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Design of On-Chip Bus of Heterogeneous 3DIC Micro-Processors (Under the Direction of Dr

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Design of On-Chip Bus of Heterogeneous 3DIC Micro-Processors (Under the Direction of Dr ABSTRACT ZHENQIAN, ZHANG. Design of On-chip Bus of Heterogeneous 3DIC Micro-processors (Under the direction of Dr. Paul D. Franzon). The three-dimensional integrated circuit (3DIC) addresses the challenges of interconnect scaling, which is a substantial performance factor of the system-on-chip as the advancement of silicon technologies, by stacking designs in vertical direction. The logic-on-logic stacking reveals promising prospects on improving the integration and energy consumption of the processor-centric system. However, obstacles such as the cross-tier synchronization and the topology of backbone bus in deep 3D integration are still to be studied well. This dissertation describes two bus applications that are uniquely motivated by the benefits of dense bonding pitch of 3DIC techniques. Firstly, the Face-to-face bus is proposed aiming to establish fast thread migration between micro-processor cores on adjacent physical tiers. Compared with the available solution of thread migration such as ARM big-LITTLE, the fast thread migration largely mitigates the migration overhead, and helps achieve a shorter migration interval by bypassing the transfer latency of memory hierarchy. To solve the challenge of clock-domain-crossing, a structure named as teleport-register-file featuring clock gating and switching is introduced. Compared with the existing synchronization approaches, the teleport-register-file is further customized to meet the characteristic of thread migration, resulting in the anticipated saving of area from 19% - 50%. The proposed bus is implemented in the 130 nm two-tier 3D tape-out. The energy consumption is measured as 0.12- 0.23 pJ / bit based on the post-layout results, and the bus throughput is 539 Gbps / mm2. Secondly, the Face-to-back bus is presented featuring post-silicon-stacking, which expands the methodology of reusable IP to reusable dies. The post-silicon-stacking shows great potential to facilitate the time from design to production substantially, by mitigating the efforts in back-end design and validation, and providing full scalability of stacked dies. To solve the challenges of arbitration, a modular arbitration unit, featuring a mix of local pre-arbitration and global token ring handshaking is introduced, which shows satisfactory arbitrating efficiency and bus utilization rate as the increment of serving components. An experiment containing four logical tiers is implemented in the 130 nm two-tier tape-out, and the performance is evaluated in various configurations using a BIST structure to feed vectors. Further, the timing verification of the available 3D physical design flow is investigated, featuring the 3D clock tree balance and stack level static timing analysis, both of which are friendly to the 2D development platform. The proposed procedure of clock tree synthesis considers the cross-tier skews, and covers the mismatch by adjusting the topology of local clock tree and inserting delay elements. Moreover, the static timing analysis in the stack level is introduced to judge the timing metrics of the routed layouts and measure the scenario of inter-tier variation. This is important as the design is done with a 2D place and route tool that is not aware of inter-tier variations. Analysis results prove that the implemented two-tier stack passes the timing checks with the applied enhancements. © Copyright 2016 Zhenqian Zhang All Rights Reserved Design of On-chip Bus of Heterogeneous 3DIC Micro-processors by Zhenqian Zhang A dissertation submitted to the Graduate Faculty of North Carolina State University in partial fulfillment of the requirements for the degree of Doctor of Philosophy Electrical Engineering Raleigh, North Carolina 2016 APPROVED BY: ———————————————— ———————————————— Dr. Paul D. Franzon Dr. William R. Davis Committee Chair ———————————————— ———————————————— Dr. Eric Rotenberg Dr. Min Kang DEDICATION This dissertation is dedicated to my parents, for their endless love and support. ii BIOGRAPHY Zhenqian Zhang was born on 29th August 1987 in Harbin, China. He received his Bachelor’s degree in physics from Jilin University in June 2010, and his Master’s degree in electrical engineering from North Carolina State University in May 2012. He started his graduate research work with Dr. Paul D. Franzon in September 2011. His research interests include methodology of reconfigurable on-chip interconnect and techniques of 3DIC physical design. He is a student member of IEEE. iii ACKNOWLEDGMENTS First, I would like to express my most sincere gratitude to my advisor, Dr. Paul Franzon for his continuous support of my Ph.D. research. His motivation, immense knowledge, and encouragement are the most valuable assets in my academic journey. In addition, I would like to thank my committee members, Dr. Rhett Davis, Dr. Eric Rotenberg, and Dr. Min Kang for their insightful advice and their great patience during the research work. I want to thank Intel Corporation for the sponsorship of the H3 project, and especially Dr. Tanay Karnik for his guidance through teleconferences. Moreover, I would like to convey my great appreciation to Dr. Krishnendu Chakrabarty, Brandon Noia, and Sergej Deutsch at the Duke University for their coordination in the development of BIST structure. I would like to specially thank Dr. Steve Lipa for his invaluable help on physical design and chip test. His professionalism deserves my utmost admiration. I would never forget the illustrative discussions and the good time I had with all my colleagues and friends at the North Carolina State University: Zhuo Yan (a special thank you for your help after the fire accident in 2013 and our enjoyable moments as roommates), Shivam Priyadarshi, Jianchen Hu, Randy Widialaksono, Joshua Schabel, Weifu Li, Wenxu Zhao, Weiyi Qi, Gary Charles, Jong Beom Park, Ataul Karim, John Forbes, Rangeen Chowdhury and Brandon Dwiel. Most of all, I would like to thank my parents, as well as Chen Cui, for their endless love and support during this amazing adventure. This dissertation would not have been possible without them. iv TABLE OF CONTENTS LIST OF TABLES ................................................................................................................ vii LIST OF FIGURES .............................................................................................................. viii Introduction ............................................................................................................ 1 1.1. Motivation ................................................................................................................ 1 1.2. Contribution ............................................................................................................. 3 1.3. Organization ............................................................................................................. 4 Backgrounds ........................................................................................................... 6 2.1. Fast thread migration of heterogeneous multi-core processors ................................ 6 2.2. Clock-domain-crossing ............................................................................................ 9 2.3. Solution of scalable 3D backbone interconnect ..................................................... 11 2.3.1. 3D network-on-chip and crossbar ............................................................... 11 2.3.2. Shared bus ................................................................................................... 13 Face-to-face bus for fast thread migration of heterogeneous micro-processors ... 18 3.1. Research objective .................................................................................................. 18 3.2. System overview .................................................................................................... 19 3.3. Controller of the Face-to-face bus .......................................................................... 22 3.3.1. Handshaking protocol ................................................................................. 24 3.4. Clock-gated teleport-register-file ........................................................................... 25 3.4.1. Static timing analysis .................................................................................. 27 3.5. Results .................................................................................................................... 35 3.6. Summary ................................................................................................................ 41 Face-to-back multiple parallel shared bus for post-silicon-stacking .................... 42 4.1. Research Objective ................................................................................................. 42 4.2. System Overview ................................................................................................... 43 4.3. Modular arbitration unit ......................................................................................... 45 4.3.1. Token ring logic .......................................................................................... 45 4.3.2. Local pre-arbitration unit ............................................................................ 48 4.4. Data Interfaces ........................................................................................................ 49 4.5. Built-in self-testing masters and slaves .................................................................. 55 4.6. Results ...................................................................................................................
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