Material Declaration Data Sheet RMCS0201 (Formerly RMCS 1/20)

Sulfur Resistant Thick Film Chip Resistor

Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 0.1500

Material Material PPM Material % of BOM Item BOM Item % of BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) Component Ceramic Substrate aluminum oxide 1344-28-1 0.1182 788,160 96.00% silicon oxide 14808-60-7 0.0037 24,630 3.00% 0.1232 82.10% magnesium oxide 1309-48-4 0.0012 8,210 1.00%

Inner termination - top side silver 7440-22-4 0.0025 16,425 75.00% palladium 7440-05-3 0.00016 1,095 5.00% 0.0033 2.19% terpineol 8000-41-7 0.0007 4,380 20.00%

Inner termination - bottom side silver 7440-22-4 0.0008 5,665 55.00% copper oxide 1317-38-0 0.0002 1,030 10.00% butyl carbitol 112-34-5 0.0003 2,060 20.00% 0.0015 1.03% terpineol 8000-41-7 0.0002 1,545 15.00%

Resistive element ruthenium oxide 12036-10-1 0.0005 3,000 25.00% terpineol 8000-41-7 0.0005 3,000 25.00% lead borosilicate glass undefined 0.0005 3,600 30.00% 0.0018 1.20% silver 7440-22-4 0.0004 2,400 20.00%

Pre-coat frits 65997-18-4 0.0006 4,200 70.00% butyl carbitol acetate 124-17-4 0.0002 1,500 25.00% resin 9004-57-3 0.0000 240 4.00% 0.0009 0.60% chromium oxide 1308-38-9 0.00001 60 1.00%

Over-coat resin 9004-57-3 0.0010 6,450 30.00% carbon black 1333-86-4 0.0002 1,075 5.00% silicon dioxide 60676-86-0 0.0015 9,675 45.00% 0.0032 2.15% butyl carbitol 112-34-5 0.0006 4,300 20.00%

Middle termination layer nickel 7440-02-0 0.0080 53,400 100.00% 0.0080 5.34% Side termination nickel 7440-02-0 0.00004 275 55.00% chromium 7440-47-3 0.00003 225 45.00% 0.0001 0.05%

Outer termination layer tin 7440-31-5 0.0080 53,400 100.00% 0.0080 5.34% Total Weight 0.1500

Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate. Material Declaration Data Sheet RMCS0402 (Formerly RMCS 1/16S)

Sulfur Resistant Thick Film Chip Resistor

Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 0.6196

Material Material PPM Material % of BOM Item BOM Item % of BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) Component Ceramic Substrate aluminum oxide 1344-28-1 0.4884 788,160 96.00% silicon oxide 14808-60-7 0.0153 24,630 3.00% 0.5087 82.10% magnesium oxide 1309-48-4 0.0051 8,210 1.00%

Inner termination - top side silver 7440-22-4 0.0102 16,425 75.00% palladium 7440-05-3 0.00068 1,095 5.00% 0.0136 2.19% terpineol 8000-41-7 0.0027 4,380 20.00%

Inner termination - bottom side silver 7440-22-4 0.0035 5,665 55.00% copper oxide 1317-38-0 0.0006 1,030 10.00% butyl carbitol 112-34-5 0.0013 2,060 20.00% 0.0064 1.03% terpineol 8000-41-7 0.0010 1,545 15.00%

Resistive element ruthenium oxide 12036-10-1 0.0019 3,000 25.00% terpineol 8000-41-7 0.0019 3,000 25.00% lead borosilicate glass undefined 0.0022 3,600 30.00% 0.0074 1.20% silver 7440-22-4 0.0015 2,400 20.00%

Pre-coat frits 65997-18-4 0.0026 4,200 70.00% butyl carbitol acetate 124-17-4 0.0009 1,500 25.00% resin 9004-57-3 0.0001 240 4.00% 0.0037 0.60% chromium oxide 1308-38-9 0.00004 60 1.00%

Over-coat resin 9004-57-3 0.0040 6,450 30.00% carbon black 1333-86-4 0.0007 1,075 5.00% silicon dioxide 60676-86-0 0.0060 9,675 45.00% 0.0133 2.15% butyl carbitol 112-34-5 0.0027 4,300 20.00%

Middle termination layer nickel 7440-02-0 0.0331 53,400 100.00% 0.0331 5.34% Side termination nickel 7440-02-0 0.00017 275 55.00% chromium 7440-47-3 0.00014 225 45.00% 0.0003 0.05%

Outer termination layer tin 7440-31-5 0.0331 53,400 100.00% 0.0331 5.34% Total Weight 0.6196

Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate. Material Declaration Data Sheet RMCS0603 (Formerly RMCS 1/16)

Sulfur Resistant Thick Film Chip Resistor

Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 2.0422

Material Material PPM Material % of BOM Item BOM Item % BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) of Component Ceramic Substrate aluminum oxide 1344-28-1 1.7393 851,712 96.00% silicon oxide 14808-60-7 0.0544 26,616 3.00% 1.8118 88.72% magnesium oxide 1309-48-4 0.0181 8,872 1.00%

Inner termination - top side silver 7440-22-4 0.0185 9,075 75.00% palladium 7440-05-3 0.00124 605 5.00% 0.0247 1.21% terpineol 8000-41-7 0.0049 2,420 20.00%

Inner termination - bottom side silver 7440-22-4 0.0031 1,540 55.00% copper oxide 1317-38-0 0.0006 280 10.00% butyl carbitol 112-34-5 0.0011 560 20.00% 0.0057 0.28% terpineol 8000-41-7 0.0009 420 15.00%

Resistive element ruthenium oxide 12036-10-1 0.0034 1,675 25.00% terpineol 8000-41-7 0.0034 1,675 25.00% lead borosilicate glass undefined 0.0041 2,010 30.00% 0.0137 0.67% silver 7440-22-4 0.0027 1,340 20.00%

Pre-coat frits 65997-18-4 0.0053 2,590 70.00% butyl carbitol acetate 124-17-4 0.0019 925 25.00% resin 9004-57-3 0.0003 148 4.00% 0.0076 0.37% chromium oxide 1308-38-9 0.00008 37 1.00%

Over-coat resin 9004-57-3 0.0083 4,080 30.00% carbon black 1333-86-4 0.0014 680 5.00% silicon dioxide 60676-86-0 0.0125 6,120 45.00% 0.0278 1.36% butyl carbitol 112-34-5 0.0056 2,720 20.00%

Middle termination layer nickel 7440-02-0 0.0741 36,300 100.00% 0.0741 3.63% Side termination nickel 7440-02-0 0.00034 165 55.00% chromium 7440-47-3 0.00028 135 45.00% 0.0006 0.03%

Outer termination layer tin 7440-31-5 0.0741 36,300 100.00% 0.0741 3.63% Marking resin 9003-57-3 0.0016 800 80.00% pigment 13463-67-7 0.0004 200 20.00% 0.0020 0.10%

Total Weight 2.0422

Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate. Material Declaration Data Sheet RMCS0805 (Formerly RMCS 1/10)

Sulfur Resistant Thick Film Chip Resistor

Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 4.3676

Material Material PPM Material % of BOM Item BOM Item % BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) of Component Ceramic Substrate aluminum oxide 1344-28-1 3.7246 852,768 96.00% silicon oxide 14808-60-7 0.1164 26,649 3.00% 3.8798 88.83% magnesium oxide 1309-48-4 0.0388 8,883 1.00%

Inner termination - top side silver 7440-22-4 0.0511 11,700 75.00% palladium 7440-05-3 0.00341 780 5.00% 0.0681 1.56% terpineol 8000-41-7 0.0136 3,120 20.00%

Inner termination - bottom side silver 7440-22-4 0.0098 2,255 55.00% copper oxide 1317-38-0 0.0018 410 10.00% butyl carbitol 112-34-5 0.0036 820 20.00% 0.0179 0.41% terpineol 8000-41-7 0.0027 615 15.00%

Resistive element ruthenium oxide 12036-10-1 0.0072 1,650 25.00% terpineol 8000-41-7 0.0072 1,650 25.00% lead borosilicate glass undefined 0.0086 1,980 30.00% 0.0288 0.66% silver 7440-22-4 0.0058 1,320 20.00%

Pre-coat frits 65997-18-4 0.0086 1,960 70.00% butyl carbitol acetate 124-17-4 0.0031 700 25.00% resin 9004-57-3 0.0005 112 4.00% 0.0122 0.28% chromium oxide 1308-38-9 0.00012 28 1.00%

Over-coat resin 9004-57-3 0.0162 3,720 30.00% carbon black 1333-86-4 0.0027 620 5.00% silicon dioxide 60676-86-0 0.0244 5,580 45.00% 0.0542 1.24% butyl carbitol 112-34-5 0.0108 2,480 20.00%

Middle termination layer nickel 7440-02-0 0.1520 34,800 100.00% 0.1520 3.48% Side termination nickel 7440-02-0 0.00048 110 55.00% chromium 7440-47-3 0.00039 90 45.00% 0.0009 0.02%

Outer termination layer tin 7440-31-5 0.1520 34,800 100.00% 0.1520 3.48% Marking resin 9003-57-3 0.0014 320 80.00% pigment 13463-67-7 0.0003 80 20.00% 0.0017 0.04%

Total Weight 4.3676

Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate. Material Declaration Data Sheet RMCS1206 (Formerly RMCS 1/8)

Sulfur Resistant Thick Film Chip Resistor

Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 8.9465

Material Material PPM Material % of BOM Item BOM Item % BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) of Component Ceramic Substrate aluminum oxide 1344-28-1 7.8157 873,600 96.00% silicon oxide 14808-60-7 0.2442 27,300 3.00% 8.1413 91.00% magnesium oxide 1309-48-4 0.0814 9,100 1.00%

Inner termination - top side silver 7440-22-4 0.0604 6,750 75.00% palladium 7440-05-3 0.00403 450 5.00% 0.0805 0.90% terpineol 8000-41-7 0.0161 1,800 20.00%

Inner termination - bottom side silver 7440-22-4 0.0197 2,200 55.00% copper oxide 1317-38-0 0.0036 400 10.00% butyl carbitol 112-34-5 0.0072 800 20.00% 0.0358 0.40% terpineol 8000-41-7 0.0054 600 15.00%

Resistive element ruthenium oxide 12036-10-1 0.0188 2,100 25.00% terpineol 8000-41-7 0.0188 2,100 25.00% lead borosilicate glass undefined 0.0225 2,520 30.00% 0.0752 0.84% silver 7440-22-4 0.0150 1,680 20.00%

Pre-coat frits 65997-18-4 0.0288 3,220 70.00% butyl carbitol acetate 124-17-4 0.0103 1,150 25.00% resin 9004-57-3 0.0016 184 4.00% 0.0412 0.46% chromium oxide 1308-38-9 0.00041 46 1.00%

Over-coat resin 9004-57-3 0.0301 3,360 30.00% carbon black 1333-86-4 0.0050 560 5.00% silicon dioxide 60676-86-0 0.0451 5,040 45.00% 0.1002 1.12% butyl carbitol 112-34-5 0.0200 2,240 20.00%

Middle termination layer nickel 7440-02-0 0.2335 26,100 100.00% 0.2335 2.61% Side termination nickel 7440-02-0 0.00098 110 55.00% chromium 7440-47-3 0.00081 90 45.00% 0.0018 0.02%

Outer termination layer tin 7440-31-5 0.2335 26,100 100.00% 0.2335 2.61% Marking resin 9003-57-3 0.0029 320 80.00% pigment 13463-67-7 0.0007 80 20.00% 0.0036 0.04%

Total Weight 8.9465

Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate. Material Declaration Data Sheet RMCS1210 (Formerly RMCS 1/4)

Sulfur Resistant Thick Film Chip Resistor

Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 15.9589

Material Material PPM Material % of BOM Item BOM Item % BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) of Component Ceramic Substrate aluminum oxide 1344-28-1 13.4760 844,416 96.00% silicon oxide 14808-60-7 0.4211 26,388 3.00% 14.0375 87.96% magnesium oxide 1309-48-4 0.1404 8,796 1.00%

Inner termination - top side silver 7440-22-4 0.1903 11,925 75.00% palladium 7440-05-3 0.01269 795 5.00% 0.2537 1.59% terpineol 8000-41-7 0.0507 3,180 20.00%

Inner termination - bottom side silver 7440-22-4 0.0448 2,805 55.00% copper oxide 1317-38-0 0.0081 510 10.00% butyl carbitol 112-34-5 0.0163 1,020 20.00% 0.0814 0.51% terpineol 8000-41-7 0.0122 765 15.00%

Resistive element ruthenium oxide 12036-10-1 0.0403 2,525 25.00% terpineol 8000-41-7 0.0403 2,525 25.00% lead borosilicate glass undefined 0.0484 3,030 30.00% 0.1612 1.01% silver 7440-22-4 0.0322 2,020 20.00%

Pre-coat frits 65997-18-4 0.0603 3,780 70.00% butyl carbitol acetate 124-17-4 0.0215 1,350 25.00% resin 9004-57-3 0.0034 216 4.00% 0.0862 0.54% chromium oxide 1308-38-9 0.00086 54 1.00%

Over-coat resin 9004-57-3 0.0536 3,360 30.00% carbon black 1333-86-4 0.0089 560 5.00% silicon dioxide 60676-86-0 0.0804 5,040 45.00% 0.1787 1.12% butyl carbitol 112-34-5 0.0357 2,240 20.00%

Middle termination layer nickel 7440-02-0 0.4628 29,000 100.00% 0.4628 2.90% Side termination nickel 7440-02-0 0.12464 7,810 55.00% chromium 7440-47-3 0.10198 6,390 45.00% 0.2266 1.42%

Outer termination layer tin 7440-31-5 0.4628 29,000 100.00% 0.4628 2.90% Marking resin 9003-57-3 0.0064 400 80.00% pigment 13463-67-7 0.0016 100 20.00% 0.0080 0.05%

Total Weight 15.9589

Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate. Material Declaration Data Sheet RMCS2010 (Formerly RMCS 1/2)

Sulfur Resistant Thick Film Chip Resistor

Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 24.2409

Material Material PPM Material % of BOM Item BOM Item % BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) of Component Ceramic Substrate aluminum oxide 1344-28-1 21.0023 866,400 96.00% silicon oxide 14808-60-7 0.6563 27,075 3.00% 21.8774 90.25% magnesium oxide 1309-48-4 0.2188 9,025 1.00%

Inner termination - top side silver 7440-22-4 0.2163 8,925 75.00% palladium 7440-05-3 0.01442 595 5.00% 0.2885 1.19% terpineol 8000-41-7 0.0577 2,380 20.00%

Inner termination - bottom side silver 7440-22-4 0.0440 1,815 55.00% copper oxide 1317-38-0 0.0080 330 10.00% butyl carbitol 112-34-5 0.0160 660 20.00% 0.0800 0.33% terpineol 8000-41-7 0.0120 495 15.00%

Resistive element ruthenium oxide 12036-10-1 0.0758 3,125 25.00% terpineol 8000-41-7 0.0758 3,125 25.00% lead borosilicate glass undefined 0.0909 3,750 30.00% 0.3030 1.25% silver 7440-22-4 0.0606 2,500 20.00%

Pre-coat frits 65997-18-4 0.1442 5,950 70.00% butyl carbitol acetate 124-17-4 0.0515 2,125 25.00% resin 9004-57-3 0.0082 340 4.00% 0.2060 0.85% chromium oxide 1308-38-9 0.00206 85 1.00%

Over-coat resin 9004-57-3 0.0909 3,750 30.00% carbon black 1333-86-4 0.0152 625 5.00% silicon dioxide 60676-86-0 0.1364 5,625 45.00% 0.3030 1.25% butyl carbitol 112-34-5 0.0606 2,500 20.00%

Middle termination layer nickel 7440-02-0 0.4751 19,600 100.00% 0.4751 1.96% Side termination nickel 7440-02-0 0.12399 5,115 55.00% chromium 7440-47-3 0.10145 4,185 45.00% 0.2254 0.93%

Outer termination layer tin 7440-31-5 0.4751 19,600 100.00% 0.4751 1.96% Marking resin 9003-57-3 0.0058 240 80.00% pigment 13463-67-7 0.0015 60 20.00% 0.0073 0.03%

Total Weight 24.2409

Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate. Material Declaration Data Sheet RMCS2512 (Formerly RMCS 1)

Sulfur Resistant Thick Film Chip Resistor

Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 39.4485

Material Material PPM Material % of BOM Item BOM Item % BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) of Component Ceramic Substrate aluminum oxide 1344-28-1 34.4432 873,120 96.00% silicon oxide 14808-60-7 1.0764 27,285 3.00% 35.8784 90.95% magnesium oxide 1309-48-4 0.3588 9,095 1.00%

Inner termination - top side silver 7440-22-4 0.3402 8,625 75.00% palladium 7440-05-3 0.02268 575 5.00% 0.4537 1.15% terpineol 8000-41-7 0.0907 2,300 20.00%

Inner termination - bottom side silver 7440-22-4 0.0564 1,430 55.00% copper oxide 1317-38-0 0.0103 260 10.00% butyl carbitol 112-34-5 0.0205 520 20.00% 0.1026 0.26% terpineol 8000-41-7 0.0154 390 15.00%

Resistive element ruthenium oxide 12036-10-1 0.1440 3,650 25.00% terpineol 8000-41-7 0.1440 3,650 25.00% lead borosilicate glass undefined 0.1728 4,380 30.00% 0.5759 1.46% silver 7440-22-4 0.1152 2,920 20.00%

Pre-coat frits 65997-18-4 0.2596 6,580 70.00% butyl carbitol acetate 124-17-4 0.0927 2,350 25.00% resin 9004-57-3 0.0148 376 4.00% 0.3708 0.94% chromium oxide 1308-38-9 0.00371 94 1.00%

Over-coat resin 9004-57-3 0.1621 4,110 30.00% carbon black 1333-86-4 0.0270 685 5.00% silicon dioxide 60676-86-0 0.2432 6,165 45.00% 0.5404 1.37% butyl carbitol 112-34-5 0.1081 2,740 20.00%

Middle termination layer nickel 7440-02-0 0.6075 15,400 100.00% 0.6075 1.54% Side termination nickel 7440-02-0 0.16489 4,180 55.00% chromium 7440-47-3 0.13491 3,420 45.00% 0.2998 0.76%

Outer termination layer tin 7440-31-5 0.6075 15,400 100.00% 0.6075 1.54% Marking resin 9003-57-3 0.0095 240 80.00% pigment 13463-67-7 0.0024 60 20.00% 0.0118 0.03%

Total Weight 39.4485

Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate.