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OLED MODULE SPECIFICATION

Model : MI6432AO-W

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Approved

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Revision 1.0 Engineering Date 2013-04-07

Our Reference MODULE NO.: MI6432AO-W Ver 1.0

REVISION RECORD REV NO. REV DATE CONTENTS REMARKS

1.0 2013-04-07 Initial Release

MULTI-INNO TECHNOLOGY CO.,LTD. P.2 MODULE NO.: MI6432AO-W Ver 1.0

CONTENT

 PHYSICAL DATA

 EXTERNAL DIMENSIONS

 ABSOLUTE MAXIMUM RATINGS

 ELECTRICAL CHARACTERISTICS

 FUNCTIONAL SPECIFICATION AND APPLICATION CIRCUIT

 ELECTRO-OPTICAL CHARACTERISTICS

 INTERFACE PIN CONNECTIONS

 RELIABILITY TESTS

 OUTGOING QUALITY CONTROL SPECIFICATION

 CAUTIONS IN USING OLED MODULE

MULTI-INNO TECHNOLOGY CO.,LTD. P.3 MODULE NO.: MI6432AO-W Ver 1.0

„ PHYSICAL DATA

No. Items Specification Unit 1 Display Mode Passive Matrix OLED - 2 Display ColorMonochrome (White) - 3 Duty 1/32 - 4 Resolution 64 (W)x 32(H) Active Area 11.18 (W) x 5.58 (H) mm 2 6 Outline Dimension 14.50 (W) x 11.60 (H) x 1.28 (D) mm 3 7 Dot Pitch 0.175 (W) x 0.175 (H) mm 2 8 Dot Size 0.155 (W) x 0.155 (H) mm 2 9 Aperture Rate 78 % 10 Driver IC SSD1306Z - 11 Interface I2C -

12 Weight 0.42f10% g

MULTI-INNO TECHNOLOGY CO.,LTD. P.4 MODULE NO.: MI6432AO-W Ver 1.0

„ EXTERNAL DIMENSIONS

MULTI-INNO TECHNOLOGY CO.,LTD. P.5 MODULE NO.: MI6432AO-W Ver 1.0

„ ABSOLUTE MAXIMUM RATINGS

ITEM SYMBOL MIN MAX UNIT REMARK IC maximum VDD -0.3 4.0 V rating Supply Voltage IC maximum VBAT -0.3 5.0 V rating IC maximum OLED Operating Voltage VCC 0 16 V rating Operating Temp. Top -40 70 ć - Storage Temp Tstg -40 85 ć - Operation life time - TBD - hrs -

Note 1: All the above voltages are on the basis of "V SS = 0V". Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur.Also,for normal operations,it is desirable to use this module under the conditions according to electro-optical characteristics .If this module is used beyond these co- nditions,malfunctioning of the module can occur and the reliability of the module may deterio- rate. ° Note 3: VCC = 7.25V, Ta = 25 C, 50% Checkerboard. Software configuration follows Actual Application Example . End of lifetime is specified as 50% of initial brightness reached.The average operating lifetime at room temperature is estimated by the accelerated operation at high temperature conditions.

„ ELECTRICAL CHARACTERISTICS DC Characteristics

TEST ITEM SYMBOL MIN TYPE MAX UNIT CONDITION 22±3 C, Logic Supply Voltage VDD q 1.65 2.8 3.3 V 55±15%R.H OLED Driver Supply Voltage 22±3 C, VCC q 7.0 7.25 7.5 (Supplied Externally) 55±15%R.H 22±3 C, Supply Voltage for DC/DC VBAT q 3.3 3.7 4.2 55±15%R.H OLED Driver Supply Voltage 22±3 C, VCC q 7.0 7.25 7.5 V (Generated by Internal DC/DC) 55±15%R.H

High-level Input Voltage VIH - 0.8hVDD - - V

Low-level Input Voltage VIL - - - 0.2hVDD V

High-level Output Voltage VOH - 0.9hVDD - - V

Low-level Output Voltage VOL - - - 0.1hVDD V

Note : The VCC input must be kept in a stable value; ripple and noise are not allowed.

MULTI-INNO TECHNOLOGY CO.,LTD. P.6 MODULE NO.: MI6432AO-W Ver 1.0

ƹ AC Characteristics I²Cnterface Timing Characteristics (VDD - VSS = 1.65V to 3.3V, TA = 25°C)

I²C interface characteristics

MULTI-INNO TECHNOLOGY CO.,LTD. P.7 MODULE NO.: MI6432AO-W Ver 1.0

„ FUNCTIONAL SPECIFICATION AND APPLICATION CIRCUIT 1. Power ON and Power OFF Sequence Power ON Sequence: 1. Power ON VDD (4) 2. After VDD become stable, set RES# pin LOW (logic low) for at least 3us (t1 ) and then HIGH (logic high). (1) 3. After set RES# pin LOW (logic low), wait for at least 3us (t2). Then Power ON VCC .

4. After VCC become stable, send command AFh for display ON. SEG/COM will be ON after 100ms (t AF).

Power OFF Sequence: 1. Send command AEh for display OFF. 2. Power OFF VCC(1) (2) (3). (5) 3. Power OFF VDD after tOFF. (Typical tOFF=100ms)

Note: (1)Since an ESD protection circuit is connected between VDD and VCC, VCC becomes lower than VDD whenever VDD is ON and VCC is OFF as shown in the dotted line of VCC in above figures. (2) VCC should be kept float (disable) when it is OFF. (3) Power Pins(VDD, VCC) can never be pulled to ground under any circumstance. (4) The register values are reset after t1. (5) VDD should not be Power OFF before VCC Power OFF.

MULTI-INNO TECHNOLOGY CO.,LTD. P.8 MODULE NO.: MI6432AO-W Ver 1.0

2. Application Circuit 1) Application Example of M00930 with Internal and I²C mode.

VDD 00930 C1 1 C2P 2 C2N C2 3 R2 R3 C1P 4 C1N VBAT 5 VBAT 6 VBREF(NC) 7 VSS VDD 8 VDD RES# 9 RES# SCL 10 SCL SDA 11 SDA 12 IREF 13 VCOMH 14 VCC

R1 C3 C4 C5 C6

GND

Pin connected to MCU interface: SCL, SDA, RES# Under Internal DC/DC Mode, the Charge Pump Setting(8Dh) must be set as follow: 8Dh: Charge Pump Setting 14h; Enable Charge Pump

Recommended components C3,C5,C6: 4.7ȝF/16V.ROHS (Tantalum ) C1,C2,C4: 1uF-0603-X7R±10%.RoHS R1: 0603 1/10W +/-5% 390Kohm.RoHS R2,R3: 0603 1/10W +/-5% 10Kohm.RoHS

MULTI-INNO TECHNOLOGY CO.,LTD. P.9 MODULE NO.: MI6432AO-W Ver 1.0

2) Application Example of M00930 with External VCC and I²C mode.

00930 1 C2P 2 C2N VDD 3 C1P 4 C1N 5 VBAT 6 R2 R3 VBREF(NC) 7 VSS VDD 8 VDD RES# 9 RES# SCL 10 SCL SDA 11 SDA 12 IREF 13 VCOMH VCC 14 VCC

R1 C1 C2 C3

GND

Pin connected to MCU interface: SCL, SDA, RES# C1P, C1N, C2P, C2N,VBAT should be left open.

Under external VCC Mode, the Charge Pump Setting(8Dh) must be set as follow: 8Dh: Charge Pump Setting 10h; Disable Charge Pump

Recommended components C2,C3: 4.7ȝF/16V.ROHS (Tantalum Capacitors) C1: 1uF-0603-X7R±10%.RoHS R1: 0603 1/10W +/-5% 390Kohm.RoHS R2,R3: 0603 1/10W +/-5% 10Kohm.RoHS

3. Display Control Instruction Refer to SSD1306 IC Specification. 4. Recommended Software Initialization TBD

MULTI-INNO TECHNOLOGY CO.,LTD. P.10

MODULE NO.: MI6432AO-W Ver 1.0

 ELECTRO-OPTICAL CHARACTERISTICS (Ta=25)

TEST ITEM SYMBOL MIN TYPE MAX UNIT CONDITION 2 Normal Mode Brightness Lbr All pixels ON(1) TBD TBD - cd/m VDD=1.65V~3.3V, VCC = 7V~15V ICC,Sleep mode Current ICC,SLEEP - - 10 uA Display OFF, No panel attached VDD=1.65V~3.3V, VCC = 7V~15V IDD,Sleep mode Current IDD,SLEEP - - 10 uA Display OFF, No panel attached Normal Mode Power Consumption(VCC Supplied Pt=(ICC*VCC) All pixels ON(1) - TBD TBD mW Externally) Normal Mode Power Consumption (V CC Generated Pt=(IBAT*VBAT) All pixels ON(1) TBD TBD by Internal DC/DC) (x) TBD TBD TBD - C.I.E(White) x,y(CIE1931) (y) TBD TBD TBD - Dark Room Contrast CR - •2000:1 - - - Response Time - - --- 10 - ­s View Angle - - •160 - - Degree

Note(1): Normal Mode test conditions are as follows: - Driving voltage : 7.25V(VCC Supplied Externally) or VBAT:3.7V(VCC Generated by Internal DC/DC). - Contrast setting : TBD - Frame rate : TBD - Duty setting : 1/32 Note(2): Standby Mode test conditions are as follows: - Driving voltage : VCC:7.25V(VCC Supplied Externally) or VBAT:3.7V(VCC Generated by Internal DC/DC). - Contrast setting : TBD - Frame rate : TBD - Duty setting : 1/32

MULTI-INNO TECHNOLOGY CO.,LTD. P.11 MODULE NO.: MI6432AO-W Ver 1.0

„ INTERFACE PIN CONNECTIONS 1. Function Block Diagram

C2P C2N C1P C1N C32-47 VBAT VBREF(NC) 64x32 VSS S32-95 VDD OLED RES# Panel SCL SDA S- IREF VCOMH VCC

2. Panel Layout Diagram

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MULTI-INNO TECHNOLOGY CO.,LTD. P.12 MODULE NO.: MI6432AO-W Ver 1.0

3 Module Interface

PIN NO. PIN NAME DESCRIPTION 1 C2P 2 C2N C1P/C1N – Pin for charge pump ; Connect to each other with a capacitor. 3 C1P C2P/C2N – Pin for charge pump capacitor; Connect to each other with a capacitor. 4 C1N 5 VBAT Power supply for charge pump regulator circuit. Table 5.1 6 VBREF(NC) No Connection. 7 VSS This is a ground pin. 8 VDD Power supply pin for core logic operation. This pin is reset signal input. When the pin is low, initialization of the chip is 9 RES# executed. 10 SCL When I²C mode is selected,D2,D1 should be tied together and serve as 11 SDA SDAout,SDAin in application and D0 is the serial clock input,SCL. This pin is segment current reference pin. A should be connected between this 12 IREF pin and VSS. This pin is the input pin for the voltage output high level for COM signals. 13 VCOMH A capacitor should be connected between this pin and VSS. Power supply for panel driving voltage. This is also the most positive power 14 VCC voltage supply pin. When charge pump is enabled, a capacitor should be connected between this pin and VSS.

Table 3.1 Status VBAT VDD VCC Enable charge pump Connect to external Connect to external A capacitor should be connected VBAT source VDD source between this pin and VSS Disable charge pump Keep float Connect to external Connect to external VCC source VDD source

MULTI-INNO TECHNOLOGY CO.,LTD. P.13 MODULE NO.: MI6432AO-W Ver 1.0

„ RELIABILITY TESTS Item Condition Criterion 1. After testing, the High Temperature Storage function test is ok. 85±2к, 240 hours (HTS) 2. After testing, no addition to the defect. 3. After testing, the High Temperature Operating 70±2к, 240 hours change of luminance (HTO) should be within +/- 50% of initial value.

Low Temperature Storage 4. After testing, the -40±2к, 240 hours change for the mono (LTS) and area color must be within (+/-0.02, +/- Low Temperature Operating 0.02) and for the full -40±2к, 240 hours color it must be within (LTO) (+/-0.04, +/-0.04) of initial value based on High Temperature / High Humidity 1931 CIE coordinates. Storage 60±3к, 90%±3%RH, 240 5. After testing, the hours change of total current (HTHHS) consumption should be -40±2к ~ 25к ~ 85±2к Thermal Shock (Non-operation) within +/- 50% of (30min) (5min) (30min) initial value. (TS) 30cycles 10~55~10Hz,amplitu Vibration de 1.5mm, 1 hour for (Packing) each direction x, y, z 1. One box for each test. 2. No addition to the cosmetic and the electrical defects. Drop Height : 1 m, each (Packing) time for 6 sides, 3 edges, 1 angle

Note˖1) For each reliability test, the sample quantity is 3, and only for one test item. 2) The HTHHS test is requested the Pure Water(Resistance˚10Mȍ).

MULTI-INNO TECHNOLOGY CO.,LTD. P.14 MODULE NO.: MI6432AO-W Ver 1.0

„ OUTGOING QUALITY CONTROL SPECIFICATION

1. Sampling Method (1) GB/T 2828.1-2003/ISO2859-1˖1999, inspection level Ċ , normal inspection, single sample inspection (2) AQL: Major 0.65; Minor 1.0

2. Inspection Conditions The environmental conditions for test and measurement are performed as follows. Temperature: 22±3qC Humidity: 55±15%R.H Fluorescent Lamp: 30W Distance between the Panel & Lamp: •50cm Distance between the Panel & Eyes: •30cm Viewing angle from the vertical in each direction: ”45° (See the sketch below)

eyes

”45° •50cm •30cm

Panel

3. Quality Assurance Zones

Zone C: Cap Area

Zone B: Viewing Area

PANEL Zone A: Active Area

MULTI-INNO TECHNOLOGY CO.,LTD. P.15 MODULE NO.: MI6432AO-W Ver 1.0

4. Inspection Standard Definition of ĭ&L&W (Unit: mm) a L

b W

ӥ=(a+b)/2

ĉ. Appearance Defects

NO. ITEM CRITERIA CLASSIFICATION

1 Black or Minor White spot, Dirty Average Diameter Acceptable Number spot, Foreign (mm) Zone A,B Zone C matter, Dent on the ĭ”0.15 Ignore polarizer 0.15<ĭ”0.30 3 Ignore ĭ>0.30 0

2 Scratch/line on the Minor glass/Polarizer Width Length Acceptable Number (mm) (mm) Zone A,B Zone C W”0.03 --- Ignore 0.030.08 --- 0

3 Polarizer Bubble Minor Average Diameter Acceptable Number (mm) Zone A,B Zone C ĭ>0.5 0 0.2<ĭ”0.5 3 Ignore ĭ”0.2 Ignore

4 Any Dirt & Scratch Ignore for not affect the polarizer. Acceptable on Polarizer’s Protective Film

5 Any Dirt on Cap Minor Average Diameter Glass Acceptable Number (mm) ĭ”0.5 Ignore 0.5<ĭ”1.0 3 ĭ>1.0 0

MULTI-INNO TECHNOLOGY CO.,LTD. P.16 MODULE NO.: MI6432AO-W Ver 1.0

5 Glass Crack Major

Propagation crack is not acceptable.

6 Corner Chip Minor

t= Glass thickness Accept a”2.0mm or b”2.0mm, c”t

7 Corner Chip on Minor Cap Glass t= Glass thickness Accept a”1.5mm or b”1.5mm, c”t

8 Chip on Contact Minor Pad t= Glass thickness Accept a”3.0mm or b”0.8mm, c”t (on the contact pin) a”3.0mm or b”1.5mm, c”t (outside of the contact pin) 9 Chip on Face of Minor Display t= Glass thickness Accept a”1.5mm or b”1.5mm, c”t

10 Chip on Cap Glass Minor t= Glass thickness Accept a”3.0mm or b”3.0mm, c”t/2 a”1.5mm or b”1.5mm, t/2”c”t

11 Stain on Surface Stain removable by soft cloth or air blow is acceptable. Minor 12 TCP/FPC Damage (1) Crack, deep scratch, deep hole and deep pressure mark on Minor the TCP/FPC are not acceptable. (2) Terminal lead twisted or broken is not allowable. (3) Copper exposed is not allowed by naked eye inspection. 13 Dimension Major Checking by mechanical drawing. Unconformity

MULTI-INNO TECHNOLOGY CO.,LTD. P.17 MODULE NO.: MI6432AO-W Ver 1.0

Ċ. Displaying Defects NO. ITEM CRITERIA CLASSIFICATION

1 Black/White spot Minor Average Diameter Pieces Permitted Dirty spot (mm) Foreign matter Zone A,B Zone C ĭ”0.10 Ignore 0.10<ĭ”0.20 3 Ignore ĭ>0.20 0

2 No Display Not allowable. Major 3 Irregular Display Not allowable. Major Missing Line 4 Not allowable. Major (row or column) 5 Short Not allowable. Major 6 Flicker Not allowable. Major 7 Abnormal Color Refer to the SPEC. Major 8 Luminance NG Refer to the SPEC. Major 9 Over Current Refer to the SPEC. Major

MULTI-INNO TECHNOLOGY CO.,LTD. P.18 MODULE NO.: MI6432AO-W Ver 1.0

„ CAUTIONS IN USING OLED MODULE ƹPrecautions For Handling OLED Module: 1. OLED module consists of glass and polarizer. Pay attention to the following items when handling: i. Avoid drop from high, avoid excessive impact and pressure. ii. Do not touch, push or rub the exposed with anything harder than an HB pencil lead. iii. If the surface becomes dirty, breathe on the surface and gently wipe it off with a soft dry cloth. If it is terrible dirty, moisten the soft cloth with Isopropyl alcohol or Ethyl alcohol. Other solvents may damage the polarizer. Especially water, Ketone and Aromatic solvents. iv. Wipe off saliva or water drops immediately, contact the polarizer with water over a long period of time may cause deformation. v. Please keep the temperature within specified range for use and storage. Polarization degradation, bubble generation or polarizer peeling-off may occur with high temperature and high humidity. vi. Condensation on the surface and the terminals due to cold or anything will damage, stain or dirty the polarizer, so make it clean as the way of iii. 2. Do not attempt to disassemble or process the OLED Module. 3. Make sure the TCP or the FPC of the Module is free of twisting, warping and distortion, do not pull or bend them forcefully, especially the soldering pins. On the other side, the SLIT part of the TCP is made to bend in the necessary case. 4. When assembling the module into other equipment, give the glass enough space to avoid excessive pressure on the glass, especially the glass cover which is much more fragile. 5. Be sure to keep the air pressure under 120 kPa, otherwise the glass cover is to be cracked. 6. Be careful to prevent damage by static electricity: i. Be sure to ground the body when handling the OLED Modules. ii. All machines and tools required for assembling, such as soldering irons, must be properly grounded. iii. Do not assemble and do no other work under dry conditions to reduce the amount of static electricity generated. A relative humidity of 50%-60% is recommended. iv. Peel off the protective film slowly to avoid the amount of static electricity generated. v. Avoid to touch the circuit, the soldering pins and the IC on the Module by the body. vi. Be sure to use anti-static package. 7. Contamination on terminals can cause an electrochemical reaction and corrade the terminal circuit, so make it clean anytime. 8. All terminals should be open, do not attach any conductor or semiconductor on the terminals. 9. When the logic circuit power is off, do not apply the input signals. 10. Power on sequence: VDD Ш VPP, and power off sequence: VPP Ш VDD. 11. Be sure to keep temperature, humidity and voltage within the ranges of the spec, otherwise shorten Moduleϗs life time, even make it damaged. 12. Be sure to drive the OLED Module following the Specification and Datasheet of IC controller, otherwise something wrong may be seen.

MULTI-INNO TECHNOLOGY CO.,LTD. P.19 MODULE NO.: MI6432AO-W Ver 1.0

13.When displaying images, keep them rolling, and avoid one fixed image displaying more than 30 seconds, otherwise the residue image is to be seen. This is the speciality of OLED.

ƹPrecautions For Soldering OLED Module: 1. Soldering temperature : 260qC r 10qC. 2. Soldering time : 3-4 sec. 3. Repeating time : no more than 3 times. 4. If soldering flux is used, be sure to remove any remaining flux after finishing soldering operation. (This does not apply in the case of a non-halogen type of flux.) It is recommended to protect the surface with a cover during soldering to prevent any damage due to flux spatters.ʳ

ƹ Precautions For Storing OLED Module: 1. Be sure to store the OLED Module in the vacuum bag with dessicant. 2. If the Module can not be used up in 1 month after the bag being opened, make sure to seal the Module in the vacuum bag with dessicant again. 3. Store the Module in a dark place, do not expose to sunlight or fluorescent . 4. The polarizer surface should not touch any other objects. It is recommended to store the Module in the shipping container. 5. It is recommended to keep the temperature between 0qC and 30qC , the relative humidity not over 60%.

ƹ Limited Warranty Unless relevant quality agreements signed with customer and law enforcement, for a period of 12 months from date of production, all products (except automotive products) Multi-Inno will replace or repair any of its OLED modules which are found to be functional defect when inspected in accordance with Multi-Inno OLED acceptance standards (copies available upon request). Cosmetic/visual defects must be returned to Multi-Inno within 90 days of shipment. Confirmation of such date should be based on freight documents. The warranty liability of Multi-Inno is limited to repair and/or replacement on the terms above. Multi-Inno will not be responsible for any subsequent or consequential events.

ƹReturn OLED Module Under Warranty: 1. No warranty in the case that the precautions are disregarded. 2. Module repairs will be invoiced to the customer upon mutual agreement. Modules must be returned with sufficient description of the failures or defects.

MULTI-INNO TECHNOLOGY CO.,LTD. P.20