Material Declaration Data Sheet RMCS0201 (Formerly RMCS 1/20) Sulfur Resistant Thick Film Chip Resistor Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 0.1500 Material Material PPM Material % of BOM Item BOM Item % of BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) Component Ceramic Substrate aluminum oxide 1344-28-1 0.1182 788,160 96.00% silicon oxide 14808-60-7 0.0037 24,630 3.00% 0.1232 82.10% magnesium oxide 1309-48-4 0.0012 8,210 1.00% Inner termination - top side silver 7440-22-4 0.0025 16,425 75.00% palladium 7440-05-3 0.00016 1,095 5.00% 0.0033 2.19% terpineol 8000-41-7 0.0007 4,380 20.00% Inner termination - bottom side silver 7440-22-4 0.0008 5,665 55.00% copper oxide 1317-38-0 0.0002 1,030 10.00% butyl carbitol 112-34-5 0.0003 2,060 20.00% 0.0015 1.03% terpineol 8000-41-7 0.0002 1,545 15.00% Resistive element ruthenium oxide 12036-10-1 0.0005 3,000 25.00% terpineol 8000-41-7 0.0005 3,000 25.00% lead borosilicate glass undefined 0.0005 3,600 30.00% 0.0018 1.20% silver 7440-22-4 0.0004 2,400 20.00% Pre-coat frits 65997-18-4 0.0006 4,200 70.00% butyl carbitol acetate 124-17-4 0.0002 1,500 25.00% resin 9004-57-3 0.0000 240 4.00% 0.0009 0.60% chromium oxide 1308-38-9 0.00001 60 1.00% Over-coat resin 9004-57-3 0.0010 6,450 30.00% carbon black 1333-86-4 0.0002 1,075 5.00% silicon dioxide 60676-86-0 0.0015 9,675 45.00% 0.0032 2.15% butyl carbitol 112-34-5 0.0006 4,300 20.00% Middle termination layer nickel 7440-02-0 0.0080 53,400 100.00% 0.0080 5.34% Side termination nickel 7440-02-0 0.00004 275 55.00% chromium 7440-47-3 0.00003 225 45.00% 0.0001 0.05% Outer termination layer tin 7440-31-5 0.0080 53,400 100.00% 0.0080 5.34% Total Weight 0.1500 Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate. Material Declaration Data Sheet RMCS0402 (Formerly RMCS 1/16S) Sulfur Resistant Thick Film Chip Resistor Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 0.6196 Material Material PPM Material % of BOM Item BOM Item % of BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) Component Ceramic Substrate aluminum oxide 1344-28-1 0.4884 788,160 96.00% silicon oxide 14808-60-7 0.0153 24,630 3.00% 0.5087 82.10% magnesium oxide 1309-48-4 0.0051 8,210 1.00% Inner termination - top side silver 7440-22-4 0.0102 16,425 75.00% palladium 7440-05-3 0.00068 1,095 5.00% 0.0136 2.19% terpineol 8000-41-7 0.0027 4,380 20.00% Inner termination - bottom side silver 7440-22-4 0.0035 5,665 55.00% copper oxide 1317-38-0 0.0006 1,030 10.00% butyl carbitol 112-34-5 0.0013 2,060 20.00% 0.0064 1.03% terpineol 8000-41-7 0.0010 1,545 15.00% Resistive element ruthenium oxide 12036-10-1 0.0019 3,000 25.00% terpineol 8000-41-7 0.0019 3,000 25.00% lead borosilicate glass undefined 0.0022 3,600 30.00% 0.0074 1.20% silver 7440-22-4 0.0015 2,400 20.00% Pre-coat frits 65997-18-4 0.0026 4,200 70.00% butyl carbitol acetate 124-17-4 0.0009 1,500 25.00% resin 9004-57-3 0.0001 240 4.00% 0.0037 0.60% chromium oxide 1308-38-9 0.00004 60 1.00% Over-coat resin 9004-57-3 0.0040 6,450 30.00% carbon black 1333-86-4 0.0007 1,075 5.00% silicon dioxide 60676-86-0 0.0060 9,675 45.00% 0.0133 2.15% butyl carbitol 112-34-5 0.0027 4,300 20.00% Middle termination layer nickel 7440-02-0 0.0331 53,400 100.00% 0.0331 5.34% Side termination nickel 7440-02-0 0.00017 275 55.00% chromium 7440-47-3 0.00014 225 45.00% 0.0003 0.05% Outer termination layer tin 7440-31-5 0.0331 53,400 100.00% 0.0331 5.34% Total Weight 0.6196 Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate. Material Declaration Data Sheet RMCS0603 (Formerly RMCS 1/16) Sulfur Resistant Thick Film Chip Resistor Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 2.0422 Material Material PPM Material % of BOM Item BOM Item % BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) of Component Ceramic Substrate aluminum oxide 1344-28-1 1.7393 851,712 96.00% silicon oxide 14808-60-7 0.0544 26,616 3.00% 1.8118 88.72% magnesium oxide 1309-48-4 0.0181 8,872 1.00% Inner termination - top side silver 7440-22-4 0.0185 9,075 75.00% palladium 7440-05-3 0.00124 605 5.00% 0.0247 1.21% terpineol 8000-41-7 0.0049 2,420 20.00% Inner termination - bottom side silver 7440-22-4 0.0031 1,540 55.00% copper oxide 1317-38-0 0.0006 280 10.00% butyl carbitol 112-34-5 0.0011 560 20.00% 0.0057 0.28% terpineol 8000-41-7 0.0009 420 15.00% Resistive element ruthenium oxide 12036-10-1 0.0034 1,675 25.00% terpineol 8000-41-7 0.0034 1,675 25.00% lead borosilicate glass undefined 0.0041 2,010 30.00% 0.0137 0.67% silver 7440-22-4 0.0027 1,340 20.00% Pre-coat frits 65997-18-4 0.0053 2,590 70.00% butyl carbitol acetate 124-17-4 0.0019 925 25.00% resin 9004-57-3 0.0003 148 4.00% 0.0076 0.37% chromium oxide 1308-38-9 0.00008 37 1.00% Over-coat resin 9004-57-3 0.0083 4,080 30.00% carbon black 1333-86-4 0.0014 680 5.00% silicon dioxide 60676-86-0 0.0125 6,120 45.00% 0.0278 1.36% butyl carbitol 112-34-5 0.0056 2,720 20.00% Middle termination layer nickel 7440-02-0 0.0741 36,300 100.00% 0.0741 3.63% Side termination nickel 7440-02-0 0.00034 165 55.00% chromium 7440-47-3 0.00028 135 45.00% 0.0006 0.03% Outer termination layer tin 7440-31-5 0.0741 36,300 100.00% 0.0741 3.63% Marking resin 9003-57-3 0.0016 800 80.00% pigment 13463-67-7 0.0004 200 20.00% 0.0020 0.10% Total Weight 2.0422 Note: Lead oxide contained in glass frit is part of the thick film formulations. This lead content is covered by exemption 7c-I of the Directive Annex ("… electronic components containing lead in a glass…"). Weights are approximate. Material Declaration Data Sheet RMCS0805 (Formerly RMCS 1/10) Sulfur Resistant Thick Film Chip Resistor Date: September 14, 2016 Max Temp: 260°C (Contact factory for detailed soldering recommendations.) Component Weight (mg): 4.3676 Material Material PPM Material % of BOM Item BOM Item % BOM Item Material CAS Number Weight (mg) of Component BOM Item Weight (mg) of Component Ceramic Substrate aluminum oxide 1344-28-1 3.7246 852,768 96.00% silicon oxide 14808-60-7 0.1164 26,649 3.00% 3.8798 88.83% magnesium oxide 1309-48-4 0.0388 8,883 1.00% Inner termination - top side silver 7440-22-4 0.0511 11,700 75.00% palladium 7440-05-3 0.00341 780 5.00% 0.0681 1.56% terpineol 8000-41-7 0.0136 3,120 20.00% Inner termination - bottom side silver 7440-22-4 0.0098 2,255 55.00% copper oxide 1317-38-0 0.0018 410 10.00% butyl carbitol 112-34-5 0.0036 820 20.00% 0.0179 0.41% terpineol 8000-41-7 0.0027 615 15.00% Resistive element ruthenium oxide 12036-10-1 0.0072 1,650 25.00% terpineol 8000-41-7 0.0072 1,650 25.00% lead borosilicate glass undefined 0.0086 1,980 30.00% 0.0288 0.66% silver 7440-22-4 0.0058 1,320 20.00% Pre-coat frits 65997-18-4 0.0086 1,960 70.00% butyl carbitol acetate 124-17-4 0.0031 700 25.00% resin 9004-57-3 0.0005 112 4.00% 0.0122 0.28% chromium oxide 1308-38-9 0.00012 28 1.00% Over-coat resin 9004-57-3 0.0162 3,720 30.00% carbon black 1333-86-4 0.0027 620 5.00% silicon dioxide 60676-86-0 0.0244 5,580 45.00% 0.0542 1.24% butyl carbitol 112-34-5 0.0108 2,480 20.00% Middle termination layer nickel 7440-02-0 0.1520 34,800 100.00% 0.1520 3.48% Side termination nickel 7440-02-0 0.00048 110 55.00% chromium 7440-47-3 0.00039 90 45.00% 0.0009 0.02% Outer termination layer tin 7440-31-5 0.1520 34,800 100.00% 0.1520 3.48% Marking resin 9003-57-3 0.0014 320 80.00% pigment 13463-67-7 0.0003 80 20.00% 0.0017 0.04% Total Weight 4.3676 Note: Lead oxide contained in glass frit is part of the thick film formulations.