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Amd Product and Technology Roadmaps Cautionary Statement AMD PRODUCT AND TECHNOLOGY ROADMAPS CAUTIONARY STATEMENT This presentation contains forward-looking statements concerning Advanced Micro Devices, Inc. (“AMD” or the “Company”) including, among other things, timing, availability, features and functionality of the AMD “Kaveri” APU, AMD “Kaveri”-based notebooks, the AMD “Mullins” APU and AMD’s R9, R7 and R5 M200 Series AMD mobile discrete GPUs, and AMD’s mobile discrete GPU roadmap which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Risks include the possibility that that Intel Corporation’s pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities may negatively impact the Company’s plans; that the Company will require additional funding and may be unable to raise sufficient capital on favorable terms, or at all; that customers stop buying the Company’s products or materially reduce their operations or demand for its products; that the Company may be unable to develop, launch and ramp new products and technologies in the volumes that are required by the market at mature yields on a timely basis; that the company’s third-party foundry suppliers will be unable to transition the Company’s products to advanced manufacturing process technologies in a timely and effective way or to manufacture the Company’s products on a timely basis in sufficient quantities and using competitive process technologies; that the Company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will not fully utilize the Company’s projected manufacturing capacity needs at GLOBALFOUNDRIES Inc. (GF) microprocessor manufacturing facilities; that the Company’s requirements for wafers will be less than the fixed number of wafers that the Company agreed to purchase from GF or GF encounters problems that significantly reduce the number of functional die the Company receives from each wafer; that the Company is unable to successfully implement its long-term business strategy; that the Company inaccurately estimates the quantity or type of products that its customers will want in the future or will ultimately end up purchasing, resulting in excess or obsolete inventory; that the Company is unable to manage the risks related to the use of its third-party distributors and add-in-board (AIB) partners or offer the appropriate incentives to focus them on the sale of the Company’s products; that the Company may be unable to maintain the level of investment in research and development that is required to remain competitive; that there may be unexpected variations in market growth and demand for the Company’s products and technologies in light of the product mix that it may have available at any particular time; that global business and economic conditions, including consumer PC market conditions, will not improve or will worsen; and the effect of political or economic instability, domestically or internationally, on our sales or supply chain. Investors are urged to review in detail the risks and uncertainties in the Company's Securities and Exchange Commission filings, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended December 28, 2013. 2 | AMD PRODUCT ROADMAPS | MAY 2014 UPDATE AMD 2013-2014 DESKTOP GRAPHICS ROADMAP 2013: AMD RADEON™ HD 8000 SERIES 2014: AMD RADEON™ 200 SERIES AMD Radeon™ HD 8990 Series GPU AMD Radeon™ R9 290X GPU Enthusiast AMD Radeon™ HD 8900 Series GPU AMD Radeon™ R9 290 GPU AMD Radeon™ HD 8800 Series GPU AMD Radeon™ R9 280X GPU Performance AMD Radeon™ HD 8700 Series GPU AMD Radeon™ R9 270X GPU AMD Radeon™ HD 8600 Series GPU AMD Radeon™ R7 260X GPU Mainstream AMD Radeon™ HD 8500 Series GPU AMD Radeon™ R7 250 GPU Value AMD Radeon™ HD 8400 Series GPU AMD Radeon™ R7 240 GPU 3 | AMD PRODUCT ROADMAPS | MAY 2014 UPDATE AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments. AMD 2013-2014 MOBILE GRAPHICS ROADMAP 2013: AMD RADEON™ HD 8000M SERIES 2014: AMD RADEON™ R9, R7, and R5 M200 SERIES AMD Radeon™ HD 8970M Series GPU AMD Radeon™ R9 M290X Series GPU Enthusiast AMD Radeon™ HD 8800M Series GPU Coming Soon Performance AMD Radeon™ HD 8700M Series GPU AMD Radeon™ R7 M265 Series GPU AMD Radeon™ HD 8600M Series GPU Coming Soon Mainstream AMD Radeon™ HD 8500M Series GPU Coming Soon AMD Radeon™ HD 8400M Series GPU AMD Radeon™ R5 M230 Series GPU 4 | AMD PRODUCT ROADMAPS | MAY 2014 UPDATE AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments. AMD 2013-2014 MOBILITY ROADMAP 2013 2014 Performance “Richland” APU “Kaveri” APU 2-4 “Piledriver” CPU Cores 2-4 “Steamroller” CPU Cores 2nd Generation DX®11 GPU Cores GCN Graphics Compute Units 17W-35W HSA Features AMD TrueAudio 15W-35W Mainstream 32nm 28nm “Kabini” APU “Beema ” APU 2-4 “Jaguar” CPU Cores 2-4 “Puma” CPU Cores GCN Graphics Compute Units GCN Graphics Compute Units 15W-25W AMD Security Processor 10W-25W Low-Power 28nm SoC 28nm SoC Essential “Temash” APU “Mullins ” APU 2-4 “Jaguar” CPU Cores 2-4 “Puma” CPU Cores GCN Graphics Compute Units GCN Graphics Compute Units 3W-4W SDP AMD Security Processor Ultra-Low Power ~2W SDP 28nm SoC 28nm SoC 5 | AMD PRODUCT ROADMAPS | MAY 2014 UPDATE AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments. AMD 2013-2014 DESKTOP ROADMAP 2013 2014 2nd Generation FX CPU Performance 32nm 4-8 “Piledriver” CPU Cores AM3+ “Richland” APU “Kaveri” APU Mainstream 2-4 “Piledriver” CPU Cores 2-4 “Steamroller” CPU Cores 2nd Generation DX®11 GPU Cores GCN Graphics Compute Units Desktop FM2 µPGA HSA Features AMD TrueAudio Performance FM2+ µPGA All-in-Ones 32nm 28nm “Brazos 2.0” APU “Kabini” APU “Beema” APU Essential 2 “Bobcat” CPU Cores 2-4 “Jaguar” CPU Cores 2-4 “Puma” CPU Cores DX®11-Capable GPU Cores GCN Graphics Compute Units GCN Graphics Compute Units FT3 BGA & FS1b µPGA AMD Security Processor FT3 BGA Small Form Factor 40nm 28nm SoC 28nm SoC 6 | AMD PRODUCT ROADMAPS | MAY 2014 UPDATE AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments. AMD 2013-2014 SERVER ROADMAP 2013 2014 AMD Opteron™ 6300 and 4300 Series “Warsaw” CPU 2P and 4P 4, 6, 8, 12 or 16 “Piledriver” CPU Cores 12 or 16 “Piledriver” CPU Cores Enterprise, 35W-140W Mainstream Platforms 32nm 32nm AMD Opteron™ 3300 Series “Berlin” CPU/APU 4 or 8 “Piledriver” CPU Cores 4 “Steamroller” CPU Cores 25W-65W TDP GCN Graphics Compute Units (APU) HSA Features (APU) 32nm 28nm 1P Web/Enterprise Services Clusters AMD Opteron™ X1150 CPU and X2150 APU “Seattle” CPU 4 “Jaguar” CPU Cores ARM “A57” CPU Cores GCN Graphics Compute Units (APU) 9W-22W 28nm SoC 28nm SoC 7 | AMD PRODUCT ROADMAPS | MAY 2014 UPDATE AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments. AMD 2013-2014 EMBEDDED SOLUTIONS ROADMAP 2013 2014 AMD Embedded R-Series APU/CPU “Bald Eagle” APU/CPU 2 or 4 “Piledriver” Cores 2 or 4 “Steamroller” CPU Cores AMD Radeon™ HD 7000 Series GPU GCN Graphics Compute Units (APU) 17W-35W 28nm HSA Features (APU) 17W-35W High-performance “Hierofalcon” CPU 4 or 8 ARM “A57” CPU cores 10 Gig Ethernet 32nm 28nm SoC 15W-30W AMD Embedded G-Series APU SOC “Steppe Eagle” APU 2 or 4 “Jaguar” CPU Cores 2 or 4 Enhanced “Jaguar” CPU Cores Low-power AMD Radeon™ HD 8000 Series GPU Cores GCN Graphics Compute Units 28nm 6W-25W 28nm SoC 5W-25W AMD Radeon™ E6460 / E6760 GPU “Adelaar” GPU 512MB GCN Graphics Compute Units Discrete Graphics 1GB GDDR5 2GB GDDR5 40nm 28nm 72GB/s Memory Throughput 8 | AMD PRODUCT ROADMAPS | MAY 2014 UPDATE AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments. AMBIDEXTROUS COMPUTING ROADMAP 2014 2015 2016+ Ambidextrous Computing Leadership x86 and 64-bit ARM for: “Kaveri” “Beema” and “Mullins" Dense Server Embedded Semi-Custom Ultra-Low “Project SkyBridge” Developing 64-bit ARM Power Client family of 20nm APUs cores alongside new “Seattle” and SoCs 64-bit x86 cores 9 | AMD PRODUCT ROADMAPS | MAY 2014 UPDATE AMD’S ARM CORE ROADMAP 2014 2015 2016 AMD “K12” ARM ARM Core ARM A57 ARM Low Power ARM A57 ARM AMD-Developed ARM Core Design Cores Methodology and Verification Combined “Seattle” Software and ARM IP “Project SkyBridge” AMD roadmaps are subject to change without notice or obligations to notify of changes. 10 | AMD PRODUCT ROADMAPS | MAY 2014 UPDATE Placement of boxes intended to represent first year of production shipments. DISCLAIMER & ATTRIBUTION The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors. The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like.
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