Microcode Compression for TIPI
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Data Storage the CPU-Memory
Data Storage •Disks • Hard disk (HDD) • Solid state drive (SSD) •Random Access Memory • Dynamic RAM (DRAM) • Static RAM (SRAM) •Registers • %rax, %rbx, ... Sean Barker 1 The CPU-Memory Gap 100,000,000.0 10,000,000.0 Disk 1,000,000.0 100,000.0 SSD Disk seek time 10,000.0 SSD access time 1,000.0 DRAM access time Time (ns) Time 100.0 DRAM SRAM access time CPU cycle time 10.0 Effective CPU cycle time 1.0 0.1 CPU 0.0 1985 1990 1995 2000 2003 2005 2010 2015 Year Sean Barker 2 Caching Smaller, faster, more expensive Cache 8 4 9 10 14 3 memory caches a subset of the blocks Data is copied in block-sized 10 4 transfer units Larger, slower, cheaper memory Memory 0 1 2 3 viewed as par@@oned into “blocks” 4 5 6 7 8 9 10 11 12 13 14 15 Sean Barker 3 Cache Hit Request: 14 Cache 8 9 14 3 Memory 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Sean Barker 4 Cache Miss Request: 12 Cache 8 12 9 14 3 12 Request: 12 Memory 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Sean Barker 5 Locality ¢ Temporal locality: ¢ Spa0al locality: Sean Barker 6 Locality Example (1) sum = 0; for (i = 0; i < n; i++) sum += a[i]; return sum; Sean Barker 7 Locality Example (2) int sum_array_rows(int a[M][N]) { int i, j, sum = 0; for (i = 0; i < M; i++) for (j = 0; j < N; j++) sum += a[i][j]; return sum; } Sean Barker 8 Locality Example (3) int sum_array_cols(int a[M][N]) { int i, j, sum = 0; for (j = 0; j < N; j++) for (i = 0; i < M; i++) sum += a[i][j]; return sum; } Sean Barker 9 The Memory Hierarchy The Memory Hierarchy Smaller On 1 cycle to access CPU Chip Registers Faster Storage Costlier instrs can L1, L2 per byte directly Cache(s) ~10’s of cycles to access access (SRAM) Main memory ~100 cycles to access (DRAM) Larger Slower Flash SSD / Local network ~100 M cycles to access Cheaper Local secondary storage (disk) per byte slower Remote secondary storage than local (tapes, Web servers / Internet) disk to access Sean Barker 10. -
PIPELINING and ASSOCIATED TIMING ISSUES Introduction: While
PIPELINING AND ASSOCIATED TIMING ISSUES Introduction: While studying sequential circuits, we studied about Latches and Flip Flops. While Latches formed the heart of a Flip Flop, we have explored the use of Flip Flops in applications like counters, shift registers, sequence detectors, sequence generators and design of Finite State machines. Another important application of latches and flip flops is in pipelining combinational/algebraic operation. To understand what is pipelining consider the following example. Let us take a simple calculation which has three operations to be performed viz. 1. add a and b to get (a+b), 2. get magnitude of (a+b) and 3. evaluate log |(a + b)|. Each operation would consume a finite period of time. Let us assume that each operation consumes 40 nsec., 35 nsec. and 60 nsec. respectively. The process can be represented pictorially as in Fig. 1. Consider a situation when we need to carry this out for a set of 100 such pairs. In a normal course when we do it one by one it would take a total of 100 * 135 = 13,500 nsec. We can however reduce this time by the realization that the whole process is a sequential process. Let the values to be evaluated be a1 to a100 and the corresponding values to be added be b1 to b100. Since the operations are sequential, we can first evaluate (a1 + b1) while the value |(a1 + b1)| is being evaluated the unit evaluating the sum is dormant and we can use it to evaluate (a2 + b2) giving us both |(a1 + b1)| and (a2 + b2) at the end of another evaluation period. -
2.5 Classification of Parallel Computers
52 // Architectures 2.5 Classification of Parallel Computers 2.5 Classification of Parallel Computers 2.5.1 Granularity In parallel computing, granularity means the amount of computation in relation to communication or synchronisation Periods of computation are typically separated from periods of communication by synchronization events. • fine level (same operations with different data) ◦ vector processors ◦ instruction level parallelism ◦ fine-grain parallelism: – Relatively small amounts of computational work are done between communication events – Low computation to communication ratio – Facilitates load balancing 53 // Architectures 2.5 Classification of Parallel Computers – Implies high communication overhead and less opportunity for per- formance enhancement – If granularity is too fine it is possible that the overhead required for communications and synchronization between tasks takes longer than the computation. • operation level (different operations simultaneously) • problem level (independent subtasks) ◦ coarse-grain parallelism: – Relatively large amounts of computational work are done between communication/synchronization events – High computation to communication ratio – Implies more opportunity for performance increase – Harder to load balance efficiently 54 // Architectures 2.5 Classification of Parallel Computers 2.5.2 Hardware: Pipelining (was used in supercomputers, e.g. Cray-1) In N elements in pipeline and for 8 element L clock cycles =) for calculation it would take L + N cycles; without pipeline L ∗ N cycles Example of good code for pipelineing: §doi =1 ,k ¤ z ( i ) =x ( i ) +y ( i ) end do ¦ 55 // Architectures 2.5 Classification of Parallel Computers Vector processors, fast vector operations (operations on arrays). Previous example good also for vector processor (vector addition) , but, e.g. recursion – hard to optimise for vector processors Example: IntelMMX – simple vector processor. -
Microprocessor Architecture
EECE416 Microcomputer Fundamentals Microprocessor Architecture Dr. Charles Kim Howard University 1 Computer Architecture Computer System CPU (with PC, Register, SR) + Memory 2 Computer Architecture •ALU (Arithmetic Logic Unit) •Binary Full Adder 3 Microprocessor Bus 4 Architecture by CPU+MEM organization Princeton (or von Neumann) Architecture MEM contains both Instruction and Data Harvard Architecture Data MEM and Instruction MEM Higher Performance Better for DSP Higher MEM Bandwidth 5 Princeton Architecture 1.Step (A): The address for the instruction to be next executed is applied (Step (B): The controller "decodes" the instruction 3.Step (C): Following completion of the instruction, the controller provides the address, to the memory unit, at which the data result generated by the operation will be stored. 6 Harvard Architecture 7 Internal Memory (“register”) External memory access is Very slow For quicker retrieval and storage Internal registers 8 Architecture by Instructions and their Executions CISC (Complex Instruction Set Computer) Variety of instructions for complex tasks Instructions of varying length RISC (Reduced Instruction Set Computer) Fewer and simpler instructions High performance microprocessors Pipelined instruction execution (several instructions are executed in parallel) 9 CISC Architecture of prior to mid-1980’s IBM390, Motorola 680x0, Intel80x86 Basic Fetch-Execute sequence to support a large number of complex instructions Complex decoding procedures Complex control unit One instruction achieves a complex task 10 -
Instruction Pipelining (1 of 7)
Chapter 5 A Closer Look at Instruction Set Architectures Objectives • Understand the factors involved in instruction set architecture design. • Gain familiarity with memory addressing modes. • Understand the concepts of instruction- level pipelining and its affect upon execution performance. 5.1 Introduction • This chapter builds upon the ideas in Chapter 4. • We present a detailed look at different instruction formats, operand types, and memory access methods. • We will see the interrelation between machine organization and instruction formats. • This leads to a deeper understanding of computer architecture in general. 5.2 Instruction Formats (1 of 31) • Instruction sets are differentiated by the following: – Number of bits per instruction. – Stack-based or register-based. – Number of explicit operands per instruction. – Operand location. – Types of operations. – Type and size of operands. 5.2 Instruction Formats (2 of 31) • Instruction set architectures are measured according to: – Main memory space occupied by a program. – Instruction complexity. – Instruction length (in bits). – Total number of instructions in the instruction set. 5.2 Instruction Formats (3 of 31) • In designing an instruction set, consideration is given to: – Instruction length. • Whether short, long, or variable. – Number of operands. – Number of addressable registers. – Memory organization. • Whether byte- or word addressable. – Addressing modes. • Choose any or all: direct, indirect or indexed. 5.2 Instruction Formats (4 of 31) • Byte ordering, or endianness, is another major architectural consideration. • If we have a two-byte integer, the integer may be stored so that the least significant byte is followed by the most significant byte or vice versa. – In little endian machines, the least significant byte is followed by the most significant byte. -
Review of Computer Architecture
Basic Computer Architecture CSCE 496/896: Embedded Systems Witawas Srisa-an Review of Computer Architecture Credit: Most of the slides are made by Prof. Wayne Wolf who is the author of the textbook. I made some modifications to the note for clarity. Assume some background information from CSCE 430 or equivalent von Neumann architecture Memory holds data and instructions. Central processing unit (CPU) fetches instructions from memory. Separate CPU and memory distinguishes programmable computer. CPU registers help out: program counter (PC), instruction register (IR), general- purpose registers, etc. von Neumann Architecture Memory Unit Input CPU Output Unit Control + ALU Unit CPU + memory address 200PC memory data CPU 200 ADD r5,r1,r3 ADD IRr5,r1,r3 Recalling Pipelining Recalling Pipelining What is a potential Problem with von Neumann Architecture? Harvard architecture address data memory data PC CPU address program memory data von Neumann vs. Harvard Harvard can’t use self-modifying code. Harvard allows two simultaneous memory fetches. Most DSPs (e.g Blackfin from ADI) use Harvard architecture for streaming data: greater memory bandwidth. different memory bit depths between instruction and data. more predictable bandwidth. Today’s Processors Harvard or von Neumann? RISC vs. CISC Complex instruction set computer (CISC): many addressing modes; many operations. Reduced instruction set computer (RISC): load/store; pipelinable instructions. Instruction set characteristics Fixed vs. variable length. Addressing modes. Number of operands. Types of operands. Tensilica Xtensa RISC based variable length But not CISC Programming model Programming model: registers visible to the programmer. Some registers are not visible (IR). Multiple implementations Successful architectures have several implementations: varying clock speeds; different bus widths; different cache sizes, associativities, configurations; local memory, etc. -
Cache-Aware Roofline Model: Upgrading the Loft
1 Cache-aware Roofline model: Upgrading the loft Aleksandar Ilic, Frederico Pratas, and Leonel Sousa INESC-ID/IST, Technical University of Lisbon, Portugal ilic,fcpp,las @inesc-id.pt f g Abstract—The Roofline model graphically represents the attainable upper bound performance of a computer architecture. This paper analyzes the original Roofline model and proposes a novel approach to provide a more insightful performance modeling of modern architectures by introducing cache-awareness, thus significantly improving the guidelines for application optimization. The proposed model was experimentally verified for different architectures by taking advantage of built-in hardware counters with a curve fitness above 90%. Index Terms—Multicore computer architectures, Performance modeling, Application optimization F 1 INTRODUCTION in Tab. 1. The horizontal part of the Roofline model cor- Driven by the increasing complexity of modern applica- responds to the compute bound region where the Fp can tions, microprocessors provide a huge diversity of compu- be achieved. The slanted part of the model represents the tational characteristics and capabilities. While this diversity memory bound region where the performance is limited is important to fulfill the existing computational needs, it by BD. The ridge point, where the two lines meet, marks imposes challenges to fully exploit architectures’ potential. the minimum I required to achieve Fp. In general, the A model that provides insights into the system performance original Roofline modeling concept [10] ties the Fp and the capabilities is a valuable tool to assist in the development theoretical bandwidth of a single memory level, with the I and optimization of applications and future architectures. -
ARM-Architecture Simulator Archulator
Embedded ECE Lab Arm Architecture Simulator University of Arizona ARM-Architecture Simulator Archulator Contents Purpose ............................................................................................................................................ 2 Description ...................................................................................................................................... 2 Block Diagram ............................................................................................................................ 2 Component Description .............................................................................................................. 3 Buses ..................................................................................................................................................... 3 µP .......................................................................................................................................................... 3 Caches ................................................................................................................................................... 3 Memory ................................................................................................................................................. 3 CoProcessor .......................................................................................................................................... 3 Using the Archulator ...................................................................................................................... -
CS152: Computer Systems Architecture Pipelining
CS152: Computer Systems Architecture Pipelining Sang-Woo Jun Winter 2021 Large amount of material adapted from MIT 6.004, “Computation Structures”, Morgan Kaufmann “Computer Organization and Design: The Hardware/Software Interface: RISC-V Edition”, and CS 152 Slides by Isaac Scherson Eight great ideas ❑ Design for Moore’s Law ❑ Use abstraction to simplify design ❑ Make the common case fast ❑ Performance via parallelism ❑ Performance via pipelining ❑ Performance via prediction ❑ Hierarchy of memories ❑ Dependability via redundancy But before we start… Performance Measures ❑ Two metrics when designing a system 1. Latency: The delay from when an input enters the system until its associated output is produced 2. Throughput: The rate at which inputs or outputs are processed ❑ The metric to prioritize depends on the application o Embedded system for airbag deployment? Latency o General-purpose processor? Throughput Performance of Combinational Circuits ❑ For combinational logic o latency = tPD o throughput = 1/t F and G not doing work! PD Just holding output data X F(X) X Y G(X) H(X) Is this an efficient way of using hardware? Source: MIT 6.004 2019 L12 Pipelined Circuits ❑ Pipelining by adding registers to hold F and G’s output o Now F & G can be working on input Xi+1 while H is performing computation on Xi o A 2-stage pipeline! o For input X during clock cycle j, corresponding output is emitted during clock j+2. Assuming ideal registers Assuming latencies of 15, 20, 25… 15 Y F(X) G(X) 20 H(X) 25 Source: MIT 6.004 2019 L12 Pipelined Circuits 20+25=45 25+25=50 Latency Throughput Unpipelined 45 1/45 2-stage pipelined 50 (Worse!) 1/25 (Better!) Source: MIT 6.004 2019 L12 Pipeline conventions ❑ Definition: o A well-formed K-Stage Pipeline (“K-pipeline”) is an acyclic circuit having exactly K registers on every path from an input to an output. -
Multi-Tier Caching Technology™
Multi-Tier Caching Technology™ Technology Paper Authored by: How Layering an Application’s Cache Improves Performance Modern data storage needs go far beyond just computing. From creative professional environments to desktop systems, Seagate provides solutions for almost any application that requires large volumes of storage. As a leader in NAND, hybrid, SMR and conventional magnetic recording technologies, Seagate® applies different levels of caching and media optimization to benefit performance and capacity. Multi-Tier Caching (MTC) Technology brings the highest performance and areal density to a multitude of applications. Each Seagate product is uniquely tailored to meet the performance requirements of a specific use case with the right memory, NAND, and media type and size. This paper explains how MTC Technology works to optimize hard drive performance. MTC Technology: Key Advantages Capacity requirements can vary greatly from business to business. While the fastest performance can be achieved using Dynamic Random Access Memory (DRAM) cache, the data in the DRAM is not persistent through power cycles and DRAM is very expensive compared to other media. NAND flash data survives through power cycles but it is still very expensive compared to a magnetic storage medium. Magnetic storage media cache offers good performance at a very low cost. On the downside, media cache takes away overall disk drive capacity from PMR or SMR main store media. MTC Technology solves this dilemma by using these diverse media components in combination to offer different levels of performance and capacity at varying price points. By carefully tuning firmware with appropriate cache types and sizes, the end user can experience excellent overall system performance. -
CUDA 11 and A100 - WHAT’S NEW? Markus Hrywniak, 23Rd June 2020 TOPICS for TODAY
CUDA 11 AND A100 - WHAT’S NEW? Markus Hrywniak, 23rd June 2020 TOPICS FOR TODAY Ampere architecture – A100, powering DGX–A100, HGX-A100... and soon, FZ Jülich‘s JUWELS Booster New CUDA 11 Toolkit release Overview of features Talk next week: Third generation Tensor Cores GTC talks go into much more details. See references! 2 HGX-A100 4-GPU HGX-A100 8-GPU • 4 A100 with NVLINK • 8 A100 with NVSwitch 3 HIERARCHY OF SCALES Multi-System Rack Multi-GPU System Multi-SM GPU Multi-Core SM Unlimited Scale 8 GPUs 108 Multiprocessors 2048 threads 4 AMDAHL’S LAW serial section parallel section serial section Amdahl’s Law parallel section Shortest possible runtime is sum of serial section times Time saved serial section Some Parallelism Increased Parallelism Infinite Parallelism Program time = Parallel sections take less time Parallel sections take no time sum(serial times + parallel times) Serial sections take same time Serial sections take same time 5 OVERCOMING AMDAHL: ASYNCHRONY & LATENCY serial section parallel section serial section Split up serial & parallel components parallel section serial section Some Parallelism Task Parallelism Infinite Parallelism Program time = Parallel sections overlap with serial sections Parallel sections take no time sum(serial times + parallel times) Serial sections take same time 6 OVERCOMING AMDAHL: ASYNCHRONY & LATENCY CUDA Concurrency Mechanisms At Every Scope CUDA Kernel Threads, Warps, Blocks, Barriers Application CUDA Streams, CUDA Graphs Node Multi-Process Service, GPU-Direct System NCCL, CUDA-Aware MPI, NVSHMEM 7 OVERCOMING AMDAHL: ASYNCHRONY & LATENCY Execution Overheads Non-productive latencies (waste) Operation Latency Network latencies Memory read/write File I/O .. -
Threading SIMD and MIMD in the Multicore Context the Ultrasparc T2
Overview SIMD and MIMD in the Multicore Context Single Instruction Multiple Instruction ● (note: Tute 02 this Weds - handouts) ● Flynn’s Taxonomy Single Data SISD MISD ● multicore architecture concepts Multiple Data SIMD MIMD ● for SIMD, the control unit and processor state (registers) can be shared ■ hardware threading ■ SIMD vs MIMD in the multicore context ● however, SIMD is limited to data parallelism (through multiple ALUs) ■ ● T2: design features for multicore algorithms need a regular structure, e.g. dense linear algebra, graphics ■ SSE2, Altivec, Cell SPE (128-bit registers); e.g. 4×32-bit add ■ system on a chip Rx: x x x x ■ 3 2 1 0 execution: (in-order) pipeline, instruction latency + ■ thread scheduling Ry: y3 y2 y1 y0 ■ caches: associativity, coherence, prefetch = ■ memory system: crossbar, memory controller Rz: z3 z2 z1 z0 (zi = xi + yi) ■ intermission ■ design requires massive effort; requires support from a commodity environment ■ speculation; power savings ■ massive parallelism (e.g. nVidia GPGPU) but memory is still a bottleneck ■ OpenSPARC ● multicore (CMT) is MIMD; hardware threading can be regarded as MIMD ● T2 performance (why the T2 is designed as it is) ■ higher hardware costs also includes larger shared resources (caches, TLBs) ● the Rock processor (slides by Andrew Over; ref: Tremblay, IEEE Micro 2009 ) needed ⇒ less parallelism than for SIMD COMP8320 Lecture 2: Multicore Architecture and the T2 2011 ◭◭◭ • ◮◮◮ × 1 COMP8320 Lecture 2: Multicore Architecture and the T2 2011 ◭◭◭ • ◮◮◮ × 3 Hardware (Multi)threading The UltraSPARC T2: System on a Chip ● recall concurrent execution on a single CPU: switch between threads (or ● OpenSparc Slide Cast Ch 5: p79–81,89 processes) requires the saving (in memory) of thread state (register values) ● aggressively multicore: 8 cores, each with 8-way hardware threading (64 virtual ■ motivation: utilize CPU better when thread stalled for I/O (6300 Lect O1, p9–10) CPUs) ■ what are the costs? do the same for smaller stalls? (e.g.