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United States Patent [19] [111 3,874,443 Bayer [45] Apr

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United States Patent [19] [111 3,874,443 Bayer [45] Apr United States Patent [19] [111 3,874,443 Bayer [45] Apr. 1, 1975 [54] HEAT DISSIPATOR Primary Examiner-Charles Sukalo Attorney, Agent, or Firm-—Torres & Berryhill [76] lnventor: Joseph V. Bayer; 2214 Monterrey ‘ Dr., Kemah, Tex. 77565 [57] ABSTRACT [22] Filed: July 16, 1973 Disclosed is a heat dissipator for use in soldering or [21] Appl.No.:379,343 desoldering dual-inline-pin integrated circuits com prising two identical heat dissipation clip members [52] US. Cl .................... .. 165/47, 165/80, 165/185, each having a notch forming a jaw. The clip members 174/15, 269/254 R, 81/417 are pivotably fastened together and biased by a spring [51] Int. Cl. ............................................ .. F24h 3/00 such that the jaw clamps over the integrated circuit {58] Field of Search .... .. 165/47, 80, 185; 174/15 R, when in use. l74/D1G. 5; 228/46; 81/417; 269/254 CS, In an alternate embodiment, the heat dissipator may 254 MW, 254 DF, 254 D, 254 R be modified to function as an extractor for removing or inserting an integrated circuit on a printed circuit [56] References Cited board, as well as functioning as a heat sink. The UNITED STATES PATENTS modi?ed embodiment includes an adaptor member 3.552.630 1/1971 Dean ........ .. .i 223/46 attached to each clip member having a plurality of 3,566,958 3/1971 Zelina .......... i. 174/DIG. 5 ?ngers to engage the integrated circuit. 3.652.903 3/1972 Eriksson ............................. .. 165/30 8 Claims, 6 Drawing Figures PATENTED APR 1 I975 5.874.443 \l, / HEl IWVHKIJBZ/IOICU. mmummwwwmy;w / 5 3,874,443 1 2 HEAT DISSIPATUR heat sink is to increase the surface area by providing vertical ribs or fins on each member. BACKGROUND OF THE INVENTION In a modified form ofthe heat sink. an attachment or puller adaptor is provided. allowing the heat sink to be 1. Field of the Invention converted to a tool for inserting and removing inte The present invention relates to heat dissipators for grated circuits on printed circuit boards. as well as electronic components. and in a more specific applica being used as a heat sink. Each adaptor is provided with tion to a heat dissipator employed while soldering and connector means in the form of a protruding dovetail desoldcring integrated circuits. to be received by a dovetail groove on each member. It A plurality of fingers are formed on each adaptor to en 2. Brief Description of the Prior Art gage the integrated circuit. It is recognized that excessive heat can increase the The present invention provides a small and easy to probability of failure of electronic components. Such use heat sink for soldering and desoldering. The sim heat can either be generated by the component or ap plicity ofits design provides a heat sink capable of dissi plied to the component by external means. Therefore. pating large amounts of heat rapidly. yet making it in in order to prevent failure of the components it is nec expensive to manufacture. essary to provide a means for dissipating heat rapidly. It should be appreciated that the heat sink may be The prior art reveals several devices employed for constructed for and employed on various sizes and dissipating heat. US. Pat. Nos. 3.305.004 — Barlowc; types of dual-inline-pin integrated circuits and is not 3.572.428 — Monaco; and 3.670.215-Wilkens ct al dis limited to the typical I4 or I6 DIP integrated circuits. close devices employed to dissipate heat generated by Other features. objects and advantages of the present the components. such as power transistors and inte invention will become more readily apparent front the grated circuits. Since these devices are designed to dis accompanying drawings and speci?cation which fol sipate heat generated by the component. they are not low. capable of rapidly dissipating large amounts of heat, ' such as heat applied by a soldering iron when the com BRIEF DESCRIPTION OF THE DRAWINGS ponent is being placed on or removed from a printed FIG. I is a perspective view of the integrated circuit circuit board. heat sink of the present invention; Prior art devices relating to heat dissipators for so! FIG. 2 is a cross sectional view of the heat sink ofthc dering and desoldering are disclosed in U. S. Pat. Nos. 30 present invention. taken along line 2-2 of FIG. I‘. 3.291.476 — Calkin and 3.552.630 — Dean. In the U. FIGS. 3 is a perspective view of an individual clip S. Pat. No. 3.552.630. a device is disclosed that is capa member of the heat sink of FIG. I; ble of holding and heat sinking a plurality of electrical FIG. 4 is a perspective view of the puller adaptor em leads. However. the device. as illustrated. is used to ployed with the heat sink of the present invention‘. hold an electrical connector having a plurality of leads 35 FIG. 5 is an end elcvational view of the heat sink of and cannot be used for heat sinking integrated circuits the present invention employing the adaptor of FIG. 4; when they are on printed circuit boards. due to the and bulkiness of the device. The US. Pat. to Calkins FIG. 6 is a bottom view of the heat sink of FIG. 5 en (3.291.476) discloses a soldering tool for individual gaging an integrated circuit. conductors. The purpose of the tool is to prevent the 40 breakdown of insulation caused by solder moving up DESCRIPTION OF THE PREFERRED the conductor. It is. therefore. necessary to have a tool EMBODIMENTS for each sile of electrical conductor used. A tool hav» Referring to the drawings and more specifically to ing recesses for 30 ga. wire would not be suitable when FIGS. I and 2. the integrated circuit heat sink of the used on 18 ga. wire. When soldering or desoldering an present invention is indicated generally at I0. The heat integrated circuit on a printed circuit hoard. it is neces~ sink It] comprises two identical heat dissipating clip sary for every conductor to be heat sinked to prevent members II pivotally secured by a suitable hinging heart damage. Therefore. the soldering tool disclosed is means. As best illustrated in FIG. 3, the hinging means not suitable for a device having a plurality of leads. is provided by a semicylindrical depression I2 adjacent SUMMARY OF THE INVENTION a semicylindrical protrusion I3 having a bore I4 for in sertion of a pin I5 which is held in place by a clip ISu The present invention provides a heat sink employed (FIG. 5) or other suitable fastening means. The depres for soldering and desoldering dual-inline-pin (DIP) in sion [2 of one member II engages the protrusion I3 of tegrated circuits. comprising two identical heat dissi 55 the opposing member forming a hinge-like fastener. It pating clip members pivot-ally hinged. each member should be appreciated that any other suitable means having notches thereon cooperating to form a jaw for may be employed for providing pivotal movement be~ engaging an integrated circuit. The heat sink is biased tween the two members II. in a gripping relationship with the integrated circuit by Each member II is provided with a recess or notch a spring positioned in a recess in each member. hi) I6 located along the lower interior edge thereof. which The heat sink simultaneously engages the integrated forms a jaw I7 to clamp over an integrated circuit I. circuit and dissipates heat applied to the integrated cir The jaw I7 conforms generally to the cross-section of cuit leads by the soldering iron. It should be appreci integrated circuit I and may contact the top and sides ated that the heat sink of the present invention is fabri of the integrated circuit I. The sides of the jaw I7 cated from a suitable material capable of dissipating contact each of the pins P of the integrated circuit I. as heat rapidly. In one form. it may be fabricated from suring good heat conductance. aluminum. A means that may be employed to increase Biasing means in the form of a coil spring 18 may be the dissipating efficiency of the material used in the employed to maintain the heat sink 10 in clamping rela 3,874.443 3 4 tionship with the integrated circuit l. The spring 18 is operably a jaw engageable with the sides and top of a positioned in cylindrical depressions 19 provided in DIP tDual-lnline-Pins) integrated circuit; and biasing each member ll. Of course. other biasing means may means between said clip members biasing said jaw into be used. gripping engagement with said DIP integrated circuit. To increase the heat dissipating characteristics of the 5 2. A heat sink as set forth in claim I in which each heat sink 10. vertical fins 20 may be provided on the of said clip members is provided with a plurality of fins interior and exterior surfaces of each member ll. in‘ along the sides thereof to increase the surface area of creasing the total surface area. The clip members 11 said heat sink. are also preferably constructed of a material. such as 3. A heat sink for dissipating heat front integrated cir' aluminum. which is a good heat conductor. ll cuits during soldering and desoldering operations com The upper and lower ends lla, llb. respectively, of prising: a pair of hingedly connected clip members the clip members are preferably flat. Thus. they may each having a notch along the lower interior edge also serve as support members during soldering opera thereof to form a jaw capable of engagement with the tions by simply turning the circuit board.
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