Introduction to High Performance Computers
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The Central Processing Unit(CPU). the Brain of Any Computer System Is the CPU
Computer Fundamentals 1'stage Lec. (8 ) College of Computer Technology Dept.Information Networks The central processing unit(CPU). The brain of any computer system is the CPU. It controls the functioning of the other units and process the data. The CPU is sometimes called the processor, or in the personal computer field called “microprocessor”. It is a single integrated circuit that contains all the electronics needed to execute a program. The processor calculates (add, multiplies and so on), performs logical operations (compares numbers and make decisions), and controls the transfer of data among devices. The processor acts as the controller of all actions or services provided by the system. Processor actions are synchronized to its clock input. A clock signal consists of clock cycles. The time to complete a clock cycle is called the clock period. Normally, we use the clock frequency, which is the inverse of the clock period, to specify the clock. The clock frequency is measured in Hertz, which represents one cycle/second. Hertz is abbreviated as Hz. Usually, we use mega Hertz (MHz) and giga Hertz (GHz) as in 1.8 GHz Pentium. The processor can be thought of as executing the following cycle forever: 1. Fetch an instruction from the memory, 2. Decode the instruction (i.e., determine the instruction type), 3. Execute the instruction (i.e., perform the action specified by the instruction). Execution of an instruction involves fetching any required operands, performing the specified operation, and writing the results back. This process is often referred to as the fetch- execute cycle, or simply the execution cycle. -
Three-Dimensional Integrated Circuit Design: EDA, Design And
Integrated Circuits and Systems Series Editor Anantha Chandrakasan, Massachusetts Institute of Technology Cambridge, Massachusetts For other titles published in this series, go to http://www.springer.com/series/7236 Yuan Xie · Jason Cong · Sachin Sapatnekar Editors Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 123 Editors Yuan Xie Jason Cong Department of Computer Science and Department of Computer Science Engineering University of California, Los Angeles Pennsylvania State University [email protected] [email protected] Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota [email protected] ISBN 978-1-4419-0783-7 e-ISBN 978-1-4419-0784-4 DOI 10.1007/978-1-4419-0784-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939282 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Foreword We live in a time of great change. -
The Intel Microprocessors: Architecture, Programming and Interfacing Introduction to the Microprocessor and Computer
Microprocessors (0630371) Fall 2010/2011 – Lecture Notes # 1 The Intel Microprocessors: Architecture, Programming and Interfacing Introduction to the Microprocessor and computer Outline of the Lecture Evolution of programming languages. Microcomputer Architecture. Instruction Execution Cycle. Evolution of programming languages: Machine language - the programmer had to remember the machine codes for various operations, and had to remember the locations of the data in the main memory like: 0101 0011 0111… Assembly Language - an instruction is an easy –to- remember form called a mnemonic code . Example: Assembly Language Machine Language Load 100100 ADD 100101 SUB 100011 We need a program called an assembler that translates the assembly language instructions into machine language. High-level languages Fortran, Cobol, Pascal, C++, C# and java. We need a compiler to translate instructions written in high-level languages into machine code. Microprocessor-based system (Micro computer) Architecture Data Bus, I/O bus Memory Storage I/O I/O Registers Unit Device Device Central Processing Unit #1 #2 (CPU ) ALU CU Clock Control Unit Address Bus The figure shows the main components of a microprocessor-based system: CPU- Central Processing Unit , where calculations and logic operations are done. CPU contains registers , a high-frequency clock , a control unit ( CU ) and an arithmetic logic unit ( ALU ). o Clock : synchronizes the internal operations of the CPU with other system components using clock pulsing at a constant rate (the basic unit of time for machine instructions is a machine cycle or clock cycle) One cycle A machine instruction requires at least one clock cycle some instruction require 50 clocks. o Control Unit (CU) - generate the needed control signals to coordinate the sequencing of steps involved in executing machine instructions: (fetches data and instructions and decodes addresses for the ALU). -
Multimedia Systems DCAP303
Multimedia Systems DCAP303 MULTIMEDIA SYSTEMS Copyright © 2013 Rajneesh Agrawal All rights reserved Produced & Printed by EXCEL BOOKS PRIVATE LIMITED A-45, Naraina, Phase-I, New Delhi-110028 for Lovely Professional University Phagwara CONTENTS Unit 1: Multimedia 1 Unit 2: Text 15 Unit 3: Sound 38 Unit 4: Image 60 Unit 5: Video 102 Unit 6: Hardware 130 Unit 7: Multimedia Software Tools 165 Unit 8: Fundamental of Animations 178 Unit 9: Working with Animation 197 Unit 10: 3D Modelling and Animation Tools 213 Unit 11: Compression 233 Unit 12: Image Format 247 Unit 13: Multimedia Tools for WWW 266 Unit 14: Designing for World Wide Web 279 SYLLABUS Multimedia Systems Objectives: To impart the skills needed to develop multimedia applications. Students will learn: z how to combine different media on a web application, z various audio and video formats, z multimedia software tools that helps in developing multimedia application. Sr. No. Topics 1. Multimedia: Meaning and its usage, Stages of a Multimedia Project & Multimedia Skills required in a team 2. Text: Fonts & Faces, Using Text in Multimedia, Font Editing & Design Tools, Hypermedia & Hypertext. 3. Sound: Multimedia System Sounds, Digital Audio, MIDI Audio, Audio File Formats, MIDI vs Digital Audio, Audio CD Playback. Audio Recording. Voice Recognition & Response. 4. Images: Still Images – Bitmaps, Vector Drawing, 3D Drawing & rendering, Natural Light & Colors, Computerized Colors, Color Palletes, Image File Formats, Macintosh & Windows Formats, Cross – Platform format. 5. Animation: Principle of Animations. Animation Techniques, Animation File Formats. 6. Video: How Video Works, Broadcast Video Standards: NTSC, PAL, SECAM, ATSC DTV, Analog Video, Digital Video, Digital Video Standards – ATSC, DVB, ISDB, Video recording & Shooting Videos, Video Editing, Optimizing Video files for CD-ROM, Digital display standards. -
MAT 253 Operating Manual - Rev
MAT 253 OPERATING MANUAL Issue 04/2002 Ident. No. 114 9090 Thermo Finnigan MAT GmbH Postfach 1401 62 28088 Bremen Germany Reparatur-Begleitkarte*) Repair-Covering Letter Absender: Geräte-Type: Despachter: Instrument Type: __________________________________ _________________________________ __________________________________ Service-Nr.: Service No Sie erhalten zur Reparatur unter unserer Bestell-Nr.: You receive for repair under our order no.: Festgestellte Mängel oder deren Auswirkung: Established defect or its effect: Bitte detaillierte Angaben machen / Please specify in detail Ein Austauschteil haben wir erhalten unter Kommissions-Nr.: An exchange part already received with commission no.: Ja/Yes Nein/No Die Anlage ist außer Funktion The system is out of function Ja/Yes Nein/No Durch die nachfolgende Unterschrift By signing this document I am/ we are certifying bestätige(n) ich /wir, daß die o.g. Teile frei von that the a. m. parts are free from hazardous gesundheitsschädlichen Stoffen sind, bzw. vor materials. In case the parts have been used for ihrer Einsendung an Thermo Finnigan MAT the analysis of hazardous substances I/we dekontaminiert wurden, falls die Teile mit attest that the parts have been decontaminated giftigen Stoffen in Verbindung gekommen sind. before sending them to Thermo Finnigan MAT. __________________________________ _________________________________ Datum / date Unterschrift / signature *) Bitte vollständig ausfüllen / Please fill in completely MAT 253 O P E R A T I N G M A N U A L TABLE OF CONTENTS 1 GETTING -
Computer Organization & Architecture Eie
COMPUTER ORGANIZATION & ARCHITECTURE EIE 411 Course Lecturer: Engr Banji Adedayo. Reg COREN. The characteristics of different computers vary considerably from category to category. Computers for data processing activities have different features than those with scientific features. Even computers configured within the same application area have variations in design. Computer architecture is the science of integrating those components to achieve a level of functionality and performance. It is logical organization or designs of the hardware that make up the computer system. The internal organization of a digital system is defined by the sequence of micro operations it performs on the data stored in its registers. The internal structure of a MICRO-PROCESSOR is called its architecture and includes the number lay out and functionality of registers, memory cell, decoders, controllers and clocks. HISTORY OF COMPUTER HARDWARE The first use of the word ‘Computer’ was recorded in 1613, referring to a person who carried out calculation or computation. A brief History: Computer as we all know 2day had its beginning with 19th century English Mathematics Professor named Chales Babage. He designed the analytical engine and it was this design that the basic frame work of the computer of today are based on. 1st Generation 1937-1946 The first electronic digital computer was built by Dr John V. Atanasoff & Berry Cliford (ABC). In 1943 an electronic computer named colossus was built for military. 1946 – The first general purpose digital computer- the Electronic Numerical Integrator and computer (ENIAC) was built. This computer weighed 30 tons and had 18,000 vacuum tubes which were used for processing. -
Lecture Notes
Lecture #4-5: Computer Hardware (Overview and CPUs) CS106E Spring 2018, Young In these lectures, we begin our three-lecture exploration of Computer Hardware. We start by looking at the different types of computer components and how they interact during basic computer operations. Next, we focus specifically on the CPU (Central Processing Unit). We take a look at the Machine Language of the CPU and discover it’s really quite primitive. We explore how Compilers and Interpreters allow us to go from the High-Level Languages we are used to programming to the Low-Level machine language actually used by the CPU. Most modern CPUs are multicore. We take a look at when multicore provides big advantages and when it doesn’t. We also take a short look at Graphics Processing Units (GPUs) and what they might be used for. We end by taking a look at Reduced Instruction Set Computing (RISC) and Complex Instruction Set Computing (CISC). Stanford President John Hennessy won the Turing Award (Computer Science’s equivalent of the Nobel Prize) for his work on RISC computing. Hardware and Software: Hardware refers to the physical components of a computer. Software refers to the programs or instructions that run on the physical computer. - We can entirely change the software on a computer, without changing the hardware and it will transform how the computer works. I can take an Apple MacBook for example, remove the Apple Software and install Microsoft Windows, and I now have a Window’s computer. - In the next two lectures we will focus entirely on Hardware. -
Recommendation to Handle Bare Dies
Recommendation to handle bare dies Rev. 1.3 General description This application note gives recommendations on how to handle bare dies* in Chip On Board (COB), Chip On Glass (COG) and flip chip technologies. Bare dies should not be handled as chips in a package. This document highlights some specific effects which could harm the quality and yield of the production. *separated piece(s) of semiconductor wafer that constitute(s) a discrete semiconductor or whole integrated circuit. International Electrotechnical Commission, IEC 62258-1, ed. 1.0 (2005-08). A dedicated vacuum pick up tool is used to manually move the die. Figure 1: Vacuum pick up tool and wrist-strap for ESD protection Delivery Forms Bare dies are delivered in the following forms: Figure 2: Unsawn wafer Application Note – Ref : APN001HBD1.3 FBC-0002-01 1 Recommendation to handle bare dies Rev. 1.3 Figure 3: Unsawn wafer in open wafer box for multi-wafer or single wafer The wafer is sawn. So please refer to the E-mapping file from wafer test (format: SINF, eg4k …) for good dies information, especially when it is picked from metal Film Frame Carrier (FFC). Figure 4: Wafer on Film Frame Carrier (FFC) Figure 5: Die on tape reel Figure 6: Waffle pack for bare die Application Note – Ref : APN001HBD1.3 FBC-0002-01 2 Recommendation to handle bare dies Rev. 1.3 Die Handling Bare die must be handled always in a class 1000 (ISO 6) clean room environment: unpacking and inspection, die bonding, wire bonding, molding, sealing. Handling must be reduced to the absolute minimum, un-necessary inspections or repacking tasks have to be avoided (assembled devices do not need to be handled in a clean room environment since the product is already well packed) Use of complete packing units (waffle pack, FFC, tape and reel) is recommended and remaining quantities have to be repacked immediately after any process (e.g. -
Lessons Learned in Deploying the World's Largest Scale Lustre File
Lessons Learned in Deploying the World’s Largest Scale Lustre File System Galen M. Shipman, David A. Dillow, Sarp Oral, Feiyi Wang, Douglas Fuller, Jason Hill, Zhe Zhang Oak Ridge Leadership Computing Facility, Oak Ridge National Laboratory Oak Ridge, TN 37831, USA fgshipman,dillowda,oralhs,fwang2,fullerdj,hilljj,[email protected] Abstract 1 Introduction The Spider system at the Oak Ridge National Labo- The Oak Ridge Leadership Computing Facility ratory’s Leadership Computing Facility (OLCF) is the (OLCF) at Oak Ridge National Laboratory (ORNL) world’s largest scale Lustre parallel file system. Envi- hosts the world’s most powerful supercomputer, sioned as a shared parallel file system capable of de- Jaguar [2, 14, 7], a 2.332 Petaflop/s Cray XT5 [5]. livering both the bandwidth and capacity requirements OLCF also hosts an array of other computational re- of the OLCF’s diverse computational environment, the sources such as a 263 Teraflop/s Cray XT4 [1], visual- project had a number of ambitious goals. To support the ization, and application development platforms. Each of workloads of the OLCF’s diverse computational plat- these systems requires a reliable, high-performance and forms, the aggregate performance and storage capacity scalable file system for data storage. of Spider exceed that of our previously deployed systems Parallel file systems on leadership-class systems have by a factor of 6x - 240 GB/sec, and 17x - 10 Petabytes, traditionally been tightly coupled to single simulation respectively. Furthermore, Spider supports over 26,000 platforms. This approach had resulted in the deploy- clients concurrently accessing the file system, which ex- ment of a dedicated file system for each computational ceeds our previously deployed systems by nearly 4x. -
From Sand to Circuits
From sand to circuits By continually advancing silicon technology and moving the industry forward, we help empower people to do more. To enhance their knowledge. To strengthen their connections. To change the world. How Intel makes integrated circuit chips www.intel.com www.intel.com/museum Copyright © 2005Intel Corporation. All rights reserved. Intel, the Intel logo, Celeron, i386, i486, Intel Xeon, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. 0605/TSM/LAI/HP/XK 308301-001US From sand to circuits Revolutionary They are small, about the size of a fingernail. Yet tiny silicon chips like the Intel® Pentium® 4 processor that you see here are changing the way people live, work, and play. This Intel® Pentium® 4 processor contains more than 50 million transistors. Today, silicon chips are everywhere — powering the Internet, enabling a revolution in mobile computing, automating factories, enhancing cell phones, and enriching home entertainment. Silicon is at the heart of an ever expanding, increasingly connected digital world. The task of making chips like these is no small feat. Intel’s manufacturing technology — the most advanced in the world — builds individual circuit lines 1,000 times thinner than a human hair on these slivers of silicon. The most sophisticated chip, a microprocessor, can contain hundreds of millions or even billions of transistors interconnected by fine wires made of copper. Each transistor acts as an on/off switch, controlling the flow of electricity through the chip to send, receive, and process information in a fraction of a second. -
Titan: a New Leadership Computer for Science
Titan: A New Leadership Computer for Science Presented to: DOE Advanced Scientific Computing Advisory Committee November 1, 2011 Arthur S. Bland OLCF Project Director Office of Science Statement of Mission Need • Increase the computational resources of the Leadership Computing Facilities by 20-40 petaflops • INCITE program is oversubscribed • Programmatic requirements for leadership computing continue to grow • Needed to avoid an unacceptable gap between the needs of the science programs and the available resources • Approved: Raymond Orbach January 9, 2009 • The OLCF-3 project comes out of this requirement 2 ASCAC – Nov. 1, 2011 Arthur Bland INCITE is 2.5 to 3.5 times oversubscribed 2007 2008 2009 2010 2011 2012 3 ASCAC – Nov. 1, 2011 Arthur Bland What is OLCF-3 • The next phase of the Leadership Computing Facility program at ORNL • An upgrade of Jaguar from 2.3 Petaflops (peak) today to between 10 and 20 PF by the end of 2012 with operations in 2013 • Built with Cray’s newest XK6 compute blades • When completed, the new system will be called Titan 4 ASCAC – Nov. 1, 2011 Arthur Bland Cray XK6 Compute Node XK6 Compute Node Characteristics AMD Opteron 6200 “Interlagos” 16 core processor @ 2.2GHz Tesla M2090 “Fermi” @ 665 GF with 6GB GDDR5 memory Host Memory 32GB 1600 MHz DDR3 Gemini High Speed Interconnect Upgradeable to NVIDIA’s next generation “Kepler” processor in 2012 Four compute nodes per XK6 blade. 24 blades per rack 5 ASCAC – Nov. 1, 2011 Arthur Bland ORNL’s “Titan” System • Upgrade of existing Jaguar Cray XT5 • Cray Linux Environment -
Audio Card User’S Manual E3859 Second Edition V2 April 2008
Xonar DX Audio Card User’s manual E3859 Second Edition V2 April 2008 Copyright © 2008 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). Product warranty or service will not be extended if: (1) the product is repaired, modified or altered, unless such repair, modification of alteration is authorized in writing by ASUS; or (2) the serial number of the product is defaced or missing. ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE), EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN THIS MANUAL OR PRODUCT. SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE, AND SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO RESPONSIBILITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT.