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Flip Chip Based on Connections – Through Hole – Surface Mount PRASANNA S GANDHI [email protected]
Lecture 20: Packaging MEMS ME 645: MEMS: Design, Fabrication and Characterization P.S. Gandhi Mechanical Engineering IIT Bombay Acknowledgements: Mukul Tikekar, Dr Anandroop Bhattacharya PRASANNA S GANDHI [email protected] What is packaging? Service and art of providing a suitable environment to the electronic/ MEMS product as a whole to perform reliably over a period of time To protect delicate components from structural damage and/or malfunctions No addition to functionalityPRASANNA S GANDHI [email protected] 1 Motivation MEMS packaging is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications Packaging is aaveryverylarge percentage of the total cost of MEMS devices MEMS packikaging iiissaaltlmost alllways app licati on specific and greatly affected by its environment and packaging techniques We will first have a look at electronic packaging and then MEMS PRASANNA S GANDHI [email protected] Electronic Packaging Levels of Packaging Edge connector Wafer Chip Printed circuit board Chip Carrier Back panel Chassis PRASANNA S GANDHI [email protected] 2 Level – I Packaging: Chip to Chip Carrier Chip carrier – Housing for the thin and fragile chip Purpose – Protects the chip from environment and abusive handling – Facilitates interconnections from the chip to the pads/holes on the circuit board – Provides pins/pads for that serve as bases for solder joints – Also involved in the heat transfer process as the first step in the heat flow path from source to sink PRASANNA -
Chapter 9 Chip Bonding At
9 CHIP BONDING AT THE FIRST LEVEL The I/O interface to the die primarily interconnects electrical power, ground and signals. It must provide for low impedance for the power distribution system, so as to keep switching noise within specification, and controlled impedance for the signal leads to allow adequate signal integrity. In addition it must accommodate all the I/O and power and ground leads required, and at the same time, minimize the cost for high volume assembly. The secondary role of chip bonding is to be mechanically robust, not interfere with thermal man- agement and be the geometrical transformer from the die features to the next level of packaging features. There are many options for the next level of interconnect, including: ¥ leadframe in a single chip package ¥ ceramic substrate in a single chip package ¥ laminate substrate in a single chip package ¥ ceramic substrate in a multichip module ¥ laminate substrate in a multichip module ¥ glass substrate, such as an LCD (liquid crystal display) ¥ laminate substrate, such as a circuit board ¥ ceramic substrate, such as a circuit board For all of these first level interfaces, the chip bonding options are the same. Illustrated in Figure 9-1, they are: ¥ wirebond ¥ TAB (tape automated bonding) ¥ flip chip; either with a solder interface, a polymer adhesive or a welded joint Because of the parallel efforts in widely separated applications involving similar, but slightly dif- ferent variations of chip attach techniques, seemingly confusing names have historically evolved to describe some of the attach technologies. COG (chip on glass) refers to assembly of bare die onto LCD panels. -
Procedures for Precap Visual Inspection
NASA Reference Publication 1122 November 1984 Procedures for Precap Visual Inspection -; -i TECH LIBRARY KAFB. NM NASA 0063L7b Reference Publication 1122 1984 Procedures for Precap Visual Inspection Oflice of the Chief Engineer National Aeronautics and Space Administration Washington, D.C. Natlonal Aeronautics and Space AdmInIstration Scientific and Technical Information Branch Library of Congress Cataloging in Publication Data Main entry under title: Procedures for precap visual inspection. (NASA Reference Publication ; 1122) Bibliography: p. 75 1. Integrated circuits-Inspection I. United States. National Aeronautics and Space Administration. Scientific and Technical Information Branch. II. Series. TK7874.P74 1984 621.381’.73’0287 84-16628 FOREWORD This document describes the techniques that can be employed for the final precap visual inspection of micro- circuits used in electronic system components. It can also serve as an effective tool in training personnel to per- form these tasks in an efficient and reliable manner. To aid in the training of personnel unfamiliar with microcircuits, the first chapter includes a brief description of the processing techniques that are commonly used in industry for the manufacture of monolithic and hybrid components. Subsequent sections describe the imperfections that may be encountered in the precap visual inspection of these semiconductor components. Photomicrographs are used to illustrate problem areas, such as scratches, voids, adhesions, bridging of the metallization, corrosion of the aluminum, -
Pdf [70] BE Semiconductor Industries N.V
This is an accepted version of a paper published in Journal of Micromechanics and Microengineering. This paper has been peer-reviewed but does not include the final publisher proof-corrections or journal pagination. Citation for the published paper: Fischer, A., Korvink, J., Wallrabe, U., Roxhed, N., Stemme, G. et al. (2013) "Unconventional applications of wire bonding create opportunities for microsystem integration" Journal of Micromechanics and Microengineering, 23(8): 083001 Access to the published version may require subscription. Permanent link to this version: http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-124074 http://kth.diva-portal.org UNCONVENTIONAL APPLICATIONS OF WIRE BONDING CREATE OPPORTUNITIES FOR MICROSYSTEM INTEGRATION A. C. Fischer1, J. G. Korvink23, N. Roxhed1, G. Stemme1, U. Wallrabe2 and F. Niklaus1 1 Department of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden 2 Department of Microsystems Engineering - IMTEK, University of Freiburg, Germany 3 Freiburg Institute for Advanced Studies - FRIAS, University of Freiburg, Germany E-mail: [email protected] Abstract. Automatic wire bonding is a highly mature, cost-efficient and broadly available back-end process, intended to create electrical interconnections in semiconductor chip packaging. Modern production wire bonding tools can bond wires with speeds of up to 30 bonds per second with placement accuracies of better than 2 µm, and the ability to form each wire individually into a desired shape. These features render wire bonding a versatile tool also for integrating wires in applications other than electrical interconnections. Wire bonding has been adapted and used to implement a variety of innovative microstructures. This paper reviews unconventional uses and applications of wire bonding that have been reported in the literature. -
A Footprint Study of Bond Initiation in Gold Wire Crescent Bonding Norman Zhou, X
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 1 A Footprint Study of Bond Initiation in Gold Wire Crescent Bonding Norman Zhou, X. Li, and N. J. Noolu Abstract—The morphological features of the crescent bond interfacial deformation to remove surface contaminants by sur- footprints on the substrate after peeling the wire off were studied face extension (i.e., to expose clean surfaces for bonding), re- to gain an understanding of the effect of process parameters on the gardless of the application of ultrasonic energy [6], [8]–[10]. crescent bond formation. In the absence of any ultrasonic energy, metallurgical bonding initiated at the peripheral regions of the Typical observations of bonded and nonbonded regions in the crescent bond. The bond strength improved at higher substrate periphery and middle regions of a wire bond is cited by the de- temperatures and higher bonding force which promoted higher formation theory to discount fretting mechanisms caused by in- shear deformation of the substrate. The application of ultrasonic terfacial sliding. According to the deformation theory, ultrasonic energy drastically improved the growth of micro welds along the energy merely acts to reduce the force required to deform the bond interface and produced micro weld patterns on the footprint that are characteristic of the level of ultrasonic energy applied. wire and substrate [6], [9]. The effect of these process parameters on the mechanisms of However, based on studies of Au ball bonding using mi- crescent bonding are discussed. crosensors, Mayer et al. [11] indicated that the sliding and Index Terms—Bonding force, bonding mechanisms, footprint scrubbing at the bump/pad interface plays a significant role in morphology, gold wire crescent bonding, substrate temperature, the bond formation and ultrasonic softening contributes little ultrasonic energy. -
Chapter A: Wire Bonding 2 Level 2. Conclusions and Guideline
Chapter A: Wire Bonding 2 Level 2. Conclusions and guideline 2.1 Wirebonding techniques There are two basic wirebonding techniques that are used in thermocompression (T/C), thermosonic (T/S) or ultrasonic (U/S) bonding process: ball bonding and wedge bonding. Approximately 93% of all semiconductor packages are manufactured using ball bonding method, while wedge bonding is used to produce about 5% of all assembled packages. 2.1.1 Ball bonding In this technique, wire is passed through a hollow capillary, and an electronic-flame-off system (EFO) is used to melt a small portion of the wire extending beneath the capillary. The surface tension of the molten metal from a spherical shape, or ball, as the wire material solidifies. The ball is pressed to the bonding pad on the die with sufficient force to cause plastic deformation and atomic interdiffusion of the wire and the underlying metallization, which ensure the intimate contact between the two metal surfaces and form the first bond (ball bond). The capillary is then raised and repositioned over the second bond site on the substrate, a precisely shaped wire connection called a wire loop is thus created as the wire goes. Deforming the wire against the bonding pad makes the second bond (wedge bond or stitch bond), having a crescent or fishtail shape made by the imprint of the capillary’s outer geometry. Then the wire clamp is closed, and the capillary ascends once again, breaking the wire just above the wedge, an exact wire length is left for EFO to form a new ball to begin bonding the next wire. -
Analyse Expérimentale Et Numérique Des Défaillances Mécaniques
Analyse expérimentale et numérique des défaillances mécaniques locales induites dans les interconnexions par les tests paramétriques et les assemblages : optimisation des procédés et des architectures des plots de connexion Romuald Roucou To cite this version: Romuald Roucou. Analyse expérimentale et numérique des défaillances mécaniques locales induites dans les interconnexions par les tests paramétriques et les assemblages : optimisation des procédés et des architectures des plots de connexion. Autre. Ecole Nationale Supérieure des Mines de Saint- Etienne, 2010. Français. NNT : 2010EMSE0589. tel-00669635 HAL Id: tel-00669635 https://tel.archives-ouvertes.fr/tel-00669635 Submitted on 13 Feb 2012 HAL is a multi-disciplinary open access L’archive ouverte pluridisciplinaire HAL, est archive for the deposit and dissemination of sci- destinée au dépôt et à la diffusion de documents entific research documents, whether they are pub- scientifiques de niveau recherche, publiés ou non, lished or not. The documents may come from émanant des établissements d’enseignement et de teaching and research institutions in France or recherche français ou étrangers, des laboratoires abroad, or from public or private research centers. publics ou privés. N° d’ordre : 2010 EMSE 0589 THÈSE présentée par Romuald ROUCOU Pour obtenir le grade de Docteur de l’École Nationale Supérieure des Mines de Saint-Étienne Spécialité : Microélectronique Analyse expérimentale et numérique des défaillances mécaniques locales induites dans les interconnexions par les tests paramétriques -
File Inseto Product Presentation Overview Download
ADVANCED TECHNOLOGY FOR RESEARCH & INDUSTRY PRODUCT PRESENTATION Inseto is a leading technical distributor of equipment and related materials to the semiconductor, microelectronic & advanced technology sectors, as well as adhesives for electronics, automotive & industrial manufacturing. Inseto, located approximately one-hour west of London, operates from a state- of-the-art facility that houses our Administration, Goods Storage & Distribution, Adhesives Application Laboratory & Demonstration, Repair & Training Facilities. ADHESIVES 4 - 6 EQUIPMENT 7 - 10 CONSUMABLES 11 - 15 ADVANCED TECHNOLOGY FOR RESEARCH & INDUSTRY The company, established in 1987 and ISO 9001 Customer support activities are at the centre of Certified since 2005, prides itself on forming Inseto’s “Total Customer Service” philosophy, long-term relationships with our principals and in where we aim to understand, communicate and obtaining mutual respect from our customers. fulfil the needs of our customers, better than any competitor. Our advanced equipment and materials are available from specialist technology divisions, We are committed to meeting these which offer carefully selected, technically requirements through the application of high innovative, high performance products. standards of quality and customer care, both before and after sales, by continually investing in training and adopting a policy of continuous improvement in our company and in our people. Inseto See our website for more details www.inseto.co.uk TECHNICAL SUPPORT SERVICES: Inseto’s SSIP “SafeContractor” certified engineering team has developed high levels of knowledge and experience in the implementation of quality support services, including resolving machine breakdowns, providing certified maintenance & calibrations, annual support contracts, equipment & process training classes and machine repairs etc. We understand that requirements may vary, depending on the size of your facility & “in house” capabilities and so will tailor our services accordingly, matching your requirements precisely. -
Polymer Micromachining Packaging of MEMS Sensors Mikrosensorer
Mikrosensorer Polymer Micromachining Packaging of MEMS sensors Project meeting 1 Sensor Time Accelerometer 18/4 , 9.15 Pressure sensor 18/4 , 10.15 Flow sensor 18/4, 11.15 Polymer Micromechanics Polymer Micromachining Cheaper materials Low cost fabrication Allow single use ”thermal recycling” Rapid prototyping Very flexible electronic components (design & state) Polymer Micromechanics • Thin Film Litography • Hot Embossing • Injection Moulding • Laser Fabrication • 3D-printing Polymer classes Plastic: materials that can be formed into shapes. Thermoplastic: materials that can be shaped more than once. Thermosetting plastic: material that can only be shaped once. Elastomer: material that is elastic in some way. If a moderate amount of deforming force is added, the elastomer will return to its original shape. Useful for fibers. Properties of Polymers • Chain length • Structure, orientation of chains • Identity of side groups • Degree of cross‐linking – Cross linking with covalent bonds formed between chains make the polymer stiffer; more crystalline Thermoplastics Melting (Tm) Rubbery flow OSTE(+) Carlborg et al Lab on a chip 2011 Saharil, F., et al µTAS 2012 Particle doped polymers • Magnetic particles • Silver • Carbon / graphene Hot Embossing Nano Imprint Litography (NIL) Thin Films Higher Temperatures Curable Polymers Limit in aspect ratio rather than linewidth Very high resolution Injection Moulding High throughput massfabrication Expensive initial cost Limited resolution (10 µm) 3D printing Stereolitography • Polymerisation