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2013NAND Flash Market Annual Report
NATIONAL IC DESIGN SHENZHEN INDUSTRIAL CENTER CHINAFLASHMARKET.COM PROVIDES THE 2013 NAND Flash market annual report LATEST MARKET INFORMATION Comprehensive and accurate NAND Flash market data report January 10, 2014 Deeply analyze and demonstrate NAND Industry analysis report 2013 global no brand tablet chip shipments will reach 130 million, to Flash market situation Provide latest market trend, display seize the tablet market share newproducts 2013, the domestic tablet chip vendors as: Allwinner, Rockchip, Amlogic and other leading on no Fully provide professional market consulting brand tablet’ sales astonishing. MediaTek due to integrate the advantages of 3G communications services tablet, began full force in the tablet market. Expects 2013 global chip no brand tablet shipments will reach 130 million, in 2014 shipments are expected to rise to 160-180 million, while the surge in shipments of market competition will become more significant. Controller Flash Chip cost down the SSD cost and the interface is transferring from SATA III to PCIe 2013 the price of SSD with SATA III interface fell by 10% to 20% and in 2014 will continue to fell, while SSD controller chip plant in 2014 increasing support for TLC NAND Flash and PCIe interface, the second half is expected to be low TLC SSD enter the consumer market applications and at the end of this year SSD PCIe interface will become the mainstream in the high-end notebook. Market trend of NAND Flash market situation in 2013 2000 price index 1900 www.ChinaFlashMarket.com 1800 Contact : 1700 Tel:+86 0755-86133027 1600 Fax:+86 0755-86185012 Email:[email protected] 1500 Add:Room 6/F,Building No4.,Software park keji Middle 2 Road,Hi-tech Industrial park,NanShan 1400 Distrist.ShenZhen,P.R.C 1300 Copyright 2012 Shenzhen Flashmarket Information Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Co., Ltd . -
Ultra-Low Energy Charge Trap Flash Based Synapse Enabled by Parasitic Leakage Mitigation
Ultra-low Energy charge trap flash based synapse enabled by parasitic leakage mitigation Shalini Shrivastava*, Tanmay Chavan and Udayan Ganguly† Department of Electrical Engineering, Indian Institute of Technology Bombay, Mumbai, 400076, India † *[email protected]; [email protected] Abstract shown [13][18]. In addition, for fixed 푉푝푢푙푠푒 applied Brain-inspired computation promises complex cognitive repeatedly, 퐺 increases/decreases gradually and then saturates 4 푚푎푥 tasks at biological energy efficiencies. The brain contains 10 (Fig. 1d). For fixed 푉푝푢푙푠푒, the maximum Δ퐺 (i.e., 훥퐺 ) synapses per neuron. Hence, ultra-low energy, high-density occurs initially. Synapses have two key challenges. First, both synapses are needed for spiking neural networks (SNN). In LTP and LTD this paper, we use tunneling enabled CTF (Charge Trap Flash) stack for ultra-low-energy operation (1F); Further, CTF on an SOI platform and back-to-back connected pn diode and Zener diode (2D) prevent parasitic leakage to preserve energy advantage in array operation. A bulk 100 휇푚 × 100 휇푚 CTF operation offers tunable, gradual conductance change (Δ퐺) i.e. 104 levels, which gives 100 × improvement over literature. SPICE simulations of 1F2D synapse shows ultra- low energy (≤ 3 fJ/pulse) at 180nm node for long-term potentiation (LTP) and depression (LTD), which is comparable to energy estimate in biological synapses (10 fJ). A record low learning rate (i.e., maximum Δ퐺<1% of 퐺- range) is observed – which is tunable. Excellent reliability (> 106 endurance cycles at full conductance swing) is observed. Such a highly energy efficient synapse with tunable learning rate on the CMOS platform is a key enabler for the Fig. -
Redacted Public Version 28
Case3:11-cv-04689-WHO Document250 Filed06/11/14 Page1 of 109 MICHAEL S. ELKIN (admitted pro hac vice) 1 [email protected] THOMAS P. LANE (admitted pro hac vice) 2 [email protected] WINSTON & STRAWN LLP 3 200 Park Avenue New York, NY 10166-4193 4 Telephone: 212.294.6700 Facsimile: 212.294.4700 5 ERIN R. RANAHAN (No. 235286) 6 [email protected] DREW A. ROBERTSON (No. 266317) 7 [email protected] WINSTON & STRAWN LLP 8 333 S. Grand Avenue, Suite 3800 Los Angeles, CA 90071-1543 9 Telephone: 213.615.1700 Facsimile: 213.615.1750 10 DANIEL B. ASIMOW (No. 165661) 11 [email protected] ROBERT D. HALLMAN (No. 239949) 12 [email protected] ARNOLD & PORTER LLP 13 Three Embarcadero Center, 10th Floor San Francisco, CA 94111-4024 14 Telephone: 415.471.3100 Facsimile: 415.471.3400 15 Attorneys for Plaintiff 16 PNY TECHNOLOGIES, INC. 17 UNITED STATES DISTRICT COURT 18 NORTHERN DISTRICT OF CALIFORNIA 19 SAN FRANCISCO DIVISION 20 21 PNY TECHNOLOGIES, INC., Case No.: 11-cv-04689 WHO 22 Plaintiff, THIRD AMENDED COMPLAINT FOR 23 ANTITRUST VIOLATIONS; v. DECLARATORY RELIEF; AND 24 UNFAIR COMPETITION SANDISK CORPORATION, 25 DEMAND FOR JURY TRIAL Defendant. 26 27 REDACTED PUBLIC VERSION 28 PNY’S THIRD AMENDED COMPLAINT 11-cv-04689-WHO LA:355215.1 Case3:11-cv-04689-WHO Document250 Filed06/11/14 Page2 of 109 1 Plaintiff PNY Technologies, Inc. (“PNY”), by and through its attorneys, Winston & Strawn 2 LLP and Arnold & Porter LLP, files this Third Amended Complaint against Defendant SanDisk 3 Corporation (“SanDisk”) to secure damages, declaratory relief and injunctive relief, and demanding 4 trial by jury, claims and alleges as follows: 5 NATURE OF ACTION 6 1. -
Technology of Enterprise Solid State Drive
White Paper | April 2014 Technology of Enterprise Solid State Drive Recently, large capacity and high-performance storages are highly required in the cloud computing and data center due to rapidly increasing amount of information and number of access. When many people heavily access to internet services such as social network service (SNS) or web search engine, they will always expect an instant response from the service. In the corporate on-premise network system and financial trading system, micro seconds range of the response time makes big difference to the business outcome. As an evolution of the enterprise server and storage system, more focus is placed on speed, response time and latency to support large number of SNS user accesses and time-critical business transactions. Then Solid State Drive (SSD) plays an important role for server system to make the transactions faster. Enterprise class SSD is a storage device with NAND flash memories and required the design to store and retrieve data at very high speed under high duty operation conditions with reliable endurance performance. It will be very beneficial for system managers to deploy SSD for boosting up computing process and storage access speed. By positioning between host processor and hard disk drive (HDD) storage pools as a large cache memory, SSD increases the system transaction speed. SSD has also good points, in addition to higher performance, such as smaller footprint and lower power consumption. Toshiba has matured leading edge technologies in the SSD as the first company developing NAND flash memory. Interfaces Host Controller Interface) is popular for client application. -
3D NAND Flash Based on Planar Cells
computers Review 3D NAND Flash Based on Planar Cells Andrea Silvagni Macronix, Via Val Passiria 8, Milan 20100, Italy; [email protected] or [email protected] Received: 28 July 2017; Accepted: 27 September 2017; Published: 24 October 2017 Abstract: In this article, the transition from 2D NAND to 3D NAND is first addressed, and the various 3D NAND architectures are compared. The article carries out a comparison of 3D NAND architectures that are based on a “punch-and-plug” process—with gate-all-around (GAA) cell devices—against architectures that are based on planar cell devices. The differences and similarities between the two classes of architectures are highlighted. The differences between architectures using floating-gate (FG) and charge-trap (CT) devices are also considered. Although the current production of 3D NAND is based on GAA cell devices, it is suggested that architectures with planar cell devices could also be viable for mass production. Keywords: NAND flash; 3D NAND flash 1. Introduction It is commonly understood that there is a lesser-known observation of Gordon Moore, sometimes referred as Moore’s second law, which is related to the cost expenditure increase to produce the next generation of processors. Whether we want to refer to Moore or not, fab cost and yield are economic limitation factors for the increase in the number of transistors per chip per each new generation. Nevertheless, we cannot think of a future without more powerful computers and huge data saved in the cloud; therefore the race keeps going. Regarding data, the industry is forced to explore new ways to pack bits in a smaller space, while the physical limitations on further miniaturization block the old path. -
8.11.15 Hied K12 3PP Price List
Apple Inc. K-12 and Higher Education Institution US Only Third-Party Products: Software Licensing and Hardware Price List August 11, 2015 Table Of Contents Page • How to Order 1 • Revisions to the Price List 1-3 SECTION A: THIRD-PARTY HARDWARE 3-20 • Bags & Cases 3-6 • Cables 6-7 • Carts, Mounts & Stands 7-9 • Digital Cameras 9 • Headphones 9-10 15-16 • Input Devices 10-11 • iPad Accessories 11-12 • iPad Cases 12-13 • iPhone/iPod Accessories 13-14 • iPhone Cases 14-16 • iPod Cases 16 • Music Creation 16 -17 • Networking 17 • Printers 17 • Printer Supplies Note: Printer supplies are no longer offered through Apple 17 • Projectors & Presentation 17 • Scanners 17 • Security & More 17-18 • Server Accessories 18-19 • Speakers & Audio 19 • Storage 19-20 SECTION B: THIRD-PARTY SOFTWARE LICENSING 20-29 • Creativity & Productivity Tools 20-21 • IT Infrastructure & Learning Services 21-26 • IT Infrastructure & Wireless Networking Products 26-31 SECTION C: FOR MORE INFORMATION 28-29 • Apple Store for Education 29 • Third-Party Websites 29 • Third-Party Sales Policies 29 • Third-Party Products and Ship-Complete Orders 29 HOW TO ORDER Many of the products on this price list are available to order online from the Apple Store for Education: www.apple.com/education/store or 800-800-2775 Purchase orders for all products may be submitted to: Apple Inc. Attn: Apple Education Sales Support 12545 Riata Vista Circle Mail Stop: 198-3ED Austin, TX 78727-6524 Phone: 1-800-800-2775 Fax: (800) 590-0063 IMPORTANT INFORMATION REGARDING ORDERING THIRD PARTY SOFTWARE LICENSING Contact Information: End-user (or, tech coordinator) contact information is required in order to fulfill orders for third party software licensing. -
MOSFET - Wikipedia, the Free Encyclopedia
MOSFET - Wikipedia, the free encyclopedia http://en.wikipedia.org/wiki/MOSFET MOSFET From Wikipedia, the free encyclopedia The metal-oxide-semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET), is by far the most common field-effect transistor in both digital and analog circuits. The MOSFET is composed of a channel of n-type or p-type semiconductor material (see article on semiconductor devices), and is accordingly called an NMOSFET or a PMOSFET (also commonly nMOSFET, pMOSFET, NMOS FET, PMOS FET, nMOS FET, pMOS FET). The 'metal' in the name (for transistors upto the 65 nanometer technology node) is an anachronism from early chips in which the gates were metal; They use polysilicon gates. IGFET is a related, more general term meaning insulated-gate field-effect transistor, and is almost synonymous with "MOSFET", though it can refer to FETs with a gate insulator that is not oxide. Some prefer to use "IGFET" when referring to devices with polysilicon gates, but most still call them MOSFETs. With the new generation of high-k technology that Intel and IBM have announced [1] (http://www.intel.com/technology/silicon/45nm_technology.htm) , metal gates in conjunction with the a high-k dielectric material replacing the silicon dioxide are making a comeback replacing the polysilicon. Usually the semiconductor of choice is silicon, but some chip manufacturers, most notably IBM, have begun to use a mixture of silicon and germanium (SiGe) in MOSFET channels. Unfortunately, many semiconductors with better electrical properties than silicon, such as gallium arsenide, do not form good gate oxides and thus are not suitable for MOSFETs. -
2020 ANNUAL MEMBERS MEETING October 22, 2020 8AM Pacific / 11AM Eastern – Teleconference (See Next Page for Dial-In and Zoom Instructions)
2020 ANNUAL MEMBERS MEETING October 22, 2020 8AM Pacific / 11AM Eastern – Teleconference (See Next Page for Dial-in and Zoom Instructions) 1 | ©2020 Storage Networking Industry Association. All Rights Reserved. Conference Call Dial-in and Zoom Info https://www.snia.org/annualmeeting Link will start Zoom meeting – afterwards, redirects to copy of the presentation materials Teleconference/Zoom coordinates: Zoom Meeting ID: 988 4674 5668 Passcode: 102220 https://zoom.us/j/98846745668?pwd=SW5BUzAxdUJZVDFhTmhPS2VNd0FKZz09 One tap mobile +16699009128,,98846745668#,,,,,,0#,,102220# US (San Jose) +13462487799,,98846745668#,,,,,,0#,,102220# US (Houston) +16465588656,,98846745668#,,,,,,0#,,102220# US (New York) Find your local number: https://zoom.us/u/aekOw6XZjj 2 | ©2020 Storage Networking Industry Association. All Rights Reserved. Zoom Format – Attendee Guidance . Enter Name (Company) on your Zoom Login/Attendee Info . Everyone will be on Mute, except the Moderator/Speaker . You can unmute yourself if you would like to say something . Voting Member Company Primary/Alternate representatives, please identify yourself when joining . Remain on Mute when not speaking . Use the Chat Icon to text message the group or a particular person . Use Raised Hand function under “participants” icon 3 | ©2020 Storage Networking Industry Association. All Rights Reserved. 2020 Annual Members Meeting Agenda . Greetings and Roll Call – Michael Oros, Executive Director . FY2019: Annual Report published . Motion to Approve 2019 Meeting Minutes – Jim Pappas, SNIA Secretary . Fiscal Report (2019 Annual Report) – Sue Amarin, SNIA Treasurer . FY2020: SNIA update and achievements to date – Michael Oros, Executive Director . FY2021: What’s ahead for SNIA – J Metz, Ph.D, SNIA Chairman . Special Guest Speakers: EPA: Ryan Fogle; DMTF: Jeff Hilland; NVM Express: Amber Huffman . -
Media Briefing
Media Briefing SANJAY MEHROTRA | President and Chief Executive Officer Mr. Mehrotra joined Micron in May 2017, after a long and distinguished career at SanDisk Corporation where he led the company from start-up in 1988 until its eventual sale in 2016. In addition to being a SanDisk co-founder, Mr. Mehrotra served as its president and CEO from 2011 to 2016, overseeing its growth to an industry-leading Fortune 500 company. Prior to SanDisk, Mr. Mehrotra held design engineering positions at Integrated Device Technology, Inc., SEEQ Technology and Intel Corporation. Mr. Mehrotra earned both bachelor’s and master’s degrees in electrical engineering and computer science from the University of California, Berkeley and is a graduate of the Stanford Graduate School of Business Executive Program (SEP). He currently serves on the board of directors of Cavium, Inc. Mr. Mehrotra holds more than 70 patents and has published articles in the areas of nonvolatile memory design and flash memory systems. MANISH BHATIA | Executive Vice President, Global Operations Mr. Bhatia is responsible for driving the vision and direction for Micron’s end-to-end operations. Mr. Bhatia joined Micron in 2017. Mr. Bhatia most recently served as the executive vice president of Silicon Operations at Western Digital Corporation. Prior to that, Mr. Bhatia held several executive roles at SanDisk Corporation and was the company’s executive vice president of Worldwide Operations when it was acquired by Western Digital. Prior to SanDisk, Mr. Bhatia’s career included positions at Matrix Semiconductor, McKinsey & Company and Saint Gobain Corporation. Mr. Bhatia earned bachelor’s and master’s degrees in mechanical engineering from the Massachusetts Institute of Technology and a master’s degree in business administration from MIT’s Sloan School of Management, which he attended as a Leaders for Manufacturing fellow. -
The Rise of the Flash Memory Market: Its Impact on Firm
The Rise of the Flash Web version: Memory Market: Its Impact July 2007 on Firm Behavior and Author: Global Semiconductor Falan Yinug1 Trade Patterns Abstract This article addresses three questions about the flash memory market. First, will the growth of the flash memory market be a short- or long-term phenomenon? Second, will the growth of the flash memory market prompt changes in firm behavior and industry structure? Third, what are the implications for global semiconductor trade patterns of flash memory market growth? The analysis concludes that flash memory market growth is a long-term phenomenon to which producers have responded in four distinct ways. It also concludes that the rise in flash memory demand has intensified current semiconductor trade patterns but has not shifted them fundamentally. 1 Falan Yinug ([email protected]) is a International Trade Analyst from the Office of Industries. His words are strictly his own and do not represent the opinions of the US International Trade Commission or of any of its Commissioners. 1 Introduction The past few years have witnessed rapid growth in a particular segment of the 2 semiconductor market known as flash memory. In each of the past five years, for example, flash memory market growth has either outpaced or equaled that 3 of the total integrated circuit (IC) market (McClean et al 2004-2007, section 5). One observer expects flash memory to have the third-strongest market growth rate over the next six years among all IC product categories (McClean et al 2007, 5-6). As a result, the flash memory share of the total IC market has increased from 5.5 percent in 2002, to 8.1 percent in 2005. -
Ulltradimm™ SSD Overview
ULLtraDIMM™ SSD Overview Rob Callaghan June 9th, 2014 c 1 A Global Leader in Flash Storage Solutions Rankings Trailing 4 Qtr Financials* Global Operations Leading Retail Brand° $6.2B Revenue #1 Global Retail $3.6B Net Cash* Revenue $0.7B R&D Investment 5,500 Employees† Share SanDisk Client All Leading & Retail SSDs Smartphone Approved & Tablet Supplier to Qualified at Manufacturers All Leading PC 6 of the Top 7 use SanDisk Manufacturers Server & Storage OEMs Enterprise SSDs and Storage Software *Financials as of Q4, ‘13. Net Cash = [Cash + cash equivalents + short-term & long-term marketable securities] less [debt at maturity value] as of the end of Q4, ‘13. †Headcount as of Jan., ‘14. NPD Estimate, Nov., ‘13. Estimates of the memory card & USB markets from NPD (Nov. ‘13) and GfK Retail and Technology, Sep., ‘13. 2 Enabling Flash Storage from Wafer to Software NAND TECH NAND DIE SCALE ASSY, TEST & CONTROLLER FLASH MGMT SSD SOFTWARE PACKAGING Close to Half of Industry Bit Output World-Leading Innovator + Together with manufacturing 4,900 Patents partner Toshiba Fabs: World class NAND capacity 1991 2013 Patents as of Oct., ‘13; NPD Estimate, Nov., ‘13. Gartner: NAND Flash Supply & Demand, WW 1Q ‘12-4Q ‘14, 3Q ’13. Update Dec., ‘13. 3 The Path to Ultra Low Latency & Scalable Performance DDR 1’s 10’s PCIe 100’s Latency (µsec) speed memory bus speed memory 1000’s on high the Flash Storage SAS/SATA/FC 1,000,000 100 100,000 IOPS 4 Creating a New Storage Interface This is a This is DRAM with SATA DIMM battery backup Flash Flash Flash Flash Flash -
Trabajo De Graduación: Valuación De Micron Technology Inc. Autor: Nicolas Vallejos DNI: 40127617 Director De Tesis: Ignacio Warnes Buenos Aires, El 11 De Mayo 2021
Universidad de San Andrés Universidad de San Andrés Escuela de Administración y Negocios Magister en Finanzas Trabajo de Graduación: Valuación de Micron Technology Inc. Autor: Nicolas Vallejos DNI: 40127617 Director de tesis: Ignacio Warnes Buenos Aires, el 11 de mayo 2021 1 Universidad de San Andrés Contenido Micron Technology 4 1. La industria de semiconductores: 8 1.1 El plan “made in China.” 9 2. Mercado de DRAM y NAND: 11 2.1 DRAM: 13 2.1.1. El mercado DRAM 13 2.1.2. Una Consolidación del mercado 16 2.1.3 Clases de DRAM: 19 2.2 NAND: 20 2.2.1. El mercado NAND 21 2.2.2. Una Consolidación del mercado 23 2.2.3. Tipos de NAND: 24 3. Análisis macroeconómico: 25 3.1 Estados Unidos: 25 3.2 Europa: 26 3.3 China: 28 4. Análisis financiero 28 4.1 Ratios de crecimiento: 28 4.2 Ratios de deuda: 35 4.3 Análisis de Dupont 35 4.4 Márgenes de Micron 37 4.5 Ratios de eficiencia: 38 5. Capex e I+D: 39 6. Manufactura: 42 7. Adquisiciones: 44 8. Patentes 45 9. Valuación por flujos descontados 46 9.1 Proyección de mercados 46 9.1.1 Mercado DRAM y NAND 46 9.1.2 Proyección cuotas de mercado Micron en DRAM 56 9.1.3 Proyección cuotas de mercado Micron en NAND 58 2 Universidad de San Andrés 9.2 Proyección inversión y desarrollo 61 9.3 Proyección de CAPEX 61 9.4. Estimación costo de los bienes vendidos 62 9.5 Estimación de depreciación y amortización 63 9.6.