Theta and the Future of Accelerator Programming
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Fact Sheet: the Next Generation of Computing Has Arrived
News Fact Sheet The Next Generation of Computing Has Arrived: Performance to Power Amazing Experiences The new 5th Generation Intel® Core™ processor family is Intel’s latest wave of 14nm processors, delivering improved system and graphics performance, more natural and immersive user experiences, and enabling longer battery life compared to previous generations. The release of the 5th Generation Intel Core technology includes 14 new processors for consumers and businesses, including 10 new 15W processors with Intel® HD Graphics and four new 28W products with Intel® Iris™ Graphics. The 5th Generation Intel Core processor is purpose-built for the next generation of compute devices offering a thinner, lighter and more efficient experience across diverse form factors, including traditional notebooks, 2 in 1s, Ultrabooks™, Chromebooks, all-in-one desktop PCs and mini PCs. With the 5th Generation Intel Core processor availability, the “Broadwell” microarchitecture is expected to be the fastest mobile transition in company history to offer consumers a broad selection and availability of devices. Intel also started shipping its next generation 14nm processor for tablets, codenamed “Cherry Trail”, to device manufacturers. The new system on a chip (SoC) offers 64-bit computing, improved graphics with Intel® Generation 8-LP graphics, great performance and battery life for mainstream tablets. The platform offers world-class modem capabilities with LTE-Advanced on Intel® XMM™ 726x platform, which supports Cat-6 speeds and carrier aggregation. Customers will introduce new products based on this platform starting in the first half of this year. Key benefits of the 5th Generation Intel Core family and the next-generation 14nm processor for tablets include: Powerful Performance. -
インテル® Parallel Studio XE 2020 リリースノート
インテル® Parallel Studio XE 2020 2019 年 12 月 5 日 内容 1 概要 ..................................................................................................................................................... 2 2 製品の内容 ........................................................................................................................................ 3 2.1 インテルが提供するデバッグ・ソリューションの追加情報 ..................................................... 5 2.2 Microsoft* Visual Studio* Shell の提供終了 ........................................................................ 5 2.3 インテル® Software Manager .................................................................................................... 5 2.4 サポートするバージョンとサポートしないバージョン ............................................................ 5 3 新機能 ................................................................................................................................................ 6 3.1 インテル® Xeon Phi™ 製品ファミリーのアップデート ......................................................... 12 4 動作環境 .......................................................................................................................................... 13 4.1 プロセッサーの要件 ...................................................................................................................... 13 4.2 ディスク空き容量の要件 .............................................................................................................. 13 4.3 オペレーティング・システムの要件 ............................................................................................. 13 -
GPU Developments 2018
GPU Developments 2018 2018 GPU Developments 2018 © Copyright Jon Peddie Research 2019. All rights reserved. Reproduction in whole or in part is prohibited without written permission from Jon Peddie Research. This report is the property of Jon Peddie Research (JPR) and made available to a restricted number of clients only upon these terms and conditions. Agreement not to copy or disclose. This report and all future reports or other materials provided by JPR pursuant to this subscription (collectively, “Reports”) are protected by: (i) federal copyright, pursuant to the Copyright Act of 1976; and (ii) the nondisclosure provisions set forth immediately following. License, exclusive use, and agreement not to disclose. Reports are the trade secret property exclusively of JPR and are made available to a restricted number of clients, for their exclusive use and only upon the following terms and conditions. JPR grants site-wide license to read and utilize the information in the Reports, exclusively to the initial subscriber to the Reports, its subsidiaries, divisions, and employees (collectively, “Subscriber”). The Reports shall, at all times, be treated by Subscriber as proprietary and confidential documents, for internal use only. Subscriber agrees that it will not reproduce for or share any of the material in the Reports (“Material”) with any entity or individual other than Subscriber (“Shared Third Party”) (collectively, “Share” or “Sharing”), without the advance written permission of JPR. Subscriber shall be liable for any breach of this agreement and shall be subject to cancellation of its subscription to Reports. Without limiting this liability, Subscriber shall be liable for any damages suffered by JPR as a result of any Sharing of any Material, without advance written permission of JPR. -
1 Intel CEO Remarks Pat Gelsinger Q2'21 Earnings Webcast July 22
Intel CEO Remarks Pat Gelsinger Q2’21 Earnings Webcast July 22, 2021 Good afternoon, everyone. Thanks for joining our second-quarter earnings call. It’s a thrilling time for both the semiconductor industry and for Intel. We're seeing unprecedented demand as the digitization of everything is accelerated by the superpowers of AI, pervasive connectivity, cloud-to-edge infrastructure and increasingly ubiquitous compute. Our depth and breadth of software, silicon and platforms, and packaging and process, combined with our at-scale manufacturing, uniquely positions Intel to capitalize on this vast growth opportunity. Our Q2 results, which exceeded our top and bottom line expectations, reflect the strength of the industry, the demand for our products, as well as the superb execution of our factory network. As I’ve said before, we are only in the early innings of what is likely to be a decade of sustained growth across the industry. Our momentum is building as once again we beat expectations and raise our full-year revenue and EPS guidance. Since laying out our IDM 2.0 strategy in March, we feel increasingly confident that we're moving the company forward toward our goal of delivering leadership products in every category in which we compete. While we have work to do, we are making strides to renew our execution machine: 7nm is progressing very well. We’ve launched new innovative products, established Intel Foundry Services, and made operational and organizational changes to lay the foundation needed to win in the next phase of our company’s great history. Here at Intel, we’re proud of our past, pragmatic about the work ahead, but, most importantly, confident in our future. -
Introduction to High Performance Computing
Introduction to High Performance Computing Shaohao Chen Research Computing Services (RCS) Boston University Outline • What is HPC? Why computer cluster? • Basic structure of a computer cluster • Computer performance and the top 500 list • HPC for scientific research and parallel computing • National-wide HPC resources: XSEDE • BU SCC and RCS tutorials What is HPC? • High Performance Computing (HPC) refers to the practice of aggregating computing power in order to solve large problems in science, engineering, or business. • Purpose of HPC: accelerates computer programs, and thus accelerates work process. • Computer cluster: A set of connected computers that work together. They can be viewed as a single system. • Similar terminologies: supercomputing, parallel computing. • Parallel computing: many computations are carried out simultaneously, typically computed on a computer cluster. • Related terminologies: grid computing, cloud computing. Computing power of a single CPU chip • Moore‘s law is the observation that the computing power of CPU doubles approximately every two years. • Nowadays the multi-core technique is the key to keep up with Moore's law. Why computer cluster? • Drawbacks of increasing CPU clock frequency: --- Electric power consumption is proportional to the cubic of CPU clock frequency (ν3). --- Generates more heat. • A drawback of increasing the number of cores within one CPU chip: --- Difficult for heat dissipation. • Computer cluster: connect many computers with high- speed networks. • Currently computer cluster is the best solution to scale up computer power. • Consequently software/programs need to be designed in the manner of parallel computing. Basic structure of a computer cluster • Cluster – a collection of many computers/nodes. • Rack – a closet to hold a bunch of nodes. -
Future-ALCF-Systems-Parker.Pdf
Future ALCF Systems Argonne Leadership Computing Facility 2021 Computational Performance Workshop, May 4-6 Scott Parker www.anl.gov Aurora Aurora: A High-level View q Intel-HPE machine arriving at Argonne in 2022 q Sustained Performance ≥ 1Exaflops DP q Compute Nodes q 2 Intel Xeons (Sapphire Rapids) q 6 Intel Xe GPUs (Ponte Vecchio [PVC]) q Node Performance > 130 TFlops q System q HPE Cray XE Platform q Greater than 10 PB of total memory q HPE Slingshot network q Fliesystem q Distributed Asynchronous Object Store (DAOS) q ≥ 230 PB of storage capacity; ≥ 25 TB/s q Lustre q 150PB of storage capacity; ~1 TB/s 3 The Evolution of Intel GPUs 4 The Evolution of Intel GPUs 5 XE Execution Unit qThe EU executes instructions q Register file q Multiple issue ports q Vector pipelines q Float Point q Integer q Extended Math q FP 64 (optional) q Matrix Extension (XMX) (optional) q Thread control q Branch q Send (memory) 6 XE Subslice qA sub-slice contains: q 16 EUs q Thread dispatch q Instruction cache q L1, texture cache, and shared local memory q Load/Store q Fixed Function (optional) q 3D Sampler q Media Sampler q Ray Tracing 7 XE 3D/Compute Slice qA slice contains q Variable number of subslices q 3D Fixed Function (optional) q Geometry q Raster 8 High Level Xe Architecture qXe GPU is composed of q 3D/Compute Slice q Media Slice q Memory Fabric / Cache 9 Aurora Compute Node • 6 Xe Architecture based GPUs PVC PVC (Ponte Vecchio) • All to all connection PVC PVC • Low latency and high bandwidth PVC PVC • 2 Intel Xeon (Sapphire Rapids) processors Slingshot -
Hardware Developments V E-CAM Deliverable 7.9 Deliverable Type: Report Delivered in July, 2020
Hardware developments V E-CAM Deliverable 7.9 Deliverable Type: Report Delivered in July, 2020 E-CAM The European Centre of Excellence for Software, Training and Consultancy in Simulation and Modelling Funded by the European Union under grant agreement 676531 E-CAM Deliverable 7.9 Page ii Project and Deliverable Information Project Title E-CAM: An e-infrastructure for software, training and discussion in simulation and modelling Project Ref. Grant Agreement 676531 Project Website https://www.e-cam2020.eu EC Project Officer Juan Pelegrín Deliverable ID D7.9 Deliverable Nature Report Dissemination Level Public Contractual Date of Delivery Project Month 54(31st March, 2020) Actual Date of Delivery 6th July, 2020 Description of Deliverable Update on "Hardware Developments IV" (Deliverable 7.7) which covers: - Report on hardware developments that will affect the scientific areas of inter- est to E-CAM and detailed feedback to the project software developers (STFC); - discussion of project software needs with hardware and software vendors, completion of survey of what is already available for particular hardware plat- forms (FR-IDF); and, - detailed output from direct face-to-face session between the project end- users, developers and hardware vendors (ICHEC). Document Control Information Title: Hardware developments V ID: D7.9 Version: As of July, 2020 Document Status: Accepted by WP leader Available at: https://www.e-cam2020.eu/deliverables Document history: Internal Project Management Link Review Review Status: Reviewed Written by: Alan Ó Cais(JSC) Contributors: Christopher Werner (ICHEC), Simon Wong (ICHEC), Padraig Ó Conbhuí Authorship (ICHEC), Alan Ó Cais (JSC), Jony Castagna (STFC), Godehard Sutmann (JSC) Reviewed by: Luke Drury (NUID UCD) and Jony Castagna (STFC) Approved by: Godehard Sutmann (JSC) Document Keywords Keywords: E-CAM, HPC, Hardware, CECAM, Materials 6th July, 2020 Disclaimer:This deliverable has been prepared by the responsible Work Package of the Project in accordance with the Consortium Agreement and the Grant Agreement. -
Marc and Mentat Release Guide
Marc and Mentat Release Guide Marc® and Mentat® 2020 Release Guide Corporate Europe, Middle East, Africa MSC Software Corporation MSC Software GmbH 4675 MacArthur Court, Suite 900 Am Moosfeld 13 Newport Beach, CA 92660 81829 Munich, Germany Telephone: (714) 540-8900 Telephone: (49) 89 431 98 70 Toll Free Number: 1 855 672 7638 Email: [email protected] Email: [email protected] Japan Asia-Pacific MSC Software Japan Ltd. MSC Software (S) Pte. Ltd. Shinjuku First West 8F 100 Beach Road 23-7 Nishi Shinjuku #16-05 Shaw Tower 1-Chome, Shinjuku-Ku Singapore 189702 Tokyo 160-0023, JAPAN Telephone: 65-6272-0082 Telephone: (81) (3)-6911-1200 Email: [email protected] Email: [email protected] Worldwide Web www.mscsoftware.com Support http://www.mscsoftware.com/Contents/Services/Technical-Support/Contact-Technical-Support.aspx Disclaimer User Documentation: Copyright 2020 MSC Software Corporation. All Rights Reserved. This document, and the software described in it, are furnished under license and may be used or copied only in accordance with the terms of such license. Any reproduction or distribution of this document, in whole or in part, without the prior written authorization of MSC Software Corporation is strictly prohibited. MSC Software Corporation reserves the right to make changes in specifications and other information contained in this document without prior notice. The concepts, methods, and examples presented in this document are for illustrative and educational purposes only and are not intended to be exhaustive or to apply to any particular engineering problem or design. THIS DOCUMENT IS PROVIDED ON AN “AS-IS” BASIS AND ALL EXPRESS AND IMPLIED CONDITIONS, REPRESENTATIONS AND WARRANTIES, INCLUDING ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE DISCLAIMED, EXCEPT TO THE EXTENT THAT SUCH DISCLAIMERS ARE HELD TO BE LEGALLY INVALID. -
Progress in Particle Tracking and Vertexing Detectors Nicolas Fourches
Progress in particle tracking and vertexing detectors Nicolas Fourches (CEA/IRFU): 22nd March 2020, University Paris-Saclay Abstract: This is part of a document, which is devoted to the developments of pixel detectors in the context of the International Linear Collider. From the early developments of the MIMOSAs to the proposed DotPix I recall some of the major progresses. The need for very precise vertex reconstruction is the reason for the Research and Development of new pixel detectors, first derived from the CMOS sensors and in further steps with new semiconductors structures. The problem of radiation effects was investigated and this is the case for the noise level with emphasis of the benefits of downscaling. Specific semiconductor processing and characterisation techniques are also described, with the perspective of a new pixel structure. TABLE OF CONTENTS: 1. The trend towards 1-micron point-to-point resolution and below 1.1. Gaseous detectors : 1.2. Liquid based detectors : 1.3. Solid state detectors : 2. The solution: the monolithically integrated pixel detector: 2.1. Advantages and drawbacks 2.2. Spatial resolution : experimental physics requirements 2.2.1. Detection Physics at colliders 2.2.1.1. Track reconstruction 2.2.1.2. Constraints on detector design a) Multiple interaction points in the incident colliding particle bunches b) Multiple hits in single pixels even in the outer layers c) Large NIEL (Non Ionizing Energy Loss) in the pixels leading to displacement defects in the silicon layers d) Cumulative ionization in the solid state detectors leading to a total dose above 1 MGy in the operating time of the machine a) First reducing the bunch length and beam diameter would significantly limit the number of spurious interaction points. -
Applying the Roofline Performance Model to the Intel Xeon Phi Knights Landing Processor
Applying the Roofline Performance Model to the Intel Xeon Phi Knights Landing Processor Douglas Doerfler, Jack Deslippe, Samuel Williams, Leonid Oliker, Brandon Cook, Thorsten Kurth, Mathieu Lobet, Tareq Malas, Jean-Luc Vay, and Henri Vincenti Lawrence Berkeley National Laboratory {dwdoerf, jrdeslippe, swwilliams, loliker, bgcook, tkurth, mlobet, tmalas, jlvay, hvincenti}@lbl.gov Abstract The Roofline Performance Model is a visually intuitive method used to bound the sustained peak floating-point performance of any given arithmetic kernel on any given processor architecture. In the Roofline, performance is nominally measured in floating-point operations per second as a function of arithmetic intensity (operations per byte of data). In this study we determine the Roofline for the Intel Knights Landing (KNL) processor, determining the sustained peak memory bandwidth and floating-point performance for all levels of the memory hierarchy, in all the different KNL cluster modes. We then determine arithmetic intensity and performance for a suite of application kernels being targeted for the KNL based supercomputer Cori, and make comparisons to current Intel Xeon processors. Cori is the National Energy Research Scientific Computing Center’s (NERSC) next generation supercomputer. Scheduled for deployment mid-2016, it will be one of the earliest and largest KNL deployments in the world. 1 Introduction Moving an application to a new architecture is a challenge, not only in porting of the code, but in tuning and extracting maximum performance. This is especially true with the introduction of the latest manycore and GPU-accelerated architec- tures, as they expose much finer levels of parallelism that can be a challenge for applications to exploit in their current form. -
Intel 2019 Year Book
YEARBOOK 2019 POWERING THE FUTURE Our 2019 yearbook invites you to look back and reflect on a memorable year for Intel. TABLE OF CONTENTS 2019 kicked off with the announcement of our new p4 New CEO. Evolving culture. Expanded ambitions. chief executive, Bob Swan. It was followed by a stream of notable news: product announcements, technology p6 More data. More storage. More processing. breakthroughs, new customers and partnerships, p10 Innovation for the PC user experience and important moves to evolve Intel’s culture as the company entered its sixth decade. p12 Self-driving cars hit the road p2 p16 AI unlocks the power of data It’s a privilege to tell the Intel story in all its complexity and humanity. Looking through these pages, the p18 Helping customers push boundaries breadth and depth of what we’ve achieved in 12 p22 More supply to meet strong demand months is substantial, as is the strong foundation we’ve built for even greater impact in the future. p26 Next-gen hardware and software to unlock it p28 Tech’s future: Inventing and investing I hope you enjoy this colorful look at what’s possible when more than 100,000 individuals from every p32 Reinforcing the nature of Moore’s Law corner of the globe unite to change the world – p34 Building for the smarter future through technologies that make a positive difference to our customers, to society, and to people’s lives. — Claire Dixon, Chief Communications Officer NEW CEO. EVOLVING CULTURE. EXPANDED AMBITIONS. 2019 was an important year in Intel’s transformation, with a new chief executive officer, ambitious business priorities, an aspirational culture evolution, and a farewell to Focal. -
Intro to Parallel Computing
Intro To Parallel Computing John Urbanic Parallel Computing Scientist Pittsburgh Supercomputing Center Copyright 2021 Purpose of this talk ⚫ This is the 50,000 ft. view of the parallel computing landscape. We want to orient you a bit before parachuting you down into the trenches. ⚫ This talk bookends our technical content along with the Outro to Parallel Computing talk. The Intro has a strong emphasis on hardware, as this dictates the reasons that the software has the form and function that it has. Hopefully our programming constraints will seem less arbitrary. ⚫ The Outro talk can discuss alternative software approaches in a meaningful way because you will then have one base of knowledge against which we can compare and contrast. ⚫ The plan is that you walk away with a knowledge of not just MPI, etc. but where it fits into the world of High Performance Computing. FLOPS we need: Climate change analysis Simulations Extreme data • Cloud resolution, quantifying uncertainty, • “Reanalysis” projects need 100 more computing understanding tipping points, etc., will to analyze observations drive climate to exascale platforms • Machine learning and other analytics • New math, models, and systems support are needed today for petabyte data sets will be needed • Combined simulation/observation will empower policy makers and scientists Courtesy Horst Simon, LBNL Exascale combustion simulations ⚫ Goal: 50% improvement in engine efficiency ⚫ Center for Exascale Simulation of Combustion in Turbulence (ExaCT) – Combines simulation and experimentation –