SMD Soldering Workshop Ñ Rule 3: the Point on the Iron-Tip Is NOT the Hottest Part
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Printed Circuit Board Rework and Repair Equipment from the Rework Company Welcome…
Lead-Free Rework printed circuit board rework and repair equipment from the rework company Welcome… ....to the APE Rework Equipment Catalog. Many changes are taking place in our industry with the influence of RoHs regulations and the acceptance of Lead-Free materials in equipment manufacture. There are few exceptions and gener- ally this requirement regulates the international electronics community. Lead-Free materials require more stringent con- trols during production. A higher degree of manufacturing complications will result in a greater demand for quality rework. To address these demands we have introduced several models of Vision/Reflow machines to meet every budget while maintaining the rigorous requirements for Lead-Free manufacture. We are confident that we can provide a solu- tion for your application and look forward to providing a personal service in caring for your rework needs. Bill Scheu.......President and CEO International Service and Support: A.P.E. USA Headquarters A.P.E. USA Headquarters Kaisertech 2 North Blackwater Lane 2 North Blackwater Lane Unit 12, M3 Trade Park Key Largo, FL 33037 Key Largo, FL 33037 Manor Way, Eastleigh, Tel: 305-451-4722 Tel: 305-451-4722 Hampshire England, SO50 9YA Fax: 305-451-3374 Fax: 305-451-3374 Tel: 44-(0)23 8065 0065 USA E-mail: [email protected] Canada E-mail: [email protected] UK Fax: 44-(0)23 8065 0060 E-mail: [email protected] Motorola Yip In Tsoi & Jacks, Ltd. American Tec Co Ltd Radio Products Service Division 523 Mahaprutharam Road Flat A 1st Floor, Block 1 1313 E. Algonquin Road Bangrak, Bangkok Cyber-Tech Zone, Gaoxin Ave 7 South Shaumburg, IL 60196-1081 Thailand 10500 Nansham District, Shenzhen 518057 Tel: 800-442-4210 Tel: 662-353-8667 Tel: 86-7556-135-0555 Radio Products Fax: 800-622-6210 Maylasia Fax: 665-353-8686 China Fax: 86-7556-135-0531 Service Division www.yipjacks.com E-mail: [email protected] Primetec Pte Ltd 3S Electronics & Automation KTI 4012 Ang Mo Kio Avenue 10 Technologies Ltd. -
Weller Pyropen GB 08 04
Weller Pyropens provide temperature variable soldering without the need for an electrical supply. Pyropens are lightweight and user friendly. A choice from 5 versions with a wide range of tips and nozzles makes them an ideal tool for maintenance and field service jobs in out of the way places. Convenient push Hot blow function, Powered by Butane gas, Pyropens offer solde- button piezo heat shrinking and ignition.* reflow soldering ring iron, hot gas blow and blowtorch and desoldering, options. They have a short heat up time and max. temperature are refuelled in seconds from a refill cylinder. 650°C A sight glass shows the level of gas in the *only Pyropen Piezo reservoir. Soldering iron Blow torch func- Heat is generated by gas passing over a cata- function, max. tion, max. tempe- temperature rature 1300°C lyst in the soldering tip or the hot air nozzle. 500°C Temperature variation is obtained by increa- sing respectively decreasing the gas flow. Pyropen WP 60 Kit An ergonomic Butane gas operated soldering iron with solder, hot blow and blow torch functions. Offers maxi- mum flexibility for use in many applications. It is tempera- ture variable within the range of 500°C to 1300°C depen- dant upon the function used. Refilling takes only a few seconds and it operates approx. 1 hour with one filling. An integral sight glass shows the level of the gas in the tank. Ignition of the gas requires an external source and the long life tips deliver rapid heat up. The hot blow nozzle supplies inert hot gas to prevent oxi- dation of non contact solder joints and is therefore suita- ble for use in solder paste applications, heat shrink and on vinyl chloride boards. -
Catalog Ersa Soldering Irons, Soldering and Desoldering Stations, Solder Fume Extractions, Hybrid Rework Equipment and Accessori
Catalog Ersa soldering irons, soldering and desoldering stations, solder fume extractions, hybrid rework equipment and accessories Quickfinder – the alphanumerical product index Order no. page Order no. page Order no. page Order no. page 00 – 03 0C 0ICV2000HP ................21 1E035VDA068 ................5 0003B ...................... 33 0CA10-001 .................. 28 0ICV403A ...................21 1HR200-HP0A67 ............. 24 0004G ...................... 33 0CA10-002 ................. 28 0ICV4000A ..................21 1HR2000000A67 ............. 24 0006G .................... 9, 33 0CA10-1002/04. 28 0ICV4000AI .................21 1IC1100A0CA67 ..............18 0008M ........... 17 – 18, 33, 37 0CA10-2002 ................ 28 0ICV4000AIC ................21 1IC1100A00A67 ..............18 0015BDH ....................6 0CA10-4001 ................ 28 0ICV4000AICXV .............21 1IC1100VCVA67 ..............18 0045BDG ....................6 0CA10-4002 ................ 28 0IRHP100A-03 .............. 30 1IC1100V0CA67 ..............18 0055JD ......................7 0CA10-4003 ................ 28 0IRHP100A-04 .............. 30 1IC1100V00A67 ..............18 0085JD ......................7 0CA10-4004 ................ 28 0IRHP200 ................... 30 1IC1100VXTA67 ..............18 0100CDJ ............. 18 – 19, 21 0CA10-4005 ................ 28 0IRHR100A-14 ............... 24 1IC1200A00A67 .............. 17 0120CDK ................... 17 0CA10-5001. 28 0IRHR100A. 24 1IC1300000A67 .............. 17 0130CDK ................... 17 0CA10-5002 ............... -
Manhattan Style” of Construction in Particu- Lar
K7QO Article 1 Manhattan Building Techniques ”Manhattan Style” of construction in particu- lar. It is my hope that this article will bring to by Chuck Adams, K7QO light some basic understanding of just what is in- This article is intended to give you an overview volved in building with this technique. To make of construction techniques for homebrewing and this article of interest for all ages and building then give significant detail on what is called the experiences, I ask for your patience while I start Manhattan Style of construction. At the begin- from the basics and work up to the more complex ning of each section is a brief paragraph outlining issues. the current topic. If you have a copy of the ARRL Handbook I recommend that you read through this material http://www.arrl.org/ for 1995 or later, please several times before building and experimenting read the first part of chapter 25 on construc- just to make sure that you have everything on tion techniques. You will note that Figures 25.10 hand before you get started. If you are like me, through 25.22 illustrate the most popular tech- you hate to start on something, be interrupted niques for building circuits. You can use these and then have to to go and find something that techniques for experimentation or for final com- you are missing or have overlooked. Plan ahead ponents of a rig or for a complete receiver, trans- and you will save a lot of valuable time. All mitter, or transceiver. These techniques consist the suggestions within this article are just that of: — suggestions. -
Price List 2020
VAUGHANS (HOPE WORKS) Tools & Equipment for Blacksmiths, Tinsmiths & Foundries – Forgings & Fabrications Unit J, Monarch Works, Balds Lane, Lye, Stourbridge, West Midlands, DY9 8TE Telephone: 01384 424232 Fax: 01384 893171 E-mail: [email protected] Website: www.anvils.co.uk PRICE LIST 2020 Approved Suppliers to British & Most Overseas Government & Aided Programmes Including World Bank United Nations VAUGHANS (HOPE WORKS) Tools & Equipment for Blacksmiths, Tinsmiths & Foundries – Forgings & Fabrications Unit J, Monarch Works, Balds Lane, Lye, Stourbridge, West Midlands, DY9 8TE Telephone: 01384 424232 Fax: 01384 893171 E-mail: [email protected] Website: www.anvils.co.uk TERMS & CONDITIONS PRICES: All prices shown are GBP £’s Sterling & ex-works POST & PACKAGING: Extra DELIVERY: Extra V A T: At Current Rate EXPORT: Packing and Delivery F O B Charged Extra ACCEPTANCE: All Orders Accepted Subject to Prices Ruling at Date of Despatch Unless Previously Agreed in Writing CANCELLATION: Orders Cancelled may be Subject to a Cancellation Charge RETURNS: A Handling Charge of 20% will be Charged (If Returns are Accepted) SPECIFICATIONS: The Right is Reserved to Add, Delete or Change the Specification of any Item at Any Time Without Prior Notice. All Dimensions are Approximate Due to the Hand Made Nature of Many of the Products. PAYMENT TERMS: Credit Account – Strictly 30 Days Nett Non Credit Accounts – Payment by Proforma or Mastercard, Visa, Switch, Delta, Solo. Paypal N B: Sizes Other Than Those in the Price List can be Manufactured – Prices on -
(SOIC) Package
Freescale Semiconductor, Inc. Document Number: AN2409 Application Note Rev. 3.0, 10/2014 Small Outline Integrated Circuit (SOIC) Package 1 Introduction Contents 1 Introduction. .1 This application note provides guidelines for handling and assembly of Freescale Small Outline Integrated Circuit (SOIC) 2 Scope . .1 package during Printed Circuit Board (PCB) assembly. 3 Small Outline Integrated Circuit . .2 Guidelines for PCB design, rework, and package performance 4 Printed Circuit Board Guidelines . .4 information such as Moisture Sensitivity Level (MSL) rating, board level reliability, mechanical and thermal resistance data are 5 Board Assembly . .10 included for reference. 6 Repair and Rework Procedure . .14 7 Board Level Reliability . .16 2 Scope 8 Thermal Characteristics . .18 9 Case Outline Drawing, MCDS and MSL Rating 20 This document contains generic information that encompasses various Freescale SOIC packages assembled internally or at 10 Package Handling . .21 external subcontractors. Specific information about each device is 11 References . .26 not provided. To develop a specific solution, actual experience and development efforts are required to optimize the assembly process 12 Revision History . .27 and application design per individual device requirements, industry standards (such as IPC and JEDEC), and prevalent practices in the assembly environment. For more details about the specific devices contained in this note, visit www.freescale.com or contact the appropriate product application team. © Freescale Semiconductor, Inc., 2014. All rights reserved. Small Outline Integrated Circuit 3 Small Outline Integrated Circuit Figure 1 shows the standard SOIC offerings through Freescale. The exposed pad (denoted as -EP) version is also displayed. Figure 1. Standard Freescale SOIC Offerings 3.1 Package Description The SOIC is a surface mount integrated circuit package. -
Land Grid Array (LGA) Package Rework
Freescale Semiconductor Document Number: AN3241 Application Note Rev. 1.0, 10/2009 Land Grid Array (LGA) Package Rework 1 Introduction Contents 1 Introduction . 1 This application note describes rework considerations 2 What is LGA? . 3 for the Land Grid Array (LGA) style package. 3 LGA Rework . 5 4 Package Removal . 6 Freescale has introduced radio frequency (RF) modules 5 LGA Reliability . 14 such as the MC1320x and MC1321x in LGA packages as 6 References . 14 an alternative package to ball grid array (BGA). The LGA packages reduce the amounts of lead in finished products and are Reduction of Hazardous Substances (RoHS) compliant, optimized for improved radio-frequency (RF) performance for wireless applications, and/or reduce the overall height of the package by eliminating the stand-off height associated with BGA balls. For assistance with any questions about the information contained in this note or for more details about the MC1320x and MC1321x devices, visit www.freescale.com/802154. or contact the appropriate product applications team. © Freescale Semiconductor, Inc., 2009. All rights reserved. Introduction 1.1 Acronyms and Abbreviations BGA Ball Grid Array BT Bismaleimide Triazine CBGA Ceramic Ball Grid Array CTE Coefficient of Thermal Expansion EU European Union ESD Electrostatic Discharge HCTE High Coefficient of Thermal Expansion HDI High Density Interconnect LGA Land Grid Array LTCC Low Temperature Co-fired Ceramic MSLn Moisture Sensitivity Level n NSMD Non-Solder Mask Defined OSP Organic Solderability Protectant PCB Printed Circuit Board RF Radio Frequency RoHS Reduction of Hazardous Substances SMD Solder Mask Defined SMT Surface Mount Technology Land Grid Array (LGA) Package Rework Application Note, Rev. -
Recommendations for Board Assembly of Infineon Ball Grid Array Packages
Recommendations for Board Assembly of Infineon Ball Grid Array Packages Additional Information Please read the Important Notice and Warnings at the end of this document Revision 4.0 www.infineon.com page 1 of 18 2020-11-09 Recommendations for Board Assembly of Infineon Ball Grid Array Packages Table of Contents Table of Contents Table of Contents ........................................................................................................................... 2 Acronyms and Abbreveations ........................................................................................................... 3 1 Package Description ............................................................................................................... 4 1.1 BGA Package Type ................................................................................................................................... 4 1.3 Package Features and General Handling Guidelines ............................................................................. 5 2 Printed Circuit Board .............................................................................................................. 7 2.1 Routing .................................................................................................................................................... 7 2.2 Pad Design ............................................................................................................................................... 7 3 PCB Assembly ....................................................................................................................... -
Soldering Kinks
ILLUSTRATED COMPLETE INSTRUCTIONS AND PRACTICAL SOLDERING SUG- GESTIONS FROM USERS OF OKORPDE, THE BEST SOLDERING PASTE IN THE WORLD" 25 f PubllsMb THEM.W.DUNTONCO. PROVIDENCE R. I., U.S.A. If you own or drive an automobile you will surely want to know how a good job of soldering should be done. This book will tell you many new ways to keep your car in service or to repair other cars. SOLDERING KINKS PUBLISHED BY THE M. W. DUNTON CO. 150-152 NIAGARA STREET PROVIDENCE, RHODE ISLAND THIRD EDITION COPYRIGHTED 1917 BY THE M. W. DUNTON COMPANY PROVIDENCE. R. I.. U. S. A. INDEX PAGES PAGES AEROPLANES. Repairing Hole in Boiler 49 Fastening Wire Strands 20 Jewelry n, 67 Knife Handle 61 AUTOMOBILES. Soldering Coffee Pot Hinge 11 Granite Ware 8 Ford Radiators Bracing 61 on Buttons 13 to Double con- Changing Single Strengthening Seams 55 tact Lamp 38 Closing Cracks in Auto Body 39 MECHANICAL. Crack in 34 Stanley Steam Pipe Solder Dents in Applying Smoothly 11 Metal Pipes 35 Bench Heaters Gasoline Feed 36 18 Pipes Brazing Band Saws 14 Gasoline Bottle 39 Priming Driving Fits 43 Gasoline Tanks 36 Machine Grease Gun 37 Extending Tap 45 Machines to Con- Lock Nuts 45 Fastening crete 43 Metal Carburetor Floats 68 Increasing 17 Oil in Crank Cases 66 Factory Output... 13, Leaks Iron 28 Platinum Points 59 Improving Soldering Lock Nuts 45 Aluminum Gear Case. 40 Repairing File 17 37 Mending Soldering Cylinders Model 53 Aluminum 33 Making Soldering Pliers as Bench Vise 45 on Hard Rubber 37 Soldering Preserving on Iron. -
Make a Portable Workstation
instructables Make a Portable Workstation by Benne I recently started working on my own tutorial blog, makerguides.com. I currently have written several Arduino tutorials on using sensors and controlling stepper motors: How to control a stepper motor with A4988 driver and Arduino HC-SR04 ultrasonic distance sensor tutorial 28BYJ-48 Stepper Motor with ULN2003 Driver and Arduino Tutorial Feel free to check them out and maybe leave a comment with some feedback, thanks! Need parts for your project? Check out my Amazon Affiliate link below: http://amzn.to/2mVlbnl After having finished my CNC router (see my other Instructable), my workshop (a small shed in my backyard 3 x 6 m), became pretty full. The only other tools that I can fit in there are a small table saw, a drill press and some small powertools and handtools. So most of my woodworking happens outside. Next to woodworking and CNC stuff, I also like to work on smaller projects with electronics, which requires soldering etc. Since my 'workshop' is pretty full, I didn't have a proper place to work on these smaller projects. So I just moved some of my smaller tools (screwdrivers, soldering iron, pliers etc.) into my bedroom and worked on my electonics projects there. My parents were ok with the fact that I did some soldering in my bedroom, (better than in the kitchen or the living room), but didn't like the fact that my tools were laying all over the place. The table I was doing my work on also became pretty dented and full of glue and solder blobs. -
1X8 Speaker Cab Assembly Manual
THE PERCOLATOR 2 WATT TUBE AMPLIFIER ASSEMBLY2 WATTINSTRUCTIONS TUBE AMPLIFIER SPEAKER CABINET Avant-Garde AUDIO Products& ELECTRONIC Assembly Instructions 1x8 SPEAKER CABINET KIT ZEPPELINDESIGNLABS.COM • 2950 N. WESTERN, CHICAGO, IL 60618 103017 1x8 SPEAKER CABINET Assembly Manual INTRODUCTION ...................................................................................................... 3 CAUTIONS, WARNINGS & DANGERS ....................................................................... 3 WHAT YOU WILL NEED ............................................................................................ 3 WHAT’S IN THE BOX ................................................................................................ 3 BUILDING THE CABINET ........................................................................................... 8 A WORD ON COUNTERSINKS .............................................................................. 9 ASSEMBLING THE BOX .......................................................................................... 9 FINISHING THE BOX ........................................................................................... 24 BUILDING THE BAFFLE BOARD................................................................................. 29 MAKING THE SPEAKER CABLE ................................................................................ 40 PUTTING IT ALL TOGETHER ..................................................................................... 45 USING YOUR NEW SPEAKER CAB ......................................................................... -
AN-1448 Application Note
AN-1448 APPLICATION NOTE One Technology Way • P. O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Recommended Rework Procedure for PBGA Packages By Ramon Navarro INTRODUCTION component, such as heating the component beyond the This application note provides a recommended procedure for specified peak temperature or overexposure to heat, can lead to removing a plastic ball grid array package (PBGA) from a package delamination or external physical damage (see Figure 2 printed circuit board (PCB). and Figure 3). For a component that must undergo further analysis, delamination caused by improper component removal PACKAGE DESCRIPTION makes identifying the true failure mechanism more difficult. The PBGA is a package format with a main distinguishing Consequently, proper removal of the defective component is characteristic of an array of solder balls as a mode of interacting necessary to conduct effective failure analysis. with the substrate (such as a PCB). This feature gives the PBGA an advantage over other package formats with different pin configurations (such as single, dual in line, and quad types) in terms of achieving higher pin count density. Interconnection inside the PBGA package is implemented through wire bonding or flip chip technology. The die for the PBGA, which contains the integrated circuit, is encapsulated in mold compound. 15521-001 Figure 1. Illustration of a PBGA Component REWORK FOR PGBA COMPONENTS If defects are present after attaching the PBGA component to the PCB, rework to remove the defective component and replace it with a functioning device. Before removing the device, apply 15521-002 heat on the defective component until the solder joints are Figure 2.