2019 Annual Report on Form 10-K March 2020 Dear Shareholders
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Effective Virtual CPU Configuration with QEMU and Libvirt
Effective Virtual CPU Configuration with QEMU and libvirt Kashyap Chamarthy <[email protected]> Open Source Summit Edinburgh, 2018 1 / 38 Timeline of recent CPU flaws, 2018 (a) Jan 03 • Spectre v1: Bounds Check Bypass Jan 03 • Spectre v2: Branch Target Injection Jan 03 • Meltdown: Rogue Data Cache Load May 21 • Spectre-NG: Speculative Store Bypass Jun 21 • TLBleed: Side-channel attack over shared TLBs 2 / 38 Timeline of recent CPU flaws, 2018 (b) Jun 29 • NetSpectre: Side-channel attack over local network Jul 10 • Spectre-NG: Bounds Check Bypass Store Aug 14 • L1TF: "L1 Terminal Fault" ... • ? 3 / 38 Related talks in the ‘References’ section Out of scope: Internals of various side-channel attacks How to exploit Meltdown & Spectre variants Details of performance implications What this talk is not about 4 / 38 Related talks in the ‘References’ section What this talk is not about Out of scope: Internals of various side-channel attacks How to exploit Meltdown & Spectre variants Details of performance implications 4 / 38 What this talk is not about Out of scope: Internals of various side-channel attacks How to exploit Meltdown & Spectre variants Details of performance implications Related talks in the ‘References’ section 4 / 38 OpenStack, et al. libguestfs Virt Driver (guestfish) libvirtd QMP QMP QEMU QEMU VM1 VM2 Custom Disk1 Disk2 Appliance ioctl() KVM-based virtualization components Linux with KVM 5 / 38 OpenStack, et al. libguestfs Virt Driver (guestfish) libvirtd QMP QMP Custom Appliance KVM-based virtualization components QEMU QEMU VM1 VM2 Disk1 Disk2 ioctl() Linux with KVM 5 / 38 OpenStack, et al. libguestfs Virt Driver (guestfish) Custom Appliance KVM-based virtualization components libvirtd QMP QMP QEMU QEMU VM1 VM2 Disk1 Disk2 ioctl() Linux with KVM 5 / 38 libguestfs (guestfish) Custom Appliance KVM-based virtualization components OpenStack, et al. -
Fenwick Employment Brief
Fenwick Employment Brief December 10, 2008 Victor Schachter Editor 650.335.7905 Mary Wang Contributor 650.335.7154 planning a workforce reduction: a brief checklist In current economic times, more and more companies are turning to “reductions in force” or “RIFs.” While RIFs can provide both short and long-term economic benefits, they are also among the most difficult events an attorney or human resources professional must oversee because of the emotional and economic impact they will have on employees, the myriad of complex laws that must be observed, and the enormous amount of work that is usually required in a very short amount of time. Thoughtful and careful planning is important not only to ensure compliance with legal requirements, but also help to minimize the adverse effects of a workforce reduction, further reducing the risk of lawsuits. The following checklist provides some practical guidance to assist employers in implementing a reduction in force and to minimize legal risks. This checklist does not address all the possible issues arising from a RIF and we encourage you to consult with counsel as part of your planning and implementation of a RIF. planning and construction of a layoff n Identify triggering events for layoff n Identify possible layoff alternatives (e.g., pay cuts, schedule reductions, temporary shutdowns and vacation/PTO drawdown, reduction of contractor headcount) n Identify affected sites and estimate number of affected employees for WARN and other analyses n Establish the RIF management team: Identify the individuals -
AMD Athlonxp/Athlon/Duron Processor Based MAIN BOARD
All manuals and user guides at all-guides.com FN41 AMD AthlonXP/Athlon/Duron Processor Based MAIN BOARD all-guides.com All manuals and user guides at all-guides.com WARNING Thermal issue is highly essential for processors with a speed of 600MHz and above. Hence, we recommend you to use the CPU fan qualified by AMD or motherboard manufacturer. Meanwhile, please make sure CPU and fan are securely fastened well. Otherwise, improper fan installation not only gets system unstable but also could damage both CPU and motherboard because insufficient thermal dissipation. If you would like to know more about thermal topic please see AMD website for detailed thermal requirement through the address: http://www.amd.com/products/athlon/thermals http://www.amd.com/products/duron/thermals All manuals and user guides at all-guides.com Shuttle® FN41 Socket 462 AMD AthlonXP/Athlon/Duron Processor based DDR Mainboard Manual Version 1.0 Copyright Copyright© 2002 by Shuttle® Inc. All Rights Reserved. No part of this publication may be reproduced, transcribed, stored in a retrieval system, translated into any language, or transmitted in any form or by any means, electronic, mechanical, magnetic, optical, chemical, photocopying, manual, or otherwise, without prior written permission from Shuttle® Inc. Disclaimer Shuttle® Inc. shall not be liable for any incidental or consequential damages resulting from the performance or use of this product. This company makes no representations or warranties regarding the contents of this manual. Information in this manual has been carefully checked for reliability; however, no guarantee is given as to the correctness of the contents. -
AMD Firestream™ 9350 GPU Compute Accelerator
AMD FireStream™ 9350 GPU Compute Accelerator High Density Server GPU Acceleration The AMD FireStream™ 9350 GPU compute accelerator card offers industry- leading performance-per-watt in a highly dense, single-slot form factor. This AMD FireStream 9350 low-profile GPU card is designed for scalable high performance computing > Heterogeneous computing that (HPC) systems that require density and power efficiency. The AMD FireStream leverages AMD GPUs and x86 CPUs 9350 is ideal for a wide range of HPC applications across several industries > High performance per watt at 2.9 including Finance, Energy (Oil and Gas), Geosciences, Life Sciences, GFLOPS / Watt Manufacturing (CAE, CFD, etc.), Defense, and more. > Industry’s most dense server GPU card 1 Utilizing the multi-billion-transistor ASICs developed for AMD Radeon™ graphics > Low profile and passively cooled cards, AMD’s FireStream 9350 cards provide maximum performance-per-slot > Massively parallel, programmable GPU and are designed to meet demanding performance and reliability requirements architecture of HPC systems that can scale to thousands of nodes. AMD FireStream 9350 > Open standard OpenCL™ and cards include a single DisplayPort output. DirectCompute2 AMD FireStream 9350 cards can be used in scalable servers, blades, PCIe® > 2.0 TFLOPS, Single-Precision Peak chassis, and are available from many leading server OEMs and HPC solution > 400 GFLOPS, Double-Precision Peak providers. > 2GB GDDR5 memory Priced competitively, AMD FireStream GPUs offer unparalleled performance > Industry’s only Single-Slot PCIe® Accelerator and value for high performance computing. > PCI Express® 2.1 Compliant Note: For workstation and server > AMD Accelerated Parallel Processing installations that require active (APP) Technology SDK with OpenCL3 cooling, AMD FirePro™ Professional > 3-year planned availability; 3-year Graphics boards are software- limited warranty compatible and offer comparable features. -
AMD Firepro™Professional Graphics for CAD & Engineering and Media
AMD FirePro™Professional Graphics for CAD & Engineering and Media & Entertainment Performance at every price point. AMD FirePro professional graphics offer breakthrough capabilities that can help maximize productivity and help lower cost and complexity — giving you the edge you need in your business. Outstanding graphics performance, compute power and ultrahigh-resolution multidisplay capabilities allows broadcast, design and engineering professionals to work at a whole new level of detail, speed, responsiveness and creativity. AMD FireProTM W9100 AMD FireProTM W8100 With 16GB GDDR5 memory and the ability to support up to six 4K The new AMD FirePro W8100 workstation graphics card is based on displays via six Mini DisplayPort outputs,1 the AMD FirePro W9100 the AMD Graphics Core Next (GCN) GPU architecture and packs up graphics card is the ideal single-GPU solution for the next generation to 4.2 TFLOPS of compute power to accelerate your projects beyond of ultrahigh-resolution visualization environments. just graphics. AMD FireProTM W7100 AMD FireProTM W5100 The new AMD FirePro W7100 graphics card delivers 8GB The new AMD FirePro™ W5100 graphics card delivers optimized of memory, application performance and special features application and multidisplay performance for midrange users. that media and entertainment and design and engineering With 4GB of ultra-fast GDDR5 memory, users can tackle moderately professionals need to take their projects to the next level. complex models, assemblies, data sets or advanced visual effects with ease. AMD FireProTM W4100 AMD FireProTM W2100 In a class of its own, the AMD FirePro Professional graphics starts with AMD W4100 graphics card is the best choice FirePro W2100 graphics, delivering for entry-level users who need a boost in optimized and certified professional graphics performance to better address application performance that similarly- their evolving workflows. -
AMD EPYC™ 7371 Processors Accelerating HPC Innovation
AMD EPYC™ 7371 Processors Solution Brief Accelerating HPC Innovation March, 2019 AMD EPYC 7371 processors (16 core, 3.1GHz): Exceptional Memory Bandwidth AMD EPYC server processors deliver 8 channels of memory with support for up The right choice for HPC to 2TB of memory per processor. Designed from the ground up for a new generation of solutions, AMD EPYC™ 7371 processors (16 core, 3.1GHz) implement a philosophy of Standards Based AMD is committed to industry standards, choice without compromise. The AMD EPYC 7371 processor delivers offering you a choice in x86 processors outstanding frequency for applications sensitive to per-core with design innovations that target the performance such as those licensed on a per-core basis. evolving needs of modern datacenters. No Compromise Product Line Compute requirements are increasing, datacenter space is not. AMD EPYC server processors offer up to 32 cores and a consistent feature set across all processor models. Power HPC Workloads Tackle HPC workloads with leading performance and expandability. AMD EPYC 7371 processors are an excellent option when license costs Accelerate your workloads with up to dominate the overall solution cost. In these scenarios the performance- 33% more PCI Express® Gen 3 lanes. per-dollar of the overall solution is usually best with a CPU that can Optimize Productivity provide excellent per-core performance. Increase productivity with tools, resources, and communities to help you “code faster, faster code.” Boost AMD EPYC processors’ innovative architecture translates to tremendous application performance with Software performance. More importantly, the performance you’re paying for can Optimization Guides and Performance be matched to the appropriate to the performance you need. -
Penguin Computing Upgrades Corona with Latest AMD Radeon Instinct GPU Technology for Enhanced ML and AI Capabilities
Penguin Computing Upgrades Corona with latest AMD Radeon Instinct GPU Technology for Enhanced ML and AI Capabilities November 18, 2019 Fremont, CA., November 18, 2019 -Penguin Computing, a leader in high-performance computing (HPC), artificial intelligence (AI), and enterprise data center solutions and services, today announced that Corona, an HPC cluster first delivered to Lawrence Livermore National Lab (LLNL) in late 2018, has been upgraded with the newest AMD Radeon Instinct™ MI60 accelerators, based on Vega which, per AMD, is the World’s 1st 7nm GPU architecture that brings PCIe® 4.0 support. This upgrade is the latest example of Penguin Computing and LLNL’s ongoing collaboration aimed at providing additional capabilities to the LLNL user community. As previously released, the cluster consists of 170 two-socket nodes with 24-core AMD EPYCTM 7401 processors and a PCIe 1.6 Terabyte (TB) nonvolatile (solid-state) memory device. Each Corona compute node is GPU-ready with half of those nodes today utilizing four AMD Radeon Instinct MI25 accelerators per node, delivering 4.2 petaFLOPS of FP32 peak performance. With the MI60 upgrade, the cluster increases its potential PFLOPS peak performance to 9.45 petaFLOPS of FP32 peak performance. This brings significantly greater performance and AI capabilities to the research communities. “The Penguin Computing DOE team continues our collaborative venture with our vendor partners AMD and Mellanox to ensure the Livermore Corona GPU enhancements expand the capabilities to continue their mission outreach within various machine learning communities,” said Ken Gudenrath, Director of Federal Systems at Penguin Computing. Corona is being made available to industry through LLNL’s High Performance Computing Innovation Center (HPCIC). -
Motherboard Gigabyte Ga-A75n-Usb3
Socket AM3+ - AMD 990FX - GA-990FXA-UD5 (rev. 1.x) Socket AM3+ Pagina 1/3 GA- Model 990FXA- Motherboard UD5 PCB 1.x Since L2 L3Core System vendor CPU Model Frequency Process Stepping Wattage BIOS Name Cache Cache Bus(MT/s) Version AMD FX-8150 3600MHz 1MBx8 8MB Bulldozer 32nm B2 125W 5200 F5 AMD FX-8120 3100MHz 1MBx8 8MB Bulldozer 32nm B2 125W 5200 F5 AMD FX-8120 3100MHz 1MBx8 8MB Bulldozer 32nm B2 95W 5200 F5 AMD FX-8100 2800MHz 1MBx8 8MB Bulldozer 32nm B2 95W 5200 F5 AMD FX-6100 3300MHz 1MBx6 8MB Bulldozer 32nm B2 95W 5200 F5 AMD FX-4100 3600MHz 1MBx4 8MB Bulldozer 32nm B2 95W 5200 F5 Socket AM3 GA- Model 990FXA- Motherboard UD5 PCB 1.x Since L2 L3Core System vendor CPU Model Frequency Process Stepping Wattage BIOS Name Cache Cache Bus(MT/s) Version AMD Phenom II X6 1100T 3300MHz 512KBx6 6MB Thuban 45nm E0 125W 4000 F2 AMD Phenom II X6 1090T 3200MHz 512KBx6 6MB Thuban 45nm E0 125W 4000 F2 AMD Phenom II X6 1075T 3000MHz 512KBx6 6MB Thuban 45nm E0 125W 4000 F2 AMD Phenom II X6 1065T 2900MHz 512KBx6 6MB Thuban 45nm E0 95W 4000 F2 AMD Phenom II X6 1055T 2800MHz 512KBx6 6MB Thuban 45nm E0 125W 4000 F2 AMD Phenom II X6 1055T 2800MHz 512KBx6 6MB Thuban 45nm E0 95W 4000 F2 AMD Phenom II X6 1045T 2700MHz 512KBx6 6MB Thuban 45nm E0 95W 4000 F2 AMD Phenom II X6 1035T 2600MHz 512KBx6 6MB Thuban 45nm E0 95W 4000 F2 AMD Phenom II X4 980 3700MHz 512KBx4 6MB Deneb 45nm C3 125W 4000 F6 AMD Phenom II X4 975 3600MHz 512KBx4 6MB Deneb 45nm C3 125W 4000 F2 AMD Phenom II X4 970 3500MHz 512KBx4 6MB Deneb 45nm C3 125W 4000 F2 AMD Phenom II X4 965 3400MHz 512KBx4 -
Memorandum in Opposition to Hewlett-Packard Company's Motion to Quash Intel's Subpoena Duces Tecum
ORIGINAL UNITED STATES OF AMERICA BEFORE THE FEDERAL TRADE COMMISSION ) In the Matter of ) ) DOCKET NO. 9341 INTEL. CORPORATION, ) a corporation ) PUBLIC ) .' ) MEMORANDUM IN OPPOSITION TO HEWLETT -PACKARD COMPANY'S MOTION TO QUASH INTEL'S SUBPOENA DUCES TECUM Intel Corporation ("Intel") submits this memorandum in opposition to Hewlett-Packard Company's ("HP") motion to quash Intel's subpoena duces tecum issued on March 11,2010 ("Subpoena"). HP's motion should be denied, and it should be ordered to comply with Intel's Subpoena, as narrowed by Intel's April 19,2010 letter. Intel's Subpoena seeks documents necessary to defend against Complaint Counsel's broad allegations and claimed relief. The Complaint alleges that Intel engaged in unfair business practices that maintained its monopoly over central processing units ("CPUs") and threatened to give it a monopoly over graphics processing units ("GPUs"). See CompI. iiii 2-28. Complaint Counsel's Interrogatory Answers state that it views HP, the world's largest manufacturer of personal computers, as a centerpiece of its case. See, e.g., Complaint Counsel's Resp. and Obj. to Respondent's First Set ofInterrogatories Nos. 7-8 (attached as Exhibit A). Complaint Counsel intends to call eight HP witnesses at trial on topics crossing virtually all of HP' s business lines, including its purchases ofCPUs for its commercial desktop, commercial notebook, and server businesses. See Complaint Counsel's May 5, 2010 Revised Preliminary Witness List (attached as Exhibit B). Complaint Counsel may also call HP witnesses on other topics, including its PUBLIC FTC Docket No. 9341 Memorandum in Opposition to Hewlett-Packard Company's Motion to Quash Intel's Subpoena Duces Tecum USIDOCS 7544743\'1 assessment and purchases of GPUs and chipsets and evaluation of compilers, benchmarks, interface standards, and standard-setting bodies. -
Amd Athlon Ii X2 270 Manual
Amd Athlon Ii X2 270 Manual Specifications. Please visit AMD Athlon II X2 215 (rev. C3) and AMD Athlon II X2 270 pages for more detailed specifications. Review, Differences, Benchmarks, Specifications, Comments Athlon II X2 270. CPUBoss recommends the AMD Athlon II X2 270 based on its. See full details. Specifications. Please visit AMD Athlon II X2 270 and AMD Athlon II X2 280 pages for more detailed specifications of both. Far Cry 4 on AMD Athlon x2 340(Dual Core) 4GB RAM HD 6570 PC Specifications. Specifications. Please visit AMD Athlon II X2 270 and AMD FX-6300 pages for more detailed specifications of both. AMD Athlon II x2 260 (3.2GHz) Although the specifications of this cpu list 74C as the max temp, i prefer to stick to the old "65C max" rule-of-thumb for amd cpus. Amd Athlon Ii X2 270 Manual Read/Download AMD Athlon II X2 270u. 2 GHz, Dual core. Front view of AMD Athlon II X2 270u. 5.9 Out of 10. VS Review, Differences, Benchmarks, Specifications, Comments. Photos of the AMD Athlon II X2 270 Black Edition from the KitGuru Price Comparison Engine. Specifications. Please visit AMD Athlon II X2 270 and AMD FX-4300 pages for more detailed specifications of both. SPECIFICATIONS : Model : AMD Athlon II X2 270. CPU Clock Speed : 3.4 GHz. Core : 2. Total L2 Cache : 2 MB Sockets : Socket AM2+,Socket AM3 Supported. up vote -5 down vote favorite. These are my specifications: AMD Athlon II x2 270 CPU, AMD 760g GPU, 4GB RAM. grand-theft-auto-5. -
Survey and Benchmarking of Machine Learning Accelerators
1 Survey and Benchmarking of Machine Learning Accelerators Albert Reuther, Peter Michaleas, Michael Jones, Vijay Gadepally, Siddharth Samsi, and Jeremy Kepner MIT Lincoln Laboratory Supercomputing Center Lexington, MA, USA freuther,pmichaleas,michael.jones,vijayg,sid,[email protected] Abstract—Advances in multicore processors and accelerators components play a major role in the success or failure of an have opened the flood gates to greater exploration and application AI system. of machine learning techniques to a variety of applications. These advances, along with breakdowns of several trends including Moore’s Law, have prompted an explosion of processors and accelerators that promise even greater computational and ma- chine learning capabilities. These processors and accelerators are coming in many forms, from CPUs and GPUs to ASICs, FPGAs, and dataflow accelerators. This paper surveys the current state of these processors and accelerators that have been publicly announced with performance and power consumption numbers. The performance and power values are plotted on a scatter graph and a number of dimensions and observations from the trends on this plot are discussed and analyzed. For instance, there are interesting trends in the plot regarding power consumption, numerical precision, and inference versus training. We then select and benchmark two commercially- available low size, weight, and power (SWaP) accelerators as these processors are the most interesting for embedded and Fig. 1. Canonical AI architecture consists of sensors, data conditioning, mobile machine learning inference applications that are most algorithms, modern computing, robust AI, human-machine teaming, and users (missions). Each step is critical in developing end-to-end AI applications and applicable to the DoD and other SWaP constrained users. -
2018 Annual Report on Form 10-K
2018 ANNUAL REPORT ON FORM 10-K MARCH 2019 DEAR SHAREHOLDERS: From the industry’s first 1GHz CPU to the world’s first GPU delivering a teraflop of computing power, AMD has always stood for pushing the boundaries of what is possible. A few years ago, we made several big bets to accelerate our pace of innovation, strengthen our execution, and enable AMD to deliver a leadership portfolio of computing and graphics processors capable of increasing our share of the $75 billion high-performance computing market. In 2018, we saw those bets begin to pay off as we delivered our second straight year of greater than 20% annual revenue growth and significantly improved our gross margin and profitability from the previous year. REVENUE GROSS MARGIN % R&D INVESTMENT EXPENSE/REVENUE % $ Billions $ Billions $6.5B 38% $1.43B 34% $5.3B 34% 33% $4.3B $1.20B 23% $1.01B 31% 2016 2017 2018 2016 2017 2018 2016 2017 2018 2016 2017 2018 Added $2.2B in revenue Significantly improved gross Increased R&D by more than Significant improvement over the last 2 years margin over last 2 years based 40% over the last 2 years in OPEX leverage on new product portfolio Our newest Ryzen™, EPYC™ and datacenter GPU products contributed more than $1.2 billion of revenue in 2018 and helped us gain share across our priority markets. In 2018, we added 3.9% points of desktop processor unit share, 5.3% points of notebook processor unit share and met our goal of exiting the year with mid-single digit server processor market share.