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Microstructure, Physical and Soldering Properties of Tin-Zinc-Bismuth Alloy

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Microstructure, Physical and Soldering Properties of Tin-Zinc-Bismuth Alloy id5437984 pdfMachine by Broadgun Software - a great PDF writer! - a great PDF creator! - http://www.pdfmachine.com http://www.broadgun.com ISSN : 0974 - 7486 Volume 12 Issue 2 MMaatteerriiaallss SSAn ccIniidieeannn Jouccrneeal Full Paper MSAIJ, 12(2), 2015 [029-035] Microstructure, physical and soldering properties of Tin-Zinc- Bismuth alloy Abu Bakr El-Bediwi*, Amira El-Shafei, Mustafa Kamal Metal Physics Lab., Physics Department, Faculty of Science, Mansoura University, (EGYPT) E-mail : [email protected] ABSTRACT KEYWORDS The aim of present work was to improve physical and soldering properties Microstructure; of tin- zinc alloy and produce new Sn-Zn-Bi alloy with superior soldering Melting point; properties for electronic applications. To verify this aims microstructure, Contact angle; electrical resistivity, elastic modulus, internal friction, thermal diffusivity, Elastic modulus; melting pointand wetting behavior of Sn96-x Zn4Bix (x=0, 6, 12, 18, 24 and 30) Internal friction; alloys have been investigated. Melting point, elastic modulus and thermal Thermal diffusivity; diffusivity values of Sn96 Zn4 alloy decreased but electrical resistivity and Sn- Zn- Bi alloy. internal friction values increased after adding bismuth content. Wetting behavior,contact angle, of Sn96 Zn4 alloyvaried after adding bismuth content. The Sn72Zn4Bi24lead free solder alloy has the beast soldering properties for electronic application compared to commercial Pb- Sn alloy. 2015 Trade Science Inc. - INDIA INTRODUCTION of lead, environmental regulations around the world have been targeted to eliminate the usage of Pb-bearing sol- There are many different types of solder being used ders in electronic assemblies. This has prompted the “Pb-free” solders, and has enhanced by industry. Solders are available in various forms that development of include bars, wires, ingots, and powders. Soldering is the research activities in this field. Lead-free solders in technically defined as the joining of two base materials commercial use may contain tin, copper, silver, bismuth, “filler” metal with a melting through the use of a third indium, zinc, antimony, and traces of other metals. Sn- temperature well below those of the substrates and typi- Zn solder alloy containing about 9 wt. % zinc (eutectic °C. Solder alloys are categorized as cally less than 450 composition) has been proposed as a lead-free solder either soft or hard. Soft solders typically contain tin and material which is expected to be put into practical use lead, although indium, cadmium, and bismuth are also for reflow soldering. Those Sn-Zn solder alloys have found in soft solders. Hard solders contain metals such advantages such that a eutectic temperature of a tin- ° C, closest to a eutectic point as gold, zinc, aluminum, and silicon. Amore rigorous zinc alloy is equal to 199 classification is based on the melting temperature where of a tin-lead alloy among Sn-based lead-free solder al- °C while hard soft solders melt belowapproximately 350 loys and costs of raw materials of them are lower than °C. Due to the inherent toxicity solders melt above 350 those of the other lead-free solder alloys. The influence 30 Microstructure, physical and soldering. properties of Tin-Zinc- Bismuth alloy MSAIJ, 12(2) 2015 Full Paper of adding cadmium content on structure and physical 95Sn-5Ag lead free solder alloys have been investi- properties of SnZn alloy has been investigated by El- gated]22[. A big problem with lead-free solder is that the 9 “ Bediwi et al[1]. Also thermodynamic properties and higher the tin content, the more likely the growth of tin ”. Solders with 60% tin or more are called phase equilibrium relationship of Sn-Bi-Zn lead free whiskers solder alloys are determined experimentally and theo- fine solders and are used in instrument soldering where retically by Yang et al[2]. Adding Ag to Sn-9Zn alloy temperatures are critical. The aim of this work is to inhibits the anodic dissolution of Zn and enhances the improve physical and soldering properties of Sn96Zn4 wettability of the solder alloy on Cu substrate[3]. The alloy. Also to produce new Sn- Zn- Bi alloy with supe- effect of RE elements on the microstructure, mechani- rior soldering properties by adding bismuth to tin- zinc cal properties, wetting behavior of certain Pb-free sol- alloy. der alloys reported and summarized[4]. Several re- search[5-7] studied eutectic tin- silver lead free solder EXPERIMENTAL WORK alloy. The results show that, the eutectic SnAg3.5 is re- garded as a good lead free solder alloy for certain as- In the present work, Sn96-x Zn4Bix (x=0, 6, 12, 18, pects such as superior fatigue properties. Also struc- 24 and 30 wt.%) were melted in a muffle furnace using ture, electrical resistivity, wettability, melting point and tin, zinc and bismuth of purity better than 99.5 %. The elastic modulus of Sn50In50, Sn72.2In20Ag2.8, resulting ingots were turned and re-melted four times Sn In Ag and Sn Ag lead free solder alloys have to increase the homogeneity. From these ingots, long 72.5 25 2.5 95 5 µm thickness been investigated[8[. The results show that, adding sil- ribbons of about 4 mm width and ~70 ver decreased electrical resistivity and wetting and in- were prepared by a single roller method in air (melt crease melting point and elastic modulus of tin-indium. spinning technique). The surface velocity of the roller × 10 Adding In from 0 to 3 wt. % to Sn-0.3Ag-0.7Cu lead- was 31.4 m/s giving a cooling rate of ~3.7 5 K/s. free solder alloy lowered its solidus and liquidus tem- The samples then cut into convenient shape for the peratures with increasing melting range. Also wetting measurements using double knife cuter. Microstructure time of alloy is reduced with increased wetting force by of used samples was performed on the flat surface of –ray Diffractometer increasing In content[9]. Indium is a useful element to all samples using an Shimadzu X –30, Japan)of Cu–K solve the problem of high melting point and low (Dx radiation with =1.54056 Å at 45 kV and 35 mA and Ni–filter in the angular wettability of solder on Cu substrate[10,11]. Microstruc- ° in continuous mode ture, thermal properties, corrosion and oxidation resis- range 2 ranging from 0 to 100 tance of Sn-9Zn-0.5Ag-1In solder alloy were stud- with a scan speed 5 deg/min. The electrical resistivity ied[12]. Adding 1% of In to Sn-9Zn-0.5Ag alloy de- was measured by a conventional double bridge method. creased melting point of alloy and enhanced adhesion The differential thermal analysis (DTA) thermographs strength of alloy on Cu substrate. Also Sn-In-Ag sys- were obtained by SDT Q600 V20.9 Build 20 tem offers several advantages such as good instrumentwith heating rate 10 k/min. The internal fric- – wettability[13,14], good corrosion behavior[15] and very tion Q 1 and the elastic constants were determined us- satisfying interaction with the substrate, especially with ing the dynamic resonance method. The value of the copper[16]. dynamic Young modulus E is determined by the fol- Many studies have been made on various solders lowing relationship[22-24]: 1 / 2 alloybased on Sn, e.g., Sn-9Zn, Sn-3.5Ag, Sn-3Ag- 2 E 2 L f [17-19[ 0 0.5Cu, etc. as likely substitutes . The properties of 2 kz two lead free solder alloys, Sn-3.5%Ag-1%Zn and Zn- In, are described by M. Mc Cormack et al]20[. Solidifi- Where the density of the sample under test, L the cation behaviors of Sn-9Zn-XAg lead-free solder al- length of the vibrated part of the sample, k the ra- loys are examined[21[. Structure, electrical resistivity, dius of gyration of cross section perpendicular to its wettability, melting point and elastic modulus of 50Sn- plane of motion, f0 the resonance frequency and z 50In, 72.2Sn-20In-2.8Ag,72.5Sn-25In-2.5Ag and the constant depends on the mode of vibration and is MaterialAsn ISndicani eJonurncael MSAIJ, 12(2) 2015 Abu Bakr El-Bediwi et al. 31 Full Paper equal to 1.8751. From the resonance frequency f0 at 6, 12, 18, 24 and 30) melt spun alloys have lines which the peak damping occurs, the thermal corresponding to sharp lines of body-centered tet- diffusivity, Dth, can be obtained directly from the ragonal Sn phase, rhombohedral Bi phase and rhom- following equation: bohedral SnBi intermetallic phase. X-ray diffrac- 2d 2f tion patterns and its analysis, Figure 1, for 0 â-Sn phase. Dth Sn96Zn4show that, it consisted of But x- Whered is the thickness of the sample ray diffraction patterns and its analysis, Figure 1, of Sn Zn Bi (x=6, 12, 18, 24 and 30) melt spun al- Plotting the amplitude of vibration against the 96-x 4 x â-Sn phase, loys show that, they consisted of frequency of vibration around the resonance f0 gives the resonance curve, the internal friction, Q-1, of the rhombohedralBi phase and rhombohedral SnBi in- sample can be determined from the following rela- termetallic compound and that agreed with pervious tionship: results[25,26]. From x-ray analysis it clear that,Sn Zn alloy 96 4 1 f â-Sn phase. Q 0.5773 consisted of That is mean Zn atoms dis- f 0 â-Sn phasewitha solid solved in Sn matrix forming â-Sn phasewith fine Zn-rich Where f the half width of the resonance curve solution appeared as phases are dispersed in the Sn matrix near to the RESULTS AND DISCUSSION interface. Bi phase andSnBi intermetallic compound â-Sn phase formed after adding bismuth content with X-ray analysis to Sn96Zn4 alloy.
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