Revision made by NSDA_25 May 2015 QUALIFICATION FILE – CONTACT DETAILS OF SUBMITTING BODY
Name and address of submitting body:
Electronics Sector Skills Council of India,
422, Okhla Industrial Estate, Phase – III, New Delhi - 110020
Name and contact details of individual dealing with the submission
Name: Rakesh Mathur
Position in the organisation: Senior Vice President
Address if different from above: Same as above.
Tel number(s)
T: +91-11-46035050
M: +91-9810 285 345 e-mail address: [email protected] List of documents submitted in support of the Qualifications File 1. Qualification Pack for Test and Repair Technician IT Hardware
2. Occupation Map for the selected job roles in the Sub-sector
3. RFP for development of National Occupational Standards
4. Composition of NOS Subcommittee 5. Mapping of Manpower skills in IT Hardware and Electronics Industry – MAIT (2009) http://www.essc-india.org/Essc/reports/MAIT0Report2008_15711.pdf 6. Approval of QP/ NOSs a) Minutes of the GC meeting 7. ESSCI IMaCS LMIS Report 8. List of Companies and industry associations which participated in the development of these qualifications packs 9. Procedure for Assessment of Assessing Bodies and Assessors
1 QUALIFICATION FILE SUMMARY
Qualification Title Test and Repair Technician- IT Hardware
Classification code ELE/Q4602
Body/bodies which will assess Electronics Sector Skills Council of India candidates Body/bodies which will award the Electronics Sector Skills Council of India certificate for the qualification. Body which will accredit providers Electronics Sector Skills Council of India to offer the qualification. Test Repair Technician: Occupation(s) to which the qualification gives access Also called ‘IT Repair Technician’, or ‘Hardware Technician’, the Test Repair Technician diagnoses and performs rework and repairs on the faulty module in the hardware. The individual at work is responsible for rectifying faults in the faulty module in of the IT hardware equipment brought in by the field technician. The individual receives the faulty module, diagnoses the problems, and decides on the action to be taken, reworks and repairs on them. The job requires the individual to have: attention to details, logical thinking and customer orientation. The individual must work on desk with different types of equipment.
Proposed level of the qualification 4 in the NSQF. Anticipated volume of 200 hours training/learning required to complete the qualification. Entry requirements / Diploma/ ITI + 1 year apprenticeship recommendations. Progression from the qualification. Test and Repair Technician – IT Hardware can progress with experience and skill enhancement to Field Engineer, Test & Repair Engineer, Service Engineer, Zonal/Regional Service Head, Service Head
Planned arrangements for RPL. Will be done at the place where required lab. Facility could be arranged.
International comparability where None known.
Formal structure of the qualification
Title of unit or other component Mandatory/ Estimated size Level (include any identification code used) Optional (learning hours) ELE/N 4604 Diagnose the problem Mandatory 80 4 ELE/N 4605 Repair and Rectify Faulty Module Mandatory 60 4 ELE/N 9909 Coordinate with colleagues and co-workers Mandatory 30 4
2 ELE/N 9910 Maintain Safe and Secure work Environment Mandatory 30 4
Please attach any document giving further detail about the structure of the qualification – eg a Curriculum or Qualification Pack. Give details of the document here: Qualification Pack is attached as Annexure 1
3 QUALIFICATION FILE SECTION 1 ASSESSMENT
Name of assessment body: If there will be more than one assessment body for this qualification, give details. Aspiring Minds Mettl IQAG
Will the assessment bodies be responsible for all assessment and for all candidates? Yes Explain how assessment for the qualification will be carried out and quality assured to achieve consistency.
Assessment of applicants is done as per ESSCI’s Assessment Procedure – Assessment Bodies and Assessors, as attached in Annexure. Will the assessment body be responsible for RPL assessment? Yes Give details of how RPL assessment for the qualification will be carried out and quality assured. RPL will be based on the same Qualification Pack and Assessment Criteria mentioned in the QP. The process of RPL assessment is under development.
ASSESSMENT POLICY Describe the overall assessment strategy and specific arrangements which have been put in place to ensure that assessment is always valid, consistent and fair and show that these are in line with the requirements of the NSQF: The emphasis is on practical demonstration of skills and knowledge based on the performance criteria. Assessment design team carries on research for understanding job details, followed with competencies mapping for the module and for the performance criteria. The assessment papers are created by the Subject Matter Experts and moderated by Assessment Designers of Assessment Partners as per the assessment criteria, for theory and practical questions considering the lab. facility available for the assessments. The Assessment Sets prepared by Assessment Partners are reviewed by ESSCI for consistency and match with the level of the QP.
The assessment partners are instructed to hire assessors with integrity, reliability and fairness and have them sign an agreement confirming confidentiality, no conflict of interest or any other position, which may compromise the quality of assessment. The assessors need to have adequate hands-on experience in the domain, preferably at a level above the position for which they conduct the assessment. Assessors are trained on the assessment process, and the question set. At the time of the assessment, the assessors check the identity of the candidates with a photo identification card and attendance during the training. They also take snapshots photographs of the practical assessments, and get the attendance for the assessment signed off by the candidate.
Give details of the document(s) here:
ESSCI’s Assessment Procedure – Assessment Bodies and Trainees
4
ASSESSMENT EVIDENCE Complete a grid for each grouping of NOS, assessment unit or other component as listed in the entry on the structure of the qualification on page 1.
CRITERIA FOR ASSESSMENT OF TRAINEES
Job Role Test and Repair Technician
QP # ELE/Q4602
Sector Skill Council Electronics Sector Skills Council of India
Guidelines for Assessment: 1. Criteria for assessment for each Qualification Pack will be created by the Sector Skill Council. Each Performance Criteria (PC) will be assigned marks proportional to its importance in NOS. SSC will also lay down proportion of marks for Theory and Skills Practical for each PC. 2. The assessment for the theory part will be based on knowledge bank of questions created by the SSC. 3. Individual assessment agencies will create unique question papers for theory part for each candidate at each examination/training centre (as per assessment criteria below) 4. Individual assessment agencies will create unique evaluations for skill practical for every student at each examination/training centre based on this criteria 5. To pass the Qualification Pack , every trainee should score a minimum of 70% in every NOS 6. In case of successfully passing only certain number of NOS's, the trainee is eligible to take subsequent assessment on the balance NOS's to pass the Qualification Pack.
Marks Allocation
Total Skills Element Performance Criteria Marks Out Of Theory Practical (400)
ELE/N4604 Diagnose the problem
PC1. receive the faulty hardware module from the 3 1 2 stores
PC2. document the number of modules received from 3 1 2 Receiving the the stores and take sign off from stores department faulty module and 100 material handling PC3. understand the daily targets on number of repairs 3 1 2 to be made
PC4. take anti static precautions before work and wear 3 1 2 ESD wrist straps or aprons
5 PC5. follow standard operating procedure while handling hardware modules such as handling PCB with 3 1 2 ESD standards
PC6. maintain accurate documentation on the module 3 1 2 and spares received for any reference
PC7. ensure that appropriate device and model 3 1 2 specific procedure is followed as per product manual
PC8. maintain zero-material defect during material 3 1 2 handling by following standard operating procedure
PC9. check visually the board and look for discoloured 3 1 2 components or any other signs of over heating
PC10. ensure the components are mounted properly 3 1 2 on the board
PC11. use multimeter to diagnose the circuit and do 3 1 2 basic check on voltage and current flow
PC12. perform a ‘power on self test’ (POST) check to identify the common issues faced by the hardware 3 1 2 module
PC13. identify the type of issue through the code displayed in POST card / beep pattern as a result of 3 1 2 POST check
PC14. use equipment such as oscilloscope to find any 3 1 2 logic related problem in the module
Diagnosing the PC15. check for individual component or module module functioning by replacing them with other spares in an 3 1 2 standard sequence
PC16. check for other issues such as fuse blow, faulty 3 1 2 joints and identify them
PC17. document clearly the various checks made to identify the issue for further reference in the spares 3 1 2 movement note
PC18. diagnose the faulty module within the 3 1 2 turnaround time (TAT)
PC19. follow standard procedure to diagnose the 2 1 1 module
PC20. document clearly the checks done to minimise 2 1 1 the work during escalation or rework
PC21. ensure all issues are diagnosed and avoid 2 1 1 rework
6 PC22. decide on the corrective action to be taken 2 1 1
PC23. decide whether the module can be repaired or 2 1 1 can be replaced
PC24. ensure the repair cost is within the beyond 2 1 1 economic repair (BER) cost Deciding on repairs PC25. escalate the issue to superior if decision cannot 2 1 1 be taken
PC26. decide on repair or replace of components 2 1 1 appropriately
PC27. estimate cost of repair and beyond economic 2 1 1 repair (BER) value
PC28. use electric and manual screw drivers to 2 1 1 disassemble and assemble the hardware
PC29. use multimeter to do basic voltage checks in 2 0 1 circuits
PC30. use special testing equipment such as Using tools 2 1 1 oscilloscope, POST cards to diagnose the module
PC31. follow standard safety procedures in handling 2 1 1 hazardous tools
PC32. maintain the tools appropriately to reduce 2 1 1 damage or repair
PC33. understand the work requirement from superior, 2 1 1 periodically
PC34. report to superior on the work completed 2 1 1
PC35. seek technical assistance from superior on 2 1 1 diagnosing the module
PC36. escalate the issues and problems that cannot be 2 1 1 handled Interacting with superior and PC37. document the work completed on the company 2 1 1 meeting target ERP software for tracking and future references
PC38. achieve 100% on time completion of diagnosing 2 1 1 the issues with reference to agreed target and time
PC39. carry out daily schedule as per instructions 2 1 1
PC40. find technical solutions on specific issues 2 1 1
PC41. report work status and prepare required 2 1 2 documentation as per company standards
7 TOTAL 100 40 60
ELE/N4605 Repair and rectify faulty module
PC1. diagnose the problem and identify the faulty 3 2 1 module
PC2. use desoldering / disassembling techniques to remove 3 1 2 the module as per company specifications
PC3. receive spare module from stores 3 1 2
PC4. assemble the module using tools such as screwdrivers 3 1 2
PC5. check for functioning of the hardware after repairing 2 1 1
Replacing the PC6. document on ERP software information procured from 2 1 1 faulty component the store and module replaced
PC7. follow standard operating procedure while handling 2 1 1 hardware modules such as handling PCB with ESD standards
PC8. identify and decide on replacing the module or 2 1 1 component as the appropriate solution
PC9. ensure that cost of replacing is justified as the repair 2 1 1 cost is beyond economic repair (BER)
PC10. ensure that replaced module or component is 100 2 1 1 working and no further rework is required
PC11. identify printed circuit board (PCB)-level or 2 1 1 electromechanical problem(s)
PC12. identify the faulty surface-mounted electronic 2 1 1 components
PC13. identify the cause of fault such as poor solder-joints 2 1 1 or solder-bridges
PC14. heat the singled out component using hot air gun to Reworking the 2 1 1 melt the solder joints and remove from PCB PCB at SMD component level PC15. clean the board by melting the old solder and 2 1 1 removing
PC16. place the new component precisely on the board at 2 1 1 specified location
PC17. solder the component on the PCB using soldering 2 1 1 stations
2 1 1 PC18. ensure the soldering is proper and the component is
8 fixed as per the specification
PC19. check for functioning of the hardware after 2 1 1 repairing
PC20. ensure that there is no damage of PCB while removal 2 1 1 and fixing of SMD components
PC21. ensure other components are not damaged while using hot air gun for removal of a component which could 2 1 1 cause damage
PC22. ensure adequate soldering for fixing the 2 1 1 component and no further rework is required
PC23. identify faults related to area array packages such as 2 1 1 ball grid array (BGA)
PC24. decide whether the component needs to be removed, repaired and replaced (re-balling) or repair without removal 2 1 1 of components (reflow)
PC25. perform the reflow function by heating the PCB in an oven, heat the non functioning component to melt the 2 1 1 solder in them, allow to cool and reassemble
PC26. check for functioning of the module after the repair 2 1 1 by reflow process
PC27. operate automated BGA work station to precisely remove the chip from the board and repair 2 1 1 them
Repairing the BGA PC28. perform re-balling function by dismantling, heating component the chip to be removed from the board, remove the solder 2 1 1 remains, put new solder balls, place the chip and solder them with the PCB
PC29. follow standard operating procedure and quality 2 1 1 standards to minimise any loss or damage
PC30. check for functioning of the PCB and equipment after 2 1 1 repairing
PC31. document the repair performed and spares used 2 1 1 in the ERP software or repairs movement note
PC32. avoid thermal stress in the surrounding areas 2 1 1
PC33. remove the component/ chip from the board without 2 1 1 any damage
2 1 1 PC34. re-ball and check for efficient functioning of the
9 chip and ensure no further rework
PC35. identify and use appropriate tools and manuals for 2 1 1 repairing the specific issue
PC36. prevent any accidents while handling hazardous tools 2 1 1 Using tools and equipment PC37. achieve results using appropriate tools for specific 2 1 1 rework activity
PC38. maintain zero-material defect during material 2 1 1 handling by following standard operating procedure
PC39. seek technical assistance from engineer on issues that 2 1 1 cannot be fixed at this level
PC40. take help from senior engineers on the non-frequent 2 1 1 repair modules such as peripherals repair
Seeking assistance PC41. receive instruction from engineers on usage of 2 1 1 on unresolved specific tools or new repair processes faults PC42. discuss with engineers if the cost estimate is found to be Beyond Economic repair (BER) and take appropriate 2 1 1 action
PC43. coordinate with engineers for performing quality 2 1 1 check on the repaired module
PC44. report on the work load and completion status 2 1 1
PC45. submit the appropriate documentation on 2 1 1 completion of task assigned
PC46. document the work completed on the company ERP Reporting and software for tracking and future references achieve 100% 2 1 1 achieving daily and weekly target of number of repairs productivity target PC47. meet the target of quality as per the Service Level 2 1 1 Agreement (SLA) and avoid rework
PC48. repair within the turnaround time (TAT) and deliver 2 1 1 them
TOTAL 100 49 51
ELE/N9909 Coordinate with colleagues and co-workers
PC1. understand and assess work requirements 7 3 4 Interacting with PC2. understand the targets and incentives 100 7 3 4 supervisor 7 3 4 PC3. understand new operating procedures and
10 constraints
PC4. report problems in the field 7 3 4
PC5. resolve personnel issues 6 2 4
PC6. receive feedback on work standards and customer 6 3 3 satisfaction
PC7. communicate any potential hazards at a particular 6 3 3 location
PC8. meet given targets 6 2 4
PC9. deliver work of expected quality despite 6 3 3 constraints
PC10. receive positive feedback on behaviour and attitude 6 2 4 shown during interaction
PC11. interact with colleagues from different functions 6 2 4 and understand the nature of their work
PC12. receive spares from tool room or stores; deposit 6 2 4 faulty modules and tools to stores
PC13. pass on customer complaints to colleagues in a Coordinating with 6 2 4 respective geographical area colleagues PC14. assist colleagues with resolving field problems 6 2 4
PC15. resolve conflicts and achieve smooth workflow 6 2 4
PC16. follow the company policy during cross functional 6 3 3 interaction
TOTAL 100 40 60
ELE/N9910 Maintain safe and secure work environment
PC1. comply with safety procedures followed in the 8 3 5 company
PC2. take adequate safety measures while handling 8 3 5 hazardous materials or tools
Following safety PC3. follow Electrostatic Discharge (ESD) measures 100 7 3 4 measures for electronic components
PC4. escalate matters about hazardous materials or 7 3 4 things found in the premises
PC5. use safety materials such as gloves, goggles, 7 3 4 masks, etc.
11 PC6. adequate safety measures while on work to 7 3 4 prevent accidents
PC7. ensure zero accidents in work 7 3 4
PC8. avoid damage of components due to negligence 7 2 5 in ESD procedures
PC9. ensure no loss for company due to safety 7 2 5 negligence
PC10. participate in regular safety drills for being 7 3 4 prepared in the event of a fire or natural calamity
PC11. help others during the drill or calamity 7 3 4 Participating in PC12. administer basic first aid 7 3 4 drills and workshops PC13. participate in company organised games and fitness 7 3 4 sessions such as yoga, etc.
PC14. develop good posture for working so that long term 7 3 4 health problems do not arise
TOTAL 100 40 60
12 QUALIFICATION FILE SECTION 3 EVIDENCE OF NEED
What evidence is there that the qualification is needed? Feedback from the industry was collected with respect to the past and projected industry growth, projected employee growth during next 5 years (Refer to Pages 14 to 27 of the LMIS report), skill gaps identified in entry level qualified workforce for the sub-sector (Refer to Page 31 of the LMIS report), and current employment number for the qualification (Refer to Occupation Map). This enabled prioritization of the development of the qualification packs.
What is the estimated uptake of this qualification and what is the basis of this estimate?
Estimated uptake of the qualification is obtained from the current employment (refer to the Occupation Map) times the projected employee growth for the sub-sector (Refer to Pages 21 to 27 of LMIS report). This is the basis for planning training with the industry and training providers. What steps were taken to ensure that the qualification(s) does/do not duplicate already existing or planned qualifications in the NSQF?
NSDC QRC team checks and confirms this. What arrangements are in place to monitor and review the qualification(s)? What data will be used and at what point will the qualification(s) be revised or updated?
Technical Committee’s inputs are sought from time-to-time as needed to check the relevance of QP/ NOSs, and the revision exercise is undertaken, as needed.
Please attach any documents giving further information about any of the topics above. Give details of the document(s) here: Refer Pages 1 & 2.
13 QUALIFICATION FILE SECTION 3 SUMMARY EVIDENCE OF LEVEL
Level of qualification: 4
Summary of Direct Evidence (from learning outcomes):
LEVELING SCORE CARD Professional Professional Process Required Knowledge Skills Core Skills Responsibility Level Requires good Requires Good Requires In his routine understanding of Technical understanding knowledge of activities of Repair & Testing of knowledge of of Customer language, good Repair & Testing Computer Computer expectation communication and listening to hardware and Technology of from the skills to interact and associated CPU, Display System and with the field understanding peripherals. Should and other placement of engineer. Requires complaint, have good peripherals its equipment, documentations diagnosing the understanding functionality, inform skill for collecting fault, identifying from experience specifications customer of information, filling the faulty and technical and placement of up the forms, module, knowledge of operational CPU and writing test assembling and common and requirements. peripherals, reports. Interacting disassembling involved defects Has to be advise with superior the faulty and solutions to experienced customer on briefing them on module or conduct repair at and Operation, status of work- component. System, module knowledge of preliminary completion and Following Safety and PCB level, equipment maintenance getting resolutions procedures he is loading-software repair, and repairs of on new faults and not under any and booting-up a identifying and equipment. repair kind of 4 new system. replacing Requires requirements and supervision. Should have good defective sub- technical alternate repair Following knowledge of systems and expertise in strategies & tools. Personal and common problems testing installation Maintain good Equipment and of trouble- computer for and repair, peer group relation safety shooting normal necessary skill and capability of procedures while hardware/software operation and correct learning from their handling issues in faulty after tools and technical and equipment and system since installation or replacement behavioural sophisticated installation and repair. As all parts to experiences. Places instruments and problem resolution the above is in achieve it at Level-4 tools. With each are predictable the field of productivity problem solving and routine placing Computer- and quality. exercise he is the job at Level-4. Technology Places job at adding to his the job is Level-4 own learning. placed at Because of these Level-4. reasons this can be pegged at level 4. 4 4 4 4 4 Summary of other evidence (if used):
14 QUALIFICATION FILE SECTION 4
EVIDENCE OF RECOGNITION OR PROGRESSION
What steps have been taken in the design of this or other qualifications to ensure that there is a clear path to other qualifications in this sector?
Vertical mobility options are available in the Occupation map.
Please attach any documents giving further information about any of the topics above. Give details of the document(s) here:
Occupation Map Refer Page 1 for the list of attachments
QUALIFICATION FILE SECTION 6 EVIDENCE OF INTERNATIONAL COMPARABILITY
List any comparisons which have been established.
Nil.
15