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Analyse Expérimentale Et Numérique Des Défaillances Mécaniques Analyse expérimentale et numérique des défaillances mécaniques locales induites dans les interconnexions par les tests paramétriques et les assemblages : optimisation des procédés et des architectures des plots de connexion Romuald Roucou To cite this version: Romuald Roucou. Analyse expérimentale et numérique des défaillances mécaniques locales induites dans les interconnexions par les tests paramétriques et les assemblages : optimisation des procédés et des architectures des plots de connexion. Autre. Ecole Nationale Supérieure des Mines de Saint- Etienne, 2010. Français. NNT : 2010EMSE0589. tel-00669635 HAL Id: tel-00669635 https://tel.archives-ouvertes.fr/tel-00669635 Submitted on 13 Feb 2012 HAL is a multi-disciplinary open access L’archive ouverte pluridisciplinaire HAL, est archive for the deposit and dissemination of sci- destinée au dépôt et à la diffusion de documents entific research documents, whether they are pub- scientifiques de niveau recherche, publiés ou non, lished or not. The documents may come from émanant des établissements d’enseignement et de teaching and research institutions in France or recherche français ou étrangers, des laboratoires abroad, or from public or private research centers. publics ou privés. N° d’ordre : 2010 EMSE 0589 THÈSE présentée par Romuald ROUCOU Pour obtenir le grade de Docteur de l’École Nationale Supérieure des Mines de Saint-Étienne Spécialité : Microélectronique Analyse expérimentale et numérique des défaillances mécaniques locales induites dans les interconnexions par les tests paramétriques et les assemblages : Optimisation des procédés et des architectures des plots de connexion soutenue à Gardanne, le 9 décembre 2010 Membres du jury Président : François BAY Directeur de Recherche Ecole des Mines, MINES ParisTech, CEMEF, Sophia Antipolis Rapporteurs : Philippe GOUDEAU Directeur de Recherche CNRS, Institut Pprime, CNRS/Université de Poitiers/ENSMA, Poitiers François BAY Directeur de Recherche Ecole des Mines, MINES ParisTech, CEMEF, Sophia Antipolis Examinateurs : Sandrine BEC Chargé de recherche CNRS, LTDS, Ecole Centrale de Lyon Ingénieur R&D, STMicroelectronics, Crolles Vincent FIORI Ingénieur R&D, STMicroelectronics, Agrate, Italie Lucia ZULLINO Professeur Ecole des Mines, Ecole Nationale Supérieure des Co-encadrant : Xavier BODDAERT Mines de Saint-Etienne, Gardanne Professeur Ecole des Mines, Ecole Nationale Supérieure des Directeur de thèse : Karim INAL Mines de Saint-Etienne, Gardanne Spécialités doctorales : Responsables : SCIENCES ET GENIE DES MATERIAUX J. DRIVER Directeur de recherche – Centre SMS MECANIQUE ET INGENIERIE A. VAUTRIN Professeur – Centre SMS GENIE DES PROCEDES G. THOMAS Professeur – Centre SPIN SCIENCES DE LA TERRE B. GUY Maître de recherche – Centre SPIN SCIENCES ET GENIE DE L’ENVIRONNEMENT J. BOURGOIS Professeur – Centre SITE MATHEMATIQUES APPLIQUEES E. TOUBOUL Ingénieur – Centre G2I INFORMATIQUE O. BOISSIER Professeur – Centre G2I IMAGE, VISION, SIGNAL JC. PINOLI Professeur – Centre CIS GENIE INDUSTRIEL P. BURLAT Professeur – Centre G2I MICROELECTRONIQUE Ph. COLLOT Professeur – Centre CMP Enseignants-chercheurs et chercheurs autorisés à diriger des thèses de doctorat (titulaires d’un doctorat d’État ou d’une HDR) AVRIL Stéphane MA Mécanique & Ingénierie CIS BATTON-HUBERT Mireille MA Sciences & Génie de l'Environnement SITE BENABEN Patrick PR 1 Sciences & Génie des Matériaux CMP BERNACHE-ASSOLANT Didier PR 0 Génie des Procédés CIS BIGOT Jean-Pierre MR Génie des Procédés SPIN BILAL Essaïd DR Sciences de la Terre SPIN BOISSIER Olivier PR 1 Informatique G2I BOUCHER Xavier MA Génie Industriel G2I BOUDAREL Marie-Reine PR 2 Génie Industriel DF BOURGOIS Jacques PR 0 Sciences & Génie de l'Environnement SITE BRODHAG Christian DR Sciences & Génie de l'Environnement SITE BURLAT Patrick PR 2 Génie industriel G2I COLLOT Philippe PR 1 Microélectronique CMP COURNIL Michel PR 0 Génie des Procédés SPIN DAUZERE-PERES Stéphane PR 1 Génie industriel CMP DARRIEULAT Michel IGM Sciences & Génie des Matériaux SMS DECHOMETS Roland PR 1 Sciences & Génie de l'Environnement SITE DESRAYAUD Christophe MA Mécanique & Ingénierie SMS DELAFOSSE David PR 1 Sciences & Génie des Matériaux SMS DOLGUI Alexandre PR 1 Génie Industriel G2I DRAPIER Sylvain PR 2 Mécanique & Ingénierie SMS DRIVER Julian DR 0 Sciences & Génie des Matériaux SMS FEILLET Dominique PR 2 Génie Industriel CMP FOREST Bernard PR 1 Sciences & Génie des Matériaux CIS FORMISYN Pascal PR 1 Sciences & Génie de l'Environnement SITE FORTUNIER Roland PR 1 Sciences & Génie des Matériaux SMS FRACZKIEWICZ Anna DR Sciences & Génie des Matériaux SMS GARCIA Daniel MR Génie des Procédés SPIN GIRARDOT Jean-Jacques MR Informatique G2I GOEURIOT Dominique MR Sciences & Génie des Matériaux SMS GRAILLOT Didier DR Sciences & Génie de l'Environnement SITE GROSSEAU Philippe MR Génie des Procédés SPIN GRUY Frédéric MR Génie des Procédés SPIN GUY Bernard MR Sciences de la Terre SPIN GUYONNET René DR Génie des Procédés SPIN HERRI Jean-Michel PR 2 Génie des Procédés SPIN INAL Karim PR 2 Microélectronique CMP KLÖCKER Helmut DR Sciences & Génie des Matériaux SMS LAFOREST Valérie CR Sciences & Génie de l'Environnement SITE LERICHE Rodolphe CR CNRS Mécanique et Ingénierie SMS LI Jean-Michel EC (CCI MP) Microélectronique CMP LONDICHE Henry MR Sciences & Génie de l'Environnement SITE MALLIARAS George Grégory PR 1 Microélectronique CMP MOLIMARD Jérôme MA Mécanique et Ingénierie SMS MONTHEILLET Frank DR 1 CNRS Sciences & Génie des Matériaux SMS PERIER-CAMBY Laurent PR 2 Génie des Procédés SPIN PIJOLAT Christophe PR 1 Génie des Procédés SPIN PIJOLAT Michèle PR 1 Génie des Procédés SPIN PINOLI Jean-Charles PR 0 Image, Vision, Signal CIS STOLARZ Jacques CR Sciences & Génie des Matériaux SMS SZAFNICKI Konrad MR Sciences & Génie de l'Environnement SITE THOMAS Gérard PR 0 Génie des Procédés SPIN TRIA Assia Microélectronique CMP VALDIVIESO François MA Sciences & Génie des Matériaux SMS VAUTRIN Alain PR 0 Mécanique & Ingénierie SMS VIRICELLE Jean-Paul MR Génie des procédés SPIN WOLSKI Krzysztof DR Sciences & Génie des Matériaux SMS XIE Xiaolan PR 1 Génie industriel CIS Glossaire : Centres : PR 0 Professeur classe exceptionnelle SMS Sciences des Matériaux et des Structures PR 1 Professeur 1ère catégorie SPIN Sciences des Processus Industriels et Naturels PR 2 Professeur 2ème catégorie SITE Sciences Information et Technologies pour l’Environnement MA(MDC) Maître assistant G2I Génie Industriel et Informatique DR Directeur de recherche CMP Centre de Microélectronique de Provence Ing. Ingénieur CIS Centre Ingénierie et Santé MR(DR2) Maître de recherche CR Chargé de recherche EC Enseignant-chercheur IGM Ingénieur général des mines Dernière mise à jour le : 9 mars 2010 « Il y a un but, mais pas de chemin; ce que nous nommons chemin est une hésitation ». Franz Kafka. Avant-propos Cette thèse est le fruit de la collaboration entre le département Packaging et Supports Souples du Centre de Microélectronique de Provence – Georges Charpak de l’Ecole Nationale Supérieure des Mines de Saint-Etienne et l’équipe de Simulation Mécanique et Thermomécanique (MTM) de ST Microelectronics à Crolles. Pour m’avoir accueilli au sein de leurs équipes respectives, je remercie Clément Tavernier, responsable du groupe TCAD et Patrick Benaben, responsable du département PS2. Mes remerciements vont également à François Bay et Philippe Goudeau qui ont accepté la lourde tâche d’être les rapporteurs de ce manuscrit. De même, je tiens à remercier Sandrine Bec et Lucia Zullino qui ont accepté de faire partie du jury, et m’ont fourni des commentaires avisés concernant les différentes parties de la thèse. Au sein de ST Microelectronics, je tiens à remercier les personnes qui, à Crolles ou à Grenoble, m’ont aidé à réaliser les différents travaux inclus dans cette thèse. Tout d’abord, merci à Jean-Pierre Gonchond pour m’avoir permis de mieux appréhender la nanoindentation. Merci également à Géraldine Thiery, Véronique Guyader, Frédéric Lorut, Philippe Delpech et Fabien Quercia pour m’avoir soutenu dans la mise en œuvre et la réalisation des différentes parties expérimentales concernant le « probing » et le « wire bonding ». Pour les moments passés à Gardanne, je remercie ceux qui m’ont aidé à avoir une vision différente de certains aspects de ma thèse. Je remercie également mes « partenaires » de repas et pauses que ce soit à Crolles (Mehdi, Alban, Sébastien, Olivier, Pierre, François, Lionel…) ou à Gardanne (Renaud, Thomas, Etienne, Mohamed, Romain(s), Brice, Jessica…) pour les discussions scientifiques mais également les moments plus détendus. Un thésard peut difficilement effectuer correctement son travail s’il n’est pas bien encadré. Ainsi, au sein de ST Microelectronics, je tiens à remercier tout d’abord Florian Cacho, qui a eu la patiente de m’initier à la simulation, et Vincent Fiori qui m’a ensuite suivi et soutenu afin de mener à bien ces travaux. Leurs disponibilités et leurs compétences, tant dans le domaine de la microélectronique que dans celui de la modélisation numérique, m’ont été d’une aide précieuse afin de ne pas perdre de vue les objectifs de la thèse. Je tiens également à remercier Karim Inal pour son soutien, les nombreuses discussions scientifiques en particulier en ce qui concerne la mécanique des matériaux. La distance ne s’est finalement que peu faite sentir au cours de ces années. Je remercie aussi Xavier Boddaert qui, malgré le fait que la thèse soit éloignée de ses domaines de prédilection, m’a apporté un soutien ponctuel et efficace. Je remercie enfin tous les
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