency-dependent non-linear opportunities behavior, for non-reciprocal provide devices Magnetic electronic devices. microwave these unique are overcome, If current challenges materials and device components. and size reduction for high-frequency responses, size weight and reduced adaptability, improved future system capabilities such as full-duplex operation, are expected to enable devices unique performance to complement the excellent effects that provide material and device magnetic There are many and power. include functionality be exploited for unique device effects that may Physical modern microelectronics. performance by provided piezoelectricityThese and other effects such as and piezomagnetism. ferromagnetism, spin-waves, magnetoelasticity, magnetostriction, performance using either multiple and component by device been combined to enable novel have waves or electromagnetic traveling devices, on magnetic materials and up-to-date perspective an will provide This workshop materials or a single multiferroic material. Academic and industry are not experts on this technologydevices. in these who a background for individuals providing also while ferrite-core including integrated devices of topics in magnetic materials for realizing RF/microwave a broad range will cover speakers auto-tune limiters, frequency-selective phase shifters, tunable and steerable antennas, tunable filters, magnetic tags, microinductors, material synthesis and integration diverse cover will The speakers rotators. and quasi-optical faraday non-reciprocal devices, filters, These approaches and bulk materials growth. roll-to-roll processing, manufacturing, additive including electrodeposition, approaches, with operating bands ranging the macro-scale, ranging from the nanoscale to materials and devices been used to realize magnetic have CMOS monolithically onto silicon been integrated have these materials and devices In some cases, frequencies. VHF to mm-wave from the will also cover Speakers and into flexible membranes. components, circuit boards and other passive onto printed electronics, This should provide materials. magnetic the unique properties of the various covering and modeling of these devices, physics will begin The workshop concepts. device participants novel with a theoretical basis and understanding that can be applied to other new - develop new also covering and overview of the technologies while background a good with academic presentations that will provide using these magnetic materials Later presentations will focus on the realization and commercialization of devices ments in the field. components and systems to support 5G and will enable future microwave These magnetic materials and devices and technologies. high-performance technology. device that require miniature, other initiatives

FRIDAY LACC

20 20 S IM FRIDAY, 26 JUNE 26 2020 FRIDAY, FRIDAY, 26 JUNE 26 2020 FRIDAY, Course Syllabus orkshop Abstract W – 13:30 12:00 – 17:15 08:00 LACC

In this technical lecture, you will learn key aspects of silicon-based mm-wave phased-array design and characteriza- phased-array of silicon-based mm-wave aspects will learn key you In this technical lecture, (2) -- theory of phased arrays topics: (1) Fundamentals the following and intuition, The lecture will cover tion. circuit building blocks for phased array (3) Silicon-based architectures, phased array Silicon-based mm-wave (6) phased measurements, (5) phased array antenna and module design and simulation, (4) Package, systems, The lecture will end with a peek into will be covered. Both CMOS and SiGe technologies system considerations. array systems. current of phased array research trends and future research outlook The workshop objective is to gather together knowledge and internationally recognized scientists developing minimally or non-invasive minimally or non-invasive and internationally recognized scientists developing knowledge together gather is to objective The workshop and promote current technologies exchanges propose to favor we With this workshop, applications. research aimed for biomedical the application of electric fields with Indeed, treatments or diagnostic. or electric fields for therapeutic based on electromagnetic waves electroporation or has been used to achieve and amplitudes of the order of hundreds of kV/m microseconds and milliseconds By inserting anti-cancer across cell membrane. “pores” or pathways the opening of nanometer-size electropermeabilization i.e. of skin electrodes in contact for example in the treatment was clinically applied using electrochemotherapy molecules inside the cells, fields pulsed electric of the cell such as mitochondria, reach internal biological targets To metastases. cutaneous and subcutaneous fields open up prospects forThese been used. intensities have and Megavolt/meter picosecond durations (nsPEF) with nanosecond, specific the effects or target in apoptosis cell death and the possibility to modulate cancer therapies such as those resulting innovative The coupling of technologies implies challenging state-of-the-art developments. Minimally or non-invasive cellular components. of an the principle radiated fields i.e. on weak tissues with no direct contact relies mainly with biological cells, electromagnetic waves and/or delivery generators to systems capable developing by the intensity levels here is to balance The main challenges antenna. have Radiofrequency or microwaves (electroporation). intensities to cause local effects on the cells induce electric fields of sufficient potentially new of cancer treatment therapies particularlybeen applied in the context Recently, and thermal hyperthermia ablation. amplitude-modulat- heating from continuous and pulsed-wave therapeutic means of cancer treatment with electromagnetically-induced been also applied for have (CW) sinusoidal signals in the MHz range Continuous-wave been investigated. have ed mm-waves are strongly supportedThe findings with these researches by correlations with experimental recently. electroporation investigations will be presented on subnanosec- developments During this workshop, imaging technologies and numerical modeling and simulations. temperature and electric fields assessments, pulses, thermal mm-wave and deliveryond or nanosecond pulse generators systems, and deep body investigations “in vitro” techniques under for example, characterization innovative numerical modeling at the cell level, the scientists between contents and to enhance exchanges a panel discussion to debate various will end with The workshop stimulation. chairs). attendees, (speakers, DARPA WORKSHOPS Lecture Title

orkshop Title Sponsor: IMS Gardill, Organizer: M. Chung, InnoSenT; S. Chen, Neuralink; Y.-K. Toward Toward Waves Non-Invasive and Characterization for Biomedical Applications: from Microwaves to to Nanosecond mm-Waves Pulsed Electric Fields (nsPEF) 8:00:00 – 11:50 08:30 – 12:00 Silicon-based Millimeter-Wave Silicon-based Millimeter-Wave Phased Array Design T. IBM Bodhisatwa Sadhu, Speakers: Watson Research Center; AlbertoJ. Watson J. IBM T. Valdes-Garcia, Research Center W

WFH TFA1

FRIDAY LECTURES TECHNICAL LACC FRIDAY

FRIDAY 76 FRIDAY 77

20 20 S IM

Dynawave Inc. Dynawave ECHO Microwave Eclipse MDI Ltd. Pvt. Technologies ELDAAS Inc. Electro Enterprises, Electro Rent Corp. Element Six Elite RF LLC Inc. RF Systems, Empower EMWorks Inc. ENGIN-IC, Inc. Epoxy Technology, Epson America Inc. ERG Aerospace Erzia Technologies ETL Systems Ltd. ETS-Lindgren Week European Microwave International Corp. Everbeing 101 Everything RF / Microwaves Inc. evissaP, Communications Exodus Advanced EXXELIA EZ Form Cable Corp. Inc. F&K Delvotec, ELASI FECOA Ferrite Technologies Microwave Ferro Corporation Inc. Filtronetics, Filtronic Fine-Line Limited Circuits Ltd. Flann Microwave Inc. Flexco Microwave Florida International University Inc. Focus Microwaves FormFactor Inc. Frontlynk Technologies FTG Corp. Ltd. Co., Tech Fuzhou MIcable Electronic Inc. Gamma Electronics, Geib Refining Corp. Ltd. Co., Technology Genmix Communication GmbH GEROTRON Inc. GGB Industries, Ltd. Co., GigaLane LLC Global Communication Semiconductors, Global Production Systems Ltd. Equipment Global Test GLOBALFOUNDRIES Ltd. Co., Golden Loch Ind. Ltd. Co., Technology Material Advanced Gova Components Group (GCG) Gowanda Electronics (affiliate of GCG) Gowanda Inc. Industries, Greenray Ltd. Co., Technology Telecom Guangdong DAPU Guerrilla RF Hamilton LLC Harbour Industries, Inc. HASCO, Ltd. Co., Technologies Hermerc Hermetic Solutions Group Herotek Inc. Hesse Mechatronics High Frequency Electronics Hirose Electric USA

Exhibitors as of 9 April 2020 as of 9 Exhibitors Beijing Hwa-Tech Information System Co., Ltd. Information System Co., Beijing Hwa-Tech Electronics Inc. Benchmark Inc. Technologies, Bliley C W Swift Inc. Systems, Cadence Design Pomona University, California State Polytechnic Carlisle IT CEL Centerline Technologies Inc. Century Seals, Inc./Cernexwave Cernex, Inc. Charter Engineering, Ltd. Co., Technology Chengdu Jingxin Microwave Ltd. Co., Technology Microwave Chengdu KeyLink Ltd. Co., Chin Nan Precision Electronics Ltd. Co., Technology Chuzhou First Ciao Wireless, Inc. Cicor Group Cinch Connectivity Solutions Inc. Cirexx International, CML Microcircuits (USA) Inc. Solutions Electronic Advanced Cobham Inc. Coilcraft, Industries Communications & Power Inc. Component Distributors, Inc. COMSOL, ConductRF Inc. Connectronics, Continential Resources Copper Mountain Technologies Corning Inc. Corry Micronics Inc. Inc. Technology, Cosmic Microwave COTECHWAVE Aerospace & Electronics Crane LLC Crescend, Criteria Labs Crystek Corp. CTS Corporation CTT Inc. Cubic Nuvotronics Inc. Assemblies, Custom Cable Inc. Components, Custom Microwave (CMi) Inc. Custom Microwave CX Thin Films Ltd. Co., Technology Daa-Sheen Inc. Daico Industries, Corp. Tech. Dalian Dalicap Ltd. Electronics Co., Teruilai Danyang dB Control dBm Corp. Delphon - Gel-Pak Corp. Delta Electronics Mfg. Delta-Sigma Inc. Denka Corporation Inc. Technologies Design Workshop Inc. Company, Tool DeWeyl Corp. Antenna & Microwave Diamond Dino-Lite Scopes Diramics AG Inc. Microwave DiTom Doosan Electro Materials dSpace Inc. Ducommun Inc. Electronics (affiliate of GCG) DYCO EXHIBITING COMPANIES COMPANIES EXHIBITING Barry Inc. Industries, B&Z Technologies Axiom Test Equipment Axiom Test AVX Corporation AVX Avalon Test Equipment Test Avalon Auden Techno Corp. Techno Auden Atlanta Micro, Inc. Atlanta Micro, Astronics Test Systems Astronics Test Association of Old Crows/Naylor ASI dba RF Depot Inc. ASB Inc. Artech House Arralis AR RF/Microwave Instrumentation AR RF/Microwave AR Modular RF Applied Thin-Film Products API Technologies APA Wireless Technologies APA AO Technologies AO ANSYS, Inc. ANSYS, Anritsu Co. Anokiwave Anapico Ltd. Analog Devices, Inc. Analog Devices, Amwav Technology Limited Technology Amwav AmpliTech Inc. AmpliTech Ampleon Amphenol Printed Circuits AMETEK Electronic Interconnect and Packaging Ametek CTS US/Instruments for Industries American Standard Circuits, Inc. American Standard Circuits, American Microwave Corp. American Microwave AMCOM Communications Inc. AMCAD Engineering Altum RF Altair Engineering, Inc. Altair Engineering, Almic Electronics Co., Ltd. Almic Electronics Co., Aldetec, Inc. (UST-Aldetec) Inc. Aldetec, Akoustis, Inc. Akoustis, A-INFO Inc. AI Technology, Inc. AI Technology, Agile Microwave Technology Inc. Technology Agile Microwave AGC-Nelco AEM, Inc. AEM, Advanced Test Equipment Rentals Test Advanced Advanced Microwave Technology Co., Ltd. Co., Technology Microwave Advanced Advanced Circuitry InternationalAdvanced Advanced Assembly Advanced AdTech Ceramics AdTech Adsantec Inc. ADMOTECH Co., Ltd. Co., ADMOTECH Adesto Technologies Corp. Adesto Technologies ACST GmbH ACST ACEWAVETECH Accurate Circuit Engineering Accumet ABF Elettronica S.r.l. A-Alpha Waveguide Inc. A-Alpha Waveguide A.T. Wall Wall Company A.T. A.L.M.T. Corp. A.L.M.T. A.J. Tuck Co. Tuck A.J. 3RWAVE 3G Shielding Specialties 3G Shielding 3D Glass Solutions Account Name IMS2020

EXHIBITING COMPANIES Exhibitors as of 9 April 2020

Holzworth Instrumentation Inc. Marki Microwave, Inc. NEL Frequency Controls, Inc. HRL Laboratories, LLC Marvin Test Solutions NEO Tech Huang Liang Technologies Co., Ltd. Massachusetts Bay Technologies Netcom, Inc. HYBOND, Inc. Materion Brush, Inc. Networks International Corp. (NIC) HYPERLABS MathWorks New Japan Radio IDT Integrated Device Technology Maury Microwave Corp. Norden Millimeter Inc. IEEE Antennas and Propagation Society MaXentric Technologies LLC Northrop Grumman IEEE Electromagnetic Compatibility Society MCV Microwave NTK Technologies, Inc. IHP GmbH MECA Electronics Inc. Nuhertz Technologies, LLC IMS 5G Pavilion Mega Circuit Inc. Oak-Mitsui Technologies, LLC IMS Interactive Forum Mega Industries, LLC OEwaves Inc. IMS Startup Pavilion MegaPhase Ohmega Technologies Inc. IMS University Booth Menlo Microsystems, Inc. OML, Inc. IMST GmbH Mercury Systems OMMIC InCompliance Magazine Metallife, Inc. OPHIR RF Inc. Indium Corp. Metallix Refining Inc. Optelligent, LLC INGUN USA, Inc. Metamagnetics, Inc. Optenni Ltd. Innertron, Inc. Metropole Products Inc. Optiforms, Inc. Innovative Power Products, Inc. Mician GmbH Orbel Corp. In-Phase Technologies, Inc. Micro Harmonics Corp. Orient Microwave Corp. Inspower Co., Ltd. Micro Lambda Wireless, Inc. Orolia Insulated Wire, Inc. Micro Systems Technologies AG Otava Integra Technologies Inc. MicroApps Pacific Microchip Corp. Intelliconnect USA, LLC Microchip Technology Inc. Palomar Technologies International Manufacturing Services Inc. MicroFab Inc. Parker Chomerics inTEST Thermal Solutions Micro-Mode Products, Inc. Pasquali Microwave Systems Ironwood Electronics Microsanj Passive Plus Inc. Isola Microtech, Inc. Pasternack ITEQ Corp. Microwave Applications Group PCB Power Inc. ITF Co., Ltd. Microwave Communications Labs, Inc. Pentek Jet Metal Technologies Microwave Development Labs Inc. Pickering Interfaces, Inc. JFW Industries, Inc. Microwave Dynamics Pico Technology Jiangsu Caiqin Technology Co., Ltd. Microwave Engineering Corporation Piconics Inc. JMJ Korea Microwave Journal Pivotone Communication Tech., Inc. Johanson Technology, Inc. Microwave Product Digest Pixus Technologies JQL Technologies Corporation Microwave Products Group Planar Monolithics Industries, Inc. Junkosha Inc. Microwave Town Company LLC Plexsa Manufacturing Keysight Technologies Microwavefilters & TVC S.r.l. Plextek RFI Ltd. Knowles Precision Devices Microwaves & RF/Informa Plymouth Rock Technologies KOSTECSYS Co., Ltd. Miczen Technologies Co., Ltd. PM Industries Inc. Kratos General Microwave Millimeter Wave Products Inc. Polyfet RF Devices KRYTAR, Inc. Millimeter Wave Systems LLC Powell Electronics Group Kumu Networks Milliwave Silicon Solutions, Inc. PPG Cuming Microwave KVG Quartz Crystal Technology GmbH Mini-Circuits Presidio Components, Inc. Kwangwoon University Mini-Systems Inc. Presto Engineering Inc. Kyocera International, Inc. Mitsubishi Electric US, Inc. pSemi Corporation L3Harris MixComm Pure Pro Technology Co., Ltd. LadyBug Technologies LLC Modelithics, Inc. Q Microwave, Inc. Lake Shore Cryotronics, Inc. Modular Components Qorvo Lanjian Electronics Morion US, LLC Q-Tech Corp. Laser Processing Technology, Inc. Mouser Electronics, Inc. Quantum Microwave Components Leader Tech. Inc. MPI Corp. Quest Microwave Inc. LEONARDO MRSI Systems LLC Quik-Pak Liberty Test Equipment Inc. MST LLC QuinStar Technology, Inc. Lilliput Electronics (USA) Inc. MtronPTI QWED Sp. z o.o Linearizer Technology, Inc. Muegge GmbH R&K Company Ltd. Lintek Pty Ltd. MUNICOM GmbH Raynool Technology Co., Ltd. Linwave Technology Ltd. Murata Software Co., Ltd. Raytech Inc. Logus Microwave MWee (Microwave Engineering Europe) Reactel, Inc. Lorentz Solution, Inc. Nanjing ECT Technologies Co., Ltd. RelComm Technologies Inc. LPKF Laser & Electronics NanoSemi, Inc. Reldan Metals Co. Div. of ARM, LLC. M2 Global Technology Ltd. National Instruments Remcom, Inc. MACOM National Taiwan University Remote Sensing Solutions Inc. Magvention Naylor Association Solutions Remtec, Inc. Malico Inc. NDK America Renaissance/Hxi 78 IMS2020 IMS2020

EXHIBITING COMPANIES Exhibitors as of 9 April 2020

Resin Systems Corp. Stellar Industries Corp. Viking Tech America Corp. Res-Net Microwave, Inc. StratEdge Corp. Viper RF Limited Response Microwave Inc. Suin Instruments Co., Ltd. Virginia Diodes Inc. RF Morecom Korea Sumitomo Electric Device Innovations Vishay Intertechnology, Inc. RFHIC Corp. Summit Interconnect Vishay UltraSource Inc. RF-Lambda USA LLC Sung Won Forming W. L. Gore & Associates, Inc. Rflight Communication Electronic Co., Ltd. SuperApex Corporation Waka Manufacturing Co., Ltd. RFMW Susumu International (USA) Inc. Wave Mechanics Pvt. Ltd. Richardson Electronics, Ltd. Suzhou Hexagon Communication Technologies Co., WAVEPIA Co., Ltd. Richardson RFPD Ltd. Wavetek Microelectronics Corporation Rigol Technologies USA, Inc. SV Microwave Inc. Wavice Inc. RJR Technologies, Inc. Switzer weasic Microelectronics S.A. RLC Electronics, Inc. Syrlinks Weinschel Associates Rogers Corp. Tabor Electronics Weiss Technik North America Rohde & Schwarz USA, Inc. TACTRON ELEKTRONIK GmbH Wenzel Associates Inc. Roos Instruments Inc. Tagore Technology Inc. Werlatone Inc. Rosenberger North America Akron, LLC Tai-Saw Technology Co., Ltd. West Bond Inc. ROSNOL RF/Microwave Technology Co., Ltd. Talent Microwave, Inc. WEVERCOMM Co., Ltd. RUPPtronik TAMAGAWA ELECTRONICS VIETNAM Wiley Rutgers University TDK-Lambda Americas WIN Semiconductors Corp. SAF North America LLC Tecdia Inc. Winchester Interconnect SAGE Millimeter, Inc. Tech Briefs Media Group WIPL-D Saint-Gobain Technetics Group Wireless Telecom Group Sainty-Tech Communications Ltd. Tech-X Corporation Withwave Co., Ltd. Samtec, Inc. Teledyne Technologies Wolfspeed, A Cree Company San-tron Inc. Telegartner, Inc. XI’AN PRECISIONRF ELECTRONICS CO., LTD. Sawnics Inc. Telonic Berkeley Inc. Xilinx Ireland Unlimited Company Schlegel TestEquity XMA Corporation Schmid & Partner Engineering AG Texas Instruments X-Microwave Scientific Microwave Corp. The Boeing Company Xpeedic Technology, Inc. Semi Dice Inc. The EMC Shop Yokowo Co., Ltd. SemiGen The Goodsystem Corp. Z-Communications, Inc. Sensorview Co., Ltd. Ticer Technologies Sentec E&E Co., Ltd. TICRA SGMC Microwave Times Microwave Systems Shanghai Huaxiang Computer Comm. Eng. TMD Technologies Ltd. Shanghai JunCoax RF Technologies Co., Ltd. TMY Technology Inc. Shanghai XinXun Microwave Technology Co., Ltd. Tooling Dynamics Shengyi Technology Co., Ltd. Top Dog Test Shenzhen Superlink Technology Co., Ltd. Tower Semiconductor Shenzhen Yulongtong Electron Co., Ltd. TPT Wire Bonder Shin Puu Technology Ltd. Co. Transcat, Inc. Siglent Technologies NA Transcom, Inc. Signal Hound Transline Technology Inc. Signal Integrity, Inc. Triarchy Technologies Corp. Signal Microwave Tronser, Inc. SignalCore Inc. TRS-RenTelco Signatone TTE Filters (affiliate of GCG) Sino Nitride Semiconductor TTM Technologies Skyworks Solutions, Inc. UBCS Co., Ltd. Smiths Interconnect UCLA Samueli Engineering Societies Pavilion UIY Inc. Solid Sealing Technology Ulbrich SOMACIS Ultra Intelligence & Communication Sonnet Software Inc. UMS (United Monolithic Semiconductors) Southwest Microwave, Inc. Universal Switching Corporation Space Machine & Engineering Corp. University of Waterloo, (CIARS) SpaceK Labs, Inc. UTE Microwave Inc. Spectrum Elektrotechnik GmbH Vanteon Corporation SRTechnology Corp. Varioprint AG SSI Cable Corp. Vaunix Technology Corp. State Of The Art, Inc. Ventec International Group Statek Corp. VIDA Products, Inc.

79 SIX DAYS THREE CONFERENCES TWO FORUMS ONE EXHIBITION The 2020 IEEE MTT-S International Microwave Symposium A Big Thank You To Our Sponsors EUROPE’S PREMIER MICROWAVE, RF, WIRELESS AND RADAR EVENT

® The European Microwave Exhibition (12th - 14th January 2021) • 10,000 sqm of gross exhibition space • Around 5,000 attendees • 1,700 - 2,000 Conference delegates • In excess of 300 international exhibitors (including Asia and US as well as Europe)

INTERESTED IN EXHIBITING? For International Sales: Richard Vaughan, International Sales Manager E: [email protected] Tel: +44 20 7596 8742 or visit www.eumweek.com 80 SIX DAYS THREE CONFERENCES TWO FORUMS ONE EXHIBITION

EUROPE’S PREMIER MICROWAVE, RF, WIRELESS AND RADAR EVENT

The European Microwave Exhibition (12th - 14th January 2021) • 10,000 sqm of gross exhibition space • Around 5,000 attendees • 1,700 - 2,000 Conference delegates • In excess of 300 international exhibitors (including Asia and US as well as Europe)

INTERESTED IN EXHIBITING? For International Sales: Richard Vaughan, International Sales Manager E: [email protected] Tel: +44 20 7596 8742 or visit www.eumweek.com 3

2021

SAVE THE DATE FOR IMS2021 6-11 JUNE 2021