Advanced Packaging Solutions
Advanced Packaging Solutions Highlights Providing silicon-scaling • Advanced packaging capabilities in solutions for tomorrow’s applications 2.5D, 3D, WLP and Silicon Photonics GLOBALFOUNDRIES post-fab services provide complementary and extended • Power, performance, cost and solutions with complete supply chain management including bump, probe, form-factor optimized solutions packaging and final test. The flexible supply chain model is tailored to your • Industry leader in smart interposers needs with services ranging from bump and probe only to a more comprehen- sive spectrum of services including package design, assembly and test. • In-house bump and wafer probe capabilities In addition to in-house bump and probe capabilities, we provide packaging • Advanced memory integration services in collaboration with a network of established OSAT partners, includ- with stacked memories ing 2D packages as well as 2.5D and 3D advanced package technologies. Test development and capabilities include RF, analog, embedded memory, • Ownership and process maturity for HVM and mmWave applications, with wide array of tester platforms for wafer sort operations. • Advanced silicon node CPI and qualification Packaging Requirements • RF system-in-package and Package types are selected based on performance requirements and optimized mmWave packaging capability for market segments including IoT, RF, Automotive, Mobile, High-end • Partnerships and strong relationships Computing, Networking and Storage. with leading-edge OSATs • Flexible supply chain and Mobile IoT RF Automotive Computing Networking Storage collaborative business models QFN FBGA WLCSP FOWLP SiP fcCSP FCBGA 2.5D 3D Si-PH Advanced Packaging Solutions Packaging Technologies TSV Si Interposer Availability GF Si nodes are qualified in a wide range of package Full Reticle 26x33mm2 technologies including 2D wirebond designs, flip Stitched Interposer >1300 mm2 chip, WLCSP and FOWLP configurations, as well 10:1 Aspect Ratio TSV 10um Dia./ 100um Depth as 2.5D, 3D and Si-Photonics.
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