UNIT 3 FIELD EFFECT TRANSISTOR JFET JFET Is a Unipolar-Transistor
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												  LSK489 Application NoteLSK489 Application Note Low Noise Dual Monolithic JFET Bob Cordell Introduction For circuits designed to work with high impedance sources, ranging from electrometers to microphone preamplifiers, the use of a low-noise, high-impedance device between the input and the op amp is needed in order to optimize performance. At first glance, one of Linear Systems’ most popular parts, the LSK389 ultra-low-noise dual JFET would appear to be a good choice for such an application. The part’s high input impedance (1 T Ω) and low noise (1 nV/ √Hz at 1kHz and 2mA drain current) enables power transfer while adding almost no noise to the signal. But further examination of the LSK389’s specification shows an input capacitance of over 20pF. This will cause intermodulation distortion as the circuit’s input signal increases in frequency if the source impedance is high. This is because the JFET junction capacitances are nonlinear. This will be especially the case where common source amplifier arrangements allow the Miller effect to multiply the effective value of the gate-drain capacitance. Further, the LSK389’s input impedance will fall to a lower value as the frequency increases relative to a part with lower input capacitance. A better design choice is Linear Systems’ new offering, the LSK489. Though the LSK489 has slightly higher noise (1.5 nV/ √Hz vs. 1.0 nV/ √Hz) its much lower input capacitance of only 4pF means that it will maintain its high input impedance as the frequency of the input signal rises. More importantly, using the lower-capacitance LSK489 will create a circuit that is much less susceptible to intermodulation distortion than one using the LSK389.
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												  PN Junction Is the Most Fundamental Semiconductor DeviceFundamentals of Microelectronics CH1 Why Microelectronics? CH2 Basic Physics of Semiconductors CH3 Diode Circuits CH4 Physics of Bipolar Transistors CH5 Bipolar Amplifiers CH6 Physics of MOS Transistors CH7 CMOS Amplifiers CH8 Operational Amplifier As A Black Box 1 Chapter 2 Basic Physics of Semiconductors 2.1 Semiconductor materials and their properties 2.2 PN-junction diodes 2.3 Reverse Breakdown 2 Semiconductor Physics Semiconductor devices serve as heart of microelectronics. PN junction is the most fundamental semiconductor device. CH2 Basic Physics of Semiconductors 3 Charge Carriers in Semiconductor To understand PN junction’s IV characteristics, it is important to understand charge carriers’ behavior in solids, how to modify carrier densities, and different mechanisms of charge flow. CH2 Basic Physics of Semiconductors 4 Periodic Table This abridged table contains elements with three to five valence electrons, with Si being the most important. CH2 Basic Physics of Semiconductors 5 Silicon Si has four valence electrons. Therefore, it can form covalent bonds with four of its neighbors. When temperature goes up, electrons in the covalent bond can become free. CH2 Basic Physics of Semiconductors 6 Electron-Hole Pair Interaction With free electrons breaking off covalent bonds, holes are generated. Holes can be filled by absorbing other free electrons, so effectively there is a flow of charge carriers. CH2 Basic Physics of Semiconductors 7 Free Electron Density at a Given Temperature E n 5.21015T 3/ 2 exp g electrons/ cm3 i 2kT 0 10 3 ni (T 300 K) 1.0810 electrons/ cm 0 15 3 ni (T 600 K) 1.5410 electrons/ cm Eg, or bandgap energy determines how much effort is needed to break off an electron from its covalent bond.
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												  A GUIDE to USING FETS for SENSOR APPLICATIONS by Ron QuanThree Decades of Quality Through Innovation A GUIDE TO USING FETS FOR SENSOR APPLICATIONS By Ron Quan Linear Integrated Systems • 4042 Clipper Court • Fremont, CA 94538 • Tel: 510 490-9160 • Fax: 510 353-0261 • Email: [email protected] A GUIDE TO USING FETS FOR SENSOR APPLICATIONS many discrete FETs have input capacitances of less than 5 pF. Also, there are few low noise FET input op amps Linear Systems that have equivalent input noise voltages density of less provides a variety of FETs (Field Effect Transistors) than 4 nV/ 퐻푧. However, there are a number of suitable for use in low noise amplifier applications for discrete FETs rated at ≤ 2 nV/ 퐻푧 in terms of equivalent photo diodes, accelerometers, transducers, and other Input noise voltage density. types of sensors. For those op amps that are rated as low noise, normally In particular, low noise JFETs exhibit low input gate the input stages use bipolar transistors that generate currents that are desirable when working with high much greater noise currents at the input terminals than impedance devices at the input or with high value FETs. These noise currents flowing into high impedances feedback resistors (e.g., ≥1MΩ). Operational amplifiers form added (random) noise voltages that are often (op amps) with bipolar transistor input stages have much greater than the equivalent input noise. much higher input noise currents than FETs. One advantage of using discrete FETs is that an op amp In general, many op amps have a combination of higher that is not rated as low noise in terms of input current noise and input capacitance when compared to some can be converted into an amplifier with low input discrete FETs.
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												  Junction Field Effect Transistor (JFET)Junction Field Effect Transistor (JFET) The single channel junction field-effect transistor (JFET) is probably the simplest transistor available. As shown in the schematics below (Figure 6.13 in your text) for the n-channel JFET (left) and the p-channel JFET (right), these devices are simply an area of doped silicon with two diffusions of the opposite doping. Please be aware that the schematics presented are for illustrative purposes only and are simplified versions of the actual device. Note that the material that serves as the foundation of the device defines the channel type. Like the BJT, the JFET is a three terminal device. Although there are physically two gate diffusions, they are tied together and act as a single gate terminal. The other two contacts, the drain and source, are placed at either end of the channel region. The JFET is a symmetric device (the source and drain may be interchanged), however it is useful in circuit design to designate the terminals as shown in the circuit symbols above. The operation of the JFET is based on controlling the bias on the pn junction between gate and channel (note that a single pn junction is discussed since the two gate contacts are tied together in parallel – what happens at one gate-channel pn junction is happening on the other). If a voltage is applied between the drain and source, current will flow (the conventional direction for current flow is from the terminal designated to be the gate to that which is designated as the source). The device is therefore in a normally on state.
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												  EE-202 Electronics-I- Field-Effect Transistors JFETEE-202 Electronics-I- Chapter 10 Field-Effect Transistors JFET 1 FET FET (Field-Effect Transistors) - BJTs (Bipolar Junction Transistors). Similarities: • Amplifiers • Switching devices • Impedance matching circuits Differences: • FETs are voltage controlled devices, BJTs are current controlled devices. • FETs have a higher input impedance, BJTs have higher gains. • FETs are less sensitive to temperature variations and they are more easily integrated on ICs. • FETs are generally more sensitive to static than BJTs. 2 FET Types •JFET–– Junction Field-Effect Transistor •MOSFET –– Metal-Oxide Field-Effect Transistor .D-MOSFET –– Depletion MOSFET .E-MOSFET –– Enhancement MOSFET 3 JFET Construction There are two types of JFETs •n-channel •p-channel The n-channel is more widely used. There are three terminals. •Drain (D) and source (S) are connected to the n-channel •Gate (G) is connected to the p-type material 4 JFET Operating Characteristics Three basic operating conditions for a JFET: • VGS = 0, VDS increasing to some positive value • VGS < 0, VDS at some positive value • Voltage-controlled resistor 5 JFET Operating Characteristics VGS = 0, VDS increasing to some positive value When VGS = 0 and VDS is increased from 0 to a more positive voltage; • The depletion region between p-gate and n-channel increases • Increasing the depletion region, decreases the size of the n-channel • Increasing in the n-channel resistance, the ID current increases. 6 JFET Operating Characteristics VGS = 0, VDS increasing to some positive value: Pinch Off VGS = 0 and VDS is increased to a more positive voltage, the depletion zone gets so large that it pinches off the n-channel.
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												  The P-N Junction (The Diode)Lecture 18 The P-N Junction (The Diode). Today: 1. Joining p- and n-doped semiconductors. 2. Depletion and built-in voltage. 3. Current-voltage characteristics of the p-n junction. Questions you should be able to answer by the end of today’s lecture: 1. What happens when we join p-type and n-type semiconductors? 2. What is the width of the depletion region? How does it relate to the dopant concentration? 3. What is built-in voltage? How to calculate it based on dopant concentrations? How to calculate it based on Fermi levels of semiconductors forming the junction? 4. What happens when we apply voltage to the p-n junction? What is forward and reverse bias? 5. What is the current-voltage characteristic for the p-n junction diode? Why is it different from a resistor? 1 From previous lecture we remember: What happens when you join p-doped and n-doped pieces of semiconductor together? When materials are put in contact the carriers flow under driving force of diffusion until chemical potential on both sides equilibrates, which would mean that the position of the Fermi level must be the same in both p and n sides. This results in band bending: - + - + + - - Holes diffuse + Electrons diffuse The electrons will diffuse into p-type material where they will recombine with holes (fill in holes). And holes will diffuse into the n-type materials where they will recombine with electrons. 2 This means that eventually in vicinity of the junction all free carriers will be depleted leaving stripped ions behind, which would produce an electric field across the junction: The electric field results from the deviation from charge neutrality in the vicinity of the junction.
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												  Lecture 16 the Pn Junction Diode (III)Lecture 16 The pn Junction Diode (III) Outline • Small-signal equivalent circuit model • Carrier charge storage –Diffusion capacitance Reading Assignment: Howe and Sodini; Chapter 6, Sections 6.4 - 6.5 6.012 Spring 2007 Lecture 16 1 I-V Characteristics Diode Current equation: ⎡ V ⎤ I = I ⎢ e(Vth )−1⎥ o ⎢ ⎥ ⎣ ⎦ I lg |I| 0.43 q kT =60 mV/dec @ 300K Io 0 0 V 0 V Io linear scale semilogarithmic scale 6.012 Spring 2007 Lecture 16 2 2. Small-signal equivalent circuit model Examine effect of small signal adding to forward bias: ⎡ ⎛ qV()+v ⎞ ⎤ ⎛ qV()+v ⎞ ⎜ ⎟ ⎜ ⎟ ⎢ ⎝ kT ⎠ ⎥ ⎝ kT ⎠ I + i = Io ⎢ e −1⎥ ≈ Ioe ⎢ ⎥ ⎣ ⎦ If v small enough, linearize exponential characteristics: ⎡ qV qv ⎤ ⎡ qV ⎤ ()kT (kT ) (kT )⎛ qv ⎞ I + i ≈ Io ⎢e e ⎥ ≈ Io ⎢e ⎜ 1 + ⎟ ⎥ ⎣⎢ ⎦⎥ ⎣⎢ ⎝ kT⎠ ⎦⎥ qV qV qv = I e()kT + I e(kT ) o o kT Then: qI i = • v kT From a small signal point of view. Diode behaves as conductance of value: qI g = d kT 6.012 Spring 2007 Lecture 16 3 Small-signal equivalent circuit model gd gd depends on bias. In forward bias: qI g = d kT gd is linear in diode current. 6.012 Spring 2007 Lecture 16 4 Capacitance associated with depletion region: ρ(x) + qNd p-side − n-side (a) xp x = xn vD VD − qNa = − QJ qNaxp ρ(x) + qNd p-side −x −x n-side (b) p p x xn xn = + > > vD VD vd VD-- − qNa x < x |q | < |Q | p p, J J = − qJ qNaxp = ∆ ∆ρ = ρ − ρ qj qNa xp (x) (x) (x) + qNd X p-side d n-side (c) x n xn − − xp xp x q = q − Q > j j j 0 − qN = −qN x − −qN a − = − ∆ a p ( axp) qj qNd xn = − qNa (xp xp) ∆ = qNa xp Depletion or junction capacitance: dqJ C j = C j (VD ) = dvD VD qεsNa Nd C j = A 2()Na + Nd ()φB −VD 6.012 Spring 2007 Lecture 16 5 Small-signal equivalent circuit model gd Cj can rewrite as: qεsNa Nd φB C j = A • 2()Na + Nd φB ()φB −VD C or, C = jo j V 1− D φB φ Under Forward Bias assume V ≈ B D 2 C j = 2C jo Cjo ≡ zero-voltage junction capacitance 6.012 Spring 2007 Lecture 16 6 3.
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												  Field Effect TransistorsModule www.learnabout-electronics.org 4 Field Effect Transistors Module 4.1 Junction Field Effect Transistors What you´ll learn in Module 4 Field Effect Transistors Section 4.1 Field Effect Transistors. Although there are lots of confusing names for field • FETs JFETs, JUGFETs, and IGFETS effect transistors (FETs) there are basically two main • The JFET. types: • Diffusion JFET Construction. • Planar JFET Construction. 1. The reverse biased PN junction types, the JFET or • JFET Circuit Symbols. Junction FET, (also called the JUGFET or Junction Unipolar Gate FET). Section 4.2 How a JFET Works. • Operation Below Pinch Off. 2. The insulated gate FET devices (IGFET). • Operation Above Pinch Off. • JFET Output Characteristic. All FETs can be called UNIPOLAR devices because • JFET Transfer Characteristic. the charge carriers that carry the current through the • JFET Video. device are all of the same type i.e. either holes or electrons, but not both. This distinguishes FETs from Section 4.3 The Enhancement Mode MOSFET. the bipolar devices in which both holes and electrons • The IGFET (Insulated Gate FET). • MOSFET(IGFET) Construction. are responsible for current flow in any one device. • MOSFET(IGFET) Operation. The JFET • MOSFET (IGFET) Circuit Symbols. • Handling Precautions for MOSFETS This was the earliest FET device available. It is a voltage-controlled device in which current flows Section 4.4 The Depletion Mode MOSFET. from the SOURCE terminal (equivalent to the • Depletion Mode MOSFET Operation. emitter in a bipolar transistor) to the DRAIN • MOSFE (IGFET) Circuit Symbols. (equivalent to the collector). A voltage applied • Applications of MOSFETS • High Power MOSFETS between the source terminal and a GATE terminal (equivalent to the base) is used to control the source - Section 4.5 Power MOSFETs.
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												  Notes on BJT & FET TransistorsPhys2303 L.A. Bumm [ver 1.1] Transistors (p1) Notes on BJT & FET Transistors. Comments. The name transistor comes from the phrase “transferring an electrical signal across a resistor.” In this course we will discuss two types of transistors: The Bipolar Junction Transistor (BJT) is an active device. In simple terms, it is a current controlled valve. The base current (IB) controls the collector current (IC). The Field Effect Transistor (FET) is an active device. In simple terms, it is a voltage controlled valve. The gate-source voltage (VGS) controls the drain current (ID). Regions of BJT operation: Cut-off region: The transistor is off. There is no conduction between the collector and the emitter. (IB = 0 therefore IC = 0) Active region: The transistor is on. The collector current is proportional to and controlled by the base current (IC = βIC) and relatively insensitive to VCE. In this region the transistor can be an amplifier. Saturation region: The transistor is on. The collector current varies very little with a change in the base current in the saturation region. The VCE is small, a few tenths of volt. The collector current is strongly dependent on VCE unlike in the active region. It is desirable to operate transistor switches will be in or near the saturation region when in their on state. Rules for Bipolar Junction Transistors (BJTs): • For an npn transistor, the voltage at the collector VC must be greater than the voltage at the emitter VE by at least a few tenths of a volt; otherwise, current will not flow through the collector-emitter junction, no matter what the applied voltage at the base.
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												  BJT JFET MOSFET Circa 1960 1970 1980 Gm/I (Signal Gain) Best Better Good• Crossover Distortion •FETS • Spec sheets • Configurations • Applications Acknowledgements: Neamen, Donald: Microelectronics Circuit Analysis and Design, 3rd Edition 6.101 Spring 2020 Lecture 6 1 Three Stage Amplifier – Crossover Distortion Hole Feedback 6.101 Spring 2020 Lecture 5 2 Crossover Distortion Analysis 6.101 Spring 2020 Lecture 5 3 Crossover Distortion Analysis 11 1 v v v e 10 in 10 out • The distortion 0.6v in each direction or 1.2v total vg 570ve resulting in a hole that is: 11 1 0.0172*1.2 ~ 0.02v vout 570 vin vout vn 10 10 • Increasing open loop gain 11 570 will reduce the crossover 1 v 10 v v 10.81v 0.0172v distortion. out 1 in 1 n in n 1 570 1 570 10 10 6.101 Spring 2020 Lecture 5 4 BJT ‐ FET Bipolar Junction Transistor Field Effect Transistor • Three terminal device • Three terminal device • Collector current controlled • Channel conduction by base current ib= f(Vbe) controlled by electric field • Think as current amplifier • No forward biased junction • NPN and PNP i.e. no current • JFETs, MOSFETs • Depletion mode, enhancement mode 6.101 Spring 2020 Lecture 6 5 BJT ‐ JFETS ‐ MOSFETS BJT JFET MOSFET Circa 1960 1970 1980 Gm/I (signal gain) Best Better Good Isolation PN Junction Metal Oxide* ESD Low Moderate Very sensitive Control Current Voltage Voltage Power YES No Yes *silicon dioxide 6.101 Spring 2020 Lecture 6 6 Voltage Noise * * Horowitz & Hill, Art of Electronics 3rd Edition p 170 6.101 Spring 2020 Lecture 6 7 FET Family Tree FET JFET depletion MOSFET n-channel p-channel depletion enhancement n-channel Vgs(off) gate source cutoff or n-channel p-channel Vp pinch-off voltage Vgs(th) gate source threshold voltage 6.101 Spring 2020 Lecture 6 8 Transistor Polarity Mapping* + output n-channel depletion n-channel enhancment n-channel JFET npn bjt input - + p-channel enhancment p-channel JFT pnp bjt - * Horwitz & Hill, the Art of Electronics, 3rd Edition 6.101 Spring 2020 Lecture 6 9 MOSFET & JFETS • MOSFETS – Much more finicky difficult process (to make) than JFET’s.
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												  Fabrication and Characterization of Polymeric P-Channel Junction Fets Tianhong Cui, Yuxin Liu, and Kody VarahramyanIEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 51, NO. 3, MARCH 2004 389 Fabrication and Characterization of Polymeric P-Channel Junction FETs Tianhong Cui, Yuxin Liu, and Kody Varahramyan Abstract—Polymer materials are attracting more and more polymer devices. The possibility of processing conducting attention for the applications to microelectronic/optoelectronic polymers based on coating techniques has enabled researchers devices due to their flexibility, lightweight, low cost, etc. In this to fabricate various electronic/optoelectronic devices such as paper, fabrication and characterization of a polymer junction field-effect transistor (JFET), using poly (3,4-ethylenedioxythio- thin film transistors, diodes, LEDs, capacitors, organic inte- phene) poly (styrenesulfonate) (PEDT/PSS) as the channel and grated circuits, organic wires, and electroluminescent devices poly (2,5-hexyloxy p-phenylene cyanovinylene) (CNPPV) as the [8]–[14]. Polymer thin films can be coated on substrates such gate layer, are reported. The all-polymer JFET was fabricated as glass, plastic, silicon, wood, or paper. by the conventional ultraviolet (UV) lithography techniques. The In this paper, a p-channel polymer JFET fabricated with ultra- fabricated device was measured and characterized electrically. In the meantime, the comparisons were listed between polymer violet (UV) lithography was presented, and its operation mech- JFET and analogous inorganic semiconductor counterparts. Its anism was discussed in detail. Based on the testing results, the pinch-off voltage reaches 1 V that is in the applicable range, and polymer JFET and the characteristics of conducting polymers the current is IQ V e at zero gate bias. It demonstrates that were analyzed. the device operates in a very similar fashion to its conventional counterparts.
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												  PhotodetectorsPhotodetectors • Convert light signals to a voltage or current. • The absorption of photons creates electron hole pairs. • Electrons in the CB and holes in the VB. • A p + n type junction describes a heavily doped p-type material(acceptors) that is much greater than a lightly doped n-type material (donor) that it is embedded into. • Illumination window with an annular electrode for photon passage. • Anti-reflection coating ( Si 3 N 4 ) reduces reflections. Vr (a) SiO 2 R Vout Electrode p+ Iph Photodetectors h" > E + g h e– n E + Antireflection Electrode • The side is on the order of less than a coating p W Depletion region micron thick (formed by planar diffusion ! (b) net into n-type epitaxial layer). eNd x • A space charge distribution occurs about the junction within the depletion layer. –eNa E (x) (c) • The depletion region extends x predominantly into the lightly doped n region ( up to 3 microns max) E max (a) A schematic diagram of a reverse biased pn junction photodiode. (b) Net space charge across the diode in the depletion region. Nd and Na are the donor and acceptor concentrations in the p and n sides. (c). The field in the depletion region. © 1999 S.O. Kasap, Optoelectronics (Prentice Hall) Photodetectors Short wavelengths (ex. UV) are absorbed at the surface, and longer wavelengths (IR) will penetrate into the depletion layer. What would be a fundamental criteria for a photodiode with a wide spectral response? Thin p-layer and thick n layer. What does thickness of depletion layer determine (along with reverse bias)? Diode capacitance.