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On the Direct Extrusion of Solder Wire from 52In-48Sn Alloy

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On the Direct Extrusion of Solder Wire from 52In-48Sn Alloy machines Article On the Direct Extrusion of Solder Wire from 52In-48Sn Alloy Sergei Faizov, Aleksandr Sarafanov, Ivan Erdakov , Dmitry Gromov, Alexandra Svistun, Lev Glebov , Vitaly Bykov, Anastasia Bryk and Liudmila Radionova * Department of Metal Forming, South Ural State University, Lenin Prospect 76, 454080 Chelyabinsk, Russia; [email protected] (S.F.); [email protected] (A.S.); [email protected] (I.E.); [email protected] (D.G.); [email protected] (A.S.); [email protected] (L.G.); [email protected] (V.B.); [email protected] (A.B.) * Correspondence: [email protected]; Tel.: +7-351-901-93-32 Abstract: In this article, technology for producing wire and rod solder from 52In-48Sn alloy has been developed and investigated in the conditions of small-scale production. The use of direct extrusion of wire and rods instead of traditional technology for producing solder, which includes pressing, rolling and drawing, can significantly reduce the fleet of required equipment. Using only a melting furnace and a hydraulic press, solder wires and rods can be produced in various sizes. Shortening the production cycle allows you to quickly fulfill small orders and be competitive in sales. This article develops a mathematical model of direct extrusion, which allows you to calculate the extrusion ratio, extrusion speed and pressing force. The results of modeling the process of extrusion of wire Ø2.00 mm and rods Ø8.0 mm made of 52In-48Sn alloy are presented. The temperature of the solder and the tool is simulated in software QForm based on the finite element method. Experimental results of manufacturing Ø2.0 mm solder wire and Ø8.0 mm rods are presented. The microstructure γ β Citation: Faizov, S.; Sarafanov, A.; of the direct extruded solder is a eutectic of phases and . Energy-dispersive X-ray spectroscopy Erdakov, I.; Gromov, D.; Svistun, A.; (EDS) mapping of the 52In-48Sn alloy showed that the solder obtained by direct extrusion has a Glebov, L.; Bykov, V.; Bryk, A.; uniform distribution of structural phases. The developed technology can be used in the manufacture Radionova, L. On the Direct of wires and rods from other low-melting alloys. Extrusion of Solder Wire from 52In-48Sn Alloy. Machines 2021, 9, 93. Keywords: extrusion; 52In-48Sn alloy; wire; lead-free solder; rod; simulation; software https://doi.org/10.3390/ machines9050093 Academic Editor: Andrey 1. Introduction A. Radionov Solder is a material that is used to join metals by soldering. It always has a melting point lower than the parts to be joined [1]. To date, a large number of solder alloys have been Received: 14 April 2021 created, which differ in composition, material ratio, and the presence of impurities [2–8]. Accepted: 29 April 2021 Published: 6 May 2021 According to the melting temperature, the solders are subdivided into solders for low- temperature soldering with a melting point of no more than 450 ◦C[9] and soldering alloys ◦ Publisher’s Note: MDPI stays neutral for high-temperature soldering with a melting point of more than 450 C[10]. According with regard to jurisdictional claims in to the main component, solders are subdivided into: gallium; indium; bismuth; tin-lead; published maps and institutional affil- pewter; cadmium; lead; zinc; aluminum; germanium, etc. Tin (Sn)—lead (Pb) low-melting iations. alloy is the most common type of solder [11]. SnPb-solders are made in the form of round wire, tape, triangular, round and square rods, round tubes filled with flux, and powder. Tin (Sn)-based lead (Pb)-free solders have been introduced because of the health and environmental concerns about conventional Pb-Sn solders. In 2006, the European Union’s RoHS (Restriction of the Use of Certain Hazardous Substances) Directive on the Copyright: © 2021 by the authors. Licensee MDPI, Basel, Switzerland. Environment restricted the use of lead in new electrical and electronic equipment to a This article is an open access article maximum of 0.01% [12]. Several environmentally friendly Sn-based alloys such as Sn- distributed under the terms and 3.0Ag-0.5Cu [13], Sn-14Bi-5In [14], Sn-0.7Cu [15], Sn-9Zn [8], Sn-8Zn-3Bi [16], Sn-58Bi [17], conditions of the Creative Commons Sn-52.5Bi-2.68In-1Ga [5], and Sn-In [6] have been considered the most promising candidates Attribution (CC BY) license (https:// to replace the toxic Sn-Pb alloy from electronic packaging systems [2]. creativecommons.org/licenses/by/ As of 2016, In-48Sn alloy solder is one of the most commonly used in semiconductor 4.0/). technology. While being Pb free, the eutectic SnIn solder offers very low melting points Machines 2021, 9, 93. https://doi.org/10.3390/machines9050093 https://www.mdpi.com/journal/machines Machines 2021, 9, x FOR PEER REVIEW 2 of 18 Machines 2021, 9, 93 2 of 17 As of 2016, In-48Sn alloy solder is one of the most commonly used in semiconductor technology. While being Pb free, the eutectic SnIn solder offers very low melting points and bonds well to copper, nickel, and gold substrates [18]. The eutectic point shown in and bonds well to copper, nickel,◦ and gold substrates [18]. The eutectic point shown in the thephase phase diagram diagram [6] [6is] at is at118 118 °C Cwith with the the composition composition of of 51.7 51.7 at. at. % % In In and and 4 48.38.3 at. at. % % Sn Sn (Figure(Figure1). 1). The The equilibrium equilibrium phases phases are are terminal terminal In In and and Sn Sn solid solid solutions, solutions, two two intermediate intermedi- β γ phasesate phasesand β and, and γ, and the the eutectic eutectic between between the the last last two two phases phases [6, 19[6,19]. The]. The microstructure microstructure of theof the alloy alloy with with the the chemical chemical composition composition In-49Sn In-49Sn is is shown shown in in Figure Figure2 2[ [2200].]. Eutectic SnIn SnIn (52In-48Sn(52In-48Sn by by weight) weight) has has often often been been used used as as a specialtya specialty solder solder in applicationsin applications where where a low a meltinglow melting point point alloy alloy is required, is required, such such as in as step in step soldering soldering orwhen or when the the components components in anin assemblyan assembly are sensitiveare sensitive to temperature to temperature [21 ].[21]. FigureFigure 1. 1.Sn-In Sn-Inbinary binary phasephase diagram.diagram. Machines 2021, 9, 93 3 of 17 Machines 2021, 9, x FOR PEER REVIEW 3 of 18 Figure 2. MicrostructureFigure of the 2. Microstructure eutectic In-49Sn of solder the eutectic. In-49Sn solder. Physical and mechanicalPhysical and properties mechanical of the properties 52In-48Sn of al theloy 52In-48Sn are presented alloy in are Table presented 1 [22]. in Table1[ 22]. Table 1. PhysicalTable and 1. mechanicalPhysical and properties mechanical of the properties 52In-48Sn of alloy. the 52In-48Sn alloy. Thermal SpecificSpecific Electrical Solidus/ Alloy Density, Ultimate Elongation, Brinell Hardness, Solidus/ AlloyConductivity, Thermal Resistance, Ultimate Brinell Liquidus g/cm3 Electrical TensileElongation, % HB W/mK Ohmm Temperature,◦C Liquidus(at 22 ◦C) Density, Conductivity, TensileStrength, MPa (at 22Hardness,◦C) (at 22 ◦C) (at 85 ◦C) (atResistance, 22 ◦C) % Temperature, g/cm3 W/mK Strength, HB Ohmm (at 22 °C) 117/120°C 7.30 (at 22 °C) 86(at 85 °C) 0.147MPa 11.9 83(at 22 °C) 5 (at 22 °C) 117/120 752In-48Sn.30 is considered86 the0 lowest.147 melting11.9 point practical83 solder.5 It is often used as the last step in a sequential soldering operation, and for soldering to metallizations on 52In-48Sntemperature-sensitive is considered the lowest components. melting point 52In-48Sn practical is relatively solder. It ductile. is often Elongation used as is reported the last step into a be sequential 83%. This soldering higher elongation operation, is aand result for ofsoldering superplastic to metallizations behavior in creep on under shear temperature-sensitiveloading atcomponents. a temperature 52In above-48Sn 0.8 is relatively of their melting ductile. temperature Elongation (Tm)is reported [23]. to be 83%. This higherThe elongation traditional is technology a result of for superplastic the production behavior of solders in creep (Figure under3)[ shear24] consists of the loading at a temperaturefollowing stages: abovealloy 0.8 of preparation, their melting casting temperature of ingots (Tm) (100–200 [23]. mm in diameter), extruding, The traditionaland drawing technology to the for required the production diameter. of In solders some cases,(Figure billet 3) [2 rolling4] consists can beof the applied between following stages:extruding alloy preparation, and drawing casting (Figure of4)[ ingots25]. (100–200 mm in diameter), extrud- ing, and drawing toTraditional the required technology diameter. for theIn some production cases, ofbillet solder rolling wire ca requiresn be applied not only a large fleet between extrudingof equipment and drawing but also (Figure often 4) comes [25]. with problems related to the stability of the drawing process. Frequent breaks of the wire during rolling and especially during drawing [26–29] require the improvement of technology and its production. At the same time, there are known methods of making wire by extrusion [30–32], which are used in medicine. We have not found any publications describing small-scale technology for the manufacture of wire solder. The purpose of this work is to develop and study a technology for the manufacture of wire and rod from 52In-48Sn lead-free alloy in the conditions of small-scale production. Machines 2021, 9, 93 4 of 17 Machines 2021, 9, xMachines FOR PEER 2021 REVIEW, 9, x FOR PEER REVIEW 4 of 18 4 of 18 Figure 3. Solder Figurewire production 3. SolderFigure wi line 3.re Solder(typeproduction 1) wire.
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