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PICMG COM Express Carrier Design Guide

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PICMG COM Express Carrier Design Guide COM Express® Carrier Design Guide Guidelines for designing COM Express® Carrier Boards December 6, 2013 Rev. 2.0 This design guide is not a specification. It contains additional detail information but does not replace the PICMG COM Express® (COM.0) specification. For complete guidelines on the design of COM Express® compliant Carrier Boards and systems, refer also to the full specification – do not use this design guide as the only reference for any design decisions. This design guide is to be used in conjunction with COM.0 R2.1. PICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 2013 1/218 © Copyright 2013, PCI Industrial Computer Manufacturers Group. The attention of adopters is directed to the possibility that compliance with or adoption of PICMG® specifications may require use of an invention covered by patent rights. PICMG® shall not be responsible for identifying patents for which a license may be required by any PICMG® specification or for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG® specifications are prospective and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents. NOTICE: The information contained in this document is subject to change without notice. The material in this document details a PICMG® specification in accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this specification in any company's products. WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG® MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR OWNERSHIP, IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE. In no event shall PICMG® be liable for errors contained herein or for indirect, incidental, special, consequential, reliance or cover damages, including loss of profits, revenue, data or use, incurred by any user or any third party. Compliance with this specification does not absolve manufacturers of equipment from the requirements of safety and regulatory agencies (UL, CSA, FCC, IEC, etc.). IMPORTANT NOTICE: This document includes references to specifications, standards or other material not created by PICMG. Such referenced materials will typically have been created by organizations that operate under IPR policies with terms that vary widely, and under process controls with varying degrees of strictness and efficacy. PICMG has not made any enquiry into the nature or effectiveness of any such policies, processes or controls, and therefore ANY USE OF REFERENCED MATERIALS IS ENTIRELY AT THE RISK OF THE USER. Users should therefore make such investigations regarding referenced materials, and the organizations that have created them, as they deem appropriate. PICMG®, CompactPCI®, AdvancedTCA®, AdvancedTCA® 300,ATCA®, ATCA® 300, AdvancedMC®, CompactPCI® Express, COM Express®, MicroTCA®, SHB Express®, and the PICMG, CompactPCI, AdvancedTCA, µTCA and ATCA logos are registered trademarks, and xTCA™, IRTM™ and the IRTM logo are trademarks of the PCI Industrial Computer Manufacturers Group. All other brand or product names may be trademarks or registered trademarks of their respective holders. PICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 2013 2/218 Contents 1. Preface..................................................................................................................................8 1.1. About This Document...........................................................................................................8 1.2. Intended Audience................................................................................................................8 1.3. No special word usage.........................................................................................................8 1.4. No statements of compliance..............................................................................................8 1.5. Correctness Disclaimer........................................................................................................8 1.6. Name and logo usage...........................................................................................................9 1.7. Intellectual property............................................................................................................10 1.8. Acronyms, Abbreviations and Definitions Used...............................................................11 1.9. Signal Table Terminology...................................................................................................14 1.10. Schematic Conventions......................................................................................................15 2. COM Express Interfaces....................................................................................................16 2.1. COM Express Signals.........................................................................................................16 2.1.1. Connector Pin-out Comparison.......................................................................................20 2.2. PCIe General Introduction..................................................................................................30 2.2.1. COM Express A-B Connector and C-D Connector PCIe Groups....................................30 2.3. General Purpose PCIe Lanes.............................................................................................31 2.3.1. General Purpose PCIe Signal Definitions.......................................................................31 2.3.2. PCI Express Lane Configurations – Per COM Express Spec.........................................32 2.3.3. PCI Express Lane Configurations – Module and Chipset Dependencies.......................32 2.3.4. Device Up / Device Down and PCIe Rx / Tx Coupling Capacitors..................................33 2.3.5. Schematic Examples.......................................................................................................34 2.3.6. PCI Express Routing Considerations..............................................................................47 2.4. PEG (PCI Express Graphics)..............................................................................................48 2.4.1. Signal Definitions.............................................................................................................48 2.4.2. PEG Configuration...........................................................................................................49 2.4.3. Reference Schematics.....................................................................................................52 2.4.4. Routing Considerations...................................................................................................53 2.5. Digital Display Interfaces....................................................................................................55 2.5.1. DisplayPort / HDMI / DVI ................................................................................................55 2.5.2. SDVO...............................................................................................................................61 2.6. Mobile PCI Express Module (MXM)....................................................................................66 2.6.1. Signal Definitions.............................................................................................................66 2.6.2. Reference Schematics.....................................................................................................68 2.6.3. Routing Considerations...................................................................................................69 2.7. LAN.......................................................................................................................................70 2.7.1. Signal Definitions.............................................................................................................70 2.7.2. Reference Schematics.....................................................................................................73 2.7.3. Routing Considerations...................................................................................................75 2.8. USB Ports............................................................................................................................76 2.8.1. Signal Definitions.............................................................................................................76 2.8.2. Reference Schematics.....................................................................................................77 2.8.3. Avoiding Back-driving Problems......................................................................................80 PICMG® COM Express® Carrier Board Design Guide Rev. 2.0 / December 6, 2013 3/218 2.8.4. Routing Considerations...................................................................................................80 2.9. USB 3.0................................................................................................................................81 2.9.1. Signal Definitions.............................................................................................................81 2.9.2. Reference Schematics.....................................................................................................84
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