Leading Optical Chip and Module Manufacturers Announce New Pluggable Transceiver Module Multi-Source Agreement for 40 Gbps Solution with an Optical Device (XLMD2)
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Defendants and Auto Parts List
Defendants and Parts List PARTS DEFENDANTS 1. Wire Harness American Furukawa, Inc. Asti Corporation Chiyoda Manufacturing Corporation Chiyoda USA Corporation Denso Corporation Denso International America Inc. Fujikura America, Inc. Fujikura Automotive America, LLC Fujikura Ltd. Furukawa Electric Co., Ltd. G.S. Electech, Inc. G.S. Wiring Systems Inc. G.S.W. Manufacturing Inc. K&S Wiring Systems, Inc. Kyungshin-Lear Sales And Engineering LLC Lear Corp. Leoni Wiring Systems, Inc. Leonische Holding, Inc. Mitsubishi Electric Automotive America, Inc. Mitsubishi Electric Corporation Mitsubishi Electric Us Holdings, Inc. Sumitomo Electric Industries, Ltd. Sumitomo Electric Wintec America, Inc. Sumitomo Electric Wiring Systems, Inc. Sumitomo Wiring Systems (U.S.A.) Inc. Sumitomo Wiring Systems, Ltd. S-Y Systems Technologies Europe GmbH Tokai Rika Co., Ltd. Tram, Inc. D/B/A Tokai Rika U.S.A. Inc. Yazaki Corp. Yazaki North America Inc. 2. Instrument Panel Clusters Continental Automotive Electronics LLC Continental Automotive Korea Ltd. Continental Automotive Systems, Inc. Denso Corp. Denso International America, Inc. New Sabina Industries, Inc. Nippon Seiki Co., Ltd. Ns International, Ltd. Yazaki Corporation Yazaki North America, Inc. Defendants and Parts List 3. Fuel Senders Denso Corporation Denso International America, Inc. Yazaki Corporation Yazaki North America, Inc. 4. Heater Control Panels Alps Automotive Inc. Alps Electric (North America), Inc. Alps Electric Co., Ltd Denso Corporation Denso International America, Inc. K&S Wiring Systems, Inc. Sumitomo Electric Industries, Ltd. Sumitomo Electric Wintec America, Inc. Sumitomo Electric Wiring Systems, Inc. Sumitomo Wiring Systems (U.S.A.) Inc. Sumitomo Wiring Systems, Ltd. Tokai Rika Co., Ltd. Tram, Inc. 5. Bearings Ab SKF JTEKT Corporation Koyo Corporation Of U.S.A. -
Integrated Report 2018 1
Integrated Report 2018 1 The latest information on the Maxell Group can be found on our website. Editorial Policy This report is issued for the purpose of sharing the vision of the Maxell Group, where business is based on harmonious coexistence with society. This is an integrated report that goes over the Group’s businesses and financial results as well as its CSR activities and the outcomes of these activities. This report, in the wake of the Maxell Group’s transition to a holding company in October 2017, is aimed at renewing stakeholders’ under- standing of the strengths of the new Maxell Group, the overall vision and specific measures of its new Mid-Term Plan, and the connection between both CSV business management and CSR activities and our business strategy, which is geared toward sustainable growth. The Group has worked hard to win support for its position on co-creation and co-prosperity as well as to foster anticipation for and confidence in the Group’s growth, and will continue to do so. Moreover, we include ESG information, which forms the foun- dation of corporate management, as a way to fulfill our social responsibility to all stakeholders and demonstrate the Maxell Group’s stance toward corporate governance, protection of the global environment, and social contributions. Detailed financial and CSR-related information that could not be Regarding Support for Disasters in published in full in this report is disclosed on the Company’s website. For Viewing via PDF Summer 2018 Category tabs, navigation buttons, and link buttons have been provided on each page for easy access to related pages and websites. -
Financial Review
Management’s Discussion and Analysis FIVE-YEAR SUMMARY Toshiba Corporation and Consolidated Subsidiaries Millions of yen, Years ended March 31 except per share amounts and ratio 2018 2017 2016 2015 2014 Net sales (Note 5) ¥ 3,947,596 ¥ 4,043,736 ¥ 4,346,485 ¥ 4,851,060 ¥ 4,722,987 Operating income (loss) (Note 6) 64,070 82,015 (581,376) (72,496) 8,836 Income (loss) from continuing operations, before income 82,378 44,945 (499,439) (122,333) (64,917) taxes and noncontrolling interests Net income (loss) attributable to shareholders 804,011 (965,663) (460,013) (37,825) 60,240 of the Company Comprehensive income (loss) attributable to shareholders 819,189 (844,585) (752,518) 90,638 236,392 of the Company Equity attributable to shareholders of the Company 783,135 (552,947) 328,874 1,083,996 1,027,189 Total equity (Note 7) 1,010,734 (275,704) 672,258 1,565,357 1,445,994 Total assets 4,458,211 4,269,513 5,433,341 6,334,778 6,172,519 Per share of common stock: (Yen) (Note 8) 120.18 (130.60) 77.67 256.01 242.58 Earnings (loss) per share attributable to shareholders of the Company (Yen) (Notes 9 and 10) −Basic 162.89 (228.08) (108.64) (8.93) 14.23 −Diluted − − − − − Shareholders' equity ratio (%) (Note 8) 17.6 (13.0) 6.1 17.1 16.6 Return on equity ratio (%) (Notes 8 and 11) 698.6 − (65.1) (3.6) 6.5 Price-to-earnings ratio (PER) (Note 12) 1.89 − − − 30.72 Net cash provided by (used in) operating activities 41,641 134,163 (1,230) 330,442 284,132 Net cash provided by (used in) investing activities (150,987) (178,929) 653,442 (190,130) (244,101) Net cash provided by (used in) financing activities (63,613) (219,758) 135,747 (125,795) (89,309) Cash and cash equivalents at end of year 533,119 707,693 975,529 185,721 155,793 Number of employees (Note 13) 141,256 153,492 187,809 198,741 200,260 Notes:) 1 Toshiba Group's Consolidated Financial Statements are based on US Generally Accepted Accounting Principles. -
Published on July 21, 2021 1. Changes in Constituents 2
Results of the Periodic Review and Component Stocks of Tokyo Stock Exchange Dividend Focus 100 Index (Effective July 30, 2021) Published on July 21, 2021 1. Changes in Constituents Addition(18) Deletion(18) CodeName Code Name 1414SHO-BOND Holdings Co.,Ltd. 1801 TAISEI CORPORATION 2154BeNext-Yumeshin Group Co. 1802 OBAYASHI CORPORATION 3191JOYFUL HONDA CO.,LTD. 1812 KAJIMA CORPORATION 4452Kao Corporation 2502 Asahi Group Holdings,Ltd. 5401NIPPON STEEL CORPORATION 4004 Showa Denko K.K. 5713Sumitomo Metal Mining Co.,Ltd. 4183 Mitsui Chemicals,Inc. 5802Sumitomo Electric Industries,Ltd. 4204 Sekisui Chemical Co.,Ltd. 5851RYOBI LIMITED 4324 DENTSU GROUP INC. 6028TechnoPro Holdings,Inc. 4768 OTSUKA CORPORATION 6502TOSHIBA CORPORATION 4927 POLA ORBIS HOLDINGS INC. 6503Mitsubishi Electric Corporation 5105 Toyo Tire Corporation 6988NITTO DENKO CORPORATION 5301 TOKAI CARBON CO.,LTD. 7011Mitsubishi Heavy Industries,Ltd. 6269 MODEC,INC. 7202ISUZU MOTORS LIMITED 6448 BROTHER INDUSTRIES,LTD. 7267HONDA MOTOR CO.,LTD. 6501 Hitachi,Ltd. 7956PIGEON CORPORATION 7270 SUBARU CORPORATION 9062NIPPON EXPRESS CO.,LTD. 8015 TOYOTA TSUSHO CORPORATION 9101Nippon Yusen Kabushiki Kaisha 8473 SBI Holdings,Inc. 2.Dividend yield (estimated) 3.50% 3. Constituent Issues (sort by local code) No. local code name 1 1414 SHO-BOND Holdings Co.,Ltd. 2 1605 INPEX CORPORATION 3 1878 DAITO TRUST CONSTRUCTION CO.,LTD. 4 1911 Sumitomo Forestry Co.,Ltd. 5 1925 DAIWA HOUSE INDUSTRY CO.,LTD. 6 1954 Nippon Koei Co.,Ltd. 7 2154 BeNext-Yumeshin Group Co. 8 2503 Kirin Holdings Company,Limited 9 2579 Coca-Cola Bottlers Japan Holdings Inc. 10 2914 JAPAN TOBACCO INC. 11 3003 Hulic Co.,Ltd. 12 3105 Nisshinbo Holdings Inc. 13 3191 JOYFUL HONDA CO.,LTD. -
Leading Optical Device Manufacturers Release Common Specifications for 40 Gbit/S Solutions Based on XLMD Optical Device Multi-Source Agreement
Leading Optical Device Manufacturers Release Common Specifications for 40 Gbit/s Solutions Based on XLMD Optical Device Multi-Source Agreement Multi-Source Agreement Enables Multiple Vendors to Produce 40 Gbit/s Optical Devices Based on a Unified Standard TOKYO, JAPAN & SAN DIEGO, CA: February 21, 2008 – Eudyna Devices Inc., Mitsubishi Electric Corp., NEC Electronics Corp., Oki Electric Industry Co., Ltd., Opnext Inc. and Sumitomo Electric Industries, Ltd., today announced, in advance of OFC/NFOEC, common specifications for pigtail type optical devices based on the 40 Gbit/s Optical Device Multi-Source Agreement (XLMD-MSA*1), introduced by the six companies in March 2007. The newly available XLMD-MSA specifications detail the external-modulation laser transmitter devices with built-in driver ICs and the PIN-TIA*2 receiver devices that comply with 40 Gbit/s interface standard for SONET OC-768*3. 10 Gbit/s optical transmission interfaces are widely deployed in Metropolitan Area Networks (MAN), Local Area Networks (LAN) and Storage Area Networks (SAN). These networks currently form the backbone of broadband infrastructure, consequently increasing the popularity of 40 Gbit/s optical transmission interfaces. The XLMD-MSA aims to establish compatible sources of 40 Gbit/s optical transmitter and receiver devices embedded into the 40 Gbit/s optical transceiver modules. This agreement will accelerate the growth of the 40 Gbit/s transceiver module market, providing advanced solutions to high capacity network and storage systems. All members will promote the MSA-compliant products in order to achieve consistent customer delivery and market growth. The XLMD-MSA specifications for compatible optical devices include: Mechanical dimensions and pin assignments of pigtail type optical devices High speed electrical interface using a dual SMPM*4 connectors Optical and electrical characteristics The specifications are now available at the XLMD-MSA web site. -
2SK3446 Datasheet
To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. 4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. -
Internal Round Table Discussion: the Potential of the Field Solutions Business
Internal Round Table Discussion: The Potential of the Field Solutions Business Our field solutions (FS) business undertakes the maintenance, repair, and modification of semiconductor production equipment supplied by the TEL Group to customers, and until now responsibility for these business activities was spread over multiple organizations, including post-sales divisions. In October 2009 these activities were unified and our FS business launched. Employees involved in this area conducted a round table discussion of the potential for FS business (the discussion was held on June 28, 2010). Generating innovation in the FS business local situations and creating ideas independently. Asano: I feel that the equipment modification business, Moderator: Business models in the world are changing which was inactive only a few years ago, has really changed. dramatically. From now on not only cutting-edge but also Our company is now calling this a period of innovation and low-cost and other numerous semiconductor applications growth. In the FS business, too, we intend to construct new are going to become necessary, especially when aiming business models and generate innovation. at developing countries. Is there a relationship between Sakamoto: I think that one way to generate innovation is the background to these times and the launching of the FS through interpersonal communication. By expanding our business? FS business, our close communication with customers has Kaminaga: In our FS business, the entire TEL Group is become livelier than ever before and this has promoted responding to the polarization of the market into competing innovation. Moreover, by making use of the broad knowledge with cutting-edge technology and effectively utilizing existing and know-how we have accumulated in developing both devices and production lines through the sale of TEL-certified hardware and software, we provide consulting services for used equipment and other efforts. -
FTSE Japan ESG Low Carbon Select
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Japanese Semiconductor Manufacturing
+44 20 8123 2220 [email protected] Japanese Semiconductor Manufacturing Industry Development and Strategies of Key Players https://marketpublishers.com/r/JE397FCA2F5EN.html Date: August 2019 Pages: 29 Price: US$ 1,260.00 (Single User License) ID: JE397FCA2F5EN Abstracts The Japanese semiconductor industry, which previously operated under the IDM (Integrated Device Manufacturer) model, not only was a leader in Asia, but also had a unprecedented role in the world. After many years passed, Japan was too slow to adjust to structural changes in the industry, causing it to gradually lose its edge. This report covers the current status and future development of the industry as it gears itself towards new application markets such as autonomous vehicles and explores strategies of key players, including Toshiba, Panasonic, Fujitsu, Renesas Electronics, and Sony. Japanese Semiconductor Manufacturing Industry Development and Strategies of Key Players +44 20 8123 2220 [email protected] Contents 1.INDUSTRY STATUS 1.1 Toshiba is the Only Japan’s Semiconductor Brand Left on Top 10 Player List 2. DEVELOPMENT OF JAPAN'S KEY PLAYERS 2.1 Toshiba 2.1.1 Japan’s No. 1 Semiconductor Manufacturer, Ranked 8th in the World 2.1.2 NAND Flash is Toshiba’s Main Semiconductor Revenue Source 2.1.3 Toshiba Memory Corporation (TMC) Spun off to Fix Accounting Issues 2.2 Panasonic 2.2.1 Missed Market Changes, Poor Operations, No Longer a Top-ranked Company 2.2.2 Tightening Belts to Focus on Sensors 2.3 Fujitsu 2.3.1 Ranked 20th in the World, with no Standout -
Committee Chairman Yukihiro SATO Senior Executive Adbisor, Mitsubishi Electric Corporation Deputy Committee Chairman Toshizo
No.1 List of Corporate Finance Executive Committee Members Committee Chairman Yukihiro SATO Senior Executive Adbisor, Mitsubishi Electric Corporation Deputy Committee Chairman Toshizo TANAKA Representative Director, Executive Vice President & CFO, CANON INC. Committee Members Board Director, Managing Executive Officer, General Manager of Finance & Accounting Ichiro TERAI Division, IHI Corporation Setsuji KIMURA Auditior, Aichi Sangyo Co., LTD. Hideki KOBORI Director, Senior Executive Officer, ASAHI KASEI CORPORATION Takao KATO Corporate Senior Vice President, Accounting Headquaters, ORIX Corporation Mikio FUJITSUKA Director, Senior Executive Officer and Chief Financial Officer, Komatsu LTD. Director, Senior Vice President, Corporate Planning DepartmentⅡ , Finance & Investor Ichiro UCHIJIMA Relations Department, JX Holdings, Inc. Nobuya HARA Executive Assistant, General Manager, Comptroller's Dept., JFE Holdings, Inc. Executive Vice President & representative Director, Chief Financial Officer, Shimizu Seikichi KUROSAWA Corporation Representative Director and Executive Vice President, Nippon Steel & Sumitomo Metal Katsuhiko OTA Corporation Kunio NOZAKI Managing Executive Officer, Sumitomo Chemical Co., LTD. Koichi TAKAHATA Managing Executive Officer, Sumitomo Corporation Director and Chief Financial Officer, Executive Officer, Finance Planning Dept, Kunio TAKAHASHI Seven & I HLDGS. CO., LTD Masaru KATO EVP and Chief Financial Officer, Corporate Excective Officer, Sony Corporation Yoshiaki NISHIURA President, Tokai Rubber Group Katsuyuki -
Emerging-Technology Mitsubishi Electric Develops
Mitsubishi Electric Develops Camera that Refocuses Photos - Emerging Technology Page 1 of 3 Ads by Google Digital Camera Tips Photography Digital Print Digital Photos Digital Backdrops Digital Headshots Digital Camera Reviews Digital Camera Ratings emerging-technology Digital Camera Prices Home > News > emerging-technology > Mitsubishi Electric Develops Camera that Refocuses Photos Find a Store Digital Camera Forum News, Guides, Tips Mitsubishi Electric Develops Camera that Refocuses Photos Videos by Karen M. Cheung Cameras for Parents Buyers Guide Canon Casio April 18, 2007 – Every photographer has experienced the letdown of an out-of-focus picture that is otherwise perfect. Blame it on the photographer or blame it on the auto focus, but call the blurry photo lost Fuji for good – until now. Scientists at Mitsubishi Electric Research Labs (MERL) last GE week announced the heterodyne light field camera that makes refocusing after capture possible. Using coded aperture that can increase depth of field by 10 Hasselblad times, the camera essentially deblurs an image after it is captured, according to HP the researchers. Kodak “[Out-of-focus pictures are] the Holy Grail problem,” said MERL Senior Leica Researcher Scientist Ramesh Raskar in an interview with DigitalCameraInfo.com. “But we can change the original image which is extremely beneficial.” Nikon Olympus Changing 2D into 4D with a Crossword Puzzle: Panasonic How Optical Heterodyning Works Pentax After two years of development, the MERL project was accepted last week into the Siggraph Conference, which is the international computer graphics convention Ricoh that will be held this August in San Diego. MERL has already caught the attention Samsung of the imaging tech industry. -
ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan
ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan Shozo Saito Chairman, ISSM2020 Organizing Committee Device & System Platform Development Center Co., Ltd. Shuichi Inoue, ATONARP INC. It is our great pleasure to announce that The 28th annual International Symposium on Semiconductor Manufacturing (ISSM) 2020 will be held on December 15-16, 2020 at KFC Hall, Ryogoku, Tokyo in cooperation with e-Manufacturing & Design Collaboration Symposium (eMDC) which is sponsored by TSIA with support from SEMI and GSA. The program will feature keynote speeches by world leading speakers, timely and highlighted topics and networking sessions focusing on equipment/materials/software/services with suppliers' exhibits. ISSM continues to contribute to the growth of the semiconductor industry through its infrastructure for networking, discussion, and information sharing among the world's professionals. We would like you to cooperate with us by supporting the ISSM 2020. Please see the benefit of ISSM2020 sponsorship. Conference Overview Date: December 15-16, 2020 Location: KFC (Kokusai Fashion Center) Hall 1-6-1 Yokoami Sumidaku, Tokyo 130-0015 Japan +81-3-5610-5810 Co-Sponsored by: IEEE Electron Devices Society Minimal Fab Semiconductor Equipment Association of Japan (SEAJ) Semiconductor Equipment and Materials International (SEMI) Taiwan Semiconductor Industry Association (TSIA) Endorsement by: The Japan Society of Applied Physics Area of Interest: Fab Management Factory Design & Automated Material