Chapter 2 Semiconductor Heterostructures
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PN Junction Is the Most Fundamental Semiconductor Device
Fundamentals of Microelectronics CH1 Why Microelectronics? CH2 Basic Physics of Semiconductors CH3 Diode Circuits CH4 Physics of Bipolar Transistors CH5 Bipolar Amplifiers CH6 Physics of MOS Transistors CH7 CMOS Amplifiers CH8 Operational Amplifier As A Black Box 1 Chapter 2 Basic Physics of Semiconductors 2.1 Semiconductor materials and their properties 2.2 PN-junction diodes 2.3 Reverse Breakdown 2 Semiconductor Physics Semiconductor devices serve as heart of microelectronics. PN junction is the most fundamental semiconductor device. CH2 Basic Physics of Semiconductors 3 Charge Carriers in Semiconductor To understand PN junction’s IV characteristics, it is important to understand charge carriers’ behavior in solids, how to modify carrier densities, and different mechanisms of charge flow. CH2 Basic Physics of Semiconductors 4 Periodic Table This abridged table contains elements with three to five valence electrons, with Si being the most important. CH2 Basic Physics of Semiconductors 5 Silicon Si has four valence electrons. Therefore, it can form covalent bonds with four of its neighbors. When temperature goes up, electrons in the covalent bond can become free. CH2 Basic Physics of Semiconductors 6 Electron-Hole Pair Interaction With free electrons breaking off covalent bonds, holes are generated. Holes can be filled by absorbing other free electrons, so effectively there is a flow of charge carriers. CH2 Basic Physics of Semiconductors 7 Free Electron Density at a Given Temperature E n 5.21015T 3/ 2 exp g electrons/ cm3 i 2kT 0 10 3 ni (T 300 K) 1.0810 electrons/ cm 0 15 3 ni (T 600 K) 1.5410 electrons/ cm Eg, or bandgap energy determines how much effort is needed to break off an electron from its covalent bond. -
Quantum Well Devices: Applications of the PIAB
Quantum Well Devices: Applications of the PIAB. H2A Real World Friday What is a semiconductor? no e- Conduction Band Empty e levels a few e- Empty e levels lots of e- Empty e levels Filled e levels Filled e levels Filled e levels Insulator Semiconductor Metal Electrons in the conduction band of semiconductors like Si or GaAs can move about freely. Conduction band a few e- Eg = hν Energy Bandgap in Valence band Filled e levels Semiconductors We can get electrons into the conduction band by either thermal excitation or light excitation (photons). Solar cells use semiconductors to convert photons to electrons. A "quantum well" structure made from AlGaAs-GaAs-AlGaAs creates a potential well for conduction electrons. 10-20 nm! A conduction electron that get trapped in a quantum well acts like a PIAB. A conduction electron that get trapped in a quantum well acts like a PIAB. Quantum Wells are used to make Laser Diodes Quantum Well Laser Diodes Quantum Wells are used to make Laser Diodes Quantum Well Laser Diodes Multiple Quantum Wells work even better. Multiple Quantum Well Laser Diodes Multiple Quantum Wells work even better. Multiple Quantum Well LEDs Multiple Quantum Wells work even better. Multiple Quantum Well Laser Diodes Multiple Quantum Wells also are used to make high efficiency Solar Cells. Quantum Well Solar Cells Multiple Quantum Wells also are used to make high efficiency Solar Cells. The most common approach to high efficiency photovoltaic power conversion is to partition the solar spectrum into separate bands and each absorbed by a cell specially tailored for that spectral band. -
Federico Capasso “Physics by Design: Engineering Our Way out of the Thz Gap” Peter H
6 IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, VOL. 3, NO. 1, JANUARY 2013 Terahertz Pioneer: Federico Capasso “Physics by Design: Engineering Our Way Out of the THz Gap” Peter H. Siegel, Fellow, IEEE EDERICO CAPASSO1credits his father, an economist F and business man, for nourishing his early interest in science, and his mother for making sure he stuck it out, despite some tough moments. However, he confesses his real attraction to science came from a well read children’s book—Our Friend the Atom [1], which he received at the age of 7, and recalls fondly to this day. I read it myself, but it did not do me nearly as much good as it seems to have done for Federico! Capasso grew up in Rome, Italy, and appropriately studied Latin and Greek in his pre-university days. He recalls that his father wisely insisted that he and his sister become fluent in English at an early age, noting that this would be a more im- portant opportunity builder in later years. In the 1950s and early 1960s, Capasso remembers that for his family of friends at least, physics was the king of sciences in Italy. There was a strong push into nuclear energy, and Italy had a revered first son in En- rico Fermi. When Capasso enrolled at University of Rome in FREDERICO CAPASSO 1969, it was with the intent of becoming a nuclear physicist. The first two years were extremely difficult. University of exams, lack of grade inflation and rigorous course load, had Rome had very high standards—there were at least three faculty Capasso rethinking his career choice after two years. -
First Line of Title
GALLIUM NITRIDE AND INDIUM GALLIUM NITRIDE BASED PHOTOANODES IN PHOTOELECTROCHEMICAL CELLS by John D. Clinger A thesis submitted to the Faculty of the University of Delaware in partial fulfillment of the requirements for the degree of Master of Science with a major in Electrical and Computer Engineering Winter 2010 Copyright 2010 John D. Clinger All Rights Reserved GALLIUM NITRIDE AND INDIUM GALLIUM NITRIDE BASED PHOTOANODES IN PHOTOELECTROCHEMICAL CELLS by John D. Clinger Approved: __________________________________________________________ Robert L. Opila, Ph.D. Professor in charge of thesis on behalf of the Advisory Committee Approved: __________________________________________________________ James Kolodzey, Ph.D. Professor in charge of thesis on behalf of the Advisory Committee Approved: __________________________________________________________ Kenneth E. Barner, Ph.D. Chair of the Department of Electrical and Computer Engineering Approved: __________________________________________________________ Michael J. Chajes, Ph.D. Dean of the College of Engineering Approved: __________________________________________________________ Debra Hess Norris, M.S. Vice Provost for Graduate and Professional Education ACKNOWLEDGMENTS I would first like to thank my advisors Dr. Robert Opila and Dr. James Kolodzey as well as my former advisor Dr. Christiana Honsberg. Their guidance was invaluable and I learned a great deal professionally and academically while working with them. Meghan Schulz and Inci Ruzybayev taught me how to use the PEC cell setup and gave me excellent ideas on preparing samples and I am very grateful for their help. A special thanks to Dr. C.P. Huang and Dr. Ismat Shah for arrangements that allowed me to use the lab and electrochemical equipment to gather my results. Thanks to Balakrishnam Jampana and Dr. Ian Ferguson at Georgia Tech for growing my samples, my research would not have been possible without their support. -
Junction Field Effect Transistor (JFET)
Junction Field Effect Transistor (JFET) The single channel junction field-effect transistor (JFET) is probably the simplest transistor available. As shown in the schematics below (Figure 6.13 in your text) for the n-channel JFET (left) and the p-channel JFET (right), these devices are simply an area of doped silicon with two diffusions of the opposite doping. Please be aware that the schematics presented are for illustrative purposes only and are simplified versions of the actual device. Note that the material that serves as the foundation of the device defines the channel type. Like the BJT, the JFET is a three terminal device. Although there are physically two gate diffusions, they are tied together and act as a single gate terminal. The other two contacts, the drain and source, are placed at either end of the channel region. The JFET is a symmetric device (the source and drain may be interchanged), however it is useful in circuit design to designate the terminals as shown in the circuit symbols above. The operation of the JFET is based on controlling the bias on the pn junction between gate and channel (note that a single pn junction is discussed since the two gate contacts are tied together in parallel – what happens at one gate-channel pn junction is happening on the other). If a voltage is applied between the drain and source, current will flow (the conventional direction for current flow is from the terminal designated to be the gate to that which is designated as the source). The device is therefore in a normally on state. -
Dephasing in an Electronic Mach-Zehnder Interferometer,” Phys
Dephasing and Quantum Noise in an electronic Mach-Zehnder Interferometer Dissertation zur Erlangung des Doktorgrades der Naturwissenschaften (Dr. rer. nat.) der Fakultät für Physik der Universität Regensburg vorgelegt von Andreas Helzel aus Kelheim Dezember 2012 ii Promotionsgesuch eingereicht am: 22.11.2012 Die Arbeit wurde angeleitet von: Prof. Dr. Christoph Strunk Prüfungsausschuss: Prof. Dr. G. Bali (Vorsitzender) Prof. Dr. Ch. Strunk (1. Gutachter) Dr. F. Pierre (2. Gutachter) Prof. Dr. F. Gießibl (weiterer Prüfer) iii In Gedenken an Maria Höpfl. Sie war die erste Taxifahrerin von Kelheim und wurde 100 Jahre alt. Contents 1. Introduction1 2. Basics 5 2.1. The two dimensional electron gas....................5 2.2. The quantum Hall effect - Quantized Landau levels...........8 2.3. Transport in the quantum Hall regime.................. 10 2.3.1. Quantum Hall edge states and Landauer-Büttiker formalism.. 10 2.3.2. Compressible and incompressible strips............. 14 2.3.3. Luttinger liquid in the QH regime at filling factor 2....... 16 2.4. Non-equilibrium fluctuations of a QPC.................. 24 2.5. Aharonov-Bohm Interferometry..................... 28 2.6. The electronic Mach-Zehnder interferometer............... 30 3. Measurement techniques 37 3.1. Cryostat and devices........................... 37 3.2. Measurement approach.......................... 39 4. Sample fabrication and characterization 43 4.1. Fabrication................................ 43 4.1.1. Material.............................. 43 4.1.2. Lithography............................ 44 4.1.3. Gold air bridges.......................... 45 4.1.4. Sample Design.......................... 46 4.2. Characterization.............................. 47 4.2.1. Filling factor........................... 47 4.2.2. Quantum point contacts..................... 49 4.2.3. Gate setting............................ 50 5. Characteristics of a MZI 51 5.1. -
The P-N Junction (The Diode)
Lecture 18 The P-N Junction (The Diode). Today: 1. Joining p- and n-doped semiconductors. 2. Depletion and built-in voltage. 3. Current-voltage characteristics of the p-n junction. Questions you should be able to answer by the end of today’s lecture: 1. What happens when we join p-type and n-type semiconductors? 2. What is the width of the depletion region? How does it relate to the dopant concentration? 3. What is built-in voltage? How to calculate it based on dopant concentrations? How to calculate it based on Fermi levels of semiconductors forming the junction? 4. What happens when we apply voltage to the p-n junction? What is forward and reverse bias? 5. What is the current-voltage characteristic for the p-n junction diode? Why is it different from a resistor? 1 From previous lecture we remember: What happens when you join p-doped and n-doped pieces of semiconductor together? When materials are put in contact the carriers flow under driving force of diffusion until chemical potential on both sides equilibrates, which would mean that the position of the Fermi level must be the same in both p and n sides. This results in band bending: - + - + + - - Holes diffuse + Electrons diffuse The electrons will diffuse into p-type material where they will recombine with holes (fill in holes). And holes will diffuse into the n-type materials where they will recombine with electrons. 2 This means that eventually in vicinity of the junction all free carriers will be depleted leaving stripped ions behind, which would produce an electric field across the junction: The electric field results from the deviation from charge neutrality in the vicinity of the junction. -
DESIGN and FABRICATION of Gan-BASED HETEROJUNCTION BIPOLAR TRANSISTORS
DESIGN AND FABRICATION OF GaN-BASED HETEROJUNCTION BIPOLAR TRANSISTORS By KYU-PIL LEE A DISSERTATION PRESENTED TO THE GRADUATE SCHOOL OF THE UNIVERSITY OF FLORIDA IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF DOCTOR OF PHILOSOPHY UNIVERSITY OF FLORIDA 2003 In his heart a man plans his course, But, the LORD determines his steps. Proverbs 16:9 ACKNOWLEDGMENTS First and foremost, I would like to express great appreciation with all my heart to Professor Pearton and Professor Ren for their expert advice, guidance, and instruction throughout the research. I also give special thanks to members of my committee (Professor Abernathy, Professor Norton, and Professor Singh) for their professional input and support. Additional special thanks are reserved for the people of our research group (Kwang-hyun, Kelly, Ben, Jihyun, and Risarbh) for their assistance, care, and friendship. I am very grateful to past group members (Sirichai, Pil-yeon, David, Donald and Bee). 1 also give my thanks to P. Mathis for her endless help and kindness; and to Mr. Santiago who is network assistant in the Chemical Engineering Department, because of his great help with my simulation. I also thank my discussion partners about material growth technologies, Dr. B. Gila, Dr. M. Overberg, Jerry and Dr. Kang-Nyung Lee. I would like to give my thanks to my friends (especially Kyung-hoon, Young-woo, Se-jin, Byeng-sung, Yong-wook, and Hyeng-jin). Even when they were very busy, they always helped my research work without hesitation. I cannot forget Samsung's vice president Dr. Jong-woo Park’s devoted help, and the steadfast support from Samsung Electronics. -
Lecture 16 the Pn Junction Diode (III)
Lecture 16 The pn Junction Diode (III) Outline • Small-signal equivalent circuit model • Carrier charge storage –Diffusion capacitance Reading Assignment: Howe and Sodini; Chapter 6, Sections 6.4 - 6.5 6.012 Spring 2007 Lecture 16 1 I-V Characteristics Diode Current equation: ⎡ V ⎤ I = I ⎢ e(Vth )−1⎥ o ⎢ ⎥ ⎣ ⎦ I lg |I| 0.43 q kT =60 mV/dec @ 300K Io 0 0 V 0 V Io linear scale semilogarithmic scale 6.012 Spring 2007 Lecture 16 2 2. Small-signal equivalent circuit model Examine effect of small signal adding to forward bias: ⎡ ⎛ qV()+v ⎞ ⎤ ⎛ qV()+v ⎞ ⎜ ⎟ ⎜ ⎟ ⎢ ⎝ kT ⎠ ⎥ ⎝ kT ⎠ I + i = Io ⎢ e −1⎥ ≈ Ioe ⎢ ⎥ ⎣ ⎦ If v small enough, linearize exponential characteristics: ⎡ qV qv ⎤ ⎡ qV ⎤ ()kT (kT ) (kT )⎛ qv ⎞ I + i ≈ Io ⎢e e ⎥ ≈ Io ⎢e ⎜ 1 + ⎟ ⎥ ⎣⎢ ⎦⎥ ⎣⎢ ⎝ kT⎠ ⎦⎥ qV qV qv = I e()kT + I e(kT ) o o kT Then: qI i = • v kT From a small signal point of view. Diode behaves as conductance of value: qI g = d kT 6.012 Spring 2007 Lecture 16 3 Small-signal equivalent circuit model gd gd depends on bias. In forward bias: qI g = d kT gd is linear in diode current. 6.012 Spring 2007 Lecture 16 4 Capacitance associated with depletion region: ρ(x) + qNd p-side − n-side (a) xp x = xn vD VD − qNa = − QJ qNaxp ρ(x) + qNd p-side −x −x n-side (b) p p x xn xn = + > > vD VD vd VD-- − qNa x < x |q | < |Q | p p, J J = − qJ qNaxp = ∆ ∆ρ = ρ − ρ qj qNa xp (x) (x) (x) + qNd X p-side d n-side (c) x n xn − − xp xp x q = q − Q > j j j 0 − qN = −qN x − −qN a − = − ∆ a p ( axp) qj qNd xn = − qNa (xp xp) ∆ = qNa xp Depletion or junction capacitance: dqJ C j = C j (VD ) = dvD VD qεsNa Nd C j = A 2()Na + Nd ()φB −VD 6.012 Spring 2007 Lecture 16 5 Small-signal equivalent circuit model gd Cj can rewrite as: qεsNa Nd φB C j = A • 2()Na + Nd φB ()φB −VD C or, C = jo j V 1− D φB φ Under Forward Bias assume V ≈ B D 2 C j = 2C jo Cjo ≡ zero-voltage junction capacitance 6.012 Spring 2007 Lecture 16 6 3. -
Based Vertical Double Heterojunction Bipolar Transistors with High Current Amplification
COMMUNICATION Heterojunction Bipolar Transistor www.advelectronicmat.de 2D Material-Based Vertical Double Heterojunction Bipolar Transistors with High Current Amplification Geonyeop Lee, Stephen J. Pearton, Fan Ren, and Jihyun Kim* been applied to various types of semicon- The heterojunction bipolar transistor (HBT) differs from the classical homo- ductor devices, such as lasers, solar cells, junction bipolar junction transistor in that each emitter-base-collector layer high electron mobility transistors, and het- [3–6] is composed of a different semiconductor material. 2D material (2DM)- erojunction bipolar transistors (HBTs). Notably, with a bipolar junction transistor, based heterojunctions have attracted attention because of their wide range which is a three-terminal transistor fabri- of fundamental physical and electrical properties. Moreover, strain-free cated by connecting two P–N homojunc- heterostructures formed by van der Waals interaction allows true bandgap tion diodes, there is a trade-off between engineering regardless of the lattice constant mismatch. These characteristics the current gain and high-frequency ability [3,7] make it possible to fabricate high-performance heterojunction devices such because of these problems. In sharp contrast, HBTs realized using the hetero- as HBTs, which have been difficult to implement in conventional epitaxy. structure can avoid these trade-offs and Herein, NPN double HBTs (DHBTs) are constructed from vertically stacked improve device performance.[8] HBTs, due 2DMs (n-MoS2/p-WSe2/n-MoS2) using dry transfer technique. The forma- to their high power efficiency, uniformity tion of the two P–N junctions, base-emitter, and base-collector junctions, of threshold voltage, and low 1/f noise in DHBTs, was experimentally observed. -
Quantum Dot and Electron Acceptor Nano-Heterojunction For
www.nature.com/scientificreports OPEN Quantum dot and electron acceptor nano‑heterojunction for photo‑induced capacitive charge‑transfer Onuralp Karatum1, Guncem Ozgun Eren2, Rustamzhon Melikov1, Asim Onal3, Cleva W. Ow‑Yang4,5, Mehmet Sahin6 & Sedat Nizamoglu1,2,3* Capacitive charge transfer at the electrode/electrolyte interface is a biocompatible mechanism for the stimulation of neurons. Although quantum dots showed their potential for photostimulation device architectures, dominant photoelectrochemical charge transfer combined with heavy‑metal content in such architectures hinders their safe use. In this study, we demonstrate heavy‑metal‑free quantum dot‑based nano‑heterojunction devices that generate capacitive photoresponse. For that, we formed a novel form of nano‑heterojunctions using type‑II InP/ZnO/ZnS core/shell/shell quantum dot as the donor and a fullerene derivative of PCBM as the electron acceptor. The reduced electron–hole wavefunction overlap of 0.52 due to type‑II band alignment of the quantum dot and the passivation of the trap states indicated by the high photoluminescence quantum yield of 70% led to the domination of photoinduced capacitive charge transfer at an optimum donor–acceptor ratio. This study paves the way toward safe and efcient nanoengineered quantum dot‑based next‑generation photostimulation devices. Neural interfaces that can supply electrical current to the cells and tissues play a central role in the understanding of the nervous system. Proper design and engineering of such biointerfaces enables the extracellular modulation of the neural activity, which leads to possible treatments of neurological diseases like retinal degeneration, hearing loss, diabetes, Parkinson and Alzheimer1–3. Light-activated interfaces provide a wireless and non-genetic way to modulate neurons with high spatiotemporal resolution, which make them a promising alternative to wired and surgically more invasive electrical stimulation electrodes4,5. -
Piezo-Phototronic Effect Enhanced UV Photodetector Based on Cui/Zno
Liu et al. Nanoscale Research Letters (2016) 11:281 DOI 10.1186/s11671-016-1499-1 NANO EXPRESS Open Access Piezo-phototronic effect enhanced UV photodetector based on CuI/ZnO double- shell grown on flexible copper microwire Jingyu Liu1†, Yang Zhang1†, Caihong Liu1, Mingzeng Peng1, Aifang Yu1, Jinzong Kou1, Wei Liu1, Junyi Zhai1* and Juan Liu2* Abstract In this work, we present a facile, low-cost, and effective approach to fabricate the UV photodetector with a CuI/ZnO double-shell nanostructure which was grown on common copper microwire. The enhanced performances of Cu/CuI/ZnO core/double-shell microwire photodetector resulted from the formation of heterojunction. Benefiting from the piezo-phototronic effect, the presentation of piezocharges can lower the barrier height and facilitate the charge transport across heterojunction. The photosensing abilities of the Cu/CuI/ZnO core/double-shell microwire detector are investigated under different UV light densities and strain conditions. We demonstrate the I-V characteristic of the as-prepared core/double-shell device; it is quite sensitive to applied strain, which indicates that the piezo-phototronic effect plays an essential role in facilitating charge carrier transport across the CuI/ZnO heterojunction, then the performance of the device is further boosted under external strain. Keywords: Photodetector, Flexible nanodevice, Heterojunction, Piezo-phototronic effect, Double-shell nanostructure Background nanostructured ZnO devices with flexible capability, Wurtzite-structured zinc oxide and gallium nitride are force/strain-modulated photoresponsing behaviors resulted gaining much attention due to their exceptional optical, from the change of Schottky barrier height (SBH) at the electrical, and piezoelectric properties which present metal-semiconductor heterojunction or the modification of potential applications in the diverse areas including the band diagram of semiconductor composites [15, 16].