Announcement March 22, 2019
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Integrated Report 2018 1
Integrated Report 2018 1 The latest information on the Maxell Group can be found on our website. Editorial Policy This report is issued for the purpose of sharing the vision of the Maxell Group, where business is based on harmonious coexistence with society. This is an integrated report that goes over the Group’s businesses and financial results as well as its CSR activities and the outcomes of these activities. This report, in the wake of the Maxell Group’s transition to a holding company in October 2017, is aimed at renewing stakeholders’ under- standing of the strengths of the new Maxell Group, the overall vision and specific measures of its new Mid-Term Plan, and the connection between both CSV business management and CSR activities and our business strategy, which is geared toward sustainable growth. The Group has worked hard to win support for its position on co-creation and co-prosperity as well as to foster anticipation for and confidence in the Group’s growth, and will continue to do so. Moreover, we include ESG information, which forms the foun- dation of corporate management, as a way to fulfill our social responsibility to all stakeholders and demonstrate the Maxell Group’s stance toward corporate governance, protection of the global environment, and social contributions. Detailed financial and CSR-related information that could not be Regarding Support for Disasters in published in full in this report is disclosed on the Company’s website. For Viewing via PDF Summer 2018 Category tabs, navigation buttons, and link buttons have been provided on each page for easy access to related pages and websites. -
2SK3446 Datasheet
To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. 4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. -
Internal Round Table Discussion: the Potential of the Field Solutions Business
Internal Round Table Discussion: The Potential of the Field Solutions Business Our field solutions (FS) business undertakes the maintenance, repair, and modification of semiconductor production equipment supplied by the TEL Group to customers, and until now responsibility for these business activities was spread over multiple organizations, including post-sales divisions. In October 2009 these activities were unified and our FS business launched. Employees involved in this area conducted a round table discussion of the potential for FS business (the discussion was held on June 28, 2010). Generating innovation in the FS business local situations and creating ideas independently. Asano: I feel that the equipment modification business, Moderator: Business models in the world are changing which was inactive only a few years ago, has really changed. dramatically. From now on not only cutting-edge but also Our company is now calling this a period of innovation and low-cost and other numerous semiconductor applications growth. In the FS business, too, we intend to construct new are going to become necessary, especially when aiming business models and generate innovation. at developing countries. Is there a relationship between Sakamoto: I think that one way to generate innovation is the background to these times and the launching of the FS through interpersonal communication. By expanding our business? FS business, our close communication with customers has Kaminaga: In our FS business, the entire TEL Group is become livelier than ever before and this has promoted responding to the polarization of the market into competing innovation. Moreover, by making use of the broad knowledge with cutting-edge technology and effectively utilizing existing and know-how we have accumulated in developing both devices and production lines through the sale of TEL-certified hardware and software, we provide consulting services for used equipment and other efforts. -
Japanese Semiconductor Manufacturing
+44 20 8123 2220 [email protected] Japanese Semiconductor Manufacturing Industry Development and Strategies of Key Players https://marketpublishers.com/r/JE397FCA2F5EN.html Date: August 2019 Pages: 29 Price: US$ 1,260.00 (Single User License) ID: JE397FCA2F5EN Abstracts The Japanese semiconductor industry, which previously operated under the IDM (Integrated Device Manufacturer) model, not only was a leader in Asia, but also had a unprecedented role in the world. After many years passed, Japan was too slow to adjust to structural changes in the industry, causing it to gradually lose its edge. This report covers the current status and future development of the industry as it gears itself towards new application markets such as autonomous vehicles and explores strategies of key players, including Toshiba, Panasonic, Fujitsu, Renesas Electronics, and Sony. Japanese Semiconductor Manufacturing Industry Development and Strategies of Key Players +44 20 8123 2220 [email protected] Contents 1.INDUSTRY STATUS 1.1 Toshiba is the Only Japan’s Semiconductor Brand Left on Top 10 Player List 2. DEVELOPMENT OF JAPAN'S KEY PLAYERS 2.1 Toshiba 2.1.1 Japan’s No. 1 Semiconductor Manufacturer, Ranked 8th in the World 2.1.2 NAND Flash is Toshiba’s Main Semiconductor Revenue Source 2.1.3 Toshiba Memory Corporation (TMC) Spun off to Fix Accounting Issues 2.2 Panasonic 2.2.1 Missed Market Changes, Poor Operations, No Longer a Top-ranked Company 2.2.2 Tightening Belts to Focus on Sensors 2.3 Fujitsu 2.3.1 Ranked 20th in the World, with no Standout -
Deals Driver (February 2018)
Deals driver Automotive trends and transactions February 2018 kpmg.ca/automotive Rapid change and exceptional profits – What’s next? By Peter Hatges, Partner & National Automotive Sector Leader, KPMG in Canada As we embark on 2018, the Auto The integration of technology and the driving experience is in full force Industry is in the midst of a rapid as autonomous driving and collision avoidance become the top technology evolution. Disruption looms as the focus points for OEMs. This ecosystem is evolving and technology companies are having a significant impact on the driving experience future demographics of the car and driver safety. Mobile connectivity in the car is an essential requirement buying public point to a decreasing for the modern traveler. Of the executives surveyed, 85% believe that love affair with the automobile. data and cybersecurity will be the number 1 consideration for future Sedans are out, SUVs are in and purchasing decisions. OEM profits are exceptionally Over half (56%) of executives surveyed believe that the number of retail strong for each of the ten major outlets will be reduced by 30% to 50% by 2025. And almost half of the car global manufacturers. Total owners today will not want to own vehicles personally by 2025. Whether this revenue from the top 10 exceeded translates to rural areas of North America remains to be seen. CDN $2.1 trillion in the last The pure electric vehicle is not expected to prevail as the infrastructure twelve months and cumulative required to enable long distance travel will not be sufficiently developed. EBITDA amounted to just over Trends indicate that various drivetrains will be available in the future and fuel CDN $223 billion. -
ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan
ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan Shozo Saito Chairman, ISSM2020 Organizing Committee Device & System Platform Development Center Co., Ltd. Shuichi Inoue, ATONARP INC. It is our great pleasure to announce that The 28th annual International Symposium on Semiconductor Manufacturing (ISSM) 2020 will be held on December 15-16, 2020 at KFC Hall, Ryogoku, Tokyo in cooperation with e-Manufacturing & Design Collaboration Symposium (eMDC) which is sponsored by TSIA with support from SEMI and GSA. The program will feature keynote speeches by world leading speakers, timely and highlighted topics and networking sessions focusing on equipment/materials/software/services with suppliers' exhibits. ISSM continues to contribute to the growth of the semiconductor industry through its infrastructure for networking, discussion, and information sharing among the world's professionals. We would like you to cooperate with us by supporting the ISSM 2020. Please see the benefit of ISSM2020 sponsorship. Conference Overview Date: December 15-16, 2020 Location: KFC (Kokusai Fashion Center) Hall 1-6-1 Yokoami Sumidaku, Tokyo 130-0015 Japan +81-3-5610-5810 Co-Sponsored by: IEEE Electron Devices Society Minimal Fab Semiconductor Equipment Association of Japan (SEAJ) Semiconductor Equipment and Materials International (SEMI) Taiwan Semiconductor Industry Association (TSIA) Endorsement by: The Japan Society of Applied Physics Area of Interest: Fab Management Factory Design & Automated Material -
Renesas Electronics Announces Share Issue Through Third-Party Allotment, and Change in Major Shareholders, Largest Shareholder W
Renesas Electronics Announces Share Issue through Third-Party Allotment, and Change in Major Shareholders, Largest Shareholder who is a Major Shareholder, Parent Company and Other Related Companies TOKYO, Japan, December 10, 2012 – Renesas Electronics Corporation (TSE: 6723, hereafter “Renesas” or “the Company”), a premier supplier of advanced semiconductor solutions, at a meeting of the board of directors held today, resolved to issue shares through Third-Party Allotment to The Innovation Network Corporation of Japan (“INCJ”), Toyota Motor Corporation, Nissan Motor Co., Ltd., Keihin Corporation, Denso Corporation, Canon Inc., Nikon Corporation, Panasonic Corporation and Yaskawa Electric Corporation, and (hereafter the “scheduled subscribers”). In implementing the Third-Party Allotment, one of the scheduled subscribers, INCJ, is required to file for regulatory approval in relation to business mergers with competition authorities in various countries, and the payment pertaining to the Allotment of Third Party Shares is subject to approval from all the applicable regulatory authorities. Furthermore, implementation of the Third-Party Allotment will result in changes to major shareholders, the largest shareholder who is a major shareholder, the parent company and other related companies, as outlined herein. I. Outline of the Third-Party Allotment 1. Outline of the offering February 23, 2013 through September 30, 2013 (Note 1) The above schedule takes into account the time required by the competition authorities of each country where INCJ, one of the (1) Issue period scheduled subscribers, files application, to review the Third-Party Allotment. Payment for the following total of shares is to be made promptly by the scheduled subscribers after approval from all applicable antitrust authorities, etc. -
Gentherm Incorporated Annual Report 2020
Gentherm Incorporated Annual Report 2020 Form 10-K (NASDAQ:THRM) Published: February 20th, 2020 PDF generated by stocklight.com UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-K (Mark One) ☒ Annual report pursuant to section 13 or 15(d) of the Securities Exchange Act of 1934 for the fiscal year ended December 31, 2019 or ☐ Transition report pursuant to section 13 or 15(d) of the Securities Exchange Act of 1934 for the transition period from to . Commission file number 0-21810 GENTHERM INCORPORATED (Exact name of registrant as specified in its charter) Michigan 95-4318554 (State or other jurisdiction of (I.R.S. Employer incorporation or organization) Identification No.) 21680 Haggerty Road, Northville, MI 48167 (Address of principal executive offices) (Zip Code) Registrant’s telephone number, including area code: ( 248) 504-0500 Securities registered pursuant to Section 12(b) of the Act: Title of each class Trading Symbol Name of each exchange on which registered Common Stock, no par value THRM Nasdaq Securities registered pursuant to Section 12(g) of the Act: None Indicate by check mark whether the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. Yes ☒ No ☐ Indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or Section 15(d) of the Act. Yes ☐ No ☒ Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days. -
Thermal Management Systems Symposium Technical Session Schedule As of 10/15/2018 07:40 Pm
Thermal Management Systems Symposium Technical Session Schedule As of 10/15/2018 07:40 pm Tuesday, October 9 Vehicle Climate Control & Cabin Comfort: Part 1 Session Code: TMSS200 Room Cabrillo Ballroom Session Time: 1:00 p.m. Climate control is a defining vehicle attribute often associated with brand image. Thermal performance and quality of climate control are both critical to customer satisfaction. While the primary objective of a climate control system is to deliver thermal comfort and occupant safety with low energy consumption, there are strong design interactions with other vehicle systems. Localized comfort, secondary fluids, air quality, controls, system sizing and HVAC consumer interface are just a few of the recent advances in this rapidly developing topic area. Organizers - Bashar AbdulNour, Ford Motor Company; Jeffrey Bozeman, General Motors LLC; Hector Cano, Bergstrom Inc.; Wilko Jansen, Jaguar & Land Rover; Jason Aaron Lustbader, National Renewable Energy Laboratory; Gursaran D. Mathur, CalsonicKansei North America Inc.; Jie Zeng, Denso; Tao Zhan, California Air Resources Board Time Paper No. Title 1:00 p.m. ORAL ONLY Influence of Partial Recirculation on the Build-up of Cabin Carbon Dioxide Concentrations Gursaran D. Mathur, CalsonicKansei North America Inc. 1:30 p.m. ORAL ONLY Development of a Standard Testing Method for Vehicle Cabin Air Quality Index Heejung Jung, Liem Pham, University Of California Riverside; Nick Molden, Sam Boyle, Emissions Analytics 2:00 p.m. ORAL ONLY Thin Ceiling Circulator to Enhance Thermal Comfort and Cabin Space Toshinori Ochiai, Shuzo Oda, DENSO CORPORATION 2:30 p.m. ORAL ONLY Compressor Design for Improved Warranty, Diagnostics & Remanufacturing Michael Hope, AutoClimTech Ltd. -
Notice of Certification/Authorization and Settlement Approval Hearings Regarding National Settlement Agreements with Hynix, Mitsubishi/Renesas, Cypress, Toshiba and Etron
NOTICE OF CERTIFICATION/AUTHORIZATION AND SETTLEMENT APPROVAL HEARINGS REGARDING NATIONAL SETTLEMENT AGREEMENTS WITH HYNIX, MITSUBISHI/RENESAS, CYPRESS, TOSHIBA AND ETRON IN THE MATTER OF SRAM (STATIC RANDOM ACCESS MEMORY) CLASS ACTION LITIGATION READ THIS NOTICE CAREFULLY. IT MAY AFFECT YOUR LEGAL RIGHTS. TO: All Persons in Canada who purchased Static Random Access Memory (“SRAM”) or products containing SRAM, between January 1, 1998 through December 31, 2005, except for the defendants or parties related to a defendant (“Settlement Class”). NATURE OF LAWSUITS SRAM is a type of memory commonly used in computers, mobile phones and other hand held communication devices. Class action proceedings were commenced in Ontario (Court File No. CV-08-0035836800CP, Toronto Registry), British Columbia (Court File No. S-070350, Vancouver Registry), and Quebec (Court File No. 200-06-000083-074, District of Quebec) alleging that the defendants, conspired to fix prices in the market for SRAM (collectively the "SRAM Proceedings"). The plaintiffs on behalf of themselves and the classes are claiming damages from the defendants for unlawfully conspiring to fix, maintain or increase the price of SRAM. The defendants include: Samsung Electronics Co. Ltd., Samsung Semiconductor, Inc. and Samsung Electronics Canada Inc. (”Samsung’), Hynix Semiconductor, Inc. and Hynix Semiconductor America, Inc. (“Hynix”), Micron Technology, Inc., Micron Semiconductor Canada and Micron Semiconductor Products, Inc.(“Micron”), Cypress Semiconductor Corporation and Cypress Semiconductor, Inc. (“Cypress”), Etron Technology Inc. and Etron Technology America, Inc. (“Etron”), Mitsubishi Electric Corporation, Mitsubishi Electric Sales Canada Inc., Mitsubishi Electric & Electronics USA, Inc., Renesas Electronics Corporation fka Renesas Technology Corporation, Renesas Electronics Canada Limited fka Renesas Technology Canada Limited, Renesas Electronics America Inc. -
Automotive Industry Insight
www.peakstone.com Automotive Industry Insight August 2017 Automotive Industry Insight | August 2017 Automotive M&A Update Automotive categories continue to see strong M&A activity For the 2017 YTD period, strategic buyers accounted for 83% of the automotive M&A transactions with financial buyers making up the difference; during 2016, strategic buyers accounted for approximately 88% of the transactions Select Recent Notable Publicly Announced M&A Transactions Transaction Date Status Target Buyer Size Dec-2016 Announced $310 million Nov-2016 Closed $3.42 billion Oct-2016 Closed $670 million Oct-2016 Closed $500 million Jul-2016 Closed $580 million www.peakstone.com 1 Automotive Industry Insight | August 2017 U.S. Automotive Industry – M&A Market Overview U.S. Automotive transaction activity has been strong U.S. Number of Transactions by Buyer Type U.S. Transaction Multiples 10.8x 14 22 8.9x 8.9x 7.6x 10 10 9 15 7.5x 10 NA 79 72 68 68 69 62 6 58 29 1.6x 0.8x 0.8x 0.7x 0.7x 0.6x 2010 2011 2012 2013 2014 2015 2016 2017 2012 2013 2014 2015 2016 2017 YTD YTD Financial Strategic EV / EBITDA EV / Revenue Source: Capital IQ, data as of 8/8/2017. www.peakstone.com 2 Automotive Industry Insight | August 2017 Peakstone Automotive Index – Trading Statistics Automotive categories performed favorably compared to the S&P 500 Relative Stock Performance 250% 200% International OEM Suppliers: 202% Automotive Manufacturers: 147% 150% Dealers and Service Providers: 124% Domestic OEM Suppliers: 119% 100% Aftermarket Suppliers: 119% S&P 500: 77% Aftermarket Retailers and Distributors: 29% 50% Peakstone Index Company details on pages 5-7 0% -50% Source: Capital IQ, data as of 8/8/2017. -
ENVIRONMENTAL REPORT 2017 Contents CONTENTS How to Each Page in This Report Contains Navigation Buttons and Category Tabs to Make It Easy to Move from Page to Page
Renesas Electronics ENVIRONMENTAL REPORT 2017 Contents CONTENTS How to Each page in this report contains navigation buttons and category tabs to make it easy to move from page to page. Use Contents/Editorial Policies 1 ■ Category tab Top Message 2 Contents/Editorial Policies/ Go to top page in each category. (Corporate Outline) How to Use/Editorial Policies Renesas Electronics Group EnvironmentalTop Message Measures 3 Eco-Management Initiative 5 Renesas Electronics Group Eco-FactoriesEnvironmental Initiative Measures 7 Eco-Products Initiative 12 Eco-Management Initiative ■ Link button Eco-Communication Initiative 15 European RoHS initiatives OpinionEco-Factories exchange Initiative meeting with Fujitsu Limited 17 https://www.renesas.com/en-eu/support/products-common/lead/rohs.html Links to site outside of the report. Eco-Products Initiative ■ Navigation button Eco-Communication Initiative Go back one page. Opinion exchange meeting Go forward one page. with Fujitsu Limited Editorial Policies Reporting Scope This Environmental Report is intended for the many stakeholders of the Renesas The report covers the Renesas Electronics Group, which consists of Renesas Electronics Electronics Group, including employees, customers, members of the local communities Corporation, 5 domestic Group companies and 22 overseas Group companies. where we conduct business, suppliers, partners, shareholders and investors. With the In this Environmental Report, we use the fiscal year, which ends on the last day of March objective of promoting two-way communication between the Company and these until FY 2015. Note that from 2016 is a period of transition for International Accounting stakeholders, this report explains our approach to the environment and illustrates our Standards. Refer to the example below.