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EP Activity Report 2014
EUROPRACTICE IC SERVICE THE RIGHT COCKTAIL OF ASIC SERVICES EUROPRACTICE IC SERVICE OFFERS YOU A PROVEN ROUTE TO ASICS THAT FEATURES: • Low-cost ASIC prototyping • Flexible access to silicon capacity for small and medium volume production quantities • Partnerships with leading world-class foundries, assembly and testhouses • Wide choice of IC technologies • Distribution and full support of high-quality cell libraries and design kits for the most popular CAD tools • RTL-to-Layout service for deep-submicron technologies • Front-end ASIC design through Alliance Partners Industry is rapidly discovering the benefits of using the EUROPRACTICE IC service to help bring new product designs to market quickly and cost-effectively. The EUROPRACTICE ASIC route supports especially those companies who don’t need always the full range of services or high production volumes. Those companies will gain from the flexible access to silicon prototype and production capacity at leading foundries, design services, high quality support and manufacturing expertise that includes IC manufacturing, packaging and test. This you can get all from EUROPRACTICE IC service, a service that is already established for 20 years in the market. THE EUROPRACTICE IC SERVICES ARE OFFERED BY THE FOLLOWING CENTERS: • imec, Leuven (Belgium) • Fraunhofer-Institut fuer Integrierte Schaltungen (Fraunhofer IIS), Erlangen (Germany) This project has received funding from the European Union’s Seventh Programme for research, technological development and demonstration under grant agreement N° 610018. This funding is exclusively used to support European universities and research laboratories. By courtesy of imec FOREWORD Dear EUROPRACTICE customers, Time goes on. A year passes very quickly and when we look around us we see a tremendous rapidly changing world. -
Mipspro C++ Programmer's Guide
MIPSproTM C++ Programmer’s Guide 007–0704–150 CONTRIBUTORS Rewritten in 2002 by Jean Wilson with engineering support from John Wilkinson and editing support from Susan Wilkening. COPYRIGHT Copyright © 1995, 1999, 2002 - 2003 Silicon Graphics, Inc. All rights reserved; provided portions may be copyright in third parties, as indicated elsewhere herein. No permission is granted to copy, distribute, or create derivative works from the contents of this electronic documentation in any manner, in whole or in part, without the prior written permission of Silicon Graphics, Inc. LIMITED RIGHTS LEGEND The electronic (software) version of this document was developed at private expense; if acquired under an agreement with the USA government or any contractor thereto, it is acquired as "commercial computer software" subject to the provisions of its applicable license agreement, as specified in (a) 48 CFR 12.212 of the FAR; or, if acquired for Department of Defense units, (b) 48 CFR 227-7202 of the DoD FAR Supplement; or sections succeeding thereto. Contractor/manufacturer is Silicon Graphics, Inc., 1600 Amphitheatre Pkwy 2E, Mountain View, CA 94043-1351. TRADEMARKS AND ATTRIBUTIONS Silicon Graphics, SGI, the SGI logo, IRIX, O2, Octane, and Origin are registered trademarks and OpenMP and ProDev are trademarks of Silicon Graphics, Inc. in the United States and/or other countries worldwide. MIPS, MIPS I, MIPS II, MIPS III, MIPS IV, R2000, R3000, R4000, R4400, R4600, R5000, and R8000 are registered or unregistered trademarks and MIPSpro, R10000, R12000, R1400 are trademarks of MIPS Technologies, Inc., used under license by Silicon Graphics, Inc. Portions of this publication may have been derived from the OpenMP Language Application Program Interface Specification. -
The Evolving Role of Semiconductor Consortia in the United States and Japan
Portland State University PDXScholar Business Faculty Publications and Presentations The School of Business Fall 1998 The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham University of California - Berkeley Greg Linden University of California - Berkeley Melissa M. Appleyard Portland State University, [email protected] Follow this and additional works at: https://pdxscholar.library.pdx.edu/busadmin_fac Part of the Business Administration, Management, and Operations Commons Let us know how access to this document benefits ou.y Citation Details Ham, R., Linden, G., & Appleyard, M. M. (1998). The Evolving Role of Semiconductor Consortia in the United States and Japan. California Management Review, 41(1), 137-163. This Article is brought to you for free and open access. It has been accepted for inclusion in Business Faculty Publications and Presentations by an authorized administrator of PDXScholar. Please contact us if we can make this document more accessible: [email protected]. The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham Greg Linden Melissa M. Appleyard ince the late 1970s, governments throughout the industrialized economics have proclaimed the benefits of research consortia. In the United States, tor example, ihe 1984 National Cooperative Research SAct (NCRA) relaxed U.S. antitrust laws to encourage the formation of research consortia hy firms in the same industry; by the end of 1995, over 575 consortia had heen registered under the NCRA in a variety of -
THINC: a Virtual and Remote Display Architecture for Desktop Computing and Mobile Devices
THINC: A Virtual and Remote Display Architecture for Desktop Computing and Mobile Devices Ricardo A. Baratto Submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy in the Graduate School of Arts and Sciences COLUMBIA UNIVERSITY 2011 c 2011 Ricardo A. Baratto This work may be used in accordance with Creative Commons, Attribution-NonCommercial-NoDerivs License. For more information about that license, see http://creativecommons.org/licenses/by-nc-nd/3.0/. For other uses, please contact the author. ABSTRACT THINC: A Virtual and Remote Display Architecture for Desktop Computing and Mobile Devices Ricardo A. Baratto THINC is a new virtual and remote display architecture for desktop computing. It has been designed to address the limitations and performance shortcomings of existing remote display technology, and to provide a building block around which novel desktop architectures can be built. THINC is architected around the notion of a virtual display device driver, a software-only component that behaves like a traditional device driver, but instead of managing specific hardware, enables desktop input and output to be intercepted, manipulated, and redirected at will. On top of this architecture, THINC introduces a simple, low-level, device-independent representation of display changes, and a number of novel optimizations and techniques to perform efficient interception and redirection of display output. This dissertation presents the design and implementation of THINC. It also intro- duces a number of novel systems which build upon THINC's architecture to provide new and improved desktop computing services. The contributions of this dissertation are as follows: • A high performance remote display system for LAN and WAN environments. -
Learning the Superior Techniques of the Barbarians China’S Pursuit of Semiconductor Independence
JANUARY 2019 Learning the Superior Techniques of the Barbarians China’s Pursuit of Semiconductor Independence AUTHOR James A. Lewis A joint project of the CSIS TECHNOLOGY POLICY PROGRAM and the CSIS FREEMAN CHAIR IN CHINA STUDIES China Innovation Policy Series JANUARY 2019 Learning the Superior Techniques of the Barbarians China’s Pursuit of Semiconductor Independence AUTHOR James A. Lewis A joint project of the CSIS Technology Policy Program and the CSIS Freeman Chair in China Studies About CSIS Established in Washington, D.C., over 50 years ago, the Center for Strategic and International Studies (CSIS) is a bipartisan, nonprofit policy research organization dedicated to providing strategic insights and policy solutions to help decisionmakers chart a course toward a better world. In late 2015, Thomas J. Pritzker was named chairman of the CSIS Board of Trustees. Mr. Pritzker succeeded former U.S. senator Sam Nunn (D-GA), who chaired the CSIS Board of Trustees from 1999 to 2015. CSIS is led by John J. Hamre, who has served as president and chief executive officer since 2000. Founded in 1962 by David M. Abshire and Admiral Arleigh Burke, CSIS is one of the world’s preeminent international policy in¬stitutions focused on defense and security; regional study; and transnational challenges ranging from energy and trade to global development and economic integration. For the past seven years consecutively, CSIS has been named the world’s number one think tank for international security by the University of Pennsylvania’s “Go To Think Tank Index.” The Center’s over 220 full-time staff and large network of affiliated scholars conduct research and analysis and develop policy initiatives that look to the future and anticipate change. -
Microprocessors History of Computing Nouf Assaid
MICROPROCESSORS HISTORY OF COMPUTING NOUF ASSAID 1 Table of Contents Introduction 2 Brief History 2 Microprocessors 7 Instruction Set Architectures 8 Von Neumann Machine 9 Microprocessor Design 12 Superscalar 13 RISC 16 CISC 20 VLIW 23 Multiprocessor 24 Future Trends in Microprocessor Design 25 2 Introduction If we take a look around us, we would be sure to find a device that uses a microprocessor in some form or the other. Microprocessors have become a part of our daily lives and it would be difficult to imagine life without them today. From digital wrist watches, to pocket calculators, from microwaves, to cars, toys, security systems, navigation, to credit cards, microprocessors are ubiquitous. All this has been made possible by remarkable developments in semiconductor technology enabling in the last 30 years, enabling the implementation of ideas that were previously beyond the average computer architect’s grasp. In this paper, we discuss the various microprocessor technologies, starting with a brief history of computing. This is followed by an in-depth look at processor architecture, design philosophies, current design trends, RISC processors and CISC processors. Finally we discuss trends and directions in microprocessor design. Brief Historical Overview Mechanical Computers A French engineer by the name of Blaise Pascal built the first working mechanical computer. This device was made completely from gears and was operated using hand cranks. This machine was capable of simple addition and subtraction, but a few years later, a German mathematician by the name of Leibniz made a similar machine that could multiply and divide as well. After about 150 years, a mathematician at Cambridge, Charles Babbage made his Difference Engine. -
Qualcomm-Snapdragon-Integrated
QUALCOMM® SNAPDRAGON™ INTEGRATED FABLESS MANUFACTURING 2 Executive Summary Assembly and Test Services (OSATS) companies as well. The new mobile age has brought with it a new approach to solve the performance and power effi- Although QTI is fabless, it is still invested in ciency problems of modern processors. As a leader advancing manufacturing technology. QTI helps in the mobile industry, Qualcomm Technologies, drive and influence semiconductor innovations Inc. (QTI) implemented the Integrated Fabless through alliances and cooperation with industry Manufacturing (IFM) model to address the changes organizations. In 2013, QTI became a core member in the evolving mobile ecosystem to deliver the of the CMOS Program at the global semiconduc- best user experiences. IFM allows Qualcomm tor research program, IMEC, to extend the group’s Technologies to work closely with selected found- collaboration into advance CMOS process tech- ries, test and assembly vendors to provide nologies. Prior to QTI’s core membership, the two cutting edge solutions that can be manufactured organizations collaborated for several years on 3D in high volume while also meeting the perfor- stacking technologies. Also in 2010, QTI became mance, power, size, and cost requirements of the the first integrated, fabless chip manufactures to mobile industry. join SEMATECH, also with the intent to advance CMOS scaling and collaborate on new technologies. Technical Engagement Flexible Foundries The QTI IFM builds tight technical interfaces among all parties in the semiconductor develop- IFM uniquely positions QTI to adjust demand ment cycle. As a technology leader in the mobile across foundries and select the most cost effective ecosystem, QTI collaborates closely with the process nodes for the various components of a foundries and other services, on virtually every mobile system chipset. -
I/O Design and Core Power Management Issues in Heterogeneous Multi/Many-Core System-On-Chip
UNIVERSITY OF CALIFORNIA, IRVINE I/O Design and Core Power Management Issues in Heterogeneous Multi/Many-Core System-on-Chip DISSERTATION submitted in partial satisfaction of the requirements for the degree of DOCTOR OF PHILOSOPHY in Computer Science by Myoung-Seo Kim Dissertation Committee: Professor Jean-Luc Gaudiot, Chair Professor Alexandru Nicolau, Co-Chair Professor Alexander Veidenbaum 2016 c 2016 Myoung-Seo Kim DEDICATION To my father and mother, Youngkyu Kim and Heesook Park ii TABLE OF CONTENTS Page LIST OF FIGURES vi LIST OF TABLES viii ACKNOWLEDGMENTS ix CURRICULUM VITAE x ABSTRACT OF THE DISSERTATION xv I DESIGN AUTOMATION FOR CONFIGURABLE I/O INTERFACE CONTROL BLOCK 1 1 Introduction 2 2 Related Work 4 3 Structure of Generic Pin Control Block 6 4 Specification with Formalized Text 9 4.1 Formalized Text . 9 4.2 Specific Functional Requirement . 11 4.3 Composition of Registers . 11 5 Experiment Results 18 6 Conclusions 24 II SPEED UP MODEL BY OVERHEAD OF DATA PREPARATION 26 7 Introduction 27 8 Reconsidering Speedup Model by Overhead of Data Preparation (ODP) 29 iii 9 Case Studies of Our Enhanced Amdahl's Law Speedup Model 33 9.1 Homogeneous Symmetric Multicore . 33 9.2 Homogeneous Asymmetric Multicore . 35 9.3 Homogeneous Dynamic Multicore . 36 9.4 Heterogeneous CPU-GPU Multicore . 39 9.5 Heterogeneous Dynamic CPU-GPU Multicore . 41 10 Conclusions 43 III EFFICIENT CORE POWER CONTROL SCHEME 44 11 Introduction 45 12 Related Work 47 13 Architecture 51 13.1 Heterogeneous Many-Core System . 51 13.2 Discrete L2 Cache Memory Model . 52 14 3-Bit Power Control Scheme 55 14.1 Active Status . -
Wearable Mixed Reality System in Less Than 1 Pound
Eurographics Symposium on Virtual Environments (2006) Roger Hubbold and Ming Lin (Editors) Wearable Mixed Reality System In Less Than 1 Pound Achille Peternier,1 Frédéric Vexo1 and Daniel Thalmann1 1Virtual Reality Laboratory (VRLab), École Polytechnique Fédérale de Lausanne (EPFL), 1015 Lausanne, Switzerland Abstract We have designed a wearable Mixed Reality (MR) framework which allows to real-time render game-like 3D scenes on see-through head-mounted displays (see through HMDs) and to localize the user position within a known internet wireless area. Our equipment weights less than 1 Pound (0.45 Kilos). The information visualized on the mobile device could be sent on-demand from a remote server and realtime rendered onboard. We present our PDA-based platform as a valid alternative to use in wearable MR contexts under less mobility and encumbering constraints: our approach eliminates the typical backpack with a laptop, a GPS antenna and a heavy HMD usually required in this cases. A discussion about our results and user experiences with our approach using a handheld for 3D rendering is presented as well. 1. Introduction also few minutes to put on or remove the whole system. Ad- ditionally, a second person is required to help him/her in- The goal of wearable Mixed Reality is to give more infor- stalling the framework for the first time. Gleue and Daehne mation to users by mixing it with the real world in the less pointed the encumbering, even if limited, of their platform invasive way. Users need to move freely and comfortably and the need of a skilled technician for the maintenance of when wear such systems, in order to improve their expe- their system [GD01]. -
The Politics of Global Production: Apple, Foxconn and Chinas New
New Technology, Work and Employment 28:2 ISSN 0268-1072 The politics of global production: Apple, Foxconn and China’s new working class Jenny Chan, Ngai Pun and Mark Selden Apple’s commercial triumph rests in part on the outsourcing of its consumer electronics production to Asia. Drawing on exten- sive fieldwork at China’s leading exporter—the Taiwanese- owned Foxconn—the power dynamics of the buyer-driven supply chain are analysed in the context of the national ter- rains that mediate or even accentuate global pressures. Power asymmetries assure the dominance of Apple in price setting and the timing of product delivery, resulting in intense pressures and illegal overtime for workers. Responding to the high- pressure production regime, the young generation of Chinese rural migrant workers engages in a crescendo of individual and collective struggles to define their rights and defend their dignity in the face of combined corporate and state power. Keywords: Foxconn, Apple, global supply chains, labour, China, outsourcing, consumer electronics manufacturing, collective actions. Introduction The magnitude of Apple’s commercial success is paralleled by, and based upon, the scale of production in its supply chain factories, the most important of them located in Asia (Apple, 2012a: 7). As the principal manufacturer of products and components for Apple, Taiwanese company Foxconn1 currently employs 1.4 million workers in China alone. Arguably, then, just as Apple has achieved a globally dominant position, described as ‘the world’s most valuable brand’ (Brand Finance Global 500, 2013), so too have the fortunes of Foxconn been entwined with Apple’s success, facilitating Foxconn’s rise to become the world’s largest electronics contractor (Dinges, 2010). -
Timeline of the Semiconductor Industry in South Portland
Timeline of the Semiconductor Industry in South Portland Note: Thank you to Kathy DiPhilippo, Executive Director/Curator of the South Portland Historical Society and Judith Borelli, Governmental Relations of Texas Inc. for providing some of the information for this timeline below. Fairchild Semiconductor 1962 Fairchild Semiconductor (a subsidiary of Fairchild Camera and Instrument Corp.) opened in the former Boland's auto building (present day Back in Motion) at 185 Ocean Street in June of 1962. They were there only temporarily, as the Western Avenue building was still being constructed. 1963 Fairchild Semiconductor moves to Western Avenue in February 1963. 1979 Fairchild Camera and Instrument Corp. is acquired/merged with Schlumberger, Ltd. (New York) for $363 million. 1987 Schlumberger, Ltd. sells its Fairchild Semiconductor Corp. subsidiary to National Semiconductor Corp. for $122 million. 1997 National Semiconductor sells the majority ownership interest in Fairchild Semiconductor to an investment group (made up of Fairchild managers, including Kirk Pond, and Citcorp Venture Capital Ltd.) for $550 million. Added Corporate Campus on Running Hill Road. 1999 In an initial public offering in August 1999, Fairchild Semiconductor International, Inc. becomes a publicly traded corporation on the New York Stock Exchange. 2016 Fairchild Semiconductor International, Inc. is acquired by ON Semiconductor for $2.4 billion. National Semiconductor 1987 National Semiconductor acquires Fairchild Semiconductor Corp. from Schlumberger, Ltd. for $122 million. 1995 National Semiconductor breaks ground on new 200mm factory in December 1995. 1996 National Semiconductor announces plans for a $600 million expansion of its facilities in South Portland; construction of a new wafer fabrication plant begins. 1997 Plant construction for 200mm factory completed and production starts. -
ATC-1425B User Manual
Table of Contents JUMPER LOCATION DIAGRAM.............................................A CONNECTOR LOCATION DIAGRAM....................................B ...................................................................................................... CHAPTER 1 INTRODUCTION........................................1 1-1 SYSTEM FEATURES...................................................................1 1-2 CHECK LIST OF THE PACKING...............................................2 CHAPTER 2 INSTALLATION.........................................3 2-1 CPU INSTALLATION..................................................................3 2-2 SIM MODULES INSTALLATION..............................................4 2-3 SRAM INSTALLATION...............................................................5 2-4 OTHER JUMPERS SETTING......................................................6 CHAPTER 3 BIOS SETUP..............................................7 APPENDIX A .................................................................14 CHAPTER 1 INTRODUCTION 1-1 SYSTEM FEATURES : Supports all of 5V and 3.3V 486 CPUs, includes AmDX4-100/120, Am5x86-P75, and Cyrix 5x86. : Flexible architecture to support 128/256/512KB Direct mapped cache scheme. : Supports 4 stage power saving: On/Doze/Standby/Suspend. : Supports L1/L2 Write back/Write through cache feature. : Supports 72-pin dual type SIM modules. : Memory configurations from 1MB up to 256MB by using 256KB/ 1MB/4MB/8MB/16MB/32MB/64MB SIM module. : Supports SMI/SMM/PMU/APM power controllers. : Dual IDE connectors