BTX) Interface

Balanced Technology Extended (BTX) Interface Specification Update Revision 1.1 July, 2018 Document Number: 600565 You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. 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All rights reserved. 2 Specification Update Contents 1 Introduction .................................................................................................... 6 1.1 Terminology ......................................................................................... 7 1.2 Reference Documents ............................................................................ 7 2 Form Factor Overview ....................................................................................... 8 3 Mechanical Requirements .................................................................................. 9 3.1 Motherboard Size and Mounting Hole Placement ........................................ 9 3.2 Volumetric Zones ................................................................................ 11 3.2.1 Motherboard Volumetric Zones ................................................. 12 3.2.2 Chassis Volumetric Zones ........................................................ 15 3.3 Chassis Mechanical Interfaces ............................................................... 17 3.3.1 Chassis Interface for EMC Grounding ......................................... 17 3.3.2 Chassis Interface to Support and Retention Module ..................... 17 3.3.3 Chassis Interface to Thermal Module ......................................... 20 3.3.4 Chassis Real Panel I/O Interface Requirements ........................... 21 3.4 Motherboard Mechanical Interfaces ........................................................ 22 3.4.1 Motherboard Real Panel Interface Requirements ......................... 22 4 Electrical Interface Requirements ..................................................................... 23 4.1 Motherboard Power Supply Connectors ................................................... 23 4.2 Motherboard Power and Control Signal Definitions .................................... 24 4.2.1 +5VSB .................................................................................. 24 4.2.2 PS_ON# ............................................................................... 24 4.2.3 PWR_OK ............................................................................... 24 4.2.4 Voltage Tolerances ................................................................. 26 5 Addition Information ...................................................................................... 27 Figures Figure 2-1. Example BTX Board and System Layouts ............................................. 8 Figure 3-1. BTX Form Factor Board and Mounting Hole Dimensions ....................... 10 Figure 3-2. Chassis and Motherboard Volumetric Zones (not all zones are shown) ... 11 Figure 3-3. Motherboard Primary Side Volumetric Zone ....................................... 13 Figure 3-4. Motherboard Secondary Side Volumetric Zones .................................. 14 Figure 3-5. Chassis Volumetric Zones ............................................................... 16 Figure 3-6. Chassis Interface to SRM Requirements ............................................ 18 Figure 3-7. Chassis Interface to SRM Requirement Details ................................... 19 Figure 3-8. Chassis to Thermal Module Interface and Relation to Chassis and Motherboard Zones .................................................................................. 20 Figure 3-9. Chassis Requirements for Thermal Module Interface Definition ............. 21 Figure 3-10. Chassis Rear Panel I/O Interface Requirements ................................ 21 Figure 3-11. Motherboard Rear Panel I/O Interface Requirements ......................... 22 Figure 4-1. Power Supply Connectors ................................................................ 23 Figure 4-2. Power Timing ................................................................................ 25 Specification Update 3 Tables Table 1-1. BTX Feature Summary ....................................................................... 6 Table 1-2.Specification Quick Reference .............................................................. 6 Table 1-3. Terminology ..................................................................................... 7 Table 1-4. Related Documents ........................................................................... 7 Table 3-1. Reference Datums ............................................................................. 9 Table 3-2. Board Size Options ............................................................................ 9 Table 3-3 Categories and Requirements for Motherboard Volumetric Zones ............ 12 Table 3-4. Categories and Requirements for Chassis Zones .................................. 15 Table 3-5. Chassis Mechanical Interface Requirements ........................................ 17 Table 4-1. Power Supply Connectors ................................................................. 23 Table 4-2. PS_ON# Signal Characteristics .......................................................... 24 Table 4-3. PWR_OK Signal Characteristics ......................................................... 25 Table 4-4 DC Output Voltage Tolerances ........................................................... 26 4 Specification Update Revision History Document Number Revision Number Description Revision Date • No change in the Content. Applied the latest Intel 600565 1.1 July 2018 Template and formatted the document. § § Specification Update 5 Introduction 1 Introduction The Balanced Technology Extended (BTX) interface specification was developed to provide standard interfaces and form factor definitions to address the electrical, thermal, and mechanical attributes of desktop computer systems. The specification is intended to allow for a wide variety of product differentiation that can be adapted to multiple applications and usage models. This specification describes the critical mechanical and electrical interfaces for the design of chassis, motherboard, power supply, and other system components necessary for hardware vendors and integrators to build and integrate compliant components, systems, and devices that are interoperable with each other. The intention of this document is not to provide all requirements necessary to design any one of these components, but instead to provide standard interfaces for the components to be designed around. The following table summarizes some of the key features enabled by the BTX specification. Table 1-1. BTX Feature Summary Features Benefits Low profile options Easy integration in small and thin form factor systems In-line core layout Optimized for efficient system cooling Scaleable board dimensions Multiple system sizes and configurations Structural board support Mechanical characteristics to support high-mass motherboard mechanisms components The following table details the interfaces defined in this specification and the section(s) that address each. Table 1-2.Specification Quick Reference Interfaces Features Defining Interface Related Sections(s) Board/Chassis Motherboard geometry and mounting hole Section 3.1 Interfaces locations (mechanical) Motherboard volumetric zones (mechanical) Section 3.2 Chassis volumetric zones (mechanical) Section 3.2.2 Rear panel chassis I/O locations and

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