North American Company Profiles 8x8

8X8

8x8, Inc. (formerly Integrated Information Technology) 2445 Mission College Boulevard Santa Clara, California 95054 Telephone: (408) 727-1885 Fax: (408) 980-0432

Fabless IC Supplier

Financial History ($M)

1991 1992 1993 1994 1995 Sales 28 45 36 41 50

Employees 100 114 100 105 110

Company Overview and Strategy

8x8, Inc. was founded originally as Integrated Information Technology, Inc. (IIT) in 1987 to supply math coprocessors for 286 and later 386 microprocessor chips. Since then, the privately-held company has moved its focus from coprocessors to high-performance multimedia processors, which were the basis for the name change to 8x8, Inc. in early 1996. The 8x8 name reflects the company’s focus on programmable integrated circuits for video conferencing and MPEG applications in a wide range of consumer and PC multimedia products. An 8x8 block of picture elements (pixels) is the basis of many video compression algorithms.

Management

Joseph L. Parkinson President and Chief Executive Officer Sandra Abbott Vice President, Finance and Chief Financial Officer David Harper Vice President, European Operations Chris McNiffe Vice President, Sales and Marketing Bryan Martin Vice President, Engineering and Chief Technical Officer Samuel Wang Vice President, Process Technology Doug Bailey Director, Worldwide Sales Kevin Deierling Director, Marketing

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-1 8x8 North American Company Profiles

Products and Processes

8x8 Inc. develops highly integrated programmable single-chip compression and decompression ICs and software for video phone, video conferencing, and MPEG/digital video such as VideoCD, karaoke, and DVD equipment.

The company’s family of processors include the following:

¥ Video Communications Processor (VCP) is a single-chip programmable video subsystem and multimedia communications processor for conferencing over ISDN telephone lines. ¥ Low-bit-rate Videophone Processor (LVP) is a single-chip programmable video-phone processor for conferencing over ordinary telephone lines. ¥ Multimedia Playback Processor (MPPex) is a single-chip programmable MPEG 1 video/audio decoder for a wide range of digital video playback applications. ¥ Multimedia Encode Processor (MEP) for powering a PCI video capture and compression board using Intel’s wavelet-based Indeo interactive video compression technology.

These processors are based on the company’s Multimedia Processor Architecture (MPA), which combines advanced DSP and RISC technologies onto a single processor chip.

Key Agreements

¥ 8x8 has strategic development alliances with National Semiconductor and Siemens Semiconductor.

1-2 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles ACC Micro

ACC MICRO

ACC Microelectronics Corporation 2500 Augustine Drive Santa Clara, California 95054 Telephone: (408) 980-0622 Fax: (408) 980-0626

Fabless IC Supplier

Company Overview and Strategy

ACC Microelectronics Corporation (ACC Microª) was established in 1987 to design, develop, and market a variety of VLSI circuit devices for computer system control, computer system board integration, and communication applications. The company's flagship products are a line of single chip solutions targeted at the desktop, notebook, and subnotebook computer industries.

Management

Wei-Tau Chiang, Ph.D. President and Chief Executive Officer Mark Shieu Vice President, Engineering

Products and Processes

ACC Micro supplies chipsets and controller chips for 386/486-based and Pentium-based computers. Other products include buffer chips, power management chips, and single-device floppy-disk controllers.

Semiconductor Fabrication Facilities

ACC Micro has second-source licensing agreements with Motorola to support delivery schedules.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-3 Actel North American Company Profiles

ACTEL

Actel Corporation 955 East Arques Avenue Sunnyvale, California 94086-4533 Telephone: (408) 739-1010 Fax: (408) 739-1540 Web Site: www.actel.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 35 41 56 76 109 Net Income 1 (0.3) 5 8 (1) R&D Expenditures 8 9 11 14 19

Employees 150 168 211 245 320

Company Overview and Strategy

Founded in 1985, Actel Corporation designs, develops, and markets field programmable gate arrays (FGPAs) and associated software development systems and programming hardware. Its products are used by designers of computer, telecommunications, military, industrial, and other electronic systems. Actel is a leader in the development of FPGAs based on antifuse technology. The company's objective is to become the leading supplier of FPGAs by fully exploiting the capabilities of its proprietary antifuse and circuit architectures.

In April 1995, Actel completed the acquisition of Texas Instruments' antifuse FPGA business. As part of the transaction, Actel signed a three-year manufacturing agreement with TI. TI had been a licensed second source of Actel's FPGAs since 1988.

Development Systems Military/Aerospace 5% 12%

Computers/ Communications/ Peripherals Networking 21% 44% FPGAs Industrial 95% 23%

1995 Sales by Product Type 1995 Sales by End-Use Market

1-4 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Actel

Asia-Pacific 9%

Japan 12%

Europe United States 17% 62%

1995 Sales by Geographic Region

Management

John C. East President and Chief Executive Officer Esmat Z. Hamdy Senior Vice President, Technology Jeffrey M. Schlageter Senior Vice President, Engineering David M. Sugishita Senior Vice President, Finance, and Chief Financial Officer Michelle A. Begun Vice President, Human Resources Doug Goodyear Vice President, Sales Dennis F. Nye Vice President, Marketing David L. Van De Hey Vice President and General Counsel Warren Miller Director, Silicon Planning and Strategic Applications Robert Nalesnik Director, Product Marketing David Stieg Director, North American Distribution Sales

Products and Processes

Actel's IC product line currently consists of three series of FPGAs.

Value Series

¥ The ACT1 family consists of two devices, a 1,200-gate part and a 2,000-gate part, and offers system performance of up to 25MHz. This family of circuits utilizes 1.0µm CMOS technology.

Accelerator Series

¥ The ACT3 family consists of devices ranging from 1,500 to 10,000 gates and offers system performance of up to 75MHz.

¥ The ACT3 PCI family consists of fully PCI-compliant devices with 4,000 to 10,000 usable gates and performance up to 250MHz.

Both families are based on a 0.8µm CMOS process that was initially developed by Hewlett-Packard.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-5 Actel North American Company Profiles

Integrator Series

¥ The 1200XL family features parts ranging from 2,500 to 8,000 gates and offers system performance of up to 60MHz. This family of circuits is based on 0.65µm CMOS technology.

¥ The 3200DX family is Actel’s newest series of FPGAs with capacities ranging from 6,500 gates to 40,000 gates and offers system performance up to 100MHz. These high-performance FPGAs offer fast dual-port SRAM, fast decode, and data path circuitry based on 0.65µm double-level-metal CMOS technology.

Actel plans to offer in 1996 radiation-hardened FPGAs for application in communications satellites. Also in 1996, Actel plans to migrate its technology to a 0.5µm triple-level-metal process.

To support its FPGA products, Actel offers design automation software, programming and test hardware, and a diagnostic option that provides special in-circuit debug and diagnostic capabilities.

Semiconductor Fabrication Facilities

Actel's FPGAs are manufactured by Matsushita, Chartered Semiconductor (Actel holds a minor equity interest in Chartered), Winbond, and Texas Instruments. Loral Federal Systems Company will be the sole source of Actel’s rad-hard FPGAs, which are being jointly developed by Actel and Loral.

Key Agreements

¥ Actel completed an agreement with Loral Federal Systems in Manassas, Virginia, in 1H95 to jointly develop radiation-hardened, nonvolatile FPGAs. The chips will be targeted at applications in military and aerospace systems. The agreement also calls for Loral to manufacture the rad-hard FPGAs.

1-6 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Allegro MicroSystems

ALLEGRO MICROSYSTEMS

Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 Telephone: (508) 853-5000 Fax: (508) 856-7434

IC Manufacturer

Financial History ($M)

1991 1992 1993 1994 1995 Sales 104 115 124 161 204 Capital Expenditures 13 10 14 61

Employees 2,000

Company Overview and Strategy

Allegro MicroSystems is the former semiconductor branch of Sprague Technologies, Inc. In 1990, Sprague was purchased by Japan's Sanken Electric and renamed Allegro MicroSystems. Today, Allegro is functionally and structurally an independently operating organization as a wholly owned subsidiary of Sanken Electric.

Allegro MicroSystems specializes in the design, manufacture, and marketing of advanced mixed-signal ICs. The company is the world leader in Hall-effect sensor ICs and a prominent supplier of power and smart power ICs. Allegro's customers are OEM's primarily serving the automotive and industrial markets, but also the consumer, telecommunications, computer mass storage, and printer markets.

Telecommunications 5%

EDP Japan 8% 14% Consumer Far East Industrial 14% 15% 47% United States 52% Automotive Europe 26% 19%

1995 Sales by End-Use Market 1995 Sales by Geographic Region

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-7 Allegro MicroSystems North American Company Profiles

Management

Allan S. Kimball President Dan Ax Vice President, Business Development Dennis Fitzgerald Vice President, Quality Systems John Kokulis Vice President, Finance and Chief Financial Officer Andy Labrecque Vice President, Operations John MacDougell Vice President, Research and Development Steven W. Miles Vice President, Product Development Fred Windover Vice President and General Counsel Marybeth Perry Director, Human Resources

Products and Processes

Allegro's product offering is outlined below by end-use market segment.

Automotive Market EDP Printer and Communication Markets Magnetic field sensors Printer head driver Power driver ICs Paper transport motor driver Signal processing ICs Battery management Radio components

Computer Mass Storage Market Industrial and Consumer Markets Spindle motor controller/driver Discretes Servo/voice-coil motor driver Chip supply for hybrids Combination drivers Smoke detector electronics

Switch Mode Power Supply Market AC-DC converter (>10W to <250W) Universal input switching (<1kW)

The semiconductor processes used by Allegro range from standard bipolar to CMOS, power DMOS (double- diffused MOS), and combinations of all of them.

Discretes 6%

BiCMOS/ BCD/CMOS ICs 22%

Bipolar ICs 72%

1995 Sales by Device Type

1-8 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Allegro MicroSystems

Semiconductor Fabrication Facilities

Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. 115 Northeast Cutoff 3900 Welsh Grove Road Worcester, Massachusetts 01615-0036 Willow Grove, Pennsylvania 19090 Cleanroom size: 20,000 square feet Cleanroom size: 15,000 square feet Capacity (wafers/week): 5,000 Capacity (wafers/week): 3,000 Wafer size: 100mm Wafer size: 100mm Processes: Bipolar, CMOS, BiCMOS, DMOS Processes: Bipolar, CMOS, BiCMOS, DMOS Products: Power and smart power ICs, Products: Power and smart power ICs, signal processing ICs, sensors ASICs (mixed-signal), sensors Feature sizes: 1.5µm-8.0µm Feature sizes: 1.5µm-8.0µm

Allegro plans to invest $80 million to expand wafer capacity at its Worcester fab facility. A 150mm wafer line will be added to support 1.5µm production of its power and smart power ICs and sensor products. Allegro is also planning to double the capacity at its Willow Grove facility.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-9 Alliance Semiconductor North American Company Profiles

ALLIANCE SEMICONDUCTOR

Alliance Semiconductor Corporation 3099 North First Street San Jose, California 95134-2006 Telephone: (408) 383-4900 Fax: (408) 383-4999

IC Manufacturer

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 4 22 55 119 201 Net Income (3) 2 9 24 11 R&D Expenditures 1248n/a

Employees 20 35 40 74 n/a

Company Overview and Strategy

Founded in 1985, Alliance Semiconductor designs, develops, and markets memory products and memory intensive logic products for high-performance applications. Such applications are in the desktop and portable personal computer, networking, telecommunications, and instrumentation industries.

The company originally manufactured its own devices in a fab facility near Kansas City, Missouri, leased from AT&T. However, high overhead costs and low demand in its product markets caused the plant to operate at a significant loss until its closure in February 1990. The company filed for Chapter 11 bankruptcy protection in March 1991 and then emerged with a new business strategy to operate as a fabless supplier of high- performance SRAMs and other memory products.

Alliance operated as a fabless company until 1995 when it announced several manufacturing partnerships with Taiwan’s United Microelectronics Corporation (UMC) and Singapore’s Chartered Semiconductor.

Other 10%

United States Asia 45% 45%

1995 Sales by Geographic Region

1-10 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Alliance Semiconductor

Since the beginning of fiscal 1993, sales of Alliance’s SRAM products have accounted for substantially all of its net revenue. The company continues to develop and introduce new SRAM products, such as high density (32K x 32), 3.3V burst synchronous SRAMs. Meanwhile, Alliance is aggressively making a transition from a single product line, SRAM supplier to a broad-based semiconductor company with multiple product lines. The new product lines include high-performance DRAMs, multimedia ICs, and flash memory devices.

Management

N. Damodar Reddy President and Chief Executive Officer C.N. Reddy Executive Vice President, Engineering and Operations Sid Agrawal Vice President, Marketing Kamal Gunsagar Vice President, Contract Manufacturing Angela Kupps Vice President, Human Resources Ken Poteet Vice President, Integrated Memory Products Phil Richards Vice President, Sales Sunit Saxena Vice President, Product Engineering Bharat Shastri Vice President, Systems Engineering Ronald K. Shelton Vice President, Finance and Administration, and Chief Financial Officer Ritu Shrivastava Vice President, Technology Development

Products and Processes

Alliance Semiconductor supplies primarily high-speed CMOS SRAMs, ranging from 64K densities with 10ns access times to 4M densities with 15ns access times. The company also offers a 1M (32K x 32) synchronous burst fully pipelined SRAM specifically designed for high-performance Pentium applications with access times as low as 6ns.

Volume production of a new line of high-speed 4M and 16M DRAMs is expected to begin in the second half of 1996. At present, Alliance only sells 256K and 1M DRAMs.

Alliance supplies a limited amount of 3.3V-only and 5V-only 1M flash memory devices. Flash memories with 2M and 4M densities are expected to be introduced in 1996.

The company's first foray beyond memory chip markets came in late 1994, when it unveiled what it considers to be the first multimedia user interface (MMUI) chip. The chip, called ProMotion-3210, is a DRAM-based motion video and graphics accelerator that is compatible with several compression techniques, including Indeo, CinePak, Motion JPEG, and MPEG 1. The chip line also includes a fully integrated graphic accelerator chip, the ProMotion-6422, which includes a RAMDAC, a clock synthesizer, and a video and graphics accelerator.

Since 1988, Alliance's CMOS process technology has migrated from the 1.5µm level to the current 0.45µm level. Currently, nearly all of Alliance’s products are manufactured using 0.6µm and 0.5µm technologies, but 0.45µm technology is being used at one of its foundries. The company’s SRAMs are based on a two-poly, one-metal CMOS process and its DRAMs on a three-poly, one-metal CMOS process.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-11 Alliance Semiconductor North American Company Profiles

Semiconductor Fabrication Facilities

Alliance Semiconductor announced major plans in 1995 calling for a substantial portion of the company’s future wafer capacity to come from fabs in which it has partial ownership. The company’s existing foundry supply agreements are with UMC, Chartered Semiconductor, Rohm, and TSMC. In addition, some of Alliance’s MMUI products are produced by Samsung.

In October 1995, Alliance entered a definitive agreement with UMC and other parties to form a separate Taiwanese company, United Silicon Inc., for the purpose of building and managing a semiconductor manufacturing facility in Taiwan. Alliance will invest approximately $60 million, representing an initial equity ownership of about 10 percent. In return for its investment, Alliance will receive 12.5 percent of the manufacturing capacity in United Silicon’s fab, which is expected to move into production in 1997.

Earlier in 1995, Alliance entered into a partnership with UMC and S3 Incorporated to establish a new jointly owned wafer foundry company in Taiwan called United Semiconductor Corporation (USC). Alliance’s investment in the foundry will initially total approximately $80 million, representing an equity ownership of 20 percent. In return for its investment, Alliance will receive 25 percent of the manufacturing capacity in the United Semiconductor fab. The fab will be a 200mm wafer, 0.35µm plant capable of producing 5,000 to 6,250 wafers per week. It will start manufacturing wafers for Alliance, S3, and other semiconductor companies in 3Q96.

Also in 1995, Alliance announced a $50 million investment in Chartered Semiconductor Manufacturing to obtain a minority ownership stake in the company and a guaranteed portion of the capacity in Chartered’s new 200mm wafer fab that began production in the second half of 1995.

Alliance’s equity investments in UMC and Chartered so far total about $200 million. By the end of 1997, the company expects wafers from the UMC and Chartered fabs it has invested in will represent more than 50 percent of its capacity.

Key Agreements

¥ Alliance and UMC signed an agreement in 4Q95 under which UMC may expand allocation of wafer fabrication capacity to Alliance for the manufacture of Alliance’s DRAM products. In return, Alliance granted UMC a license to produce for itself a certain number of Alliance DRAM products. As discussed above, UMC and Alliance will also cooperate in the manufacture of ICs through two new IC foundry companies they are setting up in Taiwan.

¥ Alliance signed an agreement with 3Dfx Interactive, Inc. in late 1995 to work together on ensuring compatibility between Alliance’s ProMotion multimedia chips and 3Dfx Interactive’s Voodoo Graphics three dimensional graphics accelerator designed for 3D entertainment applications.

¥ Alliance licensed Aspec Technology's Portfolioª family of ASIC design tools in 2Q95. These tools will allow the company to create low-cost ASIC gate array and embedded memory array products.

1-12 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Alliance Semiconductor

¥ Alliance entered into a joint development, manufacturing, and marketing agreement with Japan's Rohm Co., Ltd. in mid-1994 calling for Rohm to furnish Alliance with 0.5µm CMOS fab capacity for the production of SRAMs. Rohm will also help Alliance sell and market the products in Japan; Alliance will, in turn, assist Rohm in developing high-performance, low-power SRAMs.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-13 Altera North American Company Profiles

ALTERA

Altera Corporation 2610 Orchard Parkway San Jose, California 95134-2020 Telephone: (408) 894-7000 Fax: (408) 435-1394 Web Site: www.altera.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 107 101 140 199 402 Net Income 18 12 21 15 87 R&D Expenditures 14 16 17 22 34

Employees 446 477 527 667 900

Company Overview and Strategy

Altera Corporation, founded in 1983, is a leading supplier of high-performance, high-density CMOS programmable logic devices (PLDs) and associated development tools. Its broad line of "off-the-shelf" user- configurable chips, together with Altera-developed software, enable system manufacturers to create custom logic functions in-house for a wide variety of applications. Altera believes its products and services provide its customers with faster time-to-market than custom (ASIC) solutions. The company's name was derived from the word Alterable.

Altera products are used in a variety of applications, including telephone switching systems, computer networking, multimedia boards, broadcast video and video conferencing, and medical instrumentation.

Development Software

and Hardware Consumer 5% 4% Other Military 1% 6%

Industrial 17% Communications CMOS Programmable Computer 55% Logic Chips 17% 95%

1995 Sales by Product Type 1995 Sales by End-Use Market

1-14 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Altera

Asia-Pacific 6%

Japan 20% North America Europe 53% 21%

1995 Sales by Geographic Region

Management

Rodney Smith President and Chief Executive Officer Denis Berlan Vice President, Operations and Product Engineering Erik Cleage Vice President, Marketing Jack Fitzhenry Vice President, Human Resources Clive McCarthy Vice President, Development Engineering Thomas J. Nicoletti Vice President, Business Development and Investor Relations Nathan Sarkisian Vice President, Finance Peter Smyth Vice President, Sales

Products and Processes

Altera's PLD products extend from 20 to 560 pins with usable gate counts up to 100,000 gates and process technologies advancing to 0.5µm through its fabrication partners.

FLEX 10K Family FLEX 8000 Family ¥ 10,000-100,000 usable gates ¥ 2,500-50,000 usable gates ¥ In-circuit reconfigurable ¥ In-circuit reconfigurable ¥ 84-560 pins ¥ 84-304 pins ¥ Performance: 75MHz ¥ Performance: 75MHz ¥ SRAM technology ¥ SRAM technology ¥ 3.3V versions available ¥ 3.3V versions available ¥ Megafunction support ¥ 0.65µm-0.8µm ¥ 0.5µm

FLASHlogic Family MAX 9000 Family ¥ 800-3,200 usable gates ¥ 6,000-12,000 usable gates ¥ In-circuit reconfigurable ¥ In-system programmable ¥ In-system programmable ¥ 84-304 pins ¥ Performance: 50-100MHz ¥ Performance: 50-100MHz ¥ SRAM and flash/EPROM technology ¥ EEPROM technology ¥ 0.6µm ¥ 0.65µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-15 Altera North American Company Profiles

MAX 7000 Family MAX 5000 Family ¥ 600-5,000 usable gates ¥ 600-3,750 usable gates ¥ High pin to gate ratio ¥ High register count ¥ 44-208 pins ¥ 24-100 pins ¥ Performance: 70-150MHz ¥ Performance: 50-100MHz ¥ In-system programmable ¥ 0.65µm-0.8µm ¥ EEPROM technology ¥ 0.65µm-0.8µm

Classic Family ¥ 150-900 usable gates ¥ Zero-standby power ¥ 20-68 pins ¥ Performance: 50-125MHz ¥ 0.8µm-1.5µm

The company also offers 64K, 213K, and 1M EPROMs designed to configure its FLEX devices, as well as mask-programmed logic devices (MPLDs) for high-volume applications. MPLDs are pin-, function-, and timing-compatible with Altera’s PLDs and are available for all families.

In November 1995, Altera announced it would discontinue its military-qualified line of PLDs. It will ship Mil- spec devices until mid-1997 and support existing customers. In addition, Altera stated in early 1996 that it would drop certain low-density simple PLD lines, many of which are PAL/GAL and 22V10 equivalent devices, by August 1996.

Altera supplies proprietary software development systems (MAX+PLUS IIª) to support its PLD products.

Semiconductor Fabrication Facilities

Altera has foundry agreements with Sharp and TSMC. It also owns 17 percent of Cypress Semiconductor's wafer fab in Round Rock, Texas. Through this ownership, Altera has the right to buy a percentage of the wafers produced by Cypress approximately equal to the percentage of its ownership.

In November 1995, Altera signed a letter of intent for joint ownership of a TSMC fab to be built in Camas, Washington. Under the terms, Altera will invest $125 million to take a 16 percent equity stake in TSMC, and also gain the rights to 24 percent of the output from the new fab. Potential output from the $1.2 billion plant is expected to be 7,500 200mm wafers per week, with production scheduled to start in 1H98. Design rules will start at 0.35µm and migrate to 0.25µm.

1-16 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Altera

Cypress Semiconductor (Texas) Inc. TSMC Joint Venture Fab (17 percent owned by Altera) (will be 16 percent owned by Altera) 17 Cypress Drive Camas, Washington Round Rock, Texas 78664 Capacity (wafers/week): 7,500 Cleanroom size: 19,800 square feet Wafer size: 200mm Capacity (wafers/week): 2,200 Process: CMOS Wafer size: 150mm Products: Foundry services Processes: CMOS Feature sizes: 0.25µm, 0.35µm Products: PLDs for Altera (Scheduled to start up in 1Q98) Feature sizes: 0.5µm-1.2µm

Key Agreements

¥ In February 1996, Altera purchased a minority stake in I-Cube Inc., a privately held supplier of programmable switching and interconnect devices (PSIDs).

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-17 AMCC North American Company Profiles

APPLIED MICRO CIRCUITS (AMCC)

Applied Micro Circuits Corporation 6195 Lusk Boulevard San Diego, California 92121-2729 Telephone: (619) 450-9333 Fax: (619) 450-9885 Web Site: www.amcc.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends March 31

1991 1992 1993 1994 1995 Sales 38 39 47 50 51

Employees 265 275 300 310 270

Company Overview and Strategy

Established in 1979, Applied Micro Circuits Corporation (AMCC) develops, manufactures, and markets high- speed, high-reliability ASSPs for data communications, telecommunications, computer interface, and clock and timing applications, in addition to ASICs for commercial and military applications. The privately-held company is a leader in bipolar manufacturing and bipolar ECL logic arrays.

Bipolar Analog/Custom Pacific Rim 9% 12% Europe/Israel 8%

Bipolar/BiCMOS Digital North America 91% 80%

1995 Sales by Device Type 1995 Sales by Geographic Region

1-18 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles AMCC

Management

David Rickey President and Chief Executive Officer John Grosse Vice President, Operations Joel O. Holliday Vice President, Finance and Chief Financial Officer Roger Smullen Vice President, Sales William Staunton Vice President, Quality Assurance and Reliability Mark Denin Director, ASSP Marketing Brent Little Director, ASIC Marketing

Products and Processes

AMCC produces and sells bipolar and BiCMOS gate arrays, custom bipolar IC products, and standard bipolar and CMOS products.

The company’s line of ASSPs for high-performance networking, clock/timing, and bus interface applications, and ASICs include the following:

Q20000 Series ECL/TTL “Turbo” Logic Arrays Crosspoint Switches MicroPower 3V, low power, bipolar, standard cell ASICs CRC Generator/Checker PCI Bus Controllers ECL Terminator SONET/SDH Products Clock Buffers WAN/LAN Products ATM Products

CMOS (PCI Products) 7%

BiCMOS 20%

Bipolar 73%

1995 Sales by Process Technology

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-19 AMCC North American Company Profiles

Semiconductor Fabrication Facilities

AMCC operates from a 120,000 square foot facility in San Diego, California, which includes a design center for customer design use and training, a Class 10 cleanroom for bipolar IC production, and an assembly and test facility. The company has established strategic foundry partners to augment its wafer supply.

Applied Micro Circuits Corporation 6195 Lusk Boulevard San Diego, California 92121 Cleanroom size: 10,000 square feet (Class 10) Capacity (wafers/week): 1,200 Wafer size: 100mm Processes: Bipolar Products: Gate arrays, ASSPs, custom ICs Feature sizes: 1.0µm ECL/bipolar 2.0µm, 3.0µm bipolar

AMCC's capacity is only about half utilized, and the company expects its current manufacturing resources to reach maximum levels in a few years.

Key Agreements

¥ AMCC has a strategic alliance with Hughes Electronics for ASIC products.

1-20 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles AMD

ADVANCED MICRO DEVICES (AMD)

Advanced Micro Devices, Inc. One AMD Place P.O. Box 3453 Sunnyvale, California 94088-3453 Telephone: (408) 732-2400 Fax: (408) 774-7216 Web Site: www.amd.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 1,227 1,514 1,648 2,135 2,430 Net Income 145 245 229 305 300 R&D Expenditures 214 228 263 280 398 Capital Expenditures 111 222 324 549 621

Employees 11,254 11,554 12,065 11,793 12,730

Company Overview and Strategy

Advanced Micro Devices (AMD) was founded in 1969 and is today one of the largest U.S.-based merchant manufacturers of integrated circuits. With a focus on the personal and networked computing and communications markets, the company produces microprocessors and related peripherals, flash memories, programmable logic devices, and circuits for telecommunications and networking applications.

AMD’s strategy is to be competitive only in those markets where it can be a leading factor. The company has been a major supplier of microprocessors since 1975, it is a leading supplier of non-volatile memories, a leader in ICs for local area networks and linecards for public communications applications, and the second largest supplier of programmable logic devices.

Digital Bipolar 5% Analog

10% Japan 8% ROW MOS Micro 19% North America MOS Logic 38% 19% 45% Europe MOS Memory 28% 28%

1995 Sales by Device Type 1995 Sales by Geographic Region

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-21 AMD North American Company Profiles

In January 1996, AMD completed the acquisition of NexGen, Inc., significantly enhancing its core competency in advanced microprocessor design. The acquisition brings together the engineering resources and sixth-generation microprocessor design of NexGen with AMD’s sub-0.35µm process technology and manufacturing capability to enable AMD to offer future generations of microprocessors in a competitive timeframe. The company plans to bring to production the sixth-generation NexGen design as the AMD-K6ª microprocessor in early 1997.

Management

W.J. Sanders III Chief Executive Officer Richard Previte President and Chief Operating Officer Marvin Burkett Senior Vice President, Chief Financial and Administrative Officer and Treasurer Gene Conner Senior Vice President, Operations S. Atiq Raza Corporate Vice President and Chief Technical Officer Stanley Winvick Senior Vice President, Human Resources Stephen Zelencik Senior Vice President and Chief Marketing Executive John Bourgoin Group Vice President, Computation Products Group Vinod Dham Group Vice President, Computation Products Group Richard Forte Group Vice President, Communications and Components Group Terryll R. Smith Group Vice President, Sales Benjamin M. Anixter Vice President, External Affairs Gary Ashcraft Vice President and GM, Communication Products Division Frank Barone Vice President and GM, Programmable Logic Division and Bipolar Operations Kathryn Brandt Vice President, Business Systems Donald M. Brettner Vice President, Manufacturing Services Division David Chavoustie Vice President and GM, Embedded Processor Division Susan T. Daniel Vice President, Human Resource Operations James Doran Vice President, Technical Operations Curt Francis Vice President, Corporate Planning and Development Al F. Frugaletti Vice President, Worldwide Distribution and Headquarters Sales Clive Ghest Vice President, Business Development Gary O. Heerssen Vice President and Group Executive, Austin Wafer Fab Operations Robert R. Herb Vice President, Group Strategic Marketing, Computation Products Group Larry Hollatz Vice President and GM, Texas Microprocessor Division Robert M. Krueger Vice President and GM, I/O and Network Products Division Gerald A. Lynch Vice President, Asia Pacific Sales and Marketing Walid Maghribi Vice President and GM, Non-Volatile Memory Division Robert McConnell Vice President Thomas M. McCoy Vice President and General Counsel Giuliano Meroni Vice President, Europe Sales and Marketing K.C. Murphy Vice President, Systems and Platform Development Daryl Ostrander Vice President, Austin Wafer Fabrication Joseph Proctor Vice President, Information Systems Geoff Ribar Vice President, Corporate Controller Douglas Ritchie Vice President, Information Integration and Access

1-22 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles AMD

Jack Saltich Vice President and General Manager, European Microelectronics Center William Siegle Vice President, Integrated Technology Division and Submicron Development Center, and Chief Scientist Danne Smith Vice President, Corporate Quality Tom Sites Vice President, Communications Kimio Yanagida President, Fujitsu AMD Semiconductor Ltd.

Products and Processes

MOS MEMORY ANALOG DRAM Amplifier SRAM ✔ Interface ✔ Flash Memory Consumer/Automotive ✔ EPROM Voltage Regulator/Reference ROM ✔ Data Conversion EEPROM ✔ Comparator ✔ Other (Including Non-Volatile RAM) Other (Includes Telecom)

MOS LOGIC DIGITAL BIPOLAR ✔ General Purpose Logic ✔ Bipolar Memory Gate Array ✔ General Purpose Logic Standard Cell Gate Array/Standard Cell ✔ Field Programmable Logic ✔ Field Programmable Logic Other Special Purpose Logic Other Special Purpose Logic ✔ MPU/MCU/MPR MOS MICROCOMPONENT ✔ MPU OTHER ✔ MCU Full Custom IC ✔ MPR Discrete DSP Optoelectronic

AMD is organized into three focused product groups: AMD 1 (Microprocessor Products), AMD 2 (Communication Products), and AMD 3 (Non-Volatile Memory, Programmable Logic, and Embedded Processor Products).

Microprocessor Products

AMD5K86 Microprocessors—The first member of AMD’s K86 family of superscalar microprocessors, the 5K86 is a fifth-generation alternative to Intel’s Pentium. It is based on AMD’s 0.35µm CMOS technology and is initially offered in two versions. The 5K86-P75 and 5K86-P90 are said to offer performance greater than or equal to a 75MHz Pentium and a 90MHz Pentium, respectively. AMD’s sixth-generation offering is scheduled to start production in early 1997.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-23 AMD North American Company Profiles

Am5x86 Microprocessors—The 5x86 is said to offer Pentium-class performance using a fourth-generation architecture. It is based on a 0.35µm CMOS process and runs at a quadrupled clock rate of 133MHz.

Am486 Microprocessors—AMD’s 486DX4 microprocessors offer clock-tripled performance speeds of up to 120MHz and feature “enhanced” power management features.

InterWaveª Audio Processor—This is a complete audio sound system on a chip for PC applications that supports many major audio standards.

Communication Products

AMD’s communications and networking products include ICs for public infrastructure, including subscriber line interface circuits (SLICs), subscriber line audio-processing circuits (SLACsª), and ISDN controllers; ICs for networking, including FDDI chips and PCnetª Ethernet LAN devices; ICs for data communications, including PCI small computer systems interface (SCSI) circuits, serial communications controllers (SCCs), and TAXIchipª devices; and ICs for wireless communications, including CT2 PhoXª controllers for digital cordless telephones and PCnet-Mobile devices for wireless LANs.

Non-Volatile Memory Products

Am29Fxxx Flash Memories—The Am29Fxxx family of 5.0V-only sector-erase flash memory devices are available in densities ranging from 1M to 16M.

Am29LVxxx Flash Memories—The Am29LVxxx family of 3.0V-only sector-erase flash memory devices are available in densities ranging from 2M to 8M.

Am28Fxxx Flash Memories—This is the company’s first generation family of 5.0V/12.0V bulk-erase flash memory devices. They are available in densities ranging from 256K to 2M.

EPROM Products—AMD’s CMOS UV and OTP EPROMs are offered in densities ranging from 64K to 4M. Low-voltage versions are available in 1M and 2M densities.

ExpressROM Products—These are standard EPROM die that are pre-programmed and then encapsulated in plastic packaging before delivery. They are offered in densities ranging from 64K to 8M.

Programmable Logic Products

AMD’s PLD products include a variety of CMOS and bipolar programmable array logic (PAL) devices and its line of MACH (Macro Array CMOS High-Density) advanced complex PLDs (CPLDs) with densities as high as 20,000 gates and speeds as fast as 7.5ns.

1-24 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles AMD

Embedded Processor Products

AMD’s E86™ Family of embedded processor products include several microprocessors and microcontrollers based on the company’s 186, 386, and 486 cores. The company has shifted its embedded product focus toward its growing E86 family and away from its venerable 29Kª family of embedded RISC processors. AMD will continue to support current product designs and customers using its 29K products. However, development of new 29K devices has been discontinued. AMD cited the high cost of supporting the proprietary architecture as the reason for putting an end to the product line.

Other IC Products

The company’s other IC products include bipolar PROMs and RAMs, FIFO memories, high-performance CMOS and bipolar bus interface devices, transmission line drivers and receivers, and dynamic memory management circuits.

Semiconductor Fabrication Facilities

AMD announced plans to build a $1.9 billion sub-half-micron semiconductor manufacturing facility in Dresden, Germany, for the manufacture of its K5 microprocessors and other generations of its K86 family. Groundbreaking is scheduled for the end of 1996, with production commencing by the end of 1998.

In another move, AMD and Fujitsu broke ground in late 1995 on their second joint-venture manufacturing facility in Japan, a $1.2 billion fab for the production of flash memories.

Advanced Micro Devices Advanced Micro Devices 5204 East Ben White Boulevard 5204 East Ben White Boulevard Austin, Texas 78741 Austin, Texas 78741 Telephone: (512) 385-8542 Telephone: (512) 385-8542 Fab 10 Fab 14 Cleanroom size: 22,000 square feet (Class 100) Cleanroom size: 22,000 square feet (Class 10) Capacity (wafers/week): 4,500 Capacity (wafers/week): 3,500 Wafer size: 125mm Wafer size: 150mm Process: CMOS Process: CMOS Products: PLDs Products: Flash memories, EPROMs Feature size: 0.9µm Feature size: 0.8µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-25 AMD North American Company Profiles

Advanced Micro Devices Advanced Micro Devices 5204 East Ben White Boulevard 901 Thompson Place Austin, Texas 78741 Sunnyvale, California 94088 Telephone: (512) 385-8542 Telephone: (408) 732-2400 Fab 15 Fab 17 and Submicron Development Center Cleanroom size: 22,000 square feet (Class 10) Cleanroom size: 42,500 square feet (Class 1) Capacity (wafers/week): 3,500 Capacity (wafers/week): 2,000 Wafer size: 150mm Wafer size: 150mm Process: CMOS Process: CMOS Products: Logic, telecom, and network ICs; Products: R&D, MPUs, flash memories MPUs; microperipheral ICs Feature sizes: 0.35µm-0.8µm Feature size: 0.7µm

Advanced Micro Devices Advanced Micro Devices 5204 East Ben White Boulevard Dresden, Germany Austin, Texas 78741 Fab 30 Telephone: (512) 385-8542 Cleanroom size: 90,000 square feet Fab 25 Capacity (wafers/week): 6,000 Cleanroom size: 87,000 square feet (Class 1) Wafer size: 200mm Capacity (wafers/week): 6,250 Process: CMOS Wafer size: 200mm Products: MPUs, logic ICs Process: CMOS Feature size: 0.25µm (0.18µm capability) Products: MPUs, logic ICs, flash memories (Expected to start production by the end of 1998.) Feature sizes: 0.35µm, 0.5µm (0.25µm capability)

Fujitsu AMD Semiconductor Ltd. Fujitsu AMD Semiconductor Ltd. Aizuwakamatsu, Fukushima Prefecture, Japan Aizuwakamatsu, Fukushima Prefecture, Japan FASL I FASL II Cleanroom size: 70,000 square feet (Class 1) Cleanroom size: 88,000 square feet Capacity (wafers/week): 5,000 Capacity (wafers/week): 6,250 Wafer size: 200mm Wafer size: 200mm Process: CMOS Process: CMOS Products: Flash memories Products: Flash memories Feature sizes: 0.35µm, 0.5µm (0.25µm capability) Feature sizes: 0.25µm, 0.35µm (Scheduled to begin operations in 1997)

AMD’s back-end manufacturing facilities are located in Penang, Malaysia; Bangkok, Thailand; and Singapore. In early 1996, AMD began the construction of a new assembly and test facility in Suzhou, China.

1-26 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles AMD

Key Agreements

¥ In early 1996, NexGen, Inc. merged with and into AMD. The merger brings together the engineering resources and sixth-generation microprocessor design of NexGen with AMD’s sub-0.35µm process technology and manufacturing capability to enable AMD to offer future generations of microprocessors in a competitive timeframe. AMD paid nearly $1 billion for NexGen.

¥ AMD and Intel signed a new five-year cross-licensing agreement in early 1996 that gives the two companies rights to use each other’s patents and certain copyrights, excluding microprocessor microcode beyond the 486 generation.

¥ AMD and Fujitsu opened a large flash memory fabrication facility in Japan in September 1994. Production of flash memory chips began in 1Q95. As an extension of their relationship, Fujitsu is OEM- procuring 1M and 2M flash devices from AMD for use in portable communications equipment. In late 1995, the partners began the construction of a second joint-venture fab in Japan.

¥ Taiwan Semiconductor Manufacturing Co. (TSMC) was signed on as a foundry partner for AMD's Am486 microprocessors in late 1994. Production volumes started in 3Q95. The agreement is good through the end of 1997.

¥ AMD announced in mid-1994 that SGS-Thomson Microelectronics would become a second source for all of AMD's 5-volt-only flash memory devices.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-27 AMI North American Company Profiles

AMERICAN MICROSYSTEMS (AMI)

American Microsystems, Inc. 2300 Buckskin Road Pocatello, Idaho 83201 Telephone: (208) 233-4690 Fax: (208) 234-6795 Web Site: www.amis.com

IC Manufacturer

Financial History ($M)

1991 1992 1993 1994 1995 Sales 86 135 150 171 221

Employees 1,375 1,685 1,657 1,265 1,265

Company Overview and Strategy

Established in 1966, American Microsystems Inc. (AMI) was a pioneer in the development of application specific ICs (ASICs). Today, the company's products and services range from digital and mixed-signal ASICs, to CMOS foundry services, application-specific standard products (ASSPs), and high-level integrated solutions through multichip modules. AMI currently specializes in producing both digital and mixed-signal systems on a chip and is the number one U.S. manufacturer of mask ROMs.

The company is comprised of three business units and two divisions: the Mixed-Signal Business Unit, the Digital ASIC Business Unit, the Foundry Business Unit, the Standard Products Division, and the Multichip Products Division, which specializes in contract manufacturing solutions utilizing multichip modules. Each of the five units has the responsibility, along with the marketing and engineering resources needed, to sell its respective products and services.

Recently, AMI's sales strategy underwent a significant shift from a primary focus on direct sales to increased reliance on the company's growing international network of manufacturer's representatives, distributors, and design centers. This network markets AMI's cell-based and gate array ASICs as well as its ROMs.

1-28 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles AMI

Multichip Products 1% Other Standard 1% Cell 10% Standard Products 11% Foundry 35% Mixed Signal 14% Gate Array 28%

1995 Sales by Business Segment

AMI's products serve markets such as telecommunications, consumer electronics, computer peripherals, military, industrial, and automotive equipment.

Distributor

2% Other Europe 3% ROW Automotive 2% Japan 6% 5% 2%

Industrial Communications 13% 29% Military 13% EDP Consumer North America 18% 17% 90%

1995 Sales by End-Use Market 1995 Sales by Geographic Region

Management

Gerald "Jerry" E. Homstad President and Chief Executive Officer Harold Blomquist Vice President, Sales Randy Cook Vice President, Multichip Products Division Grant Hulse Vice President, Standard Products Paul Pimentel Vice President, Finance/Purchasing Tom Schiers Vice President, Digital ASICs Dan Schroeder Vice President, Operations Tony Cabiedes Director, Mixed-Signal Al Morrison Director, Foundry Troy Murray Manager, Site Services Marv Yancey Manager, Sub-Micron Program

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-29 AMI North American Company Profiles

Products and Processes

AMI offers the following products and services:

¥ Standard-cell and gate array digital ASICs ¥ Foundry services ¥ Mixed-signal ASIC development services ¥ Contract design and manufacturing ¥ Mask programmable ROMs (16K to 16M density) ¥ Multichip modules ¥ Digital and mixed-signal ASIC design software ¥ Custom packaging

AMI's digital ASIC standard library, which supports both gate arrays and standard cells, contains over 500 cells and operates from 2.5V to 5.5V. Its arrays have up to 464,000 usable gates.

AMI's mixed-signal processes allow the analog voltage to run from Ð5V to +5V or from 0V to 12V, and will accommodate a wide range of functions.

The company's semiconductor products are fabricated using CMOS and NMOS process technologies, with geometries as fine as 0.6µm. In 1996, the company will complete construction of Fab 10 (see section below), which will provide the capability to process devices with 0.35µm feature sizes.

Semiconductor Fabrication Facilities

AMI AMI 2300 Buckskin Road Pocatello, Idaho Pocatello, Idaho 83201 Fab 10 (startup in 4Q96) Cleanroom size: 33,000 square feet (Class 10) Cleanroom size: 40,000 square feet (Class 1) Capacity (wafers/week): 6,500 Capacity (wafers/week): 5,000 Wafer size: 125mm Wafer size: 200mm Processes: CMOS, NMOS Process: CMOS Products: ASICs, ROMs, telecom and datacom ICs, Feature size: 0.35µm-2.0µm MCMs, foundry services Feature sizes: 0.6µm-5.0µm CMOS; 3.0µm-5.0µm NMOS

AMI's facility in the Philippines performs sort and final testing, while assembly work is contracted out.

Key Agreements

¥ AMI has an alliance with WSI Inc. to jointly develop mask-programmable versions of WSI's line of microcontroller peripherals and both companies are separately marketing the complete range of devices. AMI is manufacturing the parts.

1-30 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Anadigics

ANADIGICS

Anadigics, Inc. 35 Technology Drive Warren, New Jersey 07059-5197 Telephone: (908) 668-5000 Fax: (908) 668-5068

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 7 20 29 35 51 Net Income (6) (2) 2 2 7 R&D Expenditures 657912 Capital Expenditures 2 5 9

Employees 115 200 270 320

Company Overview and Strategy

Anadigics was founded in 1985 when it initiated macrocell development. A year later, it completed construction of its wafer fab, and in 1987, started GaAs IC production with the introduction of both MMIC and fiber optic IC products. Today, the company is a leading designer and producer of GaAs ICs for high- volume, high-frequency receiver applications. The company launched its initial public offering in April 1995.

The company had originally relied on defense contracts to survive. However, with lucrative military pacts becoming more of a rarity, Anadigics looked to the commercial and consumer electronics marketplaces to sell its products. Today, Anadigics has established itself as a leading supplier of high-volume, low-cost, high- performance analog GaAs ICs for applications including direct broadcast satellite (DBS) systems, cable television systems, cellular telephones, fiber optic communications, and personal communication systems (PCS).

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-31 Anadigics North American Company Profiles

Engineering Services 4%

Asia-Pacific Fiber Optics Wireless Europe 31% 19% 29% 37%

North Cable TV Direct Broadcast America 21% Systems 32% 27%

1995 Sales by Geographic Region 1995 Sales by End-Use Market

Management

Ron Rosenzweig President and Chief Executive Officer George Gilbert Executive Vice President and Chief Operating Officer Charles Huang, Ph.D. Executive Vice President, Market Research and Business Development John F. Lyons Senior Vice President and Chief Financial Officer Robert Baytuns Vice President, Research and Technology Sheo Khetan Vice President, Manufacturing Javed S. Patel Vice President, Marketing and Sales Phillip Wallace Vice President, Product Development

Products and Processes

Among the company's GaAs IC products are low-noise block converters and tuners for DBS systems, upconverter chips for use in cable TV converters, cellular telephone power amplifiers and receivers, and fiber optic (SONET) transimpedence amplifiers. Anadigics produces all of its ICs in its GaAs MESFET process.

Semiconductor Fabrication Facilities

Anadigics, Inc. 35 Technology Drive Warren, New Jersey 07059-5197 Cleanroom size: 10,000 square feet (Class 10) Capacity (wafers/week): 400 Wafer size: 3in Process: GaAs MESFET Feature size: 0.5µm

1-32 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Analog Devices

ANALOG DEVICES (ADI)

Analog Devices, Inc. One Technology Way P.O. Box 9106 Norwood, Massachusetts 02062-9106 Telephone: (617) 329-4700 Fax: (617) 326-8703 Web Site: www.analog.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends October 31

1991 1992 1993 1994 1995 Sales 538 567 666 773 942 Net Income 8 15 44 74 119 R&D Expenditures 89 88 94 107 134 Capital Expenditures 52 66 67 91 213

Employees 5,200 5,200 5,300 5,400 6,000

Company Overview and Strategy

Analog Devices, Inc. (ADI) was founded in 1965 and is today a leading designer and manufacturer of high- performance linear, mixed-signal, and digital integrated circuits that address a wide range of real-world signal processing applications.

The company's products are typically incorporated by OEMs in equipment, instruments, and systems for a variety of applications, including communications equipment; computers and computer peripherals; engineering, medical, and scientific instruments; factory automation equipment; military/aerospace equipment; high-end consumer electronic products; and automotive equipment.

Computer Other ROW 14% 11% 8% Japan Factory Automation/ 17% North America Military/ Instrumentation 44% Aerospace 42% 14% Europe Communications 28% 22%

1995 Sales by End-Use Market 1995 Sales by Geographic Region

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-33 Analog Devices North American Company Profiles

Analog Devices’ products can be divided into four groups: general purpose, standard-function linear ICs (SLICs), including amplifiers and data converters; special-purpose linear and mixed-signal ICs (SPLICs) and general-purpose digital signal processing ICs (DSP ICs); hard disk drive ICs; and assembled products such as hybrids and multichip modules. Integrated circuits accounted for 92 percent of the company's total revenues in fiscal 1995.

Hard Disk Drive ICs Assembled 4% Products 8%

SPLICs and DSP ICs SLICs 24% 64%

1995 Sales by Product Group

ADI's strategy is to focus on major opportunities for DSPs and SPLICs as its primary sources of revenue growth, while at the same time, continuing its efforts to sell traditional SLIC product lines, which remain its largest cash and profit generators. In addition, the company plans to continue to extend its core technologies to include new technologies, such as RF/IF signal processing for wireless communications applications and surface micromachining for automobile air bag system accelerometers.

Management

Ray Stata Chief Executive Officer Jerald G. Fishman President and Chief Operating Officer J.B. Archinard Vice President and General Manager, Assembled Products Division Ross Brown Vice President, Human Resources Dennis Buss Vice President, Technology Development David D. French Vice President and General Manager, Computer Products Division Russell K. Johnsen Vice President and General Manager, Communications Products Division Rob Marshall Vice President, Worldwide Manufacturing Robert McAdam Vice President and General Manager, Standard Linear Products Division Brian McAloon Vice President, Sales Joseph E. McDonough Vice President, Finance, and Chief Financial Officer Joe Reichbach Vice President, Sales, North America Volkmar Schaldach Vice President, Sales and Marketing, Europe Shozo Sugiguchi Vice President, Sales and Marketing, Japan Goodloe Suttler Vice President, Planning and Quality Improvement Geoffrey R. M. Thomas Vice President and Manufacturing General Manager, ADSC Franklin Weigold Vice President and General Manager, Transportation and Industrial Products Division

1-34 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Analog Devices

Products and Processes

Analog Devices offers high-performance linear, digital, and mixed-signal ICs such as data converters, amplifiers, voltage references and comparators, signal processors and conditioners, application-specific ICs for the consumer, disk drive, telecommunications, and automotive industries, and temperature and accelerometer sensors.

SLICs Analog Devices principal SLIC products are high-performance amplifiers and data converters. Other SLIC products include analog signal processors, voltage references, and comparators. The company continues to expand its SLIC product line to include offerings in areas where it traditionally has had limited focus, primarily interface circuits and power management ICs, and to include a much larger number of products designed to operate from single-supply 3-volt or 5-volt power sources.

SPLICs and DSPs ADI’s SPLICs and DSP ICs, which are collectively referred to as system-level ICs, are multi-function devices that feature high levels of functional integration on a single chip. Most SPLICs are mixed-signal devices and the balance are linear-only devices. The DSP ICs include both digital-only devices and mixed-signal ICs that include a DSP core along with data conversion and analog signal processing circuitry. The company also offers sensors and surface micromachined ICs.

Hard Disk Drive ICs Chips in this category are used in hard disk drives that serve as rotating mass storage devices in equipment such as PCs, workstations, and network servers. These ICs process analog signals from a hard disk drive’s read/write head.

Assembled Products The company’s assembled products consist of hybrids, multichip modules (MCMs), and printed-board modules (primarily I/O modules used in industrial control and factory automation equipment).

In addition to utilizing standard bipolar and CMOS process technologies, ADI employs a number of proprietary processes specifically tailored for use in manufacturing high-performance linear and mixed-signal SLICs and SPLICs.

Semiconductor Fabrication Facilities

Analog Devices meets most of its need for wafers fabricated using linear and mixed-signal processes with company-owned production facilities and uses third-party wafer fabricators for most wafers that can be produced on industry-standard digital processes. Its two principal foundries are Taiwan Semiconductor Manufacturing (TSMC) and Singapore’s Chartered Semiconductor Manufacturing.

During 1995 and early 1996, Analog Devices expanded its relationships with TSMC and Chartered in response to the rapid growth of its systems IC business (see Key Agreements). Together with the current expansions of its own fab facilities, these actions will provide Analog Devices access during 1996 to approximately 2.5 times more digital CMOS capacity than it had available in 1995.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-35 Analog Devices North American Company Profiles

Expansion of company-owned fabs included the installation of its first 150mm wafer line in its Irish fab facility. The new line, completed in fiscal 1995, is currently producing 750 wafers per week, rising to 1,200 per week in 1998, and 2,000 per week in 1999. The company is also upgrading its fab in Wilmington, Massachusetts, to run 150mm wafers, starting in 3Q96.

In early 1996, Analog Devices announced it would establish a wafer fabrication facility in Cambridge, Massachusetts, dedicated to the development and production of the company’s surface micromachined ICs. The fab will be located in a building previously used by Polaroid Corporation as an R&D fab. By 1Q97 the fab is expected to run its first production parts, micromachined accelerometers, which are currently being fabricated in ADI’s Wilmington, Massachusetts, wafer fab.

Analog Devices, Inc. Analog Devices, Inc. Semiconductor Division PMI Division 804 Woburn Street 1500 Space Park Drive Wilmington, Massachusetts 01887 Santa Clara, California 95052 Cleanroom size: 34,000 square feet Capacity (wafers/week): 1,750 Capacity (wafers/week): 2,500 Wafer size: 100mm Wafer size: 100mm (upgrading to 150mm) Processes: CMOS, BiCMOS, bipolar Processes: CMOS, BiCMOS, bipolar Products: Linear ICs Products: Linear ICs, DSPs, ASICs Feature size: 1.5µm Feature sizes: 1.0µm CMOS 1.5µm BiCMOS, bipolar 4.0µm BiCMOS, complementary bipolar

Analog Devices, Inc. Analog Devices, B.V. 610 East Weddell Drive Bay F-1 Sunnyvale, California 94089 Raheen Industrial Estate Cleanroom size: 20,000 square feet Limerick, Ireland Capacity (wafers/week): 3,500 Cleanroom size: 15,000 square feet Wafer size: 150mm Capacity (wafers/week): 5,000 Process: CMOS, bipolar Wafer sizes: 100mm, 150mm Products: Linear ICs Processes: CMOS, BiCMOS (Acquired from Performance Semiconductor in 1995) Products: Linear and mixed-signal ICs, ASICs Feature sizes: 0.6µm, 1.0µm, 2.0µm

Analog Devices has its own test and assembly facilities located in the United States, Ireland, the Philippines, and Taiwan. Expansions of the latter two facilities began in 1995.

1-36 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Analog Devices

Key Agreements

¥ ADI licensed its ADSP-21xx 16-bit digital signal processor core to AMD and Acer Laboratories (Taiwan) in early 1996. AMD will embed the core in communications-related ICs and Acer Labs will use it for future PC telephony and telephone-answering devices.

¥ Analog Devices announced a license agreement with Hitachi in February 1996 for Hitachi’s 16-bit microprocessor H8/300H core. ADI also has the option of licensing Hitachi’s next-generation H8S/2000 core. The core will be used by ADI’s Wireless Communications Division.

¥ Analog Devices expanded its relationship with TSMC in fiscal 1995 to include a series of advance payments to the Taiwanese company totaling $22 million in exchange for a guaranteed amount of 200mm wafer capacity over the period from 1996 to 1999.

¥ The company entered into an additional agreement with Chartered in early 1996, whereby ADI agreed to pay Chartered $20 million for guaranteed access to certain quantities of submicron 200mm wafers through fiscal 2000. Originally in 1995, Analog Devices made an equity investment of $20 million in Chartered Semiconductor in exchange for access to 0.5µm, 200mm wafer capacity during 1996.

¥ In early 1996, Aspec Technology licensed to Analog Devices its high-density ASIC architectures. The agreement includes Aspec’s family of embedded array and standard cell architectures, as well as associated design tools.

¥ Analog devices entered an agreement with Noise Cancellation Technologies Inc. (NCT) to provide design and foundry services for NCT's first line of custom chipsets.

¥ Analog Devices is working with DSP Group to provide DSP Group's TrueSpeech voice compression technology on ADI's digital signal processors.

¥ Analog Devices has an alliance with IBM in the joint design, production, and marketing of mixed-signal and RF ICs based on IBM's silicon-germanium (SiGe) process technology.

¥ Analog Devices is developing surface micromachined accelerometers with Delco Electronics and Martin- Marietta for both defense and commercial applications.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-37 Array Microsystems North American Company Profiles

ARRAY MICROSYSTEMS

Array Microsystems, Inc. 1420 Quail Lake Loop Colorado Springs, Colorado 80906 Telephone: (719) 540-7900 Fax: (719) 540-7950

Fabless IC Supplier

Employees 38

Company Overview and Strategy

Array Microsystems, founded in 1990, designs, develops, and markets high-performance digital signal processing (DSP) products with a focus on video compression technologies and system level designs for multimedia applications. Array's mission is to become the leading supplier of optimum performance, low- cost digital motion video chipset solutions for consumer and professional markets.

Array is a privately held company that began operations with assets, personnel resources, products, and technology developed from 1984 to 1989 by Honeywell Signal Processing Technologies. Presently about 80 percent of the firm’s business comes from military-type customers.

Management

Surendar S. Magar, Ph.D. President and Chief Executive Officer Tom Kopet Vice President, Systems Engineering E. Flint Seaton Vice President and Chief Financial Officer Shannon Shen, Ph.D. Vice President, IC Technology David W. Still Vice President, IC Engineering Paul Vroomen Vice President, Marketing and Sales

Products and Processes

Array Microsystems has developed a complete line of processor and controller ICs, SRAM memory modules, software simulators, and processor boards. The company's first product family, the a66, includes proprietary VLSI chipsets, development tools, and array processor boards that set industry performance standards for frequency domain processing. Array's two-chip video compression chipset, based on unique vector data flow architecture, forms the core of the VideoFlow product family. One of the chips is called an image compression coprocessor (ICC) and the other a motion estimation coprocessor (MEC).

1-38 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Array Microsystems

Semiconductor Fabrication Facilities

Array Microsystems is a fabless IC supplier. The company's devices are produced by other companies, including Samsung and Atmel.

Key Agreements

¥ Array Microsystems signed a technology development pact with Samsung that provided Array with a strong foundry partnership. The two companies codeveloped the initial VideoFlow video compression technology. The deal provides Array with access to Samsung's advanced 0.5µm and 0.35µm CMOS fab capacity for the manufacture of its products. In 1993, Samsung secured a 20 percent equity ownership position in Array Microsystems, and in mid-1995, Samsung increased its stake to 37 percent with an additional $4 million investment.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-39 Atmel North American Company Profiles

ATMEL

Atmel Corporation 2125 O'Nel Drive San Jose, California 95131 Telephone: (408) 441-0311 Fax: (408) 436-4200 Web Site: www.atmel.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 120 140 222 375 634 Net Income 10 14 30 59 114 R&D Expenditures 15 18 26 43 70 Capital Expenditures 7 14 74 183 270

Employees 875 998 1,250 1,900 2,900

Company Overview and Strategy

Atmel designs, manufactures, and markets a broad array of high-performance CMOS memory, logic, and analog integrated circuits. Founded in 1984, the company serves the manufacturers of communications equipment, computers, and computer peripherals as well as producers of instrumentation, consumer, automotive, military, and industrial equipment. Much of Atmel's ICs are based on its proprietary non-volatile memory technology. The company's name was derived from Advanced technology: memory and logic.

Analog MCU 3% 4%

Japan ASIC Flash Memory 15% 14% 28% Asia North 16% America 44% EEPROM EPROM/ Europe 24% Other Memory 25% 27%

1995 Sales by Device Type 1995 Sales by Geographic Region

1-40 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Atmel

Atmel is a leading supplier of EPROM, EEPROM, and flash memory components. Nevertheless, the company is shifting its focus away from being primarily a memory company toward having a balanced portfolio of memory and logic products. Still, the company hopes to continue expanding its share of the memory market even as logic products take over a larger share of its production capacity.

Atmel has made several acquisitions over the past few years in support of its core product lines, nonvolatile memory and logic ICs. The company bought out FPGA supplier Concurrent Logic in 1993, acquired Seeq Technology's EEPROM product line in early 1994, and made a minority investment in SRAM producer Paradigm Technology in 1995 in return for certain SRAM product rights.

The company’s most substantial acquisition came in April 1995, when it purchased a majority interest (75 percent) in the French IC manufacturer ES2. By the end of 1995, Atmel increased its ownership of the company to more than 90 percent and renamed it Atmel-ES2. Atmel is expanding Atmel-ES2’s existing fab facility and is constructing a new 0.35µm, 200mm wafer fab at the site that will be operational by 1997.

Management

George Perlegos President and Chief Executive Officer Gust Perlegos Vice President and General Manager Tsung-Ching Wu Vice President, Technology Ralph Bohannon Vice President, Manufacturing Kris Chellam Vice President, Finance and Administration, and Chief Financial Officer Chih Jen Vice President, Asian Operations B. Jeffrey Katz Vice President, Marketing Krish Panu Vice President, North American Sales Jack Peckham Vice President and General Manager, ASIC Operations Bernard Pruniaux Vice President, Atmel-ES2 Operations Mikes Sisois Vice President, Planning and Information Systems Graham Turner Vice President, European Sales

Products and Processes

Atmel's products are outlined below.

NonVolatile Memory ICs • EPROMs—Standard, high-speed, and low-voltage parts ranging in density from 256K to 8M. • EEPROMs—Serial-interface parts ranging in density from 1K to 64K. —Parallel-interface parts ranging in density from 4K to 4M. • Flash memories—Single voltage supply (5V or 2.7V) parts ranging in density from 256K to 4M.

Programmable Logic Devices and Field Programmable Gate Arrays • PLDs—Generic PAL-type ICs including fast, low-power, and 3V flash-based versions of the standard 22V10, 16V8, and 20V8. —Complex PLDs with densities to 5,000 gates. • FPGAs—SRAM-based devices with 2,000 to 20,000 usable gates and very low power. Partial or full reconfiguration, in system, during normal operation.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-41 Atmel North American Company Profiles

ASIC Devices • Gate arrays—High speed with up to 1.2 million routable gates. • RFID ASICs—Analog, digital, and memory on a single-chip ASIC. • Cell based ASICs—Mixed-technology.

Other Products • Microcontrollers—Combine Intel's 80C51 core logic with 1K, 2K, 4K or 8K of Atmel's flash memory. • Standard logic devices—Multimedia system, controllers/chipsets. ¥ Flash memory cards. ¥ Spread spectrum cordless phone chipset.

Atmel uses proprietary CMOS and BiCMOS technology for the processing of its chips. Most products are produced with 0.8µm and 0.6µm line widths. The company's newest Colorado Springs fab facility is capable of producing ICs with 0.4µm feature sizes.

Semiconductor Fabrication Facilities

Atmel Corporation Atmel Corporation 1150 East Cheyenne Mountain Boulevard 1150 East Cheyenne Mountain Boulevard Colorado Springs, Colorado 80906 Colorado Springs, Colorado 80906 Telephone: (719) 567-3300 Telephone: (719) 567-3300 Fab 3 Fab 5 Cleanroom size: 33,900 square feet (Class 10) Cleanroom size: 43,000 square feet (Class 1) Capacity (wafers/week): 5,000 Capacity (wafers/week): 7,000 Wafer size: 150mm Wafer size: 150mm Processes: CMOS, BiCMOS Process: CMOS Products: EEPROMs, EPROMs, flash memories, Products: EEPROMs, flash memories, EPROMs PLDs, FPGAs, ASICs, MCUs, linear ICs Feature size: 0.4µm Feature sizes: 0.6µm, 0.8µm, 1.0µm

Atmel-ES2 Atmel-ES2 Zone Industrielle Zone Industrielle 13106 Rousset Cedex 13106 Rousset Cedex France France Telephone: (33) (42) 33-40-0 Telephone: (33) (42) 33-40-0 Fab 6 Fab 7 Cleanroom size: 15,000 square feet Cleanroom size: 60,000 square feet Capacity (wafers/week): 1,500 Capacity (wafers/week): 5,000 Wafer size: 150mm Wafer size: 200mm Process: CMOS Process: CMOS Products: Cell-based ASICs, MCUs Products: Cell-based ASICs, MCUs Feature sizes: 0.6µm, 0.8µm, 1.0µm Feature sizes: 0.35µm, 0.6µm (Scheduled to start production by the end of 1996)

Atmel maintains a facility for IC test and qualification at its headquarters in San Jose and assembly work is performed offshore.

1-42 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Atmel

Key Agreements

¥ Atmel and Paradigm Technology formed an alliance in May 1995 concerning Paradigm's SRAM products. Atmel provides manufacturing capacity for Paradigm's SRAMs in exchange for product rights. Atmel also purchased approximately 19 percent of Paradigm. The companies are developing new-generation SRAMs with speeds below 8ns.

¥ Atmel-ES2 licensed from Advanced RISC Machines in mid-1995, the ARM7DMI 32-bit RISC processor core and associated software tools.

¥ Atmel has a cross-licensing and product exchange agreement with Philips Semiconductors covering several of each company's proprietary PLDs.

¥ Atmel established an agreement with Wireless Logic Inc. of Hong Kong in 1994 that calls for the codevelopment and joint marketing of special-purpose DSP and microcontroller chipsets for the spread- spectrum wireless communications market.

¥ IBM Microelectronics licensed Atmel's FPGA technology in 1993. IBM also has rights to second source versions of Atmel FPGAs (to date IBM has not exercised that right). Both companies will codevelop new FPGAs.

¥ Fuji Film Microdevices and Atmel are collaborating in the development of flash memory-based products such as ATA-interface memory cards.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-43 Austin Semiconductor North American Company Profiles

AUSTIN SEMICONDUCTOR

Austin Semiconductor, Inc. 8701 Cross Park Drive Austin, Texas 78754-4566 Telephone: (512) 339-1188 Fax: (512) 835-8358

Fabless IC Supplier

Financial History ($M)

1993 1994 1995 Sales 7 14 19

Employees 60 110 114

Company Overview and Strategy

Austin Semiconductor, Inc. (ASI) was founded in 1988 to supply high-reliability semiconductors and microcircuit devices to the military and aerospace industries. In 1993, privately-held ASI acquired the Micron Semiconductor Military Products Group, and now supplies standard memory chips to those industries.

The company's business is currently divided into two distinct groups: a custom product line and a standard product line (consisting primarily of the former Micron products). At the end of 1995, about 70 percent of ASI's business was in memory products, with the balance in custom products.

Management

Roger C. Minard President and Chief Executive Officer H. Donald Ludwig Vice President and General Manager, Operations Marty Lanning Vice President, Marketing Ed Walker Director, Sales

Products and Processes

ASI's standard IC products include: 64K to 16M DRAMs, 64K to 4M SRAMs, 1M VRAMs, and SCSI interface processors. ASI also has the right to introduce military-grade versions of Micron's new products as they are brought out.

ASI's custom product capabilities include testing and packaging of a wide array of custom memory products, interface devices, and analog/digital communications products. ASI is also capable of manufacturing devices using a silicon-on-sapphire (SOS) process. In 1996, DRAMs, SRAMs, EEPROMs, and flash memories will be available.

1-44 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Austin Semiconductor

Semiconductor Fabrication Facilities

ASI is a fabless IC supplier, but maintains a Class 100 assembly, packaging, and test facility on site. As part of its purchase of Micron's military products group, ASI receives wafers from Micron. The firm also uses other major manufacturers for the fabrication of its product wafers.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-45 Benchmarq North American Company Profiles

BENCHMARQ MICROELECTRONICS

Benchmarq Microelectronics, Inc. 17919 Waterview Parkway Dallas, Texas 75252 Telephone: (214) 437-9195 Fax: (214) 437-9198 Web Site: www.benchmarq.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1994 1995 Sales 23 29 Net Income 2 4

Employees 180

Company Overview and Strategy

Benchmarq Microelectronics, founded in 1989, has a worldwide presence in the power-sensitive and portable electronic systems marketplace. It provides integrated IC and module solutions that address real- world problems in managing battery-operated, low-power, and power-sensitive equipment. Benchmarq's products are adopted by companies producing PCs, cellular phones, telecommunications equipment, and portable electronics systems.

In 1995, international sales accounted for approximately 50 percent of total sales.

Management

Derrell Coker President and Chief Executive Officer Will Davies Vice President, Manufacturing Operations Reginald McHone Vice President, Finance and Administration, and Chief Financial Officer Wallace E. Matthews Vice President, Technology Jim Vernon Vice President, Sales David Freeman Director, System Product Development David Heacock Director, Marketing and Corporate Communications Loren Reifsteck Director, Quality Technology and Assurance

1-46 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Benchmarq

Products and Processes

Benchmarq's product portfolio consists of CMOS and BiCMOS mixed-signal circuits. The focus is on low- power, battery-backed ICs and ICs for battery management. Geometries on its devices range from 0.8µm to 1.2µm.

Benchmarq’s IC product families include: ¥ Battery management ICs and modules that provide fast charge control, sophisticated battery conditioning, and “gas gauge” capacity monitoring of many different types of battery-operated systems. ¥ Real-time clock ICs and modules, which provide highly integrated clock/calendar solutions for microcomputer-based designs. The RTCs are available with 3V or 5V operation. ¥ Nonvolatile SRAM (nvSRAM) and PSRAM (nvPSRAM) ICs in densities ranging from 64K to 16M. ¥ Nonvolatile controller ICs and modules that provide power monitoring, write protection, and supply switching to convert standard SRAM and a battery backup into a reliable, predictable nonvolatile memory.

Semiconductor Fabrication Facilities

The company is fabless, relying instead on domestic and overseas foundries for wafer fabrication. Burn-in and test of ICs and value-added assembly of hybrid circuits is performed at the company's headquarters in Texas.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-47 Bit North American Company Profiles

BIT

Bit Incorporated 9400 Southwest Gemini Drive Beaverton, Oregon 97008-7193 Telephone: (503) 520-1800 Fax: (503) 520-1700

Fabless IC Supplier

Employees 30

Company Overview and Strategy

Bit Incorporated was originally established as Bipolar Integrated Technology, Inc. in 1983. As Bipolar Integrated Technology, the company developed, manufactured, and marketed VLSI products for the high- performance computing and communications markets using proprietary bipolar ECL technology. However, financial troubles forced the company to shut down its wafer fab in February 1993 and begin reforming itself as a designer and supplier of specialized ICs for emerging networking and data communications markets.

In early 1995, the company began conducting business under its current name. Bit is currently developing IC solutions for ATM and other LAN technologies. It is also completing product development and technology licensing deals with other semiconductor firms, which are expected to introduce ATM chips that have been designed by Bit.

Management

Steven S. Hubbard President and Chief Executive Officer Louis Pengue Vice President, Marketing and Sales

Products and Processes

Bit's first product in a line of LAN communications ICs is the BN2002, a single-chip solution for an eight-port Ethernet Switch.

1-48 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Brooktree

BROOKTREE

Brooktree Corporation 9868 Scranton Road San Diego, California 92121-3707 Telephone: (619) 452-7580 Fax: (619) 452-1249 Web Site: www.brooktree.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends September 30

1991 1992 1993 1994 1995 Sales 83 92 111 109 138 Net Income 10 13 28 2 13 R&D Expenditures 18 19 23 26 28

Employees 536 540 568 578 607

Company Overview and Strategy

Founded in 1981, Brooktree designs, develops, and markets high-performance digital and mixed-signal integrated circuits for computer graphics, imaging, multimedia, communications, and automated test equipment (ATE) applications.

In the past, Brooktree’s revenues had been heavily dependent on its graphics product line. However, since 1992, Brooktree has been busy transitioning its business focus toward highly integrated devices for the communications, imaging, and multimedia markets. As a percent of total revenues, Brooktree’s graphics business shrank to 36 percent in 1995 from 87 percent in fiscal 1992. Meanwhile, its communications business grew from six percent to 26 percent during those years.

Multimedia 3%

ATE 15% Graphics Imaging 36% 18% Communications 28%

1995 Sales by End-Use Market

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-49 Brooktree North American Company Profiles

With its newer communications and multimedia product lines, the company believes it is well positioned to capitalize on the convergence of the business, entertainment, and computer industries.

Sales to foreign customers accounted for 52 percent of the company’s total revenues in fiscal 1995.

Management

James A. Bixby President and Chief Executive Officer Robert W. Zabaronick Senior Vice President, Human Resources Anthony C. D'Augustine Vice President, Graphics and Imaging Strategic Business Unit Phillip L. DenAdel Vice President, Operations Pete R. Fowler Vice President, Worldwide Sales and Corporate Marketing David C. Gelvin Vice President, Multimedia Strategic Business Unit Edward P. Holtaway Vice President, Corporate Quality Stewart Kelly Vice President, Communications Strategic Business Unit David H. Russian Vice President, Finance and Chief Financial Officer Jeffrey R. Teza Vice President, Technology and Business Development David G. Matty Director, Research and Development

Products and Processes

Brooktree’s product offering consists of digital and mixed-signal VLSI circuits that address four target markets: computer graphics and imaging, communications, multimedia, and ATE.

Graphics and Imaging Products The company’s principal graphics products are RAMDACs, which are an integration of static random access memory (RAM), logic, and digital-to-analog converter (DAC) technology on a single integrated circuit, and VideoDACs, which are stand-alone video-speed DACs. Brooktree’s graphics chips service applications ranging from relatively low-resolution laptop computers to ultra-high resolution workstations. Several of the company’s multimedia devices integrate RAMDAC technology.

Brooktree’s family of mixed-signal imaging ICs includes decoders for use in a range of applications such as video capture in desktop and portable PCs, video conferencing, and video editing/authoring platforms, and encoders for use in the emerging digital video consumer market, which includes digital broadcast set- top boxes, CD interactive, and karaoke players. The company believes it holds approximately one-third of the market share in the imaging IC business.

Communications Products Brooktree's communications products target applications for high-speed voice, data, and video transmission within wide-area network (WAN), metropolitan-area network (MAN), and local-area network (LAN) environments. Its current product lines for these applications include T1/E1 and T3/E3 framer/controllers, protocol controllers, HDSL (high-bit-rate digital subscriber line) devices, ATM (asynchronous transfer mode) devices, ADPCM (adaptive differential pulse code modulation) devices, and SMDS (switched multimegabit digital service) devices.

1-50 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Brooktree

Multimedia Products In October 1994, Brooktree announced its first multimedia product, the BtV MediaStream media accelerator, which combines hardware and software to optimize audio, graphics, and full-motion video performance in a wide range of PC applications for the home and office. In the fourth quarter of calendar 1995, Brooktree announced the BtV 3D MediaStream media accelerator as a pin-compatible upgrade for the earlier 2D version. The 3D MediaStream accelerator incorporates such advanced features as perspective correct texture mapping and Z-buffer depth cueing to target the emerging segment of consumer entertainment PCs that feature 3D capabilities. The BtV media accelerators are fully-integrated chipsets consisting of four chips, the MediaStream controller, an audio I/O subsystem, a videostream decoder, and a packetized data DAC (PACDAC).

To complement the industry-standard synthesis of the BtV audio stream, Brooktree also provides a software-based wavetable synthesis solution, called WaveStream.

ATE Products In 1994, Brooktree announced that its long-term strategic plans would not include the development of new ATE products. The company discontinued the development of future ATE products but continues to market its existing devices for ATE applications.

A significant percentage of Brooktree’s products are currently based on 0.8µm CMOS process technology. New product designs are based on 0.6µm CMOS technology, and the company expects that by mid-1997, all new designs will be at the 0.35µm level. Some of the company’s products, predominantly in its ATE and certain graphics product lines, utilize bipolar technology.

Semiconductor Fabrication Facilities

Brooktree's advanced mixed-signal technology can be manufactured using standard semiconductor wafer fabrication and device assembly processes. The company currently relies on outside sources for the fabrication of its CMOS and bipolar wafers and the assembly of its ICs, while design and test are handled internally.

To help ensure continued wafer supply, Brooktree strengthened its manufacturing alliances in 1994 and 1995. The company announced long-term supply arrangements with Chartered Semiconductor Manufacturing of Singapore, Seiko Epson of Japan, and TSMC of Taiwan (see Key Agreements).

Brooktree was notified in 1994 by its primary suppliers of bipolar wafers that they would be discontinuing the manufacture of such wafers. The company was given last-time-buy notices that were good through the middle of 1996.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-51 Brooktree North American Company Profiles

Key Agreements

¥ In October 1995, Brooktree entered two agreements with Taiwan’s TSMC which grant the company options to obtain an additional supply of wafers through the year 2000. Brooktree has said it may make prepayments to TSMC in 1996 and 1997 totaling about $59 million, in return for discounts on future 200mm wafer purchases.

¥ In August 1994, Brooktree agreed to pay Seiko Epson $47 million to assist the Japanese company in the expansion of its advanced submicron wafer fab. In consideration for the payment, Seiko agreed to provide Brooktree a guaranteed minimum supply of wafers.

¥ Brooktree invested approximately $11 million in Chartered Semiconductor in February 1994 to obtain a minority equity position in Chartered and receive guaranteed foundry capacity for 0.5µm, 200mm wafers.

¥ Brooktree linked up with DEC in 1994 to jointly develop and market a family of graphics chips for the high- performance desktop and workstation markets.

1-52 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Burr-Brown

BURR-BROWN

Burr-Brown Corporation P.O. Box 11400 Tucson, Arizona 85734-1400 Telephone: (602) 746-1111 Fax: (602) 889-1510 Web Site: www.burr-brown.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 179 163 169 194 269 Net Income (10) 1 3 6 29 R&D Expenditures 20 18 20 22 26 Capital Expenditures 12 5 7 12 18

Employees 1,649 1,566 1,547 1,825 1,900

Company Overview and Strategy

Founded in 1956, Burr-Brown Corporation is primarily engaged in the design, manufacture, and marketing of a broad line of proprietary standard high-performance analog and mixed-signal ICs used in the processing of electronic signals. The company also integrates its ICs into system components including PC data acquisition and signal processing products, data collection systems, and data entry terminals. Applications that Burr-Brown's products target include: industrial control and automation; precision test and measurement equipment; telecommunications systems; medical and scientific instrumentation; medical imaging; digital audio and multimedia; electronic musical and professional audio equipment; and computers and peripherals.

Burr-Brown is moving away from its traditional focus on older IC processing technologies—primarily linear bipolar—and instead going in new directions such as CMOS and BiCMOS technologies. The company has also been strategically shifting some of its production to outside foundries, a trend that is expected to continue in order to put a cap on internal production costs.

In early 1996, Burr-Brown sold its interest in Power Convertibles Corporation (PCC). PCC formerly a majority- owned affiliate of Burr-Brown, manufactures DC-to-DC converters and battery charges used in cellular telephone applications. Burr-Brown will continue to focus on its analog and mixed-signal IC business.

In 1995, Burr-Brown set new directions for its foreign operations. Burr-Brown’s Japanese subsidiary is now concentrating exclusively on the digital audio market, while the company’s Livingston Scotland operations have been re-directed from subcontract manufacturing to in-house product R&D.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-53 Burr-Brown North American Company Profiles

Power Conversion Products* 10% Other 6%

Analog ICs 42% Europe Data Conversion ICs 29% North America 42% 36%

Asia 35% *Sold its affiliate that produced these products in early 1996. 1995 Sales by Product Type 1995 Sales by Geographic Region

PC/Multimedia 6%

Telecom 12% Consumer* 29% Test and Instrumentation 24% Industrial 29%

*Digital Audio and Video 1995 Sales by Application

Management

Syrus P. Madavi President and Chief Executive Officer John L. Carter Executive Vice President and Chief Financial Officer Michael M. Pawlik Vice President, Marketing Paul Prazak Vice President, Data Conversion Division Robert E. Reynolds Vice President, Operations Bryan Rooney Vice President, Worldwide Sales R. Mark Stitt Vice President, Linear Division Charles Lewis General Manager, Scotland Division Toshiyuki Yamasaki President, Japan Operations

Products and Processes

Burr-Brown's product portfolio includes operational, instrumentation, power, and isolation amplifiers, optoelectronic ICs, digital audio devices, digital-to-analog and analog-to-digital converters, data communications products, LAN products, microterminals, design and development software, and board-level microcomputer subsystems. The company’s products are manufactured using processes that include bipolar, complementary bipolar, CMOS, and BiCMOS.

1-54 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Burr-Brown

The following describes the various processes that Burr-Brown utilizes in the manufacture of its ICs.

40 Volt Bipolar Process: This is a high-voltage (40V) bipolar process (±15V or 36V power supplies) used to make high-voltage operational and instrumentation amplifiers. High precision in these products is made possible by the capability of ion implanted JFETs and trimmable resistors. Other typical products made from this process are universal active filters, isolation amplifiers, and high-voltage power amplifiers.

20 Volt Bipolar Process: This is a lower voltage (20V) bipolar process especially suited for data acquisition and PCM components. These are faster circuits utilizing smaller devices with lower Rc. Trimmable resistors allow high precision products.

Dielectrically Isolated Bipolar Process: This is a dielectrically isolated high-voltage bipolar (40V) process used for low noise, high precision, and low drift. Very high-performance amplifiers are built using this process where the noise and drift characteristics are important, especially in the medical equipment markets that it serves.

Complementary Bipolar Dielectrically Isolated Process: This is a dielectrically isolated process with complementary NPN and PNP bipolar transistors. It is used to manufacture high-voltage operational amplifiers, voltage-to-frequency converters, and sample/hold circuits.

CMOS Double-Level Metal Poly-Poly Process: This is a 3.0µm double-level metal CMOS process which also makes use of parasitic bipolar devices. This is a ±5V process with compatible thin film resistors and very high quality poly-poly capacitors. It produces high density, high precision (16-bit and 18-bit) single and dual analog-to-digital and digital-to-analog converters.

BiCMOS Process: This double-poly, double-metal 3.0µm process is optimized for analog circuitry including critical thin-film resistor capability. The process is primarily used for data conversion products.

Processes not available internally are sourced from various foundries, including Mitel Semiconductor, Oki, Hualon Microelectronics, and Taiwan Semiconductor Manufacturing Co. (TSMC). Such processes include 2.0µm, 1.2µm, and 0.6µm BiCMOS and CMOS processes, and a very high-frequency bipolar process for products such as video amplifiers.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-55 Burr-Brown North American Company Profiles

Semiconductor Fabrication Facilities

Burr-Brown Corporation 6730 South Tucson Boulevard Tucson, Arizona 85706 Cleanroom size: 30,000 square feet Capacity (wafer/week): 4,200 Wafer size: 100mm (Planning conversion to 150mm wafers) Processes: CMOS, Bipolar, BiCMOS Products: Digital and linear ICs, monolithic and hybrid assembly Feature size: 2.0µm-3.0µm

Burr-Brown has IC assembly facilities in Tucson and Scotland. The company also incorporated multichip module (MCM) assembly capability in its Tucson facility in 1995.

Key Agreements

¥ In 1995, Burr-Brown signed a foundry agreement with TSMC. TSMC will produce advanced products using 0.6µm technology for Burr-Brown.

¥ Burr-Brown is jointly developing with Oki 20-bit BiCMOS A/D and D/A converter chips for business digital audio equipment.

1-56 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles C-Cube Microsystems

C-CUBE MICROSYSTEMS

C-Cube Microsystems Inc. 1778 McCarthy Boulevard Milpitas, California 95035 Telephone: (408) 944-6300 Fax: (408) 944-6314 Web Site: www.c-cube.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 6 14 24 45 124 Net Income (8) (5) (1) 5 25 R&D Expenditures 6 7 7 10 14

Employees 112 140 165

Company Overview and Strategy

Founded in 1988, C-Cube Microsystems is a provider of highly integrated, standards-based, programmable digital video and still image compression products and systems. The company's innovative encoder, decoder, and codec products bring full motion video and still image capabilities to a broad range of end- user products in the consumer electronics, computer, and communications markets. Such products include video CD players, interactive game equipment, and computer add-in cards that allow full-motion video, desktop video conferencing systems, interactive digital cable TV systems, and direct broadcast satellite (DBS) systems.

In 1995, C-Cube acquired Media Computer Technologies (MCT), a supplier of PC-based digital video processing and video-windowing technology. As a subsidiary of C-Cube, MCT will be responsible for developing ASICs, reference designs, application software, and contributing to development projects of C- Cube’s PC customers.

U.S. 30%

International 70%

1995 Sales by Geographic Region

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-57 C-Cube Microsystems North American Company Profiles

Management

Alexandre A. Balanski, Ph.D. President and Chief Executive Officer Mark K. Allen Vice President, Operations James G. Burke Vice President, Finance and Administration, and Chief Financial Officer Brian T. Conners Vice President, Sales Alex Daly Vice President, Marketing Richard Foreman Vice President and Chief Information Officer Sai-Wai Fu Vice President, Hardware Engineering Didier Le Gall, Ph.D. Vice President, Research and Development Richard S. Rasmussen Vice President and General Manager, JPEG Division Senjeev Renjen, Ph.D. Vice President, Decoder Engineering

Products and Processes

C-Cube's single-chip and chipset products include: MPEG 1 video and audio/video encoders and decoders for consumer electronics applications; highly integrated MPEG 1 video and audio/video decoders, JPEG codecs, multistandard codecs, video conferencing codecs, and multimedia video processors for computer applications; and MPEG 2 video encoders and decoders and MPEG 2 transport demultiplexers for communications applications. The company also markets a line of design example boards and demonstration systems products.

C-Cube’s IC products are currently manufactured using two- or three-layer metal CMOS process technology with 0.8µm, 0.65µm, and 0.5µm feature sizes. New products are being designed with 0.35µm technology.

Semiconductor Fab Facilities

C-Cube does not manufacture its own ICs; it uses independent foundries. The company’s principal IC foundry is Texas Instruments. Other foundry partners include Matsushita, Yamaha, TSMC, and Samsung. AMD is also a foundry partner, but it is not presently manufacturing products for C-Cube. Assembly, test, and packaging of its devices is also subcontracted to third parties.

Key Agreements

¥ In October 1995, C-Cube licensed Sun Microsystems’ MicroSparc processor core technology for use in a multifunction chip, to be introduced in 1997, intended for digital compression and decompression.

¥ C-Cube entered into an agreement with Matsushita, JVC, and Sharp to jointly develop MPEG 1 and MPEG 2 decoders. Matsushita also provides C-Cube with preferential access to its 0.5µm and 0.35µm manufacturing processes. In return, Matsushita has the rights to use and sell a limited amount of the decoders.

¥ C-Cube has an agreement with TI under which TI provides C-Cube with foundry services in exchange for access to its core technology for use in creating derivative products. In addition, C-Cube has access to TI’s MPEG audio decoding technology on a reciprocal basis. C-Cube has a similar agreement with AMD.

1-58 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles California Micro Devices

CALIFORNIA MICRO DEVICES (CMD)

California Micro Devices Corporation 215 Topaz Street Milpitas, California 95035-5430 Telephone: (408) 263-3214 Fax: (408) 942-9505

IC Manufacturer

Financial History* ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 22 30 27 36 40 Net Income (0.3) 1 (7) (31) 5 R&D Expenditures 24343

Employees 204 247 273 229 240

*Financial history has been adjusted to reflect a change in fiscal year from ending in June to ending in March.

Company Overview and Strategy

Founded in 1980, California Micro Devices (CMD) is a designer, manufacturer, and marketer of integrated passive electronic component (IPECª) products and analog and mixed-signal integrated circuits. The company's IPECs, built using its silicon-based thin film materials and process technology, integrate multiple passive elements onto a single integrated circuit. They address resistor, resistor network, and capacitor applications in computers and communications equipment. The company's analog and mixed-signal ICs are designed primarily for telecommunications applications.

Recently, the company’s product mix has shifted toward thin film products, which accounted for 64 percent of sales in 1995. The company is also developing a new line of products referred to as P/Active circuits. This new product line will combine CMD’s thin film technology with active semiconductor components and techniques to create enhanced passive networks called applications specific passive networks (ASPNs).

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-59 California Micro Devices North American Company Profiles

Military Auto 2% Other 2% 4% Medical

4% Instruments 6% International PCs/Peripherals 33% Workstations 36% 16% North America Communications 67% 30%

1995 Sales by End-Use Market 1995 Sales by Region

Management

Jeffrey C. Kalb President and Chief Executive Officer Bob Filiant Vice President, Worldwide Sales P.R. "Hari" Hariharan, Ph.D. Vice President, Product Development Richard W. Helfrich Vice President, Sales and Marketing Rao R. Penumarty Vice President and General Manager, Milpitas Operations Basker B. Rao, Ph.D. Vice President and General Manager, Tempe Operations Arieh Schifrin Vice President, Operations John E. Trewin Vice President and Chief Financial Officer

Products and Processes

CMD's thin film products include precision resistors, resistor networks, capacitors, capacitor networks, resistor- capacitor networks, resistor-capacitor-diode networks, and IPEC products.

The company's analog and mixed-signal integrated circuits include data communications and interface devices, as well as telecommunication dual tone multi-frequency (DTMF) receiver and transceiver products. These products are used in personal computers, answering machines, telephones, and switching systems. They are manufactured in 1.25µm through 3.0µm BiCMOS and CMOS processing technologies.

CMD also offers the use of its fabrication facilities as a foundry and test service.

1-60 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles California Micro Devices

Semiconductor Fabrication Facilities

California Micro Devices California Micro Devices Microcircuits Division 215 Topaz Street 2000 West 14th Street Milpitas, California 95035-5430 Tempe, Arizona 85281 Cleanroom size: 10,000 square feet Telephone: (602) 921-6000 Capacity (wafers/week): 750 Cleanroom size: 16,000 square feet (Class 1) Wafer size: 100mm Capacity (wafers/week): 1,000 Products: Thin film discretes Wafer size: 125mm Processes: CMOS (SM/DP, DM/SP, DM/DP); BiCMOS (SM/DP, DM/DP) Products: Linear and mixed-signal ICs, thin film devices, foundry services Feature sizes: 1.25µm-3.0µm CMOS; 1.25µm, 1.5µm BiCMOS

Key Agreements

¥ California Micro Devices has a comprehensive strategic alliance with Hitachi Metals, Ltd. (HML), a subsidiary of Hitachi, Ltd., that involves joint IPEC product development, manufacturing, marketing, and worldwide distribution. Also under the alliance, HML purchased a 10 percent stake in CMD.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-61 Calogic North American Company Profiles

CALOGIC

Calogic Corporation 237 Whitney Place Fremont, California 94539 Telephone: (510) 656-2900 Fax: (510) 651-3025

IC Manufacturer

Employees 105

Company Overview and Strategy

Calogic is a privately held company, founded in 1983. The company offers a line of standard and full custom semiconductor products made using several technologies including CMOS/DMOS and bipolar. Its product line is specifically designed for high-performance applications. The company strives to form relationships with its customers by offering technical expertise from design to processing to final test.

Management

Manny Del Arroz President Charlie Bevivino Director, Sales Brenda Hill Director, Marketing

Products and Processes

Calogic offers bipolar standard products (e.g., switches, multiplexers, and op amps) and CMOS, DMOS, and JFET full custom ICs. Calogic acquired a small signal discrete line from Harris and now offers one of the broadest small signal FET product lines in the industry. In addition, Calogic offers its production facilities as a foundry service.

CRT Related Products : Video Products : CRT driver amplifiers (30MHz to 185MHz) Widebank buffers and amplifiers Pre-amplifiers Buffers

Instrumentation Products : Full Custom and Semicustom Capabilities : Op amps Design, layout, manufacturing, and test References Analog switches

1-62 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Calogic

Discretes : High-speed lateral DMOS FET switch and switch arrays (switching speeds under 1ns) Vertical MOS FET switches JFETs MOSFETs Diodes

Calogic’s process technologies include a dielectrically isolated (DI) complementary bipolar process, a high frequency (1GHz), low-noise bipolar process, and a medium-voltage, medium-frequency, bipolar process for supply voltages up to ±20 volts.

Semiconductor Fabrication Facilities

Calogic Corporation 237 Whitney Place Fremont, California 94539 Cleanroom size: 10,000 square feet Capacity (wafers/week): 900 Wafer size: 100mm Processes: CMOS, DMOS, bipolar Products: ASICs (gate arrays, full custom ICs); peripheral, linear, and logic ICs; discretes Feature sizes: 1.5µm-5.0µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-63 Catalyst North American Company Profiles

CATALYST SEMICONDUCTOR

Catalyst Semiconductor, Inc. 2231 Calle de Luna Santa Clara, California 95054 Telephone: (408) 748-7700 Fax: (408) 980-8209

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 29 33 54 49 60 Net Income (7) (2) (22) 2 n/a R&D Expenditures 75779

Employees 100 90 60 60 65

Company Overview and Strategy

Catalyst Semiconductor, established in 1985, designs, develops, and markets a broad range of nonvolatile memory IC products that have applications in the computer, wireless communications, network, automotive, and instrumentation markets.

The company's strategy is to become a leading supplier of flash memory devices while maintaining its position as a leading supplier of EEPROM products.

Management

C. Michael Powell President and Chief Executive Officer Chris Carstens Vice President, Quality and Reliability Heber Clement Vice President, Operations Irvin Kovalik Vice President, Sales Alan Renninger Vice President, Technology Development Radu Vanco Vice President, Engineering Donald Witmer Vice President, Finance and Administration, and Chief Financial Officer Mike Shamshirian Director, Marketing

1-64 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Catalyst

Products and Processes

Catalyst's family of nonvolatile devices includes flash memories (1M, 2M, and 4M), serial EEPROMs (1K to 16K), parallel EEPROMs (16K to 256K), battery-backed SRAMs, and NVRAMs (i.e., shadow RAMs and devices that combine EEPROM with SRAM). Catalyst also offers a line of BiCMOS data converters and other specialized products such as its application-specific electrically erasable devices (ASEEDsª).

Most of the company's products are designed and manufactured using a 1.2µm CMOS EEPROM process or a 0.7µm flash memory process. Catalyst's 4M flash memory ICs are based on a 0.7µm process and its 16M parts will use a 0.5µm process. The 4M and 16M devices are a result of a joint-development agreement between Catalyst and Oki.

Semiconductor Fabrication Facilities

Through the establishment of long-term licensing agreements, Catalyst has contracts with Oki, Seiko Epson, Chartered Semiconductor, and Newport Wafer-Fab Ltd. (Wales, U.K.) for the fabrication its devices.

Key Agreements

¥ In 1996, Catalyst announced an agreement with United Microelectronics Corp. (UMC). As part of the agreement, UMC will take a 10 percent equity stake in Catalyst and will provide significant wafer foundry capacity. Also, UMC and Catalyst will jointly develop 0.5µm and 0.35µm process technologies, geared for flash memory products. The first 0.5µm flash devices are expected to be available in 4Q96.

¥ In November 1995, Catalyst signed a cross-licensing agreement with Intel. The agreement provides Catalyst with the right to utilize all of Intel’s flash memory patents.

¥ Catalyst signed on Wales, U.K.-based Newport Wafer-Fab Ltd. in May 1995 for the manufacture of its EEPROMs and for process technology development.

¥ Catalyst formed an alliance with Zilog that calls for the joint development of 20M and 40M 2.5-inch solid- state disk drives merging Catalyst's flash memory devices with Zilog's compression and controller technology. The two companies are also developing other devices combining flash and microcontroller technology.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-65 Cherry Semiconductor North American Company Profiles

CHERRY SEMICONDUCTOR

Cherry Semiconductor Corporation 2000 South County Trail East Greenwich, Rhode Island 02818-0031 Telephone: (401) 885-3600 Fax: (401) 885-5786

IC Manufacturer

Financial History ($M), Fiscal Year Ends February 28

1992 1993 1994 1995 1996 Corporate Sales 229 266 275 339 425 Net Income 5 10 11 15 11

Semiconductor Sales 36 45 56 75 99 Net Income 3 5 7 11 5 Capital Expenditures 1 4 7 17 20

Employees 415 450 500 550 975

Company Overview and Strategy

Formed in 1972 as Micro Components Corporation, Cherry Semiconductor originally manufactured linear bipolar ICs with a focus on the photography market. In 1977, MCC was acquired by The Cherry Corporation and renamed Cherry Semiconductor Corporation (CSC). The market orientation of CSC began to include more automotive business as the photo market began to sag. In 1985, the company committed to two major market focuses: automotive and computer. Within these two markets, CSC focused further on four applications areas: dedicated automotive, power supply control, motor control, and memory management (high-performance disk drive circuits). In 3Q95, CSC was reorganized into three business groups: automotive OEM, automotive electronics, and computer and industrial.

1-66 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Cherry Semiconductor

Europe 5%

Telecom 16% Asia-Pacific 14% Computer 16% Automotive 68% United States 81%

1996 Semiconductor Sales 1996 Semiconductor Sales by End-Use Market by Geographic Region

Management

Alfred S. Budnick President, Cherry Semiconductor Andrew F. Durette Executive Vice President Walter E. McMann Vice President, Finance and Administration

Products and Processes

Cherry Semiconductor designs and builds standard linear ICs and semicustom and full-custom ICs (ASICs). The company’s automotive ICs are most often custom designs, while its standard ICs are usually targeted at the computer market.

CSC developed its high-performance PowerSenseª BiCMOS process for automotive circuits. It is a mixed- signal process that allows analog power functions and compact digital logic to be combined on a single chip. It uses 15 masks and has five critical alignments. In addition, CSC has developed a 16-volt BiCMOS process for disk drive applications and a 2.5MHz bipolar process for computer applications. The firm’s bipolar processes feature vertical and lateral PNP transistors, up-down isolation, and low leakage diodes.

Semiconductor Fabrication Facilities

Cherry Semiconductor Corporation 2000 South County Trail East Greenwich, Rhode Island 02818 Cleanroom size: 24,000 square feet Capacity (wafer/week): 2,500 Wafer sizes: 100mm, 150mm Processes: Bipolar, BiCMOS Products: Linear ICs and ASICs Feature size: 1.4µm

Key Agreements

¥ Cherry Semiconductor is working with Motorola to develop ASICs for the automotive industry. The two companies struck their first agreement in the late 1980's.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-67 Chip Express North American Company Profiles

CHIP EXPRESS

Chip Express Corporation 2903 Bunker Hill Lane, Suite 105 Santa Clara, California 95054 Telephone: (408) 988-2445 Fax: (408) 988-2449 Web Site: www.elron.net:80/chipx

Fabless IC Supplier

Financial History ($M)

1994 1995 Sales 10 18

Employees 80 110

Company Overview and Strategy

Chip Express started its operations in 1990 when it was spun out from Elron Electronics Industries Ltd. (an Israeli high technology holding company). The company offers complete time-to-market ASIC solutions featuring three high-performance gate array families. The first product, the laser personalized gate array (LPGA), is used for fast prototyping and emulation of gate arrays. The LPGA can be delivered to the customer in 24 hours. The second product, the OneMask¨ Gate Array is intended for low volume production requirements. OneMask devices can be delivered in one week. Finally, the HARD Array¨ family of products offer cost competitive high-volume gate array production that can be ready to deliver in one month. The company has over ten patents for the laser programming machine, called the QuICk¨ System, the laser personalizing architecture, and other proprietary design tools. Chip Express’ gate array libraries support popular CAE platforms such as Synopsys, Cadence, and Viewlogic.

Management

Zvi Or-Bach President and Chief Executive Officer Howard Brodsy Vice President, Finance Paul Indaco Vice President, Sales Uzi Yoeli Vice President, Research and Development

1-68 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Chip Express

Products and Processes

Chip Express offers ASICs from prototype to production. The company uses CMOS processes with geometries of 1.0µm, 0.8µm, and 0.65µm in double and triple layer metal.

Semiconductor Fabrication Facilities

Chip Express provides prototyping and production services with on-site manufacturing. The company has a 37,000 square foot facility that provides gate array prototyping and low volume production services. The laser-based QuICk System operates in a computer room environment. The QuICk System enables the personalization of one die at a time. Chip Express uses base arrays that are manufactured by international gate array vendors and are compatible with their gate array families. In order to personalize the devices, predefined links are disconnected by the laser. Thus, in a single operation, with 16,000 cuts per second, the QuICk System disconnects the predefined links of multi-layer metal gate arrays. A real time computer and image processing system use the Cut-List to control the automatic laser cutting process. The prototype is personalized in a self-contained Class 100 laminar air flow cell.

The OneMask operation for low volume production operates in a cleanroom environment, processing one wafer at a time, in a single etch step.

Chip Express presently offers arrays of up to 80,000 gates. By the end of 1996, the company will introduce its new module array architecture, the CX2000 family, with up to 225K gates, plus 128K of RAM.

The company has strategic alliances with three wafer foundries: Seiko Epson (Japan), Tower Semiconductor (Israel), and Yamaha (Japan).

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-69 Chips and Technologies North American Company Profiles

CHIPS AND TECHNOLOGIES

Chips and Technologies, Inc. 2950 Zanker Road San Jose, California 95134-2126 Telephone: (408) 894-0600 Fax: (408) 894-2085

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Sales 225 141 98 73 105 Net Income (10) (64) (49) 3 9 R&D Expenditures 53 46 23 12 13

Employees 595 400 220 180 185

Company Overview and Strategy

Founded in 1984, Chips and Technologies (also known as Chips) supplies advanced semiconductor devices to the worldwide personal computer industry. The company has a product portfolio that includes display controllers, graphics accelerators, video devices, communications ICs, and system logic chipsets. These products are built into a wide range of systems from compact portables to high-performance desktop computers.

Chips' system logic chipset business has fallen from representing 87 percent of total revenues in fiscal 1989 to 25 percent in 1995. The focus of Chips is now on fewer, more profitable products, with resources directed toward single chip systems for emerging markets such as graphics controllers for notebook PCs. Future plans are to move beyond graphics, core logic, and I/O to add multimedia products, as well as more communications-related devices.

I/O 10% Logic Asia and Europe 25% 47% North America Graphics 53% 65%

1995 Sales by Device Type 1995 Sales by Geographic Region

1-70 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Chips and Technologies

Management

James F. Stafford President and Chief Executive Officer Morris E. Jones, Jr. Senior Vice President and Chief Technical Officer Keith Angelo Vice President, Marketing Lee J. Barker Vice President, Operations Timothy R. Christofferson Vice President, Finance and Chief Financial Officer Richard E. Christopher Vice President, Sales Scott E. Cutler, Ph.D. Vice President, Software Technology Lawrence A. Roffelsen Vice President, Engineering Tom Erjavac Director, Marketing

Products and Processes

Chips' product line includes CRT and flat-panel graphics controller ICs, graphical user interface (GUI) accelerators, PC video circuits, I/O and peripheral controllers, and system logic chipsets. The company's LCD controllers have been well received by makers of industry-leading products in the laptop, notebook, and sub-notebook industries.

The firm's integrated circuits are built using bipolar, BiCMOS, and CMOS processes with geometries of 1.0µm to 2.0µm.

Semiconductor Fabrication Facilities

Chips and Technologies uses subcontractors for the fabrication and assembly of its semiconductor components. Currently its foundry partners include Chartered Semiconductor, IBM, NEC, Samsung, and TSMC.

Key Agreements

¥ Chips and Technologies signed a production agreement with Chartered Semiconductor. Under the agreement, Chips will make $20 million installments over the next year to Chartered in exchange for guaranteed production capacity support of 200mm wafers through 2000.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-71 Cirrus Logic North American Company Profiles

CIRRUS LOGIC

Cirrus Logic, Inc. 3100 West Warren Avenue Fremont, California 94538-6423 Telephone: (510) 623-8300 Fax: (510) 226-2240 Web Site: www.cirrus.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 218 355 557 889 1,147 Net Income 17 21 45 61 (36) R&D Expenditures 42 73 127 166 239

Employees 973 1,353 1,854 2,331 3,500

Company Overview and Strategy

Cirrus Logic, founded in 1984, is a leading supplier of proprietary integrated circuits and related software for multimedia (graphics, video, audio), wireline and wireless communications, magnetic hard disk and CD-ROM storage, and data acquisition in desktop, portable, and handheld computing systems, as well as in telecommunications and consumer electronics. Cirrus Logic targets emerging high growth markets as well as large existing markets that are undergoing major product or technology transitions.

The primary focus is personal computers, a market which is transforming rapidly as PCs evolve from word processing and spreadsheet tools into high performance communications and multimedia computing platforms. Cirrus Logic is also applying its core technologies to emerging digital wireless communications and digital audio and video consumer markets. Cirrus Logic serves most of the major disk drive manufacturers as well as several multimedia and video conferencing equipment suppliers.

Communications/ Wireless Other 15% 10%

Graphics Mass Storage 60% 15%

1995 Sales by End-Use Market (est)

1-72 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Cirrus Logic

Cirrus Logic has pursued a strategy of developing or acquiring key technologies and systems expertise to provide complete software-rich integrated solutions for its customers. The company has made substantial R&D investments and has completed several technology related acquisitions, including Pixel Semiconductor, Inc. (1991), Crystal Semiconductor Corporation (1991), Acumos Inc. (1992), Pacific Communication Sciences, Inc. (1993), PicoPower Technology, Inc. (1994), the 3D graphics chip technology of Austek Microsystems (1994), and the graphics and disk interface IC businesses of Appian Technology (1994). These efforts have broadened Cirrus Logic's technology base to include mixed-signal design, digital audio, graphics acceleration, modulation/demodulation algorithms, and digital wireless communications.

Until fiscal year 1996, Cirrus Logic was profitable each year since its IPO (1989). However, blaming weak market conditions, a transition to new products, manufacturing difficulties, and an $11.6 million net loss in charges related to the layoff of 455 employees and restructuring within the company, Cirrus Logic’s net income was a negative $36 million during the 1996 fiscal year. As a result of its losses, Cirrus Logic planned to sell or spin off three product lines within its Visual and Systems Interface (VSys) subsidiary and will then re- form VSys into a graphics-only enterprise. Among the divestitures is PicoPower Technology, which was purchased in 1994 but no longer fits with the central direction on the company. Cirrus Logic has pared about 20 other projects across the company as part of an ongoing effort to focus on three main markets: multimedia (2D/3D graphics/video and high-integration audio), communications (high-speed modems for fax, data, and Internet access), and mass storage (both hard disk and CD-ROM).

Approximately 55 percent of Cirrus Logic's revenues come from sales in countries other than the U.S.

Management

Michael L. Hackworth President and Chief Executive Officer Suhas S. Patil Executive Vice President, Products and Technology Michael L. Canning President, Mass Storage Products Company William W.Y. Chu President, Graphics Company James H. Clardy President, Crystal Semiconductor Corporation Robert V. Dickson President, Graphics Company David L. Lyon President, Pacific Communications Sciences, Inc. (PCSI) George N. Alexy Senior Vice President, Marketing William D. Caparelli Senior Vice President, Worldwide Sales Kenyon Mei Senior Vice President and GM, Personal Systems Business Unit C. Sena Reddy Senior Vice President, Manufacturing Sam S. Srinivasan Senior Vice President, Finance and Administration, CFO, Treasurer, Secretary William H. Bennett Vice President, Human Resources Halappa Ravindra Vice President, Research and Development

Products and Processes

Graphics Cirrus Logic offers a broad range of graphics products. The company is a leading supplier of VGA and Super VGA graphics controllers for both CRT and LCD displays. Cirrus also offers GUI accelerators and 3D graphics accelerators. In 1995, it was the first to offer high-performance LCD graphics controllers that integrate 2D graphics and video playback on a single chip.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-73 Cirrus Logic North American Company Profiles

Multimedia Cirrus Logic offers a wide variety of audio and video products through its Crystal Semiconductor and Pixel Semiconductor subsidiaries.

The company is a leading supplier of 16-bit stereo codecs for PCs, using delta sigma technology to provide high quality audio and offering SoundBlaster, AdLib, Yamaha synthesis, and Microsoft business audio compatibility. The company also provides audio decompression and wave-table sound/music synthesis chips for the PC market, and audio products used in consumer products such as digital audio tape and digital compact cassettes, as well as in broadcast and automotive applications.

Through its Pixel Semiconductor subsidiary, the company offers real-time digital video processing products for desktop PCs, video conferencing systems, and workstations. Its most advanced video processors can handle up to four video streams simultaneously.

Wireline Communications Cirrus Logic introduced the industry's first two-chip intelligent fax/data/voice modem in 1992, and offers a more recent three-chip high performance version. The company is also an innovator in providing serial and parallel I/O devices for multi-channel, multi-protocol communications.

Through its Crystal Semiconductor subsidiary, the company is a leading supplier of monolithic T1/E1 line interface circuits, CMOS Ethernet LAN line interface circuits, and infrared (IR) interface circuits.

Its PCSI subsidiary supplies the Clarity series of wide area network system products.

Wireless Communications Cirrus Logic, through its PCSI subsidiary, is a leader in the development of Cellular Digital Packet Data (CDPD) technology, offering base stations and subscriber units. The company also provides chips for digital cordless telephones operating in the 1.9GHz range, and is supplying chipsets for the U.S. IS54 digital cellular telephone market.

Mass Storage Cirrus logic is a leading supplier of chips that perform the key electronics functions contained in advanced disk drives. Controllers are offered for the AT (IDE), PCMCIA, SCSI, and high-speed SCSI2 standards. Cirrus Logic began offering read-write electronics for disk drives in 1993, and was the first supplier to provide PRML data-detection technology in its ICs. The company recently introduced a pair of hard-drive controller chips featuring "ID-less" technology that it claims can add up to 10 percent to the capacity of a hard-disk drive.

Power-Managed System Logic Cirrus Logic's acquisition of PicoPower Technology provided it with advanced power-saving system controllers and core logic chipsets for personal computers and portable and mobile electronics products. Despite the success of PicoPower Technology, it may be spun off or put up for sale during 1996 (see Company Overview and Strategy).

1-74 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Cirrus Logic

Data Acquisition Through its Crystal Semiconductor subsidiary, Cirrus Logic has established a broad line of analog-to- digital converters consisting of general-purpose and low-frequency measurement devices. The family includes more than twenty products used in industrial automation, instrumentation, medical, military, and geophysical applications.

The majority of Cirrus Logic's IC products are manufactured using 0.8µm, double-layer-metal CMOS and 0.6µm, triple-layer-metal CMOS process technologies, although some use other CMOS processes (high and low voltage), while others use BiCMOS or GaAs processes (for RF chips).

Semiconductor Fabrication Facilities

Cirrus Logic currently procures the majority of its wafers from outside wafer suppliers (about ten of them). In 1994, Cirrus Logic made a move to abandon its completely fabless approach by forming a joint venture with IBM to manufacture ICs for both companies at one of IBM's East Fishkill, New York, fab facilities. The venture is operating as a separate company, named MiCRUS (see Key Agreements).

In late 1995, Cirrus Logic announced a program to invest approximately $2 billion over a five-year period to build and develop its manufacturing infrastructure. The program emphasizes both fab ownership and foundry relationships that target 0.35µm and 0.25µm process capabilities.

The initial phase of the program was to commit additional money to the expansion of MiCRUS, and the formation of a new joint venture with Lucent Technologies (formerly AT&T Microelectronics). Slated to begin production in early 1997, the new joint venture will operate within an existing Lucent Technologies wafer fab in Orlando, Florida. The fab will be 40 percent owned by Cirrus Logic and 60 percent by Lucent Technologies. The two firms will equally split the production output, which will focus on 0.35µm and 0.25µm processing on 200mm wafers.

Cirrus Logic also unveiled manufacturing partnerships with UMC and TSMC, as part of its multi-billion dollar manufacturing investment plan. Under a foundry venture agreement with UMC and two other U.S. semiconductor companies, a new company, United Silicon, Inc., will be formed. Production at the new fab is scheduled to commence in 1997. Meanwhile, Cirrus Logic will expand its current relationship with TSMC to include a long-term purchase agreement.

Upon completion of the $2 billion manufacturing program, Cirrus believes that two-thirds of its total wafer requirement will be met from fabs in which it has partial ownership in (i.e., the company will eventually be 30 to 40 percent dependent on foundries for the production of its wafers, versus 100 percent in 1994).

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-75 Cirrus Logic North American Company Profiles

MiCRUS Lucent Technologies/Cirrus Logic Joint Venture 1580 Route 52 9333 South John Young Parkway Hopewell Junction, New York 12533 Orlando, Florida 32819 Telephone: (914) 892-2121 Telephone: (407) 345-6000 Capacity (wafers/week): 5,000 Capacity (wafers/week): 2,500 Wafer size: 200mm Wafer sizes: 200mm Process: CMOS Process: CMOS Products: DRAMs, logic ICs Products: ASICs, MPRs Feature sizes: 0.5µm-0.8µm Feature sizes: 0.35µm, 0.5µm (Joint venture with IBM Microelectronics. (Scheduled to start production in 1997.) See Key Agreements.)

Key Agreements

¥ Cirrus Logic licensed the Rambus high-performance DRAM interface architecture in early 1995. The license gives Cirrus the right to use the Rambus interface in its graphics controllers.

¥ Cirrus Logic is licensed to embed Advanced RISC Machines' ARM processor into its future ICs for communications, computer, consumer, and other applications. Cirrus is involved with Apple Computer in designing next-generation Newton chipsets based on the ARM architecture.

¥ IBM and Cirrus Logic formed a joint manufacturing venture called MiCRUS in 1994. IBM and Cirrus Logic own 52 percent and 48 percent of MiCRUS, respectively. Volume production of logic chips for Cirrus and memory ICs for IBM began in mid-1995. The two companies have said they each will invest $160 million in MiCRUS over the next few years to expand its capacity and capabilities. For the time being, the agreement does not include product and/or technology exchange.

¥ Cirrus Logic's Pixel Semiconductor subsidiary signed a deal with ITT Semiconductors in December 1993 to develop multimedia chips. Introduction of jointly-designed components for digital cable decoder boxes occurred in 1994. The firms will continue a wider exploration of both the video-on-a-PC and digital set-top box markets.

¥ Cirrus Logic's PCSI subsidiary established a strategic alliance with AT&T Microelectronics (now Lucent Technologies) in 1993 to develop a Cellular Digital Packet Data (CDPD) system for cellular networks.

¥ Anticipating a market that is expected to grow rapidly as new 3D titles appear for the PC platform, Cirrus Logic licensed 3DO’s 3D technology to use in its new line of 64-bit graphics accelerators. The chips should be ready for incorporation into customers’ products by the end of 1996.

1-76 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Crosspoint Solutions

CROSSPOINT SOLUTIONS

Crosspoint Solutions, Inc. 694 Tasman Drive Milpitas, California 95035 Telephone: (408) 324-0200 Fax: (408) 324-0123

Fabless IC Supplier

Company Overview and Strategy

With equity funding from ASCII Corporation, Crosspoint Solutions was founded in 1989 to develop a field- programmable replacement for standard gate arrays. A proprietary cell and routing architecture, coupled with a unique interconnect technology, enable Crosspoint to meet the performance and density demands of the mainstream CMOS gate array market. Crosspoint was one of the first companies offering a field- programmable challenge to gate arrays.

Management

Robert N. Blair President and Chief Executive Officer Thomas Chan Vice President, Manufacturing John Daws Vice President and Chief Financial Officer Scott Graham, Ph.D. Vice President, Technology Development Michael Levis Vice President, Business Development and Product Marketing Ian R. Mackintosh Vice President, Engineering

Products and Processes

The gate array granularity and transistor-level interconnect of Crosspoint's FPGA are made possible by the company's unique antifuse technology, for which several patents have been issued. An antifuse is a programmable switch that has a very high impedance initially, but exhibits a low resistance after programming.

Crosspoint's unique antifuse fabrication technique provides antifuse elements with very low capacitance and low "on" resistance. This translates directly to higher operating speed. The programming is permanent and non-volatile, resulting in one-time-programmable (OTP) devices.

In 1Q96, Crosspoint unveiled its CrossFireª family of FPGAs. The devices range from 20K-100K total gates with an expected 60-80 percent being usable.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-77 Crosspoint Solutions North American Company Profiles

Semiconductor Fabrication Facilities

Crosspoint has a long-standing foundry partnership with Hitachi. LG Semicon was added on recently as a foundry partner (see Key Agreements).

Key Agreements

¥ In 1Q96, Crosspoint gave LG Semicon limited licensing, manufacturing, and marketing rights to its CP20K FPGA architecture in exchange for foundry access to LG’s 0.8µm and 0.6µm two- and three-layer metal IC technology.

1-78 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Cypress Semiconductor

CYPRESS SEMICONDUCTOR

Cypress Semiconductor Corporation 3901 North First Street San Jose, California 95134-1599 Telephone: (408) 943-2600 Fax: (408) 943-2796 Web Site: www.cypress.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 287 272 305 406 596 Net Income 34 (21) 8 50 102 R&D Expenditures 72 65 50 53 72 Capital Expenditures 80 32 56 112 195

Employees 1,945 1,529 1,262 1,423 1,859

Company Overview and Strategy

Founded in 1983, Cypress Semiconductor is a designer, developer, and manufacturer of high-performance digital integrated circuits for a variety of markets including networking, military, computers, telecommunications, and instrumentation.

Military/Other 5% Asia-Pacific 6%

Japan Computer Tele- 9% Peripheral communications 17% 29% Europe 19% North Computer America 22% Datacom 66% 27%

1995 Sales by OEM Application 1995 Sales by Geographic Region

Suffering its first revenue decline in 1992, Cypress initiated a restructuring program. From the company's beginning, it had been known for its niche-market strategy of acquiring and managing smaller autonomous businesses. That approach, however, has been modified to take advantage of Cypress' lowered manufacturing costs, allowing the company to compete effectively in high-volume markets such as the PC market. Cypress has also turned to a more market-driven focus.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-79 Cypress Semiconductor North American Company Profiles

Restructuring activities included the selling of its Sparc processor subsidiary, Ross Technology, to Fujitsu and the realignment of its subsidiaries Aspen Semiconductor and Multichip Technology under the company's current four business units: the Memory Products Division (MPD), the Programmable Products Division (PPD), the Data Communications Division (DCD), and the Computation Products Division (CPD). Cypress also made a few strategic acquisitions, including Seattle-based IC Designs, Inc., a supplier of clock- frequency synthesis chips for the PC market, and the high-speed FCT logic product line from Performance Semiconductor.

Data Communications and Computation Workstations Products 6% 19% Other Military 10% Tele- 7% communications 27% Programmable Memory PCs 13% Products Products Datacom Peripheral 19% 62% 23% 14%

1995 Sales by Product Division 1995 SRAM Sales (~$300M) by Application

Management

T.J. Rodgers President and Chief Executive Officer Antonio Alvarez Vice President, Research and Development Dan Barrett Vice President, European Sales and Marketing David Barringer Vice President, New Product Planning and Applications Bernard Glasauer Vice President, Quality and Reliability Assurance Emmanuel Hernandez Vice President, Finance and Chief Financial Officer Larry Jordan Vice President, Marketing Jeff Kaszubinski Vice President, Worldwide Manufacturing Paul Keswick Vice President, Programmable Products Division Jim Kupec Vice President, Memory Products Division Lothar Maier Vice President, Worldwide Wafer Manufacturing J. Daniel McCranie Vice President, Marketing and Sales R. Michael Starnes Vice President, Process Technology Joyce Sziebert Vice President, Human Resources John Torode Vice President, Computation Products Division Ron Treadway Vice President, Data Communications Division William Verde Vice President, Strategic Accounts Michael Villott Vice President, North American Sales

1-80 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Cypress Semiconductor

Products and Processes

Highlights of Cypress Semiconductor's product line is given below. Its integrated circuits are fabricated using proprietary 0.5µm, 0.65µm, and 0.8µm CMOS, BiCMOS, and bipolar technologies.

SRAMs Specialty Memories and Memory Modules ¥ 4K to 1M CMOS SRAMs ¥ Industry-standard FIFOs ¥ 64K and 256K BiCMOS SRAMs ¥ Bidirectional FIFOs ¥ 1K and 16K ECL SRAMs ¥ Clocked FIFOs ¥ 64-bit x 18 cache tag RAMs ¥ Dual-port RAMs ¥ 128K and 256K cache RAMs ¥ Memory accelerator MCMs

UltraLogic PLDs/FPGAs/Tools Industry-Standard PLDs/FPGAs ¥ Flash370 CPLDs (44-288 pins) ¥ 20-pin CMOS/BiCMOS PLDs ¥ pASIC380 FPGAs (44-208 pins) ¥ 16V8 GAL-compatible PLDs ¥ Development tools ¥ 22V10 flash/BiCMOS PLDs ¥ MAX CPLDs (28-84 pins) ¥ Antifuse-based FPGAs

PROMs/EPROMs Data Communications ¥ 4K to 512K CMOS PROMs ¥ HOTLink point-to-point communications ¥ 4K-1M CMOS EPROMs ¥ Fast Ethernet, Fibre Channel, and ATM/ SONET transceivers/receivers

Timing Technology Products Logic and Bus Products ¥ Motherboard frequency synthesizers ¥ FCT logic chips ¥ Low-power system logic devices ¥ VMEbus controllers ¥ Graphics frequency synthesizers ¥ ECL-TTL translators ¥ Programmable products ¥ Bit slice/multipliers ¥ Custom oscillators ¥ Programmable skew clock buffers ¥ Pentium clock synthesizers/drivers ¥ Low-skew clock buffers

Semiconductor Fabrication Facilities

Cypress Semiconductor Inc. Cypress Semiconductor (Texas) Inc. 3901 North First Street 17 Cypress Drive San Jose, California 95134 Round Rock, Texas 78664 Telephone: (408) 943-2653 Telephone: (512) 244-7789 Fab I Fab II (17 percent owned by Altera) Cleanroom size: 12,000 square feet Cleanroom size: 25,000 square feet Capacity (wafers/week): 1,000 Capacity (wafers/week): 2,700 Wafer size: 150mm Wafer size: 150mm Processes: CMOS, BiCMOS Processes: CMOS, BiCMOS Products: R&D and Prototype Products: SRAMs, PLDs, FPGAs, EPROMs, Feature sizes: 0.35µm-0.8µm datacom ICs Feature sizes: 0.5µm-1.2µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-81 Cypress Semiconductor North American Company Profiles

Cypress Semiconductor (Minnesota) Inc. Cypress Semiconductor (Minnesota) Inc. 2401 East 86th Street 2401 East 86th Street Bloomington, Minnesota 55425 Bloomington, Minnesota 55425 Telephone: (612) 851-5100 Telephone: (612) 851-5100 Fab III Fab IV Cleanroom size: 20,000 square feet Cleanroom size: 30,000 square feet Capacity (wafers/week): 2,400 Capacity (wafers/week): 3,000 Wafer size: 150mm Wafer size: 200mm Processes: CMOS, BiCMOS Processes: CMOS, BiCMOS Products: SRAMs, PLDs, FPGAs, logic chips, Products: SRAMs, Specialty Memories datacom ICs Feature size: 0.5µm Feature sizes: 0.5µm-1.2µm

Cypress Semiconductor Round Rock, Texas Fab V Cleanroom size: 35,000 square feet Capacity (wafers/week): 5,000 (when fully equipped) Wafer size: 200mm Products: SRAMs, EPROMs, Logic ICs Feature sizes: 0.25µm-0.5µm

Key Agreements

¥ In 2Q96, Cypress settled its PLD litigation with AMD with a cross-licensing agreement.

¥ Cypress expanded its agreement with Altera Corporation regarding Altera's MAX 5000 EPLD line to bring a family of smaller, faster devices to market.

¥ Cypress formed an alliance with QuickLogic Corporation to develop products, technology, and design tools for high-performance FPGA architecture. Cypress also made a multi-million dollar equity investment in QuickLogic, giving Cypress a stake of less than 10 percent in the company.

1-82 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Cyrix

CYRIX

Cyrix Corporation 2703 North Central Expressway Richardson, Texas 75080-2010 Telephone: (214) 994-8388 Fax: (214) 699-9857 Web Site: www.cyrix.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 55 73 125 246 228 Net Income 13 8 20 38 16 R&D Expenditures 4 8 16 25 29

Employees 130 150 220 309 400

Company Overview and Strategy

Founded in 1988, Cyrix Corporation designs, develops, and markets high-performance x86 software- compatible microprocessors for the desktop and mobile computer markets. The company seeks to serve the needs of the PC marketplace as an alternative source for x86 microprocessors of original design with competitive price/performance characteristics.

For Cyrix, 1995 was a transitionary year. Due to the demise of the 486 market in the first half of the year and delayed introductions of new products, the company was unable to demonstrate growth over its record performance in 1994. However, by the end of 1995 Cyrix had introduced both its fifth-generation and sixth- generation microprocessors, the Cyrix 5x86ª and 6x86ª, placing it in a compelling competitive position against Intel’s Pentium and Pentium Pro microprocessors.

Math Coprocessors 1%

Europe 30% Asia-Pacific 44% North America Microprocessors 37% 99%

1995 Sales by Device Type 1995 Sales by Geographic Region

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-83 Cyrix North American Company Profiles

Cyrix has strategic alliances with IBM Microelectronics and SGS-Thomson Microelectronics for the production of its high-performance microprocessors. These agreements support the company's current strategy to focus its resources on product design, market development, and customer support.

Management

Gerald D. Rogers President and Chief Executive Officer James N. Chapman Senior Vice President, Sales Kevin C. McDonough Senior Vice President, Engineering Michael E. Barton Vice President, Sales, Americas Thomas B. Brightman Vice President, Business and Technology Development Nancy B. DeChaud Vice President, Manufacturing Russell N. Fairbanks, Jr. Vice President, General Counsel, and Secretary Timothy W. Kinnear Vice President, Finance, and Treasurer Lewis R. Paceley Vice President, Marketing Everett J. Roach Vice President, Sales, Asia Stephen A. Tobak Vice President, Corporate Marketing

Products and Processes

Cyrix’s first products were math coprocessors. The company delivered its first x86 microprocessors in 1992. It then moved quickly to develop a full line of 486 processors with advanced power management, clock- doubling capabilities, integrated math coprocessors, and write-back cache. Now the company is pushing its fifth-generation 5x86 and sixth-generation 6x86 high-performance processors (the 486 products are no longer in production).

Cyrix’s 6x86 (formerly called the M1) is based on a superscalar, superpipelined architecture and a RISC core. The 6x86 line consists of three microprocessors, the 6x86-P133+ with a 110MHz clock speed, the 6x86- P150+ with a 120MHz clock, and the 6x86-P166+ with a 133MHz clock. The P+ nomenclatures suggest which specific higher-clock-rate Intel Pentium each of the members best compete with.

Cyrix expects to bring out its seventh-generation microprocessor, the M3 or 7x86, in 1997. In the meantime, the company’s M2 processor, which will feature greater multimedia support, will begin sampling in 4Q96.

The company currently uses 0.65µm five-layer metal CMOS technology for its 6x86 products. In the second half of 1996, the company will employ 0.5µm five-layer metal process technology for certain of its products.

In March 1996, Cyrix announced its entrance into the PC market through a five-year agreement with Electronic Data Systems Corporation (EDS) to produce and sell high-performance PCs using Cyrix microprocessors. The strategy behind Cyrix’s move to offer its own PCs is to showcase the capabilities of the 6x86 to key PC OEMs, rather than drive massive volumes.

1-84 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Cyrix

Semiconductor Fabrication Facilities

Cyrix currently has relationships with SGS-Thomson and IBM Microelectronics for the manufacture of its ICs. SGS-Thomson has been a manufacturing partner of Cyrix since October 1990. In early 1994, their pact was extended and is now valid through the end of 1997.

Cyrix's agreement with IBM Microelectronics was established in April 1994 and is good through the end of 1999. As part of the agreement, Cyrix made a capital equipment investment of about $88 million in an IBM fab in 1995.

To complement its partnerships with SGS-Thomson and IBM, Cyrix is negotiating to sign up a third manufacturing partner. However, the arrangement will likely be for foundry supply only. IBM and SGS- Thomson are licensed to also produce Cyrix-designed x86 processors under their own names.

The construction of its own fabrication facility is not part of the company’s current business plan. However, the option is not being ruled out. A jointly owned fab is a more likely option.

Key Agreements

¥ In 1Q96, Cyrix announced an agreement with Cadence Design Systems. Under the agreement, Cadence will provide a broad range of technologies and services to Cyrix, and work together in designing Cyrix’s seventh-generation x86 microprocessor, called the M3.

¥ Cyrix extended its wafer supply agreement with SGS-Thomson in 1994. Under the new arrangement, SGS-Thomson increased the number of wafers it produces for Cyrix and is allowed to make a certain percentage of those same wafers for itself. In addition, Cyrix granted SGS-Thomson the right to use certain Cyrix-designed chips as part of SGS-Thomson’s ASIC libraries. SGS-Thomson is allowed to produce and sell such ASIC products under its own name in unlimited quantities, with Cyrix receiving royalties from the sale of the devices. Also, Cyrix has the right to sell the SGS Thomson-designed ASICs under its own name.

¥ Cyrix and IBM announced a five year agreement in early 1994 under which IBM is manufacturing Cyrix's x86-compatible microprocessors. The agreement calls for the two companies to equally share the output of the Cyrix-designed chips.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-85 Dallas Semiconductor North American Company Profiles

DALLAS SEMICONDUCTOR

Dallas Semiconductor Corporation 4401 South Beltwood Parkway Dallas, Texas 75244-3292 Telephone: (214) 450-0400 Fax: (214) 450-3715 Web Site: www.dalsemi.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 104 120 157 181 233 Net Income 15 18 26 30 37 R&D Expenditures 15 16 19 23 29 Capital Expenditures 13 16 21 45 49

Employees 662 696 748 850 1,000

Company Overview and Strategy

Founded in 1984, Dallas Semiconductor designs, manufactures, and markets high performance CMOS ICs and semiconductor-based systems that provide innovative and cost-effective solutions to electronic design problems in a wide range of markets. The company's continuous new product development strategy serves as a means to increase future revenues and avoid dependence upon a single industry, market, or customer. Its products are sold to OEMs in the personal computer and workstation, scientific and medical equipment, industrial control, automatic identification, telecommunications, and other markets.

Other Europe 9% Computing 17% Communications 36% Asia 25% 22% U.S. Scientific, Industrial, 61% and Medical 30%

1995 Sales by End-Use Market 1995 Sales by Geographic Region

1-86 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Dallas Semiconductor

Management

C.V. Prothro President and Chief Executive Officer Chao C. Mai, Ph.D. Senior Vice President Michael L. Bolan Vice President, Marketing and Product Development Alan P. Hale Vice President, Finance Doug Powell Vice President, Sales F.A. Scherpenberg Vice President, Computer Products

Products and Processes

Dallas Semiconductor's product groups include:

¥ Timekeeping circuits ¥ Microcontrollers (8-bit) Secure MCUs ¥ Nonvolatile RAMs (16K to 4M) High-speed MCUs Integrated battery backup Intelligent sockets ¥ Automatic identification devices Serial numbers ¥ Telecommunications ICs Touch memories T1 and E1 circuits SCSI terminators ¥ Silicon timed circuits

¥ System extension circuits ¥ Software authorization CPU supervisors Digital potentiometers

Auto ID Other 6% 17% Timekeeping 29% Micros 8% NVRAMs Telecom 14% System 14% Extension 12% 1995 Sales by Product Family

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-87 Dallas Semiconductor North American Company Profiles

Semiconductor Fabrication Facilities

Dallas Semiconductor 4401 South Beltwood Parkway Dallas, Texas 75244-3292 Cleanroom size: 22,000 square feet (Class 1) Capacity (wafers/week): 2,500 Wafer size: 150mm (2 lines) Process: CMOS Feature sizes: 0.5µm-0.8µm

1-88 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Digital Semiconductor

DIGITAL SEMICONDUCTOR

Digital Equipment Corporation Digital Semiconductor 77 Reed Road Hudson, Massachusetts 01749 Telephone: (508) 568-6868 Web Site: www.digital.com/info/semiconductor

Captive IC Manufacturer

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Corporate Sales 12,943 13,931 14,371 13,451 13,813 Net Income (617) (2,796) (251) (2,156) 122

Semiconductor* Sales 225 230 240 270 305 Internal Sales 225 230 235 245 255 External Sales — — 5 25 50

Employees 3,000 2,750

*Calendar year

Company Overview and Strategy

Digital Equipment Corporation (DEC) is one of the world's largest manufacturers of computers and computer- related products. The company provides network computer systems, systems integrator, computer peripheral equipment, software, and associated computer accessory equipment to customers in more than 100 countries.

DEC began developing semiconductor products in 1975 for use in its electronic systems. In 1993, Digital expanded its semiconductor charter to become a merchant vendor. As part of its push into the merchant market, DEC spun out its semiconductor operation in mid-1994 to become an autonomous business unit, called Digital Semiconductor. For the past several years, Digital Semiconductor has worked to establish itself as an independent semiconductor vendor, but its largest customer always has been Digital Equipment, which bases its workstations and servers on its proprietary high-performance RISC microprocessor, called Alpha. Still, the company desires to expand its merchant focus.

Digital Semiconductor designs, manufactures, and markets a broad portfolio of semiconductor products including its Alpha processor and PCI-based networking, bridge, and graphics/multimedia devices.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-89 Digital Semiconductor North American Company Profiles

Management

Robert B. Palmer President and Chief Executive Officer R.E. Caldwell Vice President, Digital Semiconductor Arthur Swift Vice President, Sales and Marketing, Digital Semiconductor

Products and Processes

Digital Semiconductor manufactures 64-bit RISC microprocessors with speeds as fast as 400MHz, PCI- compliant system and peripheral logic chipsets, Ethernet controller ICs, PCI-PCI bridge devices, graphics accelerators, and graphics coprocessors (integrated accelerator, video controller, and RAMDAC on a single chip).

Digital's IC products are built using primarily CMOS and bipolar technologies, with all advanced process development centered on CMOS technology. Its leading-edge 0.35µm, four-level interconnect, CMOS-6 process technology is being used to manufacture the latest versions of the Alpha 21164. The processor is available in 366MHz and 400MHz versions. 433MHz and 500MHz versions are expected by the end of 1996.

The Alpha processor, coupled with Digital’s FX!32 translation technology destined for future versions of Windows NT software for Alpha, will enable Alpha-based systems to run 32-bit Windows applications at an average of 70 percent of native Alpha speed.

Semiconductor Fabrication Facilities

In early 1995, Digital Semiconductor agreed to sell to Motorola its South Queensferry, Scotland, fabrication facility. Motorola agreed to continue to make Alpha microprocessors for Digital, as well as take over Digital's two-year foundry agreement with AMD for the production of AMD's 486 microprocessors at the plant.

Digital Semiconductor 75 Reed Road Hudson, MA 01749 Telephone: (508) 568-4000 Capacity (wafers/week): 4,000 Wafer sizes: 100mm, 125mm, 150mm Processes: CMOS, MOS, bipolar Products: MPUs, ASICs, logic and custom ICs Feature sizes: 0.35µm-2.0µm

Fab 6 (ramp up and production during 1996) Cleanroom size: 64,000 square feet Capacity (wafers/week): 1,000 Wafer size: 200mm Process: CMOS Products: MPUs Feature size: 0.35µm (eventually, 0.18µm)

1-90 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Digital Semiconductor

Key Agreements

¥ Digital and Microsoft joined together in a broad patent- and technology-sharing agreement that supports hardware and software development for client-server computing.

¥ Digital and Brooktree announced a long-term joint development and marketing relationship in early 1994 aimed at graphics-intensive and multimedia applications in high-performance PCs. The two companies are cooperating on development of new accelerators, RAMDACs, and chips integrating both devices. Digital and Brooktree previously worked together on RAMDACs in 1989.

¥ Mitsubishi agreed to be both a second source for Digital's Alpha MPUs and a development partner. The Japanese company began producing Alphas for Digital at its newest Saijo facility in late 1994. Subsequently, Mitsubishi will design and fabricate its own versions of the RISC architecture for use in its own systems and to be sold to its own customers.

¥ Advanced RISC Machines Ltd. announced in early 1995 it would jointly develop with DEC and Apple Computer a family of high-performance microprocessors compatible with the ARM RISC line. The 32-bit processor, called StrongARM, are being produced by DEC using its 0.35µm CMOS-6 process. Volume shipments began in the first half of 1996 and are targeted at applications in digital imaging, multimedia, set-top boxes, handheld computers, and communications products, as well as Apple's Newton line.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-91 Dionics North American Company Profiles

DIONICS

Dionics Inc. 65 Rushmore Street Westbury, New York 11590-4839 Telephone: (516) 997-7474 Fax: (516) 997-7479

IC Manufacturer

Employees 35

Company Overview and Strategy

Established in 1969, Dionics is a developer, manufacturer, and marketer of innovative high-quality integrated circuits and discrete products. It targets these devices at areas of the industrial and military markets where high voltage, high frequency, and unusual structures are required.

Using a dielectric isolation process, Dionics has evolved from a supplier of discrete components to a manufacturer of hybrid circuits, ICs, photovoltaic SSRs, and MOSFET-drivers. The products were initially targeted for use in digital watches but have since made their way to markets that require high reliability that is inherent to the dielectric isolation process.

Management

Bernard L. Kravitz President Sherman Gross Vice President

Products and Processes

Photovoltaic ICs, SSRs, and MOSFET-drivers.

Semiconductor Fabrication Facilities

Dionics Inc. 65 Rushmore Street Westbury, New York 11590-4839 Cleanroom size: 3,000 square feet Capacity (wafers/week): 400 Wafer size: 100mm Process: Dielectric isolation bipolar Products: Photovoltaic SSRs and MOSFET-drivers Feature sizes: 2.0µm-5.0µm

1-92 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles DSP Group

DSP GROUP

DSP Group, Inc. 3120 Scott Boulevard Santa Clara, California 95054 Telephone: (408) 986-4300 Fax: (408) 986-4323 Web Site: www.dspg.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1992 1993 1994 1995 Sales 9 12 29 50 Net Income (6) (0.4) 4 7 R&D Expenditures 4248

Employees 106 115

Company Overview and Strategy

DSP Group, Inc. develops, licenses, and markets digital signal processing (DSP) ICs and related software targeted at digital speech applications in the multimedia personal computer, telecommunication, consumer telephone, and consumer electronics markets.

DSP Group began business in 1987 with the purchase of a small design house that was involved in paramilitary DSP-related design for applications such as noise cancellation and eavesdropping. The company began developing its own DSPs and established a design center in 1990. In 1992, the company launched DSP Semiconductors as a subsidiary to directly focus on the licensing of its technology. Since then, DSP Semiconductors has been folded back into DSP Group and now operates as the Semiconductor Division.

The company’s strategy is to use its digital speech processing, telephony signal processing, and DSP core architecture technologies to become a leading supplier of DSP-based solutions for the emerging markets for digital speech products.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-93 DSP Group North American Company Profiles

Royalties/ Licensing/Other 18%

DSPs 82%

1995 Sales by Product Type

Management

Eli Porat President and Chief Executive Officer Yuval Cohen Vice President, Business Development John P. Goldsberry, Ph.D. Vice President, Finance and Chief Financial Officer Ofer Ronen Vice President, Consumer Products Martin Skowron Vice President, Operations Gideon Wertheizer Vice President, VLSI Design Center

Products and Processes

DSP Group has developed a family of low-power consumption, low-cost DSP core architectures that are suitable for consumer, mobile computer, and wireless communications products. The company’s products are manufactured using 0.6µm-0.8µm CMOS technologies.

¥ Application specific DSPs for speech and telephony processors used in digital telephones, answering machines, and personal computers.

¥ The PineDSPCoreª and OakDSPCoreª architectures. These core architectures are highly modular and designed for customers developing their own high-volume, application-specific DSPs.

¥ A proprietary digital speech compression technology called TrueSpeech¨. TrueSpeech software is designed for a wide range of applications, including video conferencing, computer telephony, the internet, and personal recorders.

Current licensees of the PineDSPCore and OakDSPCore architectures include Adaptec, Asahi Kasei Microsystems, DSP Communications, GEC Plessey, Harris Semiconductor, Integrated Circuit Systems, Level One Communications, LSI Logic, NEC, Samsung, Siemens, Silicon Systems, TEMIC, VLSI Technology, and Xicor.

Licensees of DSP’s TrueSpeech technology include Lucent Technologies, Atmel, Cirrus Logic, Intel, Microsoft, Siemens, Sierra Semiconductor, U.S. Robotics, and VLSI Technology.

1-94 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles DSP Group

Semiconductor Fabrication Facilities

As a fabless supplier, DSP depends on foundries for the manufacturing of its devices. The company has established foundry relationships with several companies, including Tower Semiconductor, Taiwan Semiconductor Manufacturing Co. (TSMC), and Samsung.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-95 EDI North American Company Profiles

ELECTRONIC DESIGNS (EDI)

Electronic Designs Incorporated One Research Drive Westborough, MA 01581 Telephone: (508) 366-5151 Fax: (508) 836-4850

Fabless IC Supplier

Financial History ($M)

1991 1992 1993 1994 1995 Sales 22 23 23 25 40

Employees 100 85 85 85 85

Company Overview and Strategy

Founded in 1980, Electronic Designs Incorporated (EDI) is an international supplier of high-density, high- performance semiconductor memory products to many segments of the electronic equipment industry, including computer systems and peripherals, telecommunications, medical equipment, and military systems. The company emphasizes a time-to-market advantage for its high-speed SRAM modules. New modules combining SRAM, flash, and EEPROM technology were introduced in 1994. The company also designs and supplies active-matrix LCDs.

Management

Don McGuinness President and Chief Executive Officer Ken Buckley Vice President, Sales and Marketing Frank Edwards Vice President, Finance

Products and Processes

EDI's products include the following:

¥ High-speed monolithic 256K, 1M, and 4M CMOS SRAMs (commercial or military) ¥ Monolithic 1M synchronous and special feature SRAMs (commercial) ¥ High-density CMOS SRAM modules (1M-45M) with speeds of 15ns-70ns (commercial or military) ¥ Modules combining two 1M SRAMs, two 1M flash memories, and two 256K EEPROMs (commercial) ¥ Active-matrix LCDs

1-96 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles EDI Ê

Semiconductor Fabrication Facilities

EDI handles assembly, test, and QCI at its headquarters in Westborough. For the production of its wafers, the company has silicon foundry partnerships with major U.S. and international IC manufacturers.

Key Agreements

¥ EDI formed an agreement with Atmel in 1994 that calls for EDI to design, manufacture, and market high- density memory modules using Atmel's flash memory devices.

¥ EDI signed a licensing agreement with Thomson-CSF that enables EDI to make and market products using the French company's technology for 3D stack memory products.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-97 EG&G Reticon North American Company Profiles

EG&G RETICON

EG&G Reticon 345 Potrero Avenue Sunnyvale, California 94086-4197 Telephone: (408) 245-2060 Fax: (408) 738-6979

IC Manufacturer

Employees 160

Company Overview and Strategy

EG&G Reticon was among the first semiconductor companies to specialize in solid-state imaging components and vision system products. From its start in 1971, Reticon has been a leader in image sensing and signal processing technology.

Reticon, a subsidiary of EG&G, Inc. since 1976, combines a tradition of innovation and quality with the stability and resources of EG&G, a $1.4 billion company involved in diversified high technology markets.

Management

Andris Ramans President and General Manager

Products and Processes

¥ Image sensing products—character scan devices, instrumentation devices, infrared sensors and multiplexers, photodiode arrays, and CCDs.

¥ Analog signal processing ICs—switched-capacitor filters, modem filters, universal active filters, transversal filters, and analog delay lines.

¥ Solid state camera products.

Semiconductor Fabrication Facilities

EG&G Reticon Sunnyvale, California Capacity (wafers/week): 625 Wafer size: 100mm Processes: MOS, CMOS Products: Linear ICs and image sensing devices Feature size: 2.5µm

1-98 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Elantec

ELANTEC

Elantec, Inc. 1996 Tarob Court Milpitas, California 95035 Telephone: (408) 945-1323 Fax: (408) 945-9305 Web Site: www.elantec.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends September 30

1991 1992 1993 1994 1995 Sales 15 15 18 23 27 Net Income 0.1 0.3 1 1 3 R&D Expenditures 4 4 5

Employees 103 110 120 125 165

Company Overview and Strategy

Elantec, Inc., founded in 1983, designs, manufacturers, and markets high-performance analog and mixed- signal integrated circuits for the video/multimedia, data processing, instrumentation, and communications markets. The company serves these markets with standard products and application specific standard products (ASSPs), using primarily high-speed complementary bipolar and advanced CMOS technologies.

Elantec has transformed itself from a military hybrid IC supplier to a company focused on providing high- performance analog intensive functions for growing commercial markets. At one time, military hybrid sales accounted for 90 percent of the company's total sales, versus about 18 percent today.

In October 1995, the company completed its initial public offering.

Asia 33% Standard ICs 25% Europe North America 11% 56% ASSPs 75%

1995 Sales by Geographic Region 1995 Sales by Device Type

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-99 Elantec North American Company Profiles

Management

Dave O'Brien, Ph.D. President and Chief Executive Officer Richard Corbin Vice President, Bipolar Design Ralph Granchelli, Jr. Vice President, Marketing and Sales Terrence W. Plette Vice President and Chief Financial Officer Barry Siegel Vice President, Engineering

Products and Processes

Elantec's analog and mixed-signal ICs for commercial markets include the following:

¥ Op amps ¥ H-sync Genlock-computer video circuits ¥ Video circuits ¥ DC restore subsystems ¥ Analog buffers ¥ Fader circuits ¥ Transistor arrays ¥ MOSFET drivers ¥ Servo motor drivers ¥ Half-bridge drivers ¥ Comparators and ATE pin drivers ¥ PWM controllers ¥ IGBT drivers

Elantec has developed and used a variety of technologies for its products. In particular, Elantec has focused on developing advanced complementary bipolar technology, using dielectric isolation and silicon-on- insulator (SOI) techniques, and advanced CMOS technology. The company utilizes external foundries for other technologies such as ultra high-speed bipolar and BiCMOS.

Semiconductor Fabrication Facilities

Elantec, Inc. 1996 Tarob Court Milpitas, California 95035 Telephone: (408) 945-1323 Cleanroom size: 4,000 square feet Capacity (wafers/week): 300 Wafer size: 100mm Processes: Complementary bipolar, complementary bipolar dielectric isolation (DI), JI bipolar, CMOS Products: Analog ICs Feature sizes: 5.0µm (bipolar) 1.2µm, 2.0µm (CMOS)

1-100 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles ESS Technology

ESS TECHNOLOGY

ESS Technology, Inc. 46107 Landing Parkway Fremont, California 94538 Telephone: (510) 226-1088 Fax: (510) 226-1098

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 23 24 15 33 106 Net Income 6 5 0.2 8 30 R&D Expenditures 4349

Employees 145

Company Overview and Strategy

ESS Technology, founded in 1984, designs, develops, and markets highly integrated mixed-signal semiconductor audio solutions for the PC audio market, primarily to multimedia desktop and notebook computer manufacturers.

In December 1995, ESS made an equity investment in VideoCore Technology, which will operate as a wholly owned subsidiary of ESS. In 1996, ESS acquired OSEE Technology, a developer of fax/modem technology.

In 1995, 70 percent of ESS Technology’s total sales were to international customers.

Management

Fred S.L. Chan President and Chief Executive Officer Nicholas A. Aretakis Vice President, Sales Robert L. Blair Vice President, Operations Hoover J. Chen Vice President, Engineering Ralph J. Harms Vice President and Chief Financial Officer Albert Y. Mak Vice President, Marketing Robert S. Plachno Vice President, Research and Development Roger K. Shum Vice President, Manufacturing

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-101 ESS Technology North American Company Profiles

Products and Processes

The company’s products consist of AudioDrive singe-chip solutions, wavetable synthesizers, and multimedia system chipsets.

ESS Technology’s audio chips have migrated from 12-bit to 16-bit and from mono to stereo sound. The company has also developed a core library of audio semiconductor designs, including microcontroller, bus interface, codec, mixer, filter and FM synthesizers, and device drivers, as well as application software.

The company’s products are manufactured using a mixed-signal 0.6µm CMOS process technology, with a move to 0.5µm technology expected in 1996.

Semiconductor Fabrication Facilities

ESS has contracts with several independent foundries for the manufacture of its products. The majority of its devices are currently manufactured by Taiwan Semiconductor Manufacturing Company (TSMC), its primary supplier since 1989. The company also uses UMC in Taiwan, Sharp Corporation in Japan, and IC Works in California.

In December 1995 ESS announced a wafer supply program to commit approximately $62 million, and an option to commit another $31 million, over the next three years for expanding manufacturing capacity and developing advanced technology. The company expanded its relationship with TSMC by entering into a long term agreement for an increased amount of wafer capacity. ESS agreed to pay approximately $32 million to TSMC in exchange for wafer supply through 1999. ESS also obtained an option to further expand this agreement for additional capacity.

ESS also entered into a joint venture agreement with United Microelectronics Corporation (UMC) of Taiwan. Under the agreement, ESS will invest $30 million for a five percent equity ownership in one of UMC’s three joint 200mm wafer manufacturing facilities currently under construction in Taiwan. UMC is providing ESS with capacity during the interim.

1-102 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Exar

EXAR

Exar Corporation 48720 Kato Road Fremont, California 94539 Telephone: (408) 434-6400 Fax: (408) 943-8245 Web Site: www.exar.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 140 146 162 159 126 Net Income 11 14 16 (11) 14 R&D Expenditures 11 11 11 14 16

Employees 475 500 525 468 441

Company Overview and Strategy

Founded in 1971, Exar Corporation is involved in the design and marketing of analog and mixed-signal ASICs and ASSPs, primarily for use in communications, computer peripheral, and consumer electronics products. The company also serves the automotive, industrial, and medical markets. Exar's strategy is to address niche markets in which its design and process capabilities enable it to offer analog and mixed-signal ASSPs to meet customer's needs. The company also produces digital ICs that are used primarily to complement its other products.

In 1995, Exar shifted its product mix by withdrawing from the mass storage IC business. Currently, about 90 percent of Exar’s sales are from three market sectors: communications, consumer electronics, and computers. In 1995, 62 percent of sales were to foreign customers.

Mass New Storage Markets 13% 12% Consumer 38%

Document Imaging Communications 14% 23%

1995 Sales by End-Use Market

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-103 Exar North American Company Profiles

ROW Europe 1% 8%

Asia 13% Japan 40% North America 38%

1995 Sales by Geographic Region

Exar has undergone a series of acquisitions and divestitures over the past couple of years. Included was the reduction of the ownership Rohm (its original investor) has in the company to less than five percent and the transferring of its epitaxial and bipolar manufacturing operations to Rohm. Also, Exar acquired three semiconductor companies, Micro Power Systems, Inc., Origin Technology, Inc., and Startech Semiconductor. While Micro Power Systems and Origin Technology were folded into Exar, Startech operates as a wholly owned subsidiary under its own name. In 1996, Exar acquired Silicon Microstructures, Inc. (SMI), a fabless semiconductor company mainly involved in the design, development, and marketing of silicon sensors for the automotive and industrial market. SMI will operate as a subsidiary of Exar.

Management

George D. Wells President and Chief Executive Officer Ronald W. Guire Senior Vice President, Chief Financial Officer, and Secretary John Caruso Vice President, Micro Power Systems Roubik Gregorian President, Startech Semiconductor Thomas R. Melendrez Vice President, Legal Affairs Stephen W. Michael Vice President, Operations Division Ram Reddy Chief Executive Officer, Startech Semiconductor H. Ilhan Refioglu Vice President, Strategic Product Groups Eric J. Ochiltree Vice President, Product Development Robert M. Skinner Vice President, Worldwide Sales Suhas "Sid" Bagwe Director, Strategic Planning and Long Range Development Thomas W. Jones Director, Reliability and Quality Assurance Paul Kageyama Director, Manufacturing Operations

Products and Processes

Exar offers analog, digital, and mixed-signal ASICs and ASSPs. Its products are manufactured using 0.5µm to 2.0µm CMOS processes or a 1.6µm BiCMOS process. The company also uses bipolar technology for high speed and low noise applications. In April 1995, Exar discontinued several aging bipolar product lines it inherited from Rohm. All of the products were low-margin devices, such as operational amplifiers and timers.

1-104 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Exar

Products gained through the acquisition of Micro Power Systems included high-performance data converters and data acquisition systems for the advanced consumer, mass storage, telecommunications, and imaging markets. Origin Technology provided Exar with proprietary speech recognition products for the consumer market. Startech designs and markets ASSPs for a variety of markets such as datacommunications, telecommunications, computers, workstations, and peripherals. Through the acquisition of SMI, Exar gained silicon sensor technology.

Semiconductor Fabrication Facilities

Through its relationship with Rohm, Exar has access to the Japanese company's fabrication facilities. Some of the company's products are produced by IC Works, Orbit Semiconductor, SGS-Thomson, and another unnamed European manufacturer, as well as by TSMC.

Key Agreements

¥ Exar and IC Works announced a $15 million wafer production agreement in 1995, under which IC Works will provide wafers to Exar over the next five years. As part of the agreement, Exar will purchase and install equipment in IC Works’ facility to convert it from 125mm wafers to 150mm wafers and improve its process technology.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-105 Exel Microelectronics North American Company Profiles

EXEL MICROELECTRONICS

Exel Microelectronics, Inc. 2150 Commerce Drive P.O. Box 49038 San Jose, California 95131 Telephone: (408) 432-0500 Fax: (408) 432-8710

Fabless IC Supplier

Financial History ($M)

1991 1992 1993 1994 1995 Sales 28 32 30 36 39

Company Overview and Strategy

Exel Microelectronics is a division of Rohm Corporation, a wholly owned U.S. subsidiary of Rohm Co., Ltd. in Japan. The company was founded in 1983 to design, manufacture, and market nonvolatile memory and related products. Acquired by Rohm in 1989, Exel operates independently of the Japanese company, though they maintain a close engineering and manufacturing relationship.

Exel’s original and continued focus is on EEPROM technology. The company is a high volume supplier of industry standard serial and parallel EEPROMs. It also specializes in combining core EEPROM technology with other functions providing higher levels of integration. This includes a family of both remote and contact access devices and a family of analog functions combined with EEPROM technology.

Management

Tom Freeze President Rick Orlando Vice President, Marketing and Sales

Products and Processes

Exel Microelectronics supplies serial and parallel EEPROMs and access control products.

Serial EEPROMs ¥ Microwire 1.8V to 5.5V; 1K, 2K, and 4K ¥I2C 1.8V to 5.5V; 1K, 2K, 4K, 8K, and 16K ¥ SPI 2.7V to 5.5V; 2K, and 4K (16K available in 3Q96)

Parallel EEPROMs ¥ CMOS full-featured 16K and 64K

1-106 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Exel Microelectronics

Surelokª Security Products ¥ XL 106 Random rolling code encoder, decoder, and coprocessor ¥ XL 124 Low cost rolling code encoder ¥ XL 109 ,110, and 138 Rolling code controllers

Exel's serial and parallel EEPROMs are based on proprietary 1.0µm CMOS and NMOS processes.

Semiconductor Fabrication Facilities

All of Exel's EEPROM products are manufactured in Rohm's fabrication facility located in San Jose, California.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-107 Genesis Microchip North American Company Profiles

GENESIS MICROCHIP

Genesis Microchip Inc. U.S. Representative: 200 Town Centre Boulevard Genesis Microchip Corporation Suite 400 2111 Landings Drive Markham, Ontario Mountain View, California 94043 Canada L3R 8G3 Telephone: (415) 428-4277 Telephone: (905) 470-2742 Fax: (415) 428-4288 Fax: (905) 470-2447 Web Site: www.genesisus.com

Fabless IC Supplier

Employees 47

Company Overview and Strategy

Founded in 1987, Genesis Microchip is a technology leader in digital video/image manipulation. The company designs, develops, and markets leading-edge ICs targeted at both existing and emerging applications demanding high-quality video/image processing. Genesis sets the standard in video/image resizing. Markets are divided into high-end chips (gm865 class), middle tier (gm833 class), and commodity, low-cost, high-performance cores.

Management

Paul M. Russo President and Chief Executive Officer Peter Dakin Vice President, Manufacturing Operations Hamid Farzaneh Vice President, Worldwide Sales Lance Greggain Vice President, Product Development Operations Eric Erdman Director, Finance and Administration Scott Baker Manager, ASIC Development John Chan Manager, IC Design Jordan Du Val Manager, Marketing Jay Giblon Manager, Information Systems David Green Manager, Sales Graham Loveridge Manager, Customer and Product Support Peter Mandl Manager, Video DSP Technology

1-108 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Genesis Microchip

Products and Processes

Genesis' products include the Genesis Scalingª series of video/image resizing ICs (gm865x1, gm833x2, gm833x3, gm833x3F), the gm2242B half-band filter, and the gmVLD family of video line doublers plus supporting evaluation boards and software. The patented algorithms and architectures provide improvement in computational efficiency over traditional finite impulse response (FIR) filter structures. All of Genesis' design efforts currently employ 0.8µm (and below) CMOS technology. Several products are described below.

¥ gm865x1—This is the first of the Genesis Scaling chip series. The gm865x1 IC is a single-channel device that provides high-quality video/image processing technology for medical imaging, broadcast equipment, and projection systems.

¥ gm833x2—This is the second of the Genesis Scaling chip series. The gm833x2 is a dual-channel device for use in workstation, projection systems, and multimedia applications.

¥ gm833x3—This is a triple-channel version in the 833 class designed for use in projection systems, videographic workstations, and scan conversion equipment.

¥ gm833x3F (fast) “Bullet”—This is a 68MHz version of an RGB scaler, featuring low power, and an advanced 0.35µm, 3.3V CMOS process.

¥ gm2242B Half-Band Filter—This is a decimating/interpolating digital filter for use in applications requiring pre- or post-filtering of digital video signals. The gm2242B supports NTSC, PAL, SECAM, and square pixel video standards.

¥ gmVLD8/gmVLD10 Video Line Doublers—This is a single-chip de-interlacing device for use in equipment such as large screen televisions, video walls, projection systems, video-in-a-window workstations, and home theater screens.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-109 Gennum North American Company Profiles

GENNUM

Gennum Corporation P.O. Box 489, Station A Burlington, Ontario Canada L7R 3Y3 Telephone: (905) 632-2996 Fax: (905) 632-2055

IC Manufacturer

Financial History ($M), Fiscal Year Ends November 30

1991 1992 1993 1994 1995 Sales 24 26 27 33 42 Net Income 44457 R&D Expenditures 57789 Capital Expenditures 23234

Employees 219 233 240 247 255

Company Overview and Strategy

Gennum Corporation, formed in 1973, is a Canadian high technology company that designs, manufactures, and markets electronic components, primarily silicon integrated circuits and thick-film hybrid circuits, for special applications in the information world.

The company's products include low-voltage audio electronic amplifiers and analog signal processing circuits supplied to the world hearing instrument industry; video signal distribution and processing components sold to the professional video and broadcast television markets; and user specific ICs for a wide variety of specific applications where information is being conditioned, transmitted, or interpreted.

Canada 10% Pacific Rim 19% United States 42% Europe 29%

1995 Sales By Geographic Region

1-110 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Gennum

Management

H. Douglas Barber, Ph.D. President and Chief Executive Officer Michael R. Fielding Vice President, Marketing and Sales David L. Lynch Vice President, Research and Development Ian L. McWalter Vice President, Manufacturing Operations C. Timothy Zahavich Vice President, Finance and Administration, and Chief Financial Officer

Products and Processes

Gennum produces analog arrays, linear ICs, and thick-film hybrid circuits using bipolar process technology. The company has developed a DMOS process, though it has not put it into production, and CMOS designs are contracted out for manufacture by external foundries.

Semiconductor Fabrication Facilities

Gennum Corporation 3435 Landmark Road Burlington, Ontario L7M 1T4 Cleanroom size: 18,000 square feet Capacity (wafers/week): 350 Wafer size: 100mm Process: Bipolar Products: Linear ICs, ASICs, thick-film hybrid circuits Feature sizes: 1.5µm-4µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-111 GTE Microelectronics North American Company Profiles

GTE MICROELECTRONICS

GTE Microelectronics GTE Government Systems Corporation 77 A Street Needham Heights, Massachusetts 02194-2892 Telephone: (800) 544-0052 Fax: (617) 455-5885

Fabless IC Supplier

Company Overview and Strategy

GTE Microelectronics designs, tests, and supplies high-end, complex military and commercial microelectronic devices to GTE Corporation and other companies. GTE Corporation is one of the world's largest suppliers of communications systems, equipment, and services for commercial and government/defense applications. GTE Microelectronics is an organization within the Communications Systems Division of GTE Government Systems, one of GTE Corporation's two operating groups.

GTE Microelectronics was founded in 1969 as a captive supplier to GTE. In 1993, GTE Microelectronics started providing products and services to other companies. Currently, 60 percent of GTE Microelectronics' business is internal to GTE and 40 percent is with other companies.

Approximately 75 percent of its sales, which are estimated to be in the $10 to $15 million range, are from military-related products and 25 percent commercial-related products. Typical applications for its products are avionics, imaging, portable satellite terminals, military electronics equipment, submarine communications, receivers, and the space shuttle.

Management

John Condon Director, GTE Microelectronics Debbie Cremin Manager, Business Development

Products and Processes

GTE Microelectronics' products include ASICs, FPGAs, multichip modules, and hybrids. The company specializes in rapid prototyping, small production runs, custom packaging, and conversion of hybrids to ASICs.

The company's ASIC offerings include a variety of standard cell and gate array technologies from 9.0µm to 0.65µm CMOS, BiCMOS, and bipolar for digital, analog, and mixed-signal circuits.

1-112 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles GTE Microelectronics

GTE Microelectronics also provides custom test services for test development and production of analog, digital, and mixed signal circuits, including temperature testing, characteristics, and qualification.

Semiconductor Fabrication Facilities

For the production of its ICs, GTE Microelectronics has established several strategic partnerships with wafer foundries, including National Semiconductor and Symbios Logic.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-113 Harris Semiconductor North American Company Profiles

HARRIS SEMICONDUCTOR

Harris Semiconductor 2401 Palm Bay Road Northeast Palm Bay, Florida 32905 Telephone: (407) 724-7000 Fax: (407) 729-5691 Web Site: www.semi.harris.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Corporate Sales 3,040 3,004 3,099 3,336 3,444 Net Income 20 75 111 112 155

Semiconductor Sales 741 585 591 635 659 Net Income (76) (20) 17 31 42 Capital Expenditures 54 22 27 44 80

Employees 8,000 8,100

Company Overview and Strategy

Harris Semiconductor is one of the four major business sectors of Harris Corporation, a worldwide manufacturer of electronic systems, semiconductors, communications products, and office systems with sales of over $3.4 billion and more than 26,000 employees.

Semiconductor 19% Electronic Systems 30% Communications 21% Lanier Worldwide 30%

1995 Corporate Sales by Business Sector

Harris Semiconductor originated as the Microelectronics Division of Radiation, Inc. in 1962. It became Harris Semiconductor in 1967 through the merger of Harris and Radiation. Then in 1988, Harris Semiconductor nearly tripled in size through the acquisition of the General Electric Solid State semiconductor business.

1-114 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Harris Semiconductor

Harris Semiconductor manufactures and markets advanced analog, digital, power, and mixed-signal integrated circuits and discrete semiconductors for power, signal-processing, data-acquisition, and logic applications. The company is focusing most of its future efforts on specialized applications in automotive, communications, and power control products.

Data Acquisition 7%

Intelligent Power 11% Power Discretes 25% 24% Signal Processing 16% Digital Integrated Circuits Mixed-Signal 23% 76% 18%

1995 Semiconductor Sales 1995 Semiconductor Sales by Application by Device Type

Below are applications served by Harris’ semiconductor products.

Automotive—multiplexing systems, antilock braking systems, engine controls, emission controls, engine knock sensing, air bag systems, and entertainment systems. This is Harris' largest commercial end market.

Communications—wireless local area network (LAN) systems, cellular base stations, satellite communications systems, set-top boxes, and PBX, central office, wireless local loop, and fiber-in-the-loop equipment.

Video/Multimedia—video and imaging processing systems, video teleconferencing, and multimedia systems.

Power and Load Control—motor controllers, disk drives, power supplies, distributed power systems, and power switching.

Power Protection—surge suppression equipment, uninterruptible power supplies, house electrical panel protection, and on-board electronic circuit protection.

Other Applications—test equipment, industrial controls, consumer electronics, medical imaging, computer peripherals, hand-held portable equipment, and military and aerospace equipment.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-115 Harris Semiconductor North American Company Profiles

Management

Harris Corporation Phillip W. Farmer President and Chief Executive Officer Bryan R. Roub Senior Vice President and Chief Financial Officer

Harris Semiconductor Sector John C. Garrett President George L. Gidzinski Vice President, Marketing F. Scott Moody Vice President and GM, Military and Aerospace Products Division W. Russell Morcom Vice President and GM, Semiconductor Products Division P.G. Phillips Vice President, Engineering Carleton Smith Vice President (North America), Sales Ron Van Dell Vice President, Worldwide Sales and Marketing Edward Verbeek Vice President (Europe), Sales Marcus Wise Vice President (Asia), Sales

Products and Processes

Harris offers a broad range of standard, semicustom, and custom ICs and discrete semiconductors, including intelligent power devices, data acquisition and signal processing circuits, digital microprocessor, peripheral, and logic ICs, and radiation-hardened circuits for spacecraft and satellite applications.

MOS MEMORY ANALOG DRAM ✔ Amplifier ✔ SRAM ✔ Interface Flash Memory ✔ Consumer/Automotive EPROM ✔ Voltage Regulator/Reference ROM ✔ Data Conversion EEPROM ✔ Comparator ✔ Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)

MOS LOGIC DIGITAL BIPOLAR ✔ General Purpose Logic Bipolar Memory ✔ Gate Array General Purpose Logic ✔ Standard Cell ✔ Gate Array/Standard Cell Field Programmable Logic Field Programmable Logic ✔ Other Special Purpose Logic Other Special Purpose Logic MPU/MCU/MPR MOS MICROCOMPONENT ✔ MPU OTHER ✔ MCU ✔ Full Custom IC ✔ MPR ✔ Discrete ✔ DSP ✔ Optoelectronic

1-116 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Harris Semiconductor

Process technologies used by Harris Semiconductor include: CMOS, BiCMOS, power BiMOS, high- frequency bipolar/power MOS, high-voltage bipolar/power MOS, complementary bipolar dielectric isolation (bonded wafer), CMOS/SOI (silicon-on-insulator), CMOS/SOS (silicon-on-sapphire), and radiation hardening.

Semiconductor Fabrication Facilities

Harris supplements its internal semiconductor production capabilities with foundry agreements with external semiconductor manufacturers. For example, the company uses foundries for the fabrication of triple-layer- metal CMOS devices like signal processing ICs.

In 1995, Harris started the construction of the world’s first 200mm wafer fabrication facility for discrete semiconductors. The $250 million fab will be located adjacent to the company’s Mountaintop, Pennsylvania, plant. Completion of the fab expected in the fall of 1996.

Harris Semiconductor (Ohio), Inc. Harris Semiconductor (Florida), Inc. 1700 Fostoria Road P.O. Box 883 Findlay, Ohio 45840 Palm Bay, Florida 32905 Telephone: (419) 423-0321 Telephone: (407) 724-7000 Cleanroom size: 57,500 square feet Cleanroom size: 53,000 square feet Capacity (wafers/week): 15,000 Capacity (wafers/week): 7,000 Wafer sizes: 100mm, 125mm Wafer sizes: 3in, 100mm, 125mm Processes: CMOS, bipolar, BiCMOS Processes: CMOS, PMOS, bipolar Products: Custom digital, linear, logic, and Products: MPUs, SRAMs, linear and digital ICs, mixed-signal ICs discretes Feature sizes: 1.2µm, 1.5µm, 2.0µm Feature sizes: 0.8µm, 1.0µm, 2.0µm, 4.0µm

Harris Semiconductor (Pennsylvania), Inc. Harris Semiconductor (Pennsylvania), Inc. Crestwood Industrial Park Mountaintop, Pennsylvania 125 Crestwood Road Cleanroom size: 25,000 Mountaintop, Pennsylvania 18707-2189 Capacity (wafers/week): 5,000 Telephone: (717) 474-6761 Wafer size: 200mm Cleanroom size: 74,000 square feet Process: MOS Capacity (wafers/week): 4,000 Products: Discretes Wafer sizes: 100mm, 125mm, 150mm (Scheduled to start production in 1Q97) Processes: MOS, bipolar, BiCMOS Products: Discretes, hybrids, ASICs Feature sizes: 1.0µm, 2.0µm, 5.0µm

In early 1996, Harris began building a new IC assembly and test facility in Suzhou, China. The company expects construction to be completed by early 1997. The new facility will assemble and test digital logic, microperipheral, and analog and mixed-signal devices. Harris has existing semiconductor assembly factories in Kuala Lumpur, Malaysia, and Dundalk, Ireland.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-117 Harris Semiconductor North American Company Profiles

Key Agreements

¥ In 4Q95, Harris announced a license agreement with DSP Group Inc. Harris licensed DSP Group’s Oak and Pine DSP cores for use in devices for audio-band signal processing applications.

¥ Harris has a product agreement with Sony. Under the agreement, Harris expanded its line of 10-bit, 12- bit, and 14-bit data converters to include Sony’s 6-bit and 8-bit converters.

¥ Harris has a second-source agreement with Xilinx for radiation-hardened FPGAs.

¥ Harris formed an agreement with Noise Cancellation Technologies to develop and manufacture proprietary chips for application of NCT's active noise reduction technology.

1-118 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Honeywell

HONEYWELL SSEC

Honeywell, Incorporated Solid State Electronics Center (SSEC) 12001 Highway 55 Plymouth, Minnesota 55441 Telephone: (612) 954-2301 Fax: (612) 954-2504 Web Site: www.ssec.honeywell.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Corporate Sales 6,193 6,223 5,963 6,057 6,731 Net Income 331 247 322 279 334 Capital Expenditures 300 312 337 319 323

Semiconductor IC Sales 50 53 45 45 58

Employees 500 523

Company Overview and Strategy

Founded in 1885, Honeywell is an international company that provides control components, products, systems, and services for the home and building, industrial, space and aviation, and defense and marine markets.

Other* 2%

Space and Aviation Control Home and 23% Building Control 45% Industrial Control 30%

*Includes sales from the SSEC 1995 Corporate Sales by Business Segment

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-119 Honeywell North American Company Profiles

Honeywell established its Solid State Electronics Center (SSEC) in 1965 to support the high technology demands in the markets served by the parent company. This growing reliance on microelectronics led SSEC to become a niche market manufacturer of specialized ICs and solid-state sensors.

Over the years, Honeywell SSEC has taken on numerous military contracts. Two of the more well known programs are the Very High Speed Integrated Circuit (VHSIC) program and the Enhanced Modular Signal Processor (EMSP) program. These programs helped position SSEC for its future in control, memory, and spaceborne applications.

The SSEC's mission is to develop and produce niche semiconductor technologies and products which are focused in the market areas of sensors, radiation-hardened space components, and specialized ICs for its parent's needs and for select external markets. SSEC is the world’s leading supplier of SOI CMOS ICs for space and industrial applications. Approximately 50 percent of the SSEC's IC production is sold to external customers.

Management

Michael R. Bonsignor Chief Executive Officer D. Larry Moore President and Chief Operating Officer Larry C. Welliver Vice President, SSEC Bryan Johnson Director, Human Resources and Facilities, SSEC Lou Del Monte Director, Business Management, SSEC Pravin Parekh Director, Operations, SSEC Jay Schrankher Director, Quality and Information Systems, SSEC Jim Becker Manager, Material Management, SSEC Peggy Kvam Manager, ASIC Products, SSEC

Products and Processes

Honeywell SSEC's key business areas are outlined below.

Space components (for commercial, military space, and tactical and strategic missile applications). ¥ SRAMs ¥ ROMs (SOI and bulk) ¥ Gate arrays (SOI and bulk) with ultra low power options ¥ Bus interface products (1773 and 1553)

Sensors (for industrial control, automotive, medical, and aircraft applications). ¥ Precision pressure ¥ High-accuracy magnetic

High-temperature products (for oil service industry, industrial control, and gas turbine control applications). All SOI devices. ¥ Op amps ¥ Switches ¥ A/D converters and controllers

1-120 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Honeywell

About 90 percent of Honeywell's ICs are manufactured using CMOS or radiation-intensive CMOS (RICMOSª) processes and 10 percent using an advanced bipolar process.

Semiconductor Fabrication Facilities

Honeywell, Incorporated Solid State Electronics Center 12001 Highway 55 Plymouth, Minnesota 55441 Cleanroom size: 16,750 square feet Capacity (wafers/week): 1,250 Wafer size: 100mm Processes: CMOS, bipolar Products: Rad-hard memories, ASICs, analog ICs, digital ICs, sensors, foundry services Feature sizes: 0.5µm, 0.7µm, 0.8µm, 1.2µm, 4.5µm

Key Agreements

¥ Honeywell SSEC licensed Micron Technology's Softool known-good die technology. It plans to use the test method to provide known-good die to the military and commercial markets, primarily for space applications.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-121 HP North American Company Profiles

HEWLETT-P ACKARD (HP)

Hewlett-Packard Company 3000 Hanover Street Palo Alto, California 94304-1112 Telephone: (415) 857-1501 Fax: (415) 857-5518 Web Site: www.hp.com

Captive IC Manufacturer

Financial History ($M), Fiscal Year Ends October 31

1991 1992 1993 1994 1995 Corporate Sales 14,494 16,410 20,317 24,991 31,519 Net Income 755 549 1,177 1,599 2,433

Semiconductor* Sales 560 745 880 1,085 1,250 IC Sales 340 400 475 585 655 Internal Sales 328 350 410 540 615 External Sales 12 50 65 45 40 Discrete Sales** 220 345 405 500 595

*Calendar year **Includes internal and external sales

Company Overview and Strategy

Hewlett-Packard (HP) is one of the world's leading designers and manufacturers of electronic, medical, analytical, and computing instruments and systems. HP divides its business into five product categories: computer products, electronic test and measurement instruments and systems, medical electronic equipment, analytical instruments, and electronic components.

Hewlett-Packard's Components Group is a leading supplier of microwave semiconductors and optoelectronic devices for the fiber-optic, wireless and visual communications, computer equipment, industrial, and automotive markets.

1-122 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles HP

Analytical Instruments Electronic Medical 3% Components Electronics

3% 4% Test/ Measurement Asia Instruments 10% 20% U.S. 45% Computers Europe 35% 80%

1995 Corporate Sales by 1995 Corporate Sales by Product Group Geographic Region

In 1992, HP completed the acquisition of Avantek, Inc. Through Avantek, HP gained a wider customer base in the components market. Those Avantek products targeted for commercial markets became part of the Communications Components Division. Those products whose main applications are defense-related make up the Avantek subsidiary of the Components Group.

Also under the wings of Hewlett-Packard is HP Labs, which is one of the world's leading electronic research centers.

Management

Lewis E. Platt President and Chief Executive Officer Richard W. Anderson Vice President and GM, Microwave and Communications Group William F. Craven Vice President and GM, Components Group Frederic N. Schwettmann Vice President and GM, Circuit Technology Group Neal Carney Marketing Manager, IC Business Division

Products and Processes

HP's semiconductor products range from analog and high-speed digital ICs to RF, microwave, and optoelectronic semiconductors. The company also offers motion control devices, solid-state relays, and millimeter-wave components. In addition, HP manufactures a RISC MPU that was designed using what it calls Precision Architecture-RISC (PA-RISC). Two of the newest PA-RISC microprocessors are the PA-8000 for high-end systems and the PA-7300LC for low-end and midrange systems. Both of the chips are based on HP’s 0.5µm, four-layer metal CMOS process.

In 1995, HP launched Tachyon, a gigibit-speed Fibre Channel single-chip controller for networked mass- storage applications. Also in 1995, HP unveiled an infared (IR) transceiver that will transmit data at 4M/second over distances up to one meter, eliminating the need for cables to exchange files between PCs and peripherals.

HP uses sophisticated semiconductor technologies based on silicon, GaAs, and InP materials.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-123 HP North American Company Profiles

Semiconductor Fabrication Facilities

Hewlett-Packard Hewlett-Packard 350 West Trimble Road 39201 Cherry Street San Jose, California 95131-1008 Newark, California 95131 Telephone: (408) 435-7400 Telephone: (408) 435-6765 Capacity (wafers/week): 1,100 Cleanroom size: 13,000 square feet Wafer sizes: 3in, 100mm Capacity (wafers/week): 1,250 Processes: Bipolar, GaAs Wafer size: 100mm Products: ASICs, optoelectronics, discretes Process: Bipolar Feature sizes: 0.5µm-5.0µm Products: Analog ICs, RFICs

Hewlett-Packard Hewlett-Packard 3404 East Harmony Road 1050 Northeast Circle Boulevard Fort Collins, Colorado 80525 Corvalis, Oregon 97330 Telephone: (303) 229-3800 Capacity (wafers/week): 5,600 Capacity (wafers/week): 1,250 Wafer sizes: 100mm, 150mm Wafer sizes: 100mm, 150mm Process: CMOS Processes: CMOS, bipolar Products: ASICs, MPUs, MPRs, DSPs Products: RFICs, microwave ICs, MPUs, ASICs Feature sizes: 0.5µm-1.0µm Feature sizes: 0.35µm-1.0µm

Hewlett-Packard Avantek, Inc. Santa Rosa, California Santa Clara, California Capacity (wafers/week): 1,000 Cleanroom size: 17,000 square feet Wafer size: 2in Capacity (wafers/week): 225 Process: Bipolar Wafer size: 3in Products: Discretes Process: GaAs Products: ICs and discretes TECH Semiconductor Singapore Pte. Ltd. P.O. Box 2093, SE 9040 990 Bendemeer Road Singapore 1233 Telephone: (65) 298-1122 Cleanroom size: 40,000 square feet Capacity (wafers/week): 1,750 Wafer size: 200mm Process: CMOS Products: DRAMs Feature size: 0.5µm (Joint venture with Texas Instruments, the Economic Development Board of Singapore, and Canon.)

1-124 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles HP

Key Agreements

¥ In August 1995, Hewlett-Packard signed an agreement with Tower Semiconductor to increase the amount of wafers HP receives from the Israeli foundry.

¥ AT&T Microelectronics (now Lucent Technologies) and Hewlett-Packard signed an agreement in early 1995 to develop and dual-source fiber-optic transceivers for SONET/SDH and ATM applications.

¥ To promote and coordinate the use of its PA-RISC architecture, Hewlett-Packard formed PRO, the Precision RISC Organization. Some of the founding members are Convex Computer, Hitachi, Oki, Hughes Aircraft, and Mitsubishi. Other members include Sequoia Systems and Winbond Electronics.

¥ Although not a PRO member, Samsung has the right to manufacture PA-RISC ICs to sell on the merchant market and use in its own workstations.

¥ HP formed an alliance with Analog Devices for the joint development of advanced mixed-signal processes based on HP's submicron CMOS and BiCMOS technologies.

¥ Hewlett-Packard and Intel announced a wide ranging joint research and development alliance in 1994 under which the partners are seeking to design a superior next-generation 64-bit microprocessor by 1998. The processor will be binary-compatible with both Intel x86 code and HP PA-RISC code.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-125 Hughes Electronics North American Company Profiles

HUGHES ELECTRONICS

Hughes Electronics Corporation

Delco Electronics Corporation Hughes Aircraft Company One Corporate Center Semiconductor Products Center Kokomo, Indiana 46904-9005 500 Superior Avenue Telephone: (317) 451-5700 Newport Beach, California 92663 Fax: (317) 451-5426 Telephone: (714) 759-2411 Web Site: www.delco.com Fax: (714) 759-2280 Web Site: www.hughes.com

Captive IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Corporate Sales 11,541 12,297 13,518 14,099 14,772 Net Income 559 (922) 922 1,049 1,108

Semiconductor Sales 330 341 350 360 340 Delco Electronics 195 205 220 235 240 Internal Sales 185 195 205 215 215 External Sales 10 10 15 20 25 Hughes Aircraft 135 136 130 125 100 Internal Sales 85 81 72 64 45 External Sales 50 55 58 61 55

Company Overview and Strategy

Hughes Electronics Corporation (HE), known as GM Hughes Electronics Corporation prior to March 1995, is a subsidiary of General Motors Corporation. HE's principal operating organizations are Delco Electronics Corporation and Hughes Aircraft Company. Its other business units are Hughes Telecommunications and Space Company, DirecTV, Inc., and Hughes Network Systems, Inc.

1-126 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Hughes Electronics

Other 1% Telecommunications and Space 21%

Aerospace and Defense Systems 40% Automotive Electronics 38%

1995 Corporate Sales by Business Segment

Delco Electronics (DE) is a world leader in the development, manufacture, and marketing of vehicle and driver systems for the global automotive market, and Hughes Aircraft, acquired by GM in 1985, is a world leader in aerospace, defense electronics, and information systems.

Delco Electronics has benefited in recent years from the rising content of electronics in vehicles and higher vehicle volumes. Electronic controllers for airbags, active suspensions, and anti-lock brakes, electronic pollution control systems, powertrain computers, and theft deterrent systems are major contributors to the increase in vehicle electronic content. Some of its new technologies include night vision systems, collision avoidance systems, navigation systems, keyless start systems, tire pressure warning systems, and reconfigurable LCD head-up displays.

Delco Electronics, alone, is the third largest captive IC manufacturer. Its fabrication facilities produce about 40 percent of its semiconductor needs.

Hughes Aircraft is continuing to restructure its business to adapt to severe cuts in U.S. defense spending. The company intends to maintain its leadership in key defense markets, while at the same time, explore new marketplaces and exploit new technologies. Some commercial ventures the company is involved in include: digital cellular communications systems, advanced acoustic technologies, light projection systems, digital signal compression, character recognition, and airport integration systems.

Management

C. Michael Armstrong Chief Executive Officer, Hughes Electronics Corporation Gary W. Dickinson Executive Vice President, Hughes Electronics Corporation; President and Chief Executive Officer, Delco Electronics Corp. John C. Weaver Senior Vice President, Hughes Electronics Corporation; President, Hughes Aircraft Company W. Scott Walker Senior Vice President and Chief Technical Officer, Delco Electronics Corp. Barry Abrahams Vice President, Business Development, Hughes Aircraft Company Robert A. Miller Vice President, Marketing, Delco Electronics Corp.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-127 Hughes Electronics North American Company Profiles

Products and Processes

IC Delco, DE's automotive semiconductor unit designs and manufactures custom analog and digital ICs for specific automotive applications such as anti-lock brake systems, engine controllers, suspension control systems, communications, and instrumentation. IC Delco also produces silicon-based electronic sensors.

Among the semiconductor devices Hughes Aircraft designs and manufactures are ASICs, memory devices, microcomputers, rad-hard circuits, and microwave/millimeter wave integrated circuits (MMICs) using a variety of process technologies including CMOS, BiCMOS, GaAs, and InP. Approximately half of its devices are sold to the merchant market.

Semiconductor Fabrication Facilities

Delco Electronics Corporation Hughes Aircraft Company IC Delco Business Unit 500 Superior Avenue 700 East Firmin Street Newport Beach, California 92663-3627 Kokomo, Indiana 46902-2340 Telephone: (714) 759-2411 Cleanroom size: 125,000 square feet (3 fabs) Capacity (wafers/week): 1,600 Capacity (wafers/week): 3,800 Wafer sizes: 100mm Wafer sizes: 100mm, 125mm Processes: CMOS, BiCMOS, SOS, CryoCMOS Processes: NMOS, CMOS, BiCMOS, bipolar Products: ASICs, memories, MCUs, LCD drivers, Products: MPUs, MCUs, ASICs, logic and digital and linear ICs, foundry services linear ICs, discretes Feature sizes: 1.25µm-5.0µm Feature sizes: 1.0µm-2.0µm

Hughes Aircraft Company 3100 Lomita Boulevard Torrance, California 90509 Telephone: (310) 517-6000 Capacity (wafers/week): 250 Wafer size: 3in Process: GaAs Products: MMICs, MM wave devices Feature size: 0.5µm

Key Agreements

¥ Delco Electronics and Texas Instruments jointly developed a new methodology, called Prism, that is intended to cut the high cost and long lead time of taking complex mixed-technology designs from concept to silicon. Prism is being used by DE to produce configurable 16-bit microcontrollers for GM cars.

1-128 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles IBM Microelectronics

IBM MICROELECTRONICS

IBM Microelectronics 1580 Route 52 Hopewell Junction, New York 12533 Telephone: (914) 894-2121 Fax: (914) 894-6891 Web Site: www.chips.ibm.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Corporate (IBM Corp.) Sales 64,766 64,523 62,716 64,052 71,940 Net Income (2,861) (4,965) (8,101) 3,021 4,178

Semiconductor Sales 3,835 3,775 3,885 4,575 5,705 Internal Sales 3,815 3,725 3,510 3,605 4,020 External Sales 20 50 375 970 1,685 Capital Expenditures 650 1,000

Employees (IBM Microelectronics) 22,000

Company Overview and Strategy

International Business Machines (IBM) was founded by Thomas J. Watson in 1924. Since then, IBM has grown into one of the world's largest corporations that sells in over 140 countries. IBM develops, manufactures, and sells advanced information processing products, including computers and microelectronics technology, software, networking systems, and information technology-related services.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-129 IBM Microelectronics North American Company Profiles

Finance and Other Latin America 5% 5% OEM Hardware* 6% Maintenance 10% Information Asia-Pacific Technology 19% North America Software Products 39% 18% 43% Europe/ Services Middle East/Africa 18% 37%

*Includes external sales of semiconductors. 1995 Corporate Sales by 1995 Corporate Sales by Geographic Region Product/Service Group

The Microelectronics Division of IBM develops, manufactures, and markets a wide range of integrated microelectronic products and technologies. Products and services range from semiconductor design and fabrication to fully assembled and tested functional assemblies.

Prior to 1992, IBM Microelectronics supplied its products and services exclusively to one customer—IBM Corporation. Spurred by both a comprehensive restructuring of IBM into independent business units and the high cost of developing advanced semiconductor technologies, IBM Microelectronics launched a worldwide microelectronics merchant market effort in 1992 by offering to sell virtually every product and service in its technology portfolio. Its products and services are targeted at manufacturers of computers, communications, and consumer electronics systems.

IBM Microelectronics’ strategic products are its PowerPC RISC microprocessors and embedded controllers, x86 microprocessors, memory ICs, ASICs, and leading-edge packaging services. Other important microelectronic products include analog and mixed-signal ICs, digital signal processors, and graphics chips. Initially, the company is seeking to establish itself as a high-volume supplier of microelectronic products such as standard DRAMs and microprocessors.

To bolster its technological leadership, IBM has entered into several major alliances. Examples of these alliances are Toshiba, Siemens, and Motorola in process technology, the PowerPC microprocessor alliance with Motorola and Apple Computer, and work in the area of x-ray lithography with AT&T, Motorola, and Loral.

Management

IBM Corporation Louis V. Gerstner, Jr. Chief Executive Officer Peter Draheim Chief Executive Officer, SubMicron Semiconductor Technologies GmbH Stanley J. Grubel Chief Executive Officer, MiCRUS

IBM Microelectronics Division Michael J. Attardo General Manager and IBM Senior Vice President James K. Picciano General Manager, Applications and Solutions Development Orest Bilous General Manager, Manufacturing and Process Development John C. Gleason Vice President and Assistant GM, Worldwide Sales and Marketing

1-130 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles IBM Microelectronics

Products and Processes

IBM Microelectronics offers the following products: ¥ Memory ICs—4M, 16M, and 64M DRAMs (standard and low power versions); 16M synchronous DRAMs (SDRAMs); 4M VRAMs; and 1M fast synchronous SRAMs; as well as SIMMs, DIMMS, and memory cards ¥ CMOS digital ASICs—gate arrays with gate counts ranging from 50,000 to 1.6 million, standard cell ASICs, and SRAM- and EEPROM-based FPGAs ¥ Bipolar analog and mixed-signal ASICs ¥ CMOS analog and mixed-signal ASICs ¥ BiCMOS analog and mixed-signal ASICs ¥ High-performance BiCMOS analog and mixed-signal ASICs ¥ 6x86, 5x86C, 486 DX4, and 486 DX2 microprocessors (the 5x86C and 6x86 are designed by Cyrix) ¥ PowerPCª 600 Series 32-bit and 64-bit RISC microprocessors (clock speeds of up to 150MHz) ¥ PowerPCª 400 Series 32-bit RISC embedded controllers ¥ MC196 16-bit microcontrollers (compatible with Intel’s MCSR-96 16-bit architecture) ¥ PCI core logic chipsets and PCI-to-PCI bridge chips ¥ High-end RGB series of palette digital-to-analog converters for 2D and 3D graphics ¥ Adaptive Lossless Data Compression (ADLC) ICs and MPEG-2 digital video encoders and decoders ¥ Mwaveª digital signal processing products for multimedia and communications applications ¥ Deep-UV photoresists ¥ Semiconductor test equipment ¥ Semiconductor packaging services for single or multiple chip applications ¥ Printed circuit boards and cards ¥ PCMCIA infrared wireless and data/fax modem products and solid state file storage products

It is estimated that at about half of IBM's merchant semiconductor business is represented by memory ICs.

IBM has developed and uses some of the industry's most advanced CMOS processing technologies including the following: 0.35µm, 0.5µm, and 0.6µm CMOS with up to five layers of metal. The company unveiled its 0.25µm CMOS 6S process technology in May 1996. While CMOS is the company's principal technology, various other processes are used, including bipolar, BiCMOS, CBiCMOS, and silicon-germanium (SiGe).

Semiconductor Fabrication Facilities

In early 1996, IBM announced $1.4 billion in fab facility expansions. Included is a $400 million upgrade of its fab in Vermont to handle 0.35µm and 0.25µm technologies for manufacturing PowerPC MPUs and embedded controllers, Mwave media chips, and other logic devices. The remaining $1 billion will go toward the construction of a 64M DRAM production line at its facility in Essonnes, France. The plant will initially fabricate 16M DRAMs, starting in late 1996 or early 1997. To make space for the 0.35µm CMOS processing line, IBM’s existing bipolar line at the facility will be closed down.

In August 1995, IBM pledged $1.2 billion to build a new 64M DRAM plant in cooperation with Toshiba at the site of a closed IBM fab in Manassas, Virginia. IBM and Toshiba will each own 50 percent of the facility, which will operate under the name Dominion Semiconductor. First silicon is expected from the fab in late 1997, with volume production beginning in 1998.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-131 IBM Microelectronics North American Company Profiles

Additionally, IBM’s near term fab plans may include another U.S.-based wafer fab. Work on the proposed fab would begin in 1997 and would likely produce logic chips with geometries of 0.35µm, initially.

IBM Microelectronics IBM Microelectronics East Fishkill Facility 1000 River Street 1580 Route 52 Essex Junction, Vermont 05452 Hopewell Junction, New York 12533 Telephone: (802) 769-0111 Telephone: (914) 894-5647 Capacity (wafers/week): 15,000 Capacity (wafers/week): 21,000 Wafer size: 200mm Wafer sizes: 125mm, 200mm Processes: CMOS, BiCMOS, bipolar Process: CMOS Products: DRAMs, SRAMs, logic and linear ICs, Products: Logic ICs, memories, R&D ASICs, MPUs, foundry services Feature sizes: 0.25µm-1.0µm Feature sizes: 0.5µm-1.0µm (IBM's ASTC—Advanced Semiconductor Technology Center is located here)

IBM Microelectronics IBM Microelectronics Thomas J. Watson Research Center 3605 Highway 52 North Route 134 Rochester, Minnesota 55901 Yorktown Heights, New York 10598 Telephone: (507) 253-4011 Telephone: (914) 945-3000 Products: Prototype ICs Products: R&D

IBM Microelectronics IBM Research Division 5600 Cottle Road Zurich Research Lab San Jose, California 95193 Saumerstrasse 4 Telephone: (408) 256-1600 CH-8003 Ruschlikon, Switzerland Processes: Bipolar, MOS Telephone: (41) (1) 724-8111 Products: R&D and some production Products: R&D

IBM France IBM United Kingdom Labs Ltd. 224 Bd. John Kennedy Hursley Park P.O. Box 58 North Winchester F-91102 Corbeil Essones-Cedex Hampshire SO21 2JN France England Telephone: (33) (1) 60-88-51-51 United Kingdom Capacity (wafers/week): 6,250 Telephone: (44) (962) 84-4433 Wafer size: 125mm Wafer size: 200mm Process: Bipolar Processes: Bipolar, MOS Products: MPUs Products: R&D Feature sizes: 1.0µm, 1.5µm (Being converted to a 0.35µm CMOS processing line for the manufacture of DRAMs.)

1-132 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profile IBM Microelectronics

IBM/Siemens IBM Duetschland GmbH Corbeil Essones-Cedex Werk Singdelfingen France Postfach 266 Cleanroom size: 116,000 square feet Singdelfingen, Germany Capacity (wafers/week): 3,000 Telephone: (49) 7031-910 Wafer size: 200mm Capacity (wafers/week): 18,750 Process: CMOS Wafer sizes: 125mm, 200mm Products: DRAMs Processes: Bipolar, CMOS Feature sizes: 0.35µm-5.0µm Products: DRAMs, SRAMs, ASICs, DSPs, MPUs Feature sizes: 0.8µm-2.0µm

IBM Japan Ltd. MiCRUS 800 Ohaza Ichimayake, Yasu-Machi 1580 Route 52 Yasu-gun, Shiga-ken 520-23, Japan Hopewell Junction, New York 12533 Telephone: (81) (755) 88-2511 Telephone: (914) 892-2121 Capacity (wafers/week): 2,500 Capacity (wafers/week): 5,000 Wafer sizes: 125mm-200mm Wafer size: 200mm Process: CMOS Process: CMOS Products: MPUs, DSPs, ASICs, logic ICs Products: DRAMs, logic ICs Feature size: 0.6µm Feature sizes: 0.5µm-0.8µm (DRAM production discontinued here in 1996.) (Joint venture with Cirrus Logic. See Key Agreements.)

SubMicron Semiconductor Technologies GmbH Dominion Semiconductor LLC Schoenaicherstrasse 220 Manassas, Virginia Boeblingen, Germany Capacity (wafers/week): 7,500 Wafer size: 200mm Wafer size: 200mm Process: CMOS Process: CMOS Products: DRAMs, logic ICs Products: DRAMs Feature size: 0.8µm Feature size: 0.35µm (Joint venture with Philips. The partners plan (Joint venture with Toshiba. Scheduled to begin to upgrade the fab to handle 0.5µm line production in early 1998. See Key Agreements.) widths. See Key Agreements.)

Key Agreements

¥ IBM and Synopsys announced a six-year R&D agreement in February 1996 to jointly develop tools and methodologies for designing complex ICs with as many as 10 million gates.

¥ IBM licensed the Rambus ASIC Cell (RAC) high-bandwidth interface technology in early 1996 from Rambus to use in its SystemCore ASIC megacell library.

¥ IBM granted licensing rights to Exponential Technology, Inc. to develop and market a new ultra-high- performance BiCMOS microprocessor based on the PowerPC architecture. Volume shipments of Exponential’s MPU are expected to begin in early 1997.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-133 IBM Microelectronics North American Company Profiles

¥ In August 1995, IBM and Toshiba announced they would build a new 64M DRAM plant at the site of a closed IBM fab in Manassas, Virginia. IBM and Toshiba will each own 50 percent of the facility, which will operate under the name Dominion Semiconductor. First silicon is expected from the fab in late 1997 with production beginning in 1998.

¥ Ramtron signed a manufacturing agreement with IBM in May 1995 for EDRAM production. Under the agreement, IBM is serving as a foundry for the production of Ramtron-subsidiary Enhanced Memory Systems' EDRAMs, and IBM has a non-exclusive license to sell the devices.

¥ In 1994, Philips agreed with IBM Microelectronics to form a joint venture to manufacture ICs at IBM's fab facility in Boeblingen, Germany. Philips holds 51 percent and IBM 49 percent of the new company, called SubMicron Semiconductor Technologies GmbH (SMST). SMST is supplying products solely to IBM and Philips, manufacturing 4M DRAMs for IBM and 0.8µm logic ICs for Philips. The two companies are also discussing the possibility of additional technology cooperation.

¥ IBM and Cirrus Logic formed a joint manufacturing venture called MiCRUS in 1994. MiCRUS fabricates wafers for both companies in a former IBM plant in East Fishkill, New York. IBM and Cirrus Logic own 52 percent and 48 percent of MiCRUS, respectively. The two companies have said they each will invest $160 million in MiCRUS over the next few years to expand its capacity and capabilities. For the time being, the agreement does not include product and/or technology exchange.

¥ S3 Incorporated signed an agreement with IBM for the production of S3's graphics accelerators at IBM's fab in Essex Junction, Vermont.

¥ The PowerPC RISC architecture has been, and continues to be, codeveloped by IBM, Motorola, and Apple Computer. The trio of companies are also working on combining the PowerPC technology with an open hardware platform supporting a range of operating systems.

¥ IBM is producing 16M and 64M DRAMs with Siemens at their partnership fab in Corbeil-Essones, France. The two companies are also working with Toshiba and Motorola for the development of 256M DRAMs based on 0.25µm process technology.

¥ Toshiba licensed the PowerPC microprocessor technology from IBM Microelectronics. Although Toshiba was not given the right to sell the PowerPC on the merchant market, it does have the right to develop and manufacture its own derivatives of the processor. For now, IBM will produce the MPUs for Toshiba.

¥ National Semiconductor and IBM are working on an isochronous (time-dependent) Ethernet LAN project.

¥ IBM and Cyrix announced a five-year agreement in early 1994 calling for IBM to manufacture Cyrix's 486, 5x86, and 6x86 microprocessors. The two companies equally share the output of the Cyrix-designed chips.

¥ IBM and Analog Devices announced in late 1993 plans to jointly design, produce, and market mixed- signal and RF chips based on IBM's silicon-germanium (SiGe) process technology.

1-134 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles IBM Microelectronics

¥ In mid-1993, IBM licensed Atmel's fine-grained SRAM-based FPGA architecture. IBM is allowed to use, modify, manufacture, and sell Atmel's FPGAs. IBM’s first FPGA based on the Atmel architecture were expected to be introduced in 1H96.

¥ IBM is working with Motorola, Loral Federal Systems, and Lucent Technologies to establish a manufacturing infrastructure for x-ray lithography. The team hopes to have a manufacturing capability by 1997.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-135 IC Works North American Company Profiles

IC WORKS

IC Works, Inc. 3725 North First Street San Jose, California 95134-1700 Telephone: (408) 922-0202 Fax: (408) 922-0833

IC Manufacturer

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 Sales 5* 21 26 41

Employees 85 125 150 200

*Reflects six months of operation.

Company Overview and Strategy

IC Works was established in June 1992, when it acquired the San Jose fabrication facility, process technology, and engineering and manufacturing staff of Samsung Semiconductor, the U.S. business of Korea’s Samsung. As an independent company, IC Works designs, manufactures, and markets mixed- signal products using its design and in-house facility, and provides quick-turn, submicron foundry services to selected mixed-signal semiconductor companies.

IC Works operates three complementary mixed-signal businesses—clock products, wireless communications products, and submicron foundry services.

Memory ICs 3%

Europe Japan 10% 10% Foundry North Clock Generators America 44% 53% ROW 50% 30%

1995 Sales by Product Type 1995 Sales by Geographic Region

1-136 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles IC Works

Management

Ilbok Lee, Ph.D. President and Chief Executive Officer Aurelio Fernandez Vice President, Worldwide Sales John Hagedorn Vice President and Chief Financial Officer John Kelly Vice President, Fab Operations Richard Miller Vice President, Marketing Chen Wang Vice President, Engineering

Products and Processes

IC Works' product and services include high-performance clock generator ICs, wireless communication circuits, and foundry services. New products for the computer and data communications markets are being developed.

Foundry Services IC Works’ in-house foundry provides special services to mixed-signal semiconductor companies for the development, prototyping, and early production of new products.

Clock Products IC Works offers a wide range of high performance phase-locked-loop (PLL) based clock ICs for system manufacturers in a variety of markets. The main applications within the clock market include PC motherboards, communications, mass storage, multimedia, and workstations. Products include clock buffers and single and dual PLL clocks.

Wireless Communications Utilizing its PLL and BiCMOS process technologies, IC Works is developing RF solutions for the wireless marketplace, focusing on data communications. This product strategy includes development of component level functional block products and ASSPs.

As part of the buyout, Samsung licensed IC Works to use its scaleable submicron CMOS and BiCMOS process technologies. Currently, the majority of IC Works’ production wafer output is processed to 0.7µm design rules with a migration to 0.6µm under way. Future plans include development of finer geometry processes down to 0.35µm.

Semiconductor Fabrication Facilities

IC Works, Inc. 3725 North First Street San Jose, California 95134-1700 Cleanroom size: 15,000 square feet (Class 1) Capacity (wafers/week): 1,200 (expanding) Wafer size: 125mm (upgrading to 150mm) Processes: CMOS, BiCMOS Products: Mixed-signal ICs, foundry services Feature sizes: 0.5µm, 0.7µm (0.35µm under development)

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-137 IC Works North American Company Profiles

IC Works is in the process of expanding its fab capacity with financial support from its three fab partners, Exar Corporation, Sierra Semiconductor, and TelCom Semiconductor Inc. The $50 million expansion, which includes moving from 125mm to 150mm wafers, is scheduled to be completed in the first half of 1997.

Key Agreements

¥ In 1996, IC Works and Motorola announced a second-source agreement for the development and manufacture of CMOS and BiCMOS-based mixed-signal timing circuits. Motorola will contribute high- performance timing solutions targeted at workstations, servers, and network applications, while IC Works will provide “clock” solutions targeting personal computers and peripheral applications.

¥ IC Works and Exar announced a $15 million wafer production agreement in 1995, under which IC Works will provide wafers to Exar over the next five years. As part of the agreement, Exar will purchase and install equipment in IC Works’ facility to convert it from 125mm wafers to 150mm wafers and improve its process technology.

¥ IC Works has a foundry agreement with TelCom Semiconductor. Under the agreement, TelCom will invest $10 million in equipment and the expansion of IC Works’ submicron wafer fabrication facility, in return for wafer capacity.

1-138 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles ICS

INTEGRATED CIRCUIT SYSTEMS (ICS)

Integrated Circuit Systems, Inc. 2435 Boulevard of the Generals P.O. Box 968 Valley Forge, Pennsylvania 19482-0968 Telephone: (610) 630-5300 Fax: (610) 630-5399 Web Site: www.icsinc.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Sales 21 37 78 94 104 Net Income 0.6 4 11 12 5 R&D Expenditures 6 7 9 10 11

Employees 224 314 336 219

Company Overview and Strategy

Founded in 1976, Integrated Circuit Systems, designs, develops, and markets mixed-signal integrated circuits primarily for data communications, clock, and multimedia applications. The company also provides custom application specific ICs (ASICs) for the consumer, medical, telecommunications, and aerospace industries.

ICS’s primary focus is to combine its innovation, market position, and competency in mixed-signal and phase locked-loop technology to capitalize on the trend convergence of computer, communications, and consumer applications, especially in the LAN/WAN communications marketplace.

For most of its formative years ICS concentrated on supplying its mixed-signal technology in custom ASIC designs for OEMs. In the late 1980’s, ICS began to develop proprietary standard products. ICS entered the frequency timing generator (FTG) business in 1989 with a pioneering FTG for video clocks.

In 1992, ICS completed the acquisition of the Avasem Corporation, the leader in motherboard clocks. Together, ICS and Avasem offer a breadth of clock products unequaled by any other company.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-139 ICS North American Company Profiles

Multimedia/ ARK Logic Turtle Beach 14% 12%

Clock ICs ASICs 55% 19%

1995 Sales by Product Group

In April 1995, ICS purchased a majority interest in ARK Logic Inc., a Santa Clara, California-based developer of graphical user interface (GUI) accelerator devices. ARK Logic's graphics controller technology was merged with ICS's audio and mixed-signal RAMDAC and video clock generator technologies to provide complete PC multimedia solutions.

In 1995, ICS introduced a line of high-performance transceiver chips designed for international use in the latest network systems. These devices work in local area networks (LANs) and wide area networks (WANs), including the newest technologies such as SONET/SDH fiber optic systems, asynchronous transfer mode (ATM) copper/fiber systems, and fast Ethernet systems.

Sales outside of the United States, primarily to the Pacific Rim, reached approximately 55 percent of total sales in 1995.

Management

David W. Sear, Ph.D. President, Chief Executive Officer, and Chief Operating Officer N. Werner Anderson Senior Vice President, Quality Assurance Hock Tan Senior Vice President, Finance and Administration, and Chief Financial Officer Perry Denning Vice President, Operations Ray Lu President, ARK Logic and Director, Multimedia Business Group Gregory Richmond Vice President, FTG Business Group (San Jose, CA) William Weir Vice President, Data Communications Business Group John Klein Director, Custom Products

Products and Processes

ICS's products are outlined below. The products are designed and produced using CMOS processing technologies ranging from 0.35µm to 3.0µm.

Data Communications Products Multimedia Audio Products ¥ Fast Ethernet LAN ¥ Music synthesizers ¥ ATM ¥ Audio codecs (coder and decoders) ¥ SONET/SDH ¥ Software for wavetable music synthesis

1-140 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles ICS

Clock Products Turtle Beach Products ¥ Motherboard timing generators ¥ Multimedia sound cards ¥ Video timing generators ¥ CD-ROM Products ¥ Graphics timing for workstations ¥ Software ¥ Special-purpose FTGs for Pentium Pro and PowerPC microprocessors and chipsets ASIC Products ¥ Customized, application-specific ICs Others ¥ Battery Charger ICs

Semiconductor Fabrication Facilities

All of ICS's wafers are currently manufactured by outside foundries, two of which meet a substantial majority of the company's wafer needs. One of ICS’s foundry partners is AMI.

Key Agreements

¥ ICS acquired a 51 percent interest in ARK Logic, Inc. in 3Q95. ICS plans to combine its audio design specialty with ARK’s video graphics expertise to develop a chip that handles 3D graphics, VGA control, and audio and video processing. ICS may purchase the remaining 49 percent of ARK Logic.

¥ In October 1992, ICS entered into an alliance with American Microsystems Inc., in which ICS secured wafer processing capacity through the year 2000.

¥ ICS licensed DSP Group’s Pine digital signal processing and TrueSpeech voice compression technologies for use in its next-generation audio components.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-141 ICT North American Company Profiles

ICT

ICT Inc. 2123 Ringwood Avenue San Jose, California 95131 Telephone: (408) 434-0678 Fax: (408) 434-0688 Web Site: www.ictpld.com

Fabless IC Supplier

Financial History ($M)

1991 1992 1993 1994 1995 Sales 6 8 10 12 15

Employees 30 50 75 75 80

Company Overview and Strategy

ICT Inc. was founded in November 1991 after acquiring the business originally established in 1983 by International CMOS Technology.

ICT is organized into two divisions: the Programmable Logic Division (PLD) and the Personal Computer Products Division (PCPD). The PLD division designs, develops, and markets user-programmable integrated circuits specializing in programmable logic devices (PLDs). The PCPD division designs and markets PC core logic chipsets and peripheral controller products. ICT's products are used by designers of computer, telecommunication, industrial control, medical, and consumer electronics systems.

Management

Larry Matheny President and Chief Executive Officer Volker Cathrein Chief Financial Officer Edward Barnett Vice President, Marketing Donald E. Robinson Vice President, Special Products Web Chang Director, Engineering, PCPD Manny Pitta Director, Marketing, PCPD

1-142 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles ICT

Products and Processes

ICT's programmable logic product line consists of two families of CMOS PLDs—PEEL Devices and PEEL Arrays—in addition to supporting development tools. PEEL Devices are simple PLDs designed as replacements for standard 20-pin and 24-pin PAL/GAL devices with speed grades ranging from 5ns to 25ns. PEEL Arrays are complex PLDs (CPLDs) that combine a non-segmented PLA with FPGA-like logic cells with wide single-level delays as fast as 9ns/15ns (internal/external). PEEL Arrays are used for combinatorial logic, with clocking frequencies running up to 80MHz for sequential functions.

PEEL Devices PEEL Arrays PEEL 16V8 PA7024 PEEL 18CV8 PA7128 PEEL 20V8 PA7140 PEEL 20CG10A PEEL 22CV8 PEEL 22CV10A

ICT's PLDs are designed and manufactured using proprietary 0.8µm CMOS EEPROM technology.

The company's PC product line consist of Pentium and 486 portable and desktop core logic chipsets, programmable peripheral interface ICs, and peripheral controller ICs.

Semiconductor Fabrication Facilities

As with other fabless IC suppliers, ICT utilizes external fabrication and assembly facilities. ICT wafers are currently fabricated by two companies: Chartered Semiconductor Manufacturing of Singapore and Rohm Co. of Japan. Assembly work is handled by multiple vendors in the Philippines, Thailand, and Taiwan, while testing functions are performed at the firm's headquarters in San Jose.

Key Agreements

¥ ICT has a license agreement with AMD involving PLD products.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-143 IDT North American Company Profiles

INTEGRATED DEVICE TECHNOLOGY (IDT)

Integrated Device Technology, Inc. 2972 Stender Way Santa Clara, California 95054 Telephone: (408) 727-6116 Fax: (408) 727-8043 Web Site: www.idt.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 203 236 330 422 680 Net Income (33) 5 40 78 120 R&D Expenditures 52 54 64 78 133 Capital Expenditures 26 28 38 95 n/a

Employees 2,159 2,414 2,615 2,965 3,875

Company Overview and Strategy

Integrated Device Technology, Inc. (IDT), founded in 1980, designs, manufactures, and markets complex proprietary and industry standard integrated circuits using high-performance CMOS and BiCMOS process technologies. The company's four semiconductor product groups are synergistic, and are aimed primarily at manufacturers of high-performance electronic systems in the desktop computing, network server, communications, and office automation industries. The product groups are SRAMs, specialty memory products (SMPs), logic products, and RISC microprocessors.

Military/Other RISC 6% Microprocessors Server/ 11% Workstation 11%

Desktop SRAMs Office Logic Products 39% 40% Automation 21% 18% Specialty Communications Memory Products 26% 28%

1995 Sales by End-Use Market 1995 Sales by Product Group

1-144 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles IDT

Japan Asia 9% 10%

Europe United States 20% 61%

1995 Sales by Geographic Region

Management

Leonard C. Perham President and Chief Executive Officer Stuart Bardach Vice President, Quality Charles R. Clark Vice President, Subsystems Products William B. Cortelyou Vice President, Wafer Operations Robin H. Hodge Vice President, Assembly and Test Alan H. Huggins Vice President, Memory Division Daniel Lewis Vice President, Sales Chuen-Der Lien Vice President, Technology Development John R. Mick Vice President, Systems Technology Group Danny R. Morris Vice President, FIFO Products Alex Naqvi Vice President, Microprocessor RISC Products Bob Phillips Vice President, Worldwide Manufacturing Richard R. Picard Vice President, Logic and Microprocessor Products Joseph F. Santandea Vice President, Special Products Christopher P. Schott Vice President, Specialty Memory Products William D. Snyder Vice President, Finance and Chief Financial Officer Thomas B. Wroblewski Vice President, Human Resources

Products and Processes

IDT produces SRAMs, specialty memory products (SMPs), logic products, and RISC microprocessors. These products are designed and manufactured using proprietary advanced submicron CMOS and BiCMOS process technologies, including the company's newest CMOS VIII 0.5µm process. The next-generation 0.35µm process is due in 1996. IDT's product groups are outlined below.

SRAMs ¥ Standard fast CMOS and BiCMOS SRAMs with 16K to 1M densities and access times as fast as 12ns. ¥ 3.3V fast CMOS and BiCMOS SRAMs with 256K and 1M densities and access times as fast as 15ns. ¥ Cache and cache tag SRAMs for 486, Pentium, PowerPC, and R3000 microprocessors as fast as 7ns. ¥ High-speed BiCMOS ECL I/O SRAMs with 4K to 1M densities and access times as fast as 4ns. ¥ High-speed CMOS and BiCMOS module products. ¥ Will introduce in 1996 its “Fusion Memory”, a combination of DRAM-type circuitry with near high-end SRAM performance.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-145 IDT North American Company Profiles

Specialty Memory Products (SMPs) ¥ High-speed CMOS and BiCMOS multi-port RAMs with 16K to 256K densities. ¥ First-in, first-out memories (FIFOs) in synchronous unidirectional or bidirectional and asynchronous unidirectional or bidirectional versions.

Logic Products ¥ High-speed FCT and FCT-T CMOS logic devices. ¥ High-speed complex logic devices. ¥ ATM transceiver devices.

RISC Microprocessors ¥ R3000- and R4000-based 32-bit microprocessors, microcontrollers, and cores, as well as the fourth generation R4600 Orion 64-bit microprocessor. ¥ RISC subsystems.

Semiconductor Fabrication Facilities

Integrated Device Technology Integrated Device Technology 1566 Moffett Street 2670 Seeley Road Salinas, California 93905 San Jose, California 95134 Fab 2 Telephone: (408) 944-0114 Cleanroom size: 24,000 square feet (Class 3) Fab 3 Capacity (wafers/week): 2,050 Cleanroom size: 24,000 square feet (Class 1) Wafer size: 150mm Capacity (wafers/week): 2,050 Process: CMOS Wafer size: 150mm Products: SRAMs, FIFOs, MPUs Processes: CMOS, BiCMOS Feature sizes: 0.5µm-0.8µm Products: SRAMs, FIFOs, RISC MPUs, logic ICs, R&D Feature sizes: 0.5µm-0.8µm

Integrated Device Technology Hillsboro, Oregon Fab 4 Cleanroom size: 48,000 square feet (Class 1) Capacity (wafers/week): 1,875 (3,000 when fully outfitted) Wafer size: 200mm Processes: CMOS, BiCMOS Feature sizes: 0.35µm, 0.5µm (Began operations in 1Q96)

Key Agreements

¥ IDT licensed its SRAM, RISC, and other IC technologies to startup South Korean IC producer Iljin Group. Iljin is expected to start production at its new 200mm fab in 3Q97.

¥ IDT, a MoSys Inc. foundry and minority investor, will serve as an alternate second-source supplier for a MoSys Multi-bank DRAM device version called MCache or Fusion Memory.

1-146 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles IDT

¥ IDT codesigned its Mips-based Orion 64-bit RISC microprocessor with its partner, Quantum Effect Design.

¥ IDT is cooperating with Siemens in the production of 32-bit microcontrollers based on the Mips Computer Systems R3000 architecture. The two parties are also jointly developing 32-bit RISC controller derivatives for peripherals and embedded-control applications as well as second-sourcing each other's products.

¥ IDT agreed with Toshiba to codevelop and manufacture derivatives of the R3000/R4000 Mips microprocessor architecture for embedded control, PC, and Unix markets.

¥ IDT signed an alternate source agreement with Texas Instruments for logic products. TI and IDT are also jointly developing FIFO memory devices.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-147 IMI North American Company Profiles

INTERNATIONAL MICROCIRCUITS (IMI)

International Microcircuits Inc. 525 Los Coches Street Milpitas, California 95035-5423 Telephone: (408) 263-6300 Fax: (408) 263-6571

IC Manufacturer

Employees 70

Company Overview and Strategy

International Microcircuits Inc. (IMI) was formed in 1972 to manufacture high quality chrome photomasks. With the invention of the CMOS gate array two years later, IMI pursued a new business and an engineering philosophy to which it has adhered.

In the early 1990's IMI began developing niche application specific standard products (ASSPs), building on its years of experience in ASICs. The company has a particular strength in the area of frequency synthesis using phase-locked loop (PLL) techniques.

Management

Frank Deverse President and Chief Executive Officer Charlie Stimson Vice President, Sales and Marketing, and Chief Financial Officer Orhan Tozun Vice President, Engineering Ed Walsh Vice President, Manufacturing

Products and Processes

IMI's products are focused on two major applications: frequency synthesis for telecommunications and clock generation for digital systems. These products include clock generation devices for PC motherboards (including those based on the latest CISC and RISC processors) and PLLs and phase detectors for cellular phones, cordless phones, satellite receivers, and cable TV boxes.

Semiconductor Fabrication Facilities

International Microcircuits Inc. 525 Los Coches Street Milpitas, California 95035-5423 Cleanroom size: 2,000 square feet (Class 10) Wafer size: 150mm Process: CMOS Products: ASSPs

1-148 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles IMP

IMP

IMP, Inc. 2830 North First Street San Jose, California 95134-2108 Telephone: (408) 432-9100 Fax: (408) 434-0335 Web Site: www.impweb.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 46 56 48 60 77 Net Income (6) (2) 0.4 1 5 R&D Expenditures 9 10 9 9 10 Capital Expenditures 0.2 2 5 5 n/a

Employees 331 324 340 400 425

Company Overview and Strategy

IMP was founded in 1981 as International Microelectronic Products, but changed its name to IMP, Inc. in 1993. Originally in the custom IC business, IMP began marketing its silicon foundry in 1987 and exited the custom IC business in 1990 with the introduction of its first standard product. IMP is now comprised of two business groups, the Application-Specific Standard Products group and the Customer-Specific Products group.

The company's ASSP group designs, manufacturers, and markets a proprietary line of value-added ICs for tape and disk drive manufacturers. The CSP group provides a wide range of CMOS IC manufacturing processes (specializing in mixed-signal) to companies in the computer and computer peripherals markets, as well as to fabless semiconductor companies and IMP's own ASSP group. Value-added processes include 0.8µm CMOS, EECMOS, 3-volt, and BiCMOS.

Europe and ASSPs Pacific Basin 18% 21%

North America CSP 79% 82%

1995 Sales by Geographic Region 1995 Sales by Product Group

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-149 IMP North American Company Profiles

To address the need for wafer capacity by small fabless startup companies, IMP announced the establishment of its Silicon Venture Partners (SVP) program in May 1995. Under the SVP program, IMP provides access to wafer fabrication capabilities to fabless semiconductor startups. This includes absorbing some of the expenses of developing and producing a new IC in exchange for product, marketing, and/or technology rights, a share of future profits, or other compensation.

Management

David A. Laws President and Chief Executive Officer Charles S. Isherwood Senior Vice President and Chief Financial Officer Russ Almand Vice President, Sales Jerry Block Vice President, Materials Robert J. Crossley Vice President, Administration Jerry L. DaBell Vice President, Product Development and Applications Moiz B. Khambaty, Ph.D. Vice President, Technology Eugene J. Vaatveit Vice President, Manufacturing

Products and Processes

Application-Specific Standard Products ¥ High-frequency programmable filters for tape and disk drives. ¥ Read channel ICs with both 3V and 5V operation for tape and disk drives. ¥ Electrically programmable analog circuits (EPAC™)—Analog counterparts to digital FPGAs that are designed for signal conditioning applications in the sensor, instrumentation, and industrial control markets. The EPACs are based on IMP's mixed-signal 1.2µm EECMOS process.

Customer-Specific Products—IMP provides specialized or value-added foundry services. The firm is capable of running multiple processes in the same fab. ¥ CMOS Analog Processes: For analog and mixed-signal applications in mass storage products, fax modems, local area networks, cellular phones, and computers. ¥ EECMOS Process: Suitable for customization or personalization of customer designed circuits through on-chip electrical programming. ¥ High-Voltage Processes: Allows a chip to be designed with some sections functioning up to 18 volts and other sections at the typical 5 volts. ¥ 3-volt Processes: To be used with circuits designed for portable system applications.

IMP's process technologies include: 0.8µm double-poly/double-metal CMOS, 1.0µm single- and double- poly/double-metal CMOS, 1.2µm low-voltage and high-voltage CMOS, 1.2µm double-poly/double-metal BiCMOS, and 1.2µm double-poly/double-metal EECMOS.

1-150 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles IMP

Semiconductor Fabrication Facilities

IMP, Inc. 2830 North First Street San Jose, California 95134 Cleanroom size: 16,000 square feet (Class 10) Capacity (wafers/week): 3,000 Wafer size: 125mm Processes: CMOS, BiCMOS, EECMOS Products: ASSPs, ROMs, foundry services Feature sizes: CMOS: 0.8µm, 1.0µm, 1.2µm, 2.0µm, 3.0µm, 5.0µm BiCMOS: 1.2µm EECMOS: 1.2µm

Key Agreements

¥ In July 1995, IMP signed a five-year foundry agreement with Rockwell Semiconductor Systems for the fabrication of Rockwell’s mixed-signal modem ICs.

¥ IMP joined with Zilog and Allegro MicroSystems in a marketing alliance. The team is marketing what they call a ZIA disk drive chipset, with ZIA standing for Zilog, IMP, and Allegro. IMP's contribution to the ZIA chipset are the read channel ICs and ROMs.

¥ In 1992, IMP signed a technology and distribution agreement with Asahi Kasei Microsystems (AKM) covering ASSPs.

¥ IMP has a design and process technology transfer agreement with South African Microelectronic Systems (SAMES). SAMES purchased the rights to IMP's 1.2µm and 2.0µm mixed-signal process technologies and has been qualified as a second source for IMP high-volume manufacturing processes.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-151 Integrated Silicon Solution North American Company Profiles

INTEGRATED SILICON SOLUTION (ISSI)

Integrated Silicon Solution Inc. 680 Almanor Avenue Sunnyvale, California 94086 Telephone: (408) 733-4774 Fax: (408) 245-4774

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends September 30

1991 1992 1993 1994 1995 Sales 10 29 53 61 123 Net Income (1) 1 6 5 30 R&D Expenditures 236915

Employees 190 228 311

Company Overview and Strategy

Integrated Silicon Solution, Inc. (ISSI) was founded in 1988 and focused its initial development efforts on high-performance SRAMs for cache memory applications. The company introduced its first SRAM products in 1990, and has since expanded its product offerings to include high-speed EPROMs, serial EEPROMs, and flash memory devices. To date, SRAM sales have accounted for substantially all of ISSI's product sales.

The majority of the company's sales are derived from Taiwan-based PC motherboard manufacturers, but an increasing portion is coming from PC, data communications, networking, and telecommunications OEMs in the U.S. and Asia. ISSI's business in Taiwan is handled by its wholly owned subsidiary, Integrated Silicon Solution (Taiwan), Inc. (ISSI-Taiwan).

United States/ Europe 44% Asia 56%

1995 Sales by Geographic Region

1-152 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Integrated Silicon Solution

Management

Jimmy S.M. Lee President and Chief Executive Officer Kong-Yeu Han Executive Vice President, and General Manager, ISSI-Taiwan Gary L. Fischer Executive Vice President, Finance and Administration and Chief Financial Officer Robert B. Cushman Vice President, Marketing Steve Hsia Vice President, Technology Yun S. Hwang Vice President, Design Engineering Ming D. Ni Vice President, DSP Products Robert Shen Vice President, Manufacturing and Corporate Planning John Unger Senior Director, Quality Assurance Thomas Doczy Director, North American Sales Chie-Siang Hong Director, Test and Product Engineering

Products and Processes

ISSI designs and markets a family of high-performance SRAMs, as well as several families of nonvolatile memory products, such as high-speed, high-density EPROMs, serial EEPROMs, and flash memories. In addition to new SRAM and nonvolatile products, the company is developing a memory-intensive application- specific DSP device that incorporates its memory technology.

SRAM Products ¥ 5V SRAMs in 64K, 256K, 512K, and 1M density levels with access speeds as low as 10ns. ¥ 3.3V SRAMs in 256K, 512K, and 1M density levels with access speeds as low as 12ns. ¥ 3.3V 1M synchronous SRAMs for Pentium and PowerPC cache applications.

EPROM Products ¥ 5V EPROMs in 256K, 512K, and 1M density levels with access speeds of 30ns to 90ns. ¥ 3.3V EPROMs in 512K and 1M density levels with 90ns access times. ¥ 2.4V voice EPROMs with embedded speech algorithm technology.

EEPROM Products ¥ 3.3V and 5V serial EEPROMs in 1K, 2K, and 4K density levels.

Flash Memory Products ¥ 1M Intel-compatible bulk-erase flash memories. The company plans to introduce a 2M bulk-erase and 1M, 2M, and 4M boot block flash chips in 1996.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-153 Integrated Silicon Solution North American Company Profiles

ISSI develops its advanced CMOS process technology in collaboration with its Asian manufacturing partners. Through these alliances, ISSI has jointly developed and taken into production five generations of CMOS memory technology with 1.2µm, 1.0µm, 0.8µm, 0.6µm, and 0.5µm feature sizes. The company currently has several development programs with Taiwan Semiconductor Manufacturing Company (TSMC), including a program based on a 0.35µm design for advanced SRAM applications and a 0.5µm design for a high- speed flash memory product. The company also has collaborative programs with Chartered Semiconductor Manufacturing (CSM) in Singapore for 0.5µm SRAM process technology and with Belling Semiconductor in China for EEPROM design and process technology.

Semiconductor Fabrication Facilities

ISSI has adopted the fabless manufacturing strategy. Its principal manufacturing partner is TSMC, with whom it also jointly develops process technology. In 1995, 90 percent of ISSI’s wafer capacity was supplied by TSMC. Since 1993, ISSI has also used Chartered as a foundry for some SRAM and flash products. ISSI also has agreements with United Microelectronics Corporation (UMC), and Vanguard Semiconductor, both located in Taiwan, for additional supply of wafers. (see Key Agreements below).

Key Agreements

¥ In early 1996, ISSI announced an agreement with Intel. ISSI is licensing flash-related patents from Intel and will pay royalty fees to Intel for the sales of certain flash-based products.

¥ In fiscal 1995, ISSI and UMC signed a manufacturing and joint venture agreement. Under terms of the agreement, ISSI will invest $30 million for equity in a joint manufacturing venture that will provide ISSI with an additional supply of wafers beginning in 1997. In the interim, ISSI has secured foundry capacity with UMC for its wafer supply in 1996.

¥ ISSI has an agreement with Vanguard Semiconductor, located in Taiwan, for Vanguard’s SRAM wafers. Under the agreement, Vanguard will supply ISSI with certain SRAM wafers in exchange for the right to sell specified quantities of the wafers under the Vanguard name.

¥ ISSI has a collaborative development effort with Rohm Corporation for flash memory products.

1-154 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Intel

INTEL

Intel Corporation 2200 Mission College Boulevard P.O. Box 58119 Santa Clara, California 95052-8119 Telephone: (408) 765-8080 Fax: (408) 765-1821 Web Site: www.intel.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 4,779 5,844 8,782 11,521 16,202 IC Sales 3,900 4,950 7,550 9,850 13,590 Net Income 819 1,067 2,295 2,285 3,566 R&D Expenditures 618 780 970 1,111 1,296 Capital Expenditures 948 1,228 1,933 2,441 3,550

Employees 24,600 25,800 29,500 32,600 41,600

Company Overview and Strategy

Intel Corporation was established in 1968 to pursue the potential of integrating large numbers of transistors into silicon chips. The company created the first DRAM, the first EPROM, and the first microprocessor, revolutionizing the electronics industry by making possible small and powerful computing systems. Intel originally flourished as a MOS memory supplier. However, in 1985 Intel abandoned the DRAM business, in favor of microprocessors.

Today, Intel is by far the world's leading supplier of MOS microprocessors. The company's other principal products are microprocessor peripherals, motherboards, network and communications products, embedded controllers, and flash memory devices. Its IC products are sold to manufacturers of computer systems and peripherals, automotive equipment, industrial systems, and telecommunications products.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-155 Intel North American Company Profiles

Flash Memories Systems/ 4%

Other 16% Japan 11% Asia Pacific 12% North America Microcomponents Europe 49% 80% 28%

1995 Sales by Product Group 1995 Sales by Geographic Region

Thanks to strong demand for its microprocessors, Intel grew to become the world's largest semiconductor manufacturer in 1993. Part of Intel's strategy to maintaining momentum and supporting demand for its products is heavy reinvesting with its profits. Since 1991, Intel has invested more in new plants and equipment each year than any other semiconductor company in the world. The company expects to expend approximately $4.1 billion for capital additions in 1996.

Intel believes that communications and multimedia will be decisive areas for the PC industry in the next decade. For this reason, the company continues to introduce new hardware and software products for local area network (LAN) management and personal computer conferencing systems. Intel is also pushing its multimedia extension (MMX) technology, which the company says speeds up the execution of multimedia- related functions by routing compute-intensive code to the central processor, rather than through dedicated silicon. The first processor to use the MMX instruction set will be the Pentium P55C in 4Q96. Intel’s other chips are expected to gain MMX capability in 1997.

Management

Andrew S. Grove President and Chief Executive Officer Craig R. Barrett Executive Vice President and Chief Operating Officer G. Carl Everett, Jr. Senior Vice President and GM, Desktop Products Group Frank C. Gill Senior Vice President and GM, Intel Products Group David L. House Senior Vice President and Director, Corporate Strategy Paul S. Otellini Senior Vice President and Director, Sales Gerhard H. Parker Senior Vice President and GM, Technology and Manufacturing Group Robert W. Reed Senior Vice President and GM, Semiconductor Products Group Leslie L. Vadasz Senior Vice President and Director, Corporate Business Development Ronald J. Whittier Senior Vice President and GM, Intel Architecture Laboratories Albert Y. C. Yu Senior Vice President and GM, Microprocessor Products Group Michael A. Aymar Vice President and GM, Intel486 Microprocessor Division Andy D. Bryant Vice President and Chief Financial Officer Dennis L. Carter Vice President and Director, Corporate Marketing Group Sunlin Chou Vice President and Director, Components Technology Development Jean-Claude Cornet Vice President and Director, Microprocessor Technology Richard DeLateur Vice President, Finance

1-156 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Intel

Michael Fister Vice President, Microprocessor Products Group Hans Geyer Vice President and GM, Intel Europe Robert T. Jenkins Vice President and Director, Corporate Licensing D. Craig Kinnie Vice President and Director, Architecture Development Lab Michael Maibach Vice President, Government Affairs Sean Maloney Vice President, Sales David Marsing Vice President, Technology and Manufacturing Group Edward A. Masi Vice President and GM, Scalable Systems Division Stephen P. Nachtsheim Vice President and GM, Mobile and Handheld Products Group Jacob Pena Vice President, Technology and Manufacturing Group David Perlmutter Vice President, Microprocessor Products Group Pamela Pollace Vice President, Corporate Marketing William Siu Vice President, Technology and Manufacturing Group Stephen Smith Vice President, Microprocessor Products Group Michael R. Splinter Vice President and GM, Components Manufacturing

Products and Processes

Intel's principal products are microprocessors, core logic chipsets based on the PCI bus, embedded processors and microcontrollers, flash memory chips, computer modules and boards, network and communications products, personal conferencing products, and scalable parallel processing computers. Some of these products are described in more detail below.

¥ Microprocessors—Intel's 32-bit microprocessors include the Intel486 family, the fifth-generation Pentium family, and the sixth-generation Pentium Pro family. The leading edge Pentium is a 3.3-volt 166MHz processor. The Pentium Pro, which is available in 150MHz, 166Mhz, 180MHz, and 200MHz speed grades, makes use of RISC-like techniques that Intel has chosen to call "dynamic execution". Intel announced in early 1996 that it would phase out its commercial-grade 486SX2 and DX processor lines by the end of 1997. The company will continue to offer 486SX, DX2, and DX4 MPUs, as well as its new ultra-low-power 486SX, but only for embedded applications.

¥ Embedded Processors and Microcontrollers—This product line includes the company's i960 family of 32- bit RISC processors, Intel386 and Intel486 processor cores, the 80C196 microprocessor family, and 8-bit and 16-bit microcontrollers.

¥ Flash Memory Chips—Intel continues to be the largest flash memory producer. The company provides a broad line of flash memory devices, with densities ranging from 1M to 16M. In early 1996, Intel announced that it was scaling back production of low-density (256K and 512K) flash parts to open up capacity for higher density devices.

¥ Computer Boards and Modules—A significant portion of Intel's Pentium processors are sold as board-, system-, or module-level products to OEMs.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-157 Intel North American Company Profiles

Intel uses advanced CMOS and BiCMOS process technologies in the manufacture of its integrated circuits. In 1995, most of Intel’s IC products were manufactured using 0.6µm process technology. During 1996, the company will aggressively migrate its microprocessor production to the 0.35µm level. In fact, by the end of 1996 Intel expects the majority of its processors will be at 0.35µm. The company expects to begin fabricating chips using 0.25µm process technology in 1997. Some of Intel’s products are still manufactured with 0.8µm and 1.0µm process technologies.

Semiconductor Fabrication Facilities

During 1995, Intel announced the construction of three new 200mm wafer fabs, one in Oregon (Fab 13), one in Ireland (Fab 14), and one in Israel (Fab 18). Fab 13 will be part of a $2.2 billion campus that will initially be used for research and development, but eventually volume production of the company's Pentium Pro and future P7 microprocessors. The first phase will cost $565 million and is scheduled to come on-line in 1997, at which time the company's aging Fab 4 facility at the site will be closed down.

Fab 14 is an expansion of the existing Fab 10 in Ireland. It will be used to manufacture microprocessors in generations beyond the Pentium Pro. Completion of the $1.5 billion plant is scheduled for 1998.

In Israel, the $1.6 billion Fab 18 will be used for the production of flash memory chips beginning in 1998. The factory was named out of sequence because 18 is said to be a lucky number in Hebrew tradition.

Intel Corporation Intel Corporation 3585 Southwest 98th Avenue 3601 Juliet Lane Aloha, Oregon 97007 Santa Clara, California 95050 Telephone: (503) 681-8080 Telephone: (408) 496-9023 Fabs D1A Fab D2 Cleanroom size: 20,000 square feet Cleanroom size: 70,000 square feet (Class 1) Capacity (wafers/week): 3,225 Capacity (wafers/week): 4,000 Wafer size: 200mm Wafer size: 200mm Process: CMOS Processes: CMOS, BiCMOS Products: MPUs, R&D Products: MPUs, R&D Feature sizes: 0.25µm-0.6µm Feature sizes: 0.25µm-0.6µm

Intel Corporation Intel Corporation 5200 N.E. Elam Young Parkway 2111 Northeast 25th Avenue Aloha, Oregon 97124-6497 Aloha, Oregon 97124 Telephone: (503) 681-8080 Telephone: (503) 681-8080 Fab 4 (To be closed in early 1997) Fab 5 Cleanroom size: 30,000 square feet Cleanroom size: 10,000 square feet Capacity (wafers/week): 4,500 Capacity (wafers/week): 500 Wafer size: 100mm Wafer size: 150mm Processes: NMOS, CMOS Processes: CMOS, BiCMOS Products: MPUs, MCUs, EPROMs Products: Logic and memory ICs, MPUs Feature sizes: 0.8µm, 1.0µm Feature sizes: 0.6µm, 0.8µm, 1.0µm

1-158 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Intel

Intel Corporation Intel Corporation 5000 West Chandler Boulevard 4100 Sara Road SE Chandler, Arizona 85226-3699 Rio Rancho, New Mexico 87124 Telephone: (602) 554-8080 Telephone: (505) 893-7000 Fab 6 Fab 7 Cleanroom size: 35,000 square feet Cleanroom size: 60,000 square feet Capacity (wafers/week): 5,375 Capacity (wafers/week): 8,000 Wafer size: 150mm Wafer size: 150mm Processes: NMOS, CMOS Process: CMOS Products: MPUs, MCUs Products: Flash memories Feature sizes: 0.8µm, 1.0µm Feature sizes: 0.4µm, 0.6µm, 0.8µm

Intel Israel, Ltd. Intel Corporation Jerusalem, Israel 4100 Sara Road SE Fab 8 Rio Rancho, New Mexico 87124 Cleanroom size: 10,000 square feet Telephone: (505) 893-7000 Capacity (wafers/week): 5,250 Fab 9 Wafer size: 150mm Cleanroom size: 60,000 square feet Process: CMOS Capacity (wafers/week): 7,000 Products: MPUs Wafer size: 150mm Feature sizes: 0.6µm, 1.0µm Processes: CMOS, BiCMOS Products: MPUs, flash memories Feature sizes: 0.4µm, 0.6µm

Intel Ireland, Ltd. Intel Corporation Collinstown Industrial Park 4100 Sara Road SE Leixlip, County Kildare, Ireland Rio Rancho, New Mexico Telephone: (353) (1) 707-7000 Telephone: (505) 893-7000 Fab 10 Fab 11 Cleanroom size: 65,000 square feet (Class 1) Cleanroom size: 140,000 square feet (Class 1) Capacity (wafers/week): 6,000 Capacity (wafers/week): 9,500 Wafer size: 200mm Wafer size: 200mm Process: BiCMOS Processes: BiCMOS, CMOS Products: MPUs Products: MPUs Feature size: 0.6µm Feature size: 0.35µm

Intel Corporation Intel Corporation Chandler, Arizona Hillsboro, Oregon Fab 12 (Startup in 1997) Fab 13 (Startup in 1997) Cleanroom size: 140,000 square feet (Class 1) Cleanroom size: 140,000 square feet (Class 1) Capacity (wafers/week): 12,000 Capacity (wafer/week): 12,000 Wafer size: 200mm Wafer size: 200mm Process: CMOS Process: CMOS Products: MPUs Products: R&D, MPUs Feature size: 0.25µm Feature sizes: 0.25µm, 0.4µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-159 Intel North American Company Profiles

Intel Ireland, Ltd. Intel Israel, Ltd. Collinstown Industrial Park Kiryat Gat, Israel Leixlip, County Kildare, Ireland Fab 18 (Startup in 1998) Telephone: (353) (1) 707-7000 Cleanroom size: 80,000 square feet (Class 1) Fab 14 (Startup in 1998) Capacity (wafers/week): 7,500 Cleanroom size: 80,700 square feet (Class 1) Wafer size: 200mm Capacity (wafers/week): 7,000 Process: CMOS Wafer size: 200mm Products: Flash memories Process: CMOS Feature sizes: 0.25µm, 0.4µm Products: MPUs Feature size: 0.25µm

Intel has semiconductor assembly and test facilities in Malaysia and the Philippines. In addition, the company is building a new assembly and test factory in Shanghai, China, scheduled for completion in 1997.

Key Agreements

¥ Integrated Silicon Solution Inc. (ISSI) licensed flash memory-related patents from Intel in early 1996.

¥ Intel and AMD signed a five-year patent cross-licensing agreement near the end of 1995 giving the two companies rights to use each other’s MPU-related patents and certain copyrights—excluding microprocessor code. AMD agreed not to use Intel microcode beyond the 486 MPU generation.

¥ In October 1995, Intel and flash memory card maker SanDisk agreed to cross-license the full inventory of their respective flash memory patent portfolios. The deal does not include a physical exchange of technology.

¥ Intel entered a cross-licensing agreement with Micron Technology covering Intel's full range of flash memory patents and products.

¥ Intel and Hewlett-Packard announced a wide ranging joint research and development alliance in 1994 under which the partners are seeking to design a superior next-generation 64-bit microprocessor by 1998. The processor will be binary-compatible with both Intel x86 code and HP PA-RISC code.

¥ Intel announced that it signed a 10-year licensing agreement with Sharp Corporation to co-develop 0.6µm and 0.4µm processes for Intel's flash memory ICs. Sharp currently manufactures a significant portion of Intel’s flash memory products on a foundry basis.

¥ Intel and Philips extended a patent cross-license agreement they made in 1977 to include all of each other's semiconductor devices except certain proprietary Intel MPUs and Philips video products. The agreement is now valid until the year 2000.

1-160 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Interdesign

INTERDESIGN

Interdesign Custom Arrays Corporation 525 Del Ray Avenue Sunnyvale, California 94086-3515 Telephone: (408) 749-1166 Fax: (408) 749-1718

Fabless IC Supplier

Company Overview and Strategy

Founded in 1984, Interdesign is a member of the ELEX Group of companies headquartered in Belgium. Through its association with ELEX, Interdesign offers mixed-signal CMOS custom and standard cell ASICs in addition to its own MM and MV bipolar arrays.

The ELEX Group also has a wafer foundry, X-FAB, located in Germany with technologies that include N-well and P-well CMOS, vertical DMOS, MOS analog to 40V, and micro sensors. Foundry services are available to U.S. semiconductor and sensor companies, through Interdesign acting as an interface between the foundry and the customers.

"Interdesign" has been registered as a trademark and the company has commenced doing business as Interdesign.

Management

Robert W. Townley President William H. Hass Vice President, Finance

Products and Processes

Interdesign supplies mixed-signal CMOS ASICs, both custom and standard cell.

Semiconductor Fabrication Facilities

Interdesign occupies an 8,000-square-foot facility devoted to assembly, test, and engineering.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-161 International Rectifier North American Company Profiles

INTERNATIONAL RECTIFIER (IR)

International Rectifier Corporation 233 Kansas Street El Segundo, California 90245 Telephone: (310) 322-3331 Fax: (310) 322-3332 Web Site: www.irf.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Sales 253 265 282 329 429 IC Sales* 12 15 17 22 29 Net Income 16 9 (3) 16 39 R&D Expenditures 8 9 14 16 20 Capital Expenditures 14 35 17 25 107

Employees 2,700 3,000 2,700 3,100 3,310

*Calendar year

Company Overview and Strategy

International Rectifier (IR) was founded in 1947 and is today a major worldwide manufacturer of power semiconductors with applications in the automotive, consumer electronics, computer/peripheral, industrial, lighting, telecommunications, and government/space markets.

The company's growth products for fiscal 1995 included HEXFET¨ power MOSFETs, insulated gate bipolar transistors (IGBTs), control ICs, and high-performance diodes. In control ICs, new development efforts concentrate on devices tailored to their applications. New control ICs are tuned to specific power levels, features, and circuit topologies in motor control, lighting, and power supply applications.

Asia 26% North America 46% Europe 28%

1995 Sales by Geographic Region

1-162 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles International Rectifier

Management

Alexander Lidow Chief Executive Officer Derek B. Lidow Chief Executive Officer Robert J. Mueller Executive Vice President, External Affairs and Business Development Michael P. McGee Vice President and Chief Financial Officer Gene Sheridan Director, Strategic Product Marketing

Products and Processes

IR manufactures power semiconductors, including HEXFET power MOSFETs, IGBTs, power ICs, diodes, rectifiers, thyristors, and standard and custom power modules.

In late 1995, IR introduced its next-generation manufacturing technology, a four-step mask, low-voltage process called Gen 5. The Gen 5 process is already being used at the company’s Temecula fab.

Semiconductor Fabrication Facilities

International Rectifier International Rectifier (HEXFET America) 233 Kansas Street 41915 Business Park Drive El Segundo, California 90245 Temecula, California 92390 Telephone: (310) 322-3331 Telephone: (714) 676-7500 Capacity (wafers/week): 3,250 Cleanroom size: 45,000 square feet Wafer size: 100mm Capacity (wafers/week): 13,100 Processes: CMOS, MOS Wafer sizes: 125mm, 150mm Products: Discretes, power ICs Processes: CMOS, MOS Feature size: 5.0µm Products: Discretes, power ICs Feature sizes: 1.0µm-5.0µm

International Rectifier Italiana, S.p.A. Via Privata Liguria 49 10071 Borgoro, Turin, Italy Telephone: (39) 11-470-14-84 Capacity (wafers/week): 6,250 Wafer size: 100mm Products: Discretes

Key Agreements

¥ International Rectifier signed a cross-licensing and alternate-source agreement with Motorola covering power ICs and power discretes.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-163 ISD North American Company Profiles

INFORMATION STORAGE DEVICES (ISD)

Information Storage Devices, Inc. 2045 Hamilton Avenue San Jose, California 95125 Telephone: (408) 369-2400 Fax: (408) 369-2422 Web Site: www.isd.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Sales 0.2 5 23 39 55 Net Income (3) (3) — 4 6 R&D Expenditures 11237

Employees 70 122

Company Overview and Strategy

Information Storage Devices, Inc. (ISD), designs, develops, and markets integrated circuits for voice recording and playback using the company’s proprietary ChipCorderª storage technology. The company’s ChipCorder products are targeted at the consumer, communications, and industrial market segments.

In 1991, ISD introduced its first commercially available products—non-volatile chips that store analog signals in analog form. From its inception in December 1987, ISD's charter has been to develop such devices for storage of voice, music, and other forms of analog information on a single chip.

ISD's storage technology is adaptable to a variety of small form factor applications, such as hand-held products, alarms, answering machines, cellular phones, greeting cards, and implantable medical devices. The firm's original chips were capable of storing up to 20 seconds of information. However, ISD claims parts based on a new 0.8µm process will be able to store 180 seconds of information. The company has received eight patents with several others pending. ISD became a public company in February 1995.

1-164 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles ISD

Europe 7%

United States 35% Asia 58%

1995 Sales by Geographic Region

Management

David L. Angel President and Chief Executive Officer Trevor Blyth Vice President, Advanced Development Michael Geilhufe Vice President, Quality and Reliability Genda Hu Vice President, Technology Scott Owen Vice President, Engineering and Chief Operating Officer Felix J. Rosengarten Vice President, Finance and Chief Financial Officer Steve Stephansen Vice President, Marketing, Sales, and Business Development Al Woodhull Vice President, Manufacturing

Products and Processes

ISD's ChipCorderª products are solid-state memory devices based on flash technology that store analog signals in a multi-level format. The company currently offers five product families incorporating its ChipCoder Technology. All of the company’s ChipCoder products feature an on-chip oscillator, microphone preamplifier, automatic gain control, anti-aliasing filter, smoothing filter, and speaker amplifier. The devices are being built using 0.8µm, 1.2µm, and 1.5µm CMOS technology.

Semiconductor Fabrication Facilities

ISD currently has foundry agreements with Rohm, Sanyo, and Samsung.

Key Agreements

¥ ISD formed an agreement with Samsung to jointly develop and market products based on ISD's ChipCorder technology for the recording and playback of voices. The deal also guarantees ISD a portion of Samsung's fab capacity.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-165 IXYS North American Company Profiles

IXYS

IXYS Corporation 3540 Bassett Street Santa Clara, California 95054 Telephone: (408) 435-1900 Fax: (408) 435-0670 Web Site: www.ixys.com

Fabless IC Supplier

Company Overview and Strategy

IXYS Corporation designs, develops, and markets a broad spectrum of power semiconductors, integrated circuits, and modules for the global power market. IXYS products are incorporated into various industrial, commercial, and military systems.

Founded in 1983, IXYS has been an innovator in power MOS semiconductor products and technologies since its inception. However, it has differentiated itself by focusing on the higher voltage and higher power end of the MOSFET and IGBT spectrum. The company's strategy is to provide cost-effective systems solutions for its target markets. To that end, it provides several lines of low-cost chipsets for various applications.

In April 1989, IXYS acquired the Asea Brown Boveri (ABB) power semiconductor operation in Lampertheim, Germany. Now called IXYS, GmbH, the firm is recognized for pioneering direct copper bonding-to-ceramic packaging technology and provides IXYS with a strong foothold in the European market.

Management

Nathan Zommer, Ph.D. President and Chief Executive Officer Peter Ingram Managing Director, IXYS Semiconductor GmbH Arnold Agbayani Vice President, Finance Rich Fassler Vice President, Sales and Marketing

Products and Processes

The IGBT discrete and IGBT module product lines are the company's flagship products. They are targeted at the AC motor drive market first and at electric vehicles for the long-term market.

1-166 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles IXYS

IXYS's major product lines include:

Modules ¥ IGBT modules ¥ High current thyristor and rectifier modules ¥ Rectifier bridges ¥ Custom (customer-specific) power modules

Discretes ¥ IGBTs ¥ MegaMOS FETs ¥ HiPer FETª ¥ Ultra-fast recovery epitaxial diodes (FREDs) ¥ High-current rectifiers and switching current regulators ¥ High-power thyristors and rectifiers

Smart Power ICs ¥ High-voltage current regulators ¥ Half-bridge (high side/low side) smart power ICs ¥ Pulse width modulation controllers

For the design of its products, IXYS uses a proprietary HDMOS (high performance DMOS) technology, which is compatible with standard bulk CMOS.

Semiconductor Fabrication Facilities

The company’s semiconductor products are fabricated in external wafer fabrication facilities through technology and foundry relationships with a number of semiconductor companies throughout the world.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-167 Lansdale Semiconductor North American Company Profiles

LANSDALE SEMICONDUCTOR

Lansdale Semiconductor, Inc. 2502 West Huntington Drive Tempe, Arizona 85282 Telephone: (602) 438-0123 Fax: (602) 438-0138 Web Site: ssi.syspac.com/~lansdale

IC Manufacturer

Financial History ($M)

1991 1992 1993 1994 1995 Sales 97768 Net Income 2 0.5———

Employees 40 38 40 45 50

Company Overview and Strategy

Founded in 1964, Lansdale Semiconductor is a semiconductor life cycle extender dedicated to manufacturing past and present technologies as long as the market requires them. The privately-held company is a strategic resource for critical military programs, telecommunications systems, and semiconductor OEMs wishing to offer their products longer than the normal lifecycle dictates.

The company purchases lines as they are discontinued by large semiconductor companies such as Intel, Signetics, Harris, National, and Motorola. It actively seeks new product licenses from semiconductor manufacturers as part of its niche strategy and supports OEM semiconductor companies by manufacturing wafers on a foundry basis to extend their product lifecycles.

Military weapons systems typically operate for approximately 25 years while the commercial lifecycle of a semiconductor chip is about seven years. Lansdale manufactures and supports these products on a continuing basis making it possible to extend the lifecycles of the system and its products.

Management

R. Dale Lillard Owner and President

1-168 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Lansdale Semiconductor

Products and Processes

Lansdale's current product lines (about 2,600 parts) include NMOS 8-bit MPUs and bipolar general purpose logic, MPU, SRAM, PROM, and linear ICs, as well as bipolar full custom devices.

Original Manufacturer Product Line AMD Digital Bipolar ICs Raytheon DTL 200 Series ICs Signetics DTL, TTL ICs, 54LS, 82S, 54S, 54H, LSI, 8X Motorola SUHL ICs, 5400 TTL, 3000 TTL, 900 DTE, RTL, Linear Harris 0512 Bipolar PROMs, 7600 Bipolar PROMs/Diode Matrices National PMOS ICs Intel 8080A and peripherals, 828x Peripherals

Semiconductor Fabrication Facilities

Lansdale Semiconductor, Inc. 2502 West Huntington Drive Tempe, Arizona 85282 Cleanroom size: 10,000 square feet (Class 100) Capacity (wafers/week): 2,000 Wafer sizes: 100mm, 3in Processes: Bipolar, LS, Linear, TTL Products: Foundry service, Bipolar ICs Feature size: 3µm, two-layer metal

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-169 Lattice Semiconductor North American Company Profiles

LATTICE SEMICONDUCTOR

Lattice Semiconductor Corporation 5555 Northeast Moore Court Hillsboro, Oregon 97124-6421 Telephone: (503) 681-0118 Fax: (503) 681-0347 Web Site: www.latticesemi.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 71 103 126 144 198 Net Income 11 17 22 27 42 R&D Expenditures 13 17 21 23 27

Employees 263 352 355 438 450

Company Overview and Strategy

Lattice Semiconductor, founded in 1983, is a leader in the design, development, and marketing of high- density and low-density, high-speed EECMOS programmable logic devices (PLDs) and related software development systems. Its proprietary Generic Array Logic (GAL¨ ), pLSI¨ , and ispLSI¨ devices are sold worldwide, primarily to OEMs of microcomputers, computer peripherals, graphics systems, workstations, telecommunications gear, military systems, and industrial controls.

Lattice's strategy is to offer a full line of high-performance and cost-effective standard programmable devices based on innovative architectures while offering design flexibility through reprogrammable technology. The company supports its products with sophisticated logic development tools providing high functionality at low cost that can be easily adopted and fully integrated with common third-party CAE development systems.

International 47% U.S. 53%

1995 Sales by Geographic Region

1-170 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Lattice Semiconductor

Management

Cyrus Y. Tsui President and Chief Executive Officer Albert L. Chan Vice President, California Product Development Stephen M. Donovan Vice President, International Sales Paul T. Kollar Vice President, Sales Steven A. Laub Vice President and General Manager Rodney F. Sloss Vice President, Finance and Secretary Jerry G. Taylor Vice President, Oregon Product Development Jonathan K. Yu Vice President, Operations Kenneth K. Yu Vice President and Managing Director, Lattice Asia

Products and Processes

Lattice's base business involves its GAL product family, targeting the low-density simple PLD (SPLD) market. The company sells the industry standard GAL16V8, GAL20V8, GAL22V10, GAL20RA10, and GAL20XV10 architectures in a variety of speed grades (as fast as 3.5ns), with 5V or 3.3V signal compatibility. Lattice also offers several proprietary architectures, the GAL26CV12, GAL18V10, GAL16VP8, GAL20VP8, and GAL6001/2, each of which is optimized for specific applications. In 1994, the company extended its GAL line by introducing the ispGAL22V10, bringing the advantages of in-system programmability to the low density market.

Lattice entered the high-density complex PLD (CPLD) market in 1992 by releasing its pLSI¨ and ispLSI¨ 1000 product families. The second-generation 1000E family, incorporates familiar GAL-like logic building blocks and offers performance up to 125MHz (7.5ns) and densities of 2,000 to 8,000 gates. Two of the company's newer families are the 2000 and 3000 series. The isp/pLSI 2000 family provides speeds of up to 150MHz (5.5ns) and is the first high-density PLD architecture capable of supporting advanced microprocessors operating at clock speeds over 60MHz. The isp/pLSI 3000 family offers densities of 8,000 to 14,000 gates, while retaining performance up to 110MHz (10ns). In early 1996, Lattice announced it would begin offering predefined, function-specific memory and counter-timer megacells for its pLSI and ispLSI CPLD families.

Lattice also offers its ispGDSª (Generic Digital Switch) family of in-system programmable switching matrices targeted at mechanical dip switch replacement and connectivity applications.

The company's products are based on a proprietary EECMOS process technology, called UltraMOS¨ . The current mainstream process, UltraMOS V, is a 0.65µm, double-metal CMOS technology. Lattice moved its 0.5µm UltraMOS VI process into production in late 1995.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-171 Lattice Semiconductor North American Company Profiles

Semiconductor Fabrication Facilities

Most Lattice Semiconductor products are produced by Seiko Epson in Japan. In 1994, Lattice invested $42 million in Seiko Epson for the expansion of Seiko’s submicron wafer fab in Sakata, Japan. The investment will provide Lattice with additional submicron manufacturing capacity through 1997.

Lattice added Taiwan’s United Microelectronics Corporation (UMC) as a foundry partner in 1995. In October 1995, Lattice said it would invest $60 million over a two-year period for a 10 percent equity stake in one of UMC’s joint-venture fabs that will come on-line in mid-1997. Additionally, UMC agreed to provide Lattice with interim wafer capacity from one of its existing fabs.

Key Agreements

¥ Lattice entered into a joint venture with UMC and Oak Technology. Lattice will invest $60 million to gain a 10 percent equity stake in a new joint-venture wafer fab UMC is building in Taiwan. The fab is expected to begin production in mid-1997. UMC also agreed to supply Lattice with wafers from an existing fab until the new fab comes on line.

¥ In 1994, Lattice signed a production agreement with Seiko Epson. As part of the agreement, Lattice advanced Seiko $42 million to finance additional submicron wafer capacity at its fab in Sakata, Japan. In 1995, Lattice invested an additional $2 million for the development of submicron process technology.

¥ Lattice licensed both National and SGS-Thomson to second source its EECMOS PLDs.

¥ Lattice has a cross-licensing agreement with AMD under which patents for AMD's PALs have been exchanged for Lattice's GAL patents.

1-172 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Level One

LEVEL ONE COMMUNICATIONS

Level One Communications Inc. 9750 Goethe Road Sacramento, California 95827 Telephone: (916) 855-5000 Fax: (916) 854-1101 Web Site: www.level1.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 6 14 26 47 78 Net Income (3) 2 4 8 10 R&D Expenditures 3 6 10 17

Employees 48 70 139 221 300

Company Overview and Strategy

Level One Communications, Inc., founded in 1985, is a leading supplier of silicon connectivity solutions for complex mixed-signal communications and networking applications. The company name “Level One” refers to the company’s focus on the physical layer, “layer one”, of the seven layer network model developed by the International Standards Organization (ISO).

The company specializes in the development of ASSPs, such as transceivers, repeaters, and related devices used in two key areas of the telecommunications and data communications industry: interface solutions for digital transmission systems; and local and wide area networking (LAN/WAN) solutions, including Ethernet LAN, datacom, and digital modems. Most of Level One’s ICs feature complex functions incorporated on a single silicon chip for applications formerly requiring multiple chips.

In June 1995, the company acquired San Francisco Telecom, which operates as a wholly owned subsidiary and develops products for the telecommunications market.

Management

Robert D. Pepper, Ph.D. Chief Executive Officer J. Francois Crepin Vice President, Business Development George B. Holmes Vice President, Worldwide Sales John Kehoe Vice President, Finance and Chief Financial Officer Daniel S. Koellen Vice President, Quality and Reliability Assurance Manual Yuen Vice President, Operations

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-173 Level One North American Company Profiles

Products and Processes

Level One’s semiconductor products include T1/E1 transceivers, receivers, repeaters, and clock adapters; digital subscriber line (DSL) chipsets; PDM multiplexers; and Ethernet transceivers and repeaters.

Semiconductor Fabrication Facilities

Level One utilizes several foundries in the U.S., Europe, and the Far East for the fabrication of its ICs.

Key Agreements

¥ In 1995, Level One entered into a technology agreement with Maker Communications Inc. for the development of asynchronous transfer mode (ATM) products.

1-174 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Linear Systems

LINEAR SYSTEMS

Linear Integrated Systems, Inc. 4042 Clipper Court Fremont, California 94538 Telephone: (510) 490-9160 Fax: (510) 353-0261

Fabless IC Supplier

Company Overview and Strategy

Linear Integrated Systems (LIS), a.k.a. Linear Systems, was formed in 1987 with the goal of establishing a market niche by taking advantage of refractory-metal interconnect technology. Most firms have stayed away from refractory metals and instead prefer to use CVD and silicon-gate technologies.

Linear Systems specializes in developing integrated circuits for applications in systems where obsolete devices or processes are no longer available or require upgrading. Existing IC products include operational amplifiers, voltage references, and multiplexers. Besides proprietary products, Linear Systems also supplies a broad range of second source and obsolete devices manufactured to customer's requirements.

In addition to semiconductor design and custom manufacturing services, state-of-the-art precision thin film services are also offered.

Management

John H. Hall President Mark Ashton General Manager Don Howland Manager, Eastern U.S. Marketing Paul Norton Manager, Western U.S. Marketing

Products and Processes

Linear Systems’ proprietary product line includes bipolar linear ICs (e.g., amplifiers, voltage references, multiplexers) and discretes, as well as full custom bipolar, CMOS, and BiCMOS ICs.

Using CMOS, bipolar, and dielectric isolation processes, Linear Systems offers a family of second-source products including multiplexers, monolithic dual N-channel JFETs, monolithic dual PNPs and NPNs, switches, and amplifiers.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-175 Linear Technology North American Company Profiles

LINEAR TECHNOLOGY

Linear Technology Corporation 1630 McCarthy Boulevard Milpitas, California 95035-7487 Telephone: (408) 432-1900 Fax: (408) 434-0507 Web Site: www.linear-tech.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Sales 94 119 151 201 265 Net Income 17 25 36 57 85 R&D Expenditures 10 12 10 9 9 Capital Expenditures 8 10 8 16 22

Employees 730 800 870 1,000 1,350

Company Overview and Strategy

Linear Technology Corporation (LTC) was founded in 1981 to design, manufacture, and market a broad line of high-performance standard linear integrated circuits. Its devices monitor, condition, amplify, or transform continuous analog signals associated with such physical properties as temperature, pressure, weight, position, light, sound, or speed.

The company targets its product and marketing efforts toward the high-performance segments of the linear circuit market. Applications for its products include telecommunications; notebook and desktop computers; video/multimedia; computer peripherals; cellular telephones; industrial, automotive and process controls; network and factory automation products; and satellites.

Other 17% Japan 10% U.S. 51% Europe 22%

1995 Sales By Geographic Region

1-176 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Linear Technology

Management

Robert H. Swanson, Jr. President and Chief Executive Officer Paul Chantalat Vice President, Quality, Reliability, and Service Paul Coghlan Vice President, Finance and Chief Financial Officer Timothy D. Cox Vice President, North American Sales Clive B. Davies, Ph.D. Vice President and Chief Operating Officer Robert C. Dobkin Vice President, Engineering Sean T. Hurley Vice President, Operations Thomas D. Recine Vice President, Marketing Hans J. Zapf Vice President, International Sales

Products and Processes

Linear Technology products include: operational, instrumentation, and audio amplifiers; voltage regulators, power management devices, references, comparators, and data converters; switched-capacitor filters; communications interface circuits; single-chip data acquisition sub-systems; pulse width modulators; and sample-and-hold devices. The company markets approximately 4,700 finished part types, of which more than 80 percent are proprietary.

Linear Technology uses a variety of process technologies in the design and fabrication of its chips, including standard bipolar, CMOS, BiCMOS, and complementary bipolar, as well as thin-film and laser trimming technologies.

Semiconductor Fabrication Facilities

Linear Technology Corporation Linear Technology Corporation 1630 McCarthy Boulevard Camas, Washington Milpitas, California 95035-7487 Fab 3 Fabs 1 and 2 Capacity (wafers/week): 2,500 Cleanroom size: 170,000 square feet Wafer size: 150mm Capacity (wafers/week): 4,500 Processes: CMOS, bipolar Wafer size: 100mm Products: Linear ICs Processes: CMOS, BiCMOS, bipolar Feature sizes: ≤2.0µm Products: Linear ICs (Began production in 2Q96) Feature sizes: 2.0µm-3.0µm

In early 1995, Linear Technology commenced its own plastic assembly facility in Penang, Malaysia. In the past, the company exclusively used subcontractors for the assembly of its ICs. Now, approximately half of the company’s assembly requirements for plastic packages are met by the Malaysian facility.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-177 Linfinity Microelectronics North American Company Profiles

LINFINITY MICROELECTRONICS

Linfinity Microelectronics Inc. 11861 Western Avenue Garden Grove, California 92641-2119 Telephone: (714) 898-8121 Fax: (714) 898-2781

IC Manufacturer

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Corporate Sales 62 69 88 98 103 Net Income 226710

Semiconductor Sales 33 27 31 39 40 Capital Expenditures 1225

Company Overview and Strategy

Linfinity Microelectronics Inc. (LMI) is a wholly owned subsidiary of Symmetricom, Inc. (formerly Silicon General, Inc.). It was founded in 1968 as Silicon General Semiconductors and adopted its current name in 1993. LMI designs, manufactures, and markets linear bipolar, CMOS, and BiCMOS integrated circuits for industrial, commercial, automotive, and military applications. Linfinity's special area of expertise is in power management with an emphasis on mixed-signal technology. The company is expanding the value-added products and services it currently provides for power supply systems, while adding product lines to serve new areas such as signal conditioning and motion control systems.

Management

Brad P. Whitney President and Chief Operating Officer Ralph Brandi Vice President, Sales Shufan Chan Vice President, Development Mark Granahan Vice President, Marketing Kelly Jones Vice President, Manufacturing

1-178 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Linfinity Microelectronics

Products and Processes

Linfinity's products generally address three main markets: power supply systems, motion control, and signal conditioning.

Power Supply Linfinity is a leading supplier of a wide variety of power management products, including pulse width modulators (PWMs), voltage regulators, supervisory circuits, and power factor conversion chips. Typical applications for these products include desktop and portable computers, portable communications equipment, video monitors, automotive entertainment, HVAC products, satellites, and lighting. The new product focus in this area includes controllers, linear regulators, DC-DC converters, FET drivers, and voltage supervisors.

Motion Control Linfinity makes two kinds of motion control integrated circuits: one that controls the spin motor in computer disk drives and the other controls the position of the read-write head. The new product focus in this area includes sensorless spindle controllers, voice coil controllers, and brushless DC motor controllers.

Signal Conditioning Linfinity's signal conditioning circuits include operational amplifiers, comparators, and voltage references. Typical applications include instrumentation, industrial controls, telecommunications, and audio equipment.

Linfinity uses a wide range of process technologies that address linear and mixed-signal product requirements.

Bipolar Two main process flows are available in this technology. Option A provides a rugged, high-voltage (60V), high-power process for applications such as off-line power supplies and motor drivers. Option B provides a high-performance, low-voltage (20V) process for applications in high-speed, low-noise signal conditioning equipment.

CMOS Exhibiting all the characteristics of a good analog CMOS process it provides 18V MOS transistors coupled with high density 3.0µm feature sizes for optimal packing density. Limited logic capability is available at this feature size.

BiCMOS The BiCMOS process combines the Option B bipolar and CMOS processes into a single flow. The process is idealized for mixed-signal applications requiring excellent analog performance in conjunction with logic capability. A double-level metal option is available for optimum packing density. Applications include power supply controllers and high-performance disk drive motor controllers.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-179 Linfinity Microelectronics North American Company Profiles

Semiconductor Fabrication Facilities

Linfinity Microelectronics Inc. 11861 Western Avenue Garden Grove, California 92641 Capacity (wafers/week): 1,700 Wafer size: 100mm Processes: Bipolar, CMOS, BiCMOS Products: Linear ICs, ASICs Feature size: 3.0µm

1-180 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Logic Devices

LOGIC DEVICES

Logic Devices Incorporated 628 East Evelyn Avenue Sunnyvale, California 94086 Telephone: (408) 737-3300 Fax: (408) 733-7690 Web Site: www.logicdevices.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 19 12 13 13 17 Net Income 0.5 0.1 0.3 1 1 R&D Expenditures 21111

Employees 87 61 49 44 49

Company Overview and Strategy

Logic Devices Incorporated was founded in 1983. It develops and markets high-performance digital integrated circuits for applications requiring high operating speeds and low operating power. Such applications include computers, workstations, video image processing, medical instrumentation, telecommunications, and military signal processing.

Logic Devices was founded as a supplier of building-block DSPs, but later entered the growing 1989 SRAM market. It was driven from the SRAM market in 1992 due to cost and quality problems with its then supplier of SRAM wafers. Sales of the company's SRAM products rebounded in 1994 and continue to account for about 20 percent of sales. The company intends to remain a player in fast SRAMs and other niche SRAM markets, while placing a greater emphasis on DSP devices.

Far East SRAMs Europe 8% 20% 12%

DSP Devices North America 80% 80%

1995 Sales by Device Type 1995 Sales by Geographic Region

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-181 Logic Devices North American Company Profiles

In April 1995, Logic Devices acquired Star Semiconductor, which developed the Sproc programmable digital signal processor architecture. The Sproc architecture enables multiple processors to efficiently share data via a common memory array, resulting in high processing throughput.

Management

William J. Volz President Todd J. Ashford Chief Financial Officer Antony G. Bell Vice President, Technology William L. Jackson Vice President, Manufacturing

Products and Processes

High-speed, low-power CMOS SRAMs and DSP circuits are Logic Devices' principal product lines. Its DSPs primarily target video editing, broadcast special effects, and studio production applications, where lossless manipulation of very high bandwidth data is required. The company also offers specialty memories, register products, and high-performance CMOS SCSI controllers.

Ultrafast SRAM Fast Logic Specialty Memory 16K family Pipeline registers Cache-tag memories 64K family Register files Resettable memories 256K family Shadow registers Cache-data memories 1M family FIFOs

Computational Interface Multipliers SCSI bus controllers Multiplier-accumulators Filters Arithmetic logic units Digital correlators Barrel shifters

The company's chips are produced using 0.8µm and 1.0µm CMOS technologies, and it expects to employ a 0.5µm CMOS process in 1996.

Semiconductor Fabrication Facilities

Logic Devices has teamed with two foundry partners to manufacture its products: Oki in Japan and TSMC in Taiwan. In December 1995, Logic Devices announced a foundry agreement with Zentrum Mikroelektronik Dresden (ZMD), for wafer supply in 1996.

1-182 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles LSI Computer Systems

LSI COMPUTER SYSTEMS

LSI Computer Systems, Inc. 1235 Walt Whitman Road Melville, New York 11747-3086 Telephone: (516) 271-0400 Fax: (516) 271-0405

Fabless IC Supplier

Company Overview and Strategy

LSI Computer Systems, Inc. (LSI/CSI) began operations in 1969 and is thought to be the world’s first “fabless” semiconductor company. The privately held company utilizes a broad array of LSI process technologies in the design of full custom and standard ICs for products in applications ranging from consumer and industrial to military and aerospace.

LSI Computer Systems is recognized as one of the leading suppliers of lighting control ICs and full custom ICs, and was the first company to develop and market ICs for brushless DC motors.

Management

Al Musto Chief Executive Officer

Products and Processes

LSI Computer Systems supplies both standard and full custom ICs. Its standard ICs include programmable digital delay timers, CMOS dividers, incremental encoder interface chips, counters, melody generators, lighting control ICs, AC and brushless DC motor controllers, LCD drivers, telephone line switch controllers, and programmable digital lock circuits.

The company’s analog and digital full custom IC service is called Extra-Custom. The use of several external wafer foundries that offer a broad range of process technologies makes the Extra-Custom service flexible in meeting the needs of a variety of applications. LSI Computer Systems custom designs every detail of each Extra-Custom IC thereby providing protection of the customer’s proprietary product techniques.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-183 LSI Logic North American Company Profiles

LSI LOGIC

LSI Logic Corporation 1551 McCarthy Boulevard Milpitas, California 95035 Telephone: (408) 433-8000 Fax: (408) 433-7715 Web Site: www.lsilogic.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 698 617 719 902 1,268 Net Income 8 (110) 54 109 238 R&D Expenditures 81 79 79 99 124 Capital Expenditures 74 143 88 166 233

Employees 4,000 3,400 3,370 3,750 3,750

Company Overview and Strategy

LSI Logic is a leading designer and manufacturer of high-performance ASICs and related products and services. Founded in 1981, the company uses advanced process technology and design methodology to design and develop highly complex ASICs and other integrated circuits. Customers of LSI Logic are primarily original equipment manufacturers (OEMs) in the electronic data processing, telecommunications and certain office automation industries. Within these industries, the company emphasizes digital video, networking, desktop and personal computing, and wireless communication applications.

As process technology becomes more sophisticated, allowing greater density and increased functionality, the "system-on-a-chip" is becoming the foundation of LSI Logic's business. Its CoreWare¨ methodology and submicron process technologies permit its customers to combine microprocessor "engines", logic blocks (including industry standard functions, protocols, and interfaces), and memory with their own proprietary logic on a single chip.

LSI Logic’s CoreWare technology is at the center of its shift toward more consumer and communications products. In 1995, these two segments accounted for 44 percent of the company’s revenue. The firm estimates that in the year 2000, communications and consumer markets will account for 65 percent of total revenues.

1-184 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles LSI Logic

ASIC Design and Services 6%

Europe 16%

Asia-Pacific North America 25% Component Products 59% 94%

1995 Sales by Business 1995 Sales by Geographic Region

Management

Wilfred J. Corrigan Chief Executive Officer Brian L. Halla Executive Vice President, LSI Logic Products Cyril F. Hannon Executive Vice President, Worldwide Operations Moshe N. Gavrielov Senior Vice President, International Marketing and Sales Rick Marz Senior Vice President, North American Marketing and Sales Albert A. Pimentel Senior Vice President and Chief Financial Officer Joseph M. Zelayeta Senior Vice President, Research and Development, and General Manager U.S. Wafer Fab Operations Peng H. Ang Vice President and General Manager, Consumer Products John P. Daane Vice President and General Manager, Communication Products Bruce L. Entin Vice President, Investor Relations and Corporate Communications Amnon Fisher Vice President and General Manager, Computer Products James W. Hively Vice President, ASIC Product Development Michael D. Rostoker Vice President, Strategic Alliances

Products and Processes

LSI Logic's broad product line includes high-performance gate array, cell-based, and embedded array ASICs with up to 1.5 million gates (or up to 9 million transistors). The company's CoreWare methodology enables system-on-a-chip design by integrating industry-standard interfaces, such as the PCI interface, and industry- standard cores, such as MPEG engines for video and image compression, graphics accelerators, Ethernet controllers, special-purpose memory, and Mips microprocessors, with customer-defined logic. The company unveiled its first mixed-signal cells in 2Q95, initially for data conversion applications. Over time its library will be expanded to include a wide variety of mixed-signal functions.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-185 LSI Logic North American Company Profiles

In 1995, LSI Logic introduced its G10 series of ASIC devices that are based on a methodology it calls application optimization. The new series has elements that are important for speed, power, and integration and can be developed accordingly for a customer’s application. The family, which takes advantage of LSI’s proprietary CoreWare “system-on-a-chip” technology, can integrate up to five million usable gates or 49 million transistors on a single chip.

LSI Logic hopes to capitalize on the potential market for low-cost, Internet-exclusive terminals that have been touted to sell for less than $500. The company introduced a Mips-based single-chip architecture device for such an application. Its “Internet on a chip” device, capable of 100 Mips, could open Internet access by enabling users to browse for information using a standard television monitor.

In an attempt to enter the MPEG-2 encoding market, LSI Logic unveiled its first complete MPEG-2 encoder chipset. LSI Logic also manufactures and markets stand-alone Sparc and Mips RISC microprocessors as well as other various standard products. In addition, LSI offers a comprehensive set of design tools, applications and system architectural expertise, and advanced packaging and test solutions.

MPUs 1%

MPRs 6%

Standard Gate Array ASICs Cell ASICs 52% 41%

1995 Sales by Device Type (incl. design services)

The company uses CMOS technology to manufacture its products. Its leading-edge process technology is a 0.35µm (0.25µm, Leff) 3-volt CMOS process that was developed for the G10 series of ASIC devices.

Semiconductor Fabrication Facilities

Nearly all (an estimated 90 percent) of LSI Logic's wafers are manufactured by its Japanese subsidiary, Nihon Semiconductor, Inc. (NSI), which prior to January 1995 was jointly owned by LSI Logic (55 percent) and Kawasaki Steel Corporation (45 percent). LSI Logic is now the sole owner of NSI, as a result of the purchase of Kawasaki Steel's interest.

LSI announced that its Japanese chip fab would be among the first in Japan to use SMIF isolation technology in a production setting. The company plans to use the minienvironments in office space converted to a fabrication facility. The system will be used to produce ASICs with 0.5µm and 0.6µm geometries.

1-186 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles LSI Logic

In 1995, LSI Logic made a $20 million equity investment in Chartered Semiconductor, in exchange for guaranteed wafer capacity for products based on 0.6µm technology and smaller for a period of 10 years. Chartered's new $800 million 200mm wafer fab began production in the second half of 1995.

Also, the company selected Gresham, Oregon, as the U.S. site for a major manufacturing hub that will produce deep submicron devices. Chips produced using 200mm wafers and a 0.35µm CMOS process should begin shipping in 1Q97. As much as $4 billion could be invested during the next 15-year period as the company expands operations at the Gresham location.

LSI Logic Corporation Nihon Semiconductor, Inc. (NSI) 3115 Alfred Street 10 Kitahara, Tsukuba-shi Santa Clara, California 95054 Ibaraki-ken 300-32, Japan Telephone: (408) 433-6666 Telephone: (81) (298) 64-3359 Capacity (wafers/week): 250 Fax: (81) (298) 64-3458 Wafer size: 150mm Fabs I and II Processes: CMOS, BiCMOS Cleanroom size: 50,000 square feet Products: R&D Capacity (wafers/week): 10,000 Feature sizes: 0.35µm, 0.5µm Wafer size: 150mm Products: ASICs, MPUs, MPRs Feature sizes: 0.5µm-1.0µm

Key Agreements

¥ LSI Logic joined Mentor Graphics to form a 10-year alliance that couples Mentor’s open design tools within LSI Logic’s submicron design and manufacturing environment to ensure “right-first-time” ASICs.

¥ The company formed a five-year alliance with Argonaut Software to develop a family of 3D graphics accelerators. Incorporating LSI’s system-on-chip, the companies will develop upgradeable 3D graphics cores for LSI’s ASIC library.

¥ LSI Logic entered into an agreement with InterDigital Communications Corporation that calls for LSI Logic to develop and produce custom chips for InterDigital to use in Personal Communications Services (PCS handsets and Wireless Local Loop equipment. The cores that LSI Logic will use in the design are based on the company’s G10 0.25µm process technology.

¥ LSI Logic established a joint development agreement with Sanyo Electric to design the core of an HDTV system.

¥ LSI Logic signed an agreement with Philips to collaborate on developing video compression ICs for HDTV applications.

¥ LSI Logic formed an alliance with Cadence Design Systems to provide their mutual customer base with design automation tools, submicron silicon technology (0.5µm and below), and training, service, and support.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-187 LSI Logic North American Company Profiles

¥ LSI Logic signed on Zenith to jointly develop a codec chip supporting a Zenith decoding technology that can double the channel capacity of digital cable-television systems.

¥ The company teamed with David Sarnoff Research Center in 1994 to develop an MPEG-2 video encoding engine for initial use in Sun Microsystems' SparcStation 20 systems.

1-188 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Lucent Technologies

LUCENT TECHNOLOGIES

Lucent Technologies Microelectronics Group (formerly AT&T Microelectronics) Two Oak Way Berkeley Heights, New Jersey 07922-2727 Telephone: (908) 771-2000 Fax: (908) 771-4542 Web site: www.att.com/lucent

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995

Sales (Lucent Technologies) 17,734 19,765 21,413

Semiconductor Sales 815 900 1,095 1,280 1,675 Capital Expenditures 175 135 160 185 210

Employees (Microelectronics) 19,000 20,000 20,000 18,500 18,000

Company Overview and Strategy

Lucent Technologies Microelectronics Group (formerly AT&T Microelectronics) designs and manufactures advanced integrated circuits, photonic components, interconnection products, and power systems. Its product line is built upon strengths in digital signal processing, networked computing, and communications technologies. The company's products are used in applications such as personal computers, workstations, local-area networks (LANs), wireless telecommunications, voice/data/video switches, consumer telephones, and other high-volume electronic systems. Lucent’s Microelectronics Group total revenue in 1995 is estimated to have been approximately $3.0 billion.

Lucent’s semiconductor roots stretch back to the late 1940's, when Bell Labs, the research and development arm of Lucent Technologies, was credited with the invention of the transistor. Bell Labs was given the Nobel Prize for its invention in 1956. After nearly three decades of supplying its parent with chips, AT&T Microelectronics, as it was then known, decided to offer its products on the merchant market. In 1995, semiconductor sales to firms outside AT&T Corporation represented 71 percent of total semiconductor sales.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-189 Lucent Technologies North American Company Profiles

AT&T Corporation’s restructuring began with an announcement on September 20, 1995, to separate the $80 billion corporation into three independent companies: AT&T Corporation (communications), Lucent Technologies (systems and technology), and NCR Corporation, recently AT&T Global Information Systems, (business computing).

AT&T Capital 2% NCR Corporation 10%

Lucent Technologies AT&T 26% Corporation 62%

1995 Corporate Sales by Company

The company name, Lucent, was chosen for its meaning “marked by clarity” or “glowing with light” to distinguish itself from AT&T. Lucent Technologies is made up of five business groups: Network Systems, Business Communications Systems, Microelectronics, Consumer Products, and Bell Laboratories.

Other Consumer 5% 8% Microelectronics 9%

Network Systems Communications 54% 24%

1995 Lucent Technologies' Sales by Business Group

Lucent Technologies’ Microelectronics Group is comprised of six strategic business units that are divided into two groups. The units and the major products offered by each are listed below.

Integrated Circuit Group Network Communication Digital, high-voltage, linear, high-frequency ICs Wireless and Multimedia DSPs, video encoders Integrated Systems ASICs, FPGAs, LAN ICs, ATM ICs

1-190 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Lucent Technologies

Systems and Components Group Power Systems DC/DC converters Off-Line switches Energy systems Transformers and inductors Power ICs

Interconnection Printed circuit boards Backplanes

Optoelectronic Products Laser and LED subsystems

Management

Lucent Technologies Henry B. Schacht Chief Executive Officer Richard A. McGinn President and Chief Operating Officer Curtis J. Crawford President, Microelectronics Group William T. O’Shea President, Bell Laboratories Patricia F. Russo President, Business Communications Systems Daniel C. Stanzione President, Network Systems William B. Marx, Jr. Senior Executive Vice President Carleton S. Fiorina Executive Vice President, Corporate Operations Donald K. Peterson Executive Vice President and Chief Financial Officer Curtis R. Artis Senior Vice President, Human Resources Kathleen M. Fitzgerald Senior Vice President, Public and Investor Relations Richard J. Rawson Senior Vice President and General Counsel Arun N. Netravali Vice President, Research (Bell Laboratories)

Lucent Technologies Microelectronics Group Curtis J. Crawford President John T. Dickson Vice President, Integrated Circuits (ICs) Kenneth W. Dorushka Vice President, Sales Richard Mattern Vice President and Chief Operating Officer, Interconnection Technologies Peter R. McCarthy Vice President, Sales Development and Operations John V. Pilitsis Vice President, Optoelectronics William R. Spivey Vice President, Systems and Components Jay A. Walters Vice President and Chief Operating Officer, Power Systems

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-191 Lucent Technologies North American Company Profiles

Products and Processes

Lucent utilizes CMOS, BiCMOS, bipolar, and GaAs processes in the manufacture of its integrated circuits. The following are Lucent’s primary semiconductor products: 16-bit and 32-bit DSPs, ASICs (digital and mixed-signal standard cells, gate arrays), FPGAs, mass-storage and PC graphics devices, and communication ICs. New multimedia and voice recognition products are expected to do well for the company.

Lucent has essentially completed its plans to withdraw from the CMOS foundry business (it still has manufacturing arrangements with Standard Microsystems and Cirrus Logic, see Key Agreements). The company is continuing to provide bipolar manufacturing to outside companies. The AT&T Bipolar Foundry utilizes two industry leading advanced complementary bipolar process technologies, called CBIC-U2 and CBIC-V2.

MOS MEMORY ANALOG DRAM ✔ Amplifier SRAM ✔ Interface Flash Memory ✔ Consumer/Automotive EPROM Voltage Regulator/Reference ROM Data Conversion EEPROM ✔ Comparator Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)

MOS LOGIC DIGITAL BIPOLAR General Purpose Logic ✔ Bipolar Memory ✔ Gate Array ✔ General Purpose Logic ✔ Standard Cell ✔ Gate Array/Standard Cell ✔ Field Programmable Logic Field Programmable Logic ✔ Other Special Purpose Logic Other Special Purpose Logic MPU/MCU/MPR MOS MICROCOMPONENT ✔ MPU OTHER ✔ MCU ✔ Full Custom IC MPR ✔ Discrete ✔ DSP ✔ Optoelectronic

1-192 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Lucent Technologies

Semiconductor Fabrication Facilities

Lucent Technologies Lucent Technologies Allentown Works Orlando Plant 555 Union Boulevard 9333 South John Young Parkway Allentown, Pennsylvania 18103 Orlando, Florida 32819 Telephone: (610) 712-6011 Telephone: (407) 345-6000 Cleanroom size: 80,000 square feet Cleanroom size: 35,000 square feet Capacity (wafers/week): 15,000 Capacity (wafers/week): 7,500 Wafer sizes: 125mm, 150mm Wafer sizes: 125mm, 150mm Processes: NMOS, CMOS, bipolar Process: CMOS Products: Linear and logic ICs, DSPs, MPUs Products: ASICs, FPGAs, DSPs, MPRs ASICs, FPGAs, telecom ICs Feature sizes: 0.35µm-1.25µm Feature sizes: 0.5µm-2.5µm

Lucent Technologies Lucent Technologies Reading Works Solid State Technology Center P.O. Box 13396 9901 Hamilton Boulevard Reading, Pennsylvania 19612 Breinigsville, Pennsylvania 18031-9359 Telephone: (610) 939-7011 Telephone: (610) 391-2000 Cleanroom size: 70,000 square feet Capacity (wafers/week): 5,000 Wafer size: 100mm Processes: Bipolar, HVCMOS, BCDMOS Products: Linear ICs, optoelectronics, foundry services Feature sizes: 1.5µm-3.5µm

Lucent Technologies d.a. Espana Lucent Technologies/Cirrus Logic Joint Venture Poligono Industrial de Tres Cantos 9333 South John Young Parkway S/N (Zona Oeste), 28770 Colmenar Viejo Orlando, Florida 32819 Madrid, Spain Telephone: (407) 345-6000 Cleanroom size: 20,000 square feet Capacity (wafers/week): 2,500 Capacity (wafers/week): 2,800 Wafer size: 200mm Wafer size: 150mm Process: CMOS Process: CMOS Products: ASICs, MPRs Products: ASICs, communications ICs, DSPs Feature sizes: 0.35µm, 0.5µm Feature sizes: 0.5µm, 0.9µm, 1.25µm (Scheduled to start production in 1997.)

In early 1996, Lucent announced plans to invest $145 million by 1997 to increase the manufacturing capacity at its Madrid facility. The fab will be upgraded to 0.35µm technology and the first ASIC, FPGA, and DSP products based on the new technology will be available in 1997. Expected wafer output will be 5,000 wafers per week.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-193 Lucent Technologies North American Company Profiles

Key Agreements

¥ In October 1995, Lucent signed an agreement with Cirrus Logic to form a $600 million joint manufacturing venture in Orlando, Florida. The new facility will be 60 percent owned by Lucent and 40 percent by Cirrus. The new facility will begin production by early 1997, beginning with a 0.35µm process (with plans to move to 0.25µm in the future), and the two companies will equally share its output.

¥ Lucent signed an agreement with Hewlett-Packard in 1995 to develop and dual-source fiber-optic transceivers for SONET/SDH and ATM applications.

¥ Lucent (then AT&T Microelectronics) struck an agreement with Standard Microsystems Corp. (SMC) in 1994 under which SMC agreed to buy equipment for installation in Lucent's fab in Spain in return for a guaranteed portion of the fab output for a period of five years.

¥ Lucent is working with IBM, Loral Federal Systems, and Motorola to establish a manufacturing infrastructure for x-ray lithography. The team hopes to have a manufacturing capability by 1997.

¥ Lucent will continue its IC process technology development alliance with NEC to the 0.25µm level. The deal is based on a similar agreement signed in 1991 in which the companies set out to develop a 0.35µm CMOS process.

¥ Lucent has several agreements with TriQuint Semiconductor involving the development, manufacture, and marketing of GaAs ICs for high-performance wireless and telecommunications systems. As part of the deal, Lucent discontinued its production of GaAs wafers and now relies on TriQuint for the manufacture of its GaAs wafers. The two companies are developing an epitaxial process based on Lucent's GaAs intellectual property.

¥ Lucent is teamed with Sandia National Laboratories to develop new lithography patterning technologies for the production of high-density ICs with geometries below 0.2µm.

1-194 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Maxim Integrated Products

MAXIM INTEGRATED PRODUCTS

Maxim Integrated Products, Inc. 120 San Gabriel Drive Sunnyvale, California 94086 Telephone: (408) 737-7600 Fax: (408) 737-7194 Web Site: www.maxim.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Sales 74 87 110 154 250 Net Income 10 14 17 24 39 R&D Expenditures 11 13 16 13 42 Capital Expenditures 4 4 13 22 36

Employees 500 554 638 1,016 1,552

Company Overview and Strategy

Established in 1983, Maxim Integrated Products is a leading designer, developer, and manufacturer of linear and mixed-signal integrated circuits. Maxim's products are the interface between the real, analog world and the world of digital processing. They detect, measure, amplify, and convert real world signals, such as temperature, pressure, or sound, into the digital signals necessary for computer processing. Its circuits are used in a wide variety of microprocessor-based equipment, including PCs and peripherals, test equipment, handheld products, wireless communicators, and video displays. The company also provides a range of high-frequency design processes and capabilities that can be used in custom design.

Maxim’s main objective is to actively develop and market both proprietary and industry standard analog integrated circuits that meet the increasing quality standards demanded by customers.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-195 Maxim Integrated Products North American Company Profiles

Europe and Pacific Rim United States 49% 51%

1995 Sales By Geographic Region

In mid-1994, Maxim acquired substantially all of the assets of the Tektronix's Integrated Circuits Operation in Beaverton, Oregon, for about $22 million. The acquisition provided Maxim with additional wafer production capacity, leading-edge high-frequency bipolar technologies that have broadened the firm's presence in the wireless and optic communications markets, and high-speed data acquisition, RF signal processing, and video products.

Management

Jack F. Gifford Chairman, President and Chief Executive Officer Frederick G. Beck Vice President, Marketing and Sales Ziya Boyacigiller Vice President Michael J. Byrd Vice President and Chief Financial Officer Steve Combs, Ph.D. Vice President, Operations Tunc Doluca Vice President, Research and Development Dave J. Fullager Vice President, Research and Development Anthony Gilbert Vice President, and Secretary Kenneth J. Huening Vice President William N. Levin Vice President Robert F. Scheer Vice President, Wafer Operations Richard E. Slater Vice President and Chief Accounting Officer

Products and Processes

Maxim Integrated Products offers a broad range of linear and mixed-signal ICs, including data converters, interface circuits, microprocessor supervisory circuits, operational amplifiers, power control circuits, timers and counters, display circuits, multiplexers and switches, battery chargers, voltage detectors, filters, comparators, and voltage reference circuits.

1-196 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Maxim Integrated Products

Semiconductor Fabrication Facilities

Maxim supplements is own IC production capacity with foundry agreements with other companies.

Maxim Integrated Products Maxim Integrated Products 430 West Maude Avenue 14320 Southwest Jenkins Sunnyvale, California 94086 Beaverton, Oregon 97005 Telephone: (408) 746-2650 Telephone: (503) 641-3737 Cleanroom size: 15,000 square feet (Class 10) Cleanroom size: 60,000 square feet Capacity (wafers/week): 3,000 Capacity (wafers/week): 2,000 Wafer size: 100mm Wafer size: 100mm Processes: CMOS, BiCMOS, bipolar Process: Bipolar Products: Linear and mixed-signal ICs Products: Mixed-signal ICs Feature sizes: 1.2µm-3.0µm Feature sizes: 0.8µm-2.0µm (purchased from Tektronix in mid-1994)

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-197 Micrel Semiconductor North American Company Profiles

MICREL SEMICONDUCTOR

Micrel Semiconductor, Inc. 1849 Fortune Drive San Jose, California 95131 Telephone: (408) 944-0800 Fax: (408) 944-0970

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 14 18 19 35 53 Net Income 0.3 1137 R&D Expenditures 22344

Employees 140 150 160 180 345

Company Overview and Strategy

Micrel was founded in 1978 as an independent high-performance testing facility for manufacturers and consumers of digital and analog ICs. In 1982, Micrel acquired an IC fabrication facility in Sunnyvale, California, from Siemens Components and began acting as a silicon foundry. This led to the company's development of semicustom and standard linear smart power ICs.

In early 1993, Micrel moved its headquarters and manufacturing operations from Sunnyvale to San Jose. The new fab, formerly owned by Seeq Technology, tripled Micrel's fab capacity. In 1995, Micrel signed a lease on an additional 63,000 square foot building. This additional space will be used to expand its manufacturing activities. The company also went public in 1995.

Micrel is focusing its efforts on the design and marketing of its high-performance analog power ICs to become a strong force in portable computing, desktop computing, communications, and automotive and aviation electronics.

1-198 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Micrel Semiconductor

Military and Other 7%

Custom ICs Telecom Industrial 25% 18% 29% Standard ICs 50% Foundry Services Consumer 25% 19% Computer 27%

1995 Sales by Product 1995 Sales by End-Use Market

Management

Ray Zinn President and Chief Executive Officer Robert Barker Vice President, Finance and Chief Financial Officer Robert Johnston Vice President, Marketing and Sales John Husher Vice President, Fabrication Operations Jerome Markus Vice President, Standard Products Sales Warren Muller Vice President, Test Operations

Products and Processes

Micrel supplies both standard and semicustom products. The company's key standard product lines include high-current low-side power MOSFET drivers, high-side power MOSFET drivers, low dropout (LDO) linear regulators, high-efficiency switching regulators, PCMCIA power control matrices, power latched drivers, display drivers, P-channel MOSFETs, and open drain power switches. Micrel also continues to offer the use of its fabrication facilities as a foundry source.

Micrel uses and offers a full range of processes: CMOS, DMOS, bipolar, BiCMOS, and BCDMOS. The company’s fab is capable of handling metal-gate, silicon-gate, double-metal and double-poly architectures with feature sizes down to 1.0µm.

Semiconductor Fabrication Facilities

Micrel Semiconductor, Inc. 1849 Fortune Drive San Jose, California 95131 Cleanroom size: 18,000 square feet (Class 10) Capacity (wafers/week): 5,000 Wafer size: 100mm Processes: CMOS, bipolar, DMOS, BiCMOS/DMOS, BCD Feature sizes: 1.0µm-2.0µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-199 Micro Linear North American Company Profiles

MICRO LINEAR

Micro Linear Corporation 2092 Concourse Drive San Jose, California 95131 Telephone: (408) 433-5200 Fax: (408) 432-0295

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 35 37 34 42 57 Net Income 4 3 — 3 11 R&D Expenditure 7 8 9 10

Employees 150 210 210 225 251

Company Overview and Strategy

Established in 1983, Micro Linear designs, develops, and markets analog and mixed-signal ICs for a broad range of applications within the communications, computer, and industrial markets. Such applications include local-area networks (LANs), mass storage, personal computers, notebook computers, personal digital assistants (PDAs), voice-band telecommunications, data acquisition, motor control, and power management.

Micro Linear targets high growth applications that require substantial analog and mixed signal content. Using its designs, the company integrates electronic subsystems or several analog building block circuits into a single circuit or chipset.

In 1991, Micro Linear implemented a strategy to diversify its business and lessen its dependence on the hard disk drive industry. As a result, hard disk drive product sales represented only 19 and 15 percent of total revenues in 1994 and 1995, respectively, compared to 81 percent in 1990. International sales represented approximately 31 percent of total revenues in 1995.

Other ICs Computer 38% Networking ICs 47% Hard Disk Drive ICs 15%

1995 Sales by Device Type

1-200 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Micro Linear

Management

Arthur B. Stabenow Chief Executive Officer William T. Malanczuk President and Chief Operating Officer Carlos A. Laber Vice President, Engineering Chris A. Ladas Vice President, Operations Marty Levy Vice President, Sales Ray A. Reed Vice President, Business Development J. Philip Russell Vice President, Finance and Administration Paul E. Standish Vice President, Marketing and Applications

Products and Processes

Micro Linear provides second-source products and proprietary standard products as well as semi-standard parts and ASICs using bipolar, CMOS, and BiCMOS processes, with a particular emphasis placed on its 1.5µm BiCMOS technology. Its product offerings are broken down by market application below.

Mass storage (HDD, MOD, and tape): Pulse detectors Data separators Read/write amplifiers Frequency synthesizers Motor, servo controllers Trajectory generators Servo demodulators Voice coil drivers Read channel Filters SCSI terminators Buffers Clock generators

LANs: Data quantizer Transceivers for ATM Transceivers for MPR, FOIRL Fiberoptic LED drivers Transceivers for AUI/FDDI

Voiceband telecommunications: Gain/attenuators Equalizers Tone detectors Dual filters Sine-wave generators

Power and motion control: Motor controllers Synchronized power supply chips Power factor correctors Resonant controllers Battery—DC/DC converters Phase modulation controllers PWM controllers LCD backlight IC

Data conversion: 12-bit ADCs 8-bit ADCs 10-bit ADCs 8-bit DACs

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-201 Micro Linear North American Company Profiles

Semiconductor Fabrication Facilities

Micro Linear utilizes wafer foundries for the production of its ICs.

1-202 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Microchip Technology

MICROCHIP TECHNOLOGY

Microchip Technology Inc. 2355 West Chandler Boulevard Chandler, Arizona 85224-6199 Telephone: (602) 786-7200 Fax: (602) 899-9210 Web Site: www.ultranet.com/biz/mchip

IC Manufacturer

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 73 89 139 208 286 Net Income 0.4 4 19 36 44 R&D Expenditures 8 9 14 21 49 Capital Expenditures 8 3 35 71 n/a

Employees 1,100 1,070 1,260 1,430 1,600

Company Overview and Strategy

Microchip Technology was organized in 1989 by a group of venture capital investors to acquire General Instrument Corporation's Microelectronics division, which was established in 1960. Since the acquisition, Microchip Technology has shifted its focus from commodity memory and logic products to embedded control products.

The company is now a leading manufacturer of high-performance, field-programmable RISC microcontrollers, complementary ASSPs, and related specialty memory products for high-volume embedded control applications. Microchip sells its products to a broad and diverse customer base in the consumer, automotive, communications, office automation, and industrial control markets.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-203 Microchip Technology North American Company Profiles

Commodity Memories and Logic Products 8%

Microcontrollers United States Other EEPROMs and and associated 35% (primarily Asia, Specialty EPROMs development systems Europe, and Japan) 34% 58% 65%

1995 Sales by Product Category 1995 Sales by Geographic Region

Microchip's embedded control products (microcontrollers, serial and parallel EEPROMs, and high-speed and low-power EPROMs) represented only eight percent of total product sales in fiscal 1990 compared to 92 percent in fiscal 1995. The remaining 8 percent in fiscal 1995 was represented by the company’s commodity memory and logic products.

In the fourth quarter of calendar 1995, Microchip announced it had acquired the “Keelog” hopping code and secure smart card technology and patents developed by Nanoteq of South Africa. The $10 million acquisition also provided Microchip with worldwide marketing rights to the technology. New products are being developed that combine the Keelog and smart card technology with Microchip’s 8-bit MCUs and serial EEPROMs for enhanced security applications in wireless/remote controlled systems.

Management

Steve Sanghi President and Chief Executive Officer Timothy B. Billington Vice President, Manufacturing Operations Frederick J. Bruwer Vice President, Secure Data Products Group C. Philip Chapman Vice President, Chief Financial Officer and Secretary Franc C. Guerrini Vice President, European Sales Operation Robert J. Hackmeister Vice President, Assembly and Test and Operations Support Michael J. Jones Vice President, Human Resources and Information Systems David S. Lambert Vice President, Process Development and Manufacturing Engineering Robert A. Lanford Vice President, Worldwide Sales Mitchell R. Little Vice President, Memory Products and ASSP Division Robert J. Lloyd Vice President, Facilities Management John F. Oatley Vice President, Manufacturing Operations-Pacific Rim Gordon W. Parnell Vice President, Controller and Treasurer George P. Rigg Vice President, Logic Products Division Howard Teeter Vice President, Americas Sales Ernest Villicana Vice President, Logic Product Marketing William Yang Vice President, Finance-Pacific Rim

1-204 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Microchip Technology

Products and Processes

During the 1970's and 1980's, a high-volume ROM and EPROM business was then-General Instrument's primary revenue generator. Since then, however, Microchip has placed designs derived from microcontrollers at the forefront of its strategy, and has limited nonvolatile offerings to specialty areas such as serial EEPROMs. Although commodity EPROM shipments will continue to decrease as a percentage of total sales, the company intends to manage EPROM production levels to maintain optimal manufacturing capacity utilization.

Microchip's integrated circuit products are outlined below. These products are based upon CMOS process technology with lithography dimensions down to 0.9µm. The company is in the process of transitioning products to smaller geometry processes.

Microcontroller Products ¥ PIC16/17 8-bit microcontrollers that combine a high-performance RISC processor with one-time- programmable (OTP) technology. Current PIC16/17 microcontroller product families include advanced features such as sophisticated timers, embedded A/D converters, extended instruction/data memory, inter-processor communication (I2C/SPI ports and USARTs), and ROM, RAM, EPROM, and EEPROM memories. Some of Microchip’s MCUs operate from power supplies as low as 2.0V.

Application-Specific Standard Products (ASSPs) ¥ Microchip’s ASSPs combine selected application-specific software programs with different combinations of the company’s standard microcontroller and memory products.

EEPROM Products ¥ Serial CMOS EEPROMs with densities ranging from 256bit to 64K and featuring data transfer rates up to 1MHz. The company’s serial EEPROMs are offered with a wide operating voltage range (1.8V to 6.0V). ¥ Parallel CMOS EEPROMs available in 4K, 16K, and 64K densities with 10,000 to 100,000 erase/write cycles (typ).

EPROM Products ¥ Standard CMOS EPROMs with densities ranging from 64K to 512K. ¥ Low-voltage (as low as 3.0V) CMOS EPROMs with densities ranging from 64K to 512K. ¥ High-speed 256K CMOS EPROMs with access times as fast as 55ns.

Application-Specific Standard Products ¥ TrueGaugeª intelligent battery capacity monitoring and charge controller ICs. ¥ Mouse controller ICs for all Apple Computer and IBM PC-compatible formats. ¥ Energy management controller ICs for reducing power consumption of AC induction motors. ¥ 8-bit microcontrollers with 1K of on-chip serial EEPROM.

Other Logic Products ¥ Static LCD driver ICs.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-205 Microchip Technology North American Company Profiles

Semiconductor Fabrication Facilities

Microchip announced in late 1995 that it plans to invest nearly $1 billion over the next few years to expand its fabrication capacity in Arizona. The investment will consist of $475 million for the construction of Fab III adjacent to its headquarters starting in late 1996 or early 1997 and $550 million to build Fab IV starting in 1998. Fab III will feature 50,000 square feet of cleanroom space and will process 200mm CMOS wafers.

Microchip Technology Inc. Microchip Technology Inc. 2355 West Chandler Boulevard 1200 South 52nd Street Chandler, Arizona 85224 Tempe, Arizona 85281 Fab I Fab II Cleanroom size: 24,000 square feet (Class 10) Cleanroom size: 25,000 square feet (Class 10) Capacity (wafers/week): 4,500 Capacity (wafers/week): 8,000 Wafer sizes: 125mm, 150mm Wafer size: 150mm Process: CMOS Process: CMOS Feature sizes: 0.9µm-1.5µm Feature size: 0.9µm

Microchip’s IC products are assembled and tested primarily at a subsidiary in Kaohsiung, Taiwan, and a third-party contractor in Bangkok, Thailand. Other third-party assembly and test suppliers used by Microchip are located in the Philippines and other Asian countries.

1-206 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Micron Technology

MICRON TECHNOLOGY

Micron Technology, Inc. 8000 South Federal Way P.O. Box 6 Boise, Idaho 83707-0006 Telephone: (208) 368-4000 Fax: (208) 368-4435 Web Site: www.micron.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends August 31

1991 1992 1993 1994 1995 Sales 425 506 828 1,629 2,953 Net Income 5 7 104 401 844 R&D Expenditures 36 48 57 83 129 Capital Expenditures 83 102 163 377 961

Employees 4,095 4,300 4,900 5,400 8,080

Company Overview and Strategy

Micron Technology, Inc. was founded in 1978 as a semiconductor design consulting firm. In late 1982, the company entered the memory market with a 64K DRAM, which had a significantly smaller die size than competing products.

Today, Micron is a leading developer and manufacturer of DRAM, very fast SRAM, and other semiconductor products, processes, and packaging options. It is one of the few U.S.-headquartered merchant DRAM manufacturers. The company's long-term goals are threefold: to offer electronics manufacturers the most advanced and highest quality memory products available; to take advantage of its production expertise by expanding into other memory-related businesses; and to help reinstate the U.S. as the leader in the production of memory ICs.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-207 Micron Technology North American Company Profiles

Board-Level Other Products 4% 3% SRAMs Other 6% Europe 8% 10% PCs Far East 15% DRAMs/ 15% North Specialty DRAMs America 68% 71%

1995 Sales by Product Type 1995 Sales by Geographic Region

Micron's primary business is memory ICs, but it is also involved in a number of other businesses, including the design and manufacture of custom boards and modules, the development of chips and systems for RF identification applications, flat panel display technologies, and the design and assembly of personal computers.

Management

Steve R. Appleton President and Chief Executive Officer Tyler A. Lowrey Chief Operations Officer Donald D. Baldwin Vice President, Sales Kipp A. Bedard Vice President, Corporate Affairs Eugene H. Cloud Vice President, Marketing Robert M. Donnelly Vice President, SRAM Products Group W. Bryan Farney Vice President and General Counsel Edward J. Heitzeberg Vice President, Design, Product Engineering, and Quality Assurance Norman L. Schlachler Vice President and Treasurer Nancy M. Self Vice President, Administration Kenneth G. Smith Vice President, Operations Wilbur G. Stover, Jr. Vice President, Finance, and Chief Financial Officer Thomas M. Trent Vice President, Computer Aided Design

Products and Processes

Micron's semiconductor product strategy is focused primarily on the design, development, and manufacture of memory products, primarily DRAMs and SRAMs, for standard and custom memory applications, with various packaging and configuration options, architectures, and performance characteristics.

1-208 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Micron Technology

Micron’s semiconductor products are outlined below.

DRAMs ¥ 4M DRAMs in x1 and x4 configurations with support for fast page and extended data-out (EDO) modes. ¥ 16M DRAMs in x4, x8, and x16 configurations with support for fast page, EDO, and burst EDO modes. ¥ 64M DRAMs in x4, x8, and x16 configurations with support for fast page, EDO, and burst EDO modes. ¥ DRAMs are also offered in bare-die form or module form.

Graphics DRAMs ¥ 4M EDO DRAMs in x16 configuration. ¥ 8M synchronous graphics RAM (SGRAM) in x32 configuration. Operates from a 3.3V power supply and is offered in speed grades ranging from 15ns/66MHz to 10ns/100MHz.

Synchronous SRAMs ¥ 1M flow-through or pipelined burst SRAMs in x18, x32, and x36 configurations. The flow-through devices support bus frequencies up to 67MHz and the pipelined devices up to 125MHz. ¥ 2M flow-through or pipelined burst SRAMs in x18, x32, and x36 configurations. ¥ SRAMs are also offered in bare-die form or module form.

Flash Memories ¥ 2M boot block flash memories in x8 configuration using Intel-licensed SmartVoltage technology. ¥ 4M boot block flash memories in x8 and x16 configurations using Intel-licensed SmartVoltage technology. ¥ 16M sector erase flash memories in x8 and x16 configurations using Intel-licensed SmartVoltage technology (samples expected to be available in 3Q96). ¥ Micron plans to introduce a line of solid-state flash memory cards in 2H96.

Research and development efforts continue on next generation processes and designs in DRAM, SRAM, flash memory, radio frequency identification devices (RFID), and FED flat panel displays. The company plans to be in production of its first RFID chip, the RFIDEngine, by the end of 1996.

Currently, most of Micron’s semiconductor products are based on 0.45µm CMOS technology and are migrating to 0.35µm technology.

Semiconductor Fabrication Facilities

Micron has completed the conversion of Fab III from 150mm to 200mm wafers, and is in process of converting Fabs I and II. In 1995, the company began construction on a new $2.3 billion 200mm wafer fab complex in Lehi, Utah. The new plant will be capable of processing 10,000 wafers per week, utilizing 0.25µm technology. In early 1996, the company decelerated construction of the fab, due to a softening of the DRAM market. The fab shell will be completed and equipment will be added to it as market conditions warrant.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-209 Micron Technology North American Company Profiles

Micron Technology, Inc. Micron Technology, Inc. 8000 South Federal Way 8000 South Federal Way Boise, Idaho 83707-0006 Boise, Idaho 83707-0006 Fabs I and II Fab III Cleanroom size: 26,000 square feet Cleanroom size: 32,000 square feet Capacity (wafers/week): 6,000 Capacity (wafers/week): 7,000 Wafer size: 150mm, 200mm Wafer size: 200mm Process: CMOS Process: CMOS Feature sizes: 0.35µm-0.7µm Feature sizes: 0.35µm, 0.45µm

Micron Technology, Inc. 8000 South Federal Way Boise, Idaho 83707-0006 Fab IV Capacity (wafers/week): 5,000 Wafer size: 200mm Process: CMOS Feature size: 0.45µm

Key Agreements

¥ Micron signed a cross-licensing agreement with Intel covering flash memory ICs. Volume production of 2M and 4M flash chips that are pin-compatible with Intel's boot-block products began in 1995.

¥ Micron announced a memorandum of understanding with NEC on the mutual OEM sales of each other's semiconductor memory products. The deal allows both companies to resell memory products, such as 16M DRAMs and 1M synchronous SRAMs under their own logos.

¥ Micron has made a number of agreements to license its known-good die (KGD) technology. Licensees include Honeywell SSEC, Chip Supply, nChip, and Cybex Technologies.

1-210 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Mitel Semiconductor

MITEL SEMICONDUCTOR

Mitel Semiconductor U.S. Representative: 360 Legget Drive Mitel Semiconductor P.O. Box 13089 2321 Morena Boulevard Kanata, Ontario San Diego, California 92110 Canada K2K 1X3 Telephone: (619) 276-3421 Telephone: (613) 592-2122 Fax: (619) 276-7348 Fax: (613) 592-4784 Web Site: www.semicon.mitel.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales* 45 69 80 110 121 R&D Expenditures 8679n/a

Employees 529 552 564 633 n/a

*External sales only. Mitel Semiconductor also supplies ICs and Hybrid to its parent Mitel Corporation.

Company Overview and Strategy

Mitel Semiconductor was founded in 1976 and supplies analog and digital communications ICs to telecommunications equipment manufacturers around the world. Mitel Semiconductor is a leader in providing complete communications solutions. The company provides analog and digital telecommunications ICs, thick-film hybrids, and board-level products to designers of products such as PBXs, EDs, MUXs, and computer/telephony systems. Mitel Semiconductor also provides extensive design and applications support.

Canada

8% Wafers Japan 9% 7% ROW Hybrids 31% 20% Europe ICs 23% 71% United States 31%

1995 Sales by Product Category 1995 Sales by Geographic Region

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-211 Mitel Semiconductor North American Company Profiles

Management

John Millard President and Chief Executive Officer, Mitel Corporation Kirk Mandy Vice President and General Manager, Semiconductor Division

Products and Processes

Mitel Semiconductor's product line includes analog and digital switches; DTMF and caller-ID devices; subscriber line circuits (SLICs); telephone-set, ISDN, and line interface devices; and broadband ISDN primary rate and ATM products. Mitel Semiconductor also offers a custom wafer foundry service.

Semiconductor Fabrication Facilities

Mitel Semiconductor acquired Swedish semiconductor manufacturer ABB Hafo AB in March 1996. ABB Hafo specialized in cell-based ASIC design and the manufacture of custom mixed-signal radiation-hardened ICs and optoelectronics. In 1995, ABB Hafo had revenues of about $40 million, half from ICs and foundry work and half from discretes/optoelectronics.

Mitel Semiconductor 18 Airport Boulevard Bromont, Quebec, Canada J0E 1L0 Telephone: (514) 534-2321 Fax: (514) 534-3201 Cleanroom size: 18,000 square feet Capacity (wafers/week): 2,400 Wafer size: 100mm Processes: CMOS, single and double poly and metal, CCD, metal gate, SiCr-on-chip Feature sizes: 1.2µm, 1.5µm, 2.0µm, 3.0µm, 4.0µm, 5.0µm, 9.0µm

Mitel Semiconductor AB (formerly ABB Hafo AB) Bruttovägen 1, P.O. Box 520 S-175 26 Järfälla, Sweden Telephone: (46) (8) 580 24500 Fax: (46) (8) 580 225 60 Cleanroom size: 13,000 square feet Capacity (wafers/week): 750 Wafer size: 100mm Processes: CMOS, bipolar, SOS Feature sizes: 1.5µm-3.0µm

1-212 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Mosaic Semiconductor

MOSAIC SEMICONDUCTOR

Mosaic Semiconductor, Inc. 7420 Carroll Road San Diego, California 92121-9727 Telephone: (619) 271-4565 Fax: (619) 271-6058

Fabless IC Supplier

Employees 25

Company Overview and Strategy

Founded in 1988, Mosaic Semiconductor is a supplier of high reliability memory components and subsystems for military, aerospace, industrial, and medical markets. Mosaic's customers are mainly in the U.S., Canada, and Israel, but the company is targeting similar customers in Japan.

Management

David Armstrong President and Chief Executive Officer Andrew Ross Executive Vice President and General Manager Jaime Conde Manager, Eastern Area Sales S. Fallaize Manager, North American Sales

Products and Processes

Mosaic's military IC products include DRAMs in densities ranging from 64K to 4M, EEPROMs in 256K and 1M densities, and flash memories in 1M and 4M densities; all conform to MIL STD 883D methods 5004 and 5005. Mosaic's military module offerings include SRAM, EEPROM, flash, and EPROM.

Semiconductor Fabrication Facilities

Mosaic's ICs are currently manufactured by various North American and Asian semiconductor manufacturers. The company maintains an assembly, test, and package design facility in San Diego.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-213 MOSAID Technologies North American Company Profiles

MOSAID TECHNOLOGIES

MOSAID Technologies Incorporated P.O. Box 13579 Kanata, Ontario Canada K2K 1X6 Telephone: (613) 836-3134 Fax: (613) 831-0796 Web Site: www.mosaid.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends April 30

1992 1993 1994 1995 Sales 7 10 15 24 Net Income (1) 2 3 4 R&D Expenditures 2235

Employees 61 58 74 93

Company Overview and Strategy

MOSAID Technologies was founded in 1975 to provide MOS memory design and consulting services. Today, the company is a recognized leader in the design of memory chips. It designs and licenses advanced chips for standard memory and application-specific memory (ASM) requirements. The company is also a leading supplier of engineering memory test systems. Approximately 93 percent of MOSAID's sales revenue is generated outside of Canada.

Taiwan 4% Other 11% North Korea America 44% 11% Japan 30%

1995 Sales by Geographic Region

1-214 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles MOSAID Technologies

Management

George J.J. Cwynar President and Chief Executive Officer Robert C. Albrow Vice President, Strategic and Technical Development Christine Baburek Vice President, Finance and Administration, and Chief Financial Officer G. Glann Evans Vice President and General Manager, Systems Division Iain H. Scott Vice President and General Manager, Semiconductor Division

Products and Processes

MOSAID has experience in eight generations of DRAM designs, from 4K to 64M. Some recent memory chip designs include: a high-performance 16M synchronous DRAM supporting data transfer rates of up to 100M/second, a low-voltage 16M DRAM upgrading the capabilities of portable computers, a low-voltage word-wide 4M DRAM, and a low-power SRAM. Macrocell designs intended for use as blocks within ASICs include high-speed pipelined SRAM and DACs for RAMDAC function, and HDRAMª (high-density DRAM).

MOSAID also designs and sells memory intensive components such as high-performance RAMDACs. In addition, the company designs, manufactures, and distributes engineering test systems for memory chips.

Key Agreements

¥ MOSAID announced in May 1994 the formation of a joint venture company to develop a leading edge ASM chip. Ownership of the joint venture Accelerix is shared equally with Symbionics Holdings Limited, a U.K.-based corporation with specific expertise in advanced ASIC applications.

¥ MOSAID announced a project with Newbridge Networks Corporation in Kanata and Kawasaki Steel Corporation in Tokyo, Japan, in September 1994, for the development of an ASIC incorporating a high- density DRAM (HDRAM) macrocell.

¥ MOSAID announced a project with LG Semicon (formerly Goldstar Electron) in early 1995 for the development of an advanced memory device.

¥ In FY95, MOSAID announced a project with Oki Electric Industry Co., Ltd. to design a 64M SDRAM.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-215 Motorola North American Company Profiles

MOTOROLA

Motorola, Inc. Semiconductor Products Sector (SPS) 3102 North 56th Street Phoenix, Arizona 85018 Telephone: (602) 952-3000 Fax: (602) 952-6100 Web Site: motserv.indirect.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Corporate Sales 11,341 13,303 16,963 22,245 27,037 Net Income 454 453 1,022 1,560 1,781

Semiconductor Sales 3,920 4,470 5,800 6,960 8,540 IC Sales 3,087 3,606 4,825 5,600 6,850 Discrete Sales 833 864 975 1,360 1,690 Capital Expenditures 653 666 1,120 1,640 2,530

Employees (SPS) 41,000 44,000 46,000 52,000

Company Overview and Strategy

Established in 1928, Motorola's first products were battery eliminators and private label radio sets. Shortly after WWII Motorola entered the television and semiconductor businesses. Today, Motorola supplies a wide range of electronic products, including cellular telephones, semiconductors, two-way radios, paging and data communications products, defense and space electronics, computers, and other electronic components, modules, and systems for automotive, industrial, transportation, navigation, communication, energy systems, consumer, and lighting markets.

1-216 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Motorola

Land Mobile Other 12% 11% General Systems Messaging, 36% Information, and Media Semiconductor 12% 29%

1995 Corporate Sales by Product Group/Sector

In 1949, Motorola set up a solid-state research laboratory in Phoenix, Arizona, and then established its semiconductor products sector in 1954. The company has since continued to be one of the world’s largest producers of semiconductors. It offers one of the industry's broadest portfolios of semiconductor products, including microprocessors, RF devices, microcontrollers, digital signal processors, memories, sensors, and discretes. Applications for these products are primarily in the communications, computer, and industrial markets, but also in the automotive and consumer markets.

Consumer Japan 10% Automotive 11% Communications 12% Asia/Pacific 33% 19% Americas Industrial 46% 17% Computing Europe 27% 25%

1995 Semiconductor Sales by 1995 Semiconductor Sales by End-Use Market Geographic Region

Motorola Semiconductor Products Sector (SPS) is organized into five product groups: the Microprocessor and Memory Technologies Group (MMTG); the Microcontroller Technologies Group; the Communications, Power, and Signal Technologies Group; the Logic and Analog Technologies Group; and the recently formed Communications and Advanced Consumer Technologies Group (CACTG).

The new CACTG was announced in 1Q96 as part of a broader reorganization of the SPS, undertaken, in part, to promote sales of the PowerPC RISC microprocessor. The Application Specific IC Division, the Digital Signal Processing Division, the High-Performance Embedded Systems Division, the MOS Digital-Analog IC Division, and the Israel Design Center were all combined under the CACTG to target applications in digital wireless and wireline communications, as well as in consumer products like set-top boxes and digital videodisks.

The reorganization also refined the focus of the MMTG to encompass all PC and networking solutions, with its principal product being the PowerPC. In addition, the Microcontroller Technologies Group is now responsible for providing systems solutions for the automotive market.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-217 Motorola North American Company Profiles

Management

Motorola, Inc. Gary L. Tooker Chief Executive Officer Christopher B. Galvin President and Chief Operating Officer Thomas D. George Executive Vice President Carl F. Koenemann Executive Vice President and Chief Financial Officer

Motorola Semiconductor Products Sector Thomas D. George President and General Manager Murray A. Goldman Senior Vice President and Assistant General Manager Bertrand Cambou Senior Vice President and Director, Technology R. Gary Daniels Senior Vice President and GM, Microcontroller Technologies Group Larry L. Gartin Senior Vice President and Director, Finance Gary M. Johnson Senior Vice President and GM, Service, Panning, and Logistics Paul J. Shimp Senior Vice President and Director, Quality and Support Operations Fred Shlapak Senior Vice President and GM, Communications and Advanced Consumer Technologies Group C.D. Tam Senior Vice President and GM, Asia-Pacific Semiconductor Group Barry Waite Senior Vice President and GM, Microprocessor and Memory Technologies Group Pete Bingham Vice President and GM, MOS Digital-Analog IC Division Andre Borrell Vice President and GM, Communications, Power, and Signal Technologies Group Jim George Vice President and GM, Digital Signal Processing Division Steve Hanson Vice President and GM, European Semiconductor Group George Turner Vice President and GM, Logic and Analog Technologies Group Robert Weisshappel Vice President and GM, Research and Development Brian Hilton Vice President and Director, World Marketing L.J. Reed Vice President and Director, Application Specific IC Division

1-218 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Motorola

Products and Processes

MOS MEMORY ANALOG ✔ DRAM ✔ Amplifier ✔ SRAM ✔ Interface Flash Memory ✔ Consumer/Automotive EPROM ✔ Voltage Regulator/Reference ROM ✔ Data Conversion EEPROM ✔ Comparator Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)

MOS LOGIC DIGITAL BIPOLAR ✔ General Purpose Logic ✔ Bipolar Memory ✔ Gate Array ✔ General Purpose Logic Standard Cell ✔ Gate Array/Standard Cell ✔ Field Programmable Logic Field Programmable Logic ✔ Other Special Purpose Logic Other Special Purpose Logic MPU/MCU/MPR MOS MICROCOMPONENT ✔ MPU OTHER ✔ MCU Full Custom IC ✔ MPR ✔ Discrete ✔ DSP ✔ Optoelectronic

Digital Bipolar 5%

Analog 12% MOS Micro MOS Memory 34% 15% MOS Logic Discrete/Opto 16% 18%

1995 Semiconductor Sales by Device Type

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-219 Motorola North American Company Profiles

Provided below are details concerning Motorola’s semiconductor products.

Analog ICs Motorola offers an extensive line of linear ICs, including amplifiers and comparators, power supply circuits, motor control devices, voltage references, data converters, interface circuits, communications circuits, consumer electronics ICs, automotive ICs, and other special purpose linear ICs like RF circuits. These devices are manufactured using bipolar or MOS technology.

Application-Specific ICs (ASICs) Motorola’s ASIC products include CMOS, bipolar, and BiCMOS gate arrays and FPGAs. Its most advanced µ digital gate arrays (M5C Series) are based on three-layer-metal 0.45 m (Leff ) CMOS process technology, which allows for up to 557,000 available gates and 556 I/Os.

Application-Specific Standard Products (ASSPs) The company launched its Customizable Standard Product (CSP) program in June 1995, following two years of development. For the general market, Motorola will make available a stream of ASSPs for asynchronous transfer mode (ATM) local and wide area network applications in its new MC92000 Series. The first device, an ATM cell processor that operates at 155 Mbits/second, was introduced in early 1996. The second device is expected to be a 155 Mbits/second ATM segmentation and reassembly controller.

Discretes, Optoelectronics, and Sensors These products include a variety of bipolar and MOS transistors, diodes, RF devices, thyristors, optoelectronics, pressure and temperature sensors, fiber optic devices, and power modules.

Logic ICs Since the inception of ICs, Motorola has been a leader in the market for digital logic devices. Its product line includes a broad range of bipolar MECL (Motorola emitter-coupled logic), MECL10K, MECL10KH, MECL III, ECLinPS (ECL in picoseconds), ECLinPS Lite, low-power TTL, and fast TTL logic IC families, as well as CMOS high-speed, low-voltage, and metal-gate logic IC families.

Memory ICs Motorola manufactures and markets dynamic and fast static RAMs, including processor-specific SRAMs and synchronous SRAMs. Its fast SRAMs are based on 0.8µm to 0.5µm BiCMOS and high-performance CMOS technologies with access times as fast as 5ns for 64K devices, 6ns for 256K devices, 5ns for 1M devices, and 12ns for 4M devices.

The company’s DRAMs include 4M and 16M parts designed using 0.6µm and 0.5µm high-performance CMOS technologies. In late 1995, Motorola announced it would join the IBM-Siemens-Toshiba DRAM development alliance. By joining the team, Motorola gains access to technology for 64M and 256M DRAMs, and will take part in the development of 1G DRAMs.

Motorola will be adding flash memory products to its portfolio later in 1996.

1-220 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Motorola

Microcontrollers and Digital Signal Processors Motorola offers one of the most comprehensive selections of high-performance single-chip microcontrollers, ranging from industry-standard 8-bit controllers to state-of-the-art 16-bit and 32-bit modular controllers.

The company’s 68HC05 and 68HC08 families of 8-bit MCUs are a part of the Motorola Customer Specific IC (CSIC) program, which is targeted for high-volume projects that require the cost-efficiency of standard devices, but have requirements that cannot be met by “off-the-shelf” components.

Motorola’s 16-bit MCUs include the 68HC11 controller family and the 68HC16 modular controller family. Its 32-bit MCUs include the 6833X controller family and the PowerPC-based MPC5XX controller family.

Motorola’s digital signal processor products include the 56100 and 56800 families of 16-bit general-purpose DSPs, the 56000, 56300, and 56800 families of 24-bit general-purpose DSPs, and the 96002 family of 32- bit general-purpose floating-point DSPs. The company is working to regain a dominant position in the merchant digital signal processor market by developing new DSPs for the personal and wireless communications applications. The first results of this effort are the DSP56300 for high-end digital cellular equipment and the DSP56800 for pagers and wireless handsets.

Microprocessors and Embedded Processors Motorola manufactures and markets high-performance microprocessors for computer applications and embedded processors for a variety of applications, including communications, imaging, office peripherals, multimedia systems, games, and industrial controls.

The PowerPC RISC microprocessor family has replaced the 680X0 family of CISC MPUs as Motorola’s mainstream processors for computer applications. However, the 680X0 MPUs still have a strong presence in the market for embedded processors.

¥ PowerPC 601 Microprocessor—The first member of the PowerPC family, the 2.8-million-transistor 32-bit 601 is designed for application in desktop computers. The 66MHz and 80MHz versions are based on four-layer-metal 0.6µm CMOS process technology. The newest 100MHz version (601v) is based on a µ µ 0.5 m (0.25 m Leff) CMOS process, which reduces the processor die size by 38 percent.

¥ PowerPC 602 Microprocessor—The 1-million-transistor 32-bit 602 is intended for use in portable and small form factor equipment, such as PDAs. It is based on a four-level-metal 0.5µm CMOS process.

¥ PowerPC 603/603e Microprocessors—The 32-bit 603 is a 1.6-million-transistor high-performance RISC MPU with integrated power management features for the notebook and energy-sensitive desktop PC markets. It is based on a four-level-metal 0.5µm CMOS process and is available in 66 and 80MHz versions. The 603e is an enhanced version of the PowerPC 603; it contains twice the cache size of the original 603 and extends its speed from 80MHz to 100MHz.

¥ PowerPC 604 Microprocessor—The 604 is the newest 32-bit PowerPC. Based on a 0.5µm CMOS process, the 604 has 3.6 million transistors and is available in 100, 120, 133, and 150MHz versions.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-221 Motorola North American Company Profiles

¥ PowerPC 620 Microprocessor—The 620 is the first 64-bit implementation of the PowerPC RISC architecture. It is intended for use in server and high-end workstation computers. The 133MHz 620 is based on a four-level-metal 0.5µm CMOS process and has about 7 million transistors.

Motorola’s embedded processor products include: the 680X0 family, the ColdFire (MCF51XX and MCF52XX) processors, the Embedded PowerPC (MPC8XX and MPC6XX) processors, the FlexCore products, the 683XX family of integrated microprocessors, data communications controllers and peripherals, and physical interface products.

Motorola plans to introduce a new “multimedia engine”, which combines microcontroller, MPEG-2 decompression, error correction, and 3D graphics functions on one chip. It is aimed at lowering the cost of multimedia products such as digital set-top boxes, digital video disc players, and electronic game systems.

Mixed-Signal ICs The company’s mixed-signal ICs are targeted at applications including wireless and wireline communications, multimedia systems, automotive equipment, and control networks.

Semiconductor Fabrication Facilities

Motorola has several fab facility projects underway, including the construction of a new 200mm wafer fab (MOS 17) in Tianjin, China, where CMOS and BiCMOS ICs will be produced. Other projects include the construction of a new fab facility (MOS 19) near Richmond, Virginia, for the production of PowerPC chips; an expansion of the Nippon Motorola fab in Aizu, Japan; and the starting up of MOS 13 in Austin, Texas, for the production of PowerPC devices in 1996. In addition, Motorola and Siemens may build a jointly owned $1.5 billion DRAM plant in Fort Worth, Texas. Construction of the joint venture is likely to begin in 1996, with initial production of 64M parts in 1998.

Motorola, Ltd. Motorola, Inc. Colvilles Road 3501 Ed Bluestein Boulevard Kelvin Estate, East Kilbride Austin, Texas 78721 Glasgow G75 0TG, Scotland Telephone: (512) 928-6000 United Kingdom MOS 2 Telephone: (44) (35) 52-39101 Cleanroom size: 30,000 square feet MOS 1 Capacity (wafers/week): 10,000 Cleanroom size: 30,000 square feet Wafer size: 100mm Capacity (wafers/week): 11,000 Process: CMOS Wafer size: 150mm Products: Logic ICs, ASICs Processes: CMOS, HMOS Feature sizes: 1.2µm-2.0µm Products: MCUs, linear and logic ICs Feature sizes: 1.0µm, 1.2µm

1-222 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Motorola

Motorola, Inc. Motorola, Inc. 3501 Ed Bluestein Boulevard 5005 East McDowell Road Austin, Texas 78721 Phoenix, Arizona 85008 Telephone: (512) 928-6000 Telephone: (602) 244-6900 MOS 3 MOS 4 Cleanroom size: 20,000 square feet Capacity (wafers/week): 3,000 Capacity (wafers/week): 12,000 Wafer size: 150mm Wafer size: 100mm Process: MOS Processes: CMOS, MOS Products: Power MOS discretes Products: MCUs Feature sizes: 0.5µm-5.0µm Feature size: 1.2µm

Motorola, Inc. Motorola, Inc. 2200 West Broadway Road 2200 West Broadway Road Mesa, Arizona 85202 Mesa, Arizona 85202 Telephone: (602) 962-2011 Telephone: (602) 962-2011 MOS 5 MOS 6 Cleanroom size: 48,000 square feet Cleanroom size: 150,000 square feet Capacity (wafers/week): 6,000 Capacity (wafers/week): 3,500 Wafer size: 125mm Wafer size: 150mm Processes: CMOS, MOS, bipolar Processes: CMOS, BiCMOS, Products: MCUs, logic, linear, and digital ICs Products: SRAMs, ASICs Feature size: 1.0µm Feature sizes: 0.8µm-1.2µm

Nippon Motorola, Ltd. Motorola, Inc. Aizu Facility 3501 Ed Bluestein Boulevard 1 Oyagi, Kofune Austin, Texas 78721 Shiokawa-machi, Yama-gun Telephone: (512) 928-6000 Fukushima-ken 969-35, Japan MOS 8 Telephone: (81) (241) 27-2231 Cleanroom size: 100,000 square feet MOS 7 Capacity (wafers/week): 7,000 Cleanroom size: 30,000 square feet Wafer size: 125mm Capacity (wafers/week): 10,000 Process: CMOS Wafer sizes: 100mm, 150mm Products: MCUs, MPUs, SRAMs, DSPs Process: CMOS Feature sizes: 0.7µm-1.5µm Products: MCUs, logic and smart power ICs Feature sizes: 1.0µm, 1.2µm (This fab is being upgraded to produce logic IC with 0.5µm to 0.65µm feature sizes on 200mm wafers. Construction will start in 1997 and operations in 1998.)

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-223 Motorola North American Company Profiles

Motorola, Ltd. Motorola, Inc. Colvilles Road 8105 Irvine Center Drive Kelvin Estate, East Kilbride Irvine, California 92718 Glasgow G75 0TG, Scotland, UK Telephone: (714) 932-5000 Telephone: (44) (35) 52-39101 MOS 10 MOS 9 Capacity (wafers/week): 1,500 Cleanroom size: 30,000 square feet Wafer size: 150mm Capacity (wafers/week): 5,000 Process: CMOS Wafer size: 150mm Products: DSPs, linear ICs Processes: CMOS, BiCMOS Feature size: 0.65µm Products: MPUs, MCUs, DSPs, SRAMs (Acquired from Western Digital) Feature sizes: 0.5µm, 0.65µm, 0.8µm, 1.0µm

Motorola, Inc. Motorola, Inc. 6501 William Canon Drive West 1300 North Alma School Road Austin, Texas 78735-8598 Chandler, Arizona 85224 Telephone: (512) 891-2000 Telephone: (602) 814-4691 MOS 11 MOS 12 Cleanroom size: 70,000 square feet Cleanroom size: 40,000 square feet (Class 1) Capacity (wafers/week): 4,000 Capacity (wafers/week): 4,000 Wafer size: 200mm Wafer size: 200mm Processes: CMOS, BiCMOS Process: CMOS Products: MCUs, MPUs, SRAMs, DSPs Products: MCUs, DSPs, linear ICs Feature sizes: 0.5µm-0.8µm Feature sizes: 0.5µm-0.65µm

Motorola, Inc. Motorola, Inc. 3501 Ed Bluestein Boulevard 3026 Cornwallis Road Austin, Texas 78721 Research Triangle Park, North Carolina 27709 Telephone: (512) 928-6000 Telephone: (919) 549-3100 MOS 13 MOS 15 Capacity (wafers/week): 5,000 Cleanroom size: 29,800 square feet (Class 10) Wafer size: 200mm Capacity (wafers/week): 5,000 Process: CMOS Wafer size: 150mm Products: MPUs, SRAMs Process: CMOS Feature sizes: 0.35µm-0.5µm (0.25µm capable) Products: MCUs, logic ICs Feature sizes: 0.8µm, 1.0µm (Acquired from Harris Semiconductor)

1-224 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Motorola

Motorola, Ltd. Motorola Headrig Road Tainjin, China South Queensferry MOS 17 West Lothian EH 30 9SH, Scotland Capacity (wafers/week): 3,000 MOS 16 Wafer size: 200mm Capacity (wafers/week): 5,000 Processes: CMOS, BiCMOS Wafer size: 150mm Products: ICs for wireless communications Processes: BiCMOS, CMOS Feature sizes: 0.5µm-1.0µm Products: MPUs, logic ICs (Scheduled to begin production in 1998) Feature sizes: 0.5µm-0.75µm (Acquired from Digital Equipment Corporation)

Motorola, Inc. Motorola, Inc. West Creek, Virginia 2200 West Broadway Road MOS 19 Mesa, Arizona 85202 Wafer size: 200mm Telephone: (602) 962-2011 Process: CMOS BP 1 Products: MPUs Cleanroom size: 20,000 square feet Feature sizes: 0.35µm, 0.25µm Capacity (wafers/week): 10,000 (Scheduled to begin production in 1999) Wafer size: 100mm Processes: Bipolar, MOS Products: Linear and smart power ICs Feature size: 3.0µm

Motorola, Inc. Motorola, Inc. 2200 West Broadway Road 2200 West Broadway Road Mesa, Arizona 85202 Mesa, Arizona 85202 Telephone: (602) 962-2011 Telephone: (602) 962-2011 BP 2 BP 3 Cleanroom size: 80,000 square feet Cleanroom size: 20,000 square feet Capacity (wafers/week): 10,000 Capacity (wafers/week): 5,000 Wafer size: 100mm Wafer size: 100mm Processes: Bipolar, MOS Processes: Bipolar, MOS Products: Linear ICs, ASICs Products: ASICs, logic and linear ICs Feature sizes: 1.0µm-2.0µm Feature size: 1.0µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-225 Motorola North American Company Profiles

Motorola Semiconducteurs Motorola, Inc. 126 Avenue du General Eisenhower 5005 East McDowell Road Le Mirail BP 1029 Phoenix, AZ 85008 31023 Toulouse Cedex, France Telephone: (602) 244-6900 Telephone: (33) (61) 41-11-88 RF Power and Rectifier Fabs BP 4 and Bipolar Power Fabs Cleanroom size: 80,000 square feet Cleanroom size: 40,000 square feet Capacity (wafers/week): 18,000 Capacity (wafers/week): 7,500 Wafer sizes: 100mm, 125mm Wafer size: 100mm (moving to 150mm in 1995) Processes: Bipolar, GaAs Processes: Bipolar, MOS Products: Discretes, RF MMICs, optoelectronics Products: Linear, smart power, and RF ICs, Feature sizes: 1.5µm-10.0µm discretes, optoelectronics Feature sizes: 1.0µm-3.0µm

Tohoku Semiconductor Corporation Izumi-ku, Sendai-shi, Miyagi Prefecture, Japan Capacity (wafers/week): 8,750 Wafer sizes: 150mm, 200mm Processes: CMOS, BiCMOS Products: DRAMs, SRAMs, MPUs, ASICs Feature sizes: 0.5µm-0.8µm (Joint venture with Toshiba. An individual profile of Tohoku is provided in this publication)

Key Agreements

¥ In early 1996, Motorola and IC Works entered into an agreement under which IC Works became an authorized second source of selected Motorola CMOS and BiCMOS mixed-signal timing circuits. Moreover, the two companies will work together to broaden their existing lines with complementary timing- circuit devices.

¥ In late 1995, Motorola announced it would join the IBM-Siemens-Toshiba DRAM development alliance. By joining the team, Motorola gains access to technology for 64M and 256M DRAMs, and will take part in the development of 1G DRAMs. In addition, Motorola and Siemens agreed to build a jointly owned DRAM fab in the U.S.

¥ International Rectifier signed a cross-licensing and alternate-source agreement with Motorola in early 1995 covering power ICs and power discretes.

¥ Motorola and IBM are jointly developing, producing, and marketing the PowerPC family of RISC microprocessors (Apple Computer also plays a part in the design of the MPUs).

¥ Motorola and Cherry Semiconductor have an agreement to develop mixed-signal ASICs for the automotive market.

1-226 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Motorola

¥ Motorola licensed the SRAM-based FPGA technology of Pilkington Microelectronics Ltd. of the United Kingdom in 1992. Motorola's first FPGAs were announced in 1995. In late 1995, Motorola also licensed Pilkington’s field programmable analog array (FPAA) technology.

¥ Motorola is partnering with National Semiconductor and Toshiba to develop and market new fast, high- drive, low-voltage CMOS bus interface chips.

¥ Motorola is working with IBM, Loral Federal Systems, and Lucent Technologies to establish a manufacturing infrastructure for x-ray lithography. The team hopes to have a manufacturing capability by 1997.

¥ Motorola has an RFID product agreement with Matsushita and ferroelectric memory pioneer Symetrix Corp. Motorola's subsidiary Indala Corp. will jointly produce a family of read/write RFID chips with Matsushita incorporating Symetrix's ferroelectric memory technology (Matsushita has an equity stake in Symetrix and has the right to relicense its technology).

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-227 National Semiconductor North American Company Profiles

NATIONAL SEMICONDUCTOR (NSC)

National Semiconductor Corporation 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, California 95052-8090 Telephone: (408) 721-5000 Fax: (408) 732-9742 Web Site: www.nsc.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends May 31

1991 1992 1993 1994 1995

Sales 1,702 1,718 2,014 2,295 2,374 Net Income (151) (120) 130 264 264 R&D Expenditures 199 208 229 256 283 Capital Expenditures 110 189 235 271 479

Employees 29,800 27,200 23,400 22,300 22,400

Company Overview and Strategy

National Semiconductor was established in Danbury, Connecticut, as a manufacturer of transistors in 1959. In 1967, the company moved its headquarters to Santa Clara, California, where it began producing proprietary ICs.

National has become a leading supplier of technologies for moving and shaping information that include data and voice networks; imaging, interface, and data bus protocols; audio and video signal processing; and mixed-signal applications. End-user markets for the company are focused in personal computers, telecommunication and switching systems, automotive, and mass storage. Other markets include data communications, power management, consumer electronics, and military/aerospace.

At the beginning of fiscal 1996, National decentralized its business by eliminating its group structure, leaving seven main operating divisions: the Analog and Mixed-Signal Divisions, the Data Management Division, the Embedded Technologies Division, the Local Area Networks Division, the Wide Area Networks Division, and the Personal Systems Division.

1-228 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles National Semiconductor

The Analog and Mixed-Signal Divisions offer a variety of analog products including standard products, application specific products, and full custom devices, as well as advanced mixed-signal solutions. The Data Management Division offers high performance chips for switching and data manipulation applications. The Embedded Technologies Division consists of microcontrollers and memory products. The Local and Wide Area Network Divisions provide chip solutions for networking computers, telephones, televisions, and satellites. The Personal Systems Division develops products for the personal computer, laptop, and workstation markets, particularly peripheral function devices.

In early 1995, National acquired Comlinear Corporation, a Fort Collins, Colorado-based supplier of high- frequency amplifiers, current-feedback devices, analog-to-digital converters, and other analog signal processing circuits. Comlinear is operating as a separate business unit within National's Analog Mixed-Signal Systems Division and retains the Comlinear product name.

Other Japan Discretes 17% 9% 5% Europe Americas Analog and 24% Mixed-Signal 43% Logic and Memory 56% 22% Southeast Asia 24%

1995 Sales by Product Type 1995 Sales by Geographic Region

National is continuing to shift its emphasis from its mature products lines (i.e., bipolar and CMOS logic and memory products) to its higher margin analog and mixed-signal product lines.

Management

Brian Halla President and Chief Executive Officer Richard M. Beyer Chief Operating Officer Ellen M. Hancock Chief Operating Officer Kirk P. Pond Chief Operating Officer Patrick J. Brockett President, International Business Group Donald P. Beadle Senior Vice President and Executive Advisor Charles P. Carinalli Senior Vice President and Chief Technical Officer John M. Clark III Senior Vice President and General Counsel Donald Macleod Senior Vice President, Finance and Chief Financial Officer R. Thomas Odell Senior Vice President, Standard Products Group Edgar R. Parker Senior Vice President, Quality and Reliability Richard L. Sanquini Senior Vice President, Intellectual Property Protection and Business Development Bami Bastani Vice President and GM, Embedded Technologies Division Mike Bereziuk Vice President and GM, Personal Systems Division Michael D. Burger Vice President and GM, Southeast Asia Division, International Business Group W. Wayne Carlson Vice President and GM, Data Management Division

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-229 National Semiconductor North American Company Profiles

Gordon C. Chilton Vice President, Asia Pacific David S. Dahmen Vice President and Treasurer Raymond G. Hawkins Vice President and GM, Americas Division, International Business Group Gunner Hurtig III Vice President, Corporate Strategic Planning Tatsuo Ishihara Vice President, Japan Division, International Business Group Keith D. Jackson Vice President and GM, Analog Mixed-Signal Systems Division Keith M. Kolerus Vice President, Strategy, International Business Group Robert B. Mahoney Vice President and Controller Douglas M. McBurnie Vice President and GM, Local Area Networks Division Robert M. Penn Vice President and GM, Wide Area Networks Division Hans Rohrer Vice President, European Division, International Business Group Robert M. Whelton Vice President and GM, Analog Products Division Richard Wilson Vice President, Human Resources

Products and Processes

MOS MEMORY ANALOG DRAM ✔ Amplifier ✔ SRAM ✔ Interface ✔ Flash Memory ✔ Consumer/Automotive ✔ EPROM ✔ Voltage Regulator/Reference ROM ✔ Data Conversion ✔ EEPROM ✔ Comparator ✔ Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)

MOS LOGIC DIGITAL BIPOLAR ✔ General Purpose Logic Bipolar Memory ✔ Gate Array ✔ General Purpose Logic ✔ Standard Cell Gate Array/Standard Cell ✔ Field Programmable Logic ✔ Field Programmable Logic ✔ Other Special Purpose Logic ✔ Other Special Purpose Logic MPU/MCU/MPR MOS MICROCOMPONENT ✔ MPU OTHER ✔ MCU ✔ Full Custom IC ✔ MPR ✔ Discrete DSP ✔ Optoelectronic

Analog and Mixed-Signal Products Analog products and technology has been one of National’s core competencies since its inception. The company continues to be a leader in the analog IC industry. Its analog products include high-performance operational amplifiers, power management circuits, data acquisition circuits, and voltage regulators. National’s mixed-signal products include circuits for video monitors and consumer audio equipment, real time clocks, automotive ICs, custom linear ASICs (CLASICs), and peripheral drivers.

1-230 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles National Semiconductor

Data Management Products National’s data management ICs include bipolar, CMOS, and BiCMOS ICs such as the company’s FACT, FAST, BCT, ABT, and 100K ECL general purpose logic families.

Embedded Technologies Products This product line consists of 4-bit, 8-bit, and 16-bit microcontrollers, 8-bit and 32-bit microprocessors (including its own 486-class core), and memory products such as EPROMs (16K to 4M), serial and parallel EEPROMs (256bit to 64K), and flash memories (4M, 8M, and 16M). These products are targeted at markets which combine basic computational or logic algorithms with specific memory storage chips.

Networking Products National is one of the world’s leading suppliers of LAN Ethernet controller chipsets, which are used in networking computers. The company’s WAN products include ATM, ISDN, and Sonet/SDH families of traffic management, terminal/access, and transmission devices.

Personal Systems Products National’s personal systems products consist of peripheral function devices that work in tandem with the host microprocessor in computer systems. These products include a family of input/output devices that consolidate many dependent function on the motherboard and a variety of chips for use in high performance disk drives such as read/write amplifiers, pulse detectors, data synchronizers, encoder/decoder circuits, and motor speed and head positioning control devices.

National Semiconductor's primary process technology, M2CMOS, is built around a core double-metal CMOS process. To this core, modules are added to provide a third level of metallization producing analog, EEPROM, and BiCMOS applications. Optimized for analog and mixed-signal applications, the M2CMOS process is used by the majority of the communications and computing group product lines. A wide range of design rules (down to 0.55µm) are supported by the M2CMOS process. Plans are to further shrink the process to 0.35µm by 1997.

In addition to its family of M2CMOS processes, National also utilizes a high-performance core VLSI bipolar process named ASPECT, which stands for Advanced Poly Emitter-Coupled Technology. ASPECT and its BiCMOS module, ABiC, are used for high-performance gate arrays, customer-owned designs, and wireless communications. ASPECT has been scaled from 2.0µm to 0.8µm and will be replaced with BiCMOS at 0.5µm and beyond. The current version of ASPECT and ABiC offer up to four-layers of metallization in addition to a level zero local interconnect.

A variety of analog processes are used to produce a broad line of linear products. Notable process technologies are VIP, a high speed complementary bipolar process for operational amplifiers, LB, a medium voltage automotive market oriented process, LMDMOS, a high power mixed-signal process, and LFAST and LCMOS, which are used for CLASICs.

The FAST, FACT, and BCT processes are used for bipolar, CMOS, and BiCMOS digital logic. Minimum production feature sizes for FACT are at 1.5µm, while BCT feature sizes are at 1.0µm.

National Semiconductor also has a CEPROM process for non-volatile memory products with production feature sizes of 1.2µm and 0.8µm.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-231 National Semiconductor North American Company Profiles

Semiconductor Fabrication Facilities

In 1995, National completed the construction of a new $116 million 200mm BiCMOS and CMOS wafer production line at its R&D center in Santa Clara, California. The 20,000 square-foot, Class 1 cleanroom is being used for the fabrication of ICs with 0.35µm geometries (0.25µm geometries in the future). National is also installing a 200mm wafer line at its fab in Maine for the fabrication of ICs with 0.35µm geometries. The new $600 million facility will include 40,000 square feet of Class 1 cleanroom and should be ready for production in 4Q97.

National Semiconductor Corp. National Semiconductor Corp. Fairchild Research Center 2900 Semiconductor Drive 2900 Semiconductor Drive Santa Clara, California 95012 Santa Clara, California 95012 Telephone: (408) 721-5000 Telephone: (408) 721-5000 Cleanroom size: 20,000 square feet Cleanroom size: 20,000 square feet Capacity (wafers/week): Capacity (wafers/week): 500 Wafer size: 200mm Wafer size: 150mm Processes: CMOS, BiCMOS Processes: Bipolar, CMOS, BiCMOS Products: Analog and mixed-signal ICs Products: R&D Feature sizes: 0.35µm, 0.5µm Feature sizes: 0.35µm-0.8µm

National Semiconductor Corp. National Semiconductor Corp. 333 Western Avenue 3333 West 9000 South South Portland, Maine 04106 West Jordon, Utah 84088 Telephone: (207) 775-8100 Telephone: (801) 562-7000 Cleanroom size: 51,000 square feet Cleanroom size: 50,000 square feet Capacity (wafers/week): 8,600 Capacity (wafers/week): 8,000 Wafer sizes: 100mm, 125mm Wafer size: 150mm Processes: Bipolar, CMOS, BiCMOS Process: CMOS Products: Logic and analog ICs, discretes Products: Memory, analog, and logic ICs Feature sizes: 0.8µm-2.5µm Feature size: 0.8µm

National Semiconductor Corp. National Semiconductor (UK) Ltd. 1111 West Bardin Road Earnhill Road Arlington, Texas 76017 Larkfield Industrial Estate Telephone: (817) 468-6400 Greenock PA16 OEQ Fabs I and II Scotland, UK Cleanroom size: 78,000 square feet Telephone: (44) (1475) 633733 Capacity (wafers/week): 18,000 Cleanroom size: 106,000 square feet (three facilities) Wafer sizes: 150mm Capacity (wafers/week): 20,000 Process: CMOS Wafer sizes: 100mm, 150mm Products: Logic ICs, EEPROMs, EPROMs, Processes: Bipolar, CMOS, BiCMOS Microcomponents, ASICs Products: Analog and logic ICs, MCUs Feature sizes: 0.5µm-1.5µm Feature sizes: 1.2µm, 1.5µm, 2.0µm, 2.5µm, 5.0µm

1-232 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles National Semiconductor

National’s semiconductor assembly and test plants are located in Toa Payoh, Singapore; Malacca and Penang, Malaysia; and Cebu in the Philippines.

Key Agreements

¥ In early 1996, National joined up with the Belgian research firm IMEC to develop process technology for the 0.25µm and 0.18µm generations.

¥ National acquired SiTel Sierra BV, in Hertogenbosch, the Netherlands, which designs and supplies both components and subsystems for the wireless market and baseband solutions that couple well with receiver products offered by National.

¥ National signed a three-year agreement in mid-1995 with Tower Semiconductor Ltd. under which Tower was to increase its wafer production commitment to National. Tower’s fab in Israel was originally owned by National, which retains an 8.3 percent interest in foundry.

¥ In November 1994, National formed a long-term alliance with Synaptics Inc. to jointly develop computer controls based on human senses (sight, touch, and sound).

¥ National formed an alliance with 8x8 Inc. (formerly Integrated Information Technology) in 1993. The partners are developing embedded processor, video, and data compression technologies.

¥ National entered a resale and joint-development agreement with NEC for Ethernet ICs in 1993.

¥ National began jointly developing a new family of CMOS bus-interface logic ICs with Toshiba and Motorola in 1993.

¥ National entered a cooperative relationship with Matsushita, including joint development and manufacturing (1992).

¥ National established a long-term partnership with Toshiba for the development, licensing, design, and manufacture of NAND and NOR flash memories (1992).

¥ National entered a networking technology agreement with IBM in 1992 under which IBM licensed to National its single-chip Token-Ring Protocol Interface Controller (TROPIC) technology for production and sales.

¥ National signed a 10-year semiconductor patent cross-licensing agreement with Hitachi in 1991.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-233 Oak Technology North American Company Profiles

OAK TECHNOLOGY

Oak Technology Inc. 139 Kifer Court Sunnyvale, California 94086 Telephone: (408) 737-0888 Fax: (408) 737-3838

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Sales 110 43 30 46 111 Net Income 4 (3) (5) 4 21 R&D Expenditures 5 6 15

Employees 225

Company Overview and Strategy

Oak Technology is a leading supplier of high-performance ICs and related software for multimedia applications in personal computers, PC peripheral products, and consumer electronics. The company has established four key areas of focus: optical storage, compression/imaging, video/graphics (2D and 3D), and PC audio.

Founded in 1987, Oak’s initial product offerings were PC graphics chips. In 1988, the company expanded into Super VGA graphics controllers and grew to become a unit volume leader in the SVGA market segment between 1989 and 1991. Furthermore, Oak developed the first commercially available CD-ROM controller in 1990 and pioneered the development of an IDE/ATAPI (integrated drive electronics/AT attachment packet interface) CD-ROM controller in 1993. With the IDE/ATAPI established as an interface standard for CD-ROM drives, Oak is one of the largest merchant suppliers of CD-ROM controllers.

Oak’s most recent product development includes MPEG video decoders, its Spitfireª family of 64-bit video/graphics accelerators, and its Mozartª family of 16-bit digital audio controllers supporting Sound Blaster and the Windows Sound System standards.

1-234 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Oak Technology

Other 12% PC Audio 14%

CD-ROM Controllers 74%

1995 Sales by Product Type

In fiscal 1995, 93 percent of sales were derived from foreign customers, primarily in Japan, Singapore, and Taiwan.

Management

David D. Tsang, President and Chief Executive Officer Donald R. Bryson Executive Vice President and Chief Operating Officer Sidney Faulkne Vice President, Finance, and Chief Financial Officer Dr. Mou Hsin Yang Vice President, Operations Ben T. Taniguchi Vice President, Optical Storage Business Unit Kenji Fujimoto Vice President, Oak Technology; General Manager, Oak Technology, K.K. Abel Lo Vice President, Oak Technology; General Manager, Oak Technology, Taiwan

Products and Processes

Oak currently offers products in four key multimedia categories: optical storage, compression/imaging, video/graphics, and PC audio. Oak’s products include CD-ROM controllers, MPEG video decoders, video compression/expansion processors (VCEPs), 64-bit multimedia video/graphics accelerators, and 16-bit digital audio controllers.

Semiconductor Fabrication Facilities

Oak Technology is a fabless IC supplier. The company's devices are produced by wafer foundry companies, including Chartered, TSMC, Samsung, and Seiko Epson.

In 1995, Oak Technology entered into several long-term agreements with TSMC and Chartered Semiconductor, securing additional wafer capacity through 2000.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-235 Opti North American Company Profiles

OPTI

Opti Inc. 2525 Walsh Avenue Santa Clara, California 95051-1302 Telephone: (408) 980-8178 Fax: (408) 980-8860 Web Site: www.opti.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 65 98 85 134 164 Net Income 5 9 9 15 11 R&D Expenditures 17 6 7 9 11 Capital Expenditures 2 7 10

Employees 220 224

Company Overview and Strategy

Opti Inc. was spun out from Chips and Technologies in 1989 to focus on developing and supplying core logic chipsets to the personal computer industry. The company holds the largest share of the world's PC chipset market. In addition to its core logic chipsets, Opti supplies peripheral and multimedia chipsets as well as custom ICs for audio/telephone, power management, graphics/video, and storage control applications. The company’s chipsets provide in one or a few semiconductor devices the core logic functions of a PC as well as multimedia related functions.

Audio Chips Europe/Other 20% 16%

North America Far East Core Logic Chipsets 25% 59% 80%

1995 Sales by Product Type 1995 Sales by Geographic Region

1-236 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Opti

Management

Stephen Dukker President Jerry Chang Chief Executive Officer David Zacarias Chief Financial Officer David Lin Executive Vice President, Emerging Businesses Walt Henry Vice President, Operations Matthew Ready Vice President, Sales Chin Sun Vice President, Technology Paul Tien Vice President, Multimedia Products Steve Wu Vice President, Mobile Products Steve Rowe Director, Human Resources Prem Talreja Director, Core Logic Marketing H.T. Tung Director, Core Logic Engineering Jeffrey Wang Director, Foundry Operations

Products and Processes

Opti is the industry's leading supplier of PC core logic chipsets. The company introduced its first 486 AT chipset in 1989, and its first chipset for the Pentium in 1993.

The initial member of its Viper family of Pentium-class chipsets was unveiled in 1994. The second member of the family, the Viper-N, is designed for Pentium PCI-based portable computers, and the newest member, the Viper-M, is a multimedia-enhanced chipset for Pentium PCI-based desktop computers. In addition to the Pentium, the Viper products will support compatible AMD and Cyrix microprocessors.

In 1993, Opti began to broaden its product line to include peripheral chips. In the fourth quarter of that year, the company acquired MediaChips Inc., a designer of audio chips. Through the MediaChips acquisition, Opti began supplying 16-bit audio controller ICs featuring an on-chip sigma-delta audio codec/mixer. That move was followed by an entrance into the graphics chip market with an LCD controller for notebook computers in early 1994. Its other peripheral ICs include IDE disk drive controllers and bus-interface bridge chips.

The process technologies used by Opti in the design and manufacture of its semiconductors include 0.6µm and 0.8µm CMOS.

Semiconductor Fabrication Facilities

Fabless Opti has three principal foundry partners, IBM Microelectronics, Ricoh, and UMC. The company also uses, to a certain extent, TSMC, Samsung, Winbond, and Toshiba for the fabrication of its wafers.

In 1995, Opti signed a manufacturing and foundry venture agreement with United Microelectronics Corporation (UMC). Under the agreement, Opti will make a $30 million equity investment in UMC’s joint venture IC foundry, called United Silicon Inc. (USI). The fab is expected to begin production of 0.5µm 200mm wafers in the second half of 1997.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-237 Orbit Semiconductor North American Company Profiles

ORBIT SEMICONDUCTOR

Orbit Semiconductor, Inc. 116 Java Drive Sunnyvale, California 94089 Telephone: (408) 744-1800 Fax: (408) 747-1263 Web Site: www.orbitsemi.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 24 25 34 50 62 Net Income (2) 0.4 2 5 7 R&D Expenditures 12235 Capital Expenditures 0.5 1 4 16

Employees 116 120 154 184 278

Company Overview and Strategy

Orbit Semiconductor was established in 1985 as a subsidiary of Orbit Instruments Corp. In November 1991, the business was acquired by the company's current management. In June 1995, Orbit acquired KMOS Semiconductor, a supplier of digital and analog ASICs.

Today, Orbit Semiconductor specializes in semiconductor design, manufacturing, and engineering support services that allow system designers to manage application specific integrated circuit (ASIC) development, production, scheduling, and inventory control. Orbit provides its Encore! program that converts FPGAs and other IC designs into Orbit digital gate arrays for more cost-effective solutions or accelerated delivery. Orbit also offers a mixed-signal (analog/digital) design service that provides rapid development of custom mixed- signal ASICs. A shared wafer-processing program, Foresight, is provided for cost-effective prototyping of mixed-signal ASICs. In addition, Orbit offers contract manufacturing programs including hi-rel manufacturing, a low-cost prototyping service, and charge coupled device (CCD) fabrication.

The company's Encore! program has grown rapidly since it was introduced in October 1992. As of December 1995, the number of completed Encore! design conversion totaled 733. Revenues from its gate array program, which includes Encore! and mixed-signal designs, made up 44 percent of total sales in 1995.

Orbit's customers include companies that design various electronic systems and products for application in the medical, telecommunications, consumer, aerospace and military, computers and peripherals, and other industries. Sales to foreign customers (primarily in Europe and Asia) accounted for 10 percent of revenues in 1995.

1-238 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Orbit Semiconductor

Management

Gary P. Kennedy President and Chief Executive Officer Steve Kam Executive Vice President, Technology and Chief Technology Officer Joseph K. Wai Executive Vice President, Chief Operating Officer, Chief Financial Officer, and Secretary Richard B. Kash Executive Vice President, Mixed-Signal Design Edward Rodriguez Group Vice President, Sales, Marketing, Engineering, and Customer Service Zahid Ansari Vice President, Product Engineering Fernando A. Bettencourt Vice President, Operations Brian Gillings Vice President, Marketing George W. Lewicki Vice President, Software Engineering Betty Y. Newkirk Vice President, Customer Service Lynn G. Reed Vice President, Design Engineering Glen R. Wiley Vice President, Worldwide Sales

Products and Processes

Orbit's manufacturing services include several IC fabrication programs. The most popular program, Encore!, is a service that converts netlists for gate arrays or FPGAs into Orbit gate arrays with 270 to 37,000 usable gates. The resulting circuits are functionally equivalent, but lower in price. Another program, Foresight, supports multi-project, multi-technology runs and reduces NRE charges. Subscribers of Foresight's processes see lower costs because they share space on masks and wafers.

Both Encore! and Foresight users have access to all of Orbit's processes. These include: 1.0µm and 1.2µm N-well and P-well CMOS processes with various options such as a second poly layer for capacitors and gates, NPN bipolar transistors with high or low collector resistances, classical EEPROM, imaging buried channel CCDs with an oxide nitride gate insulator to maintain low leakage on large arrays, and conventional N-channel and P-channel transistors to allow on-chip digital logic.

Orbit offers additional programs based on its independent manufacturing capabilities. Its low-volume manufacturing programs include a "High Reliability Manufacturing Program" in support of medical companies and military contractors and a low-cost prototyping service, typically for fabless semiconductor companies.

Semiconductor Fabrication Facilities

Orbit intends to establish and operate a semiconductor production facility in Eilat, Israel. Plans call for a cleanroom of 12,500 square feet (expandable to 25,000 square feet) with an initial capacity of 1,500 150mm wafers per week, utilizing 0.8µm process technology.

In the meantime, Orbit is in the process of expanding its wafer fabrication capacity in Sunnyvale, California. The expansion, consisting of an additional 6,000 square feet of cleanroom includes installation of a 150mm wafer line capable of triple-metal 0.8µm process technology.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-239 Orbit Semiconductor North American Company Profiles

Orbit Semiconductor, Inc. 169 Java Drive Sunnyvale, California 94089 Cleanroom size: 12,500 square feet Capacity (wafers/week): 2,400 Wafer size: 100mm (upgrading to 150mm) Processes: CMOS, CCD Products: ASICs, foundry services Feature sizes: 1.0µm, 1.2µm, 2.0µm (0.8µm under development)

1-240 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Paradigm Technology

PARADIGM TECHNOLOGY

Paradigm Technology, Inc. 71 Vista Montana San Jose, California 95134 Telephone: (408) 954-0500 Fax: (408) 954-8913 Web Site: www.prdm.com

IC Manufacturer

Financial History ($M)

1991 1992 1993 1994 1995 Sales 12 26 37 36 52

Employees 155 140 190 205 244

Company Overview and Strategy

Paradigm Technology was founded in 1987 and is involved in the design, development, and production of SRAM-based devices and modules. Paradigm targets its products at commercial, industrial, and military applications in high-end PC and server, telecommunications, and networking systems. Paradigm has developed a proprietary CMOS process that has achieved feature sizes in the 0.6µm range.

Paradigm completed a successful financial restructuring in June of 1994. The restructuring began in January 1994 and led to pre-negotiated Chapter 11 filling on March 30, 1994. Paradigm was under Chapter 11 bankruptcy status from March 30, 1994 through May 24, 1994. However, the company emerged with a record $9.4 million in sales in the quarter ended September 1994. Furthermore, the company received $11 million worth of investments from Singapore-based ACMA Ltd. and National Semiconductor.

In 1Q96, Paradigm acquired startup NewLogic Corporation, gaining products and technology designs that incorporate logic memory arrays. NewLogic was merged into Paradigm and operates as the firm’s new system division. The first SRAM-based product will be released in late 1996.

Management

Michael Gulett President and Chief Executive Officer Bob McClelland Vice President, Finance Phil Siu Vice President, Engineering Richard Veldhouse Vice President, Marketing and Sales Steve Zadig Vice President, Operations

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-241 Paradigm Technology North American Company Profiles

Products and Processes

Paradigm Technology manufactures high-performance 256K, 1M, and 4M asynchronous SRAMs, 100MHz FIFO buffer-memory chips, high-speed processor-specific synchronous burst RAMs, and high-speed cache RAM modules.

The proprietary technology of Paradigm involves a dual-well CMOS process consisting of two polysilicon layers and two metal layers, with three of the four layers fully configurable. Its technology has reached feature sizes of 0.6µm in the newest products.

Semiconductor Fabrication Facilities

To add production capacity, Paradigm established a foundry agreement with Atmel in May 1995 (see Key Agreements) and is working on setting up another. The company also has a foundry alliance with NKK Corporation in Japan.

Paradigm Technology, Inc. 71 Vista Montana San Jose, California 95134 Cleanroom size: 18,000 square feet Capacity (wafer/week): 2,000 Wafer size: 125mm Process: CMOS Products: SRAMs Feature sizes: 0.6µm, 0.8µm

Key Agreements

¥ Paradigm and Atmel signed a five-year manufacturing, product, and technology agreement in May 1995. Terms of the agreement include guaranteed wafer supply from Atmel to Paradigm for a five year period. Moreover, Paradigm transferred its 0.6µm SRAM process to Atmel, and the two companies are jointly developing 0.5µm and 0.4µm technologies for SRAM manufacturing by both. Atmel also made a significant equity interest in the company.

¥ Paradigm has an extensive relationship with Japan's NKK Corporation. NKK holds a 10 percent stake in Paradigm as well as a technology and product license for 256K and 1M SRAMs and FIFOs. The two companies worked together to codevelop the latest 4M technology. Paradigm also has access to NKK's state-of-the-art 200mm wafer fabrication facility in Japan.

¥ Paradigm has a strategic alliance with National Semiconductor that provides National exclusive marketing and sales rights to Paradigm’s products for military and aerospace applications. National also made an equity investment in Paradigm.

1-242 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Peregrine Semiconductor

PEREGRINE SEMICONDUCTOR

Peregrine Semiconductor Corporation 2909 Canõn Street San Diego, California 92106 Telephone: (619) 523-2660 Fax: (619) 523-2655

Fabless IC Supplier

Employees 40

Company Overview and Strategy

Founded in 1990, Peregrine Semiconductor develops and markets high-performance integrated circuits based on its patented UTSiª (ultra thin silicon) process. Initially, Peregrine focused on developing the UTSi process and today, through joint research and product development, uses this proprietary technology to develop high-performance products targeted at specific applications such as wireless communications, portable computing, and high-speed memory.

Management

Ronald E. Reedy, Ph.D. President and Chief Executive Officer Mark L. Burgener, Ph.D. Vice President, Technology Stephen Farnow Ph.D. Vice President, Operations Ed Lare Vice President, Marketing and Product Development Edward R. Moore Vice President, Finance David R. Staab Vice President, Design

Products and Processes

Currently, Peregrine is developing the Microcommunicatorª family of frequency synthesizers, which will be capable of operating at frequencies as high as 2.5GHz. This family of communications products will provide integrated solutions to wireless system design problems in applications such as satellite, cellular, and cordless telephones, and cable and direct broadcast satellite television.

Semiconductor Fabrication Facilities

The company's devices are currently produced by Asahi Kasei Microsystems in Japan.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-243 Peregrine Semiconductor North American Company Profiles

Key Agreements

¥ In January 1996, Peregrine signed a six-year fab agreement with Asahi Kasei Microsystems Co. (AKM) of Japan. AKM will provide wafer fabrication to Peregrine in exchange for process technologies. The two companies are also negotiating a joint development agreement for future products, combining their capabilities in design, manufacturing, and process technology.

1-244 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Pericom Semiconductor

PERICOM SEMICONDUCTOR

Pericom Semiconductor Corporation 2380 Bering Drive San Jose, California 95131 Telephone: (408) 435-0800 Fax: (408) 435-1100 Web Site: www.pericom.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends June 30

1992 1993 1994 1995 Sales 0.5 6 19 23

Employees 26 40 50 100

Company Overview and Strategy

Pericom Semiconductor, founded in 1990, designs and markets ultra fast digital and mixed-signal CMOS and BiCMOS ICs that provide solutions to bottlenecks in high-performance computing and communications systems. The company's first products were high-performance cache SRAMs. However, its current product line includes CMOS 5V and 3V logic clock generators and drivers, networking ICs, and application specific switching devices. Pericom's 3V, 5V, and 3V/5V products are applicable in computing, datacommunications, and networking systems.

Founded originally as Pioneer Semiconductor, the company changed its name to Pericom Semiconductor in 1993 to avoid becoming confused with a number of other technology companies with "Pioneer" in their names.

Management

Alex Hui President and Chief Executive Officer Patrick Brennan Vice President, Finance and Chief Financial Officer John Chi-Hung Hui, Ph.D. Vice President, Technology Hank O'Hara Vice President, Sales and Marketing Michael Yen Vice President, Applications and Systems Engineering Van Lewing Director, Marketing

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-245 Pericom Semiconductor North American Company Profiles

Products and Processes

Employing proprietary 0.8µm and 0.6µm CMOS and BiCMOS technologies, Pericom provides advanced logic, clock, and mixed-signal products.

• High-speed FCT bus interface logic chips with propagation delays as low as 3.2ns • High-speed clock distribution series, including PLL implementation for high clock rates • Fast switching, low impedance bus switches • Wide architecture 16-bit FCT logic families • Low voltage 3.3V, high-performance 16-bit FCT and LPT (low-power technology) logic families • Frequency synthesizer ICs that provide several PLL generated output frequencies for PC applications • Active token ring hub fully integrated, high-performance mixed-signal devices

Semiconductor Fabrication Facilities

Pericom has foundry relationships with Austria Mikro Systeme International, Chartered Semiconductor Manufacturing, and New Japan Radio Corp.

1-246 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Power Integrations

POWER INTEGRATIONS

Power Integrations Inc. 477 North Mathilda Avenue Sunnyvale, California 94086 Telephone: (408) 523-9200 Fax: (408) 523-9300

Fabless IC Supplier

Employees 75

Company Overview and Strategy

Power Integrations, founded in 1988, is a privately held company focused on the power conversion market. The company designs, develops, and markets integrated circuits that combine low-voltage analog and digital control capability with high-voltage power output devices in monolithic form.

The company's technology is used to innovate high-voltage products for the power supply, battery charging, telecommunications, motor control, and high-efficiency lighting markets.

Management

Howard Earhart President and Chief Executive Officer Balu Balakrishnan Vice President, Marketing and Engineering Vladimir Rumennik, Ph.D. Vice President, Technology Dan Selleck Vice President, Sales Robert Staples Vice President, Finance and Administration Clifford Walker Vice President, Corporate Development Shyam Dujari Director, Marketing

Products and Processes

Power Integrations utilizes a proprietary high-voltage BiCMOS process to provide monolithic power supply and interface products. This process is capable of combining 1,200V N-channel MOSFETs, 700V P-channel MOSFETs, and 400V L-IGBTs with 5-15V CMOS and bipolar logic devices.

TOPSwitch¨ is the newest family of products for power conversion applications. In addition to integration benefits of the high voltage process technology, this family also has patented circuit and system design innovations.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-247 Power Integrations North American Company Profiles

The company's power supply IC product line is targeted at the needs of portable and small form-factor products such as portable computers, camcorders, cellular telephones, PBX line cards, and feature phones. The high-voltage outputs of Power Integrations' power supply circuits provide universal input voltage (85-256 VAC) capability. The high-frequency switching capability and low system component count enables low-cost, small form-factor power supply/chargers to be realized. The power supply ICs cover universal input voltage applications from 5 watts to 50 watts (10 watts to 60 watts from 220 VAC). A one-watt back converter for non-isolated ISDN applications is also available.

Its interface IC products are designed for use in energy-efficient, variable-speed electric motors for appliances such as room air conditioners. The high-voltage capability of these products provides cost- effective level shifting capability and control for those 110/220 VAC applications. The latest product is the INT 100 half-bridge MOSFET driver, providing 800-volt level shifting and control for electric motors in the 50W to 3kW power range.

Semiconductor Fabrication Facilities

Foundry relationships with AT&T, Panasonic Semiconductor group of Matsushita, and Oki Electric have been established for wafer fabrication utilizing Power Integrations' proprietary process.

Key Agreements

¥ Power Integrations granted Matsushita access to its technology and products for internal consumption worldwide, and for non-exclusive distribution of the products in Japan and other selected geographical areas in return for providing foundry support.

1-248 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles QLogic

QLOGIC

QLogic Corporation 3545 Harbor Boulevard Costa Mesa, California 92626 Telephone: (714) 438-2200 Fax: (714) 668-5027

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends March 31

1991 1992 1993 1994 1995 Sales 28 40 52 45 58 Net Income 2 (5) 6 5 4 R&D Expenditures 89953

Employees 130 140

Company Overview and Strategy

QLogic Corporation develops and markets a full line of host and peripheral I/O controller chips and host adapter cards used to connect hard disk drives, optical storage devices, CD-ROMs, and other peripherals to computer systems. In addition, the company develops small computer system interface (SCSI) target and disk controller chips used in peripherals and host computers themselves.

QLogic was originally known as Emulex Micro Devices (EMD), a subsidiary of Emulex Corporation. In 1993, the subsidiary changed its name to QLogic and became a publicly-held company in February of 1994.

To position itself as a major supplier of computer and peripheral controllers, the company is expanding its SCSI technology. QLogic is devoted to providing its customers with products that optimize the transfer and management of data between computer systems and peripheral devices, by developing IC chips, host adapters boards, and software that combine a range of features and technologies.

In 1995, 62 percent of revenues were to foreign customers, primarily in the Pacific Rim region.

Management

H.K Desai President and Chief Executive Officer Thomas R. Anderson Vice President and Chief Financial Officer William Caldwell Vice President, Computer Product Engineering Joseph F. Pleso Vice President, Worldwide Sales David Tovey Vice President, Marketing

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-249 QLogic North American Company Profiles

Products and Processes

QLogic’s semiconductor product families include:

¥ The FAS (Fast Architecture SCSI) Family of fast and wide SCSI controller ICs for host and peripheral applications.

¥ The ESP (Enhanced SCSI Processor) Family of SCSI controller ICs based on the industry standard advanced SCSI core.

¥ The TEC (Triple Embedded Disk Controller) Family of 8-bit and 16-bit wide SCSI HDD controllers.

¥ The ISP (Intelligent SCSI Processor) Family of fast and wide, bus master host adapter ICs for 32-bit interfaces.

QLogic is working with Apple Computer to develop a new version of its high performance Fast!SCSI IQ PCI card for the Power Macintosh platform.

Semiconductor Fabrication Facilities

The company relies on outside vendors for the manufacturing of its semiconductor and circuit board products.

1-250 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Quality Semiconductor

QUALITY SEMICONDUCTOR

Quality Semiconductor, Inc. 851 Martin Avenue Santa Clara, California 95050-2903 Telephone: (408) 450-8000 Fax: (408) 496-0591 Web Site: www.qualitysemi.com

IC Manufacturer

Financial History ($M)

1991 1992 1993 1994 1995 Sales 12 18 27 38 45

Employees 100 160 160 160

Company Overview and Strategy

Quality Semiconductor, Inc. (QSI) was established in 1989 to provide high-performance CMOS logic and specialty memory devices. Quality's strategy is to go after existing areas with higher performance parts, then create new niches that can be developed. The company targets systems manufacturers principally in the networking, personal computer and workstation, and telecommunications industries.

In January 1996, Quality Semiconductor purchased AWA MicroElectronics, Pty. Ltd. (now Quality Semiconductor Australia) from AWA Limited, acquiring AWA’s fab facility, foundry business, and design center in Australia. In the first part of 1996, QSI plans to upgrade the facility in order to migrate to deep-sub- micron process technologies. The new subsidiary will continue to provide foundry services to AWA’s existing foundry customers. AWA Limited will have a share of the new subsidiary and jointly develop new products and technologies with Quality Semiconductor.

Management

Quality Semiconductor Inc. Paul Gupta President and Chief Operating Officer Chun P. Chiu Chief Executive Officer George Anderl Vice President, Sales Kevin Daroca Vice President, Sales Steve Vonderach Chief Financial Officer

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-251 Quality Semiconductor North American Company Profiles

Quality Semiconductor Australia Phil Cavanagh President Andy Brawley Manager, Operations Andrew Greatbach Manager, Marketing Clive Potter Manager, Engineering

Products and Processes

Quality Semiconductor focuses on high-performance products, particularly FCT logic devices, fast FIFOs, clock management devices, and high-speed digital logic switches.

Semiconductor Fabrication Facilities

Quality Semiconductor Australia 8 Australia Avenue Homebush, NSW, 2140 Australia Telephone: (61) 2-763-4105 Fax: (61) 2-746-1501 Cleanroom: 5,000 square-feet Capacity (wafers/week): 1,250 Wafer size: 150mm Processes: CMOS, BiCMOS Products: Logic and memory ICs, ASICs, foundry services Feature sizes: 0.8µm, 1.0µm, 1.2µm, 1.5µm (0.6µm in development)

Key Agreements

¥ Quality will develop new products and technologies through a strategic alliance agreement with AWA Limited.

¥ Quality formed a second-source and product development alliance with Sharp Corporation in April 1995 that covers a variety of specialty memory products for advanced networking, multimedia data communications, and high-performance I/O subsystem applications.

1-252 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles QuickLogic

QUICKLOGIC

QuickLogic Corporation 2933 Bunker Hill Lane Santa Clara, California 95054 Telephone: (408) 987-2000 Fax: (408) 987-2012 Web Site: www.quicklogic.com

Fabless IC Supplier

Financial History ($M)

1994 1995 Sales 7 15

Employees 40 90

Company Overview and Strategy

QuickLogic was founded in 1988 by the inventors of the programmable array logic (PAL) device. Today, the privately-held company designs and sells high density CMOS field programmable gate arrays (FPGAs) featuring high speeds and low power consumption, along with high productivity design software.

QuickLogic’s FPGAs compete with conventional high density programmable local devices and gate arrays in applications such as graphics processing, high-speed memory control, video and image processing, DSP support logic, and data acquisition.

Management

E. Thomas Hart President and Chief Executive Officer John Birkner Vice President, CAE Andrew Chan Vice President, Product Development H.T. Chua Vice President, Technology Development Richard Johnson Vice President, Worldwide Sales Nim Cho Lam Vice President, Engineering Philip Ong Vice President, Operations William Falk Director, CAE Tools Engineering Richard J. Fong Director, Product and Test Engineering Kathryn Gordon Director, Process Development Edward Smith Director, Marketing

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-253 QuickLogic North American Company Profiles

Products and Processes

QuickLogic's programmable ASIC (pASIC) devices are implemented in a submicron CMOS process and deliver high speeds and low power consumption. All of the company's existing devices are offered in both 5V and 3.3V power supply versions. They are based on QuickLogic's proprietary metal layer, amorphous silicon ViaLink¨ antifuse programming element technology that offers high speeds and high densities (up to 20,000 usable gates). QuickLogic also supplies a comprehensive set of CAE development tools, operating on the PC and popular workstation platforms. An open architecture approach allows popular third-party tools to interface to the company's development environment. pASIC 1 FPGA Family—Consists of four parts in densities ranging from 1,000 usable gates to 8,000 usable gates (96 to 768 logic cells) and I/O pin counts ranging from 64 pins to 180 pins. The pASIC 1 devices are based on high-speed, low-power, two-layer-metal 0.65µm CMOS process technology. pASIC 2 FPGA Family—Consists of seven parts in densities ranging from 3,000 usable gates to 20,000 usable gates (192 to 1,440 logic cells) and I/O pin counts ranging from 120 pins to 336 pins. The pASIC 2 devices are based on high-speed, low-power, three-layer-metal 0.65µm CMOS process technology.

During the first half of 1994, QuickLogic shifted its process technology from a 1.0µm CMOS process (125mm wafers) supplied by VLSI Technology to a 0.65µm CMOS process (150mm wafers) supplied by Cypress Semiconductor.

Semiconductor Fabrication Facilities

QuickLogic does not fabricate its own ICs, it has a manufacturing and technology agreement with Cypress Semiconductor. However, QuickLogic does perform all FPGA product testing for both companies.

Key Agreements

¥ QuickLogic has an agreement with Cypress Semiconductor to develop and produce high-performance FPGAs. Cypress has rights to market QuickLogic's current FPGA devices, as well as certain future products and software. In return, QuickLogic has guaranteed wafer production capacity using 0.65µm CMOS technology, eventually leading to 0.35µm technology.

1-254 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Ramtron

RAMTRON

Ramtron International Corporation 1850 Ramtron Drive Colorado Springs, Colorado 80921 Telephone: (719) 481-7000 Fax: (719) 481-9170 Web Site: www.csn.net/ramtron

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 0.1 0.1 4 14 11 Net Income (15) (23) (27) (20) (2) R&D Expenditures 11 15 20 17 12 Capital Expenditures 13 14 14 13 10

Employees 100 129 140 121 88

Company Overview and Strategy

Ramtron was established in 1984 to produce non-volatile memory products by combining the unique characteristics of ferroelectric materials with conventional integrated circuitry. The company was the first to manufacture ferroelectric memory devices. It holds 48 international patents covering its proprietary technologies and products and more than 81 are pending.

Ramtron's principal business focus is directed toward the development of the commercial manufacture of ferroelectric RAMs (FRAMs). The company sites benefits of FRAMs as having fast right times, high write endurance, nonvolatile retention, small form factors, and minimal power consumption. Applications for FRAM devices include consumer electronics, business machines, communications equipment, test instruments, industrial controls, and medical equipment.

Besides ferroelectric RAMs, Ramtron is also involved in the development and sale of very high speed DRAMs the company calls enhanced-DRAMs (EDRAMs), that are based on standard volatile DRAM technology. In 1995, Ramtron spun off its EDRAM business into a wholly owned subsidiary called Enhanced Memory Systems, Inc., which has the sole responsibility of developing EDRAMs.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-255 Ramtron North American Company Profiles

FRAMs 10%

EDRAMs 90%

1995 Sales by Device Type

EDRAMs have been demonstrated to provide SRAM performance with DRAM density in a product that approaches DRAM pricing. A large portion of the company’s EDRAM business is targeted at replacement of fast (≤15ns) SRAMs in high-performance systems. As such, EDRAMs applications include a wide variety of the highest performing systems such as personal computer motherboards, accelerator boards, multiprocessor systems, disk controllers, embedded computer modules, digital signal processing systems, and video graphic systems.

Ramtron's business strategy is to manufacture its own products, to license its products on a contract basis to other companies, and to license its proprietary technologies to a limited number of IC manufacturers in exchange for royalties and access to advanced manufacturing capabilities. The company has forged alliances with IBM, Fujitsu, Hitachi, Rohm, Toshiba, and Nippon Steel Semiconductor.

Management

L. David Sikes Chief Executive Officer Greg B. Jones President and Chief Operating Officer Richard L. Mohr Executive Vice President and Chief Financial Officer Elliot M. Philofsky, Ph.D. Senior Vice President, Technology and Manufacturing Craig Rhodine General Manager, Enhanced Memory Systems, Inc.

Products and Processes

Ramtron first demonstrated a working 256bit FRAM prototype in 1987 and in 1993, began commercial sales of 4K FRAMs. Commercial 16K and prototype 64K devices were introduced in 1994. Production of 256K FRAMs started in the second half of 1995. Ramtron is pursuing the development, through its strategic alliance partners, of new high-density (1M and above) FRAM products. Ramtron's FRAM products are pin compatible with many serial and parallel EEPROMs on the market.

The nonvolatile storage element in Ramtron's FRAMs is a capacitor constructed from two metal electrodes with a thin-film ferroelectric material between the transistor and metallization layers of an industry standard CMOS manufacturing process.

In addition to nonvolatile memories, Ramtron has identified other products in which ferroelectric technology may be integrated, including microcontrollers, programmable logic devices (PLDs), and radio frequency identification devices (RFIDs). Ramtron's joint venture affiliate, Racom ID Systems, Inc., is engaged in the development of ferroelectric RFID chips and systems.

1-256 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Ramtron

Enhanced Memory Systems' enhanced-DRAM (EDRAM) products were developed in cooperation with United Memories Inc. (UMI) and Nippon Steel Semiconductor (then NMB Semiconductor). Colorado Springs-based UMI was formed by Ramtron and NMB in 1988 (see Key Agreements). The EDRAMs are fabricated at Nippon Steel Semiconductor's fab facility in Japan. Enhanced Memory Systems currently sells six EDRAM configurations, all of which are 4M in density.

Semiconductor Fabrication Facilities

Ramtron International Corporation 1850 Ramtron Drive Colorado Springs, Colorado 80921 Cleanroom size: 11,500 square feet Capacity (wafers/week): 1,625 Wafer size: 150mm Process: Ferroelectric CMOS and standard CMOS Products: Specialty memory ICs Feature size: 1.0µm

Ramtron's wafers are also manufactured by Rohm Corp., Nippon Steel Semiconductor (0.6µm process), and IBM (see Key Agreements).

Key Agreements

¥ Ramtron signed a manufacturing agreement with IBM Corporation in May 1995 for EDRAM production. Under the agreement, IBM is serving as a foundry for the production of Enhanced Memory Systems' EDRAMs, and IBM has a non-exclusive license to sell the devices.

¥ Ramtron added Fujitsu to the list of companies with which it maintains joint design and licensing deals for ferroelectric memories. The two firms are developing of a 1M FRAM and working on a feasibility study for 16M FRAMs.

¥ In late 1994, Ramtron signed a cross-licensing deal with ferroelectric memory competitor, Symetrix, also located in Colorado Springs. Both companies are jointly developing a 3-volt 16K FRAM based on Symetrix's Y-1 ferroelectric material technology. In addition, Ramtron's ferroelectric technology is now licensable by Symetrix to its strategic partners, which include Motorola and Matsushita, and Ramtron may license Symetrix's technology to its partners. The deal also called for Ramtron to purchase half of Symetrix for about $6 million.

¥ Ramtron and Rohm signed a joint manufacturing, development, and marketing deal in 1993 giving Rohm access to Ramtron's line of FRAM products. Under the agreement, Rohm is supplying Ramtron with wafers and is selling completed devices in Japan under both logos. In addition, joint development of new ferroelectric-based circuits, including microcontrollers and custom products will take place.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-257 Ramtron North American Company Profiles

¥ A joint program to integrate Ramtron's ferroelectric technology with Hitachi's DRAM manufacturing process was established in 1992. In early 1994, Hitachi indicated it was satisfied with its pilot program of testing and packaging midrange density FRAMs. As a result, Hitachi is working with Ramtron to design and develop 256K, 1M, and 4M FRAMs. Volume production of the 256K FRAM is scheduled for 2H96. Further, Ramtron agreed to license to Hitachi all its non-standard as well as standard FRAM products. Ramtron will rely on Hitachi as a foundry for the devices since its own fab is not capable of the feature sizes required for the larger memories.

¥ Toshiba agreed to jointly develop and second-source Ramtron’s FRAMs in densities of 256K and above.

¥ In 1988, Ramtron and NMB Semiconductor (now Nippon Steel Semiconductor) entered into a product development and license agreement for conventional 1M and 4M DRAMs. Then, in 1990, the two companies established United Memories, Inc. (UMI) to design and develop advanced memory devices (not involving Ramtron's ferroelectric technology) for both companies. In 1995, Ramtron sold all its remaining interest in UMI to Nippon Steel. Now, Nippon Steel manufactures and sell 4M EDRAM products to Enhanced Memory Systems for resale to EMS’s customers.

1-258 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Raytheon Semiconductor

RAYTHEON SEMICONDUCTOR

Raytheon Company Semiconductor Division 350 Ellis Street P.O. Box 7016 Mountain View, California 94039-7016 Telephone: (415) 968-9211 Fax: (415) 968-8556 Web Site: www.raytheon.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Corporate Sales 9,274 9,058 9,201 10,013 11,716 Net Income 592 635 693 759 793

Semiconductor Sales 104 105 110 110 115

Employees 1,700

Company Overview and Strategy

Raytheon Semiconductor is one of the eight divisions of Raytheon Company, an international, multi-industry, technology-based firm that was founded in 1923. Approximately 10 percent to 15 percent of Raytheon Semiconductor's sales are to other Raytheon divisions. Half of its external sales are in commercial markets and the other half are in industrial and military markets.

Raytheon Semiconductor focuses primarily on video and multimedia, ATE and instrumentation, high-speed communications networks, and RF communications applications. In 1992, the company purchased TRW- LSI, a market leader in digital video processing products, as part of a strategy designed to turn its high- performance industrial and military analog and mixed-signal chip strengths into a portfolio that compliments its commercial abilities. Raytheon’s newest IC products include video encoders for MPEG-2 applications, multi-standard encoders for cable or satellite systems, and high-speed D/A converters and low-cost A/D converters.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-259 Raytheon Semiconductor North American Company Profiles

Management

Shi-Chuan Lee President, Raytheon Semiconductor James V. DiLorenzo General Manager, Advanced Device Center Arthur J. Hoage Manager, Manufacturing Services Peter F. Bejarano Director, VLSI Products Scott Keller Director, Linear and Mature Products Les Welborn Director, Worldwide Sales

Products and Processes

Raytheon Semiconductor's products are focused primarily on video/multimedia, ATE and instrumentation, and communications applications. All new products developed are mixed-signal circuits, including A/D and D/A converters, and MPEG-2 and multi-standard encoders. These products are based on bipolar processes ranging in performance from fT = 4GHz to fT = 13GHz and CMOS processes with geometries ranging from 0.5µm to 2.5µm.

Semiconductor Fabrication Facilities

Raytheon Company Raytheon Company Semiconductor Division Semiconductor Division 350 Ellis Street Hartwell Road Mountain View, California 94039 Bedford, Massachusetts 01730 Telephone: (415) 968-9211 Telephone: (617) 274-5000 Cleanroom size: 23,300 square feet Cleanroom size: 12,000 square feet Capacity (wafers/week): 4,600 Capacity (wafers/week): 100 Wafer size: 100mm (3 lines) Wafer size: 100mm Processes: Bipolar, CMOS Processes: NMOS, CMOS, bipolar Products: Linear, logic, and memory ICs, Products: Logic and custom ICs discretes Feature sizes: ≥0.5µm Feature sizes: 1.0µm-5.0µm

Raytheon Company Raytheon Company Missile Systems Division Advanced Device Center 350 Lowell Street 350 Lowell Street West Andover, Massachusetts 01810 West Andover, Massachusetts 01810 Telephone: (508) 475-5000 Telephone: (508) 470-5000 Cleanroom size: 17,000 square feet Cleanroom size: 17,000 square feet Capacity (wafers/week): 875 Capacity (wafers/week): 360 Wafer size: 125mm Wafer sizes: 3in, 100mm Processes: NMOS, CMOS, bipolar, BiCMOS Process: GaAs Products: Logic, custom, and linear ICs Products: MMICs, discretes Feature size: 0.9µm Feature sizes: 0.25µm-0.5µm

1-260 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Raytheon Semiconductor

Key Agreements

¥ Raytheon teamed with New Japan Radio Co. to provide GaAs down converters for the satellite TV market.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-261 Rochester Electronics North American Company Profiles

ROCHESTER ELECTRONICS

Rochester Electronics Inc. 10 Malcolm Hoyt Drive Newburyport, Massachusetts 01950-4018 Telephone: (508) 462-9332 Fax: (508) 462-9512

Fabless IC Supplier

Company Overview and Strategy

Rochester Electronics was established in 1981 to supply discontinued semiconductors. Rochester offers entire discontinued lines, both commercial and military, from manufacturers that reduce support for old parts to rationalize scarce manufacturing and service resources. Increased military cutbacks have also led chip makers to reduce their support for military parts as they shift to more commercial offerings.

Rochester handles discontinued lines from companies such as AMD, National, Texas Instruments, Harris, Intel, AT&T, and Raytheon.

Management

Curt Gerrish President

Products and Processes

Rochester has more than 260 million devices in stock, some over 20 years old. Its product lines include SRAMs, DRAMs, VRAMs, PROMs, logic chips, and linear devices. The company also stocks unfinished wafers and original mask sets.

Semiconductor Fabrication Facilities

Rochester uses more than 30 foundries to manufacture its product lines.

1-262 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Rockwell Semiconductor Systems

ROCKWELL SEMICONDUCTOR SYSTEMS

Rockwell International Corporation Rockwell Semiconductor Systems 4311 Jamboree Road P.O. Box C Newport Beach, California 92658-8902 Telephone: (714) 833-4600 Fax: (714) 833-4078 Web Site: www.nb.rockwell.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends September 30

1991 1992 1993 1994 1995 Corporate Sales 11,927 10,910 10,840 11,123 12,981 Net Income 601 483 562 634 742

Semiconductor Systems Sales 297 333 423 581 760

Employees (Semiconductor Systems) 1,695 4,000

Company Overview and Strategy

Rockwell International Corporation was incorporated in 1928 and is engaged in the research, development, and manufacture of diversified products for the following industries: electronics (industrial automation, avionics, semiconductor systems, and defense electronics), automotive (heavy vehicles and light vehicles), graphics (printing press systems), and aerospace (space systems and aircraft).

Graphic Systems Semiconductor Systems 5% 11% Defense Electronics Aerospace 15% 19% Electronics Automation Automotive 52% Avionics 54% 24% 20%

1995 Corporate Sales by 1995 Electronics Sales by Business Segment Business Segment

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-263 Rockwell Semiconductor Systems North American Company Profiles

Rockwell Semiconductor Systems is the fastest-growing business segment of Rockwell and comprises the Multimedia Communications Division and the Wireless Communications Division. Rockwell’s Semiconductor Systems business offers mixed-signal computing chipsets that form the core of a broad family of personal communications electronics products.

Management

Rockwell International Corporation Donald R. Beall Chief Executive Officer Don H. Davis, Jr. President and Chief Operating Officer

Rockwell Semiconductor Systems Dwight W. Decker, Ph.D. President Armando Geday Vice President and General Manager, Multimedia Communications Division Vijay Parikh Vice President and General Manager, Wireless Communications Division

Products and Processes

Rockwell Semiconductor Systems’ key product lines include facsimile, data, and integrated data/fax/voice modem devices with transmission speeds of up to 28,800 bps, multimedia engines, wireless communications engines for GPS receivers, spread spectrum cordless telephony solutions, and power amplifier devices for cellular phones.

Rockwell introduced the first modem to the worldwide communications market in the early 1950's. To this day, the company continues to be a leader in the data and fax modem markets, with a current worldwide marketshare of about 70 percent.

New technologies developed this year by the Multimedia Communications Division include extensions to the high-speed V.34 product lines, simultaneous voice and data (SVD)—the exchange of voice and data over a single, standard phone line, and the integration of fax, speakerphone, printer, and copier capabilities into multifunctional peripheral engines (MFPE) for the SOHO market.

The Wireless Communications Division addresses the digital cordless telephony (DCT) market, with an integrated circuit component family for 900MHz digital spread spectrum cordless telephones. The division also offers global positioning system (GPS) receiver engines, wireless packet data chipsets, and is developing products and technologies to address the Personal Communications Services (PCS) market.

1-264 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Rockwell Semiconductor Systems

Semiconductor Fabrication Facilities

Rockwell Semiconductor Systems Rockwell Semiconductor Systems Digital Communications Division Microelectronic Technology Center 4311 Jamboree Road 2427 West Hillcrest Drive P.O. Box C Newbury Park, California 91320 Newport Beach, California 92658-8902 Telephone: (805) 375-1256 Capacity (wafers/week): 6,250 Capacity (wafers/week): 400 Wafer sizes: 125mm, 200mm Wafer size: 100mm Process: CMOS Processes: HBT, MESFET GaAs Products: Linear ICs, memories, MPUs, DSPs, Products: ASICs, receivers, power amps, ASICs high-speed digital circuits Feature sizes: 0.5µm-2.0µm Feature sizes: 0.5µm-1.4µm

Rockwell Semiconductor Systems 1575 Garden of the Gods Road Colorado Springs, Colorado 80907-3486 Capacity (wafers/month): 7,500 Wafer size: 200mm Process: CMOS Products: Linear ICs, memories, MPUs, DSPs, ASICs Feature sizes: 0.5µm and below

In August 1995, Rockwell purchased the United Technologies Microelectronics Center (UTMC) wafer fab facility in Colorado Springs, Colorado. The company plans to invest up to $1.2 billion to build a 450,000 square-foot fab facility at this site to produce 7,500 wafers per week, supporting $1.5 billion of Semiconductor Systems’ annual revenue by 1999. Construction of Phase I, which began in March 1996, will include a 65,000 square-foot, Class 1 cleanroom with production expected to begin in July 1997.

In early 1995, Rockwell started production of fax/data modem chipsets on a new $150 million 200mm wafer line that was installed at its fab in Newport Beach. Application-specific DSPs based on the company's new RSP core-processor architecture are expected to consume the majority of the wafer output from the new line.

In early 1994, the company executed an agreement to acquire additional 200mm wafer capacity through a minority equity investment in Chartered Semiconductor Manufacturing, Pte. Ltd., of Singapore. Under the agreement, Rockwell is guaranteed capacity in Chartered’s new $1.3 billion Fab 2 facility in Singapore. The new plant began operations in late 1995.

Key Agreements

¥ In early 1996, Rockwell and SubMicron Technology announced a long-term technology transfer and wafer supply agreement. Rockwell will transfer its 0.5µm and 0.35µm CMOS wafer processes and SubMicron will guarantee Rockwell wafer capacity at its new $1.3 billion, 200mm wafer fab being built near Bangkok, Thailand. SubMicron is scheduled to begin operations in mid-1997.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-265 Rockwell Semiconductor Systems North American Company Profiles

¥ In July 1995, Rockwell signed a five-year foundry agreement with IMP, Inc. for the wafer fabrication of CMOS mixed-signal ICs.

¥ Rockwell signed a licensing agreement with Aerojet Electronic Systems Division to use Aerojet's low- infrared-background radiation-hardened technology in its infrared detectors. The detectors are used as sensing elements in tactical systems such as night-vision devices, man-portable weapons, and smart weapons.

¥ Rockwell is teamed with McCaw Cellular Communications to develop and provide a Cellular Digital Packet Data (CDPD) chipset that enables portable PCs to send digital data over cellular phone networks.

¥ Rockwell is working with Hitachi and Mitsubishi Electric to increase high-speed modem IC production. Rockwell has transferred technology to Hitachi and Mitsubishi who will produce modem ICs and supply them to Rockwell.

1-266 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Ross Technology

ROSS TECHNOLOGY

Ross Technology 5316 Highway 290 West Austin, Texas 78735 Telephone: (512) 349-3108 Fax: (512) 349-3101 Web Site: www.ross.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends March 31

1995 1996 Sales 39 101 Net Income (11) 18 R&D Expenditures 13 16

Employees 75 175

Company Overview and Strategy

Ross Technology is an independent wholly owned subsidiary of Fujitsu Ltd., which acquired the firm from Cypress Semiconductor in mid-1993 for about $22 million. In November 1995, Ross completed its initial public offering, reducing Fujitsu’s share to 61 percent. A minority position in Ross is also held by Sun Microsystems.

Originally established in 1988, Ross is involved in the design, development, and marketing of advanced RISC microprocessors based on the Sparc architecture. Ross' high-end Sparc products complement Fujitsu's existing portfolio of lower-performance Sparc chips. Cypress and Ross agreed to continue a multi- million-dollar development program focused on complex logic-oriented products.

Management

Roger D. Ross President and Chief Executive Officer David Zeleniak Chief Financial Officer Steve Goldstein Vice President, Sales and Marketing

Products and Processes

Ross Technology's current family of RISC microprocessors include the Colorado 2, 3, and 4 hyperSparcª lines. The superscaler, superpipelined hyperSparc processors are based on a 0.4µm triple-level-metal CMOS process and deliver performance of up to 150MHz..

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-267 Ross Technology North American Company Profiles

Semiconductor Fabrication Facilities

The company's devices are manufactured by Fujitsu.

1-268 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles S-MOS Systems

S-MOS SYSTEMS

S-MOS Systems, Inc. 2460 North First Street San Jose, California 95131-1002 Telephone: (408) 922-0200 Fax: (408) 922-0238 Web Site: www.smos.com

Fabless IC Supplier

Financial History ($M)

1991 1992 1993 1994 1995 Sales 125 152 137 135 190

Employees 200 210 210 220 210

Company Overview and Strategy

S-MOS Systems Inc., established in 1983, designs, develops, and markets a full line of very-low-power and low-voltage (2V) advanced CMOS integrated circuits for a variety of market applications including desktop, notebook and palmtop computers, handheld instrumentation, data and telecommunications, and mobile and portable communications devices. The company also provides silicon foundry services through its Japanese affiliate, Seiko Epson Corporation.

Management

Tadakatsu Hayashi President and Chief Executive Officer Tom Endicott Vice President, Sales and Marketing Eiicha Suda Vice President, Product Creation Kai P. Yiu Vice President, Advanced Systems Division Takami Takeuchi Executive Director, Finance

Products and Processes

S-MOS Systems' IC products include memories (SRAMs, mask ROMs, EEPROMs), 3D graphics geometry and rendering processors, VGA-LCD controllers, LCD drivers, 4-bit and 8-bit microcontrollers, semicustom system interface products (SSIPs) for PCI- and PCMCIA-based systems, and products for mobile communications systems. S-MOS also offers contract manufacturing services on 100mm, 125mm, and 150mm wafers with geometries ranging from 1.2µm to 0.6µm.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-269 S-MOS Systems North American Company Profiles

Other products include the CARDIOª line of products, which are full-function, plug-in PCs, reduced to PCMCIA-sized cards.

Semiconductor Fabrication Facilities

Design, engineering, and marketing of S-MOS's products are handled at its San Jose headquarters. Manufacturing is done at Seiko Epson's fabrication facility in Fujimi, Nagano Prefecture, Japan.

1-270 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles S3

S3

S3 Incorporated P.O. Box 58058 2770 San Tomas Expressway Santa Clara, California 95052-8058 Telephone: (408) 980-5400 Fax: (408) 980-5444 Web Site: www.s3.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 3 31 113 140 316 Net Income (5) 4 19 6 35 R&D Expenditures 3 5 12 18 42

Employees 68 141 230 444

Company Overview and Strategy

S3 Incorporated was founded in 1989 with the goal of improving the performance of personal computers by relieving the bottleneck of their graphics subsystems. The company pioneered graphics acceleration in 1991 when it introduced the industry's first single-chip graphics accelerator, significantly improving the performance of PCs. The 16-bit accelerator was followed by 32-bit and 64-bit families in 1992 and 1993, respectively.

As PCs continue to evolve beyond two-dimensional graphics toward a more natural user interface, S3 is leveraging its acceleration expertise to offer 3D graphics and video acceleration solutions for home, desktop, and mobile multimedia computing environments.

Besides 3D graphics and full-motion video, S3 believes that audio, true-color imaging and visualization, real- time communications, and voice and text recognition on the PC, will also require acceleration. To address the acceleration requirements of those applications, S3 formed two new business divisions in 1995, the Home and Advanced System Products division and the Multimedia and Mobile Products division. In addition, the company’s acquisition of Floreat, Inc., a privately-held firm specializing in communications software, will help it to expand into new markets.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-271 S3 North American Company Profiles

Asia/Europe/ROW United States 44% 56%

1995 Sales by Geographic Region

Management

Terry N. Holdt President and Chief Executive Officer Harry L. Dickinson Senior Vice President, Sales George A. Hervey Senior Vice President, Finance, and Chief Financial Officer Jackson K.C. Hu Senior Vice President, Engineering/Operations Gary J. Johnson Senior Vice President, Multimedia and Mobile Products Ronald T. Yara Senior Vice President, Strategic Marketing Paul G. Franklin Vice President, Operations Neal D. Margulis Vice President, Home and Advanced Systems Products Michael P. Nell Vice President, Corporate Marketing Maxwell G. Paley Vice President, Software Products Mark Scheible Vice President, Worldwide Sales

Products and Processes

S3 offers a variety of 32-bit and 64-bit graphics and multimedia accelerator ICs, as well as supporting software drivers. In 1995, the company significantly expanded its product offerings from 2D graphics acceleration to video acceleration, MPEG decoding, audio processing, 3D acceleration, and mobile multimedia acceleration. S3’s IC products are listed below.

¥ Trio32ª 32-bit DRAM-based integrated 2D graphics accelerators for home and desktop PCs. ¥ Trio64ª 64-bit DRAM-based integrated 2D graphics accelerators for home and desktop PCs. ¥ Trio64V+ª 64-bit DRAM-based, digital-video enabled integrated graphics and video accelerators for home and desktop PC applications. ¥ Trio64UV+ª 64-bit UMA (unified memory architecture)-based integrated graphics and video accelerators for home PCs. UMA technology eliminates the need for separate graphics memory in PC systems. ¥ ViRGEª (video and rendering graphics engine)—a 64-bit DRAM-based 2D/3D graphics and video accelerators for home PCs. ¥ ViRGE/VXª 64-bit WRAM-based or VRAM-based 2D/3D graphics and video accelerators for home PCs. ¥ Vision968ª 64-bit VRAM-based multimedia accelerators for desktop PCs. ¥ Aurora64V+ª 64-bit multimedia accelerators for mobile computers. The Aurora64V+ accelerators provide notebook computer users with desktop-equivalent graphics performance and multimedia capability, as well as the industry’s first dual display support. ¥ Scenic/MX1ª (PCI) and Scenic/MX2ª audio/video MPEG-1 decoders for home and desktop PCs. ¥ Sonic/AD™ CD-quality, sigma-delta audio DAC, S3’s first audio product for home and desktop PCs.

1-272 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles S3

Semiconductor Fabrication Facilities

The majority of S3's silicon products are currently manufactured by IBM Microelectronics, Hewlett-Packard, TSMC, and UMC. In 1995, S3 entered into a partnership with UMC and Alliance Semiconductor to establish a new jointly owned wafer foundry company in Taiwan called United Semiconductor Corporation (USC). S3 will hold a 25 percent ownership in the venture, which will begin processing 200mm wafers in 3Q96, and will have the right to purchase up to 31.25 percent of the fab’s output. S3 invested $36 million in USC in 1995 and is committed to invest $52 million in 1996.

United Semiconductor Corporation (Jointly owned by UMC, S3, and Alliance Semiconductor) Science-Based Industrial Park Hsinchu, Taiwan Capacity (wafers/week): 6,250 Wafer size: 200mm Process: CMOS Products: Foundry services Feature sizes: 0.35µm, 0.5µm (Scheduled to begin production in 3Q96)

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-273 Seeq Technology North American Company Profiles

SEEQ TECHNOLOGY

Seeq Technology, Inc. 47200 Bayside Parkway Fremont, California 94538 Telephone: (510) 226-7400 Fax: (510) 657-2837 Web Site: www.seeq.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends September 30

1991 1992 1993 1994 1995 Sales 49 37 33 21 23 Net Income (3) (11) (4) (8) 1 R&D Expenditures 75333

Employees 332 190 161 67 67

Company Overview and Strategy

Seeq Technology was established in 1981 to develop, produce, and market EEPROMs. Over the years the company has undergone a series of transitions that has created a company that is today much different than it was founded to be. Seeq began developing Ethernet products in 1982 and adopted a strategy to have its products manufactured by outside foundries in 1989. As a result of the foundry alliances that were established, the company shut down its wafer fab facility in 1992 and thus became a fabless IC supplier. In early 1994, the company abandoned the market it had itself created by selling its EEPROM business to competitor Atmel Corporation for $10 million. Additionally, the company's Ethernet adapter board product line was discontinued in early 1994.

Seeq now focuses exclusively on local area network (LAN) communication devices and subsystems. These products are targeted at system manufacturers in the personal computer, workstation, printer, networking, and telecommunications markets.

Europe LAN 10% subsystems 17% Asia-Pacific 28% U.S. 62% LAN ICs 83%

1995 Sales by Geographic Region 1995 Sales by Product Type

1-274 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Seeq Technology

Management

Phillip J. Salsbury, Ph.D. President and Chief Executive Officer Stephen Dreyer Vice President, Engineering Walter B. Gebaur Vice President, Manufacturing Barry Gray Vice President, Marketing Robert Hersh Vice President, Finance and Chief Financial Officer Philip A. Ortiz Vice President, Worldwide Sales Albert Schadlick Vice President, Eastern Sales

Products and Processes

Seeq supplies Ethernet datacommunication controllers, Ethernet chipsets, encoder/decoders, coaxial and unshielded twisted pair cable CMOS transceivers, and networking modules. The company also sells media signaling ICs for the high-speed ATM (asynchronous transfer mode) LAN market. Its products are designed using proprietary digital and mixed-signal CMOS process technologies, including submicron (0.8µm and 0.6µm). In 1995, Seeq doubled its product line by introducing ten new products such as controllers, media interface adapters, and transceivers.

Semiconductor Fabrication Facilities

Seeq has established several agreements with wafer-based and ASIC-based foundry suppliers. Its volume wafer processing partners are AMI, Hualon Microelectronics Corporation (HMC), Ricoh, and Rohm. VLSI Technology and Samsung are used for turn-key manufacturing using either a standard cell or a gate array approach.

Key Agreements

¥ In 1995, Seeq re-established its foundry relationship with HMC for the manufacture of its mixed-signal products with an agreement that guarantees foundry services through July 1998. Seeq is also sharing resources with HMC to codevelop new generations of analog circuits for Ethernet data communications products.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-275 Semtech North American Company Profiles

SEMTECH

Semtech Corporation 652 Mitchell Road Newbury Park, California 91320 Telephone: (805) 498-2111 Fax: (805) 498-3804

IC Manufacturer

Financial History ($M), Fiscal Year Ends January 31

1992 1993 1994 1995 1996 Sales 27 20 21 36 62 Net Income 1 0.4 1 2 7 R&D Expenditures 1 1 1 n/a

Employees 340 372 500

Company Overview and Strategy

Semtech Corporation, incorporated in 1960, manufacturers and market a wide variety of semiconductor products focused at both commercial and military applications. Initially, Semtech only supplied semiconductor devices to the military and aerospace industries. However, in 1990, Semtech began its migration into commercial markets with the acquisition of Lambda Electronics. This equipped Semtech with an IC fab facility in Corpus Christi, Texas. In 1992, the company acquired Modupower Inc., a supplier of solid state modules, further moving Semtech into the commercial marketplace. In late 1995, Semtech acquired ECI Semiconductor, an analog semiconductor manufacturer located in Santa Clara, California. From ECI, Semtech gained new process technology, additional wafer fab capacity, and ECI’s foundry customer base.

Today, Semtech’s primary focus is on the personal computer and telecommunications market, though it still maintains a presence in the military and aerospace market. In 1995, military and aerospace revenues accounted for 40 percent of total revenues.

Military and Aerospace 40% Commercial 60%

1995 Sales by End-Use Market

1-276 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Semtech

Management

John D. Poe President and Chief Executive Officer Raymond E. Bregar Executive Vice President, Corporate Operations David G. Franz, Jr. Vice President, Finance, and Chief Financial Officer Arthur E. Fury Vice President, Sales and Marketing

Products and Processes

Semtech offers a wide range of integrated circuits and discrete devices including transient voltage suppressers, linear and switching voltage regulators, DC-to-DC power modules, rectifiers, high voltage monolithic ceramic capacitors, and modular assemblies.

Through its acquisition of ECI Semiconductor, Semtech now offers linear and mixed-signal CMOS arrays, linear bipolar arrays, standard analog circuits, and RF discretes, in addition to offering foundry services.

Semiconductor Fabrication Facilities

Semtech Semtech 121 International Boulevard 652 Mitchell Road Corpus Christi, Texas 78406 Newbury Park, California 91320 Telephone: (512) 289-0403 Telephone: (805) 498-2111 Wafer size: 100mm Products: Discretes Process: Bipolar Products: Linear ICs Feature size: 3.0µm

Semtech (formerly ECI Semiconductor) 975 Comstock Street Santa Clara, California 95054 Capacity (wafers/week): 2,000 Wafer sizes: 100mm, 125mm Processes: CMOS, bipolar Products: ASICs, linear ICs, discretes, foundry services Feature sizes: 3.0µm, 4.0µm, 5.0µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-277 Sensory Circuits North American Company Profiles

SENSORY CIRCUITS

Sensory Circuits, Inc. 1735 North First Street San Jose, California 95112-4511 Telephone: (408) 452-1000 Fax: (408) 452-1025 Web Site: www.sensoryc.com

Fabless IC Supplier

Employees 29

Company Overview and Strategy

Founded in 1994, Sensory Circuits is a privately held company that designs and markets low-cost ICs that perform speech recognition, speaker verification, speech and music synthesis, audio record/playback, and general purpose product control for consumer electronic applications including telecommunications devices, interactive toys, home appliances, personal electronics, and security devices.

Management

Todd Mozer President and Chief Executive Officer David Dick Vice President, Engineering Robert Savoie Vice President, Technology Development Keith Kitami Director, Marketing Jay Zerfoss Director, Finance

Products and Processes

Sensory’s current products include the Interactive Speechª line of integrated circuits (ICs). This family of chips is designed to “bring life to products” through Sensory’s speech and audio technologies. The Interactive Speech single-chip ICs utilize neural network technology to deliver low-cost speech recognition and speaker verification solutions to consumer electronic products.

Other services offered by Sensory Circuits include product specification, vocabulary development for recognition and synthesis, circuit board design, application programming, product design consulting, and custom ICs.

Sensory’s complete product line is produced using a 0.6µm CMOS process technology.

1-278 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Sierra Semiconductor

SIERRA SEMICONDUCTOR

Sierra Semiconductor Corporation 2075 North Capitol Avenue San Jose, California 95132 Telephone: (408) 263-9300 Fax: (408) 263-3337

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 86 92 83 105 189 Net Income 13 12 (13) (9) 1 R&D Expenditures 13 13 15 16 23

Employees 280 322 295 335 480

Company Overview and Strategy

Sierra Semiconductor, founded in 1984, develops and markets high-performance mixed-signal integrated circuits for advanced communications applications. The company uses its strengths in broadband, wireless, data, facsimile, sound, and visual technologies to support the three fundamental segments of the communications market: wide area infrastructure, local area networking, and user interface. In addition, Sierra provides communications software support products for personal computers and wireless communications systems.

In 3Q94, Sierra acquired the remaining 39 percent of PMC-Sierra, Inc. of Burnaby, British Columbia, Canada. PMC-Sierra, now a wholly owned subsidiary of Sierra Semiconductor, supplies broadband transmission and networking chipsets for ATM, Sonet/SDH, and T1/E1 applications. PMC was originally established in 1992 as a spinoff from MPR Teltech Inc., the research arm of the British Columbia phone company.

In 4Q94, Sierra acquired Prometheus Products, Inc., a supplier of voice modems and applications software for both Microsoft Windows and Apple Macintosh platforms. Like PMC-Sierra, the Prometheus subsidiary operates as a separate entity.

International sales accounted for 39 percent of the company’s total revenues in 1995.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-279 Sierra Semiconductor North American Company Profiles

Management

James V. Diller Chief Executive Officer Richard J. Koeltl President and Chief Operating Officer Glenn C. Jones Senior Vice President, Finance and Chief Financial Officer George D. Antenucci Vice President, Human Resources Naresh K. Batra Vice President and General Manager, Multimedia Products Alden J. Chauvin, Jr. Vice President, Worldwide Sales Victor Godbole Vice President, Strategic Planning and System Engineering Raman K. Rao Vice President, Operations Marc E. Robinson Vice President, Technology Development and Quality Robert L. Bailey President and Chief Executive Officer, PMC-Sierra, Inc. John W. Murphy President and Chief Executive Officer, Prometheus Products, Inc.

Products and Processes

Sierra uses what it calls a "Triple Technology" process that uses its competencies in analog, digital, and EEPROM technologies to provide complex IC system solutions.

The company's semiconductor product offerings include WAN and LAN chipsets and subsystems; modem chipsets with data, fax, or integrated data/fax/voice capabilities; audio, voice synthesis, and voice recognition circuits; and graphics and imaging products.

Semiconductor Fabrication Facilities

Sierra Semiconductor is a fabless IC operation, with the majority of its wafers being manufactured by Chartered Semiconductor. In 1987, the company formed Chartered Semiconductor as a fab-and-test joint venture with Singapore Technologies Industrial Corporation Pte. Ltd. Sierra originally held a minority interest in the venture and licensed Chartered Semiconductor to use its manufacturing processes and fab and test technologies. In 1993, Singapore Technologies Ventures Pte. Ltd. purchased all of the shares held by Sierra.

Under an agreement that is good through November 1996, Sierra is obligated to purchase up to 60 percent of its total wafer requirements from Chartered Semiconductor, and Chartered is required to allocate a percentage of its total wafer production capacity to Sierra. The agreement may be extended to November 1999.

Key Agreements

¥ Sierra Semiconductor and MPR Teltech formed a new company in 1993 called Sierra Wireless Inc. to develop and market cellular digital packet data (CDPD) modems and modem subsystems. Sierra Wireless is based in Vancouver, British Columbia, Canada.

1-280 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Signal Processing Technologies

SIGNAL PROCESSING TECHNOLOGIES (SPT)

Signal Processing Technologies, Inc. 4755 Forge Road Colorado Springs, Colorado 80907 Telephone: (719) 528-2300 Fax: (719) 528-2370

Fabless IC Supplier

Employees 80

Company Overview and Strategy

Signal Processing Technologies (SPT) is a supplier of high-performance data conversion and signal conditioning integrated circuits. It was formed in 1983 as a business unit of Honeywell's semiconductor group. SPT was then acquired in 1989 by a group of private investors and an employee team and was established as a separate corporation. In June 1990, the company became a wholly-owned subsidiary of Japan's Toko, Inc., a worldwide supplier of electronic components and integrated circuits.

Management

Ben Takada General Manager Richard Mintle Director, Sales and Marketing Alfi Moscovici Director, Engineering Mike Ruebenson Director, Finance and Administration

Products and Processes

SPT offers a portfolio of products that includes high-speed comparators and A/D and D/A converters. The company's primary focus is on developing proprietary, high-performance signal conditioning, and data conversion products. It has received funding from its parent to develop new analog products such as RF communications and imaging markets.

Semiconductor Fabrication Facilities

Toko acts as the foundry for SPT. In late 1992, SPT purchased a former Digital Equipment Corp. R&D facility, which more than doubled the company's engineering and test area The facility includes a 10,000 square-foot space that SPT may convert into a Class 10 or Class 1 fab in the future.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-281 Silicon Systems North American Company Profiles

SILICON SYSTEMS

Silicon Systems, Incorporated 14351 Myford Road Tustin, California 92680-7022 Telephone: (714) 731-7110 Fax: (714) 731-5457 Web Site: www.ssi1.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends March 31

1991 1992 1993 1994 1995 Sales 182 244 260 300 375

Employees 1,800 2,200 2,200 2,000 2,000

Company Overview and Strategy

Silicon Systems Inc. (SSI) specializes in the marketing, design, and manufacturing of standard and custom mixed-signal ICs (MSICs), primarily for use in storage products and communications equipment. The firm was founded in 1972 and initially offered only design services. In the mid-70's, it began subcontracting out its fab for the production of other companies' devices. In 1982, the firm began manufacturing its own ICs. In 1989, Silicon Systems was acquired by TDK Corp., a $4.4 billion Japanese producer of ferrite and magnetic recording products.

Today, Silicon Systems offers MSICs to a growing worldwide customer base. It has largely tied its fortunes to the disk drive industry, designing and selling ICs aimed at applications in that market. SSI is considered to hold the largest marketshare of the mixed-signal disk-drive IC market. To a lesser extent, Silicon Systems focuses on applications in the telecommunications market.

Tele- communications 25%

Disk Drives 75%

1995 Sales by End-Use Market (est)

1-282 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Silicon Systems

Management

Yutaka Mori President and Chief Executive Officer Rick Goerner Executive Vice President and Chief Operating Officer William E. Bendush Senior Vice President, Finance and Chief Financial Officer Donald Crim Senior Vice President, Wafer Fab and Technology Martin H. Jurick Senior Vice President, Corporate Planning Jim Peterson Senior Vice President, Worldwide Sales Yoshihito Yamamoto Vice President, Corporate Planning

Products and Processes

Silicon Systems offers a line of custom and standard ICs in bipolar, CMOS, and BiCMOS technologies. It focuses on ICs that combine analog and digital circuitry.

SSI is organized into two business units, the Storage Products Division and the Communications Products Division. The Storage Products Division consists of read/write preamps, read channel ICs, disk controllers, flash controller ICs, and servo controller products. The Communications Products Division consists of wirelined and wireless modulation, digital transmission, and networking products.

Semiconductor Fabrication Facilities

Silicon Systems closed its 100mm wafer fabrication facility in Tustin, California, in May 1995. The company had been trying to sell the plant since 1993. Silicon Systems is debating whether to break ground for a new 200mm wafer fab or partner with another company.

Silicon Systems 2300 Delaware Avenue Santa Cruz, California 95060 Cleanroom size: 52,000 square feet Capacity (wafers/week): 1,500 Wafer size: 150mm Processes: Bipolar, CMOS, BiCMOS Products: Mixed-signal ICs Feature sizes: 1.0µm, 1.5µm, 3.0µm

Key Agreements

¥ Silicon Systems has an agreement with Philips for hard-disk drive ICs and bipolar process technology. As part of an extension of the agreement, Silicon Systems is licensed to use Philips' BiCMOS process technology and Philips has access to Silicon Systems' foundry services.

¥ Silicon Systems has a pact with Oki Electric under which the Japanese company is supplying Silicon Systems with 1.2µm and 1.5µm foundry services.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-283 Siliconix North American Company Profiles

SILICONIX

Siliconix Incorporated (Member of TEMIC Semiconductors) 2201 Laurelwood Road Santa Clara, California 95056-0951 Telephone: (408) 988-8000 Fax: (408) 970-3950

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 140 155 171 197 250 IC Sales 50 43 36 34 64 Discrete Sales 90 112 135 163 186 Net Income 0 5 7 11 24 R&D Expenditures 9 8 13 16 19 Capital Expenditures 7 13 18 25 28

Employees 1,247 1,202 1,211 1,172 1,269

Company Overview and Strategy

Founded in 1962, Siliconix designs, manufactures, and markets ICs and discrete components for switching, motor control, and power management in computers, automotive, instrumentation, and telecommunications applications. AEG Capital Corporation became a majority shareholder of the company in December 1990, increasing its ownership from 38.3 percent to 80.1 percent of the company's outstanding stock. In July 1992, Siliconix was joined with Telefunken Semiconductors, Matra MHS, and Dialog Semiconductor to form the semiconductor division of TEMIC, the microelectronics group of Daimler-Benz AG, a German automotive, electronics, and aerospace conglomerate.

Consumer Automotive 3%

4% Japan Hi-Rel Computer Data 13% 9% 21% Storage North America 11% Asia Pacific 37% Industrial 24% Instrumentation 20% 14% Europe Communications 26% 18%

1995 Sales by End-Use Market 1995 Sales by Geographic Region

1-284 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Siliconix

Management

Richard J. Kulle President and Chief Executive Officer King Owyang Executive Vice President, Technology and Silicon Operations Jürgen F. Biehn Vice President and Chief Financial Officer Michael Gingrass Vice President, Environmental and Plant Services Rod Graham Vice President, Worldwide Sales G. Thomas Simmons Vice President, Marketing

Products and Processes

Siliconix's power transistors and integrated circuits are mainly used for power management and motion control in computers, hard disk drives, automobiles, and communications systems. The company's analog switches, analog multiplexers, and low-power transistors are used to sense, switch, and route signals in video, multimedia, instrumentation, and test equipment in both industrial and hi-rel environments. In 1995, sales of power MOSFETs and power ICs accounted for about 70 percent of total sales.

Analog Switch and Low-Power Discrete 30% Power MOSFET and Power IC 70%

1995 Sales by Product Type

Siliconix provides products and technologies that directly answer the market's demand for smaller, more efficient, and more cost-effective components. The company's Lite Footª discrete power transistors are the industry's most compact solution for motion control in hard disk drives and for load management in portable computers. These miniaturized products can be mounted directly on the printed circuit board, and they are the first such power devices small enough to fit in a PCMCIA card. The company's Little Foot¨ line has been designed into telecom systems, automotive air bag triggers, and numerous other applications where space- savings and efficiency are at a premium.

Siliconix's power integrated circuits combine the functions of two or more discrete transistors on one chip. A family of high-frequency switchmode regulator and controller ICs designed for use with Lite Foot or Little Foot discretes offers the optimal level of integration for DC-to-DC conversion in battery-operated equipment, including laptop and notebook computers. For data storage customers the company offers highly integrated chips for voice coil and spindle motor control. Other IC products include power interface devices for computers equipped with dual battery packs or PCMCIA slots, power ICs for bus control in automobiles, and analog switches and multiplexers for use in signal switching and routing in electronic instruments and industrial equipment.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-285 Siliconix North American Company Profiles

Siliconix utilizes CMOS, DMOS, BiCMOS, and BiC/DMOS (BCDMOS) technologies in the manufacture of its IC and discrete products. The company's power ICs are manufactured using its proprietary self-isolated BCDMOS technologies, which include the BCD15 process for producing power ICs operating from 2.5V to 15V and the BCD60 process for producing power ICs operating up to 60V.

Semiconductor Fabrication Facilities

Siliconix Incorporated Siliconix Incorporated 2201 Laurelwood Road 2201 Laurelwood Road Santa Clara, California 95056 Santa Clara, California 95056 Fab 2 Fab 3 Capacity (wafers/week): 2,000 Capacity (wafers/week): 1,500 Wafer sizes: 100mm Wafer sizes: 150mm Processes: CMOS, DMOS, BiCMOS, BCDMOS Processes: CMOS, DMOS, BiCMOS, BCDMOS Products: Linear and power ICs, discretes Products: Power ICs and discretes Feature sizes: 3.0µm Feature sizes: 0.8µm-1.5µm

Siliconix also uses a foundry in Taiwan for the production of some of its cost-sensitive analog switch and low- power discrete product lines.

High-volume assembly and product testing is handled at the company's facilities in Kaohsiung, Taiwan, a joint venture in Shanghai, China, called Simconix, and at subcontractors in the Philippines, Italy, and India. A limited amount of assembly and product test is performed in Santa Clara.

1-286 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Simtek

SIMTEK

Simtek Corporation 1465 Kelly Johnson Boulevard Colorado Springs, Colorado 80920 Telephone: (719) 531-9444 Fax: (719) 531-9481 Web Site: www.csn.net/simtek

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 1 0.5 3 1 3 Net Income (6) (6) (6) (4) (2) R&D Expenditures 43222

Employees 25 32 25 17

Company Overview and Strategy

Simtek Corporation has designed, developed, and marketed nonvolatile semiconductor memory products since it commenced business operations in 1987. Its concentration has been on the design and development of fast nvSRAMs (nonvolatile SRAMs) and associated products and technologies.

Simtek's products are aimed at avionics subsystems, portable computers and instruments, medical instrumentation, navigation aids, robotics, telecommunications systems, and other high performance applications.

Pacific-Rim 17%

North America Europe 53% 30%

1995 Sales by Geographic Region

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-287 Simtek North American Company Profiles

Management

Sheldon A. Taylor President and Chief Executive Officer Sheldon A. Taylor (acting) Chief Financial Officer Jack Maxcy Vice President, Production Albert S. Weiner Vice President, Engineering

Products and Processes

Simtek's nvSRAM product family includes 4K, 16K, 64K, and 256K devices with access speeds ranging from 25ns to 45ns. The nvSRAMs utilize a unique patented memory cell technology called Novcel, which integrates fast SRAM and EEPROM elements in each cell. In late 1993, Simtek introduced its AutoStoreª nvSRAMs, which automatically detect power loss and transfer data from SRAM into EEPROM.

Simtek uses an advanced implementation of silicon-nitride-oxide-semiconductor (SNOS) technology in the design of its products. The company's Novcel technology is compatible with basic CMOS technology, allowing nvSRAM memory cells to be incorporated with other system level semiconductor products. Currently, Simtek is migrating its process technology to a 0.8µm level from a 1.2µm level.

Semiconductor Fabrication Facilities

Simtek has a foundry agreement with Chartered Semiconductor Manufacturing (CSM) of Singapore for the manufacture of its wafers.

Key Agreements

¥ Simtek signed an agreement with Zentrum Mikroelektronik Dresden (ZMD) in mid-1994 to install its 1.2µm process in ZMD's fab in Germany and to jointly develop 0.8µm process technology. The agreement was later modified to bypass the installation of 1.2µm technology and instead install 0.8µm technology. ZMD also received a license to sell Simtek's 64K and 256K nvSRAMs built in the 0.8µm process.

In 1995, the two companies expanded their relationship to include the joint development of additional nvSRAMs using the 0.8µm process. ZMD will finance the development in exchange for the right to convert its investment into additional shares in Simtek. If the option is taken, ZMD, who is already the largest shareholder of Simtek, will own approximately 25 percent.

¥ Simtek entered into a manufacturing and development agreement with Chartered Semiconductor Manufacturing (CSM) in 1992 for 64K through 1M nvSRAMs. CSM will provide Simtek with wafers at least through 3Q97.

¥ Simtek established an agreement in 1989 with GEC Plessey Semiconductors under which GEC Plessey has the right to incorporate Simtek's non-volatile memory technology into its ASICs. In 1990, the agreement was extended to grant GEC Plessey a worldwide license to manufacture and market Simtek's nvSRAM devices.

1-288 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Single Chip Systems

SINGLE CHIP SYSTEMS

Single Chip Systems Corporation (formerly Instant Circuit Holdings Inc.) 16885 West Bernardo Drive Suite 295 San Diego, California 92127 Telephone: (619) 485-9196 Fax: (619) 485-0561

Fabless IC Supplier

Company Overview and Strategy

Single Chip Systems (formerly Instant Circuit Holdings Inc.) was established in 1986 to design electrically programmable integrated circuits that employ patented antifuse technology. Specifically, Single Chip Systems is developing IC products for the field programmable gate array (FPGA) market. Since its inception, the company has developed products primarily through cross licensing agreements. This strategy has enabled Single Chip Systems to minimize its expenses in developing its products. The company has not yet sold ICs of its own, but has produced test wafers.

Management

Bruce B. Roesner, Ph.D. President and Chief Executive Officer Gregory A. Bohdan Vice President and Chief Financial Officer

Products and Processes

The company's first product is an FPGA (jointly developed with cross license) that offers a significant increase in operating and programming speed and improvements in chip size and manufacturing cost.

Semiconductor Fabrication Facilities

Single Chip Systems' products will be manufactured largely at the fabs of its cross licensees, but also at independent foundries.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-289 Sipex North American Company Profiles

SIPEX

Sipex Corporation 22 Linnell Circle Billerica, Massachusetts 01821 Telephone: (508) 667-8700 Fax: (508) 667-8310

IC Manufacturer

Company Overview and Strategy

Sipex Corporation was formed as a result of the merging of four companies: Hybrid Systems Corp., DataLinear Corp., Dielectric Semiconductor Inc., and Barvon Technology, Inc. The first two corporations merged in 1986, Dielectric Semiconductor joined in 1987, and Barvon Technology in 1988.

The company serves the analog signal processing market. It produces interface, ASIC, low voltage, signal conditioning, signal conversion, and data acquisition system products using both hybrid and monolithic technology.

Management

Jim E. Donegan Chairman and Chief Executive Officer Frank R. Dipietro Chief Financial Officer, and Senior Vice President Sanford Cohen Senior Vice President, Technology Neal Lambert Senior Vice President, Manufacturing

Products and Processes

Sipex offers both standard and custom products. The standard products include interface (line driver/receivers), data conversion, and other linear products while the custom products include ASICs, full custom monolithics, and custom hybrids. The company also provides dielectrically isolated silicon substrates to a broad spectrum of semiconductor manufacturers.

Sipex has foundry capabilities for producing 3.0µm to 5.0µm dielectrically isolated complementary bipolar and CMOS linear devices, and has foundry relationships for producing 1.2µm to 4.0µm BiCMOS linear devices.

1-290 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Sipex

Semiconductor Fabrication Facilities

Sipex Corporation Sipex Corporation 22 Linnell Circle 491 Fairview Way Billerica, Massachusetts 01821 Milpitas, California 95035 Telephone: (508) 667-8700 Telephone: (408) 945-9080 Capacity (wafers/week): 1,000 Capacity (wafers/week): 400 Wafer sizes: 100mm, 150mm Wafer size: 100mm Processes: CMOS, BiCMOS Processes: BiCMOS, Bipolar Products: Linear ICs, ASICs, interface ICs, Products: Linear ICs, ASICs data converters Feature sizes: 2.0µm-4.0µm Feature sizes: 1.2µm-4.0µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-291 Space Electronics North American Company Profiles

SPACE ELECTRONICS (SEI)

Space Electronics, Inc. 4031 Sorrento Valley Boulevard San Diego, California 92121-1404 Telephone: (619) 452-4167 Fax: (619) 452-5499 Web Site: www.newspace.com/spaceelec

Fabless IC Supplier

Financial History ($M)

1995 Sales 4

Company Overview and Strategy

Space Electronics, Inc. (SEI) was established in 1992 as a spin-off of Science Applications International Corporation (SAIC) Microelectronics Technology Center. The focus of Space Electronics is to address the niche market of spacecraft microcircuits.

Management

Robert Czajkowski Chief Executive Officer Paul Blevins Chief Financial Officer David J. Strobel Chief Operating Officer David Czajkowski Manager, Space Products Len Drogo Manager, Operations Edward Li Manager, Sales and Marketing Chris Wentworth Manager, Production

Products and Processes

Space Electronics' products and services include Rad-Pakª radiation-hardened microelectronic devices for the worldwide satellite industry in both defense and commercial applications, MicroMagª non-cryogenic magnetic sensing devices based on a magneto-resistive sensor developed and patented by Kodak, and test lab services.

1-292 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Standard Microsystems

STANDARD MICROSYSTEMS (SMC)

Standard Microsystems Corporation Component Products Division 80 Arkay Drive Hauppauge, New York 11788-9725 Telephone: (516) 435-6000 Fax: (516) 271-6004 Web Site: www.smc.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends February 28

1992 1993 1994 1995 1996 Corporate Sales 133 251 323 379 342 Net Income 1 16 20 24 12

Semiconductor Sales 35 25 57 117 150

Company Overview and Strategy

Standard Microsystems Corporation (SMC) is comprised of two complementary business divisions: Component Products and System Products. The System Products Division designs, produces, and markets hardware and software products for the PC local area network (LAN) market. The Component Products Division develops, manufactures, and markets VLSI microperipheral circuits. Its products are sold chiefly in the PC market for input/output and network control applications, and in industrial and transportation markets for network control applications.

SMC was strictly a chip manufacturer when it was founded in 1971. Then, in the early 1980's, the System Products Division was created and in 1991, Western Digital's LAN Products Division was acquired. The company's networking business grew to represent as much as 90 percent of total revenues (fiscal 1993). However, demand for the Component Products Division’s products has been very strong over the past couple of years, boosting its share of total revenues to 44 percent in fiscal 1996.

To further its advancement into the chipset market, the Component Products Division announced the acquisition of EFAR Microsystems, Inc. (EFAR) in early 1996. Technologies obtained from the acquisition include the UltraCoreª PCI PC systems logic chipset for 64-bit microprocessors and the UltraCacheª PCI core logic chipset with integrated cache memory. The UltraCore was developed in cooperation with Mosys Inc. EFAR will operate as a separate business unit called the Personal Computer Systems Logic Business Unit within the Component Products Division of SMC.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-293 Standard Microsystems North American Company Profiles

Management

Standard Microsystems Corporation Paul Richman Chief Executive Officer Arthur Sidorsky Executive Vice President, Component Products Division Anthony M. D’Agostino Senior Vice President and Chief Financial Officer Walter J. Kmeta Senior Vice President, Wafer Fab Operations Lance Murrah Senior Vice President and General Manager, System Products Division Reginald R. Maton, Jr. Vice President and Chief Information Officer

SMC’s Component Products Division John E. Burgess Vice President, Sales Douglas L. Finke Vice President, Marketing Lawrence H. Goldstein Vice President, Engineering Peter Ju Vice President, Personal Computer Systems Logic Business Unit Di Ma Vice President, Foundry Operations William A. Rotoli Vice President, Sales

Products and Processes

SMC's IC product offering includes the following:

¥ Personal computer I/O devices that perform many of the basic input/output functions required in every PC, including floppy disk control, IDE hard disk interface, parallel port control, and serial port control. Included is a family of Super I/O devices that integrate all of the above functions on a single IC. The Super I/O family includes some other new products such as a single-chip PCI to IDE hard disk interface.

¥ Highly integrated single-chip Ethernet products such as an IC that incorporates an encoder/decoder, 10Base-T transceiver, AT bus interface, and memory management unit (MMU) on a single chip.

¥ ARCNET LAN devices for use in PCs and in industrial networking environments.

¥ Foundry services for customers desiring wafer fabrication capacity for 1.6µm geometries and above or for specialized semiconductor processing requirements that require unique thin film expertise.

Semiconductor Fabrication Facilities

SMC utilizes a mix of internal and external wafer fabrication sources to manufacture its products. Its more mature products are produced at its fab in New York, while newer products, utilizing 1.0µm and 0.8µm technologies are produced by external wafer foundries in the U.S., Europe, and Asia. SMC’s core-logic products (acquired with EFAR) will initially be built by TSMC in Taiwan.

In 1995, SMC made a $12 million investment in Lucent Technologies’ (formerly AT&T Microelectronics) Madrid fab and a $20 million investment in Chartered Semiconductor to enhance its external wafer supply (see Key Agreements).

1-294 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Standard Microsystems

Standard Microsystems Corporation Component Products Division 35 Marcus Boulevard Hauppauge, New York 11788 Capacity (wafers/week): 1,500 Wafer size: 100mm Processes: CMOS, MOS Products: LAN ICs, disk controllers, discretes, foundry services Feature sizes: 1.6µm-3.0µm

Key Agreements

¥ In 1995, SMC made a $20 million investment in Singapore-based foundry Chartered Semiconductor Manufacturing (CSM) in return for guaranteed capacity from CSM's new 200mm wafer fab that came on- line in 2H95.

¥ SMC struck a foundry deal with Lucent Technologies in 1994 under which SMC agreed to boost the capacity of Lucent's fab facility in Madrid, Spain, in return for a guaranteed portion of the fab output over a five-year period. The new equipment has the capability to produce devices with 0.9µm to 0.45µm feature sizes. SMC was supposed to receive its first wafers in 2Q96.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-295 Supertex North American Company Profiles

SUPERTEX

Supertex, Inc. 1350 Bordeaux Drive Sunnyvale, California 94089 Telephone: (408) 744-0100 Fax: (408) 734-5247 Web Site: www.supertex.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 26 24 26 32 43 Net Income 32357 R&D Expenditures 44446 Capital Expenditures 1112n/a

Employees 270 240 235 265 300

Company Overview and Strategy

Established in 1976, Supertex is a niche-oriented company that designs, develops, manufactures, and markets high voltage semiconductor products utilizing advanced DMOS and HVCMOS process technologies. Supertex merged CMOS and DMOS processes creating its proprietary HVCMOS¨ technology. The company originally conducted business as a foundry. However, starting in fiscal 1990, and through fiscal 1992, the company's foundry business was phased out as sales of proprietary products steadily increased.

Supertex's proprietary products are sold to electronic equipment manufacturers in the computer, telecommunications, instrumentation, defense, medical, and consumer products industries. More specifically, Supertex's products are targeted for applications in ultrasound imaging and medical electronics, flat panel displays, non-impact printers and plotters, telecommunications, and high-reliability military and commercial aerospace systems.

Europe and United States Far East 50% 50%

1995 Sales by Geographic Region

1-296 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Supertex

Management

Henry C. Pao, Ph.D. President and Chief Executive Officer Richard E. Siegel Executive Vice President Benedict C.K. Choy Senior Vice President, Technology Development and IC Products Michael V. Bond Vice President, DMOS Products Edward MacKenna Vice President, DMOS Process Engineering

Products and Processes

Supertex has developed advanced technologies using CMOS and DMOS (Double-diffused MOS) processes. It pioneered the merging of CMOS and DMOS processes into its proprietary HVCMOS¨ (high-voltage CMOS) technology. This process allows for the combination of the high speed and low power logic circuit of CMOS and the high voltage output drive of DMOS on the same chip, thus creating the high voltage IC, or HVIC. Supertex intends to maintain a leadership position in the HVIC segment of the semiconductor industry.

Supertex's DMOS product line includes depletion-mode and low-threshold enhancement-mode transistors and arrays. Its CMOS products encompass a range of offerings from microprocessor supervisory ICs to encoder/decoder and smoke detector chips. There are three distinct categories of HVIC products available, digital products, analog products, and BiCMOS products. The digital product family includes driver/interface ICs for flat panel displays and non-impact printers and plotters. The analog product family includes high voltage analog switches and multiplexers, which are used in the medical ultrasound imaging industry, and pulse width modulators (PWMs). Lastly, the company's BiCMOS product family consists of DC/DC converters and power supply ICs.

Semiconductor Fabrication Facilities

Supertex, Inc. 1235 Bordeaux Drive Sunnyvale, California 94088-3607 Cleanroom size: 13,000 square feet Capacity (wafers/week): 1500 Wafer size: 100mm Processes: CMOS, DMOS, HVCMOS, BiCMOS Products: High-voltage ICs, discretes Feature size: 3.0µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-297 Supertex North American Company Profiles

Key Agreements

¥ Supertex made an agreement with Texas Instruments in 1991 that provided TI the rights to use Supertex's HVCMOS process technologies in return for license fees and royalties, as well as access to TI's foundry and assembly services.

¥ Supertex has received funding from the U.S. Government's ARPA agency to research and develop dielectric-isolation (DI) technology. The goal of the project is to further raise the voltage and operating speed of ICs.

1-298 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Symbios Logic

SYMBIOS LOGIC

Symbios Logic Inc. (Formerly AT&T Global Information Solutions NCR Microelectronic Products Division) 2001 Danfield Court Fort Collins, Colorado 80525-2998 Telephone: (970) 226-9576 Fax: (970) 226-9626 Web Site: www.symbios.com

IC Manufacturer

Financial History ($M)

1991 1992 1993 1994 1995 Sales 145 228 274 354 520

Employees 1,950 2,010 2,499

Company Overview and Strategy

Symbios Logic was established in February 1995 when Hyundai completed the purchase of the NCR Microelectronic Products Division from AT&T Global Information Solutions Co., a wholly owned subsidiary of AT&T Corporation. NCR Microelectronic Products Division was originally established in 1972 and was acquired along with NCR Corporation by AT&T Corporation in 1991 (NCR Corporation was later named AT&T Global Information Solutions and then recently, back to NCR Corporation). Hyundai renamed the division Symbios Logic, Symbios being a derivative from the word symbiosis, meaning a mutually beneficial relationship.

Symbios Logic, now a wholly owned, independently operated subsidiary of Hyundai Electronics America, manufactures semicustom ICs including cell-based ASICs and gate arrays, as well as a family of application- specific standard products (ASSPs). Its cell library includes extensive analog functions for cell-based mixed- signal ASICs and complex standard function macrocells (cores) for embedded SCSI, Ethernet, disk drive electronics, and serial communications. Symbios Logic is a leader in bus interface technology, offering high- performance application-specific SCSI (including an extensive family of PCI-SCSI I/O controllers), Ethernet parts, and RAID subsystems and controllers. In 4Q95, the company added a line of SCSI Host Adapter Boards and introduced a Fibre Channel Raid controller board.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-299 Symbios Logic North American Company Profiles

Management

H. Gene Patterson President and Chief Executive Officer C.S. Chung Vice President, Global Planning and Coordination, and Chief Financial Officer Jeff Dumas Vice President, General Counsel, and Secretary Dan Ellsworth Vice President, Technology Glenn Gainley Vice President, Business Units Tom Lagatta Vice President, World Sales Al Lofthus Vice President, Marketing Tim McCarthy Vice President, Manufacturing Tony Walters Director, Quality

Products and Processes

Symbios Logic is comprised of five business groups: Client/Server, OEM RAID, MetaStor, Drive Electronics, and ASIC Solutions. Listed below are the major products of each business group.

Client/Server Products ¥ Client and server I/O products including SCSI devices ¥ Communications products including LAN communications devices ¥ SCSI Host Adapter Boards

OEM RAID ¥ RAID-related products including RAID/disk array controller boards, I/O adapter boards, and OEM storage subsystems

MetaStor ¥ Storage related products including RAID/disk array subsystems and tape arrays

Drive Electronics ¥ Disk and tape drive electronic products and CD-ROM products

ASIC Solutions ¥ ASIC products include CMOS cell-based ASICs, both digital and mixed-signal, CMOS gate arrays, and complex core-related products

1-300 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Symbios Logic

Semiconductor Fabrication Facilities

Symbios Logic Inc. Symbios Logic Inc. 2001 Danfield Court 1635 Aeroplaza Drive Fort Collins, Colorado 80525 Colorado Springs, Colorado 80916 Telephone: (970) 223-5100 Telephone: (719) 596-5795 Capacity (wafers/week): 4,300 Capacity (wafers/week): 5,000 Wafer size: 150mm Wafer size: 200mm Process: CMOS Process: CMOS Products: ASICs, ASSPs, foundry services Products: ASICs, ASSPs Feature sizes: 0.7µm-2.0µm Feature sizes: 0.5µm-2.0µm

Symbios expects that approximately 20 percent of its products will be manufactured by Hyundai.

Key Agreements

¥ Symbios Logic Inc. announced an alliance with Hyundai Electronics Industries (HEI) and Compass Design Automation in the release of a new deep sub-micron 0.35µm five-layer metal CMOS technology.

¥ In 1995, Symbios licensed Advanced RISC Machines Ltd.’s “Thumb” 32-bit RISC processor core for use in I/O channel controllers and other intelligent peripheral products.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-301 Synergy Semiconductor North American Company Profiles

SYNERGY SEMICONDUCTOR

Synergy Semiconductor Corporation 3450 Central Expressway Santa Clara, California 95051 Telephone: (408) 730-1313 Fax: (408) 737-0831 Web Site: www.synergysemi.com

IC Manufacturer

Financial History ($M)

1993 1994 1995 Sales 14 19 26

Employees 110 175

Company Overview and Strategy

Founded in 1987, Synergy Semiconductor Corporation designs, develops, manufactures, and markets high- performance digital and mixed-signal integrated circuits using bipolar and BiCMOS processes. Synergy’s products include precision time-clock generators for computers and workstations, and communications circuits for local and wide area networks. Synergy’s products employ proprietary design and process technology, resulting in high-performance ICs. The company’s products are designed by an internal design team, and built in the company’s in-house wafer fabrication facility.

Management

Thomas D. Mino President and Chief Executive Officer T. Olin Nichols Chief Financial Officer George W. Brown Vice President, New Business Development Tom Lauer Vice President, Sales Larry J. Pollock Vice President, Research and Development Luke Smith Vice President, Operations E. Marshall Wilder Vice President, Quality and Administration Thomas S. Wong Vice President, Engineering

Products and Processes

Synergy supplies high-speed ICs to a range of systems vendors of public network equipment, such as multiplexers and digital access cross-connect systems (DACS); LAN and WAN private network equipment, such as adapter cards and hubs; high-performance workstations and superservers; and automatic test equipment (ATE).

1-302 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Synergy Semiconductor

Synergy’s products encompass three families: the ECLinPS and Super300K family of ultra-high-speed ECL logic products, the ClockWorks family of clock generation and distributions devices, and the SuperCOM family of optical fiber transceivers, copper wire transceivers, and clock recovery devices. Synergy recently introduced a family of network and communication products for Fast Ethernet, FDDI, ATM, SONET, and SDH applications utilizing its proprietary bipolar ASSETª (All Spacer Separated Element Transistor) technology.

Semiconductor Fabrication Facilities

Synergy Semiconductor System Microelectronic Innovation GmbH (SMI) 3450 Central Expressway Wildbahn, Markendorf Santa Clara, California 95051 O-15203 Frankfurt (Oder), Germany Telephone: (408) 730-1313 Telephone: (49) 335-46-2200 Cleanroom size: 7,000 square feet Capacity (wafers/week): 2,400 (10,500 max.) Capacity (wafers/week): 500 Wafer size: 100mm Wafer size: 100mm Processes: Bipolar, BiCMOS Processes: Bipolar, BiCMOS Products: Logic, memory, and linear ICs, ASICs Products: Transceivers, SRAMs, logic products, Feature sizes: ≥1.2µm clock control circuits, FIFOs, translators (Joint venture between Synergy and the German Feature sizes: 1.2µm, 1.5µm (bipolar); government. Synergy holds a 49 percent stake.) 1.0µm (BiCMOS); submicron in development

Wafer probing and packaged product test capabilities are performed in-house.

Key Agreements

¥ In April 1995, Synergy entered into a technology license agreement with Linear Technology Corporation. Under the agreement, Synergy gave LTC the right to use the its bipolar ASSET technology to develop non-competitive products.

¥ In March of 1993, Synergy entered into a agreement with the German government to form System Microelectronic Innovation (SMI). This is a joint venture which is currently 49 percent owned by Synergy and 51 percent owned by the German government. As part of this agreement, Synergy transferred its ASSET technology to SMI, enabling it to produce Synergy's family of ECL SRAMs, logic, clock control circuits, translators, and semicustom products and market them throughout Europe.

¥ Synergy entered into a comprehensive strategic alliance with Toshiba Corporation in November 1990. The alliance covers foundry, joint R&D and manufacturing, technology licensing, and an equity investment in Synergy by Toshiba. Under terms of the manufacturing agreement, Toshiba is providing Synergy with the use of a high-volume (150mm, submicron) IC fabrication line, which is running Synergy's high-performance ASSET and BiCMOS technologies. This fab allows Synergy to produce its current SRAM and logic products, as well as future products.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-303 TelCom Semiconductor North American Company Profiles

TEL COM SEMICONDUCTOR

TelCom Semiconductor, Inc. 1300 Terra Bella Avenue P.O. Box 7267 Mountain View, California 94039-7267 Telephone: (415) 968-9241 Fax: (415) 967-1590

IC Manufacturer

Financial History ($M)

1994 1995 Sales 25 39

Employees 125 236

Company Overview and Strategy

TelCom Semiconductor emerged in December 1993 as a result of a management-led buy-out of Teledyne Industries' Teledyne Components division. The operation's history stretches back to 1960 when Teledyne Industries began Amelco Semiconductor, one of Silicon Valley's first semiconductor firms. In 1970, Amelco merged with Continental Devices to form Teledyne Semiconductor. That company was then combined with three other Teledyne divisions Ð Philbrick, Crystalonics, and TAC Ð in 1990 to form Teledyne Components. Prior to the formation of TelCom, Teledyne Components' management shut down parts of the company Ð Philbrick and TAC Ð and sold the Crystalonics line.

Today, TelCom Semiconductor is building on Teledyne's strengths in analog and mixed-signal technology to develop standard ICs for high-volume consumer and commercial markets. TelCom's future growth strategy centers on the acquisition of mixed-signal technologies addressing the portable computing, communications, and instrumentation markets. The company has also said it will target energy management products.

Management

Phillip M. Drayer President and Chief Executive Officer Edward D. Mitchell Vice President, Quality Management Raphael M. O'Malley Vice President, Finance Gary P. Pinelli Vice President, Sales and Marketing Ali Tasdighi Vice President, New Product Development Allan I. Resnick Manager, Operations

1-304 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles TelCom Semiconductor

Products and Processes

TelCom's main products are divided into three areas of focus:

¥ Mixed-signal ICs: includes display and system A/D converters, V/F and F/V converters, and voltage references.

¥ Power management ICs: includes drivers, PWM controllers, DC/DC converters, switching regulators, voltage detectors, microprocessor supervisor circuits, and change pumps.

¥ Smart sensors: includes solid-state thermal management and battery management control ICs.

Semiconductor Fabrication Facilities

TelCom Semiconductor, Inc. 1300 Terra Bella Avenue Mountain View, California 94039 Cleanroom size: 12,000 square feet Capacity (wafers/week): 2,000 Wafer sizes: 100mm, 125mm Processes: Silicon- and metal-gate CMOS, BiCMOS, CMOS/DMOS, DMOS, bipolar Feature size: 3.0µm

Key Agreements

¥ TelCom announced a foundry agreement with IC Works (San Jose, CA). Under the agreement, TelCom will invest $10 million in equipment and the expansion of IC Works submicron wafer fabrication facility, in return for wafer capacity.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-305 Texas Instruments North American Company Profiles

TEXAS INSTRUMENTS (TI)

Texas Instruments Incorporated Semiconductor Group P.O. Box 655303 Dallas, Texas 75265 Telephone: (214) 995-2011 Fax: (214) 997-5250 Web Site: www.ti.com/sc

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Corporate Sales 6,784 7,440 8,523 10,315 13,128 Net Income (409) 247 472 691 1,088

Semiconductor Sales 2,635 3,080 4,100 5,550 7,900 IC Sales 2,550 3,000 4,040 5,500 7,850 Discrete Sales 85 80 60 50 50 Capital Expenditures 380 315 525 860 1,180

Company Overview and Strategy

Texas Instruments (TI) is one of the leading high-technology companies in the U.S. and one of the top ten semiconductor manufacturers in the world. It was founded in 1930 as Geophysical Service to provide geophysical exploration services to the petroleum industry using reflection seismographs. In 1946, the company formally added electronic systems manufacturing to its operations, and in 1951, adopted its current name.

TI's products include integrated circuits and discrete devices, defense electronics systems, software productivity tools, printers, mobile computing products, printers, electronic calculators, and metallurgical materials. Its printed circuit board contract manufacturing operation was sold to Solectron Corp. in early 1996.

1-306 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Texas Instruments

Metallurgical Materials Other 1% 1% Defense Systems 13%

Digital Europe Products 17% 14% United States East Asia 51% Components 31% 72%

1995 Sales by Business Segment 1995 Sales by Geographic Region

Texas Instruments’ business is based principally on its broad semiconductor technology and application of that technology to selected electronic end equipment markets. The company’s participation in semiconductors dates back to the emergence of the industry in the early 1950’s. It began the research and development of semiconductor devices in 1952. Two years later, the company commercialized the transistor and in 1958, invented the integrated circuit.

Although the company is the leading U.S. merchant producer of DRAMs, much of its semiconductor emphasis is focused on differentiated products like digital signal processors (DSPs), microcomponents, and mixed-signal interface devices. TI is the world’s leading supplier of DSPs, and has a strong position in the mixed-signal device market. The company's bipolar business, meanwhile, is shifting to advanced system logic, with new differentiated products for emerging markets in computers, consumer electronics, and telecommunications.

The majority (about 75 percent) of the DRAMs TI sells are sourced from the joint venture companies in which it holds a majority interest, including TI-Acer in Taiwan, KTI Semiconductor in Japan, and TECH Semiconductor in Singapore. In addition to expansions of the TI-Acer, KTI, and TECH fabs, TI is involved in the construction of two other jointly owned DRAM fabs: TwinStar Semiconductor Incorporated, a fab being built in Texas in partnership with Hitachi; and Alpha-TI Semiconductor, a fab being built near Bangkok, Thailand, in partnership with Alphatec Electronics.

Management

Tomas J. Engibous Executive Vice President and President, Semiconductor Group Richard J. Agnich Senior Vice President, Secretary, and General Counsel William A. Aylesworth Senior Vice President, Treasurer, and Chief Financial Officer Marvin M. Lane, Jr. Vice President and Corporate Controller Jeff McCreary Vice President, Americas Sales and Marketing

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-307 Texas Instruments North American Company Profiles

Products and Processes

TI's principal semiconductor products include DSPs, CISC and RISC microprocessors and controllers, graphics ICs, networking chips, ASICs, memory ICs, and mixed-signal devices. Details concerning these products are provided below.

Processors ¥ Digital Signal Processors—TI offers a variety of DSP chips, including several generations of dedicated and programmable 16-bit fixed-point and 32-bit floating-point DSPs; customizable and application- specific DSPs; and its Multimedia Video Processor (MVP), a DSP that integrates up to four 32-bit advanced DSPs and a 32-bit RISC master processor on a single-chip and delivers up to 2 BOPS (billion operations per second).

¥ Microprocessors—The TI486 family of Windows-compatible 486-class microprocessors includes DX4, DX2, and SXLC2 versions with clock speeds of up to 100MHz. In early 1996, TI announced that its 100MHz 486 would be the final microprocessor the company introduces that utilizes the core technology obtained from Cyrix. TI is now focused on bringing a proprietary 686-level family to the marketplace, although no introduction date has been released.

¥ Microcontrollers—TI offers an expanding family of ROM, one-time programmable, and UV-erasable 8- bit microcontrollers for applications in automotive, communications, computer, consumer electronics, and industrial equipment. The company’s next-generation 8-bit and 16-bit MCUs will offer higher integration levels by utilizing TI’s Prism process for reconfigurable MCU libraries.

¥ LAN Products—This group of products includes both communications processors and physical layer interface devices.

Mixed-Signal and Analog Devices ¥ TI offers a wide range of mixed-signal and standard analog semiconductor products, including power supply products, amplifiers, comparators, data converters, RAMDACs, telecommunications ICs, power ICs, sensor signal processors, hard disk drive ICs, speech processors, digital tapeless answering devices (DTADs), and CCDs. Several of these products are available in low-voltage (3V) versions.

Advanced System Logic Devices ¥ This family of products includes a full spectrum of devices in a variety of process technologies, including CMOS, bipolar, and BiCMOS. TI has second-source agreements with Philips Semiconductors and Hitachi for Advanced BiCMOS Technology (ABT) logic devices as well as for low- voltage logic chips.

1-308 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Texas Instruments

Memory ICs ¥ TI’s expanding line of memory ICs includes a broad family of DRAMs (4M, 16M, and 64M), 16M synchronous DRAMs (SDRAMs), 4M VRAMs, EPROMs, flash memories (512K to 4M), and FIFOs.

TI announced in 3Q95 that it would reduce the production of its EPROMs by as much as 50 percent in order to provide more capacity for the manufacture of DSPs. The company said it would continue to support selected EPROM customers, primarily those in the telecommunications and automotive markets, and those markets that use TI DSP products. TI plans to transition its focus from EPROM to flash memory technology.

ASICs ¥ TI was the second largest North American ASIC vendor in 1995. Its application-specific IC products include high-speed bipolar and CMOS PLDs and CMOS and BiCMOS gate arrays, embedded arrays, and standard cells. The company’s most advanced ASICs are manufactured with a four-level-metal 0.35µm CMOS process, enabling designs of up to 1.7 million gates.

In April 1995, Texas Instruments sold its antifuse FPGA business to Actel Corporation. TI had been a licensed second source of Actel's FPGAs since 1988.

MOS MEMORY ANALOG ✔ DRAM ✔ Amplifier SRAM ✔ Interface ✔ Flash Memory ✔ Consumer/Automotive ✔ EPROM ✔ Voltage Regulator/Reference ROM ✔ Data Conversion EEPROM ✔ Comparator ✔ Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)

MOS LOGIC DIGITAL BIPOLAR ✔ General Purpose Logic ✔ Bipolar Memory ✔ Gate Array ✔ General Purpose Logic ✔ Standard Cell ✔ Gate Array/Standard Cell ✔ Field Programmable Logic ✔ Field Programmable Logic ✔ Other Special Purpose Logic Other Special Purpose Logic ✔ MPU/MCU/MPR MOS MICROCOMPONENT ✔ MPU OTHER ✔ MCU Full Custom IC ✔ MPR ✔ Discrete ✔ DSP ✔ Optoelectronic

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-309 Texas Instruments North American Company Profiles

Semiconductor Fabrication Facilities

Texas Instruments has several major wafer fab projects underway. At the company’s main campus in Dallas, Texas, $2 billion is being spent to put up a new DSP production facility (DMOS-6) and an R&D development fab (R&D-1). The $1.6 billion DMOS-6 fab (to begin production by the end of 1997) is being built to accommodate a production capacity of 7,500 200mm wafers per week. Initially, capacity will be 2,500 wafers per week. Additional equipment will be installed in phases depending on market conditions. The R&D-1 facility will be used for work on 0.18µm and 0.12µm device generations and eventually for the company’s development of 300mm wafer technology.

As mentioned earlier, a great deal of fab activity is taking place at each of TI’s joint venture companies. TI- Acer recently broke ground on its second fab that is scheduled to begin production of 16M DRAMs in early 1997, and 64M DRAMs later. KTI is completing an expansion of its fab that will double the facility’s wafer capacity for the manufacture of 64M DRAMs starting in 1997. TECH Semiconductor is building its second wafer fab, which will have a capacity of 10,000 200mm wafers per week and is expected to be ready in 1998.

Texas Instruments-1 Texas Instruments-2 13500 North Central Expressway 13500 North Central Expressway Dallas, Texas 75243 Dallas, Texas 75243 Telephone: (214) 995-2001 Telephone: (214) 995-2001 Cleanroom size: 60,000 square feet (Class 1) Cleanroom size: 20,000 square feet (Class 1) Capacity (wafers/week): 5,375 Capacity (wafers/week): 4,300 Wafer sizes: 100mm, 150mm Wafer size: 100mm Processes: Bipolar, MOS, GaAs Process: MOS Products: Analog and memory ICs, discretes Products: Logic and analog ICs, ASICs Feature size: 0.8µm Feature size: 0.8µm

Texas Instruments-3 Texas Instruments-DMOS 4 13500 North Central Expressway 13500 North Central Expressway Dallas, Texas 75243 Dallas, Texas 75243 Telephone: (214) 995-2001 Telephone: (214) 995-2001 Cleanroom size: 30,000 square feet (Class 1) Cleanroom size: 50,000 square feet (Class 1) Capacity (wafers/week): 4,300 Capacity (wafers/week): 21,000 Wafer size: 150mm Wafer size: 150mm Processes: Bipolar, CMOS Process: CMOS Products: Analog ICs Products: DRAMs, EPROMs, logic ICs Feature sizes: 1.0µm-3.0µm Feature sizes: 0.5µm-0.8µm

1-310 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Texas Instruments

Texas Instruments-5 Texas Instruments-DMOS 5 13500 North Central Expressway 13500 North Central Expressway Dallas, Texas 75243 Dallas, Texas 75243 Telephone: (214) 995-2001 Telephone: (214) 995-2001 Cleanroom size: 17,000 square feet (Class 1) Cleanroom size: 35,000 square feet (Class 1) Capacity (wafers/week): 1,000 Wafer size: 200mm Wafer size: 3in Process: CMOS Process: GaAs Products: DSPs, MPUs Products: Analog and digital ICs Feature sizes: 0.35µm-0.5µm Feature size: 0.5µm

Texas Instruments-DMOS 6 Texas Instruments-R&D-1 13500 North Central Expressway 13500 North Central Expressway Dallas, Texas 75243 Dallas, Texas 75243 Telephone: (214) 995-2001 Telephone: (214) 995-2001 Cleanroom size: 118,000 square feet Cleanroom size: 51,000 square feet Capacity (wafers/week): 7,500 Wafer size: 200mm Wafer size: 200mm Process: CMOS Process: CMOS Products: R&D Products: DSPs Feature size: 0.12µm-0.25µm Feature sizes: 0.25µm, 0.35µm (Scheduled to begin operations in late 1997) (Scheduled to begin operations in late 1997)

Texas Instruments Texas Instruments 2301 North University Highway 75 South Lubbock, Texas 79415 Sherman, Texas 70590 Telephone: (806) 741-2000 Telephone: (214) 868-5980 Cleanroom size: 45,000 square feet Cleanroom size: 50,000 square feet (Class 1) Capacity (wafers/week): 8,600 Capacity (wafers/week): 10,000 Wafer size: 125mm Wafer sizes: 125mm Processes: CMOS, NMOS Process: Bipolar Products: EPROMs, ASICs Products: Logic ICs, MPRs Feature sizes: 0.8µm-2.0µm Feature size: 2.0µm

Texas Instruments Texas Instruments Japan Ltd. 32201 Southwest Freeway 18-36, Minami 3-chome Stafford, Texas 77477 Hatagoya-shi, Saitama Prefecture 334 Telephone: (713) 274-2000 Japan Cleanroom size: 27,000 square feet Telephone: (81) (48) 282-2211 Capacity (wafers/week): 8,600 Capacity (wafers/week): 4,000 Wafer size: 125mm Wafer size: 125mm Processes: Bipolar, NMOS, CMOS Processes: CMOS, NMOS Products: Logic and analog ICs, ASICs Products: Logic ICs, ASICs Feature sizes: 0.8µm-2.0µm Feature size: 1.0µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-311 Texas Instruments North American Company Profiles

Texas Instruments Japan Ltd. Texas Instruments Japan Ltd. 2355 Kihara Miho-Mura 4260 Aza-Takao Inashiki-gun, Ibaraki Prefecture Oaza-Kawasaki Miho 300-04, Japan Hiji-Machi, Hayami-gun Telephone: (81) (29) 885-3311 Oita Prefecture 979-15, Japan Capacity (wafers/week): 12,000 Telephone: (81) (97) 772-111 Wafer sizes: 125mm, 150mm Capacity (wafers/week): 4,500 Processes: CMOS, MOS Wafer sizes: 125mm, 150mm Products: ASICs, ASSPs, MCUs, Processes: CMOS, BiCMOS, bipolar MPUs, DSPs, DRAMs Products: Logic and analog ICs, DRAMs Feature sizes: 0.35µm-1.0µm Feature sizes: 0.5µm-1.0µm

Texas Instruments Italia S.p.A. Texas Instruments Deutschland GmbH Via Antonio Pacinotti 5/7 Haggertystrasse 1 Nucleo Industriale Freising, Germany I-67051 Avezzano, Italy Telephone: (49) 816-1801 Telephone: (39) 863-4321 Capacity (wafers/week): 7,500 Cleanroom size: 45,000 square feet Wafer size: 150mm Capacity (wafers/week): 12,000 Processes: CMOS, BiCMOS Wafer sizes: 150mm, 200mm Products: Logic and analog ICs, ASSPs Process: CMOS Feature sizes: 0.6µm-0.8µm Products: DRAMs Feature sizes: 0.5µm-0.8µm

Texas Instruments Japan Ltd. 6-12, Kita Aoyama 3-chome Minato-ku, Tokyo 107, Japan Telephone: (81) (3) 3498-2111 Processes: CMOS, BiCMOS Products: Logic ICs, EPROMs

KTI Semiconductor Ltd. TI-Acer Incorporated 189-1 Hirano-cho 4F, Industry East 9th Road Nishiwaki City Science-Based Industrial Park Hyogo Prefecture 677, Japan Hsinchu, Taiwan Cleanroom size: 48,400 square feet Telephone: (886) (35) 785112 Capacity (wafers/week): 2,750 (6,250 in 1997) Fax: (886) (35) 782038 Wafer size: 200mm Cleanroom size: 97,000 square feet Process: CMOS Capacity (wafers/week): 11,250 Products: Logic ICs, DRAMs Wafer sizes: 150mm, 200mm Feature sizes: 0.5µm-0.8µm Process: CMOS (Joint venture with Kobe Steel) Products: DRAMs Feature sizes: 0.55µm-0.8µm

1-312 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Texas Instruments

TECH Semiconductor Singapore Pte Ltd. TwinStar Semiconductor Incorporated P.O. Box 2093, SE 9040 Richardson, Texas 990 Bendemeer Road Cleanroom size: 48,000 square feet Singapore 1233 Wafer size: 200mm Telephone: (65) 298-1122 Process: CMOS Cleanroom size: 40,000 square feet Products: DRAMs Capacity (wafers/week): 1,750 Feature size: 0.35µm Wafer size: 200mm (Joint venture with Hitachi. Scheduled to Process: CMOS start production in mid-1996. See Key Agreements.) Products: DRAMs Feature size: 0.5µm (Joint venture with the Economic Development Board of Singapore, Canon, and HP.)

Alpha-TI Semiconductor Co. Ltd. Alphatechnopolis Industrial Park Chachoengsao, Thailand Capacity (wafers/week): 5,000 Wafer size: 200mm Process: CMOS Products: DRAMs Feature size: 0.4µm, 0.5µm (Joint venture with Alphatec Electronics. Scheduled to start production in 2Q97. See Key Agreements.)

Key Agreements

¥ Fujitsu renewed its semiconductor patent cross-licensing agreement with TI that expired the end of 1995 by signing a 10-year deal that extends through 2005.

¥ TI is collaborating with IMEC of Leuven, Belgium, on the research of advanced lithography processes to achieve 0.18µm capabilities for manufacturing 1-gigabit-class semiconductors.

¥ Texas Instruments and Ericsson have a long-standing alliance in which TI has provided the Swedish company with its leading edge process technologies for wireless communications.

¥ Hitachi joined with Texas Instruments for 16M, 64M, and 256M DRAM development and production. The partners are building a joint 16M and 64M DRAM manufacturing facility in Texas. The $500 million factory, called TwinStar Semiconductor Inc., will begin producing 16M DRAMs in July 1996 and 64M parts in 1997. The output will be shared equally between Hitachi and TI. The two companies also have a separate alternate source agreement for low-voltage logic devices.

¥ TI, Philips, and Hitachi formed a pact in 1993 covering joint development and alternate sourcing of FutureBus and BiCMOS logic IC products.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-313 Texas Instruments North American Company Profiles

¥ C-Cube Microsystems and TI made an agreement to codevelop video and audio compression ICs.

¥ IDT is serving as a second source for a series of TI logic devices and FIFOs.

¥ TI has a license agreement with Sony for the Japanese company's 16-bit MCUs and ASICs based on the 16-bit core.

¥ Sun Microsystems and TI are jointly developing asynchronous transfer mode (ATM) network chipsets. TI and Sun are also jointly developing the next-generation Sparc microprocessor, the 64-bit UltraSparc-I.

¥ TI has a joint venture with MEMC Electronic Materials, Inc., called MEMC Southwest Inc. (Sherman, Texas), for the manufacture of raw silicon wafers.

1-314 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles TLSI

TLSI

TLSI, Incorporated 815 Broadhollow Road Farmingdale, New York 11735 Telephone: (516) 755-7005 Fax: (516) 755-7626

Fabless IC Supplier

Company Overview and Strategy

TLSI designs and markets analog, digital, and mixed-signal ICs for the automotive, telecommunications, industrial process control, security, home appliance, and military/aerospace markets. TLSI was formed as a division of Telephonics Corp. in 1977 to provide Telephonics with ICs needed for its military and commercial airline communication systems. Today, TLSI remains a wholly owned subsidiary of Telephonics and provides ICs to the general marketplace.

Management

Mort Pullman President R. Hartig Vice President, Business Management Jerry Powder Director, Sales

Products and Processes

TLSI offers a wide range of solutions in the area of full custom MOS, cell-based, and gate array configurations. Broken down into categories, these alternatives include the following:

Full Custom: Includes transistor-level designs.

Standard Cell Library: Characterized functions with auto place-and-route using standard height and variable width cells.

Standard Cell Library with Custom Interconnect: Characterized functions with Calma operator place-and-route using standard height and variable width cells.

Minimum Area Cell Libraries with Custom Interconnect: Custom interconnect with minimum sized cells to reduce die area and development time/cost for higher- volume requirements where a full custom configuration may not be required.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-315 TLSI North American Company Profiles

Analog and Digital Functions Combined on the Same Chip: Maximizes system integration and minimizes printed circuit board area.

Processes: Includes 1.5µm to 3µm CMOS, 1.5µm BiCMOS, and bipolar selected to best fit the customer's specific application.

1-316 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles TranSwitch

TRANSWITCH

TranSwitch Corporation 8 Progress Drive Shelton, Connecticut 06484 Telephone: (203) 929-8810 Fax: (203) 926-9453 Web Site: www.transwitch.com

Fabless IC Supplier

Employees 90

Company Overview and Strategy

TranSwitch Corporation designs, develops, and markets highly integrated digital and mixed-signal semiconductor products for broadband telecommunications and data communications applications.

The company’s product line includes very large scale integration (VLSI) devices that serve four markets: worldwide public telephone networks, local area networks (LAN), wide area networks (WAN), and cable television (CATV) systems.

Management

Santanu Das, Ph.D. President and Chief Executive Officer Michael F. Stauff Senior Vice President, Chief Financial Officer William G. Bartholomay Vice President, Engineering Frank Middleton Vice President, PLM Transmission Products Robert G. Pico Vice President, Sales Philip C. Richards Vice President, Marketing Kandaswamy Thangamuthu Vice President, Operations Daniel C. Upp Vice President, Technology Development Jitender K. Vij Vice President, Systems Engineering

Products and Processes

TranSwitch’s IC devices include asynchronous (PDH), synchronous (SONET/SDH), and asynchronous transfer mode (ATM) communications circuits. The asynchronous products include line interface, multiplexer/demultiplexer, framer, and data communications devices. The synchronous product line includes line termination, overhead processor, mapper, and multiplexer/demultiplexer devices. The ATM products include physical layer, ATM layer, and ATM adaptation layer devices that implement a variety of public and private switching and multiplexing products.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-317 Trident Microsystems North American Company Profiles

TRIDENT MICROSYSTEMS

Trident Microsystems, Inc. 189 North Bernardo Avenue Mountain View, California 94043-5203 Telephone: (415) 691-9211 Fax: (415) 691-9260

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends June 30

1991 1992 1993 1994 1995 Sales 28 67 78 69 107 Net Income 3 12 10 1 8 R&D Expenditures 2 6 7 10 13

Employees 115 130 150 268

Company Overview and Strategy

Founded in 1987, Trident Microsystems develops and markets very large scale integrated circuits for the mainstream PC and multimedia markets.

Trident's products address three market segments: PC graphics, video technologies, and 3D acceleration and multimedia solutions. These are central to the personal computer industry’s expansion into the small office and home office market where direct display to TVs, flat-panels, and monitors are required. Trident’s multimedia accelerators drive a mix of graphic and full-motion video data types that include MPEG, off-the- air broadcast, live video, and teleconferenced images.

The company’s complete line of 32-bit and 64-bit integrated circuits, video accelerators, and multimedia video processing chips provide cost-effective easy-to-use graphics solutions based on advanced technology. Trident was among the first to deliver chips for the new Unified Memory Architecture (UMA), which reduces system memory costs by efficiently using existing PC memory for the graphics frame buffer. Additionally, several of Trident’s GUI and video acceleration products include the company’s proprietary TrueVideo algorithm, the first technology to deliver horizontal/vertical interpolation and diagonal edge recovery for clearer, sharper full-motion images.

1-318 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Trident Microsystems

Management

Frank C. Lin President and Chief Executive Officer Jung-Herng Chang, Ph.D. Chief Technical Officer Tung-Liang Chang, Ph.D. Vice President, ASIC Technology Peter Jen Vice President, Sales James T. Lindstrom Vice President, Finance and Chief Financial Officer Amir Mashkoori Vice President, Operations Richard Silverman Vice President, Marketing Lawren Farber Director, Marketing Communications

Products and Processes

Trident designs its products using 1.0µm, 0.8µm, and 0.6µm CMOS process technologies. The company's product line includes: 3D and MPEG ICs, advanced mixed-signal GUI accelerators, high-performance SVGA controllers, multimedia video processing devices, and LCD/CRT controllers.

Semiconductor Fabrication Facilities

Trident currently has foundry agreements with Toshiba and Matsushita in Japan; TSMC, UMC, Winbond, and HMC in Taiwan; and Samsung in Korea.

Key Agreements

¥ In May 1996, Trident and Samsung announced a long-term partnership. Samsung will provide manufacturing capacity to Trident in exchange for mixed-signal ASIC designs from Trident.

¥ In August 1995, Trident entered into a joint venture agreement with UMC. Under the agreement, Trident will invest $60 million over the next three years for a 10 percent equity interest in a new 0.5µm 200mm fab facility UMC is building in Taiwan. Construction is scheduled to be completed in the first half of 1997.

¥ In June 1995, Trident expanded its relationship with TSMC by signing a five-year foundry agreement. Under the agreement, Trident will purchase a certain number of wafers each year from TSMC through 1999.

¥ In October 1994, Trident signed a technology agreement with C-Cube Microsystems, Inc. for the transfer of C-Cube’s MPEG core technology to Trident. Trident integrated C-Cube's MPEG-1 video decoder technology in its own graphics accelerator products and introduced an MPEG-1 decoder in 3Q95.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-319 TriQuint Semiconductor North American Company Profiles

TRIQUINT SEMICONDUCTOR

TriQuint Semiconductor, Inc. 3625A Southwest Murray Boulevard Beaverton, Oregon 97005 Telephone: (503) 644-3535 Fax: (503) 644-3198 Web Site: www.triquint.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 24 29 33 30 46 Net Income (5) 1 1 (10) 3 R&D Expenditures 6 7 9 10 9 Capital Expenditures 11449

Employees 180 190 195 222 285

Company Overview and Strategy

TriQuint Semiconductor designs, develops, manufactures, and markets a broad range of high-performance analog and mixed-signal gallium-arsenide (GaAs) ICs for the wireless communications, telecommunications, and computing markets. TriQuint's mission is to commercialize GaAs ICs for communications and computing. The company’s continued focus is on achieving new designs and introducing new products in all three market areas.

Computing 14% International Wireless 32% Telecommunications Communications United States 33% 53% 68%

1995 Sales by End-Use Market 1995 Sales by Geographic Region

TriQuint's origin can be traced back to 1978, when researchers at Tektronix Laboratories began investigating GaAs IC technology. Established as a majority-owned subsidiary in 1985, TriQuint Semiconductor was charged with developing application-specific integrated circuits (ASICs) for high-performance microwave, linear, and digital systems.

1-320 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles TriQuint Semiconductor

TriQuint became independent from Tektronix in 1991 when it completed a successful merger with GigaBit Logic and Gazelle Microcircuits to form a new privately-held TriQuint. In 1993, TriQuint became a public company.

Management

Steven J. Sharp President and Chief Executive Officer Edward C.V. Winn Executive Vice President and Chief Operating Officer Gordon Cumming, Ph.D. Vice President, Technology Bruce R. Fournier Vice President, Sales Joseph I. Martin Vice President, Finance and Administration, and Chief Financial Officer Donald Mohn Vice President and General Manager, Telecommunications and Computing Philip B. Snow Vice President, Wireless Communications Richard Wood Vice President, Operations

Products and Processes

TriQuint Semiconductor's standard and customer-specific products are structured into three end-market groups: wireless communications, telecommunications, and computing.

Wireless Communications—Standard products for this market are used as building blocks for multipurpose applications in radio frequency (RF) and microwave systems. These systems include personal communications networks, cellular telephones, satellite communications and navigation equipment, and wireless computer networks. In October 1995, TriQuint announced the first in a family of high-power RF amplifier ICs for the burgeoning voice and data wireless communications market.

Telecommunications—Most the company's telecommunications ICs are customer-specific, but its does offer some standard products, such as SONET and SDH multiplexers/demultiplexers and transceivers, ATM framers, and high-performance crosspoint switches.

Computing—Standard products for this market are concentrated on solving system timing and data communications performance bottlenecks in high-performance PCs, workstations, servers, and storage systems.

The company utilizes its proprietary GaAs technology for the production of its ICs. Its GaAs process features 0.5µm to 0.7µm geometries, 4.0µm metal pitch, and a cutoff frequency of up to 21GHz.

TriQuint’s services include GaAs IC design, wafer fabrication, test engineering, package engineering, assembly, and test services.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-321 TriQuint Semiconductor North American Company Profiles

Semiconductor Fabrication Facilities

TriQuint Semiconductor, Inc. 3625A Southwest Murray Boulevard Beaverton, Oregon 97005 Cleanroom size: 15,000 square feet (Class 10) Capacity (wafers/week): 1,000 Wafer size: 100mm Process: GaAs Products: ASICs, standard components, foundry services Feature sizes: 0.5µm-0.7µm

In 1995, TriQuint announced its plans to build a GaAs semiconductor manufacturing facility and office complex in Hillsboro, Oregon, to provide additional production capacity. The new 165,000 square-foot site will house all of the company’s manufacturing, engineering, marketing, and administrative functions currently located in Beaverton, Oregon, with 45,000 square-feet used for the manufacturing facility. Construction is scheduled to begin in 1996, with completion scheduled for the middle of 1997

Key Agreements

¥ In April 1996, TriQuint and Philips announced a wafer sourcing agreement. Under the pact, Philips will develop GaAs ICs for TriQuint to produce according to Philips’ specifications. Assembly and test will be done by Philips at a facility in Limeil, France.

¥ In August 1993, TriQuint and AT&T Microelectronics (now Lucent Technologies) announced a set of agreements involving the development, manufacture, and marketing of GaAs ICs for high-performance wireless and telecommunications systems. As part of the deal, Lucent discontinued its production of GaAs wafers and is instead relying on TriQuint for the manufacture of its GaAs wafers. Lucent also became a minority stockholder in TriQuint. Lucent increased its stake in TriQuint to 8.2 percent in early 1995.

1-322 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Tseng Labs

TSENG LABS

Tseng Labs, Inc. 6 Terry Drive Newtown, Pennsylvania 18940 Telephone: (215) 968-0502 Fax: (215) 860-7713

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 61 75 76 81 39 Net Income 10 14 11 9 1 R&D Expenditures 11123

Employees 50 95

Company Overview and Strategy

Tseng Labs has designed and supplied integrated circuits and board-level enhancement products for graphics and video applications since 1983, its founding year. The company's graphics and multimedia accelerator products work in conjunction with a PC’s CPU to enhance its overall performance.

U.S. 41% International 59%

1995 Sales by Geographic Region

Management

Jack Tseng President and Chief Executive Officer David Kwok Ping Hui Executive Vice President John Vigna Executive Vice President and Chief Operating Officer James E. Bauer Senior Vice President, Sales and Marketing Mark H. Karsch Senior Vice President, Finance and Administration, and Chief Financial Officer Russell Bower Vice President, Manufacturing

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-323 Tseng Labs North American Company Profiles

Raymond Chang Vice President, Engineering and Product Development Barbara J. Hawkins Vice President and Chief Administrative Officer Richard K. McDowell Vice President, Production and Operations Mark Dorfman Director Christopher Sutphin Director

Products and Processes

The first product in the company's line of graphics accelerators, the ET4000/W32, was introduced late in 1992 and became one of the industry's more successful SVGA controllers. Two additional products were introduced in 1993—the W32i and the W32p. The W32i upgraded the W32 system with a more powerful graphics accelerator and added a new 32-bit interleaved memory controller. The W32p further enhanced graphics acceleration and added support for both local bus and the PCI bus architecture.

In November 1994, Tseng Labs introduced its VIPeR f/x advanced video image processor for multimedia systems. The VIPeR f/x enables full screen, accelerated playback of .AV1 and .MPG video files as well as simultaneous capture and display of full motion, 30 frames-per-second video.

Tseng is busy bringing to volume production, its ET6000, the first in a family of next generation graphics controller products. It is an advanced 128-bit graphics and multimedia engine that integrates a high quality video processor, an interface to the new high-bandwidth Multibank DRAM (MDRAM) from Mosys, Inc., and a PCI bus interface. Optimized for Windows 95 graphics performance, the ET6000 was designed to offer high resolution and color without system degradation. To complement the ET6000, Tseng also introduced the VPR6000, a video image processor, and the MPG9920, an MPEG decoder with built-in scaling capabilities.

The company’s products are based on CMOS process technology with line geometries as small as 0.6µm. Most of its new products are manufactured using an advanced triple-layer metal process.

Semiconductor Fabrication Facilities

Tseng currently has foundry agreements with Chartered Semiconductor Manufacturing in Singapore, Tower Semiconductor in Israel, and Winbond Electronics in Taiwan.

1-324 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Unitrode

UNITRODE

Unitrode Corporation 7 Continental Boulevard Merrimack, New Hampshire 03054-0399 Telephone: (603) 424-2410 Fax: (603) 424-3460

IC Manufacturer

Financial History ($M), Fiscal Year Ends January 31*

1992 1993 1994 1995 1996 Sales 40 50 65 87 116 Net Income 5 6 9 12 18 R&D Expenditures 346915 Capital Expenditures 16 12

Employees 235 300 425 514 620

*Results excluding disposed operations.

Company Overview and Strategy

Unitrode was founded in 1960 as a manufacturer of electronic components and subsystems. In 1994, the company divested its two remaining non-strategic businesses, Powercube Corporation and Micro Networks Division, leaving only its IC business, Unitrode Corporation, which was founded in 1981. Unitrode is now focused entirely on the design and manufacture of high-performance analog integrated circuits. The company's ICs are used in a variety of applications for power management and as interface devices. For the most part, the chips are used to control switching power supplies and small electronic motors, or as high- speed interface and communication circuits between various pieces of electronic equipment.

Unitrode's customers are primarily in the EDP/computer and telecommunications markets, but also in the industrial control and instrumentation, defense/aerospace, automotive, and consumer markets. In fiscal 1996, 67 percent of the company's integrated circuit sales were to international customers.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-325 Unitrode North American Company Profiles

Special Function/ Data Power Drivers Consumer/ Communications 8% Automotive/ 6% Military 10%

Industrial Power Motor Control 10% Supply Control 23% 40% Computer/Office Communi- Communi- 63% cation/Interface cations 29% 11%

1996 Sales by Product Type 1996 Sales by Market

Management

Robert L. Gable Chief Executive Officer Edward H. Browder President Richard V. Paulson Executive Vice President, Marketing and Sales Dennis A. Peasenell Executive Vice President, Operations Cosmo S. Trapani Executive Vice President and Chief Financial Officer Allan R. Campbell Senior Vice President and General Counsel S. Kelley MacDonald Vice President, Corporate Communications Patrick Moquin Vice President, Human Resources Frederick J. Myers Vice President, International Sales

Products and Processes

Unitrode's product offerings are comprised of analog ICs for power supply control, motor control, lighting, power driving, power quality, and power factoring, as well as for high-speed and high-power interface applications. Most of the products are based upon proprietary design utilizing enhanced bipolar, BiCMOS, and BCDMOS semiconductor technologies and are considered application specific standard products (ASSPs).

Semiconductor Fabrication Facilities

Unitrode Corporation 7 Continental Boulevard Merrimack, New Hampshire 03054 Capacity (wafers/week): 1,000 Wafer size: 100mm Processes: Bipolar, BiCMOS, BCDMOS Feature sizes: 1.5µm-5.0µm

1-326 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Unitrode

Unitrode has agreements with four foundries to supply additional wafers, as required. In January 1995, the company signed an agreement with GMT Microelectronics Corporation (former Commodore Semiconductor fab in Norristown, Pennsylvania) for additional wafer capacity. Under the agreement, Unitrode made a $2 million equity investment in GMT, in return for up to 30 percent of GMT's capacity.

Key Agreements

¥ Unitrode entered into an alliance with Irvine Sensors. Under the agreement, Unitrode will become a licensee and exclusive second-source for Irvine Sensors’ wireless infrared communication ICs.

¥ Unitrode entered into an agreement with GMT Microelectronics Corporation in early 1995 to supply wafers to Unitrode. As part of the agreement, Unitrode invested $2 million in GMT.

¥ Unitrode agreed with Toko Inc. (Japan) in 1993 to jointly develop power-control ICs. The deal also calls for the cross-licensing and alternate sourcing of select proprietary products.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-327 Universal Semiconductor North American Company Profiles

UNIVERSAL SEMICONDUCTOR

Universal Semiconductor, Inc. 1925 Zanker Road San Jose, California 95112 Telephone: (408) 436-1906 Fax: (408) 436-1125

IC Manufacturer

Employees 40

Company Overview and Strategy

Universal Semiconductor was established in 1978 to serve as a CMOS foundry offering design and manufacturing of customers' custom/semicustom devices, gate arrays (digital and mixed-signal), dielectrically isolated (DI) high-voltage ICs, linear arrays, and DMOS FETs.

Management

Vic Hejmadi President and Chief Executive Officer Greg Anzelc Director, Marketing and Sales Wajid Rizvi Director, Operations

Products and Processes

Universal Semiconductor uses CMOS processing for all devices and offers gate arrays with up to 2,400 gates, mixed-signal gate arrays (18V breakdown), and 300V and 500V dielectrically isolated high-voltage ICs, as well as radiation-hardened devices.

Semiconductor Fabrication Facilities

Universal Semiconductor, Inc. 1925 Zanker Road San Jose, California 95112 Cleanroom size: 9,000 square feet Capacity (wafers/week): 850 Wafer size: 100mm Process: CMOS Products: ASICs, linear devices, discretes, foundry services Feature sizes: 1.5µm, 2.0µm, 3.0µm, 4.0µm, 5.0µm

1-328 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles UTMC

UNITED TECHNOLOGIES MICROELECTRONICS CENTER (UTMC)

United Technologies Microelectronics Center Inc. 1575 Garden of the Gods Road Colorado Springs, Colorado 80907-3486 Telephone: (719) 594-8000 Fax: (719) 594-8032 Web Site: www.utmc.com

Fabless IC Supplier

Financial History ($M)

1991 1992 1993 1994 1995 Sales 17 20 27 30 30

Employees 400 350 300 300 180

Company Overview and Strategy

United Technologies Microelectronics Center Inc. (UTMC) is a subsidiary of United Technologies Corp. (UTC), a $23 billion Hartford, Connecticut-based provider of high technology products to the aerospace, building systems, and automotive industries throughout the world.

Established in 1980, UTMC serves government and commercial aerospace, commercial property and residential housing, and automotive manufacturing customers. It was originally established to assist other UTC divisions with the integration of custom and semicustom microelectronics into their systems. In 1985, UTMC began supplying semicustom and military-standard VLSI circuits to external companies in the aerospace and defense industries. Today, the majority of UTMC’s business is with external companies. The company also engages in government- and customer-funded R&D.

Up to about mid-1995, UTMC manufactured its IC products in its own fab in Colorado Springs. However, the company took on a fabless strategy with the sale of its fab to Rockwell Semiconductor. UTMC reportedly sold the fab because it could not be operated economically. It was underutilized due to the fact that the company sells only a small number of wafers with relatively high value. In addition, UTMC felt that by adopting a fabless strategy, it would be able to move to 0.8µm and smaller geometries more quickly while not incurring the large capital costs associated with a submicron fab.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-329 UTMC North American Company Profiles

Management

Charles "Nick" H. Ide President Chuck Gregory Vice President, Product Development and Engineering Rich Paetsch Chief Financial Officer Ron Hehr Director, Marketing Dwight Deem Director, Sales

Products and Processes

UTMC offers semicustom and military-standard products. Its semicustom products include CMOS gate arrays with densities from 3,400 to 150,000 usable gates, CMOS cell-based ASICs, and radiation-hardened antifuse programmable logic arrays. The process used for the gate arrays and standard cells is a JAN- qualified low-temperature double- or triple-metal rad-hard process with 1.2µm or 1.5µm geometries.

The company also offers a large selection of radiation-hardened monolithic, ASD/ENASC-certified MIL-STD- 1553 products. These include bus interface and control devices, bipolar bus transceivers, 16-bit RISC MPUs and 8-bit MCUs in both rad-hard and non-rad-hard versions, mask ROMs, dual-port RAMs, SRAMs of up to 256K density, and standard bipolar and CMOS logic devices.

Radiation-hardened products accounted for about 40 percent of UTMC’s sales in 1995.

Semiconductor Fabrication Facilities

UTMC sold its fabrication facility to Rockwell Semiconductor in mid-1995. As part of the deal, Rockwell agreed to supply UTMC with wafers until February 1997 as it makes the transition to a fabless operation. In March 1996, UTMC announced a foundry deal with Loral Federal Systems to obtain production capacity for rad-hard products from Loral’s fab in Manassas, Virginia (see Key Agreements). Other foundries used by UTMC include Analog Devices, Honeywell SSEC, and Harris Semiconductor.

Key Agreements

¥ UTMC established a three-year foundry supply deal with Loral Federal Systems in March 1996. The deal makes Loral UTMC’s main foundry for rad-hard CMOS devices.

1-330 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Vadem

VADEM

Vadem Ltd. 1885 Lundy Avenue Suite 201 San Jose, California 95131 Telephone: (408) 467-2100 Fax: (408) 467-2199

Fabless IC Supplier

Employees 45

Company Overview and Strategy

Vadem was established in 1983 as a design house specializing in chips for the portable computer industry that was emerging at the time. Now, Vadem is building upon its established portable design experience to become a leading designer and marketer of ICs and related software for subnotebook-size computers and personal communications devices.

Management

Chikok Shing Chief Executive Officer Richard H. Lee President Ahmet Alpdemir Vice President, Marketing Henry Fung Vice President, Engineering Siu-Kuen Tsang Director, ASIC Development Norman Farquhar Manager, Software Phil Mitchell Manager, Single-Chip PC Products Geoff Teng Manager, PCMCIA Products

Products and Processes

Vadem's IC products include display controllers, microprocessors, PCMCIA host adapters, and PC card controllers for portable systems. Some of these products are described below.

¥ VG-230—a 16MHz x86-compatible processor for handheld systems. The highly integrated, low-power consuming processor incorporates a CPU and core logic, along with an LCD controller, keypad scanner, and PCMCIA controller.

¥ VG-469—a 208-pin PCMCIA card controller that is register- and software-compatible with Intel's i82365SL controller ICs. The part provides a migration path for current 5V devices, emerging 3.3V, and future lower-voltage systems and is compatible with PCMCIA 2.1 ExCA (Exchangable Card Architecture) extension, Microsoft's Plug-and-Play ISA version 1.0a, and PC Card DMA operation.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-331 Vadem North American Company Profiles

¥ VG-660—claimed to be the industry's first LCD VGA controller. It supports small flat panel displays with enhanced features and VGA compatibility.

Semiconductor Fabrication Facilities

Vadem's primary foundry sources are NEC in Japan and Samsung in Korea. Atmel, Symbios Logic, and VLSI Technology are used to a lesser extent.

1-332 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Vitesse Semiconductor

VITESSE SEMICONDUCTOR

Vitesse Semiconductor Corporation 741 Calle Plano Camarillo, California 93012 Telephone: (805) 388-3700 Fax: (805) 987-5896

IC Manufacturer

Financial History ($M), Fiscal Year Ends September 30

1991 1992 1993 1994 1995 Sales 24 37 26 36 43 Net Income (3) 1 (19) (4) 2 R&D Expenditures 9 9 10 9 9 Capital Expenditures 11 3623

Employees 200 300 238 201 235

Company Overview and Strategy

Vitesse Semiconductor, founded in 1984, is a leader in the design, development, manufacturing, and marketing of digital gallium arsenide (GaAs) ICs suitable for commercial, industrial, and military customers. The company's custom, semicustom, and standard products are used in a wide variety of industries including telecommunications, data communications, computers, defense and aerospace systems, automatic test equipment (ATE), and instrumentation.

Vitesse's mission is to be the dominant supplier of the highest performance IC solutions for communications and ATE applications. As the communications market shifts from wire to optical channels, and computers undergo a shift from large proprietary central processors to open distributed processors, Vitesse is positioning itself to provide leading high-performance digital, analog, and mixed-signal IC solutions.

Foundry Other 3% Computers 3% 7% Government 13% Standard Products 28% Communications ASIC Products ATE 56% 69% 21%

1995 Sales by Product 1995 Sales by End-Use Market

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-333 Vitesse Semiconductor North American Company Profiles

Japan ROW 4% 1%

Europe 9%

North America 86%

1995 Sales by Geographic Region

Management

Louis R. Tomasetta President and Chief Executive Officer Ian Burrows Vice President, Fab Operations Ira Deyhimy Vice President, Product Development Chris Gardner Vice President, Marketing Eugene F. Hovanec Vice President, Finance and Chief Financial Officer James Mikkelson Vice President, Technology Development Michael Millhollan Vice President and General Manager, Standard Products Robert Nunn Vice President and General Manager, ASIC Products Neil Rappaport Vice President, Sales Ram Venkataraman Vice President, Quality

Products and Processes

Vitesse's products are fabricated using its proprietary H-GaAsª (high integration gallium arsenide) process technology. The current generation is the five-level metal, 0.5µm H-GaAs IV process, capable of integration levels of over one million transistors. ASIC design and simulation is supported on industry standard tools from Mentor, Cadence, Viewlogic, Synopsys, and Teradyne.

Vitesse's standard products include telecommunications and data communications ICs. Its communications products address the high-speed data transmission marketplace. Most are designed to be compatible with the SONET (Synchronous Optical Network), ATM, and Fibre Channel standards. The operating frequency of these devices is from 155MHz to 10GHz and they are aimed at providing physical layer solutions for copper or fiber optics communication lines.

1-334 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Vitesse Semiconductor

Vitesse's ASIC product line consists of five gate array families: GLX, FX, Viper, SCFX, and Furyª . Aimed at the communication, ATE/instrumental, and computer markets, GLX arrays are suited to switching networks, serial links, high-speed data bus transfers, DSP functions, and critical timing blocks. GLX utilizes a sea-of- gates architecture and can be powered from either a single or dual power supply, depending on I/O requirements. These gate arrays can accommodate virtually any digital application requiring up to 175,000 gates. The FX series provides solutions in super minicomputers, high-end workstations, telecommunications systems, and high-performance ATE/instrumentation. The Viper family provides solutions in computer peripherals, medical instrumentation, and communications. The SCFX family is targeted at telecommunications and data communications applications, offering maximum operating frequencies beyond 3GHz. The Fury series addresses the conventional silicon ECL user.

Semiconductor Fabrication Facilities

Vitesse Semiconductor 741 Calle Plano Camarillo, California 93012 Cleanroom size: 5,500 square feet (Class 10) 6,500 square feet (Class 100) Capacity (wafers/week): 1,700 Wafer size: 100mm Process: H-GaAs E/D MESFET Products: Gate arrays, telecom and datacom devices, microperipherals, foundry services Feature size: 0.5µm

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-335 Vivid Semiconductor North American Company Profiles

VIVID SEMICONDUCTOR

Vivid Semiconductor, Inc. 7402 West Detroit Street Suite 120 Chandler, Arizona 85226 Telephone: (602) 961-3200 Fax: (602) 961-0200

Fabless IC Supplier

Employees 35

Company Overview and Strategy

Vivid Semiconductor, a limited partnership, was formed in 1993 to design and market integrated circuits to manufacturers of flat panel displays (FPDs). The general partner in Vivid is FPD Technology Inc., a private company formed in June of 1993 for the purpose of developing products for the flat panel industry.

Using patented extended voltage-range CMOS technology, Vivid has developed technology that allows designers to build enhanced performance flat panel displays with 24-bit color and full-motion video. Although Vivid’s current focus is on supplying the needs of the FPD market, Vivid’s process technology can be applied to a broad range of markets, from automotive to telecommunications, where extended voltage- range CMOS can make a difference in product capability, power consumption, and reliability.

Management

Kenneth B. Fine President, and Chief Executive Officer Tim Vatuone Chief Financial Officer Alex Erhart Vice President and Chief Technical Officer Gerry Harder Vice President, Operations Steve Shank Vice President, Marketing and Sales Ed Fullman Director, Worldwide Sales

Products and Processes

Vivid Semiconductor's FPD chips are based on its patented "Dual Range" design architecture, which allows high-voltage devices to be achieved on standard, low-voltage CMOS processes.

Semiconductor Fabrication Facilities

Unlike leading edge microprocessors and memories, Vivid’s silicon requirements can be fabricated in plants that are three process generations old. Vivid’s wafer processing, packaging, and testing functions are contracted to well-established manufacturers.

1-336 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles VLSI Technology

VLSI TECHNOLOGY

VLSI Technology, Inc. 1109 McKay Drive San Jose, California 95131 Telephone: (408) 434-3100 Fax: (408) 263-2511 Web Site: www.vlsi.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 413 429 516 587 720 Net Income 10 (32) 16 32 46 R&D Expenditures 39 50 65 79 90 Capital Expenditures 55 40 72 94 204

Employees 2,315 2,379 2,659 2,728 2,986

Company Overview and Strategy

VLSI Technology is a leader in the design, manufacture, and sale of complex high-performance ASICs and ASSPs. Founded in 1979, the company has been a pioneer in the cell-based ASIC business. VLSI targets high-growth markets in which it has built expertise and can use its library of proprietary cells and FSBª functional system blocks to assist customers in designing products and bringing them to market rapidly.

VLSI’s integrated circuit business is organized in a “market-focused” structure. Its three main groups are Computing Products, Communications Products, and Consumer Digital Entertainment Products. The Computing Product group offers devices for the computer market, including PC applications and high-end computing applications such as graphics workstations and high-end storage systems. The Communications Products groups offers devices for wireless and network communications applications. The Consumer Digital Entertainment Products group supplies devices for secure communications and home entertainment applications such as interactive television and video game systems.

VLSI’s core logic chipset business is expected to show a sharp decline in 1996 as a result of Intel’s strengthened dominance in the core logic business in 1995. Therefore, the Computing Products group is shifting its focus away from standard core logic chipsets and toward custom products for x86 applications.

The wireless communications segment was the fastest growing part of the company in 1995. In 1Q96, VLSI created a European subsidiary called Creative Systems Solutions. Based in Munich, Germany, the company will focus on the wireless data communications marketplace.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-337 VLSI Technology North American Company Profiles

The company's subsidiary, Compass Design Automation, Inc., supplies software and design libraries to the broad commercial ASIC and electronic design automation (EDA) marketplaces. Nearly half (46 percent) of VLSI’s total business in 1995 was derived from the personal computer industry (33 percent from x86 products).

Europe 23% United States Japan/ 49% Asia-Pacific 28%

1995 Sales by Geographic Region

Management

Alfred J. Stein Chief Executive Officer and President, Chairman Bernd U. Braune Senior Vice President, World Wide Sales and Marketing Donald L. Ciffone, Jr. Senior Vice President, VLSI Products Gregory K. Hinckley Senior Vice President, Finance and Chief Financial Officer Dieter J. Mezger Senior Vice President and President, Compass Design Automation, Inc. John C. Batty Vice President and Treasurer Larry Grant Vice President, General Counsel and Secretary Balakrishnan S. Iyer Vice President and Controller L. Don Maulsby Group Vice President, Computing Products Division Cliff Roe Vice President, Strategic Products

Products and Processes

Using advanced design capabilities, a vast cell library of predefined cells, and advanced manufacturing processes, VLSI Technology offers highly customized, highly integrated standard cell, embedded array (FlexArray), and gate array ASICs and ASSPs for applications such as computers, wireless communications equipment, electronic games, and digital set-top boxes.

The VLSI Cell Library provides an extensive and growing variety of predesigned and characterized cells, macrocells, and large functional system blocks. The company’s specialized system blocks include: UART, parallel port, SCC, SCSI, PCMCIA, PCI, SSA, Fibre Channel, and graphics functions for computing applications; T1/E1, SONET/SDH, and ATM functions for network communications applications; GSM/DCS, DECT, CT2, PHS, CDPD, and Ruby II functions for wireless communications applications; and digital demodulation, forward error correction (FEC), MPEG 2 video and MPEG audio, microcontroller, and transport for digital entertainment applications. VLSI’s cell library also includes general-purpose system blocks such as 32-bit ARM RISC processor cores, data encryption devices, and programmable DSP cores.

1-338 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles VLSI Technology

VLSI manufactures its ASICs and ASSPs in CMOS technology with geometries ranging from 0.35µm to 1.0µm and with up to five layers of interconnect metal. At the end of 1995, approximately 30 percent of the company’s monthly wafer production was built using a 0.6µm process. Much of the remainder was 0.8µm technology. VLSI’s newest 0.35µm process technology supports 1280 pins and five million gates for cell- based designs, with supply voltages ranging from 2.2V to 3.6V.

Through its subsidiary, Compass Design Automation, VLSI provides IC design software (design tools and libraries) to a broad range of system and semiconductor customers.

Semiconductor Fabrication Facilities

The conversion of VLSI’s San Antonio facility to primarily 0.6µm and smaller feature size production was due to be completed in the first half of 1996. Because of the age of its San Jose fab, VLSI does not intend to push the technology at the facility below 0.8µm feature sizes.

VLSI Technology, Inc. VLSI Technology, Inc. 1109 McKay Drive 9641 Westover Hills Boulevard San Jose, California 95131 San Antonio, Texas 78251 Telephone: (408) 434-3000 Telephone: (210) 522-7000 Fab 1 Fab 2 Cleanroom size: 47,000 square feet Cleanroom size: 50,000 square feet (Class 1) Capacity (wafers/week): 3,400 Capacity (wafers/week): 7,400 Wafer size: 150mm Wafer size: 150mm Process: CMOS Process: CMOS Products: ASICs, ASSPs Products: ASICs, ASSPs Feature sizes: 0.8µm, 1.0µm Feature sizes: 0.35µm, 0.5µm, 0.6µm, 0.8µm

VLSI Technology's manufacturing capacity is enhanced by manufacturing relationships with Chartered Semiconductor of Singapore and TSMC of Taiwan. Approximately 20 percent of the company's total wafer production was performed by these foundries in 1995. Only 10 percent of VLSI’s wafer needs are expected to be served by foundries in 1996.

VLSI subcontracts all of its IC packaging and 50 percent of its final test needs. Its in-house final test functions are performed at its factories in California and Tempe, Arizona.

Key Agreements

¥ VLSI and Hitachi renewed and expanded their 1988 standard cell and process technology exchange agreement. The new pact gives Hitachi access to VLSI's gate array technology, and the two companies will develop compatible gate array families. In mid-1995, the companies announced successful development of a 0.35µm five-layer metal CMOS process.

¥ The DSP Group licensed its Pineª digital signal processing core technology and its TrueSpeechª speech compression technology to VLSI Technology in 1994. The new technologies were added to VLSI's FSB library for design in wireless communications applications.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-339 VLSI Technology North American Company Profiles

¥ In late 1994, VLSI licensed Santa Clara, California-based Mediametrics Inc.'s MPEG 1 and 2 video decompression technology, supporting the company's drive into the set-top box and direct broadcast satellite markets.

¥ VLSI announced its intention to jointly develop and market fuzzy logic-based ASIC technology for chip design and development capabilities with Togai InfraLogic, Inc. of Irvine, California.

¥ In February 1994, VLSI and ARM, Ltd. renewed their agreement to expand market opportunities for the ARM 32-bit architecture in embedded control and portable applications.

1-340 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles VTC

VTC

VTC Inc. 2800 East Old Shakopee Road Bloomington, Minnesota 55425-1350 Telephone: (612) 853-5100 Fax: (612) 853-3355

IC Manufacturer

Financial History ($M)

1991 1992 1993 1994 1995 Sales 19 50 75 108 166

Employees 220 300 375 480 540

Company Overview and Strategy

VTC was founded in 1984 to design and manufacture VHSIC products for government markets. Within the first year, VTC acquired Control Data Corporation's microcircuits division (a captive chip manufacturing operation for CDC's disk drive business that had operated since 1969). VTC was privately held, but Control Data was a major investor.

Control Data purchased all of VTC in 1987, making it a wholly-owned subsidiary. In 1988, the two original founders left CDC and the company was put up for sale. In October 1990, CDC sold the bipolar portion to a management buyout led by VTC's new CEO, Larry Jodsaas. Before the end of the year, CDC also sold the CMOS fab to Cypress.

Today, VTC's strategy is to offer quality, high-performance ICs to the mass storage (disk and optical drive) industry. Most of the company's revenues come from bipolar preamp ICs and much of its products are consumed by the top five disk drive makers.

Management

Larry Jodsaas President and Chief Executive Officer Cliff Boler Vice President, Engineering John Doyle Vice President, Quality Dan Griffith Vice President, Sales and Marketing Greg Peterson Vice President and Chief Financial Officer Robert Rousseau Vice President, Human Resources Ed Schnable Vice President, Manufacturing

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-341 VTC North American Company Profiles

Products and Processes

VTC offers a broad line of read/write preamplifier standard products and channel ASICs for use in rigid disk drives. Processes used by the company are complementary bipolar (CBP), ECL, and BiCMOS (called PolarMOS).

Semiconductor Fabrication Facilities

VTC Inc. 2800 East Old Shakopee Road Bloomington, Minnesota 55425-1350 Cleanroom size: 32,000 square feet Capacity (wafers/week): 5,000 Wafer sizes: 100mm, 150mm Processes: Bipolar, complementary bipolar, BiCMOS Products: Standard and ASIC read/write preamplifiers, servo preamplifiers, and channel electronics Feature sizes: 1.2µm, 2.0µm, 3.0µm

1-342 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Weitek

WEITEK

Weitek Corporation 2801 Orchard Parkway San Jose, California 95134 Telephone: (408) 526-0300 Fax: (408) 577-1066

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 39 26 36 28 18 Net Income (5) (11) (1) (11) (4) R&D Expenditures 15 14 10 10 10

Employees 206 140 144 83 60

Company Overview and Strategy

Founded in 1981, Weitek specializes in processors and controllers that enhance the performance of industry standard operating systems, user interfaces, and application software. Weitek's graphics and multimedia products bring workstation-class performance to the personal computer.

Weitek traditionally supplied coprocessors, RISC processors, and graphics processors to supercomputer and workstation manufacturers, in particular to manufacturers of Sparc2-based workstations. However, in 1991 the company began to focus more of its resources on developing high-performance user interface processors based upon the company's established RISC processor and workstation graphics technology. New product development is focused entirely on user interface processors.

Europe 10% Asia RISC Processors User Interface 15% 48% Products 52% North America 75%

1995 Sales by Device Type 1995 Sales by Geographic Region

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-343 Weitek North American Company Profiles

Management

Richard Bohnet President and Chief Executive Officer Howard J. Gopen Vice President, Operations Allen R. Samuels Vice President, Business Development Benjamin M. Warren Vice President, Engineering Stephen J. Gillis Director, Human Resources Kent D. Goodin Director, Multimedia and Systems Paul K. Kidman Director, Finance Gopal Solanki Director, IC Design Engineering

Products and Processes

Weitek's products remain in two areas, user interface processors and RISC processors:

¥ User interface products—The company's user interface products are marketed to personal computer OEMs, as well as to motherboard and add-in card manufacturers. The most recent product introductions were the Power 9100, a high-performance single-chip integrated graphics processor for high-end PC applications, and the Video Powerª coprocessor, a multimedia coprocessor designed to work with the Power 9100 to improve the performance and quality of full-motion video under Microsoft's Video for Windows.

¥ RISC processors: Weitek's RISC microprocessors products include Sparc processors for workstations and printer processors for laser printers.

The company's products are manufactured using 0.8µm, 1.0µm, and 1.2µm CMOS technologies.

Semiconductor Fabrication Facilities

Weitek's semiconductor wafers are processed to its specifications principally by Matsushita and Samsung.

Key Agreements

¥ In 1995, Weitek and Samsung established a technology exchange agreement. As part of the agreement, Samsung will provide wafer capacity for Weitek’s proprietary products. In addition, the companies will work together in developing new products including next-generation multimedia chips for PCs.

¥ Weitek licensed Intel's Indeoª video technology for use with its Video Power digital video accelerator chip to deliver television-quality video playback to PC platforms.

1-344 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles WSI

WSI

WSI, Inc. 47280 Kato Road Fremont, California 94538 Telephone: (510) 656-5400 Fax: (510) 657-5916 Web site: www.wsipsd.com

Fabless IC Supplier

Financial History ($M)

1991 1992 1993 1994 1995 Sales 35 28 27 28 38

Employees 165 137 125 125 125

Company Overview and Strategy

WSI, Inc. (formerly WaferScale Integration, Inc.) was founded in 1983 as a supplier of high-performance programmable ICs. It serves system designers who need to achieve higher system performance, reduce system size and power consumption, and shorten product development cycles to achieve faster market entry. It offers field-programmable microcontroller peripherals as well as high-performance non-volatile EPROM products.

Management

Michael Callahan President and Chief Executive Officer Robert Hoard Vice President, Worldwide Sales Boaz Eitan Vice President, New Products and Technology Development John Ekiss Vice President, Marketing Carl Mills Vice President, Finance

Products and Processes

WSI supplies several families of programmable microcontroller peripherals as well as a broad line of high performance non-volatile PROM and EPROM devices. These products are based on the company's patented self-aligned split-gate CMOS EPROM technology. WSI's fast EPROMs are available in densities ranging from 16K to 1M. The programmable peripherals integrate EPROM, SRAM, PLD, and user- configurable logic.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-345 WSI North American Company Profiles

Semiconductor Fabrication Facilities

WSI does not have its own fabrication facility. It has foundry agreements with Sharp Corp., National Semiconductor, AMD, and AMI.

Key Agreements

¥ National took a 10 percent stake in WSI as part of a five-year foundry and technology exchange agreement.

¥ WSI signed an agreement with Advanced Micro Devices that allows AMD to make and market products that are manufactured with WSI's Alternate Metal Virtual Ground non-volatile memory technology. In exchange, WSI is using AMD's technology and submicron fab to make its Programmable System Devices.

¥ WSI formed an alliance with American Microsystems to jointly develop mask-programmable versions of WSI's line of microcontroller peripherals. AMI is manufacturing the parts and the companies are marketing them separately.

1-346 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Xicor

XICOR

Xicor, Inc. 1511 Buckeye Drive Milpitas, California 95035-7493 Telephone: (408) 432-8888 Fax: (408) 432-0640 Web Site: www.xicor.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 94 93 104 104 114 Net Income (16) (30) (6) 2 10 R&D Expenditures 24 22 13 14 15 Capital Expenditures 9 6259

Employees 1,000 840 800 691 641

Company Overview and Strategy

Xicor, Inc., founded in 1978, designs and manufactures a broad line of non-volatile in-the-system programmable semiconductor ICs. In-the-system programmability enables telecommunications, consumer, computer, industrial, automotive, and military products to adapt to changing software and operating environments, and to be personalized by the user. Many of Xicor’s products consume little power and operate well from a battery powered source, making them well suited for hand-held and portable applications.

ROW 13% Japan 15% United States 52% Europe 20%

1995 Sales by Geographic Region

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-347 Xicor North American Company Profiles

Xicor emphasizes the development of proprietary products which incorporate its programmable technology, enabling customers to rapidly bring to market products with improved features, efficiency and maintainability. In 1995, Xicor introduced its first SerialFlashª memory product family, operating from low voltage power sources. Xicor is a leading supplier of EEPROM memory products and EEPOTª digitally controlled potentiometers.

Management

Raphael Klein President David J. Coakley Vice President, Wafer Operations Joseph Drori Vice President, Products Design, Engineering, Quality, and Reliability Geraldine N. Hench Vice President and Corporate Controller Klaus G. Hendig Vice President, Finance and Administration Timothy D. Kanemoto Vice President, Product Operations Madga M. Madriz Vice President, Human Resources Bruce W. Mattern Vice President, Sales and Marketing William H. Owen III Vice President, Technology Development and Intellectual Properties

Products and Processes

Xicor offers serial EEPROMs in 128bit to 128K densities, parallel EEPROMs in 16K to 1M densities, serial flash in 8K to 128K densities, NOVRAMs (nonvolatile SRAMs), NOVRAMs with Autostoreª power-loss data protection, EEPOTª digitally controlled potentiometers, EEPROMs that interface directly with microcontrollers or microprocessor bus-based systems, and memory subsystems.

As part of its move into application-specific products, Xicor introduced a chipset that performs keyboard and display control as well as power management in laptop computers in 1994. Called LapKitª, the chipset includes two Xicor EE-based devices and one microcontroller based on Intel's 80C51 architecture. The LapKit firmware may be altered at any time during system operation.

Xicor licensed the Pine 16-bit fixed-point DSP core and related development tools from DSP Group, in late 1993. The firm is developing products that integrate the Pine DSP core with its EEPROM technology.

Semiconductor Fabrication Facilities

Xicor, Inc. 1511 Buckeye Drive Milpitas, California 95035-7493 Capacity (wafers/week): 1,250 Wafer size: 150mm Processes: CMOS, NMOS Products: EEPROM-based ICs and chipsets Feature sizes: 0.7µm-1.0µm

For 1996, Xicor plans to purchase additional equipment to increase the capacity of its manufacturing facility.

1-348 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Xilinx

XILINX

Xilinx, Inc. 2100 Logic Drive San Jose, California 95124-3400 Telephone: (408) 559-7778 Fax: (408) 559-7114 Web Site: www.xilinx.com

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends March 31

1992 1993 1994 1995 1996 Sales 136 178 256 355 561 Net Income 21 27 41 59 102 R&D Expenditures 18 24 34 45 n/a

Employees 482 544 689 868 1050

Company Overview and Strategy

Xilinx is the leading supplier of CMOS programmable logic devices (PLDs) and related system software. Founded in 1984, Xilinx is credited with the invention of the field programmable gate array (FPGA). Xilinx continues to hold the largest share of the CMOS programmable logic and FPGA markets.

In February 1992, Xilinx acquired Plus Logic, Inc., a company involved in electrically programmable logic devices (EPLDs). In addition, the company also markets HardWireª devices (non-programmable ICs functionally equivalent to the programmable FPGA). The firm ships its PLD and related development system software to electronic equipment manufacturers in the computer peripherals, telecommunications, industrial control and instrumentation, and military markets.

System Software 4%

Military Other 4% 14% Computer Peripherals Industrial 36% 14% FPGAs and EPLDs Communications 96% 32%

1995 Sales by Product Category 1995 Sales by End-Use Market

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-349 Xilinx North American Company Profiles

Asia-Pacific 12% Europe 19% North America 69%

1995 Sales by Geographic Region

In April 1995, Xilinx acquired NeoCAD, Inc. NeoCad is a private PLD design software producer, founded in 1990 and is headquartered in Boulder, Colorado. Xilinx integrated NeoCAD’s operations with its own.

Management

Willem P. Roelandts Chief Executive Officer R. Scott Brown Senior Vice President, Worldwide Sales William S. Carter Vice President, Research and Development Lee D. Farrell Vice President, Corporate Marketing Charles Fox Vice President, Product Marketing Steve Hayes Vice President, North American Sales Robert C. Hinckley Vice President, Strategic Plans and Programs and Secretary Nicholas Kucharewski Vice President, EPLD Division C. Frank Myers Vice President, Operations Gordon M. Steel Vice President, Finance, and Chief Financial Officer

Products and Processes

Xilinx has seven CMOS FPGA families in production, with gate counts ranging from 800 to 52,000. Gate counts for the next-generation of devices is expected to reach 125,000. In 3Q95, Xilinx introduced its XC8100 family of FPGAs. These devices are based on Xilinx’s 0.6µm MicroViaª amorphous silicon antifuse technology and proprietary sea-of-gates architecture. The family offers from 1K to 9K usable gates.

In 4Q95, Xilinx announced its XC9500 family of complex PLDs (CPLDs). The devices are produced using 5V-only 0.6µm flash memory technology. This family offers in-system programmability (ISP) characteristics with more than 10,000 program/erase cycles. The initial family includes densities ranging from 800 to 12,800 gates.

In 2Q96, Xilinx expanded its flagship SRAM-based XC4000E FPGA series to offer densities of up to 52,000 usable gates using the new XC4000EX family. Devices with up to 125,000 usable gates are expected to sample in 1997. The new XC4000EX devices are produced using 0.5µm process technology with 0.35µm processing expected to be used for the 1997 devices.

The company also provides CAE software that offers complete FPGA and EPLD solutions, from design entry through partitioning, placement, and routing.

1-350 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Xilinx

Semiconductor Fabrication Facilities

Xilinx does not fabricate its own ICs; but has foundry agreements with Seiko Epson, Yamaha, and IC Works. In early 1994, Xilinx provided its foundry partner Seiko Epson with $42 million to help fund a wafer fab Seiko Epson built in Sakata, Japan.

Key Agreements

¥ Xilinx has a second-source agreement with Harris Semiconductor for rad-hard FPGAs.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-351 Zilog North American Company Profiles

ZILOG

Zilog, Inc. 210 East Hacienda Avenue Campbell, California 95008-6600 Telephone: (408) 370-8000 Fax: (408) 370-8056 Web Site: www.zilog.com

IC Manufacturer

Financial History ($M), Fiscal Year Ends December 31

1991 1992 1993 1994 1995 Sales 110 146 203 223 265 Net Income 11 16 27 35 43 R&D Expenditures 12 16 21 23 25 Capital Expenditures 27 40 69 79

Employees 1,330 1,400 1,500 1,500 1,575

Company Overview and Strategy

Zilog was founded in 1974 and became a wholly owned subsidiary of Exxon by 1980. In 1985, the company rechartered its course to focus on application specific market segments. In 1989, Zilog's management, employees, and a venture capitalist purchased the company from Exxon. Zilog became a public company in February 1991.

Today, Zilog is a leader in the development, design, and manufacture of application specific standard products (ASSPs) for the consumer electronics, data communications, and computer peripheral markets. The company utilizes its Superintegrationª design methodology to combine cores and cells from its extensive library of microprocessors and controllers, DSPs, and memory and logic circuits.

ROW Europe 7% 10% United States Far East 43% 40%

1995 Sales by Geographic Region

1-352 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Zilog

Management

Edgar A. Sack President and Chief Executive Officer Michael J. Bradshaw Senior Vice President, Worldwide Operations Thomas C. Carson Senior Vice President, Worldwide Sales William R. Walker Senior Vice President and Chief Financial Officer Sally M. Baumwell Vice President, Human Resources James J. Magill Vice President and General Manager, Data Communications Richard L. Moore Vice President, Technology Richard R. Pickard Vice President, General Counsel Alan Secor Vice President, Consumer/Peripherals

Products and Processes

Zilog's core library includes 8-bit microcontrollers, 8-bit, 16-bit, and 32-bit microprocessors, 16-bit digital signal processors, serial communications controllers, and peripheral circuits. These cores are available as stand- alone devices or may be combined in Superintegration products. The company’s cell library consists of logic and memory circuits that are generally combined in Superintegration products.

The Superintegration library and diverse product portfolio of over 800 items serve three distinct markets: data communications, consumer products, and intelligent peripherals.

¥ For data communications applications, Zilog offers ASSPs based on its Z80 microprocessor family and serial communications controllers. These ASSPs are optimized for Ethernet routers, bridges, data switches, modems, terminals, printers, workstations, local area networks, and wide area networks. The company holds a leadership position in general purpose, multiprotocol controllers for the LAN and WAN markets.

¥ Based on the Z8¨ 8-bit microcontroller, Zilog offers a family of controllers for use in consumer electronics products such as cellular phones, audiovisual equipment, automobiles, telephone answering machines, household appliances, battery chargers, garage door openers, security systems, set-top boxes, interactive TVs, and infrared remote controls.

¥ Zilog is an innovator in the addition of intelligence to computer peripheral chips using its line of Z80¨ 8-bit, Z180¨ 16-bit, and Z380¨ 32-bit microprocessors, and peripheral circuits. Adding intelligence to computer peripherals frees the central processor from micro-management tasks and upgrades the performance of the system. Common peripherals are printers, keyboards, monitors, pointing devices, hard disk and floppy disk controllers, modems, and PCMCIA bus interface products.

During 1994, Zilog underwent the transition from 1.2µm to 0.8µm CMOS manufacturing technology. Then, in 1995, the company began using 0.6µm CMOS process technology.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-353 Zilog North American Company Profiles

Semiconductor Fabrication Facilities

Zilog, Inc. Zilog, Inc. 2601 11th Avenue, North Extension 1401 North King Road Nampa, Idaho 83651 Nampa, Idaho 83651 Telephone: (208) 466-4551 Module III Fax: (208) 467-9765 Cleanroom size: 30,000 square-feet (Class 1) Modules I and II Capacity (wafers/week): 2,500 Cleanroom size: 77,000 square feet (Class 10) Wafer size: 200mm Capacity (wafers/week): 7,000 Process: CMOS Wafer size: 125mm Products: ASSPs, MCUs, MPUs, DSPs Processes: NMOS, CMOS, BiCMOS Feature sizes: 0.6µm, 0.8µm (0.35µm in 1996) Products: ASSPs, MCUs, MPUs, DSPs Feature sizes: 0.6µm, 0.8µm, 1.0µm, 1.2µm

Assembly and test operations are performed in company-owned facilities in Manila and Carmona, the Philippines. Contracts with outside IC fabricators Kawasaki Steel in Japan and Thesys Microelectronics in Germany, and with assembly houses in Malaysia, Indonesia, and China are back-up sources to the company's own operations.

Key Agreements

¥ Zilog purchased a license in 1995 for the design and manufacture of ASSPs using Aspec Technology's high-density array and embedded array technologies.

¥ Zilog joined with Allegro MicroSystems and IMP in a marketing alliance. The team is marketing what they call a ZIA disk drive chipset—ZIA standing for Zilog, IMP, and Allegro.

¥ Oak Technology and Zilog extended a joint-development and cross-license agreement to develop integrated circuits for mass storage applications.

¥ Zilog has an agreement (formed in 1993) with Kawasaki Steel under which Zilog is licensed to manufacture, use, and sell the Kawasaki KC80ª, an enhanced high-performance version of the Z80ª 8- bit microprocessor. Additionally, the companies are developing new Superintegration products that use the KC80 core.

¥ Zilog and Catalyst entered into a cross-licensing agreement in 1993 under which Zilog gained access to Catalyst's flash technology and Catalyst gained the right to develop products using Zilog's Z8 one-time- programmable (OTP) microcontroller family. The two companies then expanded their alliance to jointly develop flash memories.

1-354 INTEGRATED CIRCUIT ENGINEERING CORPORATION North American Company Profiles Zoran

ZORAN

Zoran Corporation 1705 Wyatt Drive Santa Clara, California 95054 Telephone: (408) 986-1314 Fax: (408) 986-1240

Fabless IC Supplier

Financial History ($M), Fiscal Year Ends December 31

1992 1993 1994 1995 Sales 1 2 6 18 Net Income (3) (8) (5) 1 R&D Expenditures 5544

Employees 75

Company Overview and Strategy

Zoran Corporation, first incorporated in 1981, and reincorporated in 1986, develops and markets integrated circuits for digital video and audio compression applications. The company’s VLSI products are produced for high-performance, cost-sensitive digital image enhancement, image compression, and audio processing applications, such as multimedia computing, digital cameras, scanners, digital television, and digital audio systems.

Zoran has a strong core expertise in DSP technology, including digital filtering and frequency domain processing. Its strategy centers on building partnerships with innovative marketing and manufacturing companies and targeting high-volume, high-performance applications, such as multimedia computing and consumer video and audio systems. In 1995, 69 percent of revenues were to foreign customers.

In 1995, Zoran entered into the worldwide television market as it teamed up with The Goldtron Group of Singapore to spin off a new company, Oren Semiconductor. The venture, based in Israel, will jointly develop and market ICs combining DSP and filtering technology to correct flawed TV images. The devices will be manufactured by Taiwan Semiconductor Manufacturing Co. (TSMC) and Tower Semiconductor using 0.6µm CMOS technology.

INTEGRATED CIRCUIT ENGINEERING CORPORATION 1-355 Zoran North American Company Profiles

Pacific Rim 21% Europe 48% United States 31%

1995 Sales by Geographic Region

Management

Levy Gerzberg, Ph.D. President and Chief Executive Officer Ami Kraft Vice President, Finance, and Chief Financial Officer Isaac Shenberg Vice President, Sales and Marketing Alexander Sinar Director, Manufacturing Meir Tsadik Vice President, Research and Development, and Chief Operating Officer

Products and Processes

Zoran has three product families: Image Compression Processors, Image Enhancement Processors, and Vector Signal Processors.

Semiconductor Fabrication Facilities

Zoran has established foundry agreements with TSMC, Motorola, and Tower Semiconductor.

Key Agreements

¥ In 1995, Zoran signed a four-year agreement with Tower Semiconductor under which Tower will supply specified quantities of wafers to Zoran.

¥ Siemens and Zoran announced in 1995 they would collaborate on the development and marketing of multimedia ICs for PC and consumer electronics applications.

¥ Dolby Laboratories formed a long-term joint technology partnership with Zoran in August 1992. The partnership calls for the development of low-cost ICs for multi-channel digital audio for motion-picture soundtracks and eventually consumer media.

1-356 INTEGRATED CIRCUIT ENGINEERING CORPORATION