Solder Alloy Directory Indalloy® Specialty Alloys Sorted by Temperature

Coefficient Temperature °C (°F) Density Electrical Thermal of Thermal Latent Specific Heat Elemental Conductivity Conductivity Expansion Tensile Shear Young’s Heat of ® Indalloy Composition (1.72µohms-cm) @ 85°C @ 20°C Strength Strength Modulus Elongation Brinell Fusion SOLID LIQUID Number Liquidus Solidus (% By Mass) lb/in3 gm/cm3 % of IACS W/cm-° C PPM/° C PSI PSI PSI x 10 6 % Hardness J/g J/g- ° C J/g- ° C Comments 61.0Ga/25.0In/ 46L 8 (46) 7 (44) 0.2348 6.50 Liquid metal used as a replacement for mercury 13.0Sn/1.0Zn 66.5Ga/20.5In/ 51E 11 (52) E 0.2283 6.32 13.0Sn 60 16 (60) E 75.5Ga/24.5In 0.2294 6.35 62.5Ga/21.5In/ 51 17 (63) 11 (51) 0.2348 6.50 16.0Sn 77 25 (77) 16 (60) 95.0Ga/5.0In 0.2222 6.15 14 30 (86) MP 100.0Ga 0.2133 5.90 42.9Bi/21.7Pb/ 15 43 (109) 38 (100) 18.3In/8.0Sn/ 0.3353 9.28 5.1Cd/4.0Hg 44.7Bi/22.6Pb/ 117 47 (117) E 19.1In/8.3Sn/ 0.3310 9.16 4.5 .15 25 5400 37.5 note 4 16.5 note1 36.8 0.163 0.197 See Table 1 5.3Cd 44.7Bi/22.6Pb/ 16 52 (126) 47 (117) 16.1In/11.3Sn/ 0.3310 9.16 5.3Cd 49.1Bi/20.9In/ 17 56 (133) 54 (129) 17.9Pb/11.6Sn/ 0.3255 9.01 0.5Cd 49.0Bi/21.0In/ Poor wettability but adequate for mechanical joining of metallic substrates when highly active flux is 136 58 (136) E 0.3255 9.01 2.43 .10 23 6300 20 note 4 16.5 note1 28.9 0.167 0.201 18.0Pb/12.0Sn used. See Table 1 51.0In/32.5Bi/ 19 60 (140) E 0.2847 7.88 3.3 .19 @ 40.1°C 22 4850 11 16.5Sn 61.7In/30.8Bi/ 18 62 (143) E 0.2898 8.02 7.5Cd 47.5Bi/25.4Pb/ 140 65 (149) 57 (135) 12.6Sn/9.5Cd/ 0.3422 9.47 3.5 .15 3725 77.5 note 4 14 note 1 36 0.159 0.188 5.0In 48.0Bi/25.6Pb/ 147 65 (149) 61 (142) 12.8Sn/9.6Cd/ 0.3432 9.50 See Table 1 4.0In 49.0Bi/18.0Pb/ 21 69 (156) 58 (136) 0.3252 9.00 18.0In/15.0Sn 50.0Bi/26.7Pb/ 158 70 (158) E 0.3461 9.58 4 .18 22 5990 300 120 note 4 14.5 note 1 39.8 0.146 0.184 Good fusible alloy used for lens blocking. See Table 1 13.3Sn/10.0Cd 162 72 (162) E 66.3In/33.7Bi 0.2887 7.99 50.5Bi/27.8Pb/ 22 73 (163) 70 (158) 0.3494 9.67 12.4Sn/9.3Cd 50.0Bi/25.0Pb/ 23 73 (163) 70 (158) 0.3468 9.60 3.1 4550 30 25 Non-electrical solder for low-ambient temperature 12.5Sn/12.5Cd 50.0Bi/25.0Pb/ 24 73 (163) 70 (158) 12.5Sn/12.5Cd 0.3465 9.59 Dopant: 0.05Ag 48.5Bi/41.5In/ 25 78 (172) E 0.3067 8.49 10.0Cd 50.0Bi/34.5Pb/ 26 78 (172) 70 (158) 0.3573 9.89 9.3Sn/6.2Cd 57.0Bi/26.0In/ 174 79 (174) E 0.3086 8.54 17.0Sn 54.0Bi/29.7In/ 27 81 (178) E 0.3060 8.47 16.3Sn 50.0Bi/39.0Pb/ 28 82 (180) 77 (171) 0.3660 10.13 8.0Cd/ 3.0Sn 50.3Bi/39.2Pb/ 29 85 (185) 81 (178) 8.0Cd/1.5In/ 0.3667 10.15 1.0Sn

E = eutetic Notes Conversions MP = melting point note 1: Brinell Hardness, 2mm ball, 4kg load Resistivity of IACS / elec. conductivity %IACS = resistivity of alloy note 2: Modified Brinell hardness, using 100-kg load, 1/2 min. ex: 1.72 x 100 / %IACS = micro ohm - cm note 3: Depends on specimen preparation note 4: % elongation on 5.65 (sq. root area) gauge length www.indium.com [email protected] Indalloy® Specialty Alloys (cont.) Sorted by Temperature

Coefficient Temperature °C (°F) Density Electrical Thermal of Thermal Latent Specific Heat Elemental Conductivity Conductivity Expansion Tensile Shear Young’s Heat of ® Indalloy Composition (1.72µohms-cm) @ 85°C @ 20°C Strength Strength Modulus Elongation Brinell Fusion SOLID LIQUID Number Liquidus Solidus (% By Mass) lb/in3 gm/cm3 % of IACS W/cm-° C PPM/° C PSI PSI PSI x 10 6 % Hardness J/g J/g- ° C J/g- ° C Comments 54.4Bi/43.6Pb/ 56 113 (235) 104 (219) 0.3750 10.38 1.0Sn/1.0Cd 50.0Bi/25.0Pb/ 44 115 (239) 95 (203) 0.3367 9.32 25.0Sn 53.0Bi/42.5Pb/ 58 117 (243) 103 (217) 0.3700 10.24 4.5Sn 38.2Bi/31.7Sn/ 26.4Pb/2.6Cd/ 59 118 (244) 75 (167) 0.3273 9.06 1.1Sb/Dopant: 0.06Cu Fair wettability on glass, quartz, and many ceramics. Good low temperature malleability. 1E 118 (244) E 52.0In/48.0Sn 0.2637 7.30 11.7 .34 20 1720 1630 83 4.5 note 2 Compensates for some CTE mismatch. Low vapor pressure 53.7Bi/43.1Pb/ 61 119 (246) 108 (226) 0.3721 10.30 3.2Sn 55.0Bi/44.0Pb/ 62 120 (248) 117 (243) 0.3754 10.39 1.0Sn 56.8Bi/41.2Pb/ 63 121 (250) 92 (198) 0.3743 10.36 2.0Cd 55.0Bi/44.0Pb/ 64 121 (250) 120 (248) 0.3754 10.39 1.0In 46.0Pb/30.7Bi/ 65 123 (253) 70 (158) 0.3519 9.74 46 18.2Sn/5.1Cd 253 123 (253) E 74.0In/26.0Cd 0.2753 7.62 255 124 (255) E 55.5Bi/44.5Pb 0.3772 10.44 4 .04 6400 37.5 15 20.9 0.126 0.155 Good fusible alloy. Poor solderability. See table 1 Fair wettability on glass, quartz, and many ceramics. Good low temperature malleability. 1 125 (257) 118 (244) 50.0In/50.0Sn 0.2637 7.30 11.7 .34 20 1720 1630 83 4.5 note 2 Compensates for some CTE mismatch. Low vapor pressure 70.0In/15.0Sn/ 13 125 (257) MP 0.2757 7.63 .39 27 1476 2000 4 9.6Pb/5.4Cd 67 126 (259) 124 (255) 58.0Bi/42.0Pb 0.3758 10.40 38.0Pb/37.0Bi/ 68 127 (261) 93 (199) 0.3425 9.48 25.0Sn 51.6Bi/37.4Sn/ 69 129 (264) 95 (203) 0.3100 8.58 6.0In/5.0Pb 40.0In/40.0Sn/ 70 130 (266) 121 (250) 0.2840 7.86 20.0Pb 71 131 (268) 118 (244) 52.0Sn/48.0In 0.2637 7.30 34.0Pb/34.0Sn 72 133 (271) 96 (205) 0.3306 9.15 32.0Bi 56.8Bi/41.2Sn/ 73 133 (271) 128 (262) 0.3107 8.60 2.0Pb 38.4Bi/30.8Pb/ 74 135 (275) 96 (205) 30.8Sn/ 0.3328 9.21 Dopant: 0.05Ag 57.4Bi/41.6Sn/ 75 135 (275) E 0.3100 8.58 1.0Pb 36.0Bi/32.0Pb/ 76 136 (277) 95 (203) 0.3331 9.22 31.0Sn/1.0Ag 36.7Bi/31.8Pb/ 31.5Sn/ 78 136 (277) 95 (203) 0.3324 9.20 Dopant: 0.25Cd and 0.05Ag 55.1Bi/39.9Sn/ 79 136 (277) 121 (250) 0.3132 8.67 5.0Pb 36.4Bi/31.8Pb/ 80 137 (279) 95 (203) 0.3320 9.19 31.8Sn 43.0Pb/28.5Bi/ 81 137 (279) 96 (205) 0.3407 9.43 28.5Sn Good low temperature solder for electronics assembly or where Cd and Pb are to be avoided. 281 138 (281) E 58.0Bi/42.0Sn 0.3093 8.56 4.5 .19 15 8000 500 55 note 4 23 note 1 44.8 0.167 0.201 Also good for thermo-electric applications. See Table 1

Coefficient Temperature °C (°F) Density Electrical Thermal of Thermal Latent Specific Heat Elemental Conductivity Conductivity Expansion Tensile Shear Young’s Heat of ® Indalloy Composition (1.72µohms-cm) @ 85°C @ 20°C Strength Strength Modulus Elongation Brinell Fusion SOLID LIQUID Number Liquidus Solidus (% By Mass) lb/in3 gm/cm3 % of IACS W/cm-° C PPM/° C PSI PSI PSI x 10 6 % Hardness J/g J/g- ° C J/g- ° C Comments 38.4Pb/30.8Bi/ 83 139 (282) 96 (205) 0.3360 9.30 30.8Sn 45.0Sn/32.0Pb/ 84 139 (282) 132 (270) 0.3118 8.63 18.0Cd/5.0Bi 57.0Bi/42.0Sn/ 282 140 (284) 139 (282) 0.3098 8.57 More malleable and ductile than #281 1.0Ag 33.4Bi/33.3Pb/ 85 143 (289) 96 (205) 0.3310 9.16 33.3Sn Has nearly the wettability, thermal conductivity, and low temperature malleability of indium. Solders 290 143 (290) E 97.0In/3.0Ag 0.2666 7.38 23 .73 22 800 2 silver, fired glass, and ceramics. Good for thermal interfaces requiring more creep resistance than pure indium 86 144 (291) E 60.0Bi/40.0Cd 0.3364 9.31 87 145 (293) 118 (244) 58.0Sn/42.0In 0.2637 7.30 51.2Sn/30.6Pb/ 181 145 (293) E 0.3053 8.45 .35 24 6263 18.2Cd 203 150 (302) 125 (257) 95.0In/5.0Bi 0.2675 7.40 88 150 (302) MP 99.3In/0.7Ga 0.2641 7.31 225 151 (304) 143 (289) 90.0In/10.0Sn 0.2641 7.31 42.0Pb/37.0Sn/ 89 152 (306) 120 (248) 0.3310 9.16 21.0Bi 54.0Sn/26.0Pb/ 230 152 (306) 140 (284) 20.0In Dopant: 0.2912 8.06 Also known as 532 0.12 - 0.16Cu 90 152 (306) MP 99.4In/0.6Ga 0.2641 7.31 91 153 (307) MP 99.6In/0.4Ga 0.2641 7.31 80.0In/15.0Pb/ 2 154 (309) 149 (300) 0.2836 7.85 13 .43 28 2550 2150 58 5.2 note 2 Especially useful for soldering to gold because it minimizes leaching. Good thermal fatigue properties 5.0Ag 92 154 (309) MP 99.5In/0.5Ga 0.2641 7.31 Soft, ductile metal which has good wettability on many surfaces, including glazed ceramics, certain metallic oxides, glass, and quartz. Deforms indefinitely under load and has no tendency to become 4 157 (314) MP 100.0In 0.2641 7.31 24 .86 29 273 890 1.57 22 to 41 0.9 28.47 0.243 brittle, making it valuable for cryogenic applications. Bonds to non-metallic. Volume change on freezing -2.5% 93 160 (320) 122 (252) 54.5Pb/45.5Bi 0.3826 10.59 50.0Sn/25.0Cd/ 94 160 (320) 145 (293) 0.3020 8.36 25.0Pb 48.0Sn/36.0Pb/ 95 162 (324) 140 (284) 0.3172 8.78 16.0Bi 43.0Sn/43.0Pb/ 97 163 (325) 144 (291) 0.3259 9.02 24 6400 3.56 41 Good general purpose step soldering alloy 14.0Bi 50.0Sn/40.0Pb/ 98 167 (333) 120 (248) 0.3169 8.77 10.0Bi 70.0Sn/18.0Pb/ 9 167 (333) 154 (309) 0.2815 7.79 12.2 .45 24 5320 4190 135.5 12 note 2 General purpose solder with good physical properties 12.0In 51.5Pb/27.0Sn/ 99 170 (338) 131 (268) 0.3461 9.58 21.5Bi 281-338 170 (338) 138 (280) 60.0Sn/40.0Bi 0.2934 8.12 5 .30 7500 35 23.5 note 1 44.4 0.18 0.213 See table 1 49.7Sn/41.8Pb/ 234 172 (342) 166 (331) 0.3187 8.82 8.0Bi/0.5Ag 50.0Pb/30.0Sn/ 101 173 (343) 130 (266) 0.3422 9.47 20.0Bi 46.0Sn/46.0Pb/ 240 173 (343) 160 (320) 0.3241 8.97 22 6000 5.28 48 8.0Bi 204 175 (347) 165 (329) 70.0In/30.0Pb 0.2959 8.19 8.8 .38 28 3450 Minimizes gold leaching characteristics. Good thermal fatigue properties 47.5Pb/39.9Sn/ 102 176 (349) 146 (295) 0.3299 9.13 12.6Bi

103 177 (351) E 67.8Sn/32.2Cd 0.2775 7.68 62.5Sn/36.1Pb/ Widely used electronic solder. Good for silver metallization. Has improved strength and 104 179 (354) E 0.3039 8.41 11.9 .50 27 7000 7540 0.167 1.4Ag fatigue properties 60.0Sn/25.5Bi/ 105 180 (356) 96 (205) 0.2981 8.25 14.5Pb 37.5Pb/37.5Sn/ 5 181 (358) 134 (273) 0.3042 8.42 7.8 .23 23 5260 4300 101 10.2 note 2 Very good resistance to alkaline corrosion 25.0In 205 181 (358) 173 (343) 60.0In/40.0Pb 0.3078 8.52 7 .29 27 4150 Minimizes gold leaching characteristics. Good thermal fatigue properties 62.6Sn/37.0Pb/ 100 182 (361) 178 (352) 0.3035 8.40 0.4Ag Most widely used SnPb electronic solder. Not recommended for soldering to gold thicker than 106 183 (361) E 63.0Sn/37.0Pb 0.3035 8.40 11.5 .50 25 7500 6200 4.35 37 17 0.167 0.5 microns (20 micro inches) 213 183 (362) 183 (361) 62.0Sn/38.0Pb 0.3046 8.43 4.35 107 184 (363) 183 (361) 65.0Sn/35.0Pb 0.3010 8.33 86.5Sn/5.5Zn/ 231 186 (367) 174 (345) 0.2659 7.36 Zinc causes high dross 4.5In/3.5Bi 108 186 (367) 183 (361) 70.0Sn/30.0Pb 0.2948 8.16 12.5 22 7800 5200 5.08 30 17 Good pre-tinning alloy Can be used as a lead-free replacement for Sn63, Sn62, Sn60. Has a similar melting point and equal 77.2Sn/20.0In/ 227 175 (347) 0.2619 7.25 9.8 .54 28 6800 4800 5.6 47 17 or superior physical and mechanical properties. Not for use over 100°C due to Sn/In eutectic. U.S. 2.8Ag Patent #5,256,370; covers 70-92%4Sn 1-6%Ag 4-35%In; temp. range: Liq.. 179-213°C, Sol. 167-212°C 83.6Sn/8.8In/ Zinc causes high dross U.S. Patent #5,242,658; covers 72.8-89.4Sn 6.7 19.2Zn 2.7-16.4In; 226 187 (369) 181 (358) 0.2627 7.27 6600 4 85.5 7.6Zn temp. range: Liq.. 176-193, Sol. 166-191.4 61.5Sn/35.5Pb/ 137 189 (372) 179 (354) 0.3046 8.43 3.0Ag 109 191 (376) 183 (361) 60.0Sn/40.0Pb 0.3071 8.50 11.5 .49 25 7600 5600 4.35 40 16 Good electrical grade solder 110 192 (378) 183 (361) 75.0Sn/25.0Pb 0.2890 8.00 58.0In/39.0Pb/ 235 195 (383) 165 (329) 0.3104 8.59 3.0Ag 55.5Pb/40.5Sn/ 111 197 (387) 170 (338) 0.3328 9.21 4.0Bi 112 199 (390) 183 (361) 80.0Sn/20.0Pb 0.2836 7.85 201 199 (390) E 91.0Sn/9.0Zn 0.2627 7.27 15 .61 7940 32.5 21.5 note 1 71.2 0.239 0.272 Recommended for soldering to aluminum using flux #3 113 200 (392) 183 (361) 55.0Sn/45.0Pb 0.3136 8.68 114 205 (401) 183 (361) 85.0Sn/15.0Pb 0.2782 7.70 86.9Sn/10.0In/ Lead-free U.S. patent #5,256,370; covers 70-92%4Sn 1-6%Ag 254 205 (401) 204 (399) 0.2663 7.37 3.1Ag 4-35%In; temp. range Liq. 179-213°C, Sol. 167-212°C 55.0Pb/44.0Sn/ 115 210 (410) 177 (351) 0.3291 9.11 1.0Ag Minimizes gold leaching characteristics. Good thermal fatigue properties. Very good resistance 7 210 (410) 184 (363) 50.0In/50.0Pb 0.3201 8.86 6 .22 27 4670 2680 55 9.6 note 2 to alkaline corrosion 116 212 (414) 183 (361) 50.0Sn/50.0Pb 0.3205 8.87 10.9 .48 23 6000 5200 35 14 General purpose solder 118 213 (415) 183 (361) 90.0Sn/10.0Pb 0.2728 7.55 91.8Sn/4.8Bi/ 249 213 (415) 211 (412) 0.2688 7.44 3.4Ag 50.0Sn/49.5Pb/ 119 216 (421) 183 (361) 0.3198 8.85 0.5Sb 238 217 (423) E 90.0Sn/10.0Au 0.2811 7.78 7280 1.1 120 218 (424) 183 (361) 52.0Pb/48.0Sn 0.3234 8.95 95.5Sn/3.8Ag/ 241 220 (428) 217 (423) 0.2674 7.40 13.2 6962 3916 36.5 15 Lead-free alloy, no patent 0.7Cu 95.5Sn/3.9Ag/ 252 220 (428) 217 (423) 0.2674 7.40 Lead-free alloy, no patent. Alloy of choice for general SMT assembly. See Indalloy 256 0.6Cu

Coefficient Temperature °C (°F) Density Electrical Thermal of Thermal Latent Specific Heat Elemental Conductivity Conductivity Expansion Tensile Shear Young’s Heat of ® Indalloy Composition (1.72µohms-cm) @ 85°C @ 20°C Strength Strength Modulus Elongation Brinell Fusion SOLID LIQUID Number Liquidus Solidus (% By Mass) lb/in3 gm/cm3 % of IACS W/cm-° C PPM/° C PSI PSI PSI x 10 6 % Hardness J/g J/g- ° C J/g- ° C Comments 96.5Sn/3.0Ag/ 256 220 (428) 217 (423) 0.2674 7.40 7200 2.41 19.3 Lead-free alloy, no patent. Preferred alloy to recommend 0.5Cu Lead-free high temperature solder. Excellent thermal fatigue properties. Not recommended for 121 221 (430) E 96.5Sn/3.5Ag 0.2710 7.50 16 .33 30 5800 2700 73 40 soldering to gold thicker than 0.5microns (20 micro inches) 122 222 (432) 183 (361) 95.0Sn/5.0Pb 0.2681 7.42 95.5Sn/4.0Ag/ 246 225 (437) 217 (423) 0.2674 7.40 7470 2.6 17.3 Lead-free alloy, no patent. See Indalloy 256 0.5Cu 96.2Sn/2.5Ag/ 251 225 (437) 217 (423) 0.2663 7.37 Castin patented alloy 0.8Cu/0.5Sb 98.5Sn/1.0Ag/ 260 226 (439) 217 (423) 0.5 Cu Dopant: 0.2645 7.32 5625 2.11 15.7 0.05Mn 123 226 (439) 221 (430) 97.5Sn/2.5Ag 0.2652 7.34 48.0Bi/28.5Pb/ 217-440 227 (441) 103 (217) 0.3360 9.30 3 13000 19 0.167 See Table 1 14.5Sn/9.0Sb 125 227 (441) 183 (361) 55.0Pb/45.0Sn 0.3277 9.07 98.5Sn/1.0Ag/ 258 227 (441) 215 (419) 0.2645 7.32 5640 2.15 13.4 0.5Cu 99.0Sn/0.3Ag/ 263 227 (441) 217 (423) 0.2641 7.31 0.7Cu 243 227 (441) E 99.0Sn/1.0Cu 0.2641 7.31 Lead-free alloy, no patent 244 227 (441) E 99.3Sn/0.7Cu 0.2641 7.31 Lead-free alloy, no patent 262 99.5Sn/0.5Cu 227 (441) E 0.2645 7.32 (Cobalt 995) Dopant 0.05Co 58.0Pb/40.0Sn/ 126 231 (448) 185 (365) 0.3313 9.17 2.0Sb 206 231 (448) 197 (387) 60.0Pb/40.0In 0.3360 9.30 5.2 .19 26 5000 Minimizes gold leaching characteristics. Good thermal fatigue properties 60.0Pb/37.0Sn/ 127 232 (450) 179 (354) 0.3393 9.39 3.0Ag 128 232 (450) MP 100.0Sn 0.2630 7.28 15.6 .73 24 1900 6.1 0.222 65.0Sn/25.0Ag/ 209 233 (451) MP 0.2818 7.80 36 17000 10.0Sb 129 235 (455) MP 99.0Sn/1.0Sb 0.2627 7.27 Has nearly the wettability and low temperature malleability of indium. Solders silver, fired glass, 3 237 (459) 143 (289) 90.0In/10.0Ag 0.2724 7.54 22.1 .67 15 1650 1600 61 2.7 note 2 and ceramics. Large plastic range 130 238 (460) 183 (361) 60.0Pb/40.0Sn 0.3353 9.28 10.1 .44 25 5400 4600 3.34 25 12 Inexpensive utility solder 131 238 (460) 232 (450) 97.0Sn/3.0Sb 0.2623 7.26 1400 132 240 (464) 221 (430) 95.0Sn/5.0Ag 0.2670 7.39 12.6 23 8000 3540 30 13.7 0.23 High temperature electrical solder Lead-free, used in food equipment, potable water systems, and refrigeration tubing. Good wettability 133 240 (464) 235 (455) 97.0Sn/5.0Sb 0.2619 7.25 11.9 .28 31 5900 6000 38 13.3 and creep resistance 63.2Pb/35.0Sn/ 134 243 (469) 185 (365) 0.3393 9.39 1.8Sb 135 247 (477) 183 (361) 65.0Pb/35.0Sn 0.3432 9.50 83.0Pb/10.0Sb/ 236 247 (477) 237 (459) 0.3739 10.35 5.0Sn/2.0Ag 68.4Pb/30.0Sn/ 138 250 (482) 185 (365) 0.3479 9.63 1.6Sb 139 251 (484) 134 (273) 95.0Bi/5.0Sn 0.3483 9.64 70.0Pb/27.0Sn/ 210 253 (487) 179 (354) 0.3555 9.84 3.0Ag 85.0Pb/10.0Sb/ 233 255 (491) 245 (473) 0.3743 10.36 6 5570 3.5 0.9 0.15 5.0Sn 141 257 (495) 183 (361) 70.0Pb/30.0Sn 0.3512 9.72 9.3 .41 26 5000 4000 3.05 18 12

Coefficient Temperature °C (°F) Density Electrical Thermal of Thermal Latent Specific Heat Elemental Conductivity Conductivity Expansion Tensile Shear Young’s Heat of ® Indalloy Composition (1.72µohms-cm) @ 85°C @ 20°C Strength Strength Modulus Elongation Brinell Fusion SOLID LIQUID Number Liquidus Solidus (% By Mass) lb/in3 gm/cm3 % of IACS W/cm-° C PPM/° C PSI PSI PSI x 10 6 % Hardness J/g J/g- ° C J/g- ° C Comments 50.0Sn/47.0Pb/ 142 260 (500) 179 (354) 0.3201 8.86 3.0Ag Minimizes gold leaching characteristics. Good thermal fatigue properties. Very good resistance 10 260 (500) 240 (464) 75.0Pb/25.0In 0.3602 9.97 4.6 .18 26 5450 3520 47.5 10.2 note 2 to alkaline corrosion 143 260 (500) 252 (486) 90.0Pb/10.0Sb 0.3830 10.60 73.7Pb/25.0Sn/ 144 263 (505) 184 (363) 0.3570 9.88 1.3Sb 202 266 (511) E 82.6Cd/17.4Zn 0.3017 8.35 Limited production 145 268 (514) 183 (361) 75.0Pb/25.0Sn 0.3599 9.96 3426 53 79.0Pb/20.0In/ 146 270 (518) 184 (363) 0.3671 10.16 1.0Sb 148 271 (520) MP 100.0Bi 0.3541 9.80 259 272 (522) 250 (482) 90.0Sn/10.0Sb 0.2616 7.24 10.7 .49 6103 2336 42.7 Minimizes gold leaching characteristics. Good thermal fatigue properties. Very good resistance 150 275 (527) 260 (500) 81.0Pb/19.0In 0.3711 10.27 4.5 .17 27 5550 to alkaline corrosion 149 280 (536) 183 (361) 80.0Pb/20.0Sn 0.3689 10.21 8.7 .37 27 4800 3000 2.9 20 11 Very strong solder with excellent thermal fatigue resistance. Excellent solder to use when soldering 182 280 (536) E 80.0Au/20.0Sn 0.5242 14.51 .57 16 40000 40000 8.57 2 0.15 to gold. High thermal conductivity 92.0Pb/5.0Sn/ 152 285 (545) 239 (462) 0.3909 10.82 3.0Sb 153 288 (550) 183 (361) 85.0Pb/15.0Sn 0.3866 10.70 4700 4470 57.0Pb/40.0Sn/ 154 289 (552) 179 (354) 0.3346 9.26 3.0Ag 88.0Pb/10.0Sn/ 228 290 (554) 267 (513) 0.3884 10.75 8.5 .27 29 3260 42 0.143 (Sn10) Not recommended for applications above 120°C, due to formation of eutectic 2.0Ag 90.0Pb/5.0Ag/ 155 292 (558) MP 0.3974 11.00 .25 27 5.0Sn 156 295 (563) 221 (430) 90.0Sn/10.0Ag 0.2713 7.51 157 295 (563) 252 (486) 95.0Pb/5.0Sb 0.3960 10.96 92.5Pb/5.0Sn/ 151 296 (565) 287 (549) 0.3982 11.02 8.6 29 4210 2240 2 0.13 2.5Ag 160 300 (572) 227 (441) 97.0Sn/3.0Cu 0.2645 7.32 159 302 (576) 275 (527) 90.0Pb/10.0Sn 0.3884 10.75 8.9 .25 29 4400 2400 2.76 30 10 242 302 (576) 275 (527) 89.5Pb/10.5Sn 0.3884 10.75 8.9 .25 29 4400 2400 2.76 30 10 161 303 (577) E 97.5Pb/2.5Ag 0.4094 11.33 8.6 4400 2900 42 Torch solder, poor corrosion resistance 95.5Pb/2.5Ag/ 163 304 (579) 299 (570) 0.4047 11.20 2.0Sn 93.0Pb/3.0Sn/ 237 304 (579) MP 0.4000 11.07 2.0In/2.0Ag 97.5Pb/1.5Ag/ High temperature solder, frequently used in semiconductor assembly. Often used in reducing 165 309 (588) E 0.4075 11.28 6 .23 30 4420 23 9.5 1.0Sn atmospheres such as 12% hydrogen. Slightly better corrosion resistance than #101 90.0Pb/5.0In/ 12 310 (590) 290 (554) 0.3974 11.00 5.6 .25 27 5730 3180 23 9 note 2 Tin-free indium solder 5.0Ag 92.5Pb/5.0In/ Good thermal fatigue. Minimal gold leaching properties of indium-lead alloys. Often used in reducing 164 310 (590) 300 (572) 0.3982 11.02 5.5 .25 25 4560 2830 2.5Ag atmospheres such as 12% hydrogen 171 312 (594) 308 (586) 95.0Pb/5.0Sn 0.3996 11.06 8.8 .23 30 4000 2100 45 8 note 2 High temperature SnPb alloy 11 313 (595) 300 (572) 95.0Pb/5.0In 0.3996 11.06 5.1 .21 29 4330 3220 52 6 note 2 91.0Pb/4.0Sn/ 239 313 (595) E 0.3992 11.05 4.0Ag/1.0In 98.0Pb/1.2Sb/ 167 315 (599) MP 0.4047 11.20 0.8Ga 168 320 (608) 300 (572) 98.0Pb/2.0Sb 0.4043 11.19

169 322 (612) 310 (590) 98.5Pb/1.5Sb 0.4057 11.23 170 327 (621) MP 100.0Pb 0.4101 11.35 7.9 .35 29 1800 1800 2.61 55 4 172 330 (626) 231 (448) 98.0Sn/2.0As 0.2616 7.24 173 345 (653) 232 (450) 99.0Sn/1.0Ge 0.2623 7.26 183 356 (673) E 88.0Au/12.0Ge 0.5300 14.67 .44 13 26835 26825 10.55 89.0Bi/11.0Ag 261 360 (680) 262 (504) 0.3559 9.85 .09 8000 5.4 Dopant: 0.05 Ge 184 363 (685) E 96.8Au/3.2Si 0.5564 15.40 .27 12 36975 31900 12.04 175 364 (687) 305 (581) 95.0Pb/5.0Ag 0.4083 11.30 229 365 (689) 304 (579) 94.5Pb/5.5Ag 0.4101 11.35 6 .23 30 4420 176 382 (720) E 95.0Zn/5.0Al 0.2385 6.60 185 395 (743) 340 (644) 95.0Cd/5.0Ag 0.3154 8.73 186 424 (795) E 55.0Ge/45.0Al 0.1340 3.71 177 465 (869) 451 (844) 75.0Au/25.0In 0.4950 13.70 Extremely hard, high temperature alloy. Limited production 178 485 (905) 451 (844) 82.0Au/18.0In 0.5383 14.90 Extremely hard, high temperature alloy. Limited production 45.0Ag/38.0Au/ 187 525 (977) E 0.3823 10.58 17.0Ge 188 577 (1071) E 88.3Al/11.7Si 0.0961 2.66 86.0Al/10.0Si/ 189 585 (1085) 521 (970) 0.0994 2.75 4.0Cu 190 610 (1130) 577 (1071) 92.5Al/7.5Si 0.0968 2.68 45.0Ag/24.0Cd/ 215 620 (1148) 605 (1121) 0.3291 9.11 16.0Zn/15.0Cu 191 630 (1166) 577 (1071) 95.0Al/5.0Si 0.0972 2.69 50.0Ag/18.0Cd/ 216 635 (1175) 625 (1157) 0.3320 9.19 16.5Zn/15.5Cu 56.0Ag/22.0Cu/ 217 650 (1202) 620 (1148) 0.3328 9.21 17.0Zn/5.0Sn 192 660 (1220) MP 100.0Al 0.0976 2.70 50.0Ag/16.0Cd/ 218 690 (1274) 630 (1166) 15.5Cu/15.5Zn/ 0.3328 9.21 3.0Ni 35.0Ag/26.0Cu 219 700 (1292) 605 (1121) 0.3208 8.88 21.0Zn/18.0Cd 61.0Ag/24.0Cu/ 179 705 (1301) 603 (1117) 0.3425 9.48 15.0In 80.0Cu/15.0Ag/ 211 705 (1301) 640 (1184) 0.2753 7.62 5.0P 30.0Ag/27.0Cu/ 212 710 (1310) 605 (1121) 0.3169 8.77 23.0Zn/20.0Cd 60.0Ag/30.0Cu/ 214 720 (1328) 600 (1112) 0.3461 9.58 10.0Sn 193 780 (1436) E 72.0Ag/28.0Cu 0.3617 10.01 71.5Ag/28.0Cu/ 220 785 (1445) 775 (1427) 0.3617 10.01 0.5Ni 194 800 (1472) 370 (698) 98.0Au/2.0Si 0.6113 16.92 63.0Ag/28.5Cu/ 221 800 (1472) 690 (1274) 0.3508 9.71 6.0Sn/2.5Ni 195 890 (1634) E 80.0Au/20.0Cu 0.5662 15.67

Table 1 Certain alloys will grow or shrink after casting. This chart shows the cumulative effects over time. Cumulative Growth and Shrinkage Time after casting Indalloy #117 Indalloy #136 Indalloy #147 Indalloy #158 Indalloy #160-190 Indalloy #217-440 Indalloy #255 Indalloy #281 Indalloy #281-338 2 min +0.0005 +0.0003 +0.0020 +0.0025 -0.0004 +0.0008 -0.0008 +0.0007 -0.0001 6 min +0.0002 +0.0002 +0.0022 +0.0027 -0.0007 +0.0014 -0.0011 +0.0007 -0.0001 30 min 0.0000 +0.0001 +0.0040 +0.0045 -0.0009 +0.0047 -0.0010 +0.0006 -0.0001 1 hour -0.0001 0.0000 +0.0046 +0.0051 0.0000 +0.0048 -0.0008 +0.0006 -0.0001 2 hour -0.0002 -0.0001 +0.0046 +0.0051 +0.0016 +0.0048 -0.0004 +0.0006 -0.0001 5 hour -0.0002 -0.0002 +0.0046 +0.0051 +0.0018 +0.0049 0.0000 +0.0005 -0.0001 500 hour -0.0002 -0.0002 +0.0052 +0.0057 +0.0025 +0.0061 +0.0022 +0.0005 -0.0001

Measurements are in inches per minute as compared to cold mold dimensions. Test bar measures ½" x 10" weighing approximately one pound. All data represents predictable characteristics and can be relied on only as a guide.

Coefficient Temperature °C (°F) Density Electrical Thermal of Thermal Latent Specific Heat Elemental Conductivity Conductivity Expansion Yield Tensile Shear Young’s Wetting Heat of ® Indalloy Composition (1.72µohms-cm) @ 85°C @ 20°C Strength Strength Strength Modulus Creep Elongation Brinell Angle Fusion SOLID LIQUID Number Liquidus Solidus (% By Mass) lb/in3 gm/cm3 % of IACS W/cm-° C PPM/° C M Pa PSI PSI PSI x 10 6 N/mm2 % Hardness ° J/g J/g- ° C J/g- ° C 61.0Ga/25.0In/ 46L 8 (46) 7 (44) 0.2348 6.50 13.0Sn/1.0Zn 66.5Ga/20.5In/ 51E 11 (52) E 0.2283 6.32 13.0Sn 60 16 (60) E 75.5Ga/24.5In 0.2294 6.35 62.5Ga/21.5In/ 51 17 (63) 11 (51) 0.2348 6.50 16.0Sn 77 25 (77) 16 (60) 95.0Ga/5.0In 0.2222 6.15 14 30 (86) MP 100.0Ga 0.2133 5.90 51.0In/32.5Bi/ 19 60 (140) E 0.2847 7.88 3.3 .19 @ 40.1°C 22 4850 11 16.5Sn 162 72 (162) E 66.3In/33.7Bi 0.2887 7.99 57.0Bi/26.0In/ 174 79 (174) E 0.3086 8.54 17.0Sn 54.0Bi/29.7In/ 27 81 (178) E 0.3060 8.47 16.3Sn 52.2In/46.0Sn/ 224 108 (226) E 0.2627 7.27 1.8Zn 53 109 (228) E 67.0Bi/33.0In 0.3183 8.81 1E 118 (244) E 52.0In/48.0Sn 0.2637 7.30 11.7 .34 20 1720 1630 83 4.5 note 2 1 125 (257) 118 (244) 50.0In/50.0Sn 0.2637 7.30 11.7 .34 20 1720 1630 83 4.5 note 2 71 131 (268) 118 (244) 52.0Sn/48.0In 0.2637 7.30 281 138 (281) E 58.0Bi/42.0Sn 0.3093 8.56 4.5 .19 15 8000 500 55 note 4 23 note 1 44.8 0.167 0.201 57.0Bi/42.0Sn/ 282 140 (284) 139 (282) 0.3098 8.57 1.0Ag 290 143 (290) E 97.0In/3.0Ag 0.2666 7.38 23 .73 22 800 2 87 145 (293) 118 (244) 58.0Sn/42.0In 0.2637 7.30 203 150 (302) 125 (257) 95.0In/5.0Bi 0.2675 7.40 88 150 (302) MP 99.3In/0.7Ga 0.2641 7.31 225 151 (304) 143 (289) 90.0In/10.0Sn 0.2641 7.31 90 152 (306) MP 99.4In/0.6Ga 0.2641 7.31 91 153 (307) MP 99.6In/0.4Ga 0.2641 7.31 92 154 (309) MP 99.5In/0.5Ga 0.2641 7.31 4 157 (314) MP 100.0In 0.2641 7.31 24 .86 29 273 890 1.57 22 to 41 0.9 28.47 0.243 281-338 170 (338) 138 (280) 60.0Sn/40.0Bi 0.2934 8.12 5 .30 7500 35 23.5 note 1 44.4 0.18 0.213 86.5Sn/5.5Zn/ 231 186 (367) 174 (345) 0.2659 7.36 4.5In/3.5Bi 77.2Sn/20.0In/ 227 187 (369) 175 (347) 0.2619 7.25 9.8 .54 28 6800 4800 5.6 47 17 2.8Ag 83.6Sn/8.8In/ 226 187 (369) 181 (358) 0.2627 7.27 6600 4 85.5 7.6Zn 201 199 (390) E 91.0Sn/9.0Zn 0.2627 7.27 15 .61 7940 32.5 21.5 note 1 71.2 0.239 0.272 86.9Sn/10.0In/ 254 205 (401) 204 (399) 0.2663 7.37 3.1Ag 91.8Sn/4.8Bi/ 249 213 (415) 211 (412) 0.2688 7.44 3.4Ag 238 217 (423) E 90.0Sn/10.0Au 0.2811 7.78 7280 1.1

E = eutetic Notes Conversions MP = melting point note 1: Brinell Hardness, 2mm ball, 4kg load Resistivity of IACS / Elec. conductivity %IACS = Resistivity of alloy note 2: Modified Brinell hardness, using 100-kg load, 1/2 min. ex: 1.72 x 100 / %IACS = micro ohm - cm note 3: Depends on specimen preparation. note 4: % elongation on 5.65 (sq. root Area) gauge length note 5: J. Zhao, Y. Miyashita and S.L. Mannan; J. Electr. Mater., Vol. 31, 8 (2002) p. 879 note 6: Results @ 20°C, Multicore Ecosol (MSL Ref. 733 9/99) note 7: Mario F. Arenas, Viola L. Acoff www.indium.com [email protected] Indalloy® Specialty Alloys (cont.) Pb-Free and Cd-Free Alloys

Coefficient Temperature °C (°F) Density Electrical Thermal of Thermal Latent Specific Heat Elemental Conductivity Conductivity Expansion Yield Tensile Shear Young’s Wetting Heat of ® Indalloy Composition (1.72µohms-cm) @ 85°C @ 20°C Strength Strength Strength Modulus Creep Elongation Brinell Angle Fusion SOLID LIQUID Number Liquidus Solidus (% By Mass) lb/in3 gm/cm3 % of IACS W/cm-° C PPM/° C M Pa PSI PSI PSI x 10 6 N/mm2 % Hardness ° J/g J/g- ° C J/g- ° C 95.5Sn/3.8Ag/ 241 220 (428) 217 (423) 0.2674 7.40 13.2 6962 3916 13 (note 6) 36.5 15 42 (note 7) 0.7Cu 95.5Sn/3.9Ag/ 252 220 (428) 217 (423) 0.2674 7.40 0.6Cu 96.5Sn/3.0Ag/ 256 220 (428) 217 (423) 0.2674 7.40 25.3 (note 5) 7200 2.41 19.3 0.5Cu 121 221 (430) E 96.5Sn/3.5Ag 0.2710 7.50 16 .33 30 5800 2700 73 40 96.2Sn/2.5Ag/ 251 225 (437) 217 (423) 0.2663 7.37 0.8Cu/0.5Sb 95.5Sn/4.0Ag/ 246 225 (437) 217 (423) 0.2674 7.40 7470 2.6 17.3 0.5Cu 98.5Sn/1.0Ag/ 260 226 (439) 217 (423) 0.5Cu Dopant: 0.2645 7.32 5625.0 2.11 15.7 0.05Mn 123 226 (439) 221 (430) 97.5Sn/2.5Ag 0.2652 7.34 98.5Sn/1.0Ag/ 258 227 (441) 215 (419) 0.2645 7.32 5640 2.15 13.4 0.5Cu 99.0Sn/0.3Ag/ 263 227 (441) 217 (423) 0.2641 7.31 0.7Cu 243 227 (441) E 99.0Sn/1.0Cu 0.2641 7.31 244 227 (441) E 99.3Sn/0.7Cu 0.2641 7.31 262 99.5Sn/0.5Cu/ 227 (441) E 0.2645 7.32 (Cobalt 995) Dopant 0.05Co 128 232 (450) MP 100.0Sn 0.2630 7.28 15.6 .73 24 1900 6.1 0.222 65.0Sn/25.0Ag/ 209 233 (451) MP 0.2818 7.80 36 17000 10.0Sb 129 235 (455) MP 99.0Sn/1.0Sb 0.2627 7.27 3 237 (459) 143 (289) 90.0In/10.0Ag 0.2724 7.54 22.1 .67 15 1650 1600 61 2.7 note 2 131 238 (460) 232 (450) 97.0Sn/3.0Sb 0.2623 7.26 1400 132 240 (464) 221 (430) 95.0Sn/5.0Ag 0.2670 7.39 12.6 23 8000 3540 30 13.7 0.23 133 240 (464) 235 (455) 95.0Sn/5.0Sb 0.2619 7.25 11.9 .28 31 5900 6000 38 13.3 139 251 (484) 134 (273) 95.0Bi/5.0Sn 0.3483 9.64 148 271 (520) MP 100.0Bi 0.3541 9.80 259 272 (522) 250 (482) 90.0Sn/10.0Sb 0.2616 7.24 10.7 .49 6103 2336 42.7 182 280 (536) E 80.0Au/20.0Sn 0.5242 14.51 .57 16 40000 40000 8.57 2 0.15 156 295 (563) 221 (430) 90.0Sn/10.0Ag 0.2713 7.51 160 300 (572) 227 (441) 97.0Sn/3.0Cu 0.2645 7.32 172 330 (626) 231 (448) 98.0Sn/2.0As 0.2616 7.24 173 345 (653) 232 (450) 99.0Sn/1.0Ge 0.2623 7.26 183 356 (673) E 88.0Au/12.0Ge 0.5300 14.67 .44 13 26835 26825 10.55 89.0Bi/11.0Ag 261 360 (680) 262 (504) 0.3559 9.85 .09 8000 5.4 2 Dopant: 0.05Ge 184 363 (685) E 96.8Au/3.2Si 0.5564 15.40 .27 12 36975 31900 12.04 176 382 (720) E 95.0Zn/5.0Al 0.2385 6.60 186 424 (795) E 55.0Ge/45.0Al 0.1340 3.71 177 465 (869) 451 (844) 75.0Au/25.0In 0.4950 13.70

178 485 (905) 451 (844) 82.0Au/18.0In 0.5383 14.90 45.0Ag/38.0Au/ 187 525 (977) E 0.3823 10.58 17.0Ge 188 577 (1071) E 88.3Al/11.7Si 0.0961 2.66 86.0Al/10.0Si/ 189 585 (1085) 521 (970) 0.0994 2.75 4.0Cu 190 610 (1130) 577 (1071) 92.5Al/7.5Si 0.0968 2.68 191 630 (1166) 577 (1071) 95.0Al/5.0Si 0.0972 2.69 56.0Ag/22.0Cu/ 217 650 (1202) 620 (1148) 0.3328 9.21 17.0Zn/5.0Sn 192 660 (1220) MP 100.0Al 0.0976 2.70 61.0Ag/24.0Cu/ 179 705 (1301) 603 (1117) 0.3425 9.48 15.0In 80.0Cu/15.0Ag/ 211 705 (1301) 640 (1184) 0.2753 7.62 5.0P 60.0Ag/30.0Cu/ 214 720 (1328) 600 (1112) 0.3461 9.58 10.0Sn 193 780 (1436) E 72.0Ag/28.0Cu 0.3617 10.01 71.5Ag/28.0Cu/ 220 785 (1445) 775 (1427) 0.3617 10.01 0.5Ni 194 800 (1472) 370 (698) 98.0Au/2.0Si 0.6113 16.92 63.0Ag/28.5Cu/ 221 800 (1472) 690 (1274) 0.3508 9.71 6.0Sn/2.5Ni 195 890 (1634) E 80.0Au/20.0Cu 0.5662 15.67 196 950 (1742) E 82.0Au/18.0Ni 0.5752 15.92 207 961 (1762) MP 100.0Ag 0.3794 10.50 85.0Cu/8.0Sn/ 208 985 (1805) 665 (1229) 0.3205 8.87 7.0Ag 198 1020 (1868) 1000 (1832) 50.0Au/50.0Ag 0.4914 13.60 222 1030 (1886) 1025 (1877) 99.0Au/1.0Ga 0.6818 18.87 199 1030 (1886) 360 (680) 99.4Au/0.6Sb 0.6894 19.08 223 1063 (1945) MP 99.8Au/0.2P 0.6843 18.94 200 1064 (1948) MP 100.0Au 0.6973 19.30 73.4 3.18 14 20000 11.2 39 to 45(2in) 0.13

Aluminum Antimony Bismuth Cadmium Offers good corrosion Increases tensile strength Low melting when alloyed Increases corrosion resistance resistance and good strength of solders. Poor conductor with Sn/Pb or In. Expands 3.32% of solders. Increases when alloyed with Zn or Si. of heat and electricity. on solidification. Non-toxic. service temperature and strength of solder.

Gallium Germanium Gold Indium Has one of the longest When alloyed with Au or Al Highly conductive and Improves wetting of liquid ranges for metals. will reduce MP and increase corrosion resistant. High Pb/Ag solders. Resists Has low vapor pressure. strength. Contributes to melting point is reduced when alkaline corrosion. Bonds glass, poor solder wettability. alloyed with Sn, Si, or Ge. quartz, and glazed ceramics.

Lead Silicon Silver Tin Exhibits the highest Excellent wetting Eonomical material, soft and When used with Au or Al will electrical and thermal characteristics. Low strength ductile. Offers increased reduce MP, increase strength conductivity of all metals. alone but when alloyed strength when alloyed with and improve wettability. becomes stronger. other elements. Toxic.

Group Key 1A 1 8A 18 Atomic Number 49 In Symbol Alkali metals Halogens 1 Alkaline earth metals 2 H 114.818 Noble gases He 1.00794 Name Indium Relative 4.00260 Atomic Mass Transition metals Lanthanides 1 Hydrogen 2A 2 3A 13 4A 14 5A 15 6A 16 7A 17 Helium Other metals Actinides 3 Li 4 Be 5 B 6 C 7 N 8 O 9 F 10 Ne Other non-metals 6.941 9.01218 10.811 12.0107 14.0067 15.9994 18.9984 20.1797 Lithium Beryllium Boron Carbon Nitrogen Oxygen Fluorine Neon 2 Symbol in white: element has no stable nuclides 11 12 13 14 15 16 17 18 Na Mg 8B Al Si P S Cl Ar 22.9898 24.305 26.9815 28.0855 30.9738 32.065 35.453 39.948 3 Sodium Magnesium 3B 3 4B 4 5B 5 6B 6 7B 7 8 9 10 1B 11 2B 12 Aluminum Silicon Phosphorus Sulfur Chlorine Argon 19 K 20 Ca 21 Sc 22 Ti 23 V 24 Cr 25 Mn 26 Fe 27 Co 28 Ni 29 Cu 30 Zn 31 Ga 32 Ge 33 As 34 Se 35 Br 36 Kr 39.0983 40.078 44.9559 47.867 50.9415 51.9961 54.938 55.845 58.9332 58.6934 63.546 65.409 69.723 72.64 74.9216 78.96 79.904 83.798 4 Potassium Calcium Scandium Titanium Vanadium Chromium Manganese Iron Cobalt Nickel Copper Zinc Gallium Germanium Arsenic Selenium Bromine Krypton 37 Rb 38 Sr 39 Y 40 Zr 41 Nb 42 Mo 43 Tc 44 Ru 45 Rh 46 Pd 47 Ag 48 Cd 49 In 50 Sn 51 Sb 52 Te 53 I 54 Xe 85.4678 87.62 88.9059 91.224 92.9064 95.94 [98] 101.07 102.9055 106.42 107.8682 112.411 114.818 118.710 121.760 127.60 126.9045 131.293 5 Rubidium Strontium Yttrium Zirconium Niobium Molybdenum Technetium Ruthenium Rhodium Palladium Silver Cadmium Indium Tin Antimony Tellurium Iodine Xenon 55 56 57-71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 Cs Ba * Hf Ta W Re Os Ir Pt Au Hg Tl Pb Bi Po At Rn 132.90545 137.327 La-Lu 178.49 180.9479 183.84 186.207 190.23 192.217 195.084 196.9666 200.59 204.383 207.2 208.9804 [209] [210] [222] 6 Cesium Barium Hafnium Tantalum Tungsten Rhenium Osmium Iridium Platinum Gold Mercury Thallium Lead Bismuth Polonium Astatine Radon

87 88 89-103 104 105 106 107 108 109 110 111 112 113 114 115 Fr Ra ** Rf Db Sg Bh Hs Mt Ds Rg Uub Uut Uuq Uup [223] [226] Ac-Lr [261] [262] [266] [264] [277] [268] [281] [272] [285] [284] [289] [288] 7 Francium Radium Rutherfordium Dubnium Seaborgium Bohrium Hassium Meitnerium Darmstadtium Roentgenium Ununbium Ununtrium Ununquadium Ununpentium

* 57 La 58 Ce 59 Pr 60 Nd 61 Pm 62 Sm 63 Eu 64 Gd 65 Tb 66 Dy 67 Ho 68 Er 69 Tm 70 Yb 71 Lu 138.9055 140.116 140.9077 144.24 [145] 150.36 151.964 157.25 158.9254 162.50 164.9303 167.259 168.9342 173.04 174.967 Lanthanum Cerium Praseodymium Neodymium Promethium Samarium Europium Gadolinium Terbium Dysprosium Holmium Erbium Thulium Ytterbium Lutetium ** 89 Ac 90 Th 91 Pa 92 U 93 Np 94 Pu 95 Am 96 Cm 97 Bk 98 Cf 99 Es 100 Fm 101 Md 102 No 103 Lr [227] 232.0381 231.0359 238.0289 [237] [244] [243] [247] [247] [251] [252] [257] [258] [259] [262] Actinium Thorium Protactinium Uranium Neptunium Plutonium Americium Curium Berkelium Californium Einsteinium Fermium Mendelevium Nobelium Lawrencium www.indium.com [email protected] 1863 Elemental indium e develop, manufacture 49 and market soft solders, ( In) discovered. electronics assembly and 1934 Indium Corporation founded. W 49 packaging materials, indium alloys, 1940’s In plating process extends and inorganic compounds. service life of aircraft bearings. 1950’s 49In preforms mass- 2 49 8 produced for Regency/ Corporate Structure 18 18 TI’s transistor radio. • Solder products and materials In 3 Indium 1960’s InCl3 generates transparent • Metals, chemicals, and energy 114.818 conductive fi lm on glass for aircraft windshields, trains Our Goal and freezer cases via a spray hydrolysis process. Increase our customer’s productivity 49 and profi tability through premium 1970’s In used in III-V Compound design, application and service Semiconductor Devices. using advanced materials. 1980’s Fine powders and chemical fl uxes enable Our basis for success: SMT development. • Excellent product 1990’s Advanced no-clean quality and performance solder pastes and polymer • Technical and material support rapid customer service miniaturization including UFP and array packages. • Cutting-edge material research and development 2000’s Unique Pb-Free solder materials used in high- • Extensive product range volume electronic assembly. • Lowest cost of ownership Metal Thermal Interface Materials product offering is expanded and enhanced.

U Milton Keynes, UK Chicago, USA U U UUU Torino, Italy Cheongju, South Korea Clinton, NY, USA Suzhou, ChinaUU Utica, NY, USA Liuzhou, ChinaU Shenzhen,U China

SingaporeU

FormForm No.No. 9984537720 ((A4)A4) RR13

www.indium.com [email protected]

ASIA: Singapore, Cheongju: +65 6268 8678 CHINA: Suzhou, Shenzhen, Liuzhou: +86 (0)512 628 34900 EUROPE: Milton Keynes, Torino: +44 (0) 1908 580400 USA: Utica, Clinton, Chicago: +1 315 853 4900

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